Bonding Proccess 1

ACF Bonding Machine PRF 960

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COMMON FAULT IN LCD/LED PANEL

➢Vertical lines ➢Horizontal lines ➢Multiple lines ➢Vertical bar ➢Horizontal bar ➢Intermediate Intermediate lines ➢Double image









FAULTY LCD/LED PANEL









CHECK PANEL FAULT BEFOR BONDING In 1st image X3 COF is faulty & in 2 nd image X2 COF is faulty.









ACF Bonding Process ✓Check LCD/LED Panel ✓LCD/LED Panel fault mark ✓Remove COF from PCB & ITO side ✓Cleaning COF, PCB & ITO ✓









REMOVE COF FROM PCB & GLASS SIDE SMD RANGETEMPRATURE-250 TEMPRATURE-250 TO 300 ° AIR -4 TO 5











Remov Remove e the sealin sealing g glue glue

1. 2.

REMOVE SE SEALING GLUE RELEAS LEASE E COF FROM : FIRST ON PCB SIDE SECO SECOND ND GLAS GLASS S SIDE SIDE









ACF Removing Removing Liquid G-430\G-450 G-550

CLEA LEANING - PCB, GL GLASS& COF Apply some liquid on Glas Glass, s, PCB PCB

Apply some liquid on COF COF pins pins









COF CHECKING WITH MICROSCOPE









ACF TAPE MODEL ACF is necessary for COF bonding, the ACF will will connect COF with Glass and PCB. Should choose the correct ACF before bonding. The ACF for Glass side and PCB side is different. AC-7206U-18 1.5(W)X50(L)M









APPLY ACF TAPE ON COF











GLASS& PCBCLEANIING

















ADJUSTMENT OF COF ALIGNER/FIXTURE









ADJUSTMENT OF MICROSCOPE









CHECK CHECK BOTH SIDE ITO SYMBOL

































Bonding Proccess 1

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