Lenovo A2010-a Service Manual
Contents 1
Layout of main board ......................... ............ .......................... .......................... .......................... ......................... ......................... .......................... ........................ ........... 3 1.1 Layout ................................................................................................................................. 3 1.2 Mobile phone principle and fault analysis ........................................................................... 4 1.3 Baseband unit ..................................................................................................................... 5 1.3.1 Does not boot ........................................................................................................... 5 1.3.2 LCD .......................................................................................................................... 8 1.3.3 CTP ........................................................................................................................ 10 1.3.4 Flash ....................................................................................................................... 11 1.3.5 MAIN CAMERA ...................................................................................................... 12 1.3.6 SUB CAMERA ........................................................................................................ 13 1.3.7 KEY ........................................................................................................................ 15 1.3.8 VIB .......................................................................................................................... 15 1.3.9 RECEIVER ............................................................................................................. 16 1.3.10 SPEAKER SPEAKER ......................... ............ .......................... .......................... .......................... ......................... ......................... .......................... .................... ....... 17 1.3.11 MIC ....................................................................................................................... 18 1.3.12 Earphone failure ................................................................................................... 20 1.3.13 SIM_CARD ........................................................................................................... 20 1.3.14 G-SENSOR......................... ............ .......................... .......................... .......................... .......................... .......................... ......................... ................. ..... 22 1.3.15 BT/WIFI/FM/GPS ......................... ............ .......................... .......................... .......................... ......................... ......................... ...................... ......... 22 1.3.16 RF unit .................................................................................................................. 26 1.3.17 GSM failure ........................................................................................................... 26 1.3.18 WCDMA failure ..................................................................................................... 27 1.3.19 LTE failure ............................................................................................................. 29 2 Assembly and disassembly disassembly instructions .......................... ............. .......................... .......................... ......................... ......................... ...................... ......... 32 2.1 Disassembly ..................................................................................................................... 32 2.1.1 Disassemble battery cover...................................................................................... 32 2.1.2 Remove the battery ................................................................................................ 32 2.1.3 Disassemble rear cover .......................................................................................... 32 2.1.4 Loosen the MIC ...................................................................................................... 33 2.1.5 Loosen the speaker ................................................................................................ 34 2.1.6 Loosen the vibrator ................................................................................................. 34 2.1.7 Dismantle the LCD connector ................................................................................. 35 2.1.8 Dismantle side key FPC connector .......................... ............. ......................... ......................... .......................... ...................... ......... 35 2.1.9 Dismantle TP connector.......................... ............. ......................... ......................... .......................... .......................... .......................... ............. 36 2.1.10 Dismantle rear camera connector .......................... ............. ......................... ......................... .......................... ...................... ......... 36 2.1.11 2.1.11 Loosen the MB screws .......................... ............. ......................... ......................... .......................... .......................... .......................... ............. 36 2.1.12 Separate MB front f ront TP&LCD assembly......................... ............ .......................... .......................... .......................... ............... .. 37 2.1.13 De-soldering speaker......................... ............ .......................... .......................... .......................... .......................... .......................... ............... .. 37 2.1.14 Dismantle front camera ......................... ............ ......................... ......................... .......................... .......................... .......................... ............. 38 2.1.15 De-soldering receiver and remove ......................... ............ ......................... ......................... .......................... ...................... ......... 38 2.1.16 De-soldering vibrator ............................................................................................ 38 2.1.17 De-soldering MIC .................................................................................................. 39 2.1.18 Tilt TP FPC ........................................................................................................... 39 2.1.19 Dismantle side key ................................................................................................ 39 2.1.20 Dismantle camera lens ......................................................................................... 40 2.1.21 Tear Tear down battery compartment Mylar ......................... ............ .......................... .......................... .......................... ............... .. 40 2.1.22 Summary of demolition materials ........................ ........... .......................... .......................... .......................... ........................ ........... 41 2.2 Assembly guide ................................................................................................................. 41
1 1.1 Layout
Layout of main board
1.2 Mobile phone principle and fault analysis MT6735 baseband chip as illustrated：
MediaTek MT6735 SoC integrates four 64 ARMv8 architecture Cortex-A53 CPU core, clocked at 1.5GHz, while integrating the next generation of GPU Mali-T720,8 core, support for OpenGL ES 3.0, OpenCL 1.2. The biggest highlight of the baseband processor processor part to support GSM / EVDO Rev. A / CDMA20 CDMA2000 00 1x / TD-SCDNA / WCDMA / TD-LTE / LTE FDD standard, including EVDO Rev. Rev. A / CDMA200 CDMA2000 0 1x is the first time in the SOC MediaTek , patents from vIA Telecom. Multimedia, supports low-power 1080p / 30fps video playback and recording, H.265 / H.264 video encoding, integrated 13 million pixel camera ISP, supports PIP PIP, VIV dual video, Video Face Beautifier, also supports ClearMo ClearMotion, tion, MiraVisio MiraVision. n. Wireless technology supports dual-band Wi-Fi, Bluetooth 4.0.
