Website:http://biz.LGservice.com
COLOR MONITOR
SERVICE MANUAL CHASSIS NO. : LM76D
MODEL:
L177WSB (L177WSB-*FS.K***AP*) (
) **Same model for Service
CAUTION BEFORE SERVICING THE UNIT, READ THE SAFETY PRECAUTIONS IN THIS MANUAL.
CONTENTS SPECIFICATIONS SPECIFICA TIONS ................................................... 2
SERVICE OSD ........................................................14
PRECAUTIONS ....................................................... 3
TROUBLESHOOTING GUIDE .............................. 15
TIMING CHART ....................................................... 7 DISASSEMBL DISAS SEMBLY Y ...... ............. ............. ............. ............. ............. .............. ............. .......... .... 8 BLOCK DIAGRAM...................................................10
WIRING DIAGRAM ............................................... 21 EXPLODED VIEW...................................................22
DISCRIPTION OF BLOCK DIAGRAM DIAGRAM .................. 11
REPLACEMENT PARTS PARTS LIST ...............................24
ADJUSTMENT ...................................................... 13
SCHEMATIC DIAGRAM......................................... 26
SPECIFICATIONS 1. LCD CHARACTERISTICS Type : TFT Color LCD Module
4. Max. Resolution D-sub Analog
Acti Ac tive ve Dis Displ play ay Are Area a
: 17 17 inc inch h
Pixel Pitch
: 0.255 (H) x 0.255 (V)
Color Depth
: 8bits, 16.2M colors
Size
: 254.5 (H) x 389.2 (W) x 11.5(D)
Ele lect ctri rica call Int Inter erfa face ce
: LVD LVDS S
Surface Treatment
: Hard-coating(3H), Anti-Glare
Operating Mode
: Normally White, Transmissive mode
Backlight Unit
: 2-CCFL
5. POWER SUPPLY 5-1. Power : AC 100~240V, 50/60Hz , 0.8A 5-2. Power Consumption MODE
2. OPTICAL CHARACTERISTICS 2-1. Viewing Angle by Contrast Ratio
POWER ON (NORMAL)
10
Left : -70 min., -80 (Typ) Right : +70 min., +80 (Typ) Top :+60 min., +75 (Typ) Bottom : -70 min., -85 (Typ) °
°
2-2. Luminance
2-3. Contrast Ratio
°
°
°
°
5000:1
(DFC)
3. SIGNAL (Refer to the Timing Chart) 3-1. Sync Signal • Type : Separate Sync, SOG 3-2. Video Input Signal 1) Type 2) Voltage Le Level a) Color 0, 0 b) Color 7, 0 c) Color 15, 0 3) In Inpu putt Im Impe peda danc nce e
: R, G, B Analog : 0 ~ 0 .7 1 V : 0 Vp-p : 0.467Vp-p : 0.714Vp-p : 75 75
H/V SYNC VIDEO POWER CONSUMPTION LED COLOR ON/ON ACTIVE
less than 27 W
BLUE
STAND-BY
OFF/ON
OFF
less than 1 W
AMBER
SUSPEND
ON/OFF
OFF
less than 1 W
AMBER
DPMS OFF
OFF/OFF OFF
less than 1 W
AMBER
less than 1 W
OFF
POWER S/W Off
°
-
-
°
: 175(min), 250(Typ) (Full White pattern, 0.70V) -6500K : 110(min) (Full White pattern, 0.70V) -9300K 75%(min) :
: 1440 x 900@75Hz
6. ENVIRONMEN ENVIRONMENT T 6-1. Operating Temperature : 10 C~35 C (50 F~95 F) (Ambient) 6-2. 62. Rel Relat ativ ive e Humi Humidi ditty : 10%~ 10%~80 80% % (Non (Non-c -con onde dens nsin ing) g) 6-3. MTBF : 50,000 HRS with 90% Confidence Lamp Life : 50,000 Hours(Min) °
°
°
7. DIMENSIONS (with TILT/SWIVEL) Width Depth Height
: 409.3 mm (16.11'') : 204.0 mm (8.03'') : 362.0mm (14.25'')
8. WEIGHT (with TILT/SWIVEL) Net. Weight Gross Weight
3-3. Operating Frequency Horizontal : 30 ~ 83kHz Vertical : 56 ~ 75Hz
-2-
: 2.8 kg (6.17 lbs) : 4.0 kg (8.82 lbs)
°
PRECAUTION WARNING
WARNING FOR THE SAFETY-RELATED COMPONENT. • There There are some some speci special al compone components nts used used in LCD LCD monitor that are important for safety. These parts are marked on the schematic diagram and the replacement parts list. It is essential that these critical parts should be replaced with the manufacturer’s specified parts to prevent electric shock, fire or other hazard. • Do not modify modify origi original nal design design without without obtaining obtaining writ written ten permission from manufacturer or you will void the original parts and labor guarantee.
BE CAREFUL ELECTRIC SHOCK ! • If you want to to replace replace with with the new new backlight backlight (CCFL (CCFL)) or inverter circuit, must disconnect the AC adapter because high voltage appears at inverter circuit about 650Vrms. • Handle with care wires or connector connectors s of the inverter inverter circuit. If the wires are pressed cause short and may burn or take fire.
Leakage Current Hot Check Circuit
TAKE CARE DURING HANDLING THE LCD MODULE WITH BACKLIGHT UNIT.
AC Volt-meter
• Must mount the module module using mount mounting ing holes holes arrang arranged ed in four corners. • Do not press press on the panel, edge of the frame frame strongl strongly y or electric shock as this will result in damage to the screen. • Do not scr scratch atch or or press press on the panel panel with with any shar sharp p objects, such as pencil or pen as this may result in damage to the panel. • Protect Protect the the module module from from the ESD ESD as it may damage the electronic circuit (C-MOS). • M a k e ce ce r t a in in t h a t tr tr e a t me me n t p e rs rs o n ’ s b o d y a re re grounded through wrist band. • Do not leave the module module in in high temper temperature ature and in areas of high humidity for a long time. • The module module not be expos exposed ed to the direct direct sunli sunlight. ght. • Avoid contac contactt with water as as it may may a short short circui circuitt within within the module. • If the surf surface ace of panel become become dirty dirty,, please please wipe wipe it off off with a softmaterial. (Cleaning with a dirty or rough cloth may damage the panel.)
