XDM_SPEC_A01_8.2.3-8.2.4_en.pdf

XDM® Version 8.2.3/8.2.4

System Specifications 417006-2009-013-A01

XDM System Specifications V8.2.3/8.2.4 Catalog No: X38696 May 2011 2 nd Edition

© Copyright by ECI, 2008-2011. All rights reserved worldwide. This is a legal agreement between you, the end user, and ECI Ltd. (“ECI”). BY OPENING THE DOCUMENTATION AND/OR DISK PACKAGE, YOU ARE AGREEING TO BE BOUND BY THE TERMS OF THIS AGREEMENT. IF YOU DO NOT AGREE TO THE TERMS OF THIS AGREEMENT, PROMPTLY RETURN THE UNOPENED DOCUMENTATION AND/OR DISK PACKAGE AND THE ACCOMPANYING ITEMS (INCLUDING WRITTEN MATERIALS AND BINDERS OR OTHER CONTAINERS), TO THE PLACE FROM WHICH YOU OBTAINED THEM. The information contained in the documentation and/or disk is proprietary and is subject to all relevant copyright, patent, and other laws protecting intellectual property, as well as any specific agreement protecting ECI's rights in the aforesaid information. Neither this document nor the information contained in the documentation and/or dis k may be published, reproduced, or disclosed to third parties, in whole or in part, without the express prior written permission of ECI. In addition, any use of this document, the documentation and/or the disk, or the information contained therein for any purposes other than those for which it was disclosed, is strictly forbidden. ECI reserves the right, without prior notice or liability, to make changes in equipment design or specifications. Information supplied by ECI is believed to be accurate and reliable. However, no responsibil ity whatsoever is assumed by ECI for the use thereof, nor for the rights of third parties, which may be affected in any way by the use and/or dissemination thereof. Any representation(s) in the documentation and/or disk concerning performance of ECI product(s) product(s) are for informational purposes only and are not warranties of product performance or otherwise, either express or implied. ECI's standard limited warranty, stated in its sales contract or order confirmation form, is the only warranty offered by ECI. The documentation and/or disk is provided “AS IS” and may contain flaws, omissions, or typesetting errors. No warranty is granted nor liability assumed in relation thereto, unless specifically undertaken in ECI's sales contract or order confirmation. Information contained in the documentation and in the disk is periodically updated, and changes will be incorporated in subsequent editions. If you have encountered an error, please notify ECI. All specifications are subject to change without prior notice. The documentation and/or disk and all information contained therein is owned by ECI and is protected by all relevant copyright, patent, and other applicable laws and international treaty provisions. Therefore, you must treat the information contained in the documentation and disk as any other copyrighted material (for example, a book or musical recording). Other Restrictions. Restrictions . You may not rent, lease, sell, or otherwise dispose of the documentation and disk, as applicable. YOU MAY NOT USE, COPY, MODIFY, OR TRANSFER THE DOCUMENTATION AND/OR DISK OR ANY COPY IN WHOLE OR PART, EXCEPT AS EXPRESSLY PROVIDED IN THIS LICENSE. ALL RIGHTS NOT EXPRESSLY GRANTED ARE RESERVED BY ECI. All trademarks mentioned herein are the property of their respective holders. ECI shall not be liable to you or to any other party for any loss or damage whatsoever or howsoever caused, arising directly or indirectly in connection with this documentation and/or disk, the information contained therein, its use, or otherwise. Notwithstanding the generality of the aforementioned, you expressly waive any claim and/or demand regarding liability for indirect, special, incidental, or consequential loss or damage which may arise in respect of the documentation and/or disk and/or the information contained therein, howsoever caused, even if advised of the possibility of such damages. The end user hereby undertakes and acknowledges that they read the "Before You Start/Safety Guidelines" instructions and that such instructions were understood by them. It is hereby clarified that ECI shall not be liable to you or to any other party for any loss or damage whatsoever or howsoever caused, arising directly or indirectly in connection with you fulfilling and/or failed to fulfill i n whole or in part the "Before You Start/Safety Guidelines" instructions.

Contents Overview............. .......................... ........................... ........................... .......................... .......................... ................. .... 1-1 XDM® – Intelligent and Scalable Optical Networking Platforms ...................... 1-1 Unparalleled Unparallel ed Capabilitie Capabilities s........................... ........................................................ ....................................................... .......................... 1-2 XDM Platforms ................................................................................................. 1-4

Physical Description ............. .......................... .......................... .......................... ........................ ........... 2-1 XDM Shelf Configurations .............................. ............................. .................................................. ..................... 2-2 XDM-50 Card and Module Layout ............................. .......................................................... ..................................... ........ 2-32 MXC50 and ECU50 Cards ............................. .......................................................... ................................................ ................... 2-33 XDM-100 Card and Module Layout ........................... ......................................................... .............................. ....... 2-35 MXC and ECU Cards .......................... ........................................................ .............................. ............................. 2-37 XDM-300 Card and Module Layout ........................... ......................................................... .............................. ....... 2-40 MXC300 and ECU300 Cards .......................... ....................................................... ............................................... .................. 2-41 XDM-900 Card and Module Layout ............................ ......................................................... .................................... ....... 2-44 MXC900 and ECU900 Cards .......................... ....................................................... ............................................... .................. 2-46 XDM-40 Card Layout ............................ ......................................................... .......................................................... ............................. 2-48 XDM-400 Card Layout.......................... ....................................................... .......................................................... ............................. 2-49 XDM-450 Card Layout.......................... ....................................................... .......................................................... ............................. 2-50 XDM-500 Card Layout.......................... ....................................................... .......................................................... ............................. 2-51 XDM-1000 Card Layout .............................. ............................. .................................................... ....................... 2-52 XDM-2000 Card Layout .............................. ............................. .................................................... ....................... 2-54 XDM-3000 Card Layout .............................. ............................. .................................................... ....................... 2-55 Control, Matrix, and I/O Cards for Large XDM Shelves .............................. ... 2-57

XDM-50 Specifications .................................. ............................................... .......................... ............. 3-1 Cross-Connect Specifications ................................................. ......................... 3-2 Cross-Connect Traffic Protection .............................................................................................. 3-2 Redundancy ..................................................................................................... 3-2 Synchronization Synchronizati on ............................. ........................................................... .............................. ............................. ..................................... ........ 3-2 Jitter and Wander ........................... ........................................................ .......................................................... ..................................... ........ 3-2 I/O Interfaces ............................ .......................................................... .............................. ............................. .......................................... ............. 3-3 Management .................................................................................................... 3-4 SDH Interfaces .......................... ....................................................... .......................................................... .......................................... ............. 3-5 Data Modules ................................................................................................... 3-8 Physical Specifications .......................... ....................................................... ......................................................... ............................ 3-11 Environmental Environme ntal Conditions .................................... .............................. ............ 3-12 EMC ............................................................................................................... 3-13 Safety ............................................................................................................. 3-13 Reliability ............................ ......................................................... .......................................................... ............................................... .................. 3-13

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ECI Telecom Ltd. Proprietary

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XDM System Specifications

XDM-100 Specifications .................................. ............................................... ........................ ........... 4-1 Cross-Connect Specifications ................................................. ......................... 4-2 Cross-Connect Traffic Protection .............................................................................................. 4-3 Redundancy ..................................................................................................... 4-3 Synchronization Synchronizati on ............................. ........................................................... .............................. ............................. ..................................... ........ 4-3 Jitter and Wander ........................... ........................................................ .......................................................... ..................................... ........ 4-4 I/O Interfaces ............................ .......................................................... .............................. ............................. .......................................... ............. 4-4 Management .................................................................................................... 4-5 SDH/SONET Interfaces ............................. .......................................................... ....................................................... .......................... 4-6 Data Modules ................................................................................................. 4-13 Optical Amplifier Modules for TPU/OCU ................................................... ..... 4-19 GbE/FC/2 Gbps FC/FICON Optical SFP Transceivers for Transponders/Combiners Transponde rs/Combiners ........................... ........................................................ .................................................... ....................... 4-20 STM-1 SFP Optical supervisory channel transceivers for OSC1_2 ............... 4-21 CWDM Modules ......................... ...................................................... ........................................................... .............................. ......... 4-21 Physical Specifications .......................... ........................................................ .............................. ........................... 4-23 Environmental Environme ntal Conditions ..................................... ............................. ......................................... ............ 4-27 EMC ............................................................................................................... 4-27 Safety ............................................................................................................. 4-27 Reliability .......................... ........................................................ .............................. ............................. ................................................ ................... 4-28

XDM-300/900 Specifications ................................ ............................................. ................... ...... 5-1 Cross-Connect Specifications ................................................. ......................... 5-2 Cross-Connect Traffic Protection .............................................................................................. 5-2 Redundancy ..................................................................................................... 5-2 Synchronization Synchronizati on ............................. ........................................................... .............................. ............................. ..................................... ........ 5-3 Jitter and Wander ........................... ........................................................ .......................................................... ..................................... ........ 5-3 I/O Interfaces ............................ .......................................................... .............................. ............................. .......................................... ............. 5-3 Management .................................................................................................... 5-5 SDH/SONET Interfaces ............................. .......................................................... ....................................................... .......................... 5-6 Data Modules ................................................................................................. 5-14 Optical Amplifier Modules for TPU/OCU ................................................... ..... 5-19 CWDM Modules ............................................................................................. 5-20 Physical Specifications .......................... ....................................................... ......................................................... ............................ 5-21 Environmental Environme ntal Conditions .................................... .............................. ............ 5-25 EMC ............................................................................................................... 5-26 Safety ............................................................................................................. 5-26 Reliability .......................... ....................................................... .......................................................... ................................................. .................... 5-26

XDM-40, 400, 450, 500, 1000, 2000, and 3000 Specifications ............. .......................... .......................... .......................... ........................... ...................... ........ 6-1 Electrical, Optical, and Mixed Basecard Information ............................. ........................................ ........... 6-2 XDM Shelf Capacities ...................................................................................... 6-5 PDH/Async and SDH/SONET Interface Specification Specifications s .......................... .................................... .......... 6-8 SDH/SONET Interfaces ............................. .......................................................... ..................................................... ........................ 6-10 XDM MPLS/Ethernet Card Summary ......................... ...................................................... .................................... ....... 6-22

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Data Cards ..................................................................................................... 6-22 Optical Components ....................................................................................... 6-32 C Band Channel Frequencies and Wavelengths (ITU-T Rec. G.694.1 for DWDM)........................................................................................................... 6-62 CWDM Frequencies and Wavelengths (ITU-T Rec. G.694.2 for CWDM) ...... 6-65 Physical Specifications .............................. ..................................................... 6-65 Environmental Conditions ............................................. .............................. ... 6-73 EMC ............................................................................................................... 6-73 Safety ............................................................................................................. 6-73 Reliability .............................. .......................................................................... 6-74 Management Specifications ................................................ ........................... 6-74 Other Specifications .............................. ......................................................... 6-75

Standards and References .................................................... A-1 Overview .......................................................................................................... A-1 Broadband Forum ............................................. ............................................... A-1 Environmental Standards ................................................................................. A-2 ETSI: European Telecommunications Standards Institute ............................... A-2 IEC: International Electrotechnical Commission .............................................. A-3 IEEE: Institute of Electrical and Electronic Engineers ...................................... A-4 IETF: Internet Engineering Task Force ............................................... ............. A-5 ISO: International Organization for Standardization ......................................... A-7 ITU-T: International Telecommunication Union ................................................ A-7 MEF: Metro Ethernet Forum ........................................................................... A-11 NIST: National Institute of Standards and Technology ............................... ... A-12 North American Standards ............................................................................. A-12 OMG: Object Management Group ......... ........................................................ A-13 TMF: TeleManagement Forum....................................................................... A-13 Web Protocol Standards .................................... .............................. .............. A-13

Index .......................................................................................... I-1

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List of Figures Figure 1-1: Multiservice metropolitan optical network .................................................... 1-3 Figure 1-2: XDM shelves................................................................................................ 1-6 Figure 2-1: Basic XDM-50 shelf ..................................................................................... 2-2 Figure 2-2: XDM-50 with TPU (I/O protection)............................................................... 2-3 Figure 2-3: Basic XDM-100 shelf ................................................................................... 2-4 Figure 2-4: XDM-100 with TPU (I/O protection) ............................................................. 2-5 Figure 2-5: XDM-100 nonredundant configuration ........................................................ 2-5 Figure 2-6: XDM-100H with one TPU/OCU shelf ........................................................... 2-6 Figure 2-7: Basic XDM-300 shelf, horizontal installation ............................................... 2-7 Figure 2-8: Basic XDM-300 shelf, vertical Installation ................................................... 2-7 Figure 2-9: XDM-300 with TPU on top ........................................................................... 2-8 Figure 2-10: XDM-300 with TPUs on top and at the bottom of the shelf ....................... 2-8 Figure 2-11: XDM-300 with two TPUs and an OCU ...................................................... 2-9 Figure 2-12: Basic XDM-900 shelf, horizontal installation ........................................... 2-10 Figure 2-13: Basic XDM-900 shelf, vertical Installation ............................................... 2-11 Figure 2-14: XDM-900 with TPU on top ....................................................................... 2-12 Figure 2-15: XDM-900 with TPUs on top and at the bottom ........................................ 2-13 Figure 2-16: XDM-900 with two TPUs and an OCU .................................................... 2-14 Figure 2-17: XDM-40 shelf layout ................................................................................ 2-15 Figure 2-18: XDM-400 shelf open view ........................................................................ 2-15 Figure 2-19: XDM-450 platform.................................................................................... 2-16 Figure 2-20: XDM-500 shelf open view ........................................................................ 2-17 Figure 2-21: XDM-1000 standard shelf open view ...................................................... 2-18 Figure 2-22: XDM-2000 open view .............................................................................. 2-19 Figure 2-23: XDM-3000 front view ............................................................................... 2-20 Figure 2-24: Three XDM-50 shelves in a 2600 mm ECI recommended ETSI rack...................................................................................................................... 2-22 Figure 2-25: Three XDM-100 or XDM-200 shelves in a 2600 mm ECI recommended ETSI rack ............................................................................................. 2-23 Figure 2-26: Two XDM-300 shelves in a 2600 mm ECI recommended ETSI rack...................................................................................................................... 2-24 Figure 2-27: XDM-1000 and XDM-500 shelves in a 2600 mm ECI recommended ETSI rack...................................................................................................................... 2-25 Figure 2-28: Two XDM-500 shelves installed in a 2200 mm ETSI rack ...................... 2-26 Figure 2-29: Two XDM-40 shelves installed in a 2200 mm ETSI rack ........................ 2-27 Figure 2-30: Two XDM-2000 shelves installed in a 2200 mm ECI recommended ETSI rack...................................................................................................................... 2-28 417006-2009-013-A01


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List of Figures


Figure 2-31: Two XDM-1000 shelves installed in a 2600 mm ECI recommended ETSI rack ............................................................................................. 2-29 Figure 2-32: XDM-1000 and XDM-100H shelves installed in a 2200 mm ECI recommended ETSI rack ............................................................................................. 2-30 Figure 2-33: XDM-500 and XDM-100H shelves installed in a 2200 mm ECI recommended ETSI rack ............................................................................................. 2-31 Figure 2-34: XDM-50 slot allocation............................................................................. 2-32 Figure 2-35: XDM-100 slot allocation........................................................................... 2-35 Figure 2-36: XDM-300 slot allocation........................................................................... 2-40 Figure 2-37: XDM-900 slot allocation........................................................................... 2-45 Figure 2-38: XDM-40 card layout ................................................................................. 2-49 Figure 2-39: XDM-400 typical card layout.................................................................... 2-49 Figure 2-40: XDM-450 slot layout ................................................................................ 2-50 Figure 2-41: XDM-500 standard card layout ................................................................ 2-51 Figure 2-42: XDM-1000 standard card layout .............................................................. 2-53 Figure 2-43: XDM-2000 standard card layout .............................................................. 2-54 Figure 2-44: XDM-3000 standard card layout .............................................................. 2-56

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List of Tables Table 3-1:

STM-1 bidirectional transceivers ........................................................... 3-6

Table 3-2:


Table 4-1:


Table 4-2:


Table 4-3:

STM-16 bidirectional transceivers ....................................................... 4-11

Table 5-1:


Table 5-2:


Table 5-3:


Table 5-4:

GbE bidirectional transceivers............................................................. 5-18

Table 6-1:

STM-1 transceivers ............................................................................. 6-12

Table 6-2:

STM-1 bidirectional transceivers ......................................................... 6-13

Table 6-3:

STM-4 transceivers ............................................................................. 6-14

Table 6-4:

STM-4 bidirectional transceivers ......................................................... 6-15

Table 6-5:

STM-16 transceivers ........................................................................... 6-17

Table 6-6:


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List of Tables

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1 Overview In this chapter: XDM® – Intelligent and Scalable Optical Networking Platforms .................. 1-1 Unparalleled Capabilities ................................................................................ 1-2 XDM Platforms .............................................................................................. . 1-4

®

XDM – Intelligent and Scalable Optical Networking Platforms The telecommunications landscape is becoming more and more competitive. Carriers and operators are demanding networking equipment that can do more for less money. Today's networking equipment must be flexible, upgradeable, and highly intelligent. It must be able to successfully integrate with equipment produced by other manufacturers according to accepted industry standards. Above all, today's networking equipment must be scalable, easy to operate and maintain, and cost effective. At ECI, we specifically addressed these issues when we designed the XDM platforms. The XDM offers carriers unprecedented capacity, cost-savings, and ease of integration, placing it at the forefront of the optical networking revolution. The XDM offers a series of outstanding advantages, including: 

Data-services – the XDM facilitates migration from voice-oriented to data-oriented networks, combining the cost-effectiveness and universality of Ethernet with the Quality of Service (QoS), scalability, and resilience of SDH/SONET.



Optical DWDM capabilities – the XDM implements low-cost all-optical networks by offering sublambda grooming of multiple low-rate services (including SDH/SONET, IP, ATM, and GbE) onto a single wavelength.

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Overview






Versatility and interoperability – the XDM coexists in perfect harmony with equipment from other vendors by enabling the free flow of management information between network elements. Its ma nagement software facilitates smooth integration with other high-level management systems. Readiness for future architectures – thanks to its inherently modular build-as-you-grow™ architecture, the XDM gives carriers the ability to meet all of tomorrow's networking environments, be they ring, star, or mesh.

The innovative design of the XDM meets all the requirements of modern transmission networks in a single shelf, consolidating key networking technologies in a modular infrastructure to create the world's most accommodating and scalable single-shelf platform. XDM operators can choose to use only the features required based on current demands, and add functions and services as requirements grow. This results in flexible and scalable platforms that provide dynamic multiservice provisioning while reducing both capital expenditures (CAPEX) and operating expenses (OPEX).

Unparalleled Capabilities Typical metro networks span distances anywhere from 10 km to 300 km, serving large bandwidth-hungry areas. Equipment serving these networks must therefore be able to interconnect a wide range of protocols, from business customers in the access layer to service providers in the backbone. As a true MultiService Provisioning Platform (MSPP), the XDM seamlessly integrates multiple network types, traffic types and technologies, including: 

SDH/SONET 

Bitrates ranging from E1 all the way up to STM-64/OC-192



Large nonblocking matrix for full connectivity





1-2

Variety of port densities that can fit into any network layer from the network termination unit all the way up to the central office

Optical 

High density of lambdas (40 to 80) in the C band



Ability to add/drop any lambda at any site



Ability to provide metro solutions without amplification



Long-haul solutions up to 1500 km


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

Data 

 



Overview

Usable bandwidth to customers, including Layer 1 and Layer 2 Ethernet services, from 10BaseT all the way up to GbE Ability to route data over SDH/SONET or DWDM Additional cards can be added as needed, to reduce cost and protect against over-expansion

Cellular 

Aggregates ATM traffic to optimize bandwidth utilization



Unifies 2G and 3G networks

As a digital cross connect, the XDM offers VC-12 granularity (STS-1 for SONET) within a 60 Gbps fabric. Several cross connect types are available, including broadband, wideband, and integrated broadband/wideband, all of which comply with applicable standards. The XDM does all of this while maintaining high levels of performance and reliability. Moreover, the inherent DWDM capabilities of the XDM provide operators with an intelligent infrastructure offering virtually unlimited expansion paths. The multilayer multiservice functionality of the XDM enables you to: 

Migrate from today's ring topologies to mesh architectures, segment by segment



Add and activate bandwidth as requirements change



Provide on-demand services across multiple network layers

Figure 1-1: Multiservice metropolitan optical network

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Overview


XDM Platforms The XDM family of integrated optical platforms consolidates key networking technologies in a modular infrastructure that integrates all the transport functions of a complete Point of Presence (POP) in a single shelf-sized element. Cards can be interchanged between the various platforms, ensuring a flexible build-as-you-grow architecture for transporting all types of traffic, including voice, ATM, IP, and data. These technical specifications address the following XDM shelf configurations: 







XDM®-50 – The Do-It-All MSPP for Up-and-Coming Networks – ultra compact platform, designed to provide a swift response to evolving network requirements. It brings greater levels of flexibility to metropolitan and cellular networks, and is emerging as a solid solution for these focused and highly cost-sensitive markets. XDM®-100 – Miniature MSPP for Metro-Access and Cellular Networks – an intelligent integrated system that offers operators a cost-effective flexible approach to maximizing bandwidth utilization, while delivering both enhanced data services and traditional voice services. XDM®-300 – Flexible MSPP for Metro Aggregation Applications – designed for metro aggregation applications and cellular Radio Access Network (RAN) infrastructure. The platform is optimized for cost- and physical size-effective implementation of MADM-64 and MADM-16 network elements. ®

XDM -900 – MSPP for High-Capacity Central Exchange Applications – designed for high-capacity central exchange applications, the XDM-900 is optimized for the metro-core and features unprecedented port densities.

As a digital cross connect, the XDM-900 forms a fully protected mesh core. As a multi-ADM, it simultaneously closes STM-64/OC-192 core MS-SPRing/BLSR and multiple edge 1+1/UPSR rings. As a DWDM, it enables migration from SDH/SONET to DWDM networks, providing high capacity and sublambda grooming and reliability. The XDM-900 provides connectivity between central office legacy switches over E1, E3/DS-3, and STM-1/OC-3 trunks, and between POPs over native Fast Ethernet, Gigabit Ethernet, or POS, while efficiently grooming traffic from edge rings. 

1-4

XDM®-40 – Modular C/DWDM and OTN Platform for Metro-Access and CPE Applications – enables service providers to build end-to-end flexible standards-based OTN solutions that address the growing demand for business data transport. It gives service providers the flexibility to take full advantage of their existing networks, while providing a smooth and fully supported migration to IP over optics.


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

Overview

XDM®-400 – Aggregator for Metro-Edge Networks – an innovative product optimized for optical metro-access and cellular applications. When equipped with high-power long-haul optical devices, it provides an excellent solution for regional applications spanning distances of up to 1500 km. ®



XDM -450 – Standalone Computer Control Panel (CCP) shelf for optics overlay – provides an efficient cost-effective way to add optical capacity to your network configuration and serves as an add-on to host additional OMs such as amplifiers and ROADMs. The XDM-450 is especially valuable for use with the XDM-300, XDM-1000, XDM-2000, XDM-3000, and ECI's CESR 9000 platforms, enabling a smooth DWDM upgrade path and supporting alien lambda extensions.



XDM -500 – Data-Aware Access Gateway – designed for medium interface capacities and street-cabinet installations, the XDM-500 is a compact optical platform optimized for the metro-edge. It provides traditional broadband services and highly advanced data services like adaptive-rate Gigabit Ethernet, sophisticated Layer 2 Ethernet, POS, and lambda. It can be used either as a simple ADM or as an edge multi-ADM/TM shared between several rings, providing distributed cross connectivity and concentration of low-rate services.



®

XDM®-1000 – MSPP for High-Capacity Central Exchange Applications – designed for high-capacity central exchange applications, the XDM-1000 is optimized for the metro-core and features unprecedented port densities.

As a digital cross connect, the XDM-1000 forms a fully protected mesh core. As a multi-ADM, it simultaneously closes STM-64/OC-192 core MS-SPRing/BLSR and multiple edge 1+1/UPSR rings. As a DWDM, it enables migration from SDH/SONET to DWDM networks, providing high capacity and sublambda grooming and reliability. The XDM-1000 provides connectivity between central office legacy switches over E1, E3/DS-3, and STM-1/OC-3 trunks, and between POPs over native Fast Ethernet, Gigabit Ethernet, or POS, while efficiently grooming traffic from edge rings. 

®

XDM -2000 – Multifunctional Intelligent Optical Switch – designed for the metro and metro-regional core, the XDM-2000 is optimized for pure DWDM and hybrid optical applications. This is a highly dense DWDM platform that provides intelligent sublambda grooming and optimum wavelength utilization.

As the most flexible optical switch on the market today, the XDM-2000 transports up to 400 Gbps (upgradeable to 1.6 Tbps and above), and integrates the most advanced optical units with a variety of interfaces and a sophisticated high-capacity matrix in one small low-cost package.

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Overview




XDM®-3000 – High Capacity Metro-Core MSPP – the 240 Gbps capacity is ideal for regional metro-core networks. The XDM-3000 is designed for ever-expanding optical transport traffic demands, with network migration to n x 10G interfaces increasing the bulk bandwidth requirements for core platforms. The high capacity of the XDM-3000 relieves metro-core network bottlenecks while enabling network expansion and improved BW efficiency through the use of 10 Gbps cards to maximize utilization of available slots.

As a multi-ADM, the XDM-3000 provides multi-ring closure, simultaneously closing STM-16/STM-64 core MSSPRing and multiple edge SNCP rings, and providing improved protection and restoration capabilities. The XDM-3000 can also be used as a cost-effective DXC for heavy traffic sites, forming a fully protected mesh core. The large amount of low-order traffic handled by this platform enables full connectivity for TDM networks.

Figure 1-2: XDM shelves

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2 Physical Description In this chapter: XDM Shelf Configurations ............................................................................. 2-2 XDM-50 Card and Module Layout ............................................................... 2-32 MXC50 and ECU50 Cards ............................................................................ 2-33 XDM-100 Card and Module Layout ............................................................. 2-35 MXC and ECU Cards .................................................................................... 2-37 XDM-300 Card and Module Layout ............................................................. 2-40 MXC300 and ECU300 Cards ........................................................................ 2-41 XDM-900 Card and Module Layout ............................................................. 2-44 MXC900 and ECU900 Cards ........................................................................ 2-46 XDM-40 Card Layout ................................................................................... 2-48 XDM-400 Card Layout ................................................................................. 2-49 XDM-450 Card Layout ................................................................................. 2-50 XDM-500 Card Layout ................................................................................. 2-51 XDM-1000 Card Layout ............................................................................... 2-52 XDM-2000 Card Layout ............................................................................... 2-54 XDM-3000 Card Layout ............................................................................... 2-55 Control, Matrix, and I/O Cards for Large XDM Shelves .............................. 2-57

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Physical Description


XDM Shelf Configurations This section describes the XDM shelf c onfigurations and slot assignments.

XDM-50 Shelf Layout The XDM-50 is available in two configurations: 

Basic XDM-50 shelf with 21 protected E1 interfaces



XDM-50 with I/O protection

Basic XDM-50 shelf The basic XDM-50 shelf is housed in a 231 mm deep, 443 mm wide, and 129 mm high equipment cage. The lower part of the shelf consists of the card cage and accommodates the MXC50 (Main Cross connect and Control) cards (main and protection), the ECU50 (External Connection Unit), the CCP50_2 (Common Connection Panel), and the INF50 (Input Filter) cards. The upper part of the shelf consists of the module cage that houses up to four I/O modules. Various types of interface modules supporting PDH, SDH, and data services are available. The FCU50 fan control unit at the right side of the shelf provides cooling air to the system. Electrical connections are located directly in the tributary modules, except for the CCP50_2, which provides electrical connection to the PDB_21 (PDH Daughter Board) residing in the MXC50. To support system redundancy, the XDM-50 contains two INF50 units with connectors for two input power sources.

Figure 2-1: Basic XDM-50 shelf

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XDM-50 with I/O protection A Tributary Protection Unit (TPU) is mounted on top of the basic XDM-50 shelf to provide I/O protection to the I/O modules. The TPU adds only 75 mm to the basic shelf height, allowing it to remain ultra compact in size. It has five slots, four allocated for Tributary Protection Modules (TPMs) and one for a Tributary Control (TC) or Tributary Control and Fan (TCF) module. Each TPM is connected to both operating and protection I/O modules in the shelf, in a 1:1 or 1:3 configuration. If a failure is detected in one of the operating I/O modules, the TC (or TCF) switches the traffic from the active to the protection I/O module.

Figure 2-2: XDM-50 with TPU (I/O protection)

XDM-100 Shelf Layout The XDM-100 is available in four configurations: 

Basic XDM-100 shelf



XDM-100 with I/O protection

 

Nonredundant XDM-100 Hybrid XDM-100H

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Basic XDM-100 shelf The basic XDM-100 shelf is housed in a 231 mm deep, 443 mm wide, and 200 mm high equipment cage. The lower part of the shelf consists of the card cage and accommodates the MXC-100 cards (main and protection) and the ECU. The upper part of the shelf consists of the module cage that houses up to eight I/O modules. Various types of interface modules supporting PDH, SDH, and data services are available. The FCU fan control unit at the right side of the shelf provides cooling air to the system. All electrical connections are located directly in t he tributary modules; therefore, the XDM-100 does not need additional electrical interface connections. To support system redundancy, each MXC card contains an integrated xINF (XDM Input Filter) unit with connectors for two input power sources.

Figure 2-3: Basic XDM-100 shelf

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XDM-100 with I/O protection A TPU is mounted on top of the basic XDM -100 shelf to provide I/O protection to the I/O modules. The TPU adds only 75 mm to the basic shelf height, allowing the XDM-100 to remain compact in size. It has five slots, four allocated for TPMs and one for a TC module. Each TPM is connected to both operating and protection I/O modules in the shelf in a 1:1, 1:2, or 1:3 configuration. If a failure is detected in one of the operating I/O modules, the TC switches the traffic from the active to the protection I/O module.

Figure 2-4: XDM-100 with TPU (I/O protection)

Nonredundant XDM-100 NOTE: The nonredundant XDM-100 configuration is not recommended for data applications.

The nonredundant XDM-100 has the same physical dimensions as the basic shelf. It differs only by the single MXC-100 card that it has in slot MXC A, compared with two cards in the basic shelf. Slot MXC B of the nonredundant configuration accommodates a bridging unit, MXC-BR. No redundancy is provided for the MXC-100 functions.

Figure 2-5: XDM-100 nonredundant configuration

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XDM-100H The XDM-100H combines the SDH/SONET and data capabilities of the XDM-100 with the optical CWDM capabilities. This is provided by the software cost option incorporated within the NVM card in each of the MXC-100 cards. The XDM-100H consists of the basic XDM-100 shelf, and if required, one or two TPU/OCU shelves. The I/O module cage can accept any mix of the XDM-100 I/O modules and CWDM I/O modules. The TPU/OCU shelf is identical in its physical dimensions and number of slots (five) to the TPU. Four of the slots can house any mix of TPMs and CWDM optical networking modules (mux/demux, OADM, and splitter/coupler); the fifth slot always accommodates a TC module.

Figure 2-6: XDM-100H with one TPU/OCU shelf

XDM-300 Shelf Layout The XDM-300 is available in following configurations: 

Basic XDM-300 shelf



Expanded XDM-300 with I/O protection as follows: 

A TPU mounted on top of the basic shelf.



A TPU mounted at the bottom of the basic shelf.





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Two TPUs mounted, one on top and one at the bottom of the basic shelf.

Expanded XDM-300 with enhanced CWDM networking capabilities. An OCU is mounted on top of the basic shelf, or on the expanded shelf (with a TPU).


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Basic XDM-300 shelf The basic XDM-300 shelf is housed in a 246 mm deep, 443 mm wide, and 350 mm high equipment cage. The upper part of the shelf consists of a module cage (upper module cage) and houses up to eight I/O modules. In the middle of the shelf is a card cage that accommodate the MXC300 cards (main and protection), the External Connection Unit (ECU300), and up to two I/O cards. The lower part of the shelf consists of an additional module cage (lower module cage) that can be equipped with up to eight I/O modules. I/O protection is not supported in this option. The XDM-300 shelf can be installed in a horizontal or vertical position.

Figure 2-7: Basic XDM-300 shelf, horizontal installation

Figure 2-8: Basic XDM-300 shelf, vertical Installation

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Expanded XDM-300 with I/O Protection TPUs can be attached to the XDM-300 shelf t o protect installed I/O modules. Each TPM is connected to both operating and protection I/O modules in the shelf in a 1:1, 1:2, or 1:3 configuration. If a failure is detected in one of the operating I/O modules, the active MXC300 via the TC module in the TPU switches the traffic from the active I/O module to the protection module. Several protection configurations are possible: 

A TPU mounted on top of the basic shelf, protects I/O modules residing in the upper module cage.



A TPU mounted at the bottom of the basic shelf, protects I/O modules installed in the lower module cage.



Two TPUs mounted one on top and one at the bottom of the basic shelf; provide protection to I/O modules in both the upper and lower module cages.

Figure 2-9: XDM-300 with TPU on top

Figure 2-10: XDM-300 with TPUs on top and at the bottom of the shelf

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Expanded XDM-300 with CWDM Networking Capabilities An OCU can be mounted on top of a basic XDM-300 shelf or on top of an expanded shelf to add enhanced CWDM networking capabilities to the platform. NOTE: An OCU is not supported at the bottom of the XDM-300 shelf.

Figure 2-11: XDM-300 with two TPUs and an OCU

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XDM-900 Shelf Layout The XDM-300 is available in following configurations: 

Basic XDM-900 shelf



Expanded XDM-900 with I/O protection as follows:   



A TPU mounted on top of the basic shelf. A TPU mounted at the bottom of the basic shelf. Two TPUs mounted, one on top and one at the bottom of the basic shelf.

Expanded XDM-900 with enhanced CWDM networking capabilities. An OCU is mounted on top of the basic shelf, or on the expanded shelf (with a TPU).

Basic XDM-900 shelf The basic XDM-900 shelf is housed in a 246 mm deep, 443 mm wide, and 350 mm high equipment cage. The upper part of the shelf consists of a module cage (upper module cage) and houses up to eight I/O modules. In the middle of the shelf is a card cage that accommodate the MXC900 cards (main and protection), the External Connection Unit (ECU900), and up to two I/O cards. The lower part of the shelf consists of an additional module cage (lower module cage) that can be equipped with up to eight I/O modules. I/O protection is not supported in this option. The XDM-900 shelf can be installed in a horizontal or vertical position.

Figure 2-12: Basic XDM-900 shelf, horizontal installation

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Figure 2-13: Basic XDM-900 shelf, vertical Installation

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Expanded XDM-900 with I/O Protection TPUs can be attached to the XDM-900 shelf t o protect installed I/O modules. Each TPM is connected to both operating and protection I/O modules in the shelf in a 1:1, 1:2, or 1:3 configuration. If a failure is detected in one of the operating I/O modules, the active MXC900 via the TC module in the TPU switches the traffic from the active I/O module to the protection module. Several protection configurations are possible: 

A TPU mounted on top of the basic shelf, protects I/O modules residing in the upper module cage.



A TPU mounted at the bottom of the basic shelf, protects I/O modules installed in the lower module cage.



Two TPUs mounted one on top and one at the bottom of the basic shelf; provide protection to I/O modules in both the upper and lower module cages.

Figure 2-14: XDM-900 with TPU on top

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Figure 2-15: XDM-900 with TPUs on top and at the bottom

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Expanded XDM-900 with CWDM Networking Capabilities An OCU can be mounted on top of a basic XDM-900 shelf or on top of an expanded shelf to add enhanced CWDM networking capabilities to the platform. NOTE: An OCU is not supported at the bottom of the XDM-900 shelf.

Figure 2-16: XDM-900 with two TPUs and an OCU

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XDM-40 Shelf Layout The compact XDM-40 shelf is located in a 285 mm deep, 447 mm wide, and 256 mm high equipment cage. The cards cage houses two I/O slots for optical cards (transponders, combiners, and/or optical a mplifiers). The upper cage houses two slots for the DWDM/amplifier modules. The shelf also includes an xMCP_B, MECP, two xINF40s, and an xFCU40 that includes three separate fans to support system redundancy.

Figure 2-17: XDM-40 shelf layout

XDM-400 Shelf Layout The compact XDM-400 shelf is located in a 285 mm deep, 450 mm wide, and 500 mm high equipment cage. It consists of a single-row cage housing I/O, matrix, processor, and common cards in the middle and right side of the shelf. The electrical interface connection modules are housed in two slots on the left side of the shelf. The shelf also contains two xINF4 (XDM-400 Input Filter) units and an xFCU4 (XDM-400 Fan Control Unit) that consists of five separate fans that provide system redundancy.

Figure 2-18: XDM-400 shelf open view

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XDM-450 Shelf Layout The standard XDM-450 is located in a 275 mm deep, 492 mm wide, and 374 mm high shelf with a single cards cage section. The shelf consists of a single-row cage housing the DWDM, processor, and common cards. The shelf also has two xINF and an xFCU unit.

Figure 2-19: XDM-450 platform

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XDM-500 Shelf Layout The XDM-500 compact shelf is located in a 285 mm deep, 450 mm wide, and 725 mm high equipment cage. The shelf consists of a single-row cage housing the I/O, matrix, processor, and common cards in two slot areas on either side of the shelf. The electrical interface connection modules and DWDM/OADM modules are housed in the central slot area. The shelf also has two xINF and three xFCU units.

Figure 2-20: XDM-500 shelf open view

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XDM-1000 Shelf Layout The standard XDM-1000 is located in a 285 mm deep, 450 mm wide, and 1100 mm high shelf with a modules cage and a cards cage section. The cards cage houses the I/O, matrix, processor, and common cards. The modules cage houses the electrical interface connection modules and DWDM/OADM modules. The shelf also has two xINFs and three xFCUs.

Figure 2-21: XDM-1000 standard shelf open view

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XDM-2000 Shelf Layout The XDM-2000 shelf is located in a 285 mm deep, 450 mm wide, and 775 mm high equipment cage. The shelf consists of a single-row cage that houses optical cards (transponders, mux/demux, optical amplifiers), and xMCP/xMCP_B and MECP cards. XDM-500 and XDM-2000 shelves may be used in conjunction with the regular XDM-1000 shelf in the same rack.

Figure 2-22: XDM-2000 open view

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XDM-3000 Shelf Layout The XDM-3000 is located in a 350 mm deep, 492 mm wide, and 1550 mm high shelf. The XDM-3000 consists of an I/O card cage arranged in four sections, together with additional power, communication, and control units.

Figure 2-23: XDM-3000 front view

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Rack Layouts and Expansion Shelves XDM shelves can be installed in both standard and ECI recommended ETSI racks, as well as in 19" and 23" racks. They can also be installed in 19" 7' and 23" 7' bay racks, except for the XDM-50, XDM-100, and XDM-300 that cannot be installed in 19" 7'bay racks. The recommended ETSI rack offered by ECI is specially designed for installation of telecommunication equipment and a wide range of equipment accessories. To facilitate cable routing, the rack has removable rear and side panels which enable tidy leading and efficient maintenance of all rack cables. Two plastic conduits on the rack's front rails support routing of up to 200 optical fibers. It also has open top and bottom frames to facilitate easy routing of cables from suspension floors and/or ceiling ladders. The front door can be mounted for right or left opening. The XDM-50, XDM-100, or XDM-300 can be installed in either 2200 mm or 2600 mm standard or ECI recommended ETSI racks. NOTE: Installations of XDM-50, XDM-100, or XDM-300 in 19" racks must be approved by ECI's Transport Networks Division – Mechanical Department.

