Planning and Installation Guide for Tri-GP v2 Systems

Triconex General Purpose v2 Systems

Planning and Installation Guide

Assembly Number 9700122-003 June 2011

Information in this document is subject to change without notice. Companies, names and data used in examples herein are fictitious unless otherwise noted. No part of this document may be reproduced or transmitted in any form or by any means, electronic or mechanical, for any purpose, without the express written permission of Invensys Systems, Inc. © 2010-2011 by Invensys Systems, Inc. All rights reserved. Invensys, the Invensys logo, Foxboro, I/A Series, Triconex, Tricon, Trident, and TriStation are trademarks of Invensys plc, its subsidiaries and affiliates. All other brands may be trademarks of their respective owners.

Document Number 9720122-003 Printed in the United States of America.

Contents

Preface

ix Summary of Sections. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ix Related Documents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . x Product and Training Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . x Technical Support . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . x We Welcome Your Comments . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . xi

Chapter 1

Introduction

1

Controller Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Fault Tolerance. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 System Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Controller Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 TriStation 1131 Software . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Theory of Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Main Processor Modules . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Bus Systems and Power Distribution . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Logic Power . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Controller Communication . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 System Diagnostics and Status Indicators . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Analog Input Module . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Analog Input/Digital Input Module . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Analog Output Modules. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Digital Input Module . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Digital Output Module . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Pulse Input Module . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Solid-State Relay Output Module . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 International Certifications and Qualifications. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Canadian Standards Association. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Factory Mutual. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 TÜV Rheinland . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 European Union CE Mark . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20

Chapter 2

System Description

23

Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 General Environmental and EMC Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 Typical Weight of Components . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 Cable Flame Test Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26

Planning and Installation Guide for Triconex General Purpose v2 Systems

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Ground Systems. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 Standard Tri-GP Products . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28 Main Processor Components. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35 MP Module Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36 MP Baseplate . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38 Communication Components . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43 Logic Power Specifications. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43 CM Baseplate . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44 I/O Modules Common Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47 Wiring Terminals. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47 Logic Power . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47 Field Power. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48 Analog Input Components . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49 AI Module 3351S2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50 AI Baseplate . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52 AI External Termination Baseplate . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54 RTD/TC/AI External Termination Panel . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56 AI Hazardous Location External Termination Panel . . . . . . . . . . . . . . . . . . . . . . . . . . 65 AI HART Baseplates . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 69 Analog Input/Digital Input Components . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 72 AI/DI Module 3361S2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73 AI/DI Baseplate . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 75 AI/DI External Termination Baseplate . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 78 AI/DI Hazardous Location External Termination Panels . . . . . . . . . . . . . . . . . . . . . 81 Analog Output Components . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 82 AO Module 3481S2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 83 AO Module 3482S2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 85 AO Baseplate . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 87 AO External Termination Baseplate . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 90 AO HART Baseplates . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 93 AO Hazardous Location External Termination Panel . . . . . . . . . . . . . . . . . . . . . . . . . 97 Digital Input Components . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 101 DI Module 3301S2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 102 DI Module 3311S2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 104 DI Baseplate . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 107 DI External Termination Baseplate . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 109 Solid State Relay Input External Termination Panel . . . . . . . . . . . . . . . . . . . . . . . . . 112 DI Hazardous Location External Termination Panel . . . . . . . . . . . . . . . . . . . . . . . . . 115 Digital Output Components . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 119 DO Module 3401S2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 120 DO Module 3411S2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 122 DO Baseplate . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 125 DO High-Current Baseplate. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 128 DO Low-Current Baseplate . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 131 Planning and Installation Guide for Triconex General Purpose v2 Systems

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DO External Termination Baseplate . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 134 Relay Output External Termination Panel. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 137 DO Hazardous Location External Termination Panel . . . . . . . . . . . . . . . . . . . . . . . . 142 Pulse Input Components . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 146 PI Module 3382S2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 148 PI Baseplate. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 151 PI Hazardous Location Baseplate . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 158 Solid-State Relay Output Components . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 165 SRO Module Schematic. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 165 SRO Baseplate . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 167 Interconnect Assemblies . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 170 I/O Extender Modules . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 171 I/O Bus Cables . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 172 I/O Bus Terminators . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 172 End Caps . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 173 MP Baseplate End Caps . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 173 I/O Baseplate and I/O Extender Module End Caps . . . . . . . . . . . . . . . . . . . . . . . . . 173 Covers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 174

Chapter 3

Installation and Maintenance

175

System Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 176 System Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 176 Determining Logic Power . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 177 General Cooling Guidelines . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 177 Determining Cooling Requirements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 177 Installation Guidelines . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 179 General Installation Guidelines . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 179 Plant Power and Grounding . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 179 Tri-GP Field, Power, and Ground Wiring . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 180 Application-Specific Installation Guidelines . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 182 Component Installation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 185 Mounting a Panel. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 185 Installing Baseplates on a Column . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 191 Connecting Columns with I/O Extender Modules . . . . . . . . . . . . . . . . . . . . . . . . . . 192 Installing Modules on Baseplates . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 195 Installing the Module Address Plug . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 196 Installing Other Components. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 197 Enclosing the Controller . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 197 Controller Grounding . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 198 Grounding Baseplates to Protective Earth . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 198 Grounding Logic Power . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 200 Grounding Field Power . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 201 Connecting Shields to Earth . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 202 Alarm Wiring . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 203


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Implementation and Maintenance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 204 Disabling Output Voter Diagnostics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 204 Checking Controller Power Sources . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 205 Enabling “Disabled” Output Voter Diagnostics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 205 Toggling Field I/O Points . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 206 Verifying Spare Modules . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 206 Module Replacement . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 207 Guidelines for Replacing Modules . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 207 Replacing a Main Processor Module . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 208 Replacing a Communication Module. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 209 Replacing an I/O Module . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 210

Chapter 4

Fault and Alarm Indicators

211

Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 212 Fault and Alarm Indicators . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 212 Main Processor Indicators . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 213 MP Status Indicators . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 214 MP System Mode Indicators . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 215 MP Alarm Indicators. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 216 MP Communication Indicators . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 217 Communication Module Indicators . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 218 CM Status Indicators. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 219 CM Communication Indicators. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 220 Analog Input Module Indicators . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 221 AI Status Indicators . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 222 AI Field Power Indicator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 223 Analog Input/Digital Input Module Indicators . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 224 AI/DI Status Indicators . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 225 AI/DI Field Power Indicator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 226 Analog Output Module Indicators . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 227 AO Status Indicators . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 228 AO Field Alarm Indicator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 229 Digital Input Module Indicators . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 230 DI Status Indicators . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 231 DI Field Power Indicator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 232 DI Point Indicators . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 232 Digital Output Module Indicators . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 233 Status Indicators on DO and SDO Modules . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 235 Power/Load Indicator on DO and SDO Modules . . . . . . . . . . . . . . . . . . . . . . . . . . . 236 Point Indicators on DO and SDO Modules . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 236 Load Indicators on SDO Modules. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 236 Pulse Input Module Indicators . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 237 PI Status Indicators . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 238 PI Field Fault Indicator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 239


Contents

vii

PI Point Indicators . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 239 Solid-State Relay Output Module Indicators . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 240 SRO Status Indicators . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 241 SRO Point Indicators . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 242

Appendix A Pin-Outs for Cables and Connectors

243

Ethernet Connectors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 244 10BaseT and 100BaseTX Ethernet Connectors. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 244 AUI 10 Megabit Ethernet MAU Connectors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 244 MII Ethernet MAU Connectors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 245 Serial Connectors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 247 RS–232 Pin-Outs. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 247 RS–485 Pin-Outs. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 248 Ethernet Cables . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 250 Cross-Over Cable . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 250 Straight-Through Cable . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 250 Serial Cables . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 251 RS-232 Serial Cable . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 251 RS-485 Serial Cables . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 251 Diagread Cables and Debug Connectors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 255 Diagread Cable. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 255 Debug Connector for MP and Left-Position CMs. . . . . . . . . . . . . . . . . . . . . . . . . . . . 255 Debug Connector for I/O and Right-Position CMs . . . . . . . . . . . . . . . . . . . . . . . . . . 255

Appendix B Non-Incendive Circuit Parameters

257

MP and CM Non-Incendive Circuit Parameters. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 258 Hazardous Location HART Baseplate Non-Incendive Circuit Parameters . . . . . . . . . . . 259

Appendix C HART Communication

261

Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 262 Triconex 4850 Hart Multiplexer. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 265 Installing the Triconex 4850 HART Multiplexer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 266 Triconex 4850 HART Multiplexer Indicators. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 267

Appendix D Warning Labels

269

General Hazard . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 269 Hazardous Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 270 Hot Surface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 270

Appendix E Recommended Parts for Replacement

271

Appendix F Panel Labels

273

Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 274 AI/DI Hazardous Location External Termination Panels . . . . . . . . . . . . . . . . . . . . . . . . . 275 RTD/TC/AI External Termination Panels . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 276 Planning and Installation Guide for Triconex General Purpose v2 Systems

viii

Contents

SSR Input External Termination Panels . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 277

Glossary

279

Index

287


Preface

This guide includes information on planning and installing a version 2.x Triconex® General Purpose System. Throughout the rest of this guide, the Triconex General Purpose System also may be referred to as the Tri-GP.

Summary of Sections •

Chapter 1, Introduction — Describes the theory of operation supporting the controller.

•

Chapter 2, System Description — Provides descriptions, illustrations, specifications, and simplified schematics for components of the controller.

•

Chapter 3, Installation and Maintenance — Provides guidelines for the person responsible for installing and maintaining a controller.

•

Chapter 4, Fault and Alarm Indicators — Provides information on responding to alarm conditions.

•

Appendix A, Pin-Outs for Cables and Connectors — Provides pin-out information for standard cables and adapters used with the controller.

•

Appendix B, Non-Incendive Circuit Parameters — Describes the parameters to be used for non-incendive communication circuits in the field.

•

Appendix C, HART Communication — Describes HART™ communication through Tri-GP systems.

•

Appendix D, Warning Labels — Provides a physical description of warning labels required for systems in which certain hazards may occur.

•

Appendix E, Recommended Parts for Replacement — Lists the parts recommended by Invensys to replace existing parts and to customize your system.

•

Appendix F, Panel Labels — Shows how to apply external termination panel (ETP) labels.

•

Glossary — Provides information for terms and topics used throughout the guide.


x

Preface

Related Documents •

Communication Guide for Triconex General Purpose v2 Systems

•

Product Release Notice for Triconex General Purpose v2.x Systems

•

Safety Considerations Guide for Triconex General Purpose v2 Systems

•

TriStation 1131 Developer’s Guide

•

TriStation 1131 Libraries Reference

Product and Training Information To obtain information about Invensys® products and in-house and on-site training, see the Invensys website or contact your regional customer center. Web Site http://www.iom.invensys.com

Technical Support Customers in the U.S. and Canada can obtain technical support from the Invensys Global Customer Support (GCS) center at the numbers below. International customers should contact their regional Invensys support office. Requests for support are prioritized as follows: •

Emergency requests are given the highest priority

•

Requests from participants in the System Watch Agreement (SWA) and customers with purchase order or charge card authorization are given next priority

•

All other requests are handled on a time-available basis

If you require emergency or immediate response and are not an SWA participant, you may incur a charge. Please have a purchase order or credit card available for billing. Telephone Toll-free number 866-746-6477, or Toll number 508-549-2424 (outside U.S.) Fax Toll number

508-549-4999

Web Site http://support.ips.invensys.com (registration required)


Preface

xi

We Welcome Your Comments To help us improve future versions of Invensys documentation, we want to know about any corrections, clarifications, or further information you would find useful. When you contact us, please include the following information: •

The title and version of the guide you are referring to

•

A brief description of the content you are referring to (for example, step-by-step instructions that are incorrect, information that requires clarification or more details, missing information that you would find helpful)

•

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•

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•

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Send e-mail to us at: [email protected] Please keep in mind that this e-mail address is only for documentation feedback. If you have a technical problem or question, please contact the Invensys Global Customer Support (GCS) center. See Technical Support on page x for contact information. Or, you can write to us at: Attn: Technical Publications - Triconex Invensys 26561 Rancho Parkway South Lake Forest, CA 92630 Thank you for your feedback.


xii

Preface


1 Introduction

Controller Features

2

Fault Tolerance

3

System Configuration

4

Theory of Operation

5

International Certifications and Qualifications

16


2

Chapter 1

Introduction

Controller Features The Tri-GP version 2.x controller is a state-of-the-art programmable logic and process controller that provides a high level of system fault tolerance. To ensure the highest possible system integrity at all times, the Tri-GP controller includes these features: •

Provides Triple Modular Redundant (TMR) architecture whereby each of three identical system channels independently executes the control program, and specialized hardware/software mechanisms “vote” all inputs and outputs.

•

Withstands harsh industrial environments.

•

Enables field installation and repair to be done at the module level while the controller remains online. Replacing an I/O module does not disturb field wiring.

•

Supports I/O modules (analog and digital) and an optional Communication Module that interfaces with Modbus masters and slaves, other Triconex controllers in Peer-toPeer networks, and external host applications on Ethernet networks.

•

Support for: — 25 I/O baseplates maximum — 416 AI points maximum (13 AI baseplates, 13 AI/DI baseplates, or any combination that does not exceed 416 total AI or AI/DI points) — 20 AO points maximum (5 baseplates) — 640 DI points maximum (20 DI baseplates, 13 AI/DI baseplates, or any combination that does not exceed 640 total DI points) — 320 DO points maximum (20 baseplates) — 30 PI points maximum (5 baseplates) — 640 SRO points maximum (20 baseplates)

•

Integrates the I/O module with the termination assembly.

•

Executes control programs developed and debugged with TriStation™ 1131 software. (For software compatibility, see the Product Release Notice for Tri-GP v2.x, available on the Invensys Global Customer Support (GCS) website.)

•

Allows normal maintenance while the Tri-GP controller is operating, without disturbing the controlled process.

•

Provides TriStation 1131 and Modbus communication from the Main Processor (MP) or from the Communication Module (CM).

•

Provides a dedicated co-processor which controls the input and output modules to reduce the workload of the MP. Each I/O module is supported by custom applicationspecific integrated circuits (ASICs), which scan inputs and perform diagnostics to detect hardware faults. Output module ASICs do the following: — Supply information for voting of output data. — Check I/O loop-back data from the output terminal for final validation of the output state. — Perform diagnostics to detect hardware and field-wiring problems.


Fault Tolerance

3

•

Provides integral online diagnostics with adaptive-repair capabilities.

•

Supports hot-spare I/O modules for critical applications where prompt service may not be possible.

•

Provides integral support for redundant field and logic power sources.

Fault Tolerance Fault tolerance, the most important capability of the Tri-GP controller, is the ability to detect transient and steady-state error conditions and take appropriate corrective action online. With fault tolerance, there is an increase in safety and an increase in the availability of the controller and the process being controlled. The Tri-GP controller provides fault tolerance through Triple Modular Redundant (TMR) architecture. The controller consists of three identical channels, except for the Power Modules which are dual-redundant. Each channel independently executes the control program (also referred to as the TriStation 1131 application) in parallel with the other two channels. Hardware voting mechanisms qualify and verify all digital inputs and outputs from the field; analog inputs are subject to a mid-value selection process. Because each channel is isolated from the others, no single-point failure in any channel can pass to another. If a hardware failure occurs in one channel, the faulty channel is overridden by the other channels. Repair consists of removing and replacing the failed module in the faulty channel while the controller is online and without process interruption. The controller then reconfigures itself to full TMR operation. Extensive diagnostics on each channel, module, and functional circuit immediately detect and report operational faults by means of indicators or alarms. All diagnostic fault information is accessible by the control program and the operator. If faults are detected, the operator can use the diagnostic information to modify control actions or direct maintenance procedures. Because the triplicated system operates as one control system, the Tri-GP controller can be programmed with one control program that terminates sensors and actuators at a single wiring terminal.


4

Chapter 1

Introduction

System Configuration Physically, a basic Tri-GP version 2 controller consists of Main Processors, I/O modules, an optional Communication Module, the baseplates on which the modules are mounted, field wiring connections, and a PC running the TriStation 1131 software. This section briefly describes these components. A typical Tri-GP system is configured into one or more vertical I/O columns guided by DIN rails and mounted on a sheet-metal panel. Tri-GP modules are field-replaceable units consisting of an electronic assembly housed in a metal spine. Each module has a protective cover that ensures no components or circuits are exposed even when a module is removed from the rail. Offset backplane connectors make it impossible to plug a module in upside down, and keys on each module prevent the insertion of modules into incorrect slots. The Tri-GP controller supports digital and analog input and output points, as well as pulse and thermocouple inputs and multiple communication protocols.

Controller Configuration A basic Tri-GP system consists of one MP assembly, an optional CM assembly, and I/O assemblies. Assemblies are configured into a system on a mounting plate using interconnect assemblies, extenders, I/O bus cables, and I/O bus terminators. I/O modules communicate with the MPs by means of a triplicated, RS-485, bi-directional communication bus, called the I/O bus. For more information, see System Specifications on page 176.

TriStation 1131 Software TriStation 1131 software is required to develop and download the control program that runs on the Tri-GP controller. TriStation 1131 software provides three programming languages which comply with the IEC 61131-3 standard: Function Block Diagram, Ladder Diagram, and Structured Text. An optional language, CEMPLE (Cause and Effect Matrix), can be purchased separately. For software compatibility, see the Product Release Notice for Tri-GP v2.x, available on the Invensys Global Customer Support (GCS) website.


Theory of Operation

5

Theory of Operation The Tri-GP controller is designed with a Triple Modular Redundant (TMR) architecture, which is a fully triplicated architecture throughout, from the input modules through the Main Processors, to the output modules. Each module houses the circuitry for three independent channels. Each channel on the input modules reads the process data and passes that information to its respective Main Processor. The three Main Processors communicate with each other using a proprietary high-speed bus system called the TriBus. Output Module

Input Module Hot Spare

Hot Spare

Channel A I/O Bus

Input Channel A

Output Channel A IOP A (IOX)

Channel B IO/ Bus

MP B (SX)

Input Channel C

Output Channel B

IOP B (IOX)

Field Output

Output Channel C

Channel C I/O Bus

MP C (SX)

Figure 1

Diagnostic Channel

Input Channel B

TriBus &TriTime

Field Input

Output Voter

MP A (SX)

IOP C (IOX)

Triplicated Architecture of the Tri-GP Controller

Once per scan, the Main Processors synchronize and communicate with their neighbors over the TriBus. The TriBus sends copies of all analog and digital input data to each Main Processor, then compares output data from each Main Processor. The Main Processors vote the input data, execute the control program, and send outputs generated by the control program to the output modules. The Tri-GP controller votes the output data on the output modules as close to the field as possible to detect and compensate for any errors that could occur between the TriBus voting and the final output driven to the field. Each I/O slot can contain two identical I/O modules which means if a fault is detected on one module, control is automatically switched to the healthy module. A faulty module can also be replaced online when only one module is installed in the slot. In this case, a healthy module is inserted in the spare slot and the control is switched to this module, which allows the faulty module to be pulled and sent for repair.


6

Chapter 1

Introduction

Main Processor Modules A Tri-GP controller contains three Main Processors. Each Main Processor controls a separate channel of the system and operates in parallel with the other Main Processors. A dedicated I/O Processor on each Main Processor manages the data exchanged between the Main Processor and the I/O modules. A triplicated I/O bus, located on the baseplates, extends from one column of I/O modules to another column of I/O modules by means of I/O bus cables. As each input module is polled, the appropriate channel of the I/O bus transmits new input data to the Main Processor. The input data is assembled into a table in the Main Processor and is stored in memory for use in the hardware voting process. The individual input table in each Main Processor is transferred to its neighboring Main Processors over the TriBus. During this transfer, hardware voting takes place. The TriBus uses a direct memory access programmable device to synchronize, transmit, vote and compare data among the three Main Processors. If a disagreement occurs, the signal value found in two out of three tables prevails, and the third table is corrected accordingly. One-time differences which result from sample timing variations are distinguished from a pattern of differing data. Each Main Processor maintains data about necessary corrections in local memory. Any disparity is flagged and used at the end of the scan by the controller’s fault analyzer routines to determine whether a fault exists on a particular module. Program Processor

I/O Processor Dual 24 V Power Inputs

Redundant Alarm Relays

Alarm 1 Alarm 2

System Alarm

Debug (RJ-12)

+3.3 V +5 V

Dual-Power Regulators

3.6 V Battery and Monitor

Program Alarm

Debug (RJ-12) I/O Bus

Modbus (DB-9) MPC860A

Reserved (DB-9) Ethernet Network (RJ-45)

Clock/NVRAM 8 KB

Shared Memory 128 K

36-Bit Bus

Flash 4/8 MB

Tribus (to other MPS)

Figure 2

TriBus FPGA

36-Bit Bus

DRAM 16 MB

Up Stream

Down Stream

Up Stream

Down Stream

Diagnostic Bus Channels (to other MPs)

MPC860A

Main Processor Architecture


DRAM 16 MB

Theory of Operation

7

The Main Processors send the corrected data to the control program. Each Main Processor executes the control program in parallel with the neighboring Main Processor. The control program generates a table of output values which are based on the table of input values according to customer-defined rules built into the control program. The I/O Processor on each Main Processor manages the transmission of output data to the output modules by means of the I/O bus. Using the table of output values, the I/O Processor generates smaller tables, each corresponding to an individual output module in the system. Each small table is transmitted to the appropriate channel of the corresponding output module over the I/O bus. For example, Main Processor A transmits the appropriate table to Channel A of each output module over I/O Bus A. The transmittal of output data has priority over the routine scanning of all I/O modules. The I/O Processor manages the data exchanged between the Main Processors and the Communication Module using the communication bus which supports a broadcast mechanism. Each Main Processor provides a 16-megabyte DRAM for the control program, sequence-ofevents (SOE) and I/O data, diagnostics, and communication buffers. The control program is stored in flash EPROM and loaded in DRAM for execution. The Main Processors receive power from redundant 24 VDC power sources. If an external power failure occurs, all critical retentive data is stored in NVRAM. A failure of one power source does not affect controller performance. If the controller loses power, the control program and all critical data are retained indefinitely.


8

Chapter 1

Introduction

Bus Systems and Power Distribution This figure depicts the three triplicated I/O bus systems which are carried baseplate-tobaseplate using Interconnect Assemblies, I/O Extender Modules, and I/O bus cables. The redundant logic power distribution system is carried using Interconnect Assemblies and I/O Extender Modules. Power Supply #1

Power Supply #2

~~~

I/O Bus Channel A Channel B Channel C

EM CM

I/O Communication Bus Interconnect Assembly

I/O Bus

I/O

I/O Bus MP I/O

I/O Power Bus

Power Bus

EM

Figure 3

EM

Tri-GP Bus Systems and Power Distribution

TriBus Operation The TriBus, which is local to the MP Baseplate, consists of three independent serial links operating at 25 megabits per second. The TriBus synchronizes the Main Processors at the beginning of a scan, and performs either of these functions: •

Transfers I/O, diagnostic, and communication data.

•

Compares data and identifies disagreements with the output data and program memory from the previous scan.

An important feature of Tri-GP controller architecture is the use of a single transmitter to send data to both the upstream and downstream Main Processors which ensures the same data is received by the upstream processor and downstream processor.


Theory of Operation

9

I/O Bus Operation Field signal distribution is local to each I/O baseplate. Each I/O module transfers signals to or from the field through its associated baseplate assembly. Two positions on the baseplate tie together as one logical slot. Each field connection on the baseplate extends to both positions, which means that both the active module and the hot-spare module receive the same information from the field termination wiring. The triplicated I/O bus transfers data between the I/O modules and the Main Processors at 2 megabits per second. The I/O bus is contained within an I/O column and can be extended to another I/O column by using a set of three I/O bus cables (one for each TMR channel.)

Communication Bus Operation The communication bus runs between the Main Processors and the Communication Modules at 2 megabits per second.

Power Distribution Power for the modules on each DIN rail is distributed using two independent power rails. Each module along the DIN rail draws power from both power rails through dual power regulators. There are four sets of power regulators on each input and output board: one set for each channel (A, B, and C) and one set for the status indicators.


10

Chapter 1

Introduction

Logic Power

+24V #1 +24V #2 RTN

Each module is designed to operate directly from redundant 24 VDC power sources. Logic power is carried baseplate-to-baseplate, allowing a single logic power connection per column. The power conditioning circuitry is protected against over-voltage, over-temperature, and overload conditions. Integral diagnostic circuitry checks for out-of-range voltages and overtemperature conditions. A short on a channel disables the power regulator rather than affecting the power sources.

~

+6.5V +6.5V

Typical I/O Module Leg A REG

Vcc

Vcc Isolated DC – DC Converter

DC – DC Converter REG

Leg B REG

Vcc


DC – DC Converter REG

Logic (System) Functional Earth

REG

Vcc


Field Functional Earth

~

~~

~~~ Power Bus

~ ~


Leg C REG

~~


Isolation Barrier

Figure 4

Logic Power Distribution

Controller Communication The controller can communicate directly with a PC running TriStation 1131 software and other devices through the Main Processor and the Communication Module.

Main Processor Modules Each MP can provide direct TriStation 1131 and Modbus communication, including: •

One TriStation 1131 (Ethernet) port for downloading an application to the controller and uploading diagnostic information.

•

One Modbus RS-232/RS-485 serial port which acts as a slave to an external host computer. Typically, a distributed control system (DCS) monitors—and optionally updates—the controller data directly though an MP.


Theory of Operation

11

Communication Module The Communication Module (CM) provides an optional, three-to-one interface to the Main Processors that supports serial and Ethernet communication protocols. A single controller supports up to two CMs on one CM Baseplate with each CM operating independently. Two CMs can provide redundant communication connections or independent communication ports. Each CM provides three RS-232/485 serial ports and two Ethernet ports. These ports support a variety of communication protocols and physical media types that enable the controller to communicate with external host computers, distributed control systems, open networks, network printers, and other Tri-GP, Trident™, and Tricon™ v9–v10 controllers. For CM specifications, see Chapter 2, System Description. For details about communication protocols, see the Communication Guide for Triconex General Purpose v2 Systems.

Physical Communication Interfaces This table lists the physical communication interfaces included with the MP and CM. Interfaces

MP

CM

RS-232/RS-485 Modbus Serial Port





10BaseT Ethernet Port





10BaseT/100BaseTX Auto-negotiable Ethernet Port



Attachment unit interface (AUI) for media access unit (MAU)



Media independent interface (MII) for MAU



Debug port





Communication Protocols This table lists the protocols supported by serial and network ports on the MP and CM. Protocols

Port Type

MP

CM

Modbus Slave (ASCII or RTU)

Serial





Modbus Master (RTU)

Serial



Modbus Master or Slave (TCP)

Network



TriStation 1131

Network





TCP/IP

Network





Triconex System Access Application (TSAA) (UDP/IP)

Network



Triconex System Access Application (TSAA) with IP Multicast (UDP/IP)

Network



Triconex Time Synchronization via DLC

Network



Triconex Time Synchronization via UDP/IP or SNTP

Network




12

Chapter 1

Introduction

Protocols

Port Type

MP

CM

Triconex Peer-to-Peer via UDP/IP

Network



Triconex Peer-to-Peer via DLC

Networka



Hewlett-Packard JetDirect® Network Printer Server Data Link Control (DLC)/Logical Link Control (LLC)

Network



a. NET 1 only

System Diagnostics and Status Indicators The Tri-GP controller incorporates online diagnostics and specialized fault monitoring circuitry which are able to detect and alarm all single-fault and most multiple-fault conditions. The circuitry includes—but is not limited to—I/O loop-back, watch-dog timers, and loss-of-power sensors. Using the alarm information, the response of the system can be customized to the specific fault sequence and operating priorities of the application. Each module can activate the system integrity alarm, which consists of normally closed (NC) relay contacts on each MP. Any failure condition, including loss or brownout of system power, activates the alarm to summon plant maintenance personnel. Each controller module can activate the system integrity alarm. The alarm consists of a normally closed or normally opened (NC or NO) relay contact on each Power Module. Any failure condition, including loss or brownout of system power, activates the alarm to summon plant maintenance personnel. The front panel of each module provides LED (light-emitting-diode) indicators that show the status of the module or the external systems to which it is connected. Pass, Fault, and Active are common indicators. Other indicators are specific to each module.

Figure 5

Front Panel Indicators

Maintenance consists of replacing plug-in modules. A lighted Fault indicator shows that the module has detected a fault and must be replaced. The control circuitry for the indicators is redundant and is isolated from each of the three channels. All internal diagnostic and alarm status data is available for remote logging and report generation. This reporting can be done through a local or remote PC running TriStation 1131 software, or through a host computer. For more information, see the TriStation 1131 Developer’s Guide.


Theory of Operation

13

Analog Input Module For Analog Input Modules, each of the three channels asynchronously measures the input signals and places the results into a table of values. Each of the three input tables is passed to its associated Main Processor using the I/O bus. The input table in each Main Processor is transferred to its neighbors across the TriBus. The middle value is selected by each Main Processor and the input table in each Main Processor is corrected accordingly. In TMR mode, the mid-value data is used by the control program; in DUAL mode, the average is used. AI Modules continuously execute Forced Value Diagnostics (FVD) which is a self-test diagnostic that detects and signals an alarm for all stuck-at and accuracy fault conditions typically in less than 500 milliseconds. This safety feature allows unrestricted operation under a variety of multiple-fault scenarios. Each AI Module is guaranteed to remain in calibration for the life of the controller. Periodic manual calibration is not required. For specifications, see Analog Input Components on page 49.

Analog Input/Digital Input Module The Analog Input/Digital Input Module has 16 digital input points (points 1–16) and 16 analog input points (points 17–32). The AI/DI Module has three isolated sets of electronics, called channels, which independently process field data input to the module. Sensing of each input point is performed in a manner that prevents a single failure on one channel from affecting another channel. For analog input points, each channel receives variable voltage signals from each point, converts them to digital values, and transmits the values to the three MPs on demand. For digital input points, an ASIC on each channel scans each input point, compiles data, and transmits it to the MPs on demand. For all points, the MPs vote the data before passing it to the control program. In TMR mode, the data passed is mid-value. In DUAL mode, the data passed is the average. AI/DI Modules sustain complete, ongoing diagnostics for each channel. If the diagnostics detect a failure on any channel, the Fault indicator turns on and activates the system alarm. The Fault indicator identifies a channel fault, not a complete module failure. AI/DI Modules are guaranteed to operate properly in the presence of a single fault and may continue to operate properly with multiple faults. AI/DI Modules include the hot-spare feature which allows online replacement of a faulty module. The AI/DI Module is mechanically keyed to prevent improper installation in a configured baseplate. For specifications, see Analog Input/Digital Input Components on page 72.


14

Chapter 1

Introduction

Analog Output Modules For Analog Output Modules, each of the three channels includes a proprietary ASIC that receives its output table from the I/O communication processor on its corresponding Main Processor. AO Modules use special shunt circuitry to vote on the individual output signals before they are applied to the load. Voter circuitry ensures only one output channel (A, B, or C) is driving the field load. The shunt output circuitry provides multiple redundancy for all critical signal paths, guaranteeing safety and maximum availability. AO Modules continuously execute Forced Switch Diagnostics (FSD) on each point. By carefully forcing error conditions and observing proper behavior of the voting circuitry, high reliability and safe operation is ensured. This safety feature allows unrestricted operation under a variety of multiple-fault scenarios. Each AO Module is guaranteed to remain in calibration for the life of the controller. Periodic manual calibration is not required. For specifications, see Analog Output Components on page 82.

Digital Input Module For Digital Input Modules, each of the three channels reside on the same module, however, the circuitry is completely isolated from each other and operates independently. This isolation means a fault on one channel cannot pass to another. In addition, each channel contains a proprietary ASIC which manages communication with its corresponding Main Processor, and supports run-time diagnostics. Each of the three input channels asynchronously measures the input signals from each point on the baseplate, determines the respective states of the input signals, and places the values into separate input tables A, B and C respectively. Each input table is regularly interrogated over the I/O bus by the I/O Communication Processor located on the corresponding Main Processor. For example, Main Processor A interrogates Input Table A over I/O Bus A. DI Modules continuously execute Forced Value Diagnostics (FVD) which is a self-test diagnostic that detects and signals an alarm for all stuck-at fault conditions typically in less than 500 milliseconds. This safety feature allows unrestricted operation under a variety of multiplefault scenarios. DI Module diagnostics are specifically designed to monitor devices which hold points in one state for long periods of time. The diagnostics ensure complete fault coverage of each input circuit even if the actual state of the input points never changes. For specifications, see Digital Input Components on page 101.

Digital Output Module For Digital Output Modules, each of the three channels includes a proprietary ASIC which receives its output table from the I/O communication processor on its corresponding Main Processor. All DO Modules use the patented Quad Voter circuitry, which is a quadruplicated output circuitry which votes on the individual output signals just before they are applied to the load. This voter circuitry is based on parallel-series paths which pass power if the drivers for


Theory of Operation

15

Channels A and B, or Channels B and C, or Channels A and C command them to close—in other words, 2-out-of-3 drivers voted On. The quadruplicated output circuitry provides multiple redundancy for all critical signal paths, guaranteeing safety and maximum availability. During Output Voter Diagnostics (OVD) execution, the commanded state of each point is momentarily reversed on one of the output drivers, one after another. Loop-back circuitry on the module allows each ASIC to read the output value for the point to determine whether a latent fault exists within the output circuit. The output signal transition is guaranteed to be less than 2 milliseconds (500 microseconds is typical) and is transparent to most field devices. For devices that cannot tolerate a signal transition of any length, OVD can be disabled on a per-point basis. DO Module diagnostics are specifically designed to monitor outputs which remain in one state for long periods of time. The OVD diagnostics ensure complete fault coverage of each output circuit even if the actual state of the output points never changes.

Supervised Digital Output Modules Supervised Digital Output Modules provide both voltage and current loopback, allowing complete fault coverage for both energized-to-trip and de-energized-to-trip conditions. In addition, a Supervised Digital Output Module verifies the presence of the field load by doing continuous circuit-continuity checks. Any loss of field load causes an open-load field error and the load indicator to illuminate.

Pulse Input Module For Pulse Input Modules, each of the three channels independently receives pulse input voltages from each point and converts the values to frequency (RPM) data. Special algorithms, optimized for accurately measuring the speed of rotating machinery, are used to compensate for the irregularly spaced teeth on timing gear or for periodic acceleration or de-acceleration. The results are placed into a table of values. Each input table is passed to its associated Main Processor using the corresponding I/O bus. The input table in each MP is transferred to its neighbors across the TriBus. The middle value is selected by each MP and the input table in each MP is corrected accordingly. In TMR mode, the mid-value is used by the control program; in DUAL mode, the average is used. Special self-test circuitry is provided to diagnose the health state of all input points, even when an active signal is not present. Each Pulse Input Module is guaranteed to remain in calibration for the life of the controller. Periodic manual calibration is not required. For specifications, see Pulse Input Components on page 146.

Solid-State Relay Output Module For Solid-State Relay Output Modules, output signals are received from the Main Processors on each of three channels. The three sets of signals are voted and the voted data is used to drive the 32 individual relays. Each output has a loop-back circuit which verifies the operation of each relay switch independently of the presence of a load. Ongoing diagnostics test the operational status of the SRO Module.


16

Chapter 1

Introduction

The SRO Module is a non-triplicated module for use on non-critical points which are not compatible with high-side, solid-state output switches; for example, interfacing with annunciator panels. For specifications, see Solid-State Relay Output Components on page 165.

International Certifications and Qualifications The Tri-GP controller has been certified as complying with multiple internationally recognized standards by the following internationally recognized certification agencies, these certifications have qualified the Tri-GP for use around the world in safety critical applications. Test reports from the various certification agencies are available upon request. Topics include: •

Canadian Standards Association on page 16

•

Factory Mutual on page 17

•

TÜV Rheinland on page 18

•

European Union CE Mark on page 20

Canadian Standards Association CSA has certified that the Tri-GP v2.x controller is in full compliance with the following internationally recognized electrical safety standards and is qualified for general use in North American and other jurisdictions requiring compliance with these standards. Standard Number

Title

CAN/CSA-C22.2 No.0-M91

General Requirements-Canadian Electrical Code, Part II

CSA Std C22.2 No.0.4-M1982

Bonding and Grounding of Electrical Equipment (Protective Grounding)

CAN/CSA C22.2 No 1010.1-92

Safety Requirements for Electrical Equipment for Measurement, Control, and Laboratory Use, Part 1: General Requirements

UL 3121-1 1998-07-14

Electrical Equipment for Laboratory Use, Part 1: General Requirements



17

Factory Mutual FM has certified that the Tri-GP v2.x controller is in full compliance with the following internationally recognized standards and is qualified for use in Class I, Division 2 Temperature T4, Groups A, B, C, and D hazardous indoor locations. In North America, the field signals used with ATEX-compliant external termination panels are certified for Class I, Division 2, Groups C and D. Standard Number

Title

3611

Electrical Equipment for use in Class I-Division 2; Class II-Division 2; and Class III-Divisions 1 and 2, Hazardous Locations

3810

Electrical and Electronic Test, Measuring and Process Control Equipment

3600

Electrical Equipment for Use in Hazardous (Classified) Locations-General Requirements

Note

For hazardous location applications, redundant power sources should be used for system power. Also, any signal going to or through a hazardous atmosphere must use hazardous location protection, such as an IS Barrier.


18

Chapter 1

Introduction

TÜV Rheinland TÜV has certified that the Tri-GP v2.x is in full compliance with the internationally recognized standards listed below, and thus is qualified for use in the following applications and jurisdictions. •

Emergency safety shut-down or other critical control applications requiring SIL 1-2 certification per the functional safety requirements of IEC 61508.

•

Emergency safety shut-down or other critical control applications in the process sector requiring SIL 1–2 certification per the functional safety requirements of IEC 61511.

•

Burner management applications requiring certification per the requirements of EN 50156-1:2004

•

Burner management applications requiring certification per the requirements of NFPA 85:2007

•

Fire detection and fire alarm applications requiring certification per the requirements of EN 54-2:1997/A1:2006a

Standard Number

Title

IEC 61508, Parts 1-7, 2000

Functional safety of electrical/electronic/programmable electronic safety-related systems

IEC 61511:2004

Functional safety - Safety instrumented systems for the process industry sector

IEC 61131-2:2007

Programmable Controllers Part 2: Equipment Requirements and Test. Overvoltage Category II is assumed.

IEC 61326-3-1:2008

Electrical equipment for measurement, control and laboratory use EMC requirements - Part 3-1: Immunity requirements for safetyrelated systems and for equipment intended to perform safety-related functions (functional safety) - General industrial applications

ANSI/ISA-84.00.01-2004 (IEC 61511-1 Mod)

Functional Safety: Safety Instrumented Systems for the Process Industry Sector - Part 1: Framework, Definitions, System, Hardware and Software Requirements

EN 50156-1:2004

Electrical equipment for furnaces and ancillary equipment. Requirements for application design and installation

EN 50178:1998

Electronic equipment for use in power installations

EN 54-2:1997/A1:2006a

Fire detection and fire alarm systems. Control and indicating equipment.

NFPA 72:2007

National Fire Alarm Code

NFPA 85:2007

Boiler and Combustion Systems Hazards Code, 2007 Edition

a. To comply with the requirements of EN 54-2:1997/A1:2006, the Tri-GP system must be installed in a metal enclosure with a sealed bottom and a closed door, connected to Safety Ground, as described in Enclosing the Controller on page 197, and it must be installed in an area with an access level greater than 2.



Note

19

To comply with standards related to conducted disturbance, a Schaffner® FN 2410 line filter, or equivalent, must be installed between power supplies and baseplates.

For semiconductor manufacturing applications, compliance with these additional installation guidelines is highly recommended: •

Field and logic power supplies should be approved for use in safety extra-low-voltage (SELV) circuits according to the requirements of IEC 61010-1.

•

For installations with voltages greater than 30 Vrms/36 VDC, the controller and associated equipment must be installed in a locked cabinet restricting access to trained personnel only, with a hazardous-voltage warning label attached prominently.

•

For installations with ambient temperatures exceeding 94° F (35° C), the controller and associated equipment should be installed in a locked cabinet restricting access to trained personnel only, with a hot-surface warning label attached prominently.

