Training Report on Title, Title, Title, In Name of Company/Organization Submitted for partial fulfillment of award of BACHELOR OF TECHNOLOGY degree in Electronics & Communication Engg. By STUDENT (Name/Roll No.)
DEPARTMENT OF ELECTRONICS & COMMUNICATION ENGG. MORADABAD INSTITUTE OF TECHNOLOGY Ram Ganga Vihar, Phase –II, Moradabad-244001 (U.P) Session: 2009-10 GONDA-271308
AAIDU-ALLAHABAD
CERTIFICATE
This is to certify that Mr. AMIT KUMAR , VSTR No.26, student of B.Tech. Electronics and Communication Engineering from Allaha Allahabad bad Agricu Agricultu ltural ral Instit Instituteute-Dee Deemed med Univer Universit sity, y, Allaha Allahabad bad has successfully completed his summer training at ITI Ltd. Mankapur, Gonda from 15-05-09 to 14-06-09.
It is further certified that during the summer training period the candidate attended the factory and office regularly and punctually.
S.S.BISHT MANAGER (HRED) ITI Ltd. Mankapur, Gonda
ACKNOWLEDGEMENTS
This project is the outcome of the efforts of several people, apart from the team members, and it is important that their help be acknowledgement here. First of all I want to present my sincere gratitude and deep appreciations to Mr. S.S.BISHT, MANAGER (HRED) to allow me to undertake the industrial training training in ITI Ltd. Mankapur, one of the leading public sector amongst the Electronics industries in India. Without motivation, a person is literally unable to make his best effort. I am highly grateful to him for his guidance as he played an important role in preparing me for industrial culture and making me aware of actual scenario and work culture in organization. I would like to devote my special thanks to Mr. KULDEEP SHARMA for teaching GSM in a very easy and interesting manner. I would like to thanks Mr.B.K.VERMA, (AO-HR-ED) and rest all faculty member of HRED centre ITI Ltd. Mankapur and all the employee of ITI Ltd. Mankapur, who devoted their valuable time to render me information about the complexities of industries and technical know-how. The factory has a beautiful and well organized work environment which made a great pleasure and an easy task to learn and understand the principles and theories.
Amit Kumar B.Tech E.C.E(IIIrd year) AAI-DU, Allahabad
PREFACE
In-Plant training has been misinterpreted by most of us as a platform for project perfo performa rmatio tion. n. Indust Industria riall traini training, ng, in a true true sense, sense, has been been includ included ed in the curriculum to make the students well versed with the technical procedure of various industries and the basic criteria for management of resources in a company or industry. The educational institutions sole aim by industrial training is to improve the technical know-how and to have a hand on experience to make them realistic in thinking to understanding the procedure for manu manufa fact cturi uring ng keep keepin ing g in mind mind the the minu minute te deta detail il whic which h will will benef benefit it the the custom customer. er. Like Like no learni learning ng is proper proper withou withoutt implem implement entati ation, on, simila similarly rly the terms and procedures we learn are of no use until and unless we bring them in practical applications. To summaries, industrial training teaches us industrial ethics, advance technical know-how and helps us to get acquainted with industrial working style. The document summaries the current state of I.T.I. Ltd. Mankapur in year 2008. The document provides information about raw materi material, al, workin working g procedu procedure re and final final product productss of differ different ent divisi divisions ons.. Overall it provides a common wide understanding of all divisions.
CHAPTER 1 ITI LIMITED 1.1. INTRODUCTION:I.T.I. Ltd. was the first public sector undertaking of the free INDIA. It was established in year 1948. The first manufacturing unit was established at the Bangalore complex in Karnataka under the name of Indian Telephone Industry Limited (I.T.I.). As time progressed progressed the full name of I.T.I. I.T.I. become become a misnomer misnomer as the industry began to manufacture several other electronic hardware than those required in the field of telephony. Now this public sector enterprise is only known as I.T.I. Ltd.
1.2The Units of I.T.I. Ltd. Are:●Bangalore:- The major products are “ESSCON PROJECT” for Defence purpose, MSC Products, CDMA (Handsets).
●Palghat:- Scratching cards, GSM, MSE. ●Naini (U.P.):- Latest Transmission equipments (ADSL). ●Raibareily (U.P.):- B.T.S. and Power plant . ●Mankapur (U.P.):- GSM, BTS, C-Dot and Landline communication . ●Srinagar (Jammu & Kashmir):- Presently shut down .
1.3.ABOUT MANKAPUR UNIT The I.T.I. Ltd. Mankapur was established in the year 1982.The construction work started on 31 May 1983 and by April 1985.the production has also started. The first complete electronic exchange was provided to INDIA by I.T.I. Mankapur Unit and hence Mankapur was given the unique distinction of “Digital City of INDIA” at that time. The land area covered by I.T.I. Ltd. is 352 acres. The factory covered area is 77,500 sq.meters, while the air- conditioned space within the factory is 44,300 sq.metres. The township under I.T.I. Mankap Mankapur ur consis consistt of 3,000 3,000 residen residences ces,, three three Interm Intermedi ediate ate school schools, s, two clubs, clubs, and one recreation centre(auditorium), post-office, banks, shopping complex, pollution free areas and a swimming pool.
1.4.Main divisions at I.T.I. Ltd. Mankapur:1. Component divisions: - Where different circuit components are manufactured or
stored if purchased from other sources . 2. Circuit Divisions: - Where circuits are developed on the base material. It consists
of Printed Circuit Board Plant & Hybrid Circuits section .
EA (switching exchange assembly) Divisions: - Where different circuit
3.
components are assembled on the P.C.B.
4. New Products Divisions: - Where new products products are manufactured manufactured,, mainly mainly uses the surface mounting technology.
5. Central Services Divisions: - Which provides AC facilities, water supplies, electricity supplies etc. used in factory.
1.5. PRODUCTS OF I.T.I. LTD.:-
● E10B Exchanges: -
Electronic Digital (10-digit) basic exchange which work at a
temperature of 18-22 degree Celsius.
● CSN-MA Exchange: - Numeric Satellite control media analog exchange which work at a temperature of 18-22 degree Celsius .
● CSN-MM Exchange: - Multimedia exchange to meet the demand of Internet and ISDN facilities
● C-DOT Exchange: - Control department of Telematics exchange was designed by Mr. Shyam Petroda of Gujarat (The scientific advisor in the ministry of Mrs. Indira Gandhi) to
suit suit the Indian Indian climatic climatic condit condition ions. s. The exchan exchange ge works works satisf satisfact actori orily ly up to 35 degree degree Celsius.
● B.T.S.:- Base transceivers station, is manufactured in I.T.I. Ltd. Mankapur . ● G.S.M.:- Global System for Mobile communication . •
Other product
The above products are telecom products. Besides these I.T.I. also produces non telecom products like NCM (note counting machine), FNDM (Fake Note Detection Machine), Fire-alarms, Inverters etc.
1.6..MISSION:-
● The mission of the Industry is to be the leader in the domestic market and be an important player in the global market for voice data and Image communication by providing total solutions to customers. ● To build core competencies to enter in new business areas.
1.7.H.R.D.(Human Resources & Development) The Human Resource & Development Centre is headed by Mr. S.S.Bisht (Manager HRED). H.R.D. stands for Human Resources & Development centre. H.R.D. has major task
to control control the manpowe manpower. r. Differen Differentt type type of training training programs programs are also also provid provided ed by the H.R.D. as like:1. Summ Summer er Trai Traini ning ng.. 2. Wint Winter er Trai Traini ning ng..
1.7.1. Parts of H.R.D.:1. H.R.D. Office. 2. Library. 3. Computer Lab. 4. Programme Rooms. 5. Auditorium.
1.7.2. Objectives of H.R.D.:-
The H.R.D. has following objectives:● To facilitate realization of lean and effective organization.
● Create businesses and strategic thinking. t hinking. ● Build managerial and technical competencies. ● Promote a culture of achievement and excellence. ● Improve quality of work life in organizations. ● Encourage empowerment of team and individuals.
● Improve organizational learning. ● Optimize resources utilization and create atmosphere of cost consciousness. ● Create financial edge to finance in purchase of the customers.
Chapter 2
ELECTRONIC SWITCHING
2.1. WHAT IS A TELEPHONE SWITCH? Basically it is a device or a system that connects one telephone line to another so that 2 or more more people people can have have a conver conversat sation ion over their their respec respectiv tivee teleph telephone oness or so that that your your computer’s modem can connect to a remote modem such as a remote modem owned by an ISP (internet service provider ) which in turn connects you to the internet.
2.2. THE INVENTION OF AUTOMATIC SWITCHING Almon B. Strowger was an undertaker in Kansas city, USA, the story goes that there was a competing undertaker locally whose wife was an operator at the local telephone exchange. Whenever a caller asked to be put through to Strowger, calls were deliberately put through to his competitor. This obviously frustrated Strowger Strowger greatly & he set about devicing a system for doing away with the human part of the equation!
Strowger Strowger developed a system system of automatic automatic switching using an electromechan electromechanical ical switch based based around around electromagnet electromagnetss &
pawls. pawls. With the help help of his nephew nephew (W.S. (W.S. Strowger) Strowger) he he
produced a working model in 1888.in this selector, a moving wiper (with contacts on the end) moved up to & around a bank of many other contacts, making connection with any one of them.
2.3. CROSS BAR SWITCH A crossbar switch is one of the principle architechtureused to construct switchesof many types.crossbar types.crossbarswitc switches hes are some some times referred to as “crosspoin “crosspointswitc tswitches”. hes”. The other principleswitch architectures are that of memoryswitches or crossover switch(banyan switch).
A CB exchange was divided into an originating side and a terminating side when a user picked up their handset, the resulting line loop operating the users’ line relay caused the exchange to connect the users’ telephone to an a n originating sender, which return the user a dial tone.the sender then recorded the dialled digits and passed them to the originating marker,
which selected an outgoing trunk & operated the various crossbar switches stages to connect the calling user to it .
2.4. E 10 B The E 10 B sys has been developed in terms of an integrated tele.netwk ,rather than in terms of individual tele exchnges. It is French techno. which is not manufactured now in ITI , Mankapur. It shapes 2 fundamental principles with the original Planton Exchnge: Exchnge: •
Ude of digital PCM techniques.
•
Separation of the sw.ng exchng function (at exchng level )from the management functions(at netwk levels).
2.4.1.Scope – This engineering engineering instruction instruction deals with the additional additional facilities incorporated incorporated in R.23 version of OCB 283 exchnges.
2.4.2.General – The following evolutions & changes introduced in R.23 version of OCB 283 sys: Hardware changes • •
Analogue subscriber facilities
•
ISDN supplementary services
•
Operation& maintainance
•
New parameters
•
New call handling architecture
•
V5.2 interface
•
Extended translation resources
•
Intelligent netwk
•
Other implementation
Chapter 3 3.1. C - DOT SEA (switching exchng assembly)division of ITI Mankapur produces exchng for fixed line .C-DOT is one such exchng .its technology is Indian . •
CDOT DSS MAX IS A UNIVERSAL DIGITAL DIGITAL SW .this can be confifured for diff appl. As local transit or integrated local & transist sw .
•
High traffic / load handling capacity upto 8 LACKS BHCAwith termination capacity of 40,000 lines . as local exchng or 15000 trunks as Trunk Automatic Exchhg.
3.2 Flexible architecture •
It is possible to upgrade a working CDOT SBM or MBM exchng to provide ISDN service by adding min additional hardware while retaining the existing hardware .
•
It supports ISDN subscribers thru remote sw unit(RSU). The processor architecture is characterised by distributed control & message based comm. In order to achieve a loosely coupled for flexible system architecture.
•
Software is written in HLL-“C.”