1.3 Baseband unit 1.3.1 Does not boot
boot sequence
The Principle: Phone is switched on in the process as shown above, press the power button, PWRKEY detected low latency 30ms, drive power management chip LDO open and the brightest to the baseband circuitry, starting from Vcore, 2ms interval turn on power to VMCH power-end. At the same time, from the beginning of the end electrical power management chip RESET signal resets 200ms after the Vcore, the baseband chip to boot into software startup program, complete boot. In addition, this platform Power Good detection function. That PMIC will automatically detect each way power output, the power output if there is not, PMIC will repeat the process on power. If this phenomenon occurs, the performance of reset signal remains low. boot process 1. Mobile phone power supply: mobile phone plus battery or DC power supply, power management chip (PMU) to get the battery voltage, its internal 32KHz watch crystal module to work, the output voltage of the external RTC's work, for real-time clock crystal start-up. 2. Phone reset: press the power button, after PMU detected RST_ON outputs a reset signal to the phone CPU, CPU will start the system self-test program; 3. The working voltage output: After the phone to complete the self-test, CPU PMU output by IIC bus control circuit voltage of each cell phone, such as VDD1, VDD2, VDD3, AVDD and the like; 4. 13M crystal work: After the clock and get a job working voltage, CPU outputs REF_ON signals to control the work of 13M circuit generates 13MHz clock, on the one hand to provide work master CPU clock, on the other hand to provide the main chip radio frequency reference frequency source ; 5. Call the boot process: After the CPU self-test completed and the operating voltage and the master clock, via IIC bus calibration work PMU output voltage from various quarters, t he calibration is complete, it will output chip select signals and address signals to FLASH, calling boot process , and boot; 6. Establishing a communication connection: the phone is turned on, CPU call RF parameters from FLASH, the received signal strength of a cell through the broadcast control channel (BCCH), if there is a SIM card or UIM card in the phone, the relevant information is transmitted to the adjacent base station, and receives information from the base station, which is connected with the corresponding networks, known as search network; 7.After completion of the standby search network, the phone will be in a wait state, the phone will periodically during the exchange of information with the base station via a number of auxiliary slow control channel (SACCH), such as signal strength, frequency synchronization, synchronization, reception quality and reception level Failure analysis processing 1. For the failure does not boot, t he first detection of the battery interfaces for any obvious damage. If the battery interface OK, then use the DC power supply to the mobile phone, observe current fault plane; plane;