CAUTION Please use only a plastic screwdriver to protect yourself from shock hazard during service operation.
-3-
Good Earth Ground such as WATER PIPE, CONDUIT etc.
To Instrument’s exposed METALLIC PARTS
1.5 Kohm/10W
SERVICING PRECAUTIONS CAUTION: Before servicing receivers covered by this service manual and its supplements and addenda, read and follow the SAFETY PRECAUTIONS on page 3 of this publication. NOTE: If unforeseen circumstances create conflict between the following servicing precautions and any of the safety precautions on page 3 of this publication, always follow the safety precautions. Remember: Safety First. General Servicing Precautions 1. Always unplug the receiver AC power cord from the AC power source before; a. Removing or reinstalling any component, circuit board module or any other receiver assembly. b. Disconnecting or reconnecting any receiver electrical plug or other electrical connection. c. Connecting a test substitute in parallel with an electrolytic capacitor in the receiver. CAUTION: A wrong part substitution or incorrect polarity installation of electrolytic capacitors may result in an explosion hazard. d. Discharging the picture tube anode. 2. Test high voltage only by measuring it with an appropriate high voltage meter or other voltage measuring device (DVM, FETVOM, etc) equipped with a suitable high voltage probe. Do not test high voltage by "drawing an arc". 3. Discharge the picture tube anode only by (a) first connecting one end of an insulated clip lead to the degaussing or kine aquadag grounding system shield at the point where the picture tube socket ground lead is connected, and then (b) touch the other end of the insulated clip lead to the picture tube anode button, using an insulating handle to avoid personal contact with high voltage. 4. Do not spray chemicals on or near this receiver or any of its assemblies. 5. Unless specified otherwise in this service manual, clean electrical contacts only by applying the following mixture to the contacts with a pipe cleaner, cottontipped stick or comparable non-abrasive applicator; 10% (by volume) Acetone and 90% (by volume) isopropyl alcohol (90%-99% strength) CAUTION: This is a flammable mixture. Unless specified otherwise in this service manual, lubrication of contacts in not required. 6. Do not defeat any plug/socket B+ voltage interlocks with which receivers covered by this service manual might be equipped. 7. Do not apply AC power to this instrument and/or any of its electrical assemblies unless all solid-state device heat sinks are correctly installed. 8. Always connect the test receiver ground lead to the receiver chassis ground before connecting the test receiver positive lead. Always remove the test receiver ground lead last.
9. Use with this receiver only the test fixtures specified in this service manual. CAUTION: Do not connect the test fixture ground strap to any heat sink in this receiver. Electrostatically Sensitive (ES) Devices Some semiconductor (solid-state) devices can be damaged easily by static electricity. Such components commonly are called Electrostatically Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some field-effect transistors and semiconductor "chip" components. The following techniques should be used to help reduce the incidence of component damage caused by static by static electricity. 1. Immediately before handling an y semiconductor component or semiconductor-equipped assembly, drain off any electrostatic charge on your body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging wrist strap device, which should be removed to prevent potential shock reasons prior to applying power to the unit under test. 2. After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as aluminum foil, to prevent electrostatic charge buildup or exposure of the assembly. 3. Use only a grounded-tip soldering iron to solder or unsolder ES devices. 4. Use only an anti-static type solder removal device. Some solder removal devices not classified as "antistatic" can generate electrical charges sufficient to damage ES devices. 5. Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ES devices. 6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most replacement ES devices are packaged with leads electrically shorted together by conductive foam, aluminum foil or comparable conductive material). 7. Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material to the chassis or circuit assembly into which the device will be installed. CAUTION: Be sure no power is applied to the chassis or circuit, and observe all other safety precautions. 8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise harmless motion such as the brushing together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity sufficient to damage an ES device.)
-4-
General Soldering Guidelines 1. Use a grounded-tip, low-wattage soldering iron and appropriate tip size and shape that will maintain tip temperature within the range or 500 F to 600 F. 2. Use an appropriate gauge of RMA resin-core solder composed of 60 parts tin/40 parts lead. 3. Keep the soldering iron tip clean and well tinned. 4. Thoroughly clean the surfaces to be soldered. Use a mall wire-bristle (0.5 inch, or 1.25cm) brush with a metal handle. Do not use freon-propelled spray-on cleaners. 5. Use the following unsoldering technique a. Allow the soldering iron tip t o reach n ormal temperature. (500 F to 600 F) b. Heat the component lead until the solder melts. c. Quickly draw the melted solder with an anti-static, suction-type solder removal device or with solder braid. CAUTION: Work quickly to avoid overheating the circuitboard printed foil. 6. Use the following soldering technique. a. Allow the soldering iron tip to reach a normal temperature (500 F to 600 F) b. First, hold the soldering iron tip and solder the strand against the component lead until the solder melts.
c. Quickly move the soldering iron tip to the junction of the component lead and the printed circuit foil, and hold it there only until the solder flows onto and around both the component lead and the foil. CAUTION: Work quickly to avoid overheating the circuit board printed foil. d. Closely inspect the solder area and remove any excess or splashed solder with a small wire-bristle brush. IC Remove/Replacement Some chassis circuit boards have slotted holes (oblong) through which the IC leads are inserted and then bent flat against the circuit foil. When holes are the slotted type, the following technique should be used to remove and replace the IC. When working with boards using the familiar round hole, use the standard technique as outlined in paragraphs 5 and 6 above. Removal 1. Desolder and straighten each IC lead in one operation by gently prying up on the lead with the soldering iron tip as the solder melts. 2. Draw away the melted solder with an anti-static suction-type solder removal device (or with solder braid) before removing the IC.
