p Bcn Rnc Hw Description

Nokia Networks

WCDMA RAN, Rel. RU50 and RU50 EP1, Operating Documentation, Issue 05 Multicontroller RNC Hardware Description DN09116019 Issue 4-0

Multicontroller Multicontroller RNC Hardware Description

The information in this document applies solely to the hardware/software product (“Product”) specified herein, and only as specified herein. This document is intended for use by Nokia Solutions and Networks' customers (“You”) only, and it may not be used except for the purposes defined in the agreement between You and Nokia Solutions and Networks (“Agreement”) under which this document is distributed. No part of this document may be used, copied, reproduced, modified or transmitted in any form or means without the prior written permission of Nokia Solutions and Networks. If you have not entered into an Agreement applicable to the Product, or if that Agreement has expired or has been terminated, You may not use this document in any manner and You are obliged to return it to Nokia Solutions and Networks and destroy or delete any copies thereof. The document has been prepared to be used by professional and properly trained personnel, and You assume full responsibility when using it. Nokia Solutions and Networks welcome Your comments as part of the process of continuous development and improvement of the documentation. This document and its contents are provided as a convenience to You. Any information or statements concerning the suitability, capacity, fitness for purpose or performance of the Product are given solely on an “as is” and “as available” basis in this document, and Nokia Solutions and Networks reserves the right to change any such information and statements without notice. Nokia Solutions and Networks has made all reasonable efforts to ensure that the content of this document is adequate and free of material errors and omissions, and Nokia Solutions and Networks will correct errors that You identify in this document. But, Nokia Solutions and Networks' total liability for any errors in the document is strictly limited to the correction of such error(s). Nokia Solutions and Networks does not warrant that the use of the software in the Product will be uninterrupted or error-free. NO WARRANTY OF ANY KIND, EITHER EXPRESS OR IMPLIED, INCLUDING BUT NOT LIMITED TO ANY WARRANTY OF AVAILABILITY AVAILABILITY,, ACCURACY, ACCURACY, RELIABILITY, RELIABILITY, TITLE, NON-INFRINGEMENT NON-INFRINGEMENT,, MERCHANTABILITY OR FITNESS FOR A PARTICULAR PURPOSE, IS MADE IN RELATION TO THE CONTENT OF THIS DOCUMENT. IN NO EVENT WILL NOKIA SOLUTIONS AND NETWORKS BE LIABLE FOR ANY DAMAGES, INCLUDING BUT NOT LIMITED TO SPECIAL, DIRECT, INDIRECT, INCIDENTAL OR CONSEQUENTIAL OR ANY LOSSES, SUCH AS BUT NOT LIMITED TO LOSS OF PROFIT, REVENUE, BUSINESS INTERRUPTION, BUSINESS OPPORTUNITY OR DATA THAT MAY ARISE FROM THE USE OF THIS DOCUMENT OR THE INFORMATION INFORMATION IN IT, IT, EVEN IN THE CASE OF ERRORS IN OR OMISSIONS FROM THIS DOCUMENT OR ITS CONTENT. This document is Nokia Solutions and Networks’ proprietary and confidential information, which may not be distributed or disclosed to any third parties without the prior written consent of Nokia Solutions and Networks. Nokia is a registered trademark of Nokia Corporation. Other product names mentioned in this document may be trademarks of their respective owners, and they are mentioned for identification purposes only. Copyright © 2015 Nokia Solutions and Networks. All rights reserved.

f

Important Notice on Product Safety This product may present safety risks due to laser, electricity, heat, and other sources of danger. Only trained and qualified personnel may install, operate, maintain or otherwise handle this product and only after having carefully read the safety information applicable to this product. The safety information is provided in the Safety Information section in the “Legal, Safety and Environmental Information” part of this document or documentation set.

Nokia Solutions and Networks is continually striving to reduce the adverse environmental effects of its products and services. We would like to encourage you as our customers and users to join us in working towards a cleaner, safer environment. Please recycle product packaging and follow the recommendations for power use and proper disposal of our products and their components. If you should have questions regarding our Environmental Policy or any of the environmental services we offer, please contact us at Nokia Solutions and Networks for any additional information.

2

DN09116019

Issue: 4-0


The information in this document applies solely to the hardware/software product (“Product”) specified herein, and only as specified herein. This document is intended for use by Nokia Solutions and Networks' customers (“You”) only, and it may not be used except for the purposes defined in the agreement between You and Nokia Solutions and Networks (“Agreement”) under which this document is distributed. No part of this document may be used, copied, reproduced, modified or transmitted in any form or means without the prior written permission of Nokia Solutions and Networks. If you have not entered into an Agreement applicable to the Product, or if that Agreement has expired or has been terminated, You may not use this document in any manner and You are obliged to return it to Nokia Solutions and Networks and destroy or delete any copies thereof. The document has been prepared to be used by professional and properly trained personnel, and You assume full responsibility when using it. Nokia Solutions and Networks welcome Your comments as part of the process of continuous development and improvement of the documentation. This document and its contents are provided as a convenience to You. Any information or statements concerning the suitability, capacity, fitness for purpose or performance of the Product are given solely on an “as is” and “as available” basis in this document, and Nokia Solutions and Networks reserves the right to change any such information and statements without notice. Nokia Solutions and Networks has made all reasonable efforts to ensure that the content of this document is adequate and free of material errors and omissions, and Nokia Solutions and Networks will correct errors that You identify in this document. But, Nokia Solutions and Networks' total liability for any errors in the document is strictly limited to the correction of such error(s). Nokia Solutions and Networks does not warrant that the use of the software in the Product will be uninterrupted or error-free. NO WARRANTY OF ANY KIND, EITHER EXPRESS OR IMPLIED, INCLUDING BUT NOT LIMITED TO ANY WARRANTY OF AVAILABILITY AVAILABILITY,, ACCURACY, ACCURACY, RELIABILITY, RELIABILITY, TITLE, NON-INFRINGEMENT NON-INFRINGEMENT,, MERCHANTABILITY OR FITNESS FOR A PARTICULAR PURPOSE, IS MADE IN RELATION TO THE CONTENT OF THIS DOCUMENT. IN NO EVENT WILL NOKIA SOLUTIONS AND NETWORKS BE LIABLE FOR ANY DAMAGES, INCLUDING BUT NOT LIMITED TO SPECIAL, DIRECT, INDIRECT, INCIDENTAL OR CONSEQUENTIAL OR ANY LOSSES, SUCH AS BUT NOT LIMITED TO LOSS OF PROFIT, REVENUE, BUSINESS INTERRUPTION, BUSINESS OPPORTUNITY OR DATA THAT MAY ARISE FROM THE USE OF THIS DOCUMENT OR THE INFORMATION INFORMATION IN IT, IT, EVEN IN THE CASE OF ERRORS IN OR OMISSIONS FROM THIS DOCUMENT OR ITS CONTENT. This document is Nokia Solutions and Networks’ proprietary and confidential information, which may not be distributed or disclosed to any third parties without the prior written consent of Nokia Solutions and Networks. Nokia is a registered trademark of Nokia Corporation. Other product names mentioned in this document may be trademarks of their respective owners, and they are mentioned for identification purposes only. Copyright © 2015 Nokia Solutions and Networks. All rights reserved.

f

Important Notice on Product Safety This product may present safety risks due to laser, electricity, heat, and other sources of danger. Only trained and qualified personnel may install, operate, maintain or otherwise handle this product and only after having carefully read the safety information applicable to this product. The safety information is provided in the Safety Information section in the “Legal, Safety and Environmental Information” part of this document or documentation set.

Nokia Solutions and Networks is continually striving to reduce the adverse environmental effects of its products and services. We would like to encourage you as our customers and users to join us in working towards a cleaner, safer environment. Please recycle product packaging and follow the recommendations for power use and proper disposal of our products and their components. If you should have questions regarding our Environmental Policy or any of the environmental services we offer, please contact us at Nokia Solutions and Networks for any additional information.

2

DN09116019

Issue: 4-0


Table of Contents This document This document has 57 pages 1 2

Issue: 4-0

Summ Su mmar aryy of ch chan ange ges. s... .... .... .... .... .... ..... ..... .... .... .... .... .... .... .... .... .... ..... ..... .... .... .... .... .... .... .... .... .... ..... ..... .... .... .... 7

Introduction.................................................................................... 8 8

3

Over Ov ervi view ew of BC BCN N mo modu dule le... ..... .... .... .... .... .... .... .... .... .... ..... ..... .... .... .... .... .... .... .... .... .... ..... ..... .... .... .... .... .... ....9 ..9

4 4.1 4.22 4. 4.2. 4. 2.11 4.2.2 4.3 4.44 4. 4.5 4.66 4. 4.7 4.8 4.99 4.

BCN hardware architecture.......................................................... architecture..........................................................111 BCN general architecture............................................................. architecture.............................................................111 Ethe Et hern rnet et sw swititch ch do doma main in an andd Et Ethe hern rnet et in inte terf rfac acin ing.. g.... .... .... .... .... .... .... ..... ..... .... ....1 ..122 Phys Ph ysic ical al st stru ruct ctur uree of th thee Et Ethe hern rnet et sw swititch ch do doma main in.. .... .... .... .... .... .... .... ..... ..... .... .... 12 External Ethernet interfaces......................................................... interfaces.........................................................13 13 Hard disk controller...................................................................... controller......................................................................13 13 USB US B in inte terf rfac ace. e... .... .... .... .... .... .... .... .... .... .... ..... ..... .... .... .... .... .... .... .... .... .... ..... ..... .... .... .... .... .... .... .... .... .... ..... ..... .... .... .... 14 Console access to add-in card proce processors.................................. ssors.................................. 14 Exte Ex tern rnal al al alar arm m in inte terf rfac ace. e... .... .... .... ..... ..... .... .... .... .... .... .... .... .... .... ..... ..... .... .... .... .... .... .... .... .... .... ..... ..... .... .... 14 Synchronizationn interface............................................................. Synchronizatio interface.............................................................15 15 Add-in card architecture and interfac interfacing...................................... ing...................................... 15 AMC AM C in inte terfa rfaci cing ng.. .... .... .... .... ..... ..... .... .... .... .... .... .... .... .... .... ..... ..... .... .... .... .... .... .... .... .... .... ..... ..... .... .... .... .... .... .... .... ...16 .16

5 5.1 5.2 5.33 5.

