ZTE ZXMP S385 Product Description

Operator Logo

ZXMP S385 V2.50 Product Description


ZXMP S385 V2.50 Product Description Version

Date

Author

Approved By

Remarks

R0

2009-09-20

ZhangQiSheng

WangQiang,QinYong

Not open to the Third Party

R1

2010-05-20

LiXiongFei

WangQiang,QinYong

Not open to the Third Party

© 2011 ZTE Corporation. All rights reserved. ZTE CONFIDENTIAL: This document contains proprietary information of ZTE and is not to be disclosed or used without the prior written permission of ZTE. Due to update and improvement of ZTE products and technologies, information in this document is subjected to change without notice.

ZTE Confidential Proprietary

© 2011 ZTE Corporation. All rights reserved.

I


TABLE OF CONTENTS 1

Overview ................................................................................................................... 1

2 2.1 2.2 2.3 2.4 2.5 2.6

Features .................................................................................................................... 2 Flexible networking & dispatching function raises profit-making ability and reduces CAPEX ...................................................................................................................... 2 Superior scalability protects CAPEX and reduces OPEX .......................................... 2 Leading RPR function supports IP evolution and protects CAPEX ............................ 2 Powerful embedded WDM function saves fiber resource .......................................... 2 Flexible design facilitates network planning & optimization........................................ 2 Wide application, mature technology and high reliability............................................ 2

3 3.1 3.2 3.2.1 3.2.2 3.2.3 3.3 3.4 3.5 3.6 3.7 3.8 3.9 3.10 3.11 3.12

Functions.................................................................................................................. 4 Cross-connection and extension capabilities ............................................................. 4 Powerful Service Access Ability................................................................................. 4 Optical Interfaces ...................................................................................................... 4 Electrical Interfaces ................................................................................................... 5 Data Interfaces .......................................................................................................... 5 Integrated WDM Function .......................................................................................... 6 Complete Equipment Protection Ability...................................................................... 6 Perfect Network Protection Ability ............................................................................. 7 Reliable Timing Synchronization Processing ............................................................. 7 System control and communication ........................................................................... 8 Overhead Processing ................................................................................................ 8 Easy For Maintenance And Upgrade ....................................................................... 10 Alarm input/output ................................................................................................... 10 System power supply .............................................................................................. 10 Perfect EMC and Operation Safety ......................................................................... 11

4 4.1 4.1.1 4.1.2 4.2 4.3

System Architecture .............................................................................................. 12 Product Physical Structure ...................................................................................... 12 System architecture ................................................................................................. 12 System mapping structure ....................................................................................... 13 Hardware Architecture ............................................................................................. 14 Software Architecture .............................................................................................. 15

5 5.1 5.1.1 5.1.2 5.1.3 5.2 5.3 5.4 5.5 5.6 5.7 5.7.1 5.7.2 5.7.3 5.7.4 5.7.5 5.8

Technical Specifications ....................................................................................... 17 Physical Indices ....................................................................................................... 17 Subrack and cabinet appearance ............................................................................ 17 Subrack backplane .................................................................................................. 18 Fan plug-in box ........................................................................................................ 18 Appearance and dimensions ................................................................................... 19 System subrack and slot diagram ............................................................................ 21 System board list and description ............................................................................ 22 STM-N optical interfaces performance .................................................................... 26 PDH interfaces performance and indexes ............................................................... 27 Performance of data boards .................................................................................... 29 Performance of SEE ................................................................................................ 29 Performance of TGE2B ........................................................................................... 29 Performance of RSEB ............................................................................................. 31 Performance of AP1×8 ............................................................................................ 32 Performance of TGSA×8 ......................................................................................... 33 Physical Performance of Ethernet ........................................................................... 33

II




5.8.1 5.8.2 5.9 5.10 5.11 5.12 5.13 5.14 5.14.1 5.14.2 5.14.3 5.14.4 5.14.5 5.14.6 5.15

Ethernet interface types and followed standard ....................................................... 33 GE interface types and followed standard ............................................................... 36 Performance of OAD ............................................................................................... 38 Performance of OBA ............................................................................................... 39 Performance of OPA ............................................................................................... 40 Performance of DCM ............................................................................................... 41 Error Performance ................................................................................................... 42 Jitter index at interfaces ........................................................................................... 42 Jitter and wander tolerance of PDH input interface.................................................. 42 Jitter and wander tolerance of SDH input interface.................................................. 44 Inherent output jitter of STM-N interface .................................................................. 46 Mapping jitter of PDH tributary................................................................................. 47 Combined Jitter ....................................................................................................... 47 Jitter transfer function of the regeneration relay....................................................... 48 Clock timing and synchronous characteristics ......................................................... 48

6 6.1 6.2 6.3 6.3.1 6.3.2 6.3.3 6.3.4 6.3.5 6.4

Environment Adaptability...................................................................................... 51 Power supply requirements ..................................................................................... 51 Grounding requirements .......................................................................................... 51 Environment requirements ...................................................................................... 52 Operation Environment ............................................................................................ 52 Environment for Storage .......................................................................................... 53 Cleanness requirements .......................................................................................... 54 Bearing Requirements of the Equipment Room....................................................... 54 Electronic Static Discharge (ESD) ........................................................................... 55 Safety requirements ................................................................................................ 57

7

Glossary ................................................................................................................. 60



III


FIGURES Figure 1 Figure 2 Figure 3 Figure 4 Figure 5 Figure 6 Figure 7 Figure 8 Figure 9 Figure 10 Figure 11 Figure 12 Figure 13 Figure 14

ZXMP S385 functional block diagram ........................................................................ 12 Appearance of S385 Sub-rack................................................................................... 13 Multiplexing/mapping structure adopted by ZXMP S385 ........................................... 13 Functional relationships of the hardware platforms .................................................... 14 Hierarchical structure diagram of NM software .......................................................... 16 Subrack structure diagram......................................................................................... 17 Structure of fan box ................................................................................................... 18 Fan box structure....................................................................................................... 19 Board slot layout of sub-rack ..................................................................................... 22 The jitter and wander tolerance at E1 PDH input interface ........................................ 43 The jitter and wander tolerance at T1 PDH input interface ........................................ 43 The jitter tolerance of STM-N terminal multiplexer input interface.............................. 45 The input jitter tolerance of STM-N SDH regenerator ................................................ 46 The jitter transfer characteristics of a regeneration relay ........................................... 48

TABLES Table 1 Table 2 Table 3 Table 4 Table 5 Table 6 Table 7 Table 8 Table 9 Table 10 Table 11 Table 12 Table 13 Table 14 Table 15 Table 16 Table 17 Table 18 Table 19 Table 20 Table 21 Table 22 Table 23 Table 24

IV

Optical Interfaces Provided by ZXMP S385 ................................................................. 5 Electrical Interfaces Provided by ZXMP S385 ............................................................. 5 Ethernet services Provided by ZXMP S385 ................................................................. 6 Equipment level protection provided by ZXMP S385 ................................................... 7 Overhead-Byte Usage List........................................................................................... 9 Dimensions and weights of structural parts ............................................................... 19 ZXMP S385 own configuration .................................................................................. 20 ZXMP S385 is configured with other products ........................................................... 20 Boards/unit list (with power consumption) ................................................................. 22 Performance of the STM-1 optical interface............................................................... 26 Performance of the STM-4 optical interface............................................................... 26 Performance of the STM-16 optical interface............................................................. 26 Performance of the STM-64/OTU2 optical interface of ZXMP S385 .......................... 27 Performance of the PDH electrical interface .............................................................. 27 Input port permitted attenuation, frequency deviation and output port signal bit rate tolerance.................................................................................................................... 28 Requirements for the input/output port reflection attenuation .................................... 28 Performance of TGE2B of ZXMP S385 ..................................................................... 30 Ethernet interface index ............................................................................................. 33 Transmission index of FE MMF optical interface ....................................................... 34 Receiver index of FE MMF optical interface .............................................................. 34 index of FE short distance SMF optical interface ....................................................... 35 receiver index of FE short distance optical interface .................................................. 35 Transmission index of FE long distance SMF optical interface .................................. 35 Receiver index of FE long distance optical interface ................................................. 36




Table 25 Table 26 Table 27 Table 28 Table 29 Table 30 Table 31 Table 32 Table 33 Table 34 Table 35 Table 36 Table 37 Table 38 Table 39 Table 40 Table 41 Table 42 Table 43 Table 44 Table 45 Table 46 Table 47 Table 48 Table 49 Table 50 Table 51 Table 52 Table 53 Table 54 Table 55 Table 56 Table 57 Table 58 Table 59 Table 60 Table 61 Table 62 Table 63 Table 64 Table 65 Table 66 Table 67

GE interface index ..................................................................................................... 36 Transmission index of GE MMF optical interface ....................................................... 36 Receiver index of GE MMF optical interface .............................................................. 37 Transmission index of GE short distance SMF optical interface ................................ 37 Receiver index of GE short distance optical interface ................................................ 37 Transmission index of FE long distance SMF optical interface .................................. 38 Receiver index of GE long distance optical interface ................................................. 38 Performance of OADD ............................................................................................... 39 Performance of OADC ............................................................................................... 39 Performance of OBA Module ..................................................................................... 40 Performance of OPA Module ..................................................................................... 40 Performance of the DCM ........................................................................................... 41 SDH system error performance ................................................................................. 42 The input jitter and wander tolerance of PDH interface.............................................. 43 The output jitter and wander tolerance of the PDH interface ..................................... 44 Input jitter and wander tolerance (UIP-P) of SDH ...................................................... 45 Input jitter and wander tolerance of the SDH ............................................................. 45 Input jitter tolerances of STM-N regenerators ............................................................ 46 STM-N interface inherent output jitter indexes of SDH .............................................. 46 STM-N network interface output jitter indexes of SDH ............................................... 47 Mapping jitter specifications....................................................................................... 47 Combined jitter .......................................................................................................... 47 Jitter transmission parameters of a regeneration relay .............................................. 48 The SEC Index list ..................................................................................................... 49 The wander limit value under constant temperature (MTIE) ...................................... 49 The wander limit value under temperature impact (MTIE) ......................................... 49 The wander limit value under constant temperature (TDEV) ..................................... 49 Climate requirement .................................................................................................. 52 Density requirements for chemical active substances ............................................... 52 Density requirements for mechanical active substances ........................................... 53 Requirements for mechanical stress.......................................................................... 53 Climate requirement .................................................................................................. 53 Requirements for mechanical stress.......................................................................... 54 Static discharge anti-interference .............................................................................. 55 RF electromagnetic radiated susceptibility ................................................................ 55 Electrical fast transient burst susceptibility at the DC power port ............................... 56 Electrical fast transient burst susceptibilities at the signal cable and control cable ports .......................................................................................................................... 56 Surge susceptibility of DC power ............................................................................... 56 Surge susceptibility of the outdoor signal cable ......................................................... 56 Surge susceptibility of the indoor signal cable ........................................................... 56 Conductivity susceptibility of RF field......................................................................... 57 Conductive emission electromagnetic interference at the direct current port ............. 57 Radioactive emission electromagnetic interference ................................................... 57



V


1

Overview ZXMP S385 is an optical transmission platform newly released by ZTE. ZXMP S385 targets the backbone or large capacity convergent layer of network which can satisfy present and future network requirements. It is an ideal transmission system in constructing broadband transmission networks. ZXMP S385 provides rich service access functions and complete protection mechanism, facilitating its wide applications. ZXMP S385 adopts modular design, incorporating SDH, Ethernet, ATM, PDH and other technologies. It can transmit voice and data services efficiently on the same platform. This document is based on ZXMP S385 V2.50.



1


2

Features

2.1

Flexible networking & dispatching function raises profit-making ability and reduces CAPEX It has high-integration service interface boards to access a lot of PDH, SDH and data services.

2.2

Superior scalability protects CAPEX and reduces OPEX ZXMP S385 can be constantly evolved and upgraded. The user will just add or replace boards to expand the network capacity, which will reduce CAPEX of the expansion project.It adapts itself to the characteristics of metro services to maximize the equipment investment return of clients.

