ILS Manual

MAR MA RU 310/ 320 DISTANC NCE E MEA MEASURIN ING G EQUIPME IPMENT NT

Tec ech hnica ical Man Manual

VOL VO LUME I

SYSTEM DESC RIPTION, OPERATIONS IONS AND MAIN MAINT TENANC NANCE E

C o p yr yright ight (C ) 2006 2006-20 -2008 08

MOP MO PIE IENS NS, Inc. Inc. www.mopiens.com

Intentional Blank Page

Revision Records Rev

Date

0

2007 2007/1 /11/ 1/05 05

Description Init Initia iall Issu Issuee

By Lee, Lee, K.W K.W.


MARU 310/320 DISTANCE MEASURING EQUIPMENT

Technical Manual VOLUME I SYSTEM DESCRIPTION, OPERATIONS AND MAINTENANCE

TABLE OF CONTENTS

SECTION 1

GENERAL INFORMATION

SECTION 2

INSTAL INSTAL LATION

SECTION 3

OPERATION

SECTION 4

MAINTENA NCE

SECTION 5

TROUBL ESHOOTING




SECTION 1 GENERAL INFORMATION

MOPIENS, INC.


MARU 310/320 DME Technical Manual Volume I, Section 1

Table of Contents SECTION 1.

GENERAL INFORMATION .......................................................................... ..................... 1-1

1.1. INTRODUCTION...................................................... ............................................................... .......... 1-1 1.2. TECHNICAL SPECIFICATION ........................................................... ............................................. 1-5 1.2.1. General............................................................... ............................................................... .......... 1-5 1.2.2. TRANSMITTER .......................................................................................................... ................. 1-7 1.2.3. RECEIVER ................................................................. ................................................................. 1-8 1.2.4. MONITOR ....................................................... ............................................................... ............. 1-9 1.2.5. POWER SUPPLY .............................................................................. ........................................ 1-10 1.3. SYSTEM DESCRIPTION ............................................................ .................................................... 1-11 1.3.1. System Overview ...................................................................................... ................................. 1-11 1.3.2. Duplexer Unit, DPX .............................................................. .................................................... 1-14 1.3.3. Receiver Unit, RXU ....................................................... ............................................................ 1-17 1.3.4. Transponder Control Unit, TCU ..................................................... .......................................... 1-19 1.3.5. Transmitter Unit, TXU.............................................................. ................................................. 1-22 1.3.6. Low Power Amplifier, LPA ..................................................................................... ................... 1-25 1.3.7. High Power Amplifier, HPA................................................................. ...................................... 1-28 1.3.8. Monitor Unit, MON ............................................................... .................................................... 1-31 1.3.9. Radio Frequency Generator Unit, RFG ..................................................................... ............... 1-34 1.3.10. Local Control Unit, LCU.................................................................. ......................................... 1-37 1.3.11. AC to DC Converter Unit, AC/DC .......................................................................... .................. 1-39 1.3.12. DC to DC Converter Unit, DC/DC ..................................................................... ...................... 1-42 1.3.13. Backup Battery ................................................................. ......................................................... 1-44 1.3.14. Remote Control Monitor Unit, RCMU ............................................................. ......................... 1-45 1.3.15. Remote Monitor Unit, RMU ............................................................ .......................................... 1-47 1.3.16. Local/Remote Maintenance Monitoring System, LMMS/RMMS ............................................... 1-49

Page i


List of Figures Figure 1-1 MARU 310/320 DME System Cabinet ............................................................................. 1-2 Figure 1-2 Remote Control Monitoring Unit, RCMU....................................................................... .. 1-4 Figure 1-3 Remote Monitoring Unit, RMU ........................................................................................ 1-4 Figure 1-4 MARU 310/320 DME System Block Diagram ............................................................... 1-12 Figure 1-5 MARU 310/320 DME System Cabinet Front View ........................................................ 1-13 Figure 1-6 DPU Front View ................................................................... ........................................... 1-14 Figure 1-7 DPU Block Diagram...................................................................... .................................. 1-15 Figure 1-8 DPDT Coaxial Switch ..................................................................................................... 1-16 Figure 1-9 RXU Front View.................................................................. ............................................ 1-17 Figure 1-10 RXU Block Diagram ..................................................................................................... 1-17 Figure 1-11 TCU Front View ............................................................................................................ 1-19 Figure 1-12 TCU Block Diagram................................................................ ...................................... 1-19 Figure 1-13 TXU Front View ................................................................... ......................................... 1-22 Figure 1-14 TXU Block Diagram ....................................... .............................................................. 1-23 Figure 1-15 LPA Front View ....................................................................................................... ...... 1-25 Figure 1-16 LPA Block Diagram.................................................................... ................................... 1-26 Figure 1-17 HPA Front View................................................................... .......................................... 1-28 Figure 1-18 HPA Block Diagram ...................................................................................................... 1-29 Figure 1-19 MON Front View .................................................................. ......................................... 1-31 Figure 1-20 MON Block Diagram ............................................................. ....................................... 1-31 Figure 1-21 RFG Front View ................................................................... ......................................... 1-34 Figure 1-22 RFG Block Diagram.............................................................. ........................................ 1-35 Figure 1-23 CSP Front View .................................................................. ........................................... 1-37 Figure 1-24 LCU Block Diagram................................................................ ...................................... 1-38 Figure 1-25 AC/DC Front View .................................................................. ...................................... 1-39 Figure 1-26 AC/DC Block Diagram ......................................................... ......................................... 1-40 Figure 1-27 DC/DC Front View .................................................................. ...................................... 1-42 Figure 1-28 DC/DC Block Diagram ............................................. .................................................... 1-42 Figure 1-29 Backup Battery Subrack Front View ............................................................................. 1-44 Figure 1-30 RCMU Front View ........................................................................................................ 1-45 Figure 1-31 RCMU Block Diagram .......................................................... ........................................ 1-45 Figure 1-32 RMU Front View .................................................................. ......................................... 1-47 Figure 1-33 RMU Block Diagram ......................................................................... ........................... 1-47 Figure 1-34 Startup Screen ............................................................................ .................................... 1-49 Figure 1-35 Main Screen ............................................................. ...................................................... 1-50 Figure 1-36 Transponder Screen ....................................................................................................... 1-51 Figure 1-37 Monitor Screen .............................................................................................................. 1-52

Page ii


Sect io n 1. 1.1.

GENERAL INFORMATION

INTRODUCTION This document provides brief technical information about MARU 310/320 Distance Measuring Equipment. Figure 1-1 shows the system cabinet of MARU 310/320 DME. MARU 310/320 DME is fully compliant with ICAO Annex 10 and EUROCAE ED-57 minimum performance specification.

Page 1-1


Figure 1-1 MARU 310/320 DME System Cabinet

Page 1-2


The key features of MARU 310/320 DME are as follows: Compact Design

Full dual high-power transponder, dual monitor and dual backup batteries are included in a standard 19” rack cabinet. Hot-swappable Plug-in Units

Most of the system hardware components are line replaceable units, which are designed to be hot-swappable plug-in modules. Therefore operators can replace a live unit without powering off, and this makes it easier to carry out routine preventive maintenance service. Modernized microprocessor-based digital control

All the system functions are monitored and controlled by high performance 16/32-bit microcontrollers. Most of the pulse waveforms are electronically synthesized using stateof-art direct digital synthesis technology. Long design life & durability

Minimum 15 years of design life through normal and regular maintenance Designed to operate on 24hours a day and 365 days per year basis Protection from EMC radiation, high voltage, etc. Self Diagnostics

The Built-In Self Test Equipment (BITE) function is included to check the integrity of system operation.

Page 1-3


Figure 1-2 shows the remote control monitoring unit, RCMU.

Figure 1-2 Remote Control Monitoring Unit, RCMU

Figure 1-3 shows the remote monitoring unit, RMU

Figure 1-3 Remote Monitoring Unit, RMU

Page 1-4


1.2.

TECHNICAL SPECIFICATION

1.2.1.

General

1.2.1.1.

Standard Compl ianc e ICAO Annex 10, Chapter 3, paragraph 3.5 EUROCAE ED-57

1.2.1.2.

System Performance Characteristi cs Aircraft handling capacity: 200 interrogators Accuracy: total system error < ±0.2 NM, at distances of from 0 to 370 km (200NM) Operating Frequency Range: 960 MHz – 1,215 MHz band Coverage: Nominal Line of Sight up to 200NM; Dependent upon site location, terrain, and aircraft altitude System Reply Delay: 50 us, nominal for X channel, 56 us, nominal for Y channel Adjustable from 35 us to 75 us Reply Delay Stability: -10 dBm to -81 dBm: ±0.5 us, -81 dBm to -91 dBm: ±0.8 us Reply Efficiency: better than 70%; up to 200 aircraft and at -91 dBm of receiver input level

1.2.1.3.

Physic al Dimensio ns System cabinet 1,922 mm (Height) x 600 mm (Width) x 600 mm (Depth), 180 kg (Weight)

1.2.1.4.

Enviro nmental Condit ions Operating Temperature: -10°C ~ 55°C Indoor Equipment -40°C ~ 70°C Outdoor Equipment Relative Humidity:95% (temperature up to 35°C) 60% (temperature up to 55°C) Operating Altitude: up to 4,500m (15,000ft) Wind Load: up to 160 km/h

1.2.1.5.