Hardware managem management................................................................ ent................................................................18 18 Hardware management at BCN mod module ule level..............................18 Hardware management at network element level........................19 Difffe Di fere renc nces es be betw twee eenn cR cRNC NC an andd mc mcRN RNC C Ha Hard rdwa ware re ma mana nage geme ment nt.. .... 20

6 6.1 6.22 6. 6.33 6.

Introd Intr oduc ucin ingg th thee Mu Multltic icon ontr trol olle lerr RN RNC. C... .... .... .... .... .... .... .... .... .... .... .... .... .... .... .... .... .... .... .... .... .... .. 25 Overview of the Multicontrolle Multicontrollerr RNC ........................................... 25 Multltic Mu icon ontr trol olle lerr RN RNC C ar arch chititec ectu ture re an andd bl bloc ockk di diag agra ram m .. .... .... .... .... .... .... .... .... ...25 .25 Redu Re dund ndan ancy cy pr prin inci cipl ples es... ..... .... .... .... .... .... .... .... .... ..... ..... .... .... .... .... .... .... .... .... .... ..... ..... .... .... .... .... .... .... .... ....26 ..26

7

Tec echn hnic ical al sp spec ecifific icat atio ions ns,, Mu Multltic icon ontr trol olle lerr RN RNC C ha hard rdwa ware re.. .... .... .... .... .... .... .. 27

8 8.11 8. 8.22 8. 8.33 8. 8.44 8. 8.55 8. 8.66 8.

Multic Mult icon ontr trol olle lerr RN RNC C fu func nctition onal al un unitits.. s.... .... .... ..... ..... .... .... .... .... .... .... .... .... .... ..... ..... .... .... .... .... .... 29 Multltic Mu icon ontr trol olle lerr RN RNC C fu func nctition onal al un unitits.. s.... .... .... ..... ..... .... .... .... .... .... .... .... .... .... ..... ..... .... .... .... .... .... 29 Cellll Sp Ce Spec ecifific ic Pr Proc oces essi sing ng Un Unitit (C (CSP SPU). U)... ..... ..... .... .... .... .... .... .... .... .... .... ..... ..... .... .... .... .... .... ...29 .29 Cent Ce ntra ralilize zedd Fu Func nctition onss Pr Proc oces essi sing ng Un Unitit (C (CFP FPU). U)... .... .... .... .... .... ..... ..... .... .... .... .... .... 30 Exte Ex tern rnal al In Inte terf rfac acee Pr Proc oces essi sing ng Un Unitit(E (EIP IPU). U)... .... .... .... .... .... .... .... .... .... ..... ..... .... .... .... .... .... .. 30 Ethe Et hern rnet et Sw Swititch chin ing. g... .... .... .... .... .... .... .... ..... ..... .... .... .... .... .... .... .... .... .... ..... ..... .... .... .... .... .... .... .... .... .... ..... ..... .... .... 30 User Us er Eq Equi uipm pmen entt Sp Spec ecifific ic Pr Proc oces essi sing ng Un Unitit (U (USP SPU) U) .. .... .... .... .... .... .... .... .... .... .... 30

9 9.11 9. 9.22 9.

Multic Mult icon ontr trol olle lerr RN RNC C ne netw twor orkk in inte terfa rface ces. s.... ..... .... .... .... .... .... .... .... .... .... ..... ..... .... .... .... .... .... ...31 .31 Giga Gi gabi bitt Et Ethe hern rnet et in inte terf rfac ace. e... .... .... .... ..... ..... .... .... .... .... .... .... .... .... .... ..... ..... .... .... .... .... .... .... .... .... ..... ..... .... .. 32 Back Ba ckpl plan anee in inte terf rfac ace. e.... ..... .... .... .... .... .... .... .... .... ..... ..... .... .... .... .... .... .... .... .... .... ..... ..... .... .... .... .... .... .... .... .... .... ....3 ..322

10

Conf Co nfig igur urat atio ions ns an andd di dime mens nsio ioni ning ng.. ..... ..... .... .... .... .... .... .... .... .... .... ..... ..... .... .... .... .... .... .... .... .... .... ...33 .33

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4

10.1 10.1 10.2 10 .2 10.2. 10 .2.11 10.2. 10 .2.22 10.2. 10 .2.33

Genera Gene rall ab abou outt Mu Multltic icon ontr trol olle lerr RN RNC C co conf nfig igur urat atio ions ns.. ..... ..... .... .... .... .... .... .... .... ....33 ..33 Multltic Mu icon ontr trol olle lerr RN RNC C ca capa paci city ty st step eps.. s.... .... .... .... .... .... .... .... ..... ..... .... .... .... .... .... .... .... .... .... ..... ..... .. 34 Multi Mu lticon contro trolle llerr RNC cap capaci acity ty ste stepp 1.. 1..... ...... ...... ....... ....... ...... ...... ...... ...... ...... ....... ....... ...... ..... .. 34 Multi Mu lticon contro trolle llerr RNC cap capaci acity ty ste stepp 3.. 3..... ...... ...... ....... ....... ...... ...... ...... ...... ...... ....... ....... ...... ..... .. 35 Multi Mu lticon contro trolle llerr RNC cap capaci acity ty ste stepp 7.. 7..... ...... ...... ....... ....... ...... ...... ...... ...... ...... ....... ....... ...... ..... .. 36

11

Power distribution principles........................................................ 38 38

12

Mech Me chan anic icss an andd el elec ectr trom omec echa hani nics cs.. .... .... .... .... ..... ..... .... .... .... .... .... .... .... .... .... ..... ..... .... .... .... .... ....40 ..40

13 13.1

Cabinet and related items............................................................ items............................................................41 41 CAB216-A cabinet frame............................................................. 41 41

14 14.1 14 .1 14.1.11 14.1. 14.1.1. 14.1. 1.11 14.1.22 14.1. 14.1.33 14.1. 14.1.3. 14.1. 3.11 14.2 14 .2 14.2.11 14.2. 14.2. 14 .2.22 14.3 14.3. 14 .3.11 14.3.22 14.3. 14.3. 14 .3.33 14.3 14 .3.4 .4 14.4 14 .4 14.4.11 14.4. 14.4. 14 .4.22 14.5 14.5.11 14.5. 14.5. 14 .5.22

Hardware items ........................................................................... ...........................................................................43 43 Add-in Add -in car cards. ds..... ....... ...... ...... ...... ...... ...... ...... ....... ....... ...... ...... ...... ...... ...... ....... ....... ...... ...... ...... ...... ...... ....... ....... ...... ..... 43 Proces Pro cessor sor ad add-i d-inn car cardd (BO (BOC-A C-A)... )...... ...... ...... ...... ...... ...... ...... ....... ....... ...... ...... ...... ...... ...... ....... ......43 Memor oryy module fo forr BO BOC C-A pro roce cess ssoor add-in card (BDM2G-A)...... 43 Add-in Add -in fil fille lerr car cardd (BF (BFC-A C-A)... )...... ...... ....... ....... ...... ...... ...... ...... ...... ....... ....... ...... ...... ...... ...... ...... ....... ....... ..... 43 Proces Pro cessor sor ad add-i d-inn car cardd (BM (BMPP2 PP2-B). -B).... ...... ...... ....... ....... ...... ...... ...... ...... ...... ....... ....... ...... ...... ..... ..44 44 Memor oryy module fo forr BM BMP PP2 pro roce cess ssoor add-in card..................... 45 AMC.... AMC ....... ...... ...... ...... ...... ...... ....... ....... ...... ...... ...... ...... ...... ...... ....... ....... ...... ...... ...... ...... ...... ....... ....... ...... ...... ...... ...... ...... ..... .. 45 Hard disk drive carrier AMC (HDSAM-A).....................................45 BCN AM AMC C fil filler ler (AM (AMCSF CSF-A). -A).... ...... ...... ...... ...... ...... ....... ....... ...... ...... ...... ...... ...... ....... ....... ...... ...... ...... ... 46 Power supply and distribution units.............................................. units..............................................47 47 AC po power wer dis distri tribu butio tionn uni unitt (BA (BAPDU PDU-A). -A)..... ....... ...... ...... ...... ...... ...... ...... ....... ....... ...... ...... .....47 ..47 DC power distri ribbution unit (BDPDU-A)........................................ 48 AC po power wer sup suppl plyy uni unit, t, var varia iant nt B (BA (BAFEFE-B).. B)..... ...... ...... ...... ....... ....... ...... ...... ...... ...... .....49 ..49 DC po powe werr su supp pply ly un unitit,, va vari rian antt B (B (BDF DFEE-B). B)... .... ..... ..... .... .... .... .... .... .... .... .... .... ..... ..... .... 50 Fann un Fa units its and air fil filter ter .... ....... ...... ...... ...... ...... ...... ....... ....... ...... ...... ...... ...... ...... ....... ....... ...... ...... ...... ...... ......52 ...52 Air fil filter ter (BA (BAFIFI-A). A)..... ....... ...... ...... ...... ...... ...... ....... ....... ...... ...... ...... ...... ...... ....... ....... ...... ...... ...... ...... ...... ...... ....... ....52 52 Main Ma in fan (BM (BMFUFU-A/ A/ BM BMFUFU-B).. B)..... ...... ...... ...... ....... ....... ...... ...... ...... ...... ...... ....... ....... ...... ...... ...... ..... .. 52 BCN installation kit ...................................................................... ......................................................................53 53 BCN ins instal tallat latio ionn kit - BIK BIK21 216-A 6-A... ....... ....... ...... ...... ...... ...... ...... ...... ....... ....... ...... ...... ...... ...... ...... ..... .. 53 53 BCN ins instal tallat latio ionn kit - BIK BIKG1 G1-A.. -A..... ...... ...... ....... ....... ...... ...... ...... ...... ...... ....... ....... ...... ...... ...... ...... .....54 ..54