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Figure 2-24: Three XDM-50 shelves in a 2600 mm ECI recommended ETSI rack

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Figure 2-25: Three XDM-100 or XDM-200 shelves in a 2600 mm ECI recommended ETSI rack

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Figure 2-26: Two XDM-300 shelves in a 2600 mm ECI recommended ETSI rack

The XDM-1000 can be installed in either a 2200 mm or 2600 mm ETSI rack. Two XDM-1000 shelves can be installed in a 2600 mm rack, whereas a 2200 mm rack can accommodate only a single XDM-1000 shelf. Alternatively, two XDM-500 and/or XDM-2000 shelves can be installed in a 2200 mm rack. One XDM-1000 shelf and one XDM-500 or XDM-2000 shelf can be installed in a 2600 mm rack. The installation of XDM-500, XDM-1000, and XDM-2000 in 19" or 23" racks is supported as well.

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In addition, a 600 mm deep rack can house XDM shelves in a back-to-back configuration, thus doubling the capacity of the rack.

Figure 2-27: XDM-1000 and XDM-500 shelves in a 2600 mm ECI recommended ETSI rack

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Figure 2-28: Two XDM-500 shelves installed in a 2200 mm ETSI rack

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Figure 2-29: Two XDM-40 shelves installed in a 2200 mm ETSI rack

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Figure 2-30: Two XDM-2000 shelves installed in a 2200 mm ECI recommended ETSI rack

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Figure 2-31: Two XDM-1000 shelves installed in a 2600 mm ECI recommended ETSI rack

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Figure 2-32: XDM-1000 and XDM-100H shelves installed in a 2200 mm ECI recommended ETSI rack

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Figure 2-33: XDM-500 and XDM-100H shelves installed in a 2200 mm ECI recommended ETSI rack

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XDM-50 Card and Module Layout Basic XDM-50 Shelf The basic XDM-50 cage contains slots for I/O interface modules and dedicated slots for the MXC50, CCP50, INF50, and ECU50. The cage's design and mechanical practice conform to international mechanical standards and specifications. The modules and cards are distributed as follows:  

Four (4) slots, I1 to I4, optimally allocated for I/O interface modules. Two (2) slots, A and B respectively, allocated for the MXC50s (main and protection). Each MXC50 has three slots (A1, A2, A3 and B1, B2, B3) to accommodate SDH aggregate SFP transceivers.



One (1) slot allocated for the CCP50_2.



Two (2) slots allocated for INF50 cards.



One (1) slot allocated for the ECU50.

The CCP50_2 provides the physical connection to 21 E1 interfaces in the PDB2_21 residing in the MXC50. Two INF50 filter cards, with inputs for two sources, support system DC redundancy. The ECU50 is located beneath the MXC50s. Its front panel features several interface connectors for management, external timing, alarms, orderwire and overhead (future release). It also includes colored alarm severity LED indicators.

Figure 2-34: XDM-50 slot allocation

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Expanded XDM-50 Shelf with I/O Protection A TPU can be mounted on top of the basic XDM-50 shelf to add protection of electrical I/O modules. The modules are distributed as follows: 

Four (4) slots flexibly allocated for TPMs (single-slot, double-slot, or triple-slot modules are supported)



One (1) slot allocated for the TC or TCF

Each TPM is connected to the operating and protection modules of the XDM-50 shelf respectively. If a failure is detected in one of the operating I/O modules, the XDM-50 control system sends control signals to the appropriate TPM relays to switch traffic from the operating I/O module to the protection module. Several types of TPMs for 1:1 or 1:3 protection schemes are supported. The TC or TCF is connected to the DC and control buses of the MXC50 cards via the TPU backplane. It controls the switching of traffic from the main to protection I/O module by relays in the corresponding TPM. In addition, the TCF has three fans that provide cooling air to the modules installed in the TPU (optional).

MXC50 and ECU50 Cards The MXC50 and ECU50 were designed to facilitate simple installation and maintenance. They feature: 

Easy routing of external management interfaces



Hot insertion of cards and modules to support quick and non-traffic-affecting maintenance and repair

MXC50 The MXC50 performs the shelf's cross-connect, timing, and multiplexing functions, including: 

Multiplexer control and traffic processing.



SDH traffic cross-connect. The switch handles aggregate and tributary interface traffic with a capacity of 128 x STM-1 (64 x STM-1 in use) equivalents.



Timing and synchronization.



Routing and handling of 16 DCC channels.

The XDM-50 supports several types of cross connects in compliance with applicable ITU-T and Telcordia standards. These include broadband, wideband, and integrated broadband/wideband cross connects.

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ECU50 and ECU50R The ECU50 is the alarms and maintenance card. It is available in two versions: ECU50 and ECU50R. The functions of both cards are similar; the main difference is that the ECU50R does not support OW. The ECU50 provides a variety of interfaces and indicators, as follows: 

RS-232 serial interface for a craft terminal



Ethernet RJ45 interface for Lightsoft ® and EMS-XDM®



Alarm severity outputs (Critical, Major, Minor, Warning) and external alarm outputs and inputs (D-type SCSI connector)



External synchronization inputs/outputs (T3/T4)



Alarms and status display



Analog orderwire (OW) circuit, providing point-to-point or conference engineering orderwire voice connection for technical st aff use (future release)



Pushbuttons for LED tests, forced laser activation during ALS, alarms cutoff (ACO), and OW circuit (future release)

 

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NET SEL switch (A/B) Optional USB interface (future use, for craft terminal)


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XDM-100 Card and Module Layout Basic XDM-100 Shelf The basic XDM-100 cage contains slots for I/O interface modules, and dedicated slots for the MXC cards and the ECU. The cage's design and mechanical practice conform to international mechanical standards and specifications. The modules and cards are distributed as follows:  



Eight (8) slots, I1 to I8, optimally allocated for I/O interface modules. Two (2) slots, A and B respectively, allocated for the MXC cards (main and protection). Each MXC has two slots (A1 and A2 and B1 and B2) to accommodate SDH/SONET aggregate modules. One (1) slot allocated for the ECU.

The ECU is located beneath the MXC cards. Its front panel features several interface connectors for management, external timing, alarms, orderwire, and overhead (future release). It also includes colored alarm severity LED indicators and selectors, and a display for selecting specific modules and ports for monitoring purposes.


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Expanded XDM-100 Shelf with I/O Protection A TPU can be mounted on top of the basic XDM-100 shelf to add protection of electrical I/O modules. The modules are distributed as follows: 

Four (4) slots flexibly allocated for TPMs (single-slot or double-slot modules are supported)



One (1) slot allocated for the TC or TCF module

Each TPM is connected to the operating and protection modules of the XDM-100 shelf respectively. If a failure is detected in one of the operating I/O modules, the XDM-100 control system sends control signals to the appropriate TPM relays to switch traffic from the operating I/O module to the protection module. Several types of TPMs for 1:1, 1:2, or 1:3 protection schemes are supported. The TC or TCF is connected to the DC and control buses of the MXC cards via the TPU backplane. It controls the switching of traffic from the main t o protection I/O module by relays in the corresponding TPM. In addition, the TCF has four fans that provide cooling air to the modules installed in the TPU (optional).

Nonredundant XDM-100 Shelf The XDM-100 is also available in a nonredundant configuration. This shelf is equipped with only one MXC. The second position of the MXC houses an MXC-BG card that bridges the buses of the second slot to the I/O modules. Redundancy for power supply, timing and synchronization, cross-connect, and all other MXC functions is not supported in this configuration. However, since the MXC has two aggregate modules, SNCP, MSP, and MS-SPRing traffic protection mechanisms are supported.

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XDM-100H Shelf The XDM-100H platform is based on the basic XDM-100 shelf, with a software cost option that supports installation of any mix of the XDM-100 I/O modules with optical I/O modules in the module cage. In addition, one or two TPU/OCU shelves can be mounted on top of the basic s helf to support any mix of TPM and CWDM optical networking modules. The XDM-100H consists of the following units: 

Basic XDM-100 shelf that includes the ECU or ECU-F, two MXC-100 cards, the I/O module cage with eight slots, and the FCU. Each MXC-100 card houses an NVM module which contains the licensed option software. The eight slots of the I/O module cage support installation of XDM-100 I/O modules, as well as CWDM I/O modules (transponders and combiners).



TPU/OCU shelf (optional), mounted on top of the XDM-100 basic shelf. It contains five (5) slots: four (4) for supporting any mix of mux/demux, OADM, splitter/coupler, and TPM modules, and one (1) for a TC module. One or two TPU/OCUs can be mounted on the basic XDM-100 shelf.

MXC and ECU Cards The MXC and ECU were designed to facilitate simple installation and maintenance. They feature: 

Electrical interface connectors that are integrated into the I/O modules, saving the need for separate electrical interface modules






Monitoring system for acceptance test purposes




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MXC Two types of MXC cards are available: 

MXC-100 – used in XDM-100. It has two slots for housing aggregate modules in XDM-100. Two MXC-100 cards are usually installed in the XDM-100, providing 1+1 protection.



MXC-100B – supported only for XDM-100. Features enhanced cross-connect and timing functionality, and also supports OW.

The basic and expanded versions of the XDM-100 shelf accommodate two identical MXC cards. By default, the MXC-A is the main card and MXC-B is the protection card. Both cards perform the following functions simultaneously in a 1+1 protection configuration: 

Communication and control



Alarm and maintenance



Cross-connect



Timing and synchronization



Distribution of power supply to all modules



Routing and handling of 32 DCC channels



Support for OW in conjunction with ECU100B (only MXC-100B)

In addition, the MXC accommodates the NVM compact flash memory card and houses SDH/SONET aggregate modules (SAMs). The additional MXC card provides 1+1 protection to the cross-connect matrix and full 1:1 protection to all other functions, since the standby MXC has an identical database to the active MXC. In case of a hardware failure in the active MXC or in its traffic interconnections, the I/O interface modules switch to the protection MXC within 50 ms. Similarly, in case of a hardware failure in the TiMing Unit (TMU) of the operational MXC card, the backup TMU takes over the timing control with no disruption in traffic. The operational MXC card is configured by LightSoft, ECI's Optical Network Division's multidimensional network manager.

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ECU The ECU connects management, alarms, overhead access, and orderwire interfaces to the active MXC card. This card also provides the physical connections for these interfaces. Two types of ECU cards are available: 

ECU-F – supports full functionality, is usually used in the XDM-100



ECU – supports reduced functionality and can also be used in XDM-100 installations

The ECU-F supports the following management and alarm interfaces and functions: 

Ethernet interface to LightSoft and EMS-XDM



Ethernet hub for multiple NE connections



Serial RS-232 interface for craft terminal



USB interface



Synchronization inputs and outputs (T3/T4)



Alarm severity outputs (Critical, Major, Minor, Warning)



External alarm outputs and inputs



Alarm Cut Off (ACO)



Operation and alarm LEDs



Selection and display of traffic interfaces for monitoring purposes



Monitor interface for STM-1/OC-3 ports



Laser activation during ALS, for maintenance purposes



Multiplexer reset



Holdup capacitors



Lamp test activation

The ECU supports all functions provided by the ECU-F except for Ethernet expansion to hub, monitoring points, holdup capacitors, and alarms in/out.

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XDM-300 Card and Module Layout Basic XDM-300 Shelf The basic XDM-300 shelf is 443 mm wide, 246 mm deep and 350 mm high. When the optional TPUs or OCU are attached to the shelf, each of these expansion shelves adds 75 mm to the height of the basic shelf. The rightmost slot of the shelf houses the FCU300. The middle part of the shelf consists of the cards cage with five horizontal slots which accommodate: 

ECU300 or ECU300-F



Two MXC300 cards (main and protect)



Up to two quad I/O cards NOTE: The slots of the quad I/O cards can be adapted to accommodate one SIM16_1 I/O module each instead of the I/O cards by using a mechanical adapter.

The upper and lower parts of the shelf consist of a module cage with eight horizontal slots. Each module cage can house up to eight I/O (PDH, SDH, or data) single slot modules, totaling a maximum of 16 modules.


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Expanded XDM-300 Shelf with I/O Protection In an expanded XDM-300 shelf with I/O protection, one or two TPUs are mounted on the top and/or at the bottom of the basic shelf, including a TC or TCF module and TPMs. An OCU with CWDM networking modules can be mounted on top of a basic or expanded shelf. The TPU modules are distributed as follows: 





Each TPM is connected to the operating and protection modules of the XDM-300 shelf respectively. If a failure is detected in one of the operating I/O modules, the XDM-300 control system sends control signals to the appropriate TPM relays to switch traffic from the operating I/O module to the protection module. Several types of TPMs for 1:1, 1:2, or 1:3 protection schemes are supported. The TC or TCF is connected to the DC and control buses of the MXC300 cards via the TPU backplane. It controls the switching of traffic from the main to protection I/O module by relays in the corresponding TPM. In addition, the TCF has four fans that provide cooling air to the modules installed in the TPU (optional).












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MXC300 The XDM-300 is a redundant platform, and two MXC300 cards must always be installed in slots MXC-A and MXC-B of the XDM-300 shelf. The MXC300 performs the following functions: 

Communications and control (by CPU): 

Routing and handling of 64 DCC channels



Control of all shelf cards and modules



Management interface





Alarms and maintenance



Control of TPU/OCU shelves





2.5 Gbps capacity for all I/O module slots, and 10 Gbps for I/O card slots

SDH-related functions: 

SDH timing and synchronization



SDH cross connect 4/3/1



60 Gbps HO/LO nonblocking matrix



Support for CWDM I/O modules (transponders and combiners) in all I/O module slots



DC voltage supply: 

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Support of the 256 Mb NonVolatile compact flash Memory (NVM) card

One 48 V DC power input that supplies voltages for all cards and modules



Input Filtering (INF) function for the entire shelf



Voltage and control for Fan Control Unit (VFCU)


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ECU300 Two types of ECU300 cards are available: 

ECU300-F – supports full functionality



ECU300 – supports reduced functionality

ECU300F The ECU300-F supports: 

Management interfaces: 

Management (LightSoft and EMS-XDM) interface (Ethernet)



Ethernet hub for the connection of multiple NEs



Serial (RS-232) interface for craft terminal






Alarm interfaces and indications, including:








External alarm outputs and inputs to client or xRAP-B/xRAP-100



ACO



LEDs for display of operation and alarms

Traffic monitoring, including: 







Selection and display of the traffic interface channel currently being monitored for all I/O module (I1 to I16) slots, as well as, quad I/O card (I17 and I18) slots Monitor interface for STM-1 ports

Activations, including: 

Laser activation during ALS for maintenance purposes



LEDs test for the entire shelf

Hold-up capacitors

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2-43



ECU300 The ECU300 card is suitable for sites that do not require alarms dry-contacts, output system monitoring, and Ethernet hub for management. It supports: 

Management interfaces, including: 





















External alarm outputs and inputs to client or xRAP-B/xRAP-100



ACO



LEDs for the display of operation and alarms






XDM-900 Card and Module Layout Basic XDM-900 Shelf The basic XDM-900 shelf is 443 mm wide, 246 mm deep and 350 mm high. When the optional TPUs or OCU are attached to the shelf, each of these expansion shelves adds 75 mm to the height of the basic shelf. The rightmost slot of the shelf houses the FCU900. The middle part of the shelf consists of the cards cage with five horizontal slots which accommodate: 

ECU900 or ECU900-F



Two MXC900 cards (main and protect)



Two ACP900 modules each in an MXC900



Up to two quad I/O cards NOTE: The slots of the quad I/O cards can be adapted to accommodate one SIM16_1 I/O module each instead of the I/O cards by using a mechanical adapter.

2-44


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The upper and lower parts of the shelf consist of a module cage with eight horizontal slots. Each module cage can house up to eight I/O (PDH, SDH, or data) single slot modules, totaling a maximum of 16 modules.


Expanded XDM-900 Shelf with I/O Protection In an expanded XDM-900 shelf with I/O protection, one or two TPUs are mounted on the top and/or at the bottom of the basic shelf, including a TC or TCF module and TPMs. An OCU with CWDM networking modules can be mounted on top of a basic or expanded shelf. The TPU modules are distributed as follows: 





Each TPM is connected to the operating and protection modules of the XDM-900 shelf respectively. If a failure is detected in one of the operating I/O modules, the XDM-900 control system sends control signals to the appropriate TPM relays to switch traffic from the operating I/O module to the protection module. Several types of TPMs for 1:1, 1:2, or 1:3 protection schemes are supported. The TC or TCF is connected to the DC and control buses of the MX900 cards via the TPU backplane. It controls the switching of traffic from the main to protection I/O module by relays in the corresponding TPM. In addition, the TCF has four fans that provide cooling air to the modules installed in the TPU (optional).

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2-45














MXC900 The XDM-900 is a redundant platform, and two MXC900 cards must always be installed in slots MXC-A and MXC-B of the XDM-40 shelf. The MXC900 performs the following functions: 

Communications and control (by CPU):    

  



SDH/SONET-related functions:  

SDH/SONET timing and synchronization SDH/SONET cross connect 4/3/1



120 Gbps HO/LO nonblocking matrix



Accommodates the ACP-900 module and provides power supply, communication, and control



Support for CWDM I/O modules (transponders and combiners) in all I/O module slots



DC voltage supply: 

 

2-46

Routing and handling of 128 DCC channels Control of all shelf cards and modules Management interface Support of the 256 Mb NonVolatile compact flash Memory (NVM) card Alarms and maintenance Control of TPU/OCU shelves 5 Gbps capacity for all I/O module slots, and 20 Gbps for quad I/O card slots

One 48 VDC power input that supplies voltages for all cards and modules Input Filtering (INF) function for the entire shelf Voltage and control for Fan Control Unit (VFCU)


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ECU900 Two types of ECU900 cards are available: 

ECU900-F – supports full functionality



ECU900 – supports reduced functionality

ECU900F The ECU900F supports: 

Management interfaces: 





















External alarm outputs and inputs to client or xRAP-100



ACO



LEDs for display of operation and alarms

Traffic monitoring, including: 







Selection and display of the traffic interface channel currently being monitored for all I/O module (I1 to I16) slots, as well as, quad I/O card (I17 and I18) slots Monitor interface for STM-1 ports






Hold-up capacitors

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ECU900 The ECU900 card is suitable for sites that do not require alarms dry-contacts, output system monitoring, and Ethernet hub for management. It supports: 

Management interfaces, including: 





















External alarm outputs and inputs to client or xRAP-100



ACO



LEDs for the display of operation and alarms






XDM-40 Card Layout The XDM-40 standard shelf consists of a modules cage housing DWDM and amplification modules, a cards cage housing the I/O cards and common cards, the xFCU40, and the power supply for the fan unit (PSFU). Modules cage 

Two (2) slots (M1 and M2) allocated to DWDM/OADM, optical booster, and accessories modules



Two (2) xINF40s designed for power supply redundancy



One (1) ECM to facilitate routing of external management interfaces, connecting the management, OHA, and OW interfaces to the active xMCP_B

Cards cage

2-48



Two (2) slots (I1 and I2) flexibly allocated to I/O optical transponders, combiners, and/or amplifiers



One (1) slot (C1) allocated to the xMCP_B card



One (1) slot (C3) allocated to the MECP card, for user and management interfaces



PSFU and xFCU40 that consists of three separate fans to support cooling system redundancy


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Hot insertion of cards and modules is allowed to supports quick maintenance and repair activities without affecting traffic.

Figure 2-38: XDM-40 card layout

XDM-400 Card Layout The XDM-400 shelf consists of a single cage containing slots for five I/O cards, and dedicated slots for the XIO (cross-connect and I/O matrix), processor and common cards in the middle and right side of the shelf. The electrical interface connection modules are housed in two slots on the left side of the shelf. The XDM-400 cage design and mechanical practice conform to international mechanical standards and specifications. The cards are distributed as follows: 

Five (5) slots, IS1 to IS5, optimally allocated for I/O cards



Two (2) slots, MS1 and MS2, allocated for electrical interface connection modules



Two (2) slots, X1 and X2, allocated for XIO-192 cards



Two (2) slots, C1 and C2, allocated for xMCP cards

An external connection module, the MECP, is located above the xMCP. It connects the management, overhead access (OHA), and orderwire interfaces to the active xMCP.

Figure 2-39: XDM-400 typical card layout

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2-49



XDM-450 Card Layout The XDM-450 shelf consists of a single cage containing slots for nine DWDM modules and dedicated slots for the processor, management and other common cards. The XDM-450 standard shelf is arranged as follows. 

Nine CCP slots (M1 to M9) flexibly allocated to DWDM modules such as ROADMs, Mux/DeMuxes, and amplifiers.



One slot (C0) allocated to the xECM-450 card, for user and management interfaces.



One slot (C1) allocated to the xMCP-B2G card.



One slot for optional OSC Mux/DeMux module with integrated C/T filter (ACC4OSC5).



Two xINF-450 modules designed for power s upply redundancy.



xFCU-450 fan unit to support cooling system redundancy.

The XDM-450 standard card layout is illustrated in the following figure.

Figure 2-40: XDM-450 slot layout

2-50


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XDM-500 Card Layout The XDM-500 shelf consists of a single cage containing slots for six I/O cards, four connection modules, and dedicated slots for the matrix, processor, and common cards. The XDM-500 cage design and mechanical practice conform to international mechanical standards and specifications. The cards are distributed as follows: 

Six (6) slots, IC1 to IC6, flexibly allocated for I/O cards and/or transponders (depending on the configuration)



Four (4) slots, MC1 to MC4, allocated for electric interface connection modules or DWDM/OADM modules



Two (2) slots, X1 and X2, allocated for the HLXC or XIO matrix cards



Two (2) slots, C1 and C2, allocated for the xMCP cards

An external connection module, the MECP, is located above the xMCP/xMCP_B cards for connecting the management, overhead access, and orderwire interfaces to the active xMCP/xMCP_B.

Figure 2-41: XDM-500 standard card layout

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2-51



XDM-1000 Card Layout The standard XDM-1000 consists of a modules cage housing the connection modules, a cards cage housing the I/O and common cards, input filters, and fan control units. The XDM-1000 standard card layout is illustrated in XDM-1000 standard card layout (page 2-53) and is allocated as described in the following paragraphs.

Modules Cage 

Eleven (11) slots, M1 to M11, allocated for electric interface connection modules or DWDM/OADM, optical booster, optical preamp modules



Two xINFs

Cards Cage 

Twelve (12) slots, I1 to I12, flexibly allocated for I/O cards and/or transponders (depending on the configuration)



Two (2) slots, X1 and X2, allocated for the HLXC or XIO matrix cards



Two (2) slots, C1 and C2, allocated for the xMCP/xMCP_B cards

An external connection module, the MECP, is located in the cards cage of the XDM-1000 above the xMCP/xMCP_B cards. It is used to connect the management, overhead access, and orderwire interfaces to the active xMCP/xMCP_B card. The modules cage contains 11 double-slot connection modules. Electrical I/O cards installed in the cards cage interface with the XDM-1000 via connection modules installed in the modules cage. The modules are extractable, thus allowing a flexible assignment of physical I/O ports.

2-52


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Optical I/O cards utilize internal slide-in I/O modules for signal interfacing and do not require connection modules in the modules cage. The free modules cage slots in optical systems can therefore be all ocated to DWDM or OADM multiplexing and amplification modules.


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2-53



XDM-2000 Card Layout The XDM-2000 consists of a single cage whose slots can be allocated as follows: 

Twelve (12) slots, I1 to I12, allocated for transponders and other optical modules



Two (2) slots, X1 and X2, allocated for mux/demux or matrix cards (depending on the system configuration)



Two (2) slots, C1 and C2, allocated for the xMCP/xMCP_B cards

The external connection module, the MECP, is located in the upper section of the cage. The cage design and mechanical practice of the XDM-2000 conform to international mechanical standards and specifications.


2-54


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XDM-3000 Card Layout The XDM-3000 consists of an I/O card cage arranged in four sections, together with additional power, communication, and control units, as follows: 

24 slots (I1 to I24) flexibly allocated to I/O cards and/or amplifiers, depending on the configuration. I/O card options include combinations of up to 24 SIO1&4B, SIO164, DIOB, and/or MCS5/10 cards. Single channel OFA2 or OFA_M amplifiers can be used for long distance applications.



Two slots (X1 and X2) allocated to HLXC1536 matrix cards.



Two slots (A1 and A2) allocated to ACP3000 ASON cards.



Two slots (C1 and C2) allocated to the xMCP-B2G cards.



One slot (C0) allocated to the MECP card, for user and management interfaces.



One ECB3000 that provides external connections for the MECP card.



Two INF3000s designed for power s upply redundancy.



Two FCU3000 fan units with ten fans each.

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2-55



The XDM-3000 card layout is illustrated in the following figure.


2-56


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Control, Matrix, and I/O Cards for Large XDM Shelves NOTE: HLXC and XIO matrix cards are offered in several versions for large XDM shelves. The generic names HLXC and XIO are used in the following sections to describe the cards functionality when the information applies to all versions.

XDM shelves have been designed to facilitate simple installation and easy maintenance. They incorporate the following layout features: 

The connection modules in the modules cage (XDM-400, XDM-500, and XDM-1000) are located as close as possible to the I/O cards in the cards cage



The HLXC-L, HLXC-R, or XIO matrix cards are located near the sidewall of the shelf to facilitate the routing of traffic buses to the I/O cards



The xMCP/xMCP_B control cards are located such that they simplify the identification of any control problem issues



The MECP is located above the xMCP/xMCP_B to facilitate the routing of the external management interfaces

HLXC192/384/768/1536 Three versions of HLXC matrix cards are offered for XDM large shelves. They differ in their switching capacity as follows: 

HLXC192 – supports 192 x 192 STM-1 streams









HLXC1536 - supports 1536 x 1536 STM-1 streams NOTE: HLXC384 and HLXC768 are not supported in XDM-500.

NOTE: HLX1536 is supported in XDM-3000 only.

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2-57



The XDM-500, XDM-1000, XDM-2000, and XDM-3000 contain two identical HLXC cards. Both cards perform the cross-connect and node synchronization functions simultaneously in a 1+1 protection configuration. In case of a hardware failure in the operational HLXC or in its traffic interconnections, the I/O interface cards switch to the backup HLXC within 50 ms. Similarly, in case of a hardware failure in the TMU of the operational HLXC, the backup TMU takes over the timing control with no traffic disruption. The operational HLXC is determined by the LightSoft network manager.

XIO192/384F XIO cards combine the functionality of an HLXC card with that of SDH I/O cards. Two versions of XIO cards are offered for XDM large shelves. They differ in their switching capacity and SDH supported ports: 

XIO192 – switching of 192 x 192 STM-1 streams. Supports 1 x STM-16/OCU-48 interface, 4 x STM-1/OC-3 interfaces, or 1 x STM-4/OCU-12 interface.



XIO384F – switching of 384 x 384 STM-1 streams. Supports 1 x STM-64/OC-192 interface or 4 x STM-16/OC-48 S TM-16/OC-48 interfaces. NOTE: XIO384F is not supported in XDM-400.

NOTE: XIO cards are not supported in XDM-3000.

The XDM can optionally contain two identical XIO cards (in the XDM-400, the XIO is the only dedicated matrix card). XIO cards consist of a matrix unit and SDH/SONET interfaces on the same basecard. Like the HLXC, XIO cards perform the cross-connect and node synchronization synchronization functions simultaneously in a 1+1 protection configuration. Upon detection of a hardware failure in the XIO or in its traffic interconnections, I/O cards switch to the backup XIO card within 50 ms. If required, the backup TMU takes over timing control from the operational XIO with no traffic disruption.

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xMCP/xMCP_B The xMCP/xMCP_B performs the communications, control, alarm, and maintenance functions for the XDM. An additional xMCP/xMCP_B may optionally provide full capability 1:1 protection since the standby xMCP/xMCP_B has an identical database to the active xMCP/xMCP_B. Upon a failure of the active xMCP/xMCP_B, the standby xMCP/xMCP_B becomes the active control unit. The xMCP/xMCP_B is also responsible for communicating with external network elements and management stations. It communicates with other SDH/SONET NEs via the DCC channel embedded in each SIO link. In addition, the xMCP/xMCP_B provides multiple access to all overhead bytes in all incoming SDH/SONET lines. It provides 64 kbps and N x 64 kbps trail capability for transporting management data, external DCC channels or for external DCN purposes.

MECP The MECP connects the management, overhead access, and orderwire interfaces to the active xMCP/xMCP_B. The physical management connections are provided by the ECB located above the MECP. The MECP supports standard OW as well as a special voice channel over the DCC when using VoIP and a special router. This feature enables external calls from outside the network to a particular site. In addition, the MECP generates system alarms and activates indicators, for example, software downloads, restarts, configurations, and so on. In pure optical networks and inline amplifier sites, one of two special MECP versions is supplied to support the optical supervisory channel operating at 1510 nm or 1310 nm.

ECB, xECB4, or ECB3000 The ECB provides the physical interface between the XDM and external management and clock devices. This card is also available in special two versions, xECB4 for the XDM-400, and ECB3000 for the XDM-3000.

ECM40 The ECM40 provides the physical connections to the XDM-40 alarms, provisioning (LCT), and OW interfaces. This unit is a dedicated module, used only in the XDM-40.

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2-60



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3 XDM-50 Specifications In this chapter: Cross-Connect Specifications .......................................................................... 3-2 Traffic Protection............................................................................................. 3-2 Redundancy ..................................................................................................... 3-2 Synchronization ............................................................................................... 3-2 Jitter and Wander ............................................................................................. 3-2 I/O Interfaces ................................................................................................... 3-3 Management .................................................................................................... 3-4 SDH Interfaces ................................................................................................ 3-5 Data Modules................................................................................................... 3-8 Physical Specifications .................................................................................. 3-11 Environmental Conditions ............................................................................. 3-12 EMC .............................................................................................................. 3-13 Safety............................................................................................................. 3-13 Reliability ...................................................................................................... 3-13

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3-1

XDM-50 Specifications


Cross-Connect Specifications Cross-Connect Levels SDH cross-connect levels ........................................................... VC-4nc, VC-4, VC-3, VC-12

Cross-Connect Capacity SDH switch core options ...................... 128 x STM-1 (64 x STM-1 in use) with cross-connect ....................................................................................................................... capability of 4/3/1

Traffic Protection Applicable specifications ................. ITU-T G.841, G.842, GR-1230-CORE, GR-1400-CORE SNCP I/N LO, HO ................................................................................................. within 30 ms MSP 1+1 ................................................................................................................ within 50 ms

Redundancy Control and synchronization systems..................................................................1+1 duplicated Switching matrix, power system, internal buses, external buses ........................ 1+1 duplicated I/O electrical modules protection .................................................................... 1:1, 1:2, and 1:3

Synchronization There are four timing references available from multiple SDH/PDH timing sources: 

From any 2 MHz/2 Mbps tributary interface



From any SDH line



External SDH 2 MHz/2 Mbps timing outputs (two per shelf)



G.813 internal clock

Synchronization Status Marker (SSM) support is also provided.

Jitter and Wander Applicable specifications .......................................................................... ITU-T G.823, G.825

3-2


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I/O Interfaces 2 Mbps (E1) Physical level .............................................................................................. G.703, Paragraph 6 Frame ......................................................................................................................... Unframed Line code .......................................................................................................................... HDB3

Ω balanced/75 Ω 1 unbalanced Bitrate ........................................................................................................ 2048 Kbps ± 50 ppm Line impedance ................................................................... 120

34 Mbps (E3) Physical level .............................................................................................. G.703, Paragraph 8 Frame ................................................................................................................................ G.751 Line code .......................................................................................................................... HDB3 Line impedance ............................................................................................... 75

Ω unbalanced

45 Mbps (DS-3) Physical level .............................................................................................. G.703, Paragraph 5 Frame .................................................................................................. Unframed, ANSI T1.107 Line code ........................................................................................................................... B3ZS Line impedance ............................................................................................... 75

Ω unbalanced

STM-1 Electrical Physical level ............................................................................................ G.703, Paragraph 12 Bitrate ..................................................................................................... 155.52 Mbps

±20 ppm

Frame ................................................................................................................................ G.707 Line code ............................................................................................................................. CMI

STM-1 Optical Physical level ..................................................................................................... G.957, Table 2 Wavelength .................................................................................................. 1310 nm, 1550 nm Bitrate .................................................................................................... 155.52 Mbps

±4.6 ppm

Transmission range ................................................................................................... S3, L3, L5

1

Through external DDF.

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3-3



STM-4 Optical Physical level ..................................................................................................... G.957, Table 3 Wavelength .................................................................................................. 1310 nm, 1550 nm Bitrate ......................................................................................................... 622 Mbps

±4.6 ppm


Management Applicable specifications ......................................................... G.784, G.774, M.3010, M.3100 LightSoft (network manager) server and client for managing all ECI ..............................................................................................equipment on SUN workstation(s) EMS-XDM (XDM element manager) ...................................................... on SUN workstation LCT-XDM local craft terminal ........................................................................................on PC EMS-XDM and LightSoft can work on the same SUN workstation.

Management and Alarm Interfaces CMIP-like over TCP/IP to EMS-XDM; MTNM from EMS-XDM to LightSoft or other TMN; RS-232 to LCT-XDM; OverHead Access (OHA); orderwire; RAP (Rack Alarm Panel).

Alarms and Performance Performance concept ............................................................................................. G.821, G.826 Alarm concept ...................................................................................................................G.783 Alarm types .................... LED indicators, dry contacts, audible alarms (per subrack), external ............................................................................................................. alarm inputs and outputs Alarm classes ......................................................................... Critical, Major, Minor, Warning

3-4


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SDH Interfaces STM-1 (155.52 Mbps ±4.6 ppm) I/O Module SFP TRANSCEIVER NAME APPLICATION CODE

2

Operating wavelength (nm)

OTR1_S3

OTR1_L3

OTR1_L5

S-1.1

L-1.1

L-1.2

1263-1360

1480-1580

SLM

SLM

1261-1360 3

Source type

MLM

Max. RMS width (nm)

7.7

-

-

Min. side mode suppression ratio (dB)

-

30

30

Min. mean launched power (dBm)

-15

-5

-5

Max. mean launched power (dBm)

-8

0

0

Min. extinction ratio (dB)

8.2

10

10

Min. sensitivity (BER of 1*10 ) EOL dBm)

-28

-34

-34

Min. overload (dBm)

-8

-10

-10

Max. receiver reflectance (dB)

-

-

-25

Max. dispersion [ps/nm]

96

-

-

Min. optical return loss of cable (dB)

-

-

-20

Max. discrete reflectance (dB)

-

-

-25

Max. optical path penalty (dB)

1

1

1

-12

NOTE: When selecting bidirectional transceivers, pay attention that they must operate in complementary pairs. For example: OTR1-S3BD can work only vis-a-vis OTR1-S5BD; OTR4-L3BD can work only vis-a-vis OTR4-L5BD, and so on. The transceivers in the following table are arranged in complementary pairs.

2

Application code is in reference to ITU-T Recommendation G.691. MultiLongitudinal Mode (MLM) source type laser can also operate with single mode fibers for S -1.1 interfaces in reference to ITU-T Recommendation G.957. 3

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3-5


Table 3-1:


STM-1 bidirectional transceivers

SFP transceiver name

OTR1-L3BD

OTR1-L5BD

BD 5

L3BD

L5BD

1260-1360

1480-1580

1280-1360

1480-1580

Source type

MLM

MLM

MLM

SLM

Max. RMS width (nm)

7

3

4

1


-

-

-

30


-14

-14

-5

-5


-8

-8

0

0


10

10

10

10

Min. sensitivity (BER of 1 * 10-12) EOL (dBm)

-32

-32

-32

-32

Min. overload (dBm)

-8

-8

0

0


-

-

-

-

Max. dispersion (ps/nm)

-

-

-

-


-20

-20

-

-


-

-

-

-


1

1

1

1

Application code

OTR1-S3BD

4

BD 3


OTR1-S5BD

5

6

TRANSMITTER

RECEIVER

7

OPTICAL PATH BETWEEN S & R

STM-4 (622 Mbps ±4.6 ppm) I/O Module SFP TRANSCEIVER NAME

OTR4_S3

OTR4_L3

OTR4_L5

S-4.1

L-4.1

L-4.2

1274-1356

1280-1335

1480-1580

Source type

MLM9

SLM

SLM

Max. RMS width (nm)

4/2.5

-

-

Max. -20 dB width (nm)

-

1

<1


-

30

30


-15

-3

-3


-8

+2

+2


8.2

10

10

Min. sensitivity (BER of 1*10 -12) EOL (dBm)

-28

-28

-28

Min. overload (dBm)

-8

-8

-8

APPLICATION CODE

8

Operating wavelength (nm) TRANSMITTER

RECEIVER

4

Application code is in reference to ITU-T Recommendation G.691. BD 3: STM-1 single-fiber bidirectional S FP module with a 1310 nm TX wavelength. 6 BD 5: STM-1 single-fiber bidirectional S FP module with a 1550 nm TX wavelength. 7 Receiver units of SFPs (excl uding bidirectional SFPs) are a wide-band type. 8 Application code is in reference to ITU-T Recommendation G.691. 9 MultiLongitudinal Mode (MLM) source type laser can also operate with single mode fibers for S -1.1 interfaces in reference to ITU-T Recommendation G.957. 5

3-6


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SFP TRANSCEIVER NAME

OTR4_S3

OTR4_L3

OTR4_L5


-

-14

-27


74

-

-


-

20

24


-

-25

-27


1

1

1



Table 3-2:



OTR4_S3BD

OTR4_S5BD

OTR4_L3BD

OTR4_L5BD

S3BD

S5BD

L3BD

L5BD

1260-1360

1480-1580

1260-1360

1480-1580

Source type

MLM

SLM

MLM

SLM

Max. RMS width (nm)

3

1

3

1


-

30

-

30


-15

-15

-3

-3


-8

-8

+2

+2


8.2

8.2

10

10


-28

-28

-28

-28

Min. overload (dBm)

-8

-8

-8

-8


-

-

-

-

-

-

-

Application code

10


RECEIVER

11


Max. dispersion (ps/nm) Min. optical return loss of cable (dB)

-

-

-

-


-

-

-

-


1

1

1

1

10

Application code is in reference to ITU-T Recommendation G.691. Receiver units of SFPs (excluding bidirectional SFPs) are a wide-band type.

11

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3-7



Data Modules DIOM Specifications Module

DIOM_04

DIOM_08

DIOM_40

Service interfaces

4 x 10/100/ 1000BaseT

8 x 10/100BaseT

4 x optical FE/GbE with SFP

Size

1 slot

1 slot

1 slot

Data handling

Layer 1

Layer 1

Layer 1

Network interfaces

4 x EoS

8 x EoS

4 x EoS

Total EoS bandwidth Up to 16 x VC-4 per module in slots I1 Up to 48 x VC-3 to I4 (2.5Gbps) Up to 252 x VC-12

Up to 8 x VC-4 Up to 24 x VC-3 Up to 252 x VC-12


Total bandwidth per 1 to 16 x VC-4 EoS port in slots I1 to 1 to 48 x VC-3 I4 1 to 63 x VC-12

1 to 8 x VC-4 1 to 24 x VC-3 1 to 63 x VC-12


Encapsulation mode

GFP-F

GFP-F

GFP-F

Differential delay compensation

256 ms for VC-3/4 128 ms for VC-12



Maximum frame length

10240 bytes

10240 bytes

10240 bytes

Interfaces ........................ 10/100/1000BaseT, 100BaseFX (single mode and multimode fiber), ...................................................... 1000BaseSX, 1000BaseLX, 1000BaseZX, 1000BaseT SFP Protection ..................................................... IOP 1:1 for both EoS ports and optical user ports Standards compliance............................................ IEEE 802.3z, G.707, G.783, G.7041 (GFP), ........................................................................................................................... G.7042 (LCAS) LCAS ............................................. Enabled or Disabled (VCAT mode), configurable per port Flow control ................................................................................. hitless following IEEE 802.3 Failure forwarding...................................................................................................... CSF, TSF

3-8


417006-2009-013-A01



EISMB Specifications 12

13

Module

EISMB_04

EISMB_40

Service interfaces

2 x 10/100/1000BaseT + 2 x 10/100BaseT

2 x optical FE/GbE + 2 x optical FE with SFP

Size

1 slot

1 slot

Data handling

Layer 2

Layer 2

Network interfaces

2 x GE EoS + 6 x FE EoS

2 x GE EoS + 6 x FE EoS

Total EoS bandwidth per module in slots I3, I4



Total bandwidth per EoS port in slots I3, I4



Encapsulation mode

GFP-F

GFP-F





9600 bytes

9600 bytes

Interfaces .............................................................................. 10/100/1000BaseT, 10/100BaseT, .......................... 100BaseFX (single mode and multimode fiber), 1000BaseSX, 1000BaseLX, .................................................................................................... 1000BaseZX, 1000BaseT SFP Switch capacity ............................................................................................................ 6.4 Gbps MAC address memory ....................................................................................................... 3500 Protection ..................................................... IOP 1:1 for both EoS ports and optical user ports Standards compliance........................ IEEE 802.1D, IEEE 802.1p, IEEE 802.1Q, IEEE 802.3, ................................... IEEE 802.1ad, IEEE 802.3x, IEEE 802.3u, IEEE 802.3z, IEEE 802.1w .......................................................................... G.707, G.783, G.7041 (GFP), G.7042 (LCAS) LCAS ............................................. Enabled or Disabled (VCAT mode), configurable per port Slot support ...................................................................... up to 4 modules in slots I1, I2, I5, I6 Untagged frame handling ........................................ block, forward, attach CTAG and forward

12

The EISMB can be installed only in slots I3, I4. The EISMB can be installed only in slots I3, I4.

