HUAWEI UMG8900 V200R007
Hardware Description
Issue
05
Date
2009-01-09
Part Number
00347892
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Contents About This Document.....................................................................................................................1 1 Cabinets........................................................................................................................................1-1 1.1 N68-22/N68E-22 Cabinet...............................................................................................................................1-2 1.1.1 Structure of N68-22 Cabinet..................................................................................................................1-2 1.1.2 Structure of the N68E-22 Cabinet..........................................................................................................1-5 1.1.3 Configuration of Internal Components..................................................................................................1-7 1.1.4 N800 Supports and Accessories.............................................................................................................1-9 1.1.5 N6X Supports and Accessories............................................................................................................1-13 1.1.6 Power Distribution Frames...................................................................................................................1-16 1.1.7 LAN Switches......................................................................................................................................1-20 1.1.8 LAN Switch Cable Frames..................................................................................................................1-23 1.1.9 Cabling Troughs...................................................................................................................................1-24 1.1.10 Fiber Management Tray.....................................................................................................................1-25 1.1.11 Structures and Mechanical Specifications of the N68-22 Cabinets...................................................1-26 1.1.12 Technical Specifications of N68E-22 Cabinets..................................................................................1-27 1.2 Auxiliary Devices..........................................................................................................................................1-28 1.2.1 LMT.....................................................................................................................................................1-28 1.2.2 Alarm Boxes.........................................................................................................................................1-28 1.2.3 EAC-2 Environment Alarm Chest.......................................................................................................1-28 1.2.4 EMU Environment Monitoring Unit....................................................................................................1-29 1.3 Environmental Specifications.......................................................................................................................1-29
2 Frames...........................................................................................................................................2-1 2.1 Appearance and Structure of the SSM Frame.................................................................................................2-3 2.2 Fan Boxes........................................................................................................................................................2-7 2.3 Transfer Boxes................................................................................................................................................2-9 2.4 Backplanes....................................................................................................................................................2-11 2.5 Board Deployment........................................................................................................................................2-12 2.6 Logical Frame Types.....................................................................................................................................2-14 2.7 Technical Specifications of the SSM Frame.................................................................................................2-20
3 Boards...........................................................................................................................................3-1 3.1 Categories of Boards.......................................................................................................................................3-3 3.2 Matching Limitation of Boards.....................................................................................................................3-14 Issue 05 (2009-01-09)
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3.3 Connection of Boards....................................................................................................................................3-17 3.4 Signal Streams Between Boards...................................................................................................................3-18 3.5 Common Characteristics of Boards...............................................................................................................3-22
4 Equipment Management and Maintenance Units...............................................................4-1 4.1 MOMU............................................................................................................................................................4-2 4.1.1 Panel of the MOMU...............................................................................................................................4-2 4.1.2 Indicators on the MOMU.......................................................................................................................4-3 4.1.3 Interfaces on the MOMU.......................................................................................................................4-4 4.1.4 Jumpers on the MOMU..........................................................................................................................4-5 4.1.5 Fusess on the MOMU............................................................................................................................4-5 4.1.6 Technical specifications of the MOMU.................................................................................................4-5 4.2 MOMB............................................................................................................................................................4-6 4.2.1 Panel of the MOMB...............................................................................................................................4-7 4.2.2 Indicators on the MOMB.......................................................................................................................4-8 4.2.3 Interfaces on the MOMB........................................................................................................................4-9 4.2.4 Fuses on the MOMB..............................................................................................................................4-9 4.2.5 Technical specifications of the MOMB...............................................................................................4-10 4.3 MMPU...........................................................................................................................................................4-10 4.3.1 Panel of the MMPU..............................................................................................................................4-11 4.3.2 Indicators on the MMPU......................................................................................................................4-11 4.3.3 Interfaces on the MMPU......................................................................................................................4-12 4.3.4 Jumpers on the MMPU........................................................................................................................4-13 4.3.5 Fuses on the MMPU.............................................................................................................................4-13 4.3.6 Technical specifications of the MMPU................................................................................................4-13 4.4 MMPB...........................................................................................................................................................4-13 4.4.1 Panel of the MMPB..............................................................................................................................4-14 4.4.2 Indicators on the MMPB......................................................................................................................4-16 4.4.3 Interfaces on the MMPB......................................................................................................................4-17 4.4.4 Fuses on the MMPB.............................................................................................................................4-17 4.4.5 Technical specifications of the MMPB................................................................................................4-17
5 IP and TDM Switching Units..................................................................................................5-1 5.1 MNET..............................................................................................................................................................5-2 5.1.1 Panel of the MNET................................................................................................................................5-2 5.1.2 Indicators on the MNET.........................................................................................................................5-4 5.1.3 Interfaces on the MNET.........................................................................................................................5-6 5.1.4 Fuses on the MNET................................................................................................................................5-8 5.1.5 Technical specifications of the MNET...................................................................................................5-8 5.2 MTNU.............................................................................................................................................................5-9 5.2.1 Panel of the MTNU................................................................................................................................5-9 5.2.2 Indicators on the MTNU......................................................................................................................5-10 5.2.3 Interfaces on the MTNU......................................................................................................................5-11 5.2.4 Fuses on the MTNU.............................................................................................................................5-12 ii
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5.2.5 Technical specifications of the MTNU................................................................................................5-12 5.3 TCLU............................................................................................................................................................5-12 5.3.1 Panel of the TCLU...............................................................................................................................5-13 5.3.2 Indicators on the TCLU........................................................................................................................5-14 5.3.3 Interfaces on the TCLU........................................................................................................................5-15 5.3.4 Fuses on the TCLU..............................................................................................................................5-15 5.3.5 Technical specifications of the TCLU..................................................................................................5-15 5.4 MTNB...........................................................................................................................................................5-16 5.4.1 Panel of the MTNB..............................................................................................................................5-16 5.4.2 Indicators on the MTNB......................................................................................................................5-17 5.4.3 Interfaces on the MTNB.......................................................................................................................5-18 5.4.4 Fuses on the MTNB.............................................................................................................................5-19 5.4.5 Technical specifications of the MTNB................................................................................................5-19 5.5 MTNC...........................................................................................................................................................5-20 5.5.1 Panel of the MTNC..............................................................................................................................5-21 5.5.2 Indicators on the MTNC......................................................................................................................5-22 5.5.3 Interfaces on the MTNC.......................................................................................................................5-23 5.5.4 Fuses on the MTNC.............................................................................................................................5-24 5.5.5 Technical specifications of the MTNC................................................................................................5-25 5.5.6 MTNC Subboards................................................................................................................................5-26
6 Resource and Management Units...........................................................................................6-1 6.1 MCMF.............................................................................................................................................................6-2 6.1.1 Panel of the MCMF................................................................................................................................6-2 6.1.2 Indicators on the MCMF........................................................................................................................6-3 6.1.3 Interfaces on the MCMF........................................................................................................................6-3 6.1.4 Fuses on the MCMF...............................................................................................................................6-4 6.1.5 Technical specifications of the MCMF..................................................................................................6-4 6.2 MCMB............................................................................................................................................................6-4 6.2.1 Panel of the MCMB...............................................................................................................................6-5 6.2.2 Indicators on the MCMB........................................................................................................................6-5 6.2.3 Interfaces on the MCMB........................................................................................................................6-6 6.2.4 Fuses on the MCMB..............................................................................................................................6-6 6.2.5 Technical specifications of the MCMB.................................................................................................6-7 6.3 SCMU..............................................................................................................................................................6-7 6.3.1 Panel of the SCMU................................................................................................................................6-8 6.3.2 Indicators on the SCMU.........................................................................................................................6-8 6.3.3 Interfaces on the SCMU.........................................................................................................................6-9 6.3.4 Fuses on the SCMU................................................................................................................................6-9 6.3.5 Technical specifications of the SCMU...................................................................................................6-9 6.4 MPPB............................................................................................................................................................6-10 6.4.1 Panel of the MPPB...............................................................................................................................6-10 6.4.2 Indicators on the MPPB.......................................................................................................................6-11 Issue 05 (2009-01-09)
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6.4.3 Interfaces on the MPPB........................................................................................................................6-12 6.4.4 Fuses on the MPPB..............................................................................................................................6-12 6.4.5 Technical specifications of the MPPB.................................................................................................6-12
7 Service and Protocol Processing Units...................................................................................7-1 7.1 MHRU.............................................................................................................................................................7-2 7.1.1 Panel of the MHRU................................................................................................................................7-2 7.1.2 Indicators on the MHRU........................................................................................................................7-4 7.1.3 Interfaces on the MHRU........................................................................................................................7-5 7.1.4 Fuses on the MHRU...............................................................................................................................7-5 7.1.5 Technical Specifications of the MHRU.................................................................................................7-6 7.1.6 MHRU Subboards..................................................................................................................................7-6 7.2 MHRD.............................................................................................................................................................7-7 7.2.1 Panel of the MHRD................................................................................................................................7-7 7.2.2 Indicators on the MHRD........................................................................................................................7-8 7.2.3 Interfaces on the MHRD........................................................................................................................7-9 7.2.4 Fuses on the MHRD...............................................................................................................................7-9 7.2.5 Technical specifications of the MHRD................................................................................................7-10 7.2.6 MHRD Subboards................................................................................................................................7-10 7.3 MRPU............................................................................................................................................................7-13 7.3.1 Panel of the MRPU..............................................................................................................................7-13 7.3.2 Indicators on the MRPU.......................................................................................................................7-14 7.3.3 Interfaces on the MRPU.......................................................................................................................7-15 7.3.4 Fuses on the MRPU..............................................................................................................................7-15 7.3.5 Technical Specifications of the MRPU................................................................................................7-16 7.4 MASU...........................................................................................................................................................7-16 7.4.1 Panel of the MASU..............................................................................................................................7-17 7.4.2 Indicators on the MASU......................................................................................................................7-18 7.4.3 Interfaces on the MASU.......................................................................................................................7-19 7.4.4 Fuses on the MASU.............................................................................................................................7-19 7.4.5 Technical Specifications of the MASU................................................................................................7-20 7.4.6 MASU Subboard..................................................................................................................................7-20 7.5 MIOE.............................................................................................................................................................7-21 7.5.1 Panel of the MIOE................................................................................................................................7-21 7.5.2 Indicators on the MIOE........................................................................................................................7-22 7.5.3 Interfaces on the MIOE........................................................................................................................7-23 7.5.4 Fuses on the MIOE...............................................................................................................................7-24 7.5.5 Technical Specifications of the MIOE.................................................................................................7-24 7.6 MSPF.............................................................................................................................................................7-24 7.6.1 Panel of the MSPF................................................................................................................................7-25 7.6.2 Indicators on the MSPF........................................................................................................................7-25 7.6.3 Interfaces on the MSPF........................................................................................................................7-26 7.6.4 Fuses on the MSPF...............................................................................................................................7-26 iv
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7.6.5 Technical Specifications of the MSPF.................................................................................................7-27 7.6.6 Subboards of the MSPF........................................................................................................................7-27
8 Cascading Units.......................................................................................................................... 8-1 8.1 MFLU..............................................................................................................................................................8-2 8.1.1 Panel of the MFLU.................................................................................................................................8-2 8.1.2 Indicators on the MFLU.........................................................................................................................8-3 8.1.3 Interfaces on the MFLU.........................................................................................................................8-4 8.1.4 Fuses on the MFLU................................................................................................................................8-4 8.1.5 Technical specifications of the MFLU...................................................................................................8-4 8.2 MBLU.............................................................................................................................................................8-5 8.2.1 Panel of the MBLU................................................................................................................................8-5 8.2.2 Indicators on the MBLU........................................................................................................................8-7 8.2.3 Interfaces on the MBLU.........................................................................................................................8-8 8.2.4 Fuses on the MBLU...............................................................................................................................8-9 8.2.5 Technical specifications of the MBLU..................................................................................................8-9 8.3 MNLU...........................................................................................................................................................8-10 8.3.1 Panel of the MNLU..............................................................................................................................8-11 8.3.2 Indicators on the MNLU......................................................................................................................8-12 8.3.3 Interfaces on the MNLU......................................................................................................................8-12 8.3.4 Fuses on the MNLU.............................................................................................................................8-13 8.3.5 Technical specifications of the MNLU................................................................................................8-13
9 Media Resource Processing Units...........................................................................................9-1 9.1 MVPB..............................................................................................................................................................9-2 9.1.1 Panel of the MVPB................................................................................................................................9-2 9.1.2 Indicators on the MVPB.........................................................................................................................9-4 9.1.3 Interfaces on the MVPB.........................................................................................................................9-5 9.1.4 Fuses on the MVPB................................................................................................................................9-5 9.1.5 Technical Specifications of the MVPB..................................................................................................9-6 9.1.6 MVPB Subboards...................................................................................................................................9-7 9.2 MVPD...........................................................................................................................................................9-10 9.2.1 Panel of the MVPD..............................................................................................................................9-11 9.2.2 Indicators on the MVPD......................................................................................................................9-13 9.2.3 Interfaces on the MVPD.......................................................................................................................9-14 9.2.4 Fuses on the MVPD.............................................................................................................................9-14 9.2.5 Technical Specifications of the MVPD................................................................................................9-15 9.2.6 MVPD Subboards................................................................................................................................9-16 9.3 MTCB............................................................................................................................................................9-19 9.3.1 Panel of the MTCB..............................................................................................................................9-20 9.3.2 Indicators on the MTCB.......................................................................................................................9-21 9.3.3 Interfaces on the MTCB.......................................................................................................................9-22 9.3.4 Fuses on the MTCB..............................................................................................................................9-22 9.3.5 Technical Specifications of the MTCB................................................................................................9-23 Issue 05 (2009-01-09)
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9.3.6 MTCB Subboards.................................................................................................................................9-24 9.4 MTCD...........................................................................................................................................................9-24 9.4.1 Panel of the MTCD..............................................................................................................................9-25 9.4.2 Indicators on the MTCD......................................................................................................................9-25 9.4.3 Interfaces on the MTCD.......................................................................................................................9-26 9.4.4 Fuses on the MTCD.............................................................................................................................9-26 9.4.5 Technical Specifications of the MTCD................................................................................................9-27 9.4.6 MTCD Subboards................................................................................................................................9-28 9.5 MECU...........................................................................................................................................................9-28 9.5.1 Panel of the MECU..............................................................................................................................9-29 9.5.2 Indicators on the MECU......................................................................................................................9-29 9.5.3 Interfaces on the MECU.......................................................................................................................9-30 9.5.4 Fuses on the MECU.............................................................................................................................9-30 9.5.5 Technical Specifications of the MECU................................................................................................9-31 9.5.6 MECU Subboards................................................................................................................................9-31
10 E1/T1 and E3/T3 Interface Units..........................................................................................10-1 10.1 ME32...........................................................................................................................................................10-2 10.1.1 Panel of the ME32..............................................................................................................................10-2 10.1.2 Indicators on the ME32......................................................................................................................10-3 10.1.3 Interfaces on the ME32......................................................................................................................10-4 10.1.4 DIP Switches and Jumpers of the ME32............................................................................................10-4 10.1.5 Fuses on the ME32.............................................................................................................................10-7 10.1.6 Technical specifications of the ME32................................................................................................10-7 10.2 MESU..........................................................................................................................................................10-8 10.2.1 Panel of the MESU.............................................................................................................................10-8 10.2.2 Indicators on the MESU.....................................................................................................................10-9 10.2.3 Interfaces on the MESU...................................................................................................................10-10 10.2.4 DIP Switches and Jumpers of the MESU.........................................................................................10-10 10.2.5 Fuses on the MESU..........................................................................................................................10-12 10.2.6 Technical specifications of the MESU.............................................................................................10-12 10.3 MT32.........................................................................................................................................................10-12 10.3.1 Panel of the MT32............................................................................................................................10-13 10.3.2 Indicators on the MT32....................................................................................................................10-14 10.3.3 Interfaces on the MT32....................................................................................................................10-14 10.3.4 DIP Switches and Jumpers of the MT32..........................................................................................10-15 10.3.5 Fuses on the MT32...........................................................................................................................10-17 10.3.6 Technical specifications of the MT32..............................................................................................10-17 10.4 MTSU........................................................................................................................................................10-17 10.4.1 Panel of the MTSU...........................................................................................................................10-18 10.4.2 Indicators on the MTSU...................................................................................................................10-19 10.4.3 Interfaces on the MTSU...................................................................................................................10-20 10.4.4 DIP Switches and Jumpers of the MTSU.........................................................................................10-20 vi
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10.4.5 Fuses on the MTSU..........................................................................................................................10-21 10.4.6 Technical specifications of the MTSU.............................................................................................10-21 10.5 MPIE.........................................................................................................................................................10-22 10.5.1 Panel of the MPIE............................................................................................................................10-22 10.5.2 Indicators on the MPIE....................................................................................................................10-23 10.5.3 Interfaces on the MPIE.....................................................................................................................10-24 10.5.4 Fuses on the MPIE...........................................................................................................................10-25 10.5.5 Technical specifications of the MPIE..............................................................................................10-25 10.5.6 MPIE Subboards..............................................................................................................................10-25 10.6 MEAC.......................................................................................................................................................10-26 10.6.1 Panel of the MEAC..........................................................................................................................10-26 10.6.2 Indicators on the MEAC..................................................................................................................10-27 10.6.3 Interfaces on the MEAC...................................................................................................................10-28 10.6.4 DIP Switches on the MEAC.............................................................................................................10-28 10.6.5 Fuses on the MEAC.........................................................................................................................10-29 10.6.6 Technical specifications of the MEAC............................................................................................10-30 10.7 MTAC.......................................................................................................................................................10-30 10.7.1 Panel of the MTAC..........................................................................................................................10-31 10.7.2 Indicators on the MTAC..................................................................................................................10-32 10.7.3 Interfaces on the MTAC...................................................................................................................10-32 10.7.4 DIP Switches and Jumpers of the MTAC........................................................................................10-33 10.7.5 Fuses on the MTAC.........................................................................................................................10-34 10.7.6 Technical specifications of the MTAC............................................................................................10-34
11 SDH Interface Units..............................................................................................................11-1 11.1 MS2L...........................................................................................................................................................11-2 11.1.1 Panel of the MS2L..............................................................................................................................11-2 11.1.2 Indicators on the MS2L......................................................................................................................11-3 11.1.3 Interfaces on the MS2L......................................................................................................................11-4 11.1.4 Fuses on the MS2L.............................................................................................................................11-5 11.1.5 Technical Specifications of the MS2L...............................................................................................11-5 11.2 MS2E...........................................................................................................................................................11-6 11.2.1 Panel of the MS2E..............................................................................................................................11-7 11.2.2 Indicators on the MS2E......................................................................................................................11-7 11.2.3 Interfaces on the MS2E......................................................................................................................11-9 11.2.4 Fuses on the MS2E.............................................................................................................................11-9 11.2.5 Technical Specifications of the MS2E...............................................................................................11-9 11.3 MS1L.........................................................................................................................................................11-10 11.3.1 Panel of the MS1L............................................................................................................................11-11 11.3.2 Indicators on the MS1L....................................................................................................................11-12 11.3.3 Interfaces on the MS1L....................................................................................................................11-13 11.3.4 Fuses on the MS1L...........................................................................................................................11-13 11.3.5 Technical specifications of the MS1L..............................................................................................11-13 Issue 05 (2009-01-09)
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11.4 MS1E.........................................................................................................................................................11-14 11.4.1 Panel of the MS1E............................................................................................................................11-15 11.4.2 Indicators on the MS1E....................................................................................................................11-15 11.4.3 Interfaces on the MS1E....................................................................................................................11-17 11.4.4 Fuses on the MS1E...........................................................................................................................11-17 11.4.5 Technical specifications of the MS1E..............................................................................................11-17
12 Packet Interface Units............................................................................................................12-1 12.1 ME8T..........................................................................................................................................................12-2 12.1.1 Panel of the ME8T.............................................................................................................................12-2 12.1.2 Indicators on the ME8T......................................................................................................................12-3 12.1.3 Interfaces on the ME8T......................................................................................................................12-4 12.1.4 Fuses on the ME8T............................................................................................................................12-4 12.1.5 Technical specifications of the ME8T................................................................................................12-5 12.2 MG1O..........................................................................................................................................................12-5 12.2.1 Panel of the MG1O............................................................................................................................12-6 12.2.2 Indicators on the MG1O.....................................................................................................................12-7 12.2.3 Interfaces on the MG1O.....................................................................................................................12-8 12.2.4 Fuses on the MG1O............................................................................................................................12-8 12.2.5 Technical specifications of the MG1O...............................................................................................12-9 12.3 MA4L........................................................................................................................................................12-10 12.3.1 Panel of the MA4L...........................................................................................................................12-11 12.3.2 Indicators on the MA4L...................................................................................................................12-12 12.3.3 Interfaces on the MA4L...................................................................................................................12-12 12.3.4 Fuses on the MA4L..........................................................................................................................12-13 12.3.5 Technical specifications of the MA4L.............................................................................................12-13
13 Clock Units..............................................................................................................................13-1 13.1 Panel of the MCLK.....................................................................................................................................13-3 13.2 Indicators on the MCLK.............................................................................................................................13-4 13.3 Interfaces on the MCLK..............................................................................................................................13-5 13.4 Fuses on the MCLK....................................................................................................................................13-6 13.5 Technical specifications of the MCLK.......................................................................................................13-6
14 Lightning Protection Units...................................................................................................14-1 14.1 Panel of the MLPB......................................................................................................................................14-2 14.2 Indicators on the MLPB..............................................................................................................................14-2 14.3 Interfaces on the MLPB..............................................................................................................................14-2 14.4 Technical specifications of the MLPB........................................................................................................14-3
15 Cables.......................................................................................................................................15-1 15.1 Monitoring Cables.......................................................................................................................................15-3 15.1.1 Monitoring Cables from SSM Frames to Fan Boxes.........................................................................15-3 15.1.2 Monitoring Cables from SSM Frames to Power Distribution Frames and Fan Boxes......................15-5 15.2 Alarm Box Connection Cables....................................................................................................................15-7 viii
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15.3 Cascading Cables......................................................................................................................................15-10 15.3.1 FE Cascading Cables........................................................................................................................15-10 15.3.2 GE Cascading Cables.......................................................................................................................15-14 15.3.3 TDM Cascading Cables...................................................................................................................15-16 15.4 Clock Cables.............................................................................................................................................15-17 15.4.1 Clock Distribution Cable..................................................................................................................15-18 15.4.2 8 kHz Clock Cables..........................................................................................................................15-20 15.4.3 BITS Clock Cables...........................................................................................................................15-22 15.4.4 GPS Clock Cables............................................................................................................................15-25 15.5 Trunk Cables of SSM Frames...................................................................................................................15-27 15.5.1 75-ohm E1 Trunk Cable...................................................................................................................15-27 15.5.2 120-ohm E1 Trunk Cable.................................................................................................................15-30 15.5.3 100-ohm T1 Cables..........................................................................................................................15-34 15.5.4 75-ohm E3/T3 Cables.......................................................................................................................15-35 15.5.5 SDH Trunk Cables...........................................................................................................................15-37 15.6 Internal Trunk Cables from SSM Frames to SIWF Frames......................................................................15-38 15.7 Straight Through Cables and Crossover Cables........................................................................................15-41 15.8 Optical Fibers............................................................................................................................................15-44 15.9 Power Cables and PGND Cables..............................................................................................................15-46 15.9.1 Power Cables and PGND Cables for Cabinets.................................................................................15-46 15.9.2 Power Cables and PGND Cables of Service Frames.......................................................................15-50
A Impedance Transfer Boxes.....................................................................................................A-1 B Board Indicators of All SSM Frames.....................................................................................B-1 B.1 Indicators on the MA4L.................................................................................................................................B-3 B.2 Indicators on the MASU................................................................................................................................B-3 B.3 Indicators on the MBLU................................................................................................................................B-4 B.4 Indicators on the MCMB...............................................................................................................................B-5 B.5 Indicators on the MCMF................................................................................................................................B-6 B.6 Indicators on the ME32..................................................................................................................................B-7 B.7 Indicators on the ME8T.................................................................................................................................B-8 B.8 Indicators on the MEAC................................................................................................................................B-9 B.9 Indicators on the MECU................................................................................................................................B-9 B.10 Indicators on the MESU.............................................................................................................................B-10 B.11 Indicators on the MFLU.............................................................................................................................B-11 B.12 Indicators on the MG1O............................................................................................................................B-12 B.13 Indicators on the MHRU............................................................................................................................B-13 B.14 Indicators on the MHRD............................................................................................................................B-14 B.15 Indicators on the MIOE.............................................................................................................................B-14 B.16 Indicators on the MMPB............................................................................................................................B-15 B.17 Indicators on the MMPU...........................................................................................................................B-16 B.18 Indicators on the MNET............................................................................................................................B-17 B.19 Indicators on the MNLU............................................................................................................................B-19 Issue 05 (2009-01-09)
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B.20 Indicators on the MOMB...........................................................................................................................B-20 B.21 Indicators on the MOMU...........................................................................................................................B-21 B.22 Indicators on the MPIE..............................................................................................................................B-21 B.23 Indicators on the MPPB.............................................................................................................................B-23 B.24 Indicators on the MRPU............................................................................................................................B-23 B.25 Indicators on the MS1E.............................................................................................................................B-24 B.26 Indicators on the MS1L.............................................................................................................................B-26 B.27 Indicators on the MS2E.............................................................................................................................B-27 B.28 Indicators on the MS2L.............................................................................................................................B-28 B.29 Indicators on the MSPF.............................................................................................................................B-29 B.30 Indicators on the MT32..............................................................................................................................B-30 B.31 Indicators on the MTAC............................................................................................................................B-31 B.32 Indicators on the MTCB............................................................................................................................B-32 B.33 Indicators on the MTCD............................................................................................................................B-32 B.34 Indicators on the MTNB............................................................................................................................B-33 B.35 Indicators on the MTNC............................................................................................................................B-34 B.36 Indicators on the MTNU............................................................................................................................B-36 B.37 Indicators on the MTSU.............................................................................................................................B-37 B.38 Indicators on the MVPB............................................................................................................................B-38 B.39 Indicators on the MVPD............................................................................................................................B-38 B.40 Indicators on the TCLU.............................................................................................................................B-39 B.41 Indicators on the SCMU............................................................................................................................B-41
C Board DIP Switches and Jumpers of all SSM Frames.......................................................C-1 C.1 DIP Switches and Jumpers of the ME32.......................................................................................................C-2 C.2 DIP Switches on the MEAC..........................................................................................................................C-4 C.3 DIP Switches and Jumpers of the MESU......................................................................................................C-5 C.4 Jumpers on the MMPU..................................................................................................................................C-7 C.5 Jumpers on the MOMU.................................................................................................................................C-7 C.6 DIP Switches and Jumpers of the MT32.......................................................................................................C-7 C.7 DIP Switches and Jumpers of the MTAC......................................................................................................C-9 C.8 DIP Switches and Jumpers of the MTSU....................................................................................................C-10
D Boards of All SSM Frames.....................................................................................................D-1 E Subboards of all SSM Frames.................................................................................................E-1 E.1 MECU Subboards...........................................................................................................................................E-2 E.2 MHRU Subboards..........................................................................................................................................E-2 E.3 MHRD Subboards..........................................................................................................................................E-3 E.4 MASU Subboard............................................................................................................................................E-5 E.5 MPIE Subboards.............................................................................................................................................E-5 E.6 Subboards of the MSPF..................................................................................................................................E-5 E.7 MTCB Subboards...........................................................................................................................................E-6 E.8 MTCD Subboards...........................................................................................................................................E-6 x
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HUAWEI UMG8900 Hardware Description
Contents
E.9 MTNC Subboards...........................................................................................................................................E-6 E.10 MVPB Subboards.........................................................................................................................................E-8 E.11 MVPD Subboards.......................................................................................................................................E-11
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Figures
Figures Figure 1-1 Appearance of the N68-22 cabinet.....................................................................................................1-3 Figure 1-2 Structure of the N68-22 cabinet..........................................................................................................1-4 Figure 1-3 Appearance of the N68E-22 cabinet...................................................................................................1-5 Figure 1-4 Structure of the N68E-22 cabinet.......................................................................................................1-6 Figure 1-5 Appearance and structure of the wire bushing...................................................................................1-7 Figure 1-6 Structure of the UMG8900 assembly cabinet.....................................................................................1-8 Figure 1-7 Structure of the UMG8900 extended assembly cabinet.....................................................................1-9 Figure 1-8 Appearance of the N800 support......................................................................................................1-10 Figure 1-9 Appearance of the guide rail.............................................................................................................1-11 Figure 1-10 Appearance of the horizontal pallet................................................................................................1-12 Figure 1-11 Appearance of the fixing bracket....................................................................................................1-12 Figure 1-12 Appearance of the side pallet..........................................................................................................1-13 Figure 1-13 Appearance of the N6X support.....................................................................................................1-14 Figure 1-14 Appearance of the guide rail...........................................................................................................1-15 Figure 1-15 Appearance of the pallet.................................................................................................................1-15 Figure 1-16 Appearance and structure of the PDF.............................................................................................1-16 Figure 1-17 Structure of the PDF.......................................................................................................................1-17 Figure 1-18 Front view of the PDF....................................................................................................................1-18 Figure 1-19 Rear panel of the PDF....................................................................................................................1-19 Figure 1-20 Front panel of the LAN Switch......................................................................................................1-21 Figure 1-21 Rear panel of the DC chassis..........................................................................................................1-22 Figure 1-22 Appearance and structure of the LAN Switch cable frames...........................................................1-23 Figure 1-23 Appearance and structure of the cabling trough.............................................................................1-24 Figure 1-24 Two holes at the bottom of the cabling trough...............................................................................1-24 Figure 1-25 Appearance and structure of the side hang fiber coiler..................................................................1-25 Figure 1-26 Appearance and structure of the back FMT...................................................................................1-26 Figure 2-1 Appearance and structure of the SSM-256 frame...............................................................................2-3 Figure 2-2 Front view of the SSM-256 frame......................................................................................................2-4 Figure 2-3 Rear view of the SSM-256 frame.......................................................................................................2-4 Figure 2-4 Side view of the SSM frame...............................................................................................................2-5 Figure 2-5 Appearance and structure of the SSM-32 frame.................................................................................2-5 Figure 2-6 Front view of the SSM-32 frame........................................................................................................2-6 Figure 2-7 Rear view of the SSM-32 frame.........................................................................................................2-6 Issue 05 (2009-01-09)
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Figures
Figure 2-8 Appearance and structure of the fan box............................................................................................2-7 Figure 2-9 Front panel of the fan box...................................................................................................................2-8 Figure 2-10 Rear panel of the fan box..................................................................................................................2-8 Figure 2-11 Front view of the transfer box........................................................................................................ 2-10 Figure 2-12 Eight-bit DIP switch on the transfer board.....................................................................................2-10 Figure 2-13 Board deployment in the SSM-256 frame......................................................................................2-13 Figure 2-14 Board deployment in the SSM-32 frame........................................................................................2-14 Figure 2-15 Board deployment in the SSM-256 main control frame.................................................................2-15 Figure 2-16 Board deployment in the SSM-32 main control frame...................................................................2-16 Figure 2-17 Board deployment in the SSM-256 central switching frame..........................................................2-17 Figure 2-18 Board deployment in the SSM-256 service frame..........................................................................2-18 Figure 2-19 Board deployment in the SSM-32 service frame............................................................................2-19 Figure 2-20 Board deployment in the SSM-256 control frame..........................................................................2-20 Figure 3-1 Connections between boards and backplane buses in the SSM-256 frame......................................3-17 Figure 3-2 Connections between boards and backplane buses in the SSM-32 frame........................................3-17 Figure 3-3 Gateway control signal processing...................................................................................................3-18 Figure 3-4 Transfer path of SS7 signaling (SSM-256 frame)............................................................................3-19 Figure 3-5 Processing flow for TDM<->IP bearer service flow........................................................................3-20 Figure 3-6 Processing flow of OMC signals......................................................................................................3-21 Figure 4-1 Panel of the MOMU...........................................................................................................................4-3 Figure 4-2 Panel of the MOMB...........................................................................................................................4-7 Figure 4-3 Panel of the UG02MOMB..................................................................................................................4-8 Figure 4-4 Panel of the MMPU..........................................................................................................................4-11 Figure 4-5 Panel of the MMPB..........................................................................................................................4-15 Figure 4-6 Panel of the UG02MMPB................................................................................................................ 4-16 Figure 5-1 Panel of the UG01MNET...................................................................................................................5-3 Figure 5-2 Panel of the UG02MNET...................................................................................................................5-4 Figure 5-3 Panel of the MTNU.......................................................................................................................... 5-10 Figure 5-4 Panel of the TCLU............................................................................................................................5-13 Figure 5-5 Panel of the MTNB...........................................................................................................................5-17 Figure 5-6 Panel of the MTNC (UG01MTNC5)................................................................................................5-21 Figure 5-7 Panel of the UG02MTNC4...............................................................................................................5-22 Figure 6-1 Panel of the MCMF............................................................................................................................6-2 Figure 6-2 Panel of the MCMB............................................................................................................................6-5 Figure 6-3 Panel of the SCMU.............................................................................................................................6-8 Figure 6-4 Panel of the MPPB........................................................................................................................... 6-11 Figure 7-1 Panel of the UG02MHRU.A..............................................................................................................7-3 Figure 7-2 Panel of the UG02MHRU.C...............................................................................................................7-4 Figure 7-3 Panel of the MHRD............................................................................................................................7-8 Figure 7-4 Panel of the MRPU...........................................................................................................................7-14 Figure 7-5 Panel of the UG02MASU.A.............................................................................................................7-17 Figure 7-6 Panel of the UG02MASU.C.............................................................................................................7-18 xiv
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Figures
Figure 7-7 Panel of the MIOE............................................................................................................................7-22 Figure 7-8 Panel of the MSPF............................................................................................................................7-25 Figure 8-1 Panel of the MFLU.............................................................................................................................8-3 Figure 8-2 Panel of the UG02MBLU_VA...........................................................................................................8-6 Figure 8-3 Panel of the UG02MBLU_VC...........................................................................................................8-7 Figure 8-4 Panel of the MNLU..........................................................................................................................8-11 Figure 9-1 Panel of the UG01MVPB...................................................................................................................9-3 Figure 9-2 Panel of the UG02MVPB...................................................................................................................9-4 Figure 9-3 Position of the MVPB subboard.......................................................................................................9-10 Figure 9-4 Panel of the UG01MVPD.................................................................................................................9-12 Figure 9-5 Panel of the UG02MVPD.................................................................................................................9-13 Figure 9-6 Position of the MVPD subboard.......................................................................................................9-19 Figure 9-7 Panel of the UG01MTCB.................................................................................................................9-20 Figure 9-8 Panel of the UG02MTCB.................................................................................................................9-21 Figure 9-9 Panel of the MTCD...........................................................................................................................9-25 Figure 9-10 Panel of the MECU.........................................................................................................................9-29 Figure 10-1 Panel of the ME32..........................................................................................................................10-3 Figure 10-2 Panel of the MESU.........................................................................................................................10-9 Figure 10-3 Panel of the MT32........................................................................................................................10-13 Figure 10-4 Panel of the MTSU.......................................................................................................................10-19 Figure 10-5 Panel of the MPIE.........................................................................................................................10-23 Figure 10-6 Panel of the MEAC.......................................................................................................................10-27 Figure 10-7 Panel of the MTAC.......................................................................................................................10-31 Figure 11-1 Panel of the MS2L..........................................................................................................................11-3 Figure 11-2 Panel of the MS2E..........................................................................................................................11-7 Figure 11-3 Panel of the MS1L........................................................................................................................11-11 Figure 11-4 Panel of the MS1E........................................................................................................................11-15 Figure 12-1 Panel of the ME8T..........................................................................................................................12-3 Figure 12-2 Panel of the MG1O.A.....................................................................................................................12-6 Figure 12-3 Panel of the UG02MG1O.B...........................................................................................................12-7 Figure 12-4 Panel of the MA4L.......................................................................................................................12-11 Figure 13-1 Panel of the MCLK.........................................................................................................................13-3 Figure 13-2 Panel of the UG03MCLK_VD.......................................................................................................13-4 Figure 14-1 Panel of the MLPB.........................................................................................................................14-2 Figure 15-1 Appearance of the monitoring cables from the SSM frame to the fan box....................................15-4 Figure 15-2 Monitoring cable from the SSM frame to the PDF and fan box....................................................15-6 Figure 15-3 Alarm box RS422 serial port cables...............................................................................................15-8 Figure 15-4 Alarm box RS232 serial port cables...............................................................................................15-9 Figure 15-5 Common FE cascading cables......................................................................................................15-10 Figure 15-6 Connections of crossover cables...................................................................................................15-11 Figure 15-7 Appearance of the FE cascading network cable with two terminals at one end...........................15-12 Figure 15-8 Structure of the FE cascading network cable with two terminals at one end...............................15-13 Issue 05 (2009-01-09)
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Figures
Figure 15-9 Appearance of the GE cascading cable........................................................................................15-14 Figure 15-10 Appearance of the LC/PC connector..........................................................................................15-15 Figure 15-11 Appearance of the TDM cascading cable...................................................................................15-16 Figure 15-12 Appearance of the LC/PC connector..........................................................................................15-16 Figure 15-13 Appearance of the clock distribution cable................................................................................15-18 Figure 15-14 Structure of the clock distribution cable.....................................................................................15-19 Figure 15-15 Appearance of the 8 kHz clock cable.........................................................................................15-21 Figure 15-16 Structure of the 8 kHz clock cable..............................................................................................15-21 Figure 15-17 Appearance of the 75-ohm BITS clock cable.............................................................................15-23 Figure 15-18 Structure of the 75-ohm BITS clock cable.................................................................................15-23 Figure 15-19 Appearance of the 120-ohm BITS clock cable...........................................................................15-24 Figure 15-20 Structure of the 120-ohm BITS clock cable...............................................................................15-25 Figure 15-21 GPS clock cable..........................................................................................................................15-26 Figure 15-22 Appearance of the 75-ohm E1 trunk cable.................................................................................15-28 Figure 15-23 Appearance of the 120-ohm E1 trunk cable...............................................................................15-31 Figure 15-24 Appearance of the E3/T3 trunk cables with two BNC connectors.............................................15-35 Figure 15-25 Appearance of the E3/T3 trunk cables with one BNC connector...............................................15-36 Figure 15-26 Appearance of the SDH trunk cables..........................................................................................15-37 Figure 15-27 Appearance of the internal trunk cable between the SSM frame and the SIWF frame..............15-39 Figure 15-28 Structure of the internal trunk cable between the SSM frame and the SIWF frame..................15-39 Figure 15-29 Appearance of straight through cable.........................................................................................15-42 Figure 15-30 Pin assignments of straight through cables.................................................................................15-42 Figure 15-31 Appearance of crossover cable...................................................................................................15-43 Figure 15-32 Pin assignments of crossover cables...........................................................................................15-43 Figure 15-33 Appearance of the multi-mode optical fiber...............................................................................15-44 Figure 15-34 Appearance of the single-mode optical fiber..............................................................................15-45 Figure 15-35 Appearance of the LC/PC connector..........................................................................................15-45 Figure 15-36 Appearance of the –48 V power cables......................................................................................15-47 Figure 15-37 Appearance of the RTN power cables........................................................................................15-48 Figure 15-38 Appearance of the PGND cables................................................................................................15-49 Figure 15-39 Appearance of the PGND feeder cable.......................................................................................15-50 Figure 15-40 Power cables from power distribution frames to SSM frames...................................................15-51 Figure 15-41 Power cables from SSM frames to fan boxes.............................................................................15-51 Figure 15-42 Appearance of the PGND feeder cable of SSM frame...............................................................15-52 Figure A-1 Method for using the impedance transfer box..................................................................................A-1 Figure A-2 Appearance of the RJ45 connector...................................................................................................A-2 Figure E-1 Position of the MVPB subboard......................................................................................................E-11 Figure E-2 Position of the MVPD subboard......................................................................................................E-14