15

Over Ov ervi view ew of ca cabl blin ingg in BC BCN. N... .... .... .... ..... ..... .... .... .... .... .... .... .... .... .... ..... ..... .... .... .... .... .... .... .... .... .... .... .. 55

16

SFP SF P an andd SF SFP+ P+ tr tran ansc scei eive vers. rs... .... .... .... .... .... .... ..... ..... .... .... .... .... .... .... .... .... .... ..... ..... .... .... .... .... .... .... ....57 ..57

DN09116019

Issue: 4-0


List of Figures Figure 1 Figure Figure 2 Figure 3 Figure Figu re 4 Figure 5 Figure 6 Figure Figu re 7 Figu igure re 8 Figu igure re 9 Figure Figu re 10 10 Figure 11 Figure Figu re 12 Figure 13 Figure 14 Figure Figu re 15 Figure 16 Figure 17 Figure 18 Figure 19 Figure Figu re 20 20 Figure 21 Figure 22 Figure Figu re 23 Figure 24 Figure Figu re 25 Figure Figu re 26 Figure Figu re 27 Figure Figu re 28 28 Figure Figu re 29 Figure Figu re 30 Figure Figu re 31

Issue: 4-0

BCN mod module ule (BCN-B (BCN-B)...... )............ ............. ............. ............ ............ ............. ............. ............ ............ ............. .............9 ......9 Back side of the BCN modu module.... le.......... ............ ............ ............. ............. ............ ............. ............. ............ ......... ...99 BCN hard hardware ware arch architect itecture.. ure........ ............ ............. ............. ............ ............ ............. ............. ............ ............ ...... 11 11 SAS cross cross-shar -sharing ing conn connectio ectionn betw between een two BCN mod modules. ules........ ............. ........ 14 Add-in Addin card conn connectiv ectivity... ity.......... ............. ............ ............. ............. ............ ............ ............. ............. ............ ......... ... 16 16 AMC bay conn connecti ectivity... vity......... ............ ............ ............. ............. ............ ............ ............. ............. ............ ............. .........17 Hardware Hard ware mana managem gement.. ent........ ............ ............. ............. ............ ............ ............. ............. ............ ............ ............ ......18 18 Networ Net work-e k-elem lemen ent-l t-leve evell har hardwa dware re ma mana nagg ement..................................20 Multi Mu lticon contro trolle llerr RNC mod module ule Arc Archit hitect ecture ure........................................... ........................................... 25 Example Exam ple of the the phys physical ical loca location tion of the the proce processing ssing unit unitss within within one module................................................................................................29 Frontt pan Fron panel el of the Mult Multicon icontroll troller er RNC m odule ................................. 31 Multicon Mult icontroll troller er RNC Capa Capacity city step steps...... s............ ............ ............. ............. ............ ............ ............. .........33 ..33 Multicon Mult icontroll troller er RNC capa capacity city Step 1..... 1........... ............ ............. ............. ............ ............. ............. ........ ..34 34 Multicon Mult icontroll troller er RNC capa capacity city Step 3..... 3........... ............ ............. ............. ............ ............. ............. ........ ..35 35 Multicon Mult icontroll troller er RNC capa capacity city Step 7..... 7........... ............ ............. ............. ............ ............. ............. ........36 ..36 Powerr distr Powe distribut ibution ion with PDUs.. PDUs........ ............ ............. ............. ............ ............ ............. ............. ............ ......... ...38 38 Powerr distr Powe distribut ibution ion with without out PDUs. PDUs....... ............. ............. ............ ............ ............. ............. ............ ........... .....39 39 CAB216-A CAB2 16-A cabi cabinet net fram framee (emp (empty ty and fully equipped with eight BCN modules and two PDUs).....................................................................41 PDUs).....................................................................41 Processor Proce ssor add add-in -in card (BOC (BOC-A).... -A).......... ............ ............ ............. ............. ............ ............. ............. .......... ....43 43 Add-in Addin fille fillerr card card (BFC(BFC-A).... A)........... ............. ............ ............ ............. ............. ............ ............. ............. ............ ...... 44 Processor Proce ssor add add-in -in card BMPP BMPP2-B... 2-B......... ............ ............. ............. ............ ............ ............. ............. ......... ...45 45 Hard disk drive carri carrier er AMC (HDSA (HDSAM-A) M-A)........................................... ........................................... 46 AMC fille fillerr (AMCS (AMCSF-A).. F-A)........ ............ ............. ............. ............ ............ ............. ............. ............ ............. ............. ........ 47 AC PDU (BAPD (BAPDU-A)... U-A)......... ............ ............ ............. ............. ............ ............. ............. ............ ............ ............. .......... ...48 48 DC PDU (BDPD (BDPDU-A).. U-A)........ ............. ............. ............ ............ ............. ............. ............ ............ ............. ............. ......... ... 48 AC PSU (BAF (BAFE-B).. E-B)......... ............. ............ ............ ............. ............. ............ ............. ............. ............ ............ .............49 .......49 DC PSU (BDFE (BDFE-B).... -B).......... ............ ............. ............. ............ ............ ............. ............. ............ ............ ............. ........... .... 51 Air filte filterr (BAFI-A (BAFI-A)...... )............ ............ ............. ............. ............ ............ ............. ............. ............ ............ ............. ............ ..... 52 Main fan (BMF (BMFU-A)... U-A)......... ............ ............ ............. ............. ............ ............. ............. ............ ............ ............. ............53 .....53 BIK216-A BIK2 16-A....... ............. ............ ............ ............. ............. ............ ............. ............. ............ ............ ............. ............. ............ .......... .... 53 BIKG1-A.. BIKG 1-A........ ............. ............. ............ ............ ............. ............. ............ ............. ............. ............ ............ ............. ............. ......... ... 54

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Multicontroller RNC Hardware Description

List of Tables Table 1 Table 2 Table 3 Table 4 Table 5 Table 6 Table 7 Table 8 Table 9 Table 10 Table 11 Table 12 Table 13 Table 14 Table 15 Table 16 Table 17 Table 18 Table 19 Table 20 Table 21 Table 22

6

BCN module technical data.................................................................. 9 BCN module front panel indicator LEDs.............................................10 HDD Difference/comparison table for mcRNC and cRNC..................20 Multicontroller RNC redundancy models............................................26 1GE interface specifications for external interfaces........................... 32 10GE interface specifications for external interfaces......................... 32 CAB216-A cabinet frame technical data.............................................42 BOC-A dimensions and weight...........................................................43 BFC-A dimensions and weight........................................................... 44 BMPP2-B dimensions and weight......................................................45 HDSAM-A dimensions and weight..................................................... 46 AMCSF-A dimensions and weight......................................................47 BAPDU-A dimensions and weight......................................................48 BDPDU-A dimensions and weight......................................................49 BAFE-B dimensions and weight.........................................................49 BAFE-B LED states............................................................................49 BDFE-B dimensions and weight.........................................................51 BDFE-B LED states............................................................................51 BAFI-A dimensions and weight.......................................................... 52 BMFU-A dimensions and weight........................................................ 53 Internal cables in the BCN system..................................................... 55 SFP and SFP+ transceivers...............................................................57

DN09116019

Issue: 4-0


Summary of changes

1 Summary of changes Changes between document issues are cumulative. Therefore, the latest document issue contains all changes made to previous issues. Changes between issues 4-0 and 3-3 Table HDD Difference/comparison table for mcRNC and cRNC has been added. Chapter Multicontroller RNC capacity step 7 has been added. BCN AMC filler BAMF-A has been replaced with AMCSF-A. Changes between issues 3-3 and 3-2 Section Technical specifications was updated with the following sentence: Maximum per cabinet 2190W (with 4 modules). Information about 2 DIMM equipping was removed from section Memory module for BMPP2-B processor add-in card.

Changes between issues 3-2 and 3-1 Updates made to reflect the new NSN brand and company name, hardware graphics updated accordingly. Chapter BCN installation kit - BIKG1-A has been added.

Issue: 4-0

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Introduction


2 Introduction This document serves as an introduction to the Box Controller Node (BCN) and the Multicontroller RNC hardware architecture and hardware parts - enclosure, power supply modules, fans, motherboard, processor add-in cards, and Advanced Mezzanine Cards (AMCs). The BCN is a generic, scalable hardware platform suitable for implementing a wide range of processing-intensive products serving as controller-, gateway- or server-type entities in telecommunication networks. Although the network context varies, the products have much in common so that a common hardware platform is viable. Network elements can consist of one BCN module (small network elements) or several BCN modules (large network elements with large processing power requirements). Availability requirements have a strong impact on the BCN module hardware configuration and interconnection solutions. The power feed operates in load-sharing mode and the BCN module is operational even if one of the power supply modules breaks down. Processors within a BCN module are independent of each other so that a faulty processor has no effect on the performance of the rest of the module.

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Overview of BCN module

3 Overview of BCN module The BCN (BCN-B) module contains a motherboard and houses add-in cards and AMCs. It also provides power feed, cooling and hardware management functions. Figure 1

BCN module (BCN-B)

Figure 2

Back side of the BCN module

Table 1

BCN module technical data

Dimensions (H x W x D)

178 mm (4U) x 444 mm x 450 mm

Weight

Fully equipped: Approx. 25-30 kg (depends on the configuration)

Issue: 4-0

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Overview of BCN module


BCN module front panel indicator LEDs The BCN module front panel contains the following indicator LEDs: Table 2

BCN module front panel indicator LEDs

Symbol and name

Color

State

Description

Application-specific LEDs

Green

Steady or blinking

Red

Steady or blinking

Two tri-color, application specific LEDs are controlled (color, state, blink) through an IPMI command.

A1 and A2

Blue

Steady or blinking

Off PSU indicator LED

NS LED

During module startup both LEDs will indicate the start (BLUE) and completion (GREEN) of LMP’s boot sequence. After a successful boot-up, LEDs will remain green and user control is enabled.

Green

Steady

Both power supplies operate normally.

Red

Steady

One of the power supplies has failed.

Off

Power is off.

Blue

Steady

Off

Reserved for future use. Default state: Off

Processor/add-in card LEDs P1-P8

Green

Steady

mcRNC application has started.

