Samsung HT BD1255

5.1CH Blu-ray Home Theater System Model Name : HT-BD1255 Model Code : HT-BD1255R/EDC Speaker

PS-BD1255

Front

PS-FBD1255

Center

PS-CBD1255

Rear

PS-RBD1255

Subwoofer

PS-WBD1255

SERVICE 5.1CH Blu-ray Home Theater System

Manual CONTENTS 1. Precaution 2. Product Specification 3. Disassembly & Reassembly 4. Troubleshooting 5. Exploded View & Part List 6. PCB Diagram 7. Schematic Diagram

HT-BD1255

Refer to the service manual in the GSPN (see the rear cover) for the more information.

GSPN (Global Service Partner Network) Area

Web Site

North America

service.samsungportal.com

Latin America

latin.samsungportal.com

CIS

cis.samsungportal.com

Europe

europe.samsungportal.com

China

china.samsungportal.com

Asia

asia.samsungportal.com

Mideast & Africa

mea.samsungportal.com

This Service Manual is a property of Samsung Electronics Co.,Ltd. Any unauthorized use of Manual can be punished under applicable International and/or domestic law.

© Samsung Electronics Co.,Ltd. Apr. 2009 Printed in Korea

Contents 1. Precaution 1-1 Safety Precautions............................................................................................ 1-1 1-2 Servicing Precautions.......................................................................................1-3 1-3 Precautions for Electrostatically Sensitive Devices (ESDs)..............................1-4

2. Product Specification 2-1 2-2 2-3 2-4

Product Feature................................................................................................ 2-1 Specifications....................................................................................................2-2 Specifications Analysis......................................................................................2-8 Accessories.......................................................................................................2-10

3. Disassembly & Reassembly 3-1 Overall Disassembly & Reassembly.................................................................3-1 3-2 DECK Disassembly & Reassembly..................................................................3-4

4. Troubleshooting 4-1 Checkpoints by Error Mode..............................................................................4-2 4-2 Initialization & Upgrade Methods......................................................................4-34 4-3 Buyer-Region Code Setting Method.................................................................4-38

5. Exploded View & Part List 5-1 5-2 5-3 5-4

Product Exploded View.....................................................................................5-2 DECK Exploded View.......................................................................................5-4 Speaker System................................................................................................ 5-6 Electrical Part List............................................................................................. 5-7

Contents 6. PCB Diagram 6-1 Wiring Diagram................................................................................................. 6-2 6-2 FRONT PCB Top............................................................................................... 6-3 6-3 FRONT PCB Bottom.........................................................................................6-5 6-4 KEY PCB Top....................................................................................................6-6 6-5 KEY PCB Bottom.............................................................................................. 6-8 6-6 AMP PCB Top................................................................................................... 6-9 6-7 AMP PCB Bottom.............................................................................................. 6-11 6-8 MAIN PCB Top.................................................................................................. 6-13 6-9 MAIN PCB Bottom............................................................................................ 6-16 6-10 SMPS PCB Top................................................................................................. 6-18 6-11 SMPS PCB Bottom........................................................................................... 6-19

7. Schematic Diagram 7-1 Overall Block Diagram......................................................................................7-2 7-2 FRONT..............................................................................................................7-3 7-3 KEY...................................................................................................................7-4 7-4 AMP..................................................................................................................7-5 7-5 AUDIO / VIDEO (COMPONENT, COMPOSITE)...............................................7-6 7-6 HDMI CEC / TX (SIL9134)................................................................................7-7 7-7 Boot Strap Option............................................................................................. 7-8 7-8 EBI ADDR, EBI DATA........................................................................................7-9 7-9 CLOCK, BBS....................................................................................................7-10 7-10 BCM7440 POWER........................................................................................... 7-11 7-11 DDR2 BANK0, BANK1......................................................................................7-12 7-12 SYSTEM MICOM / TUNER / SRC / WIRELESS..............................................7-13 7-13 EXTERNAL IN & AUDIO FLOW........................................................................7-14 7-14 Ethernet, S-ATA, USB.......................................................................................7-15 7-15 GPIO / IPOD / BT.............................................................................................. 7-16 7-16 NAND, FlexOneNand........................................................................................7-17 7-17 MAIN POWER..................................................................................................7-18 7-18 DSP SDRAM / FLASH......................................................................................7-19 7-19 BCM7620 (F/E)................................................................................................. 7-20 7-20 SMPS (110V)....................................................................................................7-21 7-21 SMPS (220V).................................................................................................... 7-22

Precaution

1. Precaution Follow these safety, servicing and ESD precautions to prevent damage and protect against potential hazards such as electrical shock and X-rays.

1-1 Safety Precautions 1. Be sure that all of the built-in protective devices are replaced. 2. When reinstalling the chassis and its assemblies, be sure to restore all protective devices, including control knobs and compartment covers. 3. Make sure that there are no cabinet openings through which people--particularly children--might insert fingers and contact dangerous voltages. Such openings include the spacing between the picture tube and the cabinet mask, excessively wide cabinet ventilation slots, and improperly fitted back covers. 4. Design Alteration Warning: Never alter or add to the mechanical or electrical design of the unit. Example: Do not add auxiliary audio or video connectors. Such alterations might create a safety hazard. Also, any design changes or additions will void the manufacturer’s warranty. 5. Leakage Current Hot Check (Fig. 1-1): Warning: Do not use an isolation transformer during this test. Use a leakage-current tester or a metering system that complies with American National Standards Institute (ANSI C101.1, Leakage Current for Appliances), and Underwriters Laboratories (UL Publication UL1410, 59.7).

LEAKAGE (READING CURRENT SHOULD NOT BE TESTER ABOVE 0.5mA)

DEVICE UNDER TEST TEST ALL EXPOSED METAL SURFACES 2-WIRE CORD ALSO TEST WITH

PLUG REVERSED With the unit completely reassembled, plug the AC line (USING AC EARTH cord directly into a 120V AC outlet. With the unit’s AC ADAPTER PLUG GROUND AS REQUIRED) switch first in the ON position and then OFF, measure the current between a known earth ground (metal water pipe, etc.) and all exposed metal parts. Examples: Handle brackets, metal cabinets, screwheads and control shafts. The current measured should not exceed 0.5 milliamp. Reverse the powerplug prongs in the AC outlet and repeat.

6. Insulation Resistance Cold Check: (1) With the unit’s AC plug disconnected from the AC source, connect an electrical jumper across the two AC prongs. (2) Set the power switch to ON. (3) Measure the resistance between the shorted AC plug and any exposed metallic parts. Example: Screwheads, antenna, control shafts or handle brackets.

Antenna Terminal Exposed Metal Part ohm

Ohmmeter

If any of the exposed metallic parts has a return path to the chassis, the measured resistance should be between 1 and 5.2 megohms. If there is no return path, the measured resistance should be “infinite.” If the resistance is outside these limits, a shock hazard might exist. See Fig. 1-2

Samsung Electronics

1-1

Precaution

7. Components, parts and wiring that appear to have overheated or that are otherwise damaged should be replaced with parts that meet the original specifications. Always determine the cause of damage or overheating, and correct any potential hazards 8. Observe the original lead dress, especially near the following areas: Antenna wiring, sharp edges, and especially the AC and high voltage power supplies. Always inspect for pinched, out-of-place, or frayed wiring. Do not change the spacing between components and the printed circuit board. Check the AC power cord for damage. Make sure that no wires or components touch thermally hot parts. 9. Product Safety Notice: Some electrical and mechanical parts have special safety-related characteristics which might not be obvious from visual inspection. These safety features and the protection they give might be lost if the replacement component differs from the original--even if the replacement is rated for higher voltage, wattage, etc. or . Use 10. Components that are critical for safety are indicated in the circuit diagram by shading, replacement components that have the same ratings, especially for flame resistance and dielectric strength specifications. A replacement part that does not have the same safety characteristics as the original might create shock, fire or other hazards.

1-2

Samsung Electronics

Precaution

1-2 Servicing Precautions 1. Servicing precautions are printed on the cabinet. Follow them. 2. Always unplug the unit’s AC power cord from the AC power source before attempting to: (a) Remove or reinstall any component or assembly, (b) Disconnect an electrical plug or connector, (c) Connect a test component in parallel with an electrolytic capacitor. 3. Some components are raised above the printed circuit board for safety. An insulation tube or tape is sometimes used. The internal wiring may be clamped to prevent contact with thermally hot components. Reinstall all such elements to their original position. 4. After servicing, always check that the screws, components and wiring have been correctly reinstalled. Make sure that the portion around the serviced part has not been damaged. 5. Check the insulation between the blades of the AC plug and accessible conductive parts (examples: metal panels, input terminals and earphone jacks). 6. Insulation Checking Procedure: Disconnect the power cord from the AC source and turn the power switch ON. Connect an insulation resistance meter (500V) to the blades of the AC plug.

The insulation resistance between each blade of the AC plug and accessible conductive parts (see above) should be greater than 1 megohm.

7. Never defeat any of the B+ voltage interlocks. Do not apply AC power to the unit (or any of its assemblies) unless all solid-state heat sinks are correctly installed. 8. Always connect a test instrument’s ground lead to the instrument chassis ground before connecting the positive lead; always remove the instrument’s ground lead last.

First read the “Safety Precautions” section of this manual. If some unforeseen circumstance creates a conflict between the servicing and safety precautions, always follow the safety precautions.

Samsung Electronics

1-3

Precaution

1-3 Precautions for Electrostatically Sensitive Devices (ESDs) 1. Some semiconductor (“solid state”) devices are easily damaged by static electricity. Such components are called Electrostatically Sensitive Devices (ESDs). Examples include integrated circuits and some field-effect transistors. The following techniques will reduce the occurrence of component damage caused by static electricity. 2. Immediately before handling any semiconductor components or assemblies, drain the electrostatic charge from your body by touching a known earth ground. Alternatively, wear a discharging wrist-strap device. (Be sure to remove it prior to applying power--this is an electric shock precaution.) 3. After removing an ESD-equipped assembly, place it on a conductive surface such as aluminum foil to prevent accumulation of electrostatic charge. 4. Do not use freon-propelled chemicals. These can generate electrical charges that damage ESDs. 5. Use only a grounded-tip soldering iron when soldering or unsoldering ESDs. 6. Use only an anti-static solder removal device. Many solder removal devices are not rated as “anti-static” (these can accumulate sufficient electrical charge to damage ESDs). 7. Do not remove a replacement ESD from its protective package until you are ready to install it. Most replacement ESDs are packaged with leads that are electrically shorted together by conductive foam, aluminum foil or other conductive materials. 8. Immediately before removing the protective material from the leads of a replacement ESD, touch the protective material to the chassis or circuit assembly into which the device will be installed. 9. Minimize body motions when handing unpackaged replacement ESDs. Motions such as brushing clothes together, or lifting a foot from a carpeted floor can generate enough static electricity to damage an ESD.

1-4

Samsung Electronics

Product Specification

2. Product Specification 2-1 Product Feature  New features for both HT-BD1250 - BD-LIVE from the beginning of the Mass Production - DTS-HD Master Audio decoding from the beginning of the Mass Production - Wireless Network • Bundle ‘Wireless LAN adapter’ not included for HT-BD1250 - MP3, JPG - 2 USB port (Not only on rear, but also on front) - I-POD Docking (Only USA) - Various Video Setups • Progressive Mode • Still Mode • BD Wise • Picture Control

 HT-BD2 → HT-BD1250 - DivX (Only EU) - PC Connected - USB HOST - Profile 2.0 Ready - Netflix, Pandora - I-POD Docking (Only USA) - Wireless Rear Speaker

Samsung Electronics

2-1


2-2 Specifications 2-2-1 HT-BD1250 / HT-BD1252 / HT-BD1255 Specifications  Basic Specification

GENERAL

Power Consumption

85 W

Weight

4.4 Kg

Dimensions

440 (W) x 345 (D) x 63 (H) mm

Operating Temperature Range

+5°C ~ +35°C

Operating Humidity Range

10% to 75%

BD (Blu-ray Disc)

Reading Speed: 4.917m/sec Reading Speed: 3.49 ~ 4.06 m/sec.

DISC

DVD (Digital Versatile Disc)

Approx. Play Time (Single Sided, Single Layer Disc): 135 min.

CD: 12 cm (COMPACT DISC)

Reading Speed: 4.8 ~ 5.6 m/sec.



Maximum Play Time: 74 min.

Maximum Play Time: 20 min. 1 channel: 1.0 Vp-p (75Ω load)

Composite Video

Blu-ray Disc: 576i (480i) DVD: 576i (480i) Y: 1.0 Vp-p (75Ω load)

VIDEO OUTPUT

Pr: 0.70 Vp-p (75Ω load) Component Video

Pb: 0.70 Vp-p (75Ω load) Blu-ray Disc: 1080i, 720p, 576p (480p), 576i (480i) DVD: 576p (480p), 480i

VIDEO/ AUDIO

AMPLIFIER

2-2

HDMI

1080p, 1080i, 720p, 576p (480p) PCM multi channel audio, Bit stream audio, PCM audio

Front speaker output

165W x 2 (3Ω)

Center speaker output

170W (3Ω)

Surround speaker output

165W x 2 (3Ω)

Subwoofer speaker output

170W (3Ω)

Frequency range

Analog input: 20Hz ~ 20kHz (±3dB) Digital input: 20Hz ~ 44kHz (±3dB)

S/N Ratio

70dB

Channel separation

60dB

Input sensitivity

(AUX) 500mV

Samsung Electronics


 HT-BD1250 Speaker Specification Speaker system

Front

Surround

Center

Subwoofer

3Ω

3Ω

3Ω

3Ω

140Hz ~ 50KHz

140Hz ~ 20KHz

140Hz ~ 20KHz

40Hz ~ 160Hz

87dB/W/M

87dB/W/M

87dB/W/M

90dB/W/M

Rated input

165W

165W

170W

170W

Maximum input

330W

330W

340W

340W

Impedance Frequency range Output sound pressure level SPEAKER

5.1ch Speaker System

Dimensions (W x H x D)

Front/Surround: 100.5 x 210 x 99 mm Centre: 300 x 59 x 50 mm Subwoofer: 201 x 403 x 410 mm

Weights

Front/Surround: 0.70 Kg, Centre: 0.33 Kg Subwoofer: 5.39 Kg


Front

Surround

Center

Subwoofer

3Ω

3Ω

3Ω

3Ω

140Hz ~ 20KHz

140Hz ~ 20KHz

140Hz ~ 20KHz

40Hz ~ 160Hz

87dB/W/M

87dB/W/M

87dB/W/M

88dB/W/M

Rated input

165W

165W

170W

170W

Maximum input

330W

330W

340W

340W




Front : 260 x 1120x 260 mm Surround : 100 x 151 x 89 mm Centre : 300 x 59 x 50 mm Subwoofer : 201 x 403 x 410 mm

Weights

Front: 2.18 Kg, Surround: 0.42 Kg Centre: 0.32 Kg, Subwoofer: 5.39 Kg

Samsung Electronics

2-3



Front

Surround

Center

Subwoofer

3Ω

3Ω

3Ω

3Ω

140Hz ~ 50KHz

140Hz ~ 20KHz

140Hz ~ 20KHz

40Hz ~ 160Hz

87dB/W/M

87dB/W/M

87dB/W/M

88dB/W/M

Rated input

165W

165W

170W

170W

Maximum input

330W

330W

340W

340W


2-4



Front/Surround: 260 x 1202 x 260 mm Centre: 300 x 59 x 50 mm Subwoofer: 201 x 403 x 410 mm

Weights

Front/Surround: 2.88 Kg, Centre: 0.34 Kg, Subwoofer: 5.39 Kg

Samsung Electronics


2-2-2 HT-BD1220 Specifications  Basic Specification

GENERAL

FM TUNER

Power Consumption

85 W

Weight

4.4 Kg

Dimensions

440 (W) x 345 (D) x 63 (H) mm

Operating Temperature Range

+5°C ~ +35°C

Operating Humidity Range

10% to 75%

FM Frequency Range

87.5 ~ 108.0 MHz

Signal / noise ratio

60 dB

Usable sensitivity

10 dB

Total harmonic distortion

1%

BD (Blu-ray Disc)

Reading Speed: 4.917m/sec Reading Speed: 3.49 ~ 4.06 m/sec.

