The materials in this report include forward-looking statements which can generally be identified by phrases such as Samsung Electronics (SEC) or its management "believes," "expects," "anticipates," "foresees," "forecasts," "estimates" or other words or phrases of similar implications. Similarly, such statements that describe the company's business strategy, outlook, objectives, plans, intentions or goals are also forward-looking statements. All such statements are subject to certain risks and uncertainties that could cause actual results to differ materially from those in the presentation files above. For us, particular uncertainties which could adversely or positively affect our future results include: · The behavior of financial markets including including fluctuations in exchange rates, interest rates and commodity prices · Strategic actions including including dispositions and acquisitions · Unanticipated dramatic developments in our major businesses businesses including CE (Consumer Electronics), IM (IT & Mobile communications), DS (Device Solutions) · Numerous other matters at the national and international levels which could affect our future results These uncertainties may cause our actual results to be materially different from those expressed in this report.
System Semiconductor Industry Samsung System LSI : Now Looking Forward
Market of Mobile Device Smartphone
Tablet
(billion units)
1.3
1.2
(billion units)
1.0 0.7
0.8
0.6
9%
0.4
0.5
0.3
0.5
0.2 22%
0.5
0.7
0.6
0.07
0.3 2012
0.1 0.05
2013
Premium
2014(E)
2015(E)
Mid + Low
* Source : Gartner, Strategy Analytics, 2013 3Q
2012
0.06 0.12 2013
Premium
0.09
0.07 25% 58% 0.19
2014(E)
0.26
2015(E)
Mid + Low
* Source : Gartner, 2013 3Q
Computing Power •
New applications require higher computing/bandwidth h t d i w d n a B / g n i t u p m o C
Dual Camcording
1080p Video Web browsing
Single Camcording Location Based Service Voice Command
Resolution
Display Trend •
Higher resolution FHD-class Display
Display n o i t u l o s e R
UHD (3,840x2,160)
WQHD (2,560x1,440)
FHD
HD-class Display
(1,920x1,080)
HD (1,280x720)
2011
2013
2015(E)
Camera Sensor Trend •
Image quality enhancement is also improving Camera Sensor 20Mp
n o i t u l o s e R
16Mp
Wide Dynamic Range
13Mp
Image Stabilization
5Mp
8Mp
Face Detection
Wide Dynamic Range
Face Detection
Image stabilization
3Mp 2007
2009
2011
2013
2015(E)
System Semiconductor Industry
Samsung System System LSI : Now Looking Forwar Forward d
Three business areas LSI SOC
Foundry AP Connectivity
Foundry
Image Sensor Display Driver IC Smart Card IC Power Management Management IC
Product Portfolio
Powerful CPU/GPU
Pixel Leadership
•
•
Low Power
•
Power Sequence Control & I2C Interface
Camera Sensor
Slim Solution
•
•
PMIC line: AP & OLED
•
High Efficiency
•
High Accuracy
•
PMIC
Low Power Consumption
•
NFC WiFi/BT GPS
vt
Smartphone
•
Full line up for next FHD
•
Lower Power solution
•
T-Con
IoT
High Density e-SE Module
•
SIM
Display Driver IC
•
World’s Best Performance
Fast Speed (New Architecture)
•
eDRAM
T-con Backlight control
1. AP (Application Processor) Focusing on high performance with low power consumption
•
CPU Leadership
Powerful GPU
Low Power
Game changing technology :
Richer 3D graphics with
Adv Ad van ance ced d mo mobi bile le pr proc oces esss &
big.LITTLE octa core
Energy efficiency
design methodologies
big
Low
High
Low
High
LITTLE
Computing Power Has been leading AP industry since 2009
•
Innovation in both Architecture & Silicon Technology
(DMIPS)
30,000
Cortex-A15 2.xGHz
Cortex-A15 Octa 1.6GHz
Cortex-A9 Quad
20,000
1.4GHz
Cortex-A9 Dual
10,000
ARM11 800MHz
2008
Cortex-A8
1.2GHz
1.0GHz
2009
2010
* Source : Samsung Electronics Electronics Co., Ltd. ARM
2011
2012
2013
*DMIPS : Dhrystone Million Instructions Per Second
big.LITTLE Architecture Best of both worlds: high performance and low energy
•
Heterogeneous architecture for energy efficiency
1
2
3
4
big C-A15
LITTLE
1
2
C-A7
3
4
big.LITTLE Architecture 20% gain at performance and energy, respectively
•
Performance
Energy
Higher is Better
Lower is Better
+ 20%
big.LITTLE
Conventional
*Source : Samsung Electronics Co., LTD, 2013 2Q
*Conventional *Conventional : big CPU only
-15 ~ 20%
big.LITTLE
Conventional
*Source : Samsung Electronics Co., LTD, 2013 2Q
Advanced Silicon Process •
Lead Leader ersh ship ip in low-po low-power wer,, advance advanced d silico silicon n proces processs
Vdd
90/65nm 45nm 32nm 28nm Strained Si
20nm m
ULK 1st Gen HK/MG
14nm
2nd Gen HK/MG
10nm
1.2V 1st Gate Last HK/MG
1.1V 1.0V
1.0V
1st Gen FinFET
0.9V
2nd Gen FinFET
0.8V 0.7V
* Source : Samsung Electronics Co., Ltd.