Red

Steady

Processor add-in card is powered on, but application is not running.

Blue

Steady

MMC is running, but the processor is powered off.

Off

No add-in card inserted into the slot.

Eight tri-colour status LEDs for processor add-in cards are controlled by the module management controllers (MMCs) on the add-in cards. In addition, each 10 GigE and 1 GigE interface is associated with a Link/Activity indication LED (ON when the link is on, blinking OFF every time there is some activity) and a Speed indication LED (ON when the port is using its maximum speed, otherwise OFF).

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BCN hardware architecture

4 BCN hardware architecture The BCN module consists of a motherboard, eight processor add-in cards, two AMC bays containing zero, one or two Advanced Mezzanine Cards (AMCs), two power supply units and three dual fans. PCI Express (PCIe) and Ethernet interfaces are used for interconnections within the BCN module.

4.1 BCN general architecture BCN hardware architecture includes the following parts: • • • • • • •

eight add-in cards PCIe switch (for interconnections) local management processor (LMP) virtual carrier management controller (VCMC) Ethernet switch (10 GbE) USB hub (only used for software debugging purposes) two AMC bays

The hardware architecture of the BCN is also illustrated in the following figure: Figure 3


The local management processor (LMP) is a central component on the motherboard and is mainly responsible for the following functions:

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• • • •


hardware management of the BCN (in co-operation with the VCMC) Ethernet switch and interface management offers services for USB mass storage devices acts as console server for providing serial console access to add-in card processors

4.2 Ethernet switch domain and Ethernet interfacing 4.2.1

Physical structure of the Ethernet switch domain Physically, the Ethernet switch domain consists of a main Ethernet switch and an extension Ethernet switch. The main purpose of the extension switch is to break two 10 GigE ports in to several 1 GigE ports be connected to the front panel and AMC modules. •

Ethernet switch domain for BCN-A The main Ethernet switch provides 24 x 10 GigE ports and four 1 GigE ports. The ports are assigned as follows: – – – – – –

Six external 10 GigE (SFP+) interfaces for external cabling and inter-module cabling via the BCN module front panel. Two internal 10 GigE interfaces towards each add-in card. Two internal 10 GigE interfaces towards the extension Ethernet switch One internal 1 GigE interface towards the management Ethernet switch One internal 1 GigE interface (FI) towards AMC bay 2 Two internal 1 GigE interface (BI) towards the AMC bays

The extension Ethernet switch provides two 10 GigE ports and 24 x 1 GigE ports that are assigned as follows: – – –

•

Sixteen external 1 GigE (SFP) interfaces for external cabling via the BCN module front panel. Two internal 10 GigE interfaces towards the main Ethernet switch Eight internal 1 GigE interfaces (FI and BI) towards AMC bays 1 and 2

Ethernet switch domain for BCN-B The main Ethernet switch provides 24 x 10 GigE ports and four 1 GigE ports. The ports are assigned as follows: – – –

g

Seven external 10 GigE (SFP+) interfaces for external cabling and inter-module cabling via the BCN module front panel. One external 1 GigE (SFP) interface port for port mirroring/tracing via the BCN module front panel. Two internal 10 GigE interfaces towards each add-in card. BCN-B slot#1 has 1x 10GigE and 1x 1 GigE.

– – –

Two internal 10 GigE interfaces towards the extension Ethernet switch One internal 1 GigE interface towards the management Ethernet switch One internal 1 GigE interface (FI) towards AMC bay 2

The extension Ethernet switch provides four 10 GigE ports and 24 x 1 GigE ports that are assigned as follows:

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–

g


Two external 10 GigE (SFP+) interfaces for external cabling via the BCN module front panel. These interfaces are 10 GigE only.

– – –

Ten external 1 GigE (SFP) interfaces for external cabling via the BCN module front panel. Two internal 10 GigE interfaces towards the main Ethernet switch Ten internal 1 GigE interfaces towards AMC bays 1 and 2

A BCN module also provides two additional 1 GigE (SFP) interfaces for accessing add-in card slots 1 and 8 for network element management purposes. These ports connect directly to the slots, bypassing the Ethernet switches.

g

4.2.2

Even though there are two 10 GigE and ten 1 GigE external interfaces connecting to the extension Ethernet switch via the front panel, the total aggregate throughput of these interfaces in 20 Gbit/s. This is because the extension Ethernet switch connects to the main Ethernet switch using two 10 GigE interfaces.

External Ethernet interfaces The external Ethernet interfaces are implemented using Small Form-factor Pluggable (SFP/SPF+) modules. The physical connection type and interface connector type depends on the type of SFP module used. The interface could be for instance a 1000Base-T RJ45 copper interface or a 1000Base-SX short-haul fiber interface. The 10 GigE interconnecting is based on more advanced SFP+ modules. At present, there are several types of fiber-based SFP+ modules available. The inter-module cabling can be implemented using direct attach cables, where the SFP+ modules are integrated with the cable. See chapter SFP and SFP+ transceivers for supported SFP and SPF+ modules.

4.3 Hard disk controller The hard disk controller can handle interfacing to up to two Serial Attached SCSI (SAS) or Serial ATA (SATA) -type hard disks - however, in BCN only SAS hard disks are used. Physically, the hard disk drive is equipped in the hard disk drive carrier AMC. It is possible to use SAS cabling to cross-connect hard disks between BCN modules. The SAS cross-connection can be used only for the hard disk drive carrier AMC that is located in the AMC bay 1 of an BCN module.

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Figure 4


SAS cross-sharing connection between two BCN modules

4.4 USB interface The USB interface is used for software downloading in NSN factory.

4.5 Console access to add-in card processors The local management processor (LMP) also performs the function of a console server and provides direct access (for an external PC) to the serial consoles of the add-in card processors for debugging purposes. An external PC is connected to the 1 GigE (1000Base-T) local management port on the BCN module front panel. From the external PC it is possible to establish a Telnet or SSH connection to the LMP. From the LMP the console access connection can be established to UARTs of any of the processor add-in cards.

4.6 External alarm interface The BCN module provides eight external alarm interfaces on two RJ45 connectors in the front panel. The inputs are voltage sensitive. An alarm is activated by closing the alarm circuit with an external switch. Both closing the loop and opening it will generate an IPMI event to the hardware management system.

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The closed loop current of the alarm circuit is 1 mA. Glitches shorter than 10 milliseconds are filtered out. Attention needs to be paid to the contact materials of the switch to prevent contamination of the contact surfaces due to the low current. The alarm inputs are not galvanically isolated in the BCN. When remote external equipment is used to drive the inputs, galvanical isolation (relays, optical isolators) should be used.

4.7 Synchronization interface The BCN module provides two external synchronization interfaces on two RJ45 connectors in the front panel. The BCN module supports natively the following synchronization signals at the synchronization interfaces (both inputs and outputs): • •

E1, 2.048 MHz T1, JT1, 1.544 MHz

The synchronization signal can be extracted from E1/T1/JT1 frames, and also embedded in the frames. Receiving and transmitting a plain, non-framed clock in and out of the BCN is also supported. Both interfaces can be configured separately to use framed or non-framed signals. However, both interfaces must use the same clock frequency: E1/2.048 MHz or T1/JT1/1.544 MHz. With an optional synchronization AMC module (BSAC-A) a wider range of synchronization signals can be used by the BCN module. The use of synchronization AMC is a network-element-specific feature.

4.8 Add-in card architecture and interfacing Up to eight processor add-in cards provide the main processing power of the BCN. The interfacing to the motherboard is independent of the type of add-in card used. Two add-in cards, on slots 1 or 8, can be accessed directly from the BCN module front panel via one of the two optional external 1 GigE management interfaces. Depending on the add-in card type, an add-in card provides networking, TCP acceleration, QoS, compression or digital signal processing features. The connection to the motherboard is via two PCIe connectors: one 16- lane and one single-lane PCIe connector. As shown below, this interfacing provides the following connections: • • • • • •

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Two 10 GigE (XAUI) ports provide connectivity towards the Ethernet switch domain. A four-lane PCIe connection extends towards the PCIe switch for providing hard disk access. IPMB-L interfacing between the module management controller (MMC) on the add-in card and the virtual carrier management controller (VCMC) on the motherboard A 100 Mbit/s Ethernet interface (100Base-T) towards the local management Ethernet switch A serial interface (UART) towards the local management processor (LMP) for enabling serial console operation USB interfacing towards the USB hub (only used for software debugging purposes)

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•


Add-in cards in slots 1 and 8 can be accessed from the BCN module front panel via an external 1 GigE management interface. The management interface is provided by a separated medium access chip that is interconnected to an add-in card via the PCIe interface. Add-in card connectivity

Figure 5

MMC

USB

IPMB-L 1-lane PCIe connector

VCMC

Management Ethernet Switch

LMP

100Base-T

4-lane PCIe

PCIe Switch

16-lane PCIe connector

10 GigE 2

4-lane PCIe

Add-in card

MAC PHY

Ethernet Switch Domain

1 GigE Management Interface

DN0969015

4.9 AMC interfacing Each BCN module contains two Advanced Mezzanine Card (AMC) bays into which midsize, single-width AMCs can be inserted. The AMC connector at the end of the AMC bay is fully compatible with the PICMG AdvancedMC specifications. As shown in figure below, the connector provides the following connections: • • • • • • •

16

Four 1 GigE ports (AMC bay 1) or five 1 GigE ports (AMC bay 2) provide payload connectivity towards the Ethernet switch domain for the fabric interface (FI). One 1 GigE port provides management connectivity towards the Ethernet switch domain for the base interface (BI). A four-lane PCIe connection extends towards the PCIe switch. Serial Attached SCSI (SAS) interfacing is provided towards the hard disk controller. Hard disk cross connect is possible (only from AMC bay 1) via the SAS connector on the BCN module front panel. Interconnecting between the AMCs is available for implementing the update channel. IPMB-L bus provides connectivity between the module management controller (MMC) on the AMC and the virtual carrier management controller (VCMC) on the motherboard.