DISC

DVD (Digital Versatile Disc)

Approx. Play Time (Single Sided, Single Layer Disc): 135 min.





Maximum Play Time: 74 min.

Maximum Play Time: 20 min. 1 channel: 1.0 Vp-p (75Ω load)

Composite Video

Blu-ray Disc: 576i/480i DVD: 576i/480i Y: 1.0 Vp-p (75Ω load)

VIDEO OUTPUT

Pr: 0.70 Vp-p (75Ω load) Component Video

Pb: 0.70 Vp-p (75Ω load) Blu-ray Disc: 1080i, 720p, 576p/480p, 576i/480i DVD: 576p/480p, 576i/480i

VIDEO/ AUDIO

AMPLIFIER

HDMI

1080p, 1080i, 720p, 576p/480p PCM multi channel audio, Bit stream audio, PCM audio

Front speaker output

165W x 2 (3Ω)

Center speaker output

170W (3Ω)

Frequency range

Analog input: 20Hz ~ 20kHz (±3dB) Digital input: 20Hz ~ 44kHz (±3dB)

S/N Ratio

70dB

Channel separation

60dB

Input sensitivity

(AUX) 500mV

Samsung Electronics

2-5



Front

Subwoofer

3Ω

3Ω

140Hz ~ 50KHz

40Hz ~ 160Hz

87dB/W/M

90dB/W/M

Rated input

165W

170W

Maximum input

330W

340W


2-6



Front: 100.5 x 210 x 99 mm Subwoofer: 201 x 403 x 410 mm

Weights

Front: 0.70 Kg Subwoofer: 5.39 Kg

Samsung Electronics


2-2-3 Video Output SPEC  BD playback Output Setup 1080P@60F

HDMI Output

Component [HDMI Connected]

Component [HDMI not Connected]

CVBS Output

1080P@60F

480i

1080i

480i

1080P@24F

1080P@24F

480i

1080i

480i

1080i

1080i

1080i

1080i

480i

720P

720P

720P

720P

480i

480P

480P

480P

480P

480i

480i

480P

480i

480i

480i

HDMI Output

Component [HDMI Connected]

Component [HDMI not Connected]

CVBS Output

1080P@60F

1080P@60F

480i

480P

480i

1080i

1080i

480i

480P

480i

720P

720P

480i

480P

480i

480P

480P

480i

480P

480i

480i

480P

480i

480i

480i

Remark

Only when source is 1080P@24F

 DVD playback Output Setup

Samsung Electronics

Remark

2-7


2-3 Specifications Analysis Model Name

HT-BD1250

HT-BD2

Profile

Blu-ray 2.0 from the beginning

Blu-ray 1.0

DVD, CD





MP3, JPG





USB HOST



X

I-POD

 (only USA)

X

Wireless LAN



X

DivX (SD)

 (only EU)

X

Wireless Rear



X

Memory Slot

X (External USB support)

X

BD-RE support

Support 1.0

Does not support 1.0

Update Method

CD, Network, USB

CD, Network

Required time for update

3~4min

10~12 min

Remote

long

long

HDMI

1.3

1.3

1080p 24frame





CEC (Anynet+)





X (8bit)

X (8bit)

xvYCC



X

HD Audio Transmission





Picture Quality control

(Progressive Mode, Still Mode,

Photo

Deep Color HDMI

 X

BD Wise, Picture Control) Video Processor

Video

Main SOC Internal Scaler

Main SOC Internal Scaler

1080p 60frame





1080i 60frame





1080p 24frame













480i/p video output for Blu-ray Simultaneous Video Output between HDMI/ Component/CVBS

 : application, X: non-application

2-8

Samsung Electronics


Model Name

HT-BD1250

HT-BD2

480p

480p

Maximum resolution for TV input

Maximum resolution for TV input

480p

480p

HT-BD1250 can also output 480i/480p

HT-BD2 can also output 480i/480p

resolution with Blu-ray Disc

resolution with Blu-ray Disc

DD Plus decoding





Dolby TrueHD decoding





dts HD HRA decoding





dts-HD MA decoding

(dts-HD Master Audio essential)



 (into dts)

X

Photo

Factory Default When connected the TV Video Resolution Default

which has correct EDID When connected the TV which has incorrect EDID Remark

Audio

H/W

Re-encoding

dts-HD MA Essential

dts-HD MA

HD audio bit stream

dts-HD HRA

dts-HD HRA

output on HDMI 1.3

TrueHD

TrueHD

DD+

DD+

SMPS

2 trans

2 trans

Deck

Draw type Plastic Cover

Slot-In

5G VE Pickup

4G VE Pickup

SANYO

SANYO

One Board

P-ATA

Pick Up Front Micom Main ↔ Loader

 : application, X: non-application

Samsung Electronics

2-9


2-4 Accessories 2-4-1 Supplied Accessories Accessories

Item

Item code

Remote Control Battery

AH59-02144L 4301-000116

HDMI Cable

AH39-00923A

Audio Cable

AH39-40001V

Remark

Samsung Service Center

2-10

FM Antenna

AH42-00021A

User’s Manual

AH68-02178F AH68-02178G AH68-02178H

Cloth Clean

AH81-02286C

Samsung Electronics

Troubleshooting

4. Troubleshooting 4-1 Checkpoints by Error Mode.................................................................4-2 4-2 Initialization & Upgrade Methods.........................................................4-34 4-3 Buyer-Region Code Setting Method....................................................4-38

Samsung Electronics

4-1

Troubleshooting

4-1 Checkpoints by Error Mode Oscilloscope Setting Values Voltage/DIV

1V/div

TIME/DIV

500ms/div

4-1-1 NO POWER No Power Detected (Stand by LED OFF)

FL1 (250V/10A) is normal?

No

Change FL1 Test SMPS PCB

No

Change BDL1 Test SMPS PCB

No

Change IC2 Test SMPS PCB

No

Change PCA3 Test SMPS PCB

Yes

BDL1 (TPS10P05G) is normal?

Yes

IC2 (ICE3B0365J) is normal?

Yes

PCA3 (PC817) is normal?

Yes

Change the SMPS PCB

4-2

Samsung Electronics

Troubleshooting

4-1-2 AMP NO POWER

AMP No Power (Stand by LED ON)

IC1 (MR4040) is normal?

No

Change IC1 Test SMPS PCB

No

Change PCA3 Test SMPS PCB

Yes

PCA1, 2 (PC817) is normal?

Yes

Change the SMPS PCB

Samsung Electronics

4-3

Troubleshooting

4-1-3 NO SOUND-1

There is no audio sound from speaker.

Check CON1 pin 17~21 of AMP PCB? ; I2S DATA/CLK must be inputed

Yes

Change MAIN PCB

 Refer to image of Fig. 4-1.

Check AL01~06 of AMP PCB? ; Output Check

Yes

No

No

Change AMP PCB

 Refer to image of Fig. 4-2-1 and Fig. 4-2-2.

Check the signal from jack and if not, change AMP PCB.

4-4

Samsung Electronics

Troubleshooting

1

CON1

 AMP, page 7-5

1

 AMP PCB Top, page 6-9 Samsung Electronics

4-5

Troubleshooting

2

2

2

2

2

2

 AMP, page 7-5

4-6

Samsung Electronics

Troubleshooting

J3

2

AIC5

AIC6

AIC3

AIC4

AIC1

AIC2

UPIC1 AIC11

 AMP PCB Top, page 6-9

Samsung Electronics

4-7

Troubleshooting

4-1-4 NO SOUND-2 (waveform when 1KHz, -20dB signal is input)

No Sound

CHECK POWER

No

CN2: +12V Check

Replace SMPS

Yes PWM INPUT CHECK

UPIC1 (PS9830B) Pin 15, 16, 17 Check

No

Check UPIC1 Data Line Pattern

Yes PWM OUTPUT CHECK Check UPIC1 Power pin pattern. UPIC1 (PS9830B) Pin 48, 49, 51, 52, 54, 55, 61, 62, 67, 68 Check

No

UPIC1 (PS9830B) POWER (3.3V) Pin 4, 10, 22, 29, 39, 47, 56, 65, 72, 84, 87, 94 Check

Yes No Replace UPIC1.

Yes

 Refer to wave pattern image of Fig. 4-3. OP AMP IC OUTPUT CHECK

AIC7, 8, 9 (4560) Pin 1, 7 Check

Yes

No

 Refer to wave pattern image of Fig. 4-4-1 and Fig. 4-4-2.

AIC7, 8, 9 (4560) POWER (+5V, -5V) Pin 8, 4 Check

No

Replace AIC7, 8, 9.

A

4-8

Samsung Electronics

Troubleshooting

A

AIC1, 2, 3, 4, 5, 6 (IRS2092S) Pin 11, 14 Check

Yes

No

 Refer to wave pattern image of Fig. 4-5-1 and Fig. 4-5-2.

AIC1, 2, 3, 4, 5, 6 (IRS2092S) POWER (+5V, -5V) Pin 1, 6 Check

No

Replace AIC1, 2, 3, 4, 5, 6.

SOUND OUTPUT OK

Samsung Electronics

4-9

Troubleshooting

1

AIC3

AIC4

 AMP, page 7-5

1 1

UPIC1

 AMP PCB Top, page 6-9 4-10

Samsung Electronics

Troubleshooting

2

2

2

 AMP, page 7-5

Samsung Electronics

4-11

J3

Troubleshooting

AIC7

AIC8

AIC9

2

 AMP PCB Bottom, page 6-11

2

4-12

Samsung Electronics

Troubleshooting

3

3

3

3

3

3  AMP, page 7-5

Samsung Electronics

4-13

J3

Troubleshooting

3

AIC5

AIC6

AIC3

AIC4

AIC1

AIC2

UPIC1 AIC11

 AMP PCB Top, page 6-9

3

4-14

Samsung Electronics

Troubleshooting

4-1-5 DISC LOADING ERROR

Disc Ioading error

Check the FEU1, IC23 → 8V, 5V PiC1 → 3.3V

No

Check the Power

Yes

PICKUP cable and Motor cable inserted correctly?

No

Reinsert cables again

Yes

Check the clock at X1 25MHz

No

Change the MAIN PCB

Yes

Change the DECK

Samsung Electronics

4-15

Troubleshooting

4-1-6 REMOTE DOES’T WORK

Remote control does not work

No

Remote Battery OK?

Check the Battery

Yes

Is the FFC cable (between Front panel & Main) OK?

No

Re-insert FFC cable correctly

Yes

REYE Pin 1 Signal OK?

Yes

No

Check REYE or change the FRONT PCB

 Refer to wave pattern image of Fig. 4-6.

Change MAIN PCB FMIC1 Pin 47 or change the MAIN PCB

4-16

Samsung Electronics

Troubleshooting

1 1

J

I

 FRONT, page 7-3

PCON1

IC1

TCON1

UIC2

FCON1

1

 FRONT PCB Top, page 6-3 J

Samsung Electronics

I

4-17

Troubleshooting

4-1-7 NO PICTURE

No Picture

Logo screen is OK?

No

Yes

BD/DVD Playback is OK?

Yes

Change the MAIN PCB

4-18

HDMI?

Yes

No

Component?

Yes

No

NO LOGO HDMI

No

NO LOGO COMPONENT

NO LOGO CVBS

Samsung Electronics

Troubleshooting

4-1-8 NO LOGO HDMI

No Logo HDMI

Video selection accords with cable connection and TV mode?

No

Check the Video select, cable connection, TV mode

No

Check U1 Power Input, Y1 Oscillation, Memory interface

Yes

Clock, Data and Sync from Pin 56~94 from IC18.

Yes


Pin 51 of IC18 is High? (2V ~ 5V)


No

Check IC18 connector and HDMI cable connection

No

Check IC18 power input and peripheral devices

Yes

Data output from IC18? (Pin 30, 31, 33, 34, 36, 37, 39, 40)

Yes


HDMI Cable Error

Samsung Electronics

4-19

Troubleshooting

1

1

CEIC1

 HDMI CEC / TX (SIL9134), page 7-7

IC18 1

 MAIN PCB Top, page 6-13

4-20

U1

DIC1 Samsung Electronics

PIC

Troubleshooting

2

<54MHz Crystal>

2

CEIC1

 CLOCK, BBS, page 7-10

IC18

2

EM2

DIC1


Samsung Electronics

U1

4-21

Troubleshooting

3

3

 HDMI CEC / TX (SIL9134), page 7-7

CEIC1

3

IC18


4-22

U1

DIC1 Samsung Electronics

PIC

Troubleshooting

4-1-9 NO LOGO COMPONENT

No Logo Component


No


No

VCN1 (VR12, VR13, VR14) soldering error

Yes

Video output from VCN1 (VR12, VR13, VR14)

Yes


No

Video output from VIC1 & VC6, VC1, VC4

Yes

Check VIC1 soldering of peripheral devices


Component Cable Error

Samsung Electronics

4-23

Troubleshooting

1

CEIC1

CON18

 AUDIO / VIDEO (COMPONENT, COMPOSITE), page 7-6

IPIC2

IC18 1


1 VR12

1 VR13

1 VR14 DIC1

PIC6

U1 DSIC1

4-24

MEM3

MEM4

Samsung Electronics DSCN1

Troubleshooting

2


VIC1

AIC3

2

 MAIN PCB Bottom, page 6-10

2 VC1

2 VC4

DSIC5

2 VC6

DSIC1

DBGN1

Samsung Electronics

4-25

MUIC1

Troubleshooting

4-1-10 NO LOGO CVBS

No Logo CVBS


No


Yes

No

Video output from VCN1 (VR16)

Yes


No

Video output from VIC1 & VC3

Yes

VCN1 (VR16) soldering error

Check VIC1 soldering of peripheral devices


Component Cable Error

4-26

Samsung Electronics

Troubleshooting

1

 AUDIO / VIDEO (COMPONENT, COMPOSITE), page 7-6 IPCN1 CON18

1 VR16

IC18

PIC5

DJ3

IPIC2

1

MUCN

DIC1

PIC6


Samsung Electronics

4-27

PCN1

DSIC1

Troubleshooting

2


2 VC3

MUCN

AIC3

VIC1

DJ3

2

MUIC1

DSIC1

Samsung Electronics

PCN1

4-28

DSIC5


Troubleshooting

4-1-11 Disc skips or freezing

Disc skips or freezing

All Media (BD/DVD/CD) NG?