3.3. Basic building modules of C-DOT DSS MAX •
Base module(BM)
•
Central module(CM)
•
Administrative module(AM)
•
i/o Module (IOM)
3.3.1. Base Module It interfaces the external world to the sw thru subscri.lines like analoge & digital trunks, CCM(coin collect metering ) & PBX lines. Each BM can interface upto 2024 terminations. It
carries out majority of call processing functions along with maintenance& operation funct with the help of IOM. In Single Base Module(SBM) exchng configuration , the BM acts as independent sw sys & provide connections to 1500 lines &128 trunks . In such configuratio configuration n ,BM directly interfaces interfaces with IOM for bulk data storage,opera storage,operations tions & maintenance functions . Clock& synchro is provided provided is provided by the source within within BM .
3.3.2. Central module Consists of message sw space to provide inter module comm.& performvoicev & data switching btw BMs. It also provides clock & synchro on a centralized basis.
3.3.3. Administrative module Performs system level resource allocation & processing function on a centralized basis. basis. It performs performs all the memory & time intensive intensive call processing processing support functions functions & also admini administr strati ation on & mainta maintaina inance nce functi functions ons.. It commun communicat icates es with with the BM via the CM. It supports the IOM for providing man machine interface. It also supports the Alarm Display Panel (ADP) for the audio visual indication of faults in the system.
3.3.4. Input / Output module It is a powerful duplex computer systemthat interfaces various secondary storagedevices like disk drives, cartridge, tape drive & floppy drive.it supports printers & upto 8 serial ports for video display units, which are used for man machine communication interface.All the bulk data processing & storage is done in this module .
3.5. Remote Switch Unit (RSU) •
RSU is an integral part of DSS architecture.
•
In order to realise a RSU ,the normal BM can be modified for remating with the host exchng via 2Mbps digital links .
•
•
No. Of 2 Mbps links btw main exchng & RSU is primerly determined by the traffic . A max 16 PCMs can be provided btw RSU & main exchng . analoge & digital trunk interfaces are also implemented in RSU to support direct parenting of small exchng from RSU itself instead of of parenting it to the main exchng .
•
As far as call processing is concerned ,RSU is an autonomous exchng capable of local call completion .in the event of failure of PCM links RSU goes to standalone mode of operation operation .in case ,it is not possible possible to process process a call request due to unavailabil unavailability ity of links to the host ,the subscriber is connected to appro.tone or announcement.
3.6. Common Channel Signalling # 7 (CCS#7) It is implem implemen ented ted in CDOT CDOT DSS DSS to provi provide de
valu valuee added added serv servic ices es in
netw netwk k
eg.intelligent netwk services,ISDN services .ISDN serv.are the most widely used carriors to transport the bulk volume of data . with the increasing use of internet access , the use of ISDN ISDN inte interf rfac acee is like likely ly to go up as it has has to prov provid idee reli reliab able le acce access ss to the the user user @ 64/128kbps.It integrates computer on telephone on single acce ss.
3.7. Redundancy To meet the stringent stringent availability availability CDOT DSS employs employs “hot standby standby techniques” techniques” for all processor complxes so that event of the failure of any one security block not more than 8 subscrib . will be effected . Hard Hardwa ware re crossl crosslin ink k btw btw have have been plann planned ed in such such
a way that that even even failur failuree 2
dissimilar dissimilar processor processorss donot effect effect the sys performance performance . In the event of failure of 1 unit ,other units will share its load preventing the disruption of services .
3.8. C –DOT Card Assembly The basic work of this shop is to design & assemble various sorts of cadrs which are used for connection & control of subscriber lines & inserted in the rack of C – DOT telephone exchange in their respective places.In C – DOT exchange ,mainly 3 kinds of cards are used : •
CLR (Control Line Rack) Cards group
•
CNR (Connection Network Rack) Cards group
•
SPL (Special Line Cards) Cards group
Chapter 4 G.S.M OVERVIEW 4.1. INTRODUCTION:G.S.M
was
though
first
developed
in
Europe
but
is
now
used everywhere in the worldG.S.M. is the short form for Global Services for Mobile communication. Analog cellular system is known as 1st generation digital system. Digital system are second generation system. The digital transmission over air interface has a number of advantages over analog transmission. In G.S.M. System, TDMA in a combination with FDMA is used. The usage of each radio channel is portioned into multiple (8) time slots and each user is assigned a specific frequency\time slot combination.
4.2. Some Version of G.S.M:1. G.S.M.-900(STANDARD) 2. G.S.M.-1800 3. G.S.M.-1900
Figure1.1. frequency limitation in GSM 900/1800 4.3. Limitation Of Fixed Line Telephone:Main limitations of fixed telephone system are:1. No mobil obilit ity. y. 2. Dela Delay y in new new conn connect ectio ion. n. 3. Secu Securi rity ty Haza Hazard rd.. 4. Pron Pronee to to fai failu lure re.. 5. Very Very less less value value adde added d serv service ices. s.
To overcome these difficulties world wide communication c ommunication organization has establish committee committee to study about wireless wireless telephony. telephony. Those groups of members members were named as CEPT (Conference of European Post &
4.4. EVOLUTION OF G.S.M. STANDARDS:-
●1980’s:During this period, Advance Mobile phone services (AMPS) was there in America .
●EARLY 1980’s:Europe European an nation nationss were develo developin ping g cellul cellular ar soluti solutions ons but no common common standa standard rd was available.
●1982:CEPT (Conference of European Posts and Telegraph) formed a study group called the Group for Special Mobile (G.S.M.) To honor the group the technology is named as G.S.M.
●1989:1.
G.S.M. G.S.M. respon responsib sibilit ility y was transfer transferred red to ETSI (European (European telecom telecom standards standards institute.)
2.
Global system for Mobile communication.
●1990:Phase-1 of G.S.M. specification was published during this period .
● MID-1991:* Commercial Service Started; * G.S.M. facility was launched in four countries:1. France 2. Italy 3. U.K. 4. Germany
● 2009:Commercial Services available in maximum all countries.
4.5. OBJECTIVES OF G.S.M. ● Good speech quality. ● Low terminal and service cost. ● Support for international roaming. ● Ability to support handheld terminals. ter minals. ● Support for range of new services and facilities. ● Spectral Efficiency. ● ISDN compatibility.
4.6. SERVICES PROVIDED BY G.S.M:-
● Tele-Service: - Telephony. ● Data Service: -Circuit Switched Data up to 9600 bps (9.6kbps). - G3 Facsimile-Of third generation. - S.M.S.
● Supplementary Services:-
Call Call forw forward arding ing,, when when subscr subscribe iberr is is unavai unavailab lable. le.
-
Call Call bar barri ring ng for for out outgo goin ing g or inco incomi ming ng cal calls ls..
-
Call all ide identific ficati ation.
-
Call waiting.
-
Mult Multip ipar arty ty Conv Conver ersi sio on.
4.7. RANGE OF ONE CHANNEL:Let’s take the case of G.S.M. Band frequency. 890 to 915 MHZ - Uplink Frequency 935 to 960 MHZ -
Downlink Frequency
Each Uplink band & Download band is of 25 MHZ duration. Now 25 MHZ is divided in 125 Parts. Each part is called Channels. 1 Channel=1 ARFCN=25 MHZ 125=200KHZ So, 1Channel=200 KHZ. Hence each channel becomes 200 KHZ .Each person is allocated for 1 Channel. Hence in one band of frequency 125 Persons can talk at a time.
4.8. TDMA (Time Division Multiple Access):After FDMA it was later found that division division of frequency frequency itself was not sufficient sufficient to meet the capacity of requirement. So frequency channels are again divided into time domain called time slots.This means that multiple users will use the same channel frequency but not at the same instance.Each user will be given a time slot of fixed time period. Hence more users can use the same channel of FDMA by time division multiplexing. This method of increasing the capacity is called Time Division Multiple Access (TDMA).
4.8. 4.8.1. 1. How How & how how much much Capa Capaci city ty Can Can Be Exte Extend nded ed By Intr Introd oduc ucin ing g TDMA:-
After FDMA each channel is of 200 KHZ. Now 200 KHZ is again divided into same slots. 125 Channels=125*8=1000 time slots. But out of 125,124 channels are used for speech transmission. One channel in each frame is left for providing gap to next frame. This one channel is used as a guard to avoid overlapping between two frames. Hence from 125 channels including TDMA no. of time slots used for traffic=124*8=992 .Hence 992 persons can talk from one frame. In this way it increases the capacity of traffic.
4.9. CDMA (Code Division Multiple Access) This is used in WLL where as in G.S.M. FDMA and TDMA both are used at a time. In this method complete frequency band is divided in 64 codes-channels. Each code channel can be used by different users. The entire user will communicate at the same time and transmit & receive related to its code. A spread spectrum technology is used in which the radio signals associated with a call is spread across a single board frequency spectrum(1.25 MHZ).
Figure 4.1 FDMA/TDMA
Chapter 5 INTRODUCTION TO CELLULAR COMMUNICATION:In a wireless communication to access the subscriber two R.F. channels are needed per active cell. But in a city if there is large no. of subscriber it needs large no. of channels to accommodate them. But there is limitation of availability of spectrum. To overcome this limitation total area of city will be divided into zones, called CELLS. CELLS. Each CELL has has base station Transceivers (BTS). The location of site will be on following factor:1. Cove Covera rage ge of prim primee locat locatio ions ns.. 2. Cost fa factor. 3. Availa Availabil bility ity of power power,, securit security y and open open space. space. 4.
Nearby Nearby install installatio ation n of other other B.T. B.T.S. S.
5.
Terr Terrai ain n cond condit itio ion. n.
Figure 5.1. Cellular telephony
5.1. CELL STRUCTURE:Each cell is hexagonal in shape. Each cell may be of different shape and size. In highly dense area, the size of cell will be small and in lesser dense area cell size will be larger. Size of cell on highways and on main roads, cell size is optimized to cover larger length along the road. This can be made possible by using highly directive antenna.
Figure 5.2. Frequency reuse cellular telephony
Chapter 6 G.S.M.NETWORK ELEMENTS:-
Figure 6.1. G.S.M. Network The meanings of various components of G.S.M. G.S.M. as used in public land (PLMN) are:MS - Mobile Station BSS - Base Station Subsystem NSS - Network Station Subsystem B.T.S. - Base Transceivers Station B.S.C. - Base Station Controller B.C. -
Billing Centre
M.S.C.-Mobile Switching Centre H.L.R. - Home Location Register V.L.R. - Visiting Location Register A.U.C. - Authentication Centre EIR-
Equipment Identity Register
OMC- Operation and Maintenance Centre SMSC- Short Message Service Centre VMSC- Voice Mail Services Centre STF-
Speech Transcoder Frame
6.1. MOBILE STATION
Mobile Network
The Mobile Station(MS) represent the terminal equipment as use by subscriber supported by G.S.M. wireless system .It consists of two parts:● SIM (Subscriber Identity Module) ● Mobile Equipment. It do following operation;● Radio Transmission Termination. ● Radio Channel Management ● Speech Encoding / Decoding. ● Radio Link Error Protection. ● Flow Control of Data. ● Mobility Management and Rate adaptation Of User Data to Radio link. ● Performance Measurement of Radio Link
6.2. BSS:The B.T.S., BCF and STF together from the BSS via Air link connection is mode between the BSS & the mobile station.
6.3. B.T.S.:The BTS by means of an antenna receives the signals as sent by the Mobile station. Several types of an antenna configuration are there depending on need. In the BTS an MRIF (Mini Rack Interface) is present. The MRIF then passes on the signal to the BCF through Abis link .In an Abis link speech and signal travel at a rate of 16Kbps . ● BTS has a set of transceivers to communicate with mobile in its area. ● One BTS cover one or more than one Cell. ● Capacity of Cell depends upon the no. of transceivers in a cell. ● BTS is connected to BSC through Abis link of 2Mbps. ● BTS transmits and receives voice at 13Kbps on Um i.e. Air interface. ● BTS commands Mobile set to set Transmission Power, Timing advance
and
Handover.
6.4. BCF:The BCF takes part in signaling part of data. It has two types of services COWS & CEWS are meant for common channel signaling to other parts like STF etc. CEWS do signaling related to the BCF. The signals coming at 16Kbps where speech is not touched in the BCF.