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AMCs are hot swappable, that is, they can be removed or replaced while the BCN module is powered up and running. The hot-swap procedure is controlled by the module manager. The module manager gives the permission for performing a hot swap by turning on the blue hot-swap LED on the AMC face plate. Despite the fact that the AMC module hot swap is fully supported by the hardware, it may also depend on the application software running in the BCN whether a specific AMC module can be changed while the application is running. Figure 6

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AMC bay connectivity

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Hardware management


5 Hardware management Hardware management in a BCN-based network element takes place both at the BCN module level and network element level.

5.1 Hardware management at BCN module level The central hardware management entity within a BCN module is the module manager. The module manager consists of the virtual carrier management controller (VCMC) and software running on the local management processor (LMP), as shown in the figure below. The interfacing from the VCMC towards the various hardware entities in the BCN module conforms with the Intelligent Platform Management Interface (IPMI) specifications. Figure 7

Hardware management

BCN module includes 8 add-in cards. Each add-in card contains a module management controller (MMC). The MMC is connected to the VCMC via the local intelligent platform management bus (IPMB-L). In a similar fashion, Hard disk AMC can be attached to the BCN module. Again, each AMC contains a module management controller which is connected to the VCMC via the IPMB-L bus.

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Hardware management

Under the control of the VCMC, the MMCs perform hardware management operations on the processor add-in cards and AMCs. The MMCs are connected to the add-in card processors or the AMC processors via a universal asynchronous receiver/transmitter (UART) serial interface. The module manager controls passive hardware parts (power supply units, fans, etc.) via the inter-integrated circuit (I2C) serial bus. It keeps track of all sensors on the motherboard (temperatures, voltages, fan rotation speed) and adjusts the fan rotation speed according to the measured temperature. The module manager also stores all the hardware-related field replaceable unit (FRU) data associated with the BCN module in the FRU inventory, and stores all hardware-related events in a system event log (SEL). The VCMC is connected to the LMP via a UART serial interface.

5.2 Hardware management at network element level Hardware management at the network element level is handled by the system management software (SMS). The network element (consisting of two or more BCN modules) typically contains one active and one standby SMS entity. The network element consists of several BCN modules, the active and standby system manager add-in cards are located in different BCN modules. The reason for selecting add-in cards in these particular slots for running the system manager software is that only these slots offer an external interface (for network element hardware management) via the BCN module front panel. A local management Ethernet switch provides 100 Mbit/s Ethernet connectivity between the system manager and the module manager. This switch is also connected to the main Ethernet switch domain, so that the system manager in one BCN module can access a module manager located in another BCN module via external inter-module Ethernet cabling. The signalling traffic between the system manager and module manager consists of IPMI commands encapsulated in Remote Management Control Protocol (RMCP) messages. The local management Ethernet switch also provides external 1 GigE access via the BCN module front panel.

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Hardware management


Figure 8

Network-element-level hardware management

User Interface

Ethernet Switch System Manager (active)

Module Manager

IPMB-L

LMP + VCMC

Add-in Card

MMC

Add-in card or AMC

Ethernet

BCN Module 1

Ethernet Switch System Manager (standby)

Module Manager

LMP + VCMC

Add-in Card

IPMB-L

MMC

Add-in card or AMC

BCN Module 2 DN0969066

Within a certain BCN module, the module manager stores all the hardware-related field replaceable unit (FRU) data in an electrically erasable programmable read-only memory (EEPROM). It is possible for the user - via the user interface to the system manager - to read and modify this data. It is possible, for instance, to modify the thresholds for thermal and voltage sensors.

5.3 Differences between cRNC and mcRNC Hardware management √: It means this feature is supported in this product; Χ: It means this feature is not supported in this product; —: It means this feature is not related with this product; Table 3

HDD Difference/comparison table for mcRNC and cRNC

Feature Difference

cRNC

Hard Functional unit √ disk state state manage ment

20

cRNC Description

mcRNC

Hard disk is configured Χ as WDU which is a functional unit and has recovery state. Recovery system handles the state of WDU and does recovery action for them. User can use IHI::WDU to show WDU state and

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mcRNC Description

The state of Hard disk is related with state of CFPU [external] If a hard disk is faulty, alarm 70359 (HARD DISK DRIVE FAILURE) will be reported and the related CFPU node will be out of use.

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Table 3

Hardware management

HDD Difference/comparison table for mcRNC and cRNC (Cont.)

Feature Difference

cRNC

cRNC Description

mcRNC

mcRNC Description

IHE to change the state. The main state of WDU can be WO, BL, TE or SE. USB memory stick is configured as FDU and can be used to make fallback package. SCSI bus is also configured as SCSI-x.

Hard disk access

Plug-in unit state

√

In mcRNC document, √ the term of add-in card is used to instead of plug-in unit. SCLI command “show hardware inventory list brief” is used to show add-in card state. The unit type of disk is HDSAM-A, hardware entity name is AMC-1 or AMC-2.

In mcRNC document, the term of add-in card is used to instead of plug-in unit. SCLI command “show hardware inventory list brief” is used to show add-in card state. The unit type of disk is HDSAM-A, hardware entity name is AMC-1 or AMC-2.

File system

√

The two disks are √ mounted in WO OMU which provides a unified file system to SP OMU and other units.

The two disks are mounted separately in two CFPU nodes. Each CFPU node has only access to the relevant disk in the same box. Each CFPU node has independent file system. The other nodes access file system via NFS. The disk are split to several partitions, each partition has fixed space. If free space of a partition < 10%, alarm 70158(FILE SYSTEM USAGE OVER LIMIT) will be reported. The other partitions will not be affected when one partition is full.

The content of whole disk is synchronized by software raid in real time.

The content of disk is synchronized in real time via network. But not all partitions are synchronized between two disks. The nonsynchronized partition

Disk √ synchronizatio n

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√

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Hardware management


Table 3


Feature Difference

cRNC

cRNC Description

mcRNC

mcRNC Description

may have different contents from the another disk. e.g /root, /mnt/backup, /var/log are non-synchronized partition. The following partitions are DRBD partitions which will be synced between two disks. It is suggested to use DRBD partitions if customer wants to save files with redundancy. /home /tmp/rshell/home /srv/Log /tmp/rshell/log /tmp/rshell/crash /var/opt/nokiasiemens/S S_AlLightProcessor/Alar mFileSystem /var/opt/nokiasiemens/S S_ILOMU /mnt/cmf /mnt/LDAPUserInfo /mnt/mstate /var/opt/nokiasiemens/S S_CLM /var/opt/nokiasiemens/S S_BPAlarms /var/opt/nokiasiemens/S S_PM9 /var/opt/nokiasiemens/ft p/ne3suser/schedules /var/opt/nokiasiemens/ft p/ne3suser/results Out of √ synchronizatio n handling

22

System will synchronize √ the disks automatically when the disks are found to be out-of-sync.

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Which operation will cause DOOS? In the situation that configuration changes during secondary node is faulty, the configuration will be only saved to one disk. This situation will cause DOOS. Alarm 70303 will be reported when secondary CFPU boots up. Alarm 70303 (CLUSTER MANAGEMENT NODE DISK OUT OF SYNC) need to be handled

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Table 3

Hardware management


Feature Difference

cRNC

cRNC Description

mcRNC

mcRNC Description

manually. The alarm manual descripts how to get the disks in sync. Hard Health status disk checking diagnos tic

√

User can check the Χ recovery state of disk to obtain the health status. The state of WO-EX show health status is ok.

An open source tool smartctl can be used to check status. e.g smartctl --health /dev/sda will show the health status of one disk. In order to check the other disk, user need to login the other CFPU node via SSH and execute the same command to check other disk. Root access needed.

√

MML command UDD is Χ used to do hard disk diagnostic. Recovery system will do diagnostic automatically in a situation where disk problem is found.

An open source tool smartctl can be used to do diagnostic. e.g. smartctl –test=long /dev/sda will do diagnostic for one of disks. In order to check the other disk, user needs to login the other CFPU node via SSH and execute the same command to check other disk. The execution time may one or several hours depending on disk load. System will not trigger disk diagnostic automatically.

Hard disk alarms

√

Some of hard disk related alarms will trigger WDU state changing. Recovery system will do some recovery action such as monitoring and diagnostic for WDU automatically.

√

Disk has no state, disk related alarms will not trigger state change. No automatic recovery action for hard disk. User needs to take recovery action manually.

Hard disk replace ment

√

Hard disk replacement

√

Before replacing disk, the relevant CFPU node needs to be shutdown firstly. During the time of

Diagnostic

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Hardware management


Table 3


Feature Difference

cRNC

cRNC Description

mcRNC

mcRNC Description

disk replacement, all the services are provided by the remaining operational CFPU node, this situation will not affect on services but only make the hot or cold a/s RGs deployed in CFPU non-redundant while one CFPU node is out of use Document: DN09109953

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Introducing the Multicontroller RNC

6 Introducing the Multicontroller RNC 6.1 Overview of the Multicontroller RNC The Multicontroller RNC is based on the new Multicontroller Platform that is highly optimised for the IP network environment and reduces the operator’s total cost of ownership. The main function of the Multicontroller RNC is to control and manage the radio access network (RAN) and the radio channels. The Multicontroller RNC is designed for efficient use of radio resources and easy installation, operation and maintenance. The Multicontroller RNC complies with the latest 3GPP and other relevant standards. A Multi-controller module is tightly integrated and has only a few field-replaceable parts. The key enablers of this approach are IP/Ethernet technology and advanced CPU technology. These simplify network element architecture especially when IP proliferates in mobile networks.The available radio spectrum is utilised efficiently to optimise the inter-related cell coverage, cell capacity and service quality aspects according to network planning and end-user experience targets.

6.2 Multicontroller RNC architecture and block diagram The Multicontroller RNC is designed with a modular software and hardware structure, which enables a distributed processing architecture. The distribution of processes is achieved by using a multi-processor system in which the functions of Multicontroller RNC are divided among several functional entities, called functional units. The following figure presents the block diagram of the Multicontroller RNC: Figure 9

Multicontroller RNC module Architecture storage

CFPU (2N) E G h 1 c t x i 6 w 1 S E t G e 0 n 1 E r e x G h 0 t 8 1 E x 6 + N S

h c t i E w S G 0 t 1 e x n r 8 e h t E l a n r e t n I

CSPU (N+M)

USPU (SN+)

EIPU (1+1...N+1) DN0952768

The block diagram of Multicontroller RNC shows the interfaces between the functional units and the interfacecs that connect the system to the environment. The hardware of the functional units and the tasks of each unit are described in more detail in the section Multicontroller RNC Functional Units .