•

For applications in which continuous, correct system operation must be assured, the controller and associated equipment should be installed in a locked cabinet restricting access to trained personnel only, with a general-hazard warning label attached prominently.

For a physical description of labels, see Appendix D, Warning Labels.


20

Chapter 1

Introduction

European Union CE Mark Based upon the independent TÜV evaluation and test results, Invensys has certified the Tri-GP v2.x controller suitable to use in the European Union and all other jurisdictions requiring compliance with the European Union EMC Directive No. 2004/108/EC and Low Voltage Equipment Directive No. 2006/95/EC. See the EC Declaration of Conformity for details. To ensure maximum reliability and trouble-free operation, the Tri-GP and associated wiring must be installed per the guidelines outlined in this manual. To comply with the CE Mark requirement for emissions and radiated susceptibility, and EU directives, these guidelines must be followed: •

The entire Tri-GP system must be mounted in a metal enclosure with the door closed.

•

Field power supplies must be approved for use in safety extra-low-voltage (SELV) circuits according to the requirements of IEC 61010-1.

EC Declaration of Conformity The following declaration of conformity with the European Union directives for electromagnetic compatibility and low-voltage equipment is provided as a convenience. The declaration is the latest available at publication time and may have been superseded. For updates, contact the Invensys Global Customer Support (GCS) center.



21

Invensys Operations Management, a business group of Invensys plc 26561 Rancho Parkway South Lake Forest, CA 92630 USA EC Declaration of Conformity EU Directives Covered by this Declaration

2004/108/EC Electromagnetic Compatibility Directive

2006/95/EC Low Voltage Equipment Directive

Products Covered by this Declaration Triconex General Purpose System (Triple Modular Redundant Controller) Version 2.x2101S2, 2201S2, 2301S2, 2302S2, 2302AS2, 2342S2, 2351S2, 2352S2, 2352AS2, 2361S2, 2381S2, 2381AS2, 2401S2, 2401LS2, 2402S2, 2402AS2, 2451S2, 2480AS2, 2481S2, 3101S2, 3201S2, 3301S2, 3311S2, 3351S2, 3361S2, 3381S2, 3382S2, 3401S2, 3411S2, 3451S2, 3481S2, 3482S2, 9764-510F, interconnect assemblies, extender modules, I/O bus cabling, and termination products

Basis on which Conformity is being Declared The product identified above complies with the requirements of the above EU Directives by meeting these standards. 1.

EN 61000-6-4:2007 EN 55011:2007 Gr. 1 Kl. A IEC 61131-2:2007 IEC 61000--6-4:2007 IEC 61131-2:2007

EMC - Emissions Conducted and radiated Radiated interference (class A) Radiated interference (class A) Conducted interference (class A)

2.

EN 61131-2:2007 IEC 61131-2:2007 - 9.5 IEC 61326-3-2:2008 EN 50130-4:2003 EN 61000-4-2:2008 EN 61000-4-3:2006 + A1:2008 + IS1:2009 IEC 61131-2:2007 - 9.8 IEC 61326-3-1:2008 IEC 61326-3-2:2008 EN 50130-4:2003 EN 61000-4-4:2004 IEC 61131-2:2007 - 9.9 IEC 61326-3-2:2008 EN 50130-4:2003 EN 61000-4-5:2006 IEC 61131-2:2007 EN 61000-4-12:2006 IEC 61326-3-1:2008 - Table 1 b-e EN 61000-4-16:1998 + A1:2004

EMC - Immunity Electrostatic discharge Electrostatic discharge Electrostatic discharge Electrostatic discharge Radiated HF fields Fast transient bursts Fast transient bursts Fast transient bursts Fast transient bursts Fast transient bursts High-energy surges High-energy surges High-energy surges High-energy surges Damped oscillatory wave (Ringwave) Damped oscillatory wave (Ringwave) Conducted common mode voltage Conducted common mode voltage

3.

EN 61131-2:2007 EN 61010-1:2007

Product Safety Overvoltage Category II

The technical documentation required to demonstrate that the product meets the requirements of the above directives has been compiled by the signatory below and is available for inspection by the relevant enforcement authorities. The CE mark was first applied in: 2010.

Special Measures and Limitations which Must be Observed The product must be installed and operated as described in the Planning and Installation Guide for Triconex General Purpose v2 Systems. Signed:

Gary Hufton, Director, Control H/W Development Invensys Operations Management 14 September 2010


22

Chapter 1

Introduction


2 System Description

Overview

24

Main Processor Components

35

Communication Components

43

I/O Modules Common Specifications

47

Analog Input Components

49

Analog Input/Digital Input Components

72

Analog Output Components

82

Digital Input Components 101 Digital Output Components 119 Pulse Input Components 146 Solid-State Relay Output Components 165 Interconnect Assemblies 170 I/O Extender Modules 171 End Caps 173 Covers 174


24

Chapter 2

System Description

Overview This chapter describes the hardware components available for Tri-GP v2.x systems. Physically, a Tri-GP system consists of field-replaceable modules, the baseplates upon which modules are mounted, field wiring connections, and a PC used to run the TriStation 1131 software. This section briefly describes these major elements and provides general specifications. A basic Tri-GP system consists of one MP assembly, an optional CM assembly, and I/O assemblies. Assemblies consist of a one or two modules on a baseplate. Assemblies are installed on a mounting plate using interconnect assemblies, extenders, I/O bus cables, and I/O bus terminators. I/O modules communicate with the MPs by means of a triplicated, RS-485, bidirectional communication bus, called the I/O bus. The I/O bus cable can be used to join I/O columns. Each module is fully enclosed to ensure that no components or circuits are exposed—even when a module is removed from the baseplate. Offset baseplate connectors make it impossible to plug a module in upside down, and keys on each module prevent the insertion of modules into incorrect slots. Topics include: •

General Environmental and EMC Specifications on page 24

•

Typical Weight of Components on page 25

•

Cable Flame Test Ratings on page 26

•

Ground Systems on page 26

•

Standard Tri-GP Products on page 28

General Environmental and EMC Specifications The Tri-GP fully meets the requirements of IEC 61131, Part2: Programmable Controllers, Equipment requirements and tests, for environmental withstand and immunity, and electromagnetic compatibility. This table outlines the general environmental and EMC specifications for the Tri-GP controller. For details, see IEC 61131. Specifications

Parameters

Operating temperature

–4° F to +158° F (–20° C to +70° C) ambient (which is the air temperature measured at the bottom of each baseplate), per IEC 60068-2-14, tests Na and Nb

Storage temperature

–40° F to +185° F (–40° C to +85° C) per IEC 60068-2-2, test Bb, IEC 60068-2-1, test Ab, and IEC 60068-2-30, test Db

Relative humidity

5% to 95%, non-condensing

Corrosive environment

Class G3 Level as defined in ISA Standard S71.04, based on exposure testing according to EIA Standard 364-65A, Class III


Overview

Specifications

Parameters

Sinusoidal vibrations per axis

1.75 mm displacement @ 5 to 8.4 Hz (continuous)

25

0.5 g acceleration @ 8.4 to 150 Hz (continuous) 3.5 mm displacement @ 5 to 8.4 Hz (occasional) 1.0 g acceleration @ 8.4 to 150 Hz (occasional) All tests per IEC 60068-2-6, test Fc Shock

15 g, 11 ms, half-sine, 3 axis, per IEC 60068-2-27, test Ea

Electrostatic discharge

IEC 61000-4-2, 4 kV contact, 8 kV air

Conducted susceptibility

IEC 61000-4-4, Fast Transient/Burst, 2 kV power & unshielded AC I/O, 1 kV signal and communication lines IEC 61000-4-5, Surge Withstand, 2 kV CM2/1 kV DM2 AC power and I/O, 1 kV CM2 I/O, shielded and communication, 0.5 kV CM2/0.5 kV DM2 DC power IEC 61000-4-6, RFI, 0.15-80 MHz, 10 V IEC 61000-4-18, Damped Oscillatory Wave, 0.5 kV CM shielded, 2.5 kV CM/1 kV DM unshielded AC I/O & power, 1 kV CM/0.5 kV DM I/O

Radiated susceptibility

IEC 61000-4-3, Radio Frequency Electromagnetic Fields, 80–1000 MHz: 10 V/m, 1.4–2.0 GHz: 3 V/m, 2.0–2.7 GHz: 1 V/m

Conducted emissions

CISPR 11, Group 1, Class A: 0.15–0.5 MHz: 79 dB(µV) quazi-peak/66 dB(µV) average 0.5–30 MHz: 73 dB(µV)quazi-peak/60 dB(µV) average when installed following the guidelines in this manual.

Radiated emissions

CISPR 11, Class A: 30–230 MHz: 40 dB(µV/m) @ 10 m 230–1000 MHz: 47 dB(µV/m) @ 10 m when installed following the guidelines in this manual.

Power interruptions

IEC 61000-4-29, 1 ms battery, 10 ms DC power supply

Typical Weight of Components This table lists the typical weight of components. The baseplate weight is based on baseplate only, not including modules. Component

Weight in Pounds

Weight in Kilograms

Analog Input Module

3.0

1.4

Analog Input Baseplate

2.4

1.1

Analog Output Module

3.1

1.4

Analog Output Baseplate

2.1

1.0

Communication Module

3.3

1.5


26

Chapter 2

System Description

Component

Weight in Pounds

Weight in Kilograms

Communication Baseplate

2.8

1.3

Digital Input Baseplate

2.4

1.1

Digital Input Module

3.0

1.3

Digital Output Baseplate

2.1

1.0

Digital Output Module

3.2

1.4

Main Processor Baseplate

2.7

1.2

Main Processor Module

3.4

1.5

Pulse Input Module

3.0

1.4

Pulse Input Baseplate

2.8

1.3

Relay Output Baseplate

2.3

1.0

Solid-State Relay Output Module

2.9

1.3

I/O Extender Module

0.4

0.2

Cable Flame Test Ratings You can order standard Triconex interface cables and I/O bus cables that meet flame test ratings as described in this table. Cable

Rating

Interface cables

FT4 Vertical Flame Test-Cables in Cable Trays per C.S.A. C22.2 No. 0.3-92 Para 4.11.4a

(connect external termination panels to baseplates) I/O bus cables (connect columns of baseplates)

FT6 Horizontal Flame & Smoke Test-per C.S.A. C22.2 No. 0.3-92 Appendix Bb

a. Cables will be marked with FT4 or CMG rating, but they all actually meet the more stringent FT4 rating. b. Cables will be marked with FT6 or CMP rating, but they all actually meet the more stringent FT6 rating.

Ground Systems The Tri-GP has the following four, separate ground systems: •

Protective earth

—an AC safety ground

•

Field ground

F—a functional earth –

•

Logic ground

L—a functional earth

•

Shield ground

S—a functional earth


Overview

27

The logic and field portions of each module use separate, isolated signal return paths. Each is connected to its own functional earth. The metallic portions of the safety ground act as an electrostatic shield for the internal circuitry. Communication cable shields are terminated to the safety ground. The metallic portions of the Tri-GP controller are connected to the protective earth. For installation procedures, see: •

Grounding Baseplates to Protective Earth on page 198

•

Grounding Logic Power on page 200

•

Connecting Shields to Earth on page 202


28

Chapter 2

System Description

Standard Tri-GP Products The following table lists all of the standard Tri-GP products. Table 1

Standard Tri-GP Products

Model

Product Name

Qty

Description

Consists of

5101S2

Main Processor TriPak

3

Main Processor Module

3101S2

1

Main Processor Baseplate Kit

2101S2

1


3201S2

1

Communication Module Baseplate Kit

2201S2

1

Analog Input Module

3351S2

1

Analog Input Baseplate Kit

2351S2

Analog Input/Digital Input TriPak

1

Analog Input/Digital Input Module

3361S2

1

Analog Input/Digital Input Baseplate Kit

2361S2

Analog Input Tripak, RTD/TC/4-20 mA

1

Analog Input Module

3351S2

1

Analog Input Baseplate, RTD/TC/4-20 mA

2352S2

Analog Input TriPak, HART

1

Analog Input Module

3351S2

1

Analog Input Baseplate Kit, HART,

2354S2

1

Triconex 4850 HART Multiplexer

1600106-001

1

Analog Input Module

3351S2

1

Analog Input Baseplate Kit, HART, Hazardous Location

2354AS2

1


1600106-001

5201S2 5351S2 5361S2 5352S2 5354S2

5354AS2

5481-1S2 5482-1S2 5301S2 5311S2 5312S2 5302S2 5401S2 5401LS2 5411HS2

Communication Module TriPak Analog Input TriPak

Analog Input TriPak, HART, Hazardous Location

Analog Output TriPak

1


3481S2

1

AO Module Baseplate Kit

2481S2

Analog Output Tripak, HighCurrent

1

High-Current Analog Output Module

3482S2

1

AO Module Baseplate Kit

2481S2

Digital Input TriPak

1


3301S2

1

Digital Input Baseplate Kit

2301S2

Digital Input TriPak, High Resolution

1

Digital Input Module, High Resolution

3311S2

1


2301S2

Digital Input TriPak, High Resolution, High Voltage

1


3311S2

1

Digital Input Baseplate Kit, High Voltage

2302S2

Digital Input TriPak, High Voltage

1


3301S2

1


2302S2

Digital Output TriPak

1


3401S2

1

Digital Output Baseplate Kit

2401S2

Digital Output TriPak, Low Current

1


3401S2

1

Digital Output Baseplate Kit, Low Current

2401LS2

Digital Output TriPak, Supervised, High Current

1

Digital Output Module, Supervised

3411S2

1

Digital Output Baseplate Kit, High Current

2401HS2


Overview

Table 1

29

Standard Tri-GP Products (continued)

Model

Product Name

Qty

Description

Consists of

5402S2

Digital Output TriPak, High Voltage

1


3401S2

1

Digital Output Baseplate Kit, High Voltage

2402S2

5451S2 5382-1S2 5382AS2 5483S2

5483AS2

2101S2

2281

2291

2292

2301S2

Solid-State Relay Output TriPak Pulse Input TriPak, Enhanced Pulse Input TriPak, Enhanced, Hazardous Location Analog Output TriPak, HART

Analog Output TriPak, HART, Hazardous Location

Main Processor Baseplate Kit

I/O Bus Extender Module Kit

I/O Bus Termination Kit, I/O Baseplate

I/O Bus Termination Kit, MP Baseplate


1


3451S2

1

Solid-State Relay Output Baseplate Kit

2451S2

1

Pulse Input Module, Enhanced

3382S2

1

Pulse Input Baseplate Kit

2381S2

1


3382S2

1

Pulse Input Baseplate Kit, Hazardous Location

2381AS2

1


3481S2

1

Analog Output Baseplate Kit, HART

2483S2

1


1600106-001

1


3481S2

1

Analog Output Baseplate Kit, HART, Hazardous Location

2483AS2

1


1600106-001

1

MP Baseplate

3000671-110

1

MP Interconnect Assembly

2920

1

Triconex General Purpose Systems User Documentation (hardcopy)

8910-6S2

1

Accessories Kit

8401

1

Top End Cap – I/O

2910

1

Top End Cap – MP

2912

1

Bottom End Cap – I/O

2911

1

Bottom End Cap – MP

2913

2

I/O Extender Module

3000678-100

3

2-ft. I/O Bus Cables

4000212-002

1

I/O Interconnect Assembly

2921

1

Top End Cap – I/O

2910

1

Bottom End Cap – I/O

2911

1

I/O Extender Module

3000678-100

1


2921

1

I/O Bus Terminator Kit (Set of 3)

3900064-003

1

I/O Extender Module

3000678-100

1


2920

1

I/O Bus Terminator Kit (Set of 3)

3900064-003

1

I/O Baseplate

3000673-030

1


2921

1

Slot Cover

2900

1

Terminal Cover

2901


30

Chapter 2

Table 1

System Description


Model

Product Name

Qty

Description

Consists of

2302S2


1

I/O External Termination Baseplate

3000721-310

2

External Termination Panel (Solid State Relay Input)

3000762-110

1


2921

1

Slot Cover

2900

2

Interface Cable, 10 ft

9105-310F

SSR Input Modules for use with SSR Input ETP 100 to 240 VAC (ordered separately) 2302AS2

2342S2

2342AS2

2351S2

2352S2

2352AS2

2354S2

2354AS2

1300447-001

1


3000989-315

1

External Termination Panel Kit

9573-610F

1


2921

1

Slot Cover

2900

1

Terminal Cover

2901

Analog Input/Digital Input Baseplate Kit, External Termination

1


3000721-140

1


2921

1

Slot Cover

2900

Analog Input/Digital Input Baseplate Kit, Hazardous Location

1


3000989-145

1


2921

1

Slot Cover

2900

1

AI/DI ETP Kit, Hazardous Location

9793-610F

Digital Input Baseplate Kit, Hazardous Location

1

I/O Baseplate

3000675-030

1


2921

1

Slot Cover

2900

1

Terminal Cover

2901

Analog Input Baseplate Kit for TC, RTD, and 4-20mA (requires 2 of part number 9764-510F)

1


3000721-110

1


2921

1

Slot Cover

2900

Analog Input Baseplate Kit, Hazardous Location

1


3000989-115

1


9792-310F

1


2921

1

Slot Cover

2900

1

I/O HART Baseplate

3000851-020

1


2920

1

Slot Cover

2900

1

Terminal Cover

2901

1

I/O HART Baseplate

3000851-120

1


2920

1

Slot Cover

2900

1

Terminal Cover

2901

Analog Input Baseplate Kit

Analog Input Baseplate Kit, HART

Analog Input Baseplate Kit, HART, Hazardous Location


Overview

Table 1

31


Model

Product Name

Qty

Description

Consists of

2361S2

Analog Input/Digital Input Baseplate Kit

1

I/O Baseplate

3000675-040

1


2921

1

Slot Cover

2900

1

Terminal Cover

2901

2381S2

2381AS2

2401S2

2401HS2

2401LS2

2402S2

Pulse Input Baseplate Kit

Pulse Input Baseplate Kit, Hazardous Location

Digital Output Baseplate Kit

Digital Output Baseplate Kit, High Current

Digital Output Baseplate Kit, Low Current

Digital Output Baseplate Kit, High Voltage

1

I/O Baseplate

3000719-110

1


2921

1

Slot Cover

2900

1

Terminal Cover

2901

1

I/O Hazardous Location Baseplate

3000719-210

1


2921

1

Slot Cover

2900

1

Terminal Cover

2901

1

I/O Baseplate

3000674-040

1


2921

1

Slot Cover

2900

1

Terminal Cover

2901

1

I/O Baseplate

3000975-040

1


2921

1

Slot Cover

2900

1

Terminal Cover

2901

1

I/O Baseplate

3000715-040

1


2921

1

Slot Cover

2900

1

Terminal Cover

2901

1

I/O Baseplate

3000764-310

1

External Termination Panel (Relay Output ETP)

3000763-110

1


2921

1

Slot Cover

2900

1


9106-310F

Relay Output Modules for use with Relay Output ETP (ordered separately)

2402AS2

Digital Output Baseplate Kit, Hazardous Location

SSR, 2 A at 75 to 264 VAC

1300462-001

SSR, 2 A at 4 to 60 VDC

1300471-001

SSR, 1.5 A at 40 to 200 VDC

1300472-001

Power (Dry Contact) Relay; 440 VAC max, 125 VDC max

1300463-001

1


3000764-310

1


9671-610

1


2921

1

Slot Cover

2900


32

Chapter 2

Table 1

System Description


Model

Product Name

Qty

Description

Consists of

2451S2

Solid-State Relay Output Baseplate Kit

1

I/O Baseplate

3000676-320

1


2921

1

Slot Cover

2900

1

Terminal Cover

2901

1


3000764-510

1


9863-610F

1


2921

1

Slot Cover

2900

2480AS2

2481S2

2483S2

2483AS2

8401

9573-610F

9671-610F

Analog Output Baseplate Kit, Hazardous Location

1

I/O Baseplate

3000674-020

1


2921

1

Slot Cover

2900

1

Terminal Cover

2901

1

I/O HART Baseplate

3000852-030

1


2920

1

Slot Cover

2900

1

Terminal Cover

2901

1

I/O HART Baseplate

3000852-130

1


2920

1

Slot Cover

2900

1

Terminal Cover

2901

4

MTL4546 Intrinsic Safety Barrier—Isolator

1600107-001

1

Set of Spare Fuses

2

Set of Address Plugs (1 through 10)

3000698-010

1


3000698-020

1


3000698-030

1


3000698-040

1


3000698-050

1


3000698-060

Digital Input Termination Panel Kit, Hazardous Location (for use with Model 2302AS2)

2

External Termination Panel, DI

3000771-880

2

Interface Cable, 10 ft, DI

4000195-310

Digital Output Termination Panel Kit, Hazardous Location (for use with Model 2402AS2)

1

External Termination Panel, DO

3000769-390

1

Interface Cable, 10 ft, DO

4000196-310

Analog Output Baseplate Kit

Analog Output Baseplate Kit, HART

Analog Output Baseplate Kit, HART, Hazardous Location

Trident/Tri-GP Accessory Kit


Overview

Table 1

33


Model

Product Name

Qty

Description

Consists of

9764-510F

RTD/TC/AI Termination Panel Kit (for use with Model 2352S2)

1

External Termination Panel, RTD/TC/AI

3000712-100

1


4000189-510

Signal Conditioning Modules for use with 9764510F (ordered separately) 1600048-220

4–20 mA 320 F to 3920 F (00 C to 2000C), RTD

1600048-030

320 F

1600048-040

(00C

to

6000C),

RTD

320 F to 14000 F (00C to 7600C), Type J TC

1600048-110

320 F

1600048-120

320 F

9792-310F

to

11120 F

to

23720 F

to

7520 F

(00C

(00C

to

to

13000C),

4000C),

Type K TC

Type T TC

1600048-130

320 F to 16520 F (00C to 9000C), Type E TC

1600048-140

Shorting Plug

1600048-300

Analog Input Termination Panel Kit, Hazardous Location (for use with Model 2352AS2)

1

External Termination Panel, AI

3000771-710

1

Interface Cable, 10 ft, AI

4000197-510

Analog Input/Digital Input Termination Panels Kit, Hazardous Location (for use with Model 2342AS2)

1

External Termination Panel, AI

3000771-710

1

External Termination Panel, DI

3000771-880

1

Interface Cable, 10 ft, AI

4000197-510

1

Interface Cable, 10 ft, DI

4000195-310

Analog Output Termination Panel Kit, Hazardous Location (for use with Model 2480AS2)

1

External Termination Panel, AO

3000770-960

1

Interface Cable, 10 ft, AO

4000198-510

Triconex 4850


1


1600106-001

7254-13S2

TriStation 1131 Developer’s Workbench version 4.8.0 for Tri-GP

1

CD containing:

3000755-829

9793-610F

9863-610F

7255-13S2

8910-5S2

8747-11

TriStation 1131 Developer’s Workbench version 4.8.0 with CEMPLE for Tri-GP

Developer’s Workbench (software) TriStation 1131 Help Documentation (online) 1

TriStation 1131 v4.8.0 Documentation Set

3000760-930

1

CD containing:

3000755-828

Developer’s Workbench (software) TriStation 1131 Help Documentation (online) 1

TriStation 1131 v4.8.0 Documentation Set

3000760-930

Triconex General Purpose Systems User Documentation (hardcopy)

1


9700122-003

1

Communication Guide for Triconex General Purpose v2 Systems

9700123-002

TriStation 1131 version 4.8.0 User Documentation (hardcopy)

1

TriStation 1131 Developer’s Guide

9700100-011

1

TriStation 1131 Libraries Reference

9700098-010

1

Safety Considerations Guide for Trident v2

9700112-005

1

Safety Considerations Guide for Tri-GP v2

9700124-003

1

Safety Considerations Guide for Trident v1

9700096-002

1

Safety Considerations Guide for Tricon

9700097-009


34

Chapter 2

Table 1

System Description


Model

Product Name

Qty

Description

Consists of

7523-4

Triconex DDE Server 4.3.0

1

CD containing DDE Server software and documentation

3000723-303

1

DDE Server, v4.3.0 Documentation Set (hardcopy)

9700108-004

1

CD containing SOE Recorder and documentation

3000708-430

SOE Recorder, v4.3.0 Documentation Set (hardcopy)

9700081-008

1

CD containing Enhanced Diagnostic Monitor, v2.5.0 (software)

3000796-009

1

Enhanced Diagnostic Monitor, v2.5.0 Documentation Set (hardcopy)

9700107-009

1

CD containing documentation in PDF format

7521-6

7260-7

Contact Invensys for current model number

SOE Recorder version 4.3.0

Enhanced Diagnostic Monitor, v2.5.0

Triconex Documentation Set



35

Main Processor Components These Main Processor components are available with Tri-GP v2.x systems. Model

Description

3101S2

Main Processor Module, Tri-GP

2101S2

Main Processor Baseplate, Tri-GP

Each of the three Main Processor Modules control a separate channel and operate in parallel with the other two modules. They communicate with each other by using TriBus, which is a high-speed, fault-tolerant bus. A dedicated I/O control processor on each Main Processor manages the data exchanged between the Main Processor and the I/O modules. The I/O Bus operates at 2 megabits per second. Program Processor

I/O Processor Dual 24 V Power Inputs

Redundant Alarm Relays

Alarm 1 Alarm 2

System Alarm

Debug (RJ-12)

Dual-Power Regulators

+3.3 V +5 V 3.6 V Battery and Monitor

Program Alarm

Debug (RJ-12) I/O Bus

Modbus (DB-9) Clock/NVRAM 8 KB

MPC860A

Reserved (DB-9) Ethernet Network (RJ-45)

Shared Memory 128 K

36-Bit Bus

Flash 6 MB

Tribus (to other MPS)

Figure 6

TriBus FPGA

MPC860A

DRAM 16 MB

Up Stream

Down Stream

Up Stream

Down Stream

Diagnostic Bus Channels (to other MPs)

36-Bit Bus

DRAM 16 MB

Main Processor Architecture

Each Main Processor includes 16 megabytes of DRAM for the control program, sequence-ofevents (SOE) and I/O data, diagnostics, and communication buffers. The control program is stored in flash EPROM and loaded in DRAM for execution. The MP Modules receive power from redundant 24 VDC power sources. In the event of an external power failure, all critical retentive data is stored in NVRAM (Non-Volatile Random Access Memory).


36

Chapter 2

System Description

MP Module Specifications This section includes specifications for the MP Modules, including: •

Control Program Processor on page 36

•

Input/Output Processor on page 37

•

Logic Power on page 37

Control Program Processor This table lists the specifications for the Control Program Processor on the MP Modules. Table 2

Control Program Processor Specifications

Feature

Specification

SX Processor

Motorola® MPC860, 32-bit, 50 MHz

Flash PROM

6 MB used for SX, IOX, and control application storage CRC-protected

DRAM

16 MB used for SX control application execution and program and SOE data Byte parity

NVRAM

8 KB, used for retentive variables CRC-protected

Clock calendar Accuracy during power on

1 sec/day typical 2.2 sec/day maximum

Accuracy during power off, with battery backed up

2.2 sec/day typical 9.2 sec/day maximum

Battery

½ AA lithium, 15-year predicted life

TriBus

25 megabits per second CRC-protected 32-bit + parity DMA

TriStation 1131 port

1 10BaseT Ethernet connector RJ-45 shielded connector on baseplate

Modbus port

1 RS-232/485 DTE DB-9-pin shielded connector on baseplate

Debug port

Used to access diagnostic information RJ-12 connector located on baseplate, shared with IOX debug port

Communication bus

RS-485 2 megabits per second HDLC

Alarm contacts

Redundant, normally closed



WARNING

37

There is a danger of explosion if the battery on MP Modules is replaced incorrectly. To ensure a safe battery replacement, you must return MP Modules to Invensys for servicing.

Input/Output Processor This table lists the specifications for the Input/Output Processor on the MP Modules. Table 3

Input/Output Processor Specifications

Feature

Specification

IOX Processor

Motorola MPC860, 32-bit, 50 MHz

DRAM

16 MB, used for IOX execution; byte parity

Shared Memory

128 KB, used to communicate with SX; byte parity

Diagnostic Bus

2 megabits per second HDLC, used to communicate I/O module diagnostic information between MP channels

Debug Port

Used to access diagnostic information RJ-12 connector located on baseplate, shared with SX debug port

I/O Bus

RS-485 2 megabits per second HDLC

Logic Power This table lists the specifications for the logic power on the MP Modules. Table 4

Logic Power Specifications for MP Modules

Feature

Specification

Nominal input voltage

24 VDC

Operational voltage range

24 VDC –15% to +20% + 5% AC ripple (+19.2 to +30 VDC)

Logic power

8 W maximum

Absolute maximum input voltage

33 VDC

Absolute maximum reverse input voltage

–0.6 VDC

Input power interruption time from nominal

1 ms minimum

Repetition rate

1 sec maximum

Reverse current isolation input to input

500 μA maximum

In-rush current per input

2.4 A maximum, 1.2 A for 50 ms, typical

Short circuit current limit per input

2.4 A maximum

Functional-earth-to-logic-ground isolation

0 V, no isolation


38

Chapter 2

System Description

Table 4

Logic Power Specifications for MP Modules (continued)

Feature

Specification

Protective-to-functional-earth isolation

500 VDC

MP Baseplate This figure depicts a front view of the model 2101S2 Main Processor Baseplate, which includes connections for alarm contacts and logic power and communication ports. For details, see Baseplate Connections and Ports on page 39.

Figure 7

Model 2101S2 MP Baseplate



39

Baseplate Connections and Ports This figure depicts the connections for alarm contacts, logic power, and communication ports on the MP Baseplate. For specifications, see: •

Alarm Connections on page 40

•

Communication Ports on page 41

•

Logic Power Connections on page 42

Logic Power 1 Fuse Logic Power 2 Fuse Logic Power 1

DSP1

Logic Power 1 Blown Fuse Indicator

Logic Return 1

DSP2

Logic Power 2 Blown Fuse Indicator

ñ

Logic Power 2 Logic Return 2

+ DSP3 FUSE

DSP4

Safety FUSE

Alarm 1

Alarm 1 Blown Fuse Indicator Alarm 1 Fuse Alarm 2 Blown Fuse Indicator Alarm 2 Fuse

Alarm 2 Left Serial Port

Middle Serial Port

Right Serial Port

Left TriStation Port

Left Debug Port

Middle TriStation Port

Middle Debug Port Right Debug Port

Right TriStation Port

1

Figure 8

Node Address

MP Baseplate Connectors and Ports


40

Chapter 2

System Description

Alarm Connections Alarms are asserted when the controller detects either a system alarm or a program alarm. Each MP contains a set of redundant alarm solid-state relays. The relays are normally closed and are connected in series between MP Modules. •

A system alarm indicates a fault in the controller, its power supplies, or field input.

•

A program alarm indicates a problem detected by the control program.

MP Baseplate

MP A

MP B

MP C

Alarm 1/NC Alarm 1/C

Alarm 2/NC Alarm 2/C

This table lists the alarm contacts on the MP Baseplate. Table 5

Alarm Contact Specifications for MP Baseplates

Feature

Specification

Alarm contacts

2, redundant pair, isolated

Rated voltage

±24 VAC/VDC


0–30 VDC

Maximum switch voltage

33 V

Maximum switching power

15 W resistive

Maximum off-state leakage

<50 µA

Maximum nominal current

0.5 A per contact, continuous 0.7 A per contact for 100 ms

Voltage drop @ baseplate

<0.25 VDC @ 0.5 A

Fuses, mounted on baseplate

1 per contact, 1 A fast-acting

Blown-fuse indicator

On baseplate

Contact-to-protective-earth isolation

500 VDC, minimum

Contact-to-functional-earth (logic) isolation

800 VDC, minimum



41

Communication Ports Ports on the MP Baseplate enable the Tri-GP controller to communicate with a PC running TriStation 1131 software and with other external devices by means of Modbus and Ethernet protocol. Ports include: •

One Ethernet (IEEE 802.3) TriStation 1131 port for downloading the control program to the Tri-GP controller and uploading diagnostic information. This port can also be used to download Tri-GP firmware to the Flash ROM.

•

One Modbus RS-232 or RS-485 serial port which acts as a Modbus slave while an external device is the master.

•

Debug ports used for Technical Support.

Feature

Specification

Connector

DB-9-pin DTE standard, shielded, located on baseplate

RS-232 maximum cable length

50 ft (15 m)


4,000 ft (1.2 km)

Supported transmission rates (bps)

1200, 2400, 4800, 9600, 19.2 K, 38.4 K, 57.6 K, 115.2 K

Protocols

Slave, RTU mode, optional parity, 1 stop bit

Galvanic isolation

500 VDC

Feature

Specification

10BaseT connector

RJ-45 standard, shielded, located on baseplate

10BaseT maximum cable length

330 ft (100 m) using category 5 twisted-pair cable

Protocol

TriStation 1131

Network address

Derived from baseplate address plug; range is 1 to 63

Galvanic isolation

500 VDC

Feature

Specification

Connector

RJ-12, Triconex proprietary pin-out

Maximum cable length

25 ft (8 m)

Protocol

RS-232, 9600 bps, ASCII, asynchronous

Galvanic isolation

500 VDC


42

Chapter 2

System Description

Logic Power Connections The MP Baseplate provides redundant, fused logic power connectors for the MP and I/O modules, which are directly connected to the MP Baseplate. Feature

Specification

Logic power

125 W, maximum

Fuse

8 A, slow-acting

Blown fuse indicator

20 mA



43

Communication Components These communication components are available with Tri-GP v2.x systems. Model

Description

Type

3201S2


Single or redundant Configuration, non-TMR

2201S2

Communication Baseplate

This section describes the features and specifications for the Communication Module and Communication Baseplate compatible with Tri-GP v2.x and later systems. The Communication Module (CM) is an optional, three-to-one interface to the Main Processors. Using a variety of communication methods, protocols, and physical media types, the CM enables communication with external computers, distributed control systems (DCS), Ethernet (open) networks, other Tri-GP, Trident, and Tricon v9–v10 systems, and network printers. A single Tri-GP controller supports up to two CMs on one CM Baseplate. Each CM operates independently and supports three RS-232/485 serial ports and two Ethernet ports. Two CMs can provide redundant communication connections or additional independent communication ports.

Logic Power Specifications This table lists specifications for logic power, which is supplied by the MP Baseplate. Table 6

Logic Power Specifications for CM

Feature

Specification


24 VDC

Specified operational voltage range

24 VDC –15% or +20% + 5% AC ripple (19.2 to 30 VDC)

Logic power (without MAUs)

8 W maximum

10 Mb AUI-type MAU

6 W maximum additional per MAU

100 Mb MII-type MAU

3.75 W maximum additional per MAU


33 VDC


–0.6 VDC

Input power interruption time from nominal value

1 ms maximum

Repetition rate

1 sec minimum


500 μA maximum

Inrush current per input

2.4 A maximum, typically 1.2 A for 50 ms


2.4 A maximum

Functional-to-logic ground isolation

0 V, no isolation


500 VDC


44

Chapter 2

System Description

Table 6

Logic Power Specifications for CM (continued)

Feature

Specification

+12 V AUI output power

12 V ±10%, 6 W maximum, current limited

+5 V MII output power

5 V ±5%, 3.75 W maximum, current limited

CM Baseplate This figure depicts the Communication Module Baseplate, which includes three serial ports, two Ethernet ports, and two multi-station access unit (MAU) ports. For details, see Communication Ports on page 45.

Figure 9

Model 2201S2 CM Baseplate



45

Communication Ports This figure depicts the ports on the CM Baseplate. For specifications, see: •

CM Serial Port Specifications on page 46

•

CM Ethernet Port Specifications on page 46

Left Module Serial 3 Serial 2 Serial 1

Right Module Serial 3 Serial 2 Serial 1 Net 1 Left Module AUI MAU Net 1 Right Module AUI MAU Net 1 Left Module 10BaseT Net 1 Right Module 10BaseT

Net 2 Left Module 10BaseT/100BaseTX Net 2 Right Module 10BaseT/100BaseTX

Net 2 Right Module MII MAU Net 2 Left Module MII MAU

Debug

Figure 10

Communication Module Port Connectors


46

Chapter 2

System Description

Table 7

CM Serial Port Specifications

Feature

Specification

Serial (Modbus) ports

3 optically isolated RS-232/485 ports, configurable from TriStation 1131 software

Connector

DB-9-pin DTE standard, shielded, located on baseplate


50 ft (15 m)


4,000 ft (1.2 km)

Supported transmission rates (bps)

1200, 2400, 4800, 9600, 19.2 K, 38.4 K, 57.6 K, 115.2 K

Protocols

TriStation 1131, Modbus Slave (ASCII or RTU), Modbus Master (RTU)

Serial port Galvanic isolation

500 VDC

Table 8

CM Ethernet Port Specifications

Feature

Specification

10BaseT network port

Ethernet 10 megabits per second, protocol-configurable from TriStation 1131 software

10BaseT connector


10BaseT maximum cable length

100 m, using Category 5 twisted-pair cable

10 Mb AUI-type MAU port

Supports AUI MAU located on baseplate Disables 10BaseT RJ-45 connector

100BaseTX Ethernet port

100 or 10 megabits per second, speed auto-selected, configurable from TriStation 1131 software

100BaseTX connector


100BaseTX maximum cable length

30 m, using Category 5 twisted-pair cable

100 Mb MII-type MAU port

Supports MII MAU located on baseplate Disables 100BaseTX RJ-45 connector

Protocols

TriStation 1131 TSAA (UDP/IP) TSAA with IP Multicast (UDP/IP) Peer-to-Peer (UDP/IP) Peer-to-Peer (DLC) Modbus Master or Slave (TCP) Triconex Time Synchronization via DLC Triconex Time Synchronization via UDP/IP SNTP Triconex Time Synchronization Network Printing using JetDirect

Network address

Derived from MP Baseplate address plug

Galvanic isolation

500 VDC


I/O Modules Common Specifications

47

I/O Modules Common Specifications This section includes specifications that are common to all I/O modules. For specifications, see: •

Wiring Terminals on page 47

•

Logic Power on page 47

•

Field Power on page 48

Wiring Terminals This table lists the wiring specifications for I/O modules. Table 9

Wiring Specifications for I/O Modules

Feature

Specification

Compression terminals

Compatible with 24 to 12 (0.2 mm2 to 3.3 mm2) AWG wiring

Logic Power This table lists the logic power specifications for I/O modules. Table 10

Logic Power Specifications for I/O Modules

Feature

Specification


24 VDC

Voltage range

24 VDC –15% or +20% + 5% AC ripple (19.2 to 30 VDC)

Logic power

<3 W


33 VDC


–0.6 VDC


1 ms maximum

Power interruption interval

1 sec minimum


500 μA maximum

Inrush current per input

2.4 A maximum


2.4 A maximum

Functional-earth-to-logic-ground isolation

0 V, no isolation


500 VDC, minimum


48

Chapter 2

System Description

Field Power This table lists the field power specifications for I/O modules. Table 11

Field Power Specifications for I/O Modules

Feature

Specification

Nominal field voltage

24 VDC


24 VDC –15% or +20% + 5% AC ripple (19.2 to 30 VDC) (For PI Modules, voltage ranges are configurable in TriStation 1131 software.)

Power

See module specifications


33 VDC


–0.6 VDC


Not applicable

Power interruption interval

Not applicable

Reverse current isolation

500 μA maximum

Functional- to-protective-earth isolation

500 VDC, minimum

Functional-to-functional-earth (logic) isolation

800 VDC, minimum


Analog Input Components 49

Analog Input Components These analog input components are available for Tri-GP v2.x systems. For installation procedures, see Component Installation on page 185. Model

Description

Current

Type

3351S2

Analog Input Module

4–20 mA

Commoned

2351S2

Analog Input Baseplate

Direct Termination

n/a

Analog Input External Termination Baseplate

External Termination

9764-510F

RTD/TC/AI External Termination Panel


9792-310F

Analog Input Hazardous Location External Termination Panel


2354S2

Analog Input HART Baseplate

Direct Termination

2354AS2

Analog Input HART Hazardous Location Baseplate

Direct Termination

Note

When ordering the 9764-510F ETP or the 9792-310F ETP, you can order longer interface cables, in increments of 10 feet, by changing the last two digits of the ETP model number from “10” to the desired length of the cable. The maximum length for interface cables is normally 100 feet. Contact the Invensys Global Customer Support (GCS) center if you require cables longer than 100 feet.