Replacement 1. Carefully insert the replacement IC in the circuit board. 2. Carefully bend each IC lead against the circuit foil pad and solder it. 3. Clean the soldered areas with a small wire-bristle brush. (It is not necessary to reapply acrylic coating to the areas). "Small-Signal" Discrete Transistor Removal/Replacement 1. Remove the defective transistor by clipping its leads as close as possible to the component body. 2. Bend into a "U" shape the end of each of three leads remaining on the circuit board. 3. Bend into a "U" shape the replacement transistor leads. 4. Connect the replacement transistor leads to the corresponding leads extending from the circuit board and crimp the "U" with long nose pliers to insure metal to metal contact then solder each connection. Power Output, Transistor Device Removal/Replacement 1. Heat and remove all solder from around the transistor leads. 2. Remove the heat sink mounting screw (if so equipped). 3. Carefully remove the transistor from the heat sink of the circuit board. 4. Insert new transistor in the circuit board. 5. Solder each transistor lead, and clip off excess lead. 6. Replace heat sink. Diode Removal/Replacement 1. Remove defective diode by clipping its leads as close as possible to diode body. 2. Bend the two remaining leads perpendicular y to the circuit board. 3. Observing diode polarity, wrap each lead of the new diode around the corresponding lead on the circuit board. 4. Securely crimp each connection and solder it. 5. Inspect (on the circuit board copper side) the solder joints of the two "original" leads. If they are not shiny, reheat them and if necessary, apply additional solder. Fuse and Conventional Resistor Removal/Replacement 1. Clip each fuse or resistor lead at top of the circuit board hollow stake. 2. Securely crimp the leads of replacement component around notch at stake top. 3. Solder the connections. CAUTION: Maintain original spacing between the replaced component and adjacent components and the circuit board to prevent excessive component temperatures.
-5-
Circuit Board Foil Repair Excessive heat applied to the copper foil of any printed circuit board will weaken the adhesive that bonds the foil to the circuit board causing the foil to separate from or "lift-off" the board. The following guidelines and procedures should be followed whenever this condition is encountered. At IC Connections To repair a defective copper pattern at IC connections use the following procedure to install a jumper wire on the copper pattern side of the circuit board. (Use this technique only on IC connections). 1. Carefully remove the damaged copper pattern with a sharp knife. (Remove only as much copper as absolutely necessary). 2. carefully scratch away the solder resist and acrylic coating (if used) from the end of the remaining copper pattern. 3. Bend a small "U" in one end of a small gauge jumper wire and carefully crimp it around the IC pin. Solder the IC connection. 4. Route the jumper wire along the path of the out-away copper pattern and let it overlap the previously scraped end of the good copper pattern. Solder the overlapped area and clip off any excess jumper wire.
At Other Connections Use the following technique to repair the defective copper pattern at connections other than IC Pins. This technique involves the installation of a jumper wire on the component side of the circuit board. 1. Remove the defective copper pattern with a sharp knife. Remove at least 1/4 inch of copper, to ensure that a hazardous condition will not exist if the jumper wire opens. 2. Trace along the copper pattern from both sides of the pattern break and locate the nearest component that is directly connected to the affected copper pattern. 3. Connect insulated 20-gauge jumper wire from the lead of the nearest component on one side of the pattern break to the lead of the nearest component on the other side. Carefully crimp and solder the connections. CAUTION: Be sure the insulated jumper wire is dressed so the it does not touch components or sharp edges.
-6-
TIMING CHART
VIDEO
A E D
B
SYNC C
DOT mode
section
polarity
CLOCK [MHz]
1
H(P ixels)
+
V(Lines)
-
H(P ixels )
-
2 V(Lines)
+
H(P ixels )
-
V(Lines)
-
H(P ixels )
-
9
10
11
12
Resol -
Porch
.
Porch
ution
(D )
(C )
(B )
640
16
96
48
640
449
350
37
2
60
350
31.468
900
720
18
108
54
720
70.08
449
400
12
2
35
400
31.469
800
640
16
96
48
640
59.94
525
480
10
2
33
480
37.5
840
640
16
64
120
640
75
500
480
1
3
16
480
37.879
1056
800
40
128
88
800
60.317
628
600
1
4
23
600
46.875
1056
800
16
80
160
800
75.0
625
600
1
3
21
600
49.725
1152
832
32
64
224
832
74.55
667
624
1
3
39
624
48.363
1344
1024
24
136
160
1024
60.0
806
768
3
6
29
768
60.123
1312
1024
16
96
176
1024
75.029
800
768
1
3
28
768
68.681
1456
1152
32
128
144
1152
75.062
915
870
3
3
39
870
61.805
1504
1152
18
134
200
1152
65.96
937
900
2
4
31
900
63.981
1688
1280
48
112
248
1280
60.02
1066
1024
1
3
38
1024
[kHz] /[Hz]
Period (E) (A)
31.469
800
70.09
x
X
x
x
31.5 V(Lines)
-
H(P ixels )
+
5
8
Back
Display
25.175
4
7
Syn c
Total
28.321
3
6
25.175
Front
Freque ncy
x
40.0 V(Lines)
+
H(P ixels)
+
V(Lines)
+
H(P ixels)
+/-
V(Lines)
+/-
H(P ixels)
-
V(Lines)
-
H(P ixels)
-
V(Lines)
-
H(P ixels)
+/-
V(Lines)
+/-
H(P ixels)
+/-
V(Lines)
+/-
H(P ixels)
+
V(Lines)
+
49.5
57.283
65.0
78.75
100.0
92.978
108.0
- 7-
x
x
x
x
x
x
x
DISASSEMBLY 1. Put a cushion or soft cloth on a flat
2. Place the monitor face down on
surface.
the cushion or soft cloth.
3. Slide the Cable Deco Cover out from the stand body.
4. Nip Latch inside, Take off the stand base from stand body.
5. Please pull the stand body lightly
6. Remove the screws.
to separate it from the hinge body.