13

417006-2009-013-A01


3-9



EISM Specifications 14

Module

EISM_226

Service interfaces

6 x 10/100BaseT + 2 x FE/GbE

Size

2 slots

Data handling

Layer 2

Network interfaces

2 x EoS

Total bandwidth per EoS port

1 to 7 x VC-4 1 to 21 x VC-3

Encapsulation mode

GFP-F

LCAS mode

LCAS and non-LCAS


3.8 ms


9600 bytes

Interfaces .......... 10/100BaseT, 100BaseFX (single mode and multimode fiber), 1000BaseSX, ........................................................................................................ 1000BaseLX, 1000BaseZX Switch capacity ............................................................................................................ 6.4 Gbps MAC address memory ...................................................................................................... 3,500 Protection ............................. IOP 1:1 for both Ethernet over SDH ports and optical user ports Standards compliance........................ IEEE 802.1D, IEEE 802.1p, IEEE 802.1Q, IEEE 802.3, ................................... IEEE 802.1ad, IEEE 802.3x, IEEE 80 2.3u, IEEE 802.3z, IEEE 802.1w .......................................................................... G.707, G.783 , G.7041 (GFP), G.7042 (LCAS) Untagged frame handling .................................................................................... block, forward

Client Transceivers for EISM Cards OTGBE_SX

15

OTGBE_LX

OTGBE_ZX

OTFE_MM

OTFE_SM

Transmitter type

GbE/FC/ FICON 16 short-reach laser, 850 nm, multimode

GbE/FC/ FICON 17 long-reach laser, 1310 nm, single mode

GbE/FC/ FICON 18 very long-reach laser, 1550 nm, single mode

FE, short-reach laser, 1310 multimode

FE, short-reach laser, 1310 nm, single mode

Data rate (nominal) (Gbps)

1.250

1.250

1.250

0.125

0.125

Average Max. launch Min. power (dBm)

-3

-3

5

-8

5

-9.5

-11

0

-15

0

9

9

9

10

10

Min. transmitter extinction ratio (dB)

14

The EISM occupies two slots and can be installed in slot pairs I1-I2, I3-I4. The EISM occupies two slots and may be installed in slot pairs I1-I2 or I3-I4. 16 For EISM applications, GbE interfaces only. 17 For EISM applications, GbE interfaces only. 18 For EISM applications, GbE interfaces only. 15

3-10


417006-2009-013-A01


OTGBE_SX

Data format


15

OTGBE_LX

OTGBE_ZX

OTFE_MM

OTFE_SM

8 B/10 B

8 B/10 B

8 B/10 B

N/A

N/A

Min.

-20

-22

-22

-28

-22

Typical

-21

-25.5

--

-30

--

Max. receiver overload (dBm)

0

0

0

-14

-8

Typical Rx LOS level (dBm)

-24

-29

-25

< -29

< -28

Connector

LC

LC

LC

LC

LC

Fiber lengths

550 m (50/62.5 µm MMF)

10 km (9 µm SMF)

80 km (9 µm SMF)

550 m (50/62.5 µm MMF)

10 km (9 µm SMF)

Average receiver sensitivity (dBm)

Electrical GbE SFP (ETGbE) ETGBE

Notes

Data rate

1000 Mbps

IEEE 802.3 compatible

Connector

RJ-45

Cable type

CAT 5

Cable length

100m

STP (Shielded Twisted Pair)

Physical Specifications Dimensions (H x W x D) XDM-50 .............................................................. 129 x 443 x 231 mm (5.08 x 17.44 x 9.09 in) SIM-1/4, PIM-2/345 .................................................. 35 x 97 x 213 mm (1.38 x 3.82 x 8.38 in) EISMB, DIOM .......................................................... 32 x 97 x 213 mm (1.26 x 3.82 x 8.38 in) EISM, PIM2_63 ......................................................32 x 195 x 213 mm (1.26 x 7.68 x 8.38 in) CCP50_2 ............................................................................. 58.5 x 79 x 251 (2.3 x 3.11 x 9.88) INF50 ................................................................................... 41 x 79 x 252 (1.61 x 3.11 x 9.92) TPM-xx_1/TPM-xx_3 ..............................................72 x 97 x 211 mm (2.83 x 3.82 x 8.31 in) TC, TCF .................................................................... 84 x 45 x 210 mm (2.91 x 1.77 x 8.27 in) MXC50.................................................................. 29 x 300 x 250 mm (1.14 x 11.81 x 9.84 in) ECU50................................................................................ 28 x 230 x 255 (1.1 x 9.05 x 10.04) TPU ...................................................................... 75 x 443 x 231 mm (2.95 x 17.44 x 9.09 in) xRAP (optional) ................................................ 100 x 450 x 285 mm (3.94 x 17.72 x 11.22 in) xRAP-100 (optional) ........................................... 133 x 445 x 185 mm (5.24 x 17.53 x 7.29 in) miniRAP (optional) ................................................. 90 x 445 x 150 mm (3.54 x 17.53 x 5.9 in) Racks ........................................2200/2600 x 600 x 300 mm (86.61/102.36 x 23.62 x 11.81 in) 417006-2009-013-A01


3-11



...................................................................................... 2134 x 584 x 305 mm (82 x 23 x 12 in)

Weight Basic XDM-50 shelf ........................................................................................... 4 kg (8.82 lbs) Basic XDM-50 fully populated ....................................................................... 12 kg (26.46 lbs)

Power Applicable specifications ........................................................ ETSI 300 132-2; FTZ 19 PFL 1 Input voltage ............................................................................................ -40 V dc to -75 V dc Nominal power source ....................................................................................... -48 V or -60 V Power consumption .............................................................. Typical 150 W, maximum 250 W

Main Equipment Power Consumption For the XDM-50 main equipment power consumption refer to XDM-100 Product Line Main Equipment Power Consumption (page 4-24) in section XDM-100 Specifications (page 4-1).

Power Dissipation Power dissipation .................................................... Typical 515 Btu/hr, maximum 855 Btu/hr

Environmental Conditions Operation Applicable specification .................................................................. ETS 300 019-1-3 Class 3.2 Temperature range ............................................................................................. -5 ºC to +55 ºC Relative humidity ..................................................................................................... 5% to 90% NOTE: Extended temperature range of -5 ºC to +65 ºC is supported for specific outdoor configurations.

Storage (packed) Applicable specification ................................................................. ETS 300 019-1-1 Class 1.2 Temperature range ........................................................................................... -25 ºC to +55 ºC Relative humidity ................................................................................................. 10% to 100%

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417006-2009-013-A01



Handling and Transportation Applicable specification ................................................................. ETS 300 019-1-2 Class 2.3 Temperature range .......................................................................................... -40 ºC to +70 ºC Relative humidity ...................................................................................................... up to 95%

EMC Applicable specifications ............................................................................... EN 300 386/2000 Applicable directive ....................................................................... EMC directive 89/336 EEC

Safety Applicable specifications .................................................................................. EN 60950/2000 Applicable CE directive ....................................................................LVD directive 73/23/EEC

Laser Safety Applicable specification ....................................................... EN 60825-1&2 (AS/NZS 2211.2)

CE Compliance The XDM-50 complies with CE standards.

Reliability Life Expected lifetime of the XDM platforms ...................................................................... 15 years

Availability Availability of service for an end-to-end service trail passing through a protected SDH/SONET network................................................................................ better than 99.999%

417006-2009-013-A01


3-13


3-14



417006-2009-013-A01

4 XDM-100 Specifications In this chapter: Cross-Connect Specifications .......................................................................... 4-2 Traffic Protection............................................................................................. 4-3 Redundancy ..................................................................................................... 4-3 Synchronization ............................................................................................... 4-3 Jitter and Wander ............................................................................................. 4-4 I/O Interfaces ................................................................................................... 4-4 Management .................................................................................................... 4-5 SDH/SONET Interfaces .................................................................................. 4-6 Data Modules................................................................................................. 4-13 Optical Amplifier Modules for TPU/OCU .................................................... 4-19 GbE/FC/2 Gbps FC/FICON Optical SFP Transceivers for Transponders/Combiners............................................................................... 4-20 STM-1 SFP Optical supervisory channel transceivers for OSC1_2 .............. 4-21 CWDM Modules ........................................................................................... 4-21 Physical Specifications .................................................................................. 4-23 Environmental Conditions ............................................................................. 4-27 EMC .............................................................................................................. 4-27 Safety............................................................................................................. 4-27 Reliability ...................................................................................................... 4-28

417006-2009-013-A01


4-1



Cross-Connect Specifications Cross-Connect Levels SDH cross-connect levels ........................................................... VC-4nc, VC-4, VC-3, VC-12 SONET cross-connect levels.............................................................................. STS-nc, STS-1

Cross-Connect Capacity SDH switch core options .......................... 192 x STM-1 with cross-connect capability of 4/3/1 SONET switch core options .....................................................................................192 x OC-3

XDM-100 Shelf Capacity XDM-100 shelf slot capacities differ as a function of the type of matrix cards (MXC-100, MXC-100B, or combination of MXC-100, and MXC-BR) used. Although the MXC-100 and the MXC-100B have identical cross-connect capabilities, the bandwidth allocation capacity per I/O slot for the MXC-100 is different than that of the MXC-100B, or MXC-100 and a MXC-BR. NOTE: The following is applicable: 

Mix of MXC-100 and MXC-100B on the same shelf is not supported



The MXC-BR is supported only for SDH applications

The following table describes the MXC-100, MXC-100B, and MXC-BR bandwidth allocation capacity per slot for the XDM-100. MXC type 19

MXC-100 (x 2)

Slot #

Capacity per slot

Total XDM-100 capacity

I1, I2, I5, I6

2.5 Gbps

25 Gbps

I3, I4, I7, I8

1.25 Gbps

A1, A2, B1, B2

2.5 Gbps

MXC-100B20 (x 2) I1 to I8 MXC-10021 (x 1) MXC-BR 22 (x 1)

2.5 Gbps

A1, A2, B1, B2

2.5 Gbps

I1 to I8

1.25 Gbps

A1, A2

2.5 Gbps

30 Gbps

15 Gbps

19

Mix of MXC-100 and MXC-100B on the same shelf is not s upported. Mix of MXC-100 and MXC-100B on the same shelf is not s upported. 21 This configuration is supported only for SDH applications. 22 This configuration is supported only for SDH applications. 20

4-2


417006-2009-013-A01



Traffic Protection Applicable specifications ................. ITU-T G.841, G.842, GR-1230-CORE, GR-1400-CORE SNCP I/N LO, HO ................................................................................................. within 30 ms MSP/APS 1+1 ........................................................................................................ within 50 ms MS-SPRing/BLSR ................................................................................................. within 50 ms OCH 1+1 optical protection .....................................................................................within 5 ms


Synchronization There are several timing references available from multiple SDH/SONET and/or PDH/Async timing sources: 




From any 1.5 Mbps tributary interface



From any SDH/SONET line






External SONET 1.5 Mbps timing outputs (two per shelf)





417006-2009-013-A01


4-3




I/O Interfaces 2 Mbps (E1) Physical level .............................................................................................. G.703, Paragraph 6 Frame ......................................................................................................................... Unframed Line code .......................................................................................................................... HDB3

Ω balanced/75 Ω 23 unbalanced Bitrate ........................................................................................................ 2048 Kbps ± 50 ppm Line impedance .................................................................. 120


Ω unbalanced


Ω unbalanced

52 Mbps (STS-1) Physical level ..................................................................................................... GR-253-CORE Frame ................................................................................................................................ G.253 Line code ............................................................................................................................. CMI Line impedance ............................................................................................... 75

Ω unbalanced

23

Through an external DDF.

4-4


417006-2009-013-A01




±20 ppm


STM-1/OC-3 Optical Physical level ..................................................................................................... G.957, Table 2 Wavelength .................................................................................................. 1310 nm, 1550 nm Bitrate .................................................................................................... 155.52 Mbps

±4.6 ppm


STM-4/OC-12 Optical Physical level ..................................................................................................... G.957, Table 3 Wavelength .................................................................................................. 1310 nm, 1550 nm Bitrate ......................................................................................................... 622 Mbps

±4.6 ppm

Transmission range ............................................................................................ S3, L3, L5, V5

STM-16/OC-48 Optical Physical level ..................................................................................................... G.957, Table 4 Wavelength ................................................................................................. 1310 nm, 1550 nm Bitrate .................................................................................................. 2488.32 Mbps

±4.6 ppm

Transmission range ......................................... I3, S3, L3, L5, C/DWDM (G.694.2 and G.695)

Management Applicable specifications ......................................................... G.784, G.774, M.3010, M.3100 LightSoft (network manager) server and client for managing all ECI equipment ............................................................................................................... on SUN workstation(s) EMS-XDM (XDM element manager) ...................................................... on SUN workstation LCT-XDM local craft terminal ........................................................................................on PC EMS-XDM and LightSoft can work on the same SUN workstation.

417006-2009-013-A01


4-5



Management and Alarm Interfaces CMIP-like over TCP/IP to EMS-XDM; MTNM from EMS-XDM to LightSoft or other TMN; RS-232 to LCT-XDM; OverHead Access (OHA); orderwire; RAP.


SDH/SONET Interfaces STM-1/OC-3 (155.52 Mbps ±4.6 ppm) I/O Modules SFP TRANSCEIVER NAME APPLICATION CODE

24


OTR1_S3

OTR1_L3

OTR1_L5

S-1.1

L-1.1

L-1.2

1263-1360

1480-1580

SLM

SLM

1261-1360 25

Source type

MLM

Max. RMS width (nm)

7.7

-

-


-

30

30


-15

-5

-5


-8

0

0


8.2

10

10

Min. sensitivity (BER of 1*10 -12) EOL dBm)

-28

-34

-34

Min. overload (dBm)

-8

-10

-10


-

-

-25


96

-

-


-

-

-20


-

-

-25


1

1

1

24

Application code is in reference to ITU-T Recommendation G.691. MultiLongitudinal Mode (MLM) source type laser can also operate with single mode fibers for S-1.1 interfaces in reference to ITU-T Recommendation G.957. 25

4-6


417006-2009-013-A01




Table 4-1:


SFP transceiver name Application code

26

OTR1-S3BD

OTR1-S5BD

27

28

BD 3


BD 5

OTR1-L3BD

OTR1-L5BD

L3BD

L5BD

1260-1360

1480-1580

1280-1360

1480-1580

Source type

MLM

MLM

MLM

SLM

Max. RMS width (nm)

7

3

4

1


-

-

-

30


-14

-14

-5

-5


-8

-8

0

0


10

10

10

10


-32

-32

-32

-32

Min. overload (dBm)

-8

-8

0

0


-

-

-

-


-

-

-

-


-20

-20

-

-


-

-

-

-


1

1

1

1

TRANSMITTER

RECEIVER

29


26

Application code is in reference to ITU-T Recommendation G.691. BD 3: STM-1 single-fiber bidirectional S FP module with a 1310 nm TX wavelength. 28 BD 5: STM-1 single-fiber bidirectional S FP module with a 1550 nm TX wavelength. 29 Receiver units of SFPs (excluding bidirectional SFPs) are a wide-band type. 27

417006-2009-013-A01


4-7



STM-4/OC-12 (622 Mbps ±4.6 ppm) I/O Modules SFP TRANSCEIVER NAME

OTR4_S3

OTR4_L3

OTR4_L5

OTR4_V5

S-4.1

L-4.1

L-4.2

V5

1274-1356

1280-1335

1480-1580

1550

Source type

MLM31

SLM

SLM

SLM

Max. RMS width (nm)

4/2.5

-

-

-


-

1

<1

1


-

30

30

30


-15

-3

-3

0


-8

+2

+2

4


8.2

10

10

10


-28

-28

-28

-34

Min. overload (dBm)

-8

-8

-8

-8


-

-14

-27

-27


74

-

-

-


-

20

24

-


-

-25

-27

-


1

1

1

1

APPLICATION CODE

30


RECEIVER



30


4-8


417006-2009-013-A01


Table 4-2:




OTR4_S3BD

OTR4_S5BD

OTR4_L3BD

OTR4_L5BD

S3BD

S5BD

L3BD

L5BD

1260-1360

1480-1580

1260-1360

1480-1580

Source type

MLM

SLM

MLM

SLM

Max. RMS width (nm)

3

1

3

1


-

30

-

30


-15

-15

-3

-3


-8

-8

+2

+2


8.2

8.2

10

10


-28

-28

-28

-28

Min. overload (dBm)

-8

-8

-8

-8


-

-

-

-

-

-

-

Application code

32


RECEIVER

33



-

-

-

-


-

-

-

-


1

1

1

1

32


33

417006-2009-013-A01


4-9



STM-16/OC-48 (2488.32 Mbps ±4.6 ppm) I/O Modules SFP TRANSCEIVER NAME APPLICATION CODE

36

34

35

OTR16_I3

OTR16_S3

OTR16_L3

OTR16_L5

OTR25_AVxx

OTR25_ABxx

I-16

S-16.1

L-16.1

L-16.2

DW100S1D2/5(C) DW100S1A2/5(C)

DW100L-1D2/5(C)F DW100C-1A2/5(C)F G.698.1/.2


1260-1360

1260-1360

1280-1335

1500-1580

1530-1565

1530-1565

Source type

SLM

SLM

SLM

SLM

SLM

SLM


2

1

1

<1

0.4

0.4

Max. RMS width (nm)

-

-

-

-

-

-

Min. side mode suppression (dB)

-

30

30

30

30

30


-10

-5

-2

-2

0

0


-3

0

+3

+3

4

4


8.2

8.2

8.2

8.2

8.2

8.2

Min. sensitivity (BER of 1*10-12) EOL (dBm)

-16

-18

-27

-28

-28

-28

Min. overload (dBm)

0

0

-9

-9

-9

-9


-27

-27

-27

-27

-27

-27

TRANSMITTER

RECEIVER



-

-

-

1600

2400 (120km G.652

3600 (180 km G.652)


-24

-24

-24

-24

-24

-24


-27

-27

-27

-27

-27

-27

Max. optical path penalty dB)

<1

1

1

2

<3

<2


34

xx designates the transceiver's wavelength in nm. xx designates the transceiver's wavelength in nm. 36 Application code is in reference to ITU-T Recommendation G.691. 35

4-10


417006-2009-013-A01


Table 4-3:




OTR16_S3BD

OTR16_S5BD OTR16_L3BD OTR16_L5BD

S3BD

S5BD

L3BD

L5BD

1260-1360

1480-1580

1260-1360

1480-1580

Source type

SLM

SLM

SLM

SLM

Max. RMS width (nm)

1

1

1

1


30

30

30

30


-5

-5

-2

-2


+2

+2

+5

+5


8.2

8.2

8.2

8.2


-18

-18

-27

-27

Min. overload (dBm)

0

0

-9

-9


-

-

-

-

-

-

-

Application code

37


RECEIVER

38



-

-

-

-


-

-

-

-


1

1

1

1

37


38

417006-2009-013-A01


4-11



2.5 Gbps Optical CWDM SFP Transceivers CWDM SFP TRANSCEIVER NAME

OTC25_1PSxx 39

DWDM OTC25_1ALxx 40

43

APPLICATION CODE

41

42

OTR25_AVxx

OTR25_ABxx

DW100S1D2/5(C) DW100S1A2/5(C)

DW100L-1D2/5(C)F DW100C-1A2/5(C)F G.698.1/.2


1464-1618

1464-1618

1530-1565

1530-1565

Source type

SLM

SLM

SLM

SLM


1

1

0.4

0.4

Max. RMS width (nm)

-

-

-

-


30

30

30

30


0

0

0

0


+5

+5

4

4


8.2

8.2

8.2

8.2


-21.5 (-23 GbE)

-28 (-32 GbE)

-28

-28

Min. overload (dBm)

0

-7

-9

-9


-27

-27

-27

-27

800 (40 km G.652)

1600 (80 km G.652)

2400 (120 km G.652)

3600 (180 km G.652)

Min. optical return loss of cable (dB) 24

24

-24

-24


-27

-27

-27

-27


1.5

2.5

<3

<2

TRANSMITTER

RECEIVER



39

xx designates the transceiver's wavelength in nm. xx designates the transceiver's wavelength in nm. 41 xx designates the transceiver's wavelength in nm. 42 xx designates the transceiver's wavelength in nm. 43 Application code is in reference to ITU-T Recommendation G.691. 40

4-12


417006-2009-013-A01




DIOM_04

DIOM_08

DIOM_40

Service interfaces

4 x 10/100/1000BaseT

8 x 10/100BaseT

4 x optical FX/GbE with SFP

Size

1 slot

1 slot

1 slot

Data handling

Layer 1

Layer 1

Layer 1

Network interfaces

4 x EoS

8 x EoS

4 x EoS

Total EoS bandwidth per module in slots 1, 2, 5, 6 (2.5Gbps)








Total bandwidth per EoS port in slots 1, 2, 5, 6








Encapsulation mode

GFP-F

GFP-F

GFP-F






10240 bytes

10240 bytes

10240 bytes


417006-2009-013-A01


4-13



EISMB Specifications Module

EISMB_04

EISMB_40

Service interfaces

2 x 10/100/1000BaseT + 2 x 10/100BaseT

2 x optical FX/GbE + 2 x optical FX with SFP

Size

1 slot

1 slot

Data handling

Layer 2

Layer 2

Network interfaces

2 x GE EoS + 6 x FX EoS


Total EoS bandwidth per module






Encapsulation mode

GFP-F

GFP-F





9600 bytes

9600 bytes

Interfaces .............................................................................. 10/100/1000BaseT, 10/100BaseT, .......................... 100BaseFX (single mode and multimode fiber), 1000BaseSX, 1000BaseLX, .................................................................................................... 1000BaseZX, 1000BaseT SFP Switch capacity ............................................................................................................ 6.4 Gbps MAC address memory ....................................................................................................... 3500 Protection ..................................................... IOP 1:1 for both EoS ports and optical user ports Standards compliance........................ IEEE 802.1D, IEEE 802.1p, IEEE 802.1Q, IEEE 802.3, ................................... IEEE 802.1ad, IEEE 802.3x, IEEE 802.3u, IEEE 802.3z, IEEE 802.1w .......................................................................... G.707, G.783, G.7041 (GFP), G.7042 (LCAS) LCAS ............................................. Enabled or Disabled (VCAT mode), configurable per port Slot support ..................................................... up to 4 modules in any slots (with MXC-100B) Untagged frame handling ........................................ block, forward, attach CTAG and forward

4-14


417006-2009-013-A01



MCSM Specifications Module

MCSM

Service interfaces

8 x 10/100BaseT + 8 x optical FX/GbE with SFP

Size

2 slots

Maximum modules per shelf

Up to 2 with MXC-100B One only with MXC-100

Data handling

Layer 2 (Ethernet/MPLS)

Network interfaces

16 x EoS/MoT





NG-SDH standards

GFP-F, VCAT, LCAS




9600 bytes

Interfaces ................................. 10/100BaseT, 100BaseFX (single mode and multimode fiber), ..................................................................................1000BaseSX, 1000BaseLX, 1000BaseZX Total EoS/MoT capacity ................................................................................................. 5 Gbps Switch capacity ............................................................................................................. 20 Gbps MAC address memory ....................................................................................... 128,000 entries Protection ........................................ <50ms FRR link and node, <50ms Dual homed/attached, ..................................................................................... Ethernet UNI/NNI LAG and EoS LAG, .............................................................................................................................. G.8032 (ERP) ................................................................... Fast IOP – MCSM 1+1 hot standby card protection MPLS-based services ... VPWS (Martini encapsulation), VPLS (Full mesh and star), H-VPLS .......................................................................................... P2MP (Multicast drop and continue) IGMP snooping and static MAC ................................................................................................

417006-2009-013-A01


4-15



Hard QoS: ........................... 8000 policed flows per card supporting CIR, CBS and EIR, EBS .............................................. Classification based on port, CVLAN, CVLAN-P bits, SVLAN, ................................................. SVLAN-Pbits (802.1p priority bits), Untagged Frame, BPDU, ......................................................... and Wildcard (all VLANs that are not explicitly defined). .............................................. Untagged frame handling with port-based VLAN (attach/detach ............................................................................ CVLAN and/or SVLAN to untagged frames) ..........................................Eight Classes of Service (CoS), Classification rules, CoS mapping, .................................................... 2 rate policing, 3 colors marking, Admission Control (CAC) ....................................... WRED, Shaping, Scheduling (WFQ/WRR – Weighted Fair Queuing ........................................................................................................... / Weighted Round Robin) MAC and VLANs:4093 x 4093 VLANs with 16k VLAN mapping rules, SVLAN translation, ..................................... S-VLAN configurable Ether-type, FDB (Forwarding Data Base) with .......................................................................................................... 128k MAC address entries E2E OAM: ........................... Tunnel OAM with Connectivity Verification per ITU-T Y.1711, .................................................................................................................. Link OAM (802.3ah) .................................................................................................... Service OAM 802.1ag (CFM) Security: ............................. VSI (Virtual Switch Instance) VPN segregation, VLAN filtering, ............................................................................... FIB quota, BSC (Broadcast S torm Control) Management: ....................... Point-and-click fast service creation, Management layers/Planes: ....................................................... Data, TDM, optic, Supporting CAC for MPLS Tunnel and ................................................... Service provisioning, Enhanced protection by SRLG (Shared .......................................................................................................... Risk Link Group) schemes Services: Triple Play ............................................ DTV/IPTV, HDTV, Gaming, VoD, VoIP, and HSI Business connectivity............................................................... VPWS, VPLS, and H-VPLS Mobile aggregation ......................... 3G Ethernet-based services, including VoIP, HSDPA, ..................................... IPTV and video streaming, MP3 streaming, VoD, video and voice ........................................................................................................................... conferences Wholesale/CoC ............................................................ Ethernet bandwidth and leased lines Standards compliance: IEEE ................................................. 802.1ad, 802.3ah (Link OAM), 802.1D/P/Q, 802.1w, ................................................................................. 802.3-2005, 802.3ad, 802.3x, 802.1ag MEF .......................... MEF 4, MEF 6, MEF 7, MEF9, MEF 10, MEF 11, MEF 12 MEF14 ITU-T ........................................ G.707, G.7041, G.7042, G.8010/Y.1306, G.8011/Y.1307, .............................................................................. G.8011.1/Y.1307.1, G.8011.2/Y.1307.2, .................................................................. G.8012/Y.1308, Y.1710, Y.171, G.783, G.8032 IETF ........................................... RFC 3031, RFC 3032, RFC 3270, RFC 3443, RFC 4448, ..................................................................... RFC 4379, RFC 3812, RFC 3813, RFC 2702, ...................................................... RFC 4090, RFC 3916, RFC 3985, RFC 4125, RFC 412

4-16


417006-2009-013-A01



EISM Specifications 44

Module

EISM_208

EISM_244

EISM_226

Service interfaces

8 x 10/100BaseT

4 x 10/100BaseT + 2 x FX/GbE + 2 x FX

6 x 10/100BaseT + 2 x FX/GbE

Size

2 slots

2 slots

2 slots

Data handling

Layer 2

Layer 2

Layer 2

Network interfaces

2 x EoS

2 x EoS

2 x EoS


1 to 7 x VC-4 1 to 21 x VC-3

1 to 7 x VC-4 1 to 21 x VC-3

1 to 7 x VC-4 1 to 21 x VC-3

Encapsulation mode

GFP-F

GFP-F

GFP-F

LCAS mode

LCAS and non-LCAS

LCAS and non-LCAS

LCAS and non-LCAS


3.8 ms

3.8 ms

3.8 ms


9600 bytes

9600 bytes

9600 bytes

Interfaces .......... 10/100BaseT, 100BaseFX (single mode and multimode fiber), 1000BaseSX, ........................................................................................................ 1000BaseLX, 1000BaseZX Switch capacity ............................................................................................................ 6.4 Gbps MAC address memory ...................................................................................................... 3,500 Protection ............................. IOP 1:1 for both Ethernet over SDH ports and optical user ports Standards compliance........................ IEEE 802.1D, IEEE 802.1p, IEEE 802.1Q, IEEE 802.3, ................................... IEEE 802.1ad, IEEE 802.3x, IEEE 802.3u, IEEE 802.3z, IEEE 802.1w .......................................................................... G.707, G.783, G.7041 (GFP), G.7042 (LCAS) Untagged frame handling .................................................................................... block, forward

44

The EISM occupies two slots and can be installed in slot pairs I1-I2, I3-I4, I5-I6, I7-I8.

417006-2009-013-A01


4-17



Client Transceivers for MCSM, EISM Cards Card

45

OTGBE_SX

OTGBE_LX

Transmitter type

GbE short-reach laser, 850 nm, multimode

GbE long-reach GbE very FX, short-reach FX, short-reach laser, 1310 nm, long-reach laser, 1310 laser, 1310 nm, single mode laser, 1550 nm, multimode single mode single mode


1.250

1.250

1.250

0.125

0.125

Average launch power (dBm)

Max.

-3

-3

5

-8

5

Min.

-9.5

-11

0

-15

0


9

9

9

10

10

Data format

8B/10B

8B/10B

8B/10B

N/A

N/A

Min.

-20

-22

-22

-28

-22

Typical

-21

-25.5

--

-30

--

Max. receiver overload 0 (dBm)

0

0

-14

-8


-24

-29

-25

< -29

< -28

Connector

LC

LC

LC

LC

LC

Fiber lengths

550 m (50/62.5 µm MMF)

10 km (9 µm SMF)

80 km (9 µm SMF)

550 m (50/62.5 µm MMF)

10 km (9 µm SMF)


OTGBE_ZX

OTFE_MM

OTFE_SM


Notes

Data rate

1000 Mbps


Connector

RJ-45

Cable type

CAT 5

Cable length

100m

STP (Shielded Twisted Pair)

45

The EISM occupies two slots and may be installed in slot pairs I1-I2, I5-I6.

4-18


417006-2009-013-A01



Optical Amplifier Modules for TPU/OCU The MO_DC0_BAS is an optical booster for the C band. MO_PAS_DCM80 is a single channel preamplifier (Channel 35 in the C band). MO_DC0_BAS

MO_PAS_DCM80

Input power (dBm)

-12–+4

-38 – -18

Output power (dBm)

14.5-16

-16 – -14

Spectrum (nm)

Channel 35

Gain tilt (Ch. 21-36) (dB)

< 346

N/A


< 747

N/A

Passband width, < 0.5 dB loss (GHz) N/A

N/A

Passband width, < 1.0 dB loss (GHz) N/A

N/A

Noise figure (dB) (dB)

<7

<6

Polarization-dependent Polarization-dependent gain (dB)

< 0.5

< 0.5

Polarization mode dispersion (ps)

< 0.1

< 0.3

Return loss (dB)

< 40

< 40

Power consumption (Watt)

<7

<7 48

Monitor port tap fraction (%)

4-6

Automatic Laser Shutdown (ALS)

100 ms

0.5 – 2

46

Measured peak-to-peak. Measured peak-to-peak. 48 Over the entire C band. 47

417006-2009-013-A01


4-19



GbE/FC/2 Gbps FC/FICON Optical SFP Transceivers for Transponders/Combiners OTGBE_SX

OTGBE_LX

OTGBE_ZX

Transmitter type

GbE/FC/2 Gbps FC/FICON short reach laser, 850 nm, multimode

GbE/FC/2 Gbps FC/FICON long reach laser, 1310 nm, single mode

GbE/FC/2 Gbps FC/FICON very long reach laser, 1550 nm, single mode

Bitrate (Gbps)

1.250

1.250

1.250

Max.

-3

-3

5

Min.

-9.5

-11

0


9

9

9

Data format

8 B/10 B

8 B/10 B

8 B/10 B

Min.

-20

-22

-22

Typical

-21

-25.5

--


0

0

0


-24

-29

-25

Connector

LC

LC

LC

Fiber lengths

550 m (50/62.5 µm MMF)

10 km (9 µm SMF)

80 km (9 µm SMF)

4-20


Mean launch power (dBm)


417006-2009-013-A01



STM-1 SFP Optical supervisory channel transceivers for OSC1_2 Optical Supervisory Channel OTR1_L3

OTR1_X3

Source type

SLM

SLM

Operating output wavelength (nm)

1263-1360

1270-1360

Spacing (nm)

NA

NA

Minimum side mode suppression suppressi on ratio (dB)

30

30

Mean launched power (min.) (dBm)

-5

0

Mean launched power (max.) (dBm)

0

+5


10

10

Sensitivity (BER of 1*10 ) (dBm)

-34

-37

Min. overload (dBm)

-9

-8


-

-


1

1

-10

CWDM Modules Mux/Demux Modules Module

49

MO-CMD4C

MO_CMD8

MO_CMD4C-E

MO_CMD4SL

Insertion loss mux + 50 demux (dB)

< 4.2

< 5.5

< 4.9

< 7.3

Return loss (dB)

< 40

< 40

< 40

< 40

Directivity (dB)

< 45

< 45

< 45

< 45

OADM Modules Module type

51

Insertion loss

52

Through

Drop

Add

MO_COADM1AB_xx

53

< 3.9 dB

< 2.6 dB

< 2.2 dB

MO_COADM2AB_xx

54

< 4.4 dB

< 3.2 dB

< 3.2 dB

49

Module specifications are also applicable to XDM-100H. Including built-in 1310 nm OSC filter. The insertion loss for 1310 nm filter is 1.2dB. 51 Module specifications are also applicable to XDM-100H. 52 Including built-in 1310 nm OSC filter. The insertion loss for 1310 nm filter is 1.2dB. 53 xx designates the channel dropped by the OADM. 54 xx designates the group of two channels dropped by the OADM. 50

417006-2009-013-A01


4-21



Splitter/Coupler Modules Module type

55

Insertion loss

MO_4CP4SPMM50

4 dB

MO_4CP4SPMM62

4 dB

MO_4CP4SPSM

4 dB

CWDM Frequencies and Wavelengths (ITU-T Rec. G.694.2 for CWDM) Nominal central wavelengths (nm) for spacing of 20 nm

4-channel system

8-channel system

1471



1491



1511





1531





1551





1571





1591



1611



55

Module specifications are also applicable to XDM-100H.

4-22


417006-2009-013-A01



Physical Specifications Dimensions (H x W x D) XDM-100 ............................................................ 200 x 443 x 231 mm (7.87 x 17.44 x 9.09 in) SIM-1/4/16, PIM-2/345.............................................35 x 97 x 213 mm (1.38 x 3.82 x 8.38 in) SAM-4/16.................................................................. 32 x 97 x 213 mm (1.26 x 3.82 x 8.38 in) EISMB, DIOM .......................................................... 32 x 97 x 213 mm (1.26 x 3.82 x 8.38 in) EISM, PIM2_63 ......................................................32 x 195 x 213 mm (1.26 x 7.68 x 8.38 in) TPM-xx_1/TPM-xx_3 ..............................................72 x 97 x 211 mm (2.83 x 3.82 x 8.31 in) TCF/TC ..................................................................... 84 x 45 x 210 mm (2.91 x 1.77 x 8.27 in) MXC-100/MXC-100B ..........................................52 x 385 x 279 mm (2.05 x 15.16 x 10.1 in) TPU ....................................................................... 75 x 443 x 231 mm (2.95 x 17.44 x 9.09 in) xRAP (optional) ................................................ 100 x 450 x 285 mm (3.94 x 17.72 x 11.22 in) xRAP-100 (optional) ...........................................133 x 445 x 185 mm (5.24 x 17.53 x 7.29 in) miniRAP (optional) ................................................. 90 x 445 x 150 mm (3.54 x 17.53 x 5.9 in) Racks ........................................2200/2600 x 600 x 300 mm (86.61/102.36 x 23.62 x 11.81 in) ...................................................................................... 2134 x 584 x 305 mm (82 x 23 x 12 in)

Weight Basic XDM-100 shelf .................................................................................... 7.6 kg (16.76 lbs) Basic XDM-100 fully populated .................................................................. 20.2 kg (44.53 lbs)

Power Applicable specifications ........................................................ ETSI 300 132-2; FTZ 19 PFL 1 Input voltage ............................................................................................ -40 V dc to -75 V dc Nominal power source ....................................................................................... -48 V or -60 V Power consumption .............................................................. Typical 300 W, maximum 420 W

Power Dissipation Power dissipation .......................................... Typical 1024.5 Btu/hr, maximum 1434.4 Btu/hr

417006-2009-013-A01


4-23



XDM-100 Product Line Main Equipment Power Consumption The following table lists the power requirements of the main equipment components. Determine the expected power requirement of the equipment installed in the shelf, and compare it with the shelf capabilities. Type

Component

Power requirements

Common cards

MXC-100

47 W

MXC-100B

47 W

MXC-BR

0W

MXC50

42 W

MXC-300

88.5 W

MXC-900

210 W

ECU

6.7 W

ECU-F

18.3 W

ECU50

68 W

ECU50_R

10 W

ECU300

6.7 W

ECU300_F

18 W

ECU900

6.7 W

ECU900_F

18 W

INF50

14 W

OHU

5W

TPU

0W

TC

2.5 W

TCF

7W

FCU-100-9F

21.6 W

FCU50

52 W

FCU300

79.2 W

FCU900

79.2 W

PIM2_21

11 W

PIM2_42

14.3 W

PIM2_63

16 W

PIM2_63B

16 W

PIM2_63S

16 W

PIM345_3

11 W

CCP50_2

2W

PDH modules

4-24


417006-2009-013-A01



Type

Component

Power requirements

SDH modules

SAM1_4E

10 W

SAM1_4O

10 W

SAM1_4OB

10 W

SAM4_2

17 W

SAM16_1

19.7 W

SAM16_1B

30 W

SIM1_4E

12 W

SIM1_4O

12 W

SIM1_4OB

12 W

SIM1_8

12.8 W

SIM4_2

17 W

SIM4_4

30 W

SIM4_8

47 W

SIM16_1

26 W

SIM16_2

37 W

SIM16_4

63.3 W

SIM16_8

110 W

SIM64_XFP

73.6 W

SIM64_1

60 W

SIM64_2

137 W

TPM2_1

5W

TPM2_3

5W

TPM2_42_2

5W

TPM2_63_2

5W

TPMH_1

5W

EISMB_804

32 W

EISMB_840

35 W

DIOM_04

22 W

DIOM_08

24 W

DIOM_40

31.2 W

MCSM

75 W

ACP100

12 W

ACP900

12 W

Protection modules

Data modules

Control module

417006-2009-013-A01


4-25



Type

Component

Power requirements

Optical modules

MO_CMD4C

1.8 W

MO_CMD8

4.8 W

MO_CMD4C_E

4.8 W

MO_CMD4SL

4.8 W

MO_COADM1AB-Gxx

4.8 W

MO_COADM2AB-xx

4.2 W

MO_4CP4SPSM

4.2 W

MO_4CP4SPMM50

4.2 W

MO_4CP4SPMM62U5

4.8 W

CCMB25_2D

34 W

CRPT25_2C

4.5 W

CTRP25_2C

10 W

OSC1_2

12 W

MO_DC0_BAS

7W

MO_PAS_DCM80

4.9 W

OTR1_YY

1W

OTR4_YY

1W

OTR25_YY

1W

OTC25_PSxx

1.5 W

OTC25_ALxx

1.5 W

OTFE_SM

1W

OTFE_MM

1W

OTGBE_LX

1W

OTGBE_SX

1W

OTGBE_ZX

1W

ETGBE

1W

OMS16-4T

8W

MO_DW16MDB-AVAV

4.8 W

MO_DW16MDB-ST

4.8 W

MO_DW16MDR-ST

10 W

MO_DW16MDRE-ST

10 W

MO_DW40MC-S

10 W

MO_DW40MC-A

10 W

MO_DW40MC-G

10 W

MO_DW40DC-A

10 W

MO_DW40DC-G

10 W

Optical amplifiers Optical transceivers

Data transceivers

4-26


417006-2009-013-A01



Environmental Conditions Operation Applicable specification .................................................................. ETS 300 019-1-3 Class 3.2 Temperature range .............................................................................................. -5 ºC to +55 ºC Relative humidity ..................................................................................................... 5% to 90% NOTE: Extended temperature range of -5 ºC to +65 ºC is supported for specific outdoor configurations.