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Tables
Tables Table 1-1 Applicable height range of each support type....................................................................................1-10 Table 1-2 Applicable height range of each type of the support..........................................................................1-14 Table 1-3 Indicator meaning of the PDF............................................................................................................1-18 Table 1-4 Interfaces on the PDF panel...............................................................................................................1-19 Table 1-5 Technical specifications of the PDF..................................................................................................1-20 Table 1-6 Meaning of indicators on the Ethernet interface................................................................................1-21 Table 1-7 Technical specifications of the LAN Switch......................................................................................1-22 Table 1-8 Technical specifications of the cabling trough...................................................................................1-25 Table 1-9 Technical specifications of the N68-22 cabinet.................................................................................1-26 Table 1-10 Technical specifications of the N68E-22 cabinet.............................................................................1-27 Table 1-11 General environmental specifications..............................................................................................1-29 Table 1-12 Air cleanness specifications.............................................................................................................1-30 Table 1-13 Anti-vibration specifications for device running.............................................................................1-31 Table 1-14 Anti-vibration specifications for device delivery.............................................................................1-32 Table 2-1 DIP switch settings on the monitoring board of the fan frame............................................................2-9 Table 2-2 Technical specifications of the fan box................................................................................................2-9 Table 2-3 Relationship between frame IDs and DIP switch settings in the SSM-256 frame.............................2-11 Table 2-4 Fixed board positions in the SSM-256 main control frame...............................................................2-15 Table 2-5 Fixed board positions in an SSM-32 main control frame..................................................................2-16 Table 2-6 Fixed board positions in the central switching frame........................................................................2-17 Table 2-7 Fixed board positions in the SSM-256 service frame........................................................................2-18 Table 2-8 Fixed board positions in the SSM-32 service frame..........................................................................2-19 Table 2-9 Fixed board positions in the control frame........................................................................................2-20 Table 2-10 Technical specifications of the SSM frame......................................................................................2-21 Table 3-1 Equipment and resource management units.........................................................................................3-3 Table 3-2 Service and protocol processing units..................................................................................................3-5 Table 3-3 Switching and cascading units.............................................................................................................3-7 Table 3-4 Interface units.....................................................................................................................................3-10 Table 3-5 Media resource processing units........................................................................................................3-12 Table 3-6 Clock units.........................................................................................................................................3-14 Table 3-7 Lightning protection units..................................................................................................................3-14 Table 3-8 Limitation on front and back boards..................................................................................................3-14 Table 3-9 Limitation on opposite positions........................................................................................................3-15 Issue 05 (2009-01-09)
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Tables
Table 3-10 Limitation on fixed positions...........................................................................................................3-15 Table 3-11 Matching limitation of boards..........................................................................................................3-16 Table 4-1 Indicator meaning of the MOMU........................................................................................................4-4 Table 4-2 Interfaces on the MOMU.....................................................................................................................4-5 Table 4-3 Jumper description of the MOMU.......................................................................................................4-5 Table 4-4 Fuses on the MOMU............................................................................................................................4-5 Table 4-5 Technical specifications of the MOMU...............................................................................................4-6 Table 4-6 Indicator meaning of the MOMB.........................................................................................................4-9 Table 4-7 Interfaces on the MOMB.....................................................................................................................4-9 Table 4-8 Fuses on the MOMB..........................................................................................................................4-10 Table 4-9 Technical specifications of the MOMB.............................................................................................4-10 Table 4-10 Technical specifications of the UG02MOMB.................................................................................4-10 Table 4-11 Indicator meaning of the MMPU.....................................................................................................4-12 Table 4-12 Interfaces on the MMPU..................................................................................................................4-12 Table 4-13 Jumper description of the MMPU....................................................................................................4-13 Table 4-14 Fuses on the MMPU.........................................................................................................................4-13 Table 4-15 Technical specifications of the MMPU............................................................................................4-13 Table 4-16 Indicator meaning of the MMPB.....................................................................................................4-16 Table 4-17 Interfaces on the MMPB..................................................................................................................4-17 Table 4-18 Fuses on the MMPB.........................................................................................................................4-17 Table 4-19 Technical specifications of the MMPB............................................................................................4-18 Table 4-20 Technical specifications of the UG02MMPB..................................................................................4-18 Table 5-1 Indicator meaning of the MNET..........................................................................................................5-4 Table 5-2 Indicator meaning of clock interfaces on the MNET...........................................................................5-6 Table 5-3 Interfaces on the MNET.......................................................................................................................5-6 Table 5-4 Fuses on the MNET.............................................................................................................................5-8 Table 5-5 Technical specifications of the MNET.................................................................................................5-8 Table 5-6 Indicator meaning of the MTNU........................................................................................................5-10 Table 5-7 Interfaces on the MTNU....................................................................................................................5-12 Table 5-8 Fuses on the MTNU...........................................................................................................................5-12 Table 5-9 Technical specifications of the MTNU..............................................................................................5-12 Table 5-10 Indicator meaning of the TCLU.......................................................................................................5-14 Table 5-11 Interfaces on the TCLU....................................................................................................................5-15 Table 5-12 Fuses on the TCLU..........................................................................................................................5-15 Table 5-13 Technical specifications of the TCLU.............................................................................................5-16 Table 5-14 Indicator meaning of the MTNB......................................................................................................5-17 Table 5-15 Interfaces on the MTNB...................................................................................................................5-19 Table 5-16 Fuses on the MTNB.........................................................................................................................5-19 Table 5-17 Technical specifications of the MTNB............................................................................................5-19 Table 5-18 Indicator meaning of the MTNC......................................................................................................5-22 Table 5-19 Interfaces on the MTNC...................................................................................................................5-24 Table 5-20 Fuses on the MTNC.........................................................................................................................5-24 xviii
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Tables
Table 5-21 Technical specifications of the UG01MTNC...................................................................................5-25 Table 5-22 Technical specifications of the UG02MTNC...................................................................................5-25 Table 5-23 Indicator meaning of the TLDA/TLDB...........................................................................................5-26 Table 5-24 Technical specifications of the TLDA/TLDB subboards................................................................ 5-26 Table 5-25 Power consumption of the TS1C/TS2C/TS4C subboards...............................................................5-27 Table 6-1 Indicator meaning of the MCMF.........................................................................................................6-3 Table 6-2 Interfaces on the MCMF......................................................................................................................6-4 Table 6-3 Fuses on the MCMF.............................................................................................................................6-4 Table 6-4 Technical specifications of the MCMF................................................................................................6-4 Table 6-5 Indicator meaning of the MCMB.........................................................................................................6-6 Table 6-6 Interfaces on the MCMB......................................................................................................................6-6 Table 6-7 Fuses on the MCMB............................................................................................................................6-7 Table 6-8 Technical specifications of the MCMB...............................................................................................6-7 Table 6-9 Indicator meaning of the SCMU..........................................................................................................6-8 Table 6-10 Interfaces on the SCMU.....................................................................................................................6-9 Table 6-11 Technical specifications of the SCMU............................................................................................ 6-10 Table 6-12 Indicator meaning of the MPPB.......................................................................................................6-11 Table 6-13 Interfaces on the MPPB................................................................................................................... 6-12 Table 6-14 Fuses on the MPPB..........................................................................................................................6-12 Table 6-15 Technical specifications of the MPPB.............................................................................................6-13 Table 7-1 Indicator meaning of the MHRU.........................................................................................................7-4 Table 7-2 Interface on the MHRU........................................................................................................................7-5 Table 7-3 Fuses on the UG02MHRU.A...............................................................................................................7-5 Table 7-4 Fuses on the UG02MHRU.C...............................................................................................................7-6 Table 7-5 Technical specifications of the MHRU................................................................................................7-6 Table 7-6 Indicator meaning of the MHRD.........................................................................................................7-8 Table 7-7 Interfaces on the MHRD......................................................................................................................7-9 Table 7-8 Fuses on the MHRD.............................................................................................................................7-9 Table 7-9 Technical specifications of the MHRD..............................................................................................7-10 Table 7-10 Service processing capability of the MHRD....................................................................................7-10 Table 7-11 Indicator meaning of the D1GO.......................................................................................................7-11 Table 7-12 Technical specifications of the D1GO.............................................................................................7-11 Table 7-13 Indicator meaning of the D8FT........................................................................................................7-12 Table 7-14 Technical specifications of the D8FT..............................................................................................7-12 Table 7-15 Indicator meaning of the MRPU......................................................................................................7-14 Table 7-16 Interfaces on the MRPU...................................................................................................................7-15 Table 7-17 Fuses on the MRPU......................................................................................................................... 7-15 Table 7-18 Technical specifications of the MRPU............................................................................................ 7-16 Table 7-19 Indicator meaning of the MASU......................................................................................................7-18 Table 7-20 Interfaces on the MASU...................................................................................................................7-19 Table 7-21 Fuses on the UG02MASU.A............................................................................................................7-19 Table 7-22 Fuses on the UG02MASU.C............................................................................................................7-20 Issue 05 (2009-01-09)
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Table 7-23 Technical specifications of the MASU............................................................................................7-20 Table 7-24 Indicator meaning of the MIOE.......................................................................................................7-22 Table 7-25 Interfaces on the MIOE....................................................................................................................7-23 Table 7-26 Fuses on the MIOE...........................................................................................................................7-24 Table 7-27 Technical specifications of the MIOE..............................................................................................7-24 Table 7-28 Indicator meaning of the MSPF.......................................................................................................7-26 Table 7-29 Interface on the MSPF.....................................................................................................................7-26 Table 7-30 Fuses on the MSPF...........................................................................................................................7-26 Table 7-31 Technical specifications of the MSPF..............................................................................................7-27 Table 7-32 Technical specifications of the SHPU subboard..............................................................................7-27 Table 8-1 Indicator meaning of the MFLU..........................................................................................................8-3 Table 8-2 Fuses on the MFLU..............................................................................................................................8-4 Table 8-3 Technical specifications of the MFLU.................................................................................................8-5 Table 8-4 Indicator meaning of the MBLU..........................................................................................................8-7 Table 8-5 Interfaces on the MBLU.......................................................................................................................8-9 Table 8-6 Fuses on the MBLU.............................................................................................................................8-9 Table 8-7 Technical specifications of the MBLU..............................................................................................8-10 Table 8-8 Indicator meaning of the MNLU........................................................................................................8-12 Table 8-9 Interfaces on the MNLU....................................................................................................................8-13 Table 8-10 Fuses on the MNLU.........................................................................................................................8-13 Table 8-11 Technical specifications of the MNLU............................................................................................8-13 Table 9-1 Indicator meaning of the MVPB..........................................................................................................9-4 Table 9-2 Interfaces on the MVPB.......................................................................................................................9-5 Table 9-3 Fuses on the MVPB.............................................................................................................................9-6 Table 9-4 Power consumption and heat dissipation of theMVPB........................................................................9-6 Table 9-5 Service processing capability of the MVPB........................................................................................9-6 Table 9-6 Technical specifications of the MVDB subboard................................................................................9-7 Table 9-7 Technical specifications of the MECC/MECE/MECF/MECG/MECH/MECI/MECJ/MECK subboards ...............................................................................................................................................................................9-8 Table 9-8 Technical specifications of the UG01MECL subboard.......................................................................9-9 Table 9-9 Technical specifications of the MVDD subboard................................................................................9-9 Table 9-10 Indicator meaning of the MVPD......................................................................................................9-13 Table 9-11 Interfaces on the MVPD...................................................................................................................9-14 Table 9-12 Fuses on the MVPD.........................................................................................................................9-15 Table 9-13 Power consumption and heat dissipation of the MVPD..................................................................9-15 Table 9-14 Technical specifications of the MVPD............................................................................................9-15 Table 9-15 Technical specifications of the MVQE subboard............................................................................9-17 Table 9-16 Technical specifications of the MVDD subboard............................................................................9-17 Table 9-17 Technical specifications of the UG01MVDF subboard...................................................................9-18 Table 9-18 Technical specifications of the UG01MECL subboard...................................................................9-18 Table 9-19 Indicator meaning of the MTCB......................................................................................................9-21 Table 9-20 Interfaces on the MTCB...................................................................................................................9-22 Table 9-21 Fuses on the MTCB.........................................................................................................................9-23 xx
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Tables
Table 9-22 Power consumption and heat dissipation of the MTCB...................................................................9-23 Table 9-23 Service processing capability of the MTCB.................................................................................... 9-23 Table 9-24 Indicator meaning of the MTCD......................................................................................................9-25 Table 9-25 Interfaces of the MTCD...................................................................................................................9-26 Table 9-26 Fuses on the MTCD.........................................................................................................................9-27 Table 9-27 Technical specifications of the MTCD............................................................................................9-27 Table 9-28 Indicator meaning of the MECU......................................................................................................9-29 Table 9-29 Interface on the MECU....................................................................................................................9-30 Table 9-30 Fuses on the MECU.........................................................................................................................9-30 Table 9-31 Technical specifications of the UG01MECU...................................................................................9-31 Table 9-32 Technical specifications of the UG02MECU...................................................................................9-31 Table 9-33 Technical specifications of the MECC/MECF/MECG/MECJ/MECK subboards...........................9-32 Table 10-1 Indicator meaning of the ME32....................................................................................................... 10-3 Table 10-2 Interfaces on the ME32....................................................................................................................10-4 Table 10-3 DIP switches of the UG01ME32......................................................................................................10-5 Table 10-4 Setting DIP switches of the UG01ME32 (75-ohm E1 coaxial cable)..............................................10-5 Table 10-5 Setting DIP switches of the UG01ME32 (120-ohm E1 twisted pair)..............................................10-5 Table 10-6 DIP switches of the UG02ME32......................................................................................................10-6 Table 10-7 Setting DIP switches of the UG02ME32 (75-ohm E1 coaxial cable)..............................................10-6 Table 10-8 Setting DIP switches of the UG02ME32 (120-ohm E1 twisted pair)..............................................10-7 Table 10-9 Fuses on the ME32...........................................................................................................................10-7 Table 10-10 Fuses on the ME32.........................................................................................................................10-7 Table 10-11 Technical specifications of the ME32............................................................................................10-7 Table 10-12 Indicator meaning of the MESU....................................................................................................10-9 Table 10-13 Interfaces on the MESU...............................................................................................................10-10 Table 10-14 DIP switches of the MESU..........................................................................................................10-11 Table 10-15 Setting DIP switches of the MESU (75-ohm E1 coaxial cable)..................................................10-11 Table 10-16 Setting DIP switches of the MESU (120-ohm E1 twisted pair)...................................................10-11 Table 10-17 Fuses on the MESU......................................................................................................................10-12 Table 10-18 Technical specifications of the MESU.........................................................................................10-12 Table 10-19 Indicator meaning of the MT32...................................................................................................10-14 Table 10-20 Interfaces on the MT32................................................................................................................10-14 Table 10-21 DIP switches of the UG01MT32..................................................................................................10-15 Table 10-22 Setting DIP switches of the UG01MT32 (100-ohm T1 cable)....................................................10-16 Table 10-23 DIP switches of the UG02MT32..................................................................................................10-16 Table 10-24 Setting DIP switches of the UG02MT32 (100-ohm T1 cable)....................................................10-16 Table 10-25 Fuses on the UG01MT32.............................................................................................................10-17 Table 10-26 Fuses on the MT32.......................................................................................................................10-17 Table 10-27 Technical specifications of the MT32..........................................................................................10-17 Table 10-28 Indicator meaning of the MTSU..................................................................................................10-19 Table 10-29 Interfaces on the MTSU...............................................................................................................10-20 Table 10-30 DIP switches of the MTSU..........................................................................................................10-20 Issue 05 (2009-01-09)
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Table 10-31 Setting DIP switches of the MTSU (100-ohm T1 cable).............................................................10-21 Table 10-32 Fuses on the MTSU......................................................................................................................10-21 Table 10-33 Technical specifications of the MTSU.........................................................................................10-22 Table 10-34 Indicator meaning of the MPIE....................................................................................................10-23 Table 10-35 Interfaces on the MPIE.................................................................................................................10-25 Table 10-36 Fuses on the MPIE.......................................................................................................................10-25 Table 10-37 Technical specifications of the MPIE..........................................................................................10-25 Table 10-38 Technical specifications of the ME3A subboard.........................................................................10-26 Table 10-39 Indicator meaning of the MEAC..................................................................................................10-27 Table 10-40 Interfaces on the MEAC...............................................................................................................10-28 Table 10-41 DIP switches of the MEAC..........................................................................................................10-28 Table 10-42 Setting DIP switches of the MEAC (75-ohm E1 coaxial cable)..................................................10-29 Table 10-43 Setting DIP switches of the MEAC (120-ohm E1 twisted pair)..................................................10-29 Table 10-44 Fuses on the MEAC.....................................................................................................................10-30 Table 10-45 Technical specifications of the MEAC........................................................................................10-30 Table 10-46 Indicator meaning of the MTAC..................................................................................................10-32 Table 10-47 Interfaces on the MTAC...............................................................................................................10-33 Table 10-48 DIP switches of the MTAC..........................................................................................................10-33 Table 10-49 Setting DIP switches of the MTAC (100-ohm T1 cable)............................................................10-34 Table 10-50 Fuses on the MTAC.....................................................................................................................10-34 Table 10-51 Technical specifications of the MTAC........................................................................................10-34 Table 11-1 Indicator meaning of the MS2L.......................................................................................................11-3 Table 11-2 Interfaces on the MS2L....................................................................................................................11-5 Table 11-3 Fuses on the MS2L...........................................................................................................................11-5 Table 11-4 Technical specifications of the MS2L..............................................................................................11-5 Table 11-5 Power consumption and heat dissipation of the UG01MS2L..........................................................11-6 Table 11-6 Power consumption and heat dissipation of the UG02MS2L..........................................................11-6 Table 11-7 Indicator meaning of the MS2E.......................................................................................................11-8 Table 11-8 Interfaces on the MS2E....................................................................................................................11-9 Table 11-9 Fuses on the MS2E...........................................................................................................................11-9 Table 11-10 Technical specifications of the MS2E............................................................................................11-9 Table 11-11 Power consumption and heat dissipation of the UG01MS2E......................................................11-10 Table 11-12 Power consumption and heat dissipation of the UG02MS2E......................................................11-10 Table 11-13 Indicator meaning of the MS1L...................................................................................................11-12 Table 11-14 Interfaces on the MS1L................................................................................................................11-13 Table 11-15 Fuses on the MS1L.......................................................................................................................11-13 Table 11-16 Technical specifications of the MS1L..........................................................................................11-14 Table 11-17 Indicator meaning of the MS1E...................................................................................................11-16 Table 11-18 Interfaces on the MS1E................................................................................................................11-17 Table 11-19 Fuses on the MS1E.......................................................................................................................11-17 Table 11-20 Technical specifications of the MS1E..........................................................................................11-17 Table 12-1 Indicator meaning of the ME8T.......................................................................................................12-3 xxii
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Table 12-2 Interface on the ME8T.....................................................................................................................12-4 Table 12-3 Fuses on the ME8T..........................................................................................................................12-4 Table 12-4 Technical specifications of the ME8T.............................................................................................12-5 Table 12-5 Indicator meaning of the MG1O......................................................................................................12-7 Table 12-6 Interface on the MG1O....................................................................................................................12-8 Table 12-7 Fuses on the MG1O.A......................................................................................................................12-9 Table 12-8 Fuses on the MG1O.B......................................................................................................................12-9 Table 12-9 Technical specifications of the MG1O.............................................................................................12-9 Table 12-10 Indicator meaning of the MA4L..................................................................................................12-12 Table 12-11 Interfaces on the MA4L...............................................................................................................12-13 Table 12-12 Fuses on the MA4L......................................................................................................................12-13 Table 12-13 Technical specifications of the MA4L.........................................................................................12-13 Table 13-1 Indicator meaning of the MCLK......................................................................................................13-4 Table 13-2 Interfaces on the MCLK...................................................................................................................13-5 Table 13-3 Fuses on the MCLK.........................................................................................................................13-6 Table 13-4 Technical specifications of the MCLK............................................................................................13-7 Table 14-1 Interfaces on the MLPB...................................................................................................................14-3 Table 14-2 Technical specifications of the MLPB.............................................................................................14-3 Table 15-1 Connections of monitoring cables from the SSM frame to the fan box...........................................15-4 Table 15-2 Pin assignment of monitoring cables from the SSM frame to the fan box......................................15-4 Table 15-3 Technical specifications of the monitoring cables from the SSM frame to the fan box..................15-5 Table 15-4 Connections of monitoring cables from the SSM frame to the PDF and fan box...........................15-5 Table 15-5 Pin assignment of monitoring cables from the SSM frame to the PDF and fan box (1) ................15-6 Table 15-6 Pin assignment of monitoring cables from the SSM frame to the PDF and fan box (2).................15-6 Table 15-7 Technical specifications of the monitoring cables from the SSM frame to the fan box..................15-7 Table 15-8 Connections of alarm box RS422 serial port cables........................................................................15-7 Table 15-9 Pin assignment of alarm box RS422 serial port cables....................................................................15-8 Table 15-10 Technical specifications of the alarm box RS422 serial port cable...............................................15-8 Table 15-11 Connections of alarm box RS232 serial port cables......................................................................15-9 Table 15-12 Pin assignment of alarm box RS232 serial port cables..................................................................15-9 Table 15-13 Technical specifications of the alarm box RS232 serial port cables..............................................15-9 Table 15-14 Technical specifications of the FE cascading network cable.......................................................15-11 Table 15-15 Connections of the FE cascading network cables with two terminals at one end........................15-11 Table 15-16 Pin assignment of the FE cascading network cable with two terminals at one end.....................15-13 Table 15-17 Technical specifications of the FE cascading network cable with two terminals at one end......15-13 Table 15-18 Technical specifications of the GE cascading cable....................................................................15-15 Table 15-19 Technical specifications of the TDM cascading cable.................................................................15-17 Table 15-20 Pin assignments of the clock distribution cable...........................................................................15-19 Table 15-21 Technical specifications of the clock distribution cable..............................................................15-20 Table 15-22 Connections of the 8 kHz clock cable..........................................................................................15-21 Table 15-23 Pin assignment of the 8 kHz clock cable (1)................................................................................15-22 Table 15-24 Pin assignment of the 8 kHz clock cable (2)................................................................................15-22 Issue 05 (2009-01-09)
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Table 15-25 Technical specifications of the 8 kHz clock cable.......................................................................15-22 Table 15-26 Connections of the BITS clock cable...........................................................................................15-23 Table 15-27 Technical specifications of the 75-ohm BITS clock cable...........................................................15-24 Table 15-28 Technical specifications of the 120-ohm BITS clock cable.........................................................15-25 Table 15-29 Connections of the GPS clock cable............................................................................................15-25 Table 15-30 Technical specifications of the GPS clock cable......................................................................... 15-26 Table 15-31 Pin assignments of the 75-ohm E1 trunk cable............................................................................15-29 Table 15-32 Technical specifications of the 75-ohm E1 trunk cable...............................................................15-30 Table 15-33 Pin assignments of the new 120-ohm E1 trunk cable .................................................................15-32 Table 15-34 Pin assignments of the old 120-ohm E1 trunk cable ...................................................................15-33 Table 15-35 Technical specifications of the 120-ohm E1 trunk cable.............................................................15-34 Table 15-36 Connections of 75-ohm E3/T3 trunk cables.................................................................................15-36 Table 15-37 Technical specifications of the E3/T3 trunk cable with two BNC connectors............................ 15-36 Table 15-38 Technical specifications of the E3/T3 trunk cable with one BNC connector..............................15-37 Table 15-39 Connections of SDH trunk cables................................................................................................15-37 Table 15-40 Technical specifications of the SDH trunk cable.........................................................................15-38 Table 15-41 Connections of the internal trunk cable between the SSM frame and the SIWF frame.............. 15-38 Table 15-42 pin assignment of the DB100PIN connector of the internal trunk cable between the SSM frame and the SIWF frame.................................................................................................................................................15-40 Table 15-43 Technical specifications of the internal trunk cable between the SSM frame and the SIWF frame ...........................................................................................................................................................................15-41 Table 15-44 Technical specifications of the straight through cable.................................................................15-42 Table 15-45 Technical specifications of the crossover cable...........................................................................15-43 Table 15-46 Technical specifications of the external optical fiber...................................................................15-45 Table 15-47 Technical specifications of –48 V power cables..........................................................................15-47 Table 15-48 Technical specifications of RTN power cables............................................................................15-48 Table 15-49 Technical specifications of PGND cables....................................................................................15-49 Table 15-50 Technical specifications of the PGND feeder cable.....................................................................15-50 Table 15-51 Technical specifications of the PGND feeder cable of SSM frame.............................................15-52 Table A-1 Pin assignment of the RJ45 connector of the 120-ohm twisted pair..................................................A-2 Table B-1 Indicator meaning of the MA4L.........................................................................................................B-3 Table B-2 Indicator meaning of the MASU........................................................................................................B-4 Table B-3 Indicator meaning of the MBLU........................................................................................................B-4 Table B-4 Indicator meaning of the MCMB........................................................................................................B-6 Table B-5 Indicator meaning of the MCMF........................................................................................................B-6 Table B-6 Indicator meaning of the ME32..........................................................................................................B-7 Table B-7 Indicator meaning of the ME8T..........................................................................................................B-8 Table B-8 Indicator meaning of the MEAC........................................................................................................B-9 Table B-9 Indicator meaning of the MECU......................................................................................................B-10 Table B-10 Indicator meaning of the MESU.....................................................................................................B-10 Table B-11 Indicator meaning of the MFLU.....................................................................................................B-11 Table B-12 Indicator meaning of the MG1O.....................................................................................................B-12 Table B-13 Indicator meaning of the MHRU....................................................................................................B-13 xxiv
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Table B-14 Indicator meaning of the MHRD....................................................................................................B-14 Table B-15 Indicator meaning of the MIOE......................................................................................................B-15 Table B-16 Indicator meaning of the MMPB....................................................................................................B-16 Table B-17 Indicator meaning of the MMPU....................................................................................................B-16 Table B-18 Indicator meaning of the MNET.....................................................................................................B-17 Table B-19 Indicator meaning of clock interfaces on the MNET......................................................................B-18 Table B-20 Indicator meaning of the MNLU....................................................................................................B-19 Table B-21 Indicator meaning of the MOMB...................................................................................................B-20 Table B-22 Indicator meaning of the MOMU...................................................................................................B-21 Table B-23 Indicator meaning of the MPIE......................................................................................................B-22 Table B-24 Indicator meaning of the MPPB.....................................................................................................B-23 Table B-25 Indicator meaning of the MRPU.....................................................................................................B-24 Table B-26 Indicator meaning of the MS1E......................................................................................................B-24 Table B-27 Indicator meaning of the MS1L......................................................................................................B-26 Table B-28 Indicator meaning of the MS2E......................................................................................................B-27 Table B-29 Indicator meaning of the MS2L......................................................................................................B-28 Table B-30 Indicator meaning of the MSPF......................................................................................................B-30 Table B-31 Indicator meaning of the MT32......................................................................................................B-30 Table B-32 Indicator meaning of the MTAC....................................................................................................B-31 Table B-33 Indicator meaning of the MTCB.....................................................................................................B-32 Table B-34 Indicator meaning of the MTCD....................................................................................................B-33 Table B-35 Indicator meaning of the MTNB....................................................................................................B-33 Table B-36 Indicator meaning of the MTNC....................................................................................................B-35 Table B-37 Indicator meaning of the MTNU....................................................................................................B-36 Table B-38 Indicator meaning of the MTSU.....................................................................................................B-37 Table B-39 Indicator meaning of the MVPB.....................................................................................................B-38 Table B-40 Indicator meaning of the MVPD....................................................................................................B-39 Table B-41 Indicator meaning of the TCLU......................................................................................................B-40 Table B-42 Indicator meaning of the SCMU.....................................................................................................B-41 Table C-1 DIP switches of the UG01ME32........................................................................................................C-2 Table C-2 Setting DIP switches of the UG01ME32 (75-ohm E1 coaxial cable)................................................C-3 Table C-3 Setting DIP switches of the UG01ME32 (120-ohm E1 twisted pair)................................................C-3 Table C-4 DIP switches of the UG02ME32........................................................................................................C-3 Table C-5 Setting DIP switches of the UG02ME32 (75-ohm E1 coaxial cable)................................................C-4 Table C-6 Setting DIP switches of the UG02ME32 (120-ohm E1 twisted pair)................................................C-4 Table C-7 DIP switches of the MEAC................................................................................................................C-4 Table C-8 Setting DIP switches of the MEAC (75-ohm E1 coaxial cable)........................................................C-5 Table C-9 Setting DIP switches of the MEAC (120-ohm E1 twisted pair).........................................................C-5 Table C-10 DIP switches of the MESU...............................................................................................................C-6 Table C-11 Setting DIP switches of the MESU (75-ohm E1 coaxial cable).......................................................C-6 Table C-12 Setting DIP switches of the MESU (120-ohm E1 twisted pair).......................................................C-6 Table C-13 Jumper description of the MMPU....................................................................................................C-7 Issue 05 (2009-01-09)
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Table C-14 Jumper description of the MOMU....................................................................................................C-7 Table C-15 DIP switches of the UG01MT32......................................................................................................C-7 Table C-16 Setting DIP switches of the UG01MT32 (100-ohm T1 cable).........................................................C-8 Table C-17 DIP switches of the UG02MT32......................................................................................................C-8 Table C-18 Setting DIP switches of the UG02MT32 (100-ohm T1 cable).........................................................C-9 Table C-19 DIP switches of the MTAC..............................................................................................................C-9 Table C-20 Setting DIP switches of the MTAC (100-ohm T1 cable)...............................................................C-10 Table C-21 DIP switches of the MTSU.............................................................................................................C-10 Table C-22 Setting DIP switches of the MTSU (100-ohm T1 cable)...............................................................C-11 Table D-1 Equipment and resource management units.......................................................................................D-1 Table D-2 Service and protocol processing units................................................................................................D-3 Table D-3 Switching and cascading units...........................................................................................................D-5 Table D-4 Interface units.....................................................................................................................................D-7 Table D-5 Media resource processing units......................................................................................................D-10 Table D-6 Clock units........................................................................................................................................D-11 Table D-7 Lightning protection units................................................................................................................D-12 Table E-1 Technical specifications of the MECC/MECF/MECG/MECJ/MECK subboards.............................E-2 Table E-2 Indicator meaning of the D1GO..........................................................................................................E-3 Table E-3 Technical specifications of the D1GO................................................................................................E-3 Table E-4 Indicator meaning of the D8FT...........................................................................................................E-4 Table E-5 Technical specifications of the D8FT.................................................................................................E-4 Table E-6 Technical specifications of the ME3A subboard................................................................................E-5 Table E-7 Technical specifications of the SHPU subboard.................................................................................E-6 Table E-8 Indicator meaning of the TLDA/TLDB..............................................................................................E-7 Table E-9 Technical specifications of the TLDA/TLDB subboards...................................................................E-7 Table E-10 Power consumption of the TS1C/TS2C/TS4C subboards................................................................E-8 Table E-11 Technical specifications of the MVDB subboard.............................................................................E-8 Table E-12 Technical specifications of the MECC/MECE/MECF/MECG/MECH/MECI/MECJ/MECK subboards ..............................................................................................................................................................................E-9 Table E-13 Technical specifications of the UG01MECL subboard..................................................................E-10 Table E-14 Technical specifications of the MVDD subboard...........................................................................E-10 Table E-15 Technical specifications of the MVQE subboard...........................................................................E-11 Table E-16 Technical specifications of the MVDD subboard...........................................................................E-12 Table E-17 Technical specifications of the UG01MVDF subboard..................................................................E-12 Table E-18 Technical specifications of the UG01MECL subboard..................................................................E-13
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HUAWEI UMG8900 Hardware Description
About This Document
About This Document
Purpose This document describes hardware components of the Universal Media Gateway (UMG8900), including cabinets, frames, boards, cables. This document provides general guide for equipment installation and routine operation.
Related Versions The following table lists the product versions related to this document. Product Name
Version
HUAWEI UMG8900
V200R007
Intended Audience The intended audiences of this document are: l
Network administrator
l
System engineer
l
Installation technician
l
Operation and maintenance engineer
Update History Updates between document versions are cumulative. Therefore, the latest document version contains all updates made to previous versions. Updates in Issue 05 (2009-01-09) Fourth commercial release. Updates in Issue 04 (2008-04-11) Third commercial release. The updated contents are as follows. The MCLK is added as the fixed board in the SSM -32 main control frame. The MMPB is deleted from the fixed boards in the SSM-32 service frames. Cable description is optimized. Updates in Issue 03 (2008-02-26) Issue 05 (2009-01-09)
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HUAWEI UMG8900 Hardware Description
About This Document
Second commercial release. The updated contents are as follows. The description of the EMU is added. The technical specifications of the cabinet and frame are modified. Updates in Issue 02 (2007-11-28) Initial commercial release. The updated contents are as follows. The description of the new features is added. Updates in Issue 01 (2007-10-18) Initial field trial release
Organization This document describes hardware components of the Universal Media Gateway (UMG8900), including cabinets, frames, boards, cables. 1 Cabinets This describes the cabinets and accessories of the UMG8900. 2 Frames This describes the service switching module (SSM) frames, fan boxes, transfer boxes, frame backplanes, board positions, and logic types of frames. 3 Boards This describes the board types, matching limitation, connection between boards, and universal features of the boards. 4 Equipment Management and Maintenance Units The equipment management and maintenance units consist of MOMU, MOMB, MMPU, and MMPB. 5 IP and TDM Switching Units The IP and TDM switching units consist of MNET, MTNU, TCLU, MTNB, and MTNC. 6 Resource and Management Units The resource and management units consist of MCMF, MCMB, and MPPB. 7 Service and Protocol Processing Units The service and protocol processing units consist of MHRU, MRPU, MASU, MIOE, and MSPF. 8 Cascading Units The cascading units consist of MFLU, MBLU, and MNLU. 9 Media Resource Processing Units The media resource processing units consist of MVPB, MVPD, MTCB, MTCD, MECU. 10 E1/T1 and E3/T3 Interface Units 2
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About This Document
The E1/T1 and E3/T3 interface units consist of ME32, MESU, MT32, MTSU, MPIE, MEAC, MTAC. 11 SDH Interface Units The SDH interface units consist of MS2L, MS2E, MS1L, and MS1E. 12 Packet Interface Units The packet interface units consist of ME8T, MG1O, MA4L, MP4L, and MP1H. 13 Clock Units This describes the functions, panels and structures, indicators, interfaces, DIP switches and jumpers, fuses, and technical specifications of the MCLK. 14 Lightning Protection Units This describes the functions, panels and structures, indicators, interfaces, DIP switches and jumpers, fuses, and technical specifications of the MLPB. 15 Cables This describes the appearance and structure, signals, and technical specifications of cables of the UMG8900. A Impedance Transfer Boxes B Board Indicators of All SSM Frames C Board DIP Switches and Jumpers of all SSM Frames D Boards of All SSM Frames E Subboards of all SSM Frames
Conventions Symbol Conventions The symbols that may be found in this document are defined as follows. Symbol
Description Indicates a hazard with a high level of risk, which if not avoided,will result in death or serious injury. Indicates a hazard with a medium or low level of risk, which if not avoided, could result in minor or moderate injury. Indicates a potentially hazardous situation, which if not avoided,could result in equipment damage, data loss, performance degradation, or unexpected results.
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About This Document
Symbol
Description Indicates a tip that may help you solve a problem or save time. Provides additional information to emphasize or supplement important points of the main text.
General Conventions The general conventions that may be found in this document are defined as follows. Convention
Description
Times New Roman
Normal paragraphs are in Times New Roman.
Boldface
Names of files, directories, folders, and users are in boldface. For example, log in as user root.
Italic
Book titles are in italics.
Courier New
Examples of information displayed on the screen are in Courier New.
Command Conventions The command conventions that may be found in this document are defined as follows. Convention
Description
Boldface
The keywords of a command line are in boldface.
Italic
Command arguments are in italics.
[]
Items (keywords or arguments) in brackets [ ] are optional.
{ x | y | ... }
Optional items are grouped in braces and separated by vertical bars. One item is selected.
[ x | y | ... ]
Optional items are grouped in brackets and separated by vertical bars. One item is selected or no item is selected.
{ x | y | ... }*
Optional items are grouped in braces and separated by vertical bars. A minimum of one item or a maximum of all items can be selected.
[ x | y | ... ]*
Optional items are grouped in brackets and separated by vertical bars. Several items or no item can be selected.
GUI Conventions The GUI conventions that may be found in this document are defined as follows.
4
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Convention
Description
Boldface
Buttons, menus, parameters, tabs, window, and dialog titles are in boldface. For example, click OK.
>
Multi-level menus are in boldface and separated by the ">" signs. For example, choose File > Create > Folder .
Keyboard Operations The keyboard operations that may be found in this document are defined as follows. Format
Description
Key
Press the key. For example, press Enter and press Tab.
Key 1+Key 2
Press the keys concurrently. For example, pressing Ctrl+Alt +A means the three keys should be pressed concurrently.
Key 1, Key 2
Press the keys in turn. For example, pressing Alt, A means the two keys should be pressed in turn.
Mouse Operations The mouse operations that may be found in this document are defined as follows.
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Action
Description
Click
Select and release the primary mouse button without moving the pointer.
Double-click
Press the primary mouse button twice continuously and quickly without moving the pointer.
Drag
Press and hold the primary mouse button and move the pointer to a certain position.
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HUAWEI UMG8900 Hardware Description
1 Cabinets
1
Cabinets
About This Chapter This describes the cabinets and accessories of the UMG8900. The UMG8900 can be installed in the N68-22 cabinet or the N68E-22 cabinet. The N68E-22 cabinet is the enhanced N68-22 cabinet. The N68E-22 cabinet is light to move and easy to install. The UMG8900 supports two configurations of cabinet. One is the assembly cabinet in which only the SSM frames can be configured. Up to three frames can be configured in the UMG8900 assembly cabinet. The other one is the extended assembly cabinet. It is used when shared interworking function (SIWF) devices are applied. 1.1 N68-22/N68E-22 Cabinet This describes the structure and mechanical parameters of the cabinet, as well as configurations of internal components, configuration description, N800 supports, N6X supports, and accessories when the cabinets are used as UMG8900 assembly cabinet and UMG8900 extended assembly cabinet. 1.2 Auxiliary Devices The UMG8900 is managed and maintained through the local maintenance terminal (LMT) and realizes the alarm function through the auxiliary alarm box. In addition, the UMG8900 monitors the environmental parameters through the environment monitoring unit. 1.3 Environmental Specifications This describes the environmental specifications of the cabinets.
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1 Cabinets
1.1 N68-22/N68E-22 Cabinet This describes the structure and mechanical parameters of the cabinet, as well as configurations of internal components, configuration description, N800 supports, N6X supports, and accessories when the cabinets are used as UMG8900 assembly cabinet and UMG8900 extended assembly cabinet. The UMG8900 integrated equipment adopts N68-22 cabinet or N68E-22 cabinet. The power distribution frame (PDF) is located on top of each cabinet. Horizontal wiring trough, cabling trough, and side hang fiber coiler are installed on the back of the cabinet. The UMG8900 supports the two configurations of cabinet. One is the UMG8900 assembly cabinet in which only the SSM frames can be configured. Up to three frames can be configured in the UMG8900 assembly cabinet. The other one is UMG8900 extended assembly cabinet. It is used when shared interworking function (SIWF) devices are applied. 1.1.1 Structure of N68-22 Cabinet This describes the overall structure of the N68-22 cabinet. 1.1.2 Structure of the N68E-22 Cabinet This describes the overall structure of the N68-22 cabinet. 1.1.3 Configuration of Internal Components This describes the configuration of internal components when the cabinet is used as a UMG8900 assembly cabinet , UMG8900 extended assembly cabinet. 1.1.4 N800 Supports and Accessories This describes the N800 supports and accessories for the N68-22 cabinet. 1.1.5 N6X Supports and Accessories This describes the N6X supports and accessories for the N68E-22 cabinet. 1.1.6 Power Distribution Frames This describes the power distribution frame (PDF) of internal components of the cabinet. 1.1.7 LAN Switches This describes the LAN Switch of internal components of the cabinet. 1.1.8 LAN Switch Cable Frames This describes the LAN Switch cable frame of internal components of the cabinet. 1.1.9 Cabling Troughs This describes the cabling trough of internal components of the cabinet. 1.1.10 Fiber Management Tray This describes the side hang fiber coiler and back fiber management tray (FMT) of internal components of the cabinet. 1.1.11 Structures and Mechanical Specifications of the N68-22 Cabinets This describes the mechanical specifications of the N68-22 cabinets. 1.1.12 Technical Specifications of N68E-22 Cabinets This describes the technical specifications of the N68E-22 cabinet.
1.1.1 Structure of N68-22 Cabinet This describes the overall structure of the N68-22 cabinet. 1-2
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The dimension of the N68-22 cabinet is 2200 mm [87 in.] x 600 mm [24 in.] x 800 mm [32 in.] (H x W x D). Figure 1-1 shows the appearance. Figure 1-1 Appearance of the N68-22 cabinet 600 800
2200
An N68-22 cabinet consists of racks, doors, frames, power distribution frames (PDFs), horizontal wiring troughs, and cabling troughs. The wire bushing can be installed on the front and back sides of racks for laying cables. Figure 1-2 shows the overall structure of the N68-22 cabinet.
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Figure 1-2 Structure of the N68-22 cabinet 2
1
5
4 3
1. Rack
2. Left panel
3. Right panel
4. Front door
5. Back door
There are cabling holes at the top and the bottom of the cabinet. You can choose the overhead cabling or underfloor cabling mode according to actual conditions of equipment room. Rodentproof nets at the cabling holes can cover the holes after cabling to prevent animals from entering the cabinet. Wire bushings on the side columns of the cabinet, and horizontal wiring troughs and cabling troughs at the back of the cabinet can facilitate the operation of laying and bundling internal cables. The mount bars on the side columns are used to fix SSM frames and other internal components. At the back of the cabinet, grounding bars on the side columns are used to connect to the protection grounding (PGND) cables of internal components and PGND cables between cabinets. The cabinet uses double door leaves for both front door and back door, saving the installation space and facilitating operations to the equipment. In addition, side panels are hung on the cabinet.
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The front and back doors and bottom plate all have minute air vents with air filters inside. The front-in, back-out and bottom-to-top ventilation modes inside the cabinet realize excellent heat dissipation and dust-proof functions. In conjunction with the N800 supports and guide rails, the N68-22 cabinet can be installed on the ESD-preventive floor or on the cement floor in the equipment room.
1.1.2 Structure of the N68E-22 Cabinet This describes the overall structure of the N68-22 cabinet. The dimensions (H x W x D) of the N68E-22 cabinet is 2200 mm x 600 mm x 800 mm. Figure 1-3 shows the appearance. Figure 1-3 Appearance of the N68E-22 cabinet
Figure 1-4 shows the structure of the N68E-22 cabinet. Issue 05 (2009-01-09)
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Figure 1-4 Structure of the N68E-22 cabinet 4
3
5
2 6
1
1. Front door
2. Front mount angle
3. Side panel
4. Rack
5. Back door
6. Back mount angle
An N68E-22 cabinet consists of racks, doors, frames, power distribution boxes (PDBs), and horizontal wiring troughs. 1-6
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l
The front door and the back door are single-leaf doors with locks on the left side. The side panels are externally fixed with screws.
l
The front mount angles in the cabinet are used to fix internal components. The grounding points on the back mount angles are used for grounding of internal components and connections of protection ground (PGND) cables between cabinets.
l
Wire bushings on the front and back columns of the cabinet can facilitate the operation of laying and bundling internal cables. Figure 1-5 shows the appearance and structure of the wire bushing. Figure 1-5 Appearance and structure of the wire bushing
l
The side hang fiber coiler can be installed on the back column of the cabinet to provide the cabling routes and space for optical fibers.
l
The N68E-22 cabinet can be installed either on the ESD-preventive floor or on the cement floor directly. When the N68E-22 cabinet is installed on the ESD-preventive floor, the N6X supports must be used.
1.1.3 Configuration of Internal Components This describes the configuration of internal components when the cabinet is used as a UMG8900 assembly cabinet , UMG8900 extended assembly cabinet.
UMG8900 Assembly Cabinet The UMG8900 assembly cabinet adopts standard 19-inch frames. The internal components include power distribution frame (PDF), SSM frame, back fiber management tray (FMT), horizontal wiring trough, and cabling trough. Figure 1-6 shows the full configuration of internal components of the UMG8900 assembly cabinet.
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Figure 1-6 Structure of the UMG8900 assembly cabinet
3
7
4
5
8
6
9
4
5
8
6
9
4
5
8
6
9
1
2
1. Front view
2. Rear view
3. Power distribution frame
4. SSM frame
5. Fan box
6. Filler panel
7. Horizontal wiring trough
8. Rear cabling trough
9. Back fiber management tray
NOTE
The fan box is at the bottom of the SSM frame.
UMG8900 Extended Assembly Cabinet The UMG8900 extended assembly cabinet is used when the shared interworking function (SIWF) device is applied. The internal components of the UMG8900 extended assembly cabinet include PDF, SSM frame, SIWF, LAN Switch, LAN Switch cable frame. The LAN Switch works in conjunction with the 1-8
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SIWF. Figure 1-7 shows the full configuration of internal components of the UMG8900 extended assembly cabinet. Figure 1-7 Structure of the UMG8900 extended assembly cabinet
3
10
4
5 6
11 12
4 4 7 8
9
8 4 4 1 1. Front view
2. Rear view
5. SSM frame 6. Fan box
2 3. Power distribution frame 4. Filler panel 7. LAN Switch
9. SIWF frame 10. Horizontal wiring trough 11. Rear cabling trough
8. LAN Switch cable frame 12. Back fiber management tray
NOTE
The fan box is at the bottom of the SSM frame.
1.1.4 N800 Supports and Accessories This describes the N800 supports and accessories for the N68-22 cabinet. Issue 05 (2009-01-09)
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N800 Supports An N800 support assembly contains the support, horizontal pallet assembly, and side pallet assembly. Supports are made from welded steel plates. They are used to block the cabinets up, thus facilitating floor paving and cabling. Before the whole set of equipment is grounded, insulation plates must be installed under the supports, and insulating coverings must be added to the expansion bolts to satisfy the insulation requirements. N800 supports have four kinds of components. Three kinds if components are height-adjustable and one kind of component is fixed in height. Figure 1-8 shows the appearance of the N800 support. Figure 1-8 Appearance of the N800 support 2 3
1
4 5
6
1. Connection hole for guide rail 2. Height mark of ESD-preventive floor 3. Upper support 4. Height-locking bolt
5. Lower support
6. Mounting hole to the ground
Table 1-1 lists the applicable height range of each support type. Table 1-1 Applicable height range of each support type
1-10
Type
Height of the Applicable ESD-Preventive Floor (mm)
I
210 to 255
II
256 to 345
III
346 to 525
IV
Customized based on the floor height (minimum: 100 mm) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd.
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The floor height refers to the distance between the upper surface of the ESD-preventive floor and the cement floor.
The heights of the N800 series I, II, III supports can be adjusted within their ranges by moving the upper and lower supports up and down. N800 series IV supports are of fixed heights, which are suitable for the floors between 100 mm [3.9 in.] to 209 mm [8.2 in.] or higher than 525 mm [20.7 in.]
Horizontal Pallet Assembly The horizontal pallet assembly includes the following: l
Horizontal pallet The pallets support the floor around the cabinet. They can be divided into front and back horizontal pallets, and side pallets.
l
Fixing bracket for the pallet The fixing brackets fix the pallets. They are installed under guide rails and used to connect guide rails and front and back horizontal pallets.
l
Guide rail The guide rails connect cabinets and supports. They are used to move the equipment and adjust the equipment positions. They can join two supports and a cabinet together to keep the cabinet in a horizontal line and keep the connection stable. The guide rail can absorb the vibrations because of its elasticity.
A cabinet uses one horizontal pallet assembly, which includes two guide rails, two horizontal pallets and two fixing pallets. Figure 1-9, Figure 1-10 and Figure 1-11 show appearances of them. Figure 1-9 Appearance of the guide rail 1
2
1. Connection hole for the rack
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2. Connection hole for the support
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Figure 1-10 Appearance of the horizontal pallet
1
2 1
1. Connection nut for the side pallet
2. Connection hole for the horizontal pallet
Figure 1-11 Appearance of the fixing bracket 1
2
1. Connection hole for guide rail
2. Connection hole for the horizontal pallet
Side Pallet Assembly Each side pallet assembly includes two side pallets and four fixing brackets. The side pallets support the floor on both sides of the cabinet. Figure 1-12 shows the appearance of the side pallet.
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Figure 1-12 Appearance of the side pallet
1
1. Connection hole for the horizontal pallet
The number of side pallet assemblies varies with the installation mode: l
In single cabinet installation, one cabinet uses one side pallet assembly.
l
In combined cabinet installation, a row of cabinets use one side pallet assembly.
Quantity of Supports and Pallet Assemblies To connect cabinets, 2N mode is used to determine the number of supports to be used. That is, each N68-22 cabinet uses two supports and N cabinets in a row need 2N supports. Each cabinet has one set of floor holder-guide rail assemblies, and the sets are delivered together with the supports. Each set of pallet assembly includes two slide rails, two side pallets, two fixing brackets and two horizontal pallets. Each cabinet needs two fixing brackets, two horizontal pallets, and cabinets in each row need two side pallets, even if there is only one cabinet in a row.
1.1.5 N6X Supports and Accessories This describes the N6X supports and accessories for the N68E-22 cabinet.
N6X Supports An N6X support assembly contains the support, guide rail, and front pallet. Supports are made from welded steel plates. They are used to block the cabinets up, thus facilitating floor paving and cabling. Before the whole set of equipment is grounded, insulation plates must be installed under the supports and insulating coverings must be added to the expansion bolts to satisfy the insulation requirements. N6X supports have two kinds of components. One kind of components are height-adjustable and the other kind of components are fixed in height. The height of the support can be adjusted based on the height of the floor on site. Figure 1-13 shows the appearance of the N6X support.
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Figure 1-13 Appearance of the N6X support
1. Connection hole for the guide rail 2. Connection hole for the front pallet 3. Height mark of the antistatic floor 4. Height-locking bolt
5. Mounting hole to the ground
-
Table 1-2 lists the applicable height range of each type of the support. Table 1-2 Applicable height range of each type of the support Type
Height of the Applicable ESD-Preventive Floor (mm)
I Height-adjustable support
296 to 465
II Height-fixed support
Customized based on the floor height (minimum: 100 mm)
NOTE
The floor height refers to the distance between the upper surface of the antistatic floor and the cement floor.
The height of N6X support I can be adjusted within its range by moving the upper and lower supports up and down. N6X support II is fixed in height, which is suitable for the floors between 100 mm to 209 mm or higher than 465 mm. One cabinet uses two supports of the same height. 1-14
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Pallet Assembly The pallet assembly includes the following: l
Guide rail The guide rails connect cabinets and supports. They are used to move the equipment and adjust the equipment positions. They can join two supports and a cabinet together to keep the cabinet in a horizontal line and keep the connection stable. The guide rail can absorb the vibrations because of its elasticity. Figure 1-14 Appearance of the guide rail 1
2
1. Connection hole for the rack
l
2. Connection hole for the support
Pallet The pallets support the floor around the cabinet. Two pallets are used to support one cabinet. Figure 1-15 Appearance of the pallet
1. Connection hole for the support
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Quantity of N6X Support Assemblies A set of N6X support assembly consists of one guide rail assembly, one pallet assembly, and one N6X support. When the cabinet is installed on the antistatic floor, the quantity of the N6X support assemblies required is 2N (N refers to a number). That is, each N68E-22 cabinet requires two sets of N6X support assemblies. If N cabinets are installed in a row, the quantity of N6X support assemblies is 2N.
1.1.6 Power Distribution Frames This describes the power distribution frame (PDF) of internal components of the cabinet.
Functions The PDF is installed at the top of a cabinet. It has two -48 V/-60 V DC input power supplies and provides six -48 V/-60 V DC power supplies through six miniature circuit breakers to the frames in the cabinet after internal processing of lightning protection. The PDF detects the input voltage, and the output power after distribution. When the PDF detects the fault, audible and visual alarm occurs. The PDF supports two types of power distribution mode. One is the DC-C, that is the protection ground (PGND) is connected with the return ground (RTN). The other is DC-I, that is the PGND cannot be connected with the RTN. If the DC-I mode is adopted, you need to take down the mental bar connecting the PGND and RTN at the power input terminal block.
Appearance and Structure Figure 1-16 shows the appearance and structure of the PDF. Figure 1-16 Appearance and structure of the PDF 1
2
3
4 9
5
6
4
7
8 1. Bundling bulge
3
2. Signal transfer board
3. Cable terminal block (16PIN)
4. Cable terminal block (6PIN) 5. Overvoltage protection transfer board 6. PDF body
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7. Miniature circuit breaker
8. Plastic panel
9. Cabling hole for switch monitor cable
Refer to Figure 1-17. The PDF is composed of the power distribution monitoring unit, lightning protection unit, and power distribution output unit. Figure 1-17 Structure of the PDF -48V1 -48V2 RTN RTN
Lighting protection unit
Dule hole OT input terminal
-48V1
-48V2
BGND
Power distribution output unit
-48V2
-48V1
Lighting fault detection To external sensor
BGND J5 J6
SW1 SW2 SW3 I -48V1
SW4 SW5 SW6 Air-48V1 breaker
II
J1
Monitoring unit
-48V fault J2 detection J3
J4 J5 J6
I RS485
RUN
ALM
MUTE
II
III
48V1 48V1 48V1
I
II
III
48V2 48V2 48V2
The power distribution frame is designed in conformity with the IEC297 standard. Its dimensions are 88.9 mm (2 U) x 482.6 mm x 476.2 mm, that is, 3.5 in. x 19.0 in. x 18.7 in. (H x W x D).
Panels l
Front panel of the PDF Figure 1-18 shows the front panel of the PDF.
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Figure 1-18 Front view of the PDF 1
RUN
2
ALM
10
RUN ALM
SW1
SW2
SW3
SW4
SW5
SW6
SW1 SW2 SW3 SW4 SW5 SW6
3 ON OFF MONITOR ALARM
4
5
6
7
8
9
LIGHTNING PROTECTION
LIGHTNING PROTECTION
1. Running indicator
2. Alarm indicator
3. Alarm sound switch
4 to 6. -48 V1 output switches
7 to 9. -48 V2 output switches
10. Lightning proof unit panel
NOTE
The UMG8900 supports -48 V/-60 V power supplies. The silkscreen on the components such as the PDF is usually marked according to the standard of -48 V power supply.
Two indicators are located on the front panel of the power distribution frame. Table 1-3 lists the indicator meaning. Table 1-3 Indicator meaning of the PDF Indicator
Identification
Color
State
Meaning
Running indicator
RUN
Green
Flashing once every two seconds
There is power supply and the PDF works normally.
Always off
There is no power supply, or the PDF is faulty.
Flashing once every 0.5 second
Communications have problem between the PDF and main control frame.
Always on
The PDF is faulty.
Always off
No fault occurs.