7. Pull the front cover upward,then separate all the latches.
8. Place the monitor face down,then disassemble back cover.
-8-
BLOCK DIAGRAM
l u d o M e z H 0 6 @ 0 0 9 * 0 4 4 1
Y E K
S D V L
e c a f r e t n i
e c S l a e f D n r V a t e L P n I
M O R h s a l F
U C M
l a t s y r C
r o t k a c r o e l C n e G
L H W C 8 5 U M U S T
g n y i a s e n l i p s e g s i c n D o r E P
D S O e e l c a i n a f u r e g n D t E n I
A T K L A C D S S /
V 3 . 3
) B / G / R ( g o l a n A
z H M 8 1 3 . 4 1
) M m O e t R P s y E S E (
V 8 . 1
V 3 . 3
V 3 . 3
V 3 . 3
V 8 . 1
r e r t o t t i S a m l D u s V g n L e a r R T V 5
V V 5 2 1
V 2 1
) c n y s H / c n y s V ( g o l a n A
S P I L r e t l i F
b u S - D
-9-
) s p m a L 2 ( r e t r e v n I
BLOCK DIAGRAM-POWER
P M A L
h g i H
V 3 1
t k c p n a b r m e r d a u e L C e F
r e s t r n e a r v T n I
n o i r e t g e t a v l c e O o t V o r P
R E T R E V N I
w o L
h c N
h c P
k c o l B e v i r D
r l e o t r r t e n C v o I n C I
V 2 1
V 5
S P M S
R E W O P
V V 2 5 1
c c V e l u d o M
) l o r t n o C t ) n r V e 3 . r u 3 ( C F p F m O a / n L ( O g r i e n t r m e m v i n D I
x u A
k c a b d e e F
e v i r D
t r r l o a e t r t w n C I S o o P C
d r & ) r a r C t e o e D r e B l v n a c C i D n a S o ( c M
- 10 -
r e t l i F e n i L
N L
DESCRIPTION OF BLOCK DIAGRAM 1. Video Controller Part. This part amplifies the level of video signal for the digital conversion and converts from the analog video signal to the digital video signal using a pixel clock. The pixel clock for each mode is generated by the PLL. The range of the pixel clock is from 25MHz to 136MHz. This part consists of the Scaler, ADC convertor, TMDS receiver and LVDS transmitter. The Scaler gets the video signal converted analog to digital, interpolates input to 1440 X 900 resolution signal and outputs 8-bit R, G, B signal to transmitter. 2. Power Part. This part consists of the one 3.3V, and one 1.8V regulators to convert power which is provided 5V in Power board. 12V is provided for inverter, 5V is provided for LCD panel. Also, 5V is converted 3.3V and 1.8V by regulator. Converted power is provided for IC in the main board. The inverter converts from DC12V to AC 700Vrms and ope rates back-light lamps of module. 3. MICOM Part. This part is include video controller part. And this part consists of EEPROM IC which stores control data, Reset IC and the Micom. The Micom distinguishes polarity and frequency of the H/V sync are supplied from signal cable. The controlled data of each modes is stored in EEPROM.
- 11 -
LIPS Board Block Diagram
12V 50 ~ 60Hz
LINE 100 ~ 240V
EMI COMPONENTS
INPUT RECTIFIER AND FILTER
HVDC
SWITCHING TRANSFORMER
100KHz
OUTPUT RECTIFIER AND FILTER
5V GND
PWM CONTROL CIRCUIT
PHOTO-COUPLER ISOLATION
PRIMARY
12V
SIGNAL COLLENTION
SECONDARY
INVERTER CIRCUIT
High Voltage
Operation description_LIPS 1. EMI components. This part contains of EMI components to comply with global marketing EMI standards like FCC,VCCI CISPR, the circuit included a line-filter, across line capacitor and of course the primary protection fuse. 2. Input rectifier and filter. This part function is for transfer the input AC voltage to a DC voltage through a bridge rectifier and a bulk capacitor. 3. Energy Transfer. This part function is for transfer the primary energy to secondary through a power transformer. 4. Output rectifier and filter. This part function is to make a pulse width modulation control and to provide the driver signal to power switch, to adjust the duty cycle during different AC input and output loading condition to achieve the dc output stabilized, and also the over power protection is also monitor by this part. 5. Photo-Coupler isolation. This part function is to feed back the DC output changing status through a photo transistor to primary controller to achieve the stabilized DC output voltage. 6. Signal collection. This part function is to collect the any change from the DC output and feed back to the primary through photo transistor.
- 12 -
ADJUSTMENT Windows EDID V1.0 User Manual
2. EDID Read & Write 1) Run WinEDID.exe
Operating System: MS Windows 98, 2000, XP Port Setup: Windows 98 => Don’t need setup Windows 2000, XP => Need to Port Setup. This program is available to LCD Monitor only. 1. Port Setup a) Copy “UserPort.sys” file to “c:\WINNT\system32\drivers” folder b) Run Userport.exe
2) Edit Week of Manufacture, Year of Manufacture, Serial Number a) Input User Info Data b) Click “Update” button c) Click “ Write” button
c) Remove all default number d) Add 300-3FF
e) Click Start button. f) Click Exit button.
- 13 -
SERVICE OSD 1) Turn off the power switch at the front side of the display. 2) Wait for about 5 seconds and press MENU, POWER switch with 1 second interval. 3) The SVC OSD menu contains additional menus that the User OSD menu as described below. a) Auto Color : W/B balance and Automatically sets the gain and offset value. b) NVRAM INIT : EEPROM initialize.(24C08) c) CLEAR ETI : To initialize using time. d) AGING : Select Aging mode(on/off). e) R/G/B-9300K : Allows you to set the R/G/B-9300K value manually. f) R/G/B-6500K : Allows you to set the R/G/B-6500K value manually. g) R/G/B-Offset : Allows you to set the R/G/B-Offset value manually.(Analog Only) h) R/G/B-Gain : Allows you to set the R/G/B-Gain value manually.(Analog Only) i) MODULE : To select applied module.