6.5. STF:-
The BCF is then connected to the STF by an M link. In this, signal travel at a rate of 64Kbps. This receives speech at 16Kbps & signals at 64 Kbps. It takes care of the speech part. It contains certain STU cards which connected to the MSC by A link .
6.6. MSC:MSC means Mobile Switching Centre. It provides switching of Cell like PSTN exchange and is the heart of GSM network. Switching means connecting, maintaining & release of mobile to mobile, mobile to PSTN &PSTN to mobile Cells. It has data base of all subscribers and stored in HLR, VLR etc.Database includes identity of subscriber MSC is weighted by no. of subscribers. For example, MSC of 1 lakh subscriber means that MSC can provide connection to 1 lakh and beyond which it need another MSC. The MSC perform the switching function for all mobile station located in its geography area covered by its BSS.
6.6.1. Function of MSC
● Call handling that copy with mobile nature of subscriber. ● Management of required logical radio link channel during calls. ● Management of MSC-BSS signaling protocol. ● Handling location Register, ensures inter working between mobile, mobilestation & VLR. ● Control of inter BSS and inter MSC handovers. ● Standard functions of local exchanges. ● Exchange of signaling information with other systems. ● Acts as gateway to interrogate HLR.
6.7. AUC:● Contain subscriber authentication data called subscriber keys. ● Generates security related parameter needed to authorize services. ● Generates unique data pattern called chipper key to encrypt user data and speech.
6.8. HLR:● MSC store all the data base of subscriber in HLR. ● MSC communicates with HLR to get database of subscriber on call. ● Contains administrative information of each subscriber registered in the corresponding GSM network.
● Location of the mobile is typically in the form of the signaling address of the VLR associated with the MS. ● Important data fields are:* MSISDN * Present VLR * IMSI (International Mobile Subscriber Identity)
6.9.VLR:Contains temporary database of subscriber. Temporary database means mobile status (like ON/OFF), ON/OFF), Location of mobile, that is in which cell is the mobile mobile so that incoming incoming call can be directed directed to that cell. Again in Roaming Roaming case case i.e. if any subscriber subscriber is coming coming from some other MSC area, then it is known to as visitor for that MSC. When that visitor subscriber switches on its mobile then first make request for call, then MSC confirms to HLR & HLR confirms it from original HLR and stores the database to visitor VLR .
6.10. EIR:It is accessed during the equipment validation procedure when a mobile station access. It contains identity of mobile station equipment called IMEI. The three lists corresponding to the status of the equipment are:● White list (valid) ● Grey list (suspected) ● Black list (banned)
6.11. OTHER ELEMENTS:-
● BC:. - To collect billing data for Public land Mobile Network (PLMN). ● SC: - To provide special service to mobile subscriber in the Public Land Mobile Network (PLMN)
Figure 6.2. GSM location updation
Figure 6.3. GSM network call routing
Chapter 7 Burst
Figure 7.1. Normal burst period structure
Figure 7.2. frame structure
BURST TYPES:-
● Normal Burst - Carry Data ● F Burst -Used in FCCH (Frequency Correction Channel) ● S Burst - Used in SCH (Synchronization Channel) ● Access Burst - Used in RACH (Random Access Channel) ● Dummy Burst-
Figure 7.3. burst types
Chapter 8 Logical channel
Figuer8.1. logical channel types
8.1. TRAFFIC CHANNEL:-
● TCH / F-Traffic Channel Full Rate. -@13 Kbps ● TCH / H-Traffic Channel Half
[email protected] Kbps ● EFR-Enhanced Full Rate.-@13 Kbps. 8.2. BROADCAST CHANNEL DOWNLINK:-
● BCCH-(Broadcast Control Channel.) -Broadcasting Network /cell specific information.
● FCCH-(Frequency Correction Control Channel)
● SCH -(Synchronization Channel.)-Synchronization of mobiles (TDMA, FN & BSIC) .
● CBCH (Cell Broadcast Control Channel.)
8.3. COMMON CONTROL CHANNEL: – ● DOWNLINK – PCH
* Paging Channel. * For Alerting Channel. AGCH
*Access Grant Channel. * For Granting Access to Mobile .
● UPLINK RACH
* Random Access Channel. * Mobiles seeking attention of the BTS.
8.4.DEDICATED CONTROL CHANNEL: •
Slow
SACCH
* Slow Associated Control Channel (Duplex). * Transmission of Signaling Signaling Data(Radio link supervision, Measurement, Transmit Power Control, Timing Advance).
●
Fast SDCCH
* Stand Alone Dedicated Control Channel (Duplex).
* Signaling Channel used for service request. FACCH
* Fast Associated Control Channel. * Stealing Flag & Preparation. * Used during cell setup, Handover.
8.5. RADIO LINK ASPECTS:● ITU Allocation for GSM 900 -Band 890-915 MHZ for Uplink (MS to BSS). -Band 935-960 MHZ for Downlink (BSS to MS).
● To maximize the capacity utilization. -Access technique is FDMA /TDMA/FDD.
● 25MHZ bandwidth is divided into:-124 Carriers (ARFCN). -Spaced 200 KHZ apart. * TDMA superimposed on carrier frequency. * Each Base Station is assigned multiple frequencies.
8.6. FREQUENCY HOPPING:-
8.6.1. 8.6.1.OBJ OBJECT ECTIVE IVE::
-
Mult ultiple iple-P -Pat ath h
fadin ading g
is
depe depend nden entt
on
carr carriier
freq freque uenc ncy. y. Chan Changi ging ng the the carr carrie ierr freq freque uenc ncy y slow slowly ly help helpss alle allevi viat atee the the problem.Co-Channel interference is in effect randomized. r andomized.
8.6.2 8.6.2 REALIZ REALIZATI ATION: ON: - The The ARFC ARFCN N for for the the chan channe nell is chan change ge in each each
success successive ive frame, frame, based based on HOPPING HOPPING Sequen Sequence. ce. The HOPPING HOPPING Sequenc Sequencee changes for each TDMA Frame.
Figure8.2. frequency hopping
Chapter 9 BTS (Base Transceiver Station)
BTS is the main part of the mobile communication.bts consists of mainly three cards. Whole system of BTS consists: 1. Fan unit (It have 9 fans) 2. Racks 3. FACB (Fan control Board)
BTS can be classified as: According to power supply 1. DC power supply BTS2. AC power supply BTS-
According to sites it is of two type 1. INDOOR BTS 2. OUTDOOR BTS
BTS consists of mainly these cards
1.SUMA CARD(Station unit module advance) 2.TEPA card(Transmitter Equipment Power amplifier) 3.TERPA CARD(Transceiver Equipment Power Amplifier ) 4.TREPS(Transceiver Equipment Power supply )\ 5.RT CARD(Transceivers) 6.ANC CARD(Antenna Network Chamber) TREPA, TREPS & TEPA are the types of RT card .one bts three sectors named: ALFA, ALFA, BETA GAMA sectors. One sector sector
can contain one ANC card and maximum four RT cards. In one BTS 12RTcards are connected. RT cards are connected to the ANC cards and ANC connected to BSC and then MSC
BTS RACKS
RACKS ASSEMBLY-As shown in figure a rack has six shelves. In first shelf
there are parts (XIBM, MSCA, POWER SUPPLY (-48V)).Second shelf can be divided into four parts (4RT) And third is of two parts for ANC, again four parts for RT and then again two parts one for SUMA & other for ANC. The last shelf also has four parts for RT. Upon every RT one fan unit is available for cooling. It also consists of a MSD unit for maintenance.
SUMA CARDS (BRAIN OF THE BTS)
FUNCTIONS
1. Digi Digita tall transm transmis issi sion on 2. Timing Timing and clock clock generat generation ion 3. Management Management of internal internal digital digital interface interface 4. Operati Operation on and maint maintenan enance ce functi function on 5. Remo Remote te inve invent ntor ory y 6. Control Control DC-DC DC-DC converte converterr & check check in of battery battery
ANC Function- (This Card is not Manufactured Here): The ANCON is responsible for maintaining the operation of the ANC,
Its principles are:-
1. Setting Setting the the LNA Game for for the assigned assigned for TREA receive receiver r 2. LNA LNA Alar Alarm m Supe Supervi rvisi sion on 3. Meas Measur urin ing g Alar Alarm m VSWR VSWR 4. Select Selection ion of Ante Antenna nna Sector Sector 5. Repo Reporti rting ng VSW VSWR R Alar Alarm m 6. RF cablin cabling g statu statuss Detec Detectio tion n 7. Remote Remote Power Power ON/OFF ON/OFF via the BCB Interface Interface 8. Status Status Disp Display lay via via front front panel panel LED’ LED’S S 9. RI via via the the BCB BCB Int Inter erfa face ce
Quality of Alcatel BTS
- Very high radio performances, in particular * Reception sensitivity, -111 dBm,
* Improved Output Power, (Standard 45 W), - Radio (synthesizer) Frequency Hopping, - Antenna Diversity (as standards option), - Minimum Service Interruption - Very High BTS availability Due to Module Reliability Due to System Architecture, - Optimi Optimized zed softwa software re releas releasee migrat migration ion.. (Simul (Simultan taneou eously sly stores stores two software-versions).
Flexibility of Alcatel BTS
- Wide possibilities of extensions and sectorization, within the same cabinet, e.g., the MBO2 cabinet can accommodate up to six sectors with a twelve-TRX total capacity, - Outdoor BTS modularity provides flexibility for other equipments (Transmission Equipment, Batteries, Microwave, DDF etc.), - System Architecture and Cabinet for GSM 850, GSM 900, GSM 1800 and GSM 1900 remains the same, - High modularity, - Reduced set of modules and a common interface
Future Proof BTS.
- GPRS Ready - EDGE Ready by “add TRE” operation
- UMTS Ready: the MBI5 and MBO2 outdoor cabinet allow mixed configurations GSM + UMTS.
Transceiver (TRX) level
The transceiver (TRX) level covers GSM 850, GSM 900, GSM 1800 and GSM 1900 functionalities, including full rate, half rate, enhanced full rate, antenna
dive divers rsit ity, y, radi radio o freq freque uenc ncyy hopp hoppin ing g (syn (synth thes esiz ized ed hoppi hopping ng)) and and diff differ eren ent t ciphering algorithms. For each band, these functions are integrated into one single module. Inside each TRX module, an RF loop is implemented. The loop test is performed after downloading the frequencies to the BTS as a supplement to the autotest. The TRX module also handles the Radio Signaling Link (RSL) protocol.
Base station Control Function (BCF) level
This level is ensured by the Station Unit Module (SUM), which is the central unit of the BTS. There is only one such module per BTS, whatever the number of sectors and TRXs is; this common control function of the SUM is also called Station Station Unit Sharing. The main base station control functions functions performed are as follows:
- Generating the clocks for all other BTS modules; the clocks can be either either synchronize synchronized d to an external external clock reference - e.g. A-bis link, GPS or another BTS - or generated in a pure free-run mode by an internal frequency generator. - Ensuring central BTS Operation & Maintenance (O&M) application, - Handling the A-bis transmission links (up to two A-bis interfaces), - Handl andlin ing g Oper Operat atio ion n and and Maint ainten enan ance ce Link Link (OM (OML) and and Qmux Qmux (transmission equipment supervision) protocols, - Cont Control rolli ling ng the the AC/D AC/DC C func functi tion on when when inte integr grat ated ed insi inside de theB theBTS TS (Outdoor or Indoor AC configurations), - Controlling the battery (capacity, voltage, temperature), - Setting the optimal voltage and current for battery charging
Antenna Coupling Level
The antenna coupling level is the stage between the antennas and the TRX level; it handles the combining functions as well as the interface with the antennas. A single module called Antenna Network Combiner (ANc) performs these functions for up to 4 TRXs. For configurations of higher capacity, a Combiner stage can be added. Thanks to the ANc flexibility and this modular building, the antenna coupling level can be adapted to a wide range of requirements (reduction of attenuation losses, minimization of the number of antennas…). The general functions performed at this level are: - Duplexing transmit and receive paths onto common antennas; - Feeding the received signals from the antenna to the receiver front end, where the signals are amplified and distributed to the different receivers (Low Noise Amplifier (LNA) and power splitter functions);
- Providing filtering for the transmit and the receive paths; - Combining, if necessary, output signals of different transmitters and connecting them to the antenna(s); - Supervising antennas VSWR (Voltage Standing Wave Ratio).