Alarm indicator
ALM
Red
The alarm sound switch on the front panel is used to enable/disable the alarm sound. If the switch is set to ON, alarm sound is generated whenever a fault occurs to the PDF; If the switch is set to OFF, no alarm sound is generated even if a fault occurs. l
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The power input and power output terminal blocks and monitoring port are in the rear panel of the PDF. Refer to Figure 1-19. Figure 1-19 Rear panel of the PDF -48VIN
-48VOUT
3 1
2 J113 J114 J112 J111 J106 J105 J104
COM1
J102 J103
J108 J107 J101
J110 J120 J109
COM2
COM3
1. Power input terminal block 2. Power output terminal block 3. External ports of monitoring board
The power distribution frame has two -48 V/-60 V input power supplies and provides six independent -48 V/-60 V output power supplies in hot backup mode. On the power input and power output terminal blocks, the connection positions are marked -48 V and RTN. Table 1-4 lists the interfaces on the PDF panel and their functions. Table 1-4 Interfaces on the PDF panel Interface
Function
COM1
Connecting the COM1 interface of the EAC-2
COM3
Connecting the MONITOR interface of the middle frame in the cabinet
J105
Connecting to the interface on the monitoring module of the Emerson power and monitoring the power supply
Other interfaces on the monitoring board in the power distribution box are not used.
Technical Specifications Table 1-5 lists the technical specifications of the PDF. Issue 05 (2009-01-09)
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Table 1-5 Technical specifications of the PDF Item Input parameter
Specification Rated input voltage
-48 V/-60 V
Input voltage range
-48 V: -57 V to -40 V -60 V: -72 V to -50 V
Output parameter
Input mode
Two -48 V/-60 V power inputs or one -48 V/-60 V power input
Maximum input current
Two -48 V/-60 V inputs (in hot backup mode), each of which is 100 A.
Rated output voltage
-48 V/-60 V
Output voltage range
-48 V: -57 V to -40 V -60 V: -72 V to -50 V
DC lightning protection
Environment
Output drop
Six 70 A outputs, each of which can be closed or open, and has short circuit protection function.
Output protection
70 A output. The protection point is 87.5 A, and the connection is recovered manually.
Rated output power
4800 W
Differential mode protection
Apply testing current of 8/20µs and 3 kA to -48 V/-60 V and RTN five times in positive and negative directions respectively. Residual voltage: ≤ 200 V
Common mode protection
Apply testing current of 8/20µs and 5 kA to -48 V/-60 V (RTN) and PGND five times in positive and negative directions respectively. Residual voltage: ≤ 300 V
Working temperature
-10°C to +50°C [14℉ to 122℉]
Storage temperature
-40°C to +70°C [-40℉ to 158℉]
Relative humidity
≤ 95%
Security compliance
In conformity with IEC60950, EN60950, UL60950 and GB4943 security specifications.
1.1.7 LAN Switches This describes the LAN Switch of internal components of the cabinet.
Functions The UMG8900 uses the LAN Switch to interconnect frames and servers and achieve intercomponent data communication.
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This document takes the Quidway S3026 of Huawei as an example. The actual type of the LAN Switch may be different from the Quidway S3026. Refer to the documentation delivered with the LAN Switch for details.
Panel Views The Quidway S3026 provides DC chassis and AC chassis for different power inputs. The DC chassis and AC chassis are the same except the power input socket. l
Front panel of the LAN Switch Refer to Figure 1-20. There are, from the left to the right, one power indicator (PWR), one state mode indicator of electrical interface (A/L and D/S), one switch of state mode indicator (MODE), one 24 fixed 10Base-T/100Base-TX auto negotiation electrical interface, two optional module sockets, and one CONSOLE port on the front panel. The RJ-45 connector is equipped with two indicators. The left indicator is yellow and the right indicator is green. Figure 1-20 Front panel of the LAN Switch 1 2 3
PWR A/L D/S MODE
5
4
1. Power indicator (PWR)
6
7
2. State mode indicator of electrical interface (A/L and D/S)
3. Switch of state mode indicator (MODE) 4. 24 fixed 10Base-T/100Base-TX auto negotiation electrical interface 5. Optional module socket
6. Optional module socket
7. Console
-
The type of Ethernet interface is a standard RJ-45 connector furnished with the status indicator. Table 1-6 lists the indicator meaning. Table 1-6 Meaning of indicators on the Ethernet interface Indicator
Panel Indicatio n
Status
Description
Power indicator
POWER
ON
The switch is powered on.
OFF
The switch is powered off.
ON (FLASH)
If the port is ACTIVE, it indicates that traffic is in progress.
OFF
If the port is DEACTIVE, it indicates that traffic is not in progress.
State mode indicator
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A/L
Yellow (left)
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Indicator
D/S
Panel Indicatio n
Status
Description
Green (right)
ON
LINK OK (right connection)
OFF
LINK FAULT (no connection); LINK ERROR (wrong connection)
Yellow (left)
ON
FULL DUPLEX (full-duplex)
OFF
HALF DUPLEX (half-duplex)
Green (right)
ON
The transmission rate of the port is 100 Mbit/s.
OFF
The transmission rate of the port is 10 Mbit/s.
NOTE Switch the state mode indicator of the port by pressing MODE.
l
Rear panel The DC power input socket, grounding screw, and redundant power input socket are located on the rear panel of the DC chassis. Refer to Figure 1-21. Figure 1-21 Rear panel of the DC chassis !
DC INPUTS FOR REDUNDANT POWER SYSTEM SPECIFIFD IN MANUAL NO HOT PLUGGABLE
NEG(-) RTN(+)
1
2
1. DC power input socket
3
2. Grounding screw
3. Redundant power input socket
Technical Specifications Table 1-7 lists the technical specifications of the LAN Switch. Table 1-7 Technical specifications of the LAN Switch Item
Specification
Dimensions
Width: 436 mm [17.2 in.] Height: 42 mm [1.7 in.] Depth: 245 mm [9.6 in.]
Weight 1-22
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Item
Specification
Input voltage
Rated voltage: -60 V to +48 V Maximum tolerance: -72 V to +36 V
Maximum power Interface
≤ 30 W Fixed interface
24 x 10Base-T/100Base-Tx
Management port
One console interface
Expansion module slot
Two module slots, and the interface module can be selected
Switching mode
Store and Forward
VLAN
Supporting 32 VLANs that conform to IEEE 802.1Q and are based on the interface
MAC address table
Supporting 4K MAC address tables at most
Work environment temperature
0°C to 45°C
Work environment relative humidity
10% to 90%
1.1.8 LAN Switch Cable Frames This describes the LAN Switch cable frame of internal components of the cabinet.
Functions The LAN Switch cable frame is used together with LAN Switches. It is located at the bottom of the LAN Switch, and enables the cabling of network cables from the front panel of the LAN Switch to the back of the cabinet.
Appearance and Structure The LAN Switch cable frame is 1U in height. Many U-shaped troughs for cable lead-ins exist on the front panel. Ventilation holds are located on the bottom plate. Figure 1-22 shows the appearance and structure of the LAN Switch cable frame. Figure 1-22 Appearance and structure of the LAN Switch cable frames
1
1
1. Mount angle
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1.1.9 Cabling Troughs This describes the cabling trough of internal components of the cabinet.
Functions The cabling trough is installed on the back of a cabinet to bundle the cables at the back of the cabinet.
Appearance and Structure The cabling trough is 2 U (88.9 mm=3.5 in.) high. Refer to Figure 1-23. Figure 1-23 Appearance and structure of the cabling trough
The two holes at the bottom of the cabling trough can facilitate the cabling of the fiber. Refer to Figure 1-24. Figure 1-24 Two holes at the bottom of the cabling trough
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Technical Specifications Table 1-8 Technical specifications of the cabling trough Item
Specification
Dimensions
Height: 2 U (88.9 mm=3.5 in.)
1.1.10 Fiber Management Tray This describes the side hang fiber coiler and back fiber management tray (FMT) of internal components of the cabinet.
Side Hang Fiber Coilers l
Functions The side hang fiber coiler is installed on the back column of the cabinet to hang up the coiled optical fibers. That is, coil and tie the superfluous optical fibers, and make sure that the diameter of the coiled optical fibers is longer than that of the side hang fiber coiler, and then put the coiled optical fibers on the side hang fiber coiler.
l
Appearance and structure Figure 1-25 shows the appearance and structure of the side hang fiber coiler. For the UMG8900, each SSM frame uses two side hang fiber coilers, which are located on right and left sides of the cabinet. Figure 1-25 Appearance and structure of the side hang fiber coiler
Back Fiber Management Tray (FMT) l
Functions The back fiber management tray (FMT) can be installed at the back of the cabinet to provide the cabling routes and space for optical fibers. Coil the tail fibers into sectors.
l
Appearance and structure Figure 1-26 shows the appearance and structure of the back FMT.
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Figure 1-26 Appearance and structure of the back FMT
1.1.11 Structures and Mechanical Specifications of the N68-22 Cabinets This describes the mechanical specifications of the N68-22 cabinets. Table 1-9 lists mechanical specifications of the N68-22 cabinet. Table 1-9 Technical specifications of the N68-22 cabinet Item
Specification
Design
It conforms to International Electrotechnical Commission (IEC) 297. The modular design facilitates expansion and maintenance.
Dimensions
2200 mm (height) x 600 mm (width) x 800 mm (depth)
Capacity
Height of available space of a cabinet: 46U (1U = 44.45 mm = 1.75 in.). One cabinet can accommodate a maximum of three standard 19-inch frames.
Weight
The empty cabinet without doors is 95 kg [209 lb] and the empty cabinet with doors is 150 kg [331 lb]. The cabinet is 330 kg [728 lb] when it is fully configured, including the three fully-configured service frame, PDF, and other accessories.
Cabling mode
There are cable-through holes both at the top and at bottom of the cabinet, supporting upward cabling and downward cabling.
Heat dissipation
The front and back doors and the bottom plate have minute air vents. The fan box is installed in the service frame The cabinet adopts front-in, backout and bottom-to-top ventilation mode so that it has excellent heat dissipation and dust-proof functions.
Protection
Fully considering EMC in cabinet design. All interfaces enjoy electromagnetic shielding. The front and back doors and the bottom plate have minute air vents and air filters.
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Item
Specification There are rodent-proof nets at the cable-through holes to prevent dust and animals from entering the cabinet.
Material
N68-22 cabinet is assembled with electrolytic zinc-coated cold-rolled steel sheet and screws, featuring light weight, simple structure and high versatility. The fireproof materials conform to the Underwriter Laboratory (UL) standards.
Color
The cabinet surface is Huawei purple-gray and NC silver-gray, and the rack is Huawei purple-gray.
1.1.12 Technical Specifications of N68E-22 Cabinets This describes the technical specifications of the N68E-22 cabinet. Table 1-10 Technical specifications of the N68E-22 cabinet Item
Specification
Design
It conforms to International Electrotechnical Commission (IEC) 297. The modular design facilitates expansion and maintenance.
Dimensions (H x W x D)
2200 mm x 600 mm x 800 mm
Capacity
Height of available space of a cabinet: 46 U (1 U = 44.45 mm).
Weight
The empty cabinet without doors is 59 kg [130 lb] and the empty cabinet with doors is 100 kg [221 lb]. The cabinet is 263.6 kg [581 lb] when it is fully configured, including the three fully-configured service frames, PDF, and other accessories.
Power consumption
The power consumption of the whole UMG8900 is 3300 W when the three frames of the UMG8900 are fully configured.
Cabling mode
The cabling mode can be the overhead cabling, underfloor cabling, front leading-out mode, or rear leading-out mode. The subrack is in front leadingout mode.
Installation mode
You can install the cabinet on either the cement floor directly or on the antistatic floor by using the N6X supports and guide rails.
Heat dissipation
The ventilation rates of front and back doors are 50%. The cabinet realizes the front-in, back-out, and bottom-to-top ventilation modes. Thus, the cabinet is excellent in heat dissipation.
Protection
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Fully considering EMC in cabinet design. All interfaces enjoy electromagnetic shielding. The front and back doors and the bottom plate have minute air vents and air filters.
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Item
Specification
Material
N68E-22 cabinet is assembled with electrolytic zinc-coated cold-rolled steel sheet and screws, featuring light weight, simple structure and high versatility. The fireproof materials conform to the Underwriter Laboratory (UL) standards.
Color
The cabinet is Huawei purple-gray.
1.2 Auxiliary Devices The UMG8900 is managed and maintained through the local maintenance terminal (LMT) and realizes the alarm function through the auxiliary alarm box. In addition, the UMG8900 monitors the environmental parameters through the environment monitoring unit. 1.2.1 LMT The local maintenance terminal (LMT) is the operation and maintenance client that manages and maintains the UMG8900. 1.2.2 Alarm Boxes The alarm box is a universal alarm box provided by Huawei. 1.2.3 EAC-2 Environment Alarm Chest The UMG8900 can realize the environment monitoring function through the EAC-2 environment alarm chest (abbreviated as EAC-2). 1.2.4 EMU Environment Monitoring Unit The UMG8900 can realize the environment monitoring function through the EMU environment monitoring unit (abbreviated as EMU).
1.2.1 LMT The local maintenance terminal (LMT) is the operation and maintenance client that manages and maintains the UMG8900. The LMT constitutes the Client/Server architecture with the UMG8900. The LMT works in the PC where the Windows 2000, Windows NT, or Windows XP runs.
1.2.2 Alarm Boxes The alarm box is a universal alarm box provided by Huawei. For details on specifications and device introduction, see the Universal Alarm Box User Manual.
1.2.3 EAC-2 Environment Alarm Chest The UMG8900 can realize the environment monitoring function through the EAC-2 environment alarm chest (abbreviated as EAC-2). The EAC-2 is used for data acquisition and voltage monitoring in the equipment room of the UMG8900. Configured with a proper sensor, it can detect corresponding electrical signals and non-electrical signals in real-time. 1-28
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It can control some equipment (such as air conditioner) in remote equipment room, and can provide thirty-two extension digital signal channels and four additional extension analog signal channels. It also has the power supply voltage detecting and alarm reporting functions. When the UMG8900 does not access the EAC-2, it can support the monitoring of one digital signal. One UMG8900 can have only one EAC-2. The monitoring function can be realized after the UMG8900 accesses the EAC-2. For details, see the EAC-2 User Manual.
1.2.4 EMU Environment Monitoring Unit The UMG8900 can realize the environment monitoring function through the EMU environment monitoring unit (abbreviated as EMU). The EMU is used for data acquisition and voltage monitoring in the equipment room of the UMG8900. Configured with a proper sensor, it can detect corresponding electrical signals and non-electrical signals in real-time. The alarm thresholds of the analog sensor can be set, including those of voltage, temperature, and humidity. The thresholds can be set according to users' needs. Ensure that the upper and lower limits fall within the specified range. Whether the alarm of the Boolean sensor is reported depends on the alarm setting by the users. Four analog input control interfaces, 32 Boolean input control interfaces, and six output control interfaces are available. The user can access an appropriate sensor according to the need.
1.3 Environmental Specifications This describes the environmental specifications of the cabinets. Environmental specifications cover the specifications for storage environment, transportation environment, and running environment. l
ETS 300019 Equipment Engineering (EE); Environmental conditions and environmental tests for telecommunications equipment
l
IEC 60721 Classification of environmental conditions
Table 1-11 lists the general environmental specifications. Table 1-11 General environmental specifications Item
Temperature
Specification Working Environment
Storage Environment (Package Storage Without Temperature Control Indoors)
Transportation Environment (Package Transportation)
Long term: 0°C to 45° C [32℉ to 113℉]
Temperature range: – 40°C to +70°C [104℉ to 158℉]
Temperature: –40°C (no ventilation) to +70°C [104℉ to 158℉]
Short term: –5°C to 55°C [23℉ to 131℉] Issue 05 (2009-01-09)
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Item
Specification
Relative humidity
Working Environment
Storage Environment (Package Storage Without Temperature Control Indoors)
Transportation Environment (Package Transportation)
Long term: 5% to 85% (1 g/m3 to 25 g/m3)
10% to 100%
5% to 100%
Short term: 5% to 95% (1 g/m3 to 29 g/m3) Height above sea level
≤ 4000 m [2.5 mi]
≤ 5000 m [3.1 mi]
Wind speed
< 5.0 m/s
< 30 m/s
Solar radiation
700 W/m2
1120 W/m2
Heat radiation
600 W/m2
Short-term rain
It is prohibited to operate the device in the open air.
IP level
IP22
< 20 m/s
6 mm/min
NOTE
Short term means that the consecutive working duration is not more than 96 hours and the accumulative duration is not more than 15 days in a year.
Table 1-12 lists the air cleanness specifications. Table 1-12 Air cleanness specifications
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Environme nt Chemical Constitutio n
Reference Value for Upper Limit of Specification
SO2
0.3 mg/m3 to 1.0 mg/m3
1.0 mg/m3
H2S
0.1 mg/m3 to 0.5 mg/m3
0.5 mg/m3
Cl2
0.1 mg/m3 to 0.3 mg/m3
Not required
HCl
0.1 mg/m3 to 0.5 mg/m3
0.5 mg/m3
Long-Term Working Environment
Storage Environment (Package Storage Without Temperature Control Indoors)
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Environme nt Chemical Constitutio n
Reference Value for Upper Limit of Specification
NOX
0.5 mg/m3 to 1.0 mg/m3
1.0 mg/m3
NH3
1.0 mg/m3 to 3.0 mg/m3
3.0 mg/m3
HF
0.01 mg/m3 to 0.03 mg/m3
0.03 mg/m3
O3
0.05 mg/m3 to 0.1 mg/m3
0.1 mg/m3
Precipitable dust
1.5 mg/m2h
20 mg/m2h
3.0 mg/m2h
Suspending dust
0.2 mg/m3
5.0 mg/m3
Not required
Sand
30 mg/m3
300 mg/m3
100 mg/m3
Long-Term Working Environment
Storage Environment (Package Storage Without Temperature Control Indoors)
Transportation Environment (Package Transportation)
Table 1-13 lists the anti-vibration specifications when the device is running. Table 1-13 Anti-vibration specifications for device running Item
Sub-Item
Range
Sinusoidal oscillation
Frequency
5 Hz to 9 Hz
9 Hz to 200 Hz
Amplitude
≤ 3.5 mm [0.1 in.]
None
Peak acceleration
None
1g
Direction
3 axial directions, 6 planes
Times
Plus or minus three times in each axial direction, once in each plane
Percussion waveform
Semi-sinusoidal wave
Peak acceleration
5g
Pulse width
11 ms
Direction
3 axial directions, 6 planes
Times
Plus and minus three times in each axial direction, once in each plane
–
EUROPEAN ETS 300 019-1-3-Amd (recommended). It can withstand earthquake intensity of 7 to 9 level.
Percussion
Earthquake
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Item
Sub-Item
Range
NOTE 1 g equals to 9.8 m/s2.
Table 1-14 lists the anti-vibration specifications during delivery (in 2M3 level package transportation). Table 1-14 Anti-vibration specifications for device delivery Item
Sub-Item
Range
Random oscillation (for duration of 30 minutes in each axial direction)
Vertical
5 Hz to 10 Hz
ASD: 13 m2/s3
10 Hz to 200 Hz
ASD: 3 m2/s3
200 Hz to 500 Hz
ASD: 1 m2/s3
5 Hz to 10 Hz
ASD: 10 m2/s3
10 Hz to 200 Hz
ASD: 1 m2/s3
200 Hz to 500 Hz
ASD: 0.3 m2/s3
Landscape orientation and longitudinal
Collision
Percussion
Free Fall
Collision waveform
Semi-sinusoidal wave
Peak acceleration
25 g
Pulse width
11 ms
Direction
Six directions
Times
500 times in each direction
Percussion waveform
Semi-sinusoidal wave
Peak acceleration
30 g
Pulse width
6 ms
Direction
3 axial directions, 6 planes
Times
Plus and minus three times in each axial direction, once in each plane
Weight range
≤ 15 kg [33 lb]
Fall height
100 cm [39.4 in.]
Plane
Six planes
Times
Once in each plane
NOTE ASD: Acceleration spectrum density
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The mechanical stress of the storage conditions is the same as that of the transportation conditions.
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2
Frames
About This Chapter This describes the service switching module (SSM) frames, fan boxes, transfer boxes, frame backplanes, board positions, and logic types of frames. An independent unit composed of various boards connected through the backplane. The SSM frame adopts the standard 19-inch frame. An SSM frame is 12 U (1 U = 44.45 mm = 1.75 in.) high with the backplane installed in the central of the frame. Front and back boards are inserted in pairs into the backplane. The UMG8900 supports two types of frames, including the SSM-32 and SSM-256, to meet different service requirements. The SSM-32 and SSM-256 are the same in appearance. They differ in the backplane and main control service board. The SSM-256 frame provides 256 K TDM switching capacity. The SSM-32 frame provides 32 K time division multiplex (TDM) switching capacity.
CAUTION The SSM frames are of two versions. In the SSM frame of the new version, the fan box is not equipped with the power input interface and monitoring interface. The transfer box is not equipped with the power output interface of the fan box. The power cable and monitoring cable of the fan box are laid inside the SSM frame. In this document, the figures show the SSM frame of the earlier version. 2.1 Appearance and Structure of the SSM Frame This describes the appearance and structure of the SSM frame. 2.2 Fan Boxes This describes the functions, appearance and structure, and technical specifications of fan boxes of the UMG8900. 2.3 Transfer Boxes This describes the functions, appearance and structure, and technical specifications of the transfer box of the UMG8900. Issue 05 (2009-01-09)
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2.4 Backplanes This describes the SSM frame and backplanes. 2.5 Board Deployment This describes the board deployment of the SSM-256 and SSM-32 frames. 2.6 Logical Frame Types Based on service functions, frames fall into four logical types, namely, main control frame, central switching frame, service frame, and control frame. Different boards are configured in different frames and provide different functions. 2.7 Technical Specifications of the SSM Frame This describes technical specifications of the SSM frame.
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2.1 Appearance and Structure of the SSM Frame This describes the appearance and structure of the SSM frame. The UMG8900 adopts semi-integrated frame structure, with embedded filter box, transfer box and fan box. The front board and back board in an SSM frame are different in height. The front board is 9 U high and the back board is 8 U high (I U = 44.45 mm = 17.5 in.). At the bottom back of SSM frame, there are two filter boxes and one transfer box. Each filter box outputs one independent –48 V/–60 V DC power supply to the backplane through feedthrough filter and blind-match connector.
SSM-256 Frames The SSM-256 frame has 32 front and back slots. For the main control frame, the default configuration is the MOMU/MNET. For the service frame, the default configuration is the MMPU/MNET. Figure 2-1 shows the appearance and structure of the SSM-256 frame. Figure 2-1 Appearance and structure of the SSM-256 frame
Figure 2-2 shows the front view of the SSM-256 frame.
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Figure 2-2 Front view of the SSM-256 frame
1
2
3 1. Frame lintel
2. Mount angle
3. Embedded fan box
Figure 2-3 shows the rear view of the SSM-256 frame. Figure 2-3 Rear view of the SSM-256 frame
1 1. Filter box
2
3 2. Fan box
4 3. Transfer box
4. Filter box
Figure 2-4 shows the side view of the SSM frame. 2-4
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Figure 2-4 Side view of the SSM frame 1
2
4
5
3
1. Frame lintel
2. 9 U board
3. Integrated fan
4. 8 U board
5. Filter box
SSM-32 Frames The SSM-32 and SSM-256 are the same in appearance. They differ in the backplane and main control service board. The SSM-32 frame has 28 front and back slots. For the main control frame, the default configuration is the MOMB/MTNC. For the service frame, the default configuration is the MTNC. Figure 2-5 shows the appearance and structure of the SSM-32 frame. Figure 2-5 Appearance and structure of the SSM-32 frame
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Figure 2-6 shows the front view of the SSM-32 frame. Figure 2-6 Front view of the SSM-32 frame
STATUS
Figure 2-7 shows the rear view of the SSM-32 frame. Figure 2-7 Rear view of the SSM-32 frame
The side view of the SSM-32 and the SSM-256 frames are the same. See Figure 2-4.
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2.2 Fan Boxes This describes the functions, appearance and structure, and technical specifications of fan boxes of the UMG8900.
CAUTION The SSM frames are of two versions. In the SSM frame of the new version, the fan box is not equipped with the power input interface and monitoring interface. In this document, the figures show the fan box in the SSM frame of the earlier version.
Functions The fan box keeps the temperature in appointed range. The fan monitoring board in the fan box provides the power input module. The supplied power includes –48 V and –60 V.
Appearance and Structure l
Appearance The fan box is at the bottom of the SSM frame. The panel of the fan box is made of plastic and the fan box body is made of sheet metal. Each fan box contains six fans, and the diameter of each fan is 119 mm [4.7 in.] and the thickness 32 mm [1.3 in.]. Each SSM frame has one fan box. Figure 2-8 shows the appearance and structure of the fan box. The appearances and structures of the –48 V fan box and –60 V fan box are the same. For details on difference, see item label on the front panel of the fan box. Figure 2-8 Appearance and structure of the fan box 1
2
6 7
3 5 4
1. Fan box body
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2. State indicator 3. Fan
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4. Fan driving power supply, control and detection terminals
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l
6. DIP switch S1 7. Terminal for state indicator signal cable
-
Front panel Figure 2-9 Front panel of the fan box
210212018461000037
1
N*
-UG0E4MFAN
2 21021201P061000037
3 N*
-UG0E4MFAN
STATE 1. Captive screws
2. Item label
3. Fan state indicator
NOTE
You can identify the –48 V fan box from the –60 V fan box through the item label on the front panel of the fan box. If the seventh to the tenth numbers are 0184, it indicates that it is the –48 V fan box. If the seventh to the tenth numbers are 0311, it indicates that it is the –60 V fan box l
Rear panel Figure 2-10 Rear panel of the fan box 1
POWER IN (BACKUP)
POWER IN
MONITOR
2
1. Power input terminals
l
2. RS485 serial port (connected to fan box monitoring cable)
Indicator If the indicator is flashing in green (on for 1 s, off for 1 s), it indicates that the fan works normally. Otherwise, it indicates that the fan does not run properly, the fan monitoring communication board or the power of the fan box is faulty.
l
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A DIP switch S1 is located on the monitoring board of the fan box. The first three bits are used to set address information. Generally, they are set to 100. The fourth bit S1-4 is used to set air direction. The UMG8900 adopts upward ventilation mode. Thus, S1-4 is set to OFF. Table 2-1 lists the settings of the DIP switches. Table 2-1 DIP switch settings on the monitoring board of the fan frame Address Information
Air Direction
S1-1
S1-2
S1-3
S1-4
OFF
ON
ON
OFF
Technical Specifications The fans in the fan box are designed with speed regulation technology. The fan speed can be adjusted when the heat dissipation and system running are affected. The monitoring communication modules in the fans help the users know the running states of the components in the fan box through indicators, and maintain the fan box remotely through network management system (NMS) terminal. Table 2-2 lists related technical specifications of the fan box. Table 2-2 Technical specifications of the fan box Item
Specification
Input voltage range
–48 V power supply: –40 V to –57 V –60 V power supply: –51 V to –72 V
Maximum power
105 W
Communication rate of RS485 serial port
9.6 kbit/s
2.3 Transfer Boxes This describes the functions, appearance and structure, and technical specifications of the transfer box of the UMG8900.
CAUTION The SSM frames are of two versions. In the SSM frame of the new version, the transfer box is not equipped with the power output interface of the fan box. In this document, the figures show the transfer box in the SSM frame of the earlier version.
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Functions The transfer box is located below the board slot. The transfer box has transfer boards inside, on which there are DIP switches, blind-match connectors, monitoring interfaces, and isolating diodes. The transfer box provides power supply interface, system monitoring, and fan box monitoring functions, and implements frame ID setting.
Appearance and Structure l
Appearance The transfer box is located below the board slot. Figure 2-11 shows the appearance and structure of the transfer box. Figure 2-11 Front view of the transfer box MONITOR
ALARM
1
2
1. Monitoring cable interface
l
FAN.48V
3
FRAME.ID
4
2. Alarm cable interface 3. Fan box power output port
4. Frame ID DIP switches
DIP Switches The 8-bit DIP switch on the transfer box is used to set the frame ID. Refer to Figure 2-12. Figure 2-12 Eight-bit DIP switch on the transfer board 1
2
3
4
5
6
7
8 ON OFF
DIP switches for the SSM-256 and the SSM-32 are set in the following different ways. For the SSM-256, SW1 to SW4 are used to set the frame ID. The SW5 to SW8 are not used and must be set to OFF. The frame ID is denoted by 4-bit binary number. That is, the frame ID = (SW4)(SW3)(SW2)(SW1). The value ON of the DIP switch indicates 0, and OFF indicates 1. Table 2-3 lists the relationship between frame IDs and DIP switch settings.
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Table 2-3 Relationship between frame IDs and DIP switch settings in the SSM-256 frame DIP Switch Setting
Binary Number
Frame ID
SW4
SW3
SW2
SW1
ON
ON
ON
ON
0000
0
ON
ON
ON
OFF
0001
1
ON
ON
OFF
ON
0010
2
ON
ON
OFF
OFF
0011
3
ON
OFF
ON
ON
0100
4
ON
OFF
ON
OFF
0101
5
ON
OFF
OFF
ON
0110
6
ON
OFF
OFF
OFF
0111
7
OFF
ON
ON
ON
1000
8
For the SSM-32, SW1 to SW6 are used to set the frame ID. SW7 and SW8 are not used and must be set to OFF. The frame ID is denoted by 6-bit binary number. The frame ID and DIP Switch setting are similar to those in the SSM-256 frame. The difference is that the frame ID of the SSM-32 frame is denoted by 6-bit binary number. That is, the frame ID = (SW6) (SW5) (SW4)(SW3)(SW2)(SW1). The appearance and structure of the SSM-256 frame and SSM-32 frame are the same while the backplanes are different. Distinguish the two frames as follows: –
Observe the silkscreen on the backplane. The silkscreen is located below slots 9 to 12 on the backplane. It is on the side where the OMU/MPU is located, rather than the side where the NET is located. The silkscreen mark of the SSM-256 is MBKP, while that of the SSM-32 is BAKP.
–
Observe the slot on the backplane. There are 16 slots respectively on the front and back of the backplane of the SSM-256 frame. The width of the slots is the same. Each OMB/MPB/TNC board occupies two physical slots in the SSM-32 frame. Therefore, their corresponding slots on the backplane also occupy two slots. That is, there are 14 slots respectively on the front and back of the backplane of the SSM-32 frame, and the two slots in the middle are wider than other slots.
2.4 Backplanes This describes the SSM frame and backplanes.
SSM-256 Frames For the SSM-256, the backplane (MBKP) is a standard 9 U central backplane. Its dimension (height x width x thickness) is as follows (The bracket shows the absolute error range): 390.7 (–0.3 to 0) mm x 412.2 (–0.3 to 0) mm x 4.5 (–0.4 to 0.4) mm, that is, 15.4 (0.01 to 0) in. x 16.2 (0.01 to 0) in. x 0.2 (-0.02 to 0.02) in. Issue 05 (2009-01-09)
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The MBKP provides the following signal interconnection channels for the boards in the SSM frame: l
Control signal channel: 100 Mbit/s fast Ethernet (FE) channels and maintenance bus (MBus) from master and slave MOMUs/MMPUs to other boards. The MBus implements environment monitoring, alarm, power-on/off, hot-pluggable and version control. The FE bus implements data configuration, log, performance and management.
l
High-speed TDM data channel: 777 Mbit/s high-speed low-voltage differential signaling (LVDS) channel from the MTNB to other TDM service interface boards.
l
High-speed packet data channel: 1.25 Gbit/s or 2.5 Gbit/s high-speed LVDS channel from the MNET to packet service boards.
l
Cascading signal channel: High-speed LVDS channel and low-voltage transistor-transistor logic (LVTTL) state identification signal channel from the MFLU and MBLU to the MNET and MTNB.
l
Clock signal assignment channel: Channel for distributing clock signals provided by the MCLK from the MNET to service boards.
l
The backplane provides service boards with –48 V power supply and 5 V MBus power supply. The pins for power supply, grounding and signals in the backplane are designed in different lengths to avoid mis-plugging boards.
SSM-32 Frames For the SSM-32, the backplane (BAKP) is a standard 9 U central backplane. Its dimension (height x width x thickness) is as follows (The bracket shows the absolute error range): 390.7 (–0.3 to 0) mm x 412.2 (–0.3 to 0) mm x 4.5 (–0.4 to 0.4) mm, that is, 15.4 (0.01 to 0) in. x 16.2 (0.01 to 0) in. x 0.2 (-0.02 to 0.02) in. The BAKP provides the following signal interconnection channels for the boards in the SSM frame: l
Control signal channel: 100 Mbit/s FE channel and maintenance bus (MBus) from master and slave MTNCs to other boards. The MBus implements environment monitoring, alarm, power-on/off, hot-pluggable and version control. The FE bus implements data configuration, log, performance and management.
l
High-speed TDM data channel: 147 Mbit/s high-speed low-voltage differential signaling (LVDS) channel from the MTNC to other TDM service interface boards.
l
High-speed packet data channel: 1.25 Gbit/s high-speed LVDS channel from the MOMB/MMPB to packet service boards.
l
Cascading signal channel: the MTNC provides the TDM and control plane cascading channels.
l
Clock signal assignment channel: the MCLK or CKMB clock subboard sends the clock signal to the MTNC, and the MTNC distributes the signal to the other service boards.
2.5 Board Deployment This describes the board deployment of the SSM-256 and SSM-32 frames.
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Board deployment in an SSM-256 frame In the UMG8900, the frame is designed to provide width of 16 standard board slots. The following boards are inserted in fixed slots in a frame and occupy the width of eight standard board slots. l
TDM switching net unit or TDM convergence cascading unit (MTNU, MTNB or TCLU)
l
Operation & maintenance unit or main processing unit (MOMU or MMPU)
l
Packet switch unit (MNET)
l
Clock unit (MCLK)
Other slots accommodate service boards and interface boards. Figure 2-13 shows the board deployment in the SSM-256 frame. Figure 2-13 Board deployment in the SSM-256 frame 4
5
7
6
5
7
1
2
3
8
9
8
1. Back board
2. Backplane
4. Clock unit
5. Back interface board or service board 6. Packet switch unit
7. TDM switching net unit 8. Front service board
3. Front board
9. Operation & maintenance unit or main processing unit
NOTE
In multi-frame cascading mode, only the main control frame must be configured with the MCLK.
Board Deployment in the SSM-32 Frame In the UMG8900, the frame is designed to provide the width of 16 standard board slots. The following boards are inserted in fixed slots in a frame and occupy the width of 10 standard board slots. The MOMB and MTNC need to occupy two slots. l
TDM switching net unit C (MTNC)
l
Operation & maintenance unit B (MOMB)
l
Clock unit (MCLK)
Other slots accommodate service boards and interface boards. Issue 05 (2009-01-09)
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Figure 2-14 shows the board deployment in the SSM-32 frame. Figure 2-14 Board deployment in the SSM-32 frame 4
5
6
5
1 2
3
7
8
7
1. Back board
2. Backplane
3. Front board
4. Clock unit
5. Back service board or interface board
6. TDM switching net unit C 7. Front service board 8. Operation & maintenance unit B or main processing unit B
NOTE
l
In multi-frame cascading mode, only the main control frame must be configured with the MCLK.
l
If only stratum-3 clock is required, the UMG8900 can synchronize the clock generated by the CKMB subboard of the MTNC. In this case, the MCLK does not need to be configured.
2.6 Logical Frame Types Based on service functions, frames fall into four logical types, namely, main control frame, central switching frame, service frame, and control frame. Different boards are configured in different frames and provide different functions.
Main Control Frame The main control frame manages and controls the whole UMG8900 device and provides clock signals for other frames. When the SSM-256 frame serves as the main control frame, the deployment of the front and back boards is shown in Figure 2-15.
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Figure 2-15 Board deployment in the SSM-256 main control frame (1)
(4)
C L K
C L K
0
1
2
3
(1)
4
(5)
(3)
(2)
5
T N B
N E T
N E T
T N B
6
7
8
9
关 系 前 插 板
O M U
O M U
(3)
10
(3)
11
12
13
14
15
(2)
1. Universal slots for back boards 2. Universal slots for front boards 3. Slots for front boards with no corresponding back boards 4. Back boards
5. Front boards
When an SSM-256 frame serves as the main control frame, the following boards are configured in fixed slots, as listed in Table 2-4. Table 2-4 Fixed board positions in the SSM-256 main control frame Board Name
Slots
MOMU
Front slots 7 and 8
MNET
Back slots 7 and 8
MTNU, MTNB, or TCLU
Back slots 6 and 9
MCLK
Back slots 0 and 1
When the SSM-32 frame serves as the main control frame, the deployment of the front and back boards is shown in Figure 2-16.
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Figure 2-16 Board deployment in the SSM-32 main control frame
(1)
(3)
C L K
0
(1)
C L K 0
1
T N N C C 1 2 3 6 7
2 4
5 8
3 6 7 9
O O M M B B
(4)
T N N C C 4 5 0 11 12 13 8 9 10 11 12 13 14 15 1 14 15
O O M M B B
(2)
(2)
1. Universal slots for back boards
2. Universal slots for front boards
3. Back boards
4. Front boards
When the SSM-32 frame serves as the main control frame, the following boards are configured in fixed slots, as listed in Table 2-5. Table 2-5 Fixed board positions in an SSM-32 main control frame Board Name
Slots
MOMB
Front slots 6 to 9
MTNC
Back slots 6 to 9
MCLK
Back slots 0 and 1
Central Switching Frame The central switching frame is applied to the cascading of three or more frames. It realizes the cascading between frames and provides service processing functions. The SSM-32 frame integrates the main control frame and the central switching frame. When the SSM-256 frame serves as the central switching frame, the deployment of the front and back boards is shown in Figure 2-17. 2-16
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Figure 2-17 Board deployment in the SSM-256 central switching frame
B L U
B L U
B L U
0
1
2
F L U
F L U
F L U
B L U
B L U
B L U
T N B
N E T
N E T
T N B
5
6
7
8
9
M P U
M P U
B L U
B L U
B L U
B L U
B L U
B L U
10
11
12
13
14
15
F L U
F L U
F L U
F L U
F L U
F L U
(2)
(3)
3
F L U
4
F L U
F L U
(1)
1. Filler panel
(1)
2. Back boards
3. Front boards
In the central switching frame, the MMPU, MTNB (MTNU) and MNET must be configured. The MFLU and MBLU also need to be configured. Table 2-6 lists the board positions. Table 2-6 Fixed board positions in the central switching frame Board Name
Slots
MMPU
Front slots 7 and 8
MNET
Back slots 7 and 8
MTNB
Back slots 6 and 9
MFLU
Front slots 0 to 5 and 10 to 15
MBLU
Back slots 0 to 5 and 10 to 15
Service Frames Service frames process services and provide interfaces. When the SSM-256 frame serves as the service frame, the deployment of the front and back boards is shown in Figure 2-18.
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Figure 2-18 Board deployment in the SSM-256 service frame (1)
(1)
T N B
N E T
N E T
T N B
6
7
8
9
M P U
M P U
(4) 0
1
2
3
4
5
(5)
(3)
(2)
(3)
10
(3)
11
12
13
14
15
(2)
1. Universal slots for back boards 2. Universal slots for front boards 3. Slots for front boards with no corresponding back boards 4. Back boards
5. Front boards
When the SSM-256 frame serves as the service frame, the boards that must be configured are listed in Table 2-7. Table 2-7 Fixed board positions in the SSM-256 service frame Board Name
Slots
MMPU
Front slots 7 and 8
MNET
Back slots 7 and 8
MTNB, or TCLU
Back slots 6 and 9
When the SSM-32 frame serves as the service frame, the deployment of the front and back boards is shown in Figure 2-19.
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Figure 2-19 Board deployment in the SSM-32 service frame (1)
(1)
T N C
T N C
(3) 0
1
2
3
4
5
6
7
8
9
10
11
12
13 14
15
(4)
(2) 1. Universal slots for back boards
2. Universal slots for front boards
3. Back boards
4. Front boards
When the SSM-32 frame serves as the service frame, the boards that must be configured are listed in Table 2-8. Table 2-8 Fixed board positions in the SSM-32 service frame Board Name
Slots
MTNC
Back slots 6 to 9
Control Frames The control frame is applied to the large-scale networking of SSM-256 frames and provides extended control function. The SSM-32 frames of the medium-UMG8900 do not require control frames for cascading networking application. When the SSM-256 frame serves as the control frame, the deployment of the front and back boards is shown in Figure 2-20.
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Figure 2-20 Board deployment in the SSM-256 control frame (3)
C C M M B B
(1)
(2)
C M B
C M B
C M B
C M B
C M B
N E T
N E T
C M B
0
1
2
3
4
5
6
7
8
9
C M F
C M F
C M F
C M F
C M F
C M F
C M F
M P U
M P U
C M F
1. Back boards
C M B
C M B
C M B
C M B
C M B
10
11
12
13
14
15
C M F
C M F
C M F
C M F
C M F
C M F
2. Front boards
3. Filler panel
In the SSM-256 control frame, the MMPU and MNET must be configured. The MCMF and MCMB are also required. Table 2-9 lists the board positions in the control frame. Table 2-9 Fixed board positions in the control frame Board Name
Slots
MMPU
Front slots 7 and 8
MNET
Back slots 7 and 8
MCMF
Front slots 0 to 6 and 9 to 15
MCMB
Back slots 0 to 6 and 9 to 14
NOTE
Back slot 15 in the control frame is occupied. Thus, no board can be configured in this slot.
2.7 Technical Specifications of the SSM Frame This describes technical specifications of the SSM frame. The dimensions of the SSM frame are compliant with the IEC297 standard. Table 2-10 lists related technical specifications of the SSM frame. 2-20
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Table 2-10 Technical specifications of the SSM frame Item
Specifications
Dimensions
Height: 533.4 mm [21 in.], equal to 12 U Width: 482.6 mm [19 in.], including amount angle Depth: 500 mm [20 in.] (distance between the front of the rackmounting ear and the back of the frame)
Weight
Empty SSM-256 frame: 16 kg [35.2 lb], fully configured frame: 45 kg [99.2 lb] Empty SSM-32 frame: 13 kg [28.7 lb], fully configured frame: 40.2 kg [88.6 lb]
EMC
30 MHz to 230 MHz: 30 dB 230 MHz to 1000 MHz: 20 dB
Power consumption
Empty SSM-256 frame and SSM-32 frame: 70 W Fully configured SSM-256 frame: 1100 W Fully configured SSM-32 frame: 850 W
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3
Boards
About This Chapter This describes the board types, matching limitation, connection between boards, and universal features of the boards. The boards of the UMG8900 can be divided into two categories in terms of management and maintenance, that is, logical board and physical board. The logical board is not the actual board but the abstract concept of the board. The logical board is composed of the actual boards whose functions are similar. The logical board is used for data configuration and alarm output. This is to facilitate the operation to manage and maintain the concrete boards belonging to the same type. The physical board is the actual board, that is, the actual object of the logical board. Every logical board includes one or more physical boards. The physical boards belonging to the same logic board are different in terms of interfaces, performance and location. The same physical boards can back up in master and slave mode or in load-sharing mode. For different physical boards, the backup mode differs. Some boards can only adopt the master and slave mode; some only the load-sharing mode. Some boards can adopt either mode. Note that only one mode can be adopted at one time. To work in the master and slave backup mode, two boards need to be inserted in paired slots. The following slots are paired slots: slot 0 and slot 1, slot 2 and slot 3, slot 4 and slot 5, slot 10 and slot 11, slot 12 and slot 13, and slot 14 and slot 15. Some boards whose positions are fixed do not need to be inserted in paired slots when the master and slave mode is adopted. For example, boards such as the OMU, TNU, CLK need to be inserted in fixed slots. 3.1 Categories of Boards 3.2 Matching Limitation of Boards 3.3 Connection of Boards 3.4 Signal Streams Between Boards 3.5 Common Characteristics of Boards Issue 05 (2009-01-09)
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3.1 Categories of Boards As a universal media gateway, the UMG8900 adopts a distributed hardware structure and uses multiple types of boards to bear and convert different services. The boards can be divided into the following categories based on their functions: l
Equipment and resource management unit
l
Service and protocol processing unit
l
Switching and cascading unit
l
Interface unit
l
Media resource processing unit
l
Clock unit
l
Lightning protection unit NOTE
The UMG8900 supports the enhanced M series of boards, and is compatible with the existing F series of boards. The boards that are excluded in the board list are described based on the M series of boards.
Equipment and Resource Management Units Table 3-1 Equipment and resource management units Board Name Logical Board
Physical Board
Operation Maintenance Unit (OMU)
Media gateway Operation Maintenance Unit (MOMU)
Backup Mode
Board Position
Function
Master/slave
It is inserted in front slot 7 or 8 of the SSM-256 main control frame.
The OMU manages all the frames of the UMG8900 when multiple frames are configured.
A corresponding NET back board is required. Media gateway Operation Maintenance Unit B (MOMB)
Master/slave
It is inserted in front slots 6, 7, 8 and 9 of the SSM-32 main control frame. Each board occupies two slots. A corresponding TNC back board is required.
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The MOMB can convert the broadband service data. The board provides the external interfaces including the Console interface.
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Board Name Logical Board
Physical Board
Main processing unit (MPU)
Media gateway Main Processing Unit (MMPU)
Backup Mode
Board Position
Function
Master/slave
It is inserted in front slot 7 or 8 of the SSM-256 frame except the main control frame.
The MPU manages the boards in the frame where the MPU is located. The MMPB can convert the broadband service data.
A corresponding NET back board is required. Media gateway Main Processing Unit B (MMPB)
Master/slave
It is inserted in front slots 6, 7, 8 and 9 of a SSM-32 service frame. Each board occupies two slots. A corresponding TNC back board is required.
Connection Maintenance Unit (CMU)
Connection Maintenance Unit (CMU)
3-4
Media gateway Connection Maintenance Front Unit (MCMF)
Master/slave
Media gateway Connection Maintenance Back unit (MCMB)
Master/slave
Sub-card of Connection & Management Unit (SCMU)
Load sharing or master/ slave
It is inserted in a common front slot of the SSM-256 frame or the SSM-32 frame. No corresponding back board is required.
The CMU processes messages of the media resource control protocol and operates the corresponding resources.
It is inserted in a common back slot of the SSM-256 frame or SSM-32 frame. No corresponding front board is required. It is inserted in the subboard slot of the UG02MOMB or the UG02MMPB of the SSM-32 frame.
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The CMU processes messages of the media resource control protocol and operates the corresponding resources.
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Board Name
Backup Mode
Board Position
Function
It is inserted in a common back slot of the SSM-256 frame.
The PPU processes the H. 248/SCTP/ UDP/TCP/IP protocols. The external interfaces include the FE interface.
Logical Board
Physical Board
Protocol Processing Unit (PPU)
Media gateway Back Protocol Processing Unit (MPPB)
Load sharing
Media gateway Connection Maintenance Front Unit (MCMF)
Load sharing
Media gateway Connection Maintenance Back unit (MCMB)
Load sharing
No corresponding front board is required. It is inserted in a common front slot of the SSM-256 frame or the SSM-32 frame. No corresponding back board is required. It is inserted in a common back slot of the SSM-256 frame or the SSM-32 frame. No corresponding front board is required.
Service and Protocol Processing Units Table 3-2 Service and protocol processing units Board Name Logical Board
Physical Board
High-speed Routing Unit (HRB)
Media gateway High-speed Routing Unit (MHRU)
Backup Mode
Board Position
Function
Master/slave
It is inserted in a common front slot of the SSM-256 frame or the SSM-32 frame.
The MHRU transfers the RTP/RTCP and IP bearer services.
A corresponding E8T/E1G back board is required. High-speed Routing Unit (HRB)
Media gateway RTP Processing Unit (MRPU)
Master/slave
It is inserted in a common front slot of the SSM-256 frame or the SSM-32 frame. A corresponding E8T/E1G back board is required.
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The MRPU processes the IP routes, converges and distributes IP services.
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Board Name Logical Board
Physical Board
High-speed Routing Unit (HRB)
Media gateway High-speed Routing Unit D (MHRD)
Backup Mode
Board Position
Function
Master/slave
It is inserted in a common back slot of the SSM-256 frame or the SSM-32 frame.
The MHRD processed the IP routes, and it converges, and distributes the IP services.
A corresponding D8FT/D1GO subboard is required.