Reliability MTBF > 5,000 hours for dual system MTBO > 10,000 hours for dual system MTTR < 30 minutes, typical

1.2.1.6.

Power Consump tio n MARU 310 – 190 W (cold-standby mode) / 230 W (hot-standby mode) or less Page 1-5


MARU 320 – 450 W (cold-standby mode) / 700 W (hot-standby mode) or less Without battery charging current.

Page 1-6


1.2.2.

TRANSMITTER

1.2.2.1.

Frequenc y Range 962 MHz – 1,213 MHz, 1MHz channel spacing

1.2.2.2.

Frequency Stabilit y ± 0.001% (±12 kHz @ 1.2 GHz)

1.2.2.3.

Channels 252 (1X - 126X, 1Y - 126Y)

1.2.2.4.

Puls e Rise Time 2.5 μs ± 0.5 μs

1.2.2.5.

Puls e Durati on 3.5 μs ± 0.5 μs

1.2.2.6.

Puls e Decay Time 2.5 μs ± 0.5 μs

1.2.2.7.

RF Puls e Spectr um Per ICAO Annex 10, Paragraph 3.5.4.1.3

1.2.2.8.

Puls e Pair Spacin g X Channel: 12 μs ± 0.1, measured between 50% amplitude point of pulse pair Y Channel: 30 μs ± 0.1, measured between 50% amplitude point of pulse pair

1.2.2.9.

Peak Power Output 100 W - MARU 310, 1 KW - MARU 320 Peak Power Stability: not differ more than 1dB for any constituent pulses of any pair of pulses

1.2.2.10.

Puls e Repetit ion Rate 700 pp/s – 5,400 pp/s

1.2.2.11.

Spuriou s Radiatio n Lower than -80 dB of peak output power during intervals between individual pulses Lower than -40 dBm/kHz at out-of-band 10 to 1,800 MHz, excluding 960 to 1,215MHz Page 1-7


Any CW harmonic of the carrier frequency on any DME channel < -10 dBm

1.2.2.12.

IDENT signal Characteristic conforms to ICAO Annex 10, Paragraph 3.5.3.6 Pulse rate: 1,350 ± 25 pp/s

1.2.3.

RECEIVER

1.2.3.1.

Frequenc y Range 1,025 MHz – 1,150 MHz, paired with transmitter frequency as per para. 3.5.3.3.3, ICAO annex 10 Interrogation frequency appropriate to the assigned DME channel

1.2.3.2.

Frequency Stabilit y ± 0.001% (±12 kHz @ 1.2 GHz)

1.2.3.3.

Transponder Sensitiv ity Better than -91 dBm for 70% reply efficiency 2

Equivalent to -103 dBW/m in a typical installation

1.2.3.4.

Dynami c Range Power density between -103 dBW/m2 and -22 dBW/m2 at transponder antenna

1.2.3.5.

Sensitiv it y Variation Lower than 1 dB for transmission rate variation between 0% and 90% of the maximum Lower than 1 dB for variation in interrogation pulse pair spacing by up to ±1%

1.2.3.6.

Aut omatic Load Limi ting Activated when transponder loading exceeds 90% of the maximum transmission rate Sensitivity reduction range wider than 50 dB

1.2.3.7.

Nois e Generated Respon se Puls e Pair Less than 5% when interrogated at -103 dBW/m2 to produce a transmission rate equal to 90% of maximum transmission rate

1.2.3.8.

Receiver Bandwid th Such that the transponder sensitivity level does not deteriorate by more than 3 dB when the total receiver drift is added to an incoming interrogation frequency drift of Page 1-8

±100

kHz total.


Sufficient to maintain system the accuracy condition as in 3.5.4.2.6.2 of ICAO Annex 10

1.2.3.9.

Off Channel Rejecti on Signals with 900 kHz or more offset within the receiver dynamic range does not trigger the transponder

1.2.3.10.

Recover y Time The minimum sensitivity level is recovered within 3 dB of the normal value within 8 μs of the reception of a signal between 0 dB and 60 dB above minimum sensitivity level This is maintained no matter whether the echo suppression is enabled or disabled.

1.2.3.11.

Spuriou s Suppressi on Higher than 80 dB for IF frequency spurious Higher than 75 dB for image frequencies and all other spurious within 960 MHz to 1,215 MHz

1.2.3.12.

Echo Suppressi on Short Distance Echo Suppression (SDES): Echo pulses that occur between the pulses of a valid interrogation pair will not affect the reply timing by more than 0.15 μs Long Distance Echo Suppression (LDES): If enabled, echo pulses that fall after the dead time (60 μs) interval are suppressed. The duration for LDES can be set between 0 μs and 300 μs.

1.2.3.13.

Reply Dead Time 60 μs, nominal Adjustable from 40 μs to 180 μs in steps of 1 μs

1.2.4.

MONITOR

1.2.4.1.

Configuration Dual independent monitor with interrogation p ulse generator ‘AND’ mode or ‘OR’ mode

1.2.4.2.

Executiv e Monitor Parameters Transponder delay: ±1 μs Transmitted power output: -3dB Receiver sensitivity: -6dB Pulse spacing: ±1 μs Frequency variation: Synthesizer PLL locking range Pulse width: ±0.5 μs Reply efficiency: < 70% Pulse repetition frequency: < 700 pp/s IDENT signal: missing or incorrect condition Page 1-9


Alarm limits adjustable in steps of 1/10th of the tolerance

1.2.4.3.

Mainten ance Monitor Parameters Monitor self-test LRU status Power supply voltage levels History logging Antenna VSWR

1.2.5.

POWER SUPPLY

1.2.5.1.

Configuration Dual redundant AC/DC converter Dual redundant DC/DC converter Parallel battery backup/charging capability Standard 65AH maintenance-free battery can sustain the system up to 4 hours

1.2.5.2.

AC/DC Conv erter Input voltage: AC 110V/220 V ±20%, nominal Input frequency: 47 Hz ~ 63 Hz Output voltage: 27 V, nominal Built-in Over Voltage Protection Built-in Over Current Protection Built-in Over Temperature Protection

1.2.5.3.

DC/DC Conv erter Input voltage: 27V, nominal Output voltage: 50V, nominal Built-in Over Voltage Protection Built-in Over Current Protection Built-in Over Temperature Protection

Page 1-10


1.3.

SYSTEM DESCRIPTION

1.3.1.

Syst em Overvi ew The MARU 310/320 DME comprises two DME/N transponders, two independent monitors and two AC/DC power supplies with b ackup batteries. The transponders can be configured as dual system capable of working as main and standby. Any of the system can be designated as main. The other automatically works as standby. The changeover between the main and standby can be either initiated by an operator command or automatically by the monitor system when an executive alarm condition is detected. The monitors can be configured such that both monitors are monitoring the main transponder simultaneously or such that one monitor is monitoring the main transponder and the other is monitoring the standby transponder. When two monitors are monitoring the main transponder, they can be configured either in ‘AND’ mode or in ‘OR’ mode for a changeover or a complete shutdown in the event of failure. The two power supplies work in parallel sharing load currents in normal condition. When one of the power supplies fails, the other power supply continues to provide enough power for the dual system with “no break’ operation. The power supplies also charge the backup batteries. When the mains power is interrupted, the backup batteries supply the power for the system with “no-break” operation. Figure 1-4 shows a simplified system block diagram of MARU 310/320 DME with dual transponder and dual monitor configuration.

Page 1-11


Figure 1-4 MARU 310/320 DME System Block Diagram

Page 1-12


Figure 1-5 shows a front view of the system cabinet and location of each unit. For single transponder configuration, unnecessary slots are covered with blank panels.

Figure 1-5 MARU 310/320 DME System Cabinet Front View

Page 1-13


1.3.2.

Dupl exer Unit , DPX

1.3.2.1.

Overview Figure 1-6 shows a front view of DPU and location in the system cabinet.

Figure 1-6 DPU Front View

Figure 1-7 shows the block diagram of DPU.

Page 1-14


(From LPA1 or HPA1)

DPU Module RF Board

Circulator

TX1

TX1 Couple(-60dBc) (To Front panel)

Coupler Tuneable BPF BW=4MHz

(To RXU1) RX1

FWDDET1 FWDDET2

3dB Hybrid Coupler

(From RF1/2) INT1 INT2 RX2 (To RXU2)

DME Antenna

RVSDET1

RVSDET2 (To CNT Board)

Tuneable BPF BW=4MHz

DPDT Switch

Switch Control Sig.

Dummy Load

Switch Status Sig. Coupler

TX2 (From LPA2 or HPA2)

TX2 Couple(-60dBc) (To Front panel)

Circulator

DPU Module CNT Board Switch Control & Command Sig.

Changeover Control

(From LCU/MON)

+24V GND

Arrestor

DC/DC Converter

Switch Control Sig. Switch Status Sig. (To DPDT Switch) Status & Command Signal (To TCU/MON)

RVSPWR_TXP1

RVSDET1 FWDDET1

FWDPWR_TXP1 Buffer

FWDDET2

FWDPWR_TXP2

RVSDET2

RVSPWR_TXP2 (To MON1/2)

+5V +15V -15V GND

Figure 1-7 DPU Block Diagram

1.3.2.2.