The Analog Input (AI) Module has three isolated sets of electronics, called channels, which independently process field data input to the module. Sensing of each input point is performed in a manner that prevents a single failure on one channel from affecting another channel. Each channel receives variable voltage signals from each point, converts them to digital values, and transmits the values to the three MPs on demand. The MPs vote the data before passing it to the control program. In TMR mode, the data passed is mid-value. In DUAL mode, the data passed is the average. AI Modules sustain complete, ongoing diagnostics for each channel. If the diagnostics detect a failure on any channel, the Fault indicator turns on and activates the system alarm. The Fault indicator identifies a channel fault, not a complete module failure. AI Modules are guaranteed to operate properly in the presence of a single fault and may continue to operate properly with multiple faults. AI Modules include the hot-spare feature which allows online replacement of a faulty module. The AI Module is mechanically keyed to prevent improper installation in a configured baseplate.


50

Chapter 2

System Description

AI Module 3351S2 This figure is a simplified schematic of the Model 3351S2 AI Module. Analog Input Module Typical Point (1 of 32)

ADC

Triplicated I/O Bus ASIC

Isolated Bus Transceiver

A

ASIC


B

ASIC


C

Isolation Filtering

Individual Point Field Terminations

DAC

ADC

DAC

ADC

DAC

Figure 11

3351S2 AI Module Simplified Schematic



This table lists the specifications for the Model 3351S2 AI Module. Table 12

3351S2 AI Module Specifications

Feature

Specification

Points

32, commoned

Nominal input current

4–20 mA DC

Operational current range

2–21.2 mA DC

Absolute maximum field voltage

33 VDC

Recommended HART baseplate field voltage

28 VDC

Absolute maximum reverse field voltage

– 0.6 VDC

Absolute maximum input current

50 mA DC

Input bandwidth (3dB)

16 Hz

Source impedance

180 Ω

Input impedance (with baseplate)

250 Ω

I to V resistor

100 Ω, ±0.01%

Resolution

12 bits

Absolute error

0.15% of full scale (20 mA)

Diagnostic

Force-to-value diagnostic (FVD)

Scan time

<1 ms for all 32 points

Functional-to-protective-earth isolation (ATEX)

500 VDC, minimum (0 VDC)


800 VDC, minimum

Input impedance (with HART baseplate)

350 Ω, nominal (300–400 Ω)

Source impedance (with HART baseplate)

250 Ω, nominal (200–300 Ω)


52

Chapter 2

System Description

AI Baseplate The Model 2351S2 AI Baseplate is typically used with 4—20 mA control programs. The short circuit current specifications for field short-to-ground faults are: •

130 mA, typical

•

200 mA, maximum

This figure is a simplified schematic of the Model 3351S2 AI Module and Model 2351S2 AI Baseplate. AI Baseplate

32-Point AI Module Mux 1

Field Power (PS1) + Field Power (PS2) +

32 To Spare

180 7 + In

150 7

Mux 1

– 100 7 .01%

32

Mux

Field Power (PS1) – Field Power (PS2) –

To Other Points

1 32



Figure 12

3351S2 AI Module and 2351S2 AI Baseplate Schematic

Typical Field Connections This figure depicts typical field connections for the Model 2351S2 AI Baseplate. +24 V #1

~

+24 V #2

~

24 V Return

~

Shield

~

Safety

~

Typical Point (1 of 32 Points Shown)

+

–

~ ~~ ~

1

~ ~~ ~

4-20 mA Transmitter

1

2

2

3

3

4

4

5

5

6

6

7

7

8

8

9

9

10

10

11

11

12

12

13

13

14

14

15

15

16

16

17 17 18 19 20 21 22 23 24

S

25 26 27 28

F

29 30 31

18 19 20 21 22 23 24 25 26 27 28 29 30 31 32

32

~ ~~ ~ ~ Figure 13

–

+

6

2351S2 AI Baseplate Typical Field Connections


54

Chapter 2

System Description

AI External Termination Baseplate The AI External Termination Baseplate is typically used with the Model 9764-510F RTD/TC/AI External Termination Panel or the Model 9792-310F AI Hazardous Location External Termination Panel. This baseplate contains ELCO connectors, which allows connection of External Termination Panels.

This figure is a simplified schematic of the Model 3351S2 AI Module and the AI External Termination Baseplate. AI Baseplate

32-Point AI Module Mux 1


32 To Spare

Mux 1

From External Termination Panels


Figure 14

32

Mux V + To External Termination Panels

1 32

3351S2 AI Module and AI External Termination Baseplate Schematic



Typical Field Connections This figure depicts typical field connections for the AI External Termination Baseplate. +24 V #1

~

+24 V #2

~

24 V Return

~

Shield

~

Safety

–

+

~

S F

~ ~~ ~ ~ Figure 15

6

AI External Termination Baseplate Typical Field Connections


56

Chapter 2

System Description

RTD/TC/AI External Termination Panel The Model 9764-510F RTD/TC/AI External Termination Panel (ETP) includes industrystandard signal-conditioning modules which can be cabled to the Analog Input External Termination Baseplate. The input-signal conditioners are manufactured by Analog Devices™. The RTD/TC/AI ETP supports 16 points and each AI Module can support up to two ETPs. The Model 9764-510F RTD/TC/AI ETP has a barrier strip with four compression screw terminals for connecting an AI Module to 16 analog inputs. The panel accepts power (+24 VDC) from the AI Baseplate or from a direct connection to the panel. Each 24 volt power source must be able to provide 0.5 amps minimally. Model 9764-510F RTD/TC/AI ETP includes a 10-foot cable and mounting plate. You must use two 16-point term panels for each 32-point AI module. Each term panel comes with two sets of labels: 1-16 and 17-32. For information on how to apply the labels, see Appendix F, Panel Labels. AI (4–20 mA)

16 16

13

12

14 15

14 15

13

12

9

R16

11

8

11 10

7

10 9

8

6

5

U16

R15

7

6

5

2

1

3 4

3 4

2

1

14 15

13

16 16

14 15

13

12

9

11

12 11

10

8

7

6

5

10 9

8

7

6

5

3 4

1

2 1

14 15

16 16

13

12 11

14 15

13

12

9

8

10

7

6

5

3 4

2

1

11 10

9

8

7

6

5

3 4

2

1

16 16

13

12

9

11

8

14 15

14 15

13

12

11

10

7

6

5

3 4

2

1

10 9

8

7

6

5

3 4

2

ISOLATED RTD INPUT

1

ANALOG DEVICES

ISOLATED RTD INPUT

U15

R14

7B34

ANALOG DEVICES

U14

R13

7B34

ISOLATED RTD INPUT

U13

ANALOG DEVICES

ISOLATED RTD INPUT

U12 R12

7B34

ANALOG DEVICES

ISOLATED RTD INPUT

J5

7B34

ANALOG DEVICES

R11

7B34

ISOLATED RTD INPUT

U11

R10

J4

J3

ANALOG DEVICES

ISOLATED RTD INPUT

U10

R9

7B34

ANALOG DEVICES

ISOLATED RTD INPUT

U9

R8

SN

7B34

ANALOG DEVICES

U8

R7

7B34

ISOLATED

PROCESS ANALOG DEVICES CURRENT INPUT

U7

R6

7B32

U6

R5

ISOLATED


ISOLATED


SHORTING PLUG

U5

R4

7B32

7B32

ANALOG DEVICES

ISOLATED TC INPUT

U4

R3

7BDS

ANALOG DEVICES

ISOLATED TC INPUT

U3

R2

7B47

ANALOG DEVICES

ISOLATED TC INPUT

U2

7B47

ANALOG DEVICES

ISOLATED TC INPUT

U1 R1

J2

7B47

ANALOG DEVICES

7B47

*

REV E

7400225-

3 4

TRICONEX 7B 16 MODULE BASEPLATE

J1

RTD

2

TC

J6

**

* A signal conditioning module or shorting plug 1600048-300 must be installed on all points. ** Unused points must be shorted at the +, –, and x terminals. The diagram shows a typical unused point.

Figure 16

9764-510F RTD/TC/AI External Termination Panel

9764-510F RTD/TC/AI ETP Dimensions Width (across DIN rail)

Length (along DIN rail)

Height (out from DIN rail)

5.22 in (13.26 cm)

19.00 in (48.26 cm)

3.24 in (8.23 cm)



This figure is a simplified schematic of the Model 3351S2 AI Module and the Model 9764-510F RTD/TC/AI ETP. RTD/TC/AI Panel

Baseplate

32-Point AI Module Mux

V+

1

To Spare

V+A

32

V+B V+ Mux 1 Com

32

+ –

x

Mux 7BXX Typical Signal Conditioner

1

32 y

rfu

CJ

Figure 17

3351S2 AI Module and 9764-510F RTD/TC/AI ETP Schematic


58

Chapter 2

System Description

Typical Field Connections These figures show typical field connections using the Model 9764-510F RTD/TC/AI ETP, which can be used with the Model 3351S2 AI Module and the AI External Termination Baseplate (these components are supplied together as the Model 5352S2 TriPak).

16 16

13

12

14 15

14 15

13

11

12

9

11

10

8

7

R12

10

9

8

6

5

U12

R11

7

6

5

2

1

3 4

3 4

2

ISOLATED RTD INPUT

1

ANALOG DEVICES

ISOLATED RTD INPUT

U11

R10

7B34

ANALOG DEVICES

ISOLATED RTD INPUT

ISOLATED RTD INPUT

U10

R9

7B34

ANALOG DEVICES

7B34

ANALOG DEVICES

7B34

U9

J5 Shield

Point #12 Typical, see 9764-510F RTD/TC/AI ETP PinOuts on page 60 for other points

9764-510F RTD/TC/AI ETP Typical RTD Field Connection

16

14 15

14 15

13

*

13

11

12

R4

12

11

10 9

J3

10

9 8

7

8 7

6

U4

R3

6

5

5

3 4

2

1

3 4 2

ISOLATED TC INPUT

1

ANALOG DEVICES

ISOLATED TC INPUT

ISOLATED TC INPUT

U3

R2

7B47

ANALOG DEVICES

ISOLATED TC INPUT

U2

R1

7B47

ANALOG DEVICES

7B47

ANALOG DEVICES

7B47

U1

16

Figure 18

Shield

+ –

* Install jumper Point #4 Typical, see 9764-510F RTD/TC/AI ETP Pin-Outs on page 60 for other points

Figure 19

9764-510F RTD/TC/AI ETP Typical TC Field Connection



16 16

13

14 15

14 15

11

13

12

R8

12

9

11 10

8

7

10 9

8

6

5

U8

R7

7

6

5

2

1

3 4

3 4

2

1

ISOLATED


U7

R6

7B32

U6

R5

ISOLATED


7B32

ISOLATED


7B32

ISOLATED


7B32

U5

J4

+ Field Transmitter

–

Point #6 Typical, see 9764-510F RTD/TC/AI ETP Pin-Outs on page 60 for other points

Figure 20

9764-510F RTD/TC/AI ETP Typical AI Field Connection

J2

+

-

+

-

+24V Power Supplies

Figure 21

9764-510F RTD/TC/AI ETP Typical Power Connections


60

Chapter 2

System Description

Pin-Out Information This table lists pin-out information for the Model 9764-510F RTD/TC/AI ETP. Table 13 Point

Point 1

Point 2

Point 3

9764-510F RTD/TC/AI ETP Pin-Outs Connector

Pin #

TC

RTD

AI

J3A (upper)

1

NCa

NC

NC

J3B (lower)

1

Jump

NC

NC

J3A (upper)

2

NC

Xb

NC

J3B (lower)

2

Jump

NC

NC

J3A (upper)

3

– and SHc

–

–

J3B (lower)

3

NC

NC

NC

J3A (upper)

4

+

+ and SH

+

J3B (lower)

4

NC

NC

NC

J3A (upper)

5

NC

NC

NC

J3B (lower)

5

Jump

NC

NC

J3A (upper)

6

NC

X

NC

J3B (lower)

6

Jump

NC

NC

J3A (upper)

7

– and SH

–

–

J3B (lower)

7

NC

NC

NC

J3A (upper)

8

+

+ and SH

+

J3B (lower)

8

NC

NC

NC

J3A (upper)

9

NC

NC

NC

J3B (lower)

9

Jump

NC

NC

J3A (upper)

10

NC

X

NC

J3B (lower)

10

Jump

NC

NC

J3A (upper)

11

– and SH

–

–

J3B (lower)

11

NC

NC

NC

J3A (upper)

12

+

+ and SH

+

J3B (lower)

12

NC

NC

NC



Table 13 Point

Point 4

Point 5

Point 6

Point 7

9764-510F RTD/TC/AI ETP Pin-Outs (continued) Connector

Pin #

TC

RTD

AI

J3A (upper)

13

NC

NC

NC

J3B (lower)

13

Jump

NC

NC

J3A (upper)

14

NC

X

NC

J3B (lower)

14

Jump

NC

NC

J3A (upper)

15

– and SH

–

–

J3B (lower)

15

NC

NC

NC

J3A (upper)

16

+

+ and SH

+

J3B (lower)

16

NC

NC

NC

J4A (upper)

1

NC

NC

NC

J4B (lower)

1

Jump

NC

NC

J4A (upper)

2

NC

X

NC

J4B (lower)

2

Jump

NC

NC

J4A (upper)

3

– and SH

–

–

J4B (lower)

3

NC

NC

NC

J4A (upper)

4

+

+ and SH

+

J4B (lower)

4

NC

NC

NC

J4A (upper)

5

NC

NC

NC

J4B (lower)

5

Jump

NC

NC

J4A (upper)

6

NC

X

NC

J4B (lower)

6

Jump

NC

NC

J4A (upper)

7

– and SH

–

–

J4B (lower)

7

NC

NC

NC

J4A (upper)

8

+

+ and SH

+

J4B (lower)

8

NC

NC

NC

J4A (upper)

9

NC

NC

NC

J4B (lower)

9

Jump

NC

NC

J4A (upper)

10

NC

X

NC

J4B (lower)

10

Jump

NC

NC

J4A (upper)

11

– and SH

–

–

J4B (lower)

11

NC

NC

NC

J4A (upper)

12

+

+ and SH

+

J4B (lower)

12

NC

NC

NC


62

Chapter 2

System Description

Table 13 Point

Point 8

Point 9

Point 10

Point 11


Pin #

TC

RTD

AI

J4A (upper)

13

NC

NC

NC

J4B (lower)

13

Jump

NC

NC

J4A (upper)

14

NC

X

NC

J4B (lower)

14

Jump

NC

NC

J4A (upper)

15

– and SH

–

–

J4B (lower)

15

NC

NC

NC

J4A (upper)

16

+

+ and SH

+

J4B (lower)

16

NC

NC

NC

J5A (upper)

1

NC

NC

NC

J5B (lower)

1

Jump

NC

NC

J5A (upper)

2

NC

X

NC

J5B (lower)

2

Jump

NC

NC

J5A (upper)

3

– and SH

–

–

J5B (lower)

3

NC

NC

NC

J5A (upper)

4

+

+ and SH

+

J5B (lower)

4

NC

NC

NC

J5A (upper)

5

NC

NC

NC

J5B (lower)

5

Jump

NC

NC

J5A (upper)

6

NC

X

NC

J5B (lower)

6

Jump

NC

NC

J5A (upper)

7

– and SH

–

–

J5B (lower)

7

NC

NC

NC

J5A (upper)

8

+

+ and SH

+

J5B (lower)

8

NC

NC

NC

J5A (upper)

9

NC

NC

NC

J5B (lower)

9

Jump

NC

NC

J5A (upper)

10

NC

X

NC

J5B (lower)

10

Jump

NC

NC

J5A (upper)

11

– and SH

–

–

J5B (lower)

11

NC

NC

NC

J5A (upper)

12

+

+ and SH

+

J5B (lower)

12

NC

NC

NC



Table 13 Point

Point 12

Point 13

Point 14

Point 15


Pin #

TC

RTD

AI

J5A (upper)

13

NC

NC

NC

J5B (lower)

13

Jump

NC

NC

J5A (upper)

14

NC

X

NC

J5B (lower)

14

Jump

NC

NC

J5A (upper)

15

– and SH

–

–

J5B (lower)

15

NC

NC

NC

J5A (upper)

16

+

+ and SH

+

J5B (lower)

16

NC

NC

NC

J6A (upper)

1

NC

NC

NC

J6B (lower)

1

Jump

NC

NC

J6A (upper)

2

NC

X

NC

J6B (lower)

2

Jump

NC

NC

J6A (upper)

3

– and SH

–

–

J6B (lower)

3

NC

NC

NC

J6A (upper)

4

+

+ and SH

+

J6B (lower)

4

NC

NC

NC

J6A (upper)

5

NC

NC

NC

J6B (lower)

5

Jump

NC

NC

J6A (upper)

6

NC

X

NC

J6B (lower)

6

Jump

NC

NC

J6A (upper)

7

– and SH

–

–

J6B (lower)

7

NC

NC

NC

J6A (upper)

8

+

+ and SH

+

J6B (lower)

8

NC

NC

NC

J6A (upper)

9

NC

NC

NC

J6B (lower)

9

Jump

NC

NC

J6A (upper)

10

NC

X

NC

J6B (lower)

10

Jump

NC

NC

J6A (upper)

11

– and SH

–

–

J6B (lower)

11

NC

NC

NC

J6A (upper)

12

+

+ and SH

+

J6B (lower)

12

NC

NC

NC


64

Chapter 2

System Description

Table 13 Point

Point 16


Pin #

TC

RTD

AI

J6A (upper)

13

NC

NC

NC

J6B (lower)

13

Jump

NC

NC

J6A (upper)

14

NC

X

NC

J6B (lower)

14

Jump

NC

NC

J6A (upper)

15

– and SH

–

–

J6B (lower)

15

NC

NC

NC

J6A (upper)

16

+

+ and SH

+

J6B (lower)

16

NC

NC

NC

a. NC = No connect b. X = Third wire (sense signal) c. SH = Shield

Temperature and Output Ranges This table gives the temperature and output ranges for available signal conditioning modules. Signal conditioners must be ordered separately and are available from Invensys or directly from Analog Devices. For more information, contact your regional customer center. For detailed specifications, see the Analog Devices catalog, Signal Conditioning and Data Acquisition Solutions. Table 14

Temperature and Output Ranges for Signal Conditioning Modules

Description

Part Number

Input Range

Output Range

Non-Isolated, Process Current Input Module

1600048-220 (7B32NI)

4 mA to 20 mA

0.4 V to 2 V

Isolated, Linearized, RTD Input,100 Ω Platinum, 2- or 3Wire, α = 0.00385

1600048-030 (7B34)

32° F to 392° F (0° C to 200° C)

0.4 V to 2 V

1600048-040 (7B34)

32° F to 1112° F (0° C to 600° C)

0.4 V to 2 V

Isolated, Linearized, Type J, Thermocouple Input Module

1600048-110 (7B47)

(32° F to 1400° F (0° C to 760° C)

0.4 V to 2 V

Isolated, Linearized, Type K, Thermocouple Input Module

1600048-120 (7B47)

32° F to 2372° F (0° C to 1300° C)

0.4 V to 2 V

Isolated, Linearized, Type T, Thermocouple Input Module

1600048-130 (7B47)

32° F to 752° F (0° C to 400° C)

0.4 V to 2 V

Isolated, Linearized, Type E, Thermocouple Input Module

1600048-140 (7B47)

(32° F to 1652° F (0° C to 900° C)

0.4 V to 2 V

Shorting Plug for unused points

1600048-300 (7BDS)

Not applicable

0.0 V



AI Hazardous Location External Termination Panel The Model 9792-310F ETP is suitable for use in Zone 2, and Class 1, Division 2 field circuits. The ETP contains extra circuitry designed to limit power available to the field terminals. The circuits have been examined and certified by TÜV Rhineland as being nonincendive. This guarantees that if the field wires are accidentally opened, shorted, or grounded, and the Tri-GP is operating normally, the wiring and attached devices will not release sufficient energy to cause ignition in the specified flammable atmosphere. Each positive terminal is current-limited with a 200-to-300-ohm positive temperature coefficient (PTC) resistor. Each input has a precision 100-ohm resistor for current-to-voltage conversion. The panel supports redundant 24 VDC power sources with diode ORing. However, recommended field power connections are on the AI External Termination Baseplate and routed to the ETP through the interface cable with ELCO connectors. Field energy will not be limited if it is connected to the ETP; it will be limited only if it is connected to the baseplate. You must use two 16-point term panels for each 32-point AI module. Each term panel comes with two sets of labels: 1-16 and 17-32. For information on how to apply the labels, see Appendix F, Panel Labels. Dimensions for Term Panel 9792-310F Width (across DIN rail)



4.42 in (11.23 cm)

5.02 in (12.75 cm)

4.25 in (10.795 cm)

Specifications This table describes general specifications for 9792-310F. Table 15

General Specifications for Term Panel 9792-310F

Feature

Description

Panel type

Hazardous location, 4-20 mA current input, 2.5 V

Points

16


66

Chapter 2

System Description

This table describes cable and load parameters for 9792-310F. Table 16

Cable and Load Parameters for Term Panel 9792-310F

Feature

IEC Symbol

ISA Symbol

Description for Zone 2 Group IIB

Operating temperature range

Tamb

Tamb

32° F to 140° F (0° C to 60° C)

Working voltage

Uw

Uw

19 to 28 V

Maximum voltage

Um

Um

32 V

Maximum input voltage

Ui

Vmax

9V

Maximum input current

Ii

Imax

0.090 A

Maximum input power

Pi

Pi

0.324 W

C internal, maximum

Ci

Ci

0.088 µF

L internal, maximum

Li

Li

43 µH

Input Connection (F–) Specifications

Output Connection (F+) Specifications

Maximum output voltage

Uo

Voc

32 V

Maximum output current

Io

Isc

0.160 A

Maximum output power

Po

Po

1.347 W

C external, maximum

Co

Ca

1.18 µF

L external, maximum

Lo

La

4.95 mH



Simplified Schematic This figure is a simplified schematic of the Model 9792-310F ETP and the Model 3351S2 AI Module with an AI External Termination Baseplate. ELCO CABLE

TERMINATION PANEL

BASEPLATE

32-POINT ANALOG INPUT MODULES to spare Isolation/filtering

Mux

200–300 Ohms F

1 30 V Zener

Amp

ADC

Amp

ADC

Amp

ADC

To other points

32

PS1

Hi-Ref Low-Ref

PS2

Mux

1

F

3.3 V Zener

32

100 ohm 0.01%

Hi-Ref PS1

To other points

To AI modules

Low-Ref

PS2

PS1

Mux

PS2

1 0 ohm

PS1 PS2

32 0 ohm

Hi-Ref Low-Ref

Figure 22

Simplified Schematic of a 9792-310F Panel and a 3351S2 AI Module with an AI External Termination Baseplate


68

Chapter 2

System Description

Typical Field Connections This figure illustrates how to connect a 9792-310F to the field (1 of 16 module points shown). TRICONEX

R25

18 R

9

R5

R29

R4

R28

R3

R27

R2

R26

TB1

R6 R7

R31

R8

16

R32

R

15

R

24

R

!

14

R

23

TB4

R30

22 R

13 R

DO NOT SEPARATE WHEN ENERGIZED

19 R 20 R 3 21 R

12 R

R4 R5 R6 R7

J1

R

R8

SN

R 10 11 R

R3

R

R2

R1

SN

TB1

7400275

0° C≤TA≤+60° C

17

REV C

R

7400275

EXT TERM ATEX/EMC

R1

EXT TERM TRICON ATEX/EMC INPUT

12 AWG, as short as possible

TB2 TB3 TB5 TB6

J2

J2

L+

L+

J3

J3

L-

P1

P2

L-

Second term panel if using a 32-point module

Typical point (1 of 16 or 32 points shown)

+ -

Field Xmtr (4-20 mA)

Note: Field power is routed from the baseplate through the Elco cable to the ETP. Do not connect field power to the ETP.

Shield Ground

Energy limited

Figure 23

Not energy limited

Field Wiring for 9792-310F with a 3351S2 AI Module

CAUTION

For more information about installing the Tri-GP in hazardous locations, see Application-Specific Installation Guidelines on page 182.



AI HART Baseplates The Model 2354S2 AI HART Baseplate and the Model 2354AS2 AI HART Hazardous Location Baseplate are used with Model 3351S2 AI Modules. The Triconex 4850 HART Multiplexer mounts directly onto the Model 2354S2 and 2354AS2 baseplates (the Multiplexer is supplied in the Model 5354S2 and 5354AS2 TriPaks). The Model 2354AS2 AI HART Baseplate should be used in hazardous locations. The short circuit current specifications for field short-to-ground faults are: •

70 mA, typical

•

110 mA, maximum

For more information, see Appendix C, HART Communication and the Triconex 4850 HART Multiplexer Instruction Manual.


70

Chapter 2

System Description

This figure is a simplified schematic of the Model 3351S2 AI Module and the Model 2354 AI HART Baseplate with the Triconex 4850 HART Multiplexer. AI HART Baseplate

Triconex 4850


HART Field Power (PS1) +

1

Field Power (PS2) +

32 To Spare

250 7 In +

Mux 1

250 7 In –

32 100 7 .01% Mux Field Power (PS1) –

To Other Points

Field Power (PS2) –

Figure 24

1 32

3351S2 AI Module and 2354S2 AI HART Baseplate Schematic

This figure is a simplified schematic of the Model 3351S2 AI Module and the Model 2354AS2 AI HART Hazardous Location Baseplate with the Triconex 4850 HART Multiplexer. AI HART Baseplate

Triconex 4850


HART Field Power (PS1) +

1

Field Power (PS2) +

32 To Spare

250 7 In +

30V zener

Mux 1

In – 250 7

32 100 7 .01% Mux


Figure 25

To Other Points

1 32

3351S2 AI Module and 2354AS2 AI HART Hazardous Location Baseplate Schematic



Typical Field Connections

PWR GND

TDA (–)

TDB (+)

This figure depicts typical field connections for the Model 2354S2 AI HART Baseplate and the Model 2354AS2 AI HART Hazardous Location Baseplate. RS232/RS485 Converter

24V DC

+24 V #1

~

+24 V #2

~

24 V Return

or

* To other HART Baseplates or terminated with 100W resistor

S

~

Shield

~

Safety

SHLD

TA

TB

SHLD

TA

~

TB

J22 J18

J27


1 2

~ ~~ ~

3 4 5 6 7 8

PWR FAULT HOST HART

9

~ ~~ ~

4-20 mA HART Transmitter

10 11 12 13 14 15 16

17 18

4850 TRICONEX

19 20 21 22 23 24 25

S

26 27 28 29 30

F

31 32 J19

~ ~~ ~ ~ HART AI Baseplate * For RS485 communication wiring, use twisted-shielded conductors run in metal conduit.

Figure 26

2354S2 and 2354AS2 AI HART Baseplate Typical Field Connections


72

Chapter 2

System Description

Analog Input/Digital Input Components These Analog Input/Digital Input components are available with Tri-GP v2.x systems. For installation procedures, see Component Installation on page 185. Model

Description

Current

Type

3361S2

Analog Input/Digital Input Module

4–20 mA

Commoned

2361S2

Analog Input/Digital Input Baseplate

Direct Termination

n/a

Analog Input/Digital Input Hazardous Location External Termination Baseplate


9793-610F

Analog Input/Digital Input Hazardous Location External Termination Panel Kit


The Analog Input/Digital Input (AI/DI) Module has 16 digital input points (points 1–16) and 16 analog input points (points 17–32). The AI/DI Module has three isolated sets of electronics, called channels, which independently process field data input to the module. Sensing of each input point is performed in a manner that prevents a single failure on one channel from affecting another channel. For analog input points, each channel receives variable voltage signals from each point, converts them to digital values, and transmits the values to the three MPs on demand. For digital input points, an ASIC on each channel scans each input point, compiles data, and transmits it to the MPs upon demand. For all points, the MPs vote the data before passing it to the control program. In TMR mode, the data passed is mid-value. In DUAL mode, the data passed is the average. AI/DI Modules sustain complete, ongoing diagnostics for each channel. If the diagnostics detect a failure on any channel, the Fault indicator turns on and activates the system alarm. The Fault indicator identifies a channel fault, not a complete module failure. AI/DI Modules are guaranteed to operate properly in the presence of a single fault and may continue to operate properly with multiple faults. AI/DI Modules include the hot-spare feature which allows online replacement of a faulty module. The AI/DI Module is mechanically keyed to prevent improper installation in a configured baseplate.



73

AI/DI Module 3361S2 This figure is a simplified schematic of the Model 3361S2 AI/DI Module. Analog Input/Digital Input Module Typical Point (1 of 32)

ADC

Isolation Filtering

Triplicated I/O Bus

ASIC


A

ASIC


B

ASIC


C

*


DAC

ADC

* DAC

ADC

* DAC

*On DI points only Figure 27

3361S2 AI/DI Module Simplified Schematic


74

Chapter 2

System Description

This table lists the specifications for the Model 3361S2 AI/DI Module. Table 17

3361S2 AI/DI Module Specifications

Features Common to all Points

Specification

Points

32, commoned

Functional earth to protective earth isolation

500 VDC, minimum

Functional earth to functional earth (logic) isolation

800 VDC, minimum

Features of AI Points

Specification

Nominal input current

4–20 mA DC

Specified operational current range

2–22 mA DC

Absolute maximum field voltage

33 VDC

Absolute maximum reverse field voltage

– 0.6 VDC

Absolute maximum input current

50 mA DC

Input bandwidth (3dB)

16 Hz

Source impedance

180 Ω

Input impedance (with baseplate)

250 Ω

I to V resistor

100 Ω ± 0.01%

Resolution

12 bits

Absolute error

0.15% of full scale (20 mA)

Diagnostic

Force-to-value diagnostic (FVD)

Scan time

< 1 ms for all 32 points

Features of DI Points

Specification


0–24 VDC


15–30 VDC


33 VDC


– 0.6 VDC

Input Delay

< 10 ms, On to Off, Off to On

Input impedance

> 100 kΩ without baseplate ~ 3 kΩ with baseplate

Input power

0.2 W/pt, @ 24 VDC 0.5 W/pt, @ 33 VDC

Input threshold

0–5 VDC = Off region 6–14 VDC = transition region 15–30 VDC = On region

Diagnostic (loss of view)

Force-to-value diagnostic (FVD), < 2 ms/test



Features of DI Points (continued)

Specification (continued)

Maximum input toggle rate to maintain diagnostic fault coverage

< 20/sec

75

FVD Off state glitch Duration Magnitude Output impedance

< 2 ms ≈ 36% test voltage 0–5 VDC, ≈ 100 kΩ

ADC scan time

< 1 ms for all DI points

AI/DI Baseplate This figure depicts a front view of the Model 2361S2 AI/DI Baseplate. The short circuit current specifications for field short-to-ground faults are: •

130 mA, typical

•

200 mA, maximum


76

Chapter 2

System Description

This figure is a simplified schematic of the Model 3361S2 AI/DI Module and Model 2361S2 AI/DI Baseplate. AI/DI Baseplate

32-Point AI/DI Module Mux 1


32 To Spare

180 7 + In –

*** Mux 1

* 32

**

*** Mux


To Other Points


1 32

*150 7 on AI points **100 7 on AI points 0 7 on DI points

Figure 28

3.01 k7 on DI points

***On DI points only

***

3361S2 AI/DI Module and 2361S2 AI/DI Baseplate Schematic



77

Typical Field Connections This figure depicts typical field connections for the Model 2361S2 AI/DI Baseplate. +24 V #1

~

+24 V #2

~

24 V Return

~

Shield

~

Safety

+

–

~

Field Contact +

1

~ ~

–

~ ~ Typical DI Point (1 of 16 DI Points Shown)

1

2

2

3

3

4

4

5

5

6

6

7

7

8

8

9

9

10

10

11

11

12

12

13

13

14

14

15

15

16

~ ~~ ~

16

4-20 mA Transmitter

17 17

~ ~~ ~

18 19 20 21 22

Typical AI Point (1 of 16 AI Points Shown)

23 24 25 26 27 28

S

29 30 31

18 19 20 21 22 23 24 25 26 27 28 29 30 31 32

32

F

~ ~~ ~ ~

Figure 29

–

+

6

2361S2 AI/DI Baseplate Typical Field Connections


78

Chapter 2

System Description

AI/DI External Termination Baseplate The AI/DI External Termination Baseplate is typically used with the Model 9793-610F External Termination Panel Kit. This panel contains ELCO connectors, which allows connection of External Termination Panels.



79

This figure is a simplified schematic of the Model 9793-610F ETP Kit and the Model 3361S2 AI/DI Module with the AI/DI External Termination Baseplate. ELCO CABLE

TERMINATION PANEL

BASEPLATE

32-POINT AI/DI MODULE

**

200–300 Ohms

Mux

3 kilohms

1

30 V Zener

32

*

3.3 V Zener

***

to other points

Mux

to spare

1

module

PS1

32

PS2 PS1

***

PS1 PS2

PS2

Mux

to modules

1 32

0 ohm

*** PS1 0 ohm

PS2

* 3.3 V zener on the AI ETP only—no 3.3 V zener on the DI ETP ** 1 00 ohm 0.01% resist or on AI points 17–3 2 3.01 kilohm 1 % resi stor on DI points 1–16 *** On DI point s onl y

Figure 30

3361S2 AI/DI Module and AI/DI External Termination Baseplate Schematic


80

Chapter 2

System Description

Typical Field Connections This figure depicts typical field connections for the AI/DI External Termination Baseplate. +24 V #1

~

+24 V #2

~

24 V Return

~

Shield

~

Safety

–

+

~

S F

~ ~~ ~ ~ Figure 31

6

AI/DI External Termination Baseplate Typical Field Connections



81

AI/DI Hazardous Location External Termination Panels To connect field wiring to the Model 3361S2 AI/DI Module in hazardous locations, you must use one DI Hazardous Location ETP—for points 1-16—and one AI Hazardous Location ETP— for points 17-32. Model 9793-610F is an ETP kit that includes one AI Hazardous Location ETP (Model 9792-310F) and one DI Hazardous Location ETP (Model 9573-610F). For more information on these ETPs, including specifications, simplified schematics, and field wiring diagrams, see: •

AI Hazardous Location External Termination Panel on page 65

•

DI Hazardous Location External Termination Panel on page 115

You must use two 16-point term panels for each 32-point AI/DI module. Each term panel comes with two sets of labels: 1-16 and 17-32. For information on how to apply the labels, see Appendix F, Panel Labels.


82

Chapter 2

System Description

Analog Output Components These Analog Output components are available with Tri-GP v2.x systems. For installation procedures, see Component Installation on page 185. Model

Description

Current

Type

3481S2


4 @ 4–20 mA

Commoned

3482S2

High-Current Analog Output Module

2 @ 4–20 mA, 2 @ 4–40 mA

Commoned, High Current

2481S2

Analog Output Baseplate

Direct Termination

n/a

Analog Output External Termination Baseplate


9863-610F

Analog Output Hazardous Location External Termination Panel


2483S2

Analog Output HART Baseplate

Direct Termination

2483AS2

Analog Output HART Hazardous Location Baseplate

Direct Termination

Note

When ordering the 9863-610F ETP, you can order longer interface cables, in increments of 10 feet, by changing the last two digits of the ETP model number from “10” to the desired length of the cable. The maximum length for interface cables is normally 100 feet. Contact the Invensys Global Customer Support (GCS) center if you require cables longer than 100 feet.

Analog Output (AO) Modules contain the circuitry for three identical, isolated channels. Each channel includes a proprietary ASIC that receives its output table from the I/O communication processor on its corresponding main processor. The AO Modules use special shunt circuitry to vote on the individual output signals before they are applied to the load. This voter circuitry insures only one output, A or B or C, is driving the field load. The shunt output circuitry provides multiple redundancy for all critical signal paths, guaranteeing safety and maximum availability. AO Modules continuously execute forced-switch diagnostics (FSD) on each point. By carefully forcing error conditions and observing proper behavior of the voting circuitry, high reliability and safe operation is insured. This safety feature allows unrestricted operation under a variety of multiple-fault scenarios. AO Modules support hot sparing for online replacement of a faulty module or continuous backup to an active module. The AO Modules are mechanically keyed to prevent improper installation in a configured baseplate.



83

AO Module 3481S2 This figure is a simplified schematic of the Model 3481S2 AO Module. Triplicated I/O Bus

A

I/O Controller(s)


ASIC

Field Circuitry Typical Point (4)

Selector Logic

DAC Voltage Loopback Current Loopback

B


ASIC

Selector Logic

DAC

Voltage Loopback Current Loopback

C


ASIC

Output Termination

Selector Logic


Figure 32

3481S2 AO Module Simplified Schematic


84

Chapter 2

System Description

This table lists specifications for the Model 3481S2 AO Module. Table 18

3481S2 AO Module Specifications

Feature

Specification

Points

4, commoned-return, DC-coupled

Output current range

4–20 mA output, controlled 0–22 mA over-range 0 mA output capability (step function <2 mA)

Output accuracy

<0.25% (in range of 4–20 mA) of FSR (0–22 mA), from 32° F to 158° F (0° C to 70° C)

Type

TMR

Resolution

12 bits

Diagnostic

Forced-switch diagnostic (FSD)

External loop power (reverse voltage-protected)

32 VDC, maximum 24 VDC, nominal

with 2483AS2 Hazardous Location Baseplate

30 VDC, maximum

Output loop power requirements for specified load

300 Ω @ >16 VDC (1 A minimum) 500 Ω @ >20 VDC (1 A minimum) 700 Ω @ >24 VDC (1 A minimum) 800 Ω @ >28 VDC (1 A minimum)

Over-range protection

36 VDC, continuous 0 VDC, continuous

Switch time on leg failure

1 ms, typical 3 ms, maximum

Functional-to-protective-earth isolation

500 VDC, minimum

with 2483AS2 Hazardous Location Baseplate Functional-to-functional-earth (logic) isolation

0 VDC 800 VDC, minimum



85

AO Module 3482S2 This figure is a simplified schematic of the Model 3482S2 High-Current AO Module. Triplicated I/O Bus

A

I/O Controller(s)


µProc A


Selector Logic


B


µProc B

Selector Logic

DAC

Voltage Loopback Current Loopback

C


µProc C

Output Termination

Selector Logic


Figure 33

3482S2 High-Current AO Module Simplified Schematic


86

Chapter 2

System Description

This table lists specifications for the Model 3482S2 High-Current AO Module. Table 19

3482S2 High-Current AO Module Specifications

Feature

Specification

Points

4, commoned-return, DC-coupled

Output current range, Points 1–2


Output accuracy, Points 1–2

<0.25% (in range of 4–20 mA) of FSR (0–22 mA), from 32° F to 158° F (0° C to +70°C°)

Output current range, Points 3–4


Output accuracy, Points 3–4

<0.25% (in range of 4–40 mA) of FSR (0–44 mA), from 32° F to 122° F (0° C to 50°C)

Type

TMR

Resolution

12 bits

Diagnostic

Forced-switch diagnostic (FSD)

External loop power (reverse voltage protected)

32 VDC, maximum 24 VDC, nominal

Output loop power requirements for specified load, Points 1–2


Over-range protection, Points 1–2

36 VDC, continuous 0 VDC, continuous

Output loop power requirements for specified load, Points 3–4


Over-range protection

36 VDC, continuous with thermal de-rating 0 VDC, continuous

Switch time on leg failure

1 ms, typical 3 ms, maximum


500 VDC, minimum


800 VDC, minimum



87

AO Baseplate This figure depicts a front view of the Model 2481S2 AO Baseplate.