2. With a test fixture measurement bad motherboard power current ： The current is too large (typically greater than 1A), proved short-circuit motherboard, usually battery Vbat pin connector is shorted to ground, can be removed U401 (PMIC) and then measuring the Vbat pin is short-circuited, then turn on the replacement Vbat path other chip U901 (flash drive), U805 (backlight driver) and then measuring the Vbat pin is shorted; A current at 70mA or or less, to check each power power supply supply is normal, usually usually PMIC, clock circuit circuit Weld or damaged, you can measure the crystal is normal; A current of 70 ~ 100mA, 100mA, typically software software data loss, half rubbing rubbing upgrade upgrade software; d, current is 100 ~ 300mA, check the clock (X401) is normal, focus on examination PMIC (U401), CPU (U101), MEMORY (U602) welding is bad
Flow chart
Current inspection
100～300mA
<70mA N Check U401
70～100mA
Welding U401 Y
Y Replace U401
Re-downlo ad software
Y N Y
N Check X401
Y
Replace U401
Replace U101 N
N Replace U401
Replace U602 OK OK
OK
Circuit Schematic：
Charge management chip U501, when checking the charging voltage, a signal is sent to the PMIC and start charging, charging current is monitored by ISENSE, VBAT monitor the battery voltage: After inserting the battery charger, the phone no response, response, can not be be charged, first replace replace the battery and charging cable for testing; and then measuring the charge current is normal; and then try to add or replace welding U502, and then try to add another weld or replace PMIC. Not charge
N
Check VCHG Voltage
Replace connector
USB
Y N
Replace R509
Check current
Y
N
Check the charging IC
Y
Replace PMIC
Replace U501
1.3.2 LCD
Circuit schematics
LCD is MIPI interface, including power/data/clock/reset. power/data/clock/reset. The main screen LCD display circuit MIPI interfaces are generally used communica communication tion interfaces. Each signal is described as follows: TDP/TDN is MIPI data interface/TCP/TCN for the MIPI clock interface; VIO18_PMU control signal voltage power supply; LCM_RST reset; LED_A, LED_K backlight power supply. Fault analysis process: Black screen, black and white, the t he video screen display dislocation LCD LCD Display bad
Y
Reassemble LCD
Replace LCD
N
Y
Check J802 abnormal
N
Upgrade or replace
Blacklight Driver
Is
Replacing Devices
OK
Analysis process Gray screen fault plane generally weak backlight, which is due to the backlight driving voltage is not enough cause, measuring LED-A in the phone is switched mode voltage is 36V. Measurement is not L802/D807/U805 L802/D807/U 805 device abnormal.
1.3.3 CTP
Circuit Schematics
Capacitive touch screen technology CTP (Capacity Touch Panel) is used by the body to work in the current sense. Capacitive screen is a four-layer composite glass screen, the inner surface of the glass panel and the sandwich and coated with a layer ITO (indium tin oxide nano), the outermost layer is a protective layer of silica glass only 0.0015mm thick, laminated ITO coating for the face, leads the four corners four electrodes, the inner layer of ITO as a screen to ensure that the work environment. Power supply circuit circuit VIO18_PMU/VIO_28PMU, VIO18_PMU/VIO_28P MU, control signal GPIO_CTP_RSTB/EINT_CTP/I2C GPIO_CTP_RSTB/EINT_CTP/I2C bus SDA1 and SCL1.
Failure analysis 1. Replace CTP； 2. Check the input voltage is normal ； 3. Enable signal is pulled up, if it is pulled ，The CPU exception, can be welded and then measuring 。 4 Is there a control signal output, use an oscilloscope to measure SDA1 and SCL1 whether a signal output, if abnormal, you can add insulation displacement displacement connector J801.