Function The DPU provides the following functions:

1.3.2.3.



System changeover transfer with configurable AND/OR mode



System shutdown



Output power level measurement



Injection of DME test interrogation signal for MON.

Description The transmit signal coming out of the LPA (MARU 310) or HPA (MARU 320) is isolated from receive signal by a circulator. The output signal from the circulator is fed to DPU module, which contains directional couplers and power detector circuitries. Finally the output is changeover controlled by DPDT and live output is fed to the antenna via a lightning arrester and standby output is fed to a dummy load. The receive signal coming through the reverse of the transmit path is isolated from transmit signal by a circulator and fed to the receiver unit, RXU via a tunable BPF. The tunable filter is adjusted for selected station channel frequency. The DPU module contains a 30 dB directional coupler, a 20 dB directional coupler and a 3 dB Page 1-15


hybrid coupler. The 30dB directional coupler is for sampling transmitter signal output and the 20 dB directional coupler along with the 3 dB hybrid coupler is used for injecting test interrogation signal from MON/RFG. Power detector for measuring RF power output level comprises RF schottky barrier diodes and OP amp buffers. The control board contains circuitry for controlling transponder changeover and system shutdown. Signals indicating executive alarm conditions from two monitors are fed to the control board. As two monitors vote for changeover, AND mode or OR mode can be selected. Also bypass control input disables transponder changeover and system shutdown even when alarm conditions are detected.

TX1 / RX1 path

DPDT Switch C1-2-LIS

DME Antenna

Switch Control Sig. Arrestor

DPU Module

Dummy Load Switch Status Sig.

TX2 / RX2 path

Figure 1-8 DPDT Coaxial Switch

The Double-Pole-Double-Throw (DPDT) switch is a RF coaxial relay with two pair of RF ports. The DPDT coaxial relay actually switches the RF signal path across the antenna for active transmitter and the RF dummy load for standby transmitter. The relay drive signal is fed the control board under control of MON. On the front panel of DPU, three indicator LEDs and two SMA test ports providing RF sample of transmitter output.

Page 1-16


1.3.3.

Receiver Unit , RXU

1.3.3.1.

Overview Figure 1-9 shows a front view of RXU and location in the system cabinet.

Figure 1-9 RXU Front View

Figure 1-10 shows the block diagram of RXU.

Figure 1-10 RXU Block Diagram

Page 1-17


1.3.3.2.

Function The RXU provides the following functions:

1.3.3.3.



Detection and recovery of incoming interrogation pulse pair



Discrimination of ON channel and OFF channel



Adjusting receive sensitivity

Description The RF down converter converts received RF signal with frequency range between 1025 MHz and 1150 MHz into 63 MHz intermediate frequency signal. The received signal from DPU is fed to a high dynamic range double balanced mixer and filtered by LC band pass IF filter. The local oscillator signal is a CW signal with the frequency same as that of transmitter and supplied from the TXU. The Variable RF attenuator attenuates the received signal to desensitize the receiver in case the load level is over a threshold point by a control of TCU. The attenuation range is from 0 dB to 80 dB. The signal from the attenuator is fed to a channel filter and gets divided into by a two-way divider. One output of the two-way divider is fed to a logarithmic detector. The output of the log detector is fed to TCU.

Page 1-18


1.3.4.

Transpon der Contro l Unit, TCU

1.3.4.1.

Overview Figure 1-11 shows a front view of TCU and location in the system cabinet.

Figure 1-11 TCU Front View

Figure 1-12 shows the block diagram of TCU.

Figure 1-12 TCU Block Diagram

1.3.4.2.

Function Page 1-19


TCU provides the following functions:

1.3.4.3.



Sampling and quantization of received signal



Decoding of received pulse pair



Generation of system delay



Echo suppression



Generation of pulse modulation signal



Measurement and adjustment of reply pulse pairs



Generation of squitter pulse pairs and IDENT pulse pairs



Load limiting by controlling receiver sensitivity



Generation of station frequency for bo th transmitter and receiver

Description In the heart of the TCU, two large scale field programmable gate arrays (FPGAs) and a high performance 16/32-bit microcontroller are comprised. The log video signal of received pulse pair is fed via buffer to a high speed analog-to-digital converter, which digitize each video sample of input pulse pair. The stream of digitized video signals are queued onto a FIFO and numerically processed to evaluate the pulse pair coding. All the processing logic is built into a FPGA 1. When valid interrogation pulse pair is detected, a trigger pulse is generated at the point 50% amplitude. The trigger pulse is fed to the other FPGA and causes it to initiate a reply pulse generation after fixed time delay. The reply pulse is generated by using combination and sequential digital logic circuitry. The pulse modulation signal is a Gaussian shape pulse signal. It is numerically synthesized and converted to an analog pulse through a digital-to-analog converter. The echo suppression is provided under control of the second FPGA. Measurements of reply pulse pair is done by sampling the transmit signal from the LPA or HPA. The sampled pulse signal is digitized by an analog-to-digital converter. The stream of digitized data samples are processed in similar way as the MON does and measured parameters are used to complement output pulse shape. The squitter signal is a pulse pair with random interval, transmitted even in no interrogation signal is present. The squitter signal is generated in the FPGA 1 and its pulse repetition is programmable via the microcontroller on the TCU. The IDENT signal is also generated in the FPGA 1 and its Morse code keying is controlled by TCU software. The TCU monitors the load level of received interrogation pulse pairs. If the load level is increased beyond a preset threshold level, the TCU lowers the control voltage supplied to the attenuator in the DPU, so as to desensitize the receiver responding range and eventually limits load level. Page 1-20


The TCU provides the serial setup data for the phase locked loop (PLL) frequency synthesizers of both transmitter and receiver with the station frequency.

Page 1-21


1.3.5.

Trans mit ter Unit , TXU

1.3.5.1.

Overview Figure 1-13 shows a front view of TXU and location in the system cabinet.

Figure 1-13 TXU Front View

Figure 1-14 shows the block diagram of TXU.

Page 1-22


TPLL_DATA, TPLL_CLK, TPLL_EN

From TCU To TCU

TPLL_LD 2

1

3 PLL Module

TCXO

Drive Amplifier

To Front Panel FREQ -20dBm(CW)

6

To MON FD 1.5Vpp at 1K Ω

FREQ DET

4

5 AGC Attenuator

7 Splitter

To RXU Local +4dBm(CW)

2Way & AGC

TXU AGC

To TCU

TXU_RF_ON 8

11

9 Final Amplifier

RF Switch

Coupler & Detector

To LPA TXU OUT +22dBm(Peak Power)

To Front Panel TXU ENV 3Vpp at 1K Ω 10 Rectangular Shape Pluse Modulation Circuit +24V GND

12

+5V DC/DC Converter

GND

Figure 1-14 TXU Block Diagram

1.3.5.2.

Function TXU provides the following functions:

1.3.5.3.



Generation of transmit carrier reference signal



Pre-scaling the reference signal for use with frequency monitoring



Binary modulation of transmit signal



Providing the local oscillator signal for the RXUr



Providing automatic gain control to maintain constant output power level

Description Page 1-23

From TCU Pulse_MOD


TCXO

generates a stable reference frequency for the PLL frequency synthesizer PLL frequency synthesize r

synthesizes CW signal with a station frequency from the reference signal from the TCXO. Driver amplifier

The output signal from the PLL frequency synthesizer is amplified to -20dBm, a level to drive the final amplifier AGC attenuator

The transmit carrier signal should be regulated by an AGC circuit to maintain stable amplitude. The attenuator is used to control amplitude of the transmit signal. The AGC control signal is generated by converting detected sample of output signal into a dc signal. A two-way power splitter, RF schottky diodes and OP amp circuitry are used for this purpose. Frequency detector

To monitor integrity of the station frequency, a sample of generated transmit signal is prescaled by 1/80 and fed to a TCU, which measures the station frequency by counting the number of pulses per unit time. RF Switch

RF switch is used to modulate the CW input signal with rectangular pulse shape. This is done by switching on/off the input signal in sync with the modulation signal. Final amplifier

The final amplifier amplifies the input signal from the drive amp to a 100W of peak power. Coupler & Detector

The signal from the final amplifier is supplied to either DPU or HPA through a directional coupler. The directional coupler samples a small amount of RF energy and RF schottky diode detects the RF signal envelope. DC/DC converter

A built-in DC-to-DC converter takes +24V DC input and converts it into multiple DC voltages, including +5V, ±15V and +10V needed for each circuitry.

Page 1-24


1.3.6.

Low Power Ampl ifi er, LPA

1.3.6.1.

Overview Figure 1-15 shows a front view of LPA and location in the system cabinet.

Figure 1-15 LPA Front View

Figure 1-16 shows the block diagram of LPA.

Page 1-25


Figure 1-16 LPA Block Diagram

1.3.6.2.

Function The LPA provides the following functions:

1.3.6.3.



Amplification of transmit signal up to a level of 100W peak.