88

Chapter 2

System Description

This figure is a simplified schematic of the Model 3481S2 or Model 3482S2 AO Module and Model 2481S2 AO Baseplate. 4-Point AO Module

AO Baseplate

Loop Power


A Selector Logic DAC

To Other Points

Load +

B Selector Logic DAC

C Selector Logic

Load – Field Power (PS1) – Field Power (PS2) –

DAC

Figure 34

3481S2 or 3482S2 AO Module and 2481S2 AO Baseplate Schematic



89

Typical Field Connections This figure depicts typical field connections for the Model 2481S2 AO Baseplate. +24 V #1

~

+24 V #2

~

RTN

~

Safety

~

+ –

Unused Output Jumper *

1

1


2

2

3

3

~ ~

4

5

5

6

6

Field Load

7

7

8

8

~ ~

9 10 11 12 13 14 15 16

–

**

4

9 10 11 12 13 14 15 16

+

F

2

~~~~ * Short unused outputs ** Use points 1 through 4 to wire field devices to the baseplate

Figure 35

2481S2 AO Baseplate Typical Field Connections


90

Chapter 2

System Description

AO External Termination Baseplate The AO External Termination Baseplate is used with the Model 9863-610F AO Hazardous Location ETP. The baseplate contains ELCO connectors, which allows connection of External Termination Panels. This figure depicts a front view of the Analog Output External Termination Baseplate, which is available for use with all Tri-GP systems.

2



91

This figure is a simplified schematic of the Model 3481S2 AO Module and the AO External Termination Baseplate. 4-Point AO Module

AO External Termination Baseplate

Loop Power Field Power (PS1) Field Power (PS2)

A Selector Logic V+ DAC

B Selector Logic

To External Termination Panel

DAC

C Selector Logic DAC

Figure 36

Field Power (PS1) Field Power (PS2)

3481S2 AO Module and AO External Termination Baseplate Schematic


92

Chapter 2

System Description

Typical Field Connections This figure depicts typical field connections for the AO External Termination Baseplate. +24 V #1

~

+24 V #2

~

24 V Return

~

Shield

~

Safety

–

+

~

S F

~ ~~ ~ ~ Figure 37

6

AO External Termination Baseplate Typical Field Connections



93

AO HART Baseplates The Model 2483S2 AO HART Baseplate and the Model 2483AS2 AO HART Hazardous Location Baseplate are used with Model 3481S2 AO Modules. The Triconex 4850 HART Multiplexer mounts directly onto the Model 2483S2 and 2483AS2 baseplates (the Multiplexer is supplied in the Model 5483S2 and 5483AS2 TriPaks). The Model 2483AS2 AO HART Hazardous Location Baseplate should be used in hazardous locations.

CAUTION

The Model 2483S2 AO HART Baseplate and the Model 2483AS2 AO HART Hazardous Location Baseplate can be used only with Model 3481S2 AO modules. Using it with other modules will destroy some of the baseplate components.

For more information, see Appendix C, HART Communication and the Triconex 4850 HART Multiplexer Instruction Manual.


94

Chapter 2

System Description

This figure is a simplified schematic of the Model 3481S2 AO module and the Model 2483S2 AO HART Baseplate with the Triconex 4850 HART Multiplexer. 4-Point AO Module

AO HART Baseplate Triconex 4850 HART To RS232-to-RS485 Converter Connection

Loop Power RS485

A

PWR

Selector Logic

Address

To Address Plug Connection

Field Power (PS1) +

DAC

Field Power (PS2) + B Selector Logic

To Other Points Load +

DAC HART Filter

C Selector Logic

Load – Field Power (PS1) –

DAC


Figure 38

3481S2 AO Module and 2483S2 AO HART Baseplate Schematic

This figure is a simplified schematic of the Model 3481S2 AO module and the Model 2483AS2 AO HART Hazardous Location Baseplate with the Triconex 4850 HART Multiplexer. 4-Point AO Module

AO HART Hazardous Location Baseplate Triconex 4850

Safe Area

HART To RS232-to-RS485 Converter Connection

Loop Power RS485

A

PWR

Selector Logic

Address

To Address Plug Connection

Field Power (PS1) +

DAC

30V zener

Field Power (PS2) +

B Selector Logic

Safe Area Hazardous Area

To Other Points Load +

DAC

IS Isolator

HART Filter

C Selector Logic

Load

Load – Field Power (PS1) –

DAC


Figure 39

3481S2 AO Module and 2483AS2 AO HART Hazardous Location Baseplate Schematic



95


PWR GND

TDA (–)

TDB (+)

This figure depicts typical field connections for the Model 2483S2 AO HART Baseplate.

24V DC

+24 V #1

~

+24 V #2

~

RTN

or

*** To other HART Baseplates or terminated with 100W resistor

S

~

Safety

~


SHLD

TA

TA

TB

~

TB

J22 SHLD

Shield

RS232/RS485 Converter

J18

J27

~ ~

1 2

*

3 4

~ ~

Field Load

5 6

PWR

7

HOST

8

HART

FAULT

9

Unused Output Jumper **

10 11 12 13 14 15 16

4850 TRICONEX

S

F J19

~~~~ ~ HART AO Baseplate * Use points 1 through 4 to wire field devices to the baseplate ** On points 1 through 4, short any unused outputs *** For RS485 communication wiring, use twisted-shielded conductors run in metal conduit

Figure 40

2483S2 AO HART Baseplate Typical Field Connections


96

Chapter 2

System Description

PWR GND

TDA (–)

TDB (+)

This figure depicts typical field connections for the Model 2483AS2 AO HART Hazardous Location Baseplate.

24V DC

+24 V #1

~

+24 V #2

~

RTN

*** To other HART Baseplates or terminated with 100W resistor

or S

~

Safety

~


SHLD

TA

TA

TB

~

TB

J22 SHLD

Shield

RS232/RS485 Converter

J18

J27

~ ~

1 2

*

3 4

~ ~

Field Load

5 6

PWR

7

HOST

8

HART

FAULT

9

Unused Output Jumper **

10 11 12 13 14 15 16

4850 TRICONEX

Intrinsic Safety (IS) Isolators **** S

MTL CPS04 Backplane F J19

Safe Area

~~~~ ~

Hazardous Area

HART AO Baseplate * Use points 1 through 4 to wire field devices to the baseplate ** On points 1 through 4, short any unused outputs *** For RS485 communication wiring, use twisted-shielded conductors run in metal conduit **** For ATEX compliance, IS isolators must be used. Triconex tested ATEX compliance using MTL4546 Isolators.

Figure 41

2483AS2 AO HART Hazardous Location Baseplate Typical Field Connections



97

AO Hazardous Location External Termination Panel The Model 9863-610F ETP is suitable for use in Zone 2, and Class 1, Division 2 field circuits. The ETP contains extra circuitry designed to limit power available to the field terminals. The circuits have been examined and certified by TÜV Rhineland as being nonincendive. This guarantees that if the field wires are accidentally opened, shorted, or grounded, and the Tri-GP is operating normally, the wiring and attached devices will not release sufficient energy to cause ignition in the specified flammable atmosphere. The Model 9863-610F ETP is compatible with the Model 3481S2 Analog Output Module. Each ETP has: •

Two, eight-position field terminals; support for eight points (only four points supported on the 3481S2 Module)

•

Two terminals per point: Out, Rtn (L+, L–)

•

A four-position terminal for redundant 24 VDC loop power

•

Two, one-position terminals for protective earth connection

The panel supports redundant 24 VDC power sources with diode ORing. However, recommended field power connections are on the AO External Termination Baseplate and routed to the ETP through the interface cable with ELCO connectors. Field energy will not be limited if it is connected to the ETP; it will be limited only if it is connected to the baseplate. Dimensions for Term Panel 9863-610F Width (across DIN rail)



4.42 in (11.23 cm)

5.02 in (12.75 cm)

4.25 in (10.795 cm)



Feature

Description

Panel type

Hazardous location, current output

Points

8


98

Chapter 2

System Description



Feature

IEC Symbol

ISA Symbol



Tamb

Tamb

32° F to 140° F (0° C to 60° C)

Working voltage

Uw

Uw

30 V

Maximum voltage

Um

Um

32 V



Uo

Voc

32 V


Io

Isc

0.250 A


Po

Po

1.72 W

C external, maximum

Co

Ca

1.18 µF

L external, maximum

Lo

La

4.95 mH



99

Simplified Schematic This figure is a simplified schematic of the Model 9863-610F ETP and the Model3481S2 AO Module with an AO External Termination Baseplate. 4-POINT ANALOG OUTPUT MODULE

AO EXTERNAL TERMINATION BASEPLATE

ELCO CABLE

TERMINATION PANEL

Loop power A

0 ohm

PS1 +

Selector Logic Current loopback

to module

0 ohm

PS2 +

DAC PS1 –

B

Selector Logic

PS2 –

Current loopback

DAC

ATEX Filter

OUT2 Typical point

C

RTN2

Selector Logic Current loopback

DAC

Figure 42

Simplified Schematic of a 9863-610F Panel and a 3481S2 AO Module with an AO External Termination Baseplate


100

Chapter 2

System Description

Typical Connections

C17 L12

SN

C15

C14

REV D

L11 L5

C12

L4

C10

C5

C3

C2

L3

L1

TRICONEX

L15

L13

L14

L9

L10

L7

L8

C35

TB8

R1

TB1—TB4

R2

C44

C43

C42

C41

C40

C39

TB7

C38

C37

!

L2

J1

C19

C22

C7

C24

L17

C20

L18

C8

EXT TERM 7400270

This figure illustrates how to connect a 9863-610F to the field (1 of 4 module points shown).

J4

C25

C27 C45

L-

P1

J5

P2

Typical unused point

Typical point (1 of 8 points shown)

Note: Field power is routed from the baseplate. Do not connect field power to the ETP.

Load

Energy limited

Figure 43

Field Wiring for 9863-610F with a 3481S2 AO Module

CAUTION Note

Not energy limited

• Unused points must be shorted together. • For more information about installing the Tri-GP in hazardous locations, see Application-Specific Installation Guidelines on page 182.

The Model 3481S2 AO Module has only four outputs, so points 5 through 8 on the ETP are not connected and are not required to be shorted together.


Digital Input Components

101

Digital Input Components These Digital Input components are available with Tri-GP v2.x systems. For installation procedures, see Component Installation on page 185. Model

Description

Voltage

Type

3301S2


24 VDC

Commoned

3311S2


24 VDC

Commoned

2301S2

Digital Input Baseplate

Direct Termination

n/a

Digital Input External Termination Baseplate


2302S2

High-Voltage DI Baseplate Kit, includes: Digital Input External Termination Baseplate, two Solid State Relay Input External Termination Panels, two 10-foot Interface Cables

9573-610F

Digital Input Hazardous Location External Termination Panel

Note

115 VAC

External Termination, Interposing Relays


When ordering the High-Voltage DI Baseplate Kit, you can order interface cables in increments of 10 feet by specifying part number 4000195-3xx, where xx equals the length in feet. When ordering the 9573-610F ETP, you can order interface cables in increments of 10 feet by changing 9573-610F to 9573-6xx, where xx equals the length in feet. The maximum length for interface cables is normally 100 feet. Contact the Invensys Global Customer Support (GCS) center if you require cables longer than 100 feet.

Digital Input (DI) Modules have three independent channels which process all data sent to the module. An ASIC on each channel scans each input point, compiles data, and transmits it to the MPs upon demand. Input data is voted at the MPs before processing to ensure the highest integrity. DI Modules sustain complete, ongoing diagnostics for each channel. If the diagnostics detect a failure on any channel, the Fault indicator is activated, which in turn activates the system alarm. The Fault indicator points to a channel fault, not a complete module failure. The DI Module is guaranteed to operate properly in the presence of a single fault and may continue to operate properly with certain multiple faults. DI Modules continuously verify the ability of the system to detect transitions to the opposite state. The DI Module supports hot sparing for online replacement of a faulty module or continuous back-up to an active module. The DI Module is mechanically keyed to prevent improper installation in a baseplate.


102

Chapter 2

System Description

DI Module 3301S2 This figure is a simplified schematic of the Model 3301S2 DI Module. Triplicated I/O Bus

Digital Input Module Typical Point (1 of 32)

ADC

ASIC


A

ASIC


B

ASIC


C

Isolation Filtering


DAC

ADC

DAC

ADC

DAC

Figure 44

3301S2 DI Module Simplified Schematic



103

This table lists the specifications for the Model 3301S2 DI Module. Table 22

3301S2 DI Module Specifications

Feature

Specification

Points

32, commoned


24 VDC


19.2–30 VDC


33 VDC


–0.6 VDC

Input delay

ON to OFF or OFF to ON Time constant = 2.86 msec, - 3dB @ 55hz

Input impedance

>30 kΩ without baseplate ≈3 kΩ with baseplate

Input power

0.2 W/pt, @ 24 VDC 0.5 W/pt, @ 33 VDC

Input threshold



Force-to-value diagnostic (FVD), <2 ms/test


<20/sec

FVD Off-state glitch Duration

<2 ms

Magnitude

≈36% test voltage

Output Impedance

0–5 VDC, ≈100 kΩ

ADC scan time



500 VDC, minimum


800 VDC, minimum


104

Chapter 2

System Description

DI Module 3311S2 This figure is a simplified schematic of the Model 3311S2 DI Module. Triplicated I/O Bus

Digital Input Module Typical Point (1 of 32)

ADC

ASIC


A

ASIC


B

ASIC


C

Isolation Filtering


DAC

ADC

DAC

ADC

DAC

Figure 45

3311S2 DI Module Simplified Schematic



105

This table lists the specifications for the Model 3311S2 DI Module. Table 23

3311S2 DI Module Specifications

Feature

Specification

Points

32, commoned


24 VDC


19.2–30 VDC


33 VDC


–0.6 VDC

Input delay

ON to OFF or OFF to ON Time constant = 0.13 msec, –3 dB @ 1.2 kHz

Input impedance

>30 kΩ without baseplate ≈3 kΩ with baseplate

Input power

0.2 W/pt, @ 24 VDC 0.5 W/pt, @ 33 VDC

Input threshold



Force-to-value diagnostic (FVD), <2 ms/test Force-to-trigger diagnostic (FTD), <2 ms/test


<20/sec

FVD and FTD Off-state glitch Duration

<2 ms

Magnitude

≈36% test voltage

Output Impedance

0–5 VDC, ≈100 kΩ

ADC scan time



500 VDC, minimum


800 VDC, minimum

The Model 3311S2 DI Module reports Sequence of Events (SOE) with a resolution of one millisecond or less and with an accuracy of one millisecond or less. These are key terms used to describe the operation of the Model 3311S2 DI Module: •

Transition—a transition is defined as a point entering the user-defined trip state (SOE Trigger State) for the minimum amount of user-specified time (SOE Trigger Time), with an accuracy of –0/+1 milliseconds.


106

Chapter 2

System Description

•

Trip state—the trip state is a user-defined property (SOE Trigger State) in TriStation 1131 software that determines if the SOE function is enabled for a point and specifies the state of transitions (Rising, Falling, Rising/Falling) to be reported.

•

Trigger time—the trigger time is a user-defined property (SOE Trigger Time) in TriStation 1131 software that specifies the number of milliseconds that a signal must be stable before its change in state (transition) causes the reporting of an event. This is also known as the debounce period. A longer trigger time results in a longer debounce period, so that pulse widths that fall within the debounce period will not be reported as an event.

•

Dead time interval—the dead time interval is a user-defined property (SOE Dead Time) in TriStation 1131 software that specifies the length of time (in seconds) that must elapse after a transition, before a subsequent transition will be reported. A longer dead time interval is better able to prevent the higher-level SOE application from being flooded with events, but it also means there is a greater chance of losing subsequent transition events.

•

Unreported events—unreported events are events that have been captured and are being processed before being reported to the SOE function block in the control program.

It can take up to three minutes for the Model 3311S2 DI Module to reach the Pass State upon initial power up, which is indicated by a steady green Pass status indicator on the front panel of the module. When an event is triggered on a point, the amount of time before a subsequent event can be captured on the same point is affected by the number of unreported events in the system and the number of unreported events on the module. This formula identifies the typical amount of time before a subsequent event can be captured on the same point. However, in the presence of certain diagnostics, the worst case time will be 20 seconds or the calculated time, whichever is greater. The calculated time does not exceed 20 seconds until there are 154 unreported events in the system with 32 unreported events on the individual module. Time = (0.11 × T) + (0.091 × P) + 0.23 seconds T = total number of unreported events in the system. The maximum number of T is the total number of SOE-enabled points in the system. The maximum number of T is reached only if all SOE-enabled points in the system are triggered at the same time. P = unreported events on the individual module. The maximum number of P is the total number of SOE-enabled points on the module. The maximum number of P is reached only if all SOE-enabled points on the module are triggered at the same time. Additional performance characteristics of the Model 3311S2 DI Module: •

The module may miss transitions after the SOE function block in the control program starts, for a period of time up to the amount of the dead time interval.

•

After the module captures a transition for an input point, a subsequent transition for that point is reported only after the user-configured dead time interval (SOE Dead Time) has elapsed.



107

•

When the trip state is set to detect both rising and falling transitions (SOE Trigger State = Rising/Falling), the trailing transition is reported only if the leading transition is reported, which means that if the point changed state but the leading change did not meet the minimum transition time—so it was not reported—the change back to the original state is not reported.

•

The module may miss transitions during a change from TMR mode to DUAL mode, or a change from DUAL mode to TMR mode. The module may not report events in correct sequence if the events happen at the same time the module changes from TMR mode to DUAL mode, when the mode change is caused by certain fault conditions.

•

In DUAL mode, the accuracy of the trigger time can be ± 1 millisecond if the runtime diagnostics are running during the transition.

DI Baseplate This figure depicts a front view of the Model 2301S2 DI Baseplate. The short circuit current specifications for field short-to-ground faults are: •

130 mA, typical

•

200 mA, maximum


108

Chapter 2

System Description

This figure is a simplified schematic of the Model 3301S2 or 3311S2 DI Module and 2301S2 DI Baseplate. DI Baseplate

32-Point DI Module Mux 1


32 To Spare

180 Ω + In

Mux 1

–

32

3K

Mux


To Other Points

1 32

Figure 46

3301S2 or 3311S2 DI Module and 2301S2 DI Baseplate Schematic



109

Typical Field Connections This figure depicts typical field connections for the Model 2301S2 DI Baseplate. +24 V #1

~

+24 V #2

~

RTN

~

Safety

+

~

–

1

Field Contact

~ ~

+

~ ~

–


1

2

2

3

3

4

4

5

5

6

6

7

7

8

8

9

9

10

10

11

11

12

12

13

13

14

14

15

15

16

16

17 18 19 20 21 22 23 24 25 26 27 28

F

29 30 31 32

~ ~~ ~ Figure 47

–

17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32

+

0

2301S2 DI Baseplate Typical Field Connections

DI External Termination Baseplate The DI External Termination Baseplate is used with the Solid State Relay (SSR) Input External Termination Panel (ETP) or the Model 9573-610F DI Hazardous Location ETP. The baseplate contains ELCO connectors, which allows connection of External Termination Panels.


110

Chapter 2

System Description

This figure depicts a front view of the DI External Termination Baseplate, which is available for use with all Tri-GP systems.

This figure is a simplified schematic of the Model 3301S2 or 3311S2 DI Module and DI External Termination Baseplate. DI Baseplate

32-Point DI Module Mux 1


32 To Spare

External Termination Panels

Mux 1 32

Mux


1 32

Figure 48

3301S2 or 3311S2 DI Module and DI External Termination Baseplate Schematic



111

Typical Field Connections This figure depicts typical field connections for the DI External Termination Baseplate. +24 V #1

~

+24 V #2

~

24 V Return

~

Shield

~

Safety

–

+

~

S F

~ ~~ ~ ~ Figure 49

6

DI External Termination Baseplate Typical Field Connections


112

Chapter 2

System Description

Solid State Relay Input External Termination Panel The Solid State Relay (SSR) Input External Termination Panel (ETP) is compatible with industry-standard solid state relays which can be cabled to the DI External Termination Baseplate. The solid state relays are manufactured by OMRON™. The SSR Input ETP supports 16 points and each DI Module can support up to two SSR Input ETPs. The SSR Input ETP has a barrier strip with four compression screw terminals per point for connecting a DI Module to 16 digital inputs. The SSR Input ETP accepts power (+24 VDC) from the DI Baseplate. The 24-volt power source connected to the baseplate must be able to provide 0.5 amps minimally. You must use two 16-point term panels for each 32-point DI module. Each term panel comes with two sets of labels: 1-16 and 17-32. For information on how to apply the labels, see Appendix F, Panel Labels. This figure depicts a front view of the SSR Input ETP. J1

DSP5

R4

CR4

R5

CR5

DSP6

DSP9

R9

CR7

CR9

NON-COM DI RELAY ETP

CR10

DSP10

DSP11

R10

R11

CR11

DSP12

R12

CR12

CR13

BOTTOM VIEW LOAD:0.1A 5–24VDC INPUT:100–240VAC~

AC

G3R-IAZR1SN

BOTTOM VIEW

OMRON

IN

F15

IN

F16

DSP14

R13

MADE IN JAPAN

LOAD:0.1A 5–24VDC INPUT:100–240VAC~

AC

G3R-IAZR1SN

BOTTOM VIEW

IN

F14 DSP13

K16

MADE IN JAPAN OMRON

AC


IN

F13

K15

G3R-IAZR1SN

BOTTOM VIEW

MADE IN JAPAN OMRON

AC


IN

F12

K14

G3R-IAZR1SN

BOTTOM VIEW

MADE IN JAPAN OMRON

AC


IN

F11

K13

G3R-IAZR1SN

BOTTOM VIEW

MADE IN JAPAN OMRON

AC


IN

F10

K12

G3R-IAZR1SN

OMRON


MADE IN JAPAN

K11

G3R-IAZR1SN

BOTTOM VIEW

OMRON AC

R8

7400256–

PWR

MADE IN JAPAN

MADE IN JAPAN

DSP8

CR8

Figure 50

IN

F9

R7

CR6


AC

K10

G3R-IAZR1SN

OMRON

BOTTOM VIEW

IN

F8 DSP7

R6


AC

F7

K9

G3R-IAZR1SN

OMRON

BOTTOM VIEW

MADE IN JAPAN


IN

G3R-IAZR1SN

BOTTOM VIEW

OMRON

MADE IN JAPAN


AC

G3R-IAZR1SN

BOTTOM VIEW

OMRON

IN

F6

K8

DSP15

R14

CR14

REV B

SN

Solid State Relay Input External Termination Panel

Dimensions of the SSR Input ETP Width (across DIN rail)



4.23 in (10.74 cm)

12.54 in (31.85 cm)

4.25 in (10.795 cm)


DSP16

R15

CONTACT

DSP4

MADE IN JAPAN


AC

CONTACT

CR3

IN

F5

K7

PWR

R3

K6

G3R-IAZR1SN

OMRON

BOTTOM VIEW


AC

G3R-IAZR1SN

IN

F4 DSP3

MADE IN JAPAN

K5

MADE IN JAPAN OMRON AC

R2

CR1

CR2

IN

F3 DSP2

R1


AC

K4

G3R-IAZR1SN

BOTTOM VIEW

IN

F2 DSP1

MADE IN JAPAN OMRON

AC


IN

F1

K3

G3R-IAZR1SN

OMRON

BOTTOM VIEW

MADE IN JAPAN


AC

K2

G3R-IAZR1SN

OMRON

MADE IN JAPAN

K1

R16

CR15

CR16

PWR

AC Power Supply AC

DSP1

CR2

Figure 52 F2 IN AC

R1 DSP2

CR1 R2

CR3

F3 IN AC

DSP3 OMRON

F4

R3 DSP4

R4

CR4

Neutral IN AC

OMRON

F5 DSP5

R5

CR5

IN AC

F6 IN AC

DSP6

R6

CR6 F7 IN AC

DSP7 OMRON

R7

CR8

F8 IN AC

DSP8

R8

CR7


7400256–

SN F9 IN AC

DSP9

R9

CR9

CR10 F10 IN AC

DSP10 OMRON

R10

CR11

F11 IN AC

DSP11

R11 OMRON

F12 IN AC

DSP12

R12

CR12 OMRON

F13 IN AC

DSP13

R13

CR13 OMRON

F14 IN AC

F15 IN AC

DSP14

R14 DSP15

CR14


OMRON

BOTTOM VIEW

BOTTOM VIEW

MADE IN JAPAN

K15

G3R-IAZR1SN


BOTTOM VIEW

MADE IN JAPAN

K14

G3R-IAZR1SN


BOTTOM VIEW

MADE IN JAPAN

K13

G3R-IAZR1SN


BOTTOM VIEW

MADE IN JAPAN

K12

G3R-IAZR1SN


BOTTOM VIEW

MADE IN JAPAN

K11

G3R-IAZR1SN


BOTTOM VIEW

MADE IN JAPAN

K10

G3R-IAZR1SN

OMRON

K9


BOTTOM VIEW

MADE IN JAPAN

1A

G3R-IAZR1SN

OMRON

MADE IN JAPAN

K8


BOTTOM VIEW

V+

G3R-IAZR1SN


BOTTOM VIEW

MADE IN JAPAN

K7

G3R-IAZR1SN

OMRON

K6


BOTTOM VIEW

MADE IN JAPAN

C+

G3R-IAZR1SN

OMRON

K5


BOTTOM VIEW

MADE IN JAPAN

V+ Other Points

G3R-IAZR1SN


BOTTOM VIEW

MADE IN JAPAN

K4

G3R-IAZR1SN


BOTTOM VIEW

MADE IN JAPAN

K3

G3R-IAZR1SN

OMRON

BOTTOM VIEW

MADE IN JAPAN

K2


G3R-IAZR1SN

OMRON

K1


BOTTOM VIEW

MADE IN JAPAN

Figure 51

Baseplate

CONTACT

IN

G3R-IAZR1SN

OMRON

MADE IN JAPAN

SSR Panel

PWR

F1

CONTACT

AC LOAD:0.1A 5–24VDC INPUT:100–240VAC~

G3R-IAZR1SN

OMRON

Digital Input Components 113

This figure depicts a simplified schematic of the Model 3301S2 or 3311S2 DI Module and the SSR Input ETP. 32-Point DI Module

1 Mux

P+ 32

To Spare

1 Mux

C– 32

P–

1 Mux

32

3301S2 or 3311S2 DI Module and SSR Input ETP Schematic

Typical Connections

This figure shows how to connect 115 VAC discrete inputs to the SSR Input ETP, which is used with the Model 3301S2 or 3311S2 DI Module and DI External Termination Baseplate. J1 K16

F16 IN

R15 DSP16

R16

CR15

REV B CR16

Hot

Typical point (1 of 16 points shown).

Field Contact

SSR Input ETP Typical Field Connections


114

Chapter 2

System Description

Input Ranges This table lists the input ranges for available SSR modules. SSRs must be ordered separately and are available from Invensys or directly from OMRON. For more information, contact the Invensys Global Customer Support (GCS) center. For detailed specifications, see the OMRON G3R-I/O data sheet. Table 24

Input Ranges for Solid State Relay (SSR) Modules

Description

Part Number

Input Range

Must Operate Voltage

Must Release Voltage

Output Range

Solid-State Relay Input Module

1300447-001 (G3R-IAZR1SN)

100 to 240 VAC

60 VAC max.

20 VAC min.

4 to 32 VDC

The OMRON family of input relays are limited to an ambient humidity range of 45% to 85%, all other Tri-GP environmental and EMC specifications remain unchanged.

CAUTION

Pin-Out Information This table lists pin-out information for the SSR Input ETP. Table 25

Pin-Out Information for the SSR Input ETP

Left Power Terminal

Right Contact Terminal

Point 1

Point 2

Point 3

Point 4

Point 5

Point 6

Point 7

Point 8

P+

C+

1

3

5

7

9

11

13

15

P–

C–

2

4

6

8

10

12

14

16

Right Power Terminal

Right Contact Terminal

Point 9

Point 10

Point 11

Point 12

Point 13

Point 14

Point 15

Point 16

P+

C+

1

3

5

7

9

11

13

15

P–

C–

2

4

6

8

10

12

14

16



115

DI Hazardous Location External Termination Panel The Model 9573-610F ETP is suitable for use in Zone 2, and Class 1, Division 2 field circuits. The ETP contains extra circuitry designed to limit power available to the field terminals. The circuits have been examined and certified by TÜV Rhineland as being nonincendive. This guarantees that if the field wires are accidentally opened, shorted, or grounded, and the Tri-GP is operating normally, the wiring and attached devices will not release sufficient energy to cause ignition in the specified flammable atmosphere. Termination panel 9573-610F is compatible with Model 3301S2 and Model 3311S2 24 VDC Digital Input Modules. Each panel has: •

Two, sixteen-position field terminals; support for sixteen points

•

Two terminals per point, for dry contact (F+, F–)

•


•


Each positive terminal is current-limited with a 200-to-300-ohm positive temperature coefficient (PTC) resistor. The panel supports redundant 24 VDC power sources with diode ORing. However, recommended field power connections are on the DI External Termination Baseplate and routed to the ETP through the interface cable with ELCO connectors. Field energy will not be limited if it is connected to the ETP; it will be limited only if it is connected to the baseplate. You must use two 16-point term panels for each 32-point DI module. Each term panel comes with two sets of labels: 1-16 and 17-32. For information on how to apply the labels, see Appendix F, Panel Labels. Dimensions for Term Panel 9573-610F Width (across DIN rail)



4.42 in (11.23 cm)

5.02 in (12.75 cm)

4.25 in (10.795 cm)



Feature

Description

Panel type

Hazardous location, commoned 24 V

Points

16


116

Chapter 2

System Description



Feature

IEC Symbol

ISA Symbol



Tamb

Tamb

32° F to 140° F (0° C to 60° C)

Working voltage

Uw

Uw

19 to 28 V

Maximum voltage

Um

Um

32 V


Ui

Vmax

32 V


Ii

Imax

0.962 µA

Maximum input power

Pi

Pi

0.03178 W

C internal, maximum

Ci

Ci

0.088 µF

L internal, maximum

Li

Li

43 µH

Input Connection (F–) Specifications



Uo

Voc

32 V


Io

Isc

0.160 A


Po

Po

1.347 W

C external, maximum

Co

Ca

1.18 µF

L external, maximum

Lo

La

4.95 mH



117

Simplified Schematic This figure is a simplified schematic of the Model 9573-610F ETP and the Model 3301S2 or 3311S2 DI Module with a DI External Termination Baseplate. ELCO CABLE

TERMINATION PANEL

BASEPLATE

200–300 Ohms

32-POINT DIGITAL INPUT MODULE

Mux

3 kilohms

1 32 30 V Zener

to other points

to spare

Mux 1

module

PS1

32

PS2 PS1 PS1 PS2

PS2

to modules

Mux 1 32

0 ohm PS1 0 ohm

Figure 53

PS2

Simplified Schematic of a 9573-610F Panel and a 3301S2 or 3311S2 DI Module with a DI External Termination Baseplate


118

Chapter 2

System Description

Typical Field Connections This figure illustrates how to connect a 9573-610F to the field (1 of 16 module points shown). TRICONEX

REV D

7400275

18

R25

SN

R5

R29

R4

R28

R3

R27

R2

TB1

R30

19 R 20 R 21 3 R 22 R 23

TB4

R7

! R

24

R31

R

WHEN ENERGIZED

R

9 R 10 11 12 13 14 15

R32

R8

R8

R

R7

R

R

R5

R

R4

R

R3

R

R2

R1

SN

TB1

EXT TERM

R

7400275

17

12 AWG, as short as possible

R1

EXT TERM "

J1 TB2 TB3 TB5

J2

J2

J3

J3

L-

P1

P2

L-

Second term panel Typical point (1 of 32 points shown) Note: Field power is routed from the baseplate through the Elco cable to the ETP. Do not connect field power to the ETP.

Field Contact

Energy limited

Figure 54

Not energy limited

Field Wiring for 9573-610F with a 3301S2 or 3311S2 DI Module

CAUTION



Digital Output Components

119

Digital Output Components These Digital Output components are available with Tri-GP v2 systems. For installation procedures, see Component Installation on page 185. Model

Description

Voltage

Type

3401S2


24 VDC

Commoned

3411S2

Digital Output Module, Supervised

24 VDC

Commoned

2401S2


Direct Termination

2401HS2


Direct Termination, High Current Capable

2401LS2


Direct Termination, Current Limited

n/a

Digital Output External Termination Baseplate


2402S2

High-Voltage DO Baseplate Kit, includes: Digital Output External Termination Baseplate, Relay Output External Termination Panel, and 10 ft Interface Cable

9671-610

Digital Output Hazardous Location External Termination Panel

Note

48 VDC, 120 VDC, 115 VAC, Dry Contact

External Termination, Interposing Relays


When ordering the High-Voltage DO Baseplate Kit, you can order interface cables in increments of 10 feet by specifying part number 4000196-3xx, where xx equals the length in feet. When ordering the 9671-610 ETP, you can order interface cables in increments of 10 feet by changing 9671-610 to 9671-6xx, where xx equals the length in feet. The maximum length for interface cables is normally 100 feet. Contact the Invensys Global Customer Support (GCS) center if you require cables longer than 100 feet.

Digital Output (DO) Modules contain the circuitry for three identical, isolated channels. Each channel includes a proprietary ASIC which receives its output table from the I/O Communication Processor on its corresponding Main Processor. DO Modules use the patented Quad Voter output circuitry to vote on the individual output signals just before they are applied to the load. This voter circuitry is based on parallel-series paths which pass power if the drivers for channels A and C, or channels B and D (D channel is a combination of A or C) command them to close; in other words, two out of three drivers are voted on. The quad output circuitry provides multiple redundancy for all critical signal paths, guaranteeing safety and maximum availability. DO Modules periodically execute an output voter diagnostic (OVD) routine on each point. This safety feature allows unrestricted operation under a variety of multiple-fault scenarios. OVD detects and provides alarms for the following: •

Points— all stuck-On and stuck-Off points are detected


120

Chapter 2

System Description

•

Switches—all stuck-On or stuck-Off switches or their associated drive circuitry are detected

During OVD execution, the commanded state of each point is momentarily reversed sequentially on one of the output drivers. Loop-back on the module allows each ASIC to read the output value for the point to determine whether a latent fault exists within the output circuit. The output signal transition is guaranteed to be less than two milliseconds and is transparent to most field devices. For devices that cannot tolerate a signal transition of any length, OVD can be disabled. DO Modules include the hot-spare feature which allows online replacement of a faulty module. DO Modules are mechanically keyed to prevent improper installation in a configured baseplate.

DO Module 3401S2 This figure is a simplified schematic of the Model 3401S2 DO Module, which is self-protected against over-voltage and over-current conditions. Triplicated I/O Bus

A

I/O Controller(s)


Field Circuitry Typical Point (16) A Output Switch Drive Circuitry

+V A

ASIC A or C Output Switch Drive Circuitry

B


ASIC

A or C

B Output Switch Drive Circuitry

C


ASIC

B

C

C Output Switch Drive Circuitry

Load A B C

Voltage Loopback Detector

To Other Points

Figure 55

3401S2 DO Module Simplified Schematic


Return


121

This table lists specifications for the Model 3401S2 DO Module. Table 28

3401S2 DO Module Specifications

Feature

Specification

Points

16, commoned

Nominal output voltage

24 VDC


19–30 VDC

Absolute maximum output voltage

33 VDC


–0.6 VDC

Output current Switching

<4.8 A, self-limiting; 3 A, typical

Carry

700 mA maximum, self limiting

Field alarms

Loss of field power, output point shorted On or Off

Loop-back thresholds


Leakage to load (Off-state)

<1 mA

Diagnostic glitch duration

<2 ms, maximum; 500 μs, typical

Diagnostic fault coverage Maximum toggle rate

>20 ms

Minimum toggle rate

Not applicable

On-state voltage drop

<1 VDC @ 1.5 A

Loop-back scan time



500 VDC, minimum


800 VDC, minimum


122

Chapter 2

System Description

DO Module 3411S2 This figure is a simplified schematic of the Model 3411S2 Supervised DO Module, which is selfprotected against over-voltage and over-current conditions.

I/O Controller(s)


Triplicated I/O Bus

A


A

Output Switch Drive Circuitry ASIC

Current Sense Circuitry A

A or C Output Switch Drive Circuitry


B

ASIC


ASIC

A or C

B Output Switch Drive Circuitry

C

+V

B

C

C Output Switch Drive Circuitry

Load A B C


Return

To Other Points

Figure 56

3411S2 Supervised DO Module Simplified Schematic

The Model 3411S2 DO Module is called “supervised” because fault detection includes potential field problems such as: •

Loss of power or blown fuse

•

Open or missing load

•

A field short resulting in the load being energized in error

•

A shorted load in the de-energized state

The module performs supervision of the field load health by using current measurement. Current that is less than the minimum load (minus accuracy error) causes an open-load field error and the load indicator to illuminate. The load indicator automatically clears once the field error condition is removed. Note that it can take up to three minutes for the Model 3411S2 DO Module to reach the Normal State, which is indicated by steady green Pass and Active status indicators on the front panel of the module.



123

This table lists specifications for the Model 3411S2 DO Module. Table 29

3411S2 DO Module Specifications

Feature

Specification

Points

16, commoned

Nominal output voltage

24 VDC


19.2–30 VDC

Absolute maximum output voltage

45 VDC


–0.6 VDC

Minimum required field load

30 mA

Output current Switching

<4.8 A, self-limiting; 3 A, typical

Carry

700 mA maximum, self limiting; (See Maximum Ambient Temperature for 3411S2 Module with 2401HS2 Baseplate on page 124 for extended carry current limits and conditions.)

Field alarms

Loss of field power, output point shorted On or Off, Open load

Loop-back thresholds


Leakage to load (Off-state)

<1 mA

Diagnostic glitch duration

<2 ms, maximum

Diagnostic fault coverage Maximum toggle rate

>20 ms

Minimum toggle rate

Not applicable

On-state voltage drop

<1.6 VDC @ 1.6 A

Loop-back scan time



500 VDC, minimum


800 VDC, minimum


124

Chapter 2

System Description

When using the Model 2401HS2 High-Current Baseplate with a Model 3411S2 DO Module, a higher 1.6 A carry current is possible. Be careful not to exceed the recommended maximum ambient temperatures, described in this table, as accuracy and component life will be degraded. Table 30

Maximum Ambient Temperature for 3411S2 Module with 2401HS2 Baseplate

Number of points @ 0.7 A

Number of points @ 1.6 A

Maximum Ambient Temperaturea

15

1

158° F (70° C)

14

2

158° F (70° C)

13

3

154.4° F (68° C)

12

4

150.8° F (66° C)

11

5

147.2° F (64° C)

10

6

143.6° F (62° C)

9

7

140° F (60° C)

8

8

138.2° F (59° C)

7

9

134.6° F (57° C)

6

10

131° F (55° C)

5

11

127.4° F (53° C)

4

12

123.8° F (51° C)

3

13

120.2° F (49° C)

2

14

116.6° F (47° C)

1

15

114.8° F (46° C)

0

16

111.2° F (44° C)

a. As measured at the bottom of the baseplate



125

DO Baseplate This figure depicts the front view of the Model 2401S2 DO Baseplate.


126

Chapter 2

System Description

This figure is a simplified schematic of the Model 3401S2 DO Module and Model 2401S2 DO Baseplate. DO Baseplate

16-Point DO Module

~

Field Power (PS1) Field Power (PS2) A or C A

To Other Points

C

Load + B

~ Load –

~ Figure 57



3401S2 DO Module and 2401S2 DO Baseplate Schematic



127

Typical Field Connections This figure depicts typical field connections for the Model 2401S2 DO Baseplate. +24V #1

~

+24V #2

~

RTN

~

Safety

~


1 1 2 3

~ ~

5 6 7 8

~ ~

Low Power Field Load

4

9 10 11 12 13 14 15

2 3 4 5 6 7 8 9 10 11 12 13 14 15 16

16

F

~~~~ Figure 58

2

2401S2 DO Baseplate Typical Field Connections


128

Chapter 2

System Description

DO High-Current Baseplate This figure depicts the front view of the Model 2401HS2 HighCurrent DO Baseplate, which is recommended for use with highcurrent power loads.