No

Yes

Check Power PiC1 (3.3V), L1112 (1.2V), IC23 (5V)?

SMPS Check

Yes

Check the clock at X-TAL1 25MHz?

Yes

No

Yes

Q3 Emitter Voltage check Q2: DVD, Q1:CD 4V ~ 6.5? Yes

No


Change the MAIN PCB

Only BD NG?

No

Check U100's phreperial part like soldering etc.

No

 Refer to image of Fig. 4-15. Change the DECK

Only DVD NG?

No

Only CD NG?

RFIP Check? Signal level OK? BD: over 400mV DVD: over 200mV CD: over 200mV

Yes

No


No

Change the MAIN PCB

Samsung Electronics

Change the MAIN PCB

Change the DECK

4-29

CE

USCO

IC18

J2

Troubleshooting

MEM2

U1 MEM1

MEM3

MEM4

1

 BCM7620 (F/E), page 7-20

1

FEIC13

CON16

DSC

CON15

 MAIN PCB Top, page 6-13 4-30

Samsung Electronics

IPIC2

IC18

VIC1

2

PIC6

DIC1 2

DSIC1 2

DSIC5

J2

USCON1

Troubleshooting

 BCM7620 (F/E), page 7-20

DBGN1

DSCN1

DSIC14

2 2 CON12

CON17

FEIC13

2

CON15 CON15


 MAIN PCB Bottom, page 6-16

Samsung Electronics

4-31

VIC1

Troubleshooting

A

DSIC5

3

DBGN1

FEIC13

DSIC

 BCM7620 (F/E), page 7-20

3

CON15

 MAIN PCB Bottom, page 6-16 4-32

Samsung Electronics

Troubleshooting

4-1-12 Network Error

Network Error

Cable connection between Set & LAN ok?

No

Connect correctly the cable or Wireless jack

Fail

Refer User Manual's Network Setup Part and reset-up setting of Network

Yes

Check Network connection Test in the setup menu.

OK

Change the MAIN PCB

 The connection between LAN and SET is direct. So there is no need to check H/W if there is network problem. If it is, the problem is MAIN CHIP(U1)'s BGA soldering problem. It must be changed to new board.

Samsung Electronics

4-33

Troubleshooting

4-2 Initialization & Upgrade Methods 4-2-1 How to check F/W version  Method 1 - Step 1: Open the tray - Step 2: Press and hold INFO button on the remote over 5 seconds. - Then, you will see below screen

LDR : 02152008 / Front : 005 Software : yymmdd.xx Region : A/1 (BD/DVD) Macrovision : BBS41

 Method 2 - Press ‘MENU’ on the remote controller - Setup – System Setup – System Information  Description for the meaning - LDR: Loader F/W (Updatable) - Front: Front Micom F/W (Not Updatable, and don’t need to mostly) - Software: Blu-ray Disc, DVD, CD, Main (Updatable) - Region: BD region code / DVD region code - Macrovision

4-34

Samsung Electronics

Troubleshooting

4-2-2 Update methods  There are 3 Update methods - CD Update - Ethernet Update - USB Update (New Feature)  F/W Update Method by CD 1. Insert update CD and close the tray.

2. Tray will be opened. 3. Press Yes. (If the update CD you inserted is a later one than Current Version)

4. Get rid of update CD from the Disc Tray. 5. Wait about 2~3 minutes.

Verifying Firmware Version.

Do you want to update Firmware? >Current Version : yymmdd.xx.XAA >New Version : yymmdd_xx_HT-BD1250_XAA Yes

No

Firmware Update. Now, Processing... Please, do not turn off the power.

6. When Finished, power automatically goes off.

Samsung Electronics

4-35

Troubleshooting

 F/W Update via Network

4-36

Samsung Electronics

Troubleshooting

 F/W Update by USB 1. Insert the USB on the rear panel.

Verifying Firmware Version.

2. Press Yes.

Do you want to update Firmware?

(If the USB you inserted has a later one than Current Version)

>Current Version : yymmdd.xx.XAA >New Version : yymmdd_xx_HT-BD1250_XAA Yes

4. Wait about 2~3 minutes.

No

Firmware Update. Now, Processing...

5. When Finished, power automatically goes off.

Please, do not turn off the power.

4-2-3 Cold Start Method (Initialize Setup) 1. This is useful for forgotten Parental Lock password. 2. Press ►| on the front panel for over 5 seconds while ‘no disc’ status. 3. Then, VFD sign: ‘COLD START’ 4. System Micom Cold Start : During Stand-By, just press  on the front panel for over 5 seconds. Then, Red LED will go out and go on.

Samsung Electronics

MENU LANGUAGE SELECTION

Press 1 for English

Pulsar 2 para Espanol

Touche 3 pour Francais

Macrovision : BBS41

4-37

Troubleshooting

4-3 Buyer-Region Code Setting Method 4-3-1 The inserting method of Region Code after replacing the Main PBA [Reference] - When replacing the Main PBA and System Micom (MUIC1) should be inserted the region code. - The set is not working properly if you don't insert the region code. - The region code is inserted by the remote control. 1. Press the “AUX” button on the remote control.

2. Press the "MARKER" button on the remote control during 4~5 seconds.

3. After step (2), you can see “T-MODE” on the VFD and press direction button “▼” during T-MODE. Please remind that “T-MODE” indicator on the VFD is appeared for a very short time.

T-MODE

4. After step (3), you can see “TEST − −” on the VFD. Insert number “3”, “3” to select Region Code.

4-38

TEST − − Samsung Electronics

Troubleshooting

5. After step (4), you can see “− −” on the VFD. Insert the Region Code (Below table) corresponding model with “0 ~ 9” buttons on the remote control.

−−

 Option Table

Area

HT-BD1250 5.1CH Region Code

HT-BD1220 2.1CH Region Code

USA

00

16

Japan

01

17

Korea

02

18

Taiwan

03

19

Philippines

04

20

Mexico

05

21

Latin American

06

22

Europe

07

23

Indonesia

08

24

Australia

09

25

Russia (semi_mic)

10

26

Only models which supporting semi-karaoke not including midi file.

Russia (full_mic)

11

27

Full karaoke models which support midi file.

Africa

12

28

China (semi_mic)

13

29

Brazil

14

30

Canada

15

31

Remark

 For example, insert 00 to select USA.

0−

Samsung Electronics

4-39

Troubleshooting

6. After step (5), you can see “00 USA” on the VFD. It means that currently System Micom (MUIC1) program is installed by USA specification.

00 USA

7. Turn the Power off.

[Tip] In case of System Micom (MUIC1) and EEPROM (MUIC2) problem, you can apply to this. For example, during Updating program of System Micom, if Updating fail is happened, it is impossible to turn on the system from stand-by status. The system will keep the stand-by status continuously, and the touch-key function will never work. In this case, you have to change System Micom, and set up the Buyer Region code again. In case of EEPROM, you don't need to care about it. After set-up the Region code, System Micom will store the information of the region code to EEPROM automatically.

4-40

Samsung Electronics

Exploded View & Part List

5. Exploded View & Part List 5-1 Product Exploded View........................................................................5-2 5-2 DECK Exploded View............................................................................5-4 5-3 Speaker System....................................................................................5-6 5-4 Electrical Part List.................................................................................5-7

Samsung Electronics

This Document can not be used without Samsung’s authorization.

5-1


5-1 Product Exploded View

T0265 W391 W275

M0014 T0076 C0104

C006 H008 AL210

FL261 W275

W392

W275 P003

W391 AD330

AM020

A4

AD150

AL180

AB501 W391

T0076 C011 T0076

C001

T0268

W275

W391 FL261 AD340 W275

AD502

AF020 AD504

P005

P007

 S.N.A: Service Not Available

5-2


Samsung Electronics


 Part List Loc. No.

Code No.

AB501

AH97-03233A

AD150

Q’ty

SNA

ASSY-BRACKET-TOP;HT-BD1250,HT-BD1250,BAS

1

SNA

AH64-04906C

DECORATION-FRONT;HT-BD1250,ABS,T2.0,440,

1

SNA

AD330

AH64-04915A

DECORATION-SIDE-L;HT-BD1250,ABS,2.5,33,3

1

SA

AD340

AH64-04916A

DECORATION-SIDE-R;HT-BD1250,ABS,2.5,33,3

1

SA

AD502

AH64-04908B

DOOR-DVD;HT-BD1250,ABS,2.0,17.4,146.0,12

1

SA

AD504

AH64-04907B

DOOR-HIDDEN;HT-BD1250,ABS,2.0T,20,80,10,

1

SNA

AF020

AH63-01832B

FILTER-VFD;HT-BD1250,PC T0.5,16,100,VIOL

1

SNA

AL180

AH67-00536A

LENS-STANDBY;HT-BD1250,PMMA MILKY,MILKY,

1

SA

AL210

AH67-00535A

LENS-VOLUME;HT-BD1250,PMMA MILKY,MILKY,W

1

SA

AM020

AH31-00039B

MOTOR FAN;C151BK10A2430,RDM5015S,0.12A,1

1

SA

C001

AH97-03048A

ASSY CABINET-FRONT;HT-BD1250,HT-BD1250,B

1

SNA

C006

AH64-04913A

KNOB-VOLUME;HT-BD1250,ABS,3.0,40,40,BLAC

1

SA

C0104

3809-001926

CABLE-FLAT;30V,80C,60mm,28P,1.25mm,UL289

1

SA

C011

AH61-02527A

SPRING ETC-DOOR;HT-Z310,STS 304 WPS,0.2,

1

SNA

FL261

3809-002242

FFC CABLE-FLAT;30V,80C,250mm,28P,1.0mm,U

1

SNA

FL261

3809-002241

FFC CABLE-FLAT;30V,80C,100MM,5P,1.0mm,UL

1

SNA

H008

AH92-03053A

ASSY PCB AMP;BD HOME THEATER,HT-BD1250,E

1

SNA

M0014

AH92-03052C

ASSY PCB MAIN;-,HT-BD1250,EU(option: I-P

1

SNA

P003

AH44-00203A

SMPS-HP;HT-BD1250,ORTP-527,150~200W,AC17

1

SA

P005

AH92-03059A

ASSY PCB FRONT;BD HOME THEATER,HT-BD1250

1

SNA

P007

AH92-03060A

ASSY PCB KEY;BD HOME THEATER,HT-BD1250,H

1

SNA

T0076

AH39-01041A

WIRE HARNESS;HT-BD1250,4,210mm,BLACK,WHI

1

SNA

T0076

AH39-01042A

WIRE HARNESS;HT-BD1250,6pin,100mm,BLACK,

1

SNA

T0076

AH39-01043A

WIRE HARNESS;HT-BD1250,24pin,#1~22 WHITE

1

SNA

T0265

AH96-00047B

ASSY COVER P-TOP;HT-BD1255,NOEUR,ASSY,HB

1

SNA

T0268

3903-000403

CBF-POWER CORD;AT,EU,CP2,HOUSING(2P),250

1

SNA

W275

6003-001561

SCREW-TAPTYPE;BH,+,-,B,M3,L6,ZPC(WHT),SW

24

SA

W391

6003-000275

SCREW-TAPTYPE;BH,+,B,M3,L10,ZPC(BLK),SWR

12

SA

W392

6003-000282

SCREW-TAPTYPE;BH,+,-,B,M3,L8,ZPC(BLK),SW

2

SNA

Samsung Electronics

Description;Specification


Remark

5-3


5-2 DECK Exploded View

W901 ( 2 x 7 W SCREW )

H200

H400 H401 ( 1.7 x 5 W SCREW )

PICK UP H301 W900 ( 2.6 x 6 W SCREW )

H300 H301

H100

H501 H500

5-4


Samsung Electronics



Code No.

H100

AK97-02460B

H200

Q’ty

SNA

ASSY FRAME-MAIN; ASSY,BD-P5B,-,-

1

SA

AK96-01014A

ASSY COVER; BD-P1600,-,-,-

1

SA

H300

AK96-01024A

ASSY TRAVERSE; BD-P5,-,-,-

1

SA

H301

AK61-00736A

BRACKET-SHAFT PU; DP-R3.5,SUS T1.0,-,

4

SA

H400

AK96-01025A

ASSY-HINGE PU; BD-P5,-,-,-

1

SA

H401

6002-001086

SCREW-TAPPING; PH,+,-,B,M1.7,L5.0,ZPC

1

SA

H500

AK92-01850A

ASSY PCB-RELAY; BD-P5B,BD-P1250,-,-

1

SA

H501

AK41-00891A

FFC-PU CABLE; BD-P1250,B TYPE,0.5 PIT

1

SA

PICKUP

AK96-01004A

ASSY PICK UP-BP5; SOH-BP5,BD-PLAYER,-,-

1

SA

W900

6003-001449

SCREW-TAPTITE; BH,+,B,M2.6,L6,NI PLT

4

SA

W901

6003-001199

SCREW-TAPTITE; PWH,+,-,B,M2,L7,ZPC(WH

4

SA

Samsung Electronics



Remark

5-5


5-3 Speaker System

Front Speaker (R)

Front Speaker (L)

Center Speaker 1

2 7

7

5

5 6

8

6

Subwoofer

4

8 3 7

7

5 8

6

6 Rear Speaker (R)

5

8 Rear Speaker (L)


Code No.