Pulse modulation of transmit signal



Monitors internal temperature



Detection of RF output level

Description The input signal to LPA is amplified through four stages of RF amplifier up to +52dBm peak. Total power gain is 30 dB with ±1 dB of tolerance. The first stage of amplifier is driven by a GaAs FET and operated as class A. The reset of the stages are driven by RF bipolar junction Page 1-26


transistors and operated as class C. Gaussian shape pulse modulation is applied onto first three stages of amplifiers. The current flow to each drain/collector is modulated by the modulation signal, which has a Gaussian shape with rectangular pedestal. The final output signal is fed to a isolator for protection against possible mismatching and the resulting reflected power. Proper protection against possible damage from absence of negative bias supply voltage is provided. Also inside temperature is monitored with a digital temperature sensor, whose output is fed to TCU. RF output signal is sampled by a 35 dB directional coupler for envelop detection and for a BITE. A schottky barrier diode and op amps are used for envelop detection and BITE functions. A DC/DC converter is built into the LPA. The DC/DC converter takes +24V input supply and generates necessary voltages including +10V, ±15V, and ±5V. Also a hot-swap controller is built around the DC/DC converter circuits. The +50V DC input is supplied from an external DC/DC converter.

Page 1-27


1.3.7.

High Power Amp lifier, HPA

1.3.7.1.

Overview Figure 1-17 shows a front view of HPA and location in the system cabinet.

Figure 1-17 HPA Front View

Figure 1-18 shows the block diagram of HPA.

Page 1-28


Figure 1-18 HPA Block Diagram

1.3.7.2.

Function HPA is equipped only in MARU 320 DME, which is 1 kW output version. The HPA provides the following functions: 

High-power amplification of DME response signal



Additional Gaussian shape pulse modulation



Adjustment of power output



Monitoring of inside temperature



Detection of RF output power

Page 1-29


1.3.7.3.

Description The HPA takes input of peak power 44.5 dBm from the output of LPA and amplifies it with maximum gain of up to 17.5 dB. To maintain stable constant amplitude, a sample of output power is detected and fed back to TCU for digital control of output amplitude. The HPA comprises two stages of amplification. The first stage is driven by a bipolar transistor operating as class C. Besides the modulation in LPA, additional pulse modulation is applied to the first stage of HPA. The final stage is driven by four transistors combined in parallel operating as class C. Like LPA, the final output signal is fed to a isolator for protection against possible mismatching and the resulting reflected power. Supervisory circuits similar to that of LPA are provided including a digital temperature sensor for monitoring inside temperature and a directional coupler, an envelop detector and op circuits for detecting RF output power. A built-in DC/DC converter takes +24V input and generates necessary voltages including +10V, ±15V, and ±5V. Also a hot-swap controller is built around the DC/DC converter circuits. The +50V DC input is supplied from an external DC/DC converter.

Page 1-30


1.3.8.

Monitor Unit , MON

1.3.8.1.

Overview Figure 1-19 shows a front view of MON and location in the system cabinet.

Figure 1-19 MON Front View

Figure 1-20 shows the block diagram of MON.

Figure 1-20 MON Block Diagram Page 1-31


1.3.8.2.

Function MON provides the following functions: 

Measurement including reply delay, spacing, duration, and rising/decay time of reply pulse pair

1.3.8.3.



Monitoring of transponder and test interrogation RF signal generator (RFG)



Detection and monitoring of IDENT code output



Monitoring of receiver sensitivity



Generation of modulation signal for RFG



Measurement of RFG interrogation signal



Built-In Self Test

Description MON is built around a high performance microcontroller with large scale FPGA and a number of analog-to-digital converters and digital-to-analog converters. Most of the measurement and evaluation functions are built into the FPGA hardware, so that software operation does not affect stability and integrity of the MON functions. Programmable alarm limits are loaded into the FPGA registers and hardware comparison logic circuits provide transponder changeover / shutdown signal in case of an alarm condition persists for a preset period of time. All the measurement results and monitored status information is collected by the microcontroller and presented to operator via LCU. The monitor causes an alarm to be indicated on all the local and remote monitoring equipments and automatically transfers to standby transponder if the transponder delay differs from the normal value (50 μs for X channel, 56 μs for Y channel) by 0.5 μs or more Also, the monitor can be configured to cause an alarm when the following conditions arise: a)

a fall of 3 dB or more in transponder transmitted power output

b)

a fall of 6 dB or more in the minimum transponder receiver sensitivity

c)

the spacing between the first and second pulse of the transponder reply pulse pair differs from the normal value by 1 μs

d)

variation of the transponder receiver and transmitter frequency beyond the control range of the reference circuit

The time that any of the conditions and malfunctioning enumerated above can persist before an executive action of a transfer or a complete shutdown takes place is adjustable by software from 0 up to 10 seconds. In any cases, the transponder is not triggered more than 120 seconds per second for either monitoring or automatic frequency control purposes, or both. Page 1-32


Failure of any part of the monitor itself automatically produces the same results as the malfunctioning of the element being monitored.

Page 1-33


1.3.9.

Radio Frequenc y Generator Unit , RFG

1.3.9.1.

Overview Figure 1-22 shows a front view of RFG and location in the system cabinet.

Figure 1-21 RFG Front View

Figure 1-22 shows the block diagram of RFG.

Page 1-34

MARU 310/320 DME Technical Manual Volume I, Section 1 RPLL_DATA, RPLL_CLK, RPLL_EN

RPLL_LD 2

1

3 PLL Module

TCXO

Drive Amplifier

6

5

8 RFG AGC

Rectangular Shape Pluse Modulation Circuit

Gaussian Modulation AMP1

From MON RFG_PULSE_MOD

To MON

RFG_RF_ON 9

To Front Panel FREQ -20dBm(CW)

7 RF Switch & AMP

Splitter & AGC

AGC Attenuator

To MON

To MON FD 1.5Vpp at 1K Ω

FREQ DET

4

From MON

11

Variable Attenuator

12 Gaussian Modulation AMP2

To DPU RFG OUT +30 ~ -70dBm (Peak Power) To Front Panel RF SAMPLE Sampling값: -25dB From MON RFG_ATT1 RFG_ATT2

10

Gaussian Shape Pluse Modulation Circuit

+24V

13

+5V +15V DC/DC Converter

GND

From MON RFG_GAU_MOD

+10V -15V GND From MON RFG_BITE

Figure 1-22 RFG Block Diagram

1.3.9.2.

Function RFG provides the following functions: 

Generation of RF signal for the monitor interrogator



Amplification of the test interrogation signal Page 1-35

MARU 310/320 DME Technical Manual Volume I, Section 1 

1.3.9.3.

Self monitoring of test interrogation signals

Description TCXO

generates a stable reference frequency for the PLL frequency synthesizer PLL frequency synthesizer

synthesizes CW signal with a station frequency from the reference signal from the TCXO. Drive amplifier

The output signal from the PLL frequency synthesizer is amplified to -20dBm and fed to the AGC attenuator. AGC attenuator

The transmit carrier signal should be regulated by an AGC circuit to maintain stable amplitude. The attenuator is used to control amplitude of the transmit signal. The AGC control signal is generated by converting detected sample of output signal into a dc signal. A two-way power splitter, RF schottky diodes and OP amp circuitry are used for this purpose. Frequency detector

To monitor integrity of the station frequency, a sample of generated transmit signal is prescaled by 1/80 and fed to a TCU, which measures the station frequency by counting the number of pulses per unit time. RF switch

RF switch is used to modulate the CW input signal with rectangular pulse shape. This is done by switching on/off the input signal in sync with the modulation signal. Gaussian shape pulse modulator/ amplifier

The rectangular pulse modulated interrogation signal is modulated by two stages of Gaussian shape modulators. Between two stages of Gaussian shape modulator, a variable attenuator is inserted. Variable attenuator

The programmable variable attenuator is located between two Gaussian shape pulse modulators. The variable attenuator is controlled by MON for measuring receiver sensitivity. DC/DC converter

A built-in DC-to-DC converter takes +24V DC input and converts it into multiple DC voltages, including +5V, ±15V and +10V needed for each circuitry.

Page 1-36


1.3.10.

Local Control Unit, LCU

1.3.10.1.

Overview The LCU is located behind the Control Status Panel, CSP. CSP can be open from the front and can be flipped down for accessing the embedded LCU. Figure 1-23 shows a front view of CSP and location in the system cabinet.

Figure 1-23 CSP Front View

Figure 1-24 shows the block diagram of LCU.

Page 1-37


Figure 1-24 LCU Block Diagram

1.3.10.2.

Function LCU provides the following functions:

1.3.10.3.



Data exchange mediation between TCU 1/2, MON 1/2, LMMS, RMMS and RCMU



Monitoring of LPA and HPA inside temperature



Control of cooling fans



Monitoring of AC/DC and DC/DC status



Monitoring of shelter environment



User interface using built-in CSP



Providing a real time clock



Audio alerting and providing IDENT keying sound

Description The LCU is made up of a high performance 32-bit microprocessor with necessary glue logic, memory, serial communication controllers and peripheral devices. A 32-bit microprocessor with 4 built-in serial communication controllers, MPC860 is the core controller for the LCU. One of its serial controllers, SCC1 is used as an Ethernet controller for connecting with a TCP/IP based RMMS/LMMS. SCC2 is used as a RS-232C controller for debug terminal. SCC3 and SCC4 are used as RS-232C controller for communicating with MON1 and MON2 respectively. SMC1 and SMC2 are also used as RS-232C controller for communicating with TCU1 and TCU2 respectively. Three external 16C2550 dual UART controllers are used for remote communication with RCMU, RMU or RMMS via modem or direct line. Temperature sensors and cooling fans and other supervisory sensors are connected to the LCU via general purpose input/output interface. Two analog-to-digital converters for monitoring AC/DC or DC/DC power supply are provided. Electrically isolated by using opto-couplers IDENT keyer and equipment status output interface are provided for collocation with other navaids equipment, such as VOR and ILS. For direct access to the system control and status info from the front panel of the system cabinet, a graphic LCD and a keypad are directly interfaced to the microcontroller of the LCU. For audio alerting of alarm conditions, a loud speaker is enclosed inside the LCU housing. This speaker is also used for audio monitoring of IDENT keying and the LCU has a tone generator for it. A secure digital card (SD card) interface is provided for history logging. Page 1-38


1.3.11.