Storage (packed) Applicable specification ................................................................. ETS 300 019-1-1 Class 1.2 Temperature range ............................................................................................ -25 ºC to +55 ºC Relative humidity ................................................................................................. 10% to 100%

Handling and Transportation Applicable specification ................................................................. ETS 300 019-1-2 Class 2.3 Temperature range ........................................................................................... -40 ºC to +70 ºC Relative humidity ...................................................................................................... up to 95%




417006-2009-013-A01


4-27



NEBS Compliance The XDM platforms are designed in accordance with NEBS regulations for EMC and Safety, including GR-1089-CORE Issue 1, October 1995 and GR-63-CORE Issue 2, December 1997 Revision 1, February 1999 (Level 3).



4-28


417006-2009-013-A01

5 XDM-300/900 Specifications In this chapter: Cross-Connect Specifications .......................................................................... 5-2 Traffic Protection............................................................................................. 5-2 Redundancy ..................................................................................................... 5-2 Synchronization ............................................................................................... 5-3 Jitter and Wander ............................................................................................. 5-3 I/O Interfaces ................................................................................................... 5-3 Management .................................................................................................... 5-5 SDH/SONET Interfaces .................................................................................. 5-6 Data Modules................................................................................................. 5-14 Optical Amplifier Modules for TPU/OCU .................................................... 5-19 CWDM Modules ........................................................................................... 5-20 Physical Specifications .................................................................................. 5-21 Environmental Conditions ............................................................................. 5-25 EMC .............................................................................................................. 5-26 Safety............................................................................................................. 5-26 Reliability ...................................................................................................... 5-26

417006-2009-013-A01


5-1

XDM-300/900 Specifications


Cross-Connect Specifications Cross-Connect Levels SDH cross-connect levels ........................................................... VC-4nc, VC-4, VC-3, VC-12 SONET cross-connect levels.............................................................................. STS-nc, STS-1

MXC300 Cross-Connect Capacity SDH switch core options .......................... 384 x STM-1 with cross-connect capability of 4/3/1 SONET switch core options ......................................................................... 384 x OC-3/STS-1

MXC900 Cross-Connect Capacity SDH switch core options .......................... 768 x STM-1 with cross-connect capability of 4/3/1 SONET switch core options ......................................................................... 768 x OC-3/STS-1

Traffic Protection Applicable specifications ................. ITU-T G.841, G.842, GR-1230-CORE, GR-1400-CORE SNCP I/N LO, HO ................................................................................................. within 30 ms MSP/APS 1+1 ........................................................................................................ within 50 ms MS-SPRing/BLSR ................................................................................................. within 50 ms


5-2


417006-2009-013-A01



Synchronization There are several timing references available from multiple SDH/SONET and/or PDH/Async timing sources: 




From any 1.5 Mbps tributary interface



From any SDH/SONET line






External SONET 1.5 Mbps timing outputs (two per shelf)






I/O Interfaces 2 Mbps (E1) Physical level .............................................................................................. G.703, Paragraph 6 Frame ......................................................................................................................... Unframed Line code .......................................................................................................................... HDB3 Line impedance .................................................................. 120

Ω balanced/75 56 Ω unbalanced

Bitrate ........................................................................................................ 2048 Kbps ± 50 ppm


Ω unbalanced

56

Through an external DDF.

417006-2009-013-A01


5-3




Ω unbalanced

52 Mbps (STS-1) Physical level ..................................................................................................... GR-253-CORE Frame ................................................................................................................................ G.253 Line code ............................................................................................................................. CMI Line impedance ............................................................................................... 75

Ω unbalanced


±20 ppm


STM-1/OC-3 Optical Physical level ..................................................................................................... G.957, Table 2 Wavelength .................................................................................................. 1310 nm, 1550 nm Bitrate .................................................................................................... 155.52 Mbps

±4.6 ppm


STM-4/OC-12 Optical Physical level ..................................................................................................... G.957, Table 3 Wavelength .................................................................................................. 1310 nm, 1550 nm Bitrate ......................................................................................................... 622 Mbps

±4.6 ppm

Transmission range ............................................................................................ S3, L3, L5, V5

STM-16/OC-48 Optical Physical level ..................................................................................................... G.957, Table 4 Wavelength ................................................................................................. 1310 nm, 1550 nm Bitrate .................................................................................................. 2488.32 Mbps

±4.6 ppm

Transmission range ............................................. I3, S3, L3, L5, CDWM (G.694.2 and G.695) 5-4


417006-2009-013-A01



STM-64/OC-192 Optical Physical level .......................................................................................... G.691, G.957, Table 5 Wavelength ................................................................................................. 1310 nm, 1550 nm Short-haul, long-haul, very long-haul, C/DWDM (G.694.1) bitrate ... 9953.28 Mbps

±4.6 ppm

Management Applicable specifications ......................................................... G.784, G.774, M.3010, M.3100 LightSoft (network manager) server and client for managing all ECI equipment .................... ............................................................................................................... on SUN workstation(s) EMS-XDM (XDM element manager) ...................................................... on SUN workstation LCT-XDM local craft terminal ........................................................................................on PC EMS-XDM and LightSoft can work on the same SUN workstation.

Management and Alarm Interfaces CMIP-like over TCP/IP to EMS-XDM; MTNM from EMS-XDM to LightSoft or other TMN; RS-232 to LCT-XDM; OverHead Access (OHA); orderwire; RAP.


417006-2009-013-A01


5-5



SDH/SONET Interfaces STM-1/OC-3 (155.52 Mbps ±4.6 ppm) I/O Modules SFP TRANSCEIVER NAME APPLICATION CODE

57


OTR1_S3

OTR1_L3

OTR1_L5

S-1.1

L-1.1

L-1.2

1263-1360

1480-1580

SLM

SLM

1261-1360 58

Source type

MLM

Max. RMS width (nm)

7.7

-

-


-

30

30


-15

-5

-5


-8

0

0


8.2

10

10

Min. sensitivity (BER of 1*10 -12) EOL dBm)

-28

-34

-34

Min. overload (dBm)

-8

-10

-10


-

-

-25


96

-

-


-

-

-20


-

-

-25


1

1

1


57


5-6


417006-2009-013-A01


Table 5-1:




59

OTR1-S3BD

OTR1-S5BD

60

61

BD 3


BD 5

OTR1-L3BD

OTR1-L5BD

L3BD

L5BD

1260-1360

1480-1580

1280-1360

1480-1580

Source type

MLM

MLM

MLM

SLM

Max. RMS width (nm)

7

3

4

1


-

-

-

30


-14

-14

-5

-5


-8

-8

0

0


10

10

10

10


-32

-32

-32

-32

Min. overload (dBm)

-8

-8

0

0


-

-

-

-


-

-

-

-


-20

-20

-

-


-

-

-

-


1

1

1

1

TRANSMITTER

RECEIVER

62


59

Application code is in reference to ITU-T Recommendation G.691. BD 3: STM-1 single-fiber bidirectional S FP module with a 1310 nm TX wavelength. 61 BD 5: STM-1 single-fiber bidirectional S FP module with a 1550 nm TX wavelength. 62 Receiver units of SFPs (excluding bidirectional SFPs) are a wide-band type. 60

417006-2009-013-A01


5-7



STM-4/OC-12 (622 Mbps ±4.6 ppm) I/O Modules SFP TRANSCEIVER NAME

OTR4_S3

OTR4_L3

OTR4_L5

OTR_V5

S-4.1

L-4.1

L-4.2

V5

1274-1356

1280-1335

1480-1580

1550

Source type

MLM64

SLM

SLM

SLM

Max. RMS width (nm)

4/2.5

-

-

-


-

1

<1

1


-

30

30

30


-15

-3

-3

0


-8

+2

+2

4


8.2

10

10

10


-28

-28

-28

-34

Min. overload (dBm)

-8

-8

-8

-8


-

-14

-27

-27


74

-

-

-


-

20

24

-


-

-25

-27

-


1

1

1

1

APPLICATION CODE

63


RECEIVER



63


5-8


417006-2009-013-A01


Table 5-2:




OTR4_S3BD

OTR4_S5BD

OTR4_L3BD

OTR4_L5BD

S3BD

S5BD

L3BD

L5BD

1260-1360

1480-1580

1260-1360

1480-1580

Source type

MLM

SLM

MLM

SLM

Max. RMS width (nm)

3

1

3

1


-

30

-

30


-15

-15

-3

-3


-8

-8

+2

+2


8.2

8.2

10

10


-28

-28

-28

-28

Min. overload (dBm)

-8

-8

-8

-8


-

-

-

-

-

-

-

Application code

65


RECEIVER

66



-

-

-

-


-

-

-

-


1

1

1

1

65


66

417006-2009-013-A01


5-9



STM-16/OC-48 (2488.32 Mbps ±4.6 ppm) I/O Modules SFP TRANSCEIVER NAME

OTR16_I3

OTR16_S3

OTR16_L3

OTR16_L5

I-16

S-16.1

L-16.1

L-16.2

1260-1360

1260-1360

1280-1335

1500-1580

Source type

SLM

SLM

SLM

SLM


2

1

1

<1

Max. RMS width (nm)

-

-

-

-


-

30

30

30


-10

-5

-2

-2


-3

0

+3

+3


8.2

8.2

8.2

8.2


-16

-18

-27

-28

Min. overload (dBm)

0

0

-9

-9


-27

-27

-27

-27

APPLICATION CODE

67


RECEIVER



-

-

-

1600


-24

-24

-24

-24


-27

-27

-27

-27

Max. optical path penalty dB)

<1

1

1

2


67

Application code is in reference to ITU-T Recommendation G.691.

5-10


417006-2009-013-A01


Table 5-3:




OTR16_S3BD

OTR16_S5BD OTR16_L3BD OTR16_L5BD

S3BD

S5BD

L3BD

L5BD

1260-1360

1480-1580

1260-1360

1480-1580

Source type

SLM

SLM

SLM

SLM

Max. RMS width (nm)

1

1

1

1


30

30

30

30


-5

-5

-2

-2


+2

+2

+5

+5


8.2

8.2

8.2

8.2


-18

-18

-27

-27

Min. overload (dBm)

0

0

-9

-9


-

-

-

-


-

-

-


-

-

-


-

-

-

-


1

1

1

1

Application code

68


RECEIVER

69


68

Application code is in reference to ITU-T Recommendation G.691. Receiver units of SFPs (excl uding bidirectional SFPs) are a wide-band type.

69

417006-2009-013-A01


5-11



2.5 Gbps Optical C/DWDM SFP Transceivers CWDM SFP TRANSCEIVER NAME

DWDM 70

OTC25_1PSxx

71

OTC25_1ALxx

74

APPLICATION CODE


72

73

OTR25_AVxx

OTR25_ABxx

DW100S1D2/5(C) DW100S1A2/5(C)

DW100L-1D2/5(C)F DW100C-1A2/5(C)F G.698.1/.2

1464-1618

1464-1618

1530-1565

1530-1565

Source type

SLM

SLM

SLM

SLM


1

1

0.4

0.4

Max. RMS width (nm)

-

-

-

-


30

30

30

30


0

0

0

0


+5

+5

4

4


8.2

8.2

8.2

8.2


-21.5 (-23 GbE)

-28(-32 GbE)

-28

-28

Min. overload (dBm)

0

-7

-9

-9


-27

-27

-27

-27


800 (40 km G.652)

1600 (80 km G.652)

2400 (120 km G.652)

3600 (180 km G.652)


24

24

-24

-24


-27

-27

-27

-27


1.5

2.5

<3

<2

TRANSMITTER

RECEIVER


70

xx designates the transceiver's wavelength in nm. xx designates the transceiver's wavelength in nm. 72 xx designates the transceiver's wavelength in nm. 73 xx designates the transceiver's wavelength in nm. 74 Application code is in reference to ITU-T Recommendation G.691. 71

5-12


417006-2009-013-A01



10 Gbps Optical XFP Transceivers Transceiver

OTR64_I3 I-64.1

Application code

P1I1_2D1 VSR2000_2R1

OTR64_S5

OTR64_L5

S-64.2b

L-64.2a

P1S1_2D2b

P1L1-2D2

OTR10_ASx x

OTX10_AT

SLM

SLM

SLM

1529-1560

1529-1560

1528.38-1564. 68

192.1 + 0.1m

192.1 + 0.1m 191.7+0.05m

m=0 to 40

m=0 to 40

m=0 to 88

±12.5

±12.5

±2.5

OTR10_ALxx

1L1-2D2F

Source type

SLM

SLM

SLM

Modulation

External

External

External


1290-1330

1529-1560

1530-1565

Central frequency (THz)

--

--

--

Maximum central frequency deviation (GHz)

--

--

--

Spacing (GHz)

--

--

--

Direct max. -20 dB width (nm)

<1

<1

<1

<1

<1

< 0.5


30

30

30

30

30

35


-6

-1

0


-1

+2

+4


6

8.2

9

Maximum attenuation (dB)

4

11

22

NA

--

Minimum attenuation (dB)

0

3

11

NA

--

Max. dispersion (ps/nm) 6.6

800

1600

1600

1440

Minimum optical return loss (dB)

24

24

24

--

--

Maximum discrete reflectance

-27

-27

-27

-27

-27

Maximum DGD (ps)

30

30

30

Sensitivity (BER of 1*10-12) (dBm)

-11

-14

-24

-24

-24

Min. overload (dBm)

-1

-1

-7

-8

-7

Maximum optical path penalty

1

2

2

2

2.5

OCH switching time (ms)

<3

<3

<3

NA

NA

417006-2009-013-A01

50

-1

-1

+3

+3

9

9

9

--


5-13




DIOM_04

DIOM_08

DIOM_40

Service interfaces

4 x 10/100/1000BaseT

8 x 10/100BaseT

4 x optical FX/GbE with SFP

Size

1 slot

1 slot

1 slot

Data handling

Layer 1

Layer 1

Layer 1

Network interfaces

4 x EoS

8 x EoS

4 x EoS

















Encapsulation mode

GFP-F

GFP-F

GFP-F






10240 bytes

10240 bytes

10240 bytes


5-14


417006-2009-013-A01



EISMB Specifications Module

EISMB_04

EISMB_40

Service interfaces

2 x 10/100/1000BaseT + 2 x 10/100BaseT

2 x optical FX/GbE + 2 x optical FX with SFP

Size

1 slot

1 slot

Data handling

Layer 2

Layer 2

Network interfaces









Encapsulation mode

GFP-F

GFP-F





9600 bytes

9600 bytes

Interfaces .............................................................................. 10/100/1000BaseT, 10/100BaseT, .......................... 100BaseFX (single mode and multimode fiber), 1000BaseSX, 1000BaseLX, .................................................................................................... 1000BaseZX, 1000BaseT SFP Switch capacity ............................................................................................................ 6.4 Gbps MAC address memory ....................................................................................................... 3500 Protection ..................................................... IOP 1:1 for both EoS ports and optical user ports Standards compliance........................ IEEE 802.1D, IEEE 802.1p, IEEE 802.1Q, IEEE 802.3, ................................... IEEE 802.1ad, IEEE 802.3x, IEEE 802.3u, IEEE 802.3z, IEEE 802.1w .......................................................................... G.707, G.783, G.7041 (GFP), G.7042 (LCAS) LCAS ............................................. Enabled or Disabled (VCAT mode), configurable per port Slot support ......................................up to 8 modules in the right-most slots only I3, I4, I7, I8, .................................................................. I11, I12, I15, I16 Untagged frame handling ........................................ block, forward, attach CTAG and forward

417006-2009-013-A01


5-15



MCSM Specifications Module

MCSM

Service interfaces

8 x 10/100BaseT + 8 x optical FX/GbE with SFP

Size

2 slots

Data handling

Layer 2 (Ethernet/MPLS)

Network interfaces

16 x EoS/MoT





NG-SDH standards

GFP-F, VCAT, LCAS




9600 bytes

Interfaces ................................. 10/100BaseT, 100BaseFX (single mode and multimode fiber), ..................................................................................1000BaseSX, 1000BaseLX, 1000BaseZX Total EoS/MoT capacity ................................................................................................. 5 Gbps Switch capacity ............................................................................................................. 20 Gbps MAC address memory ....................................................................................... 128,000 entries Protection ........................................ <50ms FRR link and node, <50ms Dual homed/attached, ..................................................................................... Ethernet UNI/NNI LAG and EoS LAG, .............................................................................................................................. G.8032 (ERP) ................................................................... Fast IOP – MCSM 1+1 hot standby card protection MPLS-based services ... VPWS (Martini encapsulation), VPLS (Full mesh and star), H-VPLS .......................................................................................... P2MP (Multicast drop and continue) IGMP snooping and static MAC Hard QoS: ....................................... 8000 policed flows per card supporting CIR, CBS and EIR, EBS ......................................... Classification based on port, CVLAN, CVLAN-Pbits, SVLAN, ........................................... SVLAN-Pbits (802.1p priority bits), Untagged Frame, BPDU, ................................................... and Wildcard (all VLANs that are not explicitly defined). ........................................ Untagged frame handling with port-based VLAN (attach/detach ...................................................................... CVLAN and/or SVLAN to untagged frames) Eight Classes of Service (CoS), Classification rules, CoS mapping, .............................................. 2 rate policing, 3 colors marking, Admission Control (CAC) .................................WRED, Shaping, Scheduling (WFQ/WRR – Weighted Fair Queuing ..................................................................................................... / Weighted Round Robin) 5-16


417006-2009-013-A01



MAC and VLANs: ........................ 4093 x 4093 VLANs with 16k VLAN mapping rules, SVLAN translation, ............................... S-VLAN configurable Ether-type, FDB (Forwarding Data Base) with .................................................................................................... 128k MAC address entries E2E OAM: ........................................Tunnel OAM with Connectivity Verification per ITU-T Y.1711, ............................................................................................................ Link OAM (802.3ah) .............................................................................................. Service OAM 802.1ag (CFM) Security: ...................................... VSI (Virtual Switch Instance) VPN segregation, VLAN filtering, ......................................................................... FIB quota, BSC (Broadcast Storm Control) Management: ....................................... Point-and-click fast service creation, Management layers/Planes: ................................................. Data, TDM, optic, Supporting CAC for MPLS Tunnel and ............................................. Service provisioning, Enhanced protection by SRLG (Shared .................................................................................................... Risk Link Group) schemes Services: Triple Play ............................................ DTV/IPTV, HDTV, Gaming, VoD, VoIP, and HSI Business connectivity............................................................... VPWS, VPLS, and H-VPLS Mobile aggregation ......................... 3G Ethernet-based services, including VoIP, HSDPA, ..................................... IPTV and video streaming, MP3 streaming, VoD, video and voice ........................................................................................................................... conferences Wholesale/CoC ............................................................ Ethernet bandwidth and leased lines Standards compliance: IEEE ............................................................... 802.1ad, 802.3ah (Link OAM), 802.1D/P/Q, .................................................................... 802.1w, 802.3-2005, 802.3ad, 802.3x, 802.1ag MEF .......................... MEF 4, MEF 6, MEF 7, MEF9, MEF 10, MEF 11, MEF 12 MEF14 ITU-T ........................................ G.707, G.7041, G.7042, G.8010/Y.1306, G.8011/Y.1307, .............................................................................. G.8011.1/Y.1307.1, G.8011.2/Y.1307.2, .................................................................. G.8012/Y.1308, Y.1710, Y.171, G.783, G.8032 IETF ........................................... RFC 3031, RFC 3032, RFC 3270, RFC 3443, RFC 4448, ..................................................................... RFC 4379, RFC 3812, RFC 3813, RFC 2702, ...................................................... RFC 4090, RFC 3916, RFC 3985, RFC 4125, RFC 412

417006-2009-013-A01


5-17



Client Transceivers for MCSM, EISMB_840 Cards OTGBE_SX

OTGBE_LX

Transmitter type

GbE short-reach laser, 850 nm, multimode

GbE long-reach GbE very laser, 1310 nm, long-reach single mode laser, 1550 nm, single mode

FX, short-reach FX, short-reach laser, 1310 laser, 1310 nm, multimode single mode


1.25

1.25

1.25

0.125

0.125


Max.

-3

-3

5

-8

5

Min.

-9.5

-11

0

-15

0


9

9

9

10

10

Data format

8B/10B

8B/10B

8B/10B

N/A

N/A

Min.

-20

-22

-22

-28

-22

Typical

-21

-25.5

--

-30

--

Max. receiver overload 0 (dBm)

0

0

-14

-8


-24

-29

-25

< -29

< -28

Connector

LC

LC

LC

LC

LC

Fiber lengths

550 m (50/62.5 µm MMF)

10 km (9 µm SMF)

80 km (9 µm SMF)

550 m (50/62.5 µm MMF)

10 km (9 µm SMF)


Table 5-4:

OTGBE_ZX

OTFE_MM

OTFE_SM

GbE bidirectional transceivers OTGBE_S3BD

OTGBE_S5BD

OTGBE_L3BD

OTGBE_L5BD

Transmitter type

Bidirectional SFP, 1310 nm


Bidirectional SFP, 1310 nm e


Data rate (nominal) (MBaud)

1250

1250

1250

1250


-3 Max.

-3

+2

+2

-10 Min.

-10

-5

-5


>9

>9

>9

>9

Data format

8B/10B

8B/10B

8B/10B

8B/10B


< -21

< -21

< -23

< -23


< -22

< -22

< -24

< -24

Connector

LC

LC

LC

LC

Fiber lengths

10 km (9 µm SMF)

10 km (9 µm SMF)

40 km (9 µm SMF)

40 km (9 µm SMF)

5-18


417006-2009-013-A01




Notes

Data rate

1000 Mbps


Connector

RJ-45

Cable type

CAT 5

Cable length

100m

Optical Amplifier Modules for TPU/OCU The MO_DC0_BAS is an optical booster for the C band. MO_PAS_DCM80 is a single channel preamplifier (Channel 35 in the C band). Input power (dBm)

MO_DC0_BAS (Booster)

MO_PAS_DCM80

-12 – +4

-38 – -18

75

Output power (dBm)

14.5-16

Spectrum (nm)

-16 – -14 Channel 35

< 376


77


<7

N/A N/A

Passband width, < 0.5 dB loss (GHz)

N/A

N/A

Passband width, < 1.0 dB loss (GHz)

N/A

N/A

Noise figure (dB)

<7

<6

Polarization-dependent gain (dB)

< 0.5

< 0.5

Polarization mode dispersion (ps)

< 0.1

< 0.3

Return loss (dB)

< 40

< 40


<7

<7

Monitor port tap fraction (%)

4-678

0.5 - 2

Automatic Laser Shutdown (ALS)

100 ms

--

75

For 10 G links, add a 3 dB attenuator to the output ports. Measured peak-to-peak. 77 Measured peak-to-peak. 78 Over the entire C band. 76

417006-2009-013-A01


5-19



CWDM Modules Mux/Demux Modules for XDM-300/900 See Section Mux/Demux Modules (page 4-21) for detailed specifications.

OADM Modules for XDM-300/900 See Section OADM Modules (page 4-21) for detailed specifications.

Splitter/Coupler Modules for XDM-300/900 See Section Splitter/Coupler Modules (page 4-22) for detailed specifications.


5-20

4-channel system

8-channel system

1471



1491



1511





1531





1551





1571





1591



1611




417006-2009-013-A01



Physical Specifications Dimensions (H x W x D) XDM-300/XDM-900 .......................................... 350 x 443 x 246 mm (13.8 x 17.44 x 9.68 in) SIM-1/4/8/16, PIM-2/345 .........................................35 x 97 x 213 mm (1.38 x 3.82 x 8.38 in) EISMB, DIOM .......................................................... 32 x 97 x 213 mm (1.26 x 3.82 x 8.38 in) PIM2_63/B, MCSM ................................................ 32 x 195 x 213 mm (1.26 x 7.68 x 8.38 in) SIM16_4/SIM64_XFP/SIM64_2 ........................................ 34 x 381 x 203 mm (1.34 x 15 x 8) TPM-xx_1/TPM-xx_3 ..............................................72 x 97 x 211 mm (2.83 x 3.82 x 8.31 in) TCF/TC ..................................................................... 84 x 45 x 210 mm (2.91 x 1.77 x 8.27 in) MXC-300 .............................................................. 52 x 385 x 279 mm (2.05 x 15.16 x 10.1 in) MXC900................................................................ 52 x 385 x 279 mm (2.05 x 15.16 x 10.1 in) ECU300...................................................................................... 27 x 381 x 203 (1.06 x 15 x 8) ECU900...................................................................................... 27 x 381 x 203 (1.06 x 15 x 8) TPU/OCU.............................................................. 75 x 443 x 246 mm (2.95 x 17.44 x 9.68 in) xRAP-D (optional) ..............................................133 x 445 x 285 mm (5.24 x 17.53 x 7.29 in) xRAP-100 (optional) ...........................................133 x 445 x 185 mm (5.24 x 17.53 x 7.29 in) Racks ........................................2200/2600 x 600 x 300 mm (86.61/102.36 x 23.62 x 11.81 in) ...................................................................................... 2134 x 584 x 305 mm (82 x 23 x 12 in)

Weight Basic XDM-300 shelf .................................................................................... 8.2 kg (18.06 lbs) Basic XDM-300 fully populated ..................................................................... 30 kg (66.08 lbs) Basic XDM-900 shelf .................................................................................... 8.2 kg (18.06 lbs) Basic XDM-900 fully populated ..................................................................... 30 kg (66.08 lbs)

Power Applicable specifications ........................................................ ETSI 300 132-2; FTZ 19 PFL 1 Input voltage ............................................................................................ -40 V dc to -75 V dc Nominal power source ....................................................................................... -48 V or -60 V XDM-300 power consumption ..........................................Typical 800 W, maximum 1100 W XDM-900 power consumption ........................................Typical 1000 W, maximum 1400 W

417006-2009-013-A01


5-21



Power Dissipation XDM-300 power dissipation ............................... Typical 2732 Btu/hr, maximum 3757 Btu/hr XDM-900 power dissipation ............................... Typical 3414 Btu/hr, maximum 4780 Btu/hr

XDM-100 Product Line Main Equipment Power Consumption The following table lists the power requirements of the main equipment components. Determine the expected power requirement of the equipment installed in the shelf, and compare it with the shelf capabilities.

5-22

Type

Component

Power requirements

Common cards

MXC-100

47 W

MXC-100B

47 W

MXC-BR

0W

MXC50

42 W

MXC-300

88.5 W

MXC-900

210 W

ECU

6.7 W

ECU-F

18.3 W

ECU50

68 W

ECU50_R

10 W

ECU300

6.7 W

ECU300_F

18 W

ECU900

6.7 W

ECU900_F

18 W

INF50

14 W

OHU

5W

TPU

0W

TC

2.5 W

TCF

7W

FCU-100-9F

21.6 W

FCU50

52 W

FCU300

79.2 W

FCU900

79.2 W


417006-2009-013-A01



Type

Component

Power requirements

PDH modules

PIM2_21

11 W

PIM2_42

14.3 W

PIM2_63

16 W

PIM2_63B

16 W

PIM2_63S

16 W

PIM345_3

11 W

CCP50_2

2W

SAM1_4E

10 W

SAM1_4O

10 W

SAM1_4OB

10 W

SAM4_2

17 W

SAM16_1

19.7 W

SAM16_1B

30 W

SIM1_4E

12 W

SIM1_4O

12 W

SIM1_4OB

12 W

SIM1_8

12.8 W

SIM4_2

17 W

SIM4_4

30 W

SIM4_8

47 W

SIM16_1

26 W

SIM16_2

37 W

SIM16_4

63.3 W

SIM16_8

110 W

SIM64_XFP

73.6 W

SIM64_1

60 W

SIM64_2

137 W

TPM2_1

5W

TPM2_3

5W

TPM2_42_2

5W

TPM2_63_2

5W

TPMH_1

5W

SDH modules

Protection modules

417006-2009-013-A01


5-23



Type

Component

Power requirements

Data modules

EISMB_804

32 W

EISMB_840

35 W

DIOM_04

22 W

DIOM_08

24 W

DIOM_40

31.2 W

MCSM

75 W

ACP100

12 W

ACP900

12 W

MO_CMD4C

1.8 W

MO_CMD8

4.8 W

MO_CMD4C_E

4.8 W

MO_CMD4SL

4.8 W

MO_COADM1AB-Gxx

4.8 W

MO_COADM2AB-xx

4.2 W

MO_4CP4SPSM

4.2 W

MO_4CP4SPMM50

4.2 W

MO_4CP4SPMM62U5

4.8 W

CCMB25_2D

34 W

CRPT25_2C

4.5 W

CTRP25_2C

10 W

OSC1_2

12 W

MO_DC0_BAS

7W

MO_PAS_DCM80

4.9 W

OTR1_YY

1W

OTR4_YY

1W

OTR25_YY

1W

OTC25_PSxx

1.5 W

OTC25_ALxx

1.5 W

Control module

Optical modules

Optical amplifiers

Optical transceivers

5-24


417006-2009-013-A01



Type

Component

Power requirements

Data transceivers

OTFE_SM

1W

OTFE_MM

1W

OTGBE_LX

1W

OTGBE_SX

1W

OTGBE_ZX

1W

ETGBE

1W

OMS16-4T

8W

MO_DW16MDB-AVAV

4.8 W

MO_DW16MDB-ST

4.8 W

MO_DW16MDR-ST

10 W

MO_DW16MDRE-ST

10 W

MO_DW40MC-S

10 W

MO_DW40MC-A

10 W

MO_DW40MC-G

10 W

MO_DW40DC-A

10 W

MO_DW40DC-G

10 W

Environmental Conditions Operation Applicable specification .................................................................. ETS 300 019-1-3 Class 3.2 Temperature range .............................................................................................. -5 ºC to +55 ºC Relative humidity ..................................................................................................... 5% to 90%

Storage (packed) Applicable specification ................................................................. ETS 300 019-1-1 Class 1.2 Temperature range ............................................................................................ -25 ºC to +55 ºC Relative humidity ................................................................................................. 10% to 100%

Handling and Transportation Applicable specification ................................................................. ETS 300 019-1-2 Class 2.3 Temperature range ........................................................................................... -40 ºC to +70 ºC Relative humidity ...................................................................................................... up to 95%

417006-2009-013-A01


5-25






NEBS Compliance The XDM platforms are designed in accordance with NEBS regulations for EMC and Safety, including GR-1089-CORE Issue 1, October 1995 and GR-63-CORE Issue 2, December 1997 Revision 1, February 1999 (Level 3).



5-26


417006-2009-013-A01

6 XDM-40, 400, 450, 500, 1000, 2000, and 3000 Specifications In this chapter: Electrical, Optical, and Mixed Basecard Information ..................................... 6-2 XDM Shelf Capacities..................................................................................... 6-5 PDH/Async and SDH/SONET Interface Specifications ................................. 6-8 SDH/SONET Interfaces ................................................................................ 6-10 XDM MPLS/Ethernet Card Summary........................................................... 6-22 Data Cards ..................................................................................................... 6-22 Optical Components ...................................................................................... 6-32 C Band Channel Frequencies and Wavelengths (ITU-T Rec. G.694.1 for DWDM)......................................................................................................... 6-62 CWDM Frequencies and Wavelengths (ITU-T Rec. G.694.2 for CWDM) .. 6-65 Physical Specifications .................................................................................. 6-65 Environmental Conditions ............................................................................. 6-73 EMC .............................................................................................................. 6-73 Safety ............................................................................................................. 6-73 Reliability ...................................................................................................... 6-74 Management Specifications........................................................................... 6-74 Other Specifications ...................................................................................... 6-75

417006-2009-013-A01


6-1

XDM-40, 400, 450, 500, 1000, 2000, and 3000 Specifications


Electrical, Optical, and Mixed Basecard Information Card

Ports/Bitrate

Electrical

PIO2_84

84 x E1 (2 Mbps) PDH/Async basecard for balanced and unbalanced interfaces

PIO2_21

21 x E1 (2 Mbps) PDH/Async basecard for balanced and unbalanced interfaces

PIO345/PIO345M 79

16 x E3/DS-3/STS-1 (34/45/51 Mbps) interfaces

Optical

SIO16/SIO16M 80

2 x STM-16/OC-48 (2.488 Gbps) interfaces 81

SIO64/SIO64M/MF SIO164

82

1 x STM-64/OC-192 (10 Gbps) interface 1 x STM-64/OC-192 (10 Gbps) interface or 4 x STM-16/OC-48 (2.488 Gbps) interfaces

XIO192

1 x STM-16/OC-48 (2.488 Gbps) + 1 x STM-4/OC-12 or 4 x STM-1/OC-3 interfaces

XIO348F 83

1 x STM-64/OC-192 (10 Gbps) interface or 4 x STM-16/OC-48 (2.488 Gbps) interfaces

Mixed

SIO1&4/SIO1&4M 84 SIO1&4B

Supports various electrical (e) and/or optical (o) interfaces as follows: 

16 x STM-1o/OC-3/OC-3c



16 x STM-1e/STS-3e



4 x STM-4/OC-12

NOTE: For full interface support per card and shelf, please contact ECI's Product Management or your local ECI representative.

79

The suffix M denotes SONET support; it also denotes MS-SPRing/BLSR support for SDH/SONET. The MF suffix denotes FEC 7% support according to ITU-T Recommendation G.709. 80 The suffix M denotes SONET support; it also denotes MS-SPRing/BLSR support for SDH/SONET. The MF suffix denotes FEC 7% support according to ITU-T Recommendation G.709. 81 The suffix M denotes SONET support; it also denotes MS-SPRing/BLSR support for SDH/SONET. The MF suffix denotes FEC 7% support according to ITU-T Recommendation G.709. Cards are not supported in XDM-400. Optical STM-16 transceivers MSA for 2 and 20 km are not s upported for SIO64MF. 82 Cards are not supported in XDM-400. 83 Cards are not supported in XDM-400. 84 The suffix M denotes SONET support; it also denotes MS-SPRing/BLSR support for SDH/SONET. The MF suffix denotes FEC 7% support according to ITU-T Recommendation G.709.

6-2


417006-2009-013-A01



Electrical Interface Connection Modules Electrical I/O cards are assigned an interface connection module. This module serves as the I/O card electrical line transceiver and is connected to the I/O cards via the XDM backplane. For example, when eleven PIO2_84 I/O cards are installed in the XDM-1000 cards cage, eleven M2_84xx connection modules should be installed in the modules cage. In this case, if hardware protection is required, one PIO2_84 I/O card can be configured as the protection card, and the corresponding protection protection connection module M2_84P I/O is installed in the appropriate slot of the XDM-1000 modules cage. I/O slot 12 is always configured as a pure optical slot without a modules cage module.

Connection Module Data for Electrical I/O Cards I/O card

Bitrate (Mbps)

I/O ports

Module

Interface type

Function/Description Function/Description

SIO1&4

155

16

M1_16BT

SDH/SONET electrical

Connection module

M1_16DIN


Connection module

M1_16P 85

-

Connection module with protection

M1_8BT


Connection module

M1_8DIN


Connection module

M345_16BT

PDH/Async

Connection Connectio n module

M345_16DI

PDH/Async

Connection module

86

PDH/Async


M345_8BT

PDH/Async

Connection module

M345_8DI

PDH/Async

Connection module

M345_8BN

PDH/Async

Connection Connectio n module

8

PIO345

34/45/52

16

M345_16P 8

85

Protection modules are not supported in XDM-400. Protection modules are not supported in XDM-400.

86

417006-2009-013-A01


6-3



I/O card

Bitrate (Mbps)

I/O ports

Module

Interface type

Function/Description Function/Description

PIO2_84

2.048

84

M2_84B

PDH

Balanced (120 Ω) connection module

M2_84BR

PDH

Low-cost, balanced (120 Ω) connection module, without protection

M2_84U

PDH

Unbalanced (75 Ω) connection module

M2_84UR

PDH

Low-cost, unbalanced (75 Ω) connection module, without protection

M2_84P 87

PDH


M2_21B

PDH

Balanced (120 Ω) connection module

M2_21U

PDH

Unbalanced (75 Ω) connection module

M2_84P 88

PDH


PIO2_21

2.048

21

Optical transceivers for I/O cards Optical I/O cards use a slide-in optical transceiver, which is directly plugged into the card for signal interfacing. I/O card

Optical module

Connector type

I/O ports per optical module

Modules per I/O card

Ports per I/O card

SIO1&4

OM01_4

LC

4

4

16 x STM-1/OC-3

OM04_1

SC/LC

1

4

4 x STM-4/OC-12

OM16_1

SC/LC

1

2

2 x STM-16/OC-48

OM64_1

LC

1

1

1 x STM-64/OC-192/OTU2 STM-64/OC-192/OTU2

OMSC16_4

LC

4

1


OMTX10_EF

LC

1

1

1 x STM-64/OC-1 92/OTU2

OMTX10

LC

1

1


OMTX10_S

LC

1

1


OM01_4

LC

4

1

4 x STM-1/OC-3

OM04_1

SC/LC

1

1

1 x STM-4/OC-12

OM16_1

SC/LC

1

1

1 x STM-16/OC-4 8

OMSC16_4

LC

4

1


OMTX10_EF

LC

1

1

1 x STM-64/OC-1 92/OTU2

OMTX10

LC

1

1


OMTX10_S

LC

1

1


SIO16 SIO64

89

SIO164

90

XIO192

XIO384F

91

87

Protection module M2_84P can be used to protect PIO2_84. Protection modules are not supported in XDM-400. Protection module M2_84P can be used to protect PIO2_84. Protection modules are not supported in XDM-400. 89 Cards are not supported in XDM-400. 90 Cards are not supported in XDM-400. 91 Cards are not supported in XDM-400. 88

6-4


417006-2009-013-A01



Optical SFP transceivers for I/O cards New optical I/O cards use a high flexibility concept, consisting of slide-in optical modules. Each module has slots for up to four SFP transceivers. I/O card

Optical module

Connector type

I/O ports per optical module

Modules per I/O card

Ports per I/O card

SIO1&4

OMS01_4 92

LC

1 to 4

4

16 x STM-1/OC-3

93

LC

1

4

4 x STM-4/OC-12

SIO16

OM16_1SFP 94 LC

1

2


SIO164

OMSC16_4

4

1


OMS04_1

LC

XDM Shelf Capacities XDM shelf slot capacities differ as a function of the type of matrix cards (HLXC or XIO) used. Although the XIO and the HLXC have identical cross-connect capabilities, the bandwidth allocation capacity per I/O slot for the XIO is different than that of the HLXC. The HLXC has uniform capacity distribution per slot, regardless of the XDM shelf in which it is installed. In contrast, XIO capacity varies, depending on the XDM shelf type in use.