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Introducing the Multicontroller RNC


6.3 Redundancy principles All the crucial parts of the Multicontroller RNC have been backed up to ensure the reliability of the system's operations. The various redundancy principles are described in the sections below. Redundancy of the functional units Different redundancy techniques are used for backing up the different types of functional units. 2N redundancy means that there is always one spare unit available to take over the tasks of a faulty unit. N+1 or N+1/L means that the workload is shared between all devices, and if one malfunctions, the other units are able to carry the full load. SN+ is load sharing redundancy, and it means that failing of a unit affects the maximum data throughput. N+M means that several spare units are available, if one of the N units fails, it selects one of the M units. The following table shows the redundancy model of each unit: Table 4

Multicontroller RNC redundancy models

Unit Type

Redundancy Model

USPU

SN+

CSPU

N+M (M >= 1)

CFPU

2N

EIPU

1+1...N+1

OMS

2N

Ethernet Switching

No redundancy schema

The redundancy principle for each functional unit type in Multicontroller RNC is given in the section Multicontroller RNC Functional Units.

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Technical specifications, Multicontroller RNC hardware

7 Technical specifications, Multicontroller RNC hardware g

The IR206 cabinet is still supported for Multicontroller RNC. Dimensions CAB216-A cabinet frame (H x W x D), with doors

2254 x 598 x 680 mm

CAB216-A cabinet frame (H x W x D), without doors

2130 x 598 x 600 mm

BCN module dimensions (H x W x D)

178 (4U) x 444 x 450 mm

PDU dimensions (H x W x D)

88.9 (2U) x 483 x 240 mm

Weight CAB216-A cabinet frame, empty

Approximately 151 kg

CAB216-A cabinet frame, fully equipped (8 BCNs, 2 PDUs)

Approximately 470 kg

BCN module, fully equipped

25-30 kg

BCN sliding rails (used in cabinet installations)

Approximately 1.9 kg

AC PDU


DC PDU


Environment Safety

EN 60950-1, UL 60950-1

Earthquake resistance

Telcordia GR-63-CORE, Zone 4

Environmental requirements

ETS 300 019-1-1, ETS 300 019-1-2, ETS 300 019-1-3, Telcordia GR-63-CORE

EMC emission

EN 300 386, Telcordia GR-1089-CORE

EMC immunity

EN 300 386, Telcordia GR-1089-CORE

Power consumption The values are nominal maximum power consumption values for DC feed. With DC feed, power consumption values are up to 10% larger than with AC feed.

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Technical specifications, Multicontroller RNC hardware


The measured maximum power consumption (DC) is as below: Maximum per cabinet

2190W (with 4 modules)

Power supply

Nominal voltage

Operating voltage range

Rated input current

DC

-40 VDC to -72 VDC

36.2 A per DC PSU

180 VAC to 264 VAC

7 A per AC PSU

-48V -60V

AC

28

230V 50Hz

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Multicontroller RNC functional units

8 Multicontroller RNC functional units 8.1 Multicontroller RNC functional units The functional unit types of the Multicontroller RNC are described in the following sections. Each description includes information on the basic configuration of the functional unit and the expansion possibilities. The functions are distributed in entities of hardware and software. The main processing units/entities of the Multicontroller RNC are listed below: • • • • •

Cell Specific Processing Unit (CSPU) Centralized Functions Processing Unit (CFPU) External Interface Processing Unit (EIPU) User Equipment Specific Processing Unit (USPU) Ethernet Switching

The following figure shows the physical location of the processing units in the Multicontroller RNC module: Note: Configurations with BOC-A are still supported in Multicontroller RNC. Figure 10

AMC 1

Example of the physical location of the processing units within one module

AMC 2

U D H A M A S D H

U P F C

U P S C

U P S C

U P S C

U P S U

U P S U

U P S U

U P I E

B 2 P P M B

B 2 P P M B

B 2 P P M B

B 2 P P M B

B 2 P P M B

B 2 P P M B

B 2 P P M B

B 2 P P M B

NS A1

SER

SFP+ 0

SFP+ 2

S F P+ 4

S FP + 6

SFP+ 12

SFP+ 14

S FP + 1 6

S FP + 1 8

S FP + 2 0

S FP + 2 2

MGT

L AN 2

A2

ALARM 2

USB 3

RESET PO

SAS

Trace

SFP+ 1

S FP + 3

S F P+ 5

SFP+ 11

SFP+ 13

S FP + 1 53

S FP + 1 7

S FP + 1 9

S FP + 2 1

L AN 1

U SB 1 / 2

A LA RM 1

SYNC 2 P1

P5

P2

P6

P3

P7

P4

P8

S YN C 1

DN09122125

8.2 Cell Specific Processing Unit (CSPU) Purpose:

This processing unit implements all cell-specific control and user plane processing. Further, all control and user plane resources for a single BTS are allocated from the same CSPU unit.Therefore CSPU units are completely independent of each others and different CSPUs might not have mutual communication at all.

Redundancy:

N+M (M >= 1)

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Multicontroller RNC functional units


8.3 Centralized Functions Processing Unit (CFPU) Purpose:

The Centralized Functions Processing Unit (CFPU) consists of OMU and CFCP. Operation and Management Unit (OMU) performs the basic system maintenance functions such as hardware configuration, alarm system, configuration of signaling transport and centralized recovery functions. It also contains cellular network related functions such as radio network configuration management, radio network recovery and RNW database.

Redundancy:

2N

8.4 External Interface Processing Unit(EIPU) Purpose:

External Interface Processing Unit (EIPU) is designed for more optimised IP transport and packet environment. EIPU unit, implements an intelligent line card concept that is targeted for multiprotocol transport interfaces in particular in Iu-PS interface of RNC.

Redundancy:

1+1...N+1

8.5 Ethernet Switching Purpose:

The Multicontroller RNC provides Ethernet switching functionality both for the internal communication between the various processing units (USPUs, CSPUs and CFPUs) as well as for flexibly connecting the external network interfaces to the processing units. The internal communication and external network switching parts are kept totally separated and each processing unit has own 10 Gbps Ethernet interfaces to both of these parts. The full line rate switching capacity supported by the product ensures fast and bottleneck-free communication both for the internal and external communication.The switches of different modules are interconnected via 10Gbps Ethernet links. Mesh topologies can be used to provide a highly resilient and reliable communication also between modules.

Redundancy:

No redundancy

8.6 User Equipment Specific Processing Unit (USPU) Purpose:

This processing unit implements all UE-specific control and user plane processing. Further, all dedicated control and user plane resources for a single UE are allocated from the same USPU unit. Therefore USPU units are completely independent of each others and different USPUs might not have mutual communication at all. It makes implementation of SN+ redundancy features like moving UE specific processing from processor to another simpler.

Redundancy:

SN+

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Multicontroller RNC network interfaces

9 Multicontroller RNC network interfaces The Multicontroller RNC module front panel contains the following interfaces: • • • • • • •

Seven 10 GigE (SFP+) interfaces for inter-module cabling two 10 GigE (SFP+) and ten 1 GigE (SFP) interfaces for external cabling two additional 1 GigE (SFP) interfaces provide access to add-in card slots 1 and 8 for network element management purposes one 1 GigE (1000Base-T) interface for local hardware management and debugging purposes two USB 2.0 interfaces for software downloading (typically during commissioning) direct RS232 interface to the local management processor (LMP) for debugging purposes A special 1 GE interface, the “trace port”, is used for providing a connection to an external traffic tracing server. The trace port is also used for port mirroring, which allows mirroring of any port connecting to the HiGig virtual backplane to the trace port.

Figure 11

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Front panel of the Multicontroller RNC module

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Multicontroller RNC network interfaces


9.1 Gigabit Ethernet interface IP over Ethernet network interfaces with protection possibility are provided in the front panel of the module. One module contains ten SFP bays that can be equipped with 1 Gigabit Ethernet interfaces and nine SFP+ bays that can be equipped with 10 Gigabit Ethernet interfaces. Table 5

1GE interface specifications for external interfaces

Interface type

1 Gigabit Ethernet

Ethernet standard

IEEE 802.3 - 2005

Physical layer

1000Base-SX

1000Base-LX

1000Base-T

Connections

SFP/LC

SFP/LC

SFP/RJ-45

Max cable length

300m

5000m

100m

Table 6

10GE interface specifications for external interfaces

Interface type

10 Gigabit Etherne

Ethernet standard

IEEE 802.3 - 2005

Physical layer

10GBase-SR

10GBase-LR

Connections

SFP+/LC

SFP+/LC

Max cable length

300m

10000m

9.2 Backplane interface 10 GE backplane interfaces include SFP+0, SFP+1,SFP+2, SFP+3, SFP+4, SFP+5 and SFP+6. All these ports are dedicated to Multicontroller RNC internal connections.