AC to DC Converter Unit , AC/DC

1.3.11.1.

Overview Figure 1-25 shows a front view of AC/DC and location in the system cabinet.

Figure 1-25 AC/DC Front View

Figure 1-26 shows the block diagram of AC/DC.

Page 1-39


Figure 1-26 AC/DC Block Diagram

1.3.11.2.

Function AC/DC converter provides the following functions:

1.3.11.3.



Generation of DC 24V from AC mains power input



Charging of backup batteries



Protection of backup batteries



Supervisory monitoring of output voltages and currents

Description The AC/DC is made up of commercial off-the-shelf SMPS modules, backup battery charger and surrounding supervisory circuits. The HWS1500-24 module is at the heart of the AC/DC and generates +24V DC voltage with maximum current of 70A. Page 1-40


The battery charger circuit provides charging current for the backup batteries. Proper protection for backup battery is provided to avoid over-discharging.

Page 1-41


1.3.12.

DC to DC Converter Unit , DC/DC

1.3.12.1.

Overview Figure 1-27 shows a front view of DC/DC and location in the system cabinet.

Figure 1-27 DC/DC Front View

Figure 1-28 shows the block diagram of DC/DC.

Figure 1-28 DC/DC Block Diagram

Function DC/DC Converter provides the following functions: Page 1-42


1.3.12.2.



Generation of +50V DC voltage



Supervisory monitoring of output voltages and currents

Description The DC/DC converter is also made up of commercial off-the-shelf DC/DC converter modules. Two PAH300S24-28 DC/DC converter modules are used in series to produce +50V DC voltage. Proper protection against over-voltage and over-current and supervisory monitoring circuitry is provided for BITE.

Page 1-43


1.3.13.

Backup Battery

1.3.13.1.

Overview Figure 1-29 shows a front view of back battery subrack and location in the system cabinet.

Figure 1-29 Backup Battery Subrack Front View

1.3.13.2.

Description The backup battery provides emergency backup electricity when AC power input is discontinued. The backup battery is composed of four maintenance-free lead-acid batteries. Two of the batteries are wired in series to produce +24V respectively. The batteries are contained in two lower subtracts of system cabinet. On the front panel cover of each battery subrack, a circuit breaker switch is installed to isolate the batteries from the system electrics and gets cut-off in case of over current flows.

Page 1-44


1.3.14 1.3.14..

Remote Control Monito r Unit, RCMU RCMU

1.3.14.1.

Overview Figure 1-30 shows a front view of RCMU.

Figure 1-30 RCMU Front View

Figure 1-31 shows the block diagram of RCMU.

: z k H c M o l 2 1 C 9 n 4 i . a 9 M 2

MPU

DATA SRAM

r r e e f f f f u u B B

SCC1

RS232 /1, RS232/2

RS232 Driver

UART

UART Clock : 14.7456MHz

ROM

UART

RS232 Driver

UART

RS232 Driver

Socket Modem1

MODEM RS232

Buffer

485 /1, RS485/2 RS

RS232 (Not Used)

EPLD RS232 Driver

DVOR Status Microprocessor Part Communication Part

Alarm Sound

Amp

Speaker out

DATA

Buffer

Buffer

Alarm Sound

Graphic LCD

R-CSP

KEY & LED

+5V

SMPS

Power [+5V]

R-CSP I/F

Figure 1-31 RCMU Block Diagram

1.3.14.2.

Description The RCMU has the same front panel control as the CSP on the system cabinet. Most of the functions that are provided with the CSP are also supported with RCMU except some of the functions that are inherently local. The RCMU is connected to the LCU through a two-wire leased-line or a dial-up line using built-in high speed modem that is capable of exchanging data at a rate of up to 33,600bps. Optionally, the RCMU supports two RS-232C interfaces for direct connection to the main system cabinet at short distance using a RS-232C cross cable or external data links such as wireless data modem. Page 1-45


Up to two slave remote monitoring units (RMU) can be connected to the RCMU via a pair of RS485 compatible balanced lines.

Page 1-46


1.3.15. 1.3.15.

Remote Moni tor Unit , RMU

1.3.15.1.

Overview Figure 1-32 shows a front view of RMU.

Figure 1-32 RMU Front View

Figure 1-33 shows the block diagram of RMU.

TXD RXD : z k H c M o 6 l C 5 n 4 i 7 . a 4 M 1

RS485_TXD RS485 Driver U301

RS485_RXD

Alarm Sound

Amp

Speaker out

RS485 Driver Alarm Sound

MPU U300

LED Control

Sink Driver U400

LED Bar LED400~LED405

LED Drive +5V KEY Input Microprocessor Part

Silence KEY

Lamp Test KEY

SMPS

Power [+5V]

Key Input Alarm Sound

Figure 1-33 RMU Block Diagram

1.3.15.2.

Description The RMU provides simple monitoring functions only. An 8-bit microcontroller is employed for the RMU. The RMU is housed in a small box with a dedicated power supply. A number number of LED indicators placed on the front of the RMU shows brief Page 1-47


status of the system. In addition a loud speaker is contained in the RMU to provide audible alert. The RMU can be connected to the LCU directly through RS-232C or RS-422/485 interface or connected to a RCMU through the same communication link.

Page 1-48


1.3.16. 1.3.16.

Loc al/Remote Maintenan ce Moni torin to rin g Syst em, LMMS/RMMS LMMS/RMMS

1.3.16.1.

Overview Figure 1-34 shows the startup screen of LMMS/RMMS.

Figure 1-34 Startup Screen

Figure 1-35 shows the main screen layout of LMMS/RMMS.

Page 1-49


Figure 1-35 Main Screen

Figure 1-36 is a screenshot of LMMS/RMMS transponder screen.

Page 1-50


Figure 1-36 Transponder Screen

Figure 1-37 is a screenshot of LMMS/RMMS monitor screen.

Page 1-51


Figure 1-37 Monitor Screen

Page 1-52



Page 1-53



SECTION 2 INSTALLATION

MOPIENS, INC.



Table of Contents Section 2. 2.1.

INSTAL LATION................................................................................................... 2-1 INTRODUCTION ................................................................................................. 2-1

2.1.1.

SAFETY PRECAUTIONS.............................................................................. 2-1

2.2.

INSTALLATION ................................................................................................... 2-2

2.3.

INSTALLATION SITE SELECTION ..................................................................... 2-2

2.4.

EQUIPMENT SITE LOCATION ........................................................................... 2-3

2.5.

UNPACKING, PACKING, AND SHIPPING .......................................................... 2-3

Page i


Page ii


Section 2.

INSTALLATION

2.1. INTRODUCTION 2.1.1.

SAFETY PRECAUTIONS

At every site, strict attention should be paid to safety regulations issued by the local authorities.

2.1.1.1.

General Rules



To avoid accidents, the following safety rules should be observed.



Do not consume alcohol in any form on the installation site.



Anyone under the influence of alcohol will not be tolerated on the installation site.



Wear protective goggles and safety gloves when working on batteries. Keep rinsing water, soda, and several cleaning cloths on hand.



Wear sturdy shoes, safety gloves, and safety helmets.



Remove protruding nails, strips, etc. immediately.



Always check ladders and planks carefully before use.



Do not tread on protruding plank sections.



Never leave objects on scaffolding or ladders.



Erect sturdy scaffolding and frames and always test them thoroughly before using them.



Test and check electrical devices and extension cables before you use them.



Remove fuses before working on the mains.



Wear protective goggles when sanding or drilling.



Sand off burr from chisels and punches.



Test striking tools for tightness of fit.



Do not put pointed or sharp objects into work clothing pockets.



Remove jewelry such as chains and rings when working on building sites, especially when working with electrical devices.

Page 2-1




Always keep escape routes clear.



Every employee on an installation site should know the following.



Where the First Aid box is kept.



The telephone number of the nearest casualty doctor and eye specialist.



Where the fire extinguisher is kept.



The location of hazardous areas on the way to the work place or at the work place itself.



When the shelter (equipment room) is unoccupied, it should be locked.

2.2. INSTALLATION 

To install the beacon, you must perform the following procedures.



Select and prepare the site.



Remove equipment from shipping containers.





Make connections (typical installation), specifically, ground the equipment, connect the power supplies, connect the antenna, and make the input/output (I/O) connections Depending on the beacon configuration selected and the options used, it may be necessary to connect the facility to the associated equipment or to other equipment.