129

This figure is a simplified schematic of the Model 3411S2 DO Module and the Model 2401HS2 DO High-Current Baseplate. 16-Point DO Module

DO Baseplate

~ ~

Current Sense Circuitry*


A or C

A

To Other Points

C B

Load +

~ Load –

~



*Only on the 3411S2 module

Figure 59

3411S2 DO Module and 2401HS2 DO High-Current Baseplate Schematic


130

Chapter 2

System Description

Typical Field Connections This figure depicts typical field connections for the Model 2401HS2 DO High-Current Baseplate. +24V #1

~

+24V #2

~

RTN

~

Safety

~


1 1 2 3

~ ~

5 6 7 8

~ ~


4

9 10 11 12 13 14 15

2 3 4 5 6 7 8 9 10 11 12 13 14 15 16

16

F

~~~~ Figure 60

2

2401HS2 DO High-Current Baseplate Typical Field Connections



131

DO Low-Current Baseplate This figure depicts the front view of the Model 2401LS2 DO LowCurrent Baseplate, which is recommended for use only with low-current power loads.


132

Chapter 2

System Description

This figure is a simplified schematic of the Model 3401S2 DO Module and Model 2401LS2 DO Low-Current Baseplate. DO Baseplate

16-Point DO Module


A or C

To Other Points

A

180 Ω

C

Load +

B

Load – Voltage Loopback Detector

Figure 61


3401S2 DO Module and 2401LS2 DO Low-Current Baseplate Schematic



133

Typical Field Connections This figure depicts typical field connections for the Model 2401LS2 DO Low-Current Baseplate. +24V #1

~

+24V #2

~

RTN

~

Safety

~


1 1 2 3

~ ~

5 6 7 8

~ ~


4

9 10 11 12 13 14 15

2 3 4 5 6 7 8 9 10 11 12 13 14 15 16

16

F

~~~~ Figure 62

2

2401LS2 DO Low-Current Baseplate Typical Field Connections


134

Chapter 2

System Description

DO External Termination Baseplate The DO External Termination Baseplate is used with the Relay Output External Termination Panel (ETP) or the Model 9671-610 DO Hazardous Location ETP. The baseplate contains ELCO connectors, which allows connection of External Termination Panels. This figure depicts a front view of the Digital Output External Termination Baseplate, which is available for use with all Tri-GP systems.

2



135

This figure is a simplified schematic of the Model 3401S2 or 3411S2 DO Module and the DO External Termination Baseplate. 16-Point DO Module

DO External Termination Baseplate

~ ~

Current Sense Circuitry*

A


A or C

V+

B

To External Termination Panel

C

~ ~




Figure 63

3401S2 or 3411S2 DO Module and DO External Termination Baseplate Schematic


136

Chapter 2

System Description

Typical Field Connections This figure depicts typical field connections for the DO External Termination Baseplate. +24 V #1

~

+24 V #2

~

24 V Return

~

Shield

~

Safety

–

+

~

S F

~ ~~ ~ ~ Figure 64

6

DO External Termination Baseplate Typical Field Connections



137

Relay Output External Termination Panel The Relay Output External Termination Panel (ETP) includes industry-standard relays which can be cabled to the DO External Termination Baseplate. The interposing relays are manufactured by OMRON™. Each relay output contact is protected with a 2.5 A fast-acting fuse with a blown fuse indicator1 and a 200 V Transient Voltage suppressor. The Relay Output ETP supports 16 points and each DO Baseplate supports one Relay Output ETP. The Relay Output ETP has a barrier strip with four compression screw terminals per point for connecting a DO Module to 16 digital outputs. The Relay Output ETP accepts power (+24 VDC) from the DO Baseplate. The 24-volt power source connected to the baseplate must be able to provide 0.5 amps minimally. This figure depicts a front view of the Relay Output ETP. J1

OMRON

G3R-IAZR1SN LOAD:0.1A 5–24VDC INPU T:100–240 VAC~

MADE IN JA PAN

K16 F16

DSP15

R14

DSP16

R15

CR14

AC

LOAD

CR13

BOTTOM VIE W

K15 F15

DSP14

R13

MADE IN JA PAN

DSP13

BOTTOM VIE W

CR12

MADE IN JA PAN

AC

IN

AC

IN

AC

IN

REV B

R16

CR15

CR16

PWR

AC

IN

AC

IN

AC

IN

AC

IN

AC

IN

AC

IN

IN

AC

IN

LOAD


PWR

IN

AC

IN

AC

IN

AC

IN

AC

IN

OMRON

R12

BOTTOM VIE W

MADE IN JA PAN

DSP12

K14 F14

AC


K13 F13

OMRON

OMRON

BOTTOM VIE W

MADE IN JA PAN

BOTTOM VIE W

BOTTOM VIE W

MADE IN JA PAN

MADE IN JA PAN

R11

CR11



DSP11

R10

OMRON

OMRON

BOTTOM VIE W

K12 F12

CR9

CR8

Figure 65

MADE IN JA PAN

CR10

CR7

K11 F11

DSP10

R9



DSP9

R8

7400255–

K10 F10

OMRON

OMRON

BOTTOM VIE W

DSP8

R7

CR6

K9 F9

F8 DSP7

R6


MADE IN JA PAN

K8

F7 DSP6

OMRON

BOTTOM VIE W

CR5

MADE IN JA PAN

R5


DSP5

CR4

BOTTOM VIE W

K7

F6

R4

OMRON


BOTTOM VIE W

K6

F5

DSP4

MADE IN JA PAN

MADE IN JA PAN

K5

OMRON


BOTTOM VIE W

CR3

MADE IN JA PAN

R3

OMRON


CR2

OMRON

CR1

K4 F4

DSP3

R2

BOTTOM VIE W

K3 F3

DSP2

R1


BOTTOM VIE W

MADE IN JA PAN

MADE IN JA PAN

BOTTOM VIE W

MADE IN JA PAN

BOTTOM VIE W

K2 F2

DSP1

OMRON



OMRON

OMRON


K1 F1

SN

Relay Output External Termination Panel

Dimensions for Relay Output Term Panel

1.

Width (across DIN rail)



4.23 in (10.74 cm)

12.54 in (31.85 cm)

4.25 in (10.795 cm)

When using AC, the blown fuse indicator will blink when a blown fuse is detected.


138

Chapter 2

System Description

Table 31

General Specifications for Termination Panel 2402

Feature

Specification

Panel Type

Non-commoned interposing relay

Points

16

Contact Fuse Rating

2.5 A fast-acting

Max Applied Contact Voltage

200 VAC/VDC

WARNING

• This fuse must not be replaced with a larger value. • Continued output current in excess of 2.5 A will cause a loss of power due to the fuse opening. • Contact voltages above 200 V will cause a loss of power due to engagment of safety devices. If current is not limited, physical damage to the ETP will occur.

This figure depicts a simplified schematic of the Model 3401S2 DO Module and the Relay Output ETP. 16-Point DO Module

DO External Termination Panel Baseplate

Relay Output Termination Panel

~ ~

Current Sense Circuitry

Field Power (PS1+) Field Power (PS2+) OMRON

A or C

A

PWR + 2.5A

C LOAD +

B

~ ~ Figure 66


Field Power (PS1–)

LOAD –

Field Power (PS2–)

PWR –

3401S2 DO Module and Relay Output ETP Schematic


AC AC

IN

PWR

LOAD

AC

IN AC

IN

AC

IN AC

IN

AC

IN AC

IN

AC

IN AC

IN

AC

IN

AC

IN

AC

IN

AC

IN

AC

IN

AC

IN

LOAD

AC

IN

PWR

AC

LOAD

MADE IN JAPAN

BOTTOM VIEW

MADE IN JAPAN

BOTTOM VIEW

MADE IN JAPAN

BOTTOM VIEW

MADE IN JAPAN

BOTTOM VIEW

MADE IN JAPAN

BOTTOM VIEW

MADE IN JAPAN

BOTTOM VIEW

MADE IN JAPAN

BOTTOM VIEW

MADE IN JAPAN

PWR

OMRON


G3R-IAZR1SN

OMRON


G3R-IAZR1SN

OMRON


G3R-IAZR1SN

OMRON


G3R-IAZR1SN

OMRON


G3R-IAZR1SN

OMRON


G3R-IAZR1SN

OMRON


G3R-IAZR1SN

OMRON

BOTTOM VIEW

MADE IN JAPAN

BOTTOM VIEW

MADE IN JAPAN

AC

IN

AC

IN

BOTTOM VIEW

MADE IN JAPAN

AC

IN

AC

IN

BOTTOM VIEW

MADE IN JAPAN

AC

IN

AC

IN

BOTTOM VIEW

MADE IN JAPAN

AC

IN

AC

IN

BOTTOM VIEW

MADE IN JAPAN

AC

IN

AC

IN

BOTTOM VIEW

MADE IN JAPAN

AC

IN

AC

IN

BOTTOM VIEW

MADE IN JAPAN AC

IN

AC

IN

BOTTOM VIEW

CR16 LOAD

MADE IN JAPAN

BOTTOM VIEW

MADE IN JAPAN

BOTTOM VIEW

MADE IN JAPAN

BOTTOM VIEW

MADE IN JAPAN

BOTTOM VIEW

MADE IN JAPAN

BOTTOM VIEW

MADE IN JAPAN

BOTTOM VIEW

MADE IN JAPAN

BOTTOM VIEW

MADE IN JAPAN


G3R-IAZR1SN

OMRON


G3R-IAZR1SN

OMRON


G3R-IAZR1SN

OMRON


G3R-IAZR1SN

OMRON


G3R-IAZR1SN

OMRON


G3R-IAZR1SN

OMRON


G3R-IAZR1SN

OMRON


G3R-IAZR1SN

OMRON G3R-IAZR1SN


PWR

OMRON


G3R-IAZR1SN

OMRON


G3R-IAZR1SN

OMRON


G3R-IAZR1SN

OMRON


G3R-IAZR1SN

OMRON


G3R-IAZR1SN

OMRON


G3R-IAZR1SN

OMRON


BOTTOM VIEW

MADE IN JAPAN

BOTTOM VIEW

MADE IN JAPAN

BOTTOM VIEW

MADE IN JAPAN

BOTTOM VIEW

MADE IN JAPAN

BOTTOM VIEW

MADE IN JAPAN

BOTTOM VIEW

MADE IN JAPAN

BOTTOM VIEW

MADE IN JAPAN

BOTTOM VIEW

MADE IN JAPAN

BOTTOM VIEW

SN

G3R-IAZR1SN

OMRON


G3R-IAZR1SN

OMRON


G3R-IAZR1SN

OMRON


G3R-IAZR1SN

OMRON


G3R-IAZR1SN

OMRON


G3R-IAZR1SN

OMRON


G3R-IAZR1SN

OMRON


G3R-IAZR1SN

OMRON


G3R-IAZR1SN

OMRON G3R-IAZR1SN


Relay Output ETP Typical DC Field Connections

Figure 68

REV B

7400255–

CR15 CR14 CR13 CR12 CR11 CR10 CR7 CR6 CR5 CR4 CR3 CR1

DSP16 DSP15 DSP14 DSP13

R16 R15 R14 R13 R12 R11


R10 R9 R8 R7 R6

DSP8 DSP7 DSP6 DSP5 DSP4

R5 R4 R3 R2 R1

DSP3 DSP2 DSP1

SN

K16 K15 K14 K13

F16 F15 F14 F13 F12 F11 F10

K12 K11 K10 K9 K8 K7

F9 F8 F7 F6 F5 F4

CR9 CR8 CR2

Typical point (1 of 16 points shown) Hot

K6 K5 K4 K3 K2 K1

F3 F2 F1

Relay Output ETP Typical AC Field Connections Figure 67

Typical point (1 of 16 points shown)

+

–

Power Supply

Neutral Power Supply

REV B

7400255–

CR16 CR9 CR8 CR2


R16 R15 R14 R13

DSP16 DSP15 DSP14 DSP13 DSP12 DSP11 DSP10

R12 R11 R10 R9 R8 R7

DSP9 DSP8 DSP7 DSP6 DSP5 DSP4

R6 R5 R4 R3 R2 R1

DSP3 DSP2 DSP1

K16 K15 K14 K13

F16 F15 F14 F13 F12 F11 F10

K12 K11 K10 K9 K8 K7

F9 F8 F7 F6 F5 F4

K6 K5 K4 K3 K2 K1

F3 F2 F1

139 Digital Output Components


These figures show typical connections to the Relay Output ETP, which is used with the Model 3401S2 DO Module and DO External Termination Baseplate. This figure shows how to connect AC discreet outputs to the Relay Output ETP. J1

Load

This figure shows how to connect DC discreet outputs to the Relay Output ETP. J1

Load


IN

IN

PWR

AC

LOAD

BOTTOM VIEW

MADE IN JAPAN

MADE IN JAPAN

AC

IN BOTTOM VIEW

MADE IN JAPAN

AC

IN BOTTOM VIEW

AC

IN BOTTOM VIEW

MADE IN JAPAN

MADE IN JAPAN

AC

IN BOTTOM VIEW

MADE IN JAPAN

AC

IN BOTTOM VIEW

AC

IN AC

IN AC

IN AC

IN

LOAD

OMRON


G3R-IAZR1SN

OMRON


G3R-IAZR1SN

OMRON


G3R-IAZR1SN

OMRON


G3R-IAZR1SN

OMRON


G3R-IAZR1SN

OMRON G3R-IAZR1SN LOAD:0.1A 5–24VDC INPUT:100–240VAC~

BOTTOM VIEW

MADE IN JAPAN

MADE IN JAPAN

BOTTOM VIEW

MADE IN JAPAN

BOTTOM VIEW

MADE IN JAPAN

BOTTOM VIEW

MADE IN JAPAN

AC

IN BOTTOM VIEW

AC

IN BOTTOM VIEW

MADE IN JAPAN

MADE IN JAPAN

AC

IN BOTTOM VIEW

MADE IN JAPAN


OMRON


G3R-IAZR1SN

OMRON


G3R-IAZR1SN

OMRON


G3R-IAZR1SN

OMRON


G3R-IAZR1SN

OMRON


G3R-IAZR1SN

OMRON


G3R-IAZR1SN

OMRON G3R-IAZR1SN

AC

IN


BOTTOM VIEW

AC

IN BOTTOM VIEW

MADE IN JAPAN

MADE IN JAPAN

AC

IN

BOTTOM VIEW

• When switching reactive or DC loads, you should carefully observe the maximum switching power specifications of the output contacts.

CAUTION

Typical point (1 of 16 points shown) C C

OMRON


G3R-IAZR1SN

OMRON


G3R-IAZR1SN

OMRON G3R-IAZR1SN


Relay Output ETP Typical Dry Contact Field Connections Figure 69

SN

CR16 CR9 CR8 CR2



R16 R15 R14 R13 R12 R11


R10 R9 R8 R7 R6

DSP8 DSP7 DSP6 DSP5 DSP4

R5 R4 R3 R2 R1

DSP3 DSP2 DSP1

K16 K15 K14

F16 F15 F14 F13 F12 F11

K13 K12 K11 K10 K9 K8

F10 F9 F8 F7 F6 F5

K7 K6 K5 K4 K3 K2 K1

F4 F3 F2 F1

REV B

7400255– PWR

System Description Chapter 2 140

This figure shows how to connect points requiring a dry contact to the Relay Output ETP. J1

• When switching incandescent lamps, the inrush current can be 10 to 15 times the rated nominal load current of the lamp. Use the inrush current to calculate the required output switching power. Contact the lamp manufacturer for detailed specifications regarding inrush amplitude and duration.

IN


141

Interposing Relay Modules This table gives the output ranges for available interposing relay modules. Relays must be ordered separately and are available from Invensys or directly from OMRON. For more information, contact the Invensys Global Customer Support (GCS) center. For detailed specifications, see the OMRON G3R-I/O and G2R data sheets. Table 32

Output Ranges for Interposing Relay Modulesa

Description

Invensys Part Number

AC Solid State Relay (SSR) Output Module

Max Inrush Current

Rated Input

Applicable Output Load

1300462-001 (G3R-OA202SZN)

5–24 VDC

2 A at 75–264 VAC

30 A, (60 Hz, 1 cycle)

DC SSR Output Module

1300471-001 (G3R-ODX02SN)

5–24 VDC

2 A at 4–60 VDC

8 A, 10 msec

DC SSR Output Module

1300472-001 (G3R-OD201SN)

5–24 VDC

1.5 A at 40–200 VDC

8 A, 10 msec

a. Relay output contact ratings may be higher than module protection specification.

CAUTION

Table 33

When using the AC SSR Output Module, Invensys recommends disabling the Output Voter Diagnostics (OVD) of the Model 3401S2 DO Module. When de-energized, the normal execution of the OVD can glitch the AC SSR output “on” for up to half of a cycle. For details, see Enabling “Disabled” Output Voter Diagnostics on page 205.

Output Ranges for Power (Dry Contact) Relaysa

Description

Invensys Part Number

Input Range— Logic Supply

Max Switching Voltage

Rated Carry Current

Power (Dry Contact) Relay

1300463-001 (G2R-1-SNDC24(S))

17–26 VDC, 21.6 mA max

440 VAC, 125 VDC

10 A

Max Switching Capacity Resistive

Max Switching Capacity Inductive

2500 VA, 300 W

1875 VA, 150 W

a. Relay output contact ratings may be higher than module protection specification.

CAUTION

The OMRON family of output relays are limited to an ambient humidity range of 45% to 85%, all other Tri-GP environmental and EMC specifications remain unchanged.


142

Chapter 2

System Description

Pin-Out Information This table lists pin-out information for the Relay Output ETP. Table 34

Pin-Out Information for Relay Output ETP

Left Power Terminal

Left Load Terminal

Point 1

Point 2

Point 3

Point 4

Point 5

Point 6

Point 7

Point 8

P+

C+

1

3

5

7

9

11

13

15

P–

C–

2

4

6

8

10

12

14

16

Right Power Terminal

Right Load Terminal

Point 9

Point 10

Point 11

Point 12

Point 13

Point 14

Point 15

Point 16

P+

C+

1

3

5

7

9

11

13

15

P–

C–

2

4

6

8

10

12

14

16

DO Hazardous Location External Termination Panel Termination panel 9671-610 is compatible with the Model 3401S2 and Model 3411S2 24 VDC commoned digital output modules. Each panel has: •

Two, sixteen-position field terminals; support for 16 points

•

Two terminals per point, (L+, L–)

•


•


The panel supports redundant 24 VDC power sources with diode ORing. However, recommended field power connections are on the DO External Termination Baseplate and routed to the ETP through the interface cable with ELCO connectors. Dimensions for Term Panel 9671-610 Width (across DIN rail)



4.42 in (11.23 cm)

5.02 in (12.75 cm)

4.25 in (10.795 cm)



143

Specifications This table describes general specifications for 9671-610. Table 35

General Specifications for Term Panel 9671-610

Feature

Description

Panel type

Hazardous location, commoned, supervised

Points

16

This table describes cable and load parameters for 9671-610. Table 36

Cable and Load Parameters for Term Panel 9671-610

Feature

IEC Symbol

ISA Symbol



Tamb

Tamb

32° F to 140° F (0° C to 60° C)

Working voltage

Uw

Uw

16–28 VDC

Maximum voltage

Um

Um

32 V



Uo

Voc

32 V


Io

Isc

0.160 A


Po

Po

1.347 W

C external, maximum

Co

Ca

1.18 µF

L external, maximum

Lo

La

4.95 mH


144

Chapter 2

System Description

Simplified Schematic This figure is a simplified schematic of the Model 9671-610 ETP and the Model 3401S2 or 3411S2 DO Module with a DO External Termination Baseplate. 16-POINT DIGITAL OUTPUT MODULE

BASEPLATE

ELCO CABLE

TERMINATION PANEL

~ Current Sense Circuitry* A PS1 +

Output Switch Drive Circuitry

PS2 + A

to other points

B

L+ 190–310 Ohms

A "B


L– PS1 –

B

to hot spare

Output Switch Drive Circuitry C

A

to other points

PS2 –

C

C


A B C



Figure 70

Simplified Schematic of a 9671-610 Panel and a 3401S2 or 3411S2 DO Module with a DO External Termination Baseplate



145

Typical Connections This figure illustrates how to connect a 9671-610 to the field (16 of 16 points shown).

TRICONEX

J1

7400274 REV C

TB2

! 15

DO NOT REMOVE FUSE WHEN ENERGIZED 12

13

11

10

8

9

7

4

5

3

2

TB5

1

TB4

14

EXT TERM ATEX/EMC COMMONED DO ETP

TB1 TB3

DO NOT SEPARATE WHEN ENERGIZED

SN

J2 P1

Load

L-

P2

*

J3

Note: Field power is routed from the baseplate through the Elco cable to the ETP. Do not connect field power to the ETP.

Not energy limited

Energy limited

* A load must be installed at every point to prevent missing-load alarm. If a field load is not available, install a 470 Ohm, 10 W load resistor.

Figure 71

Field Wiring for 9671-610 with a 3401S2 or 3411S2 DO Module

CAUTION



146

Chapter 2

System Description

Pulse Input Components These Pulse Input components are available with Tri-GP v2.x systems. For installation procedures, see Component Installation on page 185. Model

Description

Frequency Range

Type

3382S2


0.5 Hz–32 kHz

Commoned

2381S2

Pulse Input Baseplate

Direct Termination

2381AS2

Pulse Input Hazardous Location Baseplate

Direct Termination

Pulse Input (PI) Modules provide six very sensitive, high-frequency inputs. The inputs can be individually configured for non-amplified and amplified magnetic speed sensors common on rotating equipment, such as turbines or compressors. PI Modules sense voltage transitions from the speed sensors. Every input transition is sampled, and time is measured for an optimized number of input gear pulses. The resulting count and time are used to generate a frequency (revolutions per minute), which is transmitted to the Main Processors. The type of speed sensor typically used with PI Modules consists of an inductive coil and rotating teeth. The sensor is physically close to the teeth of a gear on the rotating shaft. As the shaft rotates and the teeth move past the sensor, the resulting change in the magnetic field causes a sinusoidal signal to be induced in the sensor. The magnitude of the output voltage depends on: •

How fast the teeth pass the sensor

•

The distance between the sensor and the teeth

•

The construction of the sensor

A typical gear has 30 to 120 teeth spaced at equal distances around its perimeter. The output frequency is proportional to the rotational speed of the shaft and the number of teeth.

CAUTION

A PI Module uses fully differential, input-signal-conditioning circuitry which is AC-coupled and has high bandwidth. The circuitry is designed for high-frequency operation with de-bounced edge detection, but is still sensitive to any type of waveform distortion that could result in erroneous measurements. The module counts transitions by examining one edge of each pulse, consequently, ringing on the input signal can result in many additional transitions being counted. The module is capable of counting over 32,000 transitions per second.

PI Modules have three independent input channels. Each input channel: •

Receives pulse input voltages from each point

•

Converts the values to frequency (RPM) data

•

Transmits the values to the MPs on demand


Pulse Input Components

147

To ensure correct data for each scan, one value is selected using a mid-value selection algorithm. Sensing of each input point is designed to prevent a single failure on one channel from affecting another channel. For critical control programs, we recommend using redundant sensors. PI Modules sustain complete, on-going diagnostics for each channel. If the diagnostics detect a failure on any channel, the Fault indicator is activated, which in turn activates the system alarm. The Fault indicator points to a channel fault, not a complete module failure. PI Modules are guaranteed to operate properly in the presence of a single fault and may continue to operate properly with multiple faults. PI Modules support hot sparing for online replacement of a faulty module or continuous backup to an active module. PI Modules are mechanically keyed to prevent improper installation in a configured baseplate.


148

Chapter 2

System Description

PI Module 3382S2 This figure is a simplified schematic of the Model 3382S2 PI Module. Triplicated I/O Bus

PI Module Typical Point (1 of 6)

+ Isolation Filtering

ASIC


ASIC


ASIC


A

–


Isolation Filtering

Isolation Filtering

B

Isolation Filtering

Isolation Filtering

Isolation Filtering

Figure 72

3382S2 PI Module Simplified Schematic


C


149

This table lists specifications for the Model 3382S2 PI Module. Table 37

3382S2 PI Module Specifications

Feature

Specification

Points

6

Input type

Differential, channel-isolated Single-ended, commoned ground

Sensor compatibility

Magnetic, active, open collector

Maximum operating voltage

± 33 VDC

Minimum operating voltage Differential

500 mV P-P, 2 Hz–32,000 Hz 1 V P-P, 0.5 Hz–2 Hz

Single-ended

1V P-P, 2 Hz–32,000 Hz 2V P-P, 0.5 Hz–2 Hz

Input frequency range

0.5 Hz–32 kHz

Duty cycle

20% to 80%, or 10 μsec minimum pulse width (positive and negative)

Absolute error of input frequencya

± 0.01%, 2,000–32,000 Hz ± 0.1%, 0.5–2,000 Hz

Maximum acceleration rate

4,000 Hz/sec

Absolute error of acceleration (Hz/sec)a

< 0.01 times the numeric value of the input frequency when the frequency range is 3kHz–32 kHz

Maximum jerk rate

500,000 Hz/sec2

Absolute error of jerk (Hz/sec2)a

< 2.5 times the numeric value of the input frequency when the frequency range is 3 kHz–32 kHz

Programmable number of gear teeth (G) per point

1–255b

Termination resistor

Baseplate configurable

Pull-up resistor

Baseplate configurable

Measurement algorithm

Gear multiple tracking

Diagnostic

Precision frequency reference test


500 VDC, minimum

Functional-to -functional-earth (logic) isolation

800 VDC, minimum

a. Absolute error of speed, acceleration, and jerk, does not include error introduced by the field device. The reporting of speed acceleration and jerk is susceptible to noise and inaccuracies in the gear manufacturing (tooth-tooth spacing). b. Absolute error of acceleration and jerk may exceed the specified values if the number of gear teeth per point “G” is not within the range of 255 > n*G >= 240, where n is an integer.


150

Chapter 2

System Description

The Model 3382S2 PI Module is compatible with Tri-GP v2.1 and later systems. For more compatibility information, see the Product Release Notice for Tri-GP v2.x, available on the Invensys Global Customer Support (GCS) website. The Model 3382S2 PI Module measures speed, angular acceleration (rate of speed change), and jerk rate (rate of acceleration change). The speed is reported to the control program in revolutions per minute (RPM). Acceleration is reported in RPM/second and Jerk is reported as RPM/second2. The absolute error of the acceleration measurement is less than 0.01 times the numeric value of the input frequency, with a frequency greater than 3000 Hz. The absolute error of the jerk measurement is less than 2.5 times the numeric value of the input frequency, with a frequency greater than 3000 Hz. Note

To meet the specifications for absolute error of acceleration and absolute error of jerk, the number of gear teeth per point must be a number that when multiplied by an integer is greater than or equal to 240 and less than 255. A formulaic expression of this is:

240 ≤ n × G < 255 Where: - n must be an integer - G equals the number of gear teeth Absolute error of acceleration and absolute error of jerk may exceed the specified value if the number of gear teeth is not within this range. Examples Gear:120 Input Frequency:3,000 Hz Frequency Error Calculations Input frequency:3,000 Hz Absolute error of Acceleration:[0.01 * (3,000 Hz)]/sec = 30 Hz/sec Absolute error of Jerk:[2.5 * (3,000 Hz)]/sec2 = 7,500 Hz/sec2 RPM Error Calculations RPM:(3,000 Hz * 60 sec/min)/Gear = 1,500 RPM Absolute error of Acceleration:[0.01 * (1,5000 RPM)]/sec = 15 RPM/sec Absolute error of Jerk:[2.5 * (1,500 RPM)]/sec2 = 3,750 RPM/sec2 It can take up to three minutes for the Model 3382S2 PI Module to reach the Pass State, upon initial power-up, which is indicated by steady, green Pass status indicator on the front panel of the module.



151

PI Baseplate This figure depicts a front view of the Model 2381S2 PI Baseplate. The short circuit current specifications for field short-to-ground faults are: •

130 mA, typical

•

200 mA, maximum


152

Chapter 2

System Description

This figure is a simplified schematic of the Model 3382S2 PI Module and Model 2381S2 PI Baseplate. PI Baseplate

6-Point PI Module

Field Power (PS1) + Field Power (PS2) + J29 J24 V+

J23 1

1

1 499 Ω

2

R+

Blown Fuse Indicator Comparator 1

3

FE

To Spare

2

6

3

IN+

2

Comparator 4

1

3

IN-

6

4 5

FE

4 Shield

Comparator

499 Ω

1 6


Figure 73

To Other Points

3382S2 PI Module and 2381S2 PI Baseplate Schematic



153

Typical Field Connections This figure depicts typical field connections for the Model 2381S2 PI Baseplate. Note

Unused points must be terminated. +24 V #1

~

+24 V #2 24 V Return

~

~

Safety

~

1 1 2 3 4 5 6 7

J23 Configuration Block

8 9 10 11 12

J24 Sensor Block

13 14 15 16

17 18 19 20 21


22 23 24 25

J25 Sensor Block

26 27 28 29 30 31 32

Figure 74

3 4

1

5

2

6

3

7

4

8

5

9

6

J29 Resistor Block

7

10

8

11

9

12

10

13

11

14

12

15 16

17 18 19

13

20

14

21

15

22

16

23

17

24

18

25

19

26

20

27

21

28

22

29

23

30

24

31 32

J30 Resistor Block

6

~~~~

F

2

2381S2 PI Baseplate Typical Field Connections


154

Chapter 2

System Description

Connecting an Unused Point This figure depicts a typical connection for point 2. J23

J24 1

1

2

2

3

3 4 5 6 7 8 9 10 11 12 13 14 15 16

4

1

5

2

6

3

7

4

8

5

9

6 7

10

8

11

9

12

10

13

11

14 15 16

Figure 75

12

J29

2381S2 PI Baseplate Unused Point Connection

Connecting a Passive Magnetic Sensor This figure depicts a typical connection for point 3. J23 1 2 3 4 5 6 7 8 9 10

Passive Magnetic Sensor

11

In+ In– Shield

12 13 14 15

J24 1 2 3 4

1

5

2

6

3

7

4

8

5

9

6 7

10

8

11

9

12

10

13

11

14 15 16

12

Optional Termination Resistor

J29

16

Figure 76

2381S2 PI Baseplate Passive Magnetic Sensor Connection



155

Connecting an Active Open-Collector Sensor with an Internal Resistor This figure depicts a typical connection for point 4. Active OpenCollector Sensor

J26 V+ In+ In– Shield

17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32

Figure 77

J25 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31

13 14 15

Internal Pull-Up Resistor Jumper

16 17 18 19 20 21 22 23 24

J30

32

2381S2 PI Baseplate Active Open-Collector Sensor with an Internal Resistor Connection

Connecting an Active Open-Collector Sensor with an External Resistor This figure depicts a typical connection for point 5. J26 17 18 19 20

Active OpenCollector Sensor

21

V+ In+ In– Shield

22 23 24 25 26 27 28 29 30 31 32

Figure 78

J25 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32

13 14 15 16 17 18 19 20

External Pull-Up Resistor

21 22 23 24

J30

2381S2 PI Baseplate Active Open-Collector Sensor with an External Resistor Connection


156

Chapter 2

System Description

Connecting an Active Sensor This figure depicts a typical connection for point 6. J26 17 18 19 20 21 22 23 24 25 26 27

V+ In+ In– Shield

Active Sensor

28 29 30 31 32

Figure 79

J25 17 18 19

13

20

14

21

15

22

16

23

17

24

18

25

19

26

20

27

21

28

22

29

23

30

24

31 32

6

J30

2381S2 PI Baseplate Active Sensor Connection

Terminal Blocks The Model 2381S2 PI Baseplate has three types of terminal blocks: configuration, sensor, and resistor. •

The configuration block is used to select passive or active magnetic sensors and to select an internal pull-up resistor when using an active open-collector sensor.

•

The sensor block is used to connect sensors to the baseplate.

•

The resistor block is used to attach a user-supplied termination resistor for passive sensors, or a user-supplied pull-up resistor for an active open-collector sensor.

The Model 2381S2 PI Baseplate is factory-configured with the configuration blocks set to differential mode for each point. The sensory blocks are configured to no points (spare) with the inputs shorted together. When a point is selected for use, the installed jumpers should be moved or removed as appropriate.



157

Model 2381S2 PI Baseplate Terminal Block Pin-Out Information This table contains pin-out information for the Model 2381S2 PI Baseplate terminal block. Configuration J23/J26 Signal

Point 1

Point 2

Point 3

Point 4

Point 5

Point 6

V+

1

6

12

17

22

28

R+

2

7

13

18

23

29

FE

3

8

14

19

24

30

IN1–

4

9

15

20

25

31

FE

5

10

16

21

26

32

Point 1

Point 2

Point 3

Point 4

Point 5

Point 6

V+

1

7

13

17

23

29

IN+

2

8

14

18

24

30

IN–

3

9

15

19

25

31

Shield

4

10

16

20

26

32

Point 1

Point 2

Point 3

Point 4

Point 5

Point 6

V+

1

5

9

13

17

22

IN+

2

6

10

14

18

23

IN+

3

7

11

15

19

24

IN–

4

8

12

16

20

25

Sensor J24/J25 Signal

Resistor J29/J30 Signal


158

Chapter 2

System Description

PI Hazardous Location Baseplate This figure depicts a front view of the Model 2381AS2 PI Hazardous Location Baseplate.



159

This figure is a simplified schematic of the Model 3382S2 PI Module and the Model 2381AS2 PI Hazardous Location Baseplate. PI Hazardous Location Baseplate

6-Point PI Module Module Field Power

Field Power (PS1) + Field Power (PS2) + J29

1

J24

1

J23 1

499 :

2

R+

Comparator 1

3

FE

To Spare

2

6

3

IN+ 2

Comparator 4

1

3

IN-

6

4 5

FE

4 Shield

Comparator

499 :

1 6

Field Power (PS1) ñ Field Power (PS2) ñ

Figure 80

To Other Points

3382S2 PI Module and 2381AS2 PI Hazardous Location Baseplate Schematic


160

Chapter 2

System Description

This table describes cable and load parameters for the Model 2381AS2 PI Hazardous Location Baseplate. Table 38

Cable and Load Parameters for Baseplate 2381AS2

Feature

IEC Symbol

ISA Symbol



Tamb

Tamb

–4° F to 158° F (–20° C to 70° C)

Working voltage

Uw

Uw

19 to 28 V

Maximum voltage

Um

Um

32 V

Input Connection (In+ In–) Specifications


Uo

Voc

32 V


Io

Isc

2.13 mA


Po

Po

0.068 W

C external, maximum

Co

Ca

550 nF

L external, maximum

Lo

La

0.99 mH



161

Typical Field Connections This figure depicts typical field connections for the Model 2381AS2 Hazardous Location PI Baseplate. Note

Unused points must be terminated. +24 V #1

~

+24 V #2 24 V Return

~

~

Safety

~

1 2 3 4 5 6 7


8 9 10 11 12

J24 Sensor Block

13 14 15

1 2 3 4

1

5

2

6

3

7

4

8

5

9

6

J29 Resistor Block

7

10

8

11

9

12

10

13

11

14

12

15 16

16

17 18 19 20 21


22 23 24 25

J25 Sensor Block

26 27 28 29 30 31 32

Figure 81

18 19

13

20

14

21

15

22

16

23

17

24

18

25

19

26

20

27

21

28

22

29

23

30

24

31 32

J30 Resistor Block

6

~~~~

F

17

2381AS2 PI Hazardous Location Baseplate Typical Field Connections


162

Chapter 2

System Description

Connecting an Unused Point This figure depicts a typical connection for point 2. J23

J24 1

1

2

2

3

3 4 5 6 7 8 9 10 11 12 13 14 15 16

4

1

5

2

6

3

7

4

8

5

9

6 7

10

8

11

9

12

10

13

11

14 15 16

Figure 82

12

J29

2381AS2 Hazardous Location PI Baseplate Unused Point Connection

Connecting a Passive Magnetic Sensor This figure depicts a typical connection for point 3. J23 1 2 3 4 5 6 7 8 9 10

Passive Magnetic Sensor

11

In+ In– Shield

12 13 14 15 16

Figure 83

J24 1 2 3 4

1

5

2

6

3

7

4

8

5

9

6 7

10

8

11

9

12

10

13

11

14 15 16

12

Optional Termination Resistor

J29

2381AS2 Hazardous Location PI Baseplate Passive Magnetic Sensor Connection



163

Terminal Blocks The Model 2381AS2 Hazardous Location PI Baseplate has three types of terminal blocks: configuration, sensor, and resistor. •

The configuration block is used to select passive or active magnetic sensors and to select an internal pull-up resistor when using an active open-collector sensor.

•

The sensor block is used to connect sensors to the baseplate.

•

The resistor block is used to attach a user-supplied termination resistor for passive sensors, or a user-supplied pull-up resistor for an active open-collector sensor.

The Model 2381AS2 Hazardous Location PI Baseplate is factory-configured with the configuration blocks set to differential mode for each point. The sensory blocks are configured to no points (spare) with the inputs shorted together. When a point is selected for use, the installed jumpers should be moved or removed as appropriate.


164

Chapter 2

System Description

Model 2381AS2 Hazardous Location PI Baseplate Terminal Block Pin-Out Information This table contains pin-out information for the Model 2381AS2 Hazardous Location PI Baseplate terminal block. Configuration J23/J26 Signal

Point 1

Point 2

Point 3

Point 4

Point 5

Point 6

R+

2

7

13

18

23

29

FE

3

8

14

19

24

30

IN1–

4

9

15

20

25

31

FE

5

10

16

21

26

32

Point 1

Point 2

Point 3

Point 4

Point 5

Point 6

IN+

2

8

14

18

24

30

IN–

3

9

15

19

25

31

Shield

4

10

16

20

26

32

Point 1

Point 2

Point 3

Point 4

Point 5

Point 6

IN+

2

6

10

14

18

23

IN+

3

7

11

15

19

24

IN–

4

8

12

16

20

25

Sensor J24/J25 Signal

Resistor J29/J30 Signal


Solid-State Relay Output Components

165

Solid-State Relay Output Components These Solid-State Relay Output components are available with Tri-GP v2.x systems. For installation procedures, see Component Installation on page 185. Model

Description

Voltage

Type

3451S2


24 VDC

Commoned, in groups of 2

2451S2

Solid-State Relay Output Baseplate

Direct Termination

The Solid-State Relay Output (SRO) Module is a non-triplicated module for use on non-critical points which are not compatible with high-side, solid-state output switches; for example, interfacing with annunciator panels. The SRO Module receives output signals from the Main Processors on each of three channels. The three sets of signals are then voted, and the voted data is used to drive the 32 individual relays. Each output has an I/O loop-back circuit which verifies the operation of each relay switch independently of the presence of a load. Ongoing diagnostics test the operational status of the SRO Module. The SRO Module supports hot sparing for online replacement of a faulty module or continuous back-up to an active module. The SRO Module is mechanically keyed to prevent improper installation in a configured baseplate.

SRO Module Schematic This figure is a simplified schematic of the Model 3451S2 SRO Module. Triplicated I/O Bus

I/O Controller(s)

Field Circuitry Typical Point (2 of 32)

C1 A


ASIC

B


ASIC

C


ASIC

ASIC

Com

C2

Figure 84

3451S2 SRO Module Simplified Schematic


166

Chapter 2

System Description

This table lists specifications for the Model 3451S2 SRO Module. Table 39

3451S2 SRO Module Specifications

Feature

Specification

Points

32, commoned in pairs


± 24 V


± 30 V

Maximum switching voltage

± 33 V peak

Maximum switching power

15 W resistive

Maximum off-state leakage

<100 μA

Maximum nominal current

0.5 A per channel

Maximum over current

0.7 A per channel

Voltage drop at baseplate

<0.25 V @ 0.5 A

Fuses, mounted on baseplate

1 per output, 0.75 A, fast-acting


500 VDC, minimum


800 VDC, minimum



167

SRO Baseplate This figure depicts a front view of the Model 2451S2 SRO Module Baseplate.


168

Chapter 2

System Description

This figure is a simplified schematic of the Model 3451S2 SRO Module and Model 2451S2 SRO Baseplate. 32-Point RO Module

RO Baseplate Blown Fuse Indicator

C1 Fuse 750 mA Com Blown Fuse Indicator

C2 Fuse 750 mA

Figure 85

3451S2 SRO Module and 2451S2 SRO Baseplate Schematic



169

Typical Field Connections This figure depicts typical field connections for the Model 2451S2 SRO Baseplate. Note

Points on left terminal blocks are commoned together in pairs; for example, 1-2 and 3-4.