2.3

Leading RPR function supports IP evolution and protects CAPEX It has powerful data service processing function. It supports two rings working at the same time, unicast/multicast/broadcat services and bandwidth statistical multiplexing. It features high bandwidth utilization rate, fast service provision, service priority access control and fair mechanism and high QOS. It supports the RPR multi-ring spanning in the networking and avoids service termination & conversion to reduce faulty points.

2.4

Powerful embedded WDM function saves fiber resource It can add/drop wavelength-level optical signals.

2.5

Flexible design facilitates network planning & optimization The boards can be inserted into any slot and flexible design facilitates service configuration, maintenance and network planning & optimization.

2.6

Wide application, mature technology and high reliability

2




Due to mature technology and superior performance, ZXMP S385 is widely deployed in major carriers and private networks as well as other countries and regions, e.g., Korea, Pakistan, Morocco and Vietnam.



3


3

Functions

3.1

Cross-connection and extension capabilities Cross Clock board (CSF/CSE/CSA) of ZXMP S385 provides the cross-connect function and fulfill the straight-through, broadcast, add/drop, and cross-connection of services. CSF board implements high-order and low-order cross-switching functions. CSF has a space-division switching capacity of 1536 × 1536 VC4. In which, 256×256 VC4s are assigned to the time-division cross-connect service unit, the others are allocated to the space-division cross-connect unit of the system. CSE board implements high-order and low-order cross-switching functions. CSE has a space-division switching capacity of 1152 × 1152 VC4. In which, 256×256 VC4s are assigned to the time-division cross-connect service unit, the others are allocated to the space-division cross-connect unit of the system. CSA board implements high-order and low-order cross-switching functions. CSA has a space-division switching capacity of 256 × 256 VC4. In which, 32×32 VC4s are assigned to the time-division cross-connect service unit, the others are allocated to the spacedivision cross-connect unit of the system. The equipment can supports maximum 14 service slots and access a large amount of PDH, SDH and data services. It can process 176-path ECC, and support the network topologies as linear, ring, hinge, ring with chain, tangent ring and cross ring of STM-N levels meeting the complex networking requirements thoroughly.

3.2

Powerful Service Access Ability ZXMP S385 adopts modular structure, with its hardware including cross-connect card, clock card, control card, service card and service interface card. The service access capacity is shown in following table. A single sub-rack of ZXMP S385 has 14 slots for service boards and 10 slots for interface boards. The equipment can access a large amount of PDH, SDH and data services at one time.

3.2.1

Optical Interfaces ZXMP S385 provides five types of optical interfaces: OTU2, STM-64, STM-16, STM-4 and STM-1, as shown in Table 1 .

4




Table 1

Optical Interfaces Provided by ZXMP S385

Board Type

Rate (Mbit/s)

Board Integration (channel/board)

Maximum Access Quantity

OTU2

10709.225

1

14

STM-64

9953.280

1/2

14/28

STM-16

2488.320

4/8

56/72

STM-4

622.080

1/2/4

56

STM-1

155.520

2/4/8/16

208

ZXMP S385 has the one-interface OTU2 optical line board to support AFEC or G.709 standard FEC function. By increasing the line rate, the board can correct the bit errors in the line transmission. It may increase the receiving sensitivity by about 2dB or the OSNR tolerance by 5-7dB, and work with OBA+OPA and Dispersion Compensation Module (DCM) to implement the LH transmission without electrical regeneration. ZXMP S385 also provides OTU2/STM-64/STM-16 colored interfaces comply with ITU-T G.692 and ITU-T G.695, which can be connected to DWDM/CWDM directly without the OTU board. ZXMP S385 provides OTU2/STM-64/STM-16 DWDM wavelength interface with ITU-T standard 50GHz grid in C-band.

3.2.2

Electrical Interfaces ZXMP S385 provides STM-1 electrical interface and PDH electrical interfaces, as listed in Table 2 Table 2

3.2.3

Electrical Interfaces Provided by ZXMP S385

Board Type

Rate (Mbit/s)


Maximum Access Quantity

STM-1

155.520

4/8/16

208

E3

34.368

6

96

T3

44.736

6

96

E1

2.048

63

1260

T1

1.544

63

1260

Data Interfaces There are several data boards in ZXMP S385 V2.50:SEE,TGE2B, RSEB, AP1×8 and TGSA×8, as shown in Table 3 . SEE board provide 8×10M/100M+2×GE Ethernet services which support L2 switching function and EPS protection function. TGE2B board provides 2×GE adaptive Ethernet services.



5


RSEB board provides 8×10M/100M+2×GE interfaces which employs the bandwidth of SDH/MSTP ring network to provide the dual-ring topology and implement the ring interconnection of RPR nodes. FE Ethernet interfaces of each Ethernet board above can be optical or electrical. It provides FE optical interface via ESFE×8 and optical interface via OIS1×8 respectively. 10M/100M optical or electrical interfaces are available via replacing interface board. AP1×8 board is mainly used to converge or aggregate ATM service to SDH transmission network. It provides 8×155 Mbit/s optical interfaces at the ATM side and 1×622 Mbit/s non-concatenation data flow at the system side. TGSA×8 board supports 8 user interfaces which adopt SFP optical module. The first 4 user interfaces may respectively offer GE or SAN service. SAN service includes 1G Fiber Channel and 1G FICON services. The other 4 user interfaces may offer 4×GE services. Table 3

3.3

Ethernet services Provided by ZXMP S385

Board Name Interface Type


Maximum Access Capacity

SEE

8×10M/100 M +2×GE

8+2

128+32

TGE2B

2×GE

2

56

RSEB

8×10M/100 M +2×GE

8+2

128+32

AP1×8

8×155 Mbit/s

8

112

TGSA×8

(4×SAN+4×GE) or 8×GE

(4+4) or 8

(56+56) or 112

Integrated WDM Function ZXMP S385 has OAD (Optical Add/Drop) board to add/drop or multiplex/demultiplex 4 fixed-wavelengths of optical signals. OAD board consists of two types in all: OADD is for DWDM signals and OADC is for CWDM signals. ZXMP S385 optical line board has DWDM or CWDM optical interfaces, and OAD board can add/drop DWDM or CWDM optical signals. Both of them work together to actualize OAD interface function. ZXMP S385 single sub-rack supports at most 56 channels of DWDM OAD interfaces or 56 channels of CWDM OAD interfaces. ZXMP S385 V2.50 extension sub-rack can support at most 56 channels of DWDM OADM interfaces or 56 channels of CWDM OADM interfaces.

3.4

Complete Equipment Protection Ability Table 4 shows the equipment level protection of ZXMP S385.

6




Table 4

Equipment level protection provided by ZXMP S385

Items protected

Protection scheme

E1/T1 processing board

1:N (N≤9) tributary protection switching (TPS)

E3/T3 processing board

1:N (N≤4) TPS

STM-1 processing board(except OEL1×16 board)

1:N (N≤4) TPS

FE board

1:N (N≤4) TPS

CSF/CSE/CSA(Cross-switch and Synchronous-clock board)

1+1 hot backup

NCP/ENCP board

1+1 hot backup

–48 V power interface board

1+1 hot backup

ZXMP S385 supports the co-existence of several different TPS protection. ZXMP S385 adopts a dual-bus hierarchical design for service bus, overhead bus and clock bus, which improves system reliability and stability.

3.5

Perfect Network Protection Ability In terms of the network level protection, ZXMP S385 supports multiplex section protection (MSP) ring, linear MSP, unidirectional path switched ring (UPSR), subnet connection protection (SNCP) and logical subnet protection (LSNP), etc. ZXMP S385 can implement all networking features recommended by ITU-T. It supports the route reconstruction of Ethernet and IP, and meets IEEE802.3E.

3.6

Reliable Timing Synchronization Processing The clock timing/synchronization unit is composed of Cross Clock board (CSF/CSE/CSA) and SCI board. The unit completes system timing and network synchronization. It implements the following functions: •

Providing system clock signals and system frame header signals for all the units of the SDH equipment.

•

Providing overhead bus clock and frame header

•

Providing the corresponding interface for upper-level controller to configure and monitor the clock unit.

SCI board of ZXMP S385 provides four external reference clock output and four external reference clock input. The interface type is 2Mbit/s or 2MHz. SCI can be configured with four external 2.048M clock input references and 28 lines (or tributary) 8K timing input references. Synchronization can select external clocks, line clocks or E1/T1 tributary clocks.



7


The protection switching of clock reference sources bases on the alarm information and clock synchronization status message (SSM) algorithm-based automatic switching. ZXMP S385 provides E1 tributary re-timing function. It supports synchronous priority switching based on the SSM algorithm, optimizes synchronous timing distribution of the network, prevents the occurrence of timing loops and keeps network synchronization the optimal status. A software-controlled or a hardware phase lock circuit is used to implement four working modes: a. Fast pull-in; b. Locked; c. Holdover; d. Free run.

3.7

System control and communication The Net Control Processor (NCP) and Enhanced Net Control Processor (ENCP) implement the system control and communication function, which includes sending the configuration commands to all MCUs via S interface and collecting their performance and alarm information. With ENCP, the extension subrack can be accessed. NM information intercommunicates between NEs via the ECC channel. The order-wire board (OW) performs the order-wire function. It actualizes the intercommunication of order-wire phones between NEs via E1 and E2 bytes. It employs an independent CPU for order-wire and communicating with NCP processor via S interface. The Qx interface board is the communication interface between NE and subnet management control center (SMCC). With Qx interface, NCP/ENCP can report to SMCC the alarm and performance information of the NE and subnet and receive the commands and configurations sent from SMCC to the NE and subnet. The f interface is the LMT access interface of local NM, which is for the access management of portable PC. The reset and ring trip are on the rack. Other interfaces are on QXI and SCI boards. The NCP/ENCP boards monitor the fan plug-box of the NE. The power distribution unit performs the over/under voltage monitoring of input voltage. The alarm I/O: the NCP/ENCP boards offers 8-path external alarm switch quantity interfaces, collects the alarm signal of NE and transmits it to the alarm box and the firstcabinet-in-a-row. It offers 2-path switch quantity (UC) interface and may output 2-path switch quantity for user.

3.8

Overhead Processing The overhead process of ZXMP S385 is performed by NCP/ENCP board, OW board, CSF/CSE/CSA board, optical line boards and ATM board. ZXMP S385 supports overhead transparent transmission, i.e. low rate service signal and overhead can transfer transparently in STM-16 frame. It greatly improves the network

8




construction flexibility, abates the tension of insufficient optical fiber resources, and ensures the NM integrity and the NM information continuity.Overhead-Byte Usage List is show in Table 5 . Table 5

Overhead-Byte Usage List

Overhead type

Overhead name

ZXMP S385 application

A1, A2

Frame position indication for regeneration section, A1:11110110,A2:00101000

J0

S385 may identify, set and transparent transmit J0 byte

Z0

Not applied

D1~D12

S385 may set DCC of D1~D3 or D1~D12, and support the transparent transmission of D1~D12

E1, E2

S385 supports E1, E2 order wire telephone, as well as E1, E2 transparent transmission.

F1

S385 provides F1 64kbps co-directional data interface, and the transparent transmission of F1 byte

B1

Used for the error code monitor of regeneration section

B2

Used for the error code monitor of MS

K1, K2

Used for the auto-protection switchover (APS) command of MS

S1

b5~b8 used for synchronous status message

M1

Used for MS far-end difference indication

AU PTR

The rate adjustment on AU level

J1

Used for high-order path trace, able to be set

B3

Used for path error code monitoring

C2

Used for expressing the composition or maintenance status of VC-3/VC-4/VC-4X, able to read and write

G1

Used for returning the status and performance of path terminal to the path origin of VC3/VC4/VC4XC

F2, F3

Not applying

H4

Affording the general position indication to payload, as well as the special payload Position (i.e. H4 may be the multi-frame position indication of VC12 and VC2); and performing VC3/VC4 virtual concatenation

K3

Not applied

N1

Not applied

V5

Providing the functions of error code test, signal mark and channel status for VC1/VC2

J2

VC1, VC2 path trace byte, able to be set

N2

Not supported

RSOH/MSOH

AU pointer

POH



9


Overhead type

3.9

Overhead name

ZXMP S385 application

K4

Used for the virtual concatenation process of low-order path

Easy For Maintenance And Upgrade With the following functions, the system becomes more reliable, featuring good maintainability and easy scalability:

3.10

•

It supports optical power monitoring functions.