Front Speaker (L)

AH81-05185C

Front Speaker (R)

Q’ty

SNA

SPEAKER;PS-BD1255,FRONT SPEAKER -L,5.1CH

1

SA

AH81-05186C

SPEAKER;PS-BD1255,FRONT SPEAKER-R,5.1CH

1

SA

Rear Speaker (L)

AH81-05187C

SPEAKER;PS-BD1255,REAR SPEAKER-L,5.1CH

1

SA

Rear Speaker (R)

AH81-05188C

SPEAKER;PS-BD1255,REAR SPEAKER-R,5.1CH

1

SA

1

AH81-05234C

SPEAKER;PS-BD1255,FRONT SPEAKER-R,TOP

1

SA

2

AH81-05233C

SPEAKER;PS-BD1255,FRONT SPEAKER -L,TOP

1

SA

3

AH81-05236C

SPEAKER;PS-BD1255,REAR SPEAKER-R,TOP

1

SA

4

AH81-05235C

SPEAKER;PS-BD1255,REAR SPEAKER-L,TOP

1

SA

5

AH81-04981A

A/S;FRONT SPK BOT ASS`Y,FOR PS-TZ522,

1

SA

6

AH81-04982A

A/S;STAND ASS`Y,FOR PS-FTZ522,UHL CO.,LTD

1

SA

7

AH81-03943A

SPEAKER-SCREW;PS-TZ215,SCREW,Ф5*20,FOR

1

SA

8

AH81-03944A

SPEAKER-SCREW;PS-TZ215,SCREW,Ф3.5*16,FOR

5

SA

Center Speaker

AH81-05189C

SPEAKER;PS-BD1255,CENTER SPEAKER,5.1CH

1

SA

Subwoofer

AH81-05127C

SPEAKER-SUBWOOFER;PS-BD1250,SUBWOOFER

1

SA

Speaker Wire

AH81-02177B

SPEAKER;PS-Q20,SPK CORD, CONNECTOR,

1

SA

5-6



Remark

Samsung Electronics


5-4 Electrical Part List Loc. No. Part No.


Q’ty SNA Remark

P005 AH92-03059A ASSY PCB FRONT;BD HOME THEATER,HT-B 1 A0701 AH07-00245A VF DISPLAY;HNA-09SS79T,HT-Z320,88*1 1 AAC1 2203-005249 C-CER,CHIP;100nF,10%,50V,X7R,TP,160 5 AC510 3708-001666 CONNECTOR-FPC/FFC/PIC;28P,1MM,ANGLE 1 AC510 3708-001618 CONNECTOR-FPC/FFC/PIC;5P,1mm,SMD-A, 1 AD480 2203-000979 C-CER,CHIP;47nF,10%,50V,X7R,TP,2012 1 AF020 AH63-01832B FILTER-VFD;HT-BD1250,PC T0.5,16,100 1 AH410 AH61-02752A HOLDER-VFD;HT-BD1250,HIPS,1.5,104,2 1 AQ8 0504-000156 TR-DIGITAL;KSR2103,PNP,200MW,22K/22 1 AR30 2007-000074 R-CHIP;100ohm,5%,1/10W,TP,1608 3 C125 2203-006361 C-CER,CHIP;10000nF,10%,10V,X5R,TP,2 4 CN2 3722-002313 JACK-USB;4P/1C,AU30U,BLK,STRAIGHT,A 1 D0254 0404-000002 DIODE-SCHOTTKY;CMPSH-3,30V,200mA,SO 3 DR32 3301-000314 BEAD-SMD;120ohm,1.6x0.8x0.8mm,-,-,- 2 KAR11 2007-000124 R-CHIP;2.2Kohm,5%,1/10W,TP,1608 2 KAR21 2007-000070 R-CHIP;0ohm,5%,1/10W,TP,1608 2 MROP1 2007-000090 R-CHIP;10Kohm,5%,1/10W,TP,1608 4 PR6 2007-000072 R-CHIP;47ohm,5%,1/10W,TP,1608 1 R830 2007-000101 R-CHIP;82Kohm,5%,1/10W,TP,1608 1 UCN1 3711-005306 HEADER-BOARD TO CABLE;BOX,4P,1R,2MM 1 UIC2 0609-001189 MODULE REMOCON;HORIZONTAL,16.4MM,TR 1 VCN1 3711-005160 HEADER-BOARD TO CABLE;BOX,6P,1R,2mm 1 0406-001128 DIODE-TVS;MLVS-0603-E08,50V 5 1003-002176 IC-VFD;MC3401,LQFP,44P,10x10mm,-40m 1 3002-001134 BUZZER-PIEZO;85dB,12V,2K-4KHz,BK 1 3711-000471 HEADER-BOARD TO CABLE;3WALL,4P,1R,2 1 AH41-01223A PCB-FRONT;HT-BD1250,2Layer-Penol,2, 1 AH99-00377A ASSY AUTO INSERT-FRONT PCB;-,HT-BD1 1 M0045 AH98-00222B ASSY ACCESSORY;HT-BD1250,EDC,-,- 1 T0685 4301-000116 BATTERY-ALKALINE;1.5V,R03,10.5x44.5 2 PE I/B 6902-000385 BAG PE;LDPE,T0.03,W250,L350,TRP,8,1 1 M0025 AH42-00021A ANT FM T;T18011F-1,75 ohm,1800mm 1 AH68-00650L MARK RECYCLE-CARD-WARRANTY;YP-P2,EL 1 AH68-50254B LABEL-SERIAL;T0.1,L10,W45,SME/SEHZ 2 T0511 AH68-02178F MANUAL USERS;HT-BD1250,EDC,ENG/FRN/ 1 C-AUDI AH39-40001V CABLE-AUDIO CABLE;-,-,1P-1P,3000mm, 1 HT004 AH81-02286C A/S-EYEGLASS CLOTH;HT-TXQ120,POLY-B 1 6801-001763 CARD-REGISTRATION;Europe Registrati 1 M0045 AH98-00222Y ASSY ACCESSORY;HT-BD1250,-,-,- 1 PE I/B 6902-000385 BAG PE;LDPE,T0.03,W250,L350,TRP,8,1 1 AH68-50254B LABEL-SERIAL;T0.1,L10,W45,SME/SEHZ 2 T0511 AH68-02178G MANUAL USERS;HT-BD1250,EDC,POL/HUN/ 1 T0511 AH68-02178H MANUAL USERS;HT-BD1250,EDC,GRE/RUM/ 1 AH98-00227Y ASSY LABEL;HT-BD1250,-,-,- 1 FL261 3809-002242 FFC CABLE-FLAT;30V,80C,250mm,28P,1. 1 T0076 AH39-01041A WIRE HARNESS;HT-BD1250,4,210mm,BLAC 1 T0076 AH39-01042A WIRE HARNESS;HT-BD1250,6pin,100mm,B 1 S-SHEE AH63-01301A SHEET-SET;HT-Q40,-,-,-,-,-,- 1 L-BARC AH68-00371A LABEL-BAR CODE;DVD-611/XAA,MOJO2000 2 CCM1 AH68-01929H LABEL RATING;HT-A100,ELS,SLIVER PET 2 M-CLEA AH68-01984A MANUAL-CLEANING;HT-X200,ART PAPER 1 AH69-02490A CUSHION-SET.L;HT-BD1250,EPS,15,449, 1 AH69-02491A CUSHION-SET.R;HT-BD1250,EPS,15,449, 1

Samsung Electronics

SNA SNA SNA SA SA SA SNA SNA SA SNA SNA SNA SA SNA SNA SNA SNA SNA SNA SNA SNA SA SA SA SNA SNA SNA SNA

SNA SA SNA SA SNA SNA SA SA SNA SNA

SNA SNA SNA SA SA

SNA SNA SNA SNA SNA SNA SNA SA SNA SNA

Loc. No. Part No.


Q’ty SNA Remark

AH68-02205D LABEL-TOPPER POP;HT-BD1250,EUR,ART 1 P007 AH92-03060A ASSY PCB KEY;BD HOME THEATER,HT-BD1 1 6MC22 2203-000975 C-CER,CHIP;47nF,10%,25V,X7R,TP,1608 4 AAC1 2203-005249 C-CER,CHIP;100nF,10%,50V,X7R,TP,160 6 AC14 2203-000189 C-CER,CHIP;100nF,+80-20%,25V,Y5V,16 1 AC510 3708-001618 CONNECTOR-FPC/FFC/PIC;5P,1mm,SMD-A, 1 AHR40 2007-000088 R-CHIP;7.5Kohm,5%,1/10W,TP,1608 1 AQ7 0504-000128 TR-DIGITAL;-,NPN,200MW,22K/22K,SOT- 2 AS420 3406-001146 SWITCH-ROTARY;5V DC,HOLLOW-SHAFT 1 C134 2203-000257 C-CER,CHIP;10nF,10%,50V,X7R,TP,1608 4 C3 2203-000384 C-CER,CHIP;0.015nF,5%,50V,C0G,1608 6 D1 0401-001099 DIODE-SWITCHING;1N4148WS,75V,150mA, 6 FD7 0601-001226 LED;SMD,RED,1.2x0.8mm,660nm,1.6x0.8 1 FL261 3809-002241 FFC CABLE-FLAT;30V,80C,100MM,5P,1.0 1 L0405 0601-001949 LED;SMD,BLUE,1.6x0.8x0.4mm,468nm,1. 4 MR166 2007-000119 R-CHIP;560ohm,5%,1/10W,TP,1608 4 MROP1 2007-000090 R-CHIP;10Kohm,5%,1/10W,TP,1608 7 ND51C2 2007-000066 R-CHIP;20Kohm,1%,1/10W,TP,1608 6 PPC2 2203-005148 C-CER,CHIP;100nF,10%,16V,X7R,TP,160 1 R329 2007-000081 R-CHIP;2.7Kohm,5%,1/10W,TP,1608 1 R512 2007-000107 R-CHIP;470Kohm,5%,1/10W,TP,1608 1 R67 2007-000065 R-CHIP;2.2Mohm,5%,1/10W,TP,1608 6 UCN1 3711-005306 HEADER-BOARD TO CABLE;BOX,4P,1R,2MM 1 VCN1 3711-005160 HEADER-BOARD TO CABLE;BOX,6P,1R,2mm 1 WL02 3301-001069 BEAD-SMD;120ohm,1.6x0.8x0.8mm,200mA 4 0403-001064 DIODE-ZENER;RLZ5.1B,4.94-5.2V,500mW 1 1209-001742 IC-SENSOR;SS02,SOT26,6P,2.9x1.6mm,P 1 1209-001851 IC-SENSOR;MST08S16,SOP,16P,9.9x3.9m 1 AH41-01224A PCB-KEY;HT-BD1250,2layer penol,2,1, 1 AH99-00378A ASSY AUTO INSERT-KEY PCB;-,HT-BD125 1 M0014 AH92-03052C ASSY PCB MAIN;-,HT-BD1250,EU(option 1 AAC1 2203-005249 C-CER,CHIP;100nF,10%,50V,X7R,TP,160 3 AC109 2203-000783 C-CER,CHIP;0.33nF,5%,50V,C0G,1608 2 AC139 2203-000491 C-CER,CHIP;2.2nF,10%,50V,X7R,1608 1 AC510 3708-001086 CONNECTOR-FPC/FFC/PIC;28P,1.25mm,ST 1 AC510 3708-001766 CONNECTOR-FPC/FFC/PIC;11P,1mm,SMD-S 1 AC510 3708-001981 CONNECTOR-FPC/FFC/PIC;28P,1mm,SMD-S 1 AC510 3708-002603 CONNECTOR-FPC/FFC/PIC;22P,1mm,SMD-S 1 AC510 3708-002619 CONNECTOR-FPC/FFC/PIC;13P,1.0MM,SMD 1 AC6 2402-001049 C-AL,SMD;10uF,20%,16V,GP,TP,3.3x3.3 2 AD480 2203-000585 C-CER,CHIP;0.22nF,10%,50V,X7R,1005 1 AD480 2203-005659 C-CER,CHIP;0.18nF,5%,50V,NP0,1005 1 AD480 2203-005968 C-CER,CHIP;4.7NF,10%,50V,X7R,TP,100 1 AD480 2203-006333 C-CER,CHIP;10000nF,20%,16V,X5R,TP,3 5 AD480 2203-006336 C-CER,CHIP;10000nF,10%,25V,X5R,3216 5 ADHESI 0201-001415 ADHESIVE-TS;7387 ,AMR,1.5,- 0.02 ADHESI 0201-001416 ADHESIVE-SIL;384,WHT,500000~2250000 0.08 AH060 AH62-00200A HEAT SINK-MAIN;HT-BD1250,AL EXTR,1. 1 AIC2 1002-001558 IC-A/D CONVERTER;AK5367,24,VSOP,30P 1 AR150 2007-000078 R-CHIP;1Kohm,5%,1/10W,TP,1608 1 AR164 2007-000076 R-CHIP;330ohm,5%,1/10W,TP,1608 2 AR30 2007-000074 R-CHIP;100ohm,5%,1/10W,TP,1608 1 AR30 2007-001306 R-CHIP;150ohm,5%,1/16W,TP,1005 1 AR48 2007-000431 R-CHIP;16Kohm,5%,1/10W,TP,1608 1


SNA

SNA SNA SNA SNA SA SNA SA SA SNA SNA SA SNA SNA SNA SNA SNA SA SNA SNA SNA SNA SNA SA SNA SNA SA SNA SNA SNA

SNA SNA SNA SNA SA SNA SNA SNA SNA SA SNA SNA SNA SNA SNA SNA SNA SNA SA SNA SNA SNA SA SNA

5-7


Loc. No. Part No.