2.3. INSTAL LATION SITE SELECTION The location for the distance-measuring equipment (DME) installation is determined by the responsible Civil Aviation Authority according to international air traffic regulations. The selection of the DME location also depends on nearby obstacles and clearance and, when located in the terminal area, runway configuration; e.g., overrun, clearway, stopway. The following site selection guidelines are only general recommendations. The final site decision should be made locally, prior to, and during installation. The guidelines are computed with formulas that take into account the terrain, obstacles, and other unique considerations of the location. The installation location is determined by a surveyor-supervised site survey. can provide an engineering consultant on site for this survey.

Airsys ATM

The DME installation location depends on the following conditions: 

Terminal area beacon

DME (substituting or enhancing MARKER functions) placed with instrument landing system (ILS) equipment Stand-alone

Page 2-2


DME with omnidirectional antenna on its own mast and equipment installed into a suitable shelter. The area is dependent on clearance and runway configuration. 

En route beacon

With or without associated very-high-frequency omnidirectional radio range (VOR) equipment (external zone site and normally far away from terminal area)

2.4. EQUIPMENT SITE LOCATION The ground beacon may be installed in a control room or inside a shelter that complies with the environmental temperature, humidity, and pressure values listed in section 4. The equipment has the following overall dimensions. 

Height: 1730 mm



Width: 580 mm



Depth: 610 mm

The equipment requires the following clearances. 





If rear access is required, there must be at least 24 inches between the rear part of the beacon and the wall and any piece of equipment. A minimum of 24 inches between the top of the beacon and the ceiling of the control room or the shelter to leave space for the external connection cables and to allow access to the antenna connector and to the antenna probes connectors. A minimum of 4 feet between the front of the beacon and the wall and any other piece of equipment to allow the operator to open the front door.

The base must be able to support the total weight of the equipment--about 400 pounds (200 kilograms), including the optional modules, within the range of dynamic stress envisaged for the equipment. The beacon does not normally need securing; however, if it is to be secured to the base, use four M12 bolts.

2.5. UNPACK ING, PACK ING, AND SHIPPING The equipment should be unpacked as soon as possible to ensure that it is complete and intact. If it is to be stored, the storage facility must be dry. Refer to section 4 for the appropriate temperature range specified in the technical data. The DME beacon and modules will be packed according to national and international standards. The packing procedure may vary according to shipping method and destination.

Page 2-3



Page 2-4



SECTION 3 OPERATION

MOPIENS, INC.



Table of Contents Section 3.

OPERATION ....................................................................................................... 3-1

3.1.

INTRODUCTION ................................................................................................. 3-1

3.2.

CONTROL STATUS PANEL ................................................................................ 3-1

Page i


Page ii


Sect io n 3.

OPERATION

3.1. INTRODUCTION

The control and indication panel local control status unit (LCSU) gives you limited local control; the panel offers only a few functions. A locally connected personal computer (PC) appropriate user program gives you comprehensive control, including control of configuration, alignment, and maintenance operations. See figure 1-13 for typical local PC connections.

3.2. CONTROL STATUS PANEL

The control status panel (CSP) is subdivided into the following groups. 

STATUS



CONTROL



TRANSPONDER



MONITOR

The individual fields contain indications and keys. Only those indications currently in message status are lit and readable. This minimizes misinterpretations.

Page 3-1



Page 3-2



SECTION 4

MAINTENANCE

MOPIENS, INC.



Table of Contents Section 4.

4.1. 4.2. 4.3. 4.4.

MAINTENANCE ............................................................................................... 4-1

INTRODUCTION ................................................................................................. ................4-1 Periodic Maintenance ........................................................ ....................................................4-1 Routine Tests ........................................................................................... ..............................4-2 Routine maintenance .............................................................................................................4-2 4.4.1. Cleaning ............................................................ .........................................................4-3 4.4.2. Other Checks .............................................................................................................4-3 4.4.3. Antenna Installation Inspection .................................................................................4-3 4.4.4. Standby Operation Test ............................................................... ...............................4-3

Page i


Page ii


Secti on 4.

MAINTENANCE

4.1. INTRODUCTION Plan your preventive maintenance activities according to local regulations. This section provides recommendations for initial preventive maintenance schedules and activities. Once you have confirmed that the system is stable, you can extend the maintenance intervals.

4.2. Period ic Maintenanc e Each parameter of the transponder on antenna is measured in real time by the monitor(s). The monitors incorporate BITE to verify all aspects of system performance. These instruments are constantly verified by their own self-checks, the monitor integrity check, for example. So failures are detected automatically. If a monitor fails, it will shut itself off and generate a failure message. Performance checks and periodic maintenance for the MARU 310/320 DME should be initially performed properly. Many performance checks consist of running preprogrammed tests and comparing the results to previously recorded data. The frequency of periodic maintenance can be reduced according to operator's requirements, environmental conditions, and the practical experience collected over time. Every parameter to be measured is associated with the corresponding limits according to Annex 10, Doc. 8071 Part III DME International Civil Aviation Organization (ICAO) specifications, the standards and tolerances in paragraph 5.2, and manufacturer's data in section 4. The built-in tests are performed using a local or remote PC. The parameters measured with the EXECUTIVE MONITORING and ROUTINE CHECK programs may be viewed using the CHECKS menu. In addition to the standard tests, the skilled operator may use the CONFIGURABLE MEASUREMENT tests to create special tests (not provided by the system) necessary to perform particular checks. Before starting every maintenance procedure, it is useful to analyze any possible alarm or warning condition which may have occurred from the last maintenance intervention so as to perform more accurate controls on the parameters that show signs of degradation. At the end of the maintenance procedures, print the last Routine Check and the data relating to every measurement performed; compare them to the previous data and to the data obtained upon installation. The operator should test both transponders and should use the diagnostic function (DIAGNOSTIC TEST) to do a final test on both of them.

Page 4-1


For the shelter, air conditioner, and emergency battery (if applicable), observe the manufacturer's maintenance recommendations.

Procedure

Initial Performance Interval*

Routine tests

Monthly

Perform locally or remotely using PC

Transponder frequency measurement

Annually

Performed at DME facility

Power measurements

Annually


Monitor operation, transfer, and shut-down performance

Semiannually


Operate station standby batteries

on

Semiannually


Other general checks and maintenance

Semiannually


supply

Comments

4.3. Routine Tests Routine performance tests verify the proper performance of the DME transponder and monitor and should be part of periodic maintenance. All limits should conform to the tolerances in table 5-1 or those dictated by local regulations. All tests must pass.

4.4. Routin e maintenance

WARNING To avoid an electrical shock, make sure that the equipment is turned off before you do any routine maintenance.

Page 4-2


4.4.1.

Cleaning

Clean the outside and inside of the shelter, if necessary. Clean the inside and outside of the equipment cabinet when necessary. Always use a vacuum cleaner to avoid transferring dirt to DME cabinet during the cleaning. CAUTION Use only anti-static brushes and dusters. Also, use only a soft cloth; do not use corrosive and abrasive substances. The CSP front panel may be damaged by some types of cleaning chemicals. To remove dirt from the CSP panel, moisten a cloth with ethyl alcohol, glycol, or clean water and remove dirt. Only dust the subassemblies in conjunction with the necessary removal of a subassembly and, even then, only if you can see dust on them. If you dust them, use a vacuum cleaner if you can; otherwise use a soft brush. During such operations, it is essential to observe all precautionary measures for static-sensitive semiconductors.

4.4.2.

Other Checks

Inspect all components to ensure that there is no damage, corrosion, or evidence of overheating. Verify that all components are securely mounted and that all electrical connections are secure.

4.4.3.

Ant enna Installation Inspecti on

Thoroughly inspect the antenna installation (mast, antenna cables and connectors, power cable, and obstruction lights) for damage caused by corrosion or by rodents, termites, or other pests. The frequency of inspections depends on the site’s environment. Make sure all RF cable connections (internal and external) are tight.

4.4.4.

Standby Operati on Test These procedures provide for checking the station batteries and correcting any deficiencies that may be found and should be performed as part of periodic maintenance.

WARNING

Page 4-3


Flooded batteries generate an explosive gas under normal operating conditions. Take care to avoid creating sparks that could ignite this gas. Ensure that no tools or other metal objects can fall onto the batteries or otherwise contact the batteries and cause a short. Batteries contain a very corrosive electrolyte that can cause serious injury to the skin and eyes. Wear proper protective clothing and eye, hand, and face protection when working with the batteries. 











Inspect each battery and verify it has no bulges, cracks, or other deformations. any defective batteries.

Replace

Check all battery terminal connections and verify they are tight and corrosion-free. Check that batteries are clean and corrosion free. If necessary, remove dust or dirt by wiping with a water-moistened cloth. If there is electrolyte on the surface of a sealed battery, the battery has failed and should be replaced. If there is electrolyte on the outer surfaces of a flooded battery, neutralize it with a solution made up of 1/2-pound baking soda in 1 quart of water (0.22-kilograms measurements soda/liter water). Initially, this solution will bubble. The electrolyte is neutralized when bubbling no longer occurs when fresh solution is applied. When electrolyte is neutralized, wipe battery clean with a water-moistened cloth. Dry battery with a dry clean cloth. Using a digital multimeter or equivalent, measure the voltage across all batteries. voltage should be approximately 28 volts DC. Record this voltage.