•

It supports online loading and remote upgrading of card software (including FPGA logic).

•

It provides the daily maintenance function. In case of a fault, it can quickly locate the fault to the card level.

•

All cards provide the temperature monitoring function.

•

Pluggable optical module (SFP module, LC connector).

Alarm input/output NCP/ENCP provides 8 external alarm Boolean value input interfaces and two control output interface. NCP/ENCP collects alarm indication signals from NEs and sends them to the alarm box and the first cabinet of the line. There are four alarm output interfaces. The system provides two user alarm output interfaces and level alarms. It shares a DB9 interface with F1 interface at the backplane side.

3.11

System power supply ZXMP S385 equipment employs the dual-power system to access the -48V power in the equipment room and distributes the -48V DC power in the power distribution box. It adopts separate power supply mode. No power boards in the sub-rack, the -48V power directly powers each board via the MB board through a DC/AC conversion module. Two lines of independent external -48V DC power supply, -48VGND and the system protection GND are led from the connectors on the distribution frame and then connected to the sub-rack power distribution board. The power distribution (PD) board provides the equipment with the following functions such as -48V power switch, distribution, isolation, EMI filtering, protection against lightening and surge, fan power supply and control

10




3.12

Perfect EMC and Operation Safety EMC, operation safety and fire/explosion protection of the equipment are fully considered in the circuit board design.



11


4

System Architecture

4.1

Product Physical Structure

4.1.1

System architecture ZXMP S385 functional block diagram is shown in Error! Reference source not found. Figure 1

ZXMP S385 functional block diagram

ZXMP S385 SDH Based Multi-Service Node Equipment

SDH Equipment (TM, ADM, REG)

ZXONM E300 EMS/SNMS

Security management

Maintenance management

Performance management

Fault management

Configuration management

System management

Sverice Acess Platform

Power Support Platform

Overhead Processing Platform

Sverice Crossconnect Platform

Clock Processing Platform

NE Control Platform

Hardware System

NE Management Software System

In terms of functional hierarchy, ZXMP S385 can be divided into hardware system and network management (NM) software system, which are independent of each other and work coordinately. The hardware system is the main body of the ZXMP S385. It can work independently of the NM software system. A standard "IEC cabinet + sub-rack" structure is used for ZXMP S385. Both the cabinet and sub-rack unit are designed in the principle of “front-facing installation and maintenance” to save equipment space and allow for back-to-back installation, frontfacing operations and maintenance. Appearance of S385 Sub-rack is show in Figure 2 .

12




Figure 2

4.1.2

Appearance of S385 Sub-rack

System mapping structure ZXMP S385 adopts the latest mapping structure of ITU-T recommendation, as shown in Figure 3. Figure 3

Multiplexing/mapping structure adopted by ZXMP S385

×N

STM-N

×1

AUG

AU-4

VC-4 ×3

Pointer processing

TUG-3

×1

TU-3

×7

VC-3 C-3

44736kbit/s 34368kbit/s

C-12

2048kbit/s

C-11

1544kbit/s

TUG-2 ×3

Multiplexing

TU-12

VC-12

Alignment Mapping

VC-11

Note: In above mapping structure, ZXMP S385 V2.00 and above version supports E1/T1, E3/T3, STM-1 (optical/electrical), STM-4, STM-16, STM-64 and Ethernet services. V2.20



13


and later versions support SAN service. The service enters STM-N via AU-4 multiplexing/mapping route instead of AU-3 multiplexing/mapping route. T1 service supports VC11-TU12 mapping route.

4.2

Hardware Architecture With the “platform” design concept, the ZXMP S385 hardware system consists of the NE control platform, clock processing platform, service cross platform, overhead processing platform, power supply support platform and service access platform. By means of platform establishment, transplant and integration, ZXMP S385 forms different functional units or boards, which are connected in a specific way to form the SDH equipment with perfect functions and flexible configurations. ZXMP S385 can be configured as a TM, ADM, or REG equipment, depending on the networking requirements. Configurations of REG at rates of 2.5G and 10G are available in V2.00 and above version. The relationships of all the platforms are shown in Figure 4 Figure 4

Functional relationships of the hardware platforms

Service access platform

Service crossconnect platform

. . .

Clock processing platform

. . .

. . .

Overhead processing platform

Power supply support platform

1


. . .

NE control platform

NE control platform As the interface between NE equipment and background NMS, the NE control platform is the agent for other platforms to receive or report network management information.

2

Power supply support platform With the distributed power supply style, power supply modules installed in each board provide power to corresponding boards.

3

14





This platform supports the access of SDH, PDH, Ethernet, ATM and SAN services. It converts accessed services to corresponding formats, and then forwards them to the service cross platform for aggregation and distribution. 4

Overhead processing platform This platform provides orderwire voice channel and some auxiliary data digital channels through section overhead (SOH) bytes while transmitting payloads.

5

Clock processing platform As one of the core part of the hardware system, this platform provides the system clock for all platforms in the equipment.

6

Service cross platform This platform receives service signals and various information from service access platform and overhead processing platform, and implements service orientation and information aggregation/distribution/switching. ZXMP S385 backplane uses the unified service bus, clock bus, overhead bus and control bus, and adopts the star structure centered on cross and clock board.

4.3

Software Architecture ZXMP S385 employs ZXONM E300 to manage and monitor the hardware system and transmission network, and coordinate the work of the transmission network. 1

Brief introduction to NM structure ZXONM E300 system adopts four-layered structure, including equipment layer, NE layer, NE management layer and sub-network management layer. It can also provide Corba interface for the network management layer. The hierarchical structure of ZXONM E300 system is shown in Figure 5 .



15


Figure 5

2

Hierarchical structure diagram of NM software

NE management scope ZXONM E300 features forward and backward compatibility, capable of managing all SDH-based multi-service node equipments. ZXONM E300 V3.19 supports management of ZXMP S385 V2.50 version.

3

Function introduction It can perform NE-layer network management functions such as configuration management, fault management, performance management, security management, system management, and maintenance management. Please refer to relevant documentation of ZXONM E300 for details of NMS.

16




5

Technical Specifications

5.1

Physical Indices

5.1.1

Subrack and cabinet appearance The subrack adopts 19” high rack with dimension of 888.2mm (height) ×482.6mm (width) ×270mm (depth). It consists of side panels, beams and metal guide rails, with the functions of heat dissipation and shielding. At the bottom of the subrack is a separate fan plug-in box equipped with 3 independent fan module boxes, each fan module box separately connects to fan backplane to facilitate maintenance. At the top of the subrack a decoration door featuring decoration, ventilation and shielding functions can be detached flexibly. ZXMP S385 Subrack structure diagram is show in Figure 6 . Figure 6

Subrack structure diagram

1. Top outlet 2. Decoration door 3. Board area 4. Lower cabling area 5. Fan plug-in box The subrack consists of four parts: 1

Backplane: the carrier for boards, connects ZXMP S385 to the connection interface of external signals. The boards are connected to the buses via the board connection sockets on the backplane.



17


2

Plug-in board area: it is dual-layer structure used to install ZXMP S385 boards.

3

Fan plug-in box: located at the bottom of the subrack, it provides forced air cooling for the equipment to dissipate heat.

The rear part of ZXMP S385 is equipped with one left and one right mounting lugs which are used to fix the equipment subracks in the cabinet. ZXMP S385 subrack adopts back fixing installation mode, it can be fixed in the cabinet from the front without obstructing cable layout, satisfying requirements for front-facing installation, front-facing maintenance, against wall and back-to-back installation of equipment cabinet. ZXMP S385 cabinet is 19” cabinet compliant with ETSI standards. It is made of excellent steel plate and features good electromagnetic shielding and heat dissipation performances.

5.1.2

Subrack backplane ZXMP S385 backplane is fixed at the subrack, serving the carrier for connecting all the boards. It is divided into upper and lower parts, in which, the upper part connects various functional interface boards, and the lower part connects various functional boards. The backplane contains service bus, overhead bus, clock bus, board-in-position bus, connects all the boards, equipment and external signals via interfaces and sockets. Backplane adopts unified arrangement of bus arrays of payload services, auxiliary services, internal board-to-board communication and clock, thus ensures the equipment to add boards with various types of interfaces according to customer’s requirements.

5.1.3

Fan plug-in box The structure of the fan plug-in box of the ZXMP S385 is shown in Figure 7. Three independent fan boxes are installed in the fan plug-in box, the structure of fan box is shown in Figure 8. Each fan module is electrically connected to the fan backplane via the socket at the back of the box. The fan box features independent locking function. It has running and alarm indicators on the front panel. Figure 7

Structure of fan box

1.Fan box mounting bracket 2. Fan box

18




Figure 8

Fan box structure

1. Fan box 2. Fan 3. Indicator 4. Button switch The fan system of ZXMP S385 is the component for cooling and heat dissipation. Each subrack contains a fan backplane and three independent fan units side by side. Each fan unit is composed of a fan box, a fan and a FAN board. The FAN board is control by ENCP and provides rotation-blocking signal for ENCP monitor. The FAN board controls the fan operation if the FAN board loses contact with ENCP.

5.2

Appearance and dimensions Dimensions and weight indexes of structural parts of ZXMP S385 are shown in Table 6 Table 6

Dimensions and weights of structural parts

Dimension (mm)

Weight (kg)

2000 (height)×600 (width)×300 (depth)

70


80


90

ZXMP S385 sub-rack

888.2mm (height)×482.6mm (width)×270mm (depth)

25

Power distribution box

132.5 (height)×482.6 (width)×269.5 (depth)

5

Fan plug-in box

43.6mm (height)×436mm (width)×245mm (depth)

--

Dustproof plug-in box

43.6mm (height)×482.6mm (width)×250 (depth)

2

Ventilation unit

43.6mm (height)×482.6mm (width)×250 (depth)

3

Upper cabling area

133 mm (height)×482.6mm (width)×250mm (depth)

--

Cross-connect clock board (CSA/CSE/CSF)

PCB: 320 (height)×210 (depth)×2 (depth) Front panel: 345.6 mm (height) × 8 HP (width)

--

Structural part

ZXMP S385 cabinet



19


Structural part

Dimension (mm)

Weight (kg)

Service interface board and ENCP, OW

PCB: 277.8mm (height)×160mm (depth)×2mm (width) Front panel: None

--

Service board (lower layer boards of subrack)

PCB: 320mm (height)×210mm (depth)×2mm (width) Front panel: 345.6 mm (height)×5HP (width)

--

Note: The cabinet weight is the weight of an empty cabinet. 1HP=5.08 mm ZXMP S385 offers cabinets with height of 2000mm, 2200mm and 2600mm. Subrack, the core component, is installed in ZXMP S385 cabinet. A 2000mm-high cabinet can accommodate only one subrack. A 2200mm- or 2600mm-high cabinet can accommodate one or two subracks. Various functions of the equipment can be realized via different configurations of subrack boards. In accordance with current situation of transmission cabinet, overall structure layout can be classified into 3 scenarios based on cabinet height, which are shown in Table 7 ,Table 8 . Table 7

ZXMP S385 own configuration

Cabinet height


Subrack

2.0m (with effective height of 42U)

3U

20U+1U (subrack and cabling area+dustproof plug-in box)


3U

20U+1U+1U+20U+1U (2 subracks and cabling area+2 dustproof plug-in boxes+1 ventilation unit)

2.6 m (with effective height of 56U)

3U

20U+1U+1U+20U+1U (2 subracks and cabling area+2 dustproof plug-in boxes+1 ventilation unit)

Table 8

ZXMP S385 is configured with other products

Cabinet height



20


Subrack

3U

ZXMP S385 (20U+2U)+ ZXMP S320 (4U+1U)

3U

ZXMP S385 (20U+2U)+ ZXMP S330 (10U+3U)

3U

ZXMP S385 (20U+2U)+ ZXMP S320 (4U+1U)

3U

ZXMP S385 (20U+2U)+ ZXMP S330 (10U+3U)




Cabinet height



Subrack

3U

ZXMP S385 (20U+2U)+ ZXMP S320 (4U+1U)

3U

ZXMP S385 (20U+2U)+ ZXMP S330 (10U+3U)

3U

ZXMP S385 (20U+2U)+ ZXMP S360 (21U+2U)

3U

ZXMP S385 (20U+2U)+ ZXMP S390 (23U+2U)

“+1U”,”+2U”,”+3U” in the table are space reserved for dustproof, ventilation and cabling.