XDM Shelf Capacities with HLXC The following table describes the HLXC bandwidth allocation capacity (in VC-4s) per slot for each XDM shelf type. XDM-500 slot #

XDM-1000/ 2000 slot #

XDM-500 slot capacity (HLXC192)


XDM-1000/2000 slot capacity (HLXC384)


I/C2

I/O1

32 (5 Gbps)

16 (2.5 Gbps)

32 (5 Gbps)

64 (10 Gbps)

I/C3

I/O2

32 (5 Gbps)

16 (2.5 Gbps)

32 (5 Gbps)

64 (10 Gbps)

I/C4

I/O3

32 (5 Gbps)

16 (2.5 Gbps)

32 (5 Gbps)

64 (10 Gbps)

I/C5

I/O4

32 (5 Gbps)

16 (2.5 Gbps)

32 (5 Gbps)

64 (10 Gbps)

I/C1

I/O5

32 (5 Gbps)

16 (2.5 Gbps)

32 (5 Gbps)

64 (10 Gbps)

I/C6

I/O6

32 (5 Gbps)

16 (2.5 Gbps)

32 (5 Gbps)

64 (10 Gbps)

I/O7

16 (2.5 Gbps)

32 (5 Gbps)

64 (10 Gbps)

I/O8

16 (2.5 Gbps)

32 (5 Gbps)

64 (10 Gbps)

92

SFP SDH/SONET transceivers starting system version V 5.0, DWDM SFPs release V6.2. SFP SDH/SONET transceivers starting system version V 5.0, DWDM SFPs release V6.2. 94 SFP SDH/SONET transceivers starting system version V 5.0, DWDM SFPs release V6.2. 93

417006-2009-013-A01


6-5

XDM-40, 400, 450, 500, 1000, 2000, and 3000 Specifications XDM-500 slot #

XDM-1000/ 2000 slot #


XDM-1000/2000 XDM-1000/2000 slot capacity capacity (HLXC384) (HLXC384)


I/O9

16 (2.5 Gbps)

32 (5 Gbps) Gbps)

64 (10 Gbps)

I/O10

16 (2.5 Gbps)

32 (5 Gbps) Gbps)

64 (10 Gbps)

I/O11

16 (2.5 Gbps)

32 (5 Gbps) Gbps)

64 (10 Gbps)

I/012

16 (2.5 Gbps)

32 (5 Gbps) Gbps)

64 (10 Gbps)

192

384

768

Total capacity



192

XDM Shelf Capacities with XIO The following table describes the XIO bandwidth allocation ca pacity ca pacity (in VC-4s) per slot for each XDM shelf type. 95

XDM-400 slot #

XDM-500 slot #

XDM-1000/ 2000 slot #

XDM-400 slot XDM-500 capacity slot (XIO192) capacity (XIO192)

XDM-500 slot capacity (XIO384F) (XIO384F)

XDM-1000 96 slot capacity (XIO192)

XDM-1000/ 2000 slot capacity (XIO384F 97 ConfigA) ConfigA)

XDM-1000 / 2000 slot capacity (XIO384F 98 ConfigB) ConfigB)

IS2

IC2

I/O1

32 (5 Gbps)

32 (5 Gbps) 32 (5 Gbps) 32 (5 Gbps) 32 (5 Gbps) 0

IS3

IC3

I/O2

32 (5 Gbps)

32 (5 Gbps) 64 (10 Gbps)

IC4

I/O3

16 (2.5 Gbps) 32 (5 Gbps) 64 (10 Gbps)

16 (2.5 Gbps)

32 (5 Gbps) 64 (10 Gbps)

IS4

IC5

I/O4

16 (2.5 Gbps) 32 (5 Gbps) 32 (5 Gbps) 16 (2.5 Gbps)

32 (5 Gbps) 64 (10 Gbps)

IS1

IC1

I/O5

16 (2.5 Gbps) 8 32 (5 Gbps) 16 (1.25 Gbps) (2.5 Gbps)

16 (2.5 Gbps)

16 (2.5 Gbps)

IS5

IC6

I/O6

8 32 (5 Gbps) 16 (1.25 Gbps) (2.5 Gbps)

16 (2.5 Gbps)

16 (2.5 Gbps)

I/O7

4 16 (622 Mbps) (2.5 Gbps)

16 (2.5 Gbps)

I/O8

4 16 (622 Mbps) (2.5 Gbps)

16 (2.5 Gbps)

I/O9

4 (622 Mbps)

16 (2.5 Gbps)

32 (5 Gbps) 32 (5 Gbps) 0

16 (2.5 Gbps)

95

The bandwidth capacities in the XDM-500 are suitable for cost-effective ADM-64s. Using the XIO384F with an STM-64 interface frees six slots in the XDM-500 for PIO and SIO cards. 96 The bandwidth capacities in the XDM-1000 are suitable for cost-effective ADM-64s as well as an ADM-16 with many PIO interfaces. This is an excellent option for s ystems with a large number of E1 interfaces. 97 The bandwidth capacities in this configuration of the XDM-1000/2000 are suitable for a multi-ADM-16 with eight drop slots available for SDH/SONET, PDH, and Ethernet services. 98 The bandwidth capacities in this configuration of the XDM-1000/2000 are a good solution for a double ADM64 with eight drop slots available for SDH/SONET, PDH, and Ethernet services. Two slots are available for optical transponders and/or combiners for hybrid applications.

6-6


417006-2009-013-A01


XDM-400 slot #

XDM-500 slot #

XDM-1000/ 2000 slot #

XDM-40, 400, 450, 500, 1000, 2000, and 3000 Specifications XDM-400 slot XDM-500 capacity slot (XIO192) capacity (XIO192)

95

XDM-500 slot capacity (XIO384F)

XDM-1000 96 slot capacity (XIO192)

XDM-1000/ 2000 slot capacity (XIO384F 97 ConfigA)

XDM-1000/ 2000 slot capacity (XIO384F 98 ConfigB)

I/O10

4 16 (622 Mbps) (2.5 Gbps)

16 (2.5 Gbps)

I/O11

16 (2.5 Gbps)

16 (2.5 Gbps)

I/012

16 (2.5 Gbps)

16 (2.5 Gbps)

XIO-L

XIO-L

XIO-L

20

20

64

20

64

64 (10 Gbps)

XIO-R

XIO-R

XIO-R

20

20

64

20

64

64 (10 Gbps)

OHA

OHA

OHA

8

8

--

8

--

--

192

192

384

192

384

384

Total capacity

The bandwidth capacities in the XDM-500 are suitable for cost-effective ADM-64s. Using the XIO384F with an STM-64 interface frees six slots in the XDM-500 for PIO and SIO cards. The bandwidth capacities in the XDM-1000 are suitable for cost-effective ADM-64s as well as an ADM-16 with many PIO interfaces. This is an excellent option for systems with a large number of E1 interfaces. The bandwidth capacities in this configuration of the XDM-1000/2000 are suitable for a multi-ADM-16 with eight drop slots available for SDH/SONET, PDH, and Ethernet services. The bandwidth capacities in this configuration of the XDM-1000/2000 are a good solution for a double ADM-64 with eight drop slots available for SDH/SONET, PDH, and Ethernet services. Two slots are available for optical transponders and/or combiners for hybrid applications.

417006-2009-013-A01


6-7



PDH/Async and SDH/SONET Interface Specifications 2 Mbps (E1) Physical level .............................................................................................. G.703, Paragraph 6 Frame ...................................................................................... Unframed, G.704, I.431 (ISDN) Line code .......................................................................................................................... HDB3 Line impedance ..................................................................... 120

Ω balanced/75 Ω unbalanced


Ω unbalanced

45 Mbps (DS-3) Physical level .............................................................................................. G.703, Paragraph 5 Frame ................................................................................................................................ G.751 Line code ........................................................................................................................... B3ZS Line impedance ............................................................................................... 75

Ω unbalanced

52 Mpbs (STS-1) Physical level ..................................................................................................... GR-253-CORE Frame ................................................................................................................................ G.253 Line code ............................................................................................................................. CMI Line impedance ............................................................................................... 75

Ω unbalanced

STM-1 Electrical Physical level ............................................................................................ G.703, Paragraph 12 Frame ................................................................................................................................ G.707 Line code ............................................................................................................................. CMI

6-8


417006-2009-013-A01



STM-1/OC-3 Optical Physical level ..................................................................................................... G.957, Table 2 Wavelength .................................................................................................. 1310 nm, 1550 nm Short-haul, long-haul bitrate ................................................................. 155.52 Mbps

±4.6 ppm

STM-4/OC-12 Optical Physical level ..................................................................................................... G.957, Table 3 Wavelength .................................................................................................. 1310 nm, 1550 nm Short-haul, long-haul, very long-haul, ultra long-haul bitrate ................... 622 Mbps

±4.6 ppm

STM-16/OC-48 Optical Physical level ..................................................................................................... G.957, Table 4 Wavelength ................................................................................................. 1310 nm, 1550 nm Short-haul, long-haul, very long-haul, ultra long-haul, DWDM (G.694.1 and G.957) bitrate .................................................. 2488.32 Mbps

±4.6 ppm

STM-64/OC-192 Optical Physical level .......................................................................................... G.691, G.957, Table 5 Wavelength ................................................................................................. 1310 nm, 1550 nm Short-haul, long-haul, very long-haul, DWDM (G.694.1) bitrate ...... 9953.28 Mbps

417006-2009-013-A01


±4.6 ppm

6-9



SDH/SONET Interfaces STM-1/OC-3 (155.52 Mbps ±4.6 ppm) I/O Modules CARD NAME

99

OM01_4S3

OM01_4L5

S-1.1

L-1.2

1270-1380

1261-1360

1480-1580

Source type

MLM

SLM

SLM

Max. RMS width (nm)

-

7.7

-


-

-

1


-

-

> 30


-19

-15

-5


-14

-8

0


10

8.2

10


-30

-28

-34

Min. overload (dBm)

-

-8

-10


-

-

-25


-

96

-


-

-

-20


-

-

-25


1

1

1

APPLICATION CODE

OM01_4I3 100


RECEIVER

99

MLM transceiver for 2 km with multimode fibers. Application code is in reference to ITU-T Recommendation G.691.

100

6-10


417006-2009-013-A01



MECP_OSC cards MECP_OC5OW

MECP_OC5UOW

CARD NAME

MECP_OSC5


1500-1520

1500-1520

1500-1520

Signal Rate

155 Mbps

155 Mbps

2 Mbps

Source type

SLM

SLM

SLM

Max. RMS width (nm)

-

-

-


1

1

1


> 30

> 30

> 30


0

0

+1


+2

+5

+5


10

10

10

Min. sensitivity sensitivit y (BER of 1*10-10) EOL (dBm)

-34

-35 [-40]

-54

Min. overload (dBm)

-10

-8

-5


-25

-

-


-

-

-


-20

-20

-


-25

-25

-25


1

1

1

101

[MECP_OC5XOW]

TRANSMITTER

RECEIVER

OPTICAL PATH BETWEEN S AND R

101

No interoperability possible between MECP_OC5UOW and the other MECP_OSC modules.

417006-2009-013-A01


6-11



STM-1/OC-3 SFP Optical Transceivers for OMS01_4 Table 6-1:

STM-1 transceivers

102

OTR1_S3

OTR1_L3

OTR1_L5

S-1.1

L-1.1

L-1.2

1263-1360

SFP TRANSCEIVER NAME APPLICATION CODE

103


1261-1360 104

OTR1_X5

OTR1_VL5

1480-1580

1500-1520

1500-1520

SLM

SLM

SLM

SLM

Source type

MLM

Max. RMS width (nm)

7.7

-

-

-

-


-

30

30

> 30

> 30


-15

-5

-5

0

+1


-8

0

0

+5

+5


8.2

10

10

10

10

Min. sensitivity (BER of 1*10 ) EOL (dBm)

-28

-34

-34

-35

-42

Min. overload (dBm)

-8

-10

-10

-8

-5


-

-

-25

-

-


96

-

-

-

-


-

-

-20

-20

-


-

-

-25

-25

-25


1

1

1

1

1

-12

NOTE: When selecting bidirectional transceivers, pay attention that they must operate in complementary pairs. For example: OTR1-S3BD can work only vis-a-vis OTR1-S5BD; OTR4-L3BD can work only vis-a-vis OTR4-L5BD, OTR4-L5BD, and so on. The transceivers in the following table are arranged in complementary pairs.

102

New optical SFP transceivers for existing SIO1&4B basecard. Application code is in reference to ITU-T Recommendation G.691. 104 MultiLongitudinal Mode (MLM) source type laser can also operate with single mode fibers for S -1.1 interfaces in reference to ITU-T Recommendation G.957. 103

6-12


417006-2009-013-A01


Table 6-2:


STM-1 bidirectional transceiver s


105

OTR1-S3BD

OTR1-S5BD

106

107

BD 3

Operating wavelength (nm) (nm)

BD 5

OTR1-L3BD

OTR1-L5BD

L3BD

L5BD

1260-1360

1480-1580

1280-1360

1480-1580

Source type

MLM

MLM

MLM

SLM

Max. RMS width (nm)

7

3

4

1


-

-

-

30


-14

-14

-5

-5

Max. mean launched power (dBm) power (dBm)

-8

-8

0

0


10

10

10

10


-32

-32

-32

-32

Min. overload (dBm)

-8

-8

0

0

Max. receiver reflectance (dB) (dB)

-

-

-

-


-

-

-

-

Min. optical return loss of cable cable (dB)

-20

-20

-

-

Max. discrete reflectance (dB) (dB)

-

-

-

-

Max. optical path penalty (dB) (dB)

1

1

1

1

TRANSMITTER

RECEIVER

108

OPTICAL PATH BETWEEN S BETWEEN S & R

STM-4/OC-12 (622 Mbps ±4.6 STM-4/OC-12 ±4.6 ppm) I/O Modules CARD NAME

109

OM4_1S3

OM4_1L5

S-4.1

L-4.2

1270-1380

1274-1356

1480-1580

Source type

MLM

SLM

SLM

Max. RMS width (nm)

-

4

1


-

-

1


-

-

> 30


-19

-15

-3


-14

-8

+2


10

8.2

10

APPLICATION CODE

OM4_1I3 110


105

Application code is in reference to ITU-T Recommendation G.691. BD 3: STM-1 single-fiber bidirectional S FP module with a 1310 nm TX wavelength. 107 BD 5: STM-1 single-fiber bidirectional S FP module with a 1550 nm TX wavelength. 108 Receiver units of SFPs (excluding bidirectional SFPs) are a wide-band type. 109 MLM transceiver for 2 km with multimode fibers. 110 Application code is in reference to ITU-T Recommendation G.691. 106

417006-2009-013-A01


6-13


CARD NAME APPLICATION CODE


OM4_1I3

109

110

OM4_1S3

OM4_1L5

S-4.1

L-4.2

RECEIVER


-31

-28

-28

Min. overload (dBm)

-

-8

-8


-

-

-27


-

74

-


-

-

-24


-

-

-27


1

1

1

OPTICAL PATH BETWEEN S AND R

STM-4/OC-12 SFP Optical Transceivers for OMS04_1 Table 6-3:

STM-4 transceivers


111

OTR4_S3

OTR4_L3

OTR4_L5

S-4.1

L-4.1

L-4.2

1274-1356

1280-1335

1480-1580

Source type

MLM113

SLM

SLM

Max. RMS width (nm)

4/2.5

-

-


-

1

<1


-

30

30


-15

-3

-3


-8

+2

+2


8.2

10

10


-28

-28

-28

Min. overload (dBm)

-8

-8

-8


-

-14

-27


74

-

-


-

20

24


-

-25

-27


1

1

1

APPLICATION CODE

112


RECEIVER


111

New optical SFP transceivers for existing SIO1&4B basecard. Application code is in reference to ITU-T Recommendation G.691. 113 MultiLongitudinal Mode (MLM) source type laser can also operate with single mode fibers for S-1.1 interfaces in reference to ITU-T Recommendation G.957. 112

6-14


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Table 6-4:



OTR4_S3BD

OTR4_S5BD

OTR4_L3BD

OTR4_L5BD

S3BD

S5BD

L3BD

L5BD

1260-1360

1480-1580

1260-1360

1480-1580

Source type

MLM

SLM

MLM

SLM

Max. RMS width (nm)

3

1

3

1


-

30

-

30


-15

-15

-3

-3


-8

-8

+2

+2


8.2

8.2

10

10


-28

-28

-28

-28

Min. overload (dBm)

-8

-8

-8

-8


-

-

-

-

-

-

-

Application code

114


RECEIVER

115



-

-

-

-


-

-

-

-


1

1

1

1

114


115

417006-2009-013-A01


6-15



STM-16/OC-48 (2488.32 Mbps ±4.6 ppm) I/O Modules CARD NAME

OM16_ 1AX5xx

OM16_ 1AV5xx

OM16_ 1AB5xx

OM16_ 1AX5

OM16_ 1AL5

OM16_ 1PS3

OM16_ 1PI3

X-16.2

V-16.2

U-16.2

X-16.2

L-16.2

S-16.1

I-16

15301560

15301565

15301565

15301560

15301565

12601360

1260-136 0

Source type

SLM

SLM

SLM

SLM

SLM

SLM

SLM


1

1

1

1

1

1

2

Max. RMS width (nm)

-

-

-

-

-

-

-


30

30

30

30

30

30

-


+5.5

+1

+0

+5.5

+0

-5

-10


+7.5

+3

+2

+7.5

+3

0

-3


8.2

8.2

8.2

8.2

8.2

8.2

8.2

Photodiode type

APD

APD

APD

APD

APD

Pin

Pin


-28

-28

-28

-28

-28

-18

-16

Min. overload (dBm)

-7

-7

-7

-7

-7

0

0

-27

-27

-27

-27

-27

-27

APPLICATION CODE

116


RECEIVER

Max. receiver reflectance -27 (dB) OPTICAL PATH BETWEEN S AND R


1800

1800

3000 117

2160

1800

- 118

- 119


-24

-24

-24

-24

-24

-24

-24


-27

-27

-27

-27

-27

-27

-27

Max. optical path penalty < 2 (dB)

<2

<2

<3

<2

<2

<1

116

Application code is in reference to ITU-T Recommendation G.691. To reach distances of 150 km, OM16_1AB5 should be connected to a booster. 118 The dispersion value is relevant only in the 1500 nm wavelength. PS3 is for 25 km and PI3 for 2 km. 119 The dispersion value is relevant only in the 1500 nm wavelength. PS3 is for 25 km and PI3 for 2 km. 117

6-16


417006-2009-013-A01



SDH/SONET STM-16/OC-48 SFP Optical Transceivers for OM16_1SFP and OMSC16_4 Table 6-5:

STM-16 transceivers

SFP TRANSCEIVER NAME APPLICATION CODE

120

125

OTR16_I3

121

OTR16_S3

122

OTR16_L3

123

OTR16_L5

I-16

S-16.1

L-16.1

L-16.2

1260-1360

1260-1360

1280-1335

1500-1580

Source type

SLM

SLM

SLM

SLM


2

1

1

<1

Max. RMS width (nm)

-

-

-

-


-

30

30

30


-10

-5

-2

-2


-3

0

+3

+3


8.2

8.2

8.2

8.2


-16

-18

-27

-28

Min. overload (dBm)

0

0

-9

-9


-27

-27

-27

-27


-

-

-

1600


-24

-24

-24

-24


-27

-27

-27

-27


<1

1

1

2


124

TRANSMITTER

RECEIVER



120

New optical SFP transceivers for existing SIO16 basecard. All OTR SFP transceivers can be used with SIO164 or XIO384F cards, utilizing the OMSC16_4 module (up to 4 SFP transceivers per module). 122 All OTR SFP transceivers can be used with SIO164 or XIO384F cards, utilizing the OMSC16_4 module (up to 4 SFP transceivers per module). 123 All OTR SFP transceivers can be used with SIO164 or XIO384F cards, utilizing the OMSC16_4 module (up to 4 SFP transceivers per module). 124 All OTR SFP transceivers can be used with SIO164 or XIO384F cards, utilizing the OMSC16_4 module (up to 4 SFP transceivers per module). 125 Application code is in reference to ITU-T Recommendation G.691. 121

417006-2009-013-A01


6-17


Table 6-6:




OTR16_S3BD

OTR16_S5BD

OTR16_L3BD

OTR16_L5BD

S3BD

S5BD

L3BD

L5BD

1260-1360

1480-1580

1260-1360

1480-1580

Source type

SLM

SLM

SLM

SLM

Max. RMS width (nm)

1

1

1

1


30

30

30

30


-5

-5

-2

-2


+2

+2

+5

+5


8.2

8.2

8.2

8.2


-18

-18

-27

-27

Min. overload (dBm)

0

0

-9

-9


-

-

-

-

-

-

-

Application code

126


RECEIVER

127



-

-

-

-


-

-

-

-


1

1

1

1

126


127

6-18


417006-2009-013-A01



CWDM and DWDM STM-16/OC-48/OTU1 SFP Optical Transceivers for OM16_1SFP and OMSC16_4 CWDM SFP TRANSCEIVER 128 NAME APPLICATION CODE

OTC25_PSx x 133


S-C8S1-1D2/ 5 G.695

DWDM OTC25_1A OTR25_AVx Lxx x

OTR25_ABxx

OTR16_I3

OTR16_S3

OTR16_L3

OTR16_L5

S-C8L1-1D DW100L2/5 -1D2/5(C)F DW100CG.695 -1A2/5(C)F

DW100L-1D2/5(C)F DW100C-1A2/5(C)F

I-16

S-16.1

L-16.1

L-16.2

G.698.1/.2

G.698.1/.2

129

130

131

132

1464-1618

1464-1618

1530-1565

1530-1565

1260-1360

1260-1360

1280-133 5

1500-158 0

Source type

SLM

SLM

SLM

SLM

SLM

SLM

SLM

SLM


1

1

0.4

0.4

2

1

1

<1

Max. RMS width (nm)

-

-

-

-

-

-

-

-


30

30

30

30

-

30

30

30


0

0

0

0

-10

-5

-2

-2


+5

+5

4

4

-3

0

+3

+3


8.2

8.2

8.2

8.2

8.2

8.2

8.2

8.2


-21.5 (-23 GbE)

-28 (-32 GbE)

-28

-28

-16

-18

-27

-28

Min. overload (dBm)

0

-7

-9

-9

0

0

-9

-9


-27

-27

-27

-27

-27

-27

-27

-27

TRANSMITTER

RECEIVER



800 (40 km G.652)

1600 (80 km G.652)

2400 (120 km G.652)

3600 (180 km G.652)

-

-

-24

1600


24

24

-24

-24

-24

-24

-27

-24

128

New optical SFP transceivers for existing SIO16 basecard. All OTR SFP transceivers can be used with SIO164 or XIO384F cards, utilizing the OMSC16_4 module (up to 4 SFP transceivers per module). 130 All OTR SFP transceivers can be used with SIO164 or XIO384F cards, utilizing the OMSC16_4 module (up to 4 SFP transceivers per module). 131 All OTR SFP transceivers can be used with SIO164 or XIO384F cards, utilizing the OMSC16_4 module (up to 4 SFP transceivers per module). 132 All OTR SFP transceivers can be used with SIO164 or XIO384F cards, utilizing the OMSC16_4 module (up to 4 SFP transceivers per module). 133 Application code is in reference to ITU-T Recommendation G.691. 129

417006-2009-013-A01


6-19



CWDM

DWDM

SFP TRANSCEIVER 128 NAME

OTC25_PSx x

OTC25_1A OTR25_AVx Lxx x

OTR25_ABxx

OTR16_I3

OTR16_S3

OTR16_L3

OTR16_L5


-27

-27

-27

-27

-27

-27

1

-27


1.5

2.5

<3

<2

<1

1

129

130

131

132

2

SDH/SONET STM-64/OC-192 (9953.28 Mbps ±4.6 ppm) I/O Modules CARD NAME

134

APPLICATION CODE

OM64_ 1ALSxx OM10_1AL 135 Sxx

137


L-64.2a

138

OM64_ 1ASSxx OM10_1AS 136 Sxx S-64.2a

139

OM10_ 1PSSxx

I-64.2

140

OM10_ 1PLSxx

L-64.2b

OM10_ 1PSS3

141

S-64.1

142

OM10_ 1PIS3

I-64.1

143

1530-1565

1530-1565

1530-1565

1530-1565

1285-1330

1285-1330

Source type

EML

EML

EML

EML

EML

EML


0

-2

-2

-2

-4

-6


+2

+3

+3

+3

+1

-1


9.0

8.2

8.2

10

6

6

Photodiode type

APD

APD

PIN

PIN

PIN

PIN


-23 144

-19 145

-14

-14

-15

-11

Min. overload (dBm)

-8

-8

-1

-1

-1

-1


<2

<2

<2

<2

<1

<1


-27

-27

-27

-27

-27

-27

TRANSMITTER

RECEIVER

OPTICAL PATH BETWEEN S AND R Max. attenuation range (dB)

21

15

10

10

10

4

Min. attenuation range (dB)

10

10

3

3

1

0

Max. chromatic dispersion (ps/nm)146

1600 147

800

800

1600 148

40

7

134

Not supported in XDM-400. OM10 is supported, in all three SIO64 types. 136 OM10 is supported, in all three SIO64 types. 137 Application code is in reference to ITU-T Recommendation G.691. 138 OM64/OM10 optics are also available for DWDM applications as per the standard ITU-T G.694.1 grid (n = 1-40). 139 OM64/OM10 optics are also available for DWDM applications as per the standard ITU-T G.694.1 grid (n = 1-40). 140 OM64/OM10 optics are also available for DWDM applications as per the standard ITU-T G.694.1 grid (n = 1-40). 141 OM64/OM10 optics are also available for DWDM applications as per the standard ITU-T G.694.1 grid (n = 1-40). 142 OM64/OM10 optics are also available for DWDM applications as per the standard ITU-T G.694.1 grid (n = 1-40). 143 OM64/OM10 optics are also available for DWDM applications as per the standard ITU-T G.694.1 grid (n = 1-40). 144 When adding FEC, there is a typical improvement of 2 dB for nonamplified networks (sensitivity of -25 dBm instead of -23 dBm). 145 When adding FEC, there is a typical improvement of 2 dB for nonamplified networks (sensitivity of -25 dBm instead of -23 dBm). 135

6-20


417006-2009-013-A01



SDH/SONET STM-64/OC-192 XFP Optical Transceivers XFP TRANSCEIVER NAME

OTR64_I3

OTR64_S5

OTR64_L5

I-64.1 P1I1_2D1 VSR2000_2R1

S-64.2b P1S1_2D2 b

L-64.2a P1L1-2D2

1290-1330

1529-1560

1530-1565

1529-1560

Source type

SLM

SLM

SLM

SLM

SLM


NA

NA

NA

192.1 + 0.1m m=0 to 40

192.1 + 0.1m m=0 to 40


NA

NA

NA

±12.5

±12.5


<1

<1

<1

<1

<1


30

30

30

30

30


-6

-1

0

-1

-1


-1

+2

+4

+3

+3


6

8.2

9

8.2

9


-11

-14

-24

-24

-24

Min. overload (dBm)

-1

-1

-7

-8

-8


-27

-27

-27

-27

-27

APPLICATION CODE

149


OTR10_ASxx

OTR10_ALxx 1L1-2D2F

1529-1560

TRANSMITTER

RECEIVER



6.6

800

1600

800

1600


24

24

24

2

2


-27

-27

-27

-27

-27


1

2

2

2

2

146

Effective optical power budget calculation for single channel with no amplification: Tx min. power minus Rx sensitivity (EOL) minus max. optical path penalty (dB). 147 The limitation for the long-range STM-64/OC-192 laser is 68 km. When adding FEC, the range can be extended up to 76 km. 148 The limitation for the long-range STM-64/OC-192 laser is 68 km. When adding FEC, the range can be extended up to 76 km. 149 Application code is in reference to ITU-T Recommendation G.691.

417006-2009-013-A01


6-21



OW Unit Specifications The OW unit supports omnibus conference call with two separate c onfigurable networks (A and B). Any user within the network can select another user in its n etwork by direct dialing (DTMF). Tx/R x level...................................... ....................................7 dBm, 600 Ω, (per CCITT G.711) Speech coding and bit rate ................................................................ .......... PCM A-law 8 K bps Num ber of VF channels ................................................................................................ 10 t o 12 Band pass ......................................................................................... ................. 300 to 3400 Hz Su bscriber side input/output level .......................................7 dBm, 600 Ω, (per CCITT G.711) Idle channel noise .............................................................................. ................... (-) 75 dBmOp Num ber of data channels................................................................... ................... 3 (E1, E2, F1) Inter face connectors type .................................................................. ...... Tel JACK 6P4C RCA Data rates ........................................................................................... ............................ 64 Kbps

XDM MPLS/Ethernet Card Summary The following table identifies the MPLS/Ethernet components and the platforms within which specific modules are used. The different modules are listed b y interface categories, wher e the modules within a category generally share the same func tionality. Specific details may vary from module to module. Inter face

XDM-400

XDM-500

XDM-1000

XDM-2000

XDM-3000

--

√

√

√

√

MCS5 (only in 5 and 10 Gbps slots)

--

√

√

√

√

MCS10 (only in 10 Gbps slots)

--

√

√

√

√

MCS30_X10G (only in 10 Gbps slots)

--

√

√

√

√

Ethernet over SDH/SONET Layer 1

DIOB Ethernet/MPLS Layer 1 and 2

Data Cards Card

150

DIOB

Service interfaces 151

8 x FX/GbE (optical) + [8 x 10/100BaseT + 152 8 x 10/100/1000BaseT]

Data handling

Network interfaces

Bandwidth per EoS interface

Layer 1

24 x EoS153

(1 to 16) x VC-4 (1 to 48) x VC-3 (1 to 63) x VC-12

150

All data cards are not supported in XDM-40. Optical ports on base cards, SFP for GbE or FX. 152 Electrical ports located on ME_16 module in the CCP. 151

6-22


417006-2009-013-A01


Card

150


Data handling

Service interfaces 155

Network interfaces

Bandwidth per EoS interface 157

MCS5 154

4 x FX/GbE (optical) + 4 x FX (optical) + [12 x 10/100BaseT + 4 x 10/100/1000BaseT]156

Layer 2 32 x EoS/MoT (Ethernet/M PLS)

(1 to 16) x VC-4 (1 to 48) x VC-3 158 (1 to 63) x VC-12 159

MCS10160

8 x FX/GbE (optical)161 + [8 x 10/100BaseT + 162 8 x 10/100/1000BaseT]


(1 to 16) x VC-4 163 (1 to 48) x VC-3 164 165 (1 to 63) x VC-12

MCS30_X10G

1 x 10GbE (optical) + 10 x FX/GbE (optical) 167


(1 to 64) x VC-4 (1 to 192) x VC-3 (1 to 64) x VC-12

2 x VC-4 + 126 x E1

ATM

166

ATS

168

2 x VC-4 + 125 x E1

2 x VC-4 + 125 x E1

DIOB Specifications Interfaces ........................ 10/100/1000BaseT, 100BaseFX (single mode and multimode fiber), ..................................................................................1000BaseSX, 1000BaseLX, 1000BaseZX Protection ..................................................... IOP 1:1 for both EoS ports and optical user ports Standards compliance............................................ IEEE 802.3z, G.707, G.783, G.7041 (GFP), ........................................................................................................................... G.7042 (LCAS) EoS capacity with VC-4 or VC-3 granularity .............................................. up to 2.5 or 5 Gbps EoS capacity with VC-12 granularity .......................................................... up to 512 x VC-12 LCAS ............................................. Enabled or Disabled (VCAT mode), configurable per port Flow control ................................................................................. hitless following IEEE 802.3 Failure forwarding...................................................................................................... CSF, TSF

153

EoS – Ethernet over SDH/SONET. Can be accommodated in 5 Gbps, or 10 Gbps slots only, with 5 Gbps EoS capacity. 155 Optical ports on base cards, SFP for GbE or FX. 156 Electrical ports located on ME_16 module in the CCP. 157 Maximum EoS/MoT capacity per card: 5 Gbps (32xVC-4 or 96xVC-3) and per EoS port when using LAG. 158 Maximum EoS/MoT capacity per card: 5 Gbps (32xVC-4 or 96xVC-3) and per EoS port when using LAG. 159 Maximum n x VC-12 per card: 512 x VC-12. 160 Can be accommodated in 10 Gbps slots only. 161 Optical ports on base cards, SFP for GbE or FX. 162 Electrical ports located on ME_16 module in the CCP. 163 Maximum EoS/MoT capacity per card: 10 Gbps (64xVC-4 or 192xVC-3) and per EoS port when using LAG. 164 Maximum EoS/MoT capacity per card: 10 Gbps (64xVC-4 or 192xVC-3) and per EoS port when using LAG. 165 Maximum n x VC-12 per card: 512 x VC-12. 166 Can be accommodated in 10 Gbps slots only. 167 Supported starting V8.2 168 ATS resources can be software-allocated to service or network interfaces as required 154

417006-2009-013-A01


6-23



MCS5 Specifications Interfaces ........................ 10/100/1000BaseT, 100BaseFX (single mode and multimode fiber), ..................................................................................1000BaseSX, 1000BaseLX, 1000BaseZX Total EoS/MoT capacity ................................................................................................. 5 Gbps Switch capacity ............................................................................................................. 20 Gbps MAC address memory ....................................................................................... 153,600 entries Ethernet Ring Protection (ERP) ...... <50ms FRR link and node, <50ms Dual homed/attached, , G.8032 (ERP) ............................................................ Ethernet UNI/NNI LAG and EoS LAG, .................................................................... Fast IOP – MCS5 1+1 hot standby card protection MPLS-based servicesVPWS (Martini encapsulation), VPLS (Full mesh and star), Hierarchical ................................. VPLS (H-VPLS) with multiple Split Horizon Groups and VPLS Spokes ......................................................................................... P2MP (Multicast drop and continue), ...................................................................................................................................... H-VPLS ................................................................................................. IGMP snooping and static MAC Hard QoS: ....................................... 8192 policed flows per card supporting CIR, CBS and EIR, EBS ......................................... Classification based on port, CVLAN, CVLAN-Pbits, SVLAN, ...................... SVLAN-Pbits (802.1p priority bits), DHCP field, Untagged Frame, BPDU, ................................................... and Wildcard (all VLANs that are not explicitly defined). ........................................ Untagged frame handling with port-based VLAN (attach/detach ...................................................................... CVLAN and/or SVLAN to untagged frames) .......................................... 8 Classes of Service (CoS), Classification rules, CoS mapping, ........................... 2 rate policing, 3 colors marking, Connection Admission Control (CAC) ...............................WRED, Shaping, Scheduling (WFQ/WRR – Weighted Fair Queuing / ....................................................................................................... Weighted Round Robin) MAC and VLANs: ...................... 4093 x 4093 VLANs with 16K VLAN mapping rules, S-VLAN translation, ........................................S-VLAN configurable Ether-type, FDB (Forwarding Data Base) E2E OAM: ........................................... Tunnel OAM (ITU-T Y.1711) with Connectivity Verification, ...................... Service OAM (802.1ag) with Continuity Check, Loopback and Link Trace, ........................... Link OAM (802.3ah), Link Loss Carry Forward (LLCF), Port Mirroring Security: ...................................... VSI (Virtual Switch Instance) VPN segregation, VLAN filtering, ......................................................................... FIB quota, BSC (Broadcast Storm Control) Management: ....................................... Point-and-click fast service creation, Management layers/Planes: ................................................. Data, TDM, optic, Supporting CAC for MPLS Tunnel and ............................................. Service provisioning, Enhanced protection by SRLG (Shared .................................................................................................... Risk Link Group) schemes Services: Triple Play ............................................ DTV/IPTV, HDTV, Gaming, VoD, VoIP, and HSI 6-24


417006-2009-013-A01



Business connectivity............................................................... VPWS, VPLS, and H-VPLS Mobile aggregation ......................... 3G Ethernet-based services, including VoIP, HSDPA, ..................................... IPTV and video streaming, MP3 streaming, VoD, video and voice ........................................................................................................................... conferences Wholesale/CoC ............................................................ Ethernet bandwidth and leased lines Standards compliance: IEEE ........................................................................ 802.1D/P/Q, 802.1w, 802.1ad, 802.1ag ............................................................ 802.3-2005, 802.3ad, 802.3ah (Link OAM), 802.3x MEF .......................... MEF 4, MEF 6, MEF 7, MEF9, MEF 10, MEF 11, MEF 12 MEF14 ITU-T ........................................ G.707, G.7041, G.7042, G.8010/Y.1306, G.8011/Y.1307, .............................................................................. G.8011.1/Y.1307.1, G.8011.2/Y.1307.2, ................................................... G.8012/Y.1308, Y.1710, Y.1711, G.783, G.8032/Y.1344 IETF ........................................... RFC 3031, RFC 3032, RFC 3270, RFC 3443, RFC 4448, ................................ RFC 4379, RFC 3812, RFC 3813, RFC 2702, RFC 4090, RFC 3916, ........................................................................................................... RFC 3985, RFC 4125

MCS10 Specifications Interfaces ........................ 10/100/1000BaseT, 100BaseFX (single mode and multimode fiber), ..................................................................................1000BaseSX, 1000BaseLX, 1000BaseZX Total EoS/MoT capacity ............................................................................................... 10 Gbps Switch capacity ............................................................................................................. 20 Gbps MAC address memory ....................................................................................... 153,600 entries Ethernet Ring Protection (ERP) ...... <50ms FRR link and node, <50ms Dual homed/attached, ..................................................................................... Ethernet UNI/NNI LAG and EoS LAG, .............................................................................................................................. G.8032 (ERP) .................................................................. Fast IOP – MCS10 1+1 hot standby card protection MPLS-based services ............................................................... VPWS (Martini encapsulation), .................................................................................... VPLS (Full mesh and star), Hierarchical .......................................................................................... VPLS (H-VPLS) with multiple Split ........................................................................................... Horizon Groups and VPLS Spokes, .......................................................................................... P2MP (Multicast drop and continue) ................................................................................................. IGMP snooping and static MAC Hard QoS: ....................................... 8192 policed flows per card supporting CIR, CBS and EIR, EBS ......................................... Classification based on port, CVLAN, CVLAN-Pbits, SVLAN, ...................... SVLAN-Pbits (802.1p priority bits), DHCP field, Untagged Frame, BPDU, ................................................... and Wildcard (all VLANs that are not explicitly defined). ........................................ Untagged frame handling with port-based VLAN (attach/detach ...................................................................... CVLAN and/or SVLAN to untagged frames) ....................................Eight Classes of Service (CoS), Classification rules, CoS mapping, ........................... 2 rate policing, 3 colors marking, Connection Admission Control (CAC)

417006-2009-013-A01


6-25



...............................WRED, Shaping, Scheduling (WFQ/WRR – Weighted Fair Queuing / ....................................................................................................... Weighted Round Robin) MAC and VLANs: ....................... 4093 x 4093 VLANs with 16K VLAN mapping rules, SVLAN translation, ........................................S-VLAN configurable Ether-type, FDB (Forwarding Data Base) E2E OAM: ........................................... Tunnel OAM (ITU-T Y.1711) with Connectivity Verification, ...................... Service OAM (802.1ag) with Continuity Check, Loopback and Link Trace, ........................... Link OAM (802.3ah), Link Loss Carry Forward (LLCF), Port Mirroring Security: ...................................... VSI (Virtual Switch Instance) VPN segregation, VLAN filtering, ......................................................................... FIB quota, BSC (Broadcast Storm Control) Management: ....................................... Point-and-click fast service creation, Management layers/Planes: ................................................. Data, TDM, optic, Supporting CAC for MPLS Tunnel and ............................................. Service provisioning, Enhanced protection by SRLG (Shared .................................................................................................... Risk Link Group) schemes Services: Triple Play ............................................ DTV/IPTV, HDTV, Gaming, VoD, VoIP, and HSI Business connectivity................................................................ VPWS and VPLS, H-VPLS Mobile aggregation ......................... 3G Ethernet-based services, including VoIP, HSDPA, ..................................... IPTV and video streaming, MP3 streaming, VoD, video and voice ........................................................................................................................... conferences Wholesale/CoC ............................................................ Ethernet bandwidth and leased lines Standards compliance: IEEE ........................................................................ 802.1D/P/Q, 802.1w, 802.1ad, 802.1ag ............................................................ 802.3-2005, 802.3ad, 802.3ah (Link OAM), 802.3x MEF .......................... MEF 4, MEF 6, MEF 7, MEF9, MEF 10, MEF 11, MEF 12 MEF14 ITU-T ........................................ G.707, G.7041, G.7042, G.8010/Y.1306, G.8011/Y.1307, ................................................... G.8011.1/Y.1307.1, G.8011.2/Y.1307.2, G.8012/Y.1308, .............................................................................. Y.1710, Y.1711, G.783, G.8032/Y.1344 IETF ........................................... RFC 3031, RFC 3032, RFC 3270, RFC 3443, RFC 4448, ................................................... RFC 4379, RFC 3812, RFC 3813, RFC 2702, RFC 4090, ......................................................................................... RFC 3916, RFC 3985, RFC 4125