The Antenna Network Combiner (ANc) module
The Antenna Network combiner module (ANc) connects up to four transmit signals to two antennas, and distributes the received signals from each antenna to up to four receivers (for the normal and the diversity reception). This module includes twice the same structure, each structure containing: - One duplexer allowing a single antenna to be used for the transmission and reception of both downlink and uplink channels- hence minimizing the number of antenna - A frequency selective VSWR meter to monitor antenna feeder and antenna - One LNA amplifying the receive RF signal, and giving good VSWR values, noise compression and good reliability - Two splitter levels distributing the received signal to two or four separate outputs so that each output receive the signal from its dedicated antenna and from the second one (diversity) - One Wide Band Combiner (WBC), concentrating two transmitter outputs into one, only for configurations with more than two TRX. Each sector is equipped with at least one such stage, which features very high sensitivity reception, low attenuation, and minimum inter-modulation products. The ANc can be manually configured (on site) in two modes depending on the number of TRX in the sector: - The No-combining mode for configuration up to 2 TRX, for which the Wide Band Combiner is not needed therefore bypassed.
- The Combining mode for configuration from 3 up to 4 TRX, for which the Wide Band combiner is not bypassed.
ISO
ISO (Intern (Internati ationa onall Organi Organizat zation ion for Standa Standardi rdizat zation ion)) is the the world' world'ss larges largestt developer and publisher of International Standards. ISO is a network of the national standards institutes of 157 countries, one member per country, with a Central Secretariat in Geneva, Switzerland, that coordinates the system.
ISO STRUCTURE
What “International Standardization” means?
When the large majority of products or services in a particular business or indust industry ry sector sector confor conform m to intern internati ationa onall standa standards, rds, a state state of indust industryry-wid widee stand standar ardi diza zati tion on can can be said said to exis exist. t. This This is achi achiev eved ed throu through gh cons consen ensu suss agre agreem emen entt betw betwee een n nati nation onal al dele delega gati tion onss repr repres esen enti ting ng all all the the econ econom omic ic stakeho stakeholde lders rs concern concerned ed –suppl –supplier iers, s, users, users, govern governmen mentt regulat regulators ors and other other interest groups, such as consumers. They agree on specifications and criteria to be applied consistently in the classification of materials, in the manufactures and supply of products, in testing and analysis, in terminology and in the provision of services. In this way International standards provide a reference framework, or a common technological language, between suppliers and their customers-which facilitates trade and the transfer of technology.
Standards help to: •
Adopt best practices, Discipline
•
Systematic approach to work
•
Reduces cost of rework and improves productivity
•
Improves Employee involvement, Morale and work culture
•
International recognition for quality and export worthiness benefits of software certification benefits to your software application.
•
Establishes a level of quality for your software product.
•
Instills credibility in your company and software product. pr oduct.
•
Provides a third party, unbiased evaluation of your product
•
•
New and repeat business Added exposure. Customers will be able to find your product from our site .Benefits to your customers.
•
Confidence that your software is reliable, secure and safe
•
Confidence that your software will not install viruses or anti spyware.
•
Confidence that you will stand behind your product
•
Confidence that your company is credible
ISO’s 9000
ISO 9000 is a family of standards for quality management systems. ISO ISO 9000 9000 is maint aintai aine ned d by ISO, ISO, the Int Interna ernattiona ionall Organ rganiz izat atiion for for Standardization and is administered by accreditation and certification bodies. Some of the requirements in ISO 9001 (which is one of the standards in the ISO 9000 family) include -A set of procedures that cover all key processes in the business monitoring processes to ensure they are effective; - Keeping adequate records; -Checking output for defects, with appropriate and corrective action where necessary; - Regularly reviewing individual processes and the quality system itself for effectiveness;
and
-Facilitating continual improvement
Overview of standards and certification
Why standards & certification
Acad Academ emic ic degre degrees es are are reco recogni gnize zed d beca becaus usee they they come come from from a recog recogni nize zed d institution that is usually accredited .They attest that the individual holding a diploma has knowledge of the subject matter. They don’t necessarily speak to competency of third party assessment.
Certificates- certi certifi fica cate tess are are the the smal smalle lest st buil buildi ding ng bloc block. k. A cert certif ific icat atee of
accomplishment means that one has successfully completed a specific course or program. A certificate may be awarded based on seat time (the person sat through so many hours of training) or assessment.
Certification-ISO does not itself certify organizations. Many countries have
formed formed accredi accreditat tation ion bodies bodies to authori authorize ze certifi certificat cation ion bodies bodies,, which which audit audit organ organiz izat atio ions ns appl applyi ying ng for for ISO ISO 9001 9001 comp compli lian ance ce cert certif ific icat atio ion. n. Alth Althou ough gh commonly referred to as ISO 9000:2000 certifications, the actual standard to which an organization's quality management can be certified is ISO 9001:2000. Both the accreditation bodies and the certification bodies charge fees for their services. The various accreditation bodies have mutual agreements with each other to ensure that certificates issued by one of the Accredited Certification Bodies (CB) are accepted world-wide.
An ISO certificate is not a once-and-for-all award, but must be renewed at regular intervals recommended by the certification body, usually around three years. In contrast to the Capability Maturity Model there are no grades of competence within ISO 9001.
Popular organizational standards/Models/certificates for IT Industry
•
ISO 9000:2000
•
SEI CMM
•
SEI-CMMI
•
SIX SIGMA
•
ITIL
What is quality?
Quality is an “Ability of a set of inherent characteristics of a product, system, or process to fulfill requirements of customers and other interested parties.”
A Quality Management System (QMS)- is a System to establish a quality
polic policy y and qualit quality y object objective ivess and to direct direct and control control the organi organizat zation ion to achieve those objectives
What is ISO 14000?
I.S.O. 14000 provides an internationally recognized set of standards for incorpo incorporat rating ing
environm environment ental al manage managemen mentt
company’s business.
into into
every every aspect aspect of
a
ISO 14001:1996-E 14001:1996-Environ nvironmental mental Management Management System-Spec System-Specific ification ation with guidance for use
ISO 14001-2004-En 14001-2004-Environ vironmental mental Management Management System-Req System-Requireme uirements nts with guidance for use
ISO 14004:2004-Environmental Management System-General guidelines on principles, system and support techniques
ISO 14015:2001-Environmental Management –Environmental assessment of sites and organization (EASO)
ISO 14031:1999-Environmental Management –Environmental performance evaluation-guidelines
ISO/TR ISO/TR 14032: 14032:199 1999-E 9-Envi nvironm ronment ental al Manage Managemen ment-E t-Exam xample pless of environmental
performance evaluation (EPE)
ISO 14040: 14040:199 1997-E 7-Envi nvironm ronment ental al Manage Managemen mentt –Life –Life Cycle Cycle assessm assessment ent- principles and framework
ISO 14041:1998-Environmental Management - Life Cycle assessment-Goal and scope definition and inventory analysis
ISO 14042:2000-Environmental Management- Life Cycle assessment-Life cycle impact assessment
ISO 14043:2000-Environmental Management- Life Cycle assessment-Life cycle interpretation
Advantages:
According to the Providence Business News , implementing ISO often gives the following advantages: A) Create Create a more efficient, efficient, effective effective operation operation B) Increase customer satisfaction and retention C) Reduce audits D) Enhance marketing E) Improve employee motivation, awareness, and morale F) Promote international trade G) Increases profit I) Reduce waste and increases productivity
SIX SIGMA
The concept of SIX SIGMA was put forward by “MICKEL HARRY” who was an engineer with Motorola in 1985. He introduced six sigma to his company which was facing the downfall and after following six sigma principles, the company got the regular boost in their bottom line.
According to john Maxwell,
“Leadership determines the direction of company, organization determines thee pote th potent ntiial of comp compan any, y, and and pe pers rson onne nell de dete term rmin inee th thee succ succes esss of company”.
IMPLANTATION METHODOLOGIES
Six Sigma has two key methodologies(1)DMAIC (2)DMAD
DMAIC (Define Measure analysis Improve Control)
G at e
G at e
DEFINE- Formally define the process improvement goals that are consistent
with customer demands and enterprise strategy. G at e
G at e G at e
MEASURE-To define baseline measurements on current process for future
compari comparison son,, map and measure measure process process in questi question on and collec collectt requir required ed process data.
ANALYZE- To verify relationship and causality of factors. What is the
relationship? Are there other factors that have not been considered?
IMROVE- Optimize the process based upon the analysis using techniques
like design of Experiments.
CONTOL- Setup pilot runs to establish process capability, transition to
production and thereafter continuously measure the process and institute control mechanisms to ensure that variances are corrected before they result in defects.
DMADV (Define Measure Analysis Design Verify)
It is used to create new product designs or process designs in such a way that it results in a more predictable, mature and defect free performance.
GAT E
GAT E
GAT DESIGNDevelo Develop p detail detail design designs, s, optimi optimize ze design design,, and plan plan for design design GAT E
E
verification. This phase may require simulations. GAT E
VERIFY- Design Design,, setup setup pilot pilot runs, runs, implem implement ent produc productio tion n proces processs and
handover to process owners.
FEATURES OF SIX SIGMA:
•
It can measure how good our product, services & processes really are.
•
It hel helps in esta establ bliishin shing g a gaug gaugee pace pace in race race for tota totall cust custom omer er satisfaction.
•
It describes quantitatively how a process is performing.
•
By SIX–SIGMA, a process must not produce 3.4 defects per million opportunities.
•
It can measure any defect which helps in eliminating them.
•
It denotes statistically how a given process deviates from perfection.
•
It helps an organization in increased market share, customer satisfaction, cost reduction and dramatic boost to bottom line.
SIX-SIGMA CHAIN
Six-Sigma identifies 5 key roles for its successful implementation:
1. Executive leadership: includes CEO & other key top management team
members. They are responsible for setting up a vision of SIX SIGMA implementation. They also empower the role holders with the freedom & resources to explore new ideas for breakthrough improvements.
management & project project championing championing): ): these 2. CHAMPIONS (for process management are are resp respon onsi sibl blee for for the the SIX SIX SIG SIGMA imple mplem menta entati tion on acro across ss the the organization in an integrated manner. The executive leadership draws them from the upper management. Champions also act as mentor to Black Belts .This level of certification is now no w called “Quality Leader”.
MASTER BLACK BLACK BEL BELTER TER (train (trainer, er, coach, coach, qualit quality y contro controlle llerr to 3. MASTER
prov provid idee faci facili liti ties es to impro improve ve proj projec ect, t, stat statis isti tica call anal analys ysis is of data data): ): identified by champions, act as in-house expert for the organization on SIX SIGMA.
BLACK BEL BELTER TER (to (to lead lead the the proj projec ectt team team ful fully resp respon onsi sibl blee for for 4. BLACK
technicalities
involved
in
proj roject,
general ral
proc rocess
control rol
&
improvement): operate under Master Black Belts to apply SIX SIGMA methodology to specific projects. They devote 100% of their time to SIX SIGMA. 5. GREEN BELTERS (project work, general process control for particular
assigned, head of project control team): these are the employees who take
up
SIX
SIGMA
implementation
along
with
their
other
job
responsibilities.
COMPARISION OF VARIOUS VALUED SIGMAS
SIGMA
PPM
1.0 2.0 3.0 4.0 5.0 6
YIELD
690000 308537 66800 6210 233 3.4
30.90% 69.2% 93.31% 99.38% 99.977% 99.9997%
Below Four Sigma loss is around (10-15) % and it is useless to do a process below Four Sigma.
COMPANIES FOLLOWING SIX SIGMA
Motorola, Motorola, GE, Honeywel Honeywell, l, Sony, Nokia, Nokia, Polaroid, Polaroid, Capara Maruti, Maruti, Tata SSL, Whirlpool of India, Hughes, Escorts hospital, Caterpillar, Bharti telecom.