This

Divide the voltage recorded in step d by 4 and record this voltage. Measure and record voltage across each battery. be the voltage recorded in step e ±0.2 volts DC.

The voltage across each battery should



Turn off the AC power and record the time.



Five minutes after performing step g, measure and record voltage across the battery supply.





Twenty minutes after performing step g, measure and record the voltage across the battery supply. This voltage should be no less than 0.2 volts DC less than the voltage recorded in step h. If battery supply fails this check, measure and record voltage across each battery. Replace the battery that is causing the drop in voltage. Charge the new battery and repeat steps a through i. Turn on the AC power.

Page 4-4



SECTION 5 TROUBLESHOOTING

MOPIENS, INC.



Table of Contents Section 5. TROUBLESHOOTING ........................................................................................ 5-1 5.1. INTRODUCTION................................................................................................. 5-1 5.2. Useful Information for Troubleshooting ............................................................... 5-2 5.3. Troubleshooting Procedures ............................................................................... 5-2 5.1.1. Diagnostics .................................................................................................... 5-2 5.1.2. Primary Voltages ........................................................................................... 5-3 5.1.3. Stabilized Power Supplies ............................................................................. 5-3 5.1.4. Input/Output System ...................................................................................... 5-3 5.4. Module Replacement Procedures ....................................................................... 5-4 NOTE.......................................................................................................................................... 5-4

Page i


Page ii


Section 5.

TROUBLESHOOTING

5.1. INTRODUCTION

These paragraphs provide all the information you will need to detect and replace faulty modules. The MARU 310/320 DME built-in test equipment makes troubleshooting easier. If there are faulty modules, you will see failure messages identifying the modules. If both of the transponders are shut down (dual system), you should first restore one of the two transponders by removing the faulty module and replacing it with its counterpart from the other transponder. This way you can quickly restore the beacon to service. NOTE Faulty modules should be repaired at an authorized repair facility. All technicians involved in troubleshooting should have a good knowledge of MARU 310/320 DME theory of operation and should be familiar with safety measures required to prevent injury to maintenance personnel and damage to the beacon. Replace the modules in the sequence indicated by the diagnostics. However, before you replace any module, display all of the stored alarms or warnings that have occurred since the last maintenance intervention. The colored warning lights on the different modules have the following meanings. Green light: Normally on—indicates the module or circuit is working normally. Red light: Normally off—only comes on to indicate module failure. Yellow light: Normally on—provides additional beacon operation status information. These colors and conventions are also used for PC messages. WARNINGS, ALARM, SHUT-DOWN, and HARD (primary alarm presence indication) messages are red. They also flash to be easily seen even on a monochromatic screen. When the beacon is operating normally, there are no red LEDs or PC messages. Before you replace a module with a red LED on, reset it; a transient malfunction may have activated a protection, which lit the LED. Note however, that the reset pushbuttons on the DMD and MON modules cannot be used during initialization. Connections made with flat and coaxial cables and to passive, non-plug-in components are highly reliable. You may check them last but do not overlook them. WARNING Use great care when working on the battery charger power supply (AC/DC) unit rear part; it contains dangerous voltage (240 VAC).

Page 5-1


WARNING Radio frequency voltage on RF power amplifier modules output is hazardous. The AC-DC modules contain the 240 VAC mains voltage and the corresponding 300 VDC rectified voltage. The capacitors may remain charged for several seconds after the modules are disconnected. After removing these modules, wait for a few minutes before touching the internal circuits. CAUTION To prevent the RF components from being damaged, RF loads (antenna cable, 50 Ω loads) should always be connected when the transponder is set to OPERATING.

5.2. Useful Inform ation for Troub leshoot ing The remote site procedures apply to the local site but not vice versa. The remote site is a center or a control site situated far away from the place where the beacon is installed. The local site is the place, near the antenna, where the beacon is installed. The two sites may be a few meters or many kilometers apart. Before you replace a module, set the beacon to off/stby. The following items are required for local repairing operations. Tool kit and spare fuses, supplied with the beacon Digital voltmeter Spare modules, especially those that are not redundant on the beacon such as the LCU and associated facility interface. IBM compatible PC (lap/palm top) with video, keyboard, 3.5-inch disk drive, cable for connecting to the beacon, printer, and startup diskette.

5.3. Troub leshoot ing Procedures 5.1.1.

Diagnostics

Use the diagnostics to check the efficiency of the dummy loaded transponder by carrying out a sequence of tests. Since the monitor(s) are used for the tests, they are checked before all the other modules, along with the power supply modules. Any possible faults will be indicated on the PC screen.

Page 5-2


5.1.2.

Primary Volt ages

A local or remote operator may obtain only the information relating to the site where the equipment is standing. The type of power provided to the beacon is clearly indicated on the PC video (POWER:MAINS and POWER:BATT. messages). If the mains power fails, the beacon will switch to battery power supply without interrupting its operation and the POWER:BATT message will appear.

5.1.3.

Stabili zed Power Supplies

Remote Site. A faulty SMPS module in the AC/DC unit is indicated by the message ACDC FAULTY. The POWER:BATT message appears when there is no power from the mains or when both AC-DC modules are faulty. WARNING Before removing the housing of the AC-DC module, wait about 1 minute after turning off the AC supply and removing the line connections. This will allow time for the high voltage capacitors in the AC-DC module to discharge, reducing the possibility of shock. Failures of the power supplies in the LPA, TXU, HPA units are indicated by warning messages and may be confirmed by measuring the relevant DC voltages.

5.1.4.

Input/Outpu t System The parts of the input/output (I/O) system that could contribute to system failures are listed below, starting with the most probable. 

I/O panel (connectors on top of the cabinet)



Interconnecting cables and connectors.





Diagnostics are based on checking the indications provided by the front panel of INC module. Following are some of the more common cases. No indication or command possible.

Probably a power failure: check the voltage (+5V)

of LCU module. If the measured value is +5V ±5 percent, the fault is probably on th e LCU board or the connection cable. 



Green OPERATION indicator in LCU section switches off. Probable hardware or software fault on LCU board; this condition is also caused by <4.7 volt power supplies. Yellow WARNING indicator is on in LCU section.

Page 5-3

A hardware fault in circuit on LCU


board real time clock (RTC). 

Red DATA COM indicator is on in MAIN STATUS section. Indicates no communication between LCU unit and the equipment modules. This condition may be caused by faults in the serial port circuit on LCU board or the interconnecting cables and connectors. It may also be caused by a failure in the serial port of the transponder or monitor.

Before replacing the LCU board, perform the following tests. 





Press the LAMP TEST button twice in the LCU section and verify that the indicators are working properly. Shut down all the equipment from the control panel; then switch it on again after a few seconds. Momentarily press the reset button on the CSP.

If the fault persists, replace the LCU board, since the failure is not caused by a transient fault condition. The INC board can be indirectly tested through the LAMP TEST. Also, verify that the pushbuttons function properly. If the indications and commands are correct on the PC and the corresponding indications are different on the INC module, there may be an INC board fault or the configuration is incorrect. Cable or connector faults are unlikely to occur. cable has been damaged.

When they do, you can often spot where a

5.4. Modul e Replacement Procedures All the modules may be removed and installed without removing power. The special design of the connector that supplies power to each module prevents damage to the electronics. The plug-in design and upper and lower extractors make replacement easy for every module in the cardcage. To extract these modules, lift the extractors and pull the module out of its guides. For some modules, it is necessary to press the cardcage locking mechanism while withdrawing the module. To reconnect the module, reinsert it back in its guides, push it in, and lower the extractors. Several of the modules have jumper switches on their printed circuit boards. It is essential to check that the switches or jumpers on the new PBA are set to the same positions as the ones on the old module. Section 2 contains the list of the jumpers. Modules with extractors do not require any special operations for their replacement. However, you will need a screwdriver to replace the coaxial relay, DPU, and HPA unit. For other modules, proceed as described below. NOTE Check that all the RF cables have been connected correctly before switching the transmitter on again

Page 5-4


and make sure that either the antenna or a dummy load is connected. CAUTION To avoid damage to CCA and components, observe electrostatic discharge (ESD) precautions when handling all DME subassemblies.

Page 5-5



Page 5-6

MARU 310/320 Distance Measuring Equipment

Technical Manual Volume I

SYSTEM DESCRIPTION, OPERATIONS AND MAINTENANCE Copyright© 2006-2008 MOPIENS, Inc. All rights reserved This document contains copyrighted and proprietary information, which may not be disclosed to others for any purposes without written permission from MOPIENS, Inc.

MARU 310/ 320 DISTANCE MEASURING EQUIPMENT

Technical Manual

VOLUME II

PARTS LISTand SCHEMATIC DIAGRAMS

C opyright (C ) 2006-2008

MOPIENS, Inc. www.mopiens.com


Revision Records Rev

Date

0

2007/11/05

Description Initial Issue

By Lee, K.W.


Table of Contents

Secti on 1

System Cabinet

Sectio n 2

DPU

Sectio n 3

CSP

Sectio n 4

LCU

Sectio n 5

LPA

Sectio n 6

HPA

Sectio n 7

DC/DC

Sectio n 8

RXU

Sectio n 9

TXU

Sectio n 10

TCU

Secti on 11

MON

Sectio n 12

RFG

Sectio n 13

ACDC

Sectio n 14

FAN


Technical Manual VOLUME II PARTS LIST and SCHEMATIC DIAGRAMS

Section 1 SYSTEM CABINET

MOPIENS, INC.