Safety

~

DC Power Supply

+ – 1 2 3 4 5

Field Load 2

Field Load 1

6 7 8 9 10

DC Power Supply

11

–

12 13

+

14 15 16

Field Load 2

Field Load 1

17 18 19 20

AC Power Supply

AC Power Supply

–

Field Load 1

22 23

+

–

21

Field Load 2 Field Load 1

24 25 26 27 28 29

+

30

Field Load 2

31 32

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16

17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32

9

~ Figure 86

2451S2 SRO Baseplate Typical Field Connections


170

Chapter 2

System Description

Interconnect Assemblies These interconnect assemblies are available. Model

Description

2920


2921


Interconnect Assemblies consist of a passive PCB in a molded plastic housing with two DIN-C 96-pin male connectors which enables I/O messages, logic power, and system power to be carried from one baseplate to the next. For connections between I/O Baseplates, the I/O Interconnect Assembly is used. For connections between an MP Baseplate and either an I/O or CM Baseplate, the MP Interconnect Assembly is used which also carries communication messages between the CM and MP Baseplates. •

Each MP Baseplate assembly includes one MP Interconnect Assembly.

•

Each I/O Baseplate assembly includes one I/O Interconnect Assembly.

For installation procedures, see Connecting Columns with I/O Extender Modules on page 192.


Figure 87


2920 MP Interconnect Assembly and 2921 I/O Interconnect Assembly


I/O Extender Modules

171

I/O Extender Modules These I/O Extender Modules Kits are available with Tri-GP v2.x systems. Model

Description

2281

I/O Extender Module Kit (without termination)

2291

I/O Extender Module Kit for I/O Baseplate (with termination)

2292

I/O Extender Module Kit for MP Baseplate (with termination)

I/O Extender Modules are used to extend the I/O bus from one column to another, provide I/O bus termination, provide additional input terminals for I/O module logic power, and provide a protective earth (safety ground) connection. For installation procedures, see Connecting Columns with I/O Extender Modules on page 192.

Figure 88

I/O Extender Module

An I/O Extender Module includes three DB-9-pin I/O bus connectors, two 24-volt logic power input terminal blocks, each with fuse and blown-fuse indicators, and one protective earth terminal block. This table identifies specifications for the logic power. Table 40

Logic Power Specifications for I/O Extender Modules

Feature

Specification

Logic power

125 W maximum

Fuse

8 A, slow-acting

Blown fuse indicator

20 mA


172

Chapter 2

System Description

I/O Bus Cables An I/O Bus Cable set includes three I/O bus extension cables, which can be from 2 feet (.6 meters) to 650 feet (200 meters) in length. The terminators should be installed on the open I/O bus connectors on the I/O Extender Modules at each end of the I/O bus. For distances greater than 650 feet (200 meters) or for applications requiring isolation, fiberoptic transceivers are commercially available. For compatible units and supported distances, contact the Invensys Global Customer Support (GCS) center.

I/O Bus Terminators I/O Bus Terminators plug into the open connectors on I/O Extender Modules and provide a known electrical load. The terminators consist of male 9-pin D connectors with two 120-ohm resistors mounted in the boot (or shell) of the connector. To maintain acceptable signal integrity when the I/O bus exceeds 20 feet (6 meters), you must install terminators on both ends of the I/O bus. Invensys part number 3900064-003 is a set of three terminators. If your I/O bus length is less then 20 feet (6 meters), no terminators are required.

Figure 89

I/O Bus Terminator


End Caps

173

End Caps These End Caps are available. Model

Description

2910

I/O Baseplate/I/O Extender Module Top

2911

I/O Baseplate/I/O Extender Module Bottom

2912

MP Baseplate Top

2913

MP Baseplate Bottom

End Caps are used to protect the top and bottom of each end-of-column baseplate, cover the Interconnect Assembly, and serve as a baseplate guide.

MP Baseplate End Caps This figure depicts the MP Baseplate top and bottom end caps.

Bottom End Cap

Top End Cap

Figure 90

MP Baseplate End Caps

I/O Baseplate and I/O Extender Module End Caps This figure depicts the I/O Baseplate and I/O Extender Module top and bottom End Caps.

Top End Cap

Figure 91

Bottom End Cap

I/O Baseplate and I/O Extender Module End Caps


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System Description

Covers These covers are available. Model

Description

2900

Slot Cover

2911

Terminal Cover

Covers minimize exposure to dust, dripping and splashing liquids, and corrosive atmospheres. One Slot Cover and one Terminal Cover are included with each I/O Baseplate.

Slot Cover

Figure 92

Terminal Cover

Slot Cover and Terminal Cover


3 Installation and Maintenance

System Configuration 176 Installation Guidelines 179 Component Installation 185 Controller Grounding 198 Implementation and Maintenance 204 Module Replacement 207


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System Configuration This section includes configuration information and guidelines for a Tri-GP system. Topics include: •

System Specifications on page 176

•

Determining Logic Power on page 177

•

General Cooling Guidelines on page 177

•

Determining Cooling Requirements on page 177

System Specifications This table includes specifications for determining the number and types of components that can be installed in a Tri-GP v2.x system. Table 41

Tri-GP v2.x System Specifications

Component

Quantity

I/O baseplates, maximum

25 (requires TriStation 1131 v4.5 software or later)

Number of baseplates on column, maximum

8

Length of I/O bus, maximum

650 feet (200 meters)

Communication components, maximum

1 CM baseplate and 2 CMs

Analog Input points, maximum

416 (13 AI baseplates, 13 AI/DI baseplates, or any combination that does not exceed 416 total AI or AI/DI points)

Analog Output points, maximum

20 (5 baseplates)

Digital Input points, maximum

640 (20 DI baseplates, 13 AI/DI baseplates, or any combination that does not exceed 640 total DI points)

Digital Output points, maximum

320 (20 baseplates)

Pulse Input points, maximum

30 (5 baseplates)

Solid-State Relay Output points, maximum

640 (20 baseplates)

Interconnect Assemblies, maximum

32


System Configuration

177

Determining Logic Power Logic power refers to the maximum power needed to power all the modules in the system. This calculation is based on the assumption that only one of the redundant power sources is operational. Under normal operating conditions, both power sources share the load. This table can be used as a worksheet to determine the maximum logic power needed. To do so: •

Enter the number of Communication Modules and I/O modules, including hot-spare modules.

•

Multiply the number of modules by the maximum logic power for the type.

•

Add the logic power by type to get the total power requirement for the system. Maximum Logic Power (Watts)a

Module Main Processor

8

Communicationb

8

All I/O Modules including hotspare modules

3

Number of Modules

Logic Power by Type

3

24

Total Power Requirement a. To convert watts to British thermal units: BTU = watts x 3.414. b. Without MAU connections.

General Cooling Guidelines Adequate convection or forced-air cooling should be provided. These general guidelines can be used for typical environments where the maximum ambient temperature is 120° F (50° C) with 20° C internal temperature rise. •

In sealed environments, the external surface area of the enclosure should be at least 0.009 m2/watt.

•

In vented environments, the internal air flow should be at least 7 m3/watt. Air flow should be directed to flow into vents at the bottom of the enclosure (for example, a vent at the bottom of the door) and to exit at the top of the enclosure (for example, a pagoda top).

•

For maximum reliability of the system, the average ambient temperature should be below 120° F (50° C).

Determining Cooling Requirements This table can be used to determine the total heat dissipation, which is the total logic and field power used by the modules in the system. To do so: •

Multiply the number of modules (primary and hot-spares) by the maximum logic power to get the logic power by module type.


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•

Multiply the number of modules by the maximum field power to get the field power by module type.

•

Add the field power and logic power by module type to get the total power requirement for the system. Maximum Logic Power (Watts)a

Maximum Field Power (Watts)

Main Processor; 3101S2

8

—b

Communicationc; 3201S2

8

—

Analog Input; 3351S2

3

4

Analog Input/Digital Input; 3361S2

3

4

Analog Output; 3481S2

3

3

Analog Output; 3482S2

3

7

Digital Input; 3301S2, 3311S2

3

7

Digital Output; 3401S2

3

4

Digital Output; 3411S2

3

20

Pulse Input; 3382S2

3

—

Solid-State Relay Output; 3451S2

3

4

Module

Logic Power by Module

Field Power by Module

Total Heat Dissipation a. To convert watts to British thermal units: BTU = watts x 3.414 b. Means not applicable or negligible. c. Does not include MAU connections.


Logic and Field Power

Installation Guidelines

179

Installation Guidelines This section includes installation guidelines for the Tri-GP controller. Topics include: •

General Installation Guidelines on page 179

•

Plant Power and Grounding on page 179

•

Tri-GP Field, Power, and Ground Wiring on page 180Tri-GP Field, Power, and Ground Wiring on page 180

•

Application-Specific Installation Guidelines on page 182

General Installation Guidelines Due to the critical applications the Tri-GP is typically used in, it has been designed to operate under worst cases conditions in the harsh environments typically found in industrial environments. To ensure adequate operational margins are maintained even under these worst case conditions, the Tri-GP should be installed in a controlled environment according to the general guidelines contained in: IEC 61131, Part 4, Programmable controllers, User Guidelines Section 7 of this standard includes checklists to help control the following environmental conditions: •

Temperature

•

Contaminants

•

Shock and vibration

•

Electromagnetic interference

Typical guidelines include: •

Locate the Tri-GP away from obvious sources of heat: space heaters, solar radiation, etc.

•

Locate or isolate the Tri-GP from obvious sources of corrosive gases or dust.

•

Locate or isolate the Tri-GP from obvious sources of shocks or periodic vibrations: rotating machinery, engines, compressors, presses, etc.

•

Locate or isolate the Tri-GP from obvious sources of electromagnetic interference: large motors or motor controllers, power converters, radio controlled equipment, welding equipment, etc.

Plant Power and Grounding All plant and control room power distribution and safety grounding (protective earthing) must be done according to the applicable national electric codes. Typical examples include: IEC 60364, Electrical Installations of Buildings Planning and Installation Guide for Triconex General Purpose v2 Systems

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National Fire Protection Association, 2002 Edition of the National Electrical Code Handbook For new construction, or where simple retrofits are feasible, the plant and/or control room safety grounding system should employ a supplemental Zero Reference Signal Plane or Grid (ZRSG). Installation of such a system for the plant or control room is not required for a successful Tri-GP application, but does represent modern best industry practice and should be followed wherever possible. Even when not implemented at the plant or control room level, the concepts of a modern ZRSG should be included in the Tri-GP cabinet and interconnecting cable routing. The ZRSG implementation should be extended to include all equipment racks and interconnecting cable paths: metal conduits, cable trays, wireways, etc. Detailed installation guidelines can be found in: •

EPRI TR- 102400, Volume 2, Handbook for Electromagnetic Compatibility of Digital Equipment in Power Plants, Implementation Guide for EMI Control

•

IEC 61000, Part 5, Section 2, Electromagnetic compatibility (EMC), Installation and mitigation guidelines, Earthing and cabling

•

IEEE Std 1100-1999, IEEE Recommended Practice for Powering and Grounding Electronic Equipment

Tri-GP Field, Power, and Ground Wiring All Tri-GP power distribution and safety grounding (protective earthing) must be done according to the applicable national electric codes and the information contained in this manual. Typical examples include: National Fire Protection Association, 2002 Edition of the National Electrical Code Handbook IEC 60364, Electrical Installations of Buildings Typically, the Tri-GP is installed in an equipment rack, cabinet, or wall-mounted box located in a control or equipment room. All wiring internal to that cabinet and leading to and from that cabinet should be segregated into different types and bundled accordingly, for example: •

Measurement and low-power analog control signals. These signals require shielded twisted pair cabling.

•

24 VDC discrete signals. These signals require twisted pair cabling.

•

High-power control signals and conditioned power distribution—typically nonsensitive higher-voltage signals: 48-120 V discrete signals, 24-120 VDC I/O power distribution, and so on. These signals should always use twisted pair cabling.

•

Input coming power and miscellaneous circuits—typically noisy, higher power circuits: 115 VAC discrete signals, AC power distribution, cabinet fans or lights, and so on. These signals should always use twisted-pair cabling, and the Grounding Electrode Conductor (the green wire) should be twisted along with the power leads, wherever possible.

•

Earth bonding connections.



181

All cable routing and installation should be done to minimize EMI, detailed guidelines can be found in: EPRI TR- 102400, Volume 2, Handbook for Electromagnetic Compatibility of Digital Equipment in Power Plants, Implementation Guide for EMI Control IEC 61000-5-2, Electromagnetic compatibility (EMC), Installation and mitigation guidelines, Earthing and cabling IEEE Std 1100-1999, IEEE Recommended Practice for Powering and Grounding Electronic Equipment Typical guidelines include the following: •

Use ferrous metal cabinets, cable trays, and conduits.

•

Electrically bond all surfaces of the cabinet and it's contents together with multiple conductive metal strapping, not simple wire. Particular attention should be paid to doors, and removable panels. In turn the cabinet must be bonded to the control room or plant safety ground system or ZRSG.

•

Routinely use twisted pair cabling, use shielded twisted pair cabling for all sensitive signals. Allow the minimum amount of un-twisted wire that accommodates connection.

•

Signals of different types should never be bundled together.

•

Bundles of different types should be separated by a minimum of 10 times the largest lead diameter.

•

Bundles of different types of signals should only cross at right angles to each other.

•

All wires and/or bundles should be routed along the ZRSG, for example along the along the cabinet walls, within a cable tray or conduit, along building steel or the floor ground grid.

•

Where an inline filter or power conditioning is used, the input and output leads should never be routed in the same bundle.

•

Maintain shield continuity and ensure that shield leads are not broken. Allow the minimum amount of unshielded wire that accommodates connection. Terminate the shield at both ends, use capacitive coupling at one end if potential ground loops are suspected.

•

Where ferrites or line filters are to be installed on signals or cables entering or leaving the cabinet, they must be installed as close to the cabinet egress point as possible. Cables must be routed to minimize coupling between the filtered and non-filtered signals. The non-filtered wire lengths in the cabinet must be minimized to the maximum extent possible.

Note

To comply with standards related to conducted disturbance, a Schaffner FN 2410 line filter, or equivalent, must be installed between power supplies and baseplates.


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Application-Specific Installation Guidelines The following guidelines apply when installing the Tri-GP in application-specific locations.

Class 1 Division 2 Hazardous Locations For North American hazardous location applications, the Tri-GP and associated equipment must be mounted in an enclosure that provides protection from fire and from personal injury resulting from access to live parts. The enclosure must require access via a tool, and if nonmetallic, have the appropriate flammability rating. The replacement of fuses, I/O Modules, Main Processors, Power Modules, Communications Modules, HART Multiplexers, or I/O Interconnects must not be attempted unless the area is known to be free of ignitable gas concentrations. All cabling connected between the Hazardous Location Baseplates and External Termination Panels (ETPs) must be nonincendive as described in Appendix B, Non-Incendive Circuit Parameters. Communication cabling that extends through a hazardous area must be certified as being nonincendive. Only these modules and baseplates, which are approved for use in Class 1 Division 2 hazardous locations, can be used: •

2201S2 Communication Baseplate

•

2281 I/O Extender Module Kit (without termination)

•

2291 I/O Extender Module Kit for I/O Baseplate (with termination)

•

2292 I/O Extender Module Kit for MP Baseplate (with termination)

•

2301S2 Digital Input Baseplate

•

2302S2 Digital Input External Termination Baseplate and Solid State Relay Input External Termination Panel

•

2351S2 Analog Input Baseplate

•

2352S2 Analog Input External Termination Baseplate

•

2354AS2 Analog Input HART Hazardous Location Baseplate

•

2361S2 Analog Input/Digital Input Baseplate

•

2381S2 Pulse Input Baseplate

•

2401S2 Digital Output Baseplate

•

2401LS2 Digital Output Baseplate (low current)

•

2402S2 Digital Output External Termination Baseplate and Relay Output External Termination Panel

•

2451S2 Solid-State Relay Output Baseplate

•

2481S2 Analog Output Baseplate

•

2483AS2 Analog Output HART Hazardous Location Baseplate

•

3101S2 Main Processor



•

3201S2 Communication Module

•

3301S2 24V Digital Input Module

•

3311S2 Digital Input Module, High Resolution

•

3351S2 Analog Input Module

•

3361S2 Analog Input/Digital Input Module

•

3382S2 Enhanced Pulse Input Module

•

3401S2 24VDC Digital Output Module

•

3411S2 Digital Output Module, Supervised

•

3451S2 Solid-State Relay Output Module

•

3481S2 Analog Output Module

•

3482S2 High-Current Analog Output Module

•

9764-510F RTD/TC/AI Termination Panel

WARNING

183

You must take additional explosion protection measures for field circuits when the field apparatus are in a hazardous area.

Zone 2 European Hazardous Locations For European (ATEX) hazardous location applications, the Tri-GP and associated equipment must be installed in an enclosure that provides an IP54 minimum degree of protection per the requirements of EN 60529, Specification of protection provided by enclosures (IP Code). Simply stated, the enclosure must provide protection against dust and splashing water. Additionally, the enclosure must meet the applicable requirements of EN 60079-15 or EN 50021. The following points must be taken into account: •

Mechanical strength

•

Non-metallic enclosures and non-metallic parts of enclosures

•

Earthing or equipotential bonding connection facilities

The ambient temperature range for European (ATEX) hazardous location applications is: –4° F ≤ Ta ≤ 158° F (–20° C ≤ Ta ≤ 70° C) The following warning label must be placed on the outside of the Tri-GP system enclosure: DO NOT REMOVE OR REPLACE MODULES OR CABLES WHILE ENERGIZED UNLESS THE AREA IS KNOWN TO BE FREE OF IGNITABLE GAS CONCENTRATIONS. The replacement of fuses, I/O Modules, Main Processors, Power Modules, Communications Modules, HART Multiplexers, or I/O Interconnects must not be attempted unless the area is known to be free of ignitable gas concentrations. All connecting screws must be securely tightened, so that loosening and separating are prevented.


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Male ELCO connectors must have a gasket installed, and it must be replaced before the end of its five-year life span. (Invensys part number 3000793-001 is a kit containing 25 gaskets.) All cabling connected between the Hazardous Location Baseplates and External Termination Panels (ETPs) must be nonincendive as described in Appendix B, Non-Incendive Circuit Parameters. Communication cabling that extends through a hazardous area must be certified as being nonincendive. Only these modules and baseplates, which are approved for use in Zone 2 hazardous locations, can be used: •

2101S2 Main Processor Baseplate

•

2201S2 Communication Baseplate

•

2281 I/O Extender Module Kit (without termination)

•

2291 I/O Extender Module Kit for I/O Baseplate (with termination)

•

2292 I/O Extender Module Kit for MP Baseplate (with termination)

•

2302AS2 Digital Input External Termination Baseplate and Solid State Relay Input External Termination Panel

•

2342AS2 Analog Input/Digital Input Baseplate Kit, Hazardous Location

•

2352AS2 Analog Input Baseplate Kit, Hazardous Location

•

2354AS2 Analog Input Baseplate Kit, HART, Hazardous Location

•

2381S2 Pulse Input Baseplate Kit

•

2381AS2 Pulse Input Hazardous Location Baseplate

•

2402AS2 Digital Output Baseplate Kit, Hazardous Location

•

2480AS2 Analog Output Baseplate Kit, Hazardous Location

•

2483AS2 Analog Output Baseplate Kit, HART, Hazardous Location

•

3101S2 Main Processor

•

3201S2 Communication Module

•

3301S2 24V Digital Input Module

•

3311S2 Digital Input Module, High Resolution

•

3351S2 Analog Input Module

•

3361S2 Analog Input/Digital Input Module

•

3382S2 Enhanced Pulse Input Module

•

3401S2 24VDC Digital Output Module

•

3411S2 Digital Output Module, Supervised

•

3481S2 Analog Output Module

•

9573-610F Digital Input Termination Panel Kit, Hazardous Location

•

9671-610F Digital Output Termination Panel Kit, Hazardous Location

•

9792-310F Analog Input Termination Panel Kit, Hazardous Location


Component Installation

•

185

9863-610F Analog Output Termination Panel Kit, Hazardous Location

When using the 2483AS2 Analog Output HART Hazardous Location Baseplate Kit, you must use an external isolator, such as an MTL4546, to achieve Ex nL IIB T4 ATEX certification.

WARNING

You must take additional explosion protection measures for field circuits when the field apparatus are in a hazardous area.

Component Installation This section provides installation procedures for assembling the components in a Tri-GP system. When unpacking materials, check the items against the shipping list to verify that everything ordered is included. Keep the boxes and packing materials in case you need to return items to Invensys. Topics include: •

Mounting a Panel on page 185

•

Installing Baseplates on a Column on page 191

•

Connecting Columns with I/O Extender Modules on page 192

•

Installing Modules on Baseplates on page 195

•

Installing the Module Address Plug on page 196

•

Installing Other Components on page 197

•

Enclosing the Controller on page 197

Mounting a Panel The Tri-GP system is mechanically packaged into functional units that are aligned on DIN rails on a panel mount. Each unit comprises one or more modules connected to a baseplate. Baseplates are installed on a DIN rail to form vertical columns. Each rail can support up to eight units, which are linked by MP Interconnect and I/O Interconnect Assemblies. Additional rails can be connected in a daisy-chain fashion by using I/O Extender Modules. These are guidelines for mounting components: •

All assemblies should be mounted on a 12-gauge (or heavier) steel panel aligned vertically using DIN 50 022-compatible rails.

•

All DIN system and field power supplies should be mounted on horizontal DIN 50 022compatible rails. DIN rails should be mounted on a 12-gauge (or heavier) steel panel.

•

The DIN rails and baseplate assemblies should be located on the panel to allow for the installation of wiring channels (for example, Panduit) along the left side of vertical columns and along the bottom of horizontal rails.

•

Clearance should be provided for adequate air flow around system modules.


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•

For typical environments, there should be at least 5 inches (15 centimeters) of clearance between active modules and the walls of the enclosure.

For detailed specifications, see: •

Mounting Panel Drill Template on page 186

•

Baseplate and Module Depth Dimensions on page 188

•

MP Baseplate Dimensions and Clearances on page 189

•

I/O Baseplates Dimensions and Clearances on page 190

•

I/O Extender Modules Dimensions and Clearances on page 191

Mounting Panel Drill Template This figure shows where the mounting holes should be located on the panel.



187

DIN Rail Tap, #10-32

MP or CM Baseplate

Number Equal Spaces @ 9.84 in. = 39.50 in. 252.6 mm = 1002.2 mm Ref 39.30 in. 995.7 mm Ref for 5 Baseplates As Illustrated

*

I/O Module Baseplate

2.50 in. 63.5 mm

*

7.30 in. 185.4 mm

*

Extender Module Baseplate

3.29 in. 83.6 mm 6.56 in. 166.6 mm

2.50 in. 63.5 mm

*

* Typical, non-accumulating

1.25 in. 31.8 mm Ref

8.56 in. 217.4 mm

Figure 93

Mounting Panel Drill Template


188

Chapter 3


Baseplate and Module Depth Dimensions This figure shows the depth dimensions for a baseplate and module, which is 7.10 inches (18.03 cm). Vertically mounted I/O baseplates measure approximately 7.00 inches (17.78 cm) wide by 9.79 inches (24.87 cm) long.

Figure 94

Baseplate and Module Dimensions



189

MP Baseplate Dimensions and Clearances This figure shows dimensions and clearances for MP Baseplate installation. The vertically railaligned MP Baseplate measures approximately 9 inches wide by 9.79 inches long per logical slot. 9.02 in. 229.1 mm

9.76 in. 247.9 mm 7.30 in. 185.4 mm

8.53 in. 216.7 mm

1.23 in. 31.2 mm

8.56 in. 217.4 mm

0.23 in. 5.8 mm

3.29 in. 83.6 mm 3.52 in. 89.4 mm C L

Figure 95

MP Baseplate Dimensions and Clearances


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Chapter 3


I/O Baseplates Dimensions and Clearances This figure shows dimensions and clearances for I/O Baseplate installation. 7.02 in. 166.7 mm

7.30 in. 185.4 mm 9.76 in. 247.9 mm

8.53 in. 216.7 mm

1.23 in. 31.2 mm

6.56 in. 166.7 mm

0.23 in. 5.8 mm

3.29 in. 83.6 mm 3.52 in. 89.4 mm C L

Figure 96

I/O Baseplate Dimensions and Clearances



191

I/O Extender Modules Dimensions and Clearances This figure shows dimension and clearances for I/O Extender Module installation. 1.23 in. 31.2 mm

1.23 in. 31.2 mm

6.56 in. 166.7 mm

Figure 97

0.23 in. 5.8 mm

I/O Extender Module Dimensions and Clearances

Installing Baseplates on a Column This procedure explains how to install baseplates on a column.

Procedure 1

On a mounting panel, locate, drill, and tap mounting holes. For specifications, see Mounting Panel Drill Template on page 186.

2

Install the DIN rail according to the manufacturer’s instructions.

3

Install the first baseplate, which is typically either the MP or CM Baseplate. The CM Baseplate must be directly above or below the MP Baseplate.

4

Use four #10 mounting screws with flat and lock washers and positioning the baseplate along the DIN rail so that the mounting screws are centered in the oblong mounting holes. Tighten the screws to 16 inch-pounds of torque.

5

Install the next baseplate either at the top or bottom of the previous baseplate. Use four #10 mounting screws with flat and lock washers and positioning the baseplate along the DIN rail so that the mounting screws are centered in the oblong mounting holes. Do not tighten the screws.

6

Attach an Interconnect Assembly between the two baseplates, allowing the second baseplate to move until the Interconnect Assembly snaps into place. •

For baseplates next to an MP Baseplate, use an MP Interconnect Assembly.

•

For baseplates next to an I/O Baseplate, use an I/O Interconnect Assembly.

7

Tighten the mounting screws on the second baseplate to 16 inch-pounds of torque.

8

Install additional baseplates and interconnect assemblies.


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Chapter 3


Interconnect Assembly

Screws (4 places) Baseplate

Screws (4 places)

End Cap

Connecting Columns with I/O Extender Modules This procedure explains how to use I/O Extender Modules to connect a column of baseplates to another column, which is required if the system includes more than eight baseplates or more than one column. I/O Extender Modules are used to extend the I/O bus from one column to another. Logic power also may be connected through the I/O Extender Module.

Procedure 1

Determine the length of the I/O bus by adding these dimensions: •

The length between the top and bottom of the first column and the top and bottom of the second column

•

The length of the I/O Interconnect Modules

•

The length of the cable between the columns

2

If the length does not exceed 20 feet (6 meters), go to step 3. If it does, go to step 4.

3

If the length does not exceed 20 feet (6 meters), do this: •

Install an I/O Extender Module at the top or bottom of each column, depending on where you want the cables to be.

•

Connect the cables between the two I/O Extender Modules as shown in this figure.



6

2

0

9

193

If there are additional columns, repeat the steps.


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Chapter 3


4

If the length exceeds 20 feet (6 meters), do this: •

Install an I/O Extender Module at the top or bottom of each column, depending on where you want the cables to be.

•

Connect the cables between the two I/O Extender Modules.

•

Install an I/O Extender Module at the other end of each column and insert an I/O bus terminator (male 9-pin D connector) to each connection, as shown in this figure.

Note

To maintain acceptable signal integrity when the I/O bus exceeds 20 feet (6 meters), you must install terminators on both ends of the I/O bus. Invensys part number 3900064-003 is a set of three terminators.

0

DB-9 Plug with Terminator

5

If there are additional columns, repeat the procedure as needed.



195

Installing Modules on Baseplates This procedure explains how to install a module on a baseplate. Each baseplate is keyed to allow only modules appropriate for the baseplate. For MP Baseplates, there are three slots. For Communication and I/O modules, there are two slots for modules.

Procedure 1

Seat a module on its corresponding baseplate.

2

Turn the lock lever manually 90° to 180°.

3

Insert a 1/4 inch flat-blade screwdriver into the lock and turn clock-wise to the locked position (360°). Typically, 25 in./lbs. of torque are required to rotate the lock lever. When the module is installed, the Fault indicator goes on while the diagnostics are running. At the same time, the Point indicators go on briefly, go off, then resume the normal state of blinking. The Pass Indicator should go on within about one minute. If it does not, and the Fault light persists longer than five minutes, check the diagnostic log to determine if there is a problem.

Figure 98

Module Assembly on Baseplate


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Chapter 3


Installing the Module Address Plug This procedure explains how to install the address plug, which is a device that identifies the I/O baseplate to the Main Processors. Each baseplate, except the Communication Module, must have an address plug. Invensys includes a package of address plugs to be used with the I/O baseplates.

Procedure 1

Insert the desired address plug on to the baseplate.

2

Do either of these: •

Cycle power or re-install the module

•

Change the node address for the module in the TriStation 1131 project

This figure shows the general location of an address plug on a baseplate.

Figure 99

Address Plug Location



197

Installing Other Components Interconnect Assemblies Attach the appropriate interconnect assembly between baseplates.

Installing End Caps Each end-of-column baseplate should be covered with an end cap to protect the top and bottom of each end-of-column baseplate, cover the interconnect connector, and serve as a card guide.

Installing Slot Covers Unused baseplate slots should be covered with a Slot Cover to minimize exposure to dust, dripping and splashing liquids, and corrosive atmospheres.

Installing Terminal Covers On I/O baseplates, field terminals should be covered with a Terminal Cover to minimize exposure to dust, dripping and splashing liquids, and corrosive atmospheres.

Enclosing the Controller After all of the components are mounted on a panel, the entire system should be installed in a user-supplied metal enclosure with a sealed bottom and a closed door, connected to Safety Ground. Either of these can be used: •

For a single column, a floor-mounted enclosure such as a Rittal® cabinet.

•

For two or more columns, a wall-mounted enclosure such as a Hoffman® box.

Note

To comply with the requirements of EN 54-2:1998, the Tri-GP system must be installed in a metal enclosure connected to Safety Ground, and it must be installed in an area with an access level greater than 2.


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Controller Grounding This section includes information about grounding the controller.

WARNING

During installation of a Tri-GP controller, take special care with all power sources to minimize the hazard of electrical shock.

Topics include: •

Grounding Baseplates to Protective Earth on page 198

•

Grounding Logic Power on page 200

•

Grounding Field Power on page 201

•

Connecting Shields to Earth on page 202

Grounding Baseplates to Protective Earth The Tri-GP system should be permanently connected to a protective earth to protect operations and maintenance personnel from electrical shock, and to protect the system from damage or malfunction caused by lightning or other electrical noise transients.

WARNING

• Do not operate a Tri-GP system without connecting each baseplate to a protective earth (AC safety ground) with a low-impedance cable. Improper grounding creates the potential for dangerous electrical shock—the Tri-GP controller can produce significant leakage currents which must be shunted to earth. • To ensure that the Tri-GP controller and the equipment connected to it operate safely, you should follow all applicable local and national codes and standards. At a minimum, these include national fire and electrical codes. Because codes and standards vary geographically and change over time, it is your responsibility to determine which standards apply to your specific case and to comply with them. If necessary, contact your local Fire Marshall and Electrical Inspector for assistance.


Controller Grounding

199

Procedure Connect each baseplate in the system to a common tie point, such as a copper bar, according to the applicable electrical codes. The same copper bar can be used to provide a protective earth connection for the field devices and wiring. The wire should be heavy, solid or stranded, bare or insulated. A 12 AWG (3.3 mm2) wire is adequate in most environments.

~

EM

CM

Typical Ground Connection AI 6

MP

DI

1 1

Green/Yellow Wire

0

AI

DO

6

2

DI

RO

0

EM

9

Protective Earth (Safety Ground)


200

Chapter 3


Grounding Logic Power This procedure explains how to ground logic power. An independent power source, equipped with its own fuse and switch, can be shared by all the baseplates in the system. You should connect each baseplate to two independent power sources. In critical environments, at least one power source should be an uninterruptible power supply (UPS). The UPS should be rated for the total number of baseplates to be powered and for the duration of the maximum expected down time. The internal signal grounds (logic and field) are allowed to float with respect to the protective earth (safety ground). In most installations, it is best to tie the signal ground and safety ground together at one and only one point. In simple environments, logic and field power can be combined and treated as one ground system. For more information, see Grounding Field Power on page 201.

Procedure Ground logic power from the MP and I/O Extender Modules in either of these ways: •

Connect L

to protective earth

•

Connect L

to a DCS master reference ground or other quiet earth. Power Supply 1 + –

L Distribution Block

at only one place for the entire system

Power Supply 2 + –

Power Disconnect

Power Disconnect

J5

Extender DSP1

DSP2

–

+

DSP3

DSP4

MP Baseplate 1

1 2

Protective Earth (Safety Ground)


Typical I/O Baseplate


201

Grounding Field Power This procedure explains how to ground field power, which must be done for all I/O baseplates. Multiple I/O modules can share a single set of power supplies, or each I/O module or group of modules can use separate power supplies referenced to alternate grounds. For more information, see Grounding Logic Power on page 200.

Procedure Ground field power from the I/O Baseplates in either of these ways: •

Connect L to protective earth power supplies.

•

Connect L

to a DCS master reference ground or other quiet earth. Power Supply 1 –

F Distribution Block

at only one place for each set of redundant field

+

Power Supply 2 +

–

Power Disconnect

Power Disconnect

J5

Extender

1

1

1 2

2

1

Typical I/O Baseplate

2 3


202

Chapter 3


Connecting Shields to Earth This procedure explains how to connect shields to earth, which may be required for some field input connections.

Procedure 1

Connect a cable shield at one end of the cable, typically the controller.

2

Make a connection near the termination panel using an external shield bus bar, which is available from Phoenix Contact or other terminal block suppliers.

3

Individually connect each shield bus bar to a suitable, quiet ground point, such as a dedicated protective earth or a DCS master reference ground.

~~ ~ ~


1 2 3 4 5 6

4-20 mA Transmitter

7

~~ ~ ~

8 9 10 11 12 13 14 15 16

17 18 19 20 21 22 23 24 25 26 27 28

Shield Bus Bar

29 30 31 32

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16

17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32

6

Dedicated Shield Ground, DCS Master Reference Ground (Functional Earth), or Protective Earth



203

Alarm Wiring Each Main Processor Module includes two sets of redundant alarm contacts; each with a normally closed contact and common. Typically, alarm wiring is connected to a local or remote annunciator. These devices can be wired in parallel with the alarm wiring so that the designated alarm goes off when either contact signals an alarm condition. The Program Alarm indicator is lit when the control program detects a specified condition and sets the MP.SET_PROG_ALARM_ON attribute to True. For a simplified schematic and specifications, see Alarm Connections on page 40.

DSP1

DSP2

NC Load

– 24 VDC + Power Source

Alarm 1

+

DSP3 FUSE

C NC

– 24 VDC +

–

DSP4 FUSE

C

Alarm 2

Power Source

1

Figure 100

Alarm Wiring


204

Chapter 3


Implementation and Maintenance This section includes information about implementation and maintenance that should be considered when installing a Tri-GP system. To ensure maximum safety and long service, Invensys recommends you establish a schedule for routine maintenance at the time that the Tri-GP controller is installed and adhere to it. Topics include: •

Disabling Output Voter Diagnostics on page 204

•

Checking Controller Power Sources on page 205

•

Enabling “Disabled” Output Voter Diagnostics on page 205

•

Toggling Field I/O Points on page 206

•

Verifying Spare Modules on page 206

Disabling Output Voter Diagnostics Output Voter Diagnostics (OVD) is a set of tests that detect failures in the quad-output voting mechanism of Digital Output Modules except Relay Output Modules. Because of glitches caused by forcing simulated failures, OVD may affect the controlled process. If this is not acceptable, OVD can be disabled, but should be enabled every three months. To ensure safety, you should analyze the sensitivity of each load device attached to the controller for proper operation.

WARNING

A safety program may not disable the Output Voter Diagnostic.

Invensys guarantees that an OVD-forced glitch has the following duration: Less than 2 milliseconds, which is a period that is tolerated well by electro-mechanical devices such as relays, solenoids and contactors. For assistance with load devices that might be sensitive to such glitches, please contact the Invensys Global Customer Support (GCS) center.

Procedure 1

From TriStation 1131 software, disable OVD on all or on specific Digital Output Modules. For instructions, see the guide for the version of TriStation 1131 software being used.

2

Log the date when OVD was disabled so that OVD can be enabled and tested at a later period. For information on OVD enabling, see Enabling “Disabled” Output Voter Diagnostics on page 205


Implementation and Maintenance

205

Checking Controller Power Sources Typically, Tri-GP controllers use redundant sources to power the controller and field circuitry. Under normal operating conditions, the required power is shared between the two power sources. Under abnormal conditions, one of the power sources may be required to provide 100 percent of the controller power. To verify the integrity of the power source and the Power Modules, you must periodically test each power source for its ability to provide power for the entire system when the redundant source is disabled. This procedure explains how to test the power sources used for the controller. Ideally, this test is performed when the controlled process is offline—for example, during a normally scheduled plant maintenance period.

Procedure 1

If possible, take the control process offline.

2

Every three to six months, turn off one of the power sources and leave it off for several minutes.

3

After restoring power, repeat the test for the other power source.

4

Turn on both power sources prior to restarting the controlled process.

Enabling “Disabled” Output Voter Diagnostics This procedure explains how to enable “disabled” Output Voter Diagnostics (OVD) tests used by Digital Output Modules. In some systems, these diagnostic can cause glitches that affect the controlled process. If OVD has been disabled, it should be enabled periodically.

CAUTION

Invensys does not recommend running with OVD disabled for periods greater than three months.

Procedure 1

Ensure the controlled process is shut down. (Do not stop the TriStation 1131 application from running.)

2

In TriStation 1131 software, go to the Controller Panel and enable the disabled OVD points or modules.

3

Leave OVD enabled for several minutes to verify the stability of the modules. This action provides 100 percent failure detection for all components.

4

If required, disable OVD.


206

Chapter 3


Toggling Field I/O Points During a normally scheduled plant maintenance period, you should toggle the field points from the normal operational state to the opposite state to guarantee complete fault coverage of the digital circuitry. Leave each point in the opposite state for several minutes. Ideally, this type of testing is performed with the controlled process offline. For instructions, see the TriStation 1131 Developer’s Guide.

Verifying Spare Modules The controller automatically tests all modules installed in the system. The only action needed to guarantee the integrity of a spare module is to periodically install it in an online system. Spare I/O modules should be installed as hot-spare modules because the controller automatically shifts control between the active and hot-spare modules. Control changes as follows: •

Periodically, approximately once an hour

•

After a power failure

•

After an MP re-education

Spare MP and I/O modules that cannot be used as hot-spare modules should be periodically rotated into an online system to ensure the integrity of spare inventory. A rotation schedule should be established so that a spare module is not allowed to sit on the shelf more that six months.


Module Replacement

207

Module Replacement This section explains how to replace modules after a system has been installed. Topics include: •

Guidelines for Replacing Modules on page 207

•

Replacing a Communication Module on page 209

•

Replacing an I/O Module on page 210

Guidelines for Replacing Modules Before installing any module, these guidelines should be observed.

WARNING

CAUTION

Wait until the Active indicator of the replaced module goes on, then replace the second faulty module.

Inserting modules with damaged pins may cause the controller to malfunction and may affected the controlled process. If the module has damaged pins, return it to Invensys for repair.

•

If a controller has two faults, one in an MP and one in another type of module, replace the MP first.

•

If an I/O module has a field fault and a module fault, resolve the field fault first. Before replacing the I/O module, try clearing the fault by using the Diagnostic Monitor (TriStation 1131 v4 software) or the Diagnostic Panel (TriStation 1131 v3 software). If the I/O module fails to go to Pass or won’t stay in Pass, replace it.

•

Before inserting any module into the baseplate, check for damaged pins. If damaged pins are present, do not insert the module.

•

When replacing a module, you must use a 1/4 inch flat-blade screwdriver to lock or unlock the module.

•

For optimal performance, store spare I/O modules in vacant slots of the controller as hot-spare modules.

•

Store any remaining, unused modules in their original shipping cartons.


208

Chapter 3


Replacing a Main Processor Module This procedure explains how to replace a Main Processor Module. Before replacing an MP, verify that all I/O modules are locked.

CAUTION

After replacing an MP, allow the module to fully re-educate before unlocking another MP. Never unlock more than one MP at a time.

Procedure 1

If the controlled process is online, verify that at least one MP has an Active indicator with a blinking yellow light.

2

On the faulty module, use a 1/4 inch flat-blade screwdriver to rotate the lock lever counter-clockwise until the module ejects from the baseplate.

3

Insert the replacement module and use the screwdriver to rotate the lock lever clockwise to draw the module into the baseplate.