5.3

System subrack and slot diagram ZXMP S385 sub-rack includes board, fan plug-in box and dustproof unit. Structure of sub-rack is shown in Figure 9. The plug-in board area of ZXMP S385 is separated into 2 layers, where, the top layer is for interface boards with 15 slots and the low layer is for functional boards with 16 slots. The sub-rack bottom contains a 1U fan plug-in box that contains three fans working independently.



21


Figure 9

5.4

Board slot layout of sub-rack

System board list and description Common board name (code), applying rule and unit power consumption of ZXMP S385 are shown in Table 9 .The maximum input current of subrack is 16A. Table 9

22

Boards/unit list (with power consumption)

Board

Board name and configuring explanation

Power Consum ption in Common Temperat ure (25 ) (W)

Max. Power Consum ption (45 ) (W)

Weight (Kg)

NCP

Net Control Processor, 1 for standard configuration, 2 able to practice 1+1 protection

4.8

5

0.44

ENCP

Enhanced Net Control Processor, 1 for standard configuration, 2 able to practice 1+1 protection

9.6

9.9

0.46

OW

Order-wire

5.3

5.4

0.47

QxI

Qx interface 1 for standard configuration

3.9

4.1

0.52

CSA

Cross-switch and Synchronous-clock (256x256 VC4 high order with 32x32 VC4 low order)

27.4

28.2

1.14




Board



CSF

Cross-switch and Synchronous-clock (1440x1440 VC4 high order)

32.4

33.4

1.46

TCS64

Cross-switch with low-order

17.3

17.8

0.56

TCS128


36.5

37.6

0.95

TCS256


60.5

62.3

0.98

SCIB

B-type clock interface board (2Mbit/s)

3.9

4.0

0.51

SCIH

H-type clock interface board (2MHz)

4.4

4.5

0.61

OL64FE C

Optical Line of out2, with L-64.2cIf, L64.2c IIf or L-64.2pf. Supports FEC function

25

27.3

1.12

OL64

Optical Line of STM-64, with S-64.2b, L-64.2cI, L-64.2cII, P1L1-2D2 or L64.2p.

28.8

31.2

0.95

OL64x2

STM-64×2 optical line board. Optical module types configurable include S64.2b, L-64.2c1, L-64.2c2 and L64.2p. Refer to ECC information for details.

31.9

34.3

1.12

OL16

Optical Line of STM-16, with S-16.1, L-16.2, L-16.2JE, L-16.2U or L-16.2P

14.9

16.3

0.65

OL16×4

Optical Line of STM-16×4, with S16.1, L-16.2 or L-16.2U

23.6

28.3

1.30

OL16×8

STM-16×8 optical line board. Optical module types configurable include S16.1, L-16.2, L-16.2u and L-16.2p. Refer to ECC information for details.

33.5

38.2

1.43

OL4×2

Optical Line of STM-4×2

10.1

10.4

0.70

OL4×4


16.8

17.3

0.74

OL1×4


8.9

9.2

0.74

OL1×8


14.4

14.8

0.80

OEL1×16

Optical Line/Electrical Line Process of STM-1×16

18.1

18.6

0.87

OEIS1x8

Optical /Electrical interface of STM1×8

6.4

6.4

0.38

LP1×4

Line Process of STM-1×4, used together with electric interface switchover board or bridge board

5.8

6

0.65

LP1×8

Line Process of STM-1×8, used together with electric interface switchover board or bridge board

5.8

6

0.68




Weight (Kg)

23





Weight (Kg)

4-path STM-1 electric interface switchover board, used for interface slot

Before switchove r 0.5, after switchove r 8.2


0.40

ESS1×8

Electrical Interface of STM-1×4



0.47

EP3×6

Electrical Process of E3/T3×6

12.5

12.9

0.71

ESE3×6

Electrical Interface Switching of E3/T3×6



0.40

BIE3

Bridge Interface of STM1e/E3/T3/FE,used for the interface slot corresponding to protection board

0.5

0.6

0.37

EPE1×63 (75Ω)

Electrical Process of E1×63 (75Ω)

19

19.6

0.81

EIE1×63( 75Ω)

Electrical Interface of E1×63 (75Ω)

0.5

0.6

0.36

ESE1×63 (75Ω)

Electrical Interface Switching of E1×63 (75Ω)



Before switcho ver 0.6, after switcho ver 8.4

EPE1×63 (120Ω)

Electrical Process of E1×63 (120Ω)

19

19.6

0.83

EPT1×63 (100Ω)

Electrical Process of T1×63 (100Ω)

15.4

15.8

0.81

EIT1×63

Electrical Interface of T1×63 (100Ω) or E1×63 (120Ω)

0.5

0.6

0.35

Electrical Interface Switching of T1×63 (100Ω) or E1×63 (120Ω)



0.54

Board

ESS1×4

EST1×63

24




Board



BIE1

Bridge Interface of E1/T1

0.5

0.6

0.39

SEE

Enhanced Intelligent Ethernet Processing Board(48:1),customer side 8×FE(optical or electrical)+2×GE

26.4

27

0.75

RSEB

Embedded RPR Ethernet Processing Board, customer side 8×FE(optical or electrical)+2×GE

29.4

30.3

0.98

AP1×8

8×155Mbit/s optical board at the ATM side and 1×622Mbit/s nonconcatenation data flow at the system side.

24.1

24.9

0.85

TGE2B

GE transparent process board

19.1

19.7

0.73

TGSA×8

SAN service processing board, customer side 4×SAN+4×GE or 8×GE

36.5

37.6

0.99

OIS1×8

Optical interface board cooperating with Ethernet board RSEB

7.0

7.2

0.45

OEIFEx8

Optical /electric interface board cooperating with SEE board

8.5

8.5

0.45

ESFE×8

Ethernet electric board cooperating with Ethernet board including RSEB/SEE

0.6

0.7

0.38

OADD

Optical add/drop unit board for 4 channels of fixed wavelength DWDM optical signals.

4

4.1

0.75

OADC

Optical add/drop unit board for 4 channels of fixed wavelength CWDM optical signals.

3.5

3.6

0.75

FAN

Fan board

4.2

4.3

0.36

OBA12

Optical Booster Amplifier board(12dBm) built-in

6.1

11.6

1.15

OBA14

Optical Booster Amplifier board(14dBm), built-in

6.1

11.6

1.15

OBA17


6.1

11.6

1.15

OBA19


6.1

11.6

1.15

OPA32

Optical Pre-Amplifier(-32dBm), builtin

4.8

10.3

1.18

OPA38

Optical Pre-Amplifier(-38dBm), builtin

4.8

10.3

1.18




Weight (Kg)

25


5.5

STM-N optical interfaces performance Performance of the OTU2/STM-64/16/4/1 optical interfaces is shown in Table 10 ,Table 11 ,Table 12 ,Table 13 . Table 10

Performance of the STM-1 optical interface

Nominal bit rate

155520kbit/s

Classification code

S-1.1

L-1.1

L-1.2

Working wavelength (nm)

1310

1310

1550

Source type

MLM

SLM

SLM

Min transmitting optical power (dBm)

-15

-5

-5

Max transmitting optical power (dBm)

-8

0

0

Minimum extinction ratio (dB)

8.2

10

10

Poorest sensitivity (dBm)

-28

-34

-34

Minimum overload point (dBm)

-8

-10

-10

Transmitter at reference point S G.957-compliant

Optical path between Point S and R Receiver at reference point R

Table 11


Nominal bit rate

622080kbit/s

Classification code

S-4.1

L-4.1

L-4.2


1310

1310

1550

Source type

MLM

SLM

SLM


-15

-3

-3


-8

2

2


8.2

10

10


-28

-28

-28


-8

-8

-8

Transmitter at reference point S Optical path between Point S and R

G.957-compliant

Receiver at reference point R

Table 12

26


Nominal bit rate

2488320kbit/s

Classification code

S16.1

L16.2

L16.2JE

L16.2P

L16.2U


1310

1550

1550

1550

1550

Source type

SLM

SLM

SLM

SLM

SLM




Nominal bit rate

2488320kbit/s


-5

-2

+2

-2

-2


0

3

5

3

3


8.2

8.2

8.2

8.2

8.2


-18

-28

-28

-28

-28


0

-9

-9

-9

-9


G.957-compliant


Table 13

Performance of the STM-64/OTU2 optical interface of ZXMP S385

Nominal bit rate

9953280kbit/s

10709225kbit/s

Classification code

S64.2b

L64.2c1

L64.2c2

P1L12D2

P1L1-2D2


1550

1550

1550

1550

1550

Source type

SLM

SLM

SLM

SLM

SLM


-1

-2

3

0

0


2

2

6

4

4


8.2

8.2

8.2

9

9


-14

-22

-22

-24

-24


-1

-9

-9

-7

-7


G.709compliant

G.691 or G.959.1-compliant


5.6

PDH interfaces performance and indexes Performance of PDH electrical interfaces is shown as Table 14 . Table 14

Performance of the PDH electrical interface

Type

1544 kbit/s

2048 kbit/s

34368 kbit/s

44736 kbit/s

155520 kbit/s

Code pattern

AMI or B8ZS

HDB3 code

HDB3 code

B3ZS code

CMI code

G.703complia nt

G.703complia nt

G.703complian t

G.703complian t

G.703compliant

Bit rate of signals at output port Attenuation tolerance at input port ZTE Confidential Proprietary


27


1544 kbit/s

Type

2048 kbit/s

34368 kbit/s

44736 kbit/s

155520 kbit/s

-

-

-

Frequency deviation tolerance at input port Anti-interference capability of input port

Permitted input port attenuation, permitted frequency deviation and output port signal bit rate tolerance are listed in the following Table 15 . Table 15 Input port permitted attenuation, frequency deviation and output port signal bit rate tolerance

Interface rate

Permitted input port frequency deviation(regular squared attenuation)

Permitted input port frequency deviation

Output port rate tolerance

1544kbit/s

--

Greater than ±32ppm

Less than ±32ppm

2048 kbit/s

0dB~6dB, 1024kHz


Less than ±50ppm

34368 kbit/s

0dB~12dB, 17,184kHz


Less than ±20ppm

44736 kbit/s

--


Less than ±20ppm

155520 kbit/s

0dB~12.7dB, 78MHz


Less than ±20ppm

•

Reflection attenuation at the input/output ports For input/output port reflection attenuation index of various electronic ports of ZXMP S385, please refer to Table 16 .

Table 16

Requirements for the input/output port reflection attenuation

Interface bit rate

2048Kbit/s input port

34368Kbit/s input port 155520Kbit/s input/output port •

Test frequency range

Reflection attenuation (dB)

51.2kHz~102.4kHz

12

102.4kHz~2048kHz

18

2048kHz~3072kHz

14

860kHz~1720kHz

12

1720kHz~34368kHz

18

34368kHz~51550kHz

14

8MHz~240MHz

15

Anti-interference capability of the input port The ratio of main signals to interference signals is 18dB.

28




•

Output port waveform The output port Recommendation.

•

waveform

complies

with

template

specified

in

G.703

Over-voltage protection of the input and output interfaces The input and output interfaces must bear 10 continuous standard pulses (5 positive and 5 negative) without being damaged. The rising time of a standard pulse is 1.2μs, the width is 50μs and the voltage amplitude is 20V.

5.7

Performance of data boards There are several data boards in ZXMP S385 V2.50:SEE, TGE2B, RSEB, AP1×8 and TGSA×8.

5.7.1

5.7.2

Performance of SEE •

Providing 8×10M/100M+2×GE interfaces.

•

Support 48×VCG. VCG mapping mode may be VC-12-Xv/VC-3-Xv/VC-4-Xv. VCG supports at most 1.25G bandwidth.

•

The total mapping bandwidth of SDH backplane is 1.25Gbps.

•

Support E-Line, E-Tree and E-LAN services.

•

Configure S-VLAN according to port or customer CE-VLAN.