High-speed Routing Unit (HRB)
ATM AAL2/ AAL5 SAR Processing Unit (ASU)
Media gateway IP over E1 Unit (MIOE)
Media gateway ATM AAL2/ AAL5 SAR Processing Unit (MASU)
Master/slave
Master/slave
It is inserted in a common front slot of the SSM-256 frame or the SSM-32 frame.
The MHRD provides the service access function. The MIOE implement IP over E1. When the board is used in the SSM-256 frame, the frame must be configured with the MTNB.
In the SSM-256 The ASU frame or the SSM-32 processes ATM frame, it is inserted in services. a common front slot of the main control frame and the service frame. A corresponding A4L/EAC/TAC back board is required.
Front Signalling Processing unit (SPF)
Media gateway Front Signalling Processing unit (MSPF)
Load sharing
It is inserted in a common front slot of the SSM-256 frame or the SSM-32 frame. No corresponding back board is required.
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The SPF performs signaling adaptation and transfers the signaling.
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Switching and Cascading Units Table 3-3 Switching and cascading units Board Name Logical Board
Physical Board
Packet switch Unit (NET)
Media gateway Packet switch Unit (MNET)
Backup Mode
Board Position
Function
Master/slave
It is inserted in back slot 7 or 8 of the SSM-256 frame.
The NET implements switching of packet services and data cascading between frames.
A corresponding MPU or OMU front board is required.
The external interfaces includes the 2xGE, 4xFE, Clock, MIR, OMC interfaces. Front Link Unit (FLU)
Media gateway Front Link Unit (MFLU)
Nullbackup
It is inserted in a front slot of the SSM-256 central switching frame except slots 6, 7, 8 and 9. A corresponding BLU back board is required.
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The FLU and BLU provide 32 K or 24 K subscriber cascading capacity, interfacing and switching functions on time division multiplexing (TDM) narrowband data plane, and 2 x 1.25 Gbit/s cascading capacity and interfacing function on the broadband data plane. Providing FE control data channels to directly connect frames The BLU provides the
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Board Name Logical Board
Physical Board
Back Link Unit (BLU)
Media gateway Back Link Unit (MBLU)
Backup Mode
Board Position
Function
Master/slave
It is inserted in a back slot of the SSM-256 central switching frame except slots 6, 7, 8 and 9.
cascading interface.
A corresponding FLU front board is required.
3-8
Net Link Unit (NLU)
Media gateway Net Link Unit (MNLU)
Load sharing
It is in back slots 4, 5, 10 and 11 of the SSM-32 frame.
The NLU provides 2 x 1.25G/1 x 1.25G cascading capacity and interfacing function on the broadband data plane.
TDM central switching Net Unit (TNU)
Media gateway TDM switching Net Unit (MTNU)
Master/slave
It is inserted in back slot 6 or 9 of the SSM-256 frame.
The TNU implements TDM service switching. The MTNU provides 24 K cascading capacity. The TCLU provides 24 K cascading capacity. The MTNB provides 32 K
No corresponding front board is required.
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Board Name Logical Board
Physical Board TDM Convergence & Link Unit (TCLU)
Backup Mode
Board Position
Function
Master/slave
It is inserted in back slot 6 or 9 of the SSM-256 main control frame or the service frame.
cascading capacity.
No corresponding front board is required. Media gateway TDM switching Net Unit B (MTNB)
Master/slave
Media gateway TDM switching Net Unit C (MTNC)
Master/slave
It is inserted in back slot 6 or 9 of the SSM-256 frame. No corresponding front board is required. It is in back slots 6, 7, 8 and 9 of the SSM-32 frame.
The MTNC provides maximum 4 x 8K cascading capacity. The MTNC provides the FE switching function for the control plane. The MTNC provides multiframe cascading channels for the FE plane and the TDM plane.
The MTNC manages the boards in the A corresponding frame where the MOMB/MMPB front MTNC is board is required. located. Each board occupies two slots.
The MTNC provides level 3 clock signal for the system through the clock subboard.
Interface Units
CAUTION The ports that the UMG8900 provides are type 2 equipment defined in Electromagnetic compatibility and Electrical Safety for Network Telecommunications Equipment issue 3. The E1/T1 ports are only used to connect with indoor cables. If not, install protectors to avoid any damage to the equipment.
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Table 3-4 Interface units Board Name Logical Board
Physical Board
1-port GE Optical interface card (E1G)
Media gateway one-port GE Optical interface card (MG1O)
Backup Mode
Board Position
Function
Nullbackup
It is inserted in a common back slot of the SSM-256 frame or the SSM-32 frame.
The E1G provides one GE interface.
A corresponding HRB front board is required. 2*155M SDH/ SONET optical interface card (S2L)
Media gateway 2*155M SDH/ SONET optical interface card (MS2L)
Master/ slave or load sharing
Media gateway 2*155M SDH/ SONET Electronical interface card (MS2E)
Master/ slave or load sharing
1*155M SDH/ SONET optical interface card (S1L)
Media gateway 1*155M SDH/ SONET optical interface card (MS1L)
Master/ slave or load sharing
Media gateway 2*155M SDH/ SONET Electronical interface card (MS1E)
Master/ slave or load sharing
Media gateway 4 Ports STM-1 ATM Optical Interface Board (MA4L)
Nullbackup
4 Ports STM-1 ATM Optical Interface Board (A4L)
The UG01MS2L and UG01MS2E can be only inserted in a common back slot of the SSM-256 frame. The UG02MS2L and UG02MS2E can be inserted in a common back slot of the SSM-256 frame or the SSM-32 frame. No corresponding front board is required.
The MS2L provides two 155 Mbit/s SDH optical interfaces. The MS2E provides two 155 Mbit/s SDH electrical interfaces.
It is inserted in a common back slot of the SSM-32 frame. No corresponding front board is required.
The MS1L provides one 155 Mbit/s SDH optical interface. The MS1E provides one 155 Mbit/s SDH electrical interface.
It is inserted in a common back slot of the SSM-256 frame or the SSM-32 frame.
The A4L provides four 155 M ATM optical interfaces.
A corresponding ASU front board is required.
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Board Name Logical Board
Physical Board
8-port 10/100M Ethernet interface board (E8T)
Media gateway 8port 10/100M Ethernet Interface Board (ME8T)
Backup Mode
Board Position
Function
Nullbackup
It is inserted in a common back slot of the SSM-256 frame or the SSM-32 frame.
The E8T provides eight FE interfaces.
A corresponding HRB front board is required. 32*E1 port TDM interface board (E32)
32*T1 port TDM interface board (T32)
Media gateway 32*E1 ports TDM interface board (ME32)
Load sharing
Media gateway 32*E1 interface card with Signaling function Unit (MESU)
Load sharing
Media gateway 32*T1 ports TDM interface board (MT32)
Load sharing
It is inserted in a common back slot of the SSM-256 frame or the SSM-32 frame. No corresponding front board is required.
The ME32 provides 32 E1 interfaces to extract line signaling from CAS such as R2 and CNo.1 or insert line signaling into them. The MESU provides 32 E1 interfaces to receive and send NO.5 line signaling and register signaling.
It is inserted in a common back slot of the SSM-256 frame or the SSM-32 frame.
The MT32 provides 32 T1 interfaces to extract line signaling from CAS such as R2 and CNo.1 or insert line signaling into them.
No corresponding front board is required.
32*T1 port TDM interface board (T32)
Media gateway 32*T1 interface card with Signaling function Unit (MTSU)
Load sharing
It is inserted in a common back slot of the SSM-256 frame or the SSM-32 frame. No corresponding front board is required.
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The MTSU provides 32 T1 interfaces to receive and send NO.5 line signaling and register signaling.
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Board Name Logical Board
Physical Board
PDH Interface Electronical Unit (PIE)
Media gateway PDH Interface Electronical Unit (MPIE)
Backup Mode
Board Position
Function
Master/ slave or load sharing
It is inserted in a common back slot of the SSM-256 frame or the SSM-32 frame.
The PIE provides three E3/T3 PDH electrical interfaces.
No corresponding front board is required. 32-port E1 ATM Interface Card (EAC)
Media gateway 32port E1/T1 ATM Interface Card (MEAC)
Nullbackup
It is inserted in a common back slot of the SSM-256 frame or the SSM-32 frame.
The EAC provides 32 IMA E1 interfaces.
A corresponding ASU front board is required. 32-port T1 ATM Interface Card (TAC)
Media gateway 32port T1 ATM Interface Card (MTAC)
Nullbackup
In the SSM-256 frame or the SSM-32 frame, it is inserted in a common back slot of the main control frame or the service frame.
The TAC provides 32 IMA T1 interfaces.
A corresponding ASU front board is required.
Media Resource Processing Units Table 3-5 Media resource processing units Board Name Logical Board
Physical Board
Voice Processing Unit (VPU)
Media gateway Voice Processing Unit B (MVPB)
Backup Mode
Board Position
Function
Load sharing
It is inserted in a common front slot of the SSM-256 frame.
The VPU works with the voice subboards. The VPU provides the transcoding and EC functions for voice service streams.
No corresponding back board is required.
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Board Name Logical Board
Physical Board Media gateway Voice Processing Unit D (MVPD)
Backup Mode
Board Position
Function
Load sharing
It is inserted in a common front slot of the SSM-256 frame or the SSM-32 frame.
The VPU provides announcement playing resources to implement the digit-collecting and announcementplaying services. When the MVPD is used in the SSM-256 frame, the frame must be configured with the MTNB.
No corresponding back board is required. Media gateway TransCode Unit B (MTCB)
Load sharing
It is inserted in a common front slot of the SSM-256 frame. No corresponding back board is required.
Media gateway TransCode Unit D (MTCD)
Load sharing
It is inserted in a common front slot of the SSM-256 frame or the SSM-32 frame. No corresponding back board is required.
Echo Cancellation Unit (ECU)
Media gateway Echo Cancellation Unit (MECU)
Load sharing
The UG01MECU can be inserted in a common front slot of the SSM-256 frame. The UG02MECU can be inserted in a common front slot of the SSM-256 frame or the SSM-32 frame.
The ECU works with the voice subboards. The ECU implements the EC function for voice signals.
No corresponding front board is required.
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Clock Units Table 3-6 Clock units Board Name Logical Board
Physical Board
Clock Unit (CLK)
Media gateway Clock Unit (MCLK)
Backup Mode
Board Position
Function
Master/ slave
It is inserted in back slot 0 or 1 of the SSM-256 frame or the SSM-32 frame.
The CLK provides clock signals for services.
No corresponding front board is required.
The external interfaces includes the clock input/ output interfaces.
Backup Mode
Board Position
Function
Nullback up
It is inserted in a common back slot of the SSM-256 frame or the SSM-32 frame.
The LPB provides the lightning protection for the outdoor E1 trunk cable.
Lightning Protection Units Table 3-7 Lightning protection units Board Name Logical Board
Physical Board
Lighting Protected Board (LPB)
Media gateway E1 Lightning Protected Board (MLPB)
No corresponding front board is required.
3.2 Matching Limitation of Boards Matching limitation of boards refers to the matched usage relationship of boards. Only the configuration of some boards is involved. When configuring boards of the UMG8900, comply with the matching limitation. Otherwise, the service may be abnormal. Table 3-8 to Table 3-11 list the detailed matching limitation. Table 3-8 Limitation on front and back boards
3-14
Item
Description
Front boards in SSM-256 frame
MOMU, MMPU, MHRU, MRPU, MIOE, FLU, VPU, ECU, ASU, SPF and MCMF.
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Item
Description
Back boards in SSM-256 frame
MNET, CLK, TNU, E8T, E1G, A4L, BLU, E32, T32, PIE, EAC, TAC, S2L, MHRD, PPU and MCMB.
Front boards in SSM-32 frame
MOMB, MMPB, MHRU, MRPU, MIOE, MVPD, UG02ECU, ASU, SPF and MCMF.
Back boards in SSM-32 frame
MTNC, CLK, E8T, E1G, E32, T32, A4L, S1L, UG02S2L, PIE, NLU, EAC, TAC, MHRD,MCMB and PPU.
Table 3-9 Limitation on opposite positions Item
Description
In the SSM-256 frame
BLU: FLU MOMU/MMPU: MNET ASU: A4L, EAC, TAC MHRU and MRPU of HRB: E1G, E8T
In the SSM-32 frame
MOMB/MMPB: MTNC In an SSM-32 frame, a front board and the corresponding back board cannot use the GE bus of the backplane at the same time.
Table 3-10 Limitation on fixed positions Item
Description
In the SSM-256 frame
The OMUs can be inserted only in front slots 7 and 8 in the main control frame. The MPUs can be inserted only in front slots 7 and 8 in the frames except the main control frame. The NETs can only be inserted in back slots 7 and 8. The TNUs can only be inserted in back slots 6 and 9. The CLKs can be inserted only in back slots 0 and 1 in frames 0 and 1. The FLUs and BLUs can be inserted only in frames 0 and 1.
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Item
Description
In the SSM-32 frame
The OMUs (MOMB) are physically located in front slots 7 and 9 in the main control frame, but logically, they need to be configured in slots 7 and 8. The MPUs (MMPB) are physically located in front slots 7 and 9 in the service frame, but logically, they need to be configured in slots 7 and 8. The TNUs (MTNC) are physically located in back slots 7 and 9 in the main control frame or service frame, but logically, they need to be configured in slots 7 and 8. The CLKs, if required, can only be configured in back slots 0 and 1 in the main control frame. NOTE The MOMB, MMPB, and MTNC occupy two slots. Therefore, slots 6 and 8 cannot be inserted with other boards if the MOMB, MMPB, or MTNC is used.
Table 3-11 Matching limitation of boards Item
Description
Boards that can be used when the MTNU/ TCLU is inserted in the SSM-256 frame
UG01E32, UG01T32, UG01BLU, UG01FLU, UG02BLU, UG02FLU, UG01SPF, UG01HRU, UG02HRU, UG01MS2L, UG01MS2E, UG02S2L, UG02S2E, UG02ECU, UG01VPB, UG02VPB, UG01ASU, UG02ASU
Boards that can be used when the MTNB is inserted in the SSM-256 frame
UG01E32, UG01T32, UG02E32, UG02T32, UG01ESU, UG01TSU, UG01BLU, UG01FLU, UG02BLU, UG02FLU, UG01SPF, UG02SPF, UG03SPF, UG02S2L, UG02S2E, UG02ECU, UG01VPB, UG02VPB, UG01VPD, UG02VPD, UG01HRU, UG02HRU, UG01ASU, UG02ASU
Boards that can be used when the UG01MTNC is inserted in the SSM-32 frame
UG02E32, UG02T32, UG01ESU, UG01TSU, UG02SPF, UG01HRU, UG02HRU, UG01ASU, UG02ASU, UG01S1L, UG01S1E
Boards that can be used when the UG02MTNC is inserted in the SSM-32 frame
UG02E32, UG02T32, UG01ESU, UG01TSU, UG02SPF, UG01HRU, UG02HRU, UG01ASU, UG02ASU, UG02S2L, UG02S2E, UG01S1L, UG01S1E, UG02ECU
NOTE
3-16
l
The appearance difference of the UG01, UG02 and UG03 is that the silkscreen of the front panel name of the UG01 is marked with a, or nothing, that of the UG02 is marked with b, and that of the UG03 is marked with c.
l
Run LST BRDARC to query the information of the board to get the version type of the board.
l
UG01HRU and UG01ASU can be configured only in frames 0 to 15.
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3.3 Connection of Boards Front and back boards in the service frame are inserted onto the backplane that is in the center of the frame. In the UMG8900, boards are divided into front boards, back boards and backplanes according to their positions. l
The front boards are all 9 U (1 U = 44.45 mm = 1.75 in.) high, including service processing boards, and control and management boards.
l
The back boards are all 8 U high, including protocol processing boards and interface boards.
l
The backplane provides signal interconnection between boards.
Figure 3-1 shows the connections between the boards and backplane buses in the SSM-256 frame. Figure 3-1 Connections between boards and backplane buses in the SSM-256 frame
Back
B L U
C L K
P I E
E 3 2
T 3 2
S 2 L
T N U
N E T
C M U
P P U
O M U
M P U
E 8 T
E 1 G
P 4 L
P 1 H
A 4 L
E A C
T A C
MBus FE GE TDM
Front
F L U
V P U
S P F
H R B
C M U
MBus FE GE TDM
A S U
Figure 3-2 shows the connections between the boards and backplane buses in the SSM-32 frame. Figure 3-2 Connections between boards and backplane buses in the SSM-32 frame
Back
N L U
C L K
P I E
E 3 2
T 3 2
S 1 L
T N U
C M U
O M U
M P U
P P U
E 8 T
E 1 G
P 4 L
P 1 H
A 4 L
E A C
T A C
MBus FE GE TDM
Front
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V P U
S P F
C M U
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H R B
A S U
MBus FE GE TDM
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NOTE
Figure 3-1 and Figure 3-2 only show the connections between backplane buses and boards, rather than slots positions. The front boards and back boards are different in height. Therefore, front boards cannot be inserted into the rear backplane or back boards cannot be inserted into the front backplane. Some boards have to be inserted in fixed slots. For information about board positions, see the specific description of each board.
3.4 Signal Streams Between Boards Gateway Control Signal Streams The gateway control signals are used to interact with an MGC and control various service resources of the media gateway (MGW). For the UMG8900, the gateway control signals work based on the H.248 protocol. The SSM-256 single-frame networking is taken as an example. The HRB is used for centralized forwarding and the independent CMU is used to explain the H.248 message, extract the specific H.248 command and control the boards of the service resource and bearer resource. Figure 3-3 shows the gateway control signal processing of the UMG8900. Figure 3-3 Gateway control signal processing MGC
Back
B L U
N E T
F L U
M P U
T N U
C M U
E 3 2
E 8 T
V P U
H R B
FE
Front FE
S P F
C M U
The processing path of gateway control signal streams is: The MGC sends the gateway control signals → IP interface board →HRB→CMU → media resource processing board (VPU) → service bearer board TNU/HRB/ASU → CMU (the execution result returned from the media resource processing board) → HRB → IP interface board →MGC 3-18
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Call Control Signal Streams The call control signal stream refers to the call control signaling used in the service connection process. The UMG8900 supports the embedded signaling gateway (SG) to adapt and transfer the call control signaling. The UMG8900 supports the common channel signaling and channel associated signaling (CAS). The CAS supported by the UMG8900 mainly includes R2, CNo.1, and No.5. The supported common channel signaling includes the SS7, DSSI, and V5 protocol. The UMG8900 implements the adaptation processing and forwarding from the TDM to IP packet and adopts the SIGTRAN protocol. The SPF of the UMG8900 implements the adaptation processing of the common channel signaling. In addition, the SPF parses the messages of the transmission layer at the narrowband TDM side and implements adaptation at the IP packet side. The SSM-256 single-frame networking is taken as an example. Suppose that the upstream IP packet interface provided by the HRB is used to transfer the SS7 signaling based on the M2UA mode. Figure 3-4 shows the transfer path of the SS7 signaling. Figure 3-4 Transfer path of SS7 signaling (SSM-256 frame) MGC
LE/V5AN
Back
E 3 2
N E T
C M U
T N U
E 8 T
FE TDM Front FE TDM
M P U
S P F
C M U
V P U
H R B
MGC: media gateway controller
LE: local exchange
TDM: time division multiplexing
V5AN: V5 access network
FE: fast Ethernet
The adaptation and transfer path of the SS7 signaling is: Narrowband signaling at the TDM side → TDM interface board → TNU → SPF → HRB → IP interface board → MGC For the signaling messages from the MGC, the handling process is same; however, the path is reverse. Issue 05 (2009-01-09)
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Service Bearer Signal Steams The service signal streams refer to the processing flows for bearer services in the UMG8900. The service signal streams also include the processing flows of service resources in the service connection process. The SSM-256 single-frame networking in TDM<->IP bearer application is taken as an example. Figure 3-5 shows the processing flow of service bearer data streams. Figure 3-5 Processing flow for TDM<->IP bearer service flow IP
TDM
Back
T N U
E 3 2
N E T
E 8 T
V P U
H R B
GE TDM
Front GE TDM
TDM: time division multiplexing
GE: gigabit Ethernet
In the TDM<->IP mode, the processing flow of the service bearer signals is: l
For the signal stream input from the TDM side Input of TDM signals → TDM interface board → TNU → VPU → HRB → IP interface board →Output of packet signals
l
For the data packet input from the IP side Input of packet signals → IP interface board → HRB → VPU → TNU → TDM interface board → Output of TDM signals
Related explanation is as follows:
3-20
l
Different bearer services in the packet mode need to be forwarded through the packet switching network provided by the NET.
l
The TDM interface board can be the E32, T32 or S2L. The IP interface board can be the E8T, E1G, P1H or P4L.
l
The service flow between the HRB and its back interface board is not transmitted through the backplane bus. Instead, the front HRB connects with its back interface board directly.
l
The service resource board is the VPU. Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd.
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This mainly describes the service processing flow in single-frame mode. In multi-frame cascading mode, the cascading boards are used to provide the service processing flow between frames.
Operation and Maintenance Signal Streams The operation and maintenance signal streams refer to the processing flows of various operation and maintenance signals during the operation, maintenance and management. The operation and maintenance signal stream of the UMG8900 includes the OMC signal stream, alarm signal stream, and board-loading signal stream. The OMC signal stream sent through the LMT is taken as an example. Figure 3-6 shows the processing flow of the operation and maintenance signal streams. Figure 3-6 Processing flow of OMC signals Service board
MPU Master
NMS
MAINTAIN
OMU Master Ethernet
WARN
TRACE/DEBUG
OMU Slave Main control frame
Service board
MPU Slave
Service board
Control frame
Service board
Service board Interface board Resource board Service board
Service board
MPU Master Operation and maintenace client
CAN
Interface board Resource board
MPU Slave
LAN (FE) UMG900 host
Service frame/ central switching frame
NMS: network management system WARN: alarm management subsystem CAN: control area network
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Resource board
MAINTAIN: operation & maintenance subsystem
TRACE/DEBUG: trace/debug subsystem
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The processing flow of the OMC signals is: Service board → MPU in the same frame → OMU in the main control frame → LMT operation and maintenance system/network management system NOTE
For the service board in the main control frame, the OMC signals are directly reported to the OMU in the same frame.
The previous part describes the signal streams between boards in sample service flow of the UMG8900. For details on signal streams, see the HUAWEI UMG8900 Universal Media Gateway Product Description.
3.5 Common Characteristics of Boards The UMG8900 boards contain maintenance bus (MBus) modules. The MBus module of a service board communicates with the main control board in the same frame through the controller area network (CAN) bus. The main control board is responsible for board version management, status query, board power-on/off control, reset, serial port communication, environment monitor, alarm management and so on. All boards are hot swappable. Each board has a hot pluggable indicator OFFLINE on its front panel and a hot swap switch under its ejector lever. When a board is inserted into a frame and the ejector levers snap in place, the hot swap switch is on. When the ejector levers are removed, the switch is off and the hot swap indicator lights up. This indicates that the board can be removed. The power consumption of the board of the UMG8900 turns to heat, that is, the power consumption and heat dissipation are in the same level.
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4 Equipment Management and Maintenance Units
Equipment Management and Maintenance Units
About This Chapter The equipment management and maintenance units consist of MOMU, MOMB, MMPU, and MMPB. 4.1 MOMU This describes the functions, panels and structures, indicators, interfaces, DIP switches and jumpers, fuses, and technical specifications of the MOMU. 4.2 MOMB This describes the functions, panels and structures, indicators, interfaces, DIP switches and jumpers, fuses, and technical specifications of the MOMB. 4.3 MMPU This describes the functions, panels and structures, indicators, interfaces, DIP switches and jumpers, fuses, and technical specifications of the MMPU. 4.4 MMPB This describes the functions, panels and structures, indicators, interfaces, DIP switches and jumpers, fuses, and technical specifications of the MMPB.
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HUAWEI UMG8900 Hardware Description
4.1 MOMU This describes the functions, panels and structures, indicators, interfaces, DIP switches and jumpers, fuses, and technical specifications of the MOMU. As the management and control center of the whole equipment, the master and slave MOMUs are inserted in front slots 7 and 8 in the main control frame. Their corresponding back boards are MNETs, which are in back slots 7 and 8. The MOMU can be inserted only in the SSM-256 frames. The board provides the following functions: l
Providing packet switching function at the control plane to communicate with all the boards with fast Ethernet (FE) control interfaces and to exchange information with other frames and manage interfaces in multi-frame cascading mode
l
Monitoring and managing all boards. When multiple frames are cascaded, the MOMU queries and manages the MMPUs through FE cascading channels. Therefore, it can manage and monitor the boards
l
Realizing the management and maintenance functions through the MML interfaces. The MOMU provides the embedded disk as the BAM, which enables the server/client mode with the local maintenance terminal (LMT). The embedded disk can save logs and alarm files
l
Implementing state monitoring and power-on/off management through special maintenance bus (MBus) modules; avoiding the influence of instant currents by controlling board power-on sequence
4.1.1 Panel of the MOMU 4.1.2 Indicators on the MOMU 4.1.3 Interfaces on the MOMU 4.1.4 Jumpers on the MOMU 4.1.5 Fusess on the MOMU 4.1.6 Technical specifications of the MOMU
4.1.1 Panel of the MOMU Figure 4-1 shows the panel of the MOMU.
4-2
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Figure 4-1 Panel of the MOMU
JP1
MOMU
F4 F1
POWER
POWER
LSWA BIOS
FE LSWA
RUN ALM ACT
1 2 3
J13 H10 RESET
LSWB BIOS
1
9
10 2
1
H8
2
CPLD
RTC
CPU MBUS
COM0 FE0
10
9
FE LSWB
OFFLINE
F2
MOMU
CAUTION The MOMU must be reset before being removed or inserted. Pull the two ejector levers. Then, pull out the board when the indicator is on. Follow the instructions strictly. Otherwise, the BAM file may be corrupted. In daily maintenance, it is recommended to run RST BRD to reset the boards with reset buttons to ensure the completeness of BAM information. The RESET button on the front panel is used to reset the board.
4.1.2 Indicators on the MOMU Table 4-1 lists the meaning of the indicators on the MOMU.
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Table 4-1 Indicator meaning of the MOMU Indicator
Identific ation
Color
Status
Meaning
Running indicator
RUN
Green
Always on
There is power supply, but the board is faulty.
Always off
There is no power supply, or the board is faulty.
Flashing (on for 1 second, off for another second)
The board runs normally in accordance with configuration.
Flashing fast (4 times per second)
Software is being loaded to the board, or the board does not run.
Always on or flashing fast
Alarms occur to the board.
Always off
No fault occurs.
Flashing
The board is in service such as in the master state.
Always off
The board is out of service such as in the slave state.
Always on
The board can be removed.
Always off
The board cannot be removed at the moment.
Alarm indicator
Working indicator
Hot-pluggable indicator
ALM
ACT
OFFLINE
Red
Green
Blue
4.1.3 Interfaces on the MOMU
CAUTION Crossover cables are used to directly connect the debug network port and the PC used for debugging. If the connection is set up through the LAN Switch, straight through cables are used. Table 4-2 lists the interfaces on the MOMU.
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Table 4-2 Interfaces on the MOMU Category
Quantity
Physical Interface
Function
Specification
COM0
1
RJ48
Used as a debug serial port
RS232 serial port
FE0
1
RJ45
Used as a debug network interface
FE network interface
4.1.4 Jumpers on the MOMU The jumper JP13 is available on the MOMU to choose packet switching modules to load. Table 4-3 lists the setting. Table 4-3 Jumper description of the MOMU Jumper Name and Location No.
State
Function
Loading selection jumper of switching module JP13
Jumper pins 1 and 2 are closed.
To load switching module 1
Jumper pins 2 and 3 are closed.
To load switching module 2
4.1.5 Fusess on the MOMU For details on fuse positions of the MOMU, see 4.1.1 Panel of the MOMU. Table 4-4 lists the specifications. Table 4-4 Fuses on the MOMU No.
Function
Specification
F1
–48 V power fuse
4A
F2
MBus 5 V power fuse
1A
F4
–48 V power fuse
4A
NOTE
If the fuse on the board of the UMG8900 is damaged, replace the board directly.
4.1.6 Technical specifications of the MOMU Table 4-5 lists the technical specifications of the MOMU. Issue 05 (2009-01-09)
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Table 4-5 Technical specifications of the MOMU Category
Parameter
Specification
Remarks
Power consumption
N/A
61 W
–
Heat dissipation
N/A
61 W
4.2 MOMB This describes the functions, panels and structures, indicators, interfaces, DIP switches and jumpers, fuses, and technical specifications of the MOMB. The MOMB is the operation and maintenance unit of the UMG8900. It is physically located in front slots 7 and 9 in the main control frame; however, it is logically configured in slots 7 and 8. Each MOMB occupies two slots and all the MOMBs occupy four slots from slot 6 to slot 9. The MOMBs work in master and slave mode. The MOMB is inserted opposite to the MTNC in pairs. The MOMB can be inserted only in the SSM-32 frame. The MOMB provides the following functions: l
Monitoring and managing the boards within the frame. The MOMB can be inserted only in the main control frame. The MMPB is inserted in the service frame to maintain and manage boards in the frame. In multi-frame cascading application, the MOMB and the MMPB maintain and manage the whole device through FE cascading channels between frames.
l
Providing an embedded CF card, which works as the BAM. The CF card and the local maintenance terminal (LMT) can work in server/client mode. You can manage and maintain the device through the graphical MML operating interface that is provided by the LMT. The embedded CF card can save logs and alarm files.
l
Being embedded with the high performance GE switching net and implements switching on the broadband service data plane through the backplane.
The MOMB falls into two types: UG01MOMB and UG02MOMB. The UG02MOMB is compatible with the UG01MOMB. The new functions of the UG02MOMB are as follows: l
Two CMU subboards are added on the UG02MOMB.
l
The maintenance bus (Mbus) is added on the UG02MOMB to control the power-on, poweroff, and resetting of the CMU subboard.
l
The UG02MOMB provides one GE channel for each front slot and back slot and provides two GE channels respectively for back slots 4, 5, 10, and 11.
CAUTION
4-6
l
The CMU subboard must be installed on site.
l
The CMU subboard cannot be installed on the UG02MOMB when the UG02MOMB and the UG01MOMB are used at the same time. Therefore, only the function of the UG01MOMB can be realized.
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4.2.1 Panel of the MOMB 4.2.2 Indicators on the MOMB 4.2.3 Interfaces on the MOMB 4.2.4 Fuses on the MOMB 4.2.5 Technical specifications of the MOMB
4.2.1 Panel of the MOMB Figure 4-2 shows the panel of the UG01MOMB. Figure 4-2 Panel of the MOMB
F1
MOMB
J6
POWER 10
9 1
J17
2
F2
RUN ALM ACT
CPLD 2
10
Compact FLASH
J10
CPU
RESET
J8
MBUS RTC FLASH
COM0FE0
BIOS
GE LSW
OFFLINE
MOMB
Figure 4-3 shows the panel of the UG02MOMB.
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Figure 4-3 Panel of the UG02MOMB
-48V
F1/4A
+5V
MOMBb J6 POWER
F2/1A
CPU
RUN ALM ACT
Compact FLASH
SCMU1
SCMU J8
S1 5338A
BOOTROM/ CPLD
SCMU J17 J10
J21
SCMU2
5338A
MBUS GE LSW
COM0 FE0
1208 JTAG
OFFLINE
MOMBb
CAUTION The MOMB must be reset before being removed or inserted. Pull the two ejector levers. Then, pull out the board when the indicator is on. Follow the instructions strictly. Otherwise, the BAM file may be corrupted. The RESET button on the front panel is used to reset the board.
4.2.2 Indicators on the MOMB Table 4-6 lists the meaning of indicators on the MOMB.
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Table 4-6 Indicator meaning of the MOMB Indicator
Identifica tion
Color
Status
Meaning
Running indicator
RUN
Green
Always on
There is power supply, but the board is faulty.
Always off
There is no power supply, or the board is faulty.
Flashing (on for 1 second, off for another second)
The board runs normally in accordance with configuration.
Flashing fast (4 times per second)
Software is being loaded to the board, or the board does not run.
Always on or flashing fast
Alarms occur to the board.
Always off
No fault occurs.
Always on or flashing
The board is in service such as in the master state.
Always off
The board is out of service such as in the slave state.
Always on
The board can be removed.
Always off
The board cannot be removed at the moment.
Alarm indicator
Working indicator
Hot-pluggable indicator
ALM
ACT
OFFLINE
Red
Green
Blue
4.2.3 Interfaces on the MOMB Table 4-7 lists the interfaces on the MOMB. Table 4-7 Interfaces on the MOMB Category
Quantity
Physical Interface
Function
Specification
COM0
1
RJ48
Used as a debug serial port
RS232 serial port
FE0
1
RJ45
Used as a debug network interface
FE network interface
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For details on fuse positions of the MOMB, see 4.2.1 Panel of the MOMB. Table 4-8 lists the specifications. Table 4-8 Fuses on the MOMB No.
Function
Specification
F1
–48 V power fuse
4A
F2
MBus 5 V power fuse
1A
4.2.5 Technical specifications of the MOMB Table 4-9 and Table 4-10 list the technical specifications of the MOMB. Table 4-9 Technical specifications of the MOMB Category
Parameter
Specification
Remarks
Power consumption
N/A
21.7 W
–
Heat dissipation
N/A
21.7 W
Table 4-10 Technical specifications of the UG02MOMB Category
Parameter
Specification
Remarks
Power consumption
N/A
35 W
-
Heat dissipation
N/A
35 W
4.3 MMPU This describes the functions, panels and structures, indicators, interfaces, DIP switches and jumpers, fuses, and technical specifications of the MMPU. As the main processing unit, the master and slave MMPUs are inserted in front slots 7 and 8 in the central switching frame, service frame, and extended control frame. The MMPU is inserted in a slot opposite to the MNET in pairs. The MMPU can be inserted only in SSM-256 frames. The MMPU provides the following functions: l
Providing switching functions at the FE control plane to exchange control information between all boards with FE control interfaces in the frame, and exchange control information between frames and manage interfaces in multi-frame cascading mode
l
Monitoring and managing boards within the frame
l
Implementing state monitoring and power-on/off management through special maintenance bus (MBus) modules; avoiding the influence of instant currents by controlling board power-on sequence
4.3.1 Panel of the MMPU 4.3.2 Indicators on the MMPU 4-10
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4.3.3 Interfaces on the MMPU 4.3.4 Jumpers on the MMPU 4.3.5 Fuses on the MMPU 4.3.6 Technical specifications of the MMPU
4.3.1 Panel of the MMPU Figure 4-4 shows the panel of the MMPU. Figure 4-4 Panel of the MMPU
JP1
MMPU
F4 F1
POWER
POWER
LSWA BIOS
FE LSWA
RUN ALM ACT
1 2 3
J13 H10 RESET
LSWB BIOS
1
9
10 2
1
H8
2
CPLD
RTC
CPU MBUS
COM0 FE0
10
9
FE LSWB
OFFLINE
F2
MMPU
The RESET button on the front panel is used to reset the board.
4.3.2 Indicators on the MMPU Table 4-11 lists the meaning of the indicators on the MMPU.
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Table 4-11 Indicator meaning of the MMPU Indicator
Identifica tion
Color
Status
Meaning
Running indicator
RUN
Green
Always on
There is power supply, but the board is faulty.
Always off
There is no power supply, or the board is faulty.
Flashing (on for 1 second, off for another second)
The board runs normally in accordance with configuration.
Flashing fast (4 times per second)
Software is being loaded to the board, or the board does not run.
Always on or flashing fast
Alarms occur to the board.
Always off
No fault occurs.
Always on or flashing
The board is in service such as in the master state.
Always off
The board is out of service such as in the slave state.
Always on
The board can be removed.
Always off
The board cannot be removed at the moment.
Alarm indicator
Working indicator
Hot-pluggable indicator
ALM
ACT
OFFLINE
Red
Green
Blue
4.3.3 Interfaces on the MMPU Table 4-12 lists the interfaces on the MMPU. Table 4-12 Interfaces on the MMPU
4-12
Category
Quantity
Physical Interface
Function
Specification
COM0
1
RJ48
Used as a debug serial port
RS232 serial port
FE0
1
RJ45
Used as a debug network interface
FE network interface
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4.3.4 Jumpers on the MMPU The jumper JP13 is available on the MMPU to choose packet switching modules to load. Table 4-13 lists the setting. Table 4-13 Jumper description of the MMPU Jumper Name and Location No.
State
Function
Loading selection jumper of switching module JP13
Jumper pins 1 and 2 are closed.
To load switching module 1
Jumper pins 2 and 3 are closed.
To load switching module 2
4.3.5 Fuses on the MMPU For details on fuse positions of the MMPU, see 4.3.1 Panel of the MMPU. Table 4-14 lists the specifications. Table 4-14 Fuses on the MMPU No.
Function
Specification
F1
–48 V power fuse
4A
F2
MBus 5 V power fuse
1A
F4
–48 V power fuse
4A
4.3.6 Technical specifications of the MMPU Table 4-15 lists the technical specifications of the MMPU. Table 4-15 Technical specifications of the MMPU Category
Parameter
Specification
Remarks
Power consumption
N/A
60 W
–
Heat dissipation
N/A
60 W
4.4 MMPB This describes the functions, panels and structures, indicators, interfaces, DIP switches and jumpers, fuses, and technical specifications of the MMPB. The MMPB is the main processing unit of the UMG8900. It is physically inserted in front slots 7 and 9 in the service frame; however, it is logically configured in slots 7 and 8. The MMPB can be inserted only in the SSM-32 frame. Each board occupies two slots and all the boards Issue 05 (2009-01-09)
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4 Equipment Management and Maintenance Units
HUAWEI UMG8900 Hardware Description
occupy slots 6 to 9. They work in master and slave mode. The MMPB is inserted in the slot opposite to the MTNC in pairs. The MMPB provides the following functions: l
Being embedded with the high performance GE switch net, the MMPB implements switching on the broadband service data plane through the backplane
The MMPB falls into two types: UG01MMPB and UG02MMPB. The UG02MMPB is compatible with the UG01MMPB. The new functions of the UG02MMPB are as follows: l
Two CMU subboards are added to realize the service processing function with high performance.
l
The maintenance bus (MBus) is added on the UG02MMPB to control the power-on, poweroff, and resetting of the CMU subboard.
l
The UG02MMPB provides one GE channel for each front slot and back slot and provides two GE channels respectively for back slots 4, 5, 10, and 11.
CAUTION l
The CMU subboard must be installed on site.
l
The CMU subboard cannot be installed on the UG02MMPB when the UG02MMPB and the UG01MMPB are used at the same time. Therefore, only the function of the UG01MMPB can be realized.
4.4.1 Panel of the MMPB 4.4.2 Indicators on the MMPB 4.4.3 Interfaces on the MMPB 4.4.4 Fuses on the MMPB 4.4.5 Technical specifications of the MMPB
4.4.1 Panel of the MMPB Figure 4-5 shows the panel of the MMPB.
4-14
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4 Equipment Management and Maintenance Units
Figure 4-5 Panel of the MMPB
F1
MMPB
J6
POWER
10
9 1
J17
2
F2
RUN ALM ACT
CPLD
2
10
J10
CPU
J8
RESET
MBUS RTC FLASH
GE LSWB
GE LSWA
COM0FE0
BIOS
OFFLINE
MMPB
Figure 4-6 shows the panel of the UG02MMPB.
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4 Equipment Management and Maintenance Units
Figure 4-6 Panel of the UG02MMPB
-48V
MMPBb
F1/4A
+5V
J6 POWER
F2/1A
RUN ALM ACT
CPU SCMU1
SCMU
S1 5338A
BOOTROM/ CPLD
SCMU J17 J10
J21
SCMU2
5338A
COM0 FE0
1208 JTAG
MBUS GE LSW
OFFLINE
MMPBb
4.4.2 Indicators on the MMPB Table 4-16 lists the meaning of the indicators on the MMPB. Table 4-16 Indicator meaning of the MMPB
4-16
Indicator
Identific ation
Color
Status
Meaning
Running indicator
RUN
Green
Always on
There is power supply, but the board is faulty.
Always off
There is no power supply, or the board is faulty.
Flashing (on for 1 second, off for another second)
The board runs normally in accordance with configuration.
Flashing fast (4 times per second)
Software is being loaded to the board, or the board does not run.
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Indicator
Identific ation
Color
Status
Meaning
Alarm indicator
ALM
Red
Always on or flashing fast
Alarms occur to the board.
Always off
No fault occurs.
Flashing
The board is in service such as in the master state.
Always off
The board is out of service such as in the slave state.
Always on
The board can be removed.
Always off
The board cannot be removed at the moment.
Working indicator
Hot-pluggable indicator
ACT
OFFLINE
Green
Blue
4.4.3 Interfaces on the MMPB Table 4-17 lists the interfaces on the MMPB. Table 4-17 Interfaces on the MMPB Category
Quantity
Physical Interface
Function
Specification
COM0
1
RJ48
Used as a debug serial port
RS232 serial port
FE0
1
RJ45
Used as a debug network interface
FE network interface
4.4.4 Fuses on the MMPB For details on fuse positions of the MMPB, see 4.4.1 Panel of the MMPB. Table 4-18 lists the specifications. Table 4-18 Fuses on the MMPB No.
Function
Specification
F1
–48 V power fuse
4A
F2
MBus 5 V power fuse
1A
4.4.5 Technical specifications of the MMPB Table 4-19 and Table 4-20 list the technical specifications of the MMPB. Issue 05 (2009-01-09)
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Table 4-19 Technical specifications of the MMPB Category
Parameter
Specification
Remarks
Power consumption
N/A
19.6 W
–
Heat dissipation
N/A
19.6 W
Table 4-20 Technical specifications of the UG02MMPB
4-18
Category
Parameter
Specification
Remarks
Power consumption
N/A
33 W
-
Heat dissipation
N/A
33 W
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5 IP and TDM Switching Units
5
IP and TDM Switching Units
About This Chapter The IP and TDM switching units consist of MNET, MTNU, TCLU, MTNB, and MTNC. 5.1 MNET This describes the functions, panels and structures, indicators, interfaces, DIP switches and jumpers, fuses, and technical specifications of the MNET. 5.2 MTNU This describes the functions, panels and structures, indicators, interfaces, DIP switches and jumpers, fuses, and technical specifications of the MTNU. 5.3 TCLU This describes the functions, panels and structures, indicators, interfaces, DIP switches and jumpers, fuses, and technical specifications of the TCLU. 5.4 MTNB This describes the functions, panels and structures, indicators, interfaces, DIP switches and jumpers, fuses, and technical specifications of the MTNB. 5.5 MTNC This describes the functions, panels and structures, indicators, interfaces, DIP switches and jumpers, fuses, and technical specifications of the MTNC.
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5.1 MNET This describes the functions, panels and structures, indicators, interfaces, DIP switches and jumpers, fuses, and technical specifications of the MNET. As the packet switching unit of the UMG8900, the master and slave MNETs are inserted in back slots 7 and 8 in the frame. The MNET can be inserted only in SSM-256 frames. The MNET provides the following functions: l
Providing packet service switching channels in a frame to exchange service data between packet service boards in the frame
l
Cascading two frames to realize the cascading function between frames. The embedded cascading module in the board enables interworking of 2 x GE service data planes and interworking of 2 x FE service control planes
l
Providing service control and maintenance interfaces for the corresponding front boards such as the MOMU or the MMPU to meet back cabling requirement
l
Receiving clock signals from the MCLK, and sending them to TDM service processing boards after phase lock, signal driving and distributing The internal clocks synthesized and distributed by the MNET are as follows: –
32.768 MHz clock: TDM HW synchronous clock signals for the TDM bearer processing
–
38.88 MHz clock: TDM SDH synchronous clock, including the synchronous clock required by the ATM and POS services in the SDH transmission mode
–
2 kHz clock: TDM SDH frame clock
The TNU, E32, T32, S2L, S1L, TCU, BLU, SPF and ECU use 32.768 MHz, 38.88 MHz and 2 kHz clock signals. The A4L and P1H only use the 38.88 MHz clock signal. For details on system clock, see the HUAWEI UMG8900 Universal Media Gateway Product Description. The MNET falls into two types: the UG01MNET and UG02MNET. The difference between them is as follows: l
The UG01MNET provides 16 GE cascading capacity, and the UG02MNET provides 24 GE cascading capacity.
l
The FE interfaces on the UG01MNET board include FE0 and FE1. The FE interfaces on the UG02MNET board include FE0, FE1&FE2, and FE3&FE4. The function of FE0 interface is same as that on the UG01MNET. FE1&FE2 and FE3&FE4 interfaces are cascading network interfaces which can provide four cascading network interfaces by extended network cables.
5.1.1 Panel of the MNET 5.1.2 Indicators on the MNET 5.1.3 Interfaces on the MNET 5.1.4 Fuses on the MNET 5.1.5 Technical specifications of the MNET
5.1.1 Panel of the MNET 5-2
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Figure 5-1 shows the panel of the UG01MNET. Figure 5-1 Panel of the UG01MNET MNET J11
CLK1_IN CLK0_IN FE1 FE0 MIR OMC
RUN ALM ACT
AC
T T
F1 F2
H2 MBus
CPU
H4 U23
U22 NK LI 0 TX0 RXK N LI 1 T X1 RX
H3
CPLD
COM0
AC
POWER
OFFLINE
Switching Module
MNET
Figure 5-2 shows the panel of the UG02MNET.
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5 IP and TDM Switching Units
Figure 5-2 Panel of the UG02MNET
MNET
POWER
1 2
CLK1_INCLK0_IN FE3&FE4 FE1&FE2 FE0 MIR OMC FE4 FE2
RUN ALM ACT
T AC
F2/1A
J25 POWER JTAG CPU
J22 MBUS
CPU J23
U4 CPLD
U5 CPLD
FE SWITCH
NK LI 0 TX 0 RXK N I L 1 TX 1 RX
Switching Module
COM0
T AC
F1/4A
OFFLINE
Switching Module
MNET
1. FE1&FE2 interface
2. FE3&FE4 interface
NOTE
The new indicators on panel of the UG02MNET indicate the ACT state and LINK state of FE2 and FE4 interfaces.
5.1.2 Indicators on the MNET Table 5-1 lists the meaning of the indicators on the MNET. Table 5-1 Indicator meaning of the MNET
5-4
Indicator
Identificati on
Color
Status
Meaning
Running indicator
RUN
Green
Always on
There is power supply, but the board is faulty.
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Indicator
Alarm indicator
Working indicator
Optical fiber connection state indicator
Master optical channel indicator
Hot-pluggable indicator
Identificati on
ALM
ACT
LINK
ACT
OFFLINE
Color
Red
Green
Green
Orange
Blue
Status
Meaning
Always off
There is no power supply, or the board is faulty.
Flashing (on for 1 second, off for another second)
The board runs normally in accordance with configuration.
Flashing fast (4 times per second)
Software is being loaded to the board, or the board does not run.
Always on or flashing fast
Alarms occur to the board.
Always off
No fault occurs.
Flashing
The board is in service such as in the master state.
Always off
The board is out of service such as in the slave state.
Always on
The received optical power meets the requirement.
Always off
The received optical power does not meet the requirement.
Always on or flashing
The optical channel that corresponds to the optical module is in the master state.
Always off
The optical channel that corresponds to the optical module is in the slave state.
Always on
The board can be removed.
Always off
The board cannot be removed at the moment.
The indicators of CLK0_IN and CLK1_IN interfaces on the panel of the MNET have no silkscreen. Table 5-2 lists the meaning.
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Table 5-2 Indicator meaning of clock interfaces on the MNET Indicator
Color
Status
Meaning
CLK0_IN
Orange
Always on
The MNET provides master clock for the frame where it is located.
Always off
The MNET does not provide clock for any frame, but it is in hot backup mode.
Always on
The MNET receives normal clock signals from the CLK in slot 0 through the backplane or clock cable.