4

The following should occur:

5

•

The Pass indicator should go on and stay on within one to six minutes.

•

The Active indicator on the replacement module should blink at the same rate as the other MP Modules within one to six minutes.

•

The Lock indicator goes off. (If the module is not properly seated, the Lock indicator stays on and the Active indicator does not go on.)

For the faulty module, identify the model and serial numbers. Contact the Invensys Global Customer Support (GCS) center to obtain a Returned Material Authorization (RMA) number. Then return the module to Invensys for repair.


Module Replacement

209

Replacing a Communication Module This procedure explains how to replace a Communication Module.

CAUTION

The CM does not have hot-spare capability which means communication is disrupted while the module is being replaced.

Procedure 1

If possible, make a note of the diagnostic message, model, and serial numbers.

2

Detach all communication cables from the faulty module.

3

On the faulty module, use a 1/4 inch flat-blade screwdriver to rotate the lock lever counter-clockwise until the module ejects from the baseplate. Note

If communication has not been disrupted by the fault, removing the module disrupts communication until the module is replaced. If redundant CM, replacing the faulty module does not affect communication on this module.

4

Insert the replacement module and use the screwdriver to rotate the lock lever clockwise to draw the module into the baseplate.

5

The following should occur: •

The Pass indicator should go on and stay on within one minute.

•

The Active indicator should go on within one to two minutes.

•

The Lock indicator goes off. (If the module is not properly seated, the Lock indicator stays on and the Active indicator does not go on.)

6

Re-attach all communication cables to the CM.

7

For the faulty module, identify the model and serial numbers. Contact the Invensys Global Customer Support (GCS) center to obtain a Returned Material Authorization (RMA) number. Then return the module to Invensys for repair.


210

Chapter 3


Replacing an I/O Module This procedure explains how to replace an I/O module. If an I/O module has a field fault and a module fault, the field fault should be resolved first. You need a 1/4 inch flat-blade screwdriver to install the module.

Procedure 1

If two modules are installed and one has an Active indicator, remove the other (faulty) module by turning the lock counter-clockwise with the screwdriver until the module ejects from the baseplate. (If neither module has an Active indicator on, contact the Invensys Global Customer Support (GCS) center.)

2

Install an identical type module in the empty slot and push the module in until it is firmly seated. Turn the lock clockwise to lock the module on to the baseplate. When the module is installed, the Fault indicator goes on while the diagnostics are running. At the same time, the Point indicators go on briefly, go off, then resume the normal state of blinking. The Pass Indicator should go on within about one minute. If it does not, and the Fault light persists longer than five minutes, check the diagnostic log to determine if there is a problem. If the module is not properly seated, the Lock indicator stays on. The Active indicator does not go on until the I/O module is properly seated and locked. The Active indicator should go on within one to two minutes. Then the Active indicator on the faulty module goes off. If the Active indicator on the newly inserted module does not go on within five minutes, replace it with another module.

3

Identify the model and serial number of the faulty module. Contact the Invensys Global Customer Support (GCS) center to obtain a Returned Material Authorization (RMA) number. Then return the module to Invensys for repair.


4 Fault and Alarm Indicators

Overview 212 Main Processor Indicators 213 Communication Module Indicators 218 Analog Input Module Indicators 221 Analog Input/Digital Input Module Indicators 224 Analog Output Module Indicators 227 Digital Input Module Indicators 230 Digital Output Module Indicators 233 Pulse Input Module Indicators 237 Solid-State Relay Output Module Indicators 240


212

Chapter 4


Overview Indicators are lights on the front panel of each module that identify the state of each module. Each module includes indicators that identify the general state of the module and other indicators related to the function of the module.

CAUTION

The Tri-GP controller can be repaired while operating. However, the integrity of the controller can only be assured if the operator follows repair procedures correctly. If in doubt about the procedures, the operator should take whatever steps are necessary to ensure the safety of the plant and personnel, and then contact Invensys for assistance in implementing the repair procedures.

The types of indicators include: •

Status indicators which identify the processing state of the module. Each module includes a Pass, Fault, and Active indicator.

•

A lock indicator which identifies whether the module is unlocked.

•

Mode indicators which identify the current operating state of the controller. (Only on MP Modules.)

•

Field power and power load indicators which identify whether a power problem has occurred. (Only on some I/O modules.)

•

Communication indicators which identify the type of communication occurring. (Only on MPs and CMs.)

•

Points indicators which identify whether the point is energized.

•

Alarm indicators which identify alarm conditions for the controller. (Only on MP Modules.)

Fault and Alarm Indicators Fault indicators identify potentially serious problems with a module. Alarm conditions identify abnormal field conditions such as loss of power and loss of communication. If a fault or alarm indicator is on, you should consult the appropriate section of this chapter and take appropriate action. This action may include replacing a faulty module or repairing a faulty circuit or device.

Identifying Fault and Alarm Conditions You can identify alarm and fault conditions in these ways: •

By examining the indicators on the front panel of each module and comparing the indicators with the descriptions in this chapter

•

By using the Enhanced Diagnostic Monitor


Main Processor Indicators

213

Main Processor Indicators This section describes indicators for the MP Module, including: •

MP Status Indicators on page 214

•

MP System Mode Indicators on page 215

•

MP Alarm Indicators on page 216

•

MP Communication Indicators on page 217 Pass (Green) PASS

MP Status Indicators

Fault (Red)

FAULT ACTIVE

Active (Yellow) Remote Mode (Green)

MODE REMOTE

System Mode Indicators

Run Mode (Green)

RUN

Program Mode (Yellow)

PROGRAM HALT

Halt Mode (Yellow) Field Power (Red)

ALARMS FIELD POWER

Alarm Indicators

Logic Power (Red)

LOGIC POWER

System Alarm (Red)

SYSTEM ALARM PROGRAM ALARM

Program Alarm (Blue)

OVER TEMPERATURE

Over Temperature (Red)

LOCK

Unlock (Red)

COMMUNICATIONS IO BUS

COMM BUS

Communication Indicators SERIAL

TX RX

TX RX

TX RX

LINK TRISTATION

TX RX

TX/RX I/O Bus (Green/Green) TX/RX Communication Bus (Green/Green) TX/RX Modbus (Green/Green) Link TriStation(Green) TX/RX TriStation (Green/Green)

MP3101S2 Figure 101

MP Front Panel Indicators


214

Chapter 4


MP Status Indicators The MP status indicators identify the processing state for the MP Module. A fault light indicates that the processor has an internal fault.

Normal States Pass

Fault

Active

Lock

Description

Action

Green steady

No light

Yellow blinking

No light

Module is operating normally. Active indicator blinks once per scan when executing a control program.

Normal status. No action is required.

Green steady

No light

No light

No light

Module is operating normally. Possible conditions include: Control program has not been loaded into the MP.

Load control program.

Control program has been loaded into the MP, but has not been started up.

Start control program.

Module has just been installed and is currently being educated by the other MP Modules.

Wait for the module to be educated.

Fault States Pass

Fault

Active

Lock

Description

Action

No light

Red steady

—a

No light

Module may have failed. Possible conditions include:

See mode indicator status for power-up states.

Module may be in the process of power-up self-test.

If the Pass indicator does not go on within five minutes, replace the module.

Module has detected a fault.

Module is operational, but should be replaced.

No light

Red steady

—

Red steady

Module is unlocked from the baseplate.

Lock module using a 1/4-inch flat-blade screwdriver.

Green steady

Red steady

—

—

Indicators/signal circuitry on the module are malfunctioning.

Replace the module.

No light

No light

—

—

Indicators/signal circuitry on the module are malfunctioning

Replace the module.

a. This symbol ( — ) means the indicator is not important for this condition.



215

MP System Mode Indicators The MP system mode indicators identify the current operating state of the controller. (Operational modes are set in TriStation 1131 software. For more information, see the TriStation 1131 Developer’s Guide.) Remote

Run

Program

Halt

Description

Green steady

Green steady

Yellow steady

No light

Normal operation with write capability. Allows writes to program variables by TriStation 1131 software, Modbus master, and external hosts. Allows control of the controller from TriStation 1131 software, including Download All and Download Change.

Green steady

Green steady

No light

No light

Normal operation with read-write capability.

No light

Green steady

No light

No light

Normal operation with read-only capability.

No light

No light

Yellow steady

Yellow steady

Control program loading and checkout is enabled.

Green slow blinking

Green slow blinking

Yellow slow blinking

Yellow slow blinking

Indicators change every few seconds; module is in its power-up state.

Green fast blinking

Green fast blinking

Yellow fast blinking

Yellow fast blinking

Module is ready to download new internal firmware. Condition is caused by removing the MP Baseplate address plug before module power-up.

No light

No light

No light

Yellow steady

Control program has stopped.

Green steady

Green steady

Yellow steady

Yellow steady

Module is faulty or has detected a bad address plug.

Allows writes to program variables by Modbus masters and external hosts. (Download All and Download Change by TriStation 1131 software are not allowed.) MP Modules execute the previously loaded control program. Attempts to modify program variables by Modbus masters and external hosts are rejected. Allows control of the controller from the TriStation 1131 control program, including Download All and Download Change. Control program has also been stopped.


216

Chapter 4


MP Alarm Indicators The MP alarm indicators identify alarm conditions for the controller. Field Power

Logic Power

System Alarm

Program Alarm

Over Temp

—a

Red steady

Red steady

—

Red steady

—

Red steady

—

—

Red steady

Description

Action

—

System power supply is missing/bad.

Correct the problem.

—

—

Field power supply is missing/bad.

Correct the problem.

—

—

MP or I/O module is malfunctioning.

Identify the condition by looking at the Pass or Fault indicators of other modules or by using the TriStation 1131 Diagnostic Panel. Replace faulty module.

—

—

—

—

—

Red steady

Blue steady

—

—

Red steady

I/O module has detected a field fault.

Correct field fault.

Control program has detected an alarm condition.

Check control program for bypass or overridden points or other abnormal condition.

Control program has detected an alarm condition. Alarm contacts also indicate an alarm (open contacts).

Identify the fault condition by using the control program.

Normal operation, but the ambient temperature is too high (greater than 140°F/60°C).

Correct the environmental problem or the controller may fail prematurely.



Correct the condition.


217

MP Communication Indicators The MP communication indicators identify the type of communication occurring on the controller. The TX light indicates the MP is transmitting a message and the RX light indicates the MP is receiving a message. I⁄O Bus

Comm Bus

Serial

TriStation

RX/TX

RX/TX

RX/TX

Link

RX/TX

Description

Green blinking

—a

—

—

—

Normal response. MP is polling and sending responses to the I/O modules.

—

Green blinking

—

—

—

Normal response. MP is polling and sending responses to the CMs.

—

—

Green blinking

—

—

Normal response. MP is polling and sending responses to the Modbus master.

—

—

—

Green steady

Green blinking

MP is communicating with TriStation 1131 software.

—

—

—

No light

—

MP is not communicating with TriStation 1131 software or a network hub. Note: The hub or Ethernet card in the PC running the TriStation 1131 software has a link indicator that shows whether a hardware connection has been established with the MP.



218

Chapter 4


Communication Module Indicators This section describes indicators for the CM, including: •

CM Status Indicators on page 219

•

CM Communication Indicators on page 220 Pass (Green)

CM Status Indicators

PASS

Fault (Red)

FAULT ACTIVE

Active (Yellow)

LOCK

Unlock (Red)

COMMUNICATIONS SERIAL

TX RX

SERIAL

TX RX

Communication Indicators

SERIAL

TX RX

LINK NET 1 TX RX

LINK NET 2

TX RX

Serial 1 (Green/Green) Serial 2 (Green/Green) Serial 3 (Green/Green) Net 1 Link (Green) Net 1 TX/RX (Green/Green) Net 2 Link (Green) Net 2 TX/RX (Green/Green)

CM 3201S2 Figure 102

CM Front Panel Indicators


Communication Module Indicators

219

CM Status Indicators The CM status indicators identify the processing state for the CM. A fault light indicates that the processor has an internal fault.

Normal States Pass

Fault

Active

Lock

Description

Action

Green steady

No light

Green steady

No light

Module is operating normally.

Normal status. No action is required.

Green steady

No light

Green blinking

No light

Module is downloading firmware.

Normal status. To cancel, pull module then re-seat module.

Green steady

No light

No light

No light

Module is operating normally. Possible conditions include: Control program has not been loaded into the MP.

Load control program.


Start control program.

Module has just been installed and is currently being educated by the other MP Modules.

Wait for module to be educated.

Fault States Pass

Fault

Active

Lock

Description

Action

No light

Red steady

No light

No light


See mode indicator status for power-up states.

Module may be in the process of power-up selftest.

If the Pass indicator does not go on within five minutes, replace module.

No light

Red steady

Green steady

No light

Module has detected a minor error.


No light

Red steady

—a

Red steady


Lock module.

Green steady

Red steady

—

—


Replace the module.

No light

No light

—

—


Replace the module.


220

Chapter 4



CM Communication Indicators The CM communication indicators identify the type of communication occurring on the controller. The TX light indicates the CM is transmitting a message and the RX light indicates the CM is receiving a message. Serial 1

Serial 2

Serial 3

Net 1

RX/TX

RX/TX

RX/TX

Link

Green blinking

—a

—

—

—

Normal response. CM is communicating with the attached Modbus master/slave device.

—

Green blinking

—

—

—


—

—

Green blinking

—

—


—

—

—

Green steady

Green blinking

—

—

CM is communicating with TriStation 1131 software or with an Ethernet device through the Net 1 port.

—

—

—

—

—

Green steady

Green blinking

CM is communicating with TriStation 1131 software or with an Ethernet device through the Net 2 port.

RX/TX

Net 2 Link

RX/TX



Description

Analog Input Module Indicators

221

Analog Input Module Indicators This section describes the AI Module indicators including: •

AI Status Indicators on page 222

•

AI Field Power Indicator on page 223 Pass (Green)

AI Status Indicators Field Power Indicator

PASS

Fault (Red)

FAULT

Active (Green)

ACTIVE FIELD PWR

Field Power (Yellow)

LOCK

Unlock (Red)

AI 3351S2 Figure 103

AI Front Panel Indicators


222

Chapter 4


AI Status Indicators The AI status indicators identify the processing state for the AI Module. A fault light indicates that the module has an internal fault.

Normal States Pass

Fault

Active

Lock

Description

Action

Green steady

No light

Green steady

No light


No action is required.

Fault States Pass

Fault

Active

Lock

Description

Action

Green steady

No light

No light

No light


If this is the hot-spare module, no action is required.

Control program has not been loaded into the MP. Control program has been loaded into the MP, but has not been started up.

If the module is active, replace module.

Module has just been installed and is currently running start-up diagnostics. The other module is active. No light

Red steady

—a

No light





Module has detected marginal input voltage in a steady-state condition.

Check sensor signal strength. Check sensor positioning.

—

—

—

Red steady



Green steady

Red steady

—

—


Replace the module.

No light

No light

—

—


Replace the module.



Analog Input Module Indicators

223

AI Field Power Indicator The AI field power indicator is lit when a field power problem has occurred. Field Power Yellow steady

Description

Action

Field power or logic power from one or more of the redundant sources is missing.

To isolate the missing power source, use the TriStation 1131 software. To determine the actual state, use a voltmeter, then correct the problem in the external circuit. If these steps do not solve the problem, replace the module.


224

Chapter 4


Analog Input/Digital Input Module Indicators This section describes the AI/DI Module indicators including: •

AI/DI Status Indicators on page 225

•

AI/DI Field Power Indicator on page 226 Pass (Green)

AI/DI Status Indicators Field Power Indicator

PASS

Fault (Red)

FAULT

Active (Green)

ACTIVE FIELD PWR

Field Power (Yellow) 1 2 3 4 5 6 7

Points Indicators

8

1–16 DI Points (Green)

9 10 11 12 13 14 15 16

LOCK

Unlock (Red)

AI/DI 3361S2 Figure 104

AI/DI Front Panel Indicators


Analog Input/Digital Input Module Indicators

225

AI/DI Status Indicators The AI/DI status indicators identify the processing state for the AI/DI Module. A fault light indicates that the module has an internal fault.

Normal States Pass

Fault

Active

Lock

Description

Action

Green steady

No light

Green steady

No light



Fault States Pass

Fault

Active

Lock

Description

Action

Green steady

No light

No light

No light






Red steady

—a

No light







—

—

—

Red steady



Green steady

Red steady

—

—


Replace the module.

No light

No light

—

—


Replace the module.



226

Chapter 4


AI/DI Field Power Indicator The AI/DI field power indicator is lit when a field power problem has occurred. Field Power Yellow steady

Description

Action




Analog Output Module Indicators

227

Analog Output Module Indicators This section describes the AO Module indicators including: •

AO Status Indicators on page 228

•

AO Field Alarm Indicator on page 229 Pass (Green)

AO Status Indicators Field Alarm Indicator

PASS

Fault (Red)

FAULT

Active (Green)

ACTIVE PWR/LOAD

Field Alarm (Yellow)

LOCK

Unlock (Red)

AO 3481S2 Figure 105

AO Front Panel Indicators


228

Chapter 4


AO Status Indicators The AO status indicators identify the processing state for the AO Modules. A fault light indicates that the module has an internal fault or is missing field power.

Normal State Pass

Fault

Active

Lock

Description

Action

Green steady

No light

Green steady

No light



Fault States Pass

Fault

Active

Lock

Description

Action

Green steady

No light

No light

No light






Red steady

—a

No light



Field power is missing, if field power light is also on.

Restore field power and reseat the module.





—

—

—

Red steady



Green steady

Red steady

—

—


Replace the module.


Analog Output Module Indicators

Pass

Fault

Active

Lock

Description

Action

No light

No light

—

—


Replace the module.

229


AO Field Alarm Indicator The AO field fault indicator is lit when a field power problem has occurred. Field Alarm Yellow steady

Description

Action

Field power or logic power from one or more of the redundant sources is missing or a field error is detected. A field error may be an open load or an out-of-compliance error.



230

Chapter 4


Digital Input Module Indicators This section describes the DI Module indicators including: •

DI Status Indicators on page 231

•

DI Field Power Indicator on page 232

•

DI Point Indicators on page 232 Pass (Green)

DI Status Indicators Field Power Indicator

PASS

Fault (Red)

FAULT

Active (Green)

ACTIVE FIELD PWR

Field Power (Yellow) 1 2 3 4 5 6 7

Points Indicators

8 9 10 11 12 13 14 15 16

LOCK

Unlock (Red) 1–32 Points (Green)

17 18 19 20 21 22

Points Indicators

23 24 25 26 27 28 29 30 31 32

DI 3301S2 Figure 106

24v

DI Front Panel Indicators


Digital Input Module Indicators

231

DI Status Indicators The DI status indicators identify the processing state for the DI Module. A fault light indicates that the module has an internal fault.

Normal State Pass

Fault

Active

Lock

Description

Action

Green steady

No light

Green steady

No light



Fault States Pass

Fault

Active

Lock

Description

Action

Green steady

No light

No light

No light

Module may have failed. Possible conditions include: Control program has not been loaded into the MP.




Module has just been installed and is currently running start-up diagnostics. Other module is active. No light

Red steady

—a

No light





—

—

—

Red steady


Lock the module using a 1/4-inch flat-blade screwdriver.

Green steady

Red steady

—

—


Replace the module.

No light

No light

—

—


Replace the module.



232

Chapter 4


DI Field Power Indicator The DI field power indicator is lit when a field power problem has occurred. Field Power Yellow steady

Description

Action


To isolate the missing power source, use the TriStation 1131 software. Correct the problem in the field circuit. If these steps do not solve the problem, replace the module.

DI Point Indicators The DI point indicators identify whether the point is energized or not energized. Point (1-32)

Description

Green steady

Field circuit is energized.

No light

Field circuit is not energized.


Digital Output Module Indicators

233

Digital Output Module Indicators This section describes the DO Module 3401S2 and SDO Module 3411S2 indicators, including: •

Status Indicators on DO and SDO Modules on page 235

•

Power/Load Indicator on DO and SDO Modules on page 236

•

Point Indicators on DO and SDO Modules on page 236

•

Point Indicators on DO and SDO Modules on page 236

•

Load Indicators on SDO Modules on page 236 Pass (Green)

DO Status Indicators Field Power Indicator

PASS

Fault (Red)

FAULT

Active (Green)

ACTIVE PWR/LOAD

Power/Load (Yellow) 1 2 3 4 5 6 7

Points Indicators

8

1–16 Points (Green)

9 10 11 12 13 14 15 16

LOCK

DO3401S2 Figure 107

Unlock (Red)

24v

DO Module 3401S2 Front Panel Indicators


234

Chapter 4


Pass (Green) Status Indicators Field Power Indicator

PASS

Fault (Red)

FAULT

Active (Green)

ACTIVE PWR/LOAD

Power/Load (Yellow) 1 2 3 4 5 6 7

Point Indicators

POINTS

8


9 10 11 12 13 14 15 16

LOCK

Unlock (Red)

1 2 3 4 5 6 7

Load Indicators

LOAD

8 9

1–16 Points (Yellow)

10 11 12 13 14 15 16

SDO 3411S2 24VDC

Figure 108

SDO Module 3411S2 Front Panel Indicators


Digital Output Module Indicators

235

Status Indicators on DO and SDO Modules The status indicators on the DO and SDO modules identify the processing state. A fault light indicates that the module has an internal fault. If you have a field fault and a module fault, resolve the field fault first.

Normal State Pass

Fault

Active

Lock

Description

Action

Green steady

No light

Green steady

No light



Fault States Pass

Fault

Active

Lock

Description

Action

Green steady

No light

No light

No light





Module has just been installed and is currently running start-up diagnostics. Other module is active. No light

Red steady

—a

No light



Excessive load current required.

Correct field fault condition.



—

—

—

Red steady



Green steady

Red steady

—

—


Replace the module.

No light

No light

—

—


Replace the module.



236

Chapter 4


Power/Load Indicator on DO and SDO Modules The power/load indicator on DO and SDO modules is lit when a power/load problem has occurred. Power/Load

Description

Action

Yellow steady

For at least one point, the commanded state and the measured state do not agree, logic power for one or more of the redundant sources is missing, or field power for one or both redundant sources is outside the operational range.

To isolate the suspected point or determine the commanded state of the point, use the TriStation 1131 software. To determine the actual state of the output, use a voltmeter, then correct the problem in the external circuit. Verify that load current is within product specification. If these steps do not solve the problem, replace the module.

Point Indicators on DO and SDO Modules The point indicators on DO and SDO modules identify whether the point is energized or not energized. Point (1-16)

Description

Green steady


No light


Load Indicators on SDO Modules The load indicators on SDO modules identify whether there is a fault in the field circuitry. Point (1-16)

Description

Action

Yellow steady

A fault is detected in the field circuit or the load is not connected to one or more output points.

Check for shorted or open loads and fix. Connect all output points that are not connected. Use the TriStation 1131 software to set the DO Point Options to Non-Supervised for unused points and points being used to drive loads that do not draw the minimum current required for supervision.

No light

The field circuit is operating properly.



Pulse Input Module Indicators

237

Pulse Input Module Indicators This section describes the PI Module indicators including: •

PI Status Indicators on page 238

•

PI Field Fault Indicator on page 239

•

PI Point Indicators on page 239 Pass (Green)

PI Status Indicators Field Power Indicator

PASS

Fault (Red)

FAULT

Active (Green)

ACTIVE FIELD PWR

Field Power (Yellow)

1 2

Points Indicators

3


4 5 6

LOCK

Unlock (Red)

PI 3382S2 Figure 109

PI Front Panel Indicators


238

Chapter 4


PI Status Indicators The PI status indicators identify the processing state for the PI Module. A fault light indicates that the module has an internal fault.

Normal State Pass

Fault

Active

Lock

Description

Action

Green steady

No light

Green steady

No light



Fault State Pass

Fault

Active

Lock

Description

Action

Green steady

No light

No light

No light






Red steady

—a

No light







—

—

—

Red steady



Green steady

Red steady

—

—


Replace the module.

No light

No light

—

—


Replace the module.



Pulse Input Module Indicators

239

PI Field Fault Indicator The PI field fault indicator is lit when a field power problem has occurred. Field

Description

Action

Yellow steady


To isolate the missing power source, use the TriStation 1131 software.

PI Point Indicators The PI point indicators identify whether the point is greater than or less than 0.5 hertz. Point (1-6)

Description

Green steady

Input frequency is greater than 0.5 Hz.

No light

Input frequency is less than 0.5 Hz.


240

Chapter 4


Solid-State Relay Output Module Indicators This section describes the SRO Module indicators including: •

SRO Status Indicators on page 241

•

SRO Point Indicators on page 242 Pass (Green)

SRO Status Indicators

PASS

Fault (Red)

FAULT ACTIVE

Active (Green) 1 2 3 4 5 6 7

Points Indicators

8 9 10 11 12 13 14 15 16

LOCK

Unlock (Red) 1–32 Points (Green)

17 18 19 20 21 22 23

Points Indicators

24 25 26 27 28 29 30 31 32

RO 3451S2 Figure 110

24v

SRO Front Panel Indicators


Solid-State Relay Output Module Indicators

241

SRO Status Indicators The SRO status indicators identify the processing state for the SRO Module. A fault light indicates that the module has an internal fault.

Normal State Pass

Fault

Active

Lock

Description

Action

Green steady

No light

Green steady

No light



Fault State Pass

Fault

Active

Lock

Description

Action

Green steady

No light

No light

No light






Red steady

—a

No light







—

—

—

Red steady



Green steady

Red steady

—

—


Replace the module.

No light

No light

—

—


Replace the module.



242

Chapter 4


SRO Point Indicators The SRO point indicators identify whether the point is energized or not energized. Point (1-32)

Description

Green steady


No light



A Pin-Outs for Cables and Connectors

Ethernet Connectors 244 Serial Connectors 247 Ethernet Cables 250 Serial Cables 251 Diagread Cables and Debug Connectors 255


244

Appendix A

Pin-Outs for Cables and Connectors

Ethernet Connectors This section includes pin-out information for these Ethernet connectors: •

10BaseT and 100BaseTX Ethernet Connectors on page 244

•

AUI 10 Megabit Ethernet MAU Connectors on page 244

•

MII Ethernet MAU Connectors on page 245

10BaseT and 100BaseTX Ethernet Connectors This section includes pin-out information for 10BaseT and 100BaseTX Ethernet connectors. The MP Baseplate and CM Baseplate include these type of connectors, which are typically used to connect to a PC running the TriStation 1131 software. Shield 1 TD+ 2 TD– 3 RD+ 4 5 6 RD– 7 8

Table 42 RJ-45 Pin

10BaseT and 100BaseTX Ethernet Connector Pin-Outs Signal

Direction

Function

1

TD+

Out

Transmit data +

2

TD-

Out

Transmit data –

3

RD+

In

Receive data +

4

NC

—

5

NC

—

6

RD-

In

7

NC

—

8

NC

—

Shield

—

Housing

Receive data –

Safety ground

AUI 10 Megabit Ethernet MAU Connectors This section includes pin-out information for AUI 10 megabit Ethernet MAU connectors, which are included on the CM Baseplate. Slide Clip

Table 43 DB15 Pin

1 2 3 4 5 6 7 8 Shield

9 10 11 12 13 14 15

AUI 10 Megabit Ethernet MAU Connector Pin-Outs Signal

Direction

1

Ground

—

2

CI+

In

Transmit data –

3

DO+

Out

Data output +

4

Ground

—

5

DI+

In

Data input +

6

Ground

—

Receive data –


Function

Ethernet Connectors

Table 43 DB15 Pin

245

AUI 10 Megabit Ethernet MAU Connector Pin-Outs (continued) Signal

Direction

Function

7

NC

—

8

Ground

In

MAU present detect

9

CI–

In

Collision input –

10

DO–

Out

Data output –

11

Ground

—

12

DI–

In

Data input –

13

+12 V

Out

MAU power –

14

Ground

—

15

NC

—

MII Ethernet MAU Connectors This section includes pin-out information for MII Ethernet MAU connectors, which are included on the CM Baseplate. Table 44 1

20

Shield

21

40

DB40Pin

MII Ethernet MAU Connector Pin-Outs Signal

Direction

Function

1

+5 V

Out

MII MAU power

2

MDIO

In/Out

Management data

3

MDC

Out

Management data clock

4

RxD<3>

In

Receive data 3

5

RxD<2>

In

Receive data 2

6

RxD<1>

In

Receive data 1

7

RxD<0>

In

Receive data 0

8

Rx DV

In

Receive data valid

9

Rx_Clk

In

Receive clock

10

Rx_Er

In

Receive error

11

Tx_Er

Out

Transmit error

12

Tx_Clk

In

Transmit clock

13

Tx_En

Out

Transmit enable

14

TxD<0>

Out

Transmit data 0

15

TxD<1>

Out

Transmit data 1

16

TxD<2>

Out

Transmit data 2

17

TxD<3>

Out

Transmit data 3


246

Appendix A


Table 44 DB40Pin

MII Ethernet MAU Connector Pin-Outs (continued) Signal

Direction

Function

18

Col

In

Collision (half-duplex)

19

CRS

In

Carrier receive sense

20

+5 V

Out

MII MAU power

21

+5 V

Out

MII MAU power

22

Logic ground

—

MII MAU logic ground

23

Logic ground

—


24

Logic ground

—


25

Logic ground

—


26

Logic ground

—


27

Logic ground

—


28

Logic ground

—


29

Logic ground

—


30

Logic ground

—


31

Logic ground

—


32

Logic ground

—


33

Logic ground

—


34

Logic ground

—


35

Logic ground

—


36

Logic ground

—


37

Logic ground

—


38

Logic ground

—


39

Logic ground

—


40

+5 V

Out

MII MAU power


Serial Connectors

247

Serial Connectors This section includes pin-out information for these serial connectors: •

RS–232 Pin-Outs on page 247

•

RS–485 Pin-Outs on page 248

RS–232 Pin-Outs This section includes pin-out information for RS–232 serial connections, which are typically used for Modbus communication. The serial ports on the MP and CM Baseplate can be configured in TriStation 1131 software as RS–232 or RS–485. Table 45 6 7 8 9

1 2 3 4 5

DB–9 Pin

Shield

RS–232 Pin-Outs Signal

Direction

RS–232 Function

1

CD

In

Carrier detect

2

RXD

In

Receive data

3

TXD

Out

Transmit data

4

DTR

Out

Data terminal ready

5

GND

—

Signal ground

6

DSR

—

Not used (data set ready)

7

RTS

Out

Request to send

8

CTS

In

Clear to send

9

RI

—

Not used (ring indicator)

Shield

—

Safety ground

Housing

Behavior and Effects of the RS–232 Signals This table describes the interaction between a module and RS–232 signals. Spacing (on or 0) occurs when RS–232 signals are between +6 and +12 VDC; marking (off or 1) occurs when they are between –6 and –12 VDC. The maximum cable length is 50 feet (15 meters), but can be extended using modems. Table 46

Behavior and Effects of the RS–232 Signal

Signals

Designator

Description

Carrier Detect

CD

In HRDWR handshake mode, module ignores any data received while CD is not asserted. The CD signal must be asserted by the connected equipment for the module to receive messages. When not in HRDWR handshake mode, the module ignores the CD signal.

Receive Data

RXD

Module receives serial data


248

Appendix A


Table 46

Behavior and Effects of the RS–232 Signal

Signals

Designator

Description

Transmit Data

TXD

Module transmits serial data

Data Terminal Ready

DTR

Always asserted by the module when the port is configured.

Data Set Ready

DSR

Input signal to module. Ignored in all cases.

Request to Send

RTS

When in HRDWR handshake mode, the module set RTS on when it has data to send. When not in HRDWR handshake mode, the module asserts the RTS signal continuously.

Clear to Send

CTS

When in HRDWR handshake mode, the module waits for CTS to go on before transmitting data. When not in HRDWR handshake mode, the module ignores CTS and transmits data as soon as it is available.

Data Carrier Detect

DCD

Module ignores DCD and always accepts data from RXD

Transmitted Data

TD

Transmitted data from the module

Received Data

RD

Received data from the equipment connected to the port

RS–485 Pin-Outs This section includes pin-out information for RS–485 serial connections, which are typically used for Modbus communication. The serial ports on the MP and CM Baseplate can be configured in TriStation 1131 software as RS–232 or RS–485. Table 47 6 7 8 9 Shield

1 2 3 4 5

DB–9 Pin

RS–485 Pin-Outs Signal

Direction

RS–485 Function

1

—

—

—

2

RD-A

In

Receive data

3

SD-A

Out

Transmit data

4

—

—

—

5

GND

—

Signal ground

6

—

—

—

7

SD-B

Out

Transmit data, invert

8

RD-B

In

Receive data, invert

9

OUT

Term

5 VDC through 1k Ω

Shield

—

Safety ground

Housing


Serial Connectors

249

RS–485 Signal Descriptions This table describes RS–485 signals, which are transmitted over a cable of twisted-pair-wires. The polarity of the 2-to-6-volt differential between the two wires indicates whether the data is marking or spacing. If terminal A is negative with respect to terminal B, the line is marking. If terminal A is positive with respect to terminal B, the line is spacing. The maximum cable length is dependent on the wire used. For example, using 24–AWG twisted-pair wire, the maximum length is 4,000 feet (1.2 kilometers), but can be extended using modems. Table 48

RS–485 Signal Descriptions

Signal

Designator

Description

Transmit Data Transmit Data Inverted

SD-A SD-B

Module transmits serial data

Receive Data Receive Data Inverted

RD-A RD-B

Module receives serial data

Signal Ground

GND

Signal ground

5 VDC through 1k Ω

Not used


250

Appendix A


Ethernet Cables Ethernet cables can be used to connect the MP Modules or CMs to a PC running the TriStation 1131 software or an Ethernet hub.

Cross-Over Cable Cross-over cables can be used to link the Ethernet card on a PC to the Ethernet connectors on the MP or CM Baseplate. The cable can be used for 10BaseT or 100BaseTX communication. Crossover cable TD+ 1 TD– 2 RD+ 3 4 5 RD– 6 7 8 Shield

1 TD+ 2 TD– 3 RD+ 4 5 6 RD– 7 8 Shield

Crossover cable

Crossover cable RJ-45 Connector

1 2 3 4 5 6 7 8

RJ-45 Connector

1 2 3 4 5 6 7 8

Shield

Straight-Through Cable Straight-through cables can be used to link the Ethernet connector on the MP or CM Baseplate to an Ethernet hub, or link the PC running TriStation 1131 software to an Ethernet hub. The cable can be used for 10BaseT or 100BaseTX communication.

Straight-Through Cable TD+ 1 TD– 2 RD+ 3 4 5 RD– 6 7 8 Shield

1 TD+ 2 TD– 3 RD+ 4 5 6 RD– 7 8 Shield Straight-Through Cable

Straight-Through Cable 1 2 3 4 5 6 7 8

RJ-45 Connector

RJ-45 Connector

Shield


1 2 3 4 5 6 7 8

Serial Cables

251

Serial Cables This section describes serial cables which are generally used for Modbus communication. Cable types include: •

RS-232 Serial Cable on page 251

•

RS-485 Serial Cables on page 251

RS-232 Serial Cable This figure depicts the RS-232 serial cable, which is a standard null-modem cable used to link the serial connector on the MP Baseplate to a PC acting as the Modbus master.

RS-232 Modbus Serial Cable (Null Modem) Housing D9 TXD 3 RXD 2 Signal Ground 5 DTR 4 DSR 6 CD 1 RTS 7 CTS 8

D9 Housing 2 RXD 3 TXD 5 Signal Ground 4 DTR 6 DSR 1 CD 7 RTS 8 CTS

MP Baseplate Female Connector P2 (9 pins) (molded hood)

PC Female Connector P1 (9 pins)

6

1

6

1

9

5

9

5

Housing Ground

RS-485 Serial Cables RS–485 serial cables are typically used for point-to-point (direct) and multi-point (network) connections between a CM and a Modbus master, or point-to-point (direct) connections between an MP and a Modbus master. The CM serial ports are configurable for multi-point RS485 operation without using modems.


252

Appendix A


This table identifies the RS-485 network specifications. Table 49

RS-485 Serial Cable Specifications

Item

Specification

Nodes

One Modbus master and one slave

Cable length

Cable dependent—4,000 ft (1.2 km) maximum using 24-AWG twisted-pair wire (shielding recommended)

Transmission rate (bps)

1200, 2400, 4800, 9600, 19.2 K, 38.4 K, 57.6 K, 115.2 K

The network trunk should consist of double twisted-pair wires. When the trunk consists of double twisted pairs, one pair serves as the output line for the Modbus master (input line to all slaves). The other pair serves as the input line to the Modbus master (output line from all slaves). When the trunk consists of a single twisted pair, it serves as both the output and input lines to the Modbus master and all slaves. The trunk accommodates up to 32 two-foot branches, without restriction on the distance between branches.

RS–485 Slave Network When a CM is a slave in a multi-point network, multiple transmitters connect to the same conductor. One transmitter can be active at any time; otherwise, the signal is distorted. Each node must be in the tristate (or off) mode. To set the tristate mode for the CM, set the Handshake mode to Hardware in the TriStation 1131 application. Network Trunk Trunk R Trunk T RD-A RD-B SD-A SD-B

CM or MP Serial Port 1

Shield

2

RD-A

6

SD-B

7 3

SD-A RD-B

8 4

5 VDC through 1 K7 (optional)

9 5

Signal Ground (optional) 1 K7


Serial Cables

253

RS–485 Master Network Network Trunk Trunk R Trunk T RD-A RD-B SD-A SD-B

CM or MP Serial Port 1

Shield

2

RD-A

6

SD-B

7 3

SD-A RD-B

8 4

5 VDC through 1 K7 (optional)

9 5

Signal Ground (optional) 1 K7

RS–485 Cable Selection These are guidelines for selecting an RS–485 cable for a Modbus network. •

Maintain a cable impedance of greater than or equal to 100 ohms.

•

Supply a separate shield for each twisted pair.

•

Use double twisted-pair networks to house the pairs in a single sheath or in separate sheaths.

•

Use branch cable of the same quality as the trunk cable, but of less rigid construction. For example, use Belden 9182 (150-ohm) for the trunk and Belden 9729 (150-ohm) for the branches.

•

Follow all applicable local codes.

•

Terminate the cable in the characteristic impedance of the cable.

RS–485 Cable Termination RS-485 trunk cable termination (point-to-point or multi-point for the CM, point-to-point for the MP) greater than 650 feet (200 meters) requires termination at each end. Traditionally, resistors are connected to each end of the cable. This technique matches the cable impedance and prevents signal reflections which could cause data errors. However, this technique has the following three undesirable side effects: •

When no driver is active on the pair, the resistors pull the two wires together. Noise— even very low-level noise—can appear to be data when the wires are in this state.

•

When a driver is active on the pair but not sending data, the resistors cause 33 mA of DC current to flow in the cable. This is an excessive load on the driver.

•

When a driver is transmitting data over the cable, the resistors lower the signal level and consequently lower the immunity to noise.


254

Appendix A


A better technique for terminating the cable pair is to use an RC network and pull-up/pulldown resistors. This reduces power consumption and forces the pair to a valid data state when no driver is active. For both types of termination, resistor values must match the characteristic impedance of the cable.

Traditional Network Termination Cable R

Modbus Master

SD-A SD-B Ground RD-A RD-B + 5 VDC through 1 kW


Cable T

MP Slave

Recommended Network Termination Using a Double-Pair Network .01 mf

.01 mf

Cable T

.01 mf

Modbus Master

SD-A SD-B Ground RD-A RD-B + 5 VDC through 1 kΩ

Cable R


.01 mf

MP Slave


Diagread Cables and Debug Connectors

255

Diagread Cables and Debug Connectors This section includes information about diagread cables and Debug connectors that are available for the MP, CM, and I/O modules.