SIX SIGMA PROJECTS
1. Project should be identifiable process, input & output.
2. A good good SIX SIGM SIGMA A proj projec ectt shou should ld neve neverr have have a prede predete term rmin ined ed solution.
3. If solution/answer is already known, just go & fix it instead of adopting SIX SIGMA processes.
4. All projects projects need to be approached from prospective of understanding understanding the variation in process input, controlling them & eliminating them.
5. For the projects that have the operators or operator training as an input, focus should be given to reduce the operator variation, thereby making the process more robust to different or untrained operators.
STEPS TO ATTAIN SIX-SIGMA
1. ENLIGHTMENT. 2. ACCEPTANCE. 3. TOOLS. 4. DEPLOYMENT. 5. RESULTS. 6. RENEWAL. Init Initia iall lly y comp compan anie iess took took six six year yearss to impl implem emen entt sixsix-si sigm gmaa but but now now companies can implement it within a short shor t period of time.
ERP (ENTERPRISE RESOURCE PLANNING)
ERP system are software package soothing several module, such as human resources ,sales , finance& production, marketing, advertising etc. providing cross organization integration of data through embedded business processes. These software software packages packages can be customized customized to accommodate accommodate the specific specific need of an organization.
It takes care of all activities in organization, including planning, manufacturing, sales and marketing and many more. ERP could gain much attention in a very short span of time &many software applications sprang up to business managers to implement ERP. Typically, an ERP, the expansive set of activities supported by multi module application software helps the business man manage important part of his business.
COMPETITOR
SUPPLIER
ENTERPRIS
FUNCTIONAL
CUSTOMER
Evolution of ERP
•
1950s – Inventory control module.
•
1960s – material requirement planning (MRP1)
•
1970s - manufacturing resource planning (MRP2)
•
1990s - enterprise resource planning (ERP)
•
1994-
•
Later - customer relation relation management management (CRM) (CRM)
Supply chain management
FEATURES OF ERP
•
ERP performs core business behavior& increases customer services & there by augmenting the corporate image.
•
ERP fills the sequence break across the organization.
•
ERP provide for compressive integration of system not only transversely.
•
ERP is a single elucidation for better project management.
•
ERP not only addresses addresses the current current requirement of the company company but also provide the opportunity of persistently improving &cleansing business processes.
•
ERP provid provides es busine business ss intell intellige igence nce tool tool like like decisi decision on support support system system (DSS), (DSS), execut executive ive informa informatio tion n system system (EIS), (EIS), reporti reporting, ng, data data mining mining &early warning system (ROBOT) for enabling people to make better decision & accordingly improve their business processes.
SUPPLY CHAIN MANAGEMENT
SCM can be defined as the process of planning, implementing and controlling &
effici efficient ent & cost effecti effective ve flow of raw materia materials, ls, in process process inventor inventory, y,
fini finish shed ed good good & rel related ated info nformat rmatio ion n from rom poi point of origi rigin n to poi point of consumption for the purpose of conforming to customer requirements. The 5 basic components of SCM are as follows –
.
•
Plan
•
Source
•
Make
•
Deliver
•
Return
SIMPLE MODEL
The The simp simple le manu manufa fact cturi uring ng ente enterp rpris risee buys buys item item from from exte extern rnal al supp suppli lier& er& internally produces items for direct sale & shipment to customers. The ERP sys must handle buy & make items at a single site operations.
SUPPLIER
MANUFACTU
AVAILABLE ERP IN THE WORLD
•
BAAN.
•
J. D. Edward.
•
SAP.
•
Ramco.
•
QaD.
•
Oracle.
•
People soft.
•
BOI.
CUSTOMER
BaaN
•
Founded by Jan Baan in 1978 in the Netherlands.
•
BaaN manufacturing control sys (BMCS) was the 1 st package developed by BaaN for MRP1, CRP& MRP2.
•
The company BaaN has become one of the world’s biggest software group &expects to remain on a fast track for the foreseeable future.
•
BaaN solutions are used to achieve streamline the planning process by integrating diverse information, insuring smooth planning. With the help of BaaN we get better decision support.
SAP
•
SAP SAP is the the worl world’ d’ss lead leadin ing g prov provid ider erss of coll collab abor orat atio ion n e-bu e-busi sine ness ss solutions. SAP ranks the world ‘s 3rd independent software provider
•
It has been in the business of e-business for 35 years. Founded in 1972 by 5 former IBM engineers.
•
Thro Throug ugh h this this peop people le in busi busine ness ss arou around nd the the glob globee are are impr improv ovin ing g relati relations onship hipss with with the custom customer& er& partne partners, rs, streaml streamlini ining ng operat operation ions& s& achieving significant efficiencies through there supply chain.
•
Unique Unique core process processes es like like from from aerosp aerospace ace to utili utilitie ties, s, are support supported ed effectively by SAP’s 23 industries solution.
•
Visibility through the business processes.
•
Workflow management and event triggered processes.
•
Empowered users.
•
Informed management decisions.
WHY ITI HAS GONE FOR BaaN:
•
BaaN Very strong for discrete
•
manufacturing industries. •
Long relationship with CMC for
industries &finance company. •
hardware maintenance. •
License fee is comparatively cheap.
SAP Very strong for process
CMC was implementation partner of SAP.
•
License key is comparatively large.
CIRCUIT DIVISION
•
PCB PLANT
•
HYBRID PLANT
PCB PLANT
BASE MATERIAL CUTTING DRILLING ELECTROLESS PLATING PUMICING LAMINATION EXPOSURE DEVELOPMENT ELECTROPLATING STRIPPING ETCHING Sn - Pb STRIPPING (SOLDER STRIPPING) PISM (PHOTO IMAGE SOLDER MASK) HAL (HOT AIR LEVELLING)
SCREEN MASKING/PRINTING ROUTING TESTING QUALITY CONTROL
Flowchart for preparation of final PCB
BASE MATERIALS:
PCB unit is meant for producing printed circuit boards of various dimensions. The most common dimension of which PCBs are generally made of: •
240×400 Sq. mm.
•
280×400 Sq. mm.
•
300×400 Sq. mm.
•
300×500 Sq. mm.
•
300×600 Sq. mm.
The raw material used for the manufacturing of the PCB is “COPPER CLAD EPOXY LAMINATE”.
The dimensions are: •
920×1220 Sq. mm.
•
1220×1220 Sq. mm.
Their thickness generally comes in the multiple of 0.8mm.Copper clad of the thickness thickness 17.5 or 35.0 or 70 microns is laminated laminated on the both sides of the glass epoxy.
CUTTING:
It is carried out by saw cutting machine. Cutting is done by two types of blades. One is used for cutting copper clad glass epoxy. This blade has diamond in its circumference shape, which serves as the cutting edge & the blade is circular in shape. Other blade used is for the entry sheet & the back up sheet. The blade used for this purpose is carbide blade.
BAKING:
After cutting the base material to required sizes, in order to make the surface coating of Cu even, to remove the volatile impurities, vapours & moistures & moreover to make the sheet plane, the raw sheet of glass epoxy with Cu clad laminate is baked in oven at 3 different temperatures depending upon thickness of raw materi material. al. The process process requir requireme ement nt time time and temper temperatu atures res are given given below:
Type Of Process
Temperature
Cycle Time
Curing of PCB base material
140
12 hr
Straightening of warped material
140
12 hr
Straightening of warped circuit
140
12 hr
For the purpose of straightening of warped material load is also used along with temperature application. The heating is done in oven named as “Kerry Oven”. DRILLING:
After baking, the next step is drilling. The stacks of 3 raw material sheets are made along with entry sheet & back up sheet. The stack is centered & pinned here. The lot of three stacks is thus held together by pinning. Pinning & stacking is done by a manual machine. The cards (raw material) from this goes to the drilling section. In the drilling section, drilling on the boards are done in which further SMD (Surface Mounting Device) is used for insertion of components. There are two machines being used for drilling purpose. One machine requires program to be located by magnetic tape on paper tape. Another drilling machine has computer control & is called CNC. The computer is there to initialize the process. There are various sizes of drill bits in CNC itself. The operating temperature of machine is 200C to 250C.
DEBURRING:
After drilling holes, burrs left over the sheet & on the edges are removed by deburri deburring. ng. Deburrr Deburrring ing remove removess unwant unwanted ed materi materials als & makes makes holes holes perfec perfect. t. Also, the board surface gets smoothened.
ELECTROLESS PLATING:
It is purely a chemical process which is done to make the epoxy area between the two Cu clad plates conducting. A 2 micron Cu layer is formed over the holes as a result of electroless plating. In this process, the surface of Cu also gets evened. This is also called alkaline plating & is done with the help of chemicals. As no electrode is used for plating purpose, so called as “electroless plating”.
PUMICING:
Gem stones are crushed to powdered form which is dissolved in a container & sprayed over the Cu sheet to make it little rough for better lamination & for removing any hand marks, grease or dust which may have accumulated during the process.
LAMINATION:
The polymer film to be laminated is first mounted onto a roller and after the blank board is inserted from below, the film gets laminated on to the blank Cu sheet. The polymer film used is a special kind of consisting of 3 layers. The lowest one is called myler. One of the sheets inside has glue attached to it, which holds the film to the Cu sheet
EXPOSURE:
The sheet prepared so far is now placed under circuit layer (Diazo; Photo Tool) & UV rays are passed through it. The part through which the UV rays pass becomes hard & the rest remains soft (tracks).
DEVELOPMENT:
In this process, the unexposed sensitive photo resist is removed & so we finally get the tracks printed on the Cu sheet. In this process, the sheet is passed through 1% Na2CO3 solution which removes the soft, unpolymerized layer. Then inspection is carried out under 10× magnifying glass.
ELECTROPLATING:
After development, card is fed to electroplating apparatus. Sn-Pb plating is done on the Cu plate. Here current is passed on the plate, so is called as electroplating. The thickness of Sn-Pb to be applied is 12.5 micron. On open tracks, Cu plating of about 25 micron is done. Current is passed through a mixture of Sn-fluberate, Pb-fluberate & fluberic acid. DYNATRON F is the mach machin inee used used for for elec electr trop opla lati ting ng.. In PTH PTH (Pla (Plate ted d Thro Throug ugh h Hole Holes) s) lane lane,, deposition of Cu is done inside the hole to establish the continuity between two surfaces. Electroplating involves following processes: •
Cleaning chemical.
•
Acid cleaning.
•
Cleaning through water.
•
Electro etch cleaning.
STRIPPING:
In this process, the electroplated sheet is passed through the solution of NaOH which removes the hard layer or the polymerized layer.
ETCHING:
After stripping the polymerized layer, the Cu becomes visible. This Cu layer is then removed by etching. etching. Etching is done using Ammonical Cu solution.
SOLDER STRIPPING:
In this process, process, solder Sn-Pb layer is stripped off leaving circuit pattern pattern that is, Cu over epoxy layer. HNO 3 is used for this purpose.
PISM (Photo Image Solder Masking):
In this process, ink is put over the developed board like dying. Board is inserted from bottom & ink is poured from top & with the help of leveler, it is leveled properly. Then it is cured at a temperature of 80 0C for 30 minutes to make ink adhere properly to the board. After curing, a photo tool is placed over the sheet & UV Rays are passed through it. The points where holes are to be formed remains soft as light can’t pass through it. After exposure, passing through Na2CO3 solution due to which we get an impression of the holes on the board. Then, again it is baked at temperature 120 0C for 4 hrs.
HAL (Hot Air Leveling):
The board or the sheet till now produced consists of complete ink & copper are to be soldered which is done using a solder. Therefore a layer of solder is developed over these holes by dipping the PCB in a bath of molten solder.
SRCEEN MASKING/PRINTING:
A polyester cloth of size 100×100 sq. cm is used. The ink is coated on this screen to be called as skin mesh. Then screen printing is done by special type of chemical fersol-29. The screen developing & cleaning is done using water, which is made to fall on the screen to remove excess ink.
ROUTING:
Here, unwanted portion of the plate is removed & only desired circuit is left behind.