A 9
IBM Compatible PC
Video Signal Generator
15
11
10 1
C
PARALLEL PORT
d s e t u C o 2 N 3 2 S
13
1
25
R
C
1
6
5
e n i L l o r t n o C
6
5
5V
L E L L A R A P
OFF
14
ON
F Power inlet (required)
5V
2 2 0
V G S
A
R E W O P T S M O C N I N T O Y R V S
Power Select Switch (110V/220V) Power LED
ON
E 4.7K
OFF 74LS06
B
E ST Switch
B F V-Sync On/Off Switch (Switch must be ON.)
Figure 1. Cable Connection
- 14 -
4.7K 4.7K
5V
74LS06
TROUBLESHOOTING GUIDE 1. NO POWER - MAIN
NO POWER (POWER INDICATOR OFF)
CHECK J703 VOLTAGE PIN5, PIN6 (5V)?
NO
CHECK POWER BOARD, AND FIND OUT A SHORT POINT AS OPENING EACH POWER LINE
YES
CHECK U601 PIN2 VOLTAGE (3.3V) ?
NO
CHECK 3.3V LINE (OPEN CHECK) NO PROBLEM
YES CHECK KEY CONTROL CONNECTOR ROUTINE
IS U201 PIN75 (3.3V) VOLTAGE ?
NO
CHECK 3.3V LINE
YES
1
CHECK U201 PIN PULSE
96
NO
YES
CHECK U201
Waveforms 1
U201-#96
- 15 -
CHECK X-TAL
2. NO RASTER (OSD IS NOT DISPLAYED) – LIPS
NO RASTER (OSD IS NOT DISPLAYED)
J703 PIN5, PIN6 5V?
NO
CHECK POWER BOARD, AND FIND OUT A SHORT POINT AS OPENING EACH POWER LINE
YES
J703 PIN9 5V?
NO
CHECK MICOM INV ON/OFF PORT.
YES
J703 PIN10 5V?
NO
1. CONFIRM BRIGHTNESS OSD CONTRL STATE. 2. CHECK MICOM DIM-ADJ PORT
YES
CHECK PULSE AS CONTACTING SCOPE PROBE TO CAUTION LABEL. (CONTACT PROBE TO CAUTION LABEL. CAN YOU SEE PULSE AT YOUR SCOPE?
NO
YES
REPLACE CCFL LAMP IN THE LCD MODULE
- 16 -
LIPS
3. NO RASTER (OSD IS NOT DISPLAYED) – MAIN
NO RASTER (OSD IS NOT DISPLAYED)
U201 PIN 16, 75 3.3V?
NO
CHECK U601
YES
U201 PIN96, 97 OSCILLATE AS 14.31MHZ?
1
1. CHECK C 509, C510 SOLDERING CONDITION 2. CHECK X 501 3. TROUBLE IN U201
NO
YES
2
U201 PIN27 IS 48KHz H-SYNC? PIN28 IS 60Hz V-SYNC? IS PULSE APPEARED AT SIGNAL PINS? AT MODE 12?
CHECK CONNECTION LINE FROM D-SUB TO U201
NO
YES
TROUBLE IN CABLE OR LCD MODULE
Waveforms 1
U201-#96, 97
2
2
U201-#27 H-SYNC
- 17 -
U201-#28 V-SYNC
4. TROUBLE IN DPM - MAIN
TROUBLE IN DPM
NO
CHECK R730, R731
3
CHECK PC PC IS NOT GOING INTO DPM OFF MODE
YES
CHECK U201 PIN 27,28 SYNC PULSE ?
NO
YES
TROUBLE IN U201
Waveforms 3
R442 H-Sync
3
R443 V-Sync
- 18 -
CHECK H/V SYNC LINE
5. POWER - LIPS
NO POWER (POWER INDICATOR OFF)
CHECK Fuse F101 OK?
NO
Trouble in Fuse (F101)
YES
CHECK C101 Voltage (AC110V->160Vdc (AC220V->304Vdc
NO
Check BD101
YES
Check IC101 PIN5 Voltage
NO
Trouble in IC101
YES
Check D201, D202 Voltage
NO
YES
CHECK 5V, 12V Line
- 19 -
Trouble in D201, D202
6. Raster - LIPS
NO Raster (Lamp Off)
CHECK P201 Pin9
NO
3.3V?
Check Scaler Output (Main Board)
YES
Check IC301 Pin2
NO
Check Q301, Q302
5V?
YES
Check U301 Pin6 VSEN, Less than 3V
NO
Check the waveform of U301 Pin1, 15
NO
Check the waveform of U301 Pin2, 3
YES
Check U301 Pin12 SSTCMT, Less than 1V
If waveform is no problem
Check U301 Drain waveform
NO
YES
CHECK T301
- 20 -
Check D304 Or Trouble in U301
WIRING DIAGRAM
30P
11P
6631T20023J
6P
66319000 30F
4P
6631V12031H
- 21 -
EAD37413101
EXPLODED VIEW
0 0 4
0 2 4
0 1 4
0 2 9
0 1 5 0 0 9
0 2 5
0 3 9
0 1 9
0 3 4
0 0 2
0 0 5
0 0 3 0 1 3
- 22 -
EXPLODED VIEW PARTS LIST Ref. No.
200
300
Part No.