•

Support Ethernet OAM to facilitate fault locating and performance inspection.

•

Support GFP RDI-CSF alarm.

•

Support Ethernet access rate control and DifferServ.

•

Support EPS protection.

•

Support port dispatching fairness of best-effort service.

Performance of TGE2B TGE2B board provides 2×GE adaptive Ethernet services.The performance is show as Table 17 .



29


Table 17

Performance of TGE2B of ZXMP S385

Characteristics of Ethernet board

Explanation of board function

Property sort

Board name

TGE2B

Ethernet port characteristics

1000BASE-SX/LX

Connector

LC

QTY of board interface

2

Port work mode (rate, full duplex and auto-negotiation)

Support

Optical module able to plug

Support

Ethernet port

Interface mode

Front-outlet on panel

Remote download and upgrade

Support

Max. Port QTY at system SDH side (WAN port)

2 2.5G

Total backplane mapping bandwidth

Virtual concatenation

VC3 Virtual concatenation

Support (The delay supported by VC3 is 8ms. The board adopts the V3-AU3-AUG mode and the mapping is not made via VC4. Some problems occur in the interconnection with other vendors’ equipment and in the test. The interconnection and test adopt VC4 instead of VC3. )

VC4 Virtual concatenation

Support (The delay tolerance supported by VC4 is 8ms.)

Dynamic VCG bandwidth increase/decrease, no damage with service

Support (The dynamic service bandwidth adjustment leads to 100ms loss. There is no problem in the function and interconnection.)

LCAS management functions (enable, alarm, event report)

Support

Multi-path protection of VCG level, protecting time <300ms

Support

Support GFP encapsulation, satisfy ITU-T G.7041 standard

Support

support LAPS protocol, satisfy ITU-T X.86 standard

Support

support PPP encapsulation protocol

Support

Support Jumbo frame

Support (maximum 9600 byte)

LCAS protocol

Encapsulation protocol

30

Support 16×VC4 (Each VCG supports at most 8×VC4), or 48×VC3 (Each VCG supports at most 24×VC3).




Characteristics of Ethernet board

Explanation of board function

Support the flow control based on port

Full duplex 802.3x PAUSE flow control Support port transparent transmit, the service frame format might be (Eth II, 802.3, 802.1QTAG)

Support. Support the transfer of the port Link state to the opposite end, and the Link State Transfer technique (LST), which will greatly reduce the switching time of the router.

The transparent transmit performance satisfies MSTP recommendation, refer to MSTP standard 6.2.1 for details, key performance parameters: package losing rate, burst interval, transfer rate, and delay

Support

The intercommunic ation of different products inside company

VC4 level intercommunication

VC4-level intercommunicating with EOS series boards, RPR functional RSEB board

Ethernet performance

Support Ethernet performance monitor of port level

Support

Point-to-point transparent transmit (private service mode)

5.7.3

Performance of RSEB RSEB maps Ethernet service to RPR, and performs the unique functions of RPR. It uses the channel bandwidth resource of SDH/MSTP ring network to provide the dual-ring topology required by RPR and implement the ring interconnection of RPR nodes. RSEB provides user Ethernet interfaces as 8×FE (optical/electrical) +2×GE (optical). It provides FE optical or electrical board by cooperating with OIS1×8 or ESFE interface board respectively. RSEB board provides two RPR ports and four EOS port at system side: •

RPR at system side contains two RPR SPAN: RPR SPAN1 and RPR SPAN2 with mapping methods of VC-4-Xv, VC-3-Xv, backplane bandwidth is 2.5G, capable of constructing 1.25G RPR.

•

RPR board at system side provides four EOS ports with mapping method of VC-12Xv and a maximum bandwidth of 63×VC12.

EOS system port can be used for RPR service cross-ring, or intercommunication with EOS boards as SEE . It supports LCAS protocol. RPR SPAN port and EOS system port share the 2.5 Gbit/s SDH processing bandwidth. They support maximum 2.5 Gbit/s of RPR ring total bandwidth, and maximum 155 Mbit/s ZTE Confidential Proprietary


31


of EOS bandwidth (RPR ring total bandwidth and EOS bandwidth cannot reach the maximum values simultaneously). RSEB board has the following functions:

5.7.4

•

Switching capacity: 5G, backplane bandwidth:2.5G;

•

Providing 8FE+2GE user Ethernet interfaces;

•

Compliant with IEEE802.17, support for two RPR SPAN, capable of forming 1.25G bidirectional ring at most;

•

Support for interoperation of RPR ring and EOS chain, implementing conversion of mapping granules;

•

Support for Bypass RPR MAC function, used as EOS transparent transmission board to support transparent transmission of two GE+4 FEs;

•

EOS port supporting CSF OAM function, with point-to-point LST function available;

•

Support for IGMP Snooping broadcast protocol, support for IPTV application;

•

Support for LACP protocol, providing large-capacity dynamic link aggregation function with protection;

•

Good service security isolation, support for Q in Q-based VLAN VPN;

•

Support for VC-12-Xv/VC-3-Xv/VC-4-Xv, LCAS and GFP.

Performance of AP1×8 AP1×8 board is mainly used to converge or aggregate ATM service data to SDH transmission network. It provides 8×155 Mbit/s optical interfaces at the ATM side to perform functions as ATM layer processing and mapping from ATM cell to VC-4. It provides 1×622 Mbit/s non-concatenation data flow at the system side. With 622M backplane bandwidth and 622Mbps cell switching capacity, it can select 1-4 VC-4 channels to transmit ATM services.

32

•

Backplane bandwidth: 622M, cell switching capacity: 622Mbps.

•

Supports four ATM service types as constant bit rate (CBR), realtime variable bit rate (rt-VBR), non-realtime variable bit rate (nrt-VBR) and unspecific bit rate (UBR).

•

Supports VP/VC switching.

•

Support VP uni-directional/bidirectional 1+1 and 1:1, supports VPRing, VCRing functions.




5.7.5

•

Support OAM function of ATM, supports VP protection switching, the switching request can be alarms as VP-AIS (Virtual path-based alarm indication signal), LOS (loss of signal), LOF (loss of frame), OOF (out of frame), LAIS (line alarm indication signal), LCD (loss of cell delineation), and LOP (loss of pointer).

•

Supports ATM space, logic multicast, when performing ATM exchange, it can copy one input ATM cell flow (VP, VC) to multiple output ATM links.

Performance of TGSA×8 TGSA×8 has SAN and GE transparent transmission interface. It supports 8 user interfaces which adopt SFP optical module. The first 4 user interfaces may respectively offer GE or SAN service. SAN service includes 1G Fiber Channel and 1G FICON services. The other 4 user interfaces may offer 4×GE services. TGSAx8 provides 4×2.5G service bus at the system side. The total bandwidth is 10G. Other characteristics of TGSAx8 are showed as follows: •

Support GFP and comply with G.7041.

•

Support LOF, OOF, AU-AIS and AU-LOP alarm check.

•

Provide line-side and user-side loopback functions of user interface.

•

Support VC-3 and VC-4 mixed concatenation. Any VCG may be respectively configured to VC-3 or VC-4 virtual concatenation. VC-3 supports VC-3-->TU-3->AU-4 mapping path.

•

Support LCAS protocol and complies with G.7042.

5.8

Physical Performance of Ethernet

5.8.1

Ethernet interface types and followed standard Ethernet interface index is show in Table 18 . Table 18

Ethernet interface index

Type

Rate (bps)

followed standard

Interface type

interface

10BASE-T

10M

IEEE 802.3

Electronic interface

RJ45, category 3 UTP

100BASE-TX

100M

IEEE 802.3u

Electronic interface

RJ45, category 3 UTP



33


Type

Rate (bps)

followed standard

Interface type

interface

100BASE-FX

100M

IEEE 802.3u

M-1.1/S-1.1/L-1.1

SFP-LC

All optical interface indices are described as following table. 1

FE MMF optical interface(M-1.1) FE MMF optical interface(M-1.1)as show in Table 19 ,Table 20 .

Table 19

Transmission index of FE MMF optical interface

Item

62.5/125μm MMF

Transmission unit type

MMF LD

Transmission distance

≤2

Interface

SFP-LC

Unit KM

Wavelength (λ, range)

1270~1380

nm

Trise/Tfall (maximum;10%~90%)

3

ns

RMS spectrum width (maximum)

63

nm

Output optical power (maximum)

-14

dBm

Output optical power (minimum)

-20

dBm

Output optical power when the LD is shut down (maximum)

-45

dBm

Extinction ratio (minimum)

10

dB

Table 20

Receiver index of FE MMF optical interface

Item

62.5/125μm MMF

Unit

Wavelength(λ, range)

1270~1380

Nm

input optical power (maximum)

-14

dBm

Receiver sensitivity

-30

dBm

2

FE short distance SMF optical interface(S-1.1) FE short distance SMF optical interface(S-1.1) as show in Table 21 ,Table 22

34




Table 21

index of FE short distance SMF optical interface

Item

10/125μm SMF


SMF LD


≤15

Interface type

SFP-LC

Wavelength(λ, range)

1261~1360

nm


2.5

ns

RMS spectrum width(maximum)

7.7

nm

output optical power(maximum)

-8

dBm

output optical power(minimum)

-11.5

dBm

Output optical power when the LD is shut down(maximum)

-45

dBm

Extinction ratio(minimum)

9

dB

Table 22

Unit KM

receiver index of FE short distance optical interface

Item

10/125μm SMF

Unit


1261~1360

nm

Input optical power (maximum)

-8

dBm


-31

dBm

3

FE long distance SMF optical interface(L-1.1) FE long distance SMF optical interface(L-1.1) as show in Table 23 ,Table 24 .

Table 23

Transmission index of FE long distance SMF optical interface

Item

10/125μm SMF


SMF LD


≤40

Interface type

SFP-LC

Wavelength (λ,range)

1261~1360

nm

Trise/Tfall (maximum; 20%~80%)

2.5

ns


3

nm


0

dBm


-5

dBm


-45

dBm

Extinction ratio (minimum)

10

dB



Unit KM

35


Table 24

5.8.2

Receiver index of FE long distance optical interface

Item

10/125μm SMF

Unit

Wavelength (λ range)

1261~1360

Nm


-9

dBm


-34

dBm

GE interface types and followed standard GE interface index is show in Table 25 . Table 25

GE interface index

Type

Rate(bps)

followed standard

Interface type

interface

1000BASE-SX

1000M

IEEE 802.3z

M-1.8

SFP-LC

1000BASE-FX

1000M

IEEE 802.3z

S-1.1 or L-1.2

SFP-LC

All optical interface indices are described as following table. 1

GE MMF optical interface(M-1.8) GE MMF optical interface(M-1.8) as show in Table 26 ,Table 27 .

Table 26

36

Transmission index of GE MMF optical interface

Item

62.5/125μm MMF


MMF LD


275

Interface

SFP-LC

Unit m


830~860

nm


0.26

ns


0.85

nm

Output optical power(maximum)

-4

dBm

Output optical power(minimum)

-9.5

dBm


-35

dBm

RIN(maximum)

-117

dB/Hz


9

dB




Table 27

Receiver index of GE MMF optical interface

Item

62.5/125μm MMF

Unit

Wavelength(λ,range)

770~860

nm

input optical power(maximum)

0

dBm


-17

dBm

Minimum return loss

12

dB

Intensified receiving sensitivity (maximum)

-12.5

dBm

2

GE short distance SMF optical interface(S-1.1) GE short distance SMF optical interface(S-1.1) as show in Table 28 ,Table 29 .

Table 28

Transmission index of GE short distance SMF optical interface

Item

10/125μm SMF

Unit


SMF LD


≤10

Interface type

SFP-LC


1270~1355

nm


0.26

ns


2.8

nm

KM


-3

dBm


-9.5

dBm


-35

dBm


9

dB

RIN(maximum)

-120

dB/Hz

Table 29

Receiver index of GE short distance optical interface

Item

10/125μm SMF

unit

Wavelength (λ ,range)

1270~1355

nm


-3

dBm


-20

dBm


-14.4

dBm

3

GE long distance SMF optical interface(L-1.2) GE long distance SMF optical interface(L-1.2)as show in Table 30 ,Table 31 .