Always off
The MNET receives abnormal clock signals from the CLK in slot 0 through the backplane or clock cable.
Always on
The interface on the panel of the MNET extracts clock signals from clock distribution cable normally.
Always off
The MNET extracts clock signals from the backplane.
Always on
The MNET receives normal clock signals from the CLK in slot 1 through the backplane or clock cable.
Always off
The MNET receives abnormal clock signals from the CLK in slot 1 through the backplane or clock cable.
Green
CLK1_IN
Orange
Green
5.1.3 Interfaces on the MNET Table 5-3 lists the interfaces on the MNET. Table 5-3 Interfaces on the MNET
5-6
Category
Quantit y
Physical Interface
Function
Specificatio n
COM0
1
RJ48
Used as a debug serial port
RS232 serial port
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Category
Quantit y
Physical Interface
Function
Specificatio n
OMC
1
RJ45
The OMC interface on the MNET in the main control frame is used to connect network management system and the LMT to manage and maintain the equipment.
FE network interface
The OMC interfaces on the MNETs in other frames can be configured as centralized forwarding interfaces. MIR
1
RJ45
Mirroring network interface of FE channels
FE network interface
FE0
1
RJ45
The FE0 in the central switching frame is used to cascade the extended control frame.
FE network interface
The FE0 in the main control frame is used to cascade the SIWF frame. The FE0 interfaces in other frames are not used currently.
Issue 05 (2009-01-09)
FE1
1
RJ45
Used to cascade FE channels between frames
FE network interface
FE1&FE2
1
RJ45
Used to cascade FE channels between frames
FE network interface
FE3&FE4
1
RJ45
Used to cascade FE channels between frames
FE network interface
CLK0_IN
1
RJ45
Used to receive clock signals from master/slave CLK boards
RS422
CLK1_IN
1
RJ45
Used to receive clock signals from master/slave CLK boards
RS422
Cascading packet optical interface (including RX0, RX1, TX0 and TX1)
2
LC
Used to cascade GE data Multi-mode planes Used to connect the optical module MNET, MBLU, or MNLU in other frames.
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HUAWEI UMG8900 Hardware Description
5 IP and TDM Switching Units NOTE
FE1&FE2 and FE3&FE4 interfaces are new FE cascading interfaces on the UG02MNET. They can provide four cascading interfaces by extended cascading network cables.
5.1.4 Fuses on the MNET For details on fuse positions of the MNET, see 5.1.1 Panel of the MNET. Table 5-4 lists the specifications. Table 5-4 Fuses on the MNET No.
Function
Specification
F1
–48 V power fuse
4A
F2
MBus 5 V power fuse
1A
5.1.5 Technical specifications of the MNET Table 5-5 lists the technical specifications of the MNET. Table 5-5 Technical specifications of the MNET Category
Parameter
Specification
Remarks
Optical module
Transmission distance
500 m [0.3 mi.]
UG02MNET
Mode
multi-mode
Wavelength
850 nm
Output optical power
–9.5 dBm to –2.5 dBm
Maximum receive sensitivity
–17.0 dBm
Saturation optical power
0 dBm
Optical interface speed
2.125 Gbit/s series
Power consumption
N/A
38.4 W
Heat dissipation
N/A
38.4 W
–
NOTE
The receiving power of the optical module must be larger than the maximum receive sensitivity and less than the saturation optical power. Insufficient receiving power may cause bit errors, which destabilizes the service. Excessive receiving power may cause damage to optical modules.
5-8
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5.2 MTNU This describes the functions, panels and structures, indicators, interfaces, DIP switches and jumpers, fuses, and technical specifications of the MTNU. As the time division multiplex (TDM) central switching unit of the UMG8900, the MTNU is inserted in the main control frame in single-frame or two-frame cascading application, or is inserted in the central switching frame in multi-frame cascading application. The master and slave MTNUs are inserted in back slots 6 and 9. The MTNU can be inserted only in the SSM-256 frame. The MTNU provides the following functions: l
Providing 8 K switching capacity for each interface board, and establishing and releasing TDM timeslots in conjunction with TDM service interface boards
l
Connecting with the UG01MBLU or TCLU through multi-mode optical fibers, and providing 24 K cascading capacity
5.2.1 Panel of the MTNU 5.2.2 Indicators on the MTNU 5.2.3 Interfaces on the MTNU 5.2.4 Fuses on the MTNU 5.2.5 Technical specifications of the MTNU
5.2.1 Panel of the MTNU Figure 5-3 shows the panel of the MTNU.
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Figure 5-3 Panel of the MTNU
MTNU F1
POWER
RUN ALM ACT AC AC AC
T T T
POWER F2
J4
NK LI 0 TX 0 RXK N LI 1 TX 1 RXK N LI 2 TX 2 RX
J11
Cascading Module Switching Module
J2 MBus
COM0
FPGA
CPU
OFFLINE
Bridge Module
J7 ETH
J8
MTNU
J9
5.2.2 Indicators on the MTNU Table 5-6 lists the meaning of the indicators on the MTNU. Table 5-6 Indicator meaning of the MTNU
5-10
Indicator
Identific ation
Color
Status
Meaning
Running indicator
RUN
Green
Always on
There is power supply, but the board is faulty.
Always off
There is no power supply, or the board is faulty.
Flashing (on for 1 second, off for another second)
The board runs normally in accordance with configuration.
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Indicator
Alarm indicator
Working indicator
Optical fiber connection state indicator
Master optical channel indicator
Hot-pluggable indicator
Identific ation
ALM
ACT
LINK
ACT
OFFLINE
Color
Red
Green
Green
Orange
Blue
Status
Meaning
Flashing fast (4 times per second)
Software is being loaded to the board, or the board does not run.
Always on or flashing fast
Alarms occur to the board.
Always off
No fault occurs.
Flashing
The board is in service such as in the master state.
Always off
The board is out of service such as in the slave state.
Always on
The line is in the synchronous state and the optical power meets the requirement.
Always off
The line is in the asynchronous state and the optical power does not meet the requirement.
Always on or flashing
The optical channel that corresponds to the optical module is in the master state.
Always off
The optical channel that corresponds to the optical module is in the slave state.
Always on
The board can be removed.
Always off
The board cannot be removed at the moment.
5.2.3 Interfaces on the MTNU Table 5-7 lists the interfaces on the MTNU.
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Table 5-7 Interfaces on the MTNU Category
Quantity
Physical Interface
Function
Specification
COM0
1
RJ48
Used as a debug serial port
RS232 serial port
Cascading optical interface
3
LC
Providing 24 K cascading channels
Multi-mode optical interface
5.2.4 Fuses on the MTNU For details on fuse positions of the MTNU, see 5.2.1 Panel of the MTNU. Table 5-8 lists the specifications. Table 5-8 Fuses on the MTNU No.
Function
Specification
F1
–48 V power fuse
4A
F2
MBus 5 V power fuse
1A
5.2.5 Technical specifications of the MTNU Table 5-9 lists the technical specifications of the MTNU. Table 5-9 Technical specifications of the MTNU Category
Parameter
Specification
Remarks
Optical module
Wavelength
850 nm
–
Transmission distance
500 m [0.3 mi.]
Switching capacity
256 K timeslots
Cascading capacity
24 K timeslots
Optical interface speed
960 Mbit/s
Power consumption
N/A
< 45 W
Heat dissipation
N/A
< 45 W
TDM switching network
5.3 TCLU This describes the functions, panels and structures, indicators, interfaces, DIP switches and jumpers, fuses, and technical specifications of the TCLU. 5-12
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HUAWEI UMG8900 Hardware Description
5 IP and TDM Switching Units
The TCLU is the time division multiplex (TDM) convergence and link unit of the UMG8900. Working in master and slave mode, the TCLUs are inserted in back slots 6 and 9. In two-frame cascading application, they are inserted in the service frame. In multi-frame cascading application, they are inserted in the main control frame or the service frame. The TCLUs can be inserted only in SSM-256 frames. The TCLU provides the following functions: l
Providing 8 K timeslot switching capacity for each interface board. Establishing and releasing TDM timeslots in conjunction with TDM service interface boards under the control of the MTNU
l
Connecting with the UG01MBLU or MTNU through multi-mode optical fibers, and providing 24 K timeslot cascading capacity
5.3.1 Panel of the TCLU 5.3.2 Indicators on the TCLU 5.3.3 Interfaces on the TCLU 5.3.4 Fuses on the TCLU 5.3.5 Technical specifications of the TCLU
5.3.1 Panel of the TCLU Figure 5-4 shows the panel of the TCLU. Figure 5-4 Panel of the TCLU TCLU
F1 RUN ALM ACT T AC T AC T AC
Power NK LI 0 TX 0 RXK N LI 1 TX 1 RXK N LI 2 TX 2 RX
Power
J4
Cascading Module
F2 J11
Switching Module
MBus
COM0
FPGA
CPU
OFFLINE
TCLU
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J8
Bridge Module
J7
J9
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HUAWEI UMG8900 Hardware Description
5 IP and TDM Switching Units
5.3.2 Indicators on the TCLU Table 5-10 lists the indicator meaning of the TCLU. Table 5-10 Indicator meaning of the TCLU Indicator
Identificat ion
Color
Status
Meaning
Running indicator
RUN
Green
Always on
There is power supply, but the board is faulty.
Always off
There is no power supply, or the board is faulty.
Flashing (on for 1 second, off for another second)
The board runs normally in accordance with configuration.
Flashing fast (4 times per second)
Software is being loaded to the board, or the board does not run.
Always on or flashing fast
Alarms occur to the board.
Always off
No fault occurs.
Always on or flashing
The board is in service such as in the master state.
Always off
The board is out of service such as in the slave state.
Always on
The line is in the synchronous state and the optical power meets the requirement.
Always off
The line is in the asynchronous state and the optical power does not meet the requirement.
Always on or flashing
The optical channel that corresponds to the optical module is in the master state.
Alarm indicator
Working indicator
Optical fiber connection state indicator
Master optical channel indicator
5-14
ALM
ACT
LINK
ACT
Red
Green
Green
Orange
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5 IP and TDM Switching Units
Indicator
Hot-pluggable indicator
Identificat ion
OFFLINE
Color
Blue
Status
Meaning
Always off
The optical channel that corresponds to the optical module is in the slave state.
Always on
The board can be removed.
Always off
The board cannot be removed at the moment.
5.3.3 Interfaces on the TCLU Table 5-11 lists the interfaces on the TCLU. Table 5-11 Interfaces on the TCLU Category
Quantity
Physical Interface
Function
Specification
COM0
1
RJ48
Used as a debug serial port
RS232 serial port
Cascading optical interface
3
LC
Providing 24 K cascading channels
Multi-mode optical interface
5.3.4 Fuses on the TCLU For details on fuse positions of the TCLU, see 5.3.1 Panel of the TCLU. Table 5-12 lists the specifications. Table 5-12 Fuses on the TCLU No.
Function
Specification
F1
–48 V power fuse
4A
F2
MBus 5 V power fuse
1A
5.3.5 Technical specifications of the TCLU Table 5-13 lists the technical specifications of the TCLU.
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HUAWEI UMG8900 Hardware Description
5 IP and TDM Switching Units
Table 5-13 Technical specifications of the TCLU Category
Parameter
Specification
Remarks
Optical module
Wavelength
850 nm
–
Transmission distance
500 m [0.3 mi.]
Switching capacity
256 K timeslots
Cascading capacity
24 K timeslots
Optical interface speed
960 Mbit/s
Power consumption
N/A
< 45 W
Heat dissipation
N/A
< 45 W
TDM switching network
5.4 MTNB This describes the functions, panels and structures, indicators, interfaces, DIP switches and jumpers, fuses, and technical specifications of the MTNB. As the TDM central switching unit of the UMG8900, the master and slave MTNBs are inserted in back slots 6 and 9 in the main control frame, central switching frame or service frame. The MTNB can be inserted only in SSM-256 frames. The MTNB provides the following functions: l
Providing 8 K or 2 K or 1 K switching capacity for each interface board, establishing and releasing TDM timeslots in conjunction with TDM service interface boards
l
Connecting with the MTNB in other frames directly or through the UG02MBLU with multi-mode optical fibers, and providing 32 K timeslot cascading capacity
l
Managing and maintaining the boards through dedicated maintenance bus (MBus) module; reporting the status and version of the boards to the main control board of the same frame; communicating with the main control board of the frame through the FE interface
5.4.1 Panel of the MTNB 5.4.2 Indicators on the MTNB 5.4.3 Interfaces on the MTNB 5.4.4 Fuses on the MTNB 5.4.5 Technical specifications of the MTNB
5.4.1 Panel of the MTNB Figure 5-5 shows the panel of the MTNB.
5-16
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HUAWEI UMG8900 Hardware Description
5 IP and TDM Switching Units
Figure 5-5 Panel of the MTNB
MTNB F1
POWER
RUN ALM ACT AC
T
AC
AC
AC
T
T
T
POWER F2
J4
NK LI 0 RX 0 TX NK I L 1 RX1 TX NK LI X 2 R2 TX NK LI 3 RX3 TX
J11
Cascading Module Switching Module
MBus
COM0
FPGA
CPU
OFFLINE
Bridge Module
J7 ETH
J8
MTNB
J9
5.4.2 Indicators on the MTNB Table 5-14 lists the meaning of the indicators on the MTNB. Table 5-14 Indicator meaning of the MTNB
Issue 05 (2009-01-09)
Indicator
Identificat ion
Color
Status
Meaning
Running indicator
RUN
Green
Always on
There is power supply, but the board is faulty.
Always off
There is no power supply, or the board is faulty.
Flashing (on for 1 second, off for another second)
The board runs normally in accordance with configuration.
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HUAWEI UMG8900 Hardware Description
5 IP and TDM Switching Units
Indicator
Alarm indicator
Working indicator
Optical fiber connection state indicator
Master optical channel indicator
Hot-pluggable indicator
Identificat ion
ALM
ACT
LINK
ACT
OFFLINE
Color
Red
Green
Green
Orange
Blue
Status
Meaning
Flashing fast (4 times per second)
Software is being loaded to the board, or the board does not run.
Always on or flashing fast
Alarms occur to the board.
Always off
No fault occurs.
Always on or flashing
The board is in service such as in the master state.
Always off
The board is out of service such as in the slave state.
Always on
The line is in the synchronous state and the optical power meets the requirement.
Always off
The line is in the asynchronous state and the optical power does not meet the requirement.
Always on or flashing
The optical channel that corresponds to the optical module is in the master state.
Always off
The optical channel that corresponds to the optical module is in the slave state.
Always on
The board can be removed.
Always off
The board cannot be removed at the moment.
5.4.3 Interfaces on the MTNB Table 5-15 lists the interfaces on the MTNB.
5-18
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5 IP and TDM Switching Units
Table 5-15 Interfaces on the MTNB Category
Quantity
Physical Interface
Function
Specification
COM0
1
RJ48
Used as a debug serial port
RS232 serial port
Cascading optical interface
4
LC
Providing 32 K cascading channels
Multi-mode optical interface
5.4.4 Fuses on the MTNB For details on fuse positions of the MTNB, see 5.4.1 Panel of the MTNB. Table 5-16 lists the specifications. Table 5-16 Fuses on the MTNB No.
Function
Specification
F1
–48 V power fuse
4A
F2
MBus 5 V power fuse
1A
5.4.5 Technical specifications of the MTNB Table 5-17 lists the technical specifications of the MTNB. Table 5-17 Technical specifications of the MTNB Category
Parameter
Specification
Remarks
Optical module
Transmission distance
500 m [0.3 mi.]
–
Mode
multi-mode
Wavelength
850 nm
Output optical power
–9.5 dBm to –2.5 dBm
Maximum receive sensitivity
–17.0 dBm
Saturation optical power
0 dBm
Optical interface speed
2.125 Gbit/s series
Switching capacity
256 K timeslots
Cascading capacity
32 K timeslots
Optical interface speed
960 Mbit/s
TDM switching network
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HUAWEI UMG8900 Hardware Description
5 IP and TDM Switching Units
Category
Parameter
Specification
Power consumption
N/A
49 W
Heat dissipation
N/A
49 W
Remarks
NOTE
The receiving power of the optical module must be larger than the maximum receive sensitivity and less than the saturation optical power. Insufficient receiving power may cause bit errors, which destabilizes the service. Excessive receiving power may cause damage to optical modules.
5.5 MTNC This describes the functions, panels and structures, indicators, interfaces, DIP switches and jumpers, fuses, and technical specifications of the MTNC. The MTNC is the TDM central switching unit of the UMG8900. The master and slave MTNCs are physically inserted in back slots 7 and 9 in the main control frame and the service frame; however, they are logically configured in slots 7 and 8. Each MTNC occupies two slots and all the MTNCs occupy slots 6 to 9. The MTNC can only be used in the SSM-32 frame. The MTNC provides the following functions: l
The MTNC can manage the TDM service switching. The MTNC is the TDM service switching unit. It provides 32 K timeslot switching capability and provides 1 K or 2 K switching capacity for each interface board.The UG02MTNC provides 96 K timeslot switching capacity and provides 1 K, 2 K, or 4 K switching capacity for each TDM interface. The UG02MTNC supports the UG02MS2L and UG02MECU.
l
The UG01MTNC2 provides one TDM cascading link and the UG01MTNC5 provides two TDM cascading links. If the TS1C, TS2C, or TS4C subboard is installed on the UG02MTNC, the UG02MTNC can respectively provide one, two, or four TDM cascading links. The interfaces connect with the corresponding frames through the optical fibers. Each cascading interface provides 8 K timeslot switching capacity.
l
The MTNC is the switching center of the control plane, exchanging the message among all boards in the control plane.
l
The MTNC provides three FE cascading links, exchanging the control message between frames.
l
The MTNC provides 8 KHz stratum-3 clock through the stratum-3 clock subboard.
l
The MTNC receives 16 KHz stratum-2 clock provided by the stratum-2 clock board and generates the clock required by the system.
l
The MTNC can deliver 8 KHz clock through the cascading path between frames, delivering the system clock.
l
The MTNC provides device management function. Besides the communication with all the boards through the control plane, the MTNC can also implement board information maintenance, power-on management and exceptional situations handling through the independent MBus maintenance path.
The MTNC falls into two types: UG01MTNC and UG02MTNC. The UG02MTNC is compatible with the UG01MTNC. When the UG02MTNC and the UG01MTNC are used at the same time, 5-20
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HUAWEI UMG8900 Hardware Description
5 IP and TDM Switching Units
all the functions of the UG01MTNC can be realized. When the UG02MTNC and the UG02MTNC are used at the same time, 96 K TDM switching capacity and a maximum of 4 x 8 K TDM cascading capacity are available. Other functions are the same as those of the UG01MTNC. The silkscreen on the panel of the UG02MTNC is MTNCb. The UG01MTNC falls into two types: UG01MTNC2 and UG01MTNC5. The difference between two types is that the UG01MTNC2 provides one TDM cascading optical port and the UG01MTNC5 provides two TDM cascading optical ports. The UG02MTNC contains the UG02MTNC1, UG02MTNC2, and UG02MTNC4 and they provide one, two, and four TDM cascading ports respectively. 5.5.1 Panel of the MTNC 5.5.2 Indicators on the MTNC 5.5.3 Interfaces on the MTNC 5.5.4 Fuses on the MTNC 5.5.5 Technical specifications of the MTNC 5.5.6 MTNC Subboards
5.5.1 Panel of the MTNC Figure 5-6 shows the panel of the UG01MTNC5. Figure 5-6 Panel of the MTNC (UG01MTNC5) MTNC F1
RUN ALM ACT AC
T
T
Power F2 F3
NK LI 0 TX 0 RX K N LI 1 TX1 RX
J2
Cascading Module
FPGA
8K_IN2 FE3 FE1
MC
COM0 FE4 8K_IN1 FE2 FE0 OMC
2M_IN 2M_OUT
AC
Power
LANSW
FE Interface
LANSW
LANSW LANSW
MBUS
OFFLINE
CLK Modul
J18
J3
CPU
MTNC
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HUAWEI UMG8900 Hardware Description
5 IP and TDM Switching Units
Figure 5-7 shows the panel of the UG02MTNC4. Figure 5-7 Panel of the UG02MTNC4 MTNCb RUN ALM ACT AC AC
T
AC
T
T
Power F2
NK LI 0 TX 0 RX K N I L 1 TX1 RX K N LI 2 TX 2 RX K N LI 3 TX3 RX
F3
J2
Cascading Module
FPGA
MC
COM0 FE4 8K_IN1 FE2 FE0 OMC
2M_ 2M_IN OUT
AC
T
F1
Power
8K_IN2 FE3 FE1
LANSW
FE Interface
LANSW
LANSW LANSW
MBUS CLK Modul
OFFLINE
J18
J3
CPU
MTNCb
5.5.2 Indicators on the MTNC Table 5-18 lists the meaning of the indicators on the MTNC. Table 5-18 Indicator meaning of the MTNC
5-22
Indicator
Identificat ion
Color
Status
Meaning
Running indicator
RUN
Green
Always on
There is power supply, but the board is faulty.
Always off
There is no power supply, or the board is faulty.
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5 IP and TDM Switching Units
Indicator
Alarm indicator
Working indicator
Hot-pluggable indicator
Identificat ion
ALM
ACT
OFFLINE
Optical fiber connection state indicator
LINK
Master optical channel indicator
ACT
Color
Red
Green
Blue
Green
Orange
Status
Meaning
Flashing (on for 1 second, off for another second)
The board runs normally in accordance with configuration.
Flashing fast (4 times per second)
Software is being loaded to the board, or the board does not run.
Always on or flashing fast
Alarms occur to the board.
Always off
No fault occurs.
Flashing
The board is in service such as in the master state.
Always off
The board is out of service such as in the slave state.
Always on
The board can be removed.
Always off
The board cannot be removed at the moment.
Always on
Optical fiber connection is normal.
Always off
Optical fiber connection is abnormal.
Always on or flashing
The optical channel that corresponds to the optical module is in the master state.
Always off
The optical channel that corresponds to the optical module is in the slave state.
5.5.3 Interfaces on the MTNC Table 5-19 lists the interfaces on the MTNC.
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HUAWEI UMG8900 Hardware Description
5 IP and TDM Switching Units
Table 5-19 Interfaces on the MTNC Category
Quantity
Physical Interface
Function
Specification
COM0
1
RJ48
Used as a debug serial port
RS232 serial port
Cascading optical interface
4, 2 or 1
LC
Providing 4 x 8 K, 2 x 8 K or 1 x 8 K cascading capacity
Multi-mode
2M_OUT
1
SMB male connector
2 M BITS clock output interface
2 Mbit/s or 2 MHz
2M_IN
1
SMB male connector
2 M BITS clock output interface
2 Mbit/s or 2 MHz
OMC
1
RJ45
Providing network management interface, and serving as centralized forwarding interface
FE network interface
MC
1
RJ45
Connecting with the media gateway controller (MGC)
FE network interface
FE0
1
RJ45
IWF network interface, or cascading interface
FE network interface
FE1 to FE3
3
RJ45
FE cascading network interface
FE network interface
FE4
1
RJ45
FE debug network interface
FE network interface
8K_IN1
1
RJ45
Input interface for 8 K line synchronous master clock
RS422
8K_IN2
1
RJ45
Input interface for 8 K line synchronous slave clock
RS422
5.5.4 Fuses on the MTNC For details on fuse positions of the MTNC, see Figure 5-6. Table 5-20 lists the specifications. Table 5-20 Fuses on the MTNC
5-24
No.
Function
Specification
F1
–48 V power fuse
2A
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HUAWEI UMG8900 Hardware Description
5 IP and TDM Switching Units
No.
Function
Specification
F2
–48 V power fuse
4A
F3
MBus 5 V power fuse
1A
5.5.5 Technical specifications of the MTNC Table 5-21 lists the technical specifications of the UG01MTNC. Table 5-21 Technical specifications of the UG01MTNC Category
Parameter
Specification
Remarks
TDM switching network
Switching capacity
32 K timeslots
–
Cascading capacity
3 x 8 K timeslots
Optical interface speed
960 Mbit/s
Power consumption
N/A
38.9 W
UG01MTNC2
45.3 W
UG01MTNC5
Heat dissipation
N/A
38.9 W
UG01MTNC2
45.3 W
UG01MTNC5
Table 5-22 lists the technical specifications of the UG02MTNC. Table 5-22 Technical specifications of the UG02MTNC Category
Parameter
Specification
Remarks
TDM switching network
Switching capacity
96 K timeslots
-
Cascading capacity
4 x 8 K, 2 x 8 K, or 1 x 8 K timeslots
Optical interface speed
960 Mbit/s
N/A
65.1 W
UG02MTNC1
67.2 W
UG02MTNC2
70.9 W
UG02MTNC4
65.1 W
UG02MTNC1
67.2 W
UG02MTNC2
Power consumption
Heat dissipation
Issue 05 (2009-01-09)
N/A
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HUAWEI UMG8900 Hardware Description
5 IP and TDM Switching Units
Category
Parameter
Specification
Remarks
70.9 W
UG02MTNC4
5.5.6 MTNC Subboards UG01MTNC Subboards The TLDA subboard provides one TDM cascading channel for the UG01MTNC2. The TLDB subboard provides two TDM cascading channels for the UG01MTNC5. The cascading capacity for each channel is 8 K timeslots. The interfaces are connected with the corresponding frames through optical fibers. Table 5-23 lists the indicator meaning of the TLDA/TLDB subboards. Table 5-23 Indicator meaning of the TLDA/TLDB Indicator
Identific ation
Color
Status
Meaning
Working indicator
ACT
Orange
Always on or flashing
The optical interface is in the master state.
Always off
The optical interface is in the slave state.
Always on
Connection established
Always off
Connection not established
Optical fiber connection state indicator
LINK
Green
Table 5-24 lists the technical specifications of the TLDA/TLDB subboards. Table 5-24 Technical specifications of the TLDA/TLDB subboards Category
Parameter
Specification
Remarks
Optical module
Physical type
LC
–
Wavelength
850 nm
–
Output optical power
–9.5 dBm to –4.0 dBm
–
Maximum receive sensitivity
–17.0 dBm
–
Transmission distance
550 m [0.3 mi.]
50 um optical fiber
275 m [0.2 mi.]
62.5 um optical fiber
N/A
6.4 W
–
Power consumption 5-26
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5 IP and TDM Switching Units
Category
Parameter
Specification
Heat dissipation
N/A
6.4 W
Remarks
UG02MTNC Subboards The UG02MTNC provides a maximum of 4 x 8 K time division multiplex (TDM) cascading capability. The TS1C subboard provides 1 x 8 K TDM cascading capability. The TS2C subboard provides 2 x 8 K TDM cascading capability. The TS4C subboard provides 4 x 8 K TDM cascading capability. The meaning of the indicators of the TS1C/TS2C/TS4C subboards is the same as that of the TLDA/TLDB subboards. Refer to Table 5-23. The technical specifications of the optical interfaces of the TS1C/TS2C/TS4C subboards are the same as those of the TLDA/TLDB subboards. Refer to Table 5-24. Table 5-25 lists the power consumption of the TS1C/TS2C/TS4C subboards. Table 5-25 Power consumption of the TS1C/TS2C/TS4C subboards
Issue 05 (2009-01-09)
Subboard
Power Consumption
Heat Dissipation
TS1C
22.9 W
22.9 W
TS2C
24.3 W
24.3 W
TS4C
27 W
27 W
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HUAWEI UMG8900 Hardware Description
6 Resource and Management Units
6
Resource and Management Units
About This Chapter The resource and management units consist of MCMF, MCMB, and MPPB. 6.1 MCMF 6.2 MCMB 6.3 SCMU This describes the functions, panels and structures, indicators, interfaces, DIP switches and jumpers, fuses, and technical specifications of the SCMU. 6.4 MPPB This describes the functions, panels and structures, indicators, interfaces, DIP switches and jumpers, fuses, and technical specifications of the MPPB.
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HUAWEI UMG8900 Hardware Description
6 Resource and Management Units
6.1 MCMF As the connection maintenance unit, the master and slave MCMFs are inserted in front slots 0 to 5 and slots 10 to 15 in the main control frame, service frame or extended control frame. The boards in slots 0 and 1, 2 and 3, 4 and 5, 10 and 11, 12 and 13, and 14 and 15 are in master and slave mode. The MCMF can be inserted in both SSM-256 frames and SSM-32 frames. The MCMF provides the following functions: The MCMF works with packet service boards, TDM service boards and service resource boards to implement service bearer conversion and service stream formats conversion. It returns the result to the media gateway controller (MGC) in the form of H.248 message. 6.1.1 Panel of the MCMF 6.1.2 Indicators on the MCMF 6.1.3 Interfaces on the MCMF 6.1.4 Fuses on the MCMF 6.1.5 Technical specifications of the MCMF l
6.1.1 Panel of the MCMF Figure 6-1 shows the panel of the MCMF. Figure 6-1 Panel of the MCMF MCMF
F61 J5 F15
POWER
MBUS
RUN ALM ACT
CPU
2
6-2
10
1 2
9 10
1
9
J8 J9
Bridge Unit
U2
U3
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COM0
RESET
OFFLINE
MCMF
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6 Resource and Management Units
The RESET button on the front panel is used to reset the board.
6.1.2 Indicators on the MCMF Table 6-1 lists the meaning of the indicators on the MCMF. Table 6-1 Indicator meaning of the MCMF Indicator
Identificat ion
Color
Status
Meaning
Running indicator
RUN
Green
Always on
There is power supply, but the board is faulty.
Always off
There is no power supply, or the board is faulty.
Flashing (on for 1 second, off for another second)
The board runs normally in accordance with configuration.
Flashing fast (4 times per second)
Software is being loaded to the board, or the board does not run.
Always on or flashing fast
Alarms occur to the board.
Always off
No fault occurs.
Flashing
The board is in service such as in the master state.
Always off
The board is out of service such as in the slave state.
Always on
The board can be removed.
Always off
The board cannot be removed at the moment.
Alarm indicator
Working indicator
Hot-pluggable indicator
ALM
ACT
OFFLINE
Red
Green
Blue
6.1.3 Interfaces on the MCMF Table 6-2 lists the interfaces on the MCMF.
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HUAWEI UMG8900 Hardware Description
6 Resource and Management Units
Table 6-2 Interfaces on the MCMF Category
Quantity
Physical Interface
Function
Specification
COM0
1
RJ48
Used as a debug serial port
RS232 serial port
6.1.4 Fuses on the MCMF For details on fuse positions of the MCMF, see 6.1.1 Panel of the MCMF. Table 6-3 lists the specifications. Table 6-3 Fuses on the MCMF No.
Function
Specification
F61
–48 V power fuse
4A
F15
MBus 5 V power fuse
1A
6.1.5 Technical specifications of the MCMF Table 6-4 lists the technical specifications of the MCMF. Table 6-4 Technical specifications of the MCMF Category
Parameter
Specification
Remarks
Power consumption
N/A
14.8 W
–
Heat dissipation
N/A
14.8 W
Service processing capability
Number of the H. 248 links
Up to 64 links on each board and 128 links in the system
-
6.2 MCMB As the connection maintenance unit, the master and slave MCMBs are inserted in back slots 2 to 5 and slots 10 to 15 in the main control frame, and back slots 0 to 5 and slots 10 to 15 in the service frame or extended control frame. The boards in slots 0 and 1, 2 and 3, 4 and 5, 10 and 11, 12 and 13, and 14 and 15 are in master and slave mode. The MCMB can be inserted in both SSM-256 frames and SSM-32 frames. The MCMB provides the following functions:
6-4
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6 Resource and Management Units
The MCMF works with packet service boards, TDM service boards and service resource boards to implement service bearer conversion and service stream formats conversion. It returns the result to the media gateway controller (MGC) in the form of H.248 message.
l
6.2.1 Panel of the MCMB 6.2.2 Indicators on the MCMB 6.2.3 Interfaces on the MCMB 6.2.4 Fuses on the MCMB 6.2.5 Technical specifications of the MCMB
6.2.1 Panel of the MCMB Figure 6-2 shows the panel of the MCMB. Figure 6-2 Panel of the MCMB MCMB
F61 RUN ALM ACT
POWER MBUS J10 F15
COM0
RESET
CPU
OFFLINE
MCMB
The RESET button on the front panel is used to reset the board.
6.2.2 Indicators on the MCMB Table 6-5 lists the meaning of the indicators on the MCMB. Issue 05 (2009-01-09)
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Table 6-5 Indicator meaning of the MCMB Indicator
Identificat ion
Color
Status
Meaning
Running indicator
RUN
Green
Always on
There is power supply, but the board is faulty.
Always off
There is no power supply, or the board is faulty.
Flashing (on for 1 second, off for another second)
The board runs normally in accordance with configuration.
Flashing fast (4 times per second)
Software is being loaded to the board, or the board does not run.
Always on or flashing fast
Alarms occur to the board.
Always off
No fault occurs.
Always on or flashing
The board is in service such as in the master state.
Always off
The board is out of service such as in the slave state.
Always on
The board can be removed.
Always off
The board cannot be removed at the moment.
Alarm indicator
Working indicator
Hot-pluggable indicator
ALM
ACT
OFFLINE
Red
Green
Blue
6.2.3 Interfaces on the MCMB Table 6-6 lists the interfaces on the MCMB. Table 6-6 Interfaces on the MCMB Category
Quantity
Physical Interface
Function
Specification
COM0
1
RJ48
Used as a debug serial port
RS232 serial port
6.2.4 Fuses on the MCMB For details on fuse positions of the MCMB, see 6.2.1 Panel of the MCMB. Table 6-7 lists the specifications. 6-6
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6 Resource and Management Units
Table 6-7 Fuses on the MCMB No.
Function
Specification
F61
–48 V power fuse
4A
F15
MBus 5 V power fuse
1A
6.2.5 Technical specifications of the MCMB Table 6-8 lists the technical specifications of the MCMB. Table 6-8 Technical specifications of the MCMB Category
Parameter
Specification
Remarks
Power consumption
N/A
15.7 W
–
Heat dissipation
N/A
15.7 W
Service processing capability
Number of the H. 248 links
Up to 64 links on each board and 128 links in the system
–
6.3 SCMU This describes the functions, panels and structures, indicators, interfaces, DIP switches and jumpers, fuses, and technical specifications of the SCMU. The SCMU is the subboard of the connection and management unit of the UMG8900. The SCMU is inserted in the subboard slot of the UG02MOMB or the UG02MMPB. If the board type is set to PPU, the SCMU works in load-sharing mode. If the board type is set to CMU, subboard 0 on the OMB or MPB in slot 7 and subboard 0 on the OMB or MPB in slot 8 work in master/slave mode; subboard 1 on the OMB or MPB in slot 7 and subboard 1 on the OMB or MPB in slot 8 work in master/slave mode. The SCMU can be used only in the SSM-32 frame. The SCMU provides the following functions: l
The SCMU interacts with the packet service processing board, TDM service processing board, service resource board of the UMG8900. In addition, the SCMU controls the service resources to convert the service bearer and service flow format and returns the processing results to the media gateway controller (MGC) in the form of the H.248 message.
l
The SCMU receives the H.248 packets. Then, the SCMU resolves the protocols of the transport layer and the network layer and processes the H.248 codecs.
CAUTION The SCMU needs to be installed on the UG02MOMB or the UG02MMPB on site. 6.3.1 Panel of the SCMU Issue 05 (2009-01-09)
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6.3.2 Indicators on the SCMU 6.3.3 Interfaces on the SCMU 6.3.4 Fuses on the SCMU 6.3.5 Technical specifications of the SCMU
6.3.1 Panel of the SCMU Figure 6-3 shows the panel of the SCMU. Figure 6-3 Panel of the SCMU
Clock
Power
RUN ALM ACT
CPU mini system COM0
HeartBeat Interface
OFFLINE
MBUS modules
6.3.2 Indicators on the SCMU Table 6-9 lists the meaning of the indicators on the SCMU. Table 6-9 Indicator meaning of the SCMU
6-8
Indicator
Identificat ion
Color
Status
Meaning
Running indicator
RUN
Green
Always on
There is power supply, but the board is faulty.
Always off
There is no power supply, or the board is faulty.
Flashing (on for 1 second, off for another second)
The board runs normally in accordance with configuration.
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Indicator
Alarm indicator
Working indicator
Hot-pluggable indicator
Identificat ion
ALM
ACT
OFFLINE
Color
Red
Green
Blue
Status
Meaning
Flashing fast (4 times per second)
Software is being loaded to the board, or the board does not run.
Always on or flashing fast
Alarms occur to the board.
Always off
No fault occurs.
Flashing
The board is in service such as in the master state.
Always off
The board is out of service such as in the slave state.
Always on
The board can be removed.
Always off
The board cannot be removed at the moment.
6.3.3 Interfaces on the SCMU Table 6-10 lists the interfaces on the SCMU. Table 6-10 Interfaces on the SCMU Category
Quantity
Physical Interface
Function
Specification
COM0
1
RJ48
Used as a debug serial port
RS232 serial port
6.3.4 Fuses on the SCMU None
6.3.5 Technical specifications of the SCMU Table 6-11 lists the technical specifications of the SCMU.
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HUAWEI UMG8900 Hardware Description
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Table 6-11 Technical specifications of the SCMU Category
Parameter
Specification
Remarks
Power consumption
N/A
16.5 W
-
Heat dissipation
N/A
16.5 W
Service processing capability
Number of the H. 248 links
Up to 64 links on each board and 128 links in the system
–
6.4 MPPB This describes the functions, panels and structures, indicators, interfaces, DIP switches and jumpers, fuses, and technical specifications of the MPPB. As the protocol processing unit of the UMG8900, the MPPBs are inserted in back slots 2 to 5 and slots 10 to 15 in the main control frame, and back slots 0 to 5 and slots 10 to 15 in the service frame or extended control frame. The MPPB can be inserted in both SSM-256 frames and SSM-32 frames. The MPPB provides the following functions: l
Receiving the H.248 protocol packet, resolving transport-layer and network-layer protocols, and implementing H.248 transcoding
l
Implementing H.248 transcoding, resolving transport-layer and network-layer protocols, and forwarding adapted messages to the media gateway controller (MGC)
6.4.1 Panel of the MPPB 6.4.2 Indicators on the MPPB 6.4.3 Interfaces on the MPPB 6.4.4 Fuses on the MPPB 6.4.5 Technical specifications of the MPPB
6.4.1 Panel of the MPPB Figure 6-4 shows the panel of the MPPB.
6-10
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6 Resource and Management Units
Figure 6-4 Panel of the MPPB MPPB F61
RUN ALM
POWER
FE0
MBUS J10 F15
COM0
RESET
CPU
OFFLINE
MPPB
The RESET button on the front panel is used to reset the board.
6.4.2 Indicators on the MPPB Table 6-12 lists the meaning of the indicators on the MPPB. Table 6-12 Indicator meaning of the MPPB
Issue 05 (2009-01-09)
Indicator
Identificat ion
Color
Status
Meaning
Running indicator
RUN
Green
Always on
There is power supply, but the board is faulty.
Always off
There is no power supply, or the board is faulty.
Flashing (on for 1 second, off for another second)
The board runs normally in accordance with configuration.
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Indicator
Alarm indicator
Hot-pluggable indicator
Identificat ion
ALM
Color
Red
OFFLINE
Blue
Status
Meaning
Flashing fast (4 times per second)
Software is being loaded to the board, or the board does not run.
Always on or flashing fast
Alarms occur to the board.
Always off
No fault occurs.
Always on
The board can be removed.
Always off
The board cannot be removed at the moment.
6.4.3 Interfaces on the MPPB Table 6-13 lists the interfaces on the MPPB. Table 6-13 Interfaces on the MPPB Category
Quantity
Physical Interface
Function
Specification
COM0
1
RJ48
Used as a debug serial port
RS232 serial port
6.4.4 Fuses on the MPPB For details on fuse positions of the MPPB, see 6.4.1 Panel of the MPPB. Table 6-14 lists the specifications. Table 6-14 Fuses on the MPPB No.
Function
Specification
F61
–48 V power fuse
4A
F15
MBus 5 V power fuse
1A
6.4.5 Technical specifications of the MPPB Table 6-15 lists the technical specifications of the MPPB.
6-12
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Table 6-15 Technical specifications of the MPPB
Issue 05 (2009-01-09)
Category
Parameter
Specification
Remarks
Power consumption
N/A
16 W
-
Heat dissipation
N/A
16 W
Service processing capability
Number of the H. 248 links
Up to 64 links on each board and 128 links in the system
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HUAWEI UMG8900 Hardware Description
7
7 Service and Protocol Processing Units
Service and Protocol Processing Units
About This Chapter The service and protocol processing units consist of MHRU, MRPU, MASU, MIOE, and MSPF. 7.1 MHRU This describes the functions, panels and structures, indicators, interfaces, DIP switches and jumpers, fuses, and technical specifications of the MHRU. 7.2 MHRD This describes the functions, panels and structures, indicators, interfaces, DIP switches and jumpers, fuses, and technical specifications of the MHRD. 7.3 MRPU This describes the functions, panels and structures, indicators, interfaces, DIP switches and jumpers, fuses, and technical specifications of the MRPU. 7.4 MASU This describes the functions, panels and structures, indicators, interfaces, DIP switches and jumpers, fuses, and technical specifications of the MASU. 7.5 MIOE This describes the functions, panels and structures, indicators, interfaces, DIP switches and jumpers, fuses, and technical specifications of the MIOE. 7.6 MSPF This describes the functions, panels and structures, indicators, interfaces, DIP switches and jumpers, fuses, and technical specifications of the MSPF.
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7 Service and Protocol Processing Units
HUAWEI UMG8900 Hardware Description
7.1 MHRU This describes the functions, panels and structures, indicators, interfaces, DIP switches and jumpers, fuses, and technical specifications of the MHRU. As the high-speed routing unit, the MHRUs are inserted in front slots 2 to 5 and slots 10 to 15 in the main control frame, and front slots 0 to 5 and slots 10 to 15 in the service frame. The corresponding back boards of the MHRU are the interface boards such as the MP1H, MP4L, and ME8T. The MHRU can be inserted in both SSM-256 frames and SSM-32 frames. The MHRU provides the following functions: l
Processing IP routes, and converging and distributing IP services
l
Monitoring and managing the states of the boards and the corresponding back boards
l
Supporting the Internet Protocols over ATM (IPoA) function. After the adaptation of the IP data packets to the ATM is completed, the ATM interface board forwards the IP data packets out
The MHRU falls into two types: the UG01MHRU and UG02MHRU. The difference between them is as follows: l
The UG01MHRU is used with UG01HPMB subboard.
l
The UG02MHRU is used with UG02HPMB subboard.
l
The UG01MHRU can be inserted only in frames 0 to 15, whereas the UG02MHRU can be inserted in any frame.
l
In appearance, the name silkscreen on the front panel of the UG02MHRU is MHRUb, while that of the UG01MHRU is MHRU.
The UG01MHRUs and UG02MHRUs both are categorized as VER A and VER C. Both version provide the same functions. The description of the UG01MHRU is not included. 7.1.1 Panel of the MHRU 7.1.2 Indicators on the MHRU 7.1.3 Interfaces on the MHRU 7.1.4 Fuses on the MHRU 7.1.5 Technical Specifications of the MHRU 7.1.6 MHRU Subboards
7.1.1 Panel of the MHRU Figure 7-1 shows the panel of the UG02MHRU.A.
7-2
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7 Service and Protocol Processing Units
Figure 7-1 Panel of the UG02MHRU.A
F1 F2
J4 J10
POWER
MHRUb
J3 RUN ALM ACT
J2 U1
MBUS
U31 EPLD
COM0
S1
CPU
OFFLINE
MHRUb
Figure 7-2 shows the panel of the UG02MHRU.C.
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HUAWEI UMG8900 Hardware Description
7 Service and Protocol Processing Units
Figure 7-2 Panel of the UG02MHRU.C
F10 F11
F12
F2
J4 J10
POWER
MHRUb
J3 RUN ALM ACT
J2 U101
MBUS
U110 U108
1002 Logic
CPLD
COM0
S1
CPU
OFFLINE
MHRUb
7.1.2 Indicators on the MHRU Table 7-1 lists the meaning of the indicators on the MHRU. Table 7-1 Indicator meaning of the MHRU
7-4
Indicator
Identificat ion
Color
Status
Meaning
Running indicator
RUN
Green
Always on
There is power supply, but the board is faulty.
Always off
There is no power supply, or the board is faulty.
Flashing (on for 1 second, off for another second)
The board runs normally in accordance with configuration.
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Indicator
Alarm indicator
Working indicator
Hot-pluggable indicator
Identificat ion
ALM
Color
Red
ACT
Green
OFFLINE
Blue
Status
Meaning
Flashing fast (4 times per second)
Software is being loaded to the board, or the board does not run.
Flashing slowly (on for 2 seconds, off for another 2 seconds)
The board is isolated.
Always on or flashing fast
Alarms occur to the board.
Always off
No fault occurs.
Always on or flashing
The board is in service such as in the master state.
Always off
The board is out of service such as in the slave state.
Always on
The board can be removed.
Always off
The board cannot be removed at the moment.
7.1.3 Interfaces on the MHRU Table 7-2 lists the interfaces on the MHRU. Table 7-2 Interface on the MHRU Category
Quantity
Physical Interface
Function
Specification
COM0
1
RJ48
Used as a debug serial port
RS232 serial port
7.1.4 Fuses on the MHRU For details on fuse positions of the UG02MHRU.A, see 7.1.1 Panel of the MHRU. Table 7-3 lists the specifications. Table 7-3 Fuses on the UG02MHRU.A
Issue 05 (2009-01-09)
No.
Function
Specification
F1
–48 V power fuse
4A
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HUAWEI UMG8900 Hardware Description
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No.
Function
Specification
F2
MBus 5 V power fuse
1A
For details on fuse positions of the UG02MHRU.C, see 7.1.1 Panel of the MHRU. Table 7-4 lists the specifications. Table 7-4 Fuses on the UG02MHRU.C No.
Function
Specification
F10
–48 V power fuse
4A
F11
–48 V power fuse
4A
F12
–48 V power fuse
4A
F2
MBus 5 V power fuse
1A
7.1.5 Technical Specifications of the MHRU Table 7-5 lists the technical specifications of the MHRU. Table 7-5 Technical specifications of the MHRU Category
Paramete r
Specification
Remarks
Time of switchover between master and slave boards
N/A
<1s
Time of hardware switchover
Power consumption
N/A
36.2 W
UG01MHRU
38 W
UG02MHRU.A
31 W
UG02MHRU.C
36.2 W
UG01MHRU
38 W
UG02MHRU
31 W
UG02MHRU.C
Heat dissipation
N/A
7.1.6 MHRU Subboards The subboard of the host process module broad (HPMB) is the main processor module subboard. The MHRU subboard processes the upper-layer protocol, initiates the backplane and implements the configuration and management through the HPMB subboard. The MHRU falls into two types: the UG01HPMB and UG02HPMB. They are similar in function. The UG01HPMB is used with UG01MHRU, whereas the UG02HPMB is used with UG02MHRU. 7-6
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The technical specifications of the HPMB correspond to the MHRU, see 7.1.5 Technical Specifications of the MHRU.
7.2 MHRD This describes the functions, panels and structures, indicators, interfaces, DIP switches and jumpers, fuses, and technical specifications of the MHRD. The MHRD is the high-speed routing board and can be used in the SSM-32 frame and the SSM-256 frame. The MHRD can be inserted in the universal back slot. When the MHRD is inserted in the SSM-256 frame, the MHRD needs to work with the UG02MNET board. The MHRD provides the following functions: l
The MHRD processes the IP routes, and it converges, and distributes the IP services.
l
The MHRD provides the service access function if the D8FT or D1GO interface subboard is inserted.
The MHRD falls into two types: UG01MHRD1 and UG01MHRD2. l
The D8FT subboard is inserted in the UG01MHRD1, which provides eight fast Ethernet (FE) interfaces.
l
The D1GO subboard is inserted in the UG01MHRD2, which provides one optical gigabit Ethernet (GE) interface or one electrical GE interface.