Failure analysis chart： Touch failure
Measure the voltage is abnormal
Y
Replace PMIC
N
Y
Measure RET、 EINT、SDA、SCL signal is abnormal
OK
Replace CPU
N
Y
CTP ZIF connector is abnormal
Reassemble connector
ZIF
1.3.4 Flash
Circuit Schematics
Failure analysis process Flash ends with a 3V voltage flash test, if bad then replace flash; check whether the flash is external components welded welded or body abnormal, check the flash IC welding is normal ；
Analysis flowchart
Flash failure
3V voltage to FLASH, is normal
N
Replace Flash
Y
Y
Measure Driver IC voltage is abnormal
Replace U901
Driver
IC
OK
N Y
Measure ENF and ENM is normal
Replace CPU（U101）
1.3.5 MAIN CAMERA
Camera principle analysis Main Camera: including power, clock, data and control lines, wherein the power line comprises VCAMA_PMU, VCAMD_PMU, VCAM_IO_PMU. Clock line includes CMMCLK, MIPI data interface includes RDP0-RDP1, RDN0-RDN1, MIPI clock interface RCN, RCP, the control line, including SDA0, SCL0. Failure analysis process ： Repair process: General phone camera without image or the video, there are four possibilities: the first rule Display failure, a camera bad; 2, camera and bad deck; 3, B2B deck J902 Weld. 4, CPU chip anomalies. So first determine whether the power cord has power, if the power cord abnormalities, first determine whether the short-circuit if a short circuit removed capacitance corresponding corresponding pathway, if not short-circuit the plus welding PMIC circuit; look at whether there is an output clock signal, without output can be to add PMIC chip welding; Check the signal cable is a signal, if not, you can first volume Z906 Z908 both sides, if the CPU has an output, then the exclusion air welding, soldering or replacement parts can be added; if there is no output, then the CPU exception, the first increase welding and then measured. If the peripheral signals are, we can conclude that the adverse socket, it can be welded and then measured.
Failure analysis flowchart： Camera fail
Check assembly is normal
N
Reassemble
Y
Measure voltage
N
Replace PMIC（U401）
Y
Z906-Z908 Impedance normal
N
is
Replace CPU
Y
N
Measure SCD0/SCL0/CLK/ RESET is normal Y
Replace Camera connector
1.3.6 SUB CAMERA
Circuit schematics
Replacing Devices
OK
Analysis process Front camera: including power, clock, data and control lines, wherein the power line comprises VCAMA_PMU/VGP1_PMU/VCAM_IO_PMU. Clock line includes CMMCLK. MIPI data line includes RDN0_A-RDN1_A/RDP0_A-RDP1_A, MIPI clock interface RCN_A, RCP_A. Control lines include CAM_RST1/SDA0/SCL0.
Repair process Usually cell phone camera without image or t he video, there are four possibil possibilities: ities: the first rule Display failure, 1, before the camera is bad; 2, the camera and the ZIF connector bad; 3, before the camera J901 ZIF connector Weld. 4, CPU or PMIC exception. So first determine whether the power circuit supply is normal, first determine whether a short circuit, if a short circuit removed capacitance corresponding correspondin g pathway, if not short-circuit the plus welding PMIC circuit; look at whether there is an output clock signal, the absence of output, you can first plus welding CPU chip; see signal line is a signal, if not, then the CPU exception CPU plus welding can be measured again. If the peripheral signals are, we can conclude that the connector is bad, can be welded and then measured. Failure
Camera is good and well asse assemb mbll ?
N
Replace or reassemble
Y
N
Measure voltage is normal
Replace PMIC（U401）
Y
Measure Z901-Z903 Im eda danc nce e
N
Replace CPU or EMI
Y
N
Measure SCD0 、 SCL0/CLK/RESE T Y
Replace front camera connector
Replacing Devices
OK
1.3.7 KEY
Circuit schematics
Circuit
principle analysis
Key into the power button and side buttons (volume +, -), when the key is pressed, CPU / PMIC detects a key signal to make appropriate judgments after being down and executing instructions; when all keys are invalid, first that investigation if there is a short circuit button pressed this button consistent state, bad if you consider whether a single key failure DOME / FPC body, after the exclusion of peripheral devices to the CPU, PMIC measurement investigation, this model is controlled by PMIC Power and Vloume up button, CPU control Volume down button; the button after replacing the first key signal FPC disassemble view is unobstructed, and then view PMIC and CPU devices whether Weld, damage.