Q’ty SNA Remark

AR49 2007-000140 R-CHIP;1Kohm,5%,1/16W,TP,1005 26 AVC08 2203-002398 C-CER,CHIP;22nF,10%,50V,X7R,1608 1 AVR73 2007-000142 R-CHIP;2.7Kohm,5%,1/16W,TP,1005 2 C 2402-001160 C-AL,SMD;330UF,20%,16V,WT,TP,1008 3 C100 2203-005065 C-CER,CHIP;1000nF,+80-20%,10V,Y5V,1 2 C102 2203-006158 C-CER,CHIP;100nF,10%,16V,X7R,1005 184 C125 2203-006361 C-CER,CHIP;10000nF,10%,10V,X5R,TP,2 110 C239 2203-006047 C-CER,CHIP;33nF,10%,16V,X7R,1005 6 C254 2203-000438 C-CER,CHIP;1nF,10%,50V,X7R,TP,1005 13 C317 2203-005692 C-CER,CHIP;4700nF,+80-20%,16V,Y5V,T 9 C514 2404-001035 C-TA,CHIP;10uF,10%,25V,-,TP,6032 1 C605 2203-000476 C-CER,CHIP;1000nF,+80-20%,16V,Y5V,2 4 C637 2203-001656 C-CER,CHIP;0.47nF,5%,50V,NP0,1608 4 C711 2203-002982 C-CER,CHIP;6.8nF,10%,50V,X7R,1005 1 CE1 2404-000284 C-TA,CHIP;10uF,20%,16V,-,TP,3528 1 CEIC1 AK09-00159A IC MICOM;MC80C0316-MC015 D32,44,2.7 1 CEQ2 0505-000110 FET-SILICON;2N7002,N,60V,115mA,7.5o 2 CER07 2007-001308 R-CHIP;200ohm,5%,1/16W,TP,1005 1 CF2 2801-004655 CRYSTAL-SMD;25MHz,50ppm,SX-3,18pF,2 2 CN1 3711-005582 HEADER-BOARD TO CABLE;BOX,24P,2R,2. 1 CON2 3722-002730 JACK-MODULAR;6P/4P,USB+LAN,ANGLE,N, 1 CQ3 0501-002184 TR-SMALL SIGNAL;KTD1304,NPN,200mW,S 2 D0254 0404-000002 DIODE-SCHOTTKY;CMPSH-3,30V,200mA,SO 5 D2505 0404-001036 DIODE-SCHOTTKY;SDB30A40,40V,3000MA, 1 DC1 2203-000386 C-CER,CHIP;.015nF,5%,50V,C0G,TP,100 3 DC18 2203-005138 C-CER,CHIP;1.8nF,10%,50V,X7R,1005 1 DC87 2203-001153 C-CER,CHIP;.068nF,5%,50V,NP0,1005 1 DOIC1 AH14-10004R IC-CMOS LOGIC;74HCU04,-,SOP,14P,-,- 1 DR1 2007-000043 R-CHIP;1Kohm,1%,1/10W,TP,1608 2 DR32 3301-000314 BEAD-SMD;120ohm,1.6x0.8x0.8mm,-,-,- 2 DR37 2007-000932 R-CHIP;470ohm,5%,1/16W,TP,1005 1 DR39 2007-000162 R-CHIP;100Kohm,5%,1/16W,TP,1005 5 DR4 2007-007142 R-CHIP;10Kohm,1%,1/16W,TP,1005 3 DR8 2007-007001 R-CHIP;3.9Kohm,5%,1/16W,TP,1005 1 DU501 1203-001824 IC-VOL. DETECTOR;7042,SOT-89,3P,PLA 1 F103 2901-001302 FILTER-EMI SMD;20V,0.3A,0pF,2.0x1.2 1 FAL4 2703-000301 INDUCTOR-SMD;2.7uH,10%,1608 1 FMIC1 1103-001333 IC-EEPROM;24C08A,8Kbit,1Kx8,SOP,8P, 2 FR18 2007-000982 R-CHIP;5.6Kohm,5%,1/16W,TP,1005 1 HD9 1405-001192 VARISTOR;12Vdc,30A,1.6x0.8x0.55mm,T 10 HDDCN 3708-001935 CONNECTOR-FPC/FFC/PIC;40P,0.5mm,SMD 1 HDMI 3701-001313 CONNECTOR-HDMI;19P,2R,PLUG,ANGLE,AU 1 HDR2 2007-000151 R-CHIP;15Kohm,5%,1/16W,TP,1005 7 HDR7 2007-000139 R-CHIP;220ohm,5%,1/16W,TP,1005 2 HDR9 2007-000152 R-CHIP;20Kohm,5%,1/16W,TP,1005 1 HIC1 1205-003113 IC-TRANSMITTER;SII9134CTU,TQFP,100P 1 HR12 2007-000591 R-CHIP;22ohm,1%,1/10W,TP,1608 2 HR37 2007-008107 R-CHIP;698ohm,1%,1/10W,TP,1608 1 HR60 2007-000779 R-CHIP;33ohm,1%,1/10W,TP,1608 4 HR8 2703-000166 INDUCTOR-SMD;2.7uH,5%,3225 1 HRP2 2011-001344 R-NETWORK;100ohm,5%,1/16W,L,CHIP,8P 18 IC1 1107-001763 IC-NOR FLASH;AT26DF081A-SU,8Mbit,1M 1 IC104 0801-002518 IC-CMOS LOGIC;74LCX157,2-INPUT MULT 1 IC104 0801-002564 IC-CMOS LOGIC;74VHCT244A,BUFFER,TSS 1 IC115 1107-001505 IC-FLASH MEMORY;AT49BV163DT,16Mbit, 1 IC520 0903-001580 IC-MICROCONTROLLER;BCM7620,LQFP,216 1 IC520 0903-001565 IC-MICROCONTROLLER;LC87F5NC8AVU,QFP 1 J1002 3722-002027 JACK-PIN;6P/6C,SN,YEL/GN/WH/BL/RD,A 1

5-8

SNA SNA SA SNA SNA SA SNA SA SNA SA SA SA SNA SA SA SNA SNA SNA SA SA SA SA SA SA SA SA SNA SA SNA SNA SA SNA SA SNA SA SNA SA SA SNA SA SA SA SNA SA SNA SNA SNA SA SNA SA SA SNA SA SA SNA SNA SNA SA

Loc. No. Part No.


Q’ty SNA Remark

J914 2007-000029 R-CHIP;0ohm,5%,1/8W,TP,2012 1 JC24 2203-005819 C-CER,CHIP;1000nF,+80-20%,16V,Y5V,T 3 JC31 2203-000715 C-CER,CHIP;3.3nF,10%,50V,X7R,1608 3 JP19 2007-000033 R-CHIP;0ohm,5%,1/4W,TP,3216 5 KAR21 2007-000070 R-CHIP;0ohm,5%,1/10W,TP,1608 30 KOP1 1201-000163 IC-OP AMP;4560,SOP,8P,173MIL,DUAL,1 1 KR7 2007-000402 R-CHIP;150ohm,5%,1/10W,TP,1608 3 L12 3301-000353 BEAD-SMD;120ohm,2x1.25x0.9mm,-,TP,- 5 L8 2703-000402 INDUCTOR-SMD;1uH,20%,3225 1 MC2 2203-000254 C-CER,CHIP;10nF,10%,16V,X7R,TP,1005 10 MC9 2203-000627 C-CER,CHIP;.022nF,5%,50V,C0G,TP,100 8 MD1 0404-001089 DIODE-SCHOTTKY;RB551V-30,20V,500MA, 1 MIC2 1105-001573 IC-DRAM;K4S281632,-,128Mbit,8Mx16Bi 1 MR10 2007-007141 R-CHIP;240ohm,5%,1/16W,TP,1005 1 MR122 2007-000094 R-CHIP;22Kohm,5%,1/10W,TP,1608 1 MR13 2007-000157 R-CHIP;47Kohm,5%,1/16W,TP,1005 23 MR16 2007-000168 R-CHIP;470Kohm,5%,1/16W,TP,1005 2 MR306 2007-000141 R-CHIP;2.2Kohm,5%,1/16W,TP,1005 5 MR31 2007-001305 R-CHIP;120ohm,5%,1/16W,TP,1005 4 MR36 2007-000153 R-CHIP;22Kohm,5%,1/16W,TP,1005 1 MR39 2007-000242 R-CHIP;1.5Kohm,5%,1/16W,TP,1005 29 MR8 2007-000503 R-CHIP;2.2ohm,5%,1/10W,TP,1608 3 MROP1 2007-000090 R-CHIP;10Kohm,5%,1/10W,TP,1608 1 NDL3 3301-000317 BEAD-SMD;120ohm,2012,TP,-,- 4 OTR1 2007-001292 R-CHIP;33ohm,5%,1/16W,TP,1005 63 P003 AH44-00203A SMPS-HP;HT-BD1250,ORTP-527,150~200W 1 PC23 2203-006560 C-CER,CHIP;22000nF,10%,10V,X5R,3225 1 PC69 2203-006818 C-CER,CHIP;47000nF,20%,6.3V,X5R,321 2 PE11 2402-001276 C-AL,SMD;47uF,20%,35V,TP,6.6x6.6x5. 1 PIC2 1203-002220 IC-POSI.ADJUST REG.;LD1117,DPAK,3P, 1 PIC2 1203-005188 IC-DC/DC CONVERTER;AOZ1021AIL,SOP,8 2 PL9 2703-003248 INDUCTOR-SMD;8.2uH,20%,7272 2 PPC2 2203-005148 C-CER,CHIP;100nF,10%,16V,X7R,TP,160 2 PPD1 0402-000309 DIODE-RECTIFIER;1SR154-400,400V,1A, 4 PR24 2007-002970 R-CHIP;56ohm,5%,1/16W,TP,1005 1 PR27 2007-000144 R-CHIP;5.1Kohm,5%,1/16W,TP,1005 1 PX1 2801-004021 CRYSTAL-SMD;24.576MHz,20ppm,28-AAN, 1 Q373 0501-000546 TR-SMALL SIGNAL;KSA1298,PNP,200mW,S 1 Q375 0504-000126 TR-DIGITAL;KSR1101,NPN,200mW,4.7K/4 1 Q409 0505-001170 FET-SILICON;SI9933ADY-T1,P,-20V,3.4 1 Q409 0505-001679 FET-SILICON;FDC6301N,N,25V,0.22A,5O 1 Q409 0505-002491 FET-SILICON;AO4404BL,N,30V,8.5A,0.0 1 Q613 0501-000465 TR-SMALL SIGNAL;MMBT3904,NPN,350mW, 3 R1 2007-002425 R-CHIP;1ohm,5%,1/10W,TP,1608 4 R1035 2007-000287 R-CHIP;100ohm,1%,1/10W,TP,1608 1 R104 2007-000148 R-CHIP;10Kohm,5%,1/16W,TP,1005 64 R105 2007-000138 R-CHIP;100ohm,5%,1/16W,TP,1005 35 R111 2007-000171 R-CHIP;0ohm,5%,1/16W,TP,1005 72 R123 2007-000159 R-CHIP;56Kohm,5%,1/16W,TP,1005 2 R124 2007-000775 R-CHIP;33Kohm,5%,1/16W,TP,1005 5 R15 2007-000134 R-CHIP;33Kohm,5%,1/10W,TP,1608 1 R16 2007-001313 R-CHIP;330ohm,5%,1/16W,TP,1005 1 R227 2007-000086 R-CHIP;5.6Kohm,5%,1/10W,TP,1608 1 R307 2007-007226 R-CHIP;49.9ohm,1%,1/10W,TP,1608 4 R309 2007-007441 R-CHIP;562ohm,1%,1/10W,TP,1608 2 R319 2007-000143 R-CHIP;4.7Kohm,5%,1/16W,TP,1005 39 R320 2007-000458 R-CHIP;18Kohm,5%,1/10W,TP,1608 2 R326 2007-001325 R-CHIP;3.3Kohm,5%,1/16W,TP,1005 5


SNA SNA SNA SNA SNA SNA SNA SNA SA SA SNA SNA SA SNA SNA SNA SNA SNA SNA SA SA SA SNA SNA SNA SA SA SA SA SA SNA SA SNA SNA SNA SNA SA SA SNA SA SA SNA SA SNA SA SNA SNA SNA SA SA SNA SNA SNA SA SNA SNA SNA SNA

Samsung Electronics


Loc. No. Part No.


Q’ty SNA Remark

R338 2007-000173 R-CHIP;22ohm,5%,1/16W,TP,1005 7 R348 2007-000502 R-CHIP;2.2ohm,5%,1/8W,TP,2012 1 R509 2007-000170 R-CHIP;1Mohm,5%,1/16W,TP,1005 6 R528 2007-000835 R-CHIP;39ohm,1%,1/10W,TP,1608 2 R54 2007-008426 R-CHIP;12.4Kohm,1%,1/10W,TP,1608 1 R726 2007-000695 R-CHIP;3.3ohm,5%,1/10W,TP,1608 9 RE6 2402-001042 C-AL,SMD;100uF,20%,16V,GP,TP,6.6x6. 1 REC3 2402-001237 C-AL,SMD;330uF,20%,6.3V,-,TP,6.3x7. 5 REG1 1203-001255 IC-POSI.FIXED REG.;7805,D-PAK,3P,PL 1 REG3 1203-002935 IC-POSI.ADJUST REG.;AIC1117AGE,TO-2 1 RR17 2007-003009 R-CHIP;16Kohm,5%,1/16W,TP,1005 1 RZ07 2007-000156 R-CHIP;30Kohm,5%,1/16W,TP,1005 1 S0F1331 2203-002717 C-CER,CHIP;10nF,+80-20%,50V,Y5V,100 1 T0052 2703-000158 INDUCTOR-SMD;1uH,10%,2012 2 T0052 2703-002804 INDUCTOR-SMD;10uH,20%,12x12mm 1 T0076 AH39-01040A WIRE HARNESS;HT-BD1250,4,640mm,Blac 1 T0087 1203-002253 IC-POSI.FIXED REG.;KIA7808AF,DPAK,3 1 T0087 1203-002842 IC-POSI.FIXED REG.;AP1117D-33A,TO-2 2 T0122 2802-001179 RESONATOR-CERAMIC;4MHZ,0.5%,BK,8X3X 1 T0568 3301-001202 BEAD-SMD;120ohm,4532,TP,167ohm/260M 11 T0568 3301-001655 BEAD-SMD;33ohm,3216,3000mA,TP,16ohm 9 TR100B 2007-000598 R-CHIP;22ohm,5%,1/4W,TP,3216 1 U1 1204-002900 IC-VIDEO DECODER;BCM7440PYKFEBG,FCB 1 U303 1001-001482 IC-ANALOG SWITCH;MAX4610CUD,SPST CM 2 U309 1201-000166 IC-OP AMP;LM358,SOP,ST,8P,150MIL,DU 1 U504 1203-002425 IC-POSI.FIXED REG.;1117,SOT-223,3P, 1 U600 1105-001397 IC-DRAM;K4S641632,SDR,64Mbit,4Mx16, 1 U603 0802-001007 IC-CMOS LOGIC;74LCX244,BUFFER/LINE 1 UCW0 3708-000448 CONNECTOR-FPC/FFC/PIC;6P,1.25mm,STR 1 USC4 2203-002605 C-CER,CHIP;0.008nF,0.25pF,50V,NP0,T 2 UX2 2802-001174 RESONATOR-CERAMIC;10MHZ,0.5%,BK,8X3 1 VC37 2203-006048 C-CER,CHIP;100nF,10%,10V,X7R,TP,100 56 VC40 2203-001405 C-CER,CHIP;22nF,+80-20%,25V,Y5V,100 2 VIC1 1201-002707 IC-VIDEO AMP;MM1757CHBE,HSOP-36A,36 1 VL6 2703-000398 INDUCTOR-SMD;10uH,10%,3225 2 VR37 2007-001014 R-CHIP;51ohm,5%,1/10W,TP,1608 1 WL02 3301-001069 BEAD-SMD;120ohm,1.6x0.8x0.8mm,200mA 5 WR15B 2007-001044 R-CHIP;56ohm,5%,1/10W,TP,1608 4 X202 2801-004371 CRYSTAL-SMD;12.288MHz,50ppm,SX-1,18 1 ZC4 2203-000332 C-CER,CHIP;0.012nF,5%,50V,C0G,1608 2 ZR10 2007-001164 R-CHIP;75ohm,1%,1/10W,TP,1608 12 ZRN10 2011-001261 R-NETWORK;33ohm,5%,1/16W,L,CHIP,8P, 12 ZVL3 3301-001495 BEAD-SMD;120ohm,2012,2500mA,TP,115o 10 0403-001203 DIODE-ZENER;5245B,14.25-15.75V,225m 1 0603-001164 OPTIC TRANSMITTER;5V,16Mb/s,0m,0dBm 2 0904-002352 IC-DSP;TMS320DA788B,TQFP,144P,20.2x 1 1001-001298 IC-ANALOG SWITCH;L10X,10P,2.1x1.6,1 1 1003-002187 IC-MOTOR DRIVER;AM9268,SOP,42P,18x7 1 1003-002188 IC-MOTOR DRIVER;AM9858,SOP,28P,18x7 1 1006-001438 IC-BUS DRIVER;R5H30201NA04NQ08,QFN, 1 1009-001042 IC-SAMPLE&HOLD;CS8421-CZZR,TSSOP,20 1 1105-001931 IC-DDR2 SDRAM;K4T51163Q,DDR2-800,51 2 1105-001942 IC-DDR2 SDRAM;K4T1G164Q,DDR2,1Gbit, 2 1107-001805 IC-NAND FLASH;NAND512W3A-2CN6,512Mb 1 1203-005469 IC-POWER SUPERVISOR;MIC2009YM6,SOT- 1 1203-005526 IC-DC/DC CONVERTER;AOZ1025DIL,DFN,1 1 1205-003160 IC-CODEC;AK4113VF,VSOP,30P,9.7x5.6m 1 2007-000146 R-CHIP;6.8Kohm,5%,1/16W,TP,1005 1 2007-001319 R-CHIP;1.2Kohm,5%,1/16W,TP,1005 1