CAUTION l
The front and back boards in pairs in the SSM-32 frame cannot use the GE bus of the backplane at the same time. The board opposite to the MHRD cannot be the boards such as the MVPD that uses the GE bus.
l
In the SSM-256 frame, the MHRD must be used with the UG02NET rather than the UG01NET.
7.2.1 Panel of the MHRD 7.2.2 Indicators on the MHRD 7.2.3 Interfaces on the MHRD 7.2.4 Fuses on the MHRD 7.2.5 Technical specifications of the MHRD 7.2.6 MHRD Subboards
7.2.1 Panel of the MHRD Figure 7-3 shows the panel of the MHRD.
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Figure 7-3 Panel of the MHRD F1 F2 F4
MHRD
F3
MBUS
RUN ALM ACT
Interfaces of the subboard
COM0
Subboard
OFFLINE
CPU
MHRD
7.2.2 Indicators on the MHRD Table 7-6 lists the meaning of the indicators on the MHRD. Table 7-6 Indicator meaning of the MHRD
7-8
Indicator
Identificat ion
Color
Status
Meaning
Running indicator
RUN
Green
Always on
There is power supply, but the board is faulty.
Always off
There is no power supply, or the board is faulty.
Flashing (on for 1 second, off for another second)
The board runs normally in accordance with configuration.
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Indicator
Alarm indicator
Working indicator
Hot-pluggable indicator
Identificat ion
ALM
Color
Red
ACT
Green
OFFLINE
Blue
Status
Meaning
Flashing fast (4 times per second)
Software is being loaded to the board, or the board does not run.
Flashing slowly (on for 2 seconds, off for another 2 seconds)
The board is isolated.
Always on or flashing fast
Alarms occur to the board.
Always off
No fault occurs.
Flashing
The board is in service such as in the master state.
Always off
The board is out of service such as in the slave state.
Always on
The board can be removed.
Always off
The board cannot be removed at the moment.
7.2.3 Interfaces on the MHRD Table 7-7 lists the interfaces on the MHRD. Table 7-7 Interfaces on the MHRD Category
Quantity
Physical Interface
Function
Specification
COM0
1
RJ48
Used as a debug serial port
RS232 serial port
7.2.4 Fuses on the MHRD For details on fuse positions of the MHRD, see 7.2.1 Panel of the MHRD. Table 7-8 lists the specifications. Table 7-8 Fuses on the MHRD
Issue 05 (2009-01-09)
No.
Function
Specification
F1
–48 V power fuse
4A
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No.
Function
Specification
F2
–48 V power fuse
4A
F3
–48 V power fuse
4A
F3
MBus 5 V power fuse
1A
7.2.5 Technical specifications of the MHRD Table 7-9 and Table 7-10 list the technical specifications of the MHRD. Table 7-9 Technical specifications of the MHRD Category
Parameter
Specification
Remarks
Time of switchover between master and slave boards
N/A
<1s
Time of hardware switchover
Power consumption
N/A
45 W
UG01MHRD1
41.5 W
UG01MHRD2
45 W
UG01MHRD1
41.5 W
UG01MHRD2
Heat dissipation
N/A
Table 7-10 Service processing capability of the MHRD Performance Item
Requirement
Remarks
Interface communication rate of the packet service
1.25 Gbit/s
Service channel of the GE switching net of the service plane
Interface communication rate of the management plane
125 Mbit/s
Management channel of the FE switching net of the control plane
Communication rate of the CAN bus
1 Mbit/s
Out-band maintenance channel of the control plane
7.2.6 MHRD Subboards D1GO Subboards The D1GO subboard provides one optical gigabit Ethernet (GE) interface or one electrical GE interface for the MHRD. The D1GO subboard is equipped with the pluggable interface module and provides one GE interface or electrical interface in conformity with the IEEE8002.3z standard. 7-10
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If the D1GO subboards are inserted in two MHRDs working in master/slave mode, by default, the D1GO subboards work in load-sharing mode. That is, one MHRD can manage two D1GO subboards at the same time. The interface of the D1GO subboard supports the non-APS 1+1 backup mode. Table 7-11 lists the meaning of the indicators on the D1GO. Table 7-11 Indicator meaning of the D1GO Indicator
Identifica tion
Color
Status
Meaning
Working indicator
ACT
Yellow
Flashing
Data receiving and transmitting on the optical interface
Optical fiber connection state indicator
LINK
Green
Always on
Connection established
Always off
Connection not established
Table 7-12 lists the technical specifications of the D1GO. Table 7-12 Technical specifications of the D1GO
Issue 05 (2009-01-09)
Category
Parameter
Specification
Remarks
Optical module
Physical type
LC
–
Mode
Multi-mode
Transmission distance
0.5 km
Wavelength
850 nm
Output optical power
–9.5 dBm to –2.5 dBm
Maximum receive sensitivity
–17.0 dBm
Saturation optical power
0 dBm
Specification
IEEE802.3 and IEEE802.3z
Electrical module
Physical type
RJ45 electrical interface
Transmission distance
100 m [0.06 mi.]
Power consumption
N/A
8.5 W
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–
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7 Service and Protocol Processing Units
Category
Parameter
Specification
Heat dissipation
N/A
8.5 W
Remarks
D8FT Subboards The D8FT subboard provides eight fast Ethernet (FE) interfaces for the MHRD. If the D8FT subboards are inserted in the MHRDs working in master/slave mode, by default, the D8FT subboards work in load-sharing mode. That is, one MHRD can manage two D8FT subboards at the same time. The interface of the D8FT subboard supports non-APS 1+1 backup mode. Table 7-13 lists the meaning of the indicators on the D8FT. Table 7-13 Indicator meaning of the D8FT Indicator
Identifica tion
Color
Status
Meaning
Network interface speed indicator
-
Green
Always on
The interface works at the rate of 100 Mbit/s.
Always off
The interface works at the rate of 10 Mbit/s.
Network interface connection indicator
-
Always on
The link is through.
Always off
The link is not through.
Flashing
Some data is being received or transmitted through the link.
Yellow
Table 7-14 lists the technical specifications of the D8FT. Table 7-14 Technical specifications of the D8FT
7-12
Category
Parameter
Specification
Remarks
Interface
Physical type
RJ45
–
Quantity
8
Specification
IEEE802.3 and IEEE802.3u
Power consumption
N/A
8.5 W
Heat dissipation
N/A
8.5 W
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7 Service and Protocol Processing Units
7.3 MRPU This describes the functions, panels and structures, indicators, interfaces, DIP switches and jumpers, fuses, and technical specifications of the MRPU.
CAUTION The MRPU can be configured only in frames 0 to 15. As the high-speed routing unit, the MRPU can be inserted in front slots 2 to 5 and slots 10 to 15 in the main control frame, and front slots 0 to 5 and slots 10 to 15 in the service frame. The corresponding back boards of the MRPU include the IP interface boards such as the MG1O, MP1H, MP4L and ME8T. The MRPU can be inserted in both SSM-256 frames and SSM-32 frames. The MRPU provides the following functions: l
Processing IP routes, and converging and distributing IP services
l
Monitoring and managing the states of the boards and the corresponding back boards
l
Resolving the RTP/Real-time Transport Control Protocol (RTCP) protocols
l
Realizing Jitter-buffering of the RTP service
l
Supporting 1+1 backup function
7.3.1 Panel of the MRPU 7.3.2 Indicators on the MRPU 7.3.3 Interfaces on the MRPU 7.3.4 Fuses on the MRPU 7.3.5 Technical Specifications of the MRPU
7.3.1 Panel of the MRPU Figure 7-4 shows the panel of the MRPU.
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HUAWEI UMG8900 Hardware Description
7 Service and Protocol Processing Units
Figure 7-4 Panel of the MRPU
F1 F2
J10
POWER
MRPU
J4 J3
RUN ALM ACT
J2 U1
MBUS
U31 RESET
EPLD
COM0
S1
CPU
OFFLINE
MRPU
7.3.2 Indicators on the MRPU Table 7-15 lists the indicator meaning of the MRPU. Table 7-15 Indicator meaning of the MRPU
7-14
Indicator
Identificat ion
Color
Status
Meaning
Running indicator
RUN
Green
Always on
There is power supply, but the board is faulty.
Always off
There is no power supply, or the board is faulty.
Flashing (on for 1 second, off for another second)
The board runs normally in accordance with configuration.
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HUAWEI UMG8900 Hardware Description
7 Service and Protocol Processing Units
Indicator
Alarm indicator
Working indicator
Hot-pluggable indicator
Identificat ion
ALM
ACT
OFFLINE
Color
Red
Green
Blue
Status
Meaning
Flashing fast (4 times per second)
Software is being loaded to the board, or the board does not run.
Flashing slowly (on for 2 seconds, off for another 2 seconds)
The board is isolated.
Always on or flashing fast
Alarms occur to the board.
Always off
No fault occurs.
Always on or flashing
The board is in service such as in the master state.
Always off
The board is out of service such as in the slave state.
Always on
The board can be removed.
Always off
The board cannot be removed at the moment.
7.3.3 Interfaces on the MRPU Table 7-16 lists the interfaces on the MRPU. Table 7-16 Interfaces on the MRPU Category
Quantity
Physical Interface
Function
Specification
COM0
1
RJ48
Used as a debug serial port
RS232 serial port
7.3.4 Fuses on the MRPU For details on fuse positions of the MRPU, see 7.3.1 Panel of the MRPU. Table 7-17 lists the specifications. Table 7-17 Fuses on the MRPU
Issue 05 (2009-01-09)
No.
Function
Specification
F1
–48 V power fuse
4A
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HUAWEI UMG8900 Hardware Description
7 Service and Protocol Processing Units
No.
Function
Specification
F2
MBus 5 V power fuse
1A
7.3.5 Technical Specifications of the MRPU Table 7-18 lists the technical specifications of the MRPU. Table 7-18 Technical specifications of the MRPU Category
Paramete r
Specification
Remarks
Time of switchover between master and slave boards
N/A
<1s
Time of hardware switchover
Power consumption
N/A
38 W
–
Heat dissipation
N/A
38 W
7.4 MASU This describes the functions, panels and structures, indicators, interfaces, DIP switches and jumpers, fuses, and technical specifications of the MASU. As the ATM AAL2/AAL5 SAR processing unit, the MASU are inserted in front slots 2 to 5, 10 to 15 in the main control frame and front slots 0 to 5, 10 to 15 in the service frame. The corresponding back boards of the MASU can be the interface boards such as the MA4L, MEAC and MTAC. The MASU can be inserted in both SSM-256 frames and SSM-32 frames. The MASU provides the following functions: l
Processing ATM services
l
Providing standard AAL2 segmentation and reassembly (SAR), and service specific segmentation and reassembly (SSSAR) functions, and supporting the stream shaping of real time variable bit rate (rt-VBR) and user parameter control (UPC)
l
Providing the AAL5 SAR function
l
Supporting direct forwarding over PVC, OAM cell extraction and luUP interface processing functions
l
Monitoring and managing the states of the boards and the corresponding back boards
l
Supporting 1+1 backup function
The MASU falls into two types: the UG01MASU and UG02MASU. The difference between them is as follows:
7-16
l
The UG01MASU is used with UG01HPMB.
l
The UG02MASU is used with UG02HPMB.
l
The UG01ASU can be inserted only in frames 0 to 15, whereas the UG02MASU can be inserted in any frame. Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd.
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HUAWEI UMG8900 Hardware Description l
7 Service and Protocol Processing Units
In appearance, the name silkscreen of the front panel of the UG02MASU is MASUb, and that of the UG01MASU is MASU.
The UG01MASU and UG02MASU are both categorized as VER A and VER C. Both version provide the same functions. The description of the UG01MASU is not included. 7.4.1 Panel of the MASU 7.4.2 Indicators on the MASU 7.4.3 Interfaces on the MASU 7.4.4 Fuses on the MASU 7.4.5 Technical Specifications of the MASU 7.4.6 MASU Subboard
7.4.1 Panel of the MASU Figure 7-5 shows the panel of the UG02MASU.A. Figure 7-5 Panel of the UG02MASU.A
F1 F2
J10
POWER
MASUb
J4 J3
RUN ALM ACT
J2 U1
MBUS
U31
EPLD
COM0
S1
CPU
OFFLINE
MASUb
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HUAWEI UMG8900 Hardware Description
7 Service and Protocol Processing Units
Figure 7-6 shows the panel of the UG02MASU.C. Figure 7-6 Panel of the UG02MASU.C
F10 F11
F12
F2
J10
POWER
MASUb
J4 J3
RUN ALM ACT
J2 U101
MBUS U110 U108
1002 Logic
CPLD
COM0
S1
CPU
OFFLINE
MASUb
7.4.2 Indicators on the MASU Table 7-19 lists the indicator meaning of the MASU. Table 7-19 Indicator meaning of the MASU
7-18
Indicator
Identificat ion
Color
Status
Meaning
Running indicator
RUN
Green
Always on
There is power supply, but the board is faulty.
Always off
There is no power supply, or the board is faulty.
Flashing (on for 1 second, off for another second)
The board runs normally in accordance with configuration.
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HUAWEI UMG8900 Hardware Description
7 Service and Protocol Processing Units
Indicator
Alarm indicator
Working indicator
Hot-pluggable indicator
Identificat ion
ALM
Color
Red
ACT
Green
OFFLINE
Blue
Status
Meaning
Flashing fast (4 times per second)
Software is being loaded to the board, or the board does not run.
Flashing slowly (on for 2 seconds, off for another 2 seconds)
The board is isolated.
Always on or flashing fast
Alarms occur to the board.
Always off
No fault occurs.
Flashing
The board is in service such as in the master state.
Always off
The board is out of service such as in the slave state.
Always on
The board can be removed.
Always off
The board cannot be removed at the moment.
7.4.3 Interfaces on the MASU Table 7-20 lists the interfaces on the MASU. Table 7-20 Interfaces on the MASU Category
Quantity
Physical Interface
Function
Specification
COM0
1
RJ48
Used as a debug serial port
RS232 serial port
7.4.4 Fuses on the MASU For details on fuse positions of the UG02MASU.A, see 7.4.1 Panel of the MASU. Table 7-21 lists the specifications. Table 7-21 Fuses on the UG02MASU.A
Issue 05 (2009-01-09)
No.
Function
Specification
F1
–48 V power fuse
4A
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HUAWEI UMG8900 Hardware Description
7 Service and Protocol Processing Units
No.
Function
Specification
F2
MBus 5 V power fuse
1A
For details on fuse positions of the UG02MASU.C, see 7.4.1 Panel of the MASU. Table 7-22 lists the specifications. Table 7-22 Fuses on the UG02MASU.C No.
Function
Specification
F10
–48 V power fuse
4A
F11
–48 V power fuse
4A
F12
–48 V power fuse
4A
F2
MBus 5 V power fuse
1A
7.4.5 Technical Specifications of the MASU Table 7-23 lists the technical specifications of the MASU. Table 7-23 Technical specifications of the MASU Category
Parameter
Specification
Remarks
Power consumption
N/A
36.2 W
UG01MASU
38 W
UG02MASU.A
31 W
UG02MASU.C
36.2 W
UG01MASU
38 W
UG02MASU
31 W
UG02MASU.C
Heat dissipation
N/A
7.4.6 MASU Subboard The subboard of the host process module broad (HPMB) is the main processor module subboard. The MASU subboard processes the upper-layer protocol, initiates the backplane and implements the configuration and management through the HPMB subboard. The MHRU falls into two types: the UG01HPMB and UG02HPMB. They are similar in function. The UG01HPMB is used with UG01MASU, whereas the UG02HPMB is used with UG02MASU. The technical specifications of the HPMB correspond to the MASU, see 7.4.5 Technical Specifications of the MASU. 7-20
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HUAWEI UMG8900 Hardware Description
7 Service and Protocol Processing Units
7.5 MIOE This describes the functions, panels and structures, indicators, interfaces, DIP switches and jumpers, fuses, and technical specifications of the MIOE. As the high-speed routing unit, the MIOE can be inserted in front slots 0 to 6 and slots 9 to 15 in the main control frame or the service frame when SSM-256 frame is used, and can be inserted in front slots 0 to 5 and slots 10 to 15 in the main control frame or service frame when SSM-32 frame is used. The MIOE needs to work with the E32 board, but the opposite board is not mandatory. The MIOE can be inserted in both SSM-256 frames and SSM-32 frames. When the MIOE is inserted in the SSM-256 frame, the MTNB must be inserted, but the MTNU cannot be inserted in the SSM-256 frame. The MIOE provides the following functions: l
Processing IP routes, and converging and distributing IP services.
l
Monitoring and managing the board state.
l
Supporting the Internet Protocols over ATM (IPoA) function. After the adaptation of the IP data packets to the E1 is completed, the TDM interface board forwards the IP data packets out.
7.5.1 Panel of the MIOE 7.5.2 Indicators on the MIOE 7.5.3 Interfaces on the MIOE 7.5.4 Fuses on the MIOE 7.5.5 Technical Specifications of the MIOE
7.5.1 Panel of the MIOE Figure 7-7 shows the panel of the MIOE.
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HUAWEI UMG8900 Hardware Description
7 Service and Protocol Processing Units
Figure 7-7 Panel of the MIOE
MIOE -48V
J6
F2/1A
CPU processor
Power module +3.3V
1208/CPLDS TC/EC
RUN ALM ACT
J9 J8
FE0
F1/4A +5V
Logic chip
S1 TC subboard-A
MBUS
BOOTROM / J10 CPLD
COM0
TC subboard-B
TC subboard-C/EC subboard OFFLINE
MIOE
NOTE
The subboard slot is reserved on the MIOE. At present, the configuration application with the subboard is unavailable. See the dotted lines in Figure 7-7.
7.5.2 Indicators on the MIOE Table 7-24 lists the meaning of the indicators on the MIOE. Table 7-24 Indicator meaning of the MIOE
7-22
Indicator
Identificat ion
Color
Status
Meaning
Running indicator
RUN
Green
Always on
There is power supply, but the board is faulty.
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HUAWEI UMG8900 Hardware Description
7 Service and Protocol Processing Units
Indicator
Alarm indicator
Working indicator
Hot-pluggable indicator
Identificat ion
ALM
ACT
OFFLINE
Color
Red
Green
Blue
Status
Meaning
Always off
There is no power supply, or the board is faulty.
Flashing (on for 1 second, off for another second)
The board runs normally in accordance with configuration.
Flashing fast (4 times per second)
Software is being loaded to the board, or the board does not run.
Flashing slowly (on for 2 seconds, off for another 2 seconds)
The board is isolated.
Always on or flashing fast
Alarms occur to the board.
Always off
No fault occurs.
Flashing
The board is in service such as in the master state.
Always off
The board is out of service such as in the slave state.
Always on
The board can be removed.
Always off
The board cannot be removed at the moment.
7.5.3 Interfaces on the MIOE Table 7-25 lists the interfaces on the MIOE. Table 7-25 Interfaces on the MIOE
Issue 05 (2009-01-09)
Category
Quantity
Physical Interface
Function
Specification
COM0
1
RJ48
Used as a debug serial port
RS232 serial port
FE0
1
RJ45
Used as a debug serial port
FE network interface
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HUAWEI UMG8900 Hardware Description
7 Service and Protocol Processing Units
7.5.4 Fuses on the MIOE For details on fuse positions of the MIOE, see 7.5.1 Panel of the MIOE. Table 7-26 lists the specifications. Table 7-26 Fuses on the MIOE No.
Function
Specification
F1
–48 V power fuse
4A
F2
MBus 5 V power fuse
1A
7.5.5 Technical Specifications of the MIOE Table 7-27 lists the technical specifications of the MIOE. Table 7-27 Technical specifications of the MIOE Category
Parameter
Specification
Remarks
Power consumption
N/A
20.8 W
–
Heat dissipation
N/A
20.8 W
Service processing capability
Number of users
Supporting up to 4400 online users
-
7.6 MSPF This describes the functions, panels and structures, indicators, interfaces, DIP switches and jumpers, fuses, and technical specifications of the MSPF. As the signaling processing unit of the UMG8900, the MSPFs are inserted in front slots 0 to 6 and slots 9 to 15 in the main control frame or the service frame. They work in load-sharing mode. The MSPF falls into two types: the UG01MSPF and UG02MSPF. The difference is that the UG01MSPF can be inserted only in SSM-256 frames, and the UG02MSPF can be inserted in both. The MOMB or MMPB is inserted in slot 6 or 9 in the SSM-32 frame. Therefore, the UG02MSPF cannot be inserted in slot 6 or 9. In appearance, the name silkscreen of the front panel of the UG01MSPF is MSPF, and that of the UG02MSPF is MSPFb. The MSPF provides the following functions:
7-24
l
Implementing the adaptation of the TDM narrowband signaling to the IP packet based on the SIGTRAN protocol. Receiving signaling from TDM switching units through the subboard, and processing the TDM signaling.
l
Implementing the core function of the signaling gateway by supporting the M3UA//M2UA/ V5UA/IUA adaptation on signaling, and forwarding adapted messages to the media gateway controller (MGC). Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd.
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7 Service and Protocol Processing Units
7.6.1 Panel of the MSPF 7.6.2 Indicators on the MSPF 7.6.3 Interfaces on the MSPF 7.6.4 Fuses on the MSPF 7.6.5 Technical Specifications of the MSPF 7.6.6 Subboards of the MSPF
7.6.1 Panel of the MSPF Figure 7-8 shows the panel of the MSPF. Figure 7-8 Panel of the MSPF MSPF
F61 J5 F15
POWER
MBUS
RUN ALM
Subboard 2
10
1 2
10
J14 J15
1
9
2
10
1 2
9 10
1
9
2
10
1
9
2
10
1 2
9 10
1 2
9 10
1 2
9 10
1
RESET
J13
Subboard
J12
9
J8 J9
CPU Bridge
COM0
9
U2
Unit U3
OFFLINE
MSPF
The RESET button on the front panel is used to reset the board.
7.6.2 Indicators on the MSPF Table 7-28 lists the meaning of the indicators on the MSPF. Issue 05 (2009-01-09)
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HUAWEI UMG8900 Hardware Description
7 Service and Protocol Processing Units
Table 7-28 Indicator meaning of the MSPF Indicator
Identificat ion
Color
Status
Meaning
Running indicator
RUN
Green
Always on
There is power supply, but the board is faulty.
Always off
There is no power supply, or the board is faulty.
Flashing (on for 1 second, off for another second)
The board runs normally in accordance with configuration.
Flashing fast (4 times per second)
Software is being loaded to the board, or the board does not run.
Always on or flashing fast
Alarms occur to the board.
Always off
No fault occurs.
Always on
The board can be removed.
Always off
The board cannot be removed at the moment.
Alarm indicator
Hot-pluggable indicator
ALM
Red
OFFLINE
Blue
7.6.3 Interfaces on the MSPF Table 7-29 lists the interface on the MSPF. Table 7-29 Interface on the MSPF Category
Quantity
Physical Interface
Function
Specification
COM0
1
RJ48
Used as a debug serial port
RS232 serial port
7.6.4 Fuses on the MSPF For details on fuse positions of the MSPF, see 7.6.1 Panel of the MSPF. Table 7-30 lists the specifications. Table 7-30 Fuses on the MSPF
7-26
No.
Function
Specification
F61
–48 V power fuse
4A
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HUAWEI UMG8900 Hardware Description
7 Service and Protocol Processing Units
No.
Function
Specification
F15
MBus 5 V power fuse
1A
7.6.5 Technical Specifications of the MSPF Table 7-31 lists the technical specifications of the MSPF. Table 7-31 Technical specifications of the MSPF Category
Parameter
Specification
Remarks
Power consumption
N/A
33.9 W
–
Heat dissipation
N/A
33.9 W
Service processing capability
Number of the MTP2 links
64 kbit/s: 46 links for each board. Up to 2576 links
–
2 Mbit/s: two links for each board. Up to 112 links Number of the MTP3 links
64 kbit/s: 46 links for each board. Up to 2576 links 2 Mbit/s: two links for each board. Up to 112 links
Number of the Q.921 links
64 kbit/s: 128 links for each board. Up to 4096 links
Number of the LAPV5 links
64 kbit/s: 64 links for each board. Up to 1024 links
7.6.6 Subboards of the MSPF The SHPU subboard is the signaling high-level processing subboard. The MSPF processes layer 2 signaling protocol through the SHPU subboard. Based on the configured work modes, the subboards can support different layer 2 protocols. Up to two subboards can be configured on each MSPF. Table 7-32 lists the technical specifications of the SHPU subboard. Table 7-32 Technical specifications of the SHPU subboard
Issue 05 (2009-01-09)
Category
Parameter
Specification
Remarks
Power consumption
N/A
8.5 W
–
Heat dissipation
N/A
8.5 W
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HUAWEI UMG8900 Hardware Description
7 Service and Protocol Processing Units
Category
Parameter
Specification
Remarks
Service processing capability
Number of the MTP2 links
Up to twenty-three 64 kbit/s MTP2 links
PRO_64K_PRA or PRO_BT_64K_PRA mode
Up to one 2 Mbit/s MTP2 link
PRO_2M or PRO_BT_2M mode
Up to 64 links
PRO_PRA mode
Number of the Q. 921 links Number of the LAPRSA links Number of the LAPV5 links
7-28
Up to 32 links
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HUAWEI UMG8900 Hardware Description
8 Cascading Units
8
Cascading Units
About This Chapter The cascading units consist of MFLU, MBLU, and MNLU. 8.1 MFLU This describes the functions, panels and structures, indicators, interfaces, DIP switches and jumpers, fuses, and technical specifications of the MFLU. 8.2 MBLU This describes the functions, panels and structures, indicators, interfaces, DIP switches and jumpers, fuses, and technical specifications of the MBLU. 8.3 MNLU This describes the functions, panels and structures, indicators, interfaces, DIP switches and jumpers, fuses, and technical specifications of the MNLU.
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HUAWEI UMG8900 Hardware Description
8 Cascading Units
8.1 MFLU This describes the functions, panels and structures, indicators, interfaces, DIP switches and jumpers, fuses, and technical specifications of the MFLU. As the front cascading board in multi-frame cascading application, the MFLUs are inserted in front slots 0 to 5 and 10 to 15 in the central switching frame. The MFLU can be inserted only in SSM-256 frames. The MFLU provides the following functions: l
The UG01MFLU forwards 1 x 8K TDM cascading data sent by the MTNU to the UG01MBLU in the back slot and the UG01MFLU forwards 2 x 8K TDM cascading data through the backplane. Therefore, the total TDM cascading capacity is 3 x 8K.
l
The UG02MFLU forwards 2 x 8K TDM cascading data sent by the MTNB to the UG02MBLU in the back slot and the UG02MFLU forwards 2 x 8K TDM cascading data through the backplane. Therefore, the total TDM cascading capacity is 4 x 8K.
l
Two MFLU provide 2 x 1.25 G GE data cascading channels for the MBLU in the back slot.
The MFLU falls into two types: the UG01MFLU and UG02MFLU. The major differences between the UG01MFLU and the UG02MFLU are as follows: l
The UG01MFLU can work with only the UG01MBLU and the UG01MTNU.
l
Functions of the G02MFLU are the same as those of the UG01MFLU; however, the UG02MFLU can work with only the UG02MBLU.
l
The UG02MFLU provide one more ACT indicator than the UG01MFLU. The name silkscreen of the front panel on the UG02MFLU is MFLUb, while that on the UG01MFLU is MFLU.
The UG01MFLU is not described. 8.1.1 Panel of the MFLU 8.1.2 Indicators on the MFLU 8.1.3 Interfaces on the MFLU 8.1.4 Fuses on the MFLU 8.1.5 Technical specifications of the MFLU
8.1.1 Panel of the MFLU Figure 8-1 shows the panel of the MFLU.
8-2
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HUAWEI UMG8900 Hardware Description
8 Cascading Units
Figure 8-1 Panel of the MFLU MFLUb
F3
J6 J5
F2
F4
F1
J7
RUN ALM ACT
POW ER
POW ER
J9
J3
EPLD
J2
MBUS
J4 Loading Socket
J8
OFFLINE
MFLUb
8.1.2 Indicators on the MFLU Table 8-1 lists the meaning of the indicators on the MFLU. Table 8-1 Indicator meaning of the MFLU
Issue 05 (2009-01-09)
Indicator
Identificat ion
Color
Status
Meaning
Running indicator
RUN
Green
Always on
There is power supply, but the board is faulty.
Always off
There is no power supply, or the board is faulty.
Flashing (on for 1 second, off for another second)
The board runs normally in accordance with configuration.
Flashing fast (4 times per second)
Software is being loaded to the board, or the board does not run.
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8-3
HUAWEI UMG8900 Hardware Description
8 Cascading Units
Indicator
Identificat ion
Color
Status
Meaning
Alarm indicator
ALM
Red
Always on or flashing fast
Alarms occur to the board.
Always off
No fault occurs.
Flashing
The board is in service such as in the master state.
Always off
The board is out of service such as in the slave state.
Always on
The board can be removed.
Always off
The board cannot be removed at the moment.
Working indicator
Hot-pluggable indicator
ACT
Green
OFFLINE
Blue
8.1.3 Interfaces on the MFLU None
8.1.4 Fuses on the MFLU For details on fuse positions of the MFLU, see 8.1.1 Panel of the MFLU. Table 8-2 lists the specifications. Table 8-2 Fuses on the MFLU No.
Function
Specification
F1
MBus 5 V power fuse
1A
F2
–48 V power fuse
2A
F3
–48 V power fuse
1A
F4
–48 V power fuse
1A
8.1.5 Technical specifications of the MFLU Table 8-3 lists the technical specifications of the MFLU.
8-4
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HUAWEI UMG8900 Hardware Description
8 Cascading Units
Table 8-3 Technical specifications of the MFLU Category
Parameter
Specification
Remarks
Power consumption
N/A
3.4 W
–
Heat dissipation
N/A
3.4 W
8.2 MBLU This describes the functions, panels and structures, indicators, interfaces, DIP switches and jumpers, fuses, and technical specifications of the MBLU. As the back cascading board in the multi-frame cascading application, the MBLUs are inserted in back slots 0 to 5 and 10 to 15 in the central switching frame. The boards in slots 0 and 1, 2 and 3, 4 and 5, 10 and 11, 12 and 13, 14 and 15 are in master and slave mode. The MBLU can be inserted only in SSM-256 frames. The MBLU provides the following functions: l
Providing 4 x 8 K TDM narrowband data channels to directly connect frames through multimode optical fibers
l
Providing 2 x 1.25 G broadband packet data channels to directly connect frames through multi-mode optical fibers
l
Providing the 100 M IP control data channels to directly connect frames through category-5 twisted pair or super category-5 twisted pair
The MBLU includes the UG01MBLU, UG02MBLU_VAand UG02MBLU_VC. The difference is as follows: l
The UG01MBLU works with the UG01MFLU to providing 3 x 8 K timeslot cascading capacity in conjunction with the MTNU.
l
The UG02MBLU_VA and UG01MBLU are similar in functions. In appearance, the difference is that the UG02MBLU_VA provide one more TDM cascading optical interface than the UG01MBLU. The name silkscreen of the front panel on the UG02MBLU_VA is MBLUb, while that on the UG01MBLU is MBLU.
l
The UG02MBLU_VA provides cascading network interfaces including FE0 interface. The UG02MBLU_VC provides FE1&FE2, and FE3&FE4 interfaces. Each UG02MBLU_VC can provide four FE cascading network interfaces through extended network cables.
The UG01MBLU is not described. 8.2.1 Panel of the MBLU 8.2.2 Indicators on the MBLU 8.2.3 Interfaces on the MBLU 8.2.4 Fuses on the MBLU 8.2.5 Technical specifications of the MBLU
8.2.1 Panel of the MBLU Issue 05 (2009-01-09)
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HUAWEI UMG8900 Hardware Description
8 Cascading Units
Figure 8-2 shows the panel of the UG02MBLU_VA. Figure 8-2 Panel of the UG02MBLU_VA MBLUb
J3
RUN ALM ACT
J6
FE0 AC
F2
MBUS
H3 T
AC
GE
T
NK LI 0 TX 0 RX K N LI 1 T X1 RX
TDM T
AC AC AC
T
T
NK LI 2 TX 2 RXK N LI X3 T 3 RXK N LI 4 TX4 RX K N LI 5 TX 5 X R
OFFLINE
J10
FPGA
J4 Frequency Doubler
Switching
Module
J9
CPLD J8
COM0
AC
T
F1 J7
POWER
S1 H1
CPU H2
MBLUb
Figure 8-3 shows the panel of the UG02MBLU_VC.
8-6
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HUAWEI UMG8900 Hardware Description
8 Cascading Units
Figure 8-3 Panel of the UG02MBLU_VC MBLUb
1 2
FE3&FE4 FE1&FE2 FE4 FE2
RUN ALM ACT
T AC
GE
T AC
NK LI 0 TX0 RXK N LI 1 T X1 RX
TDM
T AC T AC T AC
MBUS
COM0
T AC
NK LI X2 T2 RXK N LI 3 TX3 RXK N LI 4 TX4 RXK N LI X5 T5 RX
OFFLINE
MBLUb
1. FE1&FE2
2. FE3&FE4
NOTE
The new indicators on the UG02MBLU_VC panel are used to indicate the ACT and LINK states of the FE2 and FE4 interfaces.
8.2.2 Indicators on the MBLU Table 8-4 lists the meaning of the indicators on the MBLU. Table 8-4 Indicator meaning of the MBLU
Issue 05 (2009-01-09)
Indicator
Identificati on
Color
Status
Meaning
Running indicator
RUN
Green
Always on
There is power supply, but the board is faulty.
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HUAWEI UMG8900 Hardware Description
8 Cascading Units
Indicator
Alarm indicator
Working indicator
Identificati on
ALM
ACT
Optical fiber connection state indicator
LINK
Master optical channel indicator
ACT
Hot-pluggable indicator
OFFLINE
Color
Red
Green
Green
Orange
Blue
Status
Meaning
Always off
There is no power supply, or the board is faulty.
Flashing (on for 1 second, off for another second)
The board runs normally in accordance with configuration.
Flashing fast (4 times per second)
Software is being loaded to the board, or the board does not run.
Always on or flashing fast
Alarms occur to the board.
Always off
No fault occurs.
Flashing
The board is in service such as in the master state.
Always off
The board is out of service such as in the slave state.
Always on
Optical fiber connection is normal.
Always off
Optical fiber connection is abnormal.
Always on or flashing
The optical channel that corresponds to the optical module is in the master state.
Always off
The optical channel that corresponds to the optical module is in the slave state.
Always on
The board can be removed.
Always off
The board cannot be removed at the moment.
8.2.3 Interfaces on the MBLU Table 8-5 lists the interfaces on the MBLU.
8-8
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8 Cascading Units
Table 8-5 Interfaces on the MBLU Category
Quantit y
Physical Interface
Function
Specificatio n
COM0
1
RJ48
Used as a debug serial port
RS232 serial port
TDM cascading
4
LC
Providing 4 x 8 K cascading capacity
-
Broadband packet cascading optical interface
2
LC
Providing 2 x 1.25G cascading capacity
-
FE0
1
RJ45
Providing 1 x FE cascading capacity
FE network interface
FE1&FE2
1
RJ45
Providing 1 x FE cascading capacity, and expanding to 2 x FE cascading capacity through extended cascading network cables
FE network interface
FE3&FE4
1
RJ45
Providing 1 x FE cascading capacity, and expanding to 2 x FE cascading capacity through extended cascading network cables
FE network interface
NOTE
FE1&FE2 and FE3&FE4 are the new interfaces of the UG02MBLU_VC which can provide two cascading network interfaces through extended network cables.
8.2.4 Fuses on the MBLU For details on fuse positions of the MBLU, see 8.2.1 Panel of the MBLU. Table 8-6 lists the specifications. Table 8-6 Fuses on the MBLU No.
Function
Specification
F1
–48 V power fuse
2A
F2
MBus 5 V power fuse
1A
8.2.5 Technical specifications of the MBLU Table 8-7 lists the technical specifications of the MBLU. Issue 05 (2009-01-09)
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8 Cascading Units
Table 8-7 Technical specifications of the MBLU Category
Parameter
Specification
Remarks
Optical module
Transmission distance
500 m [0.3 mi.]
UG02MBLU_VC
Mode
multi-mode
Wavelength
850 nm
Output optical power
–9.5 dBm to –2.5 dBm
Maximum receive sensitivity
–17.0 dBm
Saturation optical power
0 dBm
Optical interface speed
2.125 Gbit/s series
TDM cascading optical interface
Optical interface speed
960 Mbit/s
FE cascading
Speed of the network interface
125 Mbit/s
Power consumption
N/A
19.4 W
Heat dissipation
N/A
19.4 W
–
NOTE
The receiving power of the optical module must be larger than the maximum receive sensitivity and less than the saturation optical power. Insufficient receiving power may cause bit errors, which destabilizes the service. Excessive receiving power may cause damage to optical modules.
8.3 MNLU This describes the functions, panels and structures, indicators, interfaces, DIP switches and jumpers, fuses, and technical specifications of the MNLU.
CAUTION In the SSM-32 frame, two boards inserted in two opposite slots cannot use the GE bus on the backplane at the same time. The MNLU cannot be inserted opposite to the boards that use the gigabit Ethernet (GE) bus, such as the MVPD. As the back cascading board in the multi-frame cascading networking, the MNLUa are inserted in back slots 4, 5, 10, and 11 in the main control frame and service frame. They work in loadsharing mode. The MNLU can only be used in the SSM-32 frame. 8-10
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HUAWEI UMG8900 Hardware Description
8 Cascading Units
The MNLU provides the following functions: l
Providing direct cascading data channel of 1 × 1.25G capacity for broadband packet services. A pair of MNLUs provides direct cascading data channel of 2 x1.25G capacity for broadband packet services.
l
Self-cascading the SSM-32 frames through optical port 0 and multimode optical fiber.
l
Mixed-cascading SSM-32 frames and SSM-256 frames through optical ports 0 and 1 and multimode optical fiber.
8.3.1 Panel of the MNLU 8.3.2 Indicators on the MNLU 8.3.3 Interfaces on the MNLU 8.3.4 Fuses on the MNLU 8.3.5 Technical specifications of the MNLU
8.3.1 Panel of the MNLU Figure 8-4 shows the panel of the MNLU. Figure 8-4 Panel of the MNLU MNLU
F2
F1195 F1196
F1
POWER
RUN ALM
J7 AC
AC
T
T
NK LI 0 T X0 RX NK LI 1 X T 1 RX
SFP
2
10
2
10
1
9
1
9
J10
MBUS
SFP
BIOS
FLASH
COM0
CPU
OFFLINE
S1
CPLD
MNLU
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HUAWEI UMG8900 Hardware Description
8 Cascading Units
8.3.2 Indicators on the MNLU Table 8-8 lists the meaning of the indicators on the MNLU. Table 8-8 Indicator meaning of the MNLU Indicator
Identificati on
Color
Status
Meaning
Running indicator
RUN
Green
Always on
There is power supply, but the board is faulty.
Always off
There is no power supply, or the board is faulty.
Flashing (on for 1 second, off for another second)
The board runs normally in accordance with configuration.
Flashing fast (4 times per second)
The board is being loaded or it does not work.
Always on or flashing fast
Alarms occur to the board.
Always off
No fault occurs.
Always on
Optical fiber connection is normal.
Always off
Optical fiber connection is abnormal.
Always on or flashing
The optical channel that corresponds to the optical module is in the master state.
Always off
The optical channel that corresponds to the optical module is in the slave state.
Always on
The board can be removed.
Always off
The board cannot be removed at the moment.
Alarm indicator
ALM
Optical fiber connection state indicator
LINK
Master optical channel indicator
ACT
Hot-pluggable indicator
OFFLINE
Red
Green
Orange
Blue
8.3.3 Interfaces on the MNLU Table 8-9 lists the interfaces on the MNLU. 8-12
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Table 8-9 Interfaces on the MNLU Category
Quantity
Physical Interface
Function
Specificatio n
COM0
1
RJ48
Used as a debug serial port
RS232 serial port
Broadband packet cascading optical interface
2
LC
Providing 2 x 1.25G cascading capacity
-
8.3.4 Fuses on the MNLU For details on fuse positions of the MNLU, see 8.3.1 Panel of the MNLU. Table 8-10 lists the specifications. Table 8-10 Fuses on the MNLU No.
Function
Specification
F1
MBus 5 V power fuse
Direction
F2
–48 V power fuse
2A
8.3.5 Technical specifications of the MNLU Table 8-11 lists the technical specifications of the MNLU. Table 8-11 Technical specifications of the MNLU
Issue 05 (2009-01-09)
Category
Parameter
Specification
Remarks
Optical module
Transmission distance
500 m [0.3 mi.]
–
Mode
multi-mode
Wavelength
850 nm
Output optical power
–9.5 dBm to –2.5 dBm
Maximum receive sensitivity
–17.0 dBm
Saturation optical power
0 dBm
Optical interface speed
2.125 Gbit/s series
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Category
Parameter
Specification
Power consumptio n
N/A
7.2 W
Heat dissipation
N/A
7.2 W
Remarks
NOTE
The receiving power of the optical module must be larger than the maximum receive sensitivity and less than the saturation optical power. Insufficient receiving power may cause bit errors, which destabilizes the service. Excessive receiving power may cause damage to optical modules.
8-14
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HUAWEI UMG8900 Hardware Description
9 Media Resource Processing Units
9
Media Resource Processing Units
About This Chapter The media resource processing units consist of MVPB, MVPD, MTCB, MTCD, MECU. 9.1 MVPB This describes the functions, panels and structures, indicators, interfaces, DIP switches and jumpers, fuses, and technical specifications of the MVPB. 9.2 MVPD This describes the functions, panels and structures, indicators, interfaces, DIP switches and jumpers, fuses, and technical specifications of the MVPD. 9.3 MTCB This describes the functions, panels and structures, indicators, interfaces, DIP switches and jumpers, fuses, and technical specifications of the MTCB. 9.4 MTCD This describes the functions, panels and structures, indicators, interfaces, DIP switches and jumpers, fuses, and technical specifications of the MTCD. 9.5 MECU This describes the functions, panels and structures, indicators, interfaces, DIP switches and jumpers, fuses, and technical specifications of the MECU.
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9-1
HUAWEI UMG8900 Hardware Description
9 Media Resource Processing Units
9.1 MVPB This describes the functions, panels and structures, indicators, interfaces, DIP switches and jumpers, fuses, and technical specifications of the MVPB. As the voice processing unit, the MVPBs are inserted in front slots 0 to 6 and slots 9 to 15 in the main control frame and the service frame. The MVPB can be inserted only in SSM-256 frames. The MVPB falls into two types: UG01MVPB and UG02MVPB. The difference between two types is as follows: l
The UG01MVPB is MVPB on the panel.
l
The UG02MVPB is MVPBb on the panel.
l
The UG02MVPB provides the FE0 interface as the debug network interface.
l
The UG02MVPB supports the UG01MVDD subboard.
l
The UG02MVPB supports voice codec modes including GSM AMR and UMTS AMR.
The MVPB provides the following functions: l
Supporting functions such as announcement playing, number collecting, audio mixing, and multiple frequency control (MFC)
l
Implementing IP packet adaptation of voice services based on UDP, RTP and IP. Supporting varied voice codec modes including G.711A, G.711μ, G.723, G.726, G.729, AMR, EVRC,QCELP8K, and QCELP13K
l
The UG02MVPB supports the GSM AMR codec and the HR, FR, and EFR codecs in the GSM network. Thus, the interworking with the GSM network can be realized.
l
The UG02MVPB supports the UMTS AMR codec for interworking with the UMTS network.
l
Accepting resource control and management of the CMU
9.1.1 Panel of the MVPB 9.1.2 Indicators on the MVPB 9.1.3 Interfaces on the MVPB 9.1.4 Fuses on the MVPB 9.1.5 Technical Specifications of the MVPB 9.1.6 MVPB Subboards
9.1.1 Panel of the MVPB Figure 9-1 shows the panel of the UG01MVPB.
9-2
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HUAWEI UMG8900 Hardware Description
9 Media Resource Processing Units
Figure 9-1 Panel of the UG01MVPB
GND
MVPB
F1
-48V
F2
POWER
RJ1
RUN ALM
J20
U24
U9
TC Subboard 0
MBUS
COM0
TC Subboard 1
U2
PGND
U54
TC Subboard 2/EC Subboard
OFFLINE
MVPB
Figure 9-2 shows the panel of the UG02MVPB.
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HUAWEI UMG8900 Hardware Description
9 Media Resource Processing Units
Figure 9-2 Panel of the UG02MVPB MVPBb -48V
J6
F2/1A
CPU processor
Power module +3.3V 1208/CPLDS TC/EC
J9 J8
RUN ALM ACT FE0
F1/4A +5V
Logic chip
S1 TC subboard 0
MBUS
BOOTROM / J10 CPLD
COM0
TC subboard 1
TC subboard 2/EC subboard
OFFLINE
MVPBb
9.1.2 Indicators on the MVPB Table 9-1 lists the meaning of the indicators on the MVPB. Table 9-1 Indicator meaning of the MVPB
9-4
Indicator
Identificat ion
Color
Status
Meaning
Running indicator
RUN
Green
Always on
There is power supply, but the board is faulty.
Always off
There is no power supply, or the board is faulty.
Flashing (on for 1 second, off for another second)
The board runs normally in accordance with configuration.
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9 Media Resource Processing Units
Indicator
Alarm indicator
Working indicator
Hot-pluggable indicator
Identificat ion
ALM
ACT
OFFLINE
Color
Red
Green
Blue
Status
Meaning
Flashing fast (4 times per second)
Software is being loaded to the board, or the board does not run.
Flashing slowly (on for 2 seconds, off for another 2 seconds)
The board is isolated.
Always on or flashing fast
Alarms occur to the board.
Always off
No fault occurs.
Flashing
The board is in service such as in the master state.
Always off
The board is out of service such as in the slave state.
Always on
The board can be removed.
Always off
The board cannot be removed at the moment.
NOTE
The working indicator ACT is unavailable on the panel of the UG01MVPB. The working indicator ACT is available on the panel of the UG02MVPB. The UG02MVPB is in loadsharing mode. Therefore, the indicator is always off.
9.1.3 Interfaces on the MVPB Table 9-2 lists the interfaces on the MVPB. Table 9-2 Interfaces on the MVPB Category
Quantity
Physical Interface
Function
Specification
COM0
1
RJ48
Used as a debug serial port
RS232 serial port
FE0
1
RJ45
Used as a debug network interface
FE network interface
NOTE
Interface FE0 is located on the UG02MVPB.
9.1.4 Fuses on the MVPB Issue 05 (2009-01-09)
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HUAWEI UMG8900 Hardware Description
9 Media Resource Processing Units
For details on fuse positions of the MVPB, see 9.1.1 Panel of the MVPB. Table 9-3 lists the specifications. Table 9-3 Fuses on the MVPB No.
Function
Specification
F1
–48 V power fuse
4A
F2
MBus 5 V power fuse
1A
9.1.5 Technical Specifications of the MVPB Table 9-4 and Table 9-5 list the technical specifications of the MVPB. Table 9-4 Power consumption and heat dissipation of theMVPB Category
Parameter
Remarks
Power consumption
24 W
UG02MVPB without the subboard
Heat dissipation
24 W
Table 9-5 Service processing capability of the MVPB Parameter
Specification
Remarks
Number of the TC channels
1024 channels (G.711 voice codec mode)
Use the MVDB subboard.
Number of the TC channels
1024 channels (G.711 voice codec mode)
Number of the CC channels
1024
Use the MVDB subboard in subboard slot 0/1.
2048
Use the MVDB subboard in subboard slot 2.
1024 (tail length: 16 ms or 32 ms)
Use the MECC subboard.