Description
EAJ38936201
LCD,Module-TFT,LM171WX3-TLA1 WXGA 17.1INCH 1280X720 250CD COLOR 60% 16/10 800:1 LPL 17"W response time :8ms,P4,Color Depth:16.7M. Viewing Angle:160/160 LG PHILIPS LCD
EAJ39167201
LCD,Module-TFT,HSD170MGW1-B00 WXGA 17.0INCH 1440X900 250CD COLOR 63% 16/10 600:1 Hannstar 17"W ZBD, 2CCFL(Edge type),16.2M, Viewing Angle 80/80/80/80. Non-Glare. HANNSTAR DISPLAY CORPORATION
EAJ39167202
LCD,Module-TFT,HSD170MGW1- B00 WXGA 17.0INCH 1440X900 250CD COLOR 63% 16/10 600:1 Hannstar 17"W Non-ZBD, 2CCFL(Edge type),16.2M, Viewing Angle 80/80/80/80, Non-Glare HANNSTAR DISPLAY CORPORATION
EAJ39167203
LCD,Module-TFT,HSD170MGW1-B01 WXGA 17.0INCH 1440X900 250CD COLOR 63% 16/10 600:1 Hannstar 17"W, ZBD, 2CCFL(Edge type),16.2M, Viewing Angle 80/80/80/80. Non-Glare. Source/Gate IC : Novatek. HANNSTAR DISPLAY CORPORATION
EAJ39167204
LCD,Module-TFT,HSD170MGW1- B01 WXGA 17.0INCH 1440X900 250CD COLOR 63% 16/10 600:1 Hannstar 17"W Non-ZBD, 2CCFL(Edge type),16.2M, Viewing Angle 80/80/80/80. Non-Glare.Source/Gate IC : Novatek HANNSTAR DISPLAY CORPORATION
ABJ34560301
Cabinet Assembly,L177WSB . 17" Cabinet Assy black NT local
MFB38581401
Lens,MOLD PMMA SAMSUNG TECHWIN LENS Lx72 / Lx7w lens , power LED Knob Double injection Power LED for L1972, Lxx7W
MFB38581403
Lens,MOLD PMMA SAMSUNG TECHWIN LENS Lx72 / Lx7w lens , power LED Knob Double injection Power LED for L1972, Lxx7W-"01" for CKD
310
400
ACQ34560801 Cover Assembly,Rear,L177WSB . 17" Back cover Assy Black NT local
410
ADV33844405
Frame Assembly,L177WSB . 17" L177WSB REAR FRAME ASSY LPL-HSD
MAZ40651001
Bracket,PRESS SBHG 0.6T BRACKET L177WSB - SBHG L177WSB Metal Bracket HSD
MAZ39062501
Bracket,PRESS SBHG 0.6 BRACKET L177W - SBHG L177W Metal Bracket
420
430
MDQ39702401 Frame,PRESS SPTE 0.3t L177WSB. SUS L177WSB Lamp Wire Shield(Metal) Set
500
EBR38509601
Upper SMT PCB,CONTROL S.T - L177WS
510
EBR39262801
PCB Assembly,MAIN T.T S chassis L177WSB BFS
520
EAY38422101
Power Supply Assembly,FREE L177WS LCD Lianchang
900
ACQ33707104 Cover Assembly,L177WS/WSB LM57B 19" Cover, Hinge Assy, Normal Stand, L177W ND Local
910
MCK38601901 Cover,MOLD ABS L1954 ABS L1954 COVER, STAND BODY
920
MCK38602601 Cover ,MOLD ABS L1954 ABS L1954, COVER CABLE
930
AAN33777301
Base Assembly ,ASSY L177W - L177W Stand base Assy_black
- 23 -
REPLACEMENT PARTS LIST
DATE:2007.07.20 L OC N O.
PA RT NO .
CAPACITORs C501 0CK104CK56A
C502 C503 C504 C505 C506 C507 C508 C509 C510 C511 C512 C513 C514 C515 C516 C517 C518 C519 C520 C521 C522 C523 C524 C525 C526 C527 C601 C602 C603 C604 C605 C702 C703 C704 C705 C706 C720 C721 C722 C723
DES CRI PT IO N/ SP ECI FI CATI ON
LO C NO .
“Capacitor,Ceramic,Chip,0603B104K500CT 100nF”
0CK473CK56A 0CK473CK56A 0CK473CK56A 0CK473CK56A 0CC102CK41A 0CK473CK56A 0CK473CK56A 0CC220CK41A 0CC220CK41A 0CK104CK56A 0CE106CF638 0CK104CK56A 0CK104CK56A 0CK104CK56A 0CK104CK56A 0CK104CK56A 0CK104CK56A 0CK104CK56A 0CK104CK56A 0CK104CK56A 0CK104CK56A 0CK104CK56A 0CK104CK56A 0CK104CK56A 0CK104CK56A 0CK104CK56A 0CE107EF610 0CK103CK51A 0CK475CC94A 0CE107EF610 0CE477EF638 0CK103CK51A 0CK103CK51A 0CK104CK56A 0CK105CD56A 0CC101CK41A 0CC680CK41A 0CC680CK41A 0CC680CK41A 0CC680CK41A