37


Table 30

Item

10/125μm SMF


SMF LD


≤80

Interface type

SFP-LC

Wavelength (λ,range)

1540~1570

nm


2.5

ns


0.16

nm


5

dBm


0

dBm


-45

dBm


9

dB

RIN(maximum)

-120

dB/Hz

Table 31

5.9

Transmission index of FE long distance SMF optical interface

Unit Km

Receiver index of GE long distance optical interface

Item

10/125μm SMF

Unit


1270~1600

nm

Input optical power(maximum)

0

dBm


-22

dBm


-14.5

dBm

Performance of OAD OAD board consists of OADD and OADC. •

OADD can add/drop 4 wavelengths of DWDM optical signals. These 4 wavelengths are among C-band 40 wavelengths.

•

OADC can multiplex/demultiplex 4 wavelengths of CWDM optical signals and 1 channel of 1310nm optical signal. These 4 wavelengths are 1471/1491/1511/1531nm or 1551/1571/1591/1611nm.

•

OADD/OADC can be upgraded. With board cascading, it can multiplex/demultiplex 8 wavelengths of optical signals.

•

OAD board may process the control commands from NM to make the online upgrade of board software.

Performance of OADD and OADC are show in Table 32 ,Table 33 .

38




Table 32

Performance of OADD

Item

Unit

Frequency Range

Min

Max

THz

192.1

196.0

Wavelength Range

nm

1529.55

1560.61

Channel Spacing

GHz

100

0.5 dB Passband

nm

±0.11

-

20dB Passband

nm

-

1.20

In-drop

dB

2.5

3.3

Add-out

dB

2.5

3.3

In-out

dB

-

2.4

dB

-

1.0

Insertion Loss

Insertion Loss Uniformity

Table 33

Performance of OADC

Item

Unit

Channel Number

Parameter 6

5

4

Central wavelength

nm

1471/1491/1511/ 1531

1471/1491/15 11/1531

1551/1571/15 91/1611

Passband @ 0.5dB

nm

±6.5

±6.5

±6.5

Wavelength range of upgrade port

nm

1544.5~1621

1544.5~1621

-

dB

≤0.5

≤0.5

≤0.5

@ 1310 Port

dB

≤0.7

-

-

Passband @ 1310 Port

nm

1260~1360

-

-

LnCWDM

dB

≤2.3

≤2.0

-

UPGCWDM

dB

-

-

≤1.7

Ln – UPG

dB

≤2.3

≤2.0

-

Ln 1310nm

dB

≤1.2

-

-

Ripple

Insertion Loss (Including connectors)

5.10

Parameter

Performance of OBA Performacen of OBA is show in Table 34 .



39


Table 34

Performance of OBA Module

Performance

Unit

OBA12

OBA14

OBA17

Operating wavelength

nm

1530~1565

1530~1565

1530~1565

Input power

dBm

-12~4

-12~4

-6~4

Output power(maximum)

dBm

12

14

17

Dynamic range of output power (dB)

dB

3

3

3

Gain

dB

5~24

7~26

10~23

Small Signal Gain

dB

>25

>25

>25

Noise Index

dB

5

5

5

Input return loss

dB

45

45

45

output return loss

dB

45

45

45

Output pump leakage

dBm

-30

-30

-30

Input pump leakage

dBm

-30

-30

-30

PDG

dB

0.5

0.5

0.5

PMD

ps

1

1

1

Power(full temperature range)

W

<25

<25

<25

-15~65

-15~65

-15~65

Operating temperature Operating humidity

5~95

5~95

5~95

Storage temperature

%

-40~75

-40~75

-40~75

Optical Connector

LC/PC

LC/PC

LC/PC

Note:OBA19 Only operating at 155M and 622M bit rate.

5.11

Performance of OPA Performance of OPA is show in Table 35 . Table 35

40

Performance of OPA Module

Performance

unit

OPA38

OPA32

Operating wavelength

nm

1550.12

1550.12

Filter-3dB bandwidth

nm

0.45

0.45

Filter -20dB bandwidth

nm

1.2

1.2

Input power

dBm

-38~20

-32~15

Output power(maximum)

dBm

-9

-6

Dynamic range of output power (dB)

dB

±3

±3

Gain

dB

26~32

25~31

Small Signal Gain

dB

30

30

Noise Index

dB

4.5

4.5




Performance

unit

OPA38

OPA32

Input return loss

dB

45

45

output return loss

dB

45

45

Output pump leakage

dBm

-30

-30

Input pump leakage

dBm

-50

-50

Forward ASE level

dBm

-30

-30

Backward ASE power level

dBm

-30

-30

Pump wavelength

nm

980

980

PDG

dB

0.2

0.2

PMD

ps

1

1

Power

W

15

15

Power supply

V

-48±10%

-48±10%

Operating temperature

-15~65

-15~65

5~95

5~95

Storage temperature

-40~75

-40~75

Optical Connector

LC/PC

LC/PC

Operating humidity

5.12

%

Performance of DCM The Dispersion Compensating Modules compensates the dispersion of conventional single mode fiber (G.652/G.655) Performance of the DCM is show in Table 36 . Table 36

Performance of the DCM

Type

DCM-20

DCM-40

DCM-60

DCM-80

DCM-100

Dispersion compensated range(ps/nm)

-329±15

-680±21

1020±31

-1360±41

-1640±41

Insert loss(dB)

≤4.1

≤5.1

≤7.0

≤8.9

≤12.1 -11.5

typical value

-3.2

-4.4

-6

-7.7

PMD(2-step)

≤0.5

≤1.0

≤1.2

≤1.3

PMD(Typical)(ps)

-0.4

-0.4

-0.5

-0.6

≤0.1

≤0.1

≤0.1

PMD cost(dB) Note:

Each DCM needs a 1U-high DCM-Box.; Generally Only 10G system need to consider dispersion problem; DCM80 can only be located in front of OBA and cannot be located after OPA



41


5.13

Error Performance For each circuit direction and for bi-directional section and path, the error performance is monitored separately, the SDH performance of ZXMP complies with ITU-T G.784, G.828 and G.826. The SDH performance includes performance items such as BBE, ES, SES, FBBE, FEES, FESES, PSC, PJC+, PJC-, UAS, etc. The long term and short-term error performances of ZXMP S385 are complied with ITUT G.828 and M.2101 recommendation. According to ITU-T G.821 and G.826, in 420km HRDP (Hypothetical Reference Digital Path), SDH system error performance of ZTE’s transmission product is as follows, these figures are tested in field and test duration is not less than 24 hour. SDH system error performance is show in Table 37 . Table 37

SDH system error performance

Bit rate(kbit/s)

2048

ESR

1.848×10

SESR

9.24×10

BBER

44736 -6

-8 -9

9.24×10

155520 -6

3.466×10

-8

9.24×10

-9

9.24×10

622080 -6

7.392×10

-8

9.24×10

-9

9.24×10

2488320 -5

1.848×10

-5

3.7×10

-8

9.24×10

-9

9.24×10

9.24×10 9.24×10

-8 -9

The performance is better than ITU-T recommendation.

5.14

Jitter index at interfaces For ZXMP S385, the jitter and wander tolerance for G.703 PDH and SDH interface conform to ITU-T G.823, G.824 (45Mbps) and G.825 respectively.

5.14.1

Jitter and wander tolerance of PDH input interface The jitter and wander tolerance at ZXMP S385 PDH input interface meets the requirements shown in Figure 10, Figure 11 and Table 38 ,Table 39 .

42




Figure 10 The jitter and wander tolerance at E1 PDH input interface

Peak-peak jitter and wander (logarithm)

A0 A3

Slope: -20dB/10 octave

A1 A2

f0

f10 f9

f8

f1

f2

f3

f4

Jitter frequency (logarithm)

Figure 11 The jitter and wander tolerance at T1 PDH input interface

Table 38

The input jitter and wander tolerance of PDH interface

Interfa ce rate

UIp-p

(kbit/s)

A0

A1

A2

1544

18

5.0 UI

0. 1U I

2048

36. 9

18

0. 2

18

4.88×1 0-3

0.0 1

34368

618 .6

1.5

0. 15

ffs

ffs

ffs

44736

18

5.0 UI

0. 1U I

Pseudo random

Frequency (Hz) A 3

f10(T1 /T3 is f0)

f9

f8

f1

f2

f3

f4

signal

10

12 0

6k

40 K

220 – 1

1.6 67

20

2.4 k

18 k

10 0k

215-1

ffs

10 0

1k

10 k

80 0k

223-1

10

60 0

30 k

40 0k

220 – 1

1.2×10 –5

1.2× 10–5

Jitter and wander tolerance of PDH output interface



43


Table 39

The output jitter and wander tolerance of the PDH interface

Parameter value

Digit rate (kbit/s)

Network limit

Measurement filter bandwidth

B1 unit interval

B2 unit interval

Band-pass filter having a lower cutoff

peak-to-peak

peak-topeak

frequency f1 or f3 and an upper cutoff frequency f4 f1

f3

f4

8kHz

40KHz

1 544

5

0.1

10Hz

2 048

1.5

0.2

20 Hz

34 368

1.5

0.15

100 Hz

10 kHz

800 kHz

44736

5

0.1

10Hz

30kHz

400kHz

18 kHz (700 Hz)

100 kHz

Note: For the co directional interface only. The frequency values shown in parenthesis only apply to certain national interfaces. UI Unit Interval: for 2048 Kbit/s 1 UI = 488 ns; for 34 368 Kbit/s 1 UI = 29.1 ns

5.14.2

Jitter and wander tolerance of SDH input interface The capability of STM-N input interface to stand jitter and wander is specified and tested with the digital test signal of sine modulated phase. The input jitter and wander tolerance of ZXMP S385 SDH terminal multiplexer satisfies the requirements in Figure 12, Table 40 and Table 41 . The input jitter and wander tolerance of ZXMP S385 SDH regenerator satisfies the requirements shown in Figure 13 and Table 42 .

44




Figure 12 The jitter tolerance of STM-N terminal multiplexer input interface

Peak-peak jitter and wander (logarithm) A0 A1

Slope: -20dB/10 octave A2 A3 A4

f12

f0

Table 40

f11

f10

f9

f8

f1

f2

f3

f4

Frequency

Input jitter and wander tolerance (UIP-P) of SDH

STM interface

A0 (18μs)

A1 (2 s)

A2 (0.25 s)

A3

A4

STM-1

2800

311

39

1.5

0.15

STM-4

11200

1244

156

1.5

0.15

STM-16

44790

4977

622

1.5

0.15

Table 41

Input jitter and wander tolerance of the SDH

STM interface

f0

f12

f11

f10

f9

f8

f1

f2

f3

f4

STM-1

1.2× 10-5

1.78× 10-4

1.6× 10-3

1.56× 10-2

0.125

19.3

500

6.5k

65k

1.3M

STM-4

1.2× 10-5

1.78× 10-4

1.6× 10-3

1.56× 10-2

0.125

9.65

1000

25k

250k

5M

STM-16

1.2× 10-5

1.78× 10-4

1.6× 10-3

1.56× 10-2

0.125

12.1

5000

100k

1M

20M



45


Figure 13 The input jitter tolerance of STM-N SDH regenerator

Input jitter amplitude

（UI

P-P

）

A2 Slope: -20dB/10 octave

A1

0

Table 42

f1

Frequency

Input jitter tolerances of STM-N regenerators

STM interface STM-1 STM-4 STM-16

5.14.3

f2

f1 (kHz)

f2 (kHz)

A1 (UIP-P)

A2 (UIP-P)

A

65

6.5

0.15

1.5

B

12

1.2

0.15

1.5

A

250

25

0.15

1.5

B

12

1.2

0.15

1.5

A

1000

100

0.15

1.5

B

12

1.2

0.15

1.5

Inherent output jitter of STM-N interface For the ADM, TM and DXC equipment of ZXMP S385, the STM-N output jittering indexes meet the requirements in Table 43 and Table 44 . Because of the randomness of jitter, the test value might exceed, and it is acceptable when over 99% test values satisfy the indexes during the test (for 1 to 2 minutes). Table 43

STM-N interface inherent output jitter indexes of SDH

STM interface STM-1 STM-4 STM-16

46

Test filter

Peak value of jitter

500Hz~1.3MHz

0.50 UI

65kHz~1.3MHz

0.10 UI

1000Hz~5MHz

0.50 UI

250kHz~5MHz

0.10 UI

5000Hz~20MHz

0.50 UI

1MHz~20MHz

0.10 UI




Table 44

STM-N network interface output jitter indexes of SDH

STM interface

f1 (Hz)

f3 (kHz)

f4 (MHz)

B1 (UIp-p)

B2 (UIp-p)

STM-1 optical interface

500

65

1.3

1.5

0.15

STM-1 electrical interface

500

65

1.3

1.5

0.075


1000

250

5

1.5

0.15


5000

1M

20

1.5

0.15

For the REG equipment, when the test filter adopts 12 kHz high-pass filter, its root mean square value (RMS) created from jitter should not be greater than 0.01UIrms.