MCS30_X10G Specifications Interfaces .................................................................. 10GBase-SR (850nm MM), 10GBase-LR ................................ (1310nm SM), 10GBase-ER (1550nm SM), 10GBase-ER (1550nm SM), ....................................................................................... 10GBase-ER (15XXnm DWDM, SM) Total EoS/MoT capacity ............................................................................................... 10 Gbps Switch capacity ............................................................................................................. 30 Gbps MAC address memory ....................................................................................... 153,600 entries 6-26


417006-2009-013-A01



Ethernet Ring Protection (ERP) ...... <50ms FRR link and node, <50ms Dual homed/attached, ..................................................................................... Ethernet UNI/NNI LAG and EoS LAG, .............................................................................................................................. G.8032 (ERP) ...................................................... Fast IOP – MCS30_X10G 1+1 hot standby card protection MPLS-based services ............................................................... VPWS (Martini encapsulation), .................................................................................... VPLS (Full mesh and star), Hierarchical .......................................................................................... VPLS (H-VPLS) with multiple Split ........................................................................................... Horizon Groups and VPLS Spokes, .......................................................................................... P2MP (Multicast drop and continue) ................................................................................................. IGMP snooping and static MAC Hard QoS: ....................................... 8192 policed flows per card supporting CIR, CBS and EIR, EBS ......................................... Classification based on port, CVLAN, CVLAN-Pbits, SVLAN, ...................... SVLAN-Pbits (802.1p priority bits), DHCP field, Untagged Frame, BPDU, ................................................... and Wildcard (all VLANs that are not explicitly defined). ........................................ Untagged frame handling with port-based VLAN (attach/detach ...................................................................... CVLAN and/or SVLAN to untagged frames) ....................................Eight Classes of Service (CoS), Classification rules, CoS mapping, ........................... 2 rate policing, 3 colors marking, Connection Admission Control (CAC) ...............................WRED, Shaping, Scheduling (WFQ/WRR – Weighted Fair Queuing / ....................................................................................................... Weighted Round Robin) MAC and VLANs: ....................... 4093 x 4093 VLANs with 16K VLAN mapping rules, SVLAN translation, ........................................S-VLAN configurable Ether-type, FDB (Forwarding Data Base) E2E OAM: ...................................... VSI (Virtual Switch Instance) VPN segregation, VLAN filtering, ......................................................................... FIB quota, BSC (Broadcast Storm Control) Security: ...................................... VSI (Virtual Switch Instance) VPN segregation, VLAN filtering, ......................................................................... FIB quota, BSC (Broadcast Storm Control) Management: ....................................... Point-and-click fast service creation, Management layers/Planes: ................................................. Data, TDM, optic, Supporting CAC for MPLS Tunnel and ............................................. Service provisioning, Enhanced protection by SRLG (Shared .................................................................................................... Risk Link Group) schemes Services: Triple Play ............................................ DTV/IPTV, HDTV, Gaming, VoD, VoIP, and HSI Business connectivity...................................................................... VPWS, VPLS, H-VPLS Mobile aggregation ......................... 3G Ethernet-based services, including VoIP, HSDPA, ..................................... IPTV and video streaming, MP3 streaming, VoD, video and voice ........................................................................................................................... conferences Wholesale/CoC ............................................................ Ethernet bandwidth and leased lines Standards compliance: 417006-2009-013-A01


6-27



IEEE ........................................................................ 802.1D/P/Q, 802.1w, 802.1ad, 802.1ag ............................................................ 802.3-2005, 802.3ad, 802.3ah (Link OAM), 802.3x MEF .......................... MEF 4, MEF 6, MEF 7, MEF9, MEF 10, MEF 11, MEF 12 MEF14 ITU-T ........................................ G.707, G.7041, G.7042, G.8010/Y.1306, G.8011/Y.1307, ................................................... G.8011.1/Y.1307.1, G.8011.2/Y.1307.2, G.8012/Y.1308, .............................................................................. Y.1710, Y.1711, G.783, G.8032/Y.1344 IETF ........................................... RFC 3031, RFC 3032, RFC 3270, RFC 3443, RFC 4448, ................................................... RFC 4379, RFC 3812, RFC 3813, RFC 2702, RFC 4090, ......................................................................................... RFC 3916, RFC 3985, RFC 4125

ATS Specifications Bandwidth ............................................................................................................. 622.08 Mbps Simultaneous IMA support ....................... 84 IMA groups per card with 1 to 32 E1 links each ATM service classes .................................................................. CBR, rt-VBR, nrt-VBR, UBR ATM signaling ............ UNI 3.1, UNI 4.0, PNNI 1.0, PNNI SPVC Addendum V 1.0, IISP 1.0 IMA ............................................................................................................... IMA 1.0, IMA 1.1 OAM ....................................................................................................................... ITU-T I.610 Traffic management ........................................................................................... ATMF TM 4.1

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417006-2009-013-A01



Data Client Transceivers for DIOB, MCS5, MCS10, MCS30_X10G OTGBE_SX

OTGBE_LX

OTGBE_ZX

OTFE_MM

OTFE_SM

Transmitter type

GbE short-reach laser, 850 nm, multi-mode

GbE long-reach laser, 1310 nm, single mode

GbE very long-reach laser, 1550 nm, single mode

FX, short-reach laser, 1310 multi-mode

FX, Bidirection Bidirection Bidirection Bidirection short-reach al SFP, al SFP, al SFP, al laser, 1310 1310 nm 1490 nm 1310 nm SFP, 1490 nm nm, single mode

Data rate (nominal) (Mbaud)

1250

1250

1250

125

125

1250

1250

1250

1250


-3 Max.

-3

5

-8

5

-3 Max.

-3

+2

+2

-9.5 Min.

-11

0

-15

0

-10 Min.

-10

-5

-5


9

9

9

10

10

>9

>9

>9

>9

Data format

8B/10B

8B/10B

8B/10B

N/A

N/A

8B/10B

8B/10B

8B/10B

8B/10B


-20 Min.

-22

--

-28

-22

< -21

< -21

< -23

< -23

-21 Typical

-25.5

-22

-30

--

< -22

< -22

< -24

< -24


0

0

0

-14

-8

0

0

-3

-3


-24

-29

-25

< -29

<-28

-35

-35

-33

-33

Connector

LC

LC

LC

LC

LC

LC

LC

LC

LC

10 km (9 µm SMF)

80 km (9 µm SMF)

550 m (50/62.5 µm MMF)

10 km (9 µm SMF)

10 km (9 µm SMF)

10 km (9 µm SMF)

40 km (9 µm SMF)

40 km (9 µm SMF)

Fiber lengths 550 m (50/62.5 µm MMF)

417006-2009-013-A01


OTGBE_S 3BD

OTGBE_S 5BD

OTGBE_L 3BD

6-29

OTGBE_L 5BD



Data Client XFP Transceivers for MCS30_X10G Transceiver

OTR103_ER

OTR103_ZR

OTR103_SR

OTR103_LR

Application code

S-64.2b P1S1_2D2b 10GBASE-ER

L-64.2a P1L1-2D2

10GBASE-SR

10GBASE-LR

Source type

SLM

SLM

MLM

SLM

Modulation

External

External

Direct

Direct


1529-1560

1530-1565

840-860

1290-1330


<1

<1

NA

<1


30

30

NA

30


-1

0

-4

-8.2


+2

+4

-1

+0.5


8.2

9

3

6


11

22

4

4


3

11

0

0


800

1600

NA

6.6


24

24

12

12


-27

-27

-27

-27

Maximum DGD (ps)

30

30

30

30

Sensitivity (BER of 1*10 -12) (dBm)

-14

-24

-11 Stressed (-7.5)

-12.6

Min. overload (dBm)

-1

-7

-1

-1


2

2

3.9 (Transmitter and dispersion penalty)

1


<3

<3

<3

<3

6-30


417006-2009-013-A01



Data Line XFP Transceivers for MCS30_X10G Transceiver

OTR10_ALxx

OTR10_ASxx

Application code

1L1-2D2F

Source type

SLM

Modulation

External, NRZ


1529-1560

1529-1560


192.1 + 0.1m m=0 to 40

192.1 + 0.1m


±12.5

±12.5


<1

<1


30

30


0

-1


4

+3


9

8.2


-24

-24

Min. overload (dBm)

-8

-8


-27

-27

Maximum DGD (ps)

30


1600

800


2

2


<3

SLM

Transmitter

m=0 to 40

Receiver

Optical Path

417006-2009-013-A01


6-31



Optical Components The XDM optical layer can service pure optical networks as well as converged networks that integrate WDM with data and SDH/SONET services in the same platform. To take full advantage of the XDM platform, a variety of optical cards and modules are used for both the modules cage and the cards cage of the various shelves, both in I/O slots as well as in the X1/X2 slots (otherwise used for the cross-connect matrix cards).

DWDM Mux/Demux Cards and Modules DWDM cards (cards cage of XDM-1000 and XDM-2000 shelves) Card

Width (slots)

Function/Description

16/32-channel DWDM mux/demux cards (slots X1, X2)

DW16VMDRE-AG

1

Variable mux AWG, demux diffraction grating, 16 red channels, expandable to 32 channels

DWDM modules (CCP cage of XDM-1000/XDM-450) Conn. type

Width (slots)

MO_DW16MDR-BB-AVAV

LC

2

Mux AWG, demux AWG, 16 red channels, nonexpandable

MO_DW16MDRE-BB-AVAV

LC

2

Mux AWG, demux AWG, 16 red channels, expandable to 32 channels

MO_DW16MDB-BB-AVAV

LC

2

Mux AWG, demux AWG, 16 blue channels, expandable to 32 channels

MO_DW40MC-BB-AV

LC

2

Mux AWG, 40 channels, C band

MO_DW40DC-BB-AV

LC

2

Demux AWG, 40 channels, C band

Module


Flat Top mux/demux for cascading applications for manual ROADM like operation

6-32


417006-2009-013-A01



Mux (CCP Flat Top) specifications Type

16-channel

32-channel

40-channel

Insertion loss (dB):

AWG

< 6.5

< 9.5

< 6.5

Adjacent isolation (dB):

AWG

< -27

< -27

< -27

Cumulative isolation (dB):

AWG

< -24

< -24

< -24

PDL (dB)

AWG

<0.2

<0.2

<0.2

PMD (ps)

AWG

<0.5

<0.5

<0.5

Insertion Loss Uniformity (dB)

<1

<2

<1.8

Return loss (dB)

< -40

< -40

< -40

Demux (CCP Flat Top) specifications Type

16-channel

32-channel

40-channel

Insertion loss (dB):

AWG

< 6.5

<8

< 6.5


AWG

< -27

< -27

< -27


AWG

< -24

N/A

< -24

PDL (dB)

AWG

<0.2

<0.2

<0.2

PMD (ps)

AWG

<0.5

<0.5

<0.5

Insertion Loss Uniformity (dB)

<1

<2

<1.8

Return loss (dB)

< -40

< -40

< -40

417006-2009-013-A01


6-33



ROADM Cards ROADM modules for XDM-1000/XDM-450 (CCP cage) Module

Conn. type

Width (Slots)

Function/ Description

LC

2

Multi-degree optical

ROADM modules

MO_ROADM8A

add/drop of any combination of channels (100GHz spacing) to 9 ports. WSS in add position. MO_ROADM8A_50

LC

2

Multi-degree optical add/drop of any combination of channels (50GHz spacing) to 9 ports. WSS in add position.

MO_ROADM8D

LC

2

Multi-degree optical add/drop of any combination of channels (100GHz spacing) to 9 ports. WSS in drop position.

MO_ROADM40

LC

3

100GHz spacing 2D PLC ROADM with forty Add/Drop ports in East/West configuration. Any channel can be dropped or passed through via management. Add/Drop channels are automatically equalized. Can be used as VMUX for OTM sites.

MO_ROADM2A

LC

1

100GHz spacing 2D WSS ROADM with Add/Drop ports in East/West configuration. Requires external 40 Ch. Mux and DeMux. Can be used as VMUX for OTM sites.

MO_ROADM2A_50

LC

1

50GHz spacing 2D WSS ROADM with Add/Drop ports in East/West configuration. Requires external 80 Ch. Mux and DeMux. Can be used as VMUX for OTM sites.

MO_ROADM8A – 100 GHz spacing –Multi Degree configuration Basecard type

ROADM8 Through

Drop

Local

MO_ROADM8A (dB) Add module

7.5

NA

7.5

MO_ROADM8A (dB) Drop module

11.5

11.5

9.5

MO_ROADM8A (dB) multi-degree Add + Drop module

19

-


<-40

PDL (dB)

At 0 dB Atten

<0.5

At 15 dB Atten

<1.3

PMD at 0 dB attenuation (ps)

6-34

Add

NA

<1


417006-2009-013-A01



MO_ROADM8A_50 – 50 GHz spacing –Multi Degree configuration Basecard type

ROADM8A_50 Through

Drop

Local

Add

MO_ROADM8A_50 (dB) Add module

6.5

NA

6.5

6.5

MO_ROADM8A_50 (dB) Drop module

11.5

11.5

9.3

NA

MO_ROADM8A_50 (dB) multi-degree Add + Drop module

18

-


<40

PDL (dB)

At 0 dB Atten

<0.5

At 15 dB Atten

<0.8


<0.5

MO_ROADM8D – 100 GHz spacing – Multi-Degree configuration Basecard type

ROADM8 Through

Drop

Add

MO_ROADM8D (dB) Drop module

7

7

NA

MO_ROADM8D (dB) Add module

14

NA

14

MO_ROADM8D (dB) multi-degree Add + Drop module

21

Adjacent isolation (dB):-

<-40


<-38

PDL (dB)

<0.45

PMD (ps)

<0.2

MO_ROADM40 2D ROADM 100 GHz spacing with equalization Basecard type

ROADM40 Through

Drop

Add

MO_ROADM40 (dB) Drop module

4.2

10.6

-

MO_ROADM40 (dB) Add module

8.5

-

6.6

MO_ROADM40 (dB) protected 169 Add + Drop module

12.7

10.6

6.6

10.6 - Demux

6.6 - Mux

MO_ROADM40 used as VMUX Adjacent isolation (dB):

<-23


<-20

PDL (dB)

<1

PMD (ps)

<0.5

169

For protected sites using two East/West cards, the through insertion loss should be doubled.

417006-2009-013-A01


6-35



MO_ROADM2A - 100 GHz spacing - 2D ROADM with Equalization Basecard type

MO_ROADM2A Through

Local Drop

Local Add

MO_ROADM2A (dB) Add module

8.7

N/A

9.2

MO_ROADM2A (dB) Drop module

9.0

3.0

N/A

MO_ROADM2A (dB) two degree Add + Drop module

14.5

Add module integrated channel isolation (dB):

35

PDL (dB)

At 0 dB Atten

0.5

At 15 dB Atten

0.85


0.5

MO_ROADM2A_50 - 50 GHz spacing - 2D ROADM with Equalization Basecard type

ROADM2A_50 Through

Local Drop

Local Add

MO_ROADM2A_50 (dB) Add module

8.7

N/A

9.2

MO_ROADM2A_50 (dB) Drop module

6.0

5.0

N/A

Add module integrated channel isolation (dB):

11.5


35

PDL (dB)

At 0 dB Atten

0.5

At 15 dB Atten

0.85

DGD at 0 dB attenuation (ps)

0.5

DWDM OADM Cards and Modules DWDM OADM cards (cards cage) Card

Width (slots)

XDM-2000

XDM-1000

XDM-500

Basecard for 1 active OADM filter; east/west configuration

√

√

√

Basecard for 1 active OADM filter; east/west configuration with 2x2 switch OADM (Ready Site)

√

√

√


Active OADM basecards for I/O slots

OADM4EW

1

OADM4EW_SW 1

6-36


417006-2009-013-A01



DWDM OADM plug-in filters for OADM cards Module


OM_AD4RQEWxx

4-channel 100 GHz OADM filter with built-in equalization for east/west configuration, 4 skip 0, 10 bands in C-band

OM_AD4RQEW_xx 4skip0 OADM for I/O slots Insertion Loss

Module type

OADM4EW 170 (dB) OADM4EW_SW

171

(dB)

Through

Drop

Add

<1.8

<3.3

<4.7

<3.2

<4.0

<5.1


<-30

Non-adjacent isolation (dB):

<-40

PDL (dB)

<0.1

PMD (ps)

<0.2

4-channel active OADM basecard only (no filters), 2 x 2 switch through I/O slots Type of OADM site

Basecard + 2x2 switches

E/W unprotected

2.6

E/W protected both base cards with 2x 2 switches

5.2

DWDM components (CCP cage of XDM-40/XDM-450/XDM-500/XDM-1000) Module

Conn. type


Basecard for CWDM mux/demux/OADM modules

MO_CW2

NA

Basecard for up to two 4/8-channel CWDM mux/demux/OADM modules; occupies one slot

4 Channel DWDM OADM module

OM_OADM4GEW_xx

LC

4-channel, 100 GHz DWDM OADM filter, 4skipe0, 10 channels in C-band

170

For protected sites using two East/West cards, the through insertion loss should be doubled. For protected sites using two East/West cards, the through insertion loss should be doubled.

171

417006-2009-013-A01


6-37



OM_OADM4GEW_xx 4 skip 0 OADM for CCP slots Module type

Insertion Loss Through

Drop

Add

OM_OADM4GEW (dB)

< 1.1

< 3.1

< 3.1


<-30

Non-adjacent isolation (dB)::

<-40

PDL (dB)

<0.1

PMD (ps)

<0.2

CWDM Mux/Demux/OADM Components CWDM components (CCP cage) Module

Conn. type


Basecard for CWDM mux/demux/OADM modules

MO_CW2

NA

Basecard for up to two 4/8-channel CWDM mux/demux/OADM modules; occupies one slot

4/8-Channel CWDM mux/demux modules

OM_CWMD4C

LC

4-channel CWDM mux/demux for 1511 nm, 1531 nm, 1551 nm, 157 nm, with built-in 1310 nm OSC filter

OM_CWM8C

LC

8-channel CWDM mux for 1471 nm, 1491 nm, 1511 nm, 1531 nm, 1551 nm, 1571 nm, 1591 nm, 1611 nm with built-in 1310 nm OSC filter

OM_CWD8C

LC

8-channel CWDM demux for 1471, 1491, 1511, 1531, 1551, 1571,1591, 1611 nm with built-in 1310 nm OSC filter

OM_CWMD4C_E

LC

Upgradeable 4-channel CWDM mux/demux for 1511 nm, 1531 nm, 1551 nm, 1571 nm with built-in 1310 nm OSC filter

OM_CWMD4SL

LC

4-channel expansion CWDM mux/demux for 1471 nm, 1491 nm, 1591 nm, 1611 nm without OSC filter

1/2-Channel CWDM OADM modules

6-38

OM_OADMC1AB_xx

LC

1-channel OADM for channel 1xx1nm, with built-in 1310 nm OSC filter

OM_OADMC2AB_xxyy/Gzz

LC

2-channel OADM for channels 1xx1+ 1yy1nm/1zz1 + 1(z+2)(z+2)1nm, with built-in 1310 nm OSC filter


417006-2009-013-A01



Mux/demux specifications OM-CWMD4C

OM_CWM8C & OM_CWD8C

OM_CWMD4C-E

OM_CWMD4SL

Insertion loss mux + < 4.2 demux (dB) 172

< 5.5

< 4.9

< 7.3

Return loss (dB)

< 40

< 40

< 40

< 40

Directivity (dB)

< 45

< 45

< 45

< 45

OADM specifications Insertion loss Module type

OM_OADMC1AB_xx

174

OM_OADMC2AB_xxyy/Gzz

175

173

Through

Drop

Add

< 3.9dB

< 2.6dB

< 2.2dB

< 4.4dB

< 3.2dB

< 3.2dB

Transponders TRP25_2 basecards Card

No. of slots


TRP25_2C

1

Basecard for two 2.5 Gbps transponders with 3R (50 Mbps to 2.7 Gbps). Provides PM (for SDH/SONET, SONET, GbE), OCH/UPSR 1+1 protection, and outband FEC.

TRP25_2CT

1

Add/Drop bidirectional transponder with tunable laser (add) and noncolored laser (drop) with 3R (50 Mbps to 2.7 Gbps). Provides PM (for SDH/SONET, SONET, GbE), OCH/UPSR 1+1 protection, and outband FEC.

TRP25_2CTR

1

Bidirectional regenerator with two tunable lasers with 3R (50 Mbps to 2.7 Gbps). Provides PM (for SDH/SONET, SONET, GbE), OCH/UPSR 1+1 protection, and outband FEC.

172

Including built-in 1310 nm OSC filter. The insertion l oss for 1310 nm filter is 1.2dB. Including built-in 1310 nm OSC filter. The insertion l oss for 1310 nm filter is 1.2dB. 174 xx designates the channel dropped by the OADM. 175 xx designates the group of two channels dropped by the OADM. 173

417006-2009-013-A01


6-39



Optical transmitters and receivers for TRP25_2 Module

Description/Function

2.5 Gbps optical transmitters and receivers for TRP25_2

OMT25_Bxx

2.5 Gbps colored transmitter type B

OMT25_S3

2.5 Gbps 1310 nm short-haul transmitter type S3

OMT25_T

Optical module tunable transmitter for C band

OMR25C_A

Type A (APD) continuous receiver

OMR25C_P

Type P (PIN diode) continuous receiver

CHTR_B basecard Configurations Card

No. of slots


CMBR25_2

1

Basecard for two SFP data (GbE/FC/FICON) modules and 2.7 Gbps line with G.709 FEC

TRP25_4

1

Basecard for 2 x 2.7 Gbps transponders with G.709 FEC

CMTR25

1

Multi rate combiner (STM-1/4, FC1/2, GbE) to 2.7 Gbps line with G.709 FEC, or Dense transponder for 4 x 2.7 Gbps transponder with G.709 FEC

CMBR10_T

1

Basecard for 4xSTM16 OTN combiner with G.709 FEC/EFEC

TRP10_2B

1

Basecard for 10.7 Gbps transponders with G.709 FEC/EFEC

TRP10_LAN

1

Basecard for 10.3 Gbps 10GbE LAN transponders with G.709 FEC/EFEC

CHTR_B basecard modules and transceivers Module


CMBR25 modules

OMCD25_2

2.7 Gbps Client/line card with G.709 FEC for two SFP data (GbE/FC/FICON) modules

CMTR25 modules

OMTR27_2

Line and client module for STM16/OTU1 services. CWDM and/or DWDM. Supports on-board protection. Two modules fit on each CHTR_B base card

OMCM25_4

Line and client module for up to four services of STM1/4, FICON, FC100, FC200, GbE to 2.7G combiner''''. CWDM and/or DWDM. Supports on-board protection. Two modules fit on CHTR_B base card

2.7 Gbps optical cards for TRP25_4

OMTR27

2.7 Gbps Client/line card with G.709 FEC for STM-16 SFP transceiver

2.7 Gbps line transceivers for CMBR25 & TRP25_4

OTX27_AT

6-40

Tunable 2.7 Gbps transceiver, transmitter type B (with G.709 FEC) and APD receiver


417006-2009-013-A01


Module

XDM-40, 400, 450, 500, 1000, 2000, and 3000 Specifications Function/Description

2.7 Gbps line transceivers for CMTR25

OTC25_PSxx

2.7 Gbps CWDM transceiver (with or without outband FEC), short haul with PIN receiver

OTC25_ALxx

2.7 Gbps CWDM transceiver (with or without outband FEC), long haul with APD receiver

OTR25_AVxx

DWDM SFP: 2.5/2.7G transceiver 2400 ps/nm, channel xx, LC connectors

OTR25_ABxx


10Gbps client side cards/transceivers for CMBR10, CMBR10_T, CMBR10_8D, TRP10_2B/LAN

OMS16_4T

Client card for four SFP STM-16 modules with timing transparency for all clients for CMBR10_T

OMSC16_4

Client card for four SFP STM-16 modules for CMBR10

OMTX10_S

Client card for STM-64/OC-192 XFP transceivers for TRP10_2B

OMTX10_LAN

Client card for XFP 10 GBE LAN transceivers for TRP10_LAN

OMCD_8

Line and client card for 8 x GbE/FC/FICON to 10.7G combiner for CMBR10_8D

OTR103_SR

10G LAN 10GBASE-SR transceiver module, 850nm MM fiber, PIN receiver, 300m

OTR103_LR

10G LAN 10GBASE-LR transceiver module, 1310nm , PIN receiver, 10Km

OTR103_ER

10G LAN 10GBASE-ER transceiver module, 1550nm , PIN receiver, 40Km

OTR103_ZR

10G LAN 10GBASE-ZR transceiver module, 1550nm , APD receiver, 80Km

OTR64_I3

STM-64/OC-192 client transceiver XFP, 1310nm short reach, 2km

OTR64_S5

STM-64/OC-192 client transceiver XFP, 1550nm short reach, 40km

OTR64_L5

STM-64/OC-192 client transceiver XFP, 1550nm long reach, 80km

10.7 Gbps line cards/transceivers for CMBR10, CMBR10_D, TRP10_2B/LAN

OMTX10

10.7 Gbps line card with G.709 FEC

OMTX10_S

10.7 Gbps Line card for XFP transceivers

OMTX10_EF

10.7 Gbps line card with G.709 FEC/EFEC

OTX10_ALxx

10.7 Gbps transceiver, colored transmitter type L (with G.709 FEC) and APD receiver

OTX10_AT

Full C band tunable 10.7 Gbps transceiver, transmitter type L (with G.709 FEC/EFEC) and APD receiver

OTX10_ATR

Full C band tunable 10.7 Gbps transceiver, transmitter type L (with G.709 FEC/EFEC) and APD receiver, RZ modulation.

Client SFP transceivers for CMBR25, CMBR10 & TRP25_4, CMTR25

OTGBE_SX

Optical GbE/FC/FICON transceiver, short reach, 850 nm multimode fiber

OTGBE_LX

Optical GbE/FC/FICON transceiver, long reach, 1310 nm single-mode fiber

OTGBE_ZX

Optical GbE/FC/FICON transceiver, very long reach, 1550 nm single-mode fiber

OTGBE_S3BD

Bi-directional GbE SFP with 1310nm TX/1490nm Rx. Short Range (10km)

OTGBE_S5BD


417006-2009-013-A01


6-41



Module


OTGBE_L3BD

Bi-directional GbE SFP with 1310nm TX/1490nm Rx. Long Range (40km)

OTGBE_L5BD

Bi-directional GbE SFP with 1490nm TX/1310nm Rx. Long Range (40km)

OTR16_I3

STM-16/OC-48 transceiver, intra-office 1310 nm

OTR16_S3

STM-16/OC-48 transceiver, short-haul 1310 nm

OTR16_L3

STM-16/OC-48 transceiver, long-haul 1310 nm

OTR16_L5


OTC25_PSxx


OTC25_ALxx


OTR25_AVxx


OTR25_ABxx


10.7 Gbps line XFP transceivers for OMTX10_S

OTR10_ASxx

40 Km DWDM color XFP

OTR10_ALxx

80 Km DWDM color XFP

AoC basecard configurations Card

No. of slots


AoC

1

Basecard for multirate combiner or ADM on Card (requires two cards) supporting 8 SFP ports of GbE, FC1/2, FICON, STM-16, OTU1

AoC basecard modules and transceivers Module


10.7 Gbps line cards/transceivers for AoC

OMTX10

10.7 Gbps line card with G.709 FEC

OMTX10_S

10.7 Gbps Line card for XFP transceivers

OMTX10_EF

10.7 Gbps line card with G.709 FEC/EFEC

OTX10_ALxx

10.7 Gbps transceiver, colored transmitter type L (with G.709 FEC) and APD receiver

OTX10_AT

Full C band tunable 10.7 Gbps transceiver, transmitter type L (with G.709 FEC/EFEC) and APD receiver

OTX10_ATR

Full C band tunable 10.7 Gbps transceiver, transmitter type L (with G.709 FEC/EFEC) and APD receiver, RZ modulation.

Client SFP transceivers for AoC

6-42

OTGBE_SX

Optical GbE/FC/FICON transceiver, short reach, 850 nm multimode fiber

OTGBE_LX

Optical GbE/FC/FICON transceiver, long reach, 1310 nm single-mode fiber

OTGBE_ZX

Optical GbE/FC/FICON transceiver, very long reach, 1550 nm single-mode fiber

OTGBE_S3BD


OTGBE_S5BD



417006-2009-013-A01



Module


OTR16_I3

STM-16/OC-48 transceiver, intra-office 1310 nm

OTR16_S3

STM-16/OC-48 transceiver, short-haul 1310 nm

OTR16_L3


OTR16_L5


OTC25_PSxx


OTC25_ALxx


OTR25_AVxx


OTR25_ABxx


TRP10_4 basecard configurations Card

No. of slots


TRP10_4M

1

Multi-service dual 10G Transponder card for 10G LAN, STM-64/OC-192 and FC10 services. Optimized for metro DWDM Networks - 2 x XFP client and 2 x XFP line

TRP10_4R

1

Multi-service dual 10G Transponder card for 10G LAN, STM-64/OC-192 and FC10 services. Optimized for LH DWDM Networks, 2 x XFP client and 2 x XFP-EL line

TRP40_2B and CMBR40B configurations Card

No. of slots


TRP40_2B

2

40G DWDM tunable transponder card for STM-256/OC-768 services

CMBR40B

2

Multi-service 40G DWDM tunable combiner card for up to 4 XFP clients for OTU2/10G LAN, STM-64/OC-192 services

TRP10_4 basecard transceivers Module


10Gbps client side cards/transceivers for TRP10_4M and 4R

OTR103_SR

10G LAN 10GBASE-SR/FC10 transceiver module, 850nm MM fiber, PIN receiver, 300m

OTR103_LR

10G LAN 10GBASE-LR/FC10 transceiver module, 1310nm , PIN receiver, 10Km

OTR103_ER

10G LAN 10GBASE-ER/FC10 transceiver module, 1550nm , PIN receiver, 40Km

OTR103_ZR

10 LAN 10GBASE-ZR/FC10 transceiver module, 1550nm , APD receiver, 80Km

OTR64_I3

STM-64/OC-192/10G LAN/FC10 client transceiver XFP, 1310nm short reach, 2km

417006-2009-013-A01


6-43



Module


OTR64_S5

STM-64/OC-192/10G LAN/FC10 client transceiver XFP, 1550nm short reach, 40km

OTR64_L5

STM-64/OC-192/10G LAN/FC10 client transceiver XFP, 1550nm long reach, 80km

Line/Client transceivers for TRP10_4M

OTC10_PSxx

40 Km CWDM XFP

OTC10_ALxx 80 Km CWDM XFP OTR10_ASxx 40 Km DWDM color XFP OTR10_ALxx 80 Km DWDM color XFP OTR10_AT

80 Km DWDM 80 ch. tunable XFP

Line transceivers for TRP10_4R

OTR10_ELT

80 Km DWDM 80 channels tunable XFP-EL

OMCM25_4 STM-1/OC-3 SFP Optical Transceivers SFP TRANSCEIVER NAME

OTR1_L5

S-1.1

L-1.1

L-1.2

1261-1360

1263-1360

1480-1580

Tx: 1260-1360 Rx: 1480-1580

Tx: 1480-1580 Rx: 1260-1360

Source type

MLM179

SLM

SLM

SLM

SLM

Max. RMS width (nm)

7.7

-

-

-

-


-

30

30

-

-


-15

-5

-5

-14

-14


-8

0

0

-8

-8


8.2

10

10

10

10


-28

-34

-34

-28

-28

Min. overload (dBm)

-8

-10

-10

-8

-8


-

-

-25

-

-

178


OTR1_S5BD

TRANSMITTER

RECEIVER

176

The OTR1_S3BD can only operate opposite the OTR1_S5BD, and vice versa. Total link budget is according to OTR1_S3BD parameters. 177 The OTR1_S3BD can only operate opposite the OTR1_S5BD, and vice versa. Total link budget is according to OTR1_S3BD parameters. 178 Application code is in reference to ITU-T Recommendation G.691. 179 MultiLongitudinal Mode (MLM) source type laser can also operate with single mode fibers for S-1.1 interfaces in reference to ITU-T Recommendation G.957.

6-44

177

OTR1_L3

APPLICATION CODE

OTR1_S3BD

176

OTR1_S3


417006-2009-013-A01




OTR1_L3

OTR1_L5

S-1.1

L-1.1

L-1.2


96

-

-


-

-

-20

-

-


-

-

-25

-

-


1

1

1

1

1

APPLICATION CODE

178

OTR1_S3BD

176

OTR1_S3

OTR1_S5BD


OMCM25_4 STM-4/OC-12 SFP Optical Transceivers SFP TRANSCEIVER NAME

OTR4_S3

OTR4_L3

OTR4_L5

S-4.1

L-4.1

L-4.2

1274-1356

1280-1335

1480-1580

Source type

MLM181

SLM

SLM

Max. RMS width (nm)

4/2.5

-

-


-

1

<1


-

30

30


-15

-3

-3


-8

+2

+2


8.2

10

10


-28

-28

-28

Min. overload (dBm)

-8

-8

-8


-

-14

-27


74

-

-


-

20

24


-

-25

-27


1

1

1

APPLICATION CODE

180


RECEIVER


180


417006-2009-013-A01


6-45

177



OMCM25_4 & AoC GbE/FC1 SFP Transceivers OTGBE_SX

OTGBE_LX

OTGBE_ZX

OTGBE_S3 BD

OTGBE_S5 BD

OTGBE_L3 BD

OTGBE_L5 BD

Transmitter type

GbE/FC/FIC ON short-reach laser, 850 nm, multimode

GbE/FC/FIC ON long-reach laser, 1310 nm, single mode

GbE/FC/FIC ON very long-reach laser, 1550 nm, single mode

Bidirection al SFP, 1310 nm


Bidirection al SFP, 1310 nm e


Data rate (nominal) (MBaud)

1250

1250

1250

1250

1250

1250

1250


-3 Max.

-3

5

-3 Max.

-3

+2

+2

-9.5 Min.

-11

0

-10 Min.

-10

-5

-5


9

9

9

>9

>9

>9

>9

Data format

8B/10B

8B/10B

8B/10B

8B/10B

8B/10B

8B/10B

8B/10B


-20 Min.

-22

--

< -21

< -21

< -23

< -23

-21 Typical

-25.5

-22

< -22

< -22

< -24

< -24


0

0

0

0

0

-3

-3


-24

-29

-25

-35

-35

-33

-33

Connector

LC

LC

LC

LC

LC

LC

LC

Fiber lengths

550 m (50/62.5 µm MMF)

10 km (9 µm SMF)

80 km (9 µm SMF)

10 km (9 µm SMF)

10 km (9 µm SMF)

40 km (9 µm SMF)

40 km (9 µm SMF)

OMCM25_4 & AoC FC2G client SFPs SFP TRANSCEIVER NAME

OTR16_MM

OTR16_I3

OTR16_S3

OTR16_L3

OTR16_L5

FC-200M5/6-SN-1

I-16

S-16.1

L-16.1

L-16.2

830-860

1260-1360

1260-1360

1280-1335

1500-1580

Source type

MM

SLM

SLM

SLM

SLM


-

2

1

1

<1

Max. RMS width (nm)

0.85

-

-

-

-


-

-

30

30

30


-9.5

-10

-5

-2

-2


-2.5

-3

0

+3

+3

APPLICATION CODE

182


182


6-46


417006-2009-013-A01




OTR16_MM

OTR16_I3

OTR16_S3

OTR16_L3

OTR16_L5


9

8.2

8.2

8.2

8.2


-13

-16

-18

-27

-28

Min. overload (dBm)

0

0

0

-9

-9


-27

-27

-27

-27

-27


-

-

-

-

1600


-24

-24

-24

-24

-24


-27

-27

-27

-27

-27


-

<1

1

1

2

RECEIVER


10 Gbps Optical Client XFP Transceivers for Transponders and CMBR40B Transceiver

OTR64_I3

OTR64_S5/ OTR103_ER

OTR64_L5/ OTR103_ZR

OTR103_SR

OTR103_LR

Application code

I-64.1

S-64.2b P1S1_2D2b

L-64.2a P1L1-2D2

10GBASE-SR

P1I1_2D1

10GBASE-LR 1200-SM-LL-L

VSR2000_2R1

10GBASE-ER

1200-SM-LL-I

1200-SM-LL-V

Source type

SLM

SLM

SLM

MLM

SLM

Modulation

External

External

External

Direct

Direct


1290-1330

1529-1560

1530-1565

840-860

1290-1330


<1

<1

<1

NA

<1


30

30

30

NA

30


-6

-1

0

-4

-8.2


-1

+2

+4

-1

+0.5


6

8.2

9

3

6


4

11

22

4

4


0

3

11

0

0


6.6

800

1600

NA

6.6

Minimum optical return loss 24 (dB)

24

24

12

12


-27

-27

-27

-27

-27

Maximum DGD (ps)

30

30

30

30

30


-11

-14

-24

-11 Stressed (-7.5)

-12.6

417006-2009-013-A01


6-47



Transceiver

OTR64_I3

OTR64_S5/ OTR103_ER

OTR64_L5/ OTR103_ZR

OTR103_SR

OTR103_LR

Min. overload (dBm)

-1

-1

-7

-1

-1


1

2

2

3.9 (Transmitter and dispersion penalty)

1


<3

<3

<3

<3

<3

AoC/OMTR27_2 STM-16/OTU1 client CWDM SFP TRANSCEIVER NAME APPLICATION CODE

183

OTR16_I OTR16_ 3 S3

OTR16_ L3

OTR16_ L5

I-16

L-16.1

L-16.2

S-16.1

OTC25_1P Sxx

DWDM OTC25_1A Lxx

OTR25_Av xx

OTR25_ABxx

DW100S1 D2/5(C) DW100S1 A2/5(C)

DW100L-1D2/5(C)F DW100C-1A2/5(C)F G.698.1/.2


1260-13 60

1260-13 60

1280-13 35

1500-15 80

1464-1618

1464-1618

15300-156 5

1530-1565

Source type

SLM

SLM

SLM

SLM

SLM

SLM

SLM

SLM


2

1

1

<1

1

1

0.4

0.4

Max. RMS width (nm)

-

-

-

-

-

-

-

-


-

30

30

30

30

30

30

30


-10

-5

-2

-2

0

0

0

0


-3

0

+3

+3

+5

+5

4

4


8.2

8.2

8.2

8.2

8.2

8.2

8.2

8.2


-16

-18

-27

-28

-21.5 (-23 GbE)

-28 (-32 GbE)

-28

-28

Min. overload (dBm)

0

0

-9

-9

0

-7

-9

-9


-27

-27

-27

-27

-27

-27

-27

-27

TRANSMITTER

RECEIVER



-

-

-

1600

800 (40 km G.652)

1600 (80 km G.652)

2400 (120 km G.652)

3600 (180 km G.652)


-24

-24

-24

-24

24

24

-24

-24


-27

-27

-27

-27

-27

-27

-27

-27

1

1

2

1.5

2.5

<3

<2

Max. optical path penalty (dB) <1

183


6-48


417006-2009-013-A01



TRP10_4 CWDM OTU2 Line/Client STM-64/10G LAN/FC10/OTU2 XFP Optical Transceivers and CMBR40B Client Transceivers Transceiver

OTC10_PSxx

184

OTC10_ALxx

185

Application code

Source type

SLM

SLM

Modulation

NRZ

NRZ


1465-1617

1465-1617

Central wavelength (nm)

1471 + 20m m=0 to 7

1471 + 20m m=0 to 7

Maximum central frequency deviation (nm)

±6.5

±6.5


<1

<1


30

30


0

0


4

4


8.2

8.2


S-band, C-band -16 L- band -15

S-band, C-band -23 L- band -21

Min. overload (dBm)

-1

-7


800

1400


2

2

Transmitter

Receiver

Optical Path

Maximum discrete reflectance Maximum DGD (ps)


184

CWDM client in TRP10_4/CMBR40 also supports 10GbE LAN and STM-64. CWDM client in TRP10_4/CMBR40 also supports 10GbE LAN and STM-64.