Key Failure
Y
Replace FPC
All key failure
N
Y
Power and Vol “-” fallure
Plus welding PMIC
N
Y
Vol“+” failure
1.3.8 VIB
Circuit schematics：
Replace CPU
OK
Failure analysis process：
Motor works relatively very simple, all the way from PMIC LDO output voltage VIBR drive motor vibration, as long PMIC output voltage is normal, the line in the resistance welding good container, motor body work we can guarantee the normal operation of the motor, so the normal process of analysis starting from the three. First cell phone on vibrate mode, resistors and capacitors on the motherboard check whether good welding, such as welding good, with a multimeter to measure the motor between the two pads pad voltage, normal should be about 3V, such as the voltage is normal, for the motor monomer issue Please replace the motor; such as abnormal voltage, compared PMIC weld or damaged, plus welding or replacement of the PMIC.
1.3.9 RECEIVER
Circuit schematics
Failure analysis flowchart
Maintenance process: check whether the assembly RECEIVER good; check around the handset device (B701, B702) for damage or short, Weld, as the handset silent above normal circumstances, it can be judged PMIC power power supply problem problem (bulk or welding) welding) ；
Receiver fail
Y
Check peripheral devices
Replace peripheral devices
N Y
Check receiver
Replace receiver
N
Y
Check PMIC(U401)
1.3.10 SPEAKER
Circuit schematics
Replace PMIC
OK
Failure analysis process Speaker can not hear sound, check whether the horn assembly unusual or abnormal body ； Speaker fail
Y
Check speaker is good and well assemble
Reassemble replace
or
N
Y
Check R704 and R705
Replace R704 、 R705
N N
Check PA(U702)
Replace PA(U702)
Y
Check PMIC(U401)
1.3.11 MIC Circuit
Schematics
Replace PMIC
OK
Circuit principle analysis： MICBIAS0 bias voltage supply to the MIC, typically a voltage of about 2.4V-2.7V. MIC bias current flows from MICBIAS-MIC GND (separate GND, rather than public GND, mainly because of too much interference GND); beads have a high resistivity and magnetic permeability, which is equivalent to resistance and inductor series, but the resistance and inductance values vary with frequency. Better than conventio conventional nal high-frequency filter inductor characteristics, showing resistance at high frequencies, it is possible to maintain a high impedance over a wide frequency f requency range, thereby improving the filtering effect of FM 。
Failure
Mic silent
Maintenance process: check MIC welding is good, can replace MIC experiment; dial phone, measuring MIC circuit board C733 MICBIAS0 Is there bias; check whether the MIC circuit in question; plus welding PMIC. Failure analysis process：
MIC silent
Y
Re-welding Or Replacing Devices
Confirm the device around
N
Y
Re-welding or replace Mic
Mic problem?
N Y
MIC bias voltage is abnormal
Re-welding or replace PMIC
OK
1.3.12 Earphone failure Circuit
schematics
Failure Analysis VIO18 PMU provided headphones voltage; EINT EAR headset button; HP MIC is a headset microphone; AU HPL and AU HPR are the left and right earpiece headset; FM antenna is integrated in the headset. 1 After replacing the headset and retest the headset features; 2 Check whether the earphone holder welding is good; 3 Check the headphone related components have significant adverse welding or body damage and so on; 4 plug in your headphones, measuring VIO18 PMU voltage is normal; 5 After replacing the headset seat, then test; 6 plus welding / re-welded PMIC (U401 MT6328) or replaced. 。
1.3.13 SIM_CARD Circuit
schematics：
Failure analysis： SIM failure
Check the SIM and assembly is good
N
Reassemble or replace SIM
Y
Measuring VSIM voltage is normal
N
Re-welding replace PMIC
or
Y N
Measuring the impedance Of IO/RST/CLK
Replace CPU
OK
1.3.14 G-SENSOR
Circuit schemtatics
Failure analysis process Phone gravity sensing technology is the use of piezoelectri piezoelectric c effect to achieve. Through the sensor, feeling in the change positions, change the focus of the phone. It's I t's powered by an external interface circuit VIO18_PMU, control / data circuit SCL2 / SDA2, constitute a control signal EINT_G.