5.14.4

Mapping jitter of PDH tributary The mapping jitter at the ZXMP S385 PDH tributary can satisfy the requirements listed in Table 45 . Table 45

Mapping jitter specifications

G.703 interface

Tolerance (ppm)

(kbit/s)

5.14.5

High-pass filter 20dB/10 multiplication

Maximum peak value of mapping jitter

f1 (Hz)

f3 (Hz)

f4 (Hz)

f1~f4

f3~f4

2048

50

20

18k

100k

Undetermined

0.08

34368

20

100

10k

800k

Undetermined

0.08

44736

20

100

10k

800k

Undetermined

0.08

Combined Jitter In the SDH system, generally, there are both mapping jitter and pointer adjusting jitter. The combined jitter of both is called the combined jitter. Under various test sequences, the value detected by ZXMP S385 should meet the ones listed in Table 46 . Table 46

Combined jitter

PDH inter face

Bit rate toler ance

High pass filter 20dB/10 octave

(kbit/ s)

(ppm )

f1 (Hz)

f3 (Hz)

f4 (Hz)

f1~f4 (UIp-p)

f3~f4 (UIp-p)

2048

50

20

18k

100 k

0.4

0.4

0.4

0.0 75

0.0 75

0.0 75

3436 8

30

100

10k

800 k

0.4

0.4

0.4

0.0 75

0.0 75

0.0 75


Maximum peak-peak value combined jitter UIP-P

0. 75


47

0.0 75


PDH inter face

Bit rate toler ance

High pass filter 20dB/10 octave

4473 6

30

100

10k

Maximum peak-peak value combined jitter UIP-P 800 k

Test sequence

5.14.6

0.4

0.4

0.4

0. 75

0.0 75

0.0 75

0.0 75

0.0 75

a

b

c

d

A

B

c

d

Jitter transfer function of the regeneration relay The jitter transfer function of the regeneration relay is defined the ratio of output STM-N signal jitter to the input STM-N signal jitter versus frequency. The jitter transmission characteristic of ZXMP S385 SDH regeneration relay is shown in Figure 14. Figure 14 The jitter transfer characteristics of a regeneration relay

Input jitter amplitude

(UI P-P ) A2 Slope: -20dB/10 octave

A1

0

f2

f1

Frequency

The jitter transmission parameters of regeneration relay are shown in Table 47 . Table 47

Jitter transmission parameters of a regeneration relay

STM-N A

STM-1 STM-4 STM-16

5.15

fc (kHz)

P (dB)

130

0.1

B

30

0.1

A

500

0.1

B

30

0.1

A

2000

0.1

B

30

0.1

Clock timing and synchronous characteristics •

48

The SEC Index list is show in Table 48 .




Table 48

The SEC Index list

Vendor

ISOTEMP

Type

OCXO

Standard Central Frequency

77.76MHz

Day aging rate

≤1×10-8

Year aging rate

≤5×10-7

Central frequency precision

1×10-7(0V)

Short time stability

≤±1×10-10/s

Temperature characteristic

±5×10-8(0~50°C)

•

Output jitter When there is no input jitter, the inhered jitter of ZXMP S385 2M clock output interface should not be over 0.05 UIP-P. The test is conducted at an interval of every 60 seconds with a single-pole band-pass filter in 20Hz and 100kHz turnover frequencies.

•

Permitted input/output attenuation and others For ZXMP S385 the bit rate tolerance of clock output signal is ±4.6ppm.

•

Long-term phase variation in clock locking mode The long-term phase variation in the clock locking mode refers to the phase noise generated at the SEC output terminal when there is an ideal input reference signal. Usually, they are expressed by the Maximum Time Interval Error (MTIE) and time deviation error (MTIE). ZXMP S385 can satisfy the requirements shown in Table 49 Table 50 and Table 51 .

Table 49

The wander limit value under constant temperature (MTIE)

MTIE limits

Observation interval

40 ns

0.1s 1s

40 0.1 ns

1s 100s

25.25 0.2 ns

100s 1000s

Table 50

The wander limit value under temperature impact (MTIE)

Additional MTIE permitted value


0.5ns

0.1s

50ns

118s

Table 51

100s

The wander limit value under constant temperature (TDEV)

MTIE limits


3.2 ns

0.1s


25s


49


MTIE limits 0.64 6.4 ns •

0.5 ns

Observation interval 25s 100s

100s 1000s

Clock accuracy in the hold mode Once all the timing references are lost, SEC will enter the hold mode after instantaneous phase variation. Now, SEC will use the last frequency information saved before the timing reference signal loss as its timing reference. Meanwhile, the oscillation frequency of the oscillator will slowly wander, but can still ensure that SEC frequency only has very small frequency deviation from the reference frequency in a long time base; therefore, the sliding loss will be within the allowed index requirement. This mode can be used to deal with an external clock failure lasting several days. When SEC loses its reference source and enters the hold mode, the phase error ΔT of the SEC output signal to the input signal should not be over the following limits when observation time S is greater than 15s from the moment that the reference source loses. ΔT (S) = [(a1+a2)S+0.5bS2+c] ns a1= 50ns/s corresponds to the initial frequency deviation of 5×10-8. a2=2000ns/s refers to the frequency deviation caused by the temperature change after the clock enters the hold mode. If there is no temperature change in 2 × 10-6, there will be no a2S in the phase error. b = 1.16×10-4ns/s. It is caused by aging, corresponding to 1×10-8/day frequency wander. c = 120ns, includes any additional phase deviation that might be generated after entering the transition stage of hold mode. ZXMP S385 meets the above requirements.

•

Frequency Accuracy of Internal Oscillator in the Free-run Mode When the internal oscillator of SEC works in the free-run mode if SEC loses all of the clock references, and their memories or SEC has no hold mode at all, it is required that its output frequency accuracy be within a certain range.

For a reference that can follow the G.811 clock, the SEC output frequency accuracy in the free-run mode should not be greater than 4.6ppm for SDH terminal equipment and 20ppm for REG equipment. ZXMP S385 can satisfy the above requirements.

50




6

Environment Adaptability

6.1

Power supply requirements Working voltage and current:

6.2

•

Rated working voltage: -48V

•

Rated working current: 16A

•

Nominal voltage: -48VDC

•

Range: -57VDC~-40VDC

Grounding requirements If separate grounding is adopted in the equipment room, the grounding resistance should meet the following requirements: •

The grounding resistance in case of –48V DC is less than or equal to 4Ω.

•

The grounding resistance for the system working ground is less than or equal to 4Ω.

•

The grounding resistance for the lightning protection ground is less than or equal to 4Ω.

If the combined grounding is adopted in the user equipment room, the grounding resistance should be less than or equal to 1Ω. The voltage difference among lightning protection ground, system working ground and 48V GND should be less than 1V. The tandem requirements between all groundings are as follows: •

The -48V ground of the board is isolated from the -48V GND.

•

The board shielding plate is connected to the cabinet via the front panel, and there is an electrical connection with the co-module filter capacitor inside a board.

The lightening protection GND only connects to the protection component, and converges with the system working GND at the grounding terminal on the bus bar of the rack. The -48V GND can converge with the PGND, or the combined GND on the bus bar of the rack, or be grounded outside.



51


6.3

Environment requirements

6.3.1

Operation Environment 1

Climate Climate requirement is show in Table 52 .

Table 52

Climate requirement

Item

Range

Altitude

4000m

Air pressure

70 ~ 106kPa

Temperature (Long-term Operating)

+5 ~+40

Temperature (Short-term Operating)

0 ~+45

Temperature change rate

0.5

Relative humidity (Short-term Operating)

20%~80%

Relative humidity (Long-term Operating)

10%~90%

Heat radiation

300W/s²

/min

In the normal working environment, the measuring point of the temperature and humidity refers to data obtained at the place 1.5 meters above the floor and 0.4m meters in front of the equipment. The short-term working refers to working continuously for no more than 48 hours and no more than accumulated 15 days in a year. 2

Biological environment Avoid multiplication of microbe, such as eumycete and mycete. Avoid the rodent, e.g., mice.

3

Air cleanliness Density requirements for chemical active substances is show in Table 53

Table 53

Density requirements for chemical active substances

Chemical active substance

52

Content mean (mg/m³)

Max( mg/m³)

SO2

0.3

1

H2S

0.1

0.5

NH3

1

3

Cl2

0.1

0.3

HCl

0.1

0.5

HF

0.01

0.03




Content

Chemical active substance

mean (mg/m³)

Max( mg/m³)

O3

0.05

0.1

NO2

0.5

1

Density requirements for mechanical active substances is show in Table 54 . Table 54

Density requirements for mechanical active substances

Mechanical active substance

Content

Perceivable dust

= 15 mg/m²·h

4

Mechanical stress Requirements for mechanical stress is show in Table 55 .

Table 55

Requirements for mechanical stress

Item

Unit

Value

Acceleration

m/S2

0.1

Frequency range

Hz

5~100, 100~5

direction

X,Y,Z

duration

Min

5

90

Condition of earthquake According with:NEBS GR-63 IEC721-2-6 “Environmental conditions appearing in nature-Earthquake vibration” IEC68-3-3 “Environmental testing - Part 3: Background information - Subpart 3: Guidance. Seismic test methods for equipment”

6.3.2

Environment for Storage The following Table 56 ,Table 57 international standards are taken as the reference for framing the environment requirements: IEC721-3-1 Classes 1K4/1Z2/1Z3/1Z5/1B2/1C2/1S3/1M2 1

Climate

Table 56

Climate requirement

Item

Range

Altitude

4000m

Air pressure

70 ~ 106kPa



53


Item

Range

Temperature

-40 ~ +70

Temperature change rate

0.5C/min

Relative humidity

10% ~ 100%

Solar radiation

600W/s²

Air speed

30m/s²

2

Mechanical stress

Table 57

Requirements for mechanical stress

Item

unit

value

Acceleration

m/S2

0.1

Frequency range

Hz

5~100, 100~5

direction

X,Y,Z

duration

Min

90

The earthquake-proof performance of the whole equipment complies with Earthquakeproof Performance Detection for SDH Optical Communications Equipment (Provisional) and Earthquake-proof Performance Detection for SDH Optical Communications Equipment (Provisional). The earthquake-proof performance detection reaches the eight-level intensity.

6.3.3

Cleanness requirements Cleanness involves dust and harmful gases in the air. The equipment should be operated in the equipment room that meets the cleanness requirements described below:

6.3.4

•

In the transmission equipment room, there is no explosive, electrically conductive, magnetically conductive or corrosive dust.

•

The density of dust particles with the diameter greater than 5µm should be no more than 3×104 particles/m3.

•

No corrosive metal or gases that are detrimental to the insulation exist in the equipment room, such as SO2 and NH3.

•

The equipment room should be always kept clean, with doors and windows being closed.

Bearing Requirements of the Equipment Room The bearing capability of the equipment room should be over 450kg/m2 to hold ZXMP S385 equipment. Electromagnetic Compatibility (EMC) requirements

54




Before introducing the EMC requirements, firstly specifies 3 criteria for test results:

6.3.5

•

Performance A: Continuous phenomenon. Neither error nor alarm is allowed. After the electromagnetic interference, the number of errors shall not exceed the maximum of the normal requirement.

•

Performance B: Transient phenomenon. During the electromagnetic interference, the degradation of function is allowed, the equipment can work as expected without the operator’s interference, the loss of frame and synchronization is not allowed, and neither pattern out-of-sync, nor AIS alarm is generated. The equipment shall work normally after the electromagnetic interference.