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Configurations and dimensioning

10 Configurations and dimensioning 10.1 General about Multicontroller RNC configurations The Multicontroller RNC can be flexibly configured to meet the capacity requirements of individual customers because of its modular structure. When the capacity needs to be increased, the system can be easily expanded by adding new modules to the existing configuration. The capacity of the network element depends on the number of controller modules in the system. Three reference capacity steps are used in Multicontroller RNC. They differ in the number of BCN modules used: the Multicontroller RNC capacity step 1 employs 2 BCN modules, capacity step 3 employs 4 BCN modules and capacity step 7 employs 8 BCN modules. Possible BCN modules are either type BCN-B2d or BCN-B2e. Both BCN-B2d and BCNB2e consist of 8 BMPP2-B add-in cards. The difference between BCN-B2d and BCNB2e is that BCN-B2d has hard disk AMC and BCN-B2e does not have hard disk AMC. For each configuration two variants of power supply are available (AC or DC). The configurations of the Multicontroller RNC capacity steps are illustrated below: Figure 12

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Multicontroller RNC Capacity steps

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10.2 Multicontroller RNC capacity steps 10.2.1

Multicontroller RNC capacity step 1 Multicontroller RNC capacity step 1 (S1-B2) is the basic configuration and it consists of two BCN-B2d BCN modules. The following graphic describes the Multicontroller RNC capacity step 1 configuration: Figure 13

Multicontroller RNC capacity Step 1

The Multicontroller RNC Capacity Step 1 configurationconsists of the following items: •

Two module Multicontroller RNC Network Element with DC power includes following items: – – – – – –

•

Two module Multicontroller RNC Network Element with AC power includes following items: – – – – – –

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2 * Multicontroller RNC basic module 4 * DC power module 2 *AMC HDD module 2 * SFP+ Direct Attach cable 2 * AMCSF-A 1 * RJ45 Ethernet batch cable (CNI)

2 * Multicontroller RNC basic module 4 * AC power module 2 *AMC HDD module 2 * SFP+ Direct Attach cable 2 * AMCSF-A 1 * RJ45 Ethernet batch cable (CNI)

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10.2.2


Multicontroller RNC capacity step 3 Multicontroller RNC capacity step 3 (S3-B2) consists of the basic NE configuration plus 2 additional type BCN-B2e BCN modules. The following graphic describes the Multicontroller RNC capacity step 3 configuration: Figure 14


The Multicontroller RNC Capacity Step 3 configuration consists of the following items: •

Four module Multicontroller RNC Network Element with DC power includes following items: – – – – – –

•

Four module Multicontroller RNC Network Element with AC power includes following items: – – – –

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4 * Multicontroller RNC basic module 8 * AC power module 2 *AMC HDD module 6 * SFP+ Direct Attach cable

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– –

10.2.3


6 * AMCSF-A 2 * RJ45 Ethernet batch cable (CNI)

Multicontroller RNC capacity step 7 mcRNC4.1 capacity step 7 (S7-B2) consists of the capacity step 3 NE configuration (S3B2) plus four BCN-B2e BCN modules. The following graphic describes the Multicontroller RNC capacity step 7 configuration: Figure 15


The Multicontroller RNC Capacity Step 7 configuration consists of the following items:

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•

Eight module Multicontroller RNC Network Element with DC power includes following items: – – – – – –

•


Eight module Multicontroller RNC Network Element with AC power includes following items: – – – – – –

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8 * Multicontroller RNC basic module 16 * AC power module 2 *AMC HDD module 28 * SFP+ Direct Attach cable 14 * AMCSF-A 4 * RJ45 Ethernet batch cable (CNI)

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Power distribution principles


11 Power distribution principles There are two power supply units (PSU) per BCN module and two power distribution units (PDU) per cabinet. Either DC or AC PDUs and PSUs can be used, but both PSUs in any one BCN module must be of the same type. The supported options for the input voltages are 230 VAC for the mains power and -48 VDC / -60 VDC for battery feed. The DC PSU in BCN is BDFE-B, and the AC PSU is BAFE-B. The PDUs are called BDPDU A for DC power feed, and BAPDU-A for AC power feed, respectively. The outputs of the DC PDU and the AC PDU are protected by circuit breakers. Each PDU has 8 output channels in two 4-output groups, both having individual inputs. This is to reduce current rating of the PDU input cables and site supply fuses. Each PSU has one input, and the PSU provides protection against surges and transients in the power feed cables. To ensure 2N redundancy for the power distribution lines, the two PSUs in a BCN module provide two mutually redundant input feeds (PSU A and PSU B). Each input is capable of supplying the entire BCN module’s power feed. The power distribution principle is illustrated in the following figures. Power distribution with PDUs

Figure 16

PDU A - Site power supply

4x30 A (DC) or 15 A (AC)

- Site power supply

4x30 A (DC) or 15 A (AC)

4x -48/-60 VDC or 230 VAC

PSU A

BCN

Other BCN modules

PDU B - Site power supply

4x30 A (DC) or 15 A (AC)

- Site power supply

4x30 A (DC) or 15 A (AC)

4x -48/-60 VDC or 230 VAC

PSU B

Other BCN modules DN0969163

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Figure 17

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Power distribution principles

Power distribution without PDUs

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Mechanics and electromechanics


12 Mechanics and electromechanics The BCN chassis or module consists of a steel enclosure, the motherboard and supporting structures for mounting replaceable HW modules such as add-in cards, AMC modules, power supplies, fan modules and air filter. The outer dimensions of the BCN enclosure are 176 mm (height) x 430 mm (width) x 450 mm (depth). The enclosure functions as a sealed EMC boundary when the AMC cards/ fillers, fan modules, power supplies and the lid are normally in place, covering the openings. Up to eight add-in cards of different kinds can be installed in to the BCN module. The spacing between cards is 40 mm, providing space for assembling heat sinks and fullheight memory modules (DIMMs) on board. Add-in cards are field replaceable, but powering off the module is required during the operation. Two standard, mid-size AMC bays are located in the front panel for expanding functionality of the BCN module. AMC modules are hot-swappable and can be added or replaced during normal operation. The BCN module is cooled using forced convection. Three system fan modules are located in the rear of the module. There are two main fan modules that force air past the add-in cards and the mother board. Two AMC fan modules force air past the AMC modules. Each fan module consists of two coupled fans, connected in series. The direction of air flow is from front to rear. A cooling algorithm controls the speed of the system fans, ensuring adequate cooling of electric components while minimizing noise level. The BCN supports two 1+1 redundant power supply modules, which are located at the rear of the module. Both AC and DC models are supported. The PSUs have their own individual fans, which draw air from front to rear. The PSUs also have their own fan control, which is independent of BCN’s system fan control. BNC modules can be installed in standard 19 inch cabinets and NSN’s proprietary cabinet, the CAB216SET-B, using cabinet specific installation kits.

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Cabinet and related items

13 Cabinet and related items Network elements are housed in cabinets. Currently CAB216-A cabinet frame is available for BCN.

13.1 CAB216-A cabinet frame The CAB216-A Equipment Cabinet is designed according to ETSI EN 300 119-4 standard. The cabinet set consists of the cabinet frame CAB216-A, two doors and mounting kit for PDU. The maximum outer height of the cabinet is 2254 mm. Width is 598 mm and depth without doors is 600 mm. The lockable doors of the cabinet add 80 mm to the depth dimension (40 mm per door). Figure 18

CAB216-A cabinet frame (empty and fully equipped with eight BCN modules and two PDUs)

The cabinet has 16 side supporting brackets and 8 rear supporting brackets for BCN modules, and vertical front and rear cabling conduits on both sides. There are also cabling openings at the roof and bottom of the cabinet. The cabinet includes wheels. The cabinet can be installed: • •

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Cabinet and related items

•


directly onto concrete floor or raised floor

Cabinet installation alternatives and detailed installation instructions are provided in the document Installing BCN Hardware to CAB216-A Cabinet . Table 7

CAB216-A cabinet frame technical data


With doors, lifting eyes, top fixing brackets, feet: 2254 x 598 x 680 mm Without doors, lifting eyes, top fixing brackets, feet: 2130 x 598 x 600 mm Foot adjustment +50/-0 mm

Weight

Cabinet frame with two doors: approx. 137 Kg without anti-toppling system and approx. 151 Kg with anti-toppling kit. Maximum total weight, with fully-equipped modules, PDUs, lifting eyes, supporting brackets, feet and cables: approx. 470 kg

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Hardware items

14 Hardware items 14.1 Add-in cards 14.1.1

Processor add-in card (BOC-A) The BOC-A processor add-in card provides networking, TCP acceleration, QoS and compression features. Up to eight add-in cards can be installed in the BCN module. The BOC-A add-in card is equipped with DDR2 memory modules, supporting memory configurations of 2x2 GB and 4x2 GB DIMM.

14.1.1.1

Figure 19

Processor add-in card (BOC-A)

Table 8

BOC-A dimensions and weight

Dimensions (W X H)

246 mm x 157 mm

Weight

Approx. 600 g

Memory module for BOC-A processor add-in card (BDM2G-A) The processor add-in card BOC-A uses 2GB 667 MHz DDR2 memory modules (BDM2G-A). Physically, the memory module complies with standard 30 mm height. One BDM2G-A memory module weights approximately 20 grams.

14.1.2

Add-in filler card (BFC-A) Empty add-in card slots are equipped with add-in card fillers (BFC-A) to ensure proper cooling of the BCN module. The add-in filler card is a dummy module with no electrical components.

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Hardware items

14.1.3


Figure 20

Add-in filler card (BFC-A)

Table 9

BFC-A dimensions and weight

Dimensions (W x H)

246 mm x 157 mm

Weight

Approx. 220 g

Processor add-in card (BMPP2-B) The BMPP2-B add-in card is a general purpose processing unit, performing various data plane and control plane processing tasks in a number of applications. Up to eight add-in cards can be installed in the BCN module. The BMPP2-B add-in card provides a total of four independent DDR3 memory controllers, which support the following high-level feature set: • • • • • • • • •

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Support for either two or four controllers Up to 32 GB of attached DDR3 DRAM per controller 64/72-bit interface (72-bit with optional SECDED ECC) Data rates from 600 to 1333 MT/s Four ranks/chip selects per controller x8 and x16 SDRAM parts are supported Support for DDR3L 1.35 V operation Support for registered and unbuffered DIMMs per rank ODT enable pins

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14.1.3.1

Hardware items

Figure 21

Processor add-in card BMPP2-B

Table 10

BMPP2-B dimensions and weight

Dimensions (W X H)

246 mm x 157 mm

Weight

Approx. 700 g

Memory module for BMPP2 processor add-in card BMPP2-B supports 8G memory module MRA3A08. The DIMMs are 240 pin, 1.2” high modules. The DIMMs populated in BMPP2-B are always identical. The following population option is supported by BMPP2-B: 4x 8GB. The data speed of MRA3A08 is up to 1333MT/s. The operating voltage of the memory module can be selected between 1.35V and 1.5V.