G-sensor Fail
Measure the voltage of 18_PMU is normal Y
Re-welding or replace U1107 N Replace （U101）
1.3.15 BT/WIFI/FM/GPS
FM Antenna circuit
CPU
N
Re-welding or replace PMIC
WIFI/BT/GPS
GPS&LNA
MT6625N/A WIFI/BT/GPS/FM
X1201 supplied with the 26M working clock/WIFI/BT/GPS/FM 1.8V and 2.8V power supply from an external LDO output, headset as an antenna for FM reception, after receiving FM demodulator chip, the output audio signal (FM_OUTL, FM_OUTR), the two-channel audio signals to the baseband chip, the baseband chip to do the t he handover process.
Failure analysis process Failure 1 FM doesn’t work Repair process: FM function in the open state, the clock signal and AVDD28_FM measuring signal is correct, if not correct then that is PMIC (U401) problems; if more signals are correct then look at FM chip MT6625 (U1201) is Weld or damage.
Failure 2
GPS doesn’t
work
Repair process: GPS function in the open state, the measurement of the clock signal is correct, measure GPS_AVDD18 voltage is normal, check the filter U1202, RF LAN U1203 is soldered properly and the body is normal, and check whether the band-stop filter U1204 welding normal and the body is normal, if these are normal, then check whether the MT6625 welding normal and the body is normal.
Failure 3
WIFI/BT doesn’t work
In the open WIFI, BT status, measure the clock signal is correct, measure WB_AVDD33 and AVDD18_WB AVDD18_ WB voltage is normal, check check whether U1205 U1205 RF filter welding welding normal and the body is normal, normal, check the MT6625 welding is normal and the body is normal.
Signal power is low
Check Antenna assembly is correct
Antenna line welding is abnormal
BT/WIFI/FM/GPS failure
FM Fail: Measuring clock signal
Y
GPS Fail Measuring clock signal
WIFI、BT Fail Measuring clock signal
Y
Measure the voltage of AVDD18 AVDD18 FM Re-welding and retest
Measure the voltage of GPS-AVDD18
Y
Measure the voltage of WB_AVDD33 and AVDD18_WB AVDD18_WB
Y Y Y
Check LAN U1203 and U1204 is good
Check U1202 and U1205 is good
Y Y
Check MT6625（U1201）is welding good and Device body good, if not then replace U1201
1.3.16 RF unit RF chip MT6169 and the PA, RF switches, filters, etc. together constitute the RF module, supports GSM, WCDMA, LTE. That support GSM \ W CDMA \ LTE U1301 MT6169V / A 3-mode RF transceiver chip supports 8-frequency mode ：
1.3.17 GSM failure
GSM850
B5
GSM900
B8
GSM1800/1900
Analysis GSM bands including GSM850/ GSM900,/DCS G SM900,/DCS1800,/PCS1900 1800,/PCS1900.. RF failure generally to receive, transmit bad 。
Repair process: 1 2 3 4 5
If the GSM850 fault, view the U1112 filter welding or body is abnormal; If the GSM900 fault, view U1508 filter welding or body is abnormal; If the fault DCS1800 see C1501 and C1519 filter welding or body is abnormal; If PCS1900 fault, view R1509 and C1513 filter welding or body is abnormal; Check the RF transceiver U1301 welding or body is normal. GSM failure
Y
DCS1800 failure
Replace U1112
Y
GSM900 failure
Replace U1508
Y
DCS1800 failure
PCS1900 failure
Replace C1501、C1519
Y
Replace C1509、C1513
Check U1301 is welding good and body is good
1.3.18 WCDMA failure
WCDMA include W 850/W900/W1900/W2100 850/W900/W1900/W2100（B1/B2/B5/B8） B1
B2
B5
B8