185

417006-2009-013-A01


6-49



TRP10_4R OTU2/OTU2e/OTU2f Optical Transceivers Transceiver

186

OTR10_ELT

OTR10_AT

Source type

SLM

SLM

Modulation

External, NRZ

External, NRZ


1529-1561

1529-1560

192.1 + 0.1m

192.05 + 0.05m

m=0 to 39

m=0 to 79

±12.5

±2.5

Application code

Transmitter

Central frequency (THz) Maximum central frequency deviation (GHz) Max. -20 dB width (nm)

<1


40

35


4

-1


7

+3


12

9


-24

-24

Min. overload (dBm)

-5

-7


-27

-27

Maximum DGD (ps)

30

30


1440

1440


2

2


<3

Receiver

Optical Path

186

Not supported in CMBR40.

6-50


417006-2009-013-A01



TRP10_4 OTU2/OTU2e Line, STM-64/10G LAN/FC10 Client, AoC, CMBR10, TRP10_LAN, TRP10_2B, OTU2 XFP Line Transceivers and CMBR40B Client Transceivers 187

Transceiver

OTR10_ALxx

OTR10_ASxx

Application code

1L1-2D2F

Source type

SLM

Modulation

External, NRZ


1529-1560

1529-1560


192.1 + 0.1m m=0 to 40

192.1 + 0.1m m=0 to 40


±12.5

±12.5


<1

<1


30

30


0

-1


4

+3


9

8.2


-24

-24

Min. overload (dBm)

-8

-8


-27

-27

Maximum DGD (ps)

30

30


1600

800


2

2


<3

188

SLM

Transmitter

Receiver

Optical Path

187

CWDM client in TRP10_4/CMBR40 also supports 10GbE LAN and STM-64. CWDM client in TRP10_4/CMBR40 also supports 10GbE LAN and STM-64.

188

417006-2009-013-A01


6-51



AoC, CMBR10, TRP10_LAN, TRP10_2B, OTU2 Line Transceivers

6-52

Transceiver

OTX10_AT

Application code

1L1-2D2F

Source type

SLM

SLM


1529-1560

1527-1567


192.05 + 0.05m m=0 to 79

192.05 + 0.05m m=0 to 79


±2.5

±5


<1

<1

Modulation

External, NRZ

External, RZ

Spacing (GHz)

50

50


1600

400


40

40


+4

+1


+6

+4


10

12


-25

-24

Min. overload (dBm)

-8

-4


2

2


<3

<3


OTX10_ATR

417006-2009-013-A01



STM-16/OTU1 Optical SFP Line Transceivers for OMTR27_2 & OMCM25_4 CWDM line transceivers OTC25_1PSxx Application code

190

DWDM line transceivers

Continuous client transceivers

189

OTC25_ 1ALxx 191 G.695

OTR25_AVx x

OTR25_AB xx

OTR16_I3

OTR16_S3

OTR16_L3

OTR16_L5

G.695 S-C8S1-1D2/5

S-C8L1-1D2/5

DW100S1D2/5(C) DW100S1A2/5(C)

DW100L-1D2/5(C)F DW100C-1A2/5(C)F

P1I_1D1

P1S1_1D1

P1L1_1D1

L-16.2

G.698.1/.2

Source type

SLM

SLM

SLM

SLM

SLM

SLM

SLM

SLM


1464-1618

1464-1618

1530-1565

1530-1565

1285-1330

1285-1330

1280-1335

1500-1580

Spacing (nm)

20

20

100

100

NA

NA

NA

NA

Minimum side mode suppression ratio (dB)

30

30

30

30

30

30

30

30

Mean launched power (min.) (dBm)

0

0

0

0

-9.5

-5

-2

-2

Mean launched power (max.) (dBm)

+5

+5

4

4

-3

0

+3

+3


8.2

8.2

8.2

8.2

8.2

8.2

8.2

8.2


-21.5 (-23 GbE)

-28 (-32 GbE)

-28

-28

-18 (-22 GbE)

-18 (-22 GbE)

-27 (-30 GbE)

-28 (-30 GbE)


800 (40 km G.652)

1600 (80 km G.652)

2400 (120 km G.652

3600 (180 km G.652)

-

-

-

1600


1.5

2.5

<3

<2

<3

<1

1

2


<3

<3

<3

<3

<3

<3

<3

<3

189

Continuous transceiver (50 Mbps to 2.7 Gbps) including STM16 and OTU1. Continuous transceiver (100 Mbps to 2.7 Gbps), xx designates the transceiver's wavelength in nm. 191 Continuous transceiver (100 Mbps to 2.7 Gbps), xx designates the transceiver's wavelength in nm. 190

417006-2009-013-A01


6-53



TRP25_2 2.5 Gbps optical transmitters/receivers for transponders, and transceivers for combiners Each TRP25_2 basecard can accommodate any combination of two optical transmitters and receivers. OMT25_T + OMR25C_A/ [OTX27_AT]

Source type

SLM


1529-1560


<1

Modulation

EA 193

Spacing (GHz)

100


3400

192

(200 km) [>18000/1000 km] Min. side mode suppression ratio (dB)

30


+. 05 [+5.5]


+5 [+7]

Min. extinction ratio (dB) Sensitivity (BER of 1*10-12) (dBm)

8.2 194

-30

Min. overload (dBm)

-8

OCH switching time (msec)

<3

TRP40_2B, CMBR40B Line Transceiver Transceiver Application code

P1S1-3C2 P1S1-3C3 P1S1-3C5

Source type

SLM


1529-1560


192.05 + 0.05m m=0 to 79


±2.5


<1

Modulation

RZ-DQPSK

Spacing (GHz)

50


1200


40

192

Data between square brackets corresponds to transceiver [OTX27_AT]. EA: External Absorption. 194 Including typical FEC improvement of 2 dB for nonamplified networks. For amplified networks, an FEC improvement of over 4 dB is typical. 193

6-54


417006-2009-013-A01



Transceiver


+2


+4


13


-18

Min. overload (dBm)

-7


2


<3

TRP40_2B Client Transceiver Transceiver Application code

VSR2000-3R2 VSR2000-3R3 VSR2000-3R5

Source type

SLM

Modulation

External


1530-1565


<1


35


0


+3


8.2


4


0


40


24


-27

Maximum DGD (ps)

7.5


-6

Min. overload (dBm)

+3


2


<3

417006-2009-013-A01


6-55



Optical Amplifiers Card/Module

Width (slots)


OFA2_I29I29C

1

Two inline amplifiers with a gain of 29 dB for the C band in a single-slot card

OFA2_I29C

1

One inline amplifier with a gain of 29 dB for the C band in a single-slot card

OFA2_I23I23C

1

Two inline amplifiers with a gain of 23 dB for the C band in a single-slot card

OFA2_I23C

1

One inline amplifier with a gain of 23 dB for the C band in a single-slot card

OFA2_I23I29C

1

Two inline amplifiers with a gain of 23 dB and 29 dB for the C band in a single-slot card

OFA_RM

2

High-power 500 mW RAMAN amplifier for long spans, reverse pumped configurations

OFA_HRM

2

High-power 700 mW RAMAN amplifier for long spans, in reverse pumped configurations

MO_BAC

1

Optical booster for the C band

MO_PAC

1

Optical preamplifier for the C band

MO_BAS

1

Single-channel optical booster for the C band

MO_PAS

1

Single-channel optical preamplifier for the C band

MO_OFA_PHBC

1

High-power dynamic booster and pre-amplifier in E/W configuration for extended long-haul metro applications. Optimized for ROADM sites.

MO_OFA_HBC

1

High-power dynamic booster for extended long-haul metro applications.

MO_OFA_PC

1

15 dBm dynamic gain pre-amp amplifier. CCP Card

MO_OFA_FBC

1

20 dBm fixed gain booster

MO_OFA_M

1

High-power dynamic multistage amplifier for extended long-haul and metro applications

MO_OFA_MH

1

High power (23 dBm) regional amplifier for high capacity applications

MO_OFA_MHe

1

High power (23 dBm) regional amplifier for high capacity applications, E/W configuration

MO_OFA_FHBC

1

High power (21 dBm) fixed gain booster amplifier with built-in output OSC filter

IO Cards cage

CCP Module cage

Rack Mounted Height

6-56

RM_OFA_VHB

2 RU

Very High-power fixed booster for long single span applications

RM_OFA_HBR

2 RU

High-power 1 W RAMAN amplifier for long span, in reverse pumped configuration

RM_OFA_FBR

2 RU

High-power 1 W RAMAN amplifier for long span, in forward pumped configuration


417006-2009-013-A01



OFAs for single channel and DWDM applications

Max. total power (dBm)

OFA2_I23C/

OFA2_I29C/

OFA2_ I23I23C 195 (Inline)

OFA2_ I29I29C 196 (Inline)

+16

+16

Gain (dB)

Typ. 21

197

Typ. 27 198

Spectrum (nm)

1529-1561

1529-1561

Gain flatness (dB)

< ±1

< ±1

199

< 6 200

Noise figure (dB)

<6

In/out isolation (dB)

> 40

> 40

Return loss (dB)

< 40

< 40


13 (for OFA2_ I23C)

13 (for OFA2_I29C)

Power consumption of two amplifiers (Watt)

21 (for OFA2_ I23I23C)

21 (for OFA2_ I29I29C)

RAMAN and very high power EDFA amplifiers OFA_RM

201

OFA_HRM

202

RM_OFA_HBR/FBR

RM_OFA_VHB


+27

+28.5

+30

+30

Gain (dB)

6-15 203

10-20 204

10-20 205

14-24

Spectrum (nm)

1529-1561

1529-1561

1529-1564

1536-1562

Gain flatness (dB)

< ±0.6

< ±0.65

< ±1

< ±0.75

Noise figure (dB)

< -0.5

< -1.5

<0

<9


> 40

> 40

> 40

> 45

Return loss (dB)

< 40

< 40

< 40

< 40

195

Inline amplifiers can be accommodated in XDM-400 shelves functioning as pure inline sites. When installed in XDM-500, XDM-1000, and XDM-2000 shelves, the site can be upgraded to a fully functional OADM site. 196 Inline amplifiers can be accommodated in XDM-400 shelves functioning as pure inline sites. When installed in XDM-500, XDM-1000, and XDM-2000 shelves, the site can be upgraded to a fully functional OADM site. 197 Rating does not include the attenuation introduced by the built-in VOA. 198 Rating does not include the attenuation introduced by the built-in VOA. 199 Does not include the effect introduced by the built-in VOA. 200 Does not include the effect introduced by the built-in VOA. 201 Not supported in XDM-40. 202 Not supported in XDM-40. 203 Depends on type of fiber. Actual gain is heavily dependent on splice quality and actual attenuation of fiber and can be drastically affected. 204 Depends on type of fiber. Actual gain is heavily dependent on splice quality and actual attenuation of fiber and can be drastically affected. 205 Depends on type of fiber. Actual gain is heavily dependent on splice quality and actual attenuation of fiber and can be drastically affected.

417006-2009-013-A01


6-57



CCP cage OFAs DWDM applications MO_OFA_FBC (Booster)

MO_OFA_PHBC/ MO_OFA_HBC (Booster)

MO_OFA_PHBC MO_OFA_PC (Pre-amp)

MO_OFA_MH

MO_OFA_M

MO_OFA_FHBC

MO_OFA_MHe


+20

+20

+15

+23

+20

+21

+23

Gain (dB)

10 to 25

10 to 25

12-27

17-41

17-39

10-23

17-40

Spectrum (nm)

1529-1561

1529-1561

1529-1561

1529-1561

1529-1561

1529-1561

1529-1561

Gain flatness (dB)

< ±0.75

< ±0.6

< ±0.6

< ±0.75

< ±0.75

< ±0.5

< ±0.5

< 6.5 Gain 25

<9

<6

<7

< 6.5

< 6.5 Gain 23

< 6.3 Gain >30

< 14 Gain >17

Gain >17

Gain >19

Gain >26

Gain >25

< 12.5 Gain >17

< 6.9 Gain >26

< 19.5 Gain 10

< 13.5 Gain >17

Noise figure (dB)

< 21 Gain 10 In/out isolation (dB)

> 30

> 40

> 40

> 40

> 40

> 40

> 40

Return loss (dB)

> 45

< 40

< 40

< 40

< 40

< 45

< 45

CCP cage OFAs for single-channel applications

6-58

MO_BAS (Booster)

MO_PAS (Preamplifier)

MO_BAC (Booster)

MO_PAC (Preamplifier)


+15

+12

+17

+12

Gain (dB)

Up to 16

Up to 30

Up to 18

Up to 32

Spectrum (nm)

1529-1561

1529-1561

1529-1561

1529-1561

Output power deviation (dB)

< ±1

< 5.5 at Pin –38 dBm < 2.5 at Pin –26 dBm < 1.0 at Pin –14 dBm

< ±1

< ±1

Noise figure (dB)

< 6.5

< 5.5

<9

< 5.5


> 40

> 40

> 40

> 40

Return loss (dB)

< 40

< 40

< 40

< 40


417006-2009-013-A01



Optical Auxiliary Cards and Modules Card/Module


Cards cage cards

AUX-2I

Auxiliary basecard installed in a single I/O slot. Each basecard accommodates any two of the modules listed below.

AUX-2X

Auxiliary basecard installed in either the X1 or X2 slot. Each basecard accommodates any two of the modules listed below.

Modules

OM_4SP50

Four 50/50 splitters

OM_2COSC5

2 x C band/OSC filters (mux + demux) for the 1510 nm supervisory channel

OM_2COSC5_RB

2 x C band/OSC filters (mux + demux) for the 1510 nm supervisory channel, and 2 x red/blue filters

OM_2COSC5_SP95

2 x C band/OSC filters (mux + demux) for the 1510 nm supervisory channel, and 2 x 95/5 splitters

OM_2LCOSC5

2 x C/L/T filters (mux + demux) for the 1510 nm supervisory channel, including provision for the L band

OM_2SP95

2 x 95/5 splitters

OM_2RB

2 x red/blue filters

OM_2VOA

2 x controlled variable optical attenuators for OADM-V implementation

OM_2COSC3

2 x C band/OSC filters (mux + demux) for the 1310 nm supervisory channel

OM_2COSC3_RB

2 x C band/OSC filters (mux + demux) for the 1310 nm supervisory channel, and 2 x red/blue filters

OM_2COSC3_SP95

2 x C band/OSC filters (mux + demux) for the 1310 nm supervisory channel, and 2 x 95/5 splitters

CCP module cage modules (single slot)

MO_ACC6CP

Six couplers

MO_ACC6SP50

Six 50/50 splitters

MO_ACC6SP95 MO_ACC4COSC5

Six 95/5 splitters 206

Four C/T filters

MO_ACC6CPSP

Six 50/50 splitters + six 50/50 couplers, Single-mode fiber

MO_ACC6CPSP5

Six 50/50 splitters + six 50/50 couplers, multi-mode fiber 50 μm

MO_ACC6CPSP6

Six 50/50 splitters + six 50/50 couplers, multi-mode fiber 62.5 μm

MO_ACC4CLOSC5 207

Four C/L/T filters

MO_ACC4COSC3

Four supervisory 1310 nm modules

MO_ACC4RB

Four red/blue filters

206

Not supported in XDM-450. Not supported in XDM-450.

207

417006-2009-013-A01


6-59



Optical Auxiliary Cards for XDM-450 Card/Module


ACC4COSC5

Four C/T filters

DCF/DCM Units Unit


DCF-40-LF

Dispersion compensation fiber for 160 ps/nm (40km LEAF)

DCF-80-LF


DCF-120-LF


DCF-40-TW

Dispersion compensation fiber for 180 ps/nm (40km TrueWave)

DCF-80-TW


DCF-120-TW


MO_DCM-Lxx

Single-channel dispersion compensation module for 700 ps/nm for channel "xx" for modules cage

MO_DCM-Vxx


MO_DCM-Xxx


Rack Mounted Single Channel DCM Units

6-60

Unit


RM_DCM2

Rack-mounted tray for up to two single-channel dispersion compensation modules as detailed below

DCM-Lxx

Single-channel dispersion compensation module for 700 ps/nm for channel "xx" for rack-mounted tray

DCM-Vxx


DCM-Xxx



417006-2009-013-A01



Auxiliary Cards and Miscellaneous Accessory Modules Module type

Insertion loss (dB)

OM_ACC4SP50/ MO_ACC6SP50

4

OM_ACC2SP95/ MO_ACC4SP95

0.65

OM_2RB/ MO_ACC4RB

Mux

Red 0.7

Blue 1.2

Demux

Red 1.2

Blue 0.7

OM_2COSC3/ MO_ACC4COSC3

Mux/demux

C band 1.2

OSC 1310 nm 1.2

OM_2COSC5/ MO_ACC4COSC5

Mux

C band 0.6

OSC 1510 nm 0.9

Demux

C band 0.9

OSC 1510 nm 1.7

OM_2LCOSC5/MO_ACC4CLOSC5

Mux/demux

C band 1.1

DCF-40-LF

4.8

DCF-80-LF

6.5

DCF-120-LF

8.2

DCF-40-TW

3

DCF-80-TW

4

DCF-120-TW

5

MO_DCM_L_xx/ DCM_L_xx

3.5

L band 1.6

OSC 1510 nm 2.0

MO_DCM_V_xx/ DCM_V_xx MO_DCM_X_xx/ DCM_X_xx

Other Optical Cards Card

No. of slots


OPM

1

Optical performance monitoring card for four fiber monitoring points

OMSP

1

Optical MS protection card

OPM card specifications Wavelength range ............................................................................................... 1529-1562 nm Power range............................................................................................................ -50 to +5 dB OSNR range ............................................................................................................... 0 to 30 dB

OMSP card specifications Insertion loss through two cards ..................................................................................... < 3 dB Switching time ................................................................................................................ < 4 ms

417006-2009-013-A01


6-61



C Band Channel Frequencies and Wavelengths (ITU-T Rec. G.694.1 for DWDM) ITU-T channel number

Sub-band

Blue

Channel center frequency (THz)

Channel center wavelength (nm)

Red

20.5

√

192.05

1561.01

21

√

192.10

1560.61

21.5

√

192.15

1560.20

22

√

192.20

1559.79

22.5

√

192.25

1559.39

23

√

192.30

1558.98

23.5

√

192.35

1558.58

24

√

192.40

1558.17

24.5

√

192.45

1557.77

25

√

192.50

1557.36

25.5

√

192.55

1556.96

26

√

192.60

1556.55

26.5

√

192.65

1556.15

27

√

192.70

1555.75

27.5

√

192.75

1555.34

28

√

192.80

1554.94

28.5

√

192.85

1554.54

29

√

192.90

1554.13

29.5

√

192.95

1553.73

30

√

193.00

1553.33

30.5

√

193.05

1552.93

31

√

193.10

1552.52

31.5

√

193.15

1552.12

32

√

193.20

1551.72

32.5

√

193.25

1551.32

33

√

193.30

1550.92

33.5

√

193.35

1550.52

34

√

193.40

1550.12

6-62

200 GHz channel spacing



8ch.

16ch.

40ch.

16ch.

32ch.

40ch.

80ch. interleaved

√ √

√

√

√

√

√

√ √

√

√

√

√

√ √

√

√

√

√

√

√

√ √

√

√

√

√

√ √

√

√

√

√

√

√

√ √

√

√

√

√

√ √

√

√

√

√

√

√

√ √

√

√

√

√

√ √

√

√

√

√

√

√

√ √

√

√

√

√

√ √

√

√

√

√

√

√

√ √

√

√

√

√

√ √

√

√

√

√

√

√

√ √

√

√


√

√

√

417006-2009-013-A01


ITU-T channel number

Sub-band

Blue


XDM-40, 400, 450, 500, 1000, 2000, and 3000 Specifications Channel center wavelength (nm)

Red

34.5

√

193.45

1549.72

35

√

193.50

1549.32

35.5

√

193.55

1548.91

36

√

193.60

1548.51

36.5

193.65

1548.11

37

193.70

1547.72

37.5

193.75

1547.32

38

193.80

1546.92

38.5

193.85

1546.52

39

193.90

1546.12

39.5

193.95

1545.72

40

194.00

1545.32

40.5

194.05

1544.92

41

194.10

1544.53

41.5

194.15

1544.13

42

194.20

1543.73

42.5

194.25

1543.33

43

194.30

1542.94

43.5

194.35

1542.54

44

194.40

1542.14

44.5

194.45

1541.75

45

√

194.50

1541.35

45.5

√

194.55

1540.95

46

√

194.60

1540.56

46.5

√

194.65

1540.16

47

√

194.70

1539.77

47.5

√

194.75

1539.37

48

√

194.80

1538.98

48.5

√

194.85

1538.58

49

√

194.90

1538.19

49.5

√

194.95

1537.79

50

√

195.00

1537.40

50.5

√

195.05

1537.00

51

√

195.10

1536.61

417006-2009-013-A01




8ch.

16ch.

40ch.

16ch.

32ch.

40ch.

80ch. interleaved

√ √

√

√

√

√

√

√ √

√

√

√

√

√ √

√

√

√

√ √

√

√

√ √

√

√

√

√ √

√

√

√ √

√

√

√

√ √

√

√

√ √

√

√

√

√ √

√

√

√ √

√

√

√

√

√ √

√

√

√

√ √

√

√

√

√

√ √

√

√

√

√ √

√

√

√

√

√ √

√

√

√

√ √

√

√


√

√

√

6-63

XDM-40, 400, 450, 500, 1000, 2000, and 3000 Specifications ITU-T channel number

Sub-band

Blue


Channel center wavelength (nm)

Red

51.5

√

195.15

1536.22

52

√

195.20

1535.82

52.5

√

195.25

1535.43

53

√

195.30

1535.04

53.5

√

195.35

1534.64

54

√

195.40

1534.25

54.5

√

195.45

1533.86

55

√

195.50

1533.47

55.5

√

195.55

1533.07

56

√

195.60

1532.68

56.5

√

195.65

1532.29

57

√

195.70

1531.90

57.5

√

195.75

1531.51

58

√

195.80

1531.12

58.5

√

195.85

1530.72

59

√

195.90

1530.33

59.5

√

195.95

1529.94

60

√

196.00

1529.55

6-64





8ch.

16ch.

40ch.

16ch.

32ch.

40ch.

80ch. interleaved

√ √

√

√

√ √

√

√

√

√ √

√

√

√

√ √

√

√

√

√ √

√

√

√

√ √

√

√

√

√ √

√

√

√

√ √

√

√

√

√ √

√


√

√

√

417006-2009-013-A01




4-channel system

8-channel system

1471



1491



1511





1531





1551





1571





1591



1611



Physical Specifications Dimensions (H x W x D) XDM-40 .......................................................... 256 x 447 x 285 mm (10.08 x 17.60 x 11.22 in) XDM-400 ........................................................ 500 x 450 x 285 mm (19.68 x 17.72 x 11.22 in) XDM-450 ........................................................ 374 x 492 x 275 mm (14.72 x 19.37 x 10.82 in) XDM-500 ........................................................ 725 x 450 x 285 mm (28.54 x 17.72 x 11.22 in) XDM-1000 .................................................... 1100 x 450 x 285 mm (43.31 x 17.72 x 11.22 in) XDM-2000 ...................................................... 775 x 450 x 285 mm (30.51 x 17.72 x 11.22 in) XDM-3000 ......................................................... 1550 x 450 x 285 mm (61 x 17.72 x 11.22 in) MECP ...................................................................... 120 x 50 x 225 mm (4.72 x 1.97 x 8.86 in) xMCP ....................................................................265 x 25 x 225 mm (10.43 x 0.98 x 8.86 in) HLXC192/384/768, XIO, SIO, PIO, DIO, ACP1000, ATS and cards cage mux/demux, OADM, transponder, OFA, OPM, DIOB, MCS5, MCS10 ...................................................... 415 x 25 x 225 mm (16.34 x 0.98 x 8.86 in) Modules cage connection modules (electrical), mux/demux, OADM, OFA ............................................................................... 265 x 40 x 175 mm (10.43 x 1.57 x 6.89 in) HLXC1536 .......................................................... 550 x 48 x 255 mm (21.65 x 1.89 x 10.04 in) ACP3000 ................................................................ 116.5 x 38 x 220 mm (4.59 x 1.5 x 8.66 in) xRAP (optional) ................................................ 100 x 450 x 285 mm (3.94 x 17.72 x 11.22 in) xRAP-100 (optional) ........................................... 133 x 445 x 185 mm (5.24 x 17.53 x 7.29 in) 417006-2009-013-A01


6-65



miniRAP (optional) ................................................. 90 x 445 x 150 mm (3.54 x 17.53 x 5.9 in) PRAP (optional) .................................................. 133 x 445 x 185 mm (5.24 x 17.53 x 7.29 in) XDM-400 heat buffer.......................................44.5 x 412 x 285 mm (1.75 x 16.22 x 11.22 in) Heat buffer ........................................................125 x 450 x 285 mm (4.92 x 17.72 x 11.22 in) Racks ........................................2200/2600 x 600 x 300 mm (86.61/102.36 x 23.62 x 11.81 in) ...................................................................................... 2134 x 584 x 305 mm (82 x 23 x 12 in)

Weight XDM-40 ......................................................................................................... 7.5 kg (16.54 lbs) XDM-40 fully populated ................................................................................. 16 kg (35.28 lbs) XDM-400 ........................................................................................................ 17 kg (37.48 lbs) XDM-400 fully populated ............................................................................... 35 kg (77.16 lbs) XDM-450 .......................................................................................................... 11.8 kg (26 lbs) XDM-450 fully populated ............................................................................... 19 kg (41.85 lbs) XDM-500 ........................................................................................................ 20 kg (44.09 lbs) XDM-500 fully populated ............................................................................. 50 kg (110.23 lbs) XDM-1000 ...................................................................................................... 25 kg (55.12 lbs) XDM-1000 fully populated ........................................................................... 70 kg (154.32 lbs) XDM-2000 ...................................................................................................... 20 kg (44.09 lbs) XDM-2000 fully populated ........................................................................... 50 kg (110.23 lbs) XDM-3000 .................................................................................................... 50 kg (110.23 lbs) XDM-3000 fully populated .............................................................................. 180 kg (284 lbs)

Floor Loading Floor loading of fully equipped rack ....................................................................... 7.35 kn/m2

Power Power requirements Applicable specifications ............................................................ ETSI 300 132-2; FTZ 19FS1 Input voltage ......................................................................................... -40 V DC to -75 V DC Nominal power source .................................................................. -60 V or -48 V BTNR 2511

6-66


417006-2009-013-A01



Power Supply Lines Surge Voltage Applicable specification .............................................................................. EN61000-4-5:1996 Line to line maximum surge voltage ...............................................................................2000 V Line to ground maximum surge voltage .........................................................................4000 V

Power consumption XDM-40 ................................................................................ Typical 380 W, maximum 450 W XDM-400 .............................................................................. Typical 500 W, maximum 800 W XDM-450 .............................................................................. Typical 282 W, maximum 630 W XDM-500 .............................................................................. Typical 720 W, maximum 950 W XDM-1000 .................................................................... Typical 1200 W, maximum 1800 W 208 XDM-2000 ........................................................................ Typical 1200 W, maximum 2000 W XDM-3000 ........................................................................ Typical 3300 W, maximum 4300 W

208

Depending on shelf revision.

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Main equipment power consumption The following table lists the power requirements of the main equipment components. Determine the expected power requirement of the equipment installed in the shelf, and compare it with the shelf capabilities. NOTE: The listed power requirements do not include the power required by modules that may be installed on the card. Type

Component

Power requirements

Common cards

xMCP

40 W

xMCP-B

20 W

MECP

15 W

MECP_OSC

20 W

HLXC192/HLXC384

90 W

HLXC768

140 W

HLXC1536

670 W

XIO192

68 W

XIO384F

127 W (without optical module)

xFCU

14 W

xFCU-H

35 W

FCU3000

350 W

xFCU450

50 W

xINF450

50 W

xINF/xINF-H

8W

INF3000

64 W

PIO2_84

45 W

PIO2_84F

33 W

M2_84 (all versions)

3W

PIO345_16 (all versions)

80 W

M345P_16P

10 W

M345_16

3W

M345_8

2W

PDH cards

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417006-2009-013-A01



Type

Component

Power requirements

STM1 and STM4 cards

SIO1&4

48 W

SIO1&4B

86 W

OMS01_4

4W

OM01_4

4W

OMS04_1

1W

OM04_1

1W

M1_8

5W

M1_16

5W

M1_16P

3W

SIO16_2

60 W

SIO16_2B

83 W

SIO16_4B

96 W

OM16_1SFP

Per specs

OMSC16_4

10 W

OM16_1

20 W

SIO64_1, SIO64_1M

125 W

SIO64_1-MF

135 W

SIO64B

106 W

SIO164

80 W

SIO164 OMSC16_4

83 W

SIO164 OMTX10

82 W

OMTX10_EF

15.5 W

OM10_1

10 W

OM64_1, OM10_1xx

18 W

DIO (all versions)

57 W

DIO1_40R

64 W

DMGE_2

7W

OMGE_1SX

1W

DM16_1

4W

DOM16_I3

1W

MCS5

100 W

MCS10

115 W

MCS30_X10G

125 W

ATS

ATS

48 W

Control cards

ACP1000

13.5 W

ACP3000

20 W

STM16 cards

STM64 cards

DIO

MCS

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XDM-40, 400, 450, 500, 1000, 2000, and 3000 Specifications Type

Component

Power requirements

Transponders and combiners

TRP25_2C

40 W

AoC

83 W

TRP10_4R/M

60 W

TRP40_2B

115 W

CMBR40

110 W

CHTR_B

54 W

OMCD_8

24 W

OMD25_2

17 W

OMTR27

12 W

OMTR27_2

5W

OMCM25_4

16 W

OMTX10

8W

OMTX10_EF

13 W

OMTX10_S

7W

OMTX10_LAN

10 W

OMS16_4T

16 W

OFA_2 single

12 W

OFA_2 dual

20W

OFA_RM

17 W

OFA_HRM

21 W

MO_BAC

15 W

MO_PAC

15 W

MO_BAS

15 W

MO_PAS

15 W

MO_OFA_PHBC

20 W

MO_OFA_PC

12 W

MO_OFA_HBC

12 W

MO_OFA_FBC

14 W

MO_OFA_M

20 W

MO_OFA_MH

25 W

MO_OFA_MHe

27 W

MO_OFA_FHBC

15 W

RM_OFA_HBR

90 W

RM_OFA_FBR

90 W

RM_OFA_VHB

80 W

CHTR base card and modules

Optical amplifier cards

Rack mounted power amplifiers

6-70



417006-2009-013-A01



Type

Component

Power requirements

ROADM

MO_ROADM8/E/I/D

15.5 W

MO_ROADM8A

25 W

MO_ROADM8A_50

25 W

MO_ROADM2A

24 W

MO_ROADM2A_50

24 W

MO_ROADM40/E

40 W

MO_CW2

4.5 W

OM_CWM8C

4.8W

OM_CWD8C

5.8 W

OM_CWMD4C

4.8 W

OM_CWMD4CE

4.8 W

OM_CWMD4SL

4.8 W

OM_COADM1AB

4.8 W

OM_COADM2AB

4.8 W

OM_OADM4GEW

5W

OADM4_EW

5W

OM_AD4RQEWxx

5W

Optical DWDM cards for X1/X2 slots

DW16MVDRE

15 W

DWDM modules

MO_DW16MDR-AVAV

10 W

MO_DW16MDRE-AVAV

10 W

MO_DW16MDB-AVAV

10 W

MO_DW16MDR-SAV

4.8 W

MO_DW16MDRE-SAV

4.8 W

MO_DW16MDB-SAV

4.8 W

MO_DW40MC-S

1W

MO_DW40MC-A

4.8 W

MO_DW40DC-A

4.8 W

MO_DW40VMD/E/I

47 W

AUX_2IO

15 W

AUX_2X

15 W

Each Plug-in

1W

OPM

OPM

15 W

OMSP

OMSP

10 W

CCP OADM modules

I/O OADM modules

AUX cards

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Type

Component

Power requirements

Accessory module

Each MO_ACC

1W

Miscellaneous and Pluggable modules

OTX10_ALxx

15 W

OTR103_SR/LR/ER, OTR64_PI3/PS5/AL5

3.5 W

OTX10_AT

15 W

OTR10_ELT

7W

OTR10_ALxx/ASxx

3.5 W

OTC10_ALxx/PSxx

3.5 W

OTR25_AVxx/ABxx

2W

OTC25_ALxx/PSxx

1.5 W

OTR10_AT

3.5 W

OTR1_S3/L3/L5

1W

OTR4_S3/L3/L5

1W

OTR16_I3/S3/L3/L5

1W

OTGBE_SX/LX/ZX

1W

OTX27_AT

4W

Heat dissipation XDM-400 ............................................................. Typical 2720 Btu/hr, maximum 3400 Btu/hr XDM-500 ............................................................. Typical 2720 Btu/hr, maximum 3400 Btu/hr XDM-1000 ........................................................... Typical 4094 Btu/hr, maximum 5115 Btu/hr XDM-2000 ........................................................... Typical 4094 Btu/hr, maximum 5115 Btu/hr XDM-3000 ....................................................... Typical 11253 Btu/hr, maximum 14663 Btu/hr

6-72


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Environmental Conditions Operation Applicable specification ................................................................ ETS 300 019-1-3 Class 3.1E Temperature range ............................................................................................. -5 ºC to +45 ºC Relative humidity ..................................................................................................... 5% to 90%

Storage (packed) Applicable specification .................................................................. ETS 300 019-1-1 Class 1.2 Temperature range ........................................................................................... -25 ºC to +55 ºC Relative humidity ................................................................................................. 10% to 100%

Handling and transportation Applicable specification .................................................................. ETS 300 019-1-2 Class 2.3 Temperature range .......................................................................................... -40 ºC to +70 ºC Relative humidity ...................................................................................................... up to 95%

EMC Applicable specifications ................... EMC directive 89/336, (including EN 300 386-2: 1997, ..........................................................................Class B, emission and immunity requirements)

Safety Applicable specificationsEN 60950 edition 2 (including A1/1992, A2/1993, A3/1995, A4/1996); EN 41003 CE safety ........................................................................................... LVD directive 73/23/EEC

Laser Safety Applicable specification ...................... EN 60825-1&2 (including A1/1997) (AS/NZS 2211.2)

NEBS Compliance The XDM platform complies with NEBS regulations for EMC and Safety, including GR-1089-CORE Issue 1, October 1995 and GR-63-CORE Issue 2, December 1997 with Revision 1, February 1999 (Level 3).

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Management Specifications Applicable specifications ......................................................... G.784, G.774, M.3010, M.3100 LightSoft server and client for managing all ECI equipment ............................................................................................................... on SUN workstation(s) EMS-XDM ................................................................................................. on SUN workstation LCT-XDM local craft terminal ........................................................................................on PC EMS-XDM and LightSoft can work on the same SUN workstation.

Management and Alarm Interfaces CMIP-like over TCP/IP to EMS-XDM; MTNM from EMS-XDM to LightSoft or other TMN; RS-232 to LCT-XDM; OverHead Access (OHA) and external alarms; orderwire; RAP.

Alarms and Performance Performance concept ............................................................................................. G.821, G.826 Alarm concept ...................................................................................................................G.783 Alarm types .................................. LED indicators, dry contacts, audible alarms (per subrack) Alarm classes .......................................................................... Critical, Major, Minor, Warning

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Other Specifications Cross-Connect Levels Cross-connect levels......................................................... VC-4nc, VC-4, VC-3, VC-2, VC-12 SONET cross-connect levels.............................................................................. STS-nc, STS-1

Cross-Connect Capacity SDH/SONET switch core options192/384/768 x STM-1 with cross-connect capability of 4/3/2/1 SONET switch core options ............................................................................. 576/1152 STS-1

Traffic Protection Applicable specifications ................. ITU-T G.841, G.842, GR-1230-CORE, GR-1400-CORE SNCP I/N LO, HO, UPSR ..................................................................................... within 30 ms MSP/APS 1+1 ........................................................................................................ within 50 ms MS-SPRing/BLSR ................................................................................................within 50 ms OCH ......................................................................................................................... within 5 ms Optical line protection ..............................................................................................within 5 ms

Redundancy Control and synchronization systems..................................................................1+1 duplicated Switching matrix, power system, internal buses, external buses ........................ 1+1 duplicated I/O electrical modules protection ....................................................................1: N (N=1 to 10)

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Synchronization The XDM supports four timing references, which can be selected from multiple timing sources, including: 

From any PDH/Async tributary interface



From any SDH/SONET line 209



External 2 MHz and 2 Mbps/1.5 Mbps timing outputs (two T3 ports per shelf)



G.813 internal clock.


209

The XDM uses the original Synchronization Status Marker (SSM) byte from SDH/SONET tributary/aggregate lines and transmits it over SDH/SONET lines.

6-76


417006-2009-013-A01

A Standards and References In this appendix: Overview ........................................................................................................ A-1 Broadband Forum ........................................................................................... A-1 Environmental Standards................................................................................ A-2 ETSI: European Telecommunications Standards Institute ............................. A-2 IEC: International Electrotechnical Commission ........................................... A-3 IEEE: Institute of Electrical and Electronic Engineers ................................... A-4 IETF: Internet Engineering Task Force .......................................................... A-5 ISO: International Organization for Standardization ...................................... A-7 ITU-T: International Telecommunication Union ........................................... A-7 MEF: Metro Ethernet Forum ........................................................................ A-11 NIST: National Institute of Standards and Technology................................ A-12 North American Standards ........................................................................... A-12 OMG: Object Management Group ............................................................... A-13 TMF: TeleManagement Forum .................................................................... A-13 Web Protocol Standards ............................................................................... A-13

Overview The following is a list of standards and reference documents that relate to the XDM platform families. The standards are listed alphabetically by groups.

Broadband Forum 

Af-phy-0064.000 – ATM Forum E1 Physical Layer Interface.



Af-phy-0086.000 – ATM Forum IMA V1.0.



Af-phy-0086.001 – ATM Forum IMA V1.1.



Af-phy-00121.00 – ATM Forum Traffic Management Specifications V4.1.

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A-1

Standards and References


Environmental Standards 

EuP Directive 2005/32/EC: Ecodesign Requirements for Energy-Using Products.



OHSAS 18001: Occupational Health and Safety Management Systems Requirements.



REACh Directive 2005/32/EC: Registration, Evaluation, Authorization, and Restriction of Chemicals.



RoHS Directive 2005/747/EC: Restriction of the Use of Certain Hazardous Substances in Electrical and Electronic Equipment.



WEEE Directive 2002/96/EC: Waste from Electrical and Electronic Equipment.

ETSI: European Telecommunications Standards Institute

A-2



EN 300 019-1-1 Class 1.2: Environmental Engineering (EE); Environmental Conditions and Environmental Tests for Telecommunications Equipment; Part 1-1: Classification of Environmental Conditions; Storage.



EN 300 019-1-2 Class 2.3: Environmental Engineering (EE); Environmental Conditions and Environmental Tests for Telecommunications Equipment; Part 1-2: Classification of Environmental Conditions; Transportation.



EN 300 019-1-3 Classes 3.2 and 3.3: Environmental Engineering (EE); Environmental Conditions and Environmental Tests for Telecommunications Equipment; Part 1-3: Classification of Environmental Conditions; Stationary use at weather-protected locations.



EN 300 019-2-4 Class 4.1: Environmental Engineering (EE); Environmental Conditions and Environmental Tests for Telecommunications Equipment; Part 2-4: Specification of Environmental Tests; Stationary use at non-weather-protected locations.



EN 300 132 -2: Environmental Engineering (EE); Power Supply Interface at the Input to Telecommunications Equipment.