Number of the EC channels
512 channels (G.723/G.726/G.729/AMR voice codec mode)
672 channels (G.729a/b voice codec mode)
Use the MVDD subboard (only for the UG02MVPB).
1024 (tail length: 48 ms or 64 ms) 512 (tail length: 80 ms, 96 ms, 110 ms, or 128 ms) 2048 (tail length: 16 ms or 32 ms)
Use the MECE subboard.
2048 (tail length: 48 ms or 64 ms) 1024 (tail length: 80 ms, 96 ms, 110 ms, or 128 ms) 9-6
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HUAWEI UMG8900 Hardware Description
9 Media Resource Processing Units
Parameter
Specification
Remarks
1024 (tail length: 64 ms)
Use the MECF subboard
1024 (tail length: 128 ms)
Use the MECG subboard.
2048 (tail length: 64 ms)
Use the MECH subboard.
2048 (tail length: 128 ms)
Use the MECI subboard.
1024 (tail length: 64 ms)
Use the MECJ subboard.
2048 (tail length: 64 ms)
Use the MECK subboard.
NOTE
l
The tail length is the parameter for the echo cancellation. If the tail length is longer, the echo cancellation is more effective, and more EC resource is occupied.
l
The TC resource channel supports functions such as code conversion, announcement playing, and digit collecting. Each channel can support only one function at one time. For example, an MVDB subboard provides 512 TC channels. If 100 channels support announcement playing and 100 channels support digit collecting, up to 312 channels can support codec.
l
The subboard slots are numbered 0, 1 and 2 from the top to the bottom.
9.1.6 MVPB Subboards MVDB Subboards The MVDB subboard works as the TC subboard and provides the following functions: l
Providing the voice codec conversion function and supporting the voice codec modes including AMR, AMR-WB, QCELP, EVRC, SMV, G.711, G.726, G.723, and G.729
l
Providing 512 AMR channels
l
Providing the FAX function, and supporting the T.30 and T.38 protocols
l
Providing the DTMF detection and DTMF number sending functions
l
Working with the MVPB to play simple announcements
Table 9-6 lists the technical specifications of the MVDB subboard. Table 9-6 Technical specifications of the MVDB subboard
Issue 05 (2009-01-09)
Category
Parameter
Specificatio n
Remarks
Power consumption
N/A
10 W
–
Heat dissipation
N/A
10 W
Service processing capability
Number of the TC channels
1024
G.711 voice codec mode
512
G.723/G.726/G.729/AMR voice codec modes
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HUAWEI UMG8900 Hardware Description
9 Media Resource Processing Units
Category
Parameter
Specificatio n
Remarks
Number of the CC channels
1024
Use the MVDB subboard in subboard slot 0/1.
2048
Use the MVDB subboard in subboard slot 2.
MECC/MECE/MECF/MECG/MECH/MECI/MECJ/MECK Subboards The MECC/MECE/MECF/MECG/MECH/MECI/MECJ/MECK subboards work as the echo cancellation (EC) subboard and provide the following functions: l
The MECC/MECE/MECF/MECG/MECH/MECI subboards provide the acoustic echo cancellation (AEC) and electric EC (EEC) functions.
l
The MECJ/MECK subboards provide the electric EC functions.
l
Supporting various tail delays.
Table 9-7 lists the technical specifications of the MECC/MECE/MECF/MECG/MECH/MECI/ MECJ/MECK subboards. Table 9-7 Technical specifications of the MECC/MECE/MECF/MECG/MECH/MECI/MECJ/ MECK subboards Subboard
Tail Delay
Number of the EC Channels
Power Consumpti on
Heat Dissipation
MECC
16 ms/32 ms
1024
3.8 W
3.8 W
48 ms/64 ms
1024
80 ms/96 ms/110 ms/128 ms
512
16 ms/32 ms
2048
9W
9W
48 ms/64 ms
2048
80 ms/96 ms/110 ms/128 ms
1024
MECF
64 ms
1024
2W
2W
MECG
128 ms
1024
5.3 W
5.3 W
MECH
64 ms
2048
6.4 W
6.4 W
MECI
128 ms
2048
2.3 W
2.3 W
MECJ
64 ms
1024
5.4 W
5.4 W
MECK
64 ms
2048
12.2 W
12.2 W
MECE
9-8
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9 Media Resource Processing Units
UG01MECL Subboards The UG01MECL subboard can be inserted only in the UG02MVPB. The UG01MECL serves as the EC subboard and provides the following functions: l
Providing electric echo cancellation
l
Providing a maximum of 1500 EC channels of 64 ms tail delay
l
Detecting the individual tone
l
Supporting simultaneous recording of four timeslots, and subboard buffering voice data of four timeslots with 384 ms tail delay
l
Providing the loopback test of the subboard EC ASIC and boasting the capability of locating the noise
l
Providing independent production information
l
Providing the JTAG interface to communicate with the CAN bus module, and supporting the system online test and logic online upgrade
Table 9-8 lists the technical specifications of the UG01MECL subboard. Table 9-8 Technical specifications of the UG01MECL subboard Category
Parameter
Specification
Remarks
Power consumption
N/A
4.3 W
Fully loaded
Heat dissipation
N/A
4.3 W
–
Service processing capability
Number of the EC channels
1536
Tail length: 64 ms
UG01MVDD Subboards The UG01MVDD subboard, only for the UG02MVPB, works as the integrated subboard of the EC and TC, and provides the following functions: l
Providing the voice codec conversion function and supporting the voice codec modes such as AMR, AMR-WB, QCELP, EVRC, SMV, G.711, G.726, G.723, and G.729.
l
Providing the echo cancellation (EC) function
l
Providing the FAX function, and supporting the T.30 and T.38 protocols
l
Providing the DTMF detection and DTMF number sending functions
l
Working with the UG02MVPB to play simple announcements
Table 9-9 lists the technical specifications of the MVDB subboard. Table 9-9 Technical specifications of the MVDD subboard
Issue 05 (2009-01-09)
Category
Parameter
Specification
Remarks
Power consumption
N/A
12 W
Fully loaded
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HUAWEI UMG8900 Hardware Description
9 Media Resource Processing Units
Category
Parameter
Specification
Remarks
Heat dissipation
N/A
12 W
–
Service processing capability
Number of the EC channels
1024
G.711 voice codec mode
672
G.729a/b voice codec mode
Board Positions Figure 9-3 shows the position of the MVPB subboard. Figure 9-3 Position of the MVPB subboard
TC subboard 0 MBUS subboard
TC subboard 1
TC subboard 2/ EC subboard
The position of the EC subboard is the same as that of TC subboard 2, but the EC subboard and TC subboard 2 do not share the subboard connector. In addition, the EC subboard and TC subboard cannot be configured in this position at same time.
9.2 MVPD This describes the functions, panels and structures, indicators, interfaces, DIP switches and jumpers, fuses, and technical specifications of the MVPD. The MVPDs, as voice processing units, are inserted in both the SSM-256 frame and SSM-32 frame. In the SSM-256 frame, the MVPDs are inserted in front slots 0 to 6 and slots 9 to 15 in the main control frame and the service frame. In the SSM-32 frame, they are inserted in front slots 0 to 5 and slots 10 to 15 in the main control frame and the service frame. When the MVPD is inserted in the SSM-256 frame, the MTNB must be inserted in the SSM-256 frame; however, the MTNU cannot be inserted in the SSM-256 frame. 9-10
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The MVPD falls into three types: UG01MVPD, UG02MVPD_VB and UG02MVPD_VC. The difference between three types is as follows: l
The UG01MVPD is MVPD on the panel.
l
The UG02MVPD is MVPDb on the panel with new ACT indicators. In addition, the UG02MVPD supports the UG01MVDD subboard.
l
The UG02MVPD_VC is compatible with the UG02MVPD_VB. In addition, the UG02MVPD_VC supports the UG01MVDF subboard and the UG01MECL subboard.
The MVPD provides the following functions: l
Supporting functions such as announcement playing, digit collecting, audio mixing and MFC
l
Implementing IP packet adaptation of voice services based on UDP, RTP and IP. Supporting varied voice codec modes including G.711A, G.711μ, G.723, G.726, G.729, AMR, EVRC,QCELP8K, and QCELP13K
l
Processing the IuUP and NbUP at the same time and complying with the 3GPP TS 25.415 TS 29.415 protocol
l
Accepting resource control and management of the main control board NOTE
In the SSM-32 frame, two boards inserted in two opposite slots cannot use the GE bus on the backplane at the same time. The slot opposite to the front MVPD cannot be inserted with the board using the GE bus.
9.2.1 Panel of the MVPD 9.2.2 Indicators on the MVPD 9.2.3 Interfaces on the MVPD 9.2.4 Fuses on the MVPD 9.2.5 Technical Specifications of the MVPD 9.2.6 MVPD Subboards
9.2.1 Panel of the MVPD Figure 9-4 shows the panel of the UG01MVPD.
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Figure 9-4 Panel of the UG01MVPD MVPD -48V
F1/4A +5V
Power module +3.3V
Power module +1.4V
RUN ALM
FE0
F2/1A
J6
TC subboard 0
TC subboard 1
COM0
MBUS
S1
BOOTROM/ CPLD J10
J8
TC subboard 2/EC subboard
OFFLINE
MVPD
Figure 9-5 shows the panel of the UG02MVPD.
9-12
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Figure 9-5 Panel of the UG02MVPD MVPDb -48V
J6
F2/1A
CPU processor
Power module +3.3V 1208/CPLDS TC/EC
J9 J8
RUN ALM ACT FE0
F1/4A +5V
Logic chip
S1 TC subboard 0
MBUS
BOOTROM / J10 CPLD
COM0
TC subboard 1
TC subboard 2/EC subboard
OFFLINE
MVPDb
9.2.2 Indicators on the MVPD Table 9-10 lists the meaning of the indicators on the MVPD. Table 9-10 Indicator meaning of the MVPD
Issue 05 (2009-01-09)
Indicator
Identificat ion
Color
Status
Meaning
Running indicator
RUN
Green
Always on
There is power supply, but the board is faulty.
Always off
There is no power supply, or the board is faulty.
Flashing (on for 1 second, off for another second)
The board runs normally in accordance with configuration.
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Indicator
Alarm indicator
Working indicator
Hot-pluggable indicator
Identificat ion
ALM
ACT
OFFLINE
Color
Red
Green
Blue
Status
Meaning
Flashing fast (4 times per second)
Software is being loaded to the board, or the board does not run.
Flashing slowly (on for 2 seconds, off for another 2 seconds)
The board is isolated.
Always on or flashing fast
Alarms occur to the board.
Always off
No fault occurs.
Flashing
The board is in service such as in the master state.
Always off
The board is out of service such as in the slave state.
Always on
The board can be removed.
Always off
The board cannot be removed at the moment.
NOTE
The working indicator ACT is unavailable on the panel of the UG01MVPD. The working indicator ACT is available on the panel of the UG02MVPD. The UG02MVPD is in loadsharing mode. Therefore, the indicator is always off.
9.2.3 Interfaces on the MVPD Table 9-11 lists the interfaces on the MVPD. Table 9-11 Interfaces on the MVPD Category
Quantity
Physical Interface
Function
Specification
COM0
1
RJ48
Used as a debug serial port
RS232 serial port
FE0
1
RJ45
Used as a debug network interface
FE network interface
9.2.4 Fuses on the MVPD 9-14
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For details on fuse positions of the MVPD, see 9.2.1 Panel of the MVPD. Table 9-12 lists the specifications. Table 9-12 Fuses on the MVPD No.
Function
Specification
F1
–48 V power fuse
4A
F2
MBus 5 V power fuse
1A
9.2.5 Technical Specifications of the MVPD Table 9-13 and Table 9-14 list the technical specifications of the MVPD. Table 9-13 Power consumption and heat dissipation of the MVPD Category
Parameter
Remarks
Power consumption
21.5 W
MVPD without the subboard
Heat dissipation
21.5 W
MVPD without the subboard
Table 9-14 Technical specifications of the MVPD Parameter
Specification
Remarks
Number of the TC channels
1024 channels (G.711 voice codec mode)
Use the MVDB subboard.
512 channels (G.723/G.726/G.729/ AMR voice codec mode) Number of the TC channels
1024 channels (G.711 voice codec mode)
Use the UG01MVDD subboard (only for the UG02MVPD_VB).
672 channels (G.729a/b codec mode) Number of the TC channels
1536 channels (G.711 voice codec mode)
Use the UG01MVDF subboard (only for the UG02MVPD_VC).
768 channels (G.723/G.726/G.729/ AMR voice codec mode) Number of the CC channels
Issue 05 (2009-01-09)
1024
Use the MVDB or UG01MVDF subboard in subboard slot 0/1.
2048
Use the MVDB or UG01MVDF subboard in subboard slot 2.
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Parameter
Specification
Remarks
Number of the EC channels
1024 (tail length: 16 ms or 32 ms)
Use the MECC subboard.
1024 (tail length: 48 ms or 64 ms) 512 (tail length: 80 ms, 96 ms, 110 ms, or 128 ms) 2048 (tail length: 16 ms or 32 ms)
Use the MECE subboard.
2048 (tail length: 48 ms or 64 ms) 1024 (tail length: 80 ms, 96 ms, 110 ms, or 128 ms) 1024 (tail length: 64 ms)
Use the MECF subboard.
1024 (tail length: 128 ms)
Use the MECG subboard.
2048 (tail length: 64 ms)
Use the MECH subboard
2048 (tail length can be 128 ms)
Use the MECI sub board.
1024 (tail length: 64 ms)
Use the MECJ subboard.
2048 (tail length: 64 ms)
Use the MECK subboard.
1024 (tail length: 64 ms)
Use the MVQE subboard.
1536 (tail length: 64 ms)
Use the UG01MECL subboard.
NOTE
l
The tail length is the parameter for the echo cancellation. If the tail length is longer, the echo cancellation is more effective, and more EC resource is occupied.
l
The TC resource channel supports functions such as code conversion, announcement playing and digit collecting. Each channel can only support one function at one time. For example, an MVDB subboard provides 512 TC channels. If 100 channels support announcement playing and 100 channels support digit collecting, up to 312 channels can support codec.
l
The subboard slots are numbered 0, 1 and 2 from the top to the bottom.
9.2.6 MVPD Subboards MVQE Subboards The MVQE subboard functions as the transcoder (TC) subboard and provides the following functions: l
Providing the acoustic echo cancellation (AEC) electric EC functions.
l
Supporting various tail delays.
Table 9-15 lists the technical specifications of the MVQE subboard.
9-16
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Table 9-15 Technical specifications of the MVQE subboard Subboard
Tail Delay
Number of the EC Channels
Power Consumption
Heat Dissipation
MVQE
64 ms
1024
10 W
10 W
UG01MVDD Subboards The UG01MVDD subboard, only for the UG02MVPD, works as the integrated subboard of the EC and TC, and provides the following functions: l
Providing the voice codec conversion function and supporting the voice codec modes such as AMR, AMR-WB, QCELP, EVRC, SMV, G.711, G.726, G.723, and G.729.
l
Providing the echo cancellation (EC) function
l
Providing the FAX function, and supporting the T.30 and T.38 protocols
l
Providing the DTMF detection and DTMF number sending functions
l
Working with the UG02MVPD to play simple announcements
Table 9-16 lists the technical specifications of the MVDB subboard. Table 9-16 Technical specifications of the MVDD subboard Category
Parameter
Specification
Remarks
Power consumption
N/A
12 W
Fully loaded
Heat dissipation
N/A
12 W
-
Service processing capability
Number of the EC channels
1024
G.711 voice codec mode
672
G.729a/b voice codec mode
UG01MVDF Subboards The UG01MVDF subboard can be inserted only in the UG02MVPD_VC. The UG01MVDF subboard serves as the TC subboard and provides the following functions: l
Supporting the codec of 768 channels, G.729a/b codec, and AMR codec
l
Supporting the G.711 voice codec service of 1500 channels
l
Supporting the multiparty service of 2000 channels
l
Detecting the clock status of the subboards by adding the subboard logic
Table 9-17 lists the technical specifications of the UG01MVDF subboard.
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Table 9-17 Technical specifications of the UG01MVDF subboard Category
Parameter
Specification
Remarks
Power consumption
N/A
7.6 W
Fully loaded
Heat dissipation
N/A
7.6 W
–
Service processing capability
Number of the TC channels
1536
G.711 voice codec mode
768
G.723/G.726/G.729/AMR voice codec mode
Number of the CC channels
1024
Use the MVDF subboard in subboard slot 0/1.
2048
Use the MVDF subboard in subboard slot 2.
UG01MECL Subboards The UG01MECL subboard can be inserted only in the UG02MVPD_VC. The UG01MECL serves as the EC subboard and provides the following functions: l
Providing electric echo cancellation
l
Providing a maximum of 1500 EC channels of 64 ms tail delay
l
Detecting the individual tone
l
Supporting simultaneous recording of four timeslots, and subboard buffering voice data of four timeslots with 384 ms tail delay
l
Providing the loopback test of the subboard EC ASIC and boasting the capability of locating the noise
l
Providing independent production information
l
Providing the JTAG interface to communicate with the CAN bus module, and supporting the system online test and logic online upgrade
Table 9-18 lists the technical specifications of the UG01MECL subboard. Table 9-18 Technical specifications of the UG01MECL subboard Category
Parameter
Specification
Remarks
Power consumption
N/A
4.3 W
Fully loaded
Heat dissipation
N/A
4.3 W
–
Service processing capability
Number of the EC channels
1536
Tail length: 64 ms
Board Positions Figure 9-6 shows the position of the MVPD subboard. 9-18
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Figure 9-6 Position of the MVPD subboard
TC subboard 0 MBUS subboard
TC subboard 1
TC subboard 2/ EC subboard
The position of the EC subboard is the same as that of TC subboard 2, but the EC subboard and TC subboard 2 do not share the subboard connector. In addition, the EC subboard and TC subboard cannot be configured in the same position at the same time. The subboards used by the MVPD are the same as those of the MVPB. See 9.1.6 MVPB Subboards.
9.3 MTCB This describes the functions, panels and structures, indicators, interfaces, DIP switches and jumpers, fuses, and technical specifications of the MTCB. As the voice processing unit, the MTCBs are inserted in front slots 0 to 6 and slots 9 to 15 in the main control frame and the service frame. The MTCB can be inserted only in the SSM-256 frame. The MTCB falls into two types: UG01MTCB and UG02MTCB. The difference between two types is as follows: l
The UG01MTCB is MTCB on the panel.
l
The UG02MTCB is MTCBb on the panel.
l
The UG02MTCB provides the FE0 interface as the debug network interface.
l
The UG02MTCB supports the UG01MVDD subboard.
l
The UG02MTCB supports voice codec modes including GSM AMR and UMTS AMR.
The MTCB provides the following functions: l
Issue 05 (2009-01-09)
Supporting functions such as announcement playing, digit collecting, audio mixing and MFC Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd.
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Implementing IP packet adaptation of voice services based on UDP, RTP and IP. Supporting varied voice codec modes including G.711, AMR, EVRC, QCELP8K, and QCELP13K l Processing the IuUP and NbUP at the same time and complying with the 3GPP TS 25.415 TS 29.415 protocol l Providing echo cancellation, supporting tail delay of 32ms, 64ms, 128ms, and supporting G.164/165 single tone detection l The UG02MTCB supports the GSM AMR codec and the HR, FR, and EFR codecs in the GSM network. Thus, the interworking with the GSM network can be realized. l The UG02MTCB supports the UMTS AMR codec for interworking with the UMTS network. l Accepting resource control and management of the CMU 9.3.1 Panel of the MTCB 9.3.2 Indicators on the MTCB 9.3.3 Interfaces on the MTCB 9.3.4 Fuses on the MTCB 9.3.5 Technical Specifications of the MTCB 9.3.6 MTCB Subboards l
9.3.1 Panel of the MTCB Figure 9-7 shows the panel of the UG01MTCB. Figure 9-7 Panel of the UG01MTCB MTCB
F1
POWER
F2
RJ1
RUN ALM
J20
U24
U9
TC Subboard 0
MBUS
COM0
TC Subboard 1 U2
U54
TC Subboard 2/EC Subboard
OFFLINE
MTCB
9-20
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Figure 9-8 shows the panel of the UG021MTCB. Figure 9-8 Panel of the UG02MTCB MTCBb -48V
J6
F2/1A
CPU processor
Power module +3.3V 1208/CPLDS TC/EC
J9 J8
RUN ALM ACT FE0
F1/4A +5V
Logic chip
S1 TC subboard 0
MBUS
BOOTROM / J10 CPLD
COM0
TC subboard 1
TC subboard 2/EC subboard
OFFLINE
MTCBb
9.3.2 Indicators on the MTCB Table 9-19 lists the indicator meaning of the MTCB. Table 9-19 Indicator meaning of the MTCB
Issue 05 (2009-01-09)
Indicator
Identificat ion
Color
Status
Meaning
Running indicator
RUN
Green
Always on
There is power supply, but the board is faulty.
Always off
There is no power supply, or the board is faulty.
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Indicator
Alarm indicator
Hot-pluggable indicator
Identificat ion
ALM
OFFLINE
Color
Red
Blue
Status
Meaning
Flashing (on for 1 second, off for another second)
The board runs normally in accordance with configuration.
Flashing fast (4 times per second)
Software is being loaded to the board, or the board does not run.
Flashing slowly (on for 2 seconds, off for another 2 seconds)
The board is isolated.
Always on or flashing fast
Alarms occur to the board.
Always off
No fault occurs.
Always on
The board can be removed.
Always off
The board cannot be removed at the moment.
9.3.3 Interfaces on the MTCB Table 9-20 lists the interfaces on the MTCB. Table 9-20 Interfaces on the MTCB Category
Quantity
Physical Interface
Function
Specification
COM0
1
RJ48
Used as a debug serial port
RS232 serial port
FE0
1
RJ45
Used as a debug network interface
FE network interface
NOTE
Interface FE0 is located on the UG02MTCB.
9.3.4 Fuses on the MTCB For details on fuse positions of the MTCB, see 9.3.1 Panel of the MTCB. Table 9-21 lists the specifications.
9-22
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Table 9-21 Fuses on the MTCB No.
Function
Specification
F1
–48 V power fuse
4A
F2
MBus 5 V power fuse
1A
9.3.5 Technical Specifications of the MTCB Table 9-22 and Table 9-23 list the technical specifications of the MTCB. Table 9-22 Power consumption and heat dissipation of the MTCB Category
Parameter
Remarks
Power consumption
24 W
UG02MTCB without the subboard
Heat dissipation
24 W
Table 9-23 Service processing capability of the MTCB Parameter
Specification
Remarks
Number of the TC channels
1024 channels (G.711 voice codec mode)
Use the MVDB subboard.
512 channels (G.723/G.726/G.729/ AMR voice codec mode) Number of the TC channels
1024 channels (G.711 voice codec mode)
Use the MVDD subboard (only for the UG02MTCB).
672 channels (G.729a/b voice codec mode) Number of the CC channels
Number of the EC channels
1024
Use the MVDB subboard in subboard slot 0/1.
2048
Use the MVDB subboard in subboard slot 2.
1024 (tail length: 16 ms or 32 ms)
Use the MECC subboard.
1024 (tail length: 48 ms or 64 ms) 512 (tail length: 80 ms, 96 ms, 110 ms, or 128 ms) 2048 (tail length: 16 ms or 32 ms)
Use the MECE subboard.
2048 (tail length: 48 ms or 64 ms) 1024 (tail length: 80 ms, 96 ms, 110 ms, or 128 ms) 1024 (tail length: 64 ms) Issue 05 (2009-01-09)
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Parameter
Specification
Remarks
1024 (tail length: 128 ms)
Use the MECG subboard.
2048 (tail length: 64 ms)
Use the MECH subboard.
2048 (tail length: 128 ms)
Use the MECI subboard.
1024 (tail length: 64 ms)
Use the MECJ subboard.
2048 (tail length: 64 ms)
Use the MECK subboard.
9.3.6 MTCB Subboards For details on the description of the MTCB subboard, see 9.1.6 MVPB Subboards.
9.4 MTCD This describes the functions, panels and structures, indicators, interfaces, DIP switches and jumpers, fuses, and technical specifications of the MTCD.
CAUTION In the SSM-32 frame, two boards inserted in two opposite slots cannot use the GE bus on the backplane at the same time. The slot opposite to the front MTCD cannot be inserted with the board using the GE bus. As the voice processing unit, the MTCDs are inserted in front slots 0 to 5 and slots 10 to 15 in the main control frame and the service frame. The MTCD can be inserted in both SSM-256 frames and SSM-32 frames. When the MTCD is inserted in the SSM-256 frame, the MTNB must be inserted in the SSM-256 frame; however, the MTNU cannot be inserted in the SSM-256 frame. The MTCD provides the following functions: l
Supporting functions such as announcement playing, digit collecting, audio mixing and MFC
l
Implementing IP packet adaptation of voice services based on UDP, RTP and IP; supporting varied voice codec modes including G.711A, G.711μ, G.723, G.726, G.729, AMR, EVRC,QCELP8K, and QCELP13K
l
Processing the IuUP and NbUP at the same time and complying with the 3GPP TS 25.415 TS 29.415 protocol
l
Accepting resource control and management of the main control board
9.4.1 Panel of the MTCD 9.4.2 Indicators on the MTCD 9.4.3 Interfaces on the MTCD 9.4.4 Fuses on the MTCD 9-24
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9.4.5 Technical Specifications of the MTCD 9.4.6 MTCD Subboards
9.4.1 Panel of the MTCD Figure 9-9 shows the panel of the MTCD. Figure 9-9 Panel of the MTCD MTCD
F1
POWER
F2
RJ1
RUN ALM
J20
U24
U9
TC Subboard 0
MBUS
COM0
TC Subboard 1 U2
U54
TC Subboard 2/EC Subboard
OFFLINE
MTCD
9.4.2 Indicators on the MTCD Table 9-24 lists the indicator meaning of the MTCD. Table 9-24 Indicator meaning of the MTCD
Issue 05 (2009-01-09)
Indicator
Identificat ion
Color
Status
Meaning
Running indicator
RUN
Green
Always on
There is power supply, but the board is faulty.
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Indicator
Alarm indicator
Hot-pluggable indicator
Identificat ion
ALM
OFFLINE
Color
Red
Blue
Status
Meaning
Always off
There is no power supply, or the board is faulty.
Flashing (on for 1 second, off for another second)
The board runs normally in accordance with configuration.
Flashing fast (4 times per second)
Software is being loaded to the board, or the board does not run.
Flashing slowly (on for 2 seconds, off for another 2 seconds)
The board is isolated.
Always on or flashing fast
Alarms occur to the board.
Always off
No fault occurs.
Always on
The board can be removed.
Always off
The board cannot be removed at the moment.
9.4.3 Interfaces on the MTCD Table 9-25 lists the interfaces on the MTCD. Table 9-25 Interfaces of the MTCD Category
Quantity
Physical Interface
Function
Specification
COM0
1
RJ48
Used as a debug serial port
RS232 serial port
FE0
1
RJ45
Used as a debug serial port
FE network interface
9.4.4 Fuses on the MTCD For details on fuse positions of the MTCD, see 9.4.1 Panel of the MTCD. Table 9-26 lists the specifications.
9-26
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Table 9-26 Fuses on the MTCD No.
Function
Specification
F1
–48 V power fuse
4A
F2
MBus 5 V power fuse
1A
9.4.5 Technical Specifications of the MTCD Table 9-27 lists the technical specifications of the MTCD. Table 9-27 Technical specifications of the MTCD Category
Parameter
Specification
Remarks
Power consumption
N/A
24 W
MTCD without the subboard
Heat dissipation
N/A
24 W
Service processing capability
Number of the TC channels
1024 channels (G.711 voice codec mode)
Use the MVDB subboard.
512 channels (G.723/ G.726/ G.729/ AMR voice codec mode) Number of the CC channels
Number of the EC channels
1024
Use the MVDB subboard in subboard slot 0/1.
2048
Use the MVDB subboard in subboard slot 2.
1024 (tail length: 16 ms or 32 ms)
Use the MECC subboard.
1024 (tail length: 48 ms or 64 ms) 512 (tail length: 80 ms, 96 ms, 110 ms, or 128 ms) 2048 (tail length: 16 ms or 32 ms)
Use the MECE subboard.
2048 (tail length: 48 ms or 64 ms) 1024 (tail length: 80 ms, 96 ms, 110 ms, or 128 ms) 1024 (tail length: 64 ms) Issue 05 (2009-01-09)
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Use the MECF subboard. 9-27
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Category
Parameter
Specification
Remarks
1024 (tail length: 128 ms)
Use the MECG subboard.
2048 (tail length: 64 ms)
Use the MECH subboard.
2048 (tail length: 128 ms)
Use the MECI subboard.
1024 (tail length: 64 ms)
Use the MECJ subboard.
2048 (tail length: 64 ms)
Use the MECK subboard.
1024 (tail length: 64 ms)
Use the MVQE subboard.
9.4.6 MTCD Subboards For details on the description of the MTCD subboard, see 9.2.6 MVPD Subboards.
9.5 MECU This describes the functions, panels and structures, indicators, interfaces, DIP switches and jumpers, fuses, and technical specifications of the MECU. As the echo cancellation unit, the MECUs are inserted in front slots 0 to 6 and slots 9 to 15 in the main control frame and the service frame. The MECU provides the following functions: l
Implementing the echo cancellation
l
Accepting resource control and management of the CMU
The MECU falls into two types: UG01MECU and UG02MECU. The difference between two types is as follows: l
The UG01MECU can be used only in the SSM-256 frame.
l
The UG02MECU can be used in the SSM-256 frame and the SSM-32 frame. The silkscreen on the ejector level of the UG02MECU is MECUb.
9.5.1 Panel of the MECU 9.5.2 Indicators on the MECU 9.5.3 Interfaces on the MECU 9.5.4 Fuses on the MECU 9.5.5 Technical Specifications of the MECU 9.5.6 MECU Subboards 9-28
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9.5.1 Panel of the MECU Figure 9-10 shows the panel of the MECU. Figure 9-10 Panel of the MECU MECU
F1 F2
U 5 5
POWER
RUN ALM
RJ1
EC MODULE
U29
U33
U24
U 5 8
MBUS
COM0
EC MODULE
OFFLINE
MECU
9.5.2 Indicators on the MECU Table 9-28 lists the meaning of the indicators on the MECU. Table 9-28 Indicator meaning of the MECU
Issue 05 (2009-01-09)
Indicator
Identificat ion
Color
Status
Meaning
Running indicator
RUN
Green
Always on
There is power supply, but the board is faulty.
Always off
There is no power supply, or the board is faulty.
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HUAWEI UMG8900 Hardware Description
9 Media Resource Processing Units
Indicator
Identificat ion
Color
Status
Meaning
Flashing (on for 1 second, off for another second)
The board runs normally in accordance with configuration.
Flashing fast (4 times per second)
Software is being loaded to the board, or the board does not run.
Flashing slowly (on The board is isolated. for 2 seconds, off for another 2 seconds) Alarm indicator
Hot-pluggable indicator
ALM
Red
OFFLINE
Blue
Always on or flashing fast
Alarms occur to the board.
Always off
No fault occurs.
Always on
The board can be removed.
Always off
The board cannot be removed at the moment.
9.5.3 Interfaces on the MECU Table 9-29 lists the interfaces on the MECU. Table 9-29 Interface on the MECU Category
Quantity
Physical Interface
Function
Specification
COM0
1
RJ48
Used as a debug serial port
RS232 serial port
9.5.4 Fuses on the MECU For details on fuse positions of the MECU, see 9.5.1 Panel of the MECU. Table 9-30 lists the specifications. Table 9-30 Fuses on the MECU
9-30
No.
Function
Specification
F1
–48 V power fuse
4A
F2
MBus 5 V power fuse
1A
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HUAWEI UMG8900 Hardware Description
9 Media Resource Processing Units
9.5.5 Technical Specifications of the MECU Table 9-31 and Table 9-32 list the technical specifications of the MECU. Table 9-31 Technical specifications of the UG01MECU Category
Parameter
Specification
Remarks
Power consumption
N/A
16.4 W
–
Heat dissipation
N/A
16.4 W
Service processing capability
Number of the EC channels
2048
–
Table 9-32 Technical specifications of the UG02MECU Category
Parameter
Specification
Remarks
Power consumption
N/A
21.5 W
–
Heat dissipation
N/A
21.5 W
Service processing capability
Number of the EC channels
4K
Used in the SSM-32 frame
2048
Used in the SSM-256 frame
9.5.6 MECU Subboards MECC/MECF/MECG/MECJ/MECK Subboards The MECC/MECF/MECG/MECJ/MECK subboards work as the EC subboards and provide the following functions: l
The MECC/MECF/MECG subboards provide the acoustic echo cancellation (AEC) and electric EC functions.
l
The MECJ/MECK subboards provide the electric EC functions.
l
The MECC/MECF/MECG/MECJ/MECK subboards support various tail delays.
Table 9-33 lists the technical specifications of the MECC/MECF/MECG/MECJ/MECK subboards.
Issue 05 (2009-01-09)
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HUAWEI UMG8900 Hardware Description
9 Media Resource Processing Units
Table 9-33 Technical specifications of the MECC/MECF/MECG/MECJ/MECK subboards
9-32
Subboard
Tail Delay
Number of EC Channels
Power Consum ption
Heat Dissipat ion
MECC
16 ms/32 ms
1024
3.8 W
3.8 W
48 ms/64 ms
1024
80 ms/96 ms/110 ms/128 ms
512
MECF
64 ms
1024
2W
2W
MECG
128 ms
1024
5.3 W
5.3 W
MECJ
64 ms
1024
5.4 W
5.4 W
MECK
64 ms
2048
12.2 W
12.2 W
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HUAWEI UMG8900 Hardware Description
10 E1/T1 and E3/T3 Interface Units
10
E1/T1 and E3/T3 Interface Units
About This Chapter The E1/T1 and E3/T3 interface units consist of ME32, MESU, MT32, MTSU, MPIE, MEAC, MTAC. 10.1 ME32 This describes the functions, panels and structures, indicators, interfaces, DIP switches and jumpers, fuses, and technical specifications of the ME32. 10.2 MESU This describes the functions, panels and structures, indicators, interfaces, DIP switches and jumpers, fuses, and technical specifications of the MESU. 10.3 MT32 This describes the functions, panels and structures, indicators, interfaces, DIP switches and jumpers, fuses, and technical specifications of the MT32. 10.4 MTSU This describes the functions, panels and structures, indicators, interfaces, DIP switches and jumpers, fuses, and technical specifications of the MTSU. 10.5 MPIE This describes the functions, panels and structures, indicators, interfaces, DIP switches and jumpers, fuses, and technical specifications of the MPIE. 10.6 MEAC This describes the functions, panels and structures, indicators, interfaces, DIP switches and jumpers, fuses, and technical specifications of the MEAC. 10.7 MTAC This describes the functions, panels and structures, indicators, interfaces, DIP switches and jumpers, fuses, and technical specifications of the MTAC.
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10-1
HUAWEI UMG8900 Hardware Description
10 E1/T1 and E3/T3 Interface Units
10.1 ME32 This describes the functions, panels and structures, indicators, interfaces, DIP switches and jumpers, fuses, and technical specifications of the ME32. As the time division multiplex (TDM) service interface board, the ME32s are inserted in back slots 2 to 5 and slots 10 to 15 in the main control frame, and back slots 0 to 5 and slots 10 to 15 in the service frame. The ME32 falls into two types: UG01ME32 and UG02ME32. They are similar in function and appearance. They differ in that the UG01ME32 can be inserted only in SSM-256 frames instead of SSM-32 frames, while the UG02ME32 can be inserted in both. The name silkscreen of the front panel on the UG01ME32 is ME32, while that on the UG02ME32 is ME32b. The ME32 provides the following functions: l
Providing 32 E1 interfaces
l
Providing 32 E1 frames
l
Providing the function of drawing the line signaling of the R2 signaling or inserting the signaling
l
Providing internal FE interfaces to enable operation, maintenance, and management of the main control board
l
Interacting with the main control board through maintenance bus (MBus) modules to monitor board temperature, voltage and control the operations of power-on/off
l
Providing the 8 kHz line clock source for the master/slave clock board from the board panel through clock distribution cables
l
Receiving SSM information from the E1 interface and sending it to the clock system
l
Providing service link loopback at all levels and service channel detection within the board
10.1.1 Panel of the ME32 10.1.2 Indicators on the ME32 10.1.3 Interfaces on the ME32 10.1.4 DIP Switches and Jumpers of the ME32 10.1.5 Fuses on the ME32 10.1.6 Technical specifications of the ME32
10.1.1 Panel of the ME32 Figure 10-1 shows the panel of the ME32.
10-2
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HUAWEI UMG8900 Hardware Description
10 E1/T1 and E3/T3 Interface Units
Figure 10-1 Panel of the ME32 ME32
RUN ALM
J6 F131(3) F132(4)
POWER
MBUS E1/T1_0-15
S5 S12 S14 S11
J16
8K_OUT
S10 J13 S9
J14
E1/T1_16-31
J10 S8 S6
J15 S1 J12
S7
J11
OFFLINE
S15 S13
J20
ME32
J7 J21
10.1.2 Indicators on the ME32 Table 10-1 lists the meaning of the indicators on the ME32. Table 10-1 Indicator meaning of the ME32
Issue 05 (2009-01-09)
Indicator
Identificat ion
Color
Status
Meaning
Running indicator
RUN
Green
Always on
There is power supply, but the board is faulty.
Always off
There is no power supply, or the board is faulty.
Flashing (on for 1 second, off for another second)
The board runs normally in accordance with configuration.
Flashing fast (4 times per second)
Software is being loaded to the board, or the board does not run.
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HUAWEI UMG8900 Hardware Description
10 E1/T1 and E3/T3 Interface Units
Indicator
Identificat ion
Alarm indicator
Hot-pluggable indicator
ALM
OFFLINE
Color
Red
Blue
Status
Meaning
Flashing slowly (on for 2 seconds, off for another 2 seconds)
The board is isolated.
Always on or flashing fast
Alarms occur to the board.
Always off
No fault occurs.
Always on
The board can be removed.
Always off
The board cannot be removed at the moment.
10.1.3 Interfaces on the ME32 Table 10-2 lists the interfaces on the ME32. Table 10-2 Interfaces on the ME32 Category
Quantit y
Physical Interface
Function
Specificatio n
8K_OUT
1
RJ48
Providing the resource of 8 kHz clock signal
RS422
E1/T1_0-15
1
DB100
The 2 M E1 interface in group 0, connecting the E1 cables 0 to 15
-
E1/T1_16-31
1
DB100
The 2 M E1 interface in group 1, connecting the E1 cables 16 to 31
-
10.1.4 DIP Switches and Jumpers of the ME32
CAUTION The 32 E1 cables connected with the ME32 must be of the same characteristic impedance value. That is, one ME32 cannot be connected with both 75-ohm E1 cables and 120-ohm E1 cables. The methods for setting DIP switches for the UG01ME32 and UG02ME32 are slightly different. The following describes how to set the DIP switches. 10-4
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HUAWEI UMG8900 Hardware Description
10 E1/T1 and E3/T3 Interface Units
DIP Switches of the UG01ME32 Table 10-3 lists DIP switches of the UG01ME32. Table 10-3 DIP switches of the UG01ME32 Function
Switch
Bit
Range of E1 Interfaces
Setting the grounding modes for the E1 cables
S2
1 to 8
16 to 23
S3
1 to 8
24 to 31
S4
1 to 8
0 to 7
S5
1 to 8
8 to 15
S6
1 to 8
24 to 27
S7
1 to 8
20 to 23
S8
1 to 8
28 to 31
S9
1 to 8
0 to 3
S10
1 to 8
4 to 7
S11
1 to 8
8 to 11
S12
1 to 8
12 to 15
S13
1 to 8
16 to 19
S14
1 to 2
0 to 31
Setting the impedance values that match the E1 cables
Reporting attribute of the E1 links
The method for setting DIP switches of the UG01ME32 is as follows: l
Method for setting DIP switches for 75-ohm E1 cables Table 10-4 Setting DIP switches of the UG01ME32 (75-ohm E1 coaxial cable)
l
Switch
Bit
Status
S2 to S13
1 to 8
ON
S14
1 to 2
ON
Method for setting DIP switches for 120-ohm E1 cables Table 10-5 Setting DIP switches of the UG01ME32 (120-ohm E1 twisted pair)
Issue 05 (2009-01-09)
Switch
Bit
Status
S2 to S5
1 to 8
OFF
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HUAWEI UMG8900 Hardware Description
10 E1/T1 and E3/T3 Interface Units
Switch
Bit
Status
S6 to S13
1 to 4
OFF
5 to 8
ON
1
OFF
2
ON
S14
DIP Switches of the UG02ME32 Table 10-6 lists DIP switches of the UG02ME32. Table 10-6 DIP switches of the UG02ME32 Function
Switch
Bit
Range of E1 Interfaces
Setting the impedance values that match the E1 cables
S2
1 to 8
20 to 23
S3
1 to 8
24 to 27
S4
1 to 8
28 to 31
S5
1 to 8
0 to 3
S6
1 to 8
4 to 7
S7
1 to 8
8 to 11
S8
1 to 8
12 to 15
S9
1 to 8
16 to 19
S10
1 to 8
16 to 23
S11
1 to 8
8 to 15
S12
1 to 8
0 to 7
S13
1 to 8
24 to 31
S14
1 to 2
0 to 31
Setting the grounding modes for the E1 cables
Reporting attribute of the E1 links
The method for setting DIP switches of the UG02ME32 is as follows: l
Method for setting DIP switches for 75-ohm E1 cables Table 10-7 Setting DIP switches of the UG02ME32 (75-ohm E1 coaxial cable)
10-6
Switch
Bit
Status
S2 to S13
1 to 8
ON
S14
1 to 2
ON
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10 E1/T1 and E3/T3 Interface Units
l
Method for setting DIP switches for 120-ohm E1 cables Table 10-8 Setting DIP switches of the UG02ME32 (120-ohm E1 twisted pair) Switch
Bit
Status
S2 to S9
1 to 4
OFF
5 to 8
ON
S10 to S13
1 to 8
OFF
S14
1
OFF
2
ON
10.1.5 Fuses on the ME32 For details on fuse positions of the UG01ME32, see 10.1.1 Panel of the ME32. Table 10-9 lists the specifications. Table 10-9 Fuses on the ME32 No.
Function
Specification
F131
–48 V power fuse
2A
F132
MBus 5 V power fuse
1A
The fuses on the UG02ME32 are the same as those on the UG01ME32, and the numbers are F133 and F134. For fuse positions, see 10.1.1 Panel of the ME32. Table 10-10 lists the specifications. Table 10-10 Fuses on the ME32 No.
Function
Specification
F133
–48 V power fuse
2A
F134
MBus 5 V power fuse
1A
10.1.6 Technical specifications of the ME32 Table 10-11 lists the technical specifications of the ME32. Table 10-11 Technical specifications of the ME32
Issue 05 (2009-01-09)
Category
Parameter
Specification
Remarks
Power consumption
N/A
19.2 W
–
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HUAWEI UMG8900 Hardware Description
10 E1/T1 and E3/T3 Interface Units
Category
Parameter
Specification
Heat dissipation
N/A
19.2 W
Remarks
10.2 MESU This describes the functions, panels and structures, indicators, interfaces, DIP switches and jumpers, fuses, and technical specifications of the MESU. As the TDM service interface board, the MESUs are inserted in back slots 2 to 5 and slots 10 to 15 in the main control frame, and back slots 0 to 5 and slots 10 to 15 in the service frame. The MESU can be inserted in both SSM-256 frames and SSM-32 frames. The MESU provides the following functions: l
Providing 32 E1 interfaces
l
Providing 32 E1 frames
l
Providing internal FE interfaces to enable operation, maintenance, and management of the main control board
l
Interacting with the main control board through maintenance bus (MBus) modules to monitor board temperature, voltage and control the operations of power-on/off
l
Providing the 8 kHz line clock source for the master/slave clock board from the board panel through clock distribution cables
l
Receiving SSM information from the E1 interface and sending it to the clock system
l
Providing the receiving and transmitting of the No.5 signaling and the register signaling
l
Providing service link loopback at all levels and service channel detection within the board
10.2.1 Panel of the MESU 10.2.2 Indicators on the MESU 10.2.3 Interfaces on the MESU 10.2.4 DIP Switches and Jumpers of the MESU 10.2.5 Fuses on the MESU 10.2.6 Technical specifications of the MESU
10.2.1 Panel of the MESU Figure 10-2 shows the panel of the MESU.
10-8
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HUAWEI UMG8900 Hardware Description
10 E1/T1 and E3/T3 Interface Units
Figure 10-2 Panel of the MESU MESU
RUN ALM
J6 F131 F132
POWER
MBUS E1/T1_0-15
S5 S12 S14 S11
J16
S4 8K_OUT
S10 J22
E1/T1_16-31
S3
J13 S9
J10 S8
S2
J9
J14
S6
J15 S1 J12
S7
J11
OFFLINE
S15 S13
J20
MESU
J7 J21
10.2.2 Indicators on the MESU Table 10-12 lists the meaning of the indicators on the MESU. Table 10-12 Indicator meaning of the MESU
Issue 05 (2009-01-09)
Indicator
Identific ation
Color
Status
Meaning
Running indicator
RUN
Green
Always on
There is power supply, but the board is faulty.
Always off
There is no power supply, or the board is faulty.
Flashing (on for 1 second, off for another second)
The board runs normally in accordance with configuration.
Flashing fast (4 times per second)
Software is being loaded to the board, or the board does not run.
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HUAWEI UMG8900 Hardware Description
10 E1/T1 and E3/T3 Interface Units
Indicator
Alarm indicator
Hot-pluggable indicator
Identific ation
ALM
OFFLINE
Color
Red
Blue
Status
Meaning
Flashing slowly (on for 2 seconds, off for another 2 seconds)
The board is isolated.
Always on or flashing fast
Alarms occur to the board.
Always off
No fault occurs.
Always on
The board can be removed.
Always off
The board cannot be removed at the moment.
10.2.3 Interfaces on the MESU Table 10-13 lists the interfaces on the MESU. Table 10-13 Interfaces on the MESU Category
Quantit y
Physical Interface
Function
Specificat ion
8K_OUT
1
RJ48
Providing the resource of 8 kHz clock signal
RS422
E1/T1_0-15
1
DB100
The 2 M E1 interface in group 0, connecting the E1 cables 0 to 15
-
E1/T1_16-31
1
DB100
The 2 M E1 interface in group 1, connecting the E1 cables 16 to 31
-
10.2.4 DIP Switches and Jumpers of the MESU
CAUTION The 32 E1 cables connected with the MESU must be of the same characteristic impedance value. That is, one MESU cannot be connected with both 75-ohm E1 cables and 120-ohm E1 cables. Table 10-14 lists DIP switches of the MESU.
10-10
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HUAWEI UMG8900 Hardware Description
10 E1/T1 and E3/T3 Interface Units
Table 10-14 DIP switches of the MESU Function
Switch
Bit
Range of E1 Interfaces
Setting the impedance values that match the E1 cables
S2
1 to 8
20 to 23
S3
1 to 8
24 to 27
S4
1 to 8
28 to 31
S5
1 to 8
0 to 3
S6
1 to 8
4 to 7
S7
1 to 8
8 to 11
S8
1 to 8
12 to 15
S9
1 to 8
16 to 19
S10
1 to 8
16 to 23
S11
1 to 8
8 to 15
S12
1 to 8
0 to 7
S13
1 to 8
24 to 31
S14
1 to 2
0 to 31
Setting the grounding modes for the E1 cables
Reporting attribute of the E1 links
The method for setting DIP switches of the MESU is as follows: l
Method for setting DIP switches for 75-ohm E1 cables Table 10-15 Setting DIP switches of the MESU (75-ohm E1 coaxial cable)
l
Switch
Bit
Status
S2 to S13
1 to 8
ON
S14
1 to 2
ON
Method for setting DIP switches for 120-ohm E1 cables Table 10-16 Setting DIP switches of the MESU (120-ohm E1 twisted pair)
Issue 05 (2009-01-09)
Switch
Bit
Status
S2 to S9
1 to 4
OFF
5 to 8
ON
S10 to S13
1 to 8
OFF
S14
1
OFF
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HUAWEI UMG8900 Hardware Description
10 E1/T1 and E3/T3 Interface Units
Switch
Bit
Status
2
ON
10.2.5 Fuses on the MESU For details on fuse positions of the MESU, see 10.2.1 Panel of the MESU. Table 10-17 lists the specifications. Table 10-17 Fuses on the MESU No.