Samsung Electronics

SNA SC SNA SNA SNA SNA SNA SA SA SA SA SA SA SNA SNA SNA SNA SA SA SA SA SNA SA SNA SA SA SNA SNA SA SNA SA SA SA SA SNA SNA SNA SNA SNA SNA SA SA SA SA SNA SNA SNA SNA SNA SNA SNA SNA SNA SNA SNA SNA SNA SNA SA

Loc. No. Part No.


Q’ty SNA Remark

2007-007008 R-CHIP;300ohm,5%,1/16W,TP,1005 4 2007-007132 R-CHIP;15Kohm,1%,1/16W,TP,1005 1 2007-007136 R-CHIP;4.7Kohm,1%,1/16W,TP,1005 1 2007-007138 R-CHIP;27Kohm,1%,1/16W,TP,1005 1 2007-007310 R-CHIP;8.2Kohm,1%,1/16W,TP,1005 1 2007-007334 R-CHIP;200Kohm,1%,1/16W,TP,1005 1 2007-007528 R-CHIP;1.5Kohm,1%,1/16W,TP,1005 1 2007-007698 R-CHIP;5.1Kohm,1%,1/16W,TP,1005 1 2007-008275 R-CHIP;30Kohm,1%,1/16W,TP,1005 1 2007-008297 R-CHIP;33.2Kohm,1%,1/16W,TP,1005 1 2011-001345 R-NETWORK;10Kohm,5%,1/16W,L,CHIP,8P 3 2402-000125 C-AL,SMD;1uF,20%,50V,GP,TP,3.3x3.3x 1 2402-000130 C-AL,SMD;2.2uF,20%,50V,GP,TP,4.3x4. 1 2404-001474 C-TA,CHIP;47uF,20%,10V,TP,2.2X1.25X 5 2801-004641 CRYSTAL-UNIT;54MHz,20ppm,HC-49/U,10 1 3709-001287 CONNECTOR-CARD SLOT;10P,1.5mm,SMD-A 1 3710-002628 SOCKET-INTERFACE;18P,1R,0.5mm,SMD-A 1 AH40-00152A TUNER-MODULE;KST-MW104FV1-S58,MAX-D 1 AH41-01218B PCB-MAIN;HT-BD1250,FR-4,4,00,T1.6,1 1 AH69-02426B PAD-THERMAL.B;HT-BD1250,OTHER,T2.0, 1 AH94-02237F ASSY-NOR FLASH;HT-Z320,MX25L1605A,M 1 AH99-00452A ASSY AUTO INSERT-MAIN CPB;-,HT-BD12 1 H008 AH92-03053A ASSY PCB AMP;BD HOME THEATER,HT-BD1 1 6MC22 2203-000975 C-CER,CHIP;47nF,10%,25V,X7R,TP,1608 1 AAC1 2203-005249 C-CER,CHIP;100nF,10%,50V,X7R,TP,160 85 AAR11 2007-000312 R-CHIP;10ohm,5%,1/4W,TP,3216 12 AC10 2203-000531 C-CER,CHIP;2.7nF,10%,50V,X7R,1608 12 AC139 2203-000491 C-CER,CHIP;2.2nF,10%,50V,X7R,1608 6 AC14 2203-000189 C-CER,CHIP;100nF,+80-20%,25V,Y5V,16 2 AC510 3708-001086 CONNECTOR-FPC/FFC/PIC;28P,1.25mm,ST 1 AC6 2402-001049 C-AL,SMD;10uF,20%,16V,GP,TP,3.3x3.3 6 AD480 2203-001386 C-CER,CHIP;100nF,10%,100V,X7R,TP,32 6 AD480 2203-005886 C-CER,CHIP;0.15NF,5%,200V,C0G,TP,20 6 AD480 2203-006333 C-CER,CHIP;10000nF,20%,16V,X5R,TP,3 5 AD480 2203-006336 C-CER,CHIP;10000nF,10%,25V,X5R,3216 12 AD480 2203-006698 C-CER,CHIP;1000nF,10%,25V,X7R,1608 18 AD480 2203-006706 C-CER,CHIP;2200nF,10%,50V,X7R,3225 1 AH025 AH62-00199A HEAT SINK-AMP;HT-BD1250,AL EXTR,1.6 1 AH260 AH61-02854A HOLDER-HEATSINK;HT-BD1250,HIPS V0,2 3 AQ7 0504-000128 TR-DIGITAL;-,NPN,200MW,22K/22K,SOT- 4 AQ8 0504-000156 TR-DIGITAL;KSR2103,PNP,200MW,22K/22 1 AR108 2007-000097 R-CHIP;47Kohm,5%,1/10W,TP,1608 12 AR150 2007-000078 R-CHIP;1Kohm,5%,1/10W,TP,1608 14 AR28 2007-000683 R-CHIP;3.3Kohm,1%,1/10W,TP,1608 6 AR30 2007-000074 R-CHIP;100ohm,5%,1/10W,TP,1608 4 AR42 2007-000939 R-CHIP;47Kohm,1%,1/10W,TP,1608 6 ARR2 2007-000102 R-CHIP;100Kohm,5%,1/10W,TP,1608 2 C 2401-004106 C-AL;680uF,20%,50V,-,BK,12.5 x 35,5 6 C125 2203-006361 C-CER,CHIP;10000nF,10%,10V,X5R,TP,2 11 C134 2203-000257 C-CER,CHIP;10nF,10%,50V,X7R,TP,1608 18 C212 2203-000440 C-CER,CHIP;1nF,10%,50V,X7R,1608 1 C24 2203-005565 C-CER,CHIP;1nF,5%,50V,NP0,TP,1608 18 C4N08 2203-000140 C-CER,CHIP;1.5nF,10%,50V,X7R,1608 6 CCW1 3711-000658 HEADER-BOARD TO CABLE;BOX,12P,1R,2. 1 CER04 2007-000084 R-CHIP;4.7Kohm,5%,1/10W,TP,1608 7 D1 0401-001099 DIODE-SWITCHING;1N4148WS,75V,150mA, 7 DR1 2007-000043 R-CHIP;1Kohm,1%,1/10W,TP,1608 6


SNA SNA SA SNA SA SNA SNA SNA SNA SNA SA SNA SNA SNA SNA SA SNA SA SNA SNA SNA SNA

SNA SNA SNA SNA SNA SNA SNA SA SA SNA SNA SNA SNA SA SNA SNA SNA SA SA SNA SNA SA SNA SNA SNA SNA SNA SNA SNA SA SNA SNA SNA SA SNA

5-9


Loc. No. Part No.


Q’ty SNA Remark

ER19 2007-002899 R-CHIP;10ohm,1%,1/10W,TP,1608 6 FAN1 3711-000820 HEADER-BOARD TO CABLE;BOX,2P,1R,2.5 1 FAR22 2007-000082 R-CHIP;3.3Kohm,5%,1/10W,TP,1608 3 FD7 0601-001226 LED;SMD,RED,1.2x0.8mm,660nm,1.6x0.8 6 FMR4 2007-000080 R-CHIP;2Kohm,5%,1/10W,TP,1608 12 HDC24 2402-000008 C-AL,SMD;47uF,20%,16V,GP,TP,6.6x6.6 2 IDR23 2007-000116 R-CHIP;120ohm,5%,1/10W,TP,1608 1 JP19 2007-000033 R-CHIP;0ohm,5%,1/4W,TP,3216 10 KAC5 2203-001126 C-CER,CHIP;0.68nF,10%,50V,X7R,1608 12 KAR21 2007-000070 R-CHIP;0ohm,5%,1/10W,TP,1608 3 KAR7 2007-000120 R-CHIP;680ohm,5%,1/10W,TP,1608 12 KOP1 1201-000163 IC-OP AMP;4560,SOP,8P,173MIL,DUAL,1 3 KQ1 0501-000279 TR-SMALL SIGNAL;KSA1182-Y,PNP,150mW 2 KQ6 0501-000341 TR-SMALL SIGNAL;KSC1623-L,NPN,200mW 1 MC111 2203-000646 C-CER,CHIP;0.024NF,5%,50V,C0G,TP,16 2 MPIC1 AH14-10003E IC;KIA7812PI,,TO-220 1 MR112 2007-000309 R-CHIP;10ohm,5%,1/10W,TP,1608 18 MR122 2007-000094 R-CHIP;22Kohm,5%,1/10W,TP,1608 2 MR19 2007-000087 R-CHIP;6.8Kohm,5%,1/10W,TP,1608 9 MROP1 2007-000090 R-CHIP;10Kohm,5%,1/10W,TP,1608 23 P803T 1404-001483 THERMISTOR-PTC;470ohm,50%,32V,TP 1 PPD1 0402-000309 DIODE-RECTIFIER;1SR154-400,400V,1A, 2 PR4 2007-000265 R-CHIP;1.8Kohm,1%,1/10W,TP,1608 6 PR6 2007-000072 R-CHIP;47ohm,5%,1/10W,TP,1608 18 Q1 0501-000479 TR-SMALL SIGNAL;KST42,NPN,350mW,SOT 2 Q409 0505-002365 FET-SILICON;IRF6645,N,100V,5.7A,0.0 12 R1 2007-002425 R-CHIP;1ohm,5%,1/10W,TP,1608 12 R15 2007-000134 R-CHIP;33Kohm,5%,1/10W,TP,1608 19 R331 2007-000079 R-CHIP;1.8Kohm,5%,1/10W,TP,1608 1 R3A08 2007-000091 R-CHIP;12Kohm,5%,1/10W,TP,1608 1 R3A13 2007-000100 R-CHIP;68Kohm,5%,1/10W,TP,1608 6 R419 2007-000882 R-CHIP;4.7ohm,5%,1/10W,TP,1608 12 R505 2007-000496 R-CHIP;2.2Kohm,5%,1/4W,TP,3216 6 R509 2007-001179 R-CHIP;8.2Kohm,5%,1/10W,TP,1608 6 R830 2007-000101 R-CHIP;82Kohm,5%,1/10W,TP,1608 1 R893B 2007-000122 R-CHIP;1.2Kohm,5%,1/10W,TP,1608 17 RE6 2402-001042 C-AL,SMD;100uF,20%,16V,GP,TP,6.6x6. 2 REG1 1203-001255 IC-POSI.FIXED REG.;7805,D-PAK,3P,PL 1 RR2 2007-000075 R-CHIP;220ohm,5%,1/10W,TP,1608 6 S1G0843 2203-000989 C-CER,CHIP;47nF,10%,50V,X7R,2012 1 S1H0220 2402-000120 C-AL,SMD;10UF,20%,50V,GP,TP,6.6X6.6 3 T0415 3716-001243 TERMINAL-BLOCK;WIRE TYPE,12P,14mm,0 1 U1502 1203-001212 IC-VOL. DETECTOR;7029,SOT-89,3P,-,P 1 W390 6003-000276 SCREW-TAPTYPE;BH,+,-,B,M3,L10,ZPC(W 3 WC31 2305-000407 C-FILM,LEAD-PEF;470nF,5%,100V,TP,10 6 WL02 3301-001069 BEAD-SMD;120ohm,1.6x0.8x0.8mm,200mA 4 X202 2801-004371 CRYSTAL-SMD;12.288MHz,50ppm,SX-1,18 1 ZPD2 0401-001090 DIODE-SWITCHING;1SS355,80V,100MA,SO 7 ZR24 2007-000109 R-CHIP;1Mohm,5%,1/10W,TP,1608 1 ZVL3 3301-001495 BEAD-SMD;120ohm,2012,2500mA,TP,115o 2 0401-001166 DIODE-SWITCHING;BAV20WS-V,150V,250m 7 0402-001427 DIODE-RECTIFIER;ES1D,200V,1A,DO-214 6 0403-001398 DIODE-ZENER;UDZ2.4B,2.43-2.63V,200M 1 0403-001483 DIODE-ZENER;UDZS18B,17.56-18.35V,20 1 0501-000150 TR-SMALL SIGNAL;2SA1037,PNP,200mW,S 4 0502-001053 TR-POWER;MMSTA06,NPN,-,SOT-23,TP,10 2 0502-001176 TR-POWER;KTC2026,NPN,2000mW,TO-220I 1 1003-002143 IC-GATE DRIVER;IRS2092STRPBF,SOP,16 6

5-10

SA SA SNA SNA SNA SNA SNA SNA SNA SNA SNA SNA SNA SNA SNA SA SNA SNA SNA SNA SNA SNA SNA SNA SA SNA SNA SNA SNA SNA SNA SNA SNA SNA SNA SNA SNA SA SNA SNA SA SA SA SA SA SNA SNA SC SNA SA SNA SA SNA SNA SA SA SA SNA

Loc. No. Part No.