“Capacitor,Ceramic,Chip,C1608X7R1H473KT 47nF” “Capacitor,Ceramic,Chip,C1608X7R1H473KT 47nF” “Capacitor,Ceramic,Chip,C1608X7R1H473KT 47nF” “Capacitor,Ceramic,Chip,C1608X7R1H473KT 47nF” “Capacitor,Ceramic,Chip,C1608C0G1H102JT 1nF” “Capacitor,Ceramic,Chip,C1608X7R1H473KT 47nF” “Capacitor,Ceramic,Chip,C1608X7R1H473KT 47nF” “Capacitor,Ceramic,Chip,C1608C0G1H220JT 22pF” “Capacitor,Ceramic,Chip,C1608C0G1H220JT 22pF” “Capacitor,Ceramic,Chip,0603B104K500CT 100nF” “Capacitor,AL,Radial,SHL5.0TP16VB10M 10uF” “Capacitor,Ceramic,Chip,0603B104K500CT 100nF” “Capacitor,Ceramic,Chip,0603B104K500CT 100nF” “Capacitor,Ceramic,Chip,0603B104K500CT 100nF” “Capacitor,Ceramic,Chip,0603B104K500CT 100nF” “Capacitor,Ceramic,Chip,0603B104K500CT 100nF” “Capacitor,Ceramic,Chip,0603B104K500CT 100nF” “Capacitor,Ceramic,Chip,0603B104K500CT 100nF” “Capacitor,Ceramic,Chip,0603B104K500CT 100nF” “Capacitor,Ceramic,Chip,0603B104K500CT 100nF” “Capacitor,Ceramic,Chip,0603B104K500CT 100nF” “Capacitor,Ceramic,Chip,0603B104K500CT 100nF” “Capacitor,Ceramic,Chip,0603B104K500CT 100nF” “Capacitor,Ceramic,Chip,0603B104K500CT 100nF” “Capacitor,Ceramic,Chip,0603B104K500CT 100nF” “Capacitor,Ceramic,Chip,0603B104K500CT 100nF” “Capacitor,AL,Radial,KMG16VB100M 100uF 20” “Capacitor,Ceramic,Chip,0603B103K500CT 10nF” “Capacitor,Ceramic,Chip,C1608Y5V0J475ZT 4.7u” “Capacitor,AL,Radial,KMG16VB100M 100uF 20” “Capacitor,AL,Radial,KMG5.0TP16VB470M 470” “Capacitor,Ceramic,Chip,0603B103K500CT 10nF” “Capacitor,Ceramic,Chip,0603B103K500CT 10nF” “Capacitor,Ceramic,Chip,0603B104K500CT 100nF” “Capacitor,Ceramic,Chip,C1608X7R1A105KT 1uF” “Capacitor,Ceramic,Chip,C1608C0G1H101JT 100p” “Capacitor,Ceramic,Chip,C1608C0G1H680JT 68pF” “Capacitor,Ceramic,Chip,C1608C0G1H680JT 68pF” “Capacitor,Ceramic,Chip,C1608C0G1H680JT 68pF” “Capacitor,Ceramic,Chip,C1608C0G1H680JT 68pF”
0DSIH00018A 0DSIH00018A 0DSIH00018A 0DZ560009GB 0DZ560009GB 0DZ560009GB 0DZ560009GB 0DZ560009GB 0DZ560009GB 0DZ560009GB 0DZ560009GB 0DZ560009GB 0DZ560009GB 0DZ560009GB 0DZ560009GB 0DZ560009GB
“Diode,Switching,ENKMC2837-T112 1.2V” “Diode,Switching,ENKMC2837-T112 1.2V” “Diode,Switching,ENKMC2837-T112 1.2V” “Diode,Zener,BZT52C5V6S-(F) 5.6V” “Diode,Zener,BZT52C5V6S-(F) 5.6V” “Diode,Zener,BZT52C5V6S-(F) 5.6V” “Diode,Zener,BZT52C5V6S-(F) 5.6V” “Diode,Zener,BZT52C5V6S-(F) 5.6V” “Diode,Zener,BZT52C5V6S-(F) 5.6V” “Diode,Zener,BZT52C5V6S-(F) 5.6V” “Diode,Zener,BZT52C5V6S-(F) 5.6V” “Diode,Zener,BZT52C5V6S-(F) 5.6V” “Diode,Zener,BZT52C5V6S-(F) 5.6V” “Diode,Zener,BZT52C5V6S-(F) 5.6V” “Diode,Zener,BZT52C5V6S-(F) 5.6V” “Diode,Zener,BZT52C5V6S-(F) 5.6V”
EAN39545901 EAN37157001 0IMMR00203A 0IPMGA0010A 0IPMG00049A
“IC,Protocol Controller,TSUMU58BWHL-LF -0.3T” “IC,Serial Flash Memory,W25X20VSNIG 2MBIT 25” “IC,EEPROM,FM24C08 8KBIT 1KX8BI” “IC,LDO Voltage Regulator,AZ1117H-3.3 4.75TO10” “IC,LDO Voltage Regulator,AZ1117H-”
DIODEs
D711 D712 D713 ZD1 ZD2 ZD3 ZD4 ZD5 ZD6 ZD7 ZD705 ZD706 ZD707 ZD709 ZD710 ZD8 ICs
U201 U502 U503 U601 U602
PART N O.
DES CRI PT IO N/ SP ECI FI CATO N
TRANSISTORs
Q501 Q601 Q602 Q701 Q702
0TRKE80046A 0TRKE80046A 0TR127309AA 0TR390609DC 0TR390609DC
“TR,Bipolar,2N3904S NPN 6V 60V 4” “TR,Bipolar,2N3904S NPN 6V 60V 4” “TR,Bipolar,KTA1273 PNP -5V -30V” “TR,Bipolar,2N3906S-RTK PNP -5V” “TR,Bipolar,2N3906S-RTK PNP -5V”
RESISTORs
R1 R2 R3 R4 R5 R501 R502 R503 R504 R505 R506 R507 R508 R509 R510 R511 R512 R513 R514 R515 R516 R517 R518 R519 R520 R521 R522 R524 R525 R6 R601 R602 R603 R604 R605 R606 R607 R608 R701 R702 R703 R704 R705 R706 R707 R708 R709 R710 R711 R726 R727 R728 R729 R730 R731 R732 R733 R734
- 24 -
0RJ7501D677 0RJ7501D677 0RJ1201D677 0RJ1801D677 0RJ1201D677 0RJ0562D677 0RJ0562D677 0RJ0562D677 0RJ0562D677 0RJ1001D677 0RJ0562D677 0RJ0562D677 0RJ1002D677 0RJ3900D677 0RJ4700D677 0RJ2002D677 0RJ1002D677 0RJ1002D677 0RJ1002D677 0RJ1002D677 0RJ4701D677 0RJ4701D677 0RJ1000D677 0RJ4701D677 0RJ0332D677 0RJ0332D677 0RJ4701D677 0RJ0000D677 0RJ0000D677 0RJ1801D677 0RJ2001D677 0RJ3900D677 0RJ3900D677 0RJ1002D677 0RX0681K668 0RJ0000D677 0RH1002D622 0RJ1002D677 0RJ0000D677 0RJ4701D677 0RJ4701D677 0RJ1200D677 0RJ1200D677 0RJ1000D677 0RJ1000D677 0RJ1000D677 0RJ2001D677 0RJ4701D677 0RJ4701D677 0RJ4701D677 0RJ4701D677 0RJ0332D677 0RJ0000D677 0RJ0682D677 0RJ0682D677 0RJ0332D677 0RJ0752D677 0RJ0752D677