Secti on 1.

System Cabinet

Sect ion 1. System Cabin et ................................................................................................... 1-1 1.1. Ext ernal Interface ................................................................................................... 1-1 1.2. LCU Bac kplane ....................................................................................................... 1-5 1.3. RF Subrack Backp lane ........................................................................................ 1-10 1.4. Contr oller Subrack Backp lane ............................................................................ 1-20 1.5. AC/DC Subrack Backplane .................................................................................. 1-31


MARU 310/320 DME Technical Manual Volume II, Section 1.

Section 1. 1.1.

System Cabinet

External Interface

Figure 1-1 External Int erface PCB Layout Page 1-1


Figure 1-2 External Interface, sheet 1 of 3 Page 1-2






1.2.

LCU Back plane

Figure 1-5 LCU BP Page 1-5


Figure 1-6 LCU BP, sheet 1 of 4 Page 1-6








1.3.

RF Subrack Backpl ane

Figu re 1-10 BP RF

Page 1-10


Figure 1-11 BP RF (BOTTOM)

Page 1-11


Figure 1-12 RF BP, sheet 1 of 8 Page 1-12
















1.4.

Contro ller Subrack Backpl ane

Figure 1-20 CTRL BP Page 1-20


Figure 1-21 CTRL BP (BOTTOM)

Page 1-21


Figu re 1-22 CTRL BP, sheet 1 of 9 Page 1-22


















1.5.

AC/DC Subrack Backpl ane

Figu re 1-31 AC/DC BPU Page 1-31


Figure 1-32 AC/DC BP Page 1-32


Page 1-33



Section 2 DPU

MOPIENS, INC.


Sectio n 2. 2.1. 2.2.

DPU

DPU RF .................................................................................................................... 2-1 DPU CTRL ............................................................................................................... 2-6


MARU 310/320 DME Technical Manual Volume II, Section 2

Section 2. 2.1.

System Cabinet

DPU RF

Figure 2-1 DPU RF

Page 2-1


Figure 2-2 DPU RF, sheet 1 of 4 Page 2-2








2.2.

DPU CTRL

Figure 2-6 DPU CTRL

Page 2-6


Figure 2-7 DPU CTRL, sheet 1 of 4

Page 2-7



Page 2-8



Page 2-9



Page 2-10



Section 3 CSP

MOPIENS, INC.


Sectio n 3.

CSP

Sectio n. 3. CSP ................................................................................................................... 3-1 3.1. CSP .......................................................................................................................... 3-1



Section 3. 3.1.

CSP

CSP

Figure 3-1 CSP

Page 3-1


Figure 3-2 CSP (BOTTOM)

Page 3-2


Figure 3-3 CSP, sheet 1 of 2 Page 3-3


Figure 3-4 CSP, sheet 2 of 2 Page 3-4



Section 4 LCU

MOPIENS, INC.


Sectio n 4.

LCU

Sectio n. 4. LCU ................................................................................................................... 4-1 4.1. LCU .......................................................................................................................... 4-1



Section 4. 4.1.

LCU

LCU

Figure 4-1 LCU

Page 4-1


Figure 4-2 LCU Main Board, s heet 1 of 16 Page 4-2
















Figure 4-10 LCU Main Board, sheet 9 of 16 Page 4-10

















Page 4-18



Section 5 LPA

MOPIENS, INC.


Sectio n 5.

LPA

Sect ion 5. LPA ....................................................................................................................... 5-1 5.1. LPA MOD ................................................................................................................. 5-1 5.2. LPA AMP .................................................................................................................. 5-8



Section 5. LPA 5.1.

LPA MOD

Page 5-1


Figure 5-1 LPA MOD PCB Layout

Figu re 5-2 LPA MOD, sheet 1 of 6 Page 5-2


Figu re 5-3 LPA MOD, sheet 2 of 6 Page 5-3


Figu re 5-4 LPA LPA MOD, sheet 3 of 6 Page 5-4








5.2.

LPA AMP

Figure 5-8 LPA AMP PCB Layout

Page 5-8


Figu re 5-9 LPA AMP Page 5-9



Page 5-10



Section 6 HPA

MOPIENS, INC.


Sectio n 6

HPA

Sectio n 6. HPA ....................................................................................................................... 6-1 6.1. HPA MOD ................................................................................................................. 6-1 6.2. HPA AMP ................................................................................................................. 6-6 6.3. HPA LED .................................................................................................................. 6-8



Section 6. HPA 6.1.

HPA MOD

Figure 6-1 HPA MOD

Page 6-1


Figure 6-2 HPA MOD, sheet 1 of 4 Page 6-2








6.2.

HPA AMP

Figure 6-6 HPA AMP PCB Layout

Page 6-6


Figure 6-7 HPA AMP Page 6-7


6.3.

HPA LED

Figure 6-8 HPA LED PCB Layout

Page 6-8


Figure 6-9 HPA LED Page 6-9



Page 6-10



Section 7 DC/DC

MOPIENS, INC.


Sectio n 7

DC/DC

Sect ion 7. DC/DC .................................................................................................................. 7-1 7.1. DC/DC ...................................................................................................................... 7-1



Section 7. DC/DC 7.1.

DC/DC

Figure 7-1 DC/DC Page 7-1


Figure 7-2 DC/DC, sheet 1 of 4 Page 7-2









Page 7-6



Section 8 RXU

MOPIENS, INC.


Sectio n 8

RXU

Sect ion 8. RXU ...................................................................................................................... 8-1 8.1. RXU .......................................................................................................................... 8-1



Section 8. RXU 8.1.

RXU

Figure 8-1 RXU PCB Layout Page 8-1


Figure 8-2 RXU, sheet 1 of 7 Page 8-2















Section 9 TXU

MOPIENS, INC.


Sectio n 9

TXU

Sect ion 9. TXU ....................................................................................................................... 9-1 9.1. TXU .......................................................................................................................... 9-1



Section 9. TXU 9.1.

TXU

Figure 9-1 TXU PCB Layout Page 9-1


Figure 9-2 TXU, sheet 1 of 6 Page 9-2













Page 9-8



Section 10 TCU

MOPIENS, INC.


Sectio n 10

TCU

Sect ion 10. TCU ................................................................................................................. 10-1 10.1. TCU .................................................................................................................... 10-1



Section 10. 10.1.

TCU

TCU

Figure 10-1 TCU PCB Layou t (TOP) Page 10-1


Figu re 10-2 TCU PCB Layou t (BOTTOM)

Page 10-2


Figu re 10-3 TCU, sheet 1 of 15 Page 10-3














Figure 10-10 TCU, sheet 8 of 15 Page 10-10


Figu re 10-11 TCU, sheet 9 o f 15 Page 10-11















Page 10-18



Section 11 MON

MOPIENS, INC.


Secti on 11

MON

Sectio n 11. MON ................................................................................................................ 11-1 11.1. MON ................................................................................................................... 11-1



Section 11. 11.1.

MON

MON

Figure 11-1 MON PCB L ayout (TOP) Page 11-1


Figure 11-2 MON PCB Layo ut (BOTTOM)

Page 11-2


Figure 11-3 MON, sheet 1 of 19 Page 11-3














Figu re 11-10 MON, sheet 8 of 19 Page 11-10






Figure 11-13 MON, sh eet 11 of 19 Page 11-13



















Page 11-22



Section 12 RFG

MOPIENS, INC.


Sectio n 12

RFG

Sect ion 12. RFG................................................................................................................. 12-1 12.1. RFG .................................................................................................................... 12-1



Section 12. 12.1.

RFG

RFG

Figure 12-1 RFG PCB Layout Page 12-1


Figure 12-2 RFG, sh eet 1 of 7 Page 12-2















Section 13 AC/DC

MOPIENS, INC.


Sectio n 13

AC/DC

Sect ion io n 13. AC/DC ................................................................... ............................................................................................................. .......................................... 13-1 13.1. AC/DC CTRL ............................................................................. ...................................................................................................... ......................... 13-1 13.2. AC/DC LED .................................................................................. ........................................................................................................ ...................... 13-5



Section 13. 13.1.

AC/DC

AC/DC CTRL

Figure 13-1 AC/DC CTRL PCB Layout Page 13-1


Figu re 13-2 AC/DC CTRL, sheet 1 of 3 Page 13-2


Figu re 13-3 AC/DC CTRL, sheet 2 of 3 Page 13-3


Figure 13-4 AC/DC CTRL, sheet 3 of 3 Page 13-4


13.2.

AC/DC LED

Figure 13-5 AC/DC LED PCB Layout

Page 13-5


Figure 13-6 AC/DC LED Page 13-6



Section 14 FAN

MOPIENS, INC.


Sectio n 14

FAN

Sect ion 14. FAN ................................................................................................................. 14-1 14.1. FAN DRIVE......................................................................................................... 14-1



Section 14. 14.1.

FAN

FAN DRIVE

Figure 14-1 FAN DRIVE PCB Layout

Page 14-1


Figure 14-2 FAN DRIVE Page 14-2

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