Repair process 1. W850 (B5) failure, f ailure, check the filter U1112 welding or body is normal; 2. W900 (B8) failure, f ailure, check the filter element U1508 welding or body is normal; 3. W1900 (B2) failure, check the filter element U1515 welding or body is normal; 4. W2100 (B1) failure, check the filter element U1504 welding or body is normal; 5. Check MT6169 (U1301) RF transceiver welding or body is normal; 6. Check the CPU (U101) welding or body is normal
WCDMA failure
Y
W850&W900 failure
Replace U1112 or U1508
N Y
W1900&W2100 failure
N
Check T6169 （U1301）is normal N
Check PU（U101）is normal
1.3.19 LTE failure
TDD
PRX B40
FDD
TRX B1
FDD
TRX B3
LTE
DRX
Replace U1515 or U1504
LTE RF Power Amplifiter
Analysis：
LTE into TRX (main set to receive r eceive and transmit common) and DRX (diversity reception) Repair process： 1. If the TLE of PRX B40 fault, plus welding or replace filter U1507, RF power amplifier U1401; 2. If the TLE of TRX B1 fault, plus welding or replace filter U1504, RF power amplifier U1401, U1505; 3. If TRX B3 / B4 TLE's fault, plus welding or replace filter U1513 and U1514, U1514, RF switch U1512, RF power amplifier U1505, U1401; 4. If the DRX TLE fault, plus welding or replace RF power amplifier U1608, and each band corresponding correspondin g filter; 5. The still unresolved, plus welding welding or replace RF transceiver chip MT6169 (U1301); 6. Re-welding or replace CPU (U101).
LTE failure
B40 PRX Fail Replace U1507、 U1401
Y
B1/3/4 TRX Fail Replace U1505，or U1504、U1513、
B5/8 TRX Fail Replace U1112、 U1508
Y
Y
B1/3/4 DRX Fail re-welding or replace U1608/U1605/U1606
Y
B5/8 DRX Fail re-welding or replace U1608/U1601/U1603
Y
Check MT6169（U1301）is welding good and body good, if not then re-welding or replace CPU（U101）
2 Assembly and disassembly instructions 2.1 Disassembly 2.1.1 Disassemble battery cover
2.1.2 Remove the battery
2.1.3 Disassemble rear cover First tighten the screws, and then separating the housing from the volume keys at the rear shell removed
Isolated housing with disassemble card
2.1.4 Loosen the MIC
2.1.5 Loosen the speaker
Using forceps at the arrows tilt the speaker. Be careful not to damage the speakers
2.1.6 Loosen the vibrator Using forceps loose motor
2.1.7 Dismantle the LCD connector Be careful not to damage the LCD FPC
2.1.8 Dismantle side key FPC connector Be careful not to damage the side buttons FPC
2.1.9 Dismantle TP connector Be careful not to damage the TP FPC
2.1.10 Dismantle rear camera connector Be careful not to damage the surrounding components
2.1.11 Loosen the MB screws
2.1.12 Separate MB front TP&LCD assembly Board separation process note to protect the rear camera FPC
2.1.13 De-soldering speaker
2.1.14 Dismantle front camera
2.1.15 De-soldering receiver and remove Soldering iron temperature controlled at about 320 ℃
2.1.16 De-soldering vibrator Soldering iron temperature controlled at about 320 ℃
2.1.17 De-soldering MIC Soldering iron temperature controlled at about 320 ℃
2.1.18 Tilt TP FPC
Use tweezers from arrow, tilt TP.
2.1.19 Dismantle side key The rubber-coated surface and the side buttons A shell using forceps to separate and remove the side buttons
2.1.20 Dismantle camera lens
2.1.21 Tear down battery compartment Mylar
2.1.22 Summary of demolition materials 1. TP&LCD assembly 2. Rear cover 3. Battery 4. MB 5. Battery cover 6. Speaker 7. Vibrator 8. MIC 9. Receiver 10. Rear camera 11. Front camera 12. Side key 13. Rear cover screws 14. MB screws 15. Camera lens 16. Battery compartment Mylar
2.2 Assembly guide Assembly and disassembly disassembly is just the opposite