Q’ty SNA Remark

1204-002968 IC-MODULATOR;PS9830B,TQFP,100P,14x1 1 2007-000039 R-CHIP;0ohm,1%,1/10W,TP,1608 17 2007-000253 R-CHIP;1.5ohm,5%,1/4W,TP,3216 2 2007-000285 R-CHIP;100Kohm,5%,1/4W,TP,3216 2 2007-000303 R-CHIP;10Kohm,5%,1/4W,TP,3216 1 2007-000464 R-CHIP;18ohm,5%,1/4W,TP,3216 1 2007-001300 R-CHIP;56ohm,5%,1/2W,TP,5025 1 2007-007065 R-CHIP;10ohm,5%,1W,TP,6432 6 2007-007750 R-CHIP;39ohm,1%,1W,TP,6432 1 2007-007790 R-CHIP;20ohm,1%,1W,TP,6432 4 2301-001760 C-FILM,MPEF;100nF,10%,250V,TP,B5xH1 6 AH27-00070A COIL FILTER;8019P-51-150L,15uH,0.1o 6 AH41-01217A PCB-AMP;HT-BD1250,EPOXY,2,1,T1.6,20 1 AH69-02426C PAD-THERMAL.B;HT-BD1250,OTHER,T2.0, 2 AH99-00359A ASSY AUTO INSERT-AMP PCB;-,HT-BD125 1 M0238 AH59-02211C SPEAKER SYSTEM;HT-BD1255,SATELLITE 1 AH69-02560A CUSHION EPS-CUSHION;BD1255 SATELLIT 1 C455 AH81-02177B SPEAKER;PS-Q20,SPK CORD# CONNECTOR, 1 T0082 AH81-05185C SPEAKER;PS-BD1255,FRONT SPEAKER -L, 1 AH81-04981A A/S;FRONT SPK BOT ASS`Y,FOR PS-TZ52 1 AH61-02702A CASE-REAR_BTM;PS-TZ525,ABS,2.7t 1 AH64-04834A PANEL-FRONT_BTM;PS-TZ525,HIPS,2.5t 1 AH81-04982A A/S;STAND ASS`Y,FOR PS-FTZ522,UHL C 1 M0111 AH63-01809A COVER-STAND;PS-TZ525,ABS+PMMA,2.5t 1 T0082 AH81-04680A SPEAKER;STAND STEEL,FOR PS-TZ525,BL 1 T0082 AH81-05233C SPEAKER;PS-BD1255,FRONT SPEAKER -L, 1 AH61-02701A CASE-REAR_TOP;PS-TZ525,ABS,2.7t 1 AH64-04833A PANEL-FRONT_TOP;PS-TZ525,HIPS,2.5t 1 T0082 AH81-04668A SPEAKER;GRILLE_F,80*9*160,STEEL, SP 1 T0082 AH81-04684B SPEAKER;HT-BD1250,TWEETER BH 1 AH81-04919B SPEAKER-UNIT;WOOFER UNIT-FRONT,FOR 1 T0527 AH81-05198C LABEL;PS-BD1255,BACK LABEL,FRONT-L, 1 T0082 AH81-05186C SPEAKER;PS-BD1255,FRONT SPEAKER-R,5 1 AH81-04981A A/S;FRONT SPK BOT ASS`Y,FOR PS-TZ52 1 AH61-02702A CASE-REAR_BTM;PS-TZ525,ABS,2.7t 1 AH64-04834A PANEL-FRONT_BTM;PS-TZ525,HIPS,2.5t 1 AH81-04982A A/S;STAND ASS`Y,FOR PS-FTZ522,UHL C 1 M0111 AH63-01809A COVER-STAND;PS-TZ525,ABS+PMMA,2.5t 1 T0082 AH81-04680A SPEAKER;STAND STEEL,FOR PS-TZ525,BL 1 T0082 AH81-05234C SPEAKER;PS-BD1255,FRONT SPEAKER-R,T 1 AH61-02701A CASE-REAR_TOP;PS-TZ525,ABS,2.7t 1 AH64-04833A PANEL-FRONT_TOP;PS-TZ525,HIPS,2.5t 1 T0082 AH81-04668A SPEAKER;GRILLE_F,80*9*160,STEEL, SP 1 T0082 AH81-04684B SPEAKER;HT-BD1250,TWEETER BH 1 AH81-04919B SPEAKER-UNIT;WOOFER UNIT-FRONT,FOR 1 T0527 AH81-05199C LABEL;PS-BD1255,BACK LABEL,FRONT-R, 1 T0082 AH81-05187C SPEAKER;PS-BD1255,REAR SPEAKER-L,5. 1 AH81-04981A A/S;FRONT SPK BOT ASS`Y,FOR PS-TZ52 1 AH61-02702A CASE-REAR_BTM;PS-TZ525,ABS,2.7t 1 AH64-04834A PANEL-FRONT_BTM;PS-TZ525,HIPS,2.5t 1 AH81-04982A A/S;STAND ASS`Y,FOR PS-FTZ522,UHL C 1 M0111 AH63-01809A COVER-STAND;PS-TZ525,ABS+PMMA,2.5t 1 T0082 AH81-04680A SPEAKER;STAND STEEL,FOR PS-TZ525,BL 1 T0082 AH81-05235C SPEAKER;PS-BD1255,REAR SPEAKER-L,TO 1 AH61-02701A CASE-REAR_TOP;PS-TZ525,ABS,2.7t 1 AH64-04833A PANEL-FRONT_TOP;PS-TZ525,HIPS,2.5t 1 T0082 AH81-04668A SPEAKER;GRILLE_F,80*9*160,STEEL, SP 1


SNA SNA SNA SNA SNA SNA SNA SNA SNA SNA SNA SNA SNA SNA SNA

SNA SA SA SNA SNA SNA SNA SNA SNA SNA SNA SNA SNA SA SNA SNA SNA SNA SNA SNA SNA SNA SNA SNA SNA SNA SNA SA SNA SNA SNA SNA SNA SNA SNA SNA SNA SNA SNA SNA SNA SA

Samsung Electronics


Loc. No. Part No.


Q’ty SNA Remark

T0082 AH81-04684B SPEAKER;HT-BD1250,TWEETER BH 1 AH81-04919B SPEAKER-UNIT;WOOFER UNIT-FRONT,FOR 1 T0527 AH81-05200C LABEL;PS-BD1255,BACK LABEL,REAR-L,U 1 T0082 AH81-05188C SPEAKER;PS-BD1255,REAR SPEAKER-R,5. 1 AH81-04981A A/S;FRONT SPK BOT ASS`Y,FOR PS-TZ52 1 AH61-02702A CASE-REAR_BTM;PS-TZ525,ABS,2.7t 1 AH64-04834A PANEL-FRONT_BTM;PS-TZ525,HIPS,2.5t 1 AH81-04982A A/S;STAND ASS`Y,FOR PS-FTZ522,UHL C 1 M0111 AH63-01809A COVER-STAND;PS-TZ525,ABS+PMMA,2.5t 1 T0082 AH81-04680A SPEAKER;STAND STEEL,FOR PS-TZ525,BL 1 T0082 AH81-05236C SPEAKER;PS-BD1255,REAR SPEAKER-R,TO 1 AH61-02701A CASE-REAR_TOP;PS-TZ525,ABS,2.7t 1 AH64-04833A PANEL-FRONT_TOP;PS-TZ525,HIPS,2.5t 1 T0082 AH81-04668A SPEAKER;GRILLE_F,80*9*160,STEEL, SP 1 T0082 AH81-04684B SPEAKER;HT-BD1250,TWEETER BH 1 AH81-04919B SPEAKER-UNIT;WOOFER UNIT-FRONT,FOR 1 T0527 AH81-05201C LABEL;PS-BD1255,BACK LABEL,REAR-R,U 1 T0082 AH81-05189C SPEAKER;PS-BD1255,CENTER SPEAKER,5. 1 T0082 AH81-04662A SPEAKER;NET FRAME_C,250*10*55,ABS, 1 T0082 AH81-04669A SPEAKER;GRILLE_C,220*9*45,STEEL, SP 1 T0082 AH81-04725A SPEAKER;REAR CASE_C,300*55*50,PART 1 AH81-04920A SPEAKER-A/S PART;WOOFER UNIT-CENTER 1 T0527 AH81-05202C LABEL;PS-BD1255,BACK LABEL CENTER,U 1 AH69-02713A CUSHION;PS-BD1255 STAND& CENTER CUS 1 AH81-03943A SPEAKER-SCREW;PS-TZ215,SCREW,#5*20, 4 AH81-03944A SPEAKER-SCREW;PS-TZ215,SCREW,#3.5*1 20 M0238 AH59-02203C SPEAKER SYSTEM;HT-BD1250,ELS 5.1CH, 1 AH81-05121A CUSHION-SUBWOOFER;PS-BD1250,SUBWOOF 1 AH81-05127C SPEAKER-SUBWOOFER;PS-BD1250,SUBWOOF 1 T0082 AH81-04675A SPEAKER;FRONT PANEL-SW,FOR PS-Z520, 1 AH81-04922A SPEAKER-A/S PART;CABINET SUBWOOFER, 1 AH81-04971A A/S;SUBWOOFER UNIT,FOR PS-WZ520,165 1 T0527 AH81-05119C LABEL;PS-BD1250,SUBWOOFER LABEL,ELS 1 T0268 3903-000403 CBF-POWER CORD;AT,EU,CP2,HOUSING(2P 1 A001 AH59-02144L REMOCON-ASSY;HT-BD1250-EUR,SAMSUNG, 1 AH69-02494J MASTER CARTON;PPR-OTH,7,440,370,450 2 AH96-00051A ASSY MISC P-IPOD CRADLE;HT-Z520,XAA 1

Samsung Electronics

Loc. No. Part No.


Q’ty SNA Remark

SNA SNA SNA SNA SNA SNA SNA SNA SNA SNA SNA SNA SNA SA SNA SNA SNA SNA SA SA SA SNA SNA SNA SNA SNA

SNA SNA SNA SNA SNA SNA SNA

SNA SNA SNA SA


5-11

MEMO

5-12

Samsung Electronics

PCB Diagram

6. PCB Diagram 6-1 Wiring Diagram................................................................................................. 6-2 6-2 FRONT PCB Top................................................................................................ 6-3 6-3 FRONT PCB Bottom......................................................................................... 6-5 6-4 KEY PCB Top..................................................................................................... 6-6 6-5 KEY PCB Bottom............................................................................................... 6-8 6-6 AMP PCB Top.................................................................................................... 6-9 6-7 AMP PCB Bottom.............................................................................................. 6-11 6-8 MAIN PCB Top................................................................................................... 6-13 6-9 MAIN PCB Bottom............................................................................................. 6-16 6-10 SMPS PCB Top.................................................................................................. 6-18 6-11 SMPS PCB Bottom............................................................................................ 6-19

Samsung Electronics

6-1

PCB Diagram

6-1 Wiring Diagram

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22

DECK ASSY

6-2

(CON12) SW3 LDO+ LDOCLOSE OPEN GND W V U GND H+ HU+ HUHW+ HWHHVHV+ SLD2+ SLD2SLD1+ SLD1-

LOADER1 1 5V 2 SA_INT 3 SAOUT2+ 4 SAOUT1+ 5 SAOUT16 SAOUT27 GND 8 CDLD 9 CDVR 10 DVDCDMPD 11 DVDVR 12 DVDLD 13 TEMP 14 VDMPD 15 GND 16 BDSLEEP 17 GAINSW 18 VREFB 19 VREFB 20 5V 21 RFID 22 RFIN 23 GG 24 HH 25 EE 26 FF 27 DD 28 CC 29 BB 30 AA 31 GND 32 TD33 FD34 TILT35 TILT+ 36 FD+ 37 TD+ 38 GND 39 BDLD 40 BDHFM

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24

(PCN1) ST 5.4V ST 5.4V ST 5.4V GND GND GND D5.4V D5.4V D5.4V GND GND GND FE 12V FE 12V FE GND FE GND NC POWER_ON NC DGND VFD +4.6V VFD -4.6V -34V DGND

SMPS

POWER(J3) 1 2 3 4 5 6 7 8 9 10 11 12

(DJ3)

MAIN

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28

AVGND MIC_PDN SD(POWER) RESET(POWER) AUOUT3 AUOUT2 AUOUT1 LRCKOUT BCLKOUT GND GND AV 3.3V DS 5V EXT_MUTE(PWM) RESET(PWM) SO(PWM) CS(PWM) SCK(PWM) SI(PWM) SW_MUTE FAN_PWR FAN_SEN MIC AL 5.4V AVGND

AGND +12V AGND -5V +35V +35V +35V GND GND -35V -35V -35V

AMP

(SCN2) 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28

UART_BT_RX UART_BT_TX MIC_SENSE VFD_FU_CLK VFD_FU_DATA VFD_CE GND SMPS_VFD(+4.6V) VFD 4.6V(-) SMPS_VFD -34V GND AL 5.4V MIC_DATA POWER_LED MIC_CLK POWER_TOUCH_1KEY BTRST BUZZER GND VOL_DOWN VOL_UP TC_SDA TOUCH_CLK TOUCHRST TOUCH_INT GND

FRONT

1 2 3 4

(PCON1) POWER_ON DGND KEY + 5.6V

POWER

1 2 3 4 5 6

(TCON1) 5V KEY_INT KEY_SDA KEY_SCL KEY_RESET D_GND

FUNTION

Samsung Electronics

PCB Diagram

6-2 FRONT PCB Top

1

2

J

PCON1

I

VCON1

IC1

TCON1

BCON1

K

UIC2

MMIC1

FCON1

UCON1

K

J

I

TP4

Samsung Electronics

6-3

PCB Diagram

6-2-1 Pin Connection 1 FCON1 VFD & Function Key Control Signal

6-2-2 Test Point Wave Form 2 IC1 VFD Control Signal

TP4

Pin No.

Signal

Pin No.

Signal

Pin No.