TESTING:
This is done to detect any anomaly. Error detected is shown by printer & it can be rectified if within limits, otherwise discarded. Visual inspection is done to check any discrepancy crack or any connection fault. Bare board testing (BBT) is done for very sophisticated result.
QUALITY CONTROL:
In the the end, end, qual qualit ity y insp inspec ecti tion on of the the PCB PCB plat platee is done done.. Plat Platee is visu visual ally ly inspected to meet the desired specifications like conduction area must be totally covered by solder resist, overlapping of solder resist must be admissible, solder must pass adhesive test etc.
HYBRID PLANT
As indicated by the name, the division is responsible for development of hybrid networks which are to be mounted on the PCB or which can be used directly. Hybrid Hybrid networks networks are compri comprised sed of both both active active & passiv passivee elemen elements. ts. Active Active networ networks ks consis consistt of compon component entss like like transi transisto stors, rs, diodes diodes,, capaci capacitor tors. s. Passiv Passivee netw network orkss cons consis istt of purel purely y resis resisti tive ve elem elemen ents ts.. Hybr Hybrid idss are base based d on two two technologies: •
Thin film technology
•
Thick film technology
Here, thick film technology is being used.
The various sections of hybrid department are : •
Screen printing
•
Firing
•
LASER trimming
•
Assembly
•
Encapsulation
•
Final testing
PROCESS OF HYBRIDIZATION SCREE N PRINTIN G
FINAL TEST
ENCAPSULA TION
FIRING
LASER TRIMMIN G
ASSEM BL Y
SCREEN PRINTING:
In this section, 1st steel mesh is prepared by cutting plates into required sizes. Then, they are held in clamps from all sides & appropriate tensile strength is maintained. The frame is oriented at 45 0. This is done to prevent viscous paste from flowing. The different materials used for conduction & resistors are: •
A silver coloured paste of Silver Palladium for conduction.
•
Paste of Ruthenium Oxide for resistors.
•
A green coloured paste is used for protective cover.
FIRING:
Substrate after printing of every component is sent to the firing section. In this section, the substrate is put into the firing machine where it is subjected to high temperature, as per requirement. Conductors and resistors are subjected to a temperature of 8500C for 90 minutes. When the protective cover is printed on the substrate, it is sent to this section & is subjected to a temperature of 550 0C for 45minutes.
LASER TRIMMING:
The resistive networks are always made of value lower than the required value. This This is done done becaus becausee the manufact manufactured ured value of resist resistive ive networ networks ks can be increased to required value by LASER trimming based on following formula: R = S×L/A; where R = Resistance, S= Resistivity, L= Length, A= Area.
ASSEMBLY:
In this section, lead pins of conductive materials are inserted in the chip for making contacts. The pins are soldered using a material that consists of lead, tin, silver.
ENCAPSULATION:
The resistive network covered with Epoxy Powered network is inserted into the bar of powder coating machine. Air is rotated for uniform cooling. The network is sent to to the maskin masking g section section where where various various specif specifica icatio tions ns like like file, file, batch batch number, rating are masked on the network.
FINAL TESTING:
The resisti resistive ve networ network k before before being being used used is subjec subjected ted to differe different nt climat climatic ic conditions artificially created. The conditions are: •
Temperature : (21±7)0C
•
Dust level : zero
•
Relative humidity : 55±5%
COMPONENT DIVISION
LAYOUT OF COMPONENT DIVISION:
15
16
17
14 18
1
13
1
12
10
11
3
8
9
7
2
6
1
KEYS:
1. GATES 2. CANTEEN 3. OFFICES 4. NCM & RELA RELAY Y 5. CM OFF OFFIC ICE( E(P. P.I. I.)) 6. MANUF MANUFACT ACTURI URING NG OF NCM PARTS PARTS 7. OFFICES 8. STORE 9. C & T 10.SHOE RACK 11.TOILET & WATER 12.U.P.S. SYSTEM 13.TOOL ROOM 14.PAINTING 15.PLATTING
4
5
16.WELDING 17.PUNCHING MACHINES 18.DIFFERENT TYPES OF PUNCHING P UNCHING MACHINES
Component division is concerned with the mechanical work being carried out in the industry. Here many piece parts and shelves are made for exchange. The work assign to this division is t manufacture and assemble different components that are utilized in production of exchange.
COMPONENT DIVISION
MANUFACTURING 1) Moulding
ASSEMBLY 1) Connector
Assembly 2) Punching
2) Coil &
Transformer 3) CNC
3) MDF
Assembly 4) Metal part
4) Relay
Assembly 5) NCM
Assembly of different components is done in Production Unit 1 and manufacturing is done in Production Unit 2.
PRODUCTION UNIT 1
In this section following type of components are assembled: •
Connector Assembly
•
Coil Winding and Transformer
•
MDF (Main Distributed Frame)
•
Relay Assembly
CONNECTOR ASSEMBLY:
Here 4 T types of connectors are manufactured handing different sizes, dimensions, number of pins etc. Assembly of connector requires •
Plastic raw material(insulator)
•
Metallic piece(conductive)
Plastic raw material is manufactured in moulding shop and metallic pieces are manufactured in punching shop. Different type of tools and machine used in this shop are: •
Hand press tool
•
Combination separation tool
•
Assembly machine
•
Locking machine
COIL AND TRANSFORMER ASSEMBLY:
In this shop coil and different type of transformer used in exchange are manufactured. Different types of transformer prepared here are:
•
Tube transformer
•
Pulse transformer
•
Power transformer
•
Converter transformer
•
Switching transformer
Various machines are used in this shop are: •
Coil and winding machine
•
Auto shop machine
•
Pneumatic assembly machine
•
Tape ringing machine
•
Automatic marking machine
After assembly the transformer is subjected to testing in order to avoid any discrepancy. The following parameters on which a transformer is tested are: •
Number of turns
•
Resistance
•
Inductance
•
Transformer ratio
•
Insulation strength
•
Dielectric test
•
Thermal test
•
Short circuit in winding
NOTE COUNTING MACHINE (NCM):
NCM (Note Counting Machine) is used for note counting. It has many function of note counting. counting. It works on 230V AC supply. It works on suction bare. It has some important parts: •
SPINDLE MOTOR: Rotates spindle unit. It has speed 1450 rpm power rating 20W and current 0.5A.
•
HOPPER HOPPER MOTOR: Moves the hopper. It has gears. It has speed of 1450 rpm but gears convert it into 56 to 60 rpm. Its power rating is 20W and current 0.5A.
•
SPINDLE ASSEMBLY: Spindle is a moving part of NCM. It has five fingers which suck the note with the help of vacuum.
•
VACUUM PUMP MOTOR: It has two parts. One part sucks the air and the other part blows the air on the spindle finger. Its speed 2850 rpm power rating 0.25 HP and current 1.8A.
•
TRANSFORMER: It takes 230V AC and given 9V and 22V AC output.
•
DAMPER UNIT: Its main work is to move the hopper plate smoothly.
•
POWER SUPPLY: It takes supply from transformer 9V and 22V AC from transformer and gives 5V and 24V DC to mother board.
•
MOTHER BOARD: It has some IC relays connectors LEDs. It has 5V DC supply for display unit keyboard IC, switches, and relays. It has 24 V supp supply ly for for batc batch h sole soleno noid id and and stam stamp p sole soleno noid id and and 230V 230V supp supply ly for for spindle hopper and vacuum pump motor.
•
FILTER: FILTER: It has three air filter filter and an EMI filter filter paper filter filter (transparent) (transparent) for suction. Oil filter filter for diaphragm assembly.EMI assembly.EMI filter is an electronic device which protects from the disturbance in 230V AC supply.
•
DIAP DIAPHR HRAG AGM M ASSE ASSEMB MBLY LY:: It work workss on suct suctio ion n syst system em.. It has has a
diaphragm and sensor which moves up and down. Sensor senses the counting and displays it with the help of mother board.
PRODUCTION UNIT 2
This section includes: •
Moulding
•
Punching
•
CNC
•
Metal part
MOULDING:
In this shop various components of plastics are manufactured that are used in manufacturing of racks of exchanges. Component of NCM, antennal clamps and other miscellaneous components are also made. Components used in NCM are cam, damper cover, damper unit, gears, and several other big parts that are not manufactured here. Other important parts are charger case and carbon rings etc.
for for rela relay y uni unit sock socket et,, pill pillin ing g suppo upport rt and and othe otherr insul nsulat atiing part partss are are manufactured. For this purpose a machine called AIMM (Automatic Injection Moulding Machine) is used. The moulding has three main parts: •
Injection unit
•
Mould unit
•
Control unit
PUNCHING:
In punching shop, conductors are made. Raw materials are copper, bronze, brass, stainless steel etc. There are several steps to manufacture a product. these are as follows: •
Planning and control department decides the total quantity of products and fixes quality at which it should be manufactured.
•
After this we decide that which raw material would be used and then choose an appropriate tool for a particular product.
•
Then appropriate machine is selected.
•
After manufacturing the product it is sent to quality control for quality check.
Some machines used for punching: •
High speed automatic punching
•
Sawing machine
•
Buffering machine
CNC (COMPUTERIZED NUMERIC CONTROL):
In this shop punching and bending of heavy components is done by CNC
punching and CNC bending machine.
This mach machin inee equi equipp pped ed with with 45 1) CNC PUNCHING MACHINE: This different types of punching tools. A program is fed to the control panes of machine used to monitor punching machine.
FEATURES:
Capacity - 30 tones
Table travel - 1270 mm (Y-axis) on change
Carriage travel - 1830 mm(X-axis) adjusted X2
Stroke/min - 350
Maximum rate - 200
Maximum sheet size - 1270 × 3660
Relative humidity - 75%
2) CNC BENDING MACHINE : This machine is used for bending the
surfaces. It works on the principle of hieratic pressure i.e. pressure appl applie ied d by mach machin inee is due due to the pres pressu sure re of oil oil in tank. ank. The The dimension angle of bending is feed through the control panel. This machine can bend a no of surfaces at different angles in a single cycle using different tool machine.
FEATURES:
Capacity - 400 tones
Table length - 4000mm
Ramp travel - 300 mm
Max sheet thickness - 10 mm
operating temperature - 00C to 350C
Relative humidity - 75%
SEA PLANT (SWITCHING EXCHANGE ASSEMBLY)
WAY TO COMPONENT DIVISION
13
14
1
15
1
2 3
2
4 11
5 9
8
6
12 17 19
20 7
18
1
17
10 1 6
1 6
KEYS:
1. GATES 2. TOIL TOILET ET AND AND WATE WATER R 3. STORE RO ROOM 4. COMPON COMPONENT ENT INSER INSERTIO TION-I N-I & TESTI TESTING NG 5. SOLD SOLDER ERIN ING G (CSN (CSN)) 6. INSE INSERT RTION ION - II II & QC 7. TEST TESTIN ING G (FIN (FINAL AL)) 8. RACK RACK ASSE ASSEMB MBLY LY 9. SYSTEM SYSTEM INTEGR INTEGRATI ATION ON TEST TESTING ING 10.QC & QA 11.CANTEEN 12.CWM OF ICE (SIT) 13.CWM OF ICE (RACK) 14.CWM OF ICE (CARD)
2
2
1
1
16
15.CM OFFICE 16.SHOE RACK 17.OFFICE CWM(CSN or NP) & MODEL EXCHANGE 18.NP & CSN OR TABA HALL 19.WAY TO COMPUTER DIVISION 20.BTS MANUFACTURING In SEA plant where the entire integration takes place and final product is assembled. This plant takes input from the PCB, hybrid, component divisions and these inputs are processed according to need and final product is given as output. Currently this section goes both telecom and non-telecom products are being assembled.