14.2 AMC 14.2.1

Hard disk drive carrier AMC (HDSAM-A) The hard disk drive carrier AMC (HDSAM-A) is a mid-size (single-width, 4 HP) AMC module providing serial attached SCSI (SAS) storage in the system. The AMC complies with AdvancedMC specifications of the PICMG. The HDSAM-A is installed in an AMC bay on the BCN module. The HDSAM-A is equipped with a 2.5-inch small form factor serial attached SCSI (SAS) hard disk drive. The hard disk drive needs to be acquired separately. Hard disks currently supported are HDS14-A (147GB) and HDS30-A (300GB).

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Hardware items


Figure 22

Hard disk drive carrier AMC (HDSAM-A)

Table 11

HDSAM-A dimensions and weight

Dimensions

4 HP, mid-size

Weight

With hard disk drive: 340 g

14.2.2

BCN AMC filler (AMCSF-A) Empty AMC bays must always be equipped with AMC fillers to ensure proper cooling of the BCN module. The AMC filler acts also as an EMC shield. The AMC filler is a dummy module with no electrical components.

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Hardware items

Figure 23

AMC filler (AMCSF-A)

Table 12

AMCSF-A dimensions and weight

Dimensions

4 HP, mid-size

Weight

Approx. 80 g

14.3 Power supply and distribution units 14.3.1

AC power distribution unit (BAPDU-A) In a cabinet installation an AC power distribution unit (PDU) BAPDU-A can be used to supply the BCN modules with AC power. The PDUs take the input power from the site power supply. The input voltage range for the PDU is between 180 and 264 V. An AC PDU has eight breakers installed in the front panel. One PDU provides eight outputs, that are connected to the BCN module power supplies. If both PSUs of an BCN module are connected to the same PDU, the PDU can provide power for up to four BCN modules. When the maximum reliability is required for the system’s power supply, two redundant PDUs are installed in the cabinet. In this case both PSUs of an BCN module are connected to different PDUs. Two installed PDUs occupy 4U in the cabinet.

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Hardware items


Figure 24

AC PDU (BAPDU-A)

Table 13

BAPDU-A dimensions and weight


90 mm (2U) x 485 mm x 230 mm In addition, the connector at the rear of PDU adds 150 mm in depth.

Weight

14.3.2

Approx. 5700 g

DC power distribution unit (BDPDU-A) In a cabinet installation a DC power distribution unit (PDU) BDPDU-A can be used to supply the BCN modules with DC power. The PDUs take the input power from the site power supply. A DC PDU has eight breakers installed in the front panel, and there is a 30 A circuit breaker on the negative wire at the input to protect the PDU from over-current. The input is also protected from over-voltage. One PDU provides eight outputs, that are connected to the BCN module power supplies. If both PSUs of an BCN module are connected to the same PDU, the PDU can provide power for up to four BCN modules. When the maximum reliability is required for the system’s power supply, two redundant PDUs are installed in the cabinet. In this case both PSUs of an BCN module are connected to different PDUs. Two installed PDUs occupy 4U in the cabinet. Figure 25

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DC PDU (BDPDU-A)

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Table 14

14.3.3

Hardware items

BDPDU-A dimensions and weight

Dimensions (H)

90 mm (2U) x 485 mm x 230 mm

Weight

Approx. 3960 g

AC power supply unit, variant B (BAFE-B) BAFE-B is a 1200-watt AC power supply unit for BCN module. A power supply unit is hot swappable and located on the rear of the BCN module. Power supplies provide protection against surges and transients in the battery feed cables. Two redundant power supply units are used in a BCN module. One power supply alone is capable of providing power for the BCN module if the other power supply unit fails. The BAFE-B AC supply unit has an IEC 320 C20 type input, and operates on 230 VAC. The PSU includes two outputs to the BCN module: the standby output (3.3 V, used for powering the BCN’s hardware management) and the main output (12 V, used for powering all BCN’s electronics - excluding the hardware management). Figure 26

AC PSU (BAFE-B)

Table 15

BAFE-B dimensions and weight


81 mm x 40 mm x 318 mm

Weight

Approx. 1350 g

Front panel The front panel of the BAFE-B has a LED indicating the states of the power supply: Table 16

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BAFE-B LED states

Symbol and name

Color

State

Description

PSU indicator LED

Green

Steady

Supply outputs are on, and the power supply operates normally.

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Table 16

BAFE-B LED states (Cont.)

Symbol and name

Color

Amber

State

Description

Blinking

AC power is present, but the supply is in standby mode and the main output is off.

Steady

One of the following events has occurred (PSU is turned off): • • • •

Blinking

One of the following events has occurred (PSU is turned off): • • •

Off

14.3.4

fan failure over-temperature protection standby output over-current protection standby output undervoltage protection

main output over-current protection main output over-voltage protection main output under-voltage protection

AC power is not present.

DC power supply unit, variant B (BDFE-B) BDFE-B is a 1200-watt DC power supply unit for BCN module. The power supply unit is hot swappable, and it is located on the rear of the BCN module. Power supplies provide protection against surges and transients in the battery feed cables. Two redundant power supply units are used in the BCN module. One power supply alone is capable of providing power for the BCN module if the other power supply unit fails. The DC power supply unit implements the interface “A” of a BCN module (as specified in ETSI EN 300 132-2) and accepts -48/- 60 VDC as the input voltage. The PSU includes two outputs to the BCN module: the standby output (3.3 V, used for powering the BCN’s hardware management) and the main output (12 V, used for powering all BCN’s electronics excluding the hardware management).

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Hardware items

Figure 27

DC PSU (BDFE-B)

Table 17

BDFE-B dimensions and weight


81 mm x 40 mm x 318 mm

Weight

Approx. 1270 g

Front panel The front panel of the BDFE-B has a LED indicating the states of the power supply: Table 18

BDFE-B LED states

Symbol and name

Color

State

Description

PSU indicator LED

Green

Steady

Supply outputs are on, and the power supply operates normally.

Blinking

DC power is present, but the supply is in standby mode and the main output is off.

Steady

One of the following events has occurred (PSU is turned off):

Amber

• • • •

Blinking

One of the following events has occurred (PSU is turned off): • •

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fan failure over-temperature protection standby output over-current protection standby output undervoltage protection

main output over-current protection main output over-voltage protection

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Hardware items


Table 18

BDFE-B LED states (Cont.)

Symbol and name

Color

State

Description •

Off

main output under-voltage protection

DC power is not present.

14.4 Fan units and air filter 14.4.1

Air filter (BAFI-A) The BCN module includes an air filter to prevent dust from accumulating inside the equipment. The air filter meets the NEBS GR 63 CORE and GR 78 CORE requirements. The air filter is located at the front of the BCN module in the cooling air inlet.

14.4.2

Figure 28

Air filter (BAFI-A)

Table 19

BAFI-A dimensions and weight


101 mm x 297 mm x 8 mm

Weight

Approx. 40 g

Main fan (BMFU-A/ BMFU-B) The BCN module contains two dual-fans (BMFU-A/ BMFU-B) for cooling the BCN. BMFU-A is used in BCN-A and BMFU-B in BCN-B. The difference in BMFU-A/ BMFU-B is in maximum rotating speed, 3700/4000 rpm respectively. The main fan modules are located on the rear of the BCN module. Fan speed is controlled by the hardware managent system to regulate the temperature within the BCN.

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Hardware items

Figure 29

Main fan (BMFU-A)

Table 20

BMFU-A dimensions and weight


142 mm x 140 mm x 75 mm

Weight

Approx. 880 g

14.5 BCN installation kit 14.5.1

BCN installation kit - BIK216-A The installation kit BIK216-A is used when BCN modules are installed in CAB216 cabinet. The installation kit includes the following items: • • •

1 x cable tray 2 x ear plates 2 x handles

Figure 30 BIK216-A

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Hardware items

14.5.2


BCN installation kit - BIKG1-A The installation kit BIKG1-A is used when BCN modules are installed in certain 19-inch cabinets that fulfill the requirements stated in the document Installation Site Requirements for BCN Hardware .The installation kit includes the following items: • • • • • •

2 x sliding rails 2 x front brackets 4 x rear brackets (2 short and 2 long) 1 x cable tray 2 x ear plates for 19-inch rack 2 x handles

Figure 31 BIKG1-A

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Overview of cabling in BCN

15 Overview of cabling in BCN The cables in BCN system can be divided into internal and external cables. Internal cables Internal cables consist of cables inside the network element or the cabinet, such as cables between BCN modules or PDU and BCN module. Table 21

Internal cables in the BCN system

Cable name

Use

CNI

Ethernet batch/Management cable between BCN modules

CACPB

Power cable between AC PDU and BCN module

CVKPB

Power cable between DC PDU and BCN module

CVKPBA

Power cable between DC PDU and BCN module (used only in commercial 19” cabinet with BIKG1-A)

CGNDB or CGNDE1)

Grounding cable between PDU (AC or DC) and cabinet

CGNDC

Grounding cable between BCN module and cabinet

CGNDF2)

Grounding cable between PDU (AC or DC) and cabinet

External cables External cables consist of cables leaving the network element and the cabinet, such as cables to external networks. Direct attach cables between modules and Ethernet batch cables External cables include: • • • •

LAN/Ethernet cables external synchronization cables external alarm cable power cables between site AC/DC power supply and BCN module, used in standalone installations (without PDU and cabinet) –

•

EU plug model AC power cord between site AC power supply and BCN module is included in deliveries (other models, if needed, must be obtained locally).

power cables between site AC/DC power supply and PDU (when cabinet and PDU are in use)

LAN/Ethernet cables leave the cabinet from front panels of BCN modules. 1) 2)

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CGNDB is used for IR206 cabinet, and CGNDE is used for CAB216-A cabinet. CGNDF is used in commercial 19” cabinet for grounding PDUs.

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Overview of cabling in BCN


External cables (other than the EU plug module AC power cord) are not part of equipment deliveries; they must be obtained locally. The requirements for external cables are included in the Installation Site Requirements document of the network element. For detailed cable positions and routing instructions, see the installation documentation for the network element.

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p Bcn Rnc Hw Description

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