Diagread Cable This figure depicts a diagread cable. Diagread Cable

MP and Left-Position CM Debug Connector 1 2 3 4 5 6

1 2 3 4 5 6

2 3 5

9-pin D-Sub-to-Modular

Straight-Through RJ-12 Cable (standard 6-wire telephone cable) 6-pin RJ12 Adapter

Debug Connector for MP and Left-Position CMs For the MP and left-position CMs, the Debug connector uses pins 1, 2 and 3. Table 50 1 2 3 4 5 6

RJ–12 Pin

MP and Left-Position CM Debug Connector Pin-Outs Signal

Direction

Description

1

TXD

Out

Module Diagread Transmit Data

2

RXD

In

Module Diagread Receive Data

3

GND

—

Module Ground

Debug Connector for I/O and Right-Position CMs For I/O and right-position CMs, the Debug connector uses pins 4, 5 and 6. Table 51 1 2 3 4 5 6

RJ–12 Pin

I/O and Right-Position CM Debug Connector Pin-Outs Signal

Direction

Description

4

TXD

Out

Module Diagread Transmit Data

5

RXD

In

Module Diagread Receive Data

6

GND

—

Module Ground


256

Appendix A



B Non-Incendive Circuit Parameters

MP and CM Non-Incendive Circuit Parameters 258 Hazardous Location HART Baseplate Non-Incendive Circuit Parameters 259


258

Appendix B

Non-Incendive Circuit Parameters

MP and CM Non-Incendive Circuit Parameters This figure depicts special parameters which apply to Main Processor and Communication Modules for non-incendive communication circuits in the field. These parameters are extracted from Triconex Drawing 9110043-001, REV. A.

MP Model 3101S2

CM Model 3201S2

Figure 111

CLASS 1, DIV 2 HAZARDOUS LOCATION

CLASS 1, DIV 2 OR NON-HAZARDOUS

NETWORK

(9) SHIELDED TWISTED PAIR IN/OUT SIGNALS

SERIAL PORT

(9) SHIELDED IN/OUT SIGNALS

RS-232 DIAG READ

(5) IN/OUT SIGNALS

NETWORK #1


NETWORK #2


SERIAL PORT #1


SERIAL PORT #2


SERIAL PORT #3


RS-232 DIAG READ

(3) IN/OUT SIGNALS

ASSOCIATED APPARATUS (NOTE 1)

ASSOCIATED APPARATUS (NOTE 1)

Non-Incendive Communication Circuits Simplified Schematic

Note 1 in the figure applies to FMRC-approved apparatus. The voltage (Vmax) and current (Imax) that the load device can receive must be equal to or greater than the maximum open circuit voltage (Voc) and maximum short circuit current (Isc) that can be delivered by the source device. In addition, the maximum capacitance (Ci) and inductance (Li) of the load, which is not prevented by circuit components from providing a stored energy charge to the field wiring (for example, diode across a winding to clamp an inductive discharge), and the capacitance and inductance of the interconnecting wiring must be equal to or less than the capacitance (Ca) or inductance (La) that can be driven by the source device. MP Model 3101S2

CM Model 3201S2

NETWORK

SERIAL PORT and RS-232 DIAG READ

NETWORKS 1 and 2

SERIAL PORTS 1, 2, 3 and RS-232 DIAG READ

Voc/Vmax

1V/1V

10V/10V

1V/1V

10V/10V

Isc/Imax

1mA/1mA

30mA/30mA

1mA/1mA

30mA/30mA

Ca/Ci

11nf/11nf

15uF/0

11nf/11nf

15uF/0

La/Li

1.3mH/1.3mH

85mH/0

1.3mH/1.3mH

85mH/0

Figure 112

Signal Levels for Non-Incendive Communication Circuits

For detailed information on signal data (inputs or outputs), see the manufacturer’s documentation.


Hazardous Location HART Baseplate Non-Incendive Circuit Parameters

259

Hazardous Location HART Baseplate Non-Incendive Circuit Parameters The following tables describe non-incendive circuit parameters for hazardous location HART baseplates. While reading these tables, please note the following: •

For C, ATEXmax = C internal, max (Ci) + C external, max (Co)

•

For L, ATEXmax = L internal, max (Li) + L external, max (Lo)

Note

The external maximums (Lo and Co) include field wiring and the field device.

This table describes non-incendive circuit parameters for the 2354AS2 Analog Input HART Hazardous Location Baseplate. Table 52

Cable and Load Parameters for AI HART Baseplate 2354AS2

Feature

IEC Symbol

ISA Symbol



Tamb

Tamb

32° F to 140° F (0° C to 60° C)

Working voltage

Uw

Uw

19 to 30 V

Maximum voltage

Um

Um

32 V


Uo

Voc

32 V


Io

Isc

0.160 A


Po

Po

1.280 W

C external, maximum

Co

Ca

1.162 µF

L external, maximum

Lo

La

4.969 mH


Ui

Vmax

9V


Ii

Imax

0.030 A

Maximum input power

Pi

Pi

0.270 W

C internal, maximum

Ci

Ci

0.0683 µF

L internal, maximum

Li

Li

30.85 µH

AI Field + Connection Specifications

AI Field – Connection Specifications


260

Appendix B

Non-Incendive Circuit Parameters

This table describes non-incendive circuit parameters for the 2483AS2 Analog Output HART Hazardous Location Baseplate. Table 53

Cable and Load Parameters for AO HART Baseplate 2483AS2

Feature

IEC Symbol

ISA Symbol



Tamb

Tamb

32° F to 140° F (0° C to 60° C)

Working voltage

Uw

Uw

30 V

Maximum voltage

Um

Um

32 V


Uo

Voc

32 V


Io

Isc

0.256 A


Po

Po

1.856 W

C external, maximum

Co

Ca

1.15 µF

L external, maximum

Lo

La

4.95 µH

C internal, maximum

Ci

Ci

Additional isolation required; MTL 4546 or similar.

L internal, maximum

Li

Li

Additional isolation required; MTL 4546 or similar.

Output Connection (L+) Specifications


C HART Communication

Overview 262 Triconex 4850 Hart Multiplexer 265


262

Appendix C

HART Communication

Overview This appendix describes HART communication through Tri-GP systems. Highway Addressable Remote Transducer protocol (HART) is a bi-directional industrial field communication protocol used to communicate between intelligent field instruments and host systems over 4–20 mA instrumentation wiring. Invensys offers these components to enable HART communication between HART devices in the field and Configuration and Asset Management Software running on a PC. •

2354S2 Analog Input HART Baseplate

•


•

2483S2 Analog Output HART Baseplate

•


•

Triconex 4850 HART Multiplexer Workstation PC running instrument management software RS232

RS232/RS485 converter

RS485

SHLD

TA

TB

SHLD

TA

TB

J22 J18

J27 1

TRICONEX

TRICONEX

PASS FAULT ACTIVE FIELD PWR


2 3 4

4–20 mA

5 6 7 8

PWR FAULT HOST HART

9 10 11 12 13

I

14 15 16

P

17

HART transmitter and valve

18

4850 TRICONEX

19 20 21 22 23 24 25 26 27 28 29 30 31 32 J19

HART AI Baseplate

Figure 113

Typical Tri-GP HART Analog Input Installation


Overview

263

Workstation PC running instrument management software RS232


RS485

SHLD

TA

TB

SHLD

TB

TA

J22

4–20 mA

J18

J27 1

TRICONEX

TRICONEX



2 3 4

I P

5 6

PWR

7

HOST

8

HART

FAULT

9 10 11 12 13 14 15 16

4850 TRICONEX

4–20 mA

I P HART transmitters and valves

J19

HART AO Baseplate

Figure 114

Typical Tri-GP HART Analog Output Installation


264

Appendix C

HART Communication

Workstation PC running instrument management software RS232


RS485

SHLD

TA

TB

SHLD

TB

MTL4546 Isolator

TA

J22

4–20 mA

J18

J27 1

TRICONEX

TRICONEX



2

MTL4546 Isolator

I

MTL4546 Isolator

P

3 4 5 6

PWR

7

HOST

8

HART

FAULT

9 10 11

MTL4546 Isolator

12 13 14 15 16

4850 TRICONEX

4–20 mA

I P HART transmitters and valves

J19

HART AO Baseplate

Figure 115

Typical Tri-GP HART Analog Output Hazardous Location Installation

If you are using HART communication in a safety-related application, see the Safety Considerations Guide for Triconex General Purpose v2 Systems for more information.


Triconex 4850 Hart Multiplexer

265

Triconex 4850 Hart Multiplexer The Triconex 4850 HART Multiplexer provides an interface between HART smart devices in the field and Configuration and Asset Management Software running on a PC. The Triconex 4850 HART Multiplexer mounts directly onto these Tri-GP baseplates: •

2354S2 Analog Input HART Baseplate

•


•

2483S2 Analog Output HART Baseplate

•


Note

The Triconex 4850 HART Multiplexer operates independently of the AI and the AO modules, so there is no interference from the multiplexer to these modules.

For more information about the HART compatible baseplates, including simplified schematics and field connection diagrams, see Analog Input Components on page 49 and Analog Output Components on page 82. For more information about the Triconex 4850 HART Multiplexer, including PC software installation and configuration, see the Triconex 4850 HART Multiplexer Instruction Manual.


266

Appendix C

HART Communication

Installing the Triconex 4850 HART Multiplexer The Triconex 4850 HART Multiplexer mounts directly onto the Tri-GP baseplate in socket J42 as shown in this figure. Triconex 4850 Multiplexer

Figure 116

Triconex 4850 Multiplexer Mounted on Tri-GP Baseplate

After you mount the Triconex 4850 HART Multiplexer onto the baseplate, secure it by tightening the screws on the back of the baseplate using a Phillips-head screwdriver with a shaft smaller than 4 millimeters.


Triconex 4850 Hart Multiplexer

267

Triconex 4850 HART Multiplexer Indicators This section describes the LED status indicators on the front of the Triconex 4850 HART Multiplexer. Table 54

Triconex 4850 HART Multiplexer Status Indicators

Indicator

Color

State

Description

PWR

Green

Off

Multiplexer is not receiving power.

On

Multiplexer is receiving power.

Off

Multiplexer is in the running state.

Steady flash

Multiplexer rebuild is in progress.

Short/long flash

No HART loops found.

On (steady)

A fault was detected and multiplexer operation has halted.

Off

No communication on the channel.

Short flash (0.25 sec)

Correctly framed message received by the multiplexer.

Long flash (1 sec)

Response transmitted—this is re-triggerable so repeated transmissions will leave the indicator permanently on.

Off

No communication on the channel.

Short flash (0.25 sec)

Message transmitted.

Long flash (1 sec)

Response received—this is re-triggerable so repeated receptions will leave the indicator permanently on.

FAULT

HOST

HART

Red

Yellow

Yellow


268

Appendix C

HART Communication


D Warning Labels

This appendix provides a physical description of warning labels which must be prominently attached to the controller for systems in which these hazards apply. Labels must meet the requirements of ANSI Z535, ISO 3864, and IEC 1310-1. Labels are available from Invensys upon request.

General Hazard This figure is an example of a general hazard label.

Safety alert symbol Black triangle, orange exclamation point

Signal word panel Safety orange per ANSI Z535.1 Pantone 152C 13 parts yellow, 3 parts warm red, ¼ part black Signal word Sans serif font, all capital letters, minimum letter height 1.5 x message panel text height

White background Yellow background

WARNING GENERAL HAZARD. Service restricted to trained personnel only.

Optional black border

Base width 30 mm (1.2 inch) minimum

Figure 117

Black border 0.06 x base width

Black letters on white background Sans serif font Upper or lower case 2.54 mm (0.10 inch) high

General Hazard Label


270

Appendix D

Warning Labels

Hazardous Voltage This figure is an example of a hazardous voltage label.




WARNING HAZARDOUS VOLTAGE. Contact may cause electric shock or burn. Service restricted to trained personnel only.



Figure 118



Hazardous Voltage Label

Hot Surface This figure is an example of a hot surface label.




WARNING HOT SURFACE. Contact may cause burns. Service restricted to trained personnel only.



Figure 119



Hot Surface Label


E Recommended Parts for Replacement

This table lists information on the recommended parts for replacement of Tri-GP components. Part Description

Manufacturer

Part Number

Usage

Fuse, ¾ A

Invensys

1410054-001

Littlefuse

273.75

SRO Baseplate and MP Baseplate

Fuse, 5x20 mm, 8 A, slow-acting

Invensys

1410056-001

Littlefuse

218008

MP Baseplate and I/O Extender Module

16-point plug connector

Invensys

1420048-016

I/O Baseplate

Phoenix

1901742

Expansion cable, 2-foot

Invensys

4000212-002

I/O Extender Module

Terminator

Invensys

4000138-001

I/O Extender Module

Address plug (available only as part of the Trident/Tri-GP Accessory Kit)

Invensys

7400215-0xx

MP and I/O Baseplates

Trident/Tri-GP Accessory Kit—includes one set of spare fuses, two sets of address plugs (1 through 10), one set of address plugs (11 through 20), one set of address plugs (21 through 32), one set of address plugs (33 through 43), one set of address plugs (44 through 54), and one set of address plugs (55 through 63)

Invensys

(xx = address 01-63)

3000696-001 (Model 8401)

MP, I/O, and SRO Baseplates; I/O Extender Module


272

Appendix E

Recommended Parts for Replacement


F Panel Labels

AI/DI Hazardous Location External Termination Panels 275 RTD/TC/AI External Termination Panels 276 SSR Input External Termination Panels 277


274

Appendix F

Panel Labels

Overview This appendix shows how to apply external termination panel (ETP) labels. Because some modules require a two-panel arrangement to accommodate all points, each standard panel must have a set of labels that indicate the correct range of points. Panels that are not used in a twopanel arrangement are labelled at the factory. Standard panels that require labels include the appropriate labels as loose-piece parts. Since a panel can be connected as the first or second panel, a set of labels appropriate for either range is provided with every panel, with a duplicate label for each row of terminals on each terminal block. Any unused labels can be stored or discarded. Attach the appropriate labels to each panel as shown in these illustrations.


AI/DI Hazardous Location External Termination Panels

275

AI/DI Hazardous Location External Termination Panels This figure illustrates placement of labels for 32-point AI and DI hazardous location ETPs. TRICONEX

EXT TERM

17

REV B

R

R27 R28

R

23

TB4

R29

22 R

13 R

!

14

R

24

R 15

R32

R

19 R 20 R 3 21 R

12 R

R4 R5 R7 R8

R25

18 R

9 R 10 11 R

R3

R

R2

R1

SN

TB1

R30

7400275

R31

Panel Type 9573-610F DI 9792-310F AI

J1 TB2 TB3 TB5

J2

J3

L-

P1

P2

Labels (for front and back row) 1

2

3

4

5

6

7

8

9 10 11 12 13 14 15 16

First Panel

Labels (for front and back row) 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32

Second Panel

Figure 120

AI/DI Hazardous Location ETP Label Placement


276

Appendix F

Panel Labels

RTD/TC/AI External Termination Panels This figure illustrates placement of labels for Model 9764-510F 16-point RTD/TC/AI ETPs.

16 16

13

12

14 15

14 15

13

12

9

11

8

R16

11

10

7

10 9

8

6

5

3 4

2

1

U16

R15

7

6

5

3 4

2

1

14 15

13

12

9

16 16

14 15

13

12

11

8

11

7

6

5

10 9

10

8

7

5

2

1

3 4

3 4

2

1

14 15

13

16 16

14 15

12 11

13

12

9

11 10

8

7

6

5

3 4

2

10 9

8

7

6

5

3 4

1

1

2

16 16

14 15

13

12 11

14 15

13

12

9

8

11 10

7

6

5

3 4

2

1

10 9

8

7

6

5

3 4

2

ISOLATED RTD INPUT

1

ANALOG DEVICES

ISOLATED RTD INPUT

U15

R14

7B34

ANALOG DEVICES

U14

R13

7B34

ISOLATED RTD INPUT

ISOLATED RTD INPUT

U13

ANALOG DEVICES

ISOLATED RTD INPUT

U12 R12

7B34

ANALOG DEVICES

7B34

ANALOG DEVICES

R11

7B34

ISOLATED RTD INPUT

U11

R10

J4

J3

ANALOG DEVICES

ISOLATED RTD INPUT

U10

R9

7B34

ANALOG DEVICES

ISOLATED RTD INPUT

U9

R8

SN

7B34

ANALOG DEVICES

U8

R7

7B34

ISOLATED


U7

R6

7B32

U6

R5

ISOLATED


7B32

U5

R4

ISOLATED


7B32

U4

R3

ISOLATED

ISOLATED TC INPUT


7B32

ANALOG DEVICES

ISOLATED TC INPUT

ISOLATED TC INPUT

U3

R2

7B47

ANALOG DEVICES

7B47

ANALOG DEVICES

ISOLATED TC INPUT

U2

R1

J2

7B47

ANALOG DEVICES

7B47

U1

REV E

7400225-

6

TRICONEX 7B 16 MODULE BASEPLATE

J1

J6

J5

First Panel Labels (for front and back row) 1

2

3

4

5

6

7

8

9

10 11 12 13 14 15 16


2

3

4

5

6

7

8

9

Labels (for front and back row)

10 11 12 13 14 15 16

1

2

3

4

5

6

7

8

9

10 11 12 13 14 15 16


2

3

4

5

6

7

8

9

10 11 12 13 14 15 16

Second Panel Labels (for front and back row) 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32

Figure 121



RTD/TC/AI ETP Label Placement



SSR Input External Termination Panels

277

SSR Input External Termination Panels This figure illustrates placement of labels for 16-point SSR Input ETPs. J1

DSP1

R1

DSP3

R5

CR5

R9

CR7

CR9


+2 – +3 –

R10

DSP12

+6 – +7 –

CR13

CR10

LOAD:0.1A 5–24VDC

G3R-IAZR1SN

OMRON MADE IN JAPAN

F16 DSP15

R14

SN

+4 – +5 –

AC

F15 DSP14

R13

CR12

LOAD:0.1A 5–24VDC

AC

F14 DSP13

R12

K16

G3R-IAZR1SN

OMRON MADE IN JAPAN

G3R-IAZR1SN

OMRON MADE IN JAPAN

LOAD:0.1A 5–24VDC

K15

AC

F13

R11

CR11

LOAD:0.1A 5–24VDC

AC

F12 DSP11

K14

G3R-IAZR1SN

OMRON MADE IN JAPAN

LOAD:0.1A 5–24VDC

G3R-IAZR1SN

OMRON MADE IN JAPAN

LOAD:0.1A 5–24VDC

G3R-IAZR1SN

LOAD:0.1A 5–24VDC

OMRON MADE IN JAPAN

AC

F11 DSP10

K13

DSP16

R15

CR14

R16

CR15

CR16

REV B

Labels (for front and back row) +1 –

G3R-IAZR1SN

OMRON MADE IN JAPAN

LOAD:0.1A 5–24VDC

R8

K12

AC

F10 DSP9

7400256–

PWR

G3R-IAZR1SN

OMRON MADE IN JAPAN

LOAD:0.1A 5–24VDC

G3R-IAZR1SN

DSP8

CR8

K11

AC

F9

R7

CR6

K10

AC

F8 DSP7

R6

K9

AC

F7 DSP6

OMRON MADE IN JAPAN

LOAD:0.1A 5–24VDC

G3R-IAZR1SN

OMRON MADE IN JAPAN

LOAD:0.1A 5–24VDC

G3R-IAZR1SN

OMRON MADE IN JAPAN

LOAD:0.1A 5–24VDC

G3R-IAZR1SN

OMRON MADE IN JAPAN

CR4

DSP5

K8

AC

F6

CONTACT

CR3

R4

K7

AC

F5 DSP4

R3

K6

AC

F4

R2

CR1

LOAD:0.1A 5–24VDC

AC

F3 DSP2

K5

G3R-IAZR1SN

OMRON MADE IN JAPAN

LOAD:0.1A 5–24VDC

G3R-IAZR1SN

AC

F2

CR2

K4

CONTACT

AC

F1

OMRON MADE IN JAPAN

G3R-IAZR1SN

LOAD:0.1A 5–24VDC

K3

PWR

AC

OMRON MADE IN JAPAN

LOAD:0.1A 5–24VDC

K2

G3R-IAZR1SN

OMRON MADE IN JAPAN

K1


+9 –

+ 10 – +11 –

+ 12 –

+13 –

+ 14 – + 15 –

+ 16 –

First Panel

Labels (for front and back row) + 17 –

+ 18 – + 19 –

+ 20 – + 21 –

+22 – + 23 –


+ 25 –

+ 26 – +27 –

+ 28 –

+29 –

+ 30 – + 31 –

+ 32 –

Second Panel

Figure 122

SSR Input ETP Label Placement


278

Appendix F

Panel Labels


Glossary

AI Module Analog Input Module. AI/DI Module Analog Input/Digital Input Module. Each AI/DI Module contains 16 AI points and 16 DI points. alias Five-digit number that the system uses in place of a variable name when communicating with an external host. The alias is a convention of Modbus, an industry-standard protocol adopted by Invensys for use with its communication modules. Each alias contains a Modbus message type and the address of the variable in the system. ASIC Application-specific integrated circuit. availability Probability that the controller is operational at some instant of time. bin Address range of system aliased variables based on class and type combinations. For example, all Read Only Input Discrete variables are grouped into Bin 2, and all Read/Write Memory Integer variables are grouped into Bin 12. CE Mark Certification by the European Union which ensures the electro-magnetic compatibility of the system with other pieces of electrical/electronic equipment. channel Data path from input point to output point. Triple modular redundant (TMR) systems have three channels. CSA Canadian Standards Association, a not-for-profit membership organization which develops standards and tests in areas ranging from nuclear power, health care, occupational health and safety, housing and construction materials to the electrical, electronic and telecommunications fields. CSA certification of a product generates consumer confidence in many countries. configuration Arrangement of the programmable electronics within a system and the combination of programmable and non-programmable equipment within the installation.


280

Glossary

control system Governs the operation of plant, machinery or other equipment by producing appropriate instructions in response to input signals. coverage Probability that a particular class of fault is successfully detected before a system failure occurs. DCS Distributed control system. DDE Dynamic data exchange (DDE) is an interprocess communication mechanism provided by the Microsoft® Windows® operating system. Applications running the Windows operating system can use DDE to send and receive data and instructions to and from each other. debug Act of locating and correcting faults: 1) one of the normal operations in software development; such as editing, compiling, debugging, loading, and verifying; or 2) the identification and isolation of a faulty physical component, including its replacement or repair to return the system to operational status. DI Module Digital Input Module. DO Module Digital Output Module. environment Stimuli at an interface (or interfaces) of the system. error Element of a system resource assumes an undesired state. Such a state is then contrary to the specification of the resource or the expectation (requirement) of the user. event State change of a discrete aliased variable which has been designated for event logging. An event is said is to occur if such a variable changes from the normal state. If the variable later changes back to the normal state, another event is said to have occurred. event logger Program that logs, displays and/or prints critical events in real time, based on state changes of discrete variables in the program. Proper use of an event logger warns users about dangerous conditions and printouts of events can help identify the sequence of events that led to a trip. event variable Discrete memory variable or discrete input point that has been assigned to an SOE block. external host Computer, such as a mainframe, minicomputer, workstation, or PC that communicates with the controller over an Ethernet open network.


Glossary 281

fail-safe Characteristic of a device or system to always revert to a safe, predictable state, even when one or more of its internal elements has failed. failure System resource perceives that a service resource ceases to deliver the expected services. The fault-tolerant system masks most failures. See “fault”. failure rate Rate at which failures occur over time. Usually expressed in failures per million hours. The inverse of failure rate is MTTF. fault Cause of a resource failure or an error within the resource. fault avoidance Result of conservative design techniques using high-reliability components, system burn-in, and careful design. The goal of fault avoidance is to reduce the possibility of a failure by designing a device with performance margins so large that the probability of a detrimental failure is negligible. fault masking Means of removing failed elements from influencing system operation while enabling properly operating redundant elements to continue the control process. fault tolerance Ability to identify and compensate for failed control system elements and allow repair while continuing an assigned task without process interruption. Fault tolerance is achieved by incorporating redundancy and fault masking. FE Functional earth. FSR Full-scale range. Specifies an operating range for input or output signals. For example, if 0-5V is the “range,” then 5V is the “full scale”. HART Highway Addressable Remote Transducer protocol is a bi-directional industrial field communication protocol used to communicate between intelligent field instruments and host systems over 4–20 mA instrumentation wiring. host See external host. hot-spare modules A unique feature of the Tri-GP controller which allows you to install a second identical I/O module which becomes active if the other module fails.


282

Glossary

input poll time Time required by the controller to collect input data from the controlled process. Input polling is asynchronous and overlaps application execution. I/A Series® DCS Foxboro® Industrial Automation (I/A) Series Distributed Control System. IEEE Institute of Electrical and Electronics Engineers (IEEE) is a professional society for engineers. ISO International Organization for Standardization (ISO) is a world-wide federation of national standards bodies (ISO member bodies) that promulgates standards affecting international commerce and communications. intermittent fault Fault or error that is only occasionally present due to unstable hardware or varying software states. LED Light-emitting diode. One of the color-coded signal lights on each controller circuit board that indicates the board’s status. Each system component includes at least the Pass, Fail, and Active LEDs. logical slot Logical slot comprises a primary module, a hot-spare module, and associated field termination components. A baseplate is a physical representation of a logical slot. Markov model Generalized modeling technique which can be used to represent a system with an arbitrary number of modules, failure events, and repair events. A Markov model can be mathematically solved to produce a resultant probability. MP Main Processor Module. module Active field-replaceable unit consisting of an electronic circuit assembly housed in a metal cover. MTBF Mean-time-between-failure. The expected average time between failures of a system, including the time taken to repair the system. Usually expressed in hours. MTTF Mean-time-to-failure. The expected average time to a system failure in a population of identical systems. Usually expressed in hours.


Glossary 283

MTTR Mean-time-to-repair. The expected time to repair a failed system or subsystem. Usually expressed in hours. node Any of the machines on a network. node number Physical address of a node. non-triplicated module I/O module with a single set of field-interface circuitry for communication with all three main processor modules. Non-triplicated modules provide a cost-effective alternative to the use of TMR modules for non-critical environments. open network Network to which an external host can be connected. output poll time Time required by the controller to implement the outputs generated by the application in response to inputs from the controlled process. PE Protective earth. PES Programmable electronic system. peer-to-peer Protocol that allow multiple systems on a proprietary network to exchange process and safety information. permanent fault Failure, fault or error in the system that is continuous and stable. PHA Process hazard analysis. process demand Occurrence of a process deviation that results in the SIS initiating a trip of the process unit. program Basic programming unit within a project. A set of instructions, commands, and/or other directions. In the TriStation 1131 software, programs are written in any of the available languages, and are subsequently placed within a project’s hierarchy. programmable logic controller “Black box” device which accepts analog or digital input signals, acts upon them in a welldefined way, and produces appropriate output signals as a result.


284

Glossary

proprietary network Network of controllers. protocol Set of rules describing the format used for data exchange between two entities. quad output circuit Provides fault-tolerant outputs. Each output is composed of four identical switching elements in a “quad” arrangement. reliability Probability that no failure of the system will occur in a given period of time. scan time Period of the controller’s cycle of required control functions. Scan time is composed of three elements: •

Input poll time (asynchronous with program execution)

•

Time required to execute the program

•

Output poll time

SIL Safety integrity level. single module Digital Input Module which is optimized for safety-critical environments where low cost is more important than maximum availability. On a single module, only those portions of the signal path which are required to ensure safe operation are triplicated. Special self-test circuitry detects all stuck-On and stuck-Off fault conditions in less than half a second. SIS Safety instrumented system. SRS Safety requirements specification. SRO Module Solid-State Relay Output Module. system Set of components which interact under the control of a design. TCP/IP Transmission Control Protocol/Internet Protocol (TCP/IP) are protocols for the transport and network layers of the OSI network model. TCP/IP provides reliable, sequenced data delivery. time sync Triconex Time Synchronization protocol.


Glossary 285

transient fault Fault or error resulting from a temporary environmental condition. TMR Triple-Modular-Redundant architecture, which allows the system to achieve fault tolerance. The complete system is triplicated; each of the three identical systems is called a channel. Each channel independently executes the application in parallel with the other channels. Tri-GP State-of-the-art programmable logic and process controller that provides a high level of fault tolerance. trip Safety-related shutdown of the controlled process, or a portion of the controlled process. TriStation 1131 software TriStation 1131 software is a Windows-based developer’s workbench for writing and downloading applications and for performing maintenance and diagnostics on Triconex systems. TriStation 1131 protocol Master/slave protocol used by TriStation 1131 software for communication with the system. The TriStation 1131 protocol supports a maximum of 10 systems, but each master can communicate with only one slave at a time. TSAA Triconex System Access Application (TSAA) protocol is a master-slave protocol in which the master (an external host) communicates with one or more slaves over an open network. TSAA supports a maximum of ten controllers. TÜV Rheinland Technischer Überwachungs-Verein in German or Technical Supervisory Association in English. In Germany, TÜV Rheinland is an authorized technical inspection agency for a wide variety of products, processes, installations, plants, and equipment. In addition, the agency is authorized to carry out statutory inspections and acceptance tests by more than 25 other countries. UDP/IP User Datagram Protocol/Internet Protocol (UDP/IP) are protocols for the Transport and network layers of the OSI network model. UDP/IP provides best-effort datagram delivery. voting Mechanism whereby each channel of a TMR system compares and corrects the data in each channel using a two-out-of-three majority voting scheme.


286

Glossary


Index

2481S2 schematic, 88 2483AS2 figure, 93 2483AS2 schematic, 94 2483S2 figure, 93 2483S2 schematic, 94 3481S2 schematic, 83 3481S2 specifications, 83 3482S2 schematic, 85 3482S2 specifications, 85 description, 82 external termination baseplate figure, 90 field connections, 89, 92, 95, 100 hazardous location termination panel, 97 indicators, 227–229 operation, 14

Numerics 100BaseTX connectors, pin-outs, 244 10BaseT connectors, pin-outs, 244

A addresses node, 196 plugs, 196 alarms definition, 212 MP Module contacts, 40 overview, 212 system integrity, 12 wiring, 203 Analog Input 2351S2 figure, 52 2351S2 schematic, 52 2354AS2 figure, 69 2354AS2 schematic, 70 2354S2 figure, 69 2354S2 schematic, 70 3351S2 schematic, 50 3351S2 specifications, 50 description, 49 external termination baseplate figure, 54 external termination baseplate schematic, 54 field connections, 53, 55, 68, 71 hazardous location termination panel, 65 indicators, 221–223 operation, 13 Analog Input/Digital Input 2361S2 figure, 75 2361S2 schematic, 76 3361S2 schematic, 73 3361S2 specifications, 73 description, 72 external termination baseplate figure, 78 external termination baseplate schematic, 79 field connections, 77, 80 hazardous location termination panels, 81 indicators, 224–226 operation, 13

application., See control program approvals, Factory Mutual, 17 architecture MP Module, 6 system, 3, 5 assemblies installing Interconnect, 197 Interconnect, 170 ATEX, installation guidelines, 183 AUI Ethernet MAU connectors, 244

B baseplates depth dimensions, 188 maximum number, 4 buses I/O distribution, 8 TriBus, 5, 8

C cables CM diagread, 255 cross-over, 250

Analog Output 2481S2 figure, 87


288

Index

cables (continued) flame test ratings, 26 guidelines for selection, 253 MP Module diagread, 255 RS-232 serial, 251 RS-485 serial, 251 shield, 202 straight-through, 250 terminating, 253 caps description, 173 installing, 197 CD designator, 247 CE Mark certification, 20 certifications CE Mark, 20 TÜV, 18 columns, connecting, 192 communication bus operation, 9 Communication Module features, 11 controller, 10 MP Modules, 10 physcial interfaces, 11 Communication Module AUI Ethernet MAU connectors, 244 baseplate figure, 44 communication ports, 45 Debug connectors, 255 description, 43 diagread cables, 255 indicators, 218–220 installation, 209 MII Ethernet MAU connectors, 245 operations, 11 communication protocols Communication Module, 11 Main Processor Modules, 11 connectors AUI Ethernet MAU, 244 Ethernet, 244 MII Ethernet MAU, 245 Modbus RS-232 serial, 247 control program, TriStation 1131, 4 controller configuration, 4 environmental specifications, 24 features, 2 safety certification, 16

cooling convection, 177 forced-air, 177 covers description, 174 installing, 197 customer support, x

D Debug connectors, Communication Module, 255 debug ports, Main Processor, 41 diagnostics fault tolerance, 3 Tri-GP controller, 12 diagread cables CMs, 255 MP Modules, 255 Digital Input 2301S2 figure, 107 2301S2 schematic, 108 3301S2 schematic, 102 3301S2 specifications, 102 3311S2 schematic, 104 3311S2 specifications, 105 description, 101 external termination baseplate figure, 109 external termination baseplate schematic, 110 field connections, 109, 111, 118 hazardous location external termination panel, 115 indicators, 230–232 operation, 14 Digital Output 2401HS2 figure, 128 2401HS2 schematic, 129 2401LS2 figure, 131 2401LS2 schematic, 132 2401S2 figure, 125 2401S2 schematic, 126 3401S2 schematic, 120 3401S2 specifications, 120 3411S2 schematic, 122 3411S2 specifications, 123 description, 119–120 external termination baseplate figure, 134 field connections, 127, 130, 133, 136, 139, 145 indicators, 233–236 operation, 14 dimensions I/O baseplates, 190 I/O Extender Modules, 191 Main Processor Baseplates, 189 drill templates, mounting panels, 186


Index

E

ground (continued) logic power, 200 system, 26

earth, connecting shield, 202 end caps description, 173 installing, 197

H HART AI baseplates, 69 AO baseplates, 93–96 overview, 262 Triconex 4850 Multiplexer description, 265 Triconex 4850 Multiplexer indicators, 267 Triconex 4850 Multiplexer installation, 266

environment, requirements, 24 Ethernet 100BaseTX connectors, 244 10BaseT connectors, 244 cross-over cables, 250 straight-through cables, 250 EU Declaration of Conformity, 20

hazardous locations approved modules for, 184 installation guidelines, 182–185

F Factory Mutual approval, 17

I

fault tolerance, defined, 3

I/O baseplates, dimensions, 190

faults definition, 212 overview, 212 field alarm indicator, AO Module, 229 field connections 2381AS2 pulse input, 161 2381S2 pulse input, 153 AI Baseplate model 2351S2, 53 analog input, 53, 55, 58, 68, 71 analog input/digital input, 77, 80 analog output, 89, 92, 95, 100 digital input, 109, 111, 113, 118 digital output, 127, 130, 133, 136, 139, 145 relay output, 139 solid-state relay input, 113 solid-state relay output, 169 field power, grounding, 201 field power indicator Analog Input Module, 223 Analog Input/Digital Input Module, 226 Digital Input Module, 232 field signal distribution, 9 forced-air cooling, 177

G ground field power, 201

289

I/O Bus cables, 172 distribution, 8 operation, 9 terminators, 172 I/O Extender Modules connecting, 192 description, 171 dimensions, 191 I/O modules common specifications, 47 installing, 210 I/O points, toggling to opposite, 206 I/O processors, MP Module, 37 indicators AI Module, 221–223 AI/DI Module, 224–226 AO Module, 227–229 Communication Module, 218–220 DI Module, 230–232 DO Modules, 233–236 MP Modules, 213–217 overview, 212 PI Module, 237–239 SRO Module, 240–242 installation application-specific guidelines, 182 mechanical, 185 Interconnect Assemblies, description, 170 interconnect assemblies, installing, 197 interfaces, physical communication, 11


290

Index

L logic power Communication Module, 43 determining, 177 grounding, 200 MP Baseplate, 42 MP Module, 37 overview, 10

M Main Processor alarm contacts, 40 application processors, 36 baseplate dimensions, 189 communication ports, 41 Debug connectors, 255 description, 35 I/O processors, 37 indicators, 213–217 installing modules, 208 logic power, 37 logic power connectors, 42 Modbus ports, 41 overview, 6 maintenance, routine, 204 mechanical installation, 185 MII Ethernet MAU connectors, 245 Modbus ports Main Processor Module, 41 ports on Communication Module, 45 Modbus RS-232 serial connectors, 247 modules Analog Input, 49 Analog Input/Digital Input, 72 Analog Output, 82 Communication, 11, 43 depth dimensions, 188 Digital Input, 101 Digital Output, 119–120 I/O Extender Modules, 171 Main Processor Module, 35 Pulse Input, 146–147 Solid-State Relay Output, 165 spare, 206 mounting panels drill templates, 186 guidelines, 185

N

network ports (continued) Main Processor, 41

O operations, Communication Module, 11 Output Voter Diagnostics disabling, 204 enabling, 205 operation, 14 OVD. See Output Voter Diagnostics overview, 16

P panels, mounting, 185 parts, recommended, 271 physical interfaces, communication, 11 pin-outs 2381AS2 PI baseplate, 164 2381S2 PI baseplate, 157 RS-232, 247 RS-485, 248 RTD/TC/AI termination panel, 60 solid-state relay input termination panel, 114 point indicators, Digital Input Module, 232 ports CM serial ports, 45 MP Module communication, 41 MP Module I/O and system executive, 41 power Communication Module, 43 distribution, 8, 9 MP Baseplate, 42 MP Module logic, 37 testing sources, 205 power/load indicators, DO and SDO Module, 236 processors MP Module application, 36 MP Module I/O, 37 programs, alarms, 40 protective earth connecting shield, 202 grounding baseplates, 198 Pulse Input 2381AS2 field connections, 161 2381AS2 figure, 158 2381AS2 schematic, 158 2381S2 field connections, 153

network ports Communication Module, 45


Index

291

schematics (continued) DO hazardous location external termination baseplate, 135 DO hazardous location termination panel, 144 DO module 3401S2, 120 DO module 3411S2, 122 PI baseplate 2381S2, 151 PI hazardous location baseplate 2381AS2, 158 PI module 3382S2, 148 RTD/TC/AI termination panel, 57

Pulse Input (continued) 2381S2 figure, 151 2381S2 schematic, 151 3382S2 schematic, 148 3382S2 specifications, 148 description, 146–147 indicators, 237–239 operation, 15

R

SD-A designator, 249

RD-A designator, 249

SD-B designator, 249

RD-B designator, 249

shields, connecting, 202

recommended parts, 271

signals connecting ground, 200 field distribution, 9 RS-232, 247 RS-485 description, 249

replacing modules, guidelines, 207 routine maintenance, 204 RS-232 pin-outs, 247 serial cables, 251 signals, 247

Slot Covers description, 174 installing, 197

RS-485 pin-outs, 248 selecting cables, 253 serial cables, 251 signal description, 249 terminating cables, 253

solid state relay input external termination panel, 112 Solid-State Relay Output 2451S2 figure, 167 2451S2 schematic, 168 3451S2 schematic, 165 3451S2 specifications, 165 description, 165 field connections, 169 indicators, 240–242 operation, 15

RTD/TC/AI Termination Panel description, 56 pin-out information, 60 schematic, 57

S

spare modules, verifying, 206

safety certifications, 16 schematics AI HART baseplates, 70 AI hazardous location termination panel, 67 AI module 3351S2, 50 AI/DI module 3361S2, 73 AO baseplate 2481S2, 88 AO HART Baseplates, 94 AO hazardous location external termination baseplate, 91 AO hazardous location termination panel, 99 AO module 3481S2, 83 AO module 3482S2, 85 DI baseplate 2301S2, 108 DI Hazardous Location Termination Panel, 117 DI module 3301S2, 102 DI module 3311S2, 104 DO baseplate 2401LS2, 132 DO baseplate 2401S2, 126

specifications environmental, 24 I/O common, 47 status indicators AI/DI Module, 222, 225 AO Module, 228 DI Module, 231 diagnostic, 12 DO Module, 235 system executive debug ports, MP Module, 41 systems ground, 26 overview, 24

T technical support, x temperature and output ranges, signal conditioning modules, 64


292

Index

Terminal Covers, installing, 197 terminal covers, description, 174 termination panels AI hazardous location, 65 AI/DI hazardous location, 81 AO hazardous location, 97 DI hazardous location, 115 DO hazardous location, 142 relay output, 137 RTD/TC/AI, 56 solid state relay input, 112 TMR.See Triple Modular Redundant architecture training, x TriBus description, 5 operation, 8 Triconex contact information, x Tri-GP controller architecture, 5 fault tolerance, 3 triple modular redundant, architecture, 3 TriStation 1131 Ethernet connectors, 244 software, 4 TRM, architecture, 5 trunks, cables, 253 TÜV certification, 18

V verifying spare modules, 206

W wiring, alarms, 203


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Planning and Installation Guide for Tri-GP v2 Systems

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