TELECOM PRODUCTS:
As it has has alrea already dy bein being g spec specif ifie ied d that that the the majo majorr tele teleco com m prod produc ucts ts of ITI ITI Mankapur are exchanges. These exchanges may be of E10B, CSN and C-DOT technology. Currently C-DOT and CSN exchanges are being made and repair. As the E10B technology is outdated only repairing of these exchanges are being carried out according to request of Customer. The main processes of SEA plant are as follows:
1. COMPON COMPONENT ENT PREPER PREPERATI ATION: ON:
Components are cut to desired size by instruments like: •
RCD RCD CUTTER CUTTER: Which Which is a machin machinee for manual manual cuttin cutting g two termin terminal al medium and large size components like capacitor, resistor. This machine can cut a maximum 556 components per hour.
•
MK6 MK6 CUTT CUTTER ER: This This is used used for for cutt cuttin ing g smal smalll size size two two term termin inal al comp compon onent ents. s. It has has a C058 C058 Cutt Cutter er:: It is used used for for cutt cuttin ing g conne connect ctors ors.. Connectors are inserted and cut when pedal is pressed.
REDIAL SUPER: It is also a component cutting machine with a maximum
•
capacity of 3600 components per hour. It is a radial cutter.
2. PCB PCB PREP PREPER ERAT ATIO ION: N:
Preparation of PCB involves: •
Marking of PCB with suitable codes
•
Heat sinks and connectors are connected
•
Masking is done on the holes, which are drilled for component to be inserted during second insertion
•
Baking of PCB plates is done at temperature of 10ºC for a period of 10
3. FIRST FIRST STAGE STAGE INSERT INSERTION ION::
Components which need to be solved are manually inserted on the PCB according to the desired circuit. Diagram is given by the method section. To speed up the process, an optical film of the given circuit is used.
4. VISU VISUAL AL INS INSPE PECT CTIO ION: N:
Before soldering, the cards are manually checked for error.
5. SOLDERING:
The soldering of components of first stage is done after visual inspection. The soldering is done with the help of WAVE SOLDERING MACHINE. This machine has been imported from CIT Alcatel France. The parameters of the machine are as follows: •
Name of machine - Ultrapak with Wave Dynamic (machine parameter with no-clean flux).
•
Flux density maintained at .810 to .815.
•
Conveyer speed - 9m/min; tolerance - 0.1.
•
First preheated temperature - 400 degree Celsius; variation - 20 degree Celsius.
•
Sold Solder er bath bath temp temper erat atur uree - 243 243 degr degree ee Cels Celsiu ius; s; vari variat atio ion n - 05 degr degree ee Celsius.
In this machine, the PCB with the lose component is passed through the heater first. Then the flux is applied to the leads to be soldered. After this the PCB passed through the solder bath & the components get soldered. This machine uses two waves to provide reliable fixation. It has a moving wave along with a stationary wave.
6. SE SECO COND ND INSE INSERT RTIO ION: N:
The components which cannot withstand high temperature of the solder bar are inserted manually in the hole of the PCB. If the cards contain some SMD components it sends to CSN section for this purpose. The card is then tested and sent to the store.
7. TESTING:
The cards are tested for their conductivity, continuity and other parameter. Each Each test tester er has has achi achiev eved ed an idea ideall card card on its its CPU. CPU. If the the diff differ eren ence ce of parameter is greater than the tolerance with respect to ideal card then card is sent to the repair section.
8. QUAL QUALIT ITY Y CHEC CHECK: K:
Before the cards are inserted in the racks. They are randomly checked for their ideal performance. performance. The pass cards are inserted inserted in the racks and the other are sent back.
9. RACK RACKS S ASSE ASSEMB MBLY LY::
In the the rack rackss asse assemb mbly ly the the outp output ut of comp compon onen ents ts and and SEA SEA PLAN PLANT T are are inte integra grate ted. d. The The racks racks whic which h hous housee the the exch exchan ange gess are manu manufa fact cture ured d in component division. their connectors, MFD & other components are installed and then they are sent to rack assembly. In rack assembly the quality checked cards are inserted and after connection C-DOT Exchanges are being tested in SEA PLANT.
10.QUALITY CONTROL:
In this section of SEA PLANT, manufactured cards or assembly of racks are tested or Q.C. checked. If card performs right operation then it is OK & sent to the the quali quality ty assu assuran rance ce depa departm rtmen ent. t. If card card or rack rack is not perf perfor ormi ming ng righ rightt operation then it is sent for repairing and after that, again tested.
11.QUALITY ASSURANCE:
When quality is tested then it is assured that the product has performed right operation. For this some cards or racks are randomly picked and tested. Again if it performs right operation then we mark Q.A. & whole lot is ready to go to customer’s hand. If it does not perform right operation then we return the cards or racks to Q.C.
NON-TELECOM PRODUCTS:
The Non-Telecom products of ITI Mankapur include:
1. NCM (Note Counting Counting Machine Machine)) 2. NBM (Note Bundling Bundling Machine Machine)) 3. FNDM (Fake Note Note Detect Detector or Machine) Machine) 4. Inve Invert rter er 5. Energ Energy y mete meter r 6. UPS (Uninte (Uninterrupted rrupted Power Supply) Supply)
NCM, NCM, NBM, NBM, FNDM FNDM are basica basically lly Bankin Banking g Automa Automatio tion n produc products. ts. NCM is bei being ng made made in comp compon onen entt divi divisi sion on and and has has been been disc discus usse sed d in deta detail il in component section. The remaining Non Telecom Products are being made in SEA- Plant. Out of above mentioned products we had to study only FNDM. Its detail is as follows.
FNDM:
As the name indicates, this machine is used for detecting whether the note is true true or fake fake.. This This mach machin inee is used used to prov provid idee Bank Bankin ing g Auto Automa mati tion on.. This This machine consists of 2 tubes. One is normal DL tube & other is UV tube. On the upper side of the metal body, the UV tube is put on the lower side the DL is present. The working of machine is very simple. The note to be tested is placed on the machine. First, DL tube is ON & the face which is not clearly visible become visible after this the UV lamp is switched ON & the water marks on the note become visible. Thus fake note can be detected if the is aware of the correct identification marks of the note. The main disadvantage of this machine is that it tests one note at the time. An advance of this machine is being developed developed in which several bundles of the notes can be tested at the same time. In the advance version 2 sets of UV lamps are present, one above & one below.
The bundles of notes to be tested tested are passed through through these lamps, the fake note can be clearly detected as its entire length shines in contrast to the true note, shines at one point of its length.
SWITCHING EXCHANGE ASSEMBLY
SEA division of ITI, Mankapur produces exchange for fixed line. The main type of exchange which is manufactured here is E10B and C-DOT. E10B is French techn technol olog ogy y where where as C-DO C-DOT T is Indi Indian an.. The The use use of E10B E10B is abso absolu lute te.. So, So, nowadays only mode of C-DOT is taken in. The assembly is done here.
C-DOT: •
C-DOT DSS MAX is universal digital switch. This can be configured for
different application as local transit or integrated local and transit switch. •
High traffic/load handling capacity up to 8,00,00 BHCA with termination
capacity of 4000 lines as local exchange or 15,000 trunks as trunk automatic exchange the C-DOT DSS family is ideally placed to meet the different requirement of any integrated digital network. •
The design of C-DOT DSS MAX has envisaged a family concept. The
advantages of family concept are standardized components, commonly in hardwar hardwaree docume documenta ntatio tion, n, traini training ng instal installat lation ion and field field support support for all produc products ts and minimi minimizat zation ion of invent inventory ory of spaces spaces.. In fact fact this this modula modular r design has been consciously consciously achieved achieved by employing employing appropriate appropriate hardware, hardware, software equipment practices
FLEXIBLE ARCHITECTURE:
C-DOT DSS is a modular and flexible digital switching. System which provides
economical means of serving metropolitan under and rural environments. It incorporates all important and mandatory services needed by user with option of up gradation to add new features and services in future. •
The architecture for C-DOT DSS is such that it is possible to upgrade a working C-DOT SBM or MBM exchange to provide ISDN service by adding adding a minimu minimum m additi additiona onall hardwar hardwaree while while retain retaining ing the existi existing ng hardware.
•
Another factor of the architecture is its support to ISDN subscribers throu through gh remo remote te swit switch chin ing g unit unit (RSU) (RSU).. The The proce process ssor or arch archit itec ectu ture re is characterized by distributed control and message-based communication in orde orderr to achi achiev evee a loos loosel ely y coup couple led d net network work for flexib exible le syst system em architecture.
•
Software is written in high level language ‘c’ and distributed over various processors and is structural as hierarchy of virtual machine.
TECHNOLOGY:
The system employs a T-S-T switching configuration and is based on a 32 channel PCM structure. It uses a basic rate of 64 Kbps and 2 Mbps primary multiplexing rate. It uses a basic rate control is distributed over the system by by usin using g 32-b 32-bit it,, 16 bit, bit, 8 bit bit micr microp oproc roces esso sors. rs. All All the the crit critic ical al cent central ral circuitry has built-in-redundancy.
System hardware utilities advanced concepts in micro-electronics form a compact and optimum design. Basic memory unit has been implementing as 16 MB dynamic Ram board.
Single chip digital processors are used for implementing DTMF and MF receive receivers. rs. High High perfor performan mances ces,, high high densit densities ies VLSI VLSI chip chip detect detect multi multiple ple tares and simultaneously perform signal filtering or four channels. This approach reduces costs, power dissipation and saves PCB space.
A to D carburetion is done by CODEC chips and ASICS/FPGA’s which makes cards small & compact.
BASIC BUILDING MODULES OF C-DOT DSS MAX: •
Base module(BM)
•
Central module(CM)
•
Administrative module(AM)
•
I/O Module (IOM)
BASE MODULE:
It interfaces the external world to the switch through subscriber lines like analog & digital trunks, CCM (Coin Collection & Metering) & PBX lines. Each BM can interface up to 2024 terminatio terminations. ns. It carries out majority of call processing processing functions along with maintenance & operation functions with the help of IOM. In Sing Single le Base Base Modu Module le (SBM (SBM)) exch exchan ange ge conf config igur urat atio ion, n, the the BM acts acts as independent independent switch system & provides provides connections connections to 1500 lines &128 trunks. In such configuration, BM directly interfaces with IOM for bulk data storage, operations & maintenance functions. Clock & synchronization is provided by the source within BM.
CENTRAL MODULE:
Consists of message switch space to provide inter module communication & perf perfor orms ms voic voicee & data data swit switch chin ing g betw betwee een n BMs. BMs. It also also prov provid ides es cloc clock k & synchronization on a centralized basis.
ADMINISTRATIVE MODULE:
Perf Perfor orms ms syst system em leve levell reso resour urce ce allo alloca cati tion on & proc proces essi sing ng func functi tion on on a centralized basis. It performs all the memory & time intensive call processing supp suppor ortt func functi tion onss & also also admi admini nist stra rati tion on & main mainte tena nanc ncee func functi tion ons. s. It communicates with the BM via the CM. It supports the IOM for providing man machine interface. It also supports the Alarm Display Panel (ADP) for the audio visual indication of faults in the system.
INPUT / OUTPUT MODULE:
It is a powerfu powerfull duplex duplex comput computer er system system that that interfa interfaces ces variou variouss second secondary ary storage devices like disk drives, cartridge, tape drive & floppy drive. It supports printers & up to 8 serial ports for video display units, which are used for man machine communication interface. All the bulk data processing & storage is done in this module.
REMOTE SWITCH UNIT (RSU): •
RSU is an integral part of DSS architecture.
•
In order to realize a RSU, the normal BM can be modified for remoting with the host exchange via 2Mbps digital links.
•
Number of 2 Mbps links between main exchange & RSU is primarily determined by the traffic.
•
A maximum 16 PCMs can be provided provided between RSU & main exchange. exchange. Anal Analog og & digi digita tall trun trunk k inte interf rfac aces es are are also also impl implem emen ente ted d in RSU RSU to support direct parenting of small exchange from RSU itself instead of parenting it to the main exchange.
•
As far as call processing is concerned, RSU is an autonomous exchange capable of local call completion. In the event of failure of PCM links RSU goes to standalone mode of operation. In case, it is not possible to
process a call request due to unavailability of links to the host, the subscriber is connected to appropriate tone or announcement.