•

Performance R: Resistive phenomenon. The fuse or other special devices can be replaced or restarted.

Electronic Static Discharge (ESD) 1

Anti-interference for static discharging The static discharge anti-interference index of ZXMP S385 equipment is shown in Table 58 . During the operation in the interface area, be sure to wear an antistatic wrist strap.

Table 58

Static discharge anti-interference

Contact discharge

Air discharge

Criterion for test results

6kV

8kV

Performance B

8kV

15kV

Performance R

2

RF electromagnetic radiated susceptibility The RF electromagnetic radiated susceptibility of ZXMP S385 equipment is shown in Table 59 .

Table 59

RF electromagnetic radiated susceptibility

Test frequency (80MHz~1000MHz) Electric field intensity

Amplitude modulation


10V/m

80%AM (1kHz)

Performance A

3

Electrical fast transient burst susceptibility The electrical fast transient burst susceptibility of ZXMP S385 equipment is shown in Table 60 and Table 61 .



55


Table 60

Electrical fast transient burst susceptibility at the DC power port

Generator waveform 5/50ns Test voltage

Repeated frequency


1kV

5kHz

Performance B

Table 61

Electrical fast transient burst susceptibilities at the signal cable and control cable ports

Generator waveform 5/50ns Test voltage

Repeated frequency


1kV

5kHz

Performance B

4

Surge susceptibility The surge susceptibility of ZXMP S385 equipment is shown in Table 62 , Table 63 and Table 64 .

Table 62

Surge susceptibility of DC power

The waveform of generators 1.2/50us (8/20μs), internal resistance 12 Test mode

Test voltage


Line to ground

1kV

Performance B

Line to ground

2kV

Performance R

Table 63

Surge susceptibility of the outdoor signal cable

The waveform of generators 10/700µs, internal resistance 40 Test mode Line to line Line to ground Line to line Line to ground

Table 64

Test voltage


2kV

Performance B

4kV

Performance R

Surge susceptibility of the indoor signal cable

Generator waveform 1.2/50μs (8/20μs), internal resistance 42 Test mode

Test voltage


Line to ground

1kV

Performance B

Line to ground

2kV

Performance R

5

Conductivity susceptibility of RF field The conductivity susceptibility of RF field of ZXMP S385 equipment is shown in Table 65 .

56




Table 65

Conductivity susceptibility of RF field

Test frequency 0.15MHz ~ 80MHz Test intensity

Amplitude modulation


3V

80%AM (1kHz)

Performance A

Electromagnetic Interference (EMI) 6

Conductive emission electromagnetic interference The conductive emission electromagnetic interference of ZXMP S385 equipment is shown in Table 66 .

Table 66

Conductive emission electromagnetic interference at the direct current port

Limits (dBuV)

Testing frequency (MHz)

Quasi-peak

Mean value

0.02~0.15

79

--

0.15~0.5

79

66

0.5~30

73

60

7

Radioactive emission electromagnetic interference The radioactive emission electromagnetic interference of the ZXMP S385 equipment is shown in Table 67 .

Table 67

Radioactive emission electromagnetic interference

Testing frequency (MHz)

6.4

Quasi-peak demodulating limit (dBµV/m) 10m

3m

30~230

40

50

230~1000

47

57

230~1000

47

57

Safety requirements This product adopts the technical requirements specified in the following standard: •

IEC/EN 60950:2000 Safety of information technology equipment

•

Working voltage and current Rated working voltage: -48V Max. working voltage: -57V Min. working voltage: -40V



57


Rated working current: 16A •

Insulation classification of the equipment The power supply of the equipment provides the SELV circuit with safe and excessively low voltage, without self-generating dangerous voltage. It belongs to the equipment of the class III insulation (Class III equipment).

•

Optical interface The optical module of the maximum power belongs to (Class 3A). All the optical modules shall be under strict control and certified by authorities (such as UL, TUV and NEMKO), and comply with EN60825.

•

Fuse All the fuses and power modules, including recoverable fuses, shall be certified by authorities such as CE, UL and TUV.

•

Safety mark On the package of the equipment, there are striking labels about antistatic, fragile, waterproof, and damp-proof. The maximum optical power satisfies the 3A safety standard. An obvious label warning against the laser shall be pasted at the optical interface. Cables of different colors shall be used for the power input, shielding GND and lightening protection GND to avoid incorrect connection. Different power connectors shall use coding keys. There shall be a power label at the power inlet. Both the equipment and each board shall have an antistatic label. Grounding symbol “

•

.“

“ indicates switch-on, and “

“ indicates switch-off.

Mechanical structure In installation, four bolts are designed at the rack bottom (may also be used to adjust balance) to fix the rack to the ground. At the rack top, the corresponding screws are designed to fix the rack to the cabling rack. When installed in the equipment room, the rack shall be fixed both at the top and bottom to ensure the stability and safety of the equipment. The corners of both the rack and sub-rack are processed to avoid hurting people.

•

Fire protection The materials of the circuit boards in the equipment use the fireproof materials of the V-2 level to prevent the circuits from burning in case of failure. The structural parts use unburnable materials with a good fireproof performance, including surface processing materials.

58




With the effective heat dissipation design, it ensures that the temperature does not exceed 70ºC to prevent heat aggregation and reduce the possibility of burning. Safe parts passing the safety authentication (CE, UL, etc.) are used. •

High temperature protection In abnormal conditions, the temperature does not exceed 70ºC. The plastic parts, components, wires and cables, and safety labels shall all comply with the requirements specified in the safety standard-GB4943/EN60950.

•

Lightening protection In this system, good grounding and isolation and protection of electrical interfaces are used to prevent the dangerous voltage of lightening.



59


7

Glossary Abbreviations

60

Full Name

ADM

Add-Drop Multiplexer

AFEC

Advanced Forward Error Correction

AIS

Alarm Indication Signal

ANSI

American National Standards Institute

APS

Automatic Protection Switching

ASIC

Application Specific Integrated Circuit

ASON

Automatically Switched Optical Network

ATM

Asynchronous Transfer Mode

AU

Administrative Unit

AUG

Administration Unit Group

AU-n

Administration Unit, level n

AU-PTR

Administration Unit Pointer

BBE

Background Block Error

BBER

Background Block Error Ratio

BER

Bit Error Ratio

BITS

Building Integrated Timing Supply

BML

Business Management Layer

CBR

Constant Bit Rate

CDM

Code Division Multiplexing

CLP

Cell Loss Priority

CMI

Coded Mark Inversion

C-n

Container- n

CORBA

Common Object Request Broker Architecture

CV

Code Violation

CWDM

Coarse Wavelength Division Multiplexing

DB

Data Base

DBMS

Data Base Management System

DCC

Data Communications Channel

DCE

Data Circuit-terminating Equipment

DCF

Data Communications Function

DCN

Data Communications Network

DDN

Digital Data Network

DLL

Dynamic Link Libraries

DNA

Distributed Network Architecture

DNI

Dual Node Interconnection




Abbreviations

Full Name

DQDB

Distributed Queue Double Bus

DTE

Data Terminal Equipment

DWDM

Dense Wavelength-division Multiplexing

DXC

Digital Cross Connect

ECC

Embedded Control Channel

EDFA

Erbium Doped Fiber Amplifier

EM

Element Management

EMC

Electromagnetic Compatibility

EMI

Electromagnetic Interference

EML

Element Management Layer

EMS

Element Management System

EOS

Ethernet Over SDH

ES

Error Second

ESD

Electronic Static Discharge

ESR

Error Second Ratio

ETS

European Telecommunication Standards

ETSI

European Telecommunication Standards Institute

FDDI

Fiber Distributed Data Interface

FDM

Frequency Division Multiplexing

FE

Fast Ethernet

FEBBE

Far End Background Block Error

FEC

Forward Error Correction

FEES

Far End Error Second

FESES

Far End Severely Error Second

GUI

Graphical User Interface

HDLC

High Digital Link Control

HPC

Higher order Path Connection

HW

High-Way

IEC

International Electro technical Commission

IEEE

Institute of Electrical & Electronic Engineers

IP

Internet Protocol

ITU-T

International Telecommunication UnionTelecommunication Standardization Sector

L2

Layer 2

LAN

Local Area Network

LAPD

Link Access Procedure On D-channel



61


62

Abbreviations

Full Name

LAPS

Link Access Procedure for SDH

LCD

Loss of ATM Cell Delineation

LCT

Local Craft Terminal

LOF

Loss Of Frame

LOP

Loss Of Pointer

LOS

Loss Of Signal

LPC

Lower order Path Connection

MAC

Medium Access Control

MAN

Metropolitan Area Network

MCF

Message Communication Function

MCU

Micro Control Unit

MD

Mediation Device

MF

Mediation Function

MII

Medium Independent Interface

MM

Multi Mode

MS

Multiplex Section

MS-AIS

Multiplex Sections - Alarm Indication Signal

MSOH

Multiplex Section OverHead

MSP

Multiplex Section Protection

MS-PSC

Multiplex Sections - Protection Switching Count

MS-PSD

Multiplex Sections - Protection Switching Duration

MS-SPRing

Multiplexer Section Shared Protection Ring

MST

Multiplex Section Terminal

MTIE

Maximum Time Interval Error

NE

Network Element

NEF

Network Element Function

NEL

Network Element Layer

NML

Network Manager Layer

NMS

Network Management System

NRZ

Non-Return-to-Zero

OAM

Operation, Administration and Maintenance

OFS

Out of Frame Second

OOF

Out of Frame

OS

Operation System

OSF

Operation System Function




Abbreviations

Full Name

OSI

Open System Interconnect

PCB

Printed Circuit Board

PCM

Pulse Code Modulation

PDH

Plesiochronous Digital Hierarchy

PGND

Protection GND

PHY

physical Layer Device

PJE-

Pointer Justification Event -

PJE+

Pointer Justification Event +

POH

Path OverHead

PPP

Point to Point Protocol

PRC

Primary Reference Clock

QA

Q Adaptor

QAF

Q Adaptor Function

QoS

Quality of Service

RAM

Random Access Memory

RDI

Remote Defect Indication

REG

Regenerator

REI

Remote Error Indication

RFI

Remote Failure Indication

RIP

Router Information Protocol

RMII

Reduced Medium Independent Interface

RS

Regenerator Section

RSOH

Regenerator Section OverHead

SAR

Segmentation and Reassembly

SDH

Synchronous Digital Hierarchy

SEC

SDH Equipment Clock

SEMF

Synchronous Equipment Manage Function

SES

Severely Error Second

SESR

Severely Error Second Ratio

SETS

Synchronous Equipment Timing Source

SM

Single Mode

SMCC

Sub-network management control center

SML

Service Management Layer

SMN

SDH Management Network

SMS

SDH Management Sub-Network

SMT

Surface Mount Technology

SNC

Sub-network Connection

SNCP

Sub-network Connection Protection



63


64

Abbreviations

Full Name

SOH

Section Overhead

SPRING

Shared Protection Ring

SSF

Service Signal Fail

SSM

Synchronization status messaging

SSM

Synchronous State Message

STM-N

Synchronous Transport Module Level-N

TCP

Transport Control Protocol

TDEV

Time Deviation

TDM

Time Division Multiplex

TM

Terminal Multiplexer

TMN

Telecommunications Management Network

TTL

Transistor-Transistor Logic

TU

Tributary Unit

TUG-m

Tributary Unit Group, level m

TU-m

Tributary Unit, level m

UART

Universal Asynchronous Receiver Transmitter

UAS

Unavailable Second

UBR

Unspecified Bit Rate

UNI

User-Network Interface

UPC

Usage Parameter Control

VBR

Variable Bit Rate

VC

Virtual Channel

VC

Virtual Container

VCI

Virtual channel Indicator

VC-n

Virtual Container, level n

VDN

Virtual Data Network

VLAN

Virtual Local Area Network

VP

Virtual Path

VPI

Virtual Path Indicator

VPG

VP Group

WAN

Wide Area Network

WDM

Wavelength Division Multiplexing

WS

Work Station

WSF

Work Station Function

ZXMP

Zhong Xing MSTP



ZTE ZXMP S385 Product Description

Recommend Documents