Process Node
2. Image Sensor •
Higher resolution & smaller pixel have driven sensor industry Back-side Illumination Pixel
Pixel Pitch (um)
13Mp
12Mp 8Mp
5.6
ISOCELL Wide Dynamic Range
5Mp 2.8
Resolution
3Mp 2.25 1.8
1.3Mp
1.4
2Mp
1.1
VGA Standard Mobile Imaging Architecture (SMIA)
2004
2005
2006
2007
Sub 1um
2008
2009
2010
2011
2012
2013
Pixel Architecture To increase sensitivity and decrease light loss & crosstalk
•
Gap-less u-lens
Deep PD
Light-guide
Increase sensitivity
Reduce loss in Si
Reduce metal layer reflection u-lens C/F Metal Photo-diode
Conventional
Without color interference interference
With color interference
G
Light-guide
ISOCELL
Back-side illumination
No light loss
Remove metal layer reflection
R
G
R
Photo Photo Diode Diode
Photo Photo Diode Diode
Back-side illumination
ISOCELL
Back-side Front-side illumination illumination
New Products for 2014-15
16Mp ISOCELL Sensor with 1.12um pixels
•
- Main sensor for smartphones - Wide dynamic range & Auto focus
Next APS-C sensor
•
- Sensor for mirror-less cameras
3. Foundry Advanced technology and continuous capacity growth
Customers
One stop IP shopping and design support
Best service for development and mass production
Technolo echnology gy & Capacity IP & Design Support
Partnership with customers Service
14nm Achievement •
World’s leading 14nm FinFET solution via collaboration
Samsung : 14nm FinFET test sample & Design Infrastructure Infrastructure ready
ARM , Cadence, Synopsys & Mentor FinFET Design Enablement Platform
First Cortex-A7 implementation
Technology & Capacity
Samsung
IBM
ISDA
Giheung, KR STMicro.
GlobalFoundries Austin, Texas, USA * ISDA : International Semiconductor Semiconductor Development Alliance
Hwaseong, KR
System Semiconductor : Introduction Samsung System LSI : Now
Looking Forward
1
“ Widcon Widcon” & TSV (Through Silicon Via)
2
64-bit CPU
3
FinFET Process
“Widcon” with TSV
Wide connection between logic and memory
•
Higher bandwidth, lower power consumption
Memory Stacking with TSV
Short Connection with TSV
Micro Bump
DRAM u-bump
AP Package PCB
Widcon in reality •
World’s 1st AP using Widcon & TSV
Performance
Power 33%
Higher is Better
Lower is Better 60% 43%
14%
Widcon1 LPDDR3
Widcon2 LPDDR4
Widcon1
*Source : Samsung Electronics Co., Ltd., JEDEC, 2013 1Q
LPDDR3
Widcon2 LPDDR4
64-bit CPU core for Smart Devices 2-step approach:
•
AP with ARM’s 64-bit core
AP with Samsung’s own 64-bit core
Samsung
14nm FinFET Technology FinFET technology leadership
•
Lower Vdd and delay than a planar process Advantage
Structure FinFET Gate Source Source
Drain
y a l e D
20nm Planar
Less Delay Lower Vdd Vdd
New Business
1
ModAP (Cellular Modem + AP)
2
IoT
3
Foundry 2.0
1. ModAP (Modem + AP) Dual tracks for modem collaboration
•
High-end
: 2-chip strategy with Tier-1 modem suppliers
Mid/low-end : ModAP using system company’s modem
Existing Products
Additional Products
ModAP
AP
Modem
Memory
Memory
AP
Modem
Memory
ModAP •
System LSI’s 1 st ModAP was shipped in 3Q’13
Exynos 4 Quad + System Company’s Modem
2. IoT (Internet of Things) Smart building, Smart community, . . .
•
Total connectivity solutions
•
Air condition conditioning ing and Temperature control
Energy Generation Energy Storage
Lighting Control
Control of Elevators and Escalators
Total Solutions Security Control Disaster Prevention Monitoring Cameras
3. Foundry 2.0 •
Technical leadership
14FF and beyond
Foundry 2.0 1
Follower
Technology Leadership
2
Tier 1 only
Tier 1 + Tier 2/3
3
Silicon
Silicon + IP Provider Provider
Foundry 2.0 10nm FinFET Leadership
•
SRD
Schedule *SRD: Semiconducto Semiconductorr Research & Development
Performance, power and area
ISDA
Early EUV Adoption
•
Concluding Remarks
•
Samsung S.LSI provides total solution for connected world Mobile AP (Application Processor)
Image Sensor
ModAP
IoT
•
Samsung S.LSI offers attractive offers attractive foundry solution Leading-edge technology: 14FF
Capacity