“Resistor,Chip,MCR03EZPJ752 7.5KOHM” “Resistor,Chip,MCR03EZPJ752 7.5KOHM” “Resistor,Chip,MCR03EZPJ122 1.2KOHM” “Resistor,Chip,MCR03EZPJ182 1.8KOHM” “Resistor,Chip,MCR03EZPJ122 1.2KOHM” “Resistor,Chip,MCR03EZPJ560 56OHM 5” “Resistor,Chip,MCR03EZPJ560 56OHM 5” “Resistor,Chip,MCR03EZPJ560 56OHM 5” “Resistor,Chip,MCR03EZPJ560 56OHM 5” “Resistor,Chip,MCR03EZPJ102 1KOHM 5” “Resistor,Chip,MCR03EZPJ560 56OHM 5” “Resistor,Chip,MCR03EZPJ560 56OHM 5” “Resistor,Chip,MCR03EZPJ103 10KOHM” “Resistor,Chip,MCR03EZPJ391 390OHM” “Resistor,Chip,MCR03EZPJ471 470OHM” “Resistor,Chip,MCR03EZPJ203. 20KOHM” “Resistor,Chip,MCR03EZPJ103 10KOHM” “Resistor,Chip,MCR03EZPJ103 10KOHM” “Resistor,Chip,MCR03EZPJ103 10KOHM” “Resistor,Chip,MCR03EZPJ103 10KOHM” “Resistor,Chip,MCR03EZPJ472 4.7KOHM” “Resistor,Chip,MCR03EZPJ472 4.7KOHM” “Resistor,Chip,MCR03EZPJ101 100OHM” “Resistor,Chip,MCR03EZPJ472 4.7KOHM” “Resistor,Chip,MCR03EZPJ330 33OHM 5” “Resistor,Chip,MCR03EZPJ330 33OHM 5” “Resistor,Chip,MCR03EZPJ472 4.7KOHM” “Resistor,Chip,MCR03EZPJ000 0OHM 5%” “Resistor,Chip,MCR03EZPJ000 0OHM 5%” “Resistor,Chip,MCR03EZPJ182 1.8KOHM” “Resistor,Chip,MCR03EZPJ202 2KOHM 5” “Resistor,Chip,MCR03EZPJ391 390OHM” “Resistor,Chip,MCR03EZPJ391 390OHM” “Resistor,Chip,MCR03EZPJ103 10KOHM” “Resistor,Metal Oxide Film,RSD02F36R80J ” “Resistor,Chip,MCR03EZPJ000 0OHM 5%” “Resistor,Chip,MCR10EZHJ103 10KOHM” “Resistor,Chip,MCR03EZPJ103 10KOHM” “Resistor,Chip,MCR03EZPJ000 0OHM 5%” “Resistor,Chip,MCR03EZPJ472 4.7KOHM” “Resistor,Chip,MCR03EZPJ472 4.7KOHM” “Resistor,Chip,MCR03EZPJ121 120OHM” “Resistor,Chip,MCR03EZPJ121 120OHM” “Resistor,Chip,MCR03EZPJ101 100OHM” “Resistor,Chip,MCR03EZPJ101 100OHM” “Resistor,Chip,MCR03EZPJ101 100OHM” “Resistor,Chip,MCR03EZPJ202 2KOHM 5” “Resistor,Chip,MCR03EZPJ472 4.7KOHM” “Resistor,Chip,MCR03EZPJ472 4.7KOHM” “Resistor,Chip,MCR03EZPJ472 4.7KOHM” “Resistor,Chip,MCR03EZPJ472 4.7KOHM” “Resistor,Chip,MCR03EZPJ330 33OHM 5” “Resistor,Chip,MCR03EZPJ000 0OHM 5%” “Resistor,Chip,MCR03EZPJ680 68OHM 5” “Resistor,Chip,MCR03EZPJ680 68OHM 5” “Resistor,Chip,MCR03EZPJ330 33OHM 5” “Resistor,Chip,MCR03EZPJ750 75OHM 5” “Resistor,Chip,MCR03EZPJ750 75OHM 5”
LOC NO.
R736
PART NO.
0RJ0752D677
DESCRIPTION/SPECIFICATON
LOC NO.
“Resistor,Chip,MCR03EZPJ750 75OHM 5”
CONNECTORs
J1 J2 J404 J701 J703 J707 P2
6602T12005E 6602T12005C 6630V90220E 6630G100316 6630V90220K EAG37060101 6602T12004C
“Connector,Wafer,12505WR-06A00 6P 1.2” “Connector,Wafer,12505WR-04A00 4P 1.2” “Connector,Wafer,TJC2004-6A 6P 2.0MM” “Connector,DSUB,DZ11AA1-HVG-PF D-SUB” “Connector,Wafer,TJC2004-11A 11P 2.0M” “Connector,FFC/FPC/PIC,10031HR-30 30P 1.00M” “Connector,Wafer,12505WS-04A00 4P 1.2”
6600R00004C 6600R00004C 6600R00004C 6600R00004C 6600R00004C 6600R00004C
“Switch,Tact,JTP1127WEM 1C1P 15VD” “Switch,Tact,JTP1127WEM 1C1P 15VD” “Switch,Tact,JTP1127WEM 1C1P 15VD” “Switch,Tact,JTP1127WEM 1C1P 15VD” “Switch,Tact,JTP1127WEM 1C1P 15VD” “Switch,Tact,JTP1127WEM 1C1P 15VD”
0DLGP0128AA 6212AA2001G
“LED,Chip ,GPTD1210YBC BLUE/YEL” “Crystal,HLX-U-F-14.31818M-18”
SWITCHs
SW1 SW2 SW3 SW4 SW5 SW6 OTHERs
D1 X501
- 25 -
PART NO.
DESCRIPTION/SPECIFICATON
SCHEMATIC DIAGRAM
1. SCALER
- 26 -
2. POWER & WAFER
- 27 -
3. INVERTER
2 D / 1 D
1 S
1 G
2 S
2 G
- 28 -
4. POWER
4
2
3
1
D
D
S
M F
- 29 -
c c V
D N G
B F