Signal

1

UART_BT_RX

1

F-_1

24

p14

2

UART_BT_TX

2

F-_2

25

p15

3

MIC_SENSE

3

26

4

VFD_FU_CLK

4

27

p16

5

VFD_FU_DATA

5

p1

28

p17

6

VFD_CE

6

p2

29

7

GND

7

8

SMPS_VFD(+4.6V)

8

9

VFD 4.6V(-)

9

10

SMPS_VFD -34V

10

11

GND

11

12

AL 5.4V

13 14

p18

p3

31

p19

p4

32 33

9G

p5

34

8G

12

p6

35

7G

MIC_DATA

13

p7

36

6G

POWER_LED

14

p8

37

5G

38

4G

15

15

16

MIC_CLK

16

p9

39

3G

17

POWER_TOUCH_1KEY

17

p10

40

2G

41

1G

18

6-4

30

18

19

BTRST

19

p11

42

20

BUZZER

20

p12

43

21

GND

21

22

VOL_DOWN

22

23

VOL_UP

23

24

TC_SDA

25

TOUCH_CLK

26

TOUCHRST

27

TOUCH_INT

28

GND

p13

44

F+_44

45

F+_45

Samsung Electronics

PCB Diagram

6-3 FRONT PCB Bottom

J

PCON1

I

IC1

TCON1

VCON1 BCON1

K

UIC2

MMIC1

FCON1

UCON1

K

Samsung Electronics

J

I

6-5

PCB Diagram

6-4 KEY PCB Top

TCON

PCON2

1

6-6

VCON2

TIC1

2

Samsung Electronics

PCB Diagram

6-4-1 Pin Connection 1 TCON FRONT ↔ FUNCTION KEY

2 PCON2 FRONT ↔ POWER KEY

Pin No.

Signal

Pin No.

Signal

1

5V

1

POWER_ON

2

KEY_INT

2

DGND

3

KEY_SDA

3

KEY

4

KEY_SCL

4

+ 5.6V

5

KEY_RESET

6

D_GND

Samsung Electronics

6-7

PCB Diagram

6-5 KEY PCB Bottom

6-8

Samsung Electronics

PCB Diagram

CON1

6-6 AMP PCB Top

J3

1

2

TP3 AIC5

AIC6

AIC3

AIC4

AIC1

AIC2

TP1

UPIC1 AIC11

Samsung Electronics

6-9

PCB Diagram

6-6-1 Pin Connection 1 CON1 MAIN ↔ AMP (DATA LINE) Pin No.

Signal

2 J3 SMPS ↔ AMP (POWER LINE) Pin No.

Signal

1

1

AGND

2

2

+12V

3

AVGND

3

AGND

4

MIC_PDN

4

-5V

5

SD(POWER)

5

+35V

6

RESET(POWER)

6

+35V

7

+35V

7

6-10

6-6-2 Test Point Wave Form

8

AUOUT3

8

GND

9

AUOUT2

9

GND

10

AUOUT1

10

-35V

11

LRCKOUT

11

-35V

12

BCLKOUT

12

-35V

13

GND

14

GND

15

AV 3.3V

16

DS 5V

17

EXT_MUTE(PWM)

18

RESET(PWM)

19

SO(PWM)

20

CS(PWM)

21

SCK(PWM)

22

SI(PWM)

23

SW_MUTE

24

FAN_PWR

25

FAN_SEN

26

MIC

27

AL 5.4V

28

AVGND

TP1

TP3

Samsung Electronics

PCB Diagram

J3

CON1

6-7 AMP PCB Bottom

Samsung Electronics

AIC7

AIC8

AIC9

TP2

6-11

PCB Diagram

6-7-1 Test Point Wave Form TP2

6-12

Samsung Electronics

PCB Diagram

6-8 MAIN PCB Top

TP7 TP8 TP9

5

CON18

IPCN1

TP10

IC18

IPIC2

USCON1

MUCN2

PIC5

DJ3

J2

1

CEIC1

TP5

TP6 MEM2

DIC1

PIC6

U1 MEM1

4

MEM3

MEM4

PCN1

DSIC1

DSIC14

CON16

DSCN1

FEIC13

SCN2

CON17

CON12

CON15

2

Samsung Electronics

3

6-13

PCB Diagram

6-8-1 Pin Connection 1 USCN1 MAIN ↔ USB (USB Connect Line)

2 CON17 MAIN ↔ Loader (Loader Data Line)

3 CON12 MAIN ↔ Loader (Loader Power Line)

4 PCN1 MAIN ↔ SMPS(Power Supply Line)

5 IPCN1 MAIN ↔ iPod Cradle (iPod Power/Audio/Video Line)

Pin No.

Signal

Pin No.

Signal

Pin No.

Signal

Pin No.

Signal

Pin No.

Signal

1

D5V

1

5V

21

RFID

1

SW3

1

ST 5.4V

Pin No.

Signal

2

DN1

2

SA_INT

22

RFIN

2

LDO+

2

ST 5.4V

1

Reserved

3

DP1

3

SAOUT2+

23

GG

3

LDO-

3

ST 5.4V

2

DGND

4

GND

4

SAOUT1+

24

HH

4

CLOSE

4

GND

3

USB Vbus(D5V)

5

SAOUT1-

25

EE

5

OPEN

5

GND

4

ACC_POWER

6

SAOUT2-

26

FF

6

GND

6

GND

5

DGND

7

GND

27

DD

7

W

7

D 5.4V

6

reserved

8

CDLD

28

CC

8

V

8

D 5.4V

7

DGND

9

CDVR

29

BB

9

U

9

D 5.4V

8

iPod_UART_RX

10

DVDCDMPD

30

AA

10

GND

10

GND

9

iPod_UART_TX

11

DVDVR

31

GND

11

H+

11

GND

10

DGND

12

DVDLD

32

TD-

12

HU+

12

GND

11

Reserved

13

TEMP

33

FD-

13

HU-

13

FE 12V

12

iPod C

14

VDMPD

34

TILT-

14

HW+

14

FE 12V

13

iPod COMPOSIT

15

GND

35

TILT+

15

HW-

15

FE GND

14

VGND

16

BDSLEEP

36

FD+

16

H-

16

FE GND

15

AN_LCH

17

GAINSW

37

TD+

17

HV-

17

NC

16

AGND

18

VREFB

38

GND

18

HV+

18

POWER_ON

17

AN_RCH

19

VREFB

39

BDLD

19

SLD2+

19

NC

18

iPod_DET

20

5V

40

BDHFM

20

SLD2-

20

DGND

21

SLD1+

21

VFD +4.6V

22

SLD1-

22

VFD -4.6V

23

-34 V

24

DGND

6-14

Samsung Electronics

PCB Diagram


TP10

TP6

TP7

TP8

TP9

Samsung Electronics

6-15

PCB Diagram

6-9 MAIN PCB Bottom

MUCN2

USCON1

TP10 AIC3

DJ3

J2

VIC1

TP8 TP7 MUIC1

DSIC1

PCN1

DSIC5

TP9

DBGN1

FEIC13

CON15

6-16

Samsung Electronics

PCB Diagram


TP8

TP9

TP10

Samsung Electronics

6-17

PCB Diagram

6-10 SMPS PCB Top

CN3

CN2

6-18

Samsung Electronics

PCB Diagram

6-11 SMPS PCB Bottom

CN3

CN2

Samsung Electronics

6-19

MEMO

6-20

Samsung Electronics

Schematic Diagram

7. Schematic Diagram 7-1 Overall Block Diagram...................................................................................... 7-2 7-2 FRONT................................................................................................................ 7-3 7-3 KEY..................................................................................................................... 7-4 7-4 AMP.................................................................................................................... 7-5 7-5 AUDIO / VIDEO (COMPONENT, COMPOSITE)................................................ 7-6 7-6 HDMI CEC / TX (SIL9134).................................................................................. 7-7 7-7 Boot Strap Option............................................................................................. 7-8 7-8 EBI ADDR, EBI DATA........................................................................................ 7-9 7-9 CLOCK, BBS...................................................................................................... 7-10 7-10 BCM7440 POWER............................................................................................. 7-11 7-11 DDR2 BANK0, BANK1...................................................................................... 7-12 7-12 SYSTEM MICOM / TUNER / SRC / WIRELESS................................................ 7-13 7-13 EXTERNAL IN & AUDIO FLOW........................................................................ 7-14 7-14 Ethernet, S-ATA, USB....................................................................................... 7-15 7-15 GPIO / IPOD / BT............................................................................................... 7-16 7-16 NAND, FlexOneNand........................................................................................ 7-17 7-17 MAIN POWER.................................................................................................... 7-18 7-18 DSP SDRAM / FLASH........................................................................................ 7-19 7-19 BCM7620 (F/E)................................................................................................... 7-20 7-20 SMPS (110V)...................................................................................................... 7-21 7-21 SMPS (220V)...................................................................................................... 7-22

Samsung Electronics


7-1

Schematic Diagram

7-1 Overall Block Diagram I-Pod Externel DOCKING

Pick-up / Loader

IPOD Y/C VIDEO ANALOG AUDIO INPUT ADC

Y/C MIXER

VIDEO FILTER MM1757

CVBS

CVBS YPbPr

Y/Pb/Pr

Serial Flash

SDRAM

NAND FLASH 64MB

I-Pod CP CHIP

Bluetooth TX Module

UART UART

F/E BCM7620

Motor Driver USB1

For wireless LAN For Local Storage & USB Host

USB2 CEC

UART

SATA

USB1/2

B/E BCM7440P

MEM0

DDR2

IPOD ANALOG AUDIO L/R

128MB (32M x 16b x 2ea)

ADC AK5367

AUX

7-2

DIR AK4113

DDR2

64M SDRAM

I2S

 MAIN SYSTEM MICOM control BCM7440P, AUDIO DSP MICOM, CEC. He gets all information from BCM7440P, and then transfer the information to AUDIO DSP MICOM. They have a communication among them with HOST ↔ SLAVE Interface. And MAIN SYSTEM MICOM gets the information from User’s remote control. So whenever he get the information, he displays it on the VFD.

UART

D/M 2ch

Flash ROM

SYSTEM U-com

Power Stage

PWM

DDR2

256MB (64M x 16 x 2ea)

 AUDIO DSP (TM320D788) is connected to MAIN SYSTEM. They get the DIGITAL audio signal from main system with bit stream status. And after decoding the signal, they send the digital signal, which is already decoded, to DIGITAL AMP PWM driver IC.

I2S Lo, Ro

I2S 5.1ch PCM

Audio DSP TMP320D788

Power Stage

I2S 5.1ch

 The loader transfer the source audio, video data to BCM7440P.

PWM

DRIVER PS9830B

Power Stage

 Both of USB are available, but front USB is for LOCAL STORAGE of PROFILE 1.1/2.0 and USB HOST function, whire

I2S Rear 2ch

Sampling Rate Converter CS8421

48KHz

SPI I/F

Tuner Optical In

CEC MICOM MC80C0316

Digital Video

MEM1

DDR2

HDMI TX

HDMI TX SIL9134

24Bit

I2C

Audio Decoder

SPI I/F

DISPLAY

CVBS/YPbPr

Video Decoder

ETHER MAC

Ethernet

System U-com LC87F5NC8A

UART

 MAIN SYSTEM (BCM7440P) is connected to whole HT-BD1250 function IC. For HDMI 1080P, BCM7440P transfer the digital video signal with 24bit to HDMI TX chip SIL9134. BCM7440P doesn’t need external up scaling IC because it has a own internal scalar. About it has internal video DAC, so it transfer the analog signal to MM1757, BCM7440P. MM1757 are video filter and amp.

SMPS POWER

Rear USB is for wireless LAN Dongle. Wireless TX Module

 DIGITAL IN 1, 2 (SPDIF IN), AUX IN and Tuner IN are each connected to DIR and ADC IC. And then after transforming DIGITAL SIGNAL (SPDIF IN is DIGITAL signal), the audio signal transfers to AUDIO DSP. Wireless RX Module


Samsung Electronics

Schematic Diagram

7-2 FRONT

TP4

TP4

Samsung Electronics


7-3

Schematic Diagram

7-3 KEY

7-4


Samsung Electronics

Schematic Diagram

7-4 AMP

TP2 TP3

TP3

TP2 TP1

TP3

TP3

TP2 TP3

TP3

TP1

Samsung Electronics


TP2

TP3

7-5

Schematic Diagram

7-5 AUDIO / VIDEO (COMPONENT, COMPOSITE) POWER AUDIO VIDEO

TP10

TP10

TP7

TP8

TP7

TP8

TP9 TP9

7-6

TP7

TP9

TP8

TP10


Samsung Electronics

Schematic Diagram

7-6 HDMI CEC / TX (SIL9134) TP5

POWER AUDIO VIDEO

TP5

TP5

Samsung Electronics


7-7

Schematic Diagram

7-7 Boot Strap Option POWER

7-8


Samsung Electronics

Schematic Diagram

7-8 EBI ADDR, EBI DATA POWER

Samsung Electronics


7-9

Schematic Diagram

7-9 CLOCK, BBS TP6

POWER

TP6

7-10


Samsung Electronics

Schematic Diagram

7-10 BCM7440 POWER POWER

Samsung Electronics


7-11

Schematic Diagram

7-11 DDR2 BANK0, BANK1 POWER

7-12


Samsung Electronics

Schematic Diagram

7-12 SYSTEM MICOM / TUNER / SRC / WIRELESS POWER AUDIO

Samsung Electronics


7-13

Schematic Diagram

7-13 EXTERNAL IN & AUDIO FLOW POWER AUDIO

7-14


Samsung Electronics

Schematic Diagram

7-14 Ethernet, S-ATA, USB POWER

Samsung Electronics


7-15

Schematic Diagram

7-15 GPIO / IPOD / BT POWER AUDIO VIDEO

7-16


Samsung Electronics

Schematic Diagram

7-16 NAND, FlexOneNand POWER

Samsung Electronics


7-17

Schematic Diagram

7-17 MAIN POWER POWER

7-18


Samsung Electronics

Schematic Diagram

7-18 DSP SDRAM / FLASH POWER AUDIO

Samsung Electronics


7-19

Schematic Diagram

7-19 BCM7620 (F/E) POWER

7-20


Samsung Electronics

Schematic Diagram

7-20 SMPS (110V) L51 2.9uH(BAR TYPE)

ORTP-527 T1

L52 2.9uH(BAR TYPE)

L61 33uH(5A)

L71 33uH(3A)

ORTP-527 T2

(SOD-123)

L62 15uH

Samsung Electronics


7-21

Schematic Diagram

7-21 SMPS (220V) L51 2.9uH(BAR TYPE)

ORTP-527 T1

L52 2.9uH(BAR TYPE)

L61 33uH(5A)

L71 33uH(3A)

ORTP-527 T2

(SOD-123)

L62 15uH

7-22


Samsung Electronics

Samsung HT BD1255

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