COMMON CHANNEL SIGNALLING NO.7 (CCS NO. 7):
It is implemented in CDOT DSS to provide value added services in network, e.g. intelligent network services, ISDN services. ISDN services are the most widely used carriers to transport the bulk volume of data. With the increasing use of internet access, the use of ISDN interface is likely to go up as it has to provide reliable access to the user @ 64/128 Kbps. It integrates computer on telephone on single access.
REDUNDANCY:
To meet meet the the stri string ngen entt avai availa labi billity ity CDOT CDOT DSS DSS empl employ oyss “hot hot stan standb dby y techniques” for all processor complexes so that event of the failure of any one security block not more than 8 subscribers will be affected. Hardware crosslink btw have been planned in such a way that even failure 2 dissimilar processors do not affect the system performance. In the event of failure of 1 unit, other units will share its load preventing the disruption of services.
C –DOT CARD ASSEMBLY:
The basic work of this shop is to design & assemble various sorts of cards which are used for connection & control of subscriber lines & inserted in the rack rack of C-DO C-DOT T tele teleph phon onee exch exchan ange ge in thei theirr respe respect ctiv ivee plac places es.. In C-DO C-DOT T exchange, mainly 3 kinds of cards are used: •
CLR (Control Line Rack) Cards group
•
CNR (Connection Network Rack) Cards group
•
SPL (Special Line Cards) Cards group
CSN (CENTRAL SATELLITE NUMERIC)
In the technology affect of electronics switching exchanges, CSN was leap of C-DOT. It was the technology developed by CIT ALCATEL; France. In ITI Mankapur, the connection work of OCB-283 is done. Control, operation and maintenance is done at Palghat. CSN CSN MM (one (one rack) rack) has has a capac capacit ity y of 2048 2048 subs subscr crib ibers ers.. The The numb number er of different different types of cards used in CSN MM is 33. The cards are made by surface mount technology. The PCB from PCB section is input for the manufacturing section of CSN MM cards. The board with printed circuit is first made to apply on a solder paste on it. This is done by the solder pasting machine. This machine has a frame exactly same as the circuit printed on the PCB. Their centers are coincided and placed on the machine. The material used as solder paste has following constituent - Sn 62%, 62%, Pb 36%, 36%, Ag 2%. 2%. Two Two came cameras ras obse observe rve the the fixa fixati tion on.. Pneu Pneuma mati ticc air air pressure (6 bar) sucks the card and create vacuum. There is a squeeze brush which moves back and froth for one complete cycle. If the distance of holes is very small then it can be fixed to move for half cycle. The back and forth motion spread the solder paste in the holes of PCB. If however one time pasting on cards does not give fine results then before second time paste on card the isopropyl alcohol is used to wash off.
PICK AND PLACE MACHINE :
It is a CNC machine which is microprocessor controlled. After pasting card is sent to this machine where components are picked one at a time and placed at the appropriate position on card automatically. The chip or IC are sent by the help of rollers on PLC (Plastic Loaded Chip Carrier). It checks the SMD’s before putting on any IC. It throws the faulty IC to the dustbin.
REFLOW (Thermo Tech Oven) :
After placing placing and centering, centering, the card is sent to oven so that components components can be tightly fixed. The thermo tech oven has six zones. First, the solder melts and then it is cooled. cooled. In this way, the grip of solder becomes becomes strong. The process is called REFLOW. Then the inspection of card is done by bare eyes through inspection machine to check whether the components are placed correctly or not. We can also check misalignment or disconnection.
Now for bottom side assembly various machines are involved: 1) GLUING MACHINE: The glue is epoxy silicon which is applied to
the bottom part of the car. This gluing machine has two parts:
Gluing unit
Pick and place unit
GLUING UNIT: In this unit the adhesive is applied by two springs
on the bottom of the card via a nozzle. It makes adhesive dots between slots so that components are tightly glued.
PICK AND PLACE UNIT: This picks and places the components at
appropriate place.
2) CURING: This card is then put to oven which is divided into six
zones. There are two plates at upper side and lower side and there is a covering for these plates. Parameters for curing:
Conveyer speed: 60 cm per minute
Temperature zone:
1H 440
2H 250
3H 270
4H 280
After this, the card goes to the manufacturing area where the component, which can not be placed on the card, is placed manually. Then soldering is done with the help of wave soldering machine.
WAVE SOLDERING:
After assembly assembly manual inspection of components is done. Then after this, it is put put in the the baki baking ng oven oven to remov removee mois moistu ture. re. After After that that,, it come comess to wave wave soldering machine. This wave soldering machine is little different from the machine used in C-DOT soldering. It has a real wave like solder flowing in it to solder the component. After placing the cards on conveyer, at first flux is sprayed on the card by nozzle. This smoothen the plate and device the leads of components for soldering. Then it passes through 3 pre-heaters maintained at gradu gradual ally ly incre increas asin ing g temp temper erat ature ure of 250 250 degre degreee cent centig igrad rade, e, 350 350 degr degree ee
centigrade, 400 degree centigrade. The flux is completely vaporized which is necessary for better soldering. Then it passes through the solder bath having two waves of solder flowing in opposite direction. The tank of solder bath contains 400 Kg of solder. The solder has following composition: Sn 63%, Pb 37% with melting point 170°C to 180°C. The temperature of both is kept at 243°C so that the solder comes in molten form. At the output, air cooling is done for a while and then the card is sent for marking which specifies the card.
CARD TESTING IN CSN SHOP:
After marking the cards, come to the card testing section. Here the function and manufacturing defects are traced using electronic machine.
Processes in card testing: •
Input from manufacturing
•
MDA(Manufacturing defect analyzer)
•
FDA(Functional defect analyzer)
•
Final testing
•
Burn in for 48 to 72 hours
•
Quality control test
•
Sample test
•
Custome
QUALITY CONTROL PLANT
This shop controls and checks the quality of the products manufactured by the plant. •
Quality is fitness for use.
QC is of types: •
IGI (Inwards Goods Inspection): Function of IGI to check the supplied goods. Steps in IGI are: To check the qualification of the supplier Visual
check(damage,
components)
value
and
marking
of
the
Electrical test It passed, given to PPC(production, planning and control) •
IPQC: In this process, quality of the finished and unfinished products is checked by the sampling process. The vital point is how much sample should be taken and how much should be passed so that whole sample is considered to be passed. For this we have sampling plan. ITI ITI (SEA (SEA)) QC foll follow owss the the stan standa dard rd MIL MIL STD. STD.10 105 5 D. This This is military standard.
Apart from sample size the other two criteria are there to pass the sample lot: AQL (Acceptable Quality Level): It is that quantity which
customer would always accept. (QL: Quality level: percentage defective) Level: Amount of inspection. This gives the sample size of
inspection.
Here, we usually do level two checkings. There are 3 types of sampling plans : 1) Single sampling sampling plan plan (used (used in SEA- QC) 2) Double Double sampli sampling ng plan plan 3) Multip Multiple le samp samplin ling g plan plan
WHAT IS QUALITY CONTROL?
It is that that proce process ss throu through gh we meas measure ure actu actual al qual qualit ity y perf perfor orma manc nce, e, compare it with standard & act on the difference.
INSPECTION:
It is the process by which we check the product whether it confirms or don’t confirm the given specification.
Three main parts of QC are: Plan : Test data Measure : Carry out test & generate data Control : Analyze data & generate corrective action
RELIABILITY:
It is measured in terms of quality & time.
QUALITY ASSURANCE
Qualit Quality y assuran assurance ce is respons responsibl iblee to plan, plan, control control & execut executee the inspec inspectio tion, n, testing, verification & surveillance function which are required to attain & sustain the product quality as specified. The officer of quality assurance shall be responsible to assure that the products are accepted as per delivering plan. The officer shall be responsible to organize intra structure mainframe & all other inputs required for smooth operation of the department. He is authorized to release the product to dispatch after obtaining the clearance from customer (BHARAT SANCHAR NIGAM LTD.) quality assurance wherever applicable. It is a department that is used for checking purpose of the final product before the dispatch according to the customer demand.
WORKING PROCESS:
There are various working processes that are used: 1)
Offe Offeri ring ng of equi equipm pmen entt by by pro produ duct ctio ion n to to pur purch chas asee ord order er
2)
Visu Visual al insp inspec ecti tion on by qual qualit ity y assu assura ranc ncee off offic icer er
3)
Func Functi tion onal al inspe nspect ctio ion n by by qua quallity ity ass assur uran ance ce
4)
Offe Offeri ring ng of of equ equip ipme ment nt by qual qualit ity y ass assur uran ance ce to to BSN BSNL L or or MTNL MTNL
5)
Release th the in inspection ce certi rtificate
6)
Disp Dispat atch ch the the mat mater eria iall to to the the site site by sell sellss & sett settin ing g dep depar artm tmen entt
7)
Real Realiz izat atio ion n of of fin finan ance ce bill bill by sell sellss dep depar artm tmen entt
QUALITY ASSURANCE TESTING:
The quality assurance shall carry out 100% administration check and card visual check on sample as per sample plan level (iii) on the cards taken from two of the racks of the lot as per sample plan level (iii). For logic test, AQL is 0.65% and for analogic test, AQL is 1.0%.
RETESTING:
If the lot is successfully passes all the above tests then the lot is offered to DOT (Department Of Telephone). Quality assurances along with the reports received from from SEA plant plant and the reports reports regener regenerate ated d during during the qualit quality y assuran assurances ces checks along with LEQ.
BSNL QUALITY ASSURANCES TESTING:
The BSNL quality assurance carries out the following checks before acceptance & issuing clearance for dispatch. 100% administration checks of 2 racks picked up from the lot after
removing the wrapping remaining racks are checked without the scale /wrapping. One of the two racks is subjected to rack visual check.
Visual checks of cards are carried out as per the sample plan(III) on samples taken from two racks with 4%AQL(acceptable quality level) for major defects and 10% AQL for minor defects.
Cards in the lots are grouped as logic and analogic cards and samples are
taken for the functional test by cards in card test from the second rack of the lot as per the sample plan. 30% of the rack is subjected to RI test.
MAINTENANCE/EXTENSION MAINTENANCE/EXTENSIO N CARDS/SSC CARDS:
These cards are offered offered by SEA plant after completion completion of 100% administration administration and visual check and 10% of cards are tested in RI test.
These cards are subjected to following checks: 1) Admini Administr strati ation on check check - 100% 100% 2) Visual Visual chec check k on samp sample le basic basic 3) Functi Functiona onall test test on sample sample basi basicc
Sample plan level (IV): •
AQL (Acceptance Quality Level) - 0.65% logic cards
•
AQL (Acceptance Quality Level) - 1.0% analogic cards
After successful successful completion completion of checks as above, the cards are offered to BSNL Quality assurance department along with report and LEQ.
CONCLUSION
We are living in an information technology age which is rated as “A magical technology which combines the skillful hands with the reasoning minds”.
Because of its very high positive impacts on employment, wages, labour skills, productivity and research, IT is treated as a strategic industry. Information is the basic resource in today’s society. Information technologies in modern computer based information systems are once again being portrayed as measure force for organizational and managerial changes. A centralized computer system would process all the data for an organization, control all of its operation and carry out all the tasks.
Naturally, highly automated system does not require as many people as manual method methods. s. Therefo Therefore, re, there there has been signif significa icant nt reducti reduction on in the number number of people required for performing manual task in the organization.
Know Knowle ledg dgee and and idea ideass are are the the hear heartt of the the deve develo lopm pmen entt proc proces esss and and are are increa increasin singly gly over over shadow shadowing ing the natural natural resource resource base base becaus becausee knowle knowledge dge generation and information processing are at the roots of new productivity. IT based processes enhanced countries access to global knowledge, market and capital.
“TOOL L FOR FOR RF PLAN PLANNI NING NG AND AND DESI DESIGN GN FOR FOR GS GSM” M” is a Thus, “TOO
soft softwa ware re whic which h perf perfor orms ms all all the the abov abovee ment mentio ione ned d acti activi viti ties es in a trai traini ning ng scenario in an effective and efficient manner. It fulfils all the needs perceived by the user.