EN 300-166: Physical and electrical characteristics of hierarchical digital interfaces for equipment using the 2 048 kbit/s based plesiochronous or synchronous digital hierarchies.


417006-2009-013-A01





EN 300 386: Electromagnetic compatibility and Radio spectrum Matters (ERM); Telecommunication network equipment; Electromagnetic Compatibility (EMC) requirements.



EN 300-417-2-1: Transmission and Multiplexing (TM); Generic requirements of transport functionality of equipment.



EN 300-417-5-1: Generic requirements of transport functionality of equipment.



EN 300-462-5-1: Transmission and Multiplexing (TM); Generic requirements for synchronization networks.



EN 300-689: 34 Mbit/s digital leased lines (D34U and D34S); Terminal equipment interface.



EN 301-164: SDH leased lines connection characteristics.



EN 301-165: SDH leased lines Network and Terminal interface presentation.



EN 55022: Radio Disturbance Characteristics of Information Technology Equipment.



ETR 114: Functional Architecture of SDH Transport Networks.



ETR 275: Considerations on Transmission Delay and Transmission Delay value for components on connections supporting speech communication over evolving digital networks.



FTZ 1TR9: Deutsche Telekom A.G. EMC Requirements.



FTZ 153 TL 1part 1: Synchronous Multiplexing Equipment (SM) for Synchronous Multiplex Hierarchy.

IEC: International Electrotechnical Commission 

IEC 68: Environmental Testing.



IEC 917: Modular Order for the Development of Mechanical Structures for Electronic Equipment Practices.



IEC 3309: Information Technology – Telecommunications and Information Exchange between Systems – High-Level Data Link Control (HDLC) Procedures – Frame Structure.



IEC 9314-3: Information Processing Systems - Fiber Distributed Data Interface (FDDI) Multiplex.



IEC 9595, Information Technology: Open Systems Interconnection, Common Management Information Services.

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A-3





IEC 9596, Information Technology: Open Systems Interconnection, Common Management Information Protocol.



IEC 13239: Information technology — Telecommunications and information exchange between systems — High-level data link control (HDLC) procedures.



IEC 17025: General Requirements for Competence of Testing and Calibration Laboratories.



IEC 60825-1: Safety of Laser Products – Part 1: Equipment Classification and Requirements.



IEC 60825-2 (AS/NZS 2211.2): Safety of Laser Products – Part 2: Safety of Optical Fiber Communication System (OFCS).



IEC/EN/UL 60950-1: Information Technology Equipment - Safety General Requirements.



IS 1249-1: Safety of Laser products: Equipment classification requirements and users guide.

IEEE: Institute of Electrical and Electronic Engineers

A-4



IEEE 802.1ad: Virtual Bridged Local Area Networks—Revision— Amendment 4: Provider Bridges.



IEEE 802.1ag: Virtual Bridged Local Area Networks Amendment 5: Connectivity Fault Management.



IEEE 802.1D: Media access control (MAC) Bridges (Incorporates IEEE 802.1t and IEEE 802.1w).



IEEE 802.1P: Traffic Class Expediting and Dynamic Multicast Filtering.



IEEE 802.1Q: Virtual Bridged Local Area Networks—Revision.



IEEE 802.1w: Rapid Reconfiguration of Spanning Tree.



IEEE 802.3: Carrier Sense Multiple Access with Collision Detection (CSMA/CD) Access Method and Physical Layer Specifications.



IEEE 802.3ad: Link Aggregation.



IEEE 802.3ah: Ethernet in the First Mile (Link OAM).



IEEE 802.3x: Full Duplex Operation and Flow Control Protocol.


417006-2009-013-A01



IETF: Internet Engineering Task Force 

RFC 1493: Definition of Managed Objects for Bridges.



RFC 1643: Ethernet-like Interfaces.



RFC 1662: PPP in HDLC-Life Framing.



RFC 1757: Remote Network Monitoring Management Information Base.



RFC 1823: LDAP Application Program Interface (API).



RFC 1901: Introduction to Community-based SNMPv2.



RFC 2108: Definitions of Managed Objects for IEEE 802.3 Repeater Devices using SMIv2.



RFC 2251: Lightweight Directory Access Protocol (v3) [specification of the LDAP on-the-wire protocol].



RFC 2252: Lightweight Directory Access Protocol (v3): Attribute Syntax Definitions.



RFC 2253: Lightweight Directory Access Protocol (v3): UTF-8 String Representation of Distinguished Names.



RFC 2254: The String Representation of LDAP Search Filters.



RFC 2255: The LDAP URL Format.



RFC 2256: A Summary of the X.500(96) User Schema for use with LDAPv3.



RFC 2401: Security Architecture for the Internet Protocol.



RFC 2409: Internet Key Exchange Protocol (IKE).



RFC 2474: Definition of the Differentiated Services Field (DS Field) in the IPv4 and IPv6 Headers.



RFC 2597: Assured Forwarding PHB Group.



RFC 2615: PPP over SONET/SDH.



RFC 2665: Definitions of Managed Objects for the Ethernet-like Interface Types.



RFC 2674: Bridge MIB with VLAN/Traffic Classes/Multicast Extensions.



RFC 2702: Requirements for Traffic Engineering Over MPLS.



RFC 2737: Entity MIB (Version 2).



RFC 2819: Remote Network Monitoring Management Information Base.



RFC 2829: Authentication Methods for LDAP.

417006-2009-013-A01


A-5




RFC 2830: Lightweight Directory Access Protocol (v3): Extension for Transport Layer Security.



RFC 2863: Interfaces Group MIB.



RFC 3014: Notification Log MIB.



RFC 3031: Multiprotocol Label Switching Architecture.



RFC 3032: MPLS Label Stack Encoding.



RFC 3246: An Expedited Forwarding PHB (Per-Hop Behavior).



RFC 3270: Multi-Protocol Label Switching (MPLS) Support of Differentiated Services.



RFC 3377: Lightweight Directory Access Protocol (v3): Technical Specification.



RFC 3411: SNMP Framework MIB.



RFC 3414: SNMP User-Based SM MIB.



RFC 3415: SNMP Vies-Based ACM MIB.



RFC 3443: Time To Live (TTL) Processing in Multi-Protocol Label Switching (MPLS) Networks.



RFC 3812: Multiprotocol Label Switching (MPLS) Traffic Engineering (TE) Management Information Base (MIB).



RFC 3813: Multiprotocol Label Switching (MPLS) Label Switching Router (LSR) Management Information Base (MIB).



RFC 3916: Requirements for Pseudo-Wire Emulation Edge-to-Edge (PWE3).



RFC 3985: Pseudo Wire Emulation Edge-to-Edge (PWE3) Architecture.



RFC 4090: Fast Reroute Extensions to RSVP-TE for LSP Tunnels.



RFC 4125: Maximum Allocation Bandwidth Constraints Model for Diffserv-aware MPLS Traffic Engineering.



RFC 4126: Max Allocation with Reservation Bandwidth Constraints Model for Diffserv-aware MPLS Traffic Engineering & Performance Comparisons.



RFC 4379: Detecting Multi-Protocol Label Switched (MPLS) Data Plane Failures.



RFC 4448: Encapsulation Methods for Transport of Ethernet over MPLS Networks.



A-6


RFC 5462: Multiprotocol Label Switching (MPLS) Label Stack Entry: "EXP" Field Renamed to "Traffic Class" Field.


417006-2009-013-A01





IETF Drafts: 

draft-ietf-l2vpn-vpls-ldp.



draft-ietf-l2vpn-vpls-mcast-reqts.



draft-ietf-magma-snoop.



draft-ietf-mpls-rsvp-te-p2mp.



draft-ietf-mpls-tp-nm-framework.



draft-ietf-mpls-tp-nm-req.



draft-ietf-pwe3-ethernet-encap.



draft-martini-l2circuit-encap-mpls.



draft-sajassi-l2vpn-vpls-multicast-congruency.



draft-vasseur-mpls-backup-computation.

ISO: International Organization for Standardization 

A2LA: Accredited Laboratory for Electrical and Mechanical Testing.



ISO 9001: Quality Management System – Requirements.



ISO 14001: Environmental Management Systems – Requirements With Guidance for Use.



ISO 27001: Information Security Management Systems – Requirements.



TL 9000, QuEST Forum: Quality Management System – Requirements & Measurements Handbooks for the Telecom Industry.

ITU-T: International Telecommunication Union 

G.650: Definition and Test Methods for the Relevant Parameters of Single-Mode Fibers.



G.651: Characteristics of a 50/125 µm Multimode Graded Index Optical Fiber Cable.



G.652: Characteristics of a Single-Mode Optical Fiber Cable.



G.653: Characteristics of a Dispersion-Shifted Single-Mode Optical Fiber Cable.



G.654: Characteristics of a Cut-off Shifted Single-Mode Optical Fiber Cable.

417006-2009-013-A01


A-7


A-8




G.655: Characteristics of a Non-Zero Dispersion Shifted Single-Mode Optical Fiber Cable.



G.661: Definition and Test Methods for the Relevant Generic Parameters of Optical Amplifier Devices and Subsystems.



G.662: Generic Characteristics of Optical Fiber Amplifier Devices and Subsystems.



G.663: Application Related Aspects of Optical Fiber Amplifier Devices and Subsystems.



G.664: Optical Safety Procedures and Requirements for Optical Transport Systems.



G.671: Transmission Characteristics of Passive Optical Components.



G.691: Optical Interfaces for Single Channel SDH Systems with Optical Amplifiers and STM-64 Systems (Draft).



G.692: Optical Interfaces for Multi-Channel Systems with Optical Amplifiers.



G.694.1: Spectral Grids for WDM Applications: DWDM Frequency Grid.



G.694.2: Spectral Grids for WDM Applications: CWDM Wavelength Grid.



G.695: Optical Interfaces for Coarse Wavelength Division Multiplexing Applications.



G.703: Physical/Electrical Characteristics of Hierarchical Digital Interfaces.



G.704: Synchronous Frame Structures Used at 1544, 6312, 2048, 8448 and 44 736 kbps Hierarchical Levels.



G.706: Frame Alignment and CRC Procedures Relating to Basic Frame Structure Defined in Rec G.704.



G.707: Network Node Interface for the Synchronous Digital Hierarchy.



G.709: Interfaces for the Optical Transport Network (OTN).



G.752: Characteristics of digital multiplex equipments based on a second order bit rate of 6312 kbit/s and using positive justification.



G.772: Protected Monitoring Points Provided on Digital Transmission Systems.



G.774 & G774.n: SDH Information Model.



G.775: Loss of Signal (LOS), Alarm Indication Signal (AIS) and Remote Defect Indication (RDI) defect detection and clearance criteria for PDH signals.



G.781: Synchronization Layer Functions.



G.783: Characteristics of SDH Equipment Functional Blocks.



G.784: Synchronous Digital Hierarchy (SDH) Management. ECI Telecom Ltd. Proprietary

417006-2009-013-A01





G.798: Characteristics of OTN Hierarchy Equipment Functional Blocks.



G.803: Architectures of Transport Networks based on the Synchronous Digital Hierarchy.



G.805: Generic Functional Architecture of Transport Networks.



G.806: Characteristics of Transport Equipment –Description Methodology and Generic Functionality.



G.809: Functional Architecture of Connectionless Layer Networks.



G.811: Timing Characteristics of Primary Reference Clocks.



G.812: Timing Requirements of Slave Clocks Suitable for Use as Node Clocks in Synchronization Networks.



G.813: Timing Characteristics of SDH Equipment Slave Clocks (SEC).



G.823: The Control of Jitter and Wander within Digital Networks Based on the 2048 kbit/s Hierarchy.



G.825: The Control of Jitter and Wander within Digital Networks Based on the SDH (Draft).



G.8251: The Control of Jitter and Wander within the Optical Transport Network (OTN).



G.826: Error Performance Parameters and Objectives for International, Constant Bit Rate Digital Paths at or above the Primary Rate.



G.828: Error Performance Parameters and Objectives for International, Constant Bit Rate Synchronous Digital Paths.



G.829: Error Performance Events for SDH Multiplex and Regenerator Sections.



G.831: Management Capabilities of Transport Networks Based on the Synchronous Digital Hierarchy (SDH).



G.841: Types and Characteristics of SDH Network Protection Architectures.



G.842: Inter-Working of SDH Protection Architectures.



G.872: Architecture of Optical Transport Networks.



G.874: Management Aspects of the Optical Transport Network Element.



G.874.1: Optical Transport Network (OTN): Protocol-Neutral Management Information Model for the Network Element View.



G.957: Optical Interfaces for Equipment and Systems relating to the Synchronous Digital Hierarchy.



G.959.1: Optical Transport Network Physical Layer Interfaces.



G.975: Forward Error Correction for Submarine Systems.



G.985: 100 Mbit/s point-to-point Ethernet based optical access system.

417006-2009-013-A01


A-9


A-10




G.7041: Generic Framing Procedure (GFP).



G.7042: Link Capacity Adjustment Scheme (LCAS) for Virtual Concatenated Signals.



G.7713: Distributed Connection Management.



G.7713.2: RSVP-TE Implementation.



G.7714: Generalized Automatic Discovery Techniques.



G.7714.1: Protocol for Automatic Discovery in SDH & OTN network.



G.7715: ASON Routing.



G.7715.1: Based on PNNI, OSPF or IS_IS.



G.8010/Y.1306: Architecture of Ethernet Layer Networks.



G.8011/Y.1307: Ethernet Services Framework.



G.8011.1/Y.1307.1: Ethernet Private Line Service.



G.8011.2/Y.1307.2: Ethernet Virtual Private Line Service.



G.8012/Y.1308: Ethernet UNI and Ethernet NNI.



G.8261/Y. 1361: Timing and synchronization aspects in packet network.



G.8262/Y. 1362: Timing characteristics of synchronous Ethernet equipment slave clock (EEC).



I.356: ATM Layer Cell Transfer Performance.



I.361: ATM Layer Specification.



I.371: Traffic Control and Congestion Control.



I.610: ATM Operation and Maintenance Principles.



M.3010: Principles for a Telecommunications Management Network.



M.3013: Considerations for a Telecommunications Management N etwork.



M.3100: Generic Network Information Model.



M.3180: Catalogue of TMN Management Information.



M.3200: TMN Management Services and Telecommunications Managed Areas: Overview.



M.3300: TMN F Interface Requirements.



M.3400: TMN Management Functions.



Q.821: Alarm Surveillance.



Q.822: Performance Monitoring.



X.217: Open Systems Interconnection, Service Definition for the Association Control Service Element.



X.219: Remote Operations - Model, Notation and Service Definition.


417006-2009-013-A01





X.227: Open Systems Interconnection, Connection-Oriented Protocol for the Association Control Service Element - Protocol Specification.



X.229: Remote Operations: Protocol Specification.



X.710: Open Systems Interconnection, Common Management Information Service.



X.720: Open Systems Interconnection, Structure of Management Information - Management Information Model.



X.721 Information Technology: Open Systems Interconnection, Structure of Management Information - Definition of Management Information.



X.722: Open Systems Interconnection, Structure of Management Information - Guidelines for the Definition of Managed Objects.



X.731: Open Systems Interconnection, Systems Management - State Management Function.



X.733: Open Systems Interconnection, Systems Management - Alarm Reporting Function.



X.743: Open Systems Interconnection, Systems Management - Time Management Function.



X.744: Open Systems Interconnection, Systems Management - Software Management Function.



Y.1311: Network-based VPNs - Generic architecture and service requirements.



Y.1710: Requirements for Operation & Maintenance functionality for MPLS networks.



Y.1711: Operation & Maintenance mechanism for MPLS networks.

MEF: Metro Ethernet Forum 

MEF4 Metro Ethernet Network Architecture Framework Part 1: Generic Framework.



MEF6 Metro Ethernet Services Definitions.



MEF7 EMS-NMS Information Model.



MEF9 Test Suite for Ethernet Services at the UNI.



MEF10 Ethernet Service Attributes.



MEF11 User Network Interface (UNI) Requirements and Framework.



MEF12 Metro Ethernet Network Architecture Framework Part 2: Ethernet Services Layer.



MEF14 Test Suite for Ethernet Traffic Management.

417006-2009-013-A01


A-11



NIST: National Institute of Standards and Technology 

FIPS PUB 197: Advanced Encryption Standard (AES).



FIPS PUB 140-2: Security Requirements for Cryptographic Modules.

North American Standards

A-12



ANSI FC–F1-2: Fiber Channel Physical Interface REV 10.



ANSI T1.102: Digital hierarchy electrical interface.



ANSI T1.105: Synchronous Optical Network (SONET) - Basic Description including Multiplex Structure, Rates, and Formats.



ANSI X3.296: Single-Byte Command code sets CONnection (SBCON) architecture.



FCC CFR Title 47 Part 15: Radio Emission.



FCC Part 101.147 Fixed microwave services: (i8, i7, K7, 7)



NEBS GR1089 and GR63 (temperature aspect)



NEBS Level 3 support for N.A. platforms.



Rural Utility Service (RUS) Certification.



Telcordia GR-63-CORE: Network Equipment Building System (NEBS) Requirements: Physical Protection.



Telcordia GR-253-CORE: Synchronous Optical Network (SONET) Transport Systems: Common Generic Criteria.



Telcordia GR-383-CORE: COMMON LANGUAGE® Equipment Codes (CLEI™ Codes) – Generic Requirements for Bar Code Labels.



Telcordia GR-487-CORE: Generic Requirements for Electronic Equipment Cabinets.



Telcordia GR-499-CORE: Transport System Generic Requirements (TSGR): Common Requirements.



Telcordia GR-1089-CORE: Electromagnetic Compatibility and Electrical Safety – Generic Criteria for Network Telecommunications Equipment.



Telcordia GR-1209-CORE: Generic Requirements for Passive Optical Components.



Telcordia GR-1230-CORE: SONET Bidirectional Line-Switched Ring Equipment Generic Criteria.



Telcordia GD-1244-CORE: Clock for the synchronization network: Common generic criteria. ECI Telecom Ltd. Proprietary

417006-2009-013-A01





Telcordia GR-1312-CORE: Generic Requirements for Optical Fiber Amplifiers and Proprietary Dense Wavelength-Division Multiplexed Systems.



Telcordia GR-1400-CORE: SONET Dual-Fed Unidirectional Path Switched Ring (UPSR) Equipment Generic Criteria.



Telcordia GD-2979-CORE: Common Generic Requirements for Optical Add-Drop Multiplexers (OADMs) and Optical Terminal Multiplexers (OTMs).

OMG: Object Management Group  

Notification Service Specification V 1.0. The Common Object Request Broker: Architecture and Specification V 2.6.

TMF: TeleManagement Forum 

TMF 513: MTNM Business Agreement Release 3.5.



TMF 518: Framework Document Delivery Package (DDP) Business Agreement (BA) V1.1.



TMF 518: Resource Provisioning DDP BA V1.0.



TMF 608: Multi Technology Network Management Information Agreement V 2.1 and V 3.5.



TMF 814: Multi Technology Network Management Solution Set V 2.1 and V 3.5.



TMF 854: The MTOSI XML Solution Set Package Release 1.1.

Web Protocol Standards W3C: World Wide Web Consortium 

SOAP 1.1: Simple Object Access Protocol.



WSDL 1.1: Web Services Description Language.

WS-I: Web Services Interoperability Organization 

WS-I Basic Profile 1.1: Web Services Interoperability.

417006-2009-013-A01


A-13


A-14



417006-2009-013-A01

Index 1 10 Gbps Optical Client XFP Transceivers for Transponders and CMBR40B • 6 47 10 Gbps Optical XFP Transceivers • 5-13

2 2 Mbps (E1) • 3-3, 4-4, 5-3, 6-8 2.5 Gbps Optical C/DWDM SFP Transceivers • 5-12 2.5 Gbps Optical CWDM SFP Transceivers • 4-12

3 34 Mbps (E3) • 3-3, 4-4, 5-3, 6-8

4 45 Mbps (DS-3) • 3-3, 4-4, 5-4, 6-8 4-channel active OADM basecard only (no filters), 2 x 2 switch through I/O slots • 6-37

5 52 Mbps (STS-1) • 4-4, 5-4 52 Mpbs (STS-1) • 6-8

A ADM • 1-4 Aggregator for Metro-Edge NetworksSee XDM-400 • 1-4 Alarms and Performance • 3-4, 4-6, 5-5, 6-74 AoC basecard configurations • 6-42 AoC basecard modules and transceivers • 6-42 AoC, CMBR10, TRP10_LAN, TRP10_2B, OTU2 Line Transceivers • 6-52 AoC/OMTR27_2 STM-16/OTU1 client • 6-48 417006-2009-013-A01

ATM • 1-2, 1-4 ATS Specifications • 6-28 Auxiliary Cards and Miscellaneous Accessory Modules • 6-61 Auxiliary Cards and Miscellaneous Accessory Modules Specifications • 6-61 Availability • 3-14, 4-28, 5-26, 6-74

B Basic XDM-100 shelf • 2-4 Basic XDM-100 Shelf • 2-35 Basic XDM-300 shelf • 2-7 Basic XDM-300 Shelf • 2-40 Basic XDM-50 shelf • 2-2 Basic XDM-50 Shelf • 2-32 Basic XDM-900 shelf • 2-10 Basic XDM-900 Shelf • 2-44 Broadband Forum • A-1

C C Band Channel Frequencies and Wavelengths (ITU-T Rec. G.694.1 for DWDM) • 6-62 C/DWDM and OTN Platform for Metro-access and CPE ApplicationsSee XDM-40 • 1-4 Cards • 2-33, 2-37, 2-41, 2-48, 2-49, 251, 2-52, 2-54, 2-57, 2-58, 2-59 control, matrix and I/O • 2-57 ECB/xECB4 • 2-59 ECM40 • 2-59 ECU • 2-37 ECU50 • 2-33, 2-41 HLXC • 2-57 HLXC192/384/768 • 2-57 I/O • 2-51, 2-52 MECP • 2-48, 2-59 MXC • 2-37


I-1

Index


MXC50 • 2-33, 2-41 PSFU • 2-48 xFCU40 • 2-48 XIO • 2-57, 2-58 XIO192 • 2-49 XIO192/384F • 2-58 xMCP • 2-49 xMCP/xMCP_B • 2-51, 2-52, 2-54, 259 xMCP_B • 2-48 Cards Cage • 2-52 CCP cage OFAs DWDM applications • 658 CCP cage OFAs for single-channel applications • 6-58 CCP50 • 2-32 CCP50_2 • 2-2 CDWD Modules Specifications • 4-19, 519 CE Compliance • 3-14 CHTR_B basecard Configurations • 6 -40 CHTR_B basecard modules and transceivers • 6-40 Client Transceivers for EISM Cards • 311 Client Transceivers for MCSM, EISM Cards • 4-18 Client Transceivers for MCSM, EISMB_840 Cards • 5-18 Compact CWDM Platform for Metroaccess NetworksSee XDM-200 • 1-4 Connection Module Data for Electrical I/O Cards • 6-3 Control, Matrix, and I/O Cards for Large XDM Shelves • 2-57 Cross-Connect Capacity • 3-2, 4-2, 6-75 Cross-connect Capacity Specifications • 6-75 Cross-Connect Levels • 3-2, 4-2, 5-2, 675 Cross-connect Levels Specifications • 675 Cross-connect Specifications • 3-2, 4-2, 5-2 I-2

Cross-Connect Specifications • 3-2, 4-2, 5-2 CWDM and DWDM STM-16/OC48/OTU1 SFP Optical Transceivers for OM16_1SFP and OMSC16_4 • 619 CWDM components (CCP cage) • 6-38 CWDM Frequencies and Wavelengths (ITU-T Rec. G.694.2 for CWDM) • 4-22, 5-20, 6-65 CWDM Modules • 4-21, 5-20 CWDM Mux/Demux/OADM Components • 6-38

D Data Cards • 6-23 Data Cards Specifications • 6-23 Data Client Transceivers for DIOB, MCS5, MCS10, MCS30_X10G • 629 Data Client XFP Transceivers for MCS30_X10G • 6-30 Data Line XFP Transceivers for MCS30_X10G • 6-31 Data Modules • 3-8, 4-13, 5-14 Data Modules Specifications • 3-8, 4-13, 5-14 Data-Aware Access GatewaySee XDM500 • 1-4 DCF/DCM Units • 6-60 DCF/DCM Units Specifications • 6-60 Demux (CCP Flat Top) specifications • 633 Dimensions (H x W x D) • 3 -12, 4-23, 521, 6-65 DIOB Specifications • 6-23 DIOM Specifications • 3-8, 4-13, 5-14 DWDM • 1-4 DWDM cards (cards cage of XDM-1000 and XDM-2000 shelves) • 6-32 DWDM components (CCP cage of XDM40/XDM-450/XDM-500/ XDM-1000) • 6-37 DWDM modules (CCP cage of XDM1000/XDM-450) • 6-32


417006-2009-013-A01


Index

DWDM Mux/Demux Cards and Modules • 6-32 DWDM OADM cards (cards cage) • 6-36 DWDM OADM Cards and Modules • 636 DWDM OADM plug-in filters for OADM cards • 6-37

E ECB, xECB4, or ECB3000 • 2 -59 ECB/xECB4 • 2-59 ECM40 • 2-59 ECU • 2-4, 2-37, 2-39 ECU300 • 2-43, 2-44 ECU300F • 2-43 ECU50 • 2-2, 2-32, 2-33, 2-41 ECU50 and ECU50R • 2-34 ECU900 • 2-47, 2-48 ECU900F • 2-47 EISM Specifications • 3-10, 4-17 EISMB Specifications • 3-9, 4-14, 5-15 Electrical GbE SFP (ETGbE) • 3-11, 418, 5-19 Electrical Interface Connection Modules • 6-3 Electrical, Optical and Mixed Basecard Information Specifications • 6-2 Electrical, Optical, and Mixed Basecard Information • 6-2 EMC • 3-13, 4-27, 5-26, 6-73 EMC Specifications • 3-13, 4-27, 5-26, 673 Environmental Conditions • 3-13, 4-27, 5-25, 6-73 Environmental Conditions Specifications • 3-13, 4-27, 5-25, 6-73 Environmental Standards • A-2 ETSI European Telecommunications Standards Institute • A-2 Expanded XDM-100 Shelf with I/O Protection • 2-36 Expanded XDM-300 Shelf with I/O Protection • 2-41 417006-2009-013-A01

Expanded XDM-300 with CWDM Networking Capabilities • 2-9 Expanded XDM-300 with I/O Protection • 2-8 Expanded XDM-50 Shelf with I/O Protection • 2-33 Expanded XDM-900 Shelf with I/O Protection • 2-45 Expanded XDM-900 with CWDM Networking Capabilities • 2-14 Expanded XDM-900 with I/O Protection • 2-12 Expansion Shelves • 2-21

F FCU • 2-4 FCU40 • 2-15 FCU50 • 2-2 Floor Loading • 6-66

G GbE/FC/2 Gbps FC/FICON Optical SFP Transceivers for Transponders/Combiners • 4-20

H Handling and transportation • 6-73 Handling and Transportation • 3-13, 4-27, 5-25 Heat dissipation • 6-72 HLXC192/384/768 • 2-57 HLXC192/384/768/1536 • 2-57

I I/O Interfaces • 3-3, 4-4, 5-3 I/O Interfaces Specifications • 3-3, 4-4, 53 I/O Protection Options • 2-8 IEC International Electrotechnical Commission • A-3 IEEE Institute of Electrical and Electronic Engineers • A-4 IETF


I-3

Index


Internet Engineering Task Force • A-5 INF50 • 2-2, 2-32 ISO International Organization for Standardization • A-7 ITU-T International Telecommunication Union • A-7

J Jitter and Wander • 3-2, 4-4, 5-3, 6-76 Jitter and Wander Specifications • 3-2, 44, 5-3, 6-76

L Laser Safety • 3-14, 4-27, 5-26, 6-73 Life • 3-14, 4-28, 5-26, 6-74

M Main equipment power consumption • 668 Main Equipment Power Consumption • 313 Management • 3-4, 4-5, 5-5 Management and Alarm Interfaces • 3-4, 4-6, 5-5, 6-74 Management Specifications • 3-4, 4-5, 55, 6-74 MCS10 Specifications • 6-25 MCS30_X10G Specifications • 6-27 MCS5 Specifications • 6-24 MCSM Specifications • 4-15, 5-16 MECP • 2-15, 2-19, 2-48, 2-59 MECP_OSC cards • 6-11 MEF Metro Ethernet Forum • A-11 Miniature MSPP for Metro-access and Cellular NetworksSee XDM-100 • 14 MO_ROADM2A - 100 GHz spacing - 2D ROADM with Equalization • 6-36 MO_ROADM2A_50 - 50 GHz spacing 2D ROADM with Equalization • 6-36

I-4

MO_ROADM40 2D ROADM 100 GHz spacing with equalization • 6-35 MO_ROADM8A – 100 GHz spacing – Multi Degree configuration • 6-34 MO_ROADM8A_50 – 50 GHz spacing – Multi Degree configuration • 6-35 MO_ROADM8D – 100 GHz spacing – Multi-Degr ee configuration • 6-35 Modules Cage • 2-52 MSPP • 1-2 MSPP for High Capacity Central Exchange ApplicationsSee XDM1000 • 1-4 Multifunctional Intelligent Optical SwitchSee XDM-2000 • 1-4 Mux (CCP Flat Top) specifications • 6-33 Mux/Demux Modules • 4-21 Mux/Demux Modules for XDM-300/900 • 5-20 Mux/demux specifications • 6-39 MXC • 2-37, 2-38 MXC and ECU Cards • 2-37 MXC-100 • 2-4 MXC300 • 2-42 MXC300 and ECU300 Cards • 2-41 MXC300 Cross-Connect Capacity • 5-2 MXC50 • 2-2, 2-32, 2-33, 2-41 MXC50 and ECU50 Cards • 2-33 MXC900 • 2-46 MXC900 and ECU900 Cards • 2-46 MXC900 Cross-Connect Capacity • 5-2 MXC-BG • 2-36

N NEBS Compliance • 4-28, 5-26, 6-73 NIST National Institute of Standards and Technology • A-12 Nonredundant XDM-100 • 2-5 Nonredundant XDM-100 Shelf • 2-36 North American Standards • A-12 NVM • 2-6


417006-2009-013-A01


Index

O

OW Unit Specifications • 6-22

OADM Modules • 4-21 OADM Modules for XDM-300/900 • 520 OADM specifications • 6-39 OFAs for single channel and DWDM applications • 6-57 OM_AD4RQEW_xx 4skip0 OADM for I/O slots • 6-37 OM_OADM4GEW_xx 4 skip 0 OADM for CCP slots • 6-38 OMCM25_4 & AoC GbE/FC1 SFP Transceivers • 6-46 OMCM25_4 FC2G client SFPs • 6-46 OMCM25_4 STM-1/OC-3 SFP Optical Transceivers • 6-44 OMCM25_4 STM-4/OC-12 SFP Optical Transceivers • 6-45 OMG Object Management Group • A-13 OMSP card specifications • 6-61 Operation • 3-13, 4-27, 5-25, 6-73 OPM card specifications • 6-61 Optical Amplifier Modules for TPU/OCU • 4-19, 5-19 Optical Amplifiers • 6-56 Optical Amplifiers Specifications • 6-56 Optical Auxiliary Cards and Modules • 659 Optical Auxiliary Cards and Modules Specifications • 6-59 Optical Auxiliary Cards for XDM-450 • 6-60 Optical Components • 6-32 Optical Components Specifications • 6-32 Optical SFP transceivers for I/O cards • 6-5 Optical transceivers for I/O cards • 6-4 Optical transmitters and receivers for TRP25_2 • 6-40 Other Optical Cards • 6-61 Other Specifications • 6-75 Overview • 1-1, A-1

P

417006-2009-013-A01

PDH/Async and SDH/SONET Interface Specifications • 6-8 Physical Description • 2-1 Physical Specifications • 3-12, 4-23, 5-21, 6-65 Power • 3-12, 4-23, 5-21, 6-66 Power consumption • 6-67 Power Dissipation • 3-13, 4-23, 5-22 Power requirements • 6-66 Power Supply Lines Surge Voltage • 6-67 PSFU • 2-48

Q QoS • 1-1

R Rack Layouts • 2-21 Rack Layouts and Expansion Shelves • 221 Rack Mounted Single Channel DCM Units • 6-60 RAMAN and very high power EDFA amplifiers • 6-57 Redundancy • 3-2, 4-3, 5-2, 6-75 Redundancy Specifications • 3-2, 4-3, 52, 6-75 Reliability • 3-14, 4-28, 5-26, 6-74 Reliability Specifications • 3-14, 4-28, 526, 6-74 ROADM Cards • 6-34 ROADM modules for XDM-1000/XDM450 (CCP cage) • 6-34

S Safety • 3-14, 4-27, 5-26, 6-73 Safety Specifications • 3-14, 4-27, 5-26, 6-73 SDH Interfaces • 3-5 SDH/SONET Interfaces • 4-6, 5-6, 6-10 SDH/SONET Interfaces Specifications • 4-6, 5-6, 6-10


I-5

Index


SDH/SONET STM-16/OC-48 SFP Optical Transceivers for OM16_1SFP and OMSC16_4 • 6-17 SDH/SONET STM-64/OC-192 (9953.28 Mbps ±4.6 ppm) I/O Modules • 6-20 SDH/SONET STM-64/OC-192 XFP Optical Transceivers • 6-21 Shelf Layouts • 2-2, 2-3, 2-6, 2-15, 2-17, 2-18, 2-19 XDM-100 • 2-3, 2-6 XDM-1000 • 2-18 XDM-2000 • 2-19 XDM-40 • 2-15 XDM-400 • 2-15 XDM-50 • 2-2 XDM-500 • 2-17 Specifications • 3-2, 3-3, 3-4, 3-8, 3-12, 3-13, 3-14, 4-2, 4-3, 4-4, 4-5, 4-6, 413, 4-19, 4-23, 4-27, 4-28, 5-2, 5-3, 55, 5-6, 5-14, 5-19, 5-21, 5-25, 5-26, 62, 6-5, 6-8, 6-10, 6-23, 6-32, 6-56, 659, 6-60, 6-61, 6-65, 6-73, 6-74, 6-75, 6-76 auxiliary cards • 6-61 cross-connect • 3-2, 4-2, 5-2 cross-connect capacity • 6-75 cross-connect levels • 6-75 CWDM modules • 4-19, 5-19 data cards • 6-23 data modules • 3-8, 4-13, 5-14 DCF/DCM units • 6-60 DWDM cards • 6-32 electrical, optical and mixed basecard information • 6-2 EMC • 3-13, 4-27, 5-26, 6-73 environmental conditions • 3-13, 427, 5-25, 6-73 I/O interfaces • 3-3, 4-4, 5-3 jitter and wander • 3-2, 4-4, 5-3, 6-76 management • 3-4, 4-5, 5-5, 6-74 miscellaneous accessory modules • 661 optical amplifiers • 6-56

I-6

optical auxiliary cards and modules • 6-59 optical components • 6-32 PDH/Async and SDH/SONET interface • 6-8 physical • 3-12, 4-23, 5-21, 6-65 redundancy • 3-2, 4-3, 5-2, 6-75 reliability • 3-14, 4-28, 5-26, 6-74 safety • 3-14, 4-27, 5-26, 6-73 SDH/SONET interfaces • 4-6, 5-6, 610 synchronization • 3-2, 4-3, 5-3, 6-76 traffic protection • 3-2, 4-3, 5-2, 6-75 XDM shelf capacities • 6-5 XDM-1000 product line • 6-2 Splitter/Coupler Modules • 4-22 Splitter/Coupler Modules for XDM300/900 • 5-20 Standards and References • A-1 STM-1 (155.52 Mbps ±4.6 ppm) I/O Module • 3-5 STM-1 Electrical • 3-3, 4-5, 5-4, 6-8 STM-1 Optical • 3-3 STM-1 SFP Optical supervisory channel transceivers for OSC1_2 • 4-21 STM-1/OC-3 (155.52 Mbps ±4.6 ppm) I/O Modules • 4-6, 5-6, 6-10 STM-1/OC-3 Optical • 4-5, 5-4, 6-9 STM-1/OC-3 SFP Optical Transceivers for OMS01_4 • 6-12 STM-16/OC-48 (2488.32 Mbps ±4.6 ppm) I/O Modules • 4-10, 5-10, 6-16 STM-16/OC-48 Optical • 4-5, 5-4, 6-9 STM-16/OTU1 Optical SFP Line Transceivers for OMTR27_2 & OMCM25_4 • 6-53 STM-4 (622 Mbps ±4.6 ppm) I/O Module • 3-6 STM-4 Optical • 3-4 STM-4/OC-12 (622 Mbps ±4.6 ppm) I/O Modules • 4-8, 5-8, 6-13 STM-4/OC-12 Optical • 4-5, 5-4, 6-9 STM-4/OC-12 SFP Optical Transceivers for OMS04_1 • 6-14


417006-2009-013-A01


Index

STM-64/OC-192 Optical • 5-5, 6-9 Storage (packed) • 3-13, 4-27, 5-25, 6-73 Synchronization • 3-2, 4-3, 5-3, 6-76 Synchronization Specifications • 3-2, 4-3, 5-3, 6-76

T The Do-It-All MSPP for Up-and-Coming NetworksSee XDM-50 • 1-4 TM • 1-4 TMF TeleManagement Forum • A-13 Traffic Protection • 3-2, 4-3, 5-2, 6-75 Traffic Protection Specifications • 3-2, 43, 5-2, 6-75 Transponders • 6-39 TRP10_4 basecard configurations • 6-43 TRP10_4 basecard transceivers • 6-43 TRP10_4 CWDM OTU2 Line/Client STM-64/10G LAN/FC10/OTU2 XFP Optical Transceivers and CMBR40B Client Transceivers • 6-49 TRP10_4 OTU2/OTU2e Line, STM64/10G LAN/FC10 Client, AoC, CMBR10, TRP10_LAN, TRP10_2B, OTU2 XFP Line Transceivers and CMBR40B Client Transceivers • 6-51 TRP10_4R OTU2/OTU2e/OTU2f Optical Transceivers • 6-50 TRP25_2 2.5 Gbps optical transmitters/receivers for transponders, and transceivers for combiners • 6-54 TRP25_2 basecards • 6-39 TRP40_2B and CMBR40B configurations • 6-43 TRP40_2B Client Transceiver • 6-55 TRP40_2B, CMBR40B Line Transceiver • 6-54

U Unparalleled Capabilities • 1-2

W Web Protocol Standards • A-13 417006-2009-013-A01

Weight • 3-12, 4-23, 5-21, 6-66

X XDM • 1-2, 1-4, 2-57 capabilities • 1-2 cellular capabilities • 1-2 control, matrix and I/O cards • 2-57 data capabilities • 1-2 optical capabilities • 1-2 platforms • 1-4 SDH/SONET capabilities • 1-2 XDM MPLS/Ethernet Card Summary • 622 XDM Platforms • 1-4 XDM Shelf Capacities • 6-5 XDM Shelf Capacities Specifications • 65 XDM Shelf Capacities with HLXC • 6-5 XDM Shelf Capacities with XIO • 6-6 XDM Shelf Configurations • 2-2 XDM® – Intelligent and Scalable Optical Networking Platforms • 1-1 XDM-100 • 1-4, 2-3, 2-4, 2-5, 2-6, 2-35, 2-36, 2-37, 2-40 basic shelf • 2-4, 2-35, 2-40 cards and modules • 2-35 expanded shelf • 2-36 I/O protection • 2-5 nonredundant • 2-5 nonredundant shelf • 2-36 NVM • 2-6 shelf layout • 2-3 slot allocation • 2-35 XDM-100H • 2-6 XDM-100H shelf • 2-37 XDM-100 Card and Module Layout • 235 XDM-100 Product Line Main Equipment Power Consumption • 4-24, 5-22 XDM-100 Shelf Capacity • 4-2 XDM-100 Shelf Layout • 2-3 XDM-100 Specifications • 4-1 XDM-100 with I/O protection • 2-5


I-7

XDM_SPEC_A01_8.2.3-8.2.4_en.pdf

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