Function
Specification
F133
–48 V power fuse
2A
F134
MBus 5 V power fuse
1A
10.2.6 Technical specifications of the MESU Table 10-18 lists the technical specifications of the MESU. Table 10-18 Technical specifications of the MESU Category
Parameter
Specification
Remarks
Power consumption
N/A
24 W
–
Heat dissipation
N/A
24 W
10.3 MT32 This describes the functions, panels and structures, indicators, interfaces, DIP switches and jumpers, fuses, and technical specifications of the MT32. As the TDM service interface board, the MT32s are inserted in back slots 2 to 5 and slots 10 to 15 in the main control frame, and back slots 0 to 5 and slots 10 to 15 in the service frame. The MT32 falls into two types: UG01MT32 and UG02MT32. They are similar in function and appearance. The difference is that the UG01MT32 can be inserted only in the SSM-256 frame, while the UG02MT32 can be inserted in both the SSM-256 frame and the SSM-32 frame. In appearance, the name silkscreen on the front panel of the UG01MT32 is marked with MT32, and that of the UG02MT32 is marked with MT32b. The MT32 provides the following functions:
10-12
l
Providing 32 T1 interfaces
l
Providing 32 T1 frames
l
Providing the function of extracting or inserting the line signaling of the R2 channel associated signaling (CAS) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd.
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l
Providing internal FE interfaces to enable operation, maintenance, and management of the main control board
l
Interacting with the main control board through maintenance bus (MBus) modules to monitor board temperature, voltage and control the operations of power-on/off
l
Providing the 8 kHz line clock source for the master/slave clock board from the board panel through clock distribution cables
l
Receiving SSM information from the T1 interface and sending it to the clock system
l
Providing service link loopback at all levels and service channel detection within the board
10.3.1 Panel of the MT32 10.3.2 Indicators on the MT32 10.3.3 Interfaces on the MT32 10.3.4 DIP Switches and Jumpers of the MT32 10.3.5 Fuses on the MT32 10.3.6 Technical specifications of the MT32
10.3.1 Panel of the MT32 Figure 10-3 shows the panel of the MT32. Figure 10-3 Panel of the MT32 MT32
RUN ALM
J6 F131(3) F132(4)
POWER
E1/T1_0-15
MBUS S5 S12 S14 J4
S11
J16
E1/T1_16-31
8K_OUT
S4 S10 J13 S3
S9
J3 S6
J15 S1 J12
S7
J11
OFFLINE
S15 S13 MT32
Issue 05 (2009-01-09)
J9 J10
S8
S2
J14
J20
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J7 J21
10-13
HUAWEI UMG8900 Hardware Description
10 E1/T1 and E3/T3 Interface Units
10.3.2 Indicators on the MT32 Table 10-19 lists the meaning of the indicators on the MT32. Table 10-19 Indicator meaning of the MT32 Indicator
Identificat ion
Color
Status
Meaning
Running indicator
RUN
Green
Always on
There is power supply, but the board is faulty.
Always off
There is no power supply, or the board is faulty.
Flashing (on for 1 second, off for another second)
The board runs normally in accordance with configuration.
Flashing fast (4 times per second)
Software is being loaded to the board, or the board does not run.
Flashing slowly (on for 2 seconds, off for another 2 seconds)
The board is isolated.
Always on or flashing fast
Alarms occur to the board.
Always off
No fault occurs.
Always on
The board can be removed.
Always off
The board cannot be removed at the moment.
Alarm indicator
Hot-pluggable indicator
ALM
OFFLINE
Red
Blue
10.3.3 Interfaces on the MT32 Table 10-20 lists the interfaces on the MT32. Table 10-20 Interfaces on the MT32
10-14
Category
Quantity
Physical Interface
Function
Specificati on
8K_OUT
1
RJ48
Providing the resource of 8 kHz clock signal
RS422
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10 E1/T1 and E3/T3 Interface Units
Category
Quantity
Physical Interface
Function
Specificati on
E1/T1_0-15
1
DB100
The T1 interface in group 0, connecting the T1 cables 0 to 15
-
E1/T1_16-31
1
DB100
The T1 interface in group 1, connecting the T1 cables 16 to 31
-
10.3.4 DIP Switches and Jumpers of the MT32 DIP Switches and Jumpers of the UG01MT32 Table 10-21 lists DIP switches of the UG01MT32. Table 10-21 DIP switches of the UG01MT32 Function
Switch
Bit
Range of E1 Interfaces
Setting the grounding modes for the E1 cables
S2
1 to 8
16 to 23
S3
1 to 8
24 to 31
S4
1 to 8
0 to 7
S5
1 to 8
8 to 15
S6
1 to 8
24 to 27
S7
1 to 8
20 to 23
S8
1 to 8
28 to 31
S9
1 to 8
0 to 3
S10
1 to 8
4 to 7
S11
1 to 8
8 to 11
S12
1 to 8
12 to 15
S13
1 to 8
16 to 19
S14
1 to 2
0 to 31
Setting the impedance values that match the E1 cables
Reporting attribute of the E1 links
Table 10-22 lists the method for setting DIP switches of the UG01MT32.
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10-15
HUAWEI UMG8900 Hardware Description
10 E1/T1 and E3/T3 Interface Units
Table 10-22 Setting DIP switches of the UG01MT32 (100-ohm T1 cable) Switch
Bit
Status
S2 to S5
1 to 8
OFF
S6 to S13
1 to 4
ON
5 to 8
OFF
1
ON
2
OFF
S14
DIP Switches of the UG02MT32 Table 10-23 lists DIP switches of the UG02MT32. Table 10-23 DIP switches of the UG02MT32 Function
Switch
Bit
Range of E1 Interfaces
Setting the impedance values that match the E1 cables
S2
1 to 8
20 to 23
S3
1 to 8
24 to 27
S4
1 to 8
28 to 31
S5
1 to 8
0 to 3
S6
1 to 8
4 to 7
S7
1 to 8
8 to 11
S8
1 to 8
12 to 15
S9
1 to 8
16 to 19
S10
1 to 8
16 to 23
S11
1 to 8
8 to 15
S12
1 to 8
0 to 7
S13
1 to 8
24 to 31
S14
1 to 2
0 to 31
Setting the grounding modes for the E1 cables
Reporting attribute of the E1 links
Table 10-24 lists the method for setting DIP switches of the UG02MT32. Table 10-24 Setting DIP switches of the UG02MT32 (100-ohm T1 cable)
10-16
Switch
Bit
Status
S2 to S9
1 to 4
ON
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Switch
Bit
Status
5 to 8
OFF
S10 to S13
1 to 8
OFF
S14
1
ON
2
OFF
10.3.5 Fuses on the MT32 For details on fuse positions of the UG01MT32, see 10.3.1 Panel of the MT32. Table 10-25 lists the specifications. Table 10-25 Fuses on the UG01MT32 No.
Function
Specification
F131
–48 V power fuse
2A
F132
MBus 5 V power fuse
1A
The fuses on the UG02MT32 are the same as those on the UG01MT32, and the numbers are F133 and F134. For fuse positions, see 10.3.1 Panel of the MT32. Table 10-26 lists the specifications. Table 10-26 Fuses on the MT32 No.
Function
Specification
F133
–48 V power fuse
2A
F134
MBus 5 V power fuse
1A
10.3.6 Technical specifications of the MT32 Table 10-27 lists the technical specifications of the MT32. Table 10-27 Technical specifications of the MT32 Category
Parameter
Specification
Remarks
Power consumption
N/A
19.2 W
–
Heat dissipation
N/A
19.2 W
10.4 MTSU This describes the functions, panels and structures, indicators, interfaces, DIP switches and jumpers, fuses, and technical specifications of the MTSU. Issue 05 (2009-01-09)
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HUAWEI UMG8900 Hardware Description
10 E1/T1 and E3/T3 Interface Units
As the TDM service interface board, the MTSUs are inserted in back slots 2 to 5 and slots 10 to 15 in the main control frame, and back slots 0 to 5 and slots 10 to 15 in the service frame. The MTSU can be inserted in both SSM-256 frames and SSM-32 frames. The MTSU provides the following functions: l
Providing 32 T1 interfaces
l
Providing 32 T1 frames
l
Providing internal FE interfaces to enable operation, maintenance, and management of the main control board
l
Interacting with the main control board through maintenance bus (MBus) modules to monitor board temperature, voltage and control the operations of power-on/off
l
Providing the 8 kHz line clock source for the master/slave clock board from the board panel through clock distribution cables
l
Receiving SSM information from the T1 interface and sending it to the clock system
l
Providing the receiving and transmitting of the No.5 signaling and the register signaling
l
Providing service link loopback at all levels and service channel detection within the board
10.4.1 Panel of the MTSU 10.4.2 Indicators on the MTSU 10.4.3 Interfaces on the MTSU 10.4.4 DIP Switches and Jumpers of the MTSU 10.4.5 Fuses on the MTSU 10.4.6 Technical specifications of the MTSU
10.4.1 Panel of the MTSU Figure 10-4 shows the panel of the MTSU.
10-18
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HUAWEI UMG8900 Hardware Description
10 E1/T1 and E3/T3 Interface Units
Figure 10-4 Panel of the MTSU MTSU
RUN ALM
J6 F131(3) F132(4)
POWER
MBUS E1/T1_0-15
S5 S12 S14 J4
S11
J16
S4 8K_OUT
S10 J22 S3
J13 S9
J8
E1/T1_16-31
S8
J10
J15
J3 S2
J9
J14
S1
S6
J12 S7
J11
OFFLINE
S15 S13
J20
MTSU
J7 J21
10.4.2 Indicators on the MTSU Table 10-28 lists the meaning of the indicators on the MTSU. Table 10-28 Indicator meaning of the MTSU
Issue 05 (2009-01-09)
Indicator
Identificat ion
Color
Status
Meaning
Running indicator
RUN
Green
Always on
There is power supply, but the board is faulty.
Always off
There is no power supply, or the board is faulty.
Flashing (on for 1 second, off for another second)
The board runs normally in accordance with configuration.
Flashing fast (4 times per second)
Software is being loaded to the board, or the board does not run.
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HUAWEI UMG8900 Hardware Description
10 E1/T1 and E3/T3 Interface Units
Indicator
Alarm indicator
Hot-pluggable indicator
Identificat ion
ALM
OFFLINE
Color
Red
Blue
Status
Meaning
Flashing slowly (on for 2 seconds, off for another 2 seconds)
The board is isolated.
Always on or flashing fast
Alarms occur to the board.
Always off
No fault occurs.
Always on
The board can be removed.
Always off
The board cannot be removed at the moment.
10.4.3 Interfaces on the MTSU Table 10-29 lists the interfaces on the MTSU. Table 10-29 Interfaces on the MTSU Category
Quantity
Physical Interface
Function
Specification
8K_OUT
1
RJ48
Providing the resource of 8 kHz clock signal
RS422
E1/T1_0-15
1
DB100
The T1 interface in group 0, connecting the T1 cables 0 to 15
-
E1/T1_16-31
1
DB100
The T1 interface in group 1, connecting the T1 cables 16 to 31
-
10.4.4 DIP Switches and Jumpers of the MTSU Table 10-30 lists DIP switches of the MTSU. Table 10-30 DIP switches of the MTSU
10-20
Function
Switch
Bit
Range of E1 Interfaces
Setting the impedance values that match the T1 cables
S2
1 to 8
20 to 23
S3
1 to 8
24 to 27
S4
1 to 8
28 to 31
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Function
Setting the grounding modes for the T1 links
Reporting attribute of the T1 links
Switch
Bit
Range of E1 Interfaces
S5
1 to 8
0 to 3
S6
1 to 8
4 to 7
S7
1 to 8
8 to 11
S8
1 to 8
12 to 15
S9
1 to 8
16 to 19
S10
1 to 8
16 to 23
S11
1 to 8
8 to 15
S12
1 to 8
0 to 7
S13
1 to 8
24 to 31
S14
1 to 2
0 to 31
Table 10-31 lists the method for setting DIP switches of the MTSU. Table 10-31 Setting DIP switches of the MTSU (100-ohm T1 cable) Switch
Bit
Status
S2 to S9
1 to 4
ON
5 to 8
OFF
S10 to S13
1 to 8
OFF
S14
1
ON
2
OFF
10.4.5 Fuses on the MTSU For details on fuse positions of the MTSU, see 10.4.1 Panel of the MTSU. Table 10-32 lists the specifications. Table 10-32 Fuses on the MTSU No.
Function
Specification
F133
–48 V power fuse
2A
F134
MBus 5 V power fuse
1A
10.4.6 Technical specifications of the MTSU Issue 05 (2009-01-09)
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10 E1/T1 and E3/T3 Interface Units
Table 10-33 lists the technical specifications of the MTSU. Table 10-33 Technical specifications of the MTSU Category
Parameter
Specification
Remarks
Power consumption
N/A
24 W
–
Heat dissipation
N/A
24 W
10.5 MPIE This describes the functions, panels and structures, indicators, interfaces, DIP switches and jumpers, fuses, and technical specifications of the MPIE. As the TDM service interface board, the MPIEs are inserted in back slots 2 to 5 and slots 10 to 15 in the main control frame, and back slots 0 to 5 and slots 10 to 15 in the service frame. You can set the work mode to either master/slave mode or load-sharing mode; however, you can only choose one work mode at one time. The MPIE can be inserted in both SSM-256 frames and SSM-32 frames. The MPIE provides the following functions: l
Providing three PDH electrical interfaces of E3/T3 that carry TDM services
l
Providing the HDB3/B3ZS codec through each E3/T3.
l
Multiplexing 16 E1s/28 T1s/21 E1s to one E3/T3/G.747 and demultiplexing one E3/T3/G. 747 to 16 E1s/28 T1s/21 E1s respectively
l
Providing the function of extracting and inserting channel associated signaling (CAS)
l
Providing the 8 kHz line clock source for the master/slave clock board from the board panel through clock distribution cables
l
Supporting the extraction of the SSM information and sending it to the clock system
l
Supporting receiving the SSM message from the clock system, and connecting to the interface
l
Providing service link loopback at all levels and service channel detection within the board NOTE
When the interface type of the MPIE is set to T3 or G.747, and the transmission distance is required to be longer than 68.5 m [75 yd.], the communication distance is set to long.
10.5.1 Panel of the MPIE 10.5.2 Indicators on the MPIE 10.5.3 Interfaces on the MPIE 10.5.4 Fuses on the MPIE 10.5.5 Technical specifications of the MPIE 10.5.6 MPIE Subboards
10.5.1 Panel of the MPIE Figure 10-5 shows the panel of the MPIE. 10-22
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HUAWEI UMG8900 Hardware Description
10 E1/T1 and E3/T3 Interface Units
Figure 10-5 Panel of the MPIE MPIE
F4
POWER
J4
F2 F1 F3
RUN ALM ACT T AC
T AC
NK LI 0 TX
MBUS
0 RX NK I L 1 TX
8K_OUT
1 RX
T AC
J11 NK LI 2 X T
s1
COM0
2 RX
U70
J10
OFFLINE
J5
J6
CPU
MPIE
10.5.2 Indicators on the MPIE Table 10-34 lists the meaning of the indicators on the MPIE. Table 10-34 Indicator meaning of the MPIE
Issue 05 (2009-01-09)
Indicator
Identificat ion
Color
Status
Meaning
Running indicator
RUN
Green
Always on
There is power supply, but the board is faulty.
Always off
There is no power supply, or the board is faulty.
Flashing (on for 1 second, off for another second)
The board runs normally in accordance with configuration.
Flashing fast (4 times per second)
The board is being loaded or it does not work.
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HUAWEI UMG8900 Hardware Description
10 E1/T1 and E3/T3 Interface Units
Indicator
Alarm indicator
Working indicator
Service interface link connection indicator
Identificat ion
ALM
ACT
LINK
Service interface master indicator
ACT
Hot-pluggable indicator
OFFLINE
Color
Red
Green
Green
Orange
Blue
Status
Meaning
Flashing slowly (on for 2 seconds, off for another 2 seconds)
The board is isolated.
Always on or flashing fast
Alarms occur to the board.
Always off
The board is out of service such as in the slave state.
Flashing
The board is in service such as in the master state.
Always off
The board is out of service such as in the slave state.
Always on
The line is in the synchronous state and the line specifications meet the requirements.
Always off
The line is in the asynchronous state and the line specifications do not meet the requirements.
Always on or flashing
The interface is in master state.
Always off
The interface is in slave state.
Always on
The board can be removed.
Always off
The board cannot be removed at the moment.
10.5.3 Interfaces on the MPIE Table 10-35 lists the interfaces on the MPIE.
10-24
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Table 10-35 Interfaces on the MPIE Category
Quantity
Physical Interface
Function
Specification
COM0
1
RJ48
Used as a debug serial port
RS232 serial port
8K_OUT
1
RJ48
Providing the output interface of 8 kHz clock signal
RS422
Service interface
3
BNC electrical interface
Providing three PDH service interfaces of E3/T3, that is, electrical interfaces
E3, T3 and G.747
10.5.4 Fuses on the MPIE For details on fuse positions of the MPIE, see 10.5.1 Panel of the MPIE. Table 10-36 lists the specifications. Table 10-36 Fuses on the MPIE No.
Function
Specification
F1
–48 V power fuse
3A
F2
–48 V power fuse
3A
F3
MBus 5 V power fuse
1A
F4
–48 V power fuse
2A
10.5.5 Technical specifications of the MPIE Table 10-37 lists the technical specifications of the MPIE. Table 10-37 Technical specifications of the MPIE Category
Parameter
Specification
Remarks
Power consumption
N/A
23.4 W
–
Heat dissipation
N/A
23.4 W
10.5.6 MPIE Subboards Up to three ME3A subboards can be configured on the MPIE. The ME3A subboard is mainly used to multiplex and demultiplex an E3/T3 interface. Table 10-38 lists the technical specifications of the ME3A subboard. Issue 05 (2009-01-09)
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HUAWEI UMG8900 Hardware Description
10 E1/T1 and E3/T3 Interface Units
Table 10-38 Technical specifications of the ME3A subboard Category
Parameter
Specification
Remarks
Power consumption
N/A
6W
–
Heat dissipation
N/A
6W
10.6 MEAC This describes the functions, panels and structures, indicators, interfaces, DIP switches and jumpers, fuses, and technical specifications of the MEAC. As the 32-port E1 interface board, the MEAC is inserted in back slots 2 to 5 and slots 10 to 15 in the main control frame, and back slots 0 to 5 and slots 10 to 15 in the service frame. The MEAC is inserted with the MASU in front-and-back mode. The MEAC can be inserted in both SSM-256 frames and SSM-32 frames. The MEAC provides the following functions: l
Providing 32 E1 interfaces
l
Providing 32 E1 frames
l
Supporting 32 IMA groups, each of which supports up to 32 links
l
Providing 8 kHz clock reference source for the master and slave CLKs
l
Conducting all-level loopback on service links
l
Supporting self-recovering software and locating faults NOTE
The MASU provides a dedicated maintenance bus (MBus) module, but no internal FE interface. Therefore, the main control board operates and maintains the back interface board through the front MASU
10.6.1 Panel of the MEAC 10.6.2 Indicators on the MEAC 10.6.3 Interfaces on the MEAC 10.6.4 DIP Switches on the MEAC 10.6.5 Fuses on the MEAC 10.6.6 Technical specifications of the MEAC
10.6.1 Panel of the MEAC Figure 10-6 shows the panel of the MEAC.
10-26
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10 E1/T1 and E3/T3 Interface Units
Figure 10-6 Panel of the MEAC MEAC
RUN ALM
J6 F131(3) F132(4)
POWER
MBUS E1/T1_0-15
S5 S12 S14 S11
J16
S4 8K_OUT
S10 J13
E1/T1_16-31
S3
S9
J14
J10 S8
S2
J9
J15 S1
S6
J12 S7
J11
OFFLINE
S15 S13
J20
MEAC
J7 J21
10.6.2 Indicators on the MEAC Table 10-39 lists the meaning of the indicators on the MEAC. Table 10-39 Indicator meaning of the MEAC
Issue 05 (2009-01-09)
Indicator
Identific ation
Color
Status
Meaning
Board running indicator
RUN
Green
Always on
There is power supply, but the board is faulty.
Always off
There is no power supply, or the board is faulty.
Flashing (on for 1 second, off for another second)
The board runs normally in accordance with configuration.
Flashing fast (4 times per second)
Software is being loaded to the board, or the board does not run.
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HUAWEI UMG8900 Hardware Description
10 E1/T1 and E3/T3 Interface Units
Indicator
Identific ation
Color
Status
Meaning
Board alarm indicator
ALM
Red
Always on or flashing fast
Alarms occur to the board.
Always off
No fault occurs.
Flashing
The board is in service such as in the master state.
Always off
The board is out of service such as in the slave state.
Always on
The board can be removed.
Always off
The board cannot be removed at the moment.
Board master indicator
Hot-pluggable indicator
ACT
OFFLINE
Green
Blue
10.6.3 Interfaces on the MEAC Table 10-40 lists the interfaces on the MEAC. Table 10-40 Interfaces on the MEAC Category
Quantity
Physical Interface
Function
Specificatio n
8K_OUT
1
RJ48
Providing the resource of 8 kHz clock signal
RS422
E1/T1_0-15
1
DB100
The 2 M E1 interface in group 0, connecting the E1 cables 0 to 15
-
E1/T1_16-31
1
DB100
The 2 M E1 interface in group 1, connecting the E1 cables 16 to 31
-
10.6.4 DIP Switches on the MEAC Table 10-41 lists DIP switches on the MEAC. Table 10-41 DIP switches of the MEAC
10-28
Function
Switch
Bit
Range of E1 Interfaces
Resetting the switch manually
S1
1
Resetting the board
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Function
Switch
Bit
Range of E1 Interfaces
Setting the grounding modes for the E1 cables
S5
1 to 8
0 to 7
S6
1 to 8
8 to 15
S7
1 to 8
16 to 23
S8
1 to 8
24 to 31
S9
1 to 8
0 to 3
S10
1 to 8
4 to 7
S11
1 to 8
8 to 11
S12
1 to 8
12 to 15
S13
1 to 8
16 to 19
S14
1 to 8
20 to 23
S15
1 to 8
24 to 27
S16
1 to 8
28 to 31
Setting the impedance values that match the E1 cables
The method for setting DIP switches of the MEAC is as follows: l
Method for setting DIP switches for 75-ohm E1 cables Table 10-42 Setting DIP switches of the MEAC (75-ohm E1 coaxial cable)
l
Switch
Bit
Status
S5 to S8
1 to 8
ON
S9 to S16
1 to 8
ON
Method for setting DIP switches for 120-ohm E1 cables Table 10-43 Setting DIP switches of the MEAC (120-ohm E1 twisted pair) Switch
Bit
Status
S5 to S8
1 to 8
OFF
S9 to S16
1 to 4
OFF
5 to 8
ON
10.6.5 Fuses on the MEAC For details on fuse positions of the MEAC, see 10.6.1 Panel of the MEAC. Table 10-44 lists the specifications. Issue 05 (2009-01-09)
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10 E1/T1 and E3/T3 Interface Units
Table 10-44 Fuses on the MEAC No.
Function
Specification
F131
–48 V power fuse
2A
F132
MBus 5 V power fuse
1A
10.6.6 Technical specifications of the MEAC Table 10-45 lists the technical specifications of the MEAC. Table 10-45 Technical specifications of the MEAC Category
Parameter
Specification
Remarks
Power consumption
N/A
12.8 W
–
Heat dissipation
N/A
12.8 W
Interfaces
Transmission distance
Supporting long and short transmission. Long cable: 1500 m [4921 ft.]; Short cable: 400 m [1312 ft.]
Transmission cable
E1: 120-ohm twisted pair and 75ohm coaxial cable
IMA
IMA1.1 protocol, compatible with 1.0, supporting 32 IMA groups
Interface capability
32 E1 interfaces
Transmission code
HDB3, AMI
Maximum receive sensitivity
–43 dB/1024 kHz
Electromagnetic characteristics
CLASS B
–
10.7 MTAC This describes the functions, panels and structures, indicators, interfaces, DIP switches and jumpers, fuses, and technical specifications of the MTAC. As the 32-port IMA T1 service interface card, the MEACs are inserted in back slots 2 to 5 and slots 10 to 15 in the main control frame, and back slots 0 to 5 and slots 10 to 15 in the service frame. The MTACs can be inserted in both SSM-256 frames and SSM-32 frames. The MTAC provides the following functions: l
10-30
Providing 32 T1 interfaces Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd.
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10 E1/T1 and E3/T3 Interface Units
l
Providing 32 T1 frames
l
Supporting 32 IMA groups, each of which supports up to 32 links
l
Providing 8 kHz clock reference source for the master and slave CLKs
l
Conducting all-level loopback on service links
l
Supporting self-recovering software and locating faults NOTE
The MASU provides a dedicated maintenance bus (MBus) module on the back interface board, but internal FE interface is unavailable. Therefore, the main control board operates and maintains the back interface board through the front MASU.
10.7.1 Panel of the MTAC 10.7.2 Indicators on the MTAC 10.7.3 Interfaces on the MTAC 10.7.4 DIP Switches and Jumpers of the MTAC 10.7.5 Fuses on the MTAC 10.7.6 Technical specifications of the MTAC
10.7.1 Panel of the MTAC Figure 10-7 shows the panel of the MTAC. Figure 10-7 Panel of the MTAC MTAC
RUN ALM
J6 F131(3) F132(4)
POWER
E1/T1_0-15
MBUS S5 S12 S14 S11
J16
E1/T1_16-31
8K_OUT
S4 S10 J13 S3
S9
S6
J15 S1 J12
S7
J11
OFFLINE
S15 S13 MTAC
Issue 05 (2009-01-09)
J9 J10
S8
S2
J14
J20
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J7 J21
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10 E1/T1 and E3/T3 Interface Units
10.7.2 Indicators on the MTAC Table 10-46 lists the indicator meaning of the MTAC. Table 10-46 Indicator meaning of the MTAC Indicator
Identificat ion
Color
Status
Meaning
Board running indicator
RUN
Green
Always on
There is power supply, but the board is faulty.
Always off
There is no power supply, or the board is faulty.
Flashing (on for 1 second, off for another second)
The board runs normally in accordance with configuration.
Flashing fast (4 times per second)
Software is being loaded to the board, or the board does not run.
Always on or flashing fast
Alarms occur to the board.
Always off
No fault occurs.
Always on or flashing
The board is in service such as in the master state.
Always off
The board is out of service such as in the slave state.
Always on
The board can be removed.
Always off
The board cannot be removed at the moment.
Board alarm indicator
Board master indicator
Hot-pluggable indicator
ALM
ACT
OFFLINE
Red
Green
Blue
10.7.3 Interfaces on the MTAC Table 10-47 lists the interfaces on the MTAC.
10-32
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Table 10-47 Interfaces on the MTAC Category
Quantity
Physical Interface
Function
Specificatio n
8K_OUT
1
RJ48
Providing the resource of 8 kHz clock signal
RS422
E1/T1_0-15
1
DB100
The T1 interface in group 0, connecting the T1 cables 0 to 15
-
E1/T1_16-31
1
DB100
The T1 interface in group 1, connecting the T1 cables 16 to 31
-
10.7.4 DIP Switches and Jumpers of the MTAC Table 10-48 lists DIP switches of the MTAC. Table 10-48 DIP switches of the MTAC Function
Switch
Bit
Range of E1 Interfaces
Resetting the switch manually
S1
1
Resetting the board
Setting the grounding modes for the T1 cables
S5
1 to 8
0 to 7
S6
1 to 8
8 to 15
S7
1 to 8
16 to 23
S8
1 to 8
24 to 31
S9
1 to 8
0 to 3
S10
1 to 8
4 to 7
S11
1 to 8
8 to 11
S12
1 to 8
12 to 15
S13
1 to 8
16 to 19
S14
1 to 8
20 to 23
S15
1 to 8
24 to 27
S16
1 to 8
28 to 31
Setting the impedance values that match the T1 cables
Table 10-49 lists the method for setting DIP switches of the MTAC.
Issue 05 (2009-01-09)
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10-33
HUAWEI UMG8900 Hardware Description
10 E1/T1 and E3/T3 Interface Units
Table 10-49 Setting DIP switches of the MTAC (100-ohm T1 cable) Switch
Bit
Status
S5 to S8
1 to 8
OFF
S9 to S16
1 to 4
ON
5 to 8
OFF
10.7.5 Fuses on the MTAC For details on fuse positions of the MTAC, see 10.7.1 Panel of the MTAC. Table 10-50 lists the specifications. Table 10-50 Fuses on the MTAC No.
Function
Specification
F131
–48 V power fuse
2A
F132
MBus 5 V power fuse
1A
10.7.6 Technical specifications of the MTAC Table 10-51 lists the technical specifications of the MTAC. Table 10-51 Technical specifications of the MTAC
10-34
Category
Parameter
Specification
Remarks
Power consumption
N/A
12.8 W
–
Heat dissipation
N/A
12.8 W
Interfaces
Transmission distance
Supporting long and short transmission. Long cable: 1500 m [4921 ft.]; Short cable: 400 m [1312 ft.]
Transmission cable
T1: 120-ohm twisted pair
IMA
IMA1.1 protocol, compatible with 1.0, supporting 32 IMA groups
Interface capability
32 T1 interfaces
Transmission code
HDB3, AMI
Maximum receive sensitivity
–43 dB/1024 kHz
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HUAWEI UMG8900 Hardware Description
10 E1/T1 and E3/T3 Interface Units
Category
Issue 05 (2009-01-09)
Parameter
Specification
Electromagnetic characteristics
CLASS B
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Remarks
10-35
HUAWEI UMG8900 Hardware Description
11 SDH Interface Units
11
SDH Interface Units
About This Chapter The SDH interface units consist of MS2L, MS2E, MS1L, and MS1E. 11.1 MS2L This describes the functions, panels and structures, indicators, interfaces, DIP switches and jumpers, fuses, and technical specifications of the MS2L. 11.2 MS2E This describes the functions, panels and structures, indicators, interfaces, DIP switches and jumpers, fuses, and technical specifications of the MS2E. 11.3 MS1L This describes the functions, panels and structures, indicators, interfaces, DIP switches and jumpers, fuses, and technical specifications of the MS1L. 11.4 MS1E This describes the functions, panels and structures, indicators, interfaces, DIP switches and jumpers, fuses, and technical specifications of the MS1E.
Issue 05 (2009-01-09)
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11-1
HUAWEI UMG8900 Hardware Description
11 SDH Interface Units
11.1 MS2L This describes the functions, panels and structures, indicators, interfaces, DIP switches and jumpers, fuses, and technical specifications of the MS2L. As the TDM service interface board, the MS2Ls are inserted in back slots 2 to 5 and slots 10 to 15 in the main control frame, and back slots 0 to 5 and slots 10 to 15 in the service frame. In the SSM-32 frame, if the clock subboard of the MTNC provides the system clock, then the MS2L can be inserted in any slot of back slots 0 to 5 in the main control frame. The MS2L can work in master and slave backup mode or load-sharing mode. The MS2L provides the following functions: l
Extracting clock signals and forming frames at the two 155 Mbit/s SDH optical interfaces; providing interfaces with pluggable optical modules enabling different transmission distances
l
Processing overheads of regenerator section and multiplex section of optical signals and checking communication over optical channels
l
Implementing SDH mapping, de-mapping and processing overheads of high-order path and low-order path
l
Forming 2 x 63 E1 or 2 x 84 T1 frames and performing DS0 switch
The MS2L falls into two types: the UG01MS2L and UG02MS2L. The difference between two types is as follows: l
The UG01MS2L can be used only in the SSM-256 frame.
l
The UG02MS2L can be used in the SSM-256 frame and the SSM-32 frame. The silkscreen on the ejector level of the UG02MS2L is MS2Lb.
11.1.1 Panel of the MS2L 11.1.2 Indicators on the MS2L 11.1.3 Interfaces on the MS2L 11.1.4 Fuses on the MS2L 11.1.5 Technical Specifications of the MS2L
11.1.1 Panel of the MS2L Figure 11-1 shows the panel of the MS2L.
11-2
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11 SDH Interface Units
Figure 11-1 Panel of the MS2L MS2L F1
Power
RUN ALM ACT AC
T
MBUS NK LI 0 TX 0 RX NK LI 1 TX 1 RX
F2
J12
Framer U22 J10
J16
Framer U23
U34
FPGA
8K_OUT
AC
T
J5
J18
Switch
CPLD U31
S1
J17
MAC
COM0
J7
Flash
MAC
CPU U57
OFFLINE
MAC
MS2L
11.1.2 Indicators on the MS2L Table 11-1 lists the meaning of the indicators on the MS2L. Table 11-1 Indicator meaning of the MS2L
Issue 05 (2009-01-09)
Indicator
Identificat ion
Color
Status
Meaning
Board running indicator
RUN
Green
Always on
There is power supply, but the board is faulty.
Always off
There is no power supply, or the board is faulty.
Flashing (on for 1 second, off for another second)
The board runs normally in accordance with configuration.
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HUAWEI UMG8900 Hardware Description
11 SDH Interface Units
Indicator
Board alarm indicator
Board master indicator
Service interface link connection indicator
Identificat ion
ALM
ACT
LINK
Service interface master indicator
ACT
Hot-pluggable indicator
OFFLINE
Color
Red
Green
Green
Orange
Blue
Status
Meaning
Flashing fast (4 times per second)
Software is being loaded to the board, or the board does not run.
Flashing slowly (on for 2 seconds, off for another 2 seconds)
The board is isolated.
Always on or flashing fast
Alarms occur to the board.
Always off
No fault occurs.
Always on or flashing
The board is in service such as in the master state.
Always off
The board is out of service such as in the slave state or in loadsharing mode.
Always on
The line is in the synchronous state and the line specifications and optical power meet the requirements.
Always off
The line is in the asynchronous state and the line specifications and optical power do not meet the requirements.
Always on or flashing
The interface is in master state.
Always off
The interface is in slave state.
Always on
The board can be removed.
Always off
The board cannot be removed at the moment.
11.1.3 Interfaces on the MS2L Table 11-2 lists the interfaces on the MS2L.
11-4
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11 SDH Interface Units
Table 11-2 Interfaces on the MS2L Category
Quantity
Physical Interface
Function
Specification
COM0
1
RJ48
Used as a debug serial port
RS232 serial port
8K_OUT
1
RJ48
Providing the output interface of 8 kHz clock signal
RS422
Service interface
2
-
Providing two 155 Mbit/ s SDH service interfaces
STM-1
11.1.4 Fuses on the MS2L For details on fuse positions of the MS2L, see 11.1.1 Panel of the MS2L. Table 11-3 lists the specifications. Table 11-3 Fuses on the MS2L No.
Function
Specification
F1
–48 V power fuse
2A
F2
MBus 5 V power fuse
1A
11.1.5 Technical Specifications of the MS2L Table 11-4 to Table 11-6 list the technical specifications of the MS2L. Table 11-4 Technical specifications of the MS2L
Issue 05 (2009-01-09)
Categor y
Parameter
Specification
Interface s
Transmissio n distance
2 km [1.2 mi.]
15 km [9.3 mi.]
40 km [24.9 mi.]
80 km [49.7 mi.]
Mode
Multimode
Singlemode
Singlemode
Singlemode
Wavelength
1310 nm
1310 nm
1310 nm
1550 nm
Output optical power
–19 dBm to –14 dBm
–15 dBm to –8 dBm
–5 dBm to 0 dBm
–5 dBm to 0 dBm
Maximum receive sensitivity
–30 dBm
–28 dBm
–34 dBm
–34 dBm
Remark s
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11-5
HUAWEI UMG8900 Hardware Description
11 SDH Interface Units
Categor y
Parameter
Specification
Saturation optical power
–14.0 dBm
Remark s
–7.0 dBm
–9.0 dBm
–10.0 dBm
Table 11-5 Power consumption and heat dissipation of the UG01MS2L Category
Parameter
Specification
Remarks
Power consumption
N/A
25 W
-
Heat dissipation
N/A
25 W
Table 11-6 Power consumption and heat dissipation of the UG02MS2L Category
Parameter
Specification
Remarks
Power consumption
N/A
21.5 W
-
Heat dissipation
N/A
21.5 W
NOTE
l
All optical fiber interface boards are identical in appearance. They use different optical modules. You can query the optical module type of a board with LST OPTINFO.
l
The receiving power of the optical module must be greater than the maximum receive sensitivity and less than the saturation optical power. Excessively low receiving power may cause bit errors, which destabilizes the service. Excessive receiving power may cause damage to optical modules.
11.2 MS2E This describes the functions, panels and structures, indicators, interfaces, DIP switches and jumpers, fuses, and technical specifications of the MS2E. As the time division multiplex (TDM) service interface board, the MS2Es are inserted in back slots 2 to 5 and slots 10 to 15 in the main control frame, and back slots 0 to 5 and slots 10 to 15 in the service frame. In the SSM-32 frame, if the clock subboard of the MTNC provides the system clock, then the MS2E can be inserted in any slot of back slots 0 to 5 in the main control frame. The MS2E can work in the master and slave backup mode or the load-sharing mode. The MS2E provides the following functions: l
Extracting clock signals and forming frames at the two 155 Mbit/s SDH electrical interfaces
l
Processing overheads of regenerator section and multiplex section of optical signals and checking communication over optical channels
l
Implementing SDH mapping, de-mapping and processing overheads of high-order path and low-order path
l
Forming 2 x 63 E1 or 2 x 84 T1 frames and performing DS0 switch
The MS2E falls into two types: UG01MS2E and UG02MS2E. The difference between two types is as follows: 11-6
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HUAWEI UMG8900 Hardware Description
11 SDH Interface Units
l
The UG01MS2E can be used only in the SSM-256 frame.
l
The UG02MS2E can be used in the SSM-256 frame and the SSM-32 frame. The silkscreen on the ejector level of the UG02MS2E is MS2Eb.
11.2.1 Panel of the MS2E 11.2.2 Indicators on the MS2E 11.2.3 Interfaces on the MS2E 11.2.4 Fuses on the MS2E 11.2.5 Technical Specifications of the MS2E
11.2.1 Panel of the MS2E Figure 11-2 shows the panel of the MS2E. Figure 11-2 Panel of the MS2E MS2E F1
Power
RUN ALM ACT T AC
0 TX NK LI 0 RX
1 TX NK LI 1 RX
8K_OUT
T AC
J5
MBUS T8
F2
Framer U22 J10
T9
Framer U23
U34
FPGA J18
Switch
CPLD U31
S1
COM0
J17
MAC
J7
Flash
MAC
CPU U57
OFFLINE
MAC
MS2E
11.2.2 Indicators on the MS2E Table 11-7 lists the meaning of the indicators on the MS2E. Issue 05 (2009-01-09)
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11-7
HUAWEI UMG8900 Hardware Description
11 SDH Interface Units
Table 11-7 Indicator meaning of the MS2E Indicator
Identificat ion
Color
Status
Meaning
Board running indicator
RUN
Green
Always on
There is power supply, but the board is faulty.
Always off
There is no power supply, or the board is faulty.
Flashing (on for 1 second, off for another second)
The board runs normally in accordance with configuration.
Flashing fast (4 times per second)
Software is being loaded to the board, or the board does not run.
Flashing slowly (on for 2 seconds, off for another 2 seconds)
The board is isolated.
Always on or flashing fast
Alarms occur to the board.
Always off
No fault occurs.
Always on or flashing
The board is in service such as in the master state.
Always off
The board is out of service such as in the slave state or in loadsharing mode.
Always on
The line is in the synchronous state and the line specifications meet the requirements.
Always off
The line is in the asynchronous state and the line specifications do not meet the requirements.
Always on or flashing
The interface is in master state.
Always off
The interface is in slave state.
Always on
The board can be removed.
Board alarm indicator
Board master indicator
Service interface link connection indicator
11-8
ALM
ACT
LINK
Service interface master indicator
ACT
Hot-pluggable indicator
OFFLINE
Red
Green
Green
Orange
Blue
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HUAWEI UMG8900 Hardware Description
11 SDH Interface Units
Indicator
Identificat ion
Color
Status
Meaning
Always off
The board cannot be removed at the moment.
11.2.3 Interfaces on the MS2E Table 11-8 lists the interfaces on the MS2E. Table 11-8 Interfaces on the MS2E Category
Quantity
Physical Interface
Function
Specification
COM0
1
RJ48
Used as a debug serial port
RS232 serial port
8K_OUT
1
RJ48
Providing the output interface of 8 kHz clock signal
RS422
Service interface
2
SMB male connector
Providing two 155 Mbit/ s SDH service interfaces
STM-1
11.2.4 Fuses on the MS2E For details on fuse positions of the MS2E, see 11.2.1 Panel of the MS2E. Table 11-9 lists the specifications. Table 11-9 Fuses on the MS2E No.
Function
Specification
F1
–48 V power fuse
2A
F2
MBus 5 V power fuse
1A
11.2.5 Technical Specifications of the MS2E Table 11-10 to Table 11-12 list the technical specifications of the MS2E. Table 11-10 Technical specifications of the MS2E
Issue 05 (2009-01-09)
Category
Parameter
Specification
Remarks
Interfaces
Bit rate of output signals
155520 kbit/s +/- 20 ppm
–
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11-9
HUAWEI UMG8900 Hardware Description
11 SDH Interface Units
Category
Parameter
Specification
Remarks
Waveform and parameter of output signals
In conformity with the TABLE 11/G. 703 requirements
Allowable frequency deviation of input interface
155520 kbit/s +/- 20 ppm
Allowable attenuation of input interface
Attenuation range (0 to 12.7DB) @ 78 MHz
Over-voltage protection for interface
In conformity with the ITU-T K.41 recommendation
Reflection attenuation of input/output interface
Not less than 15 dB, with the frequency range 8000 kHz to 240000 kHz
Input jitter tolerance
In conformity with the ITU-T G.703 recommendation
Output jitter tolerance
In conformity with the ITU-T G.703 recommendation
Interface capability
STM-1 × 2
Framer capacity
E1: 63 x 2, T1: 84 x 2
Switching capacity
4 K DS0 switching
Electromagnetic characteristics
CLASS B
Table 11-11 Power consumption and heat dissipation of the UG01MS2E Category
Parameter
Specification
Remarks
Power consumption
N/A
25.7 W
-
Heat dissipation
N/A
25.7 W
Table 11-12 Power consumption and heat dissipation of the UG02MS2E Category
Parameter
Specification
Remarks
Power consumption
N/A
24.2 W
–
Heat dissipation
N/A
24.2 W
11.3 MS1L This describes the functions, panels and structures, indicators, interfaces, DIP switches and jumpers, fuses, and technical specifications of the MS1L. 11-10
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HUAWEI UMG8900 Hardware Description
11 SDH Interface Units
As the TDM service interface board, the MS1Ls are inserted in back slots 2 to 5 and slots 10 to 15 in the main control frame, and back slots 0 to 5 and slots 10 to 15 in the service frame. The MS1L can be inserted only in the SSM-32 frame. The MS1L can work in master and slave backup mode or load-sharing mode. The MS1L provides the following functions: Extracting clock signals and forming frames at the one 155 Mbit/s optical interface; providing interfaces with pluggable optical modules enabling different transmission distances l Processing overheads of regenerator section and multiplex section of optical signals and checking communication over optical channels l Implementing SDH mapping, de-mapping and processing overheads of high-order path and low-order path l Forming 1 x 63 E1 or 1 x 84 T1 frames and performing DS0 switch 11.3.1 Panel of the MS1L 11.3.2 Indicators on the MS1L 11.3.3 Interfaces on the MS1L 11.3.4 Fuses on the MS1L 11.3.5 Technical specifications of the MS1L l
11.3.1 Panel of the MS1L Figure 11-3 shows the panel of the MS1L. Figure 11-3 Panel of the MS1L MS1L
F1
Power
RUN ALM ACT AC
T
J5
MBUS
NK
LI 0 TX0 RX
J12
F2
Framer U22 J10
8K_OUT
Framer U23
U34
FPGA J18
CPLD U31
S1
COM0
J17
OFFLINE
MAC
J7
Flash
MAC
CPU U57
MAC
MS1L
Issue 05 (2009-01-09)
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11-11
HUAWEI UMG8900 Hardware Description
11 SDH Interface Units
11.3.2 Indicators on the MS1L Table 11-13 lists the meaning of the indicators on the MS1L. Table 11-13 Indicator meaning of the MS1L Indicator
Identific ation
Color
Status
Meaning
Board running indicator
RUN
Green
Always on
There is power supply, but the board is faulty.
Always off
There is no power supply, or the board is faulty.
Flashing (on for 1 second, off for another second)
The board runs normally in accordance with configuration.
Flashing fast (4 times per second)
Software is being loaded to the board, or the board does not run.
Flashing slowly (on for 2 seconds, off for another 2 seconds)
The board is isolated.
Always on or flashing fast
Alarms occur to the board.
Always off
No fault occurs.
Flashing
The board is in service such as in the master state.
Always off
The board is out of service such as in the slave state or in loadsharing mode.
Always on
The line is in the synchronous state and the line specifications and optical power meet the requirements.
Always off
The line is in the asynchronous state and the line specifications and optical power do not meet the requirements.
Board alarm indicator
Board master indicator
Service interface link connection indicator
11-12
ALM
ACT
LINK
Red
Green
Green
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HUAWEI UMG8900 Hardware Description
11 SDH Interface Units
Indicator
Identific ation
Color
Status
Meaning
Service interface master indicator
ACT
Orange
Always on or flashing
The interface is in master state.
Always off
The interface is in slave state.
Hot-pluggable indicator
OFFLINE
Always on
The board can be removed.
Always off
The board cannot be removed at the moment.
Blue
11.3.3 Interfaces on the MS1L Table 11-14 lists the interfaces on the MS1L. Table 11-14 Interfaces on the MS1L Category
Quantit y
Physical Interface
Function
Specificatio n
COM0
1
RJ48
Used as a debug serial port
RS232 serial port
8K_OUT
1
RJ48
Providing the output interface of 8 kHz clock signal
RS422
Service interface
1
-
Providing one 155 Mbit/s SDH service interface
STM-1
11.3.4 Fuses on the MS1L For details on fuse positions of the MS1L, see 11.3.1 Panel of the MS1L. Table 11-15 lists the specifications. Table 11-15 Fuses on the MS1L No.
Function
Specification
F1
–48 V power fuse
2A
F2
MBus 5 V power fuse
1A
11.3.5 Technical specifications of the MS1L Table 11-16 lists the technical specifications of the MS1L. Issue 05 (2009-01-09)
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11-13
HUAWEI UMG8900 Hardware Description
11 SDH Interface Units
Table 11-16 Technical specifications of the MS1L Categor y
Parameter
Specification
Remark s
Interface s
Transmissi on distance
2 km [1.2 mi.]
15 km [9.3 mi.]
40 km [24.9 mi.]
80 km [49.7 mi.]
Mode
multimode
Singlemode
Singlemode
Single-mode
Wavelengt h
1310 nm
1310 nm
1310 nm
1550 nm
Output optical power
–19 dBm to –14 dBm
–15 dBm to –8 dBm
–5 dBm to 0 dBm
–5 dBm to 0 dBm
Maximum receive sensitivity
–30 dBm
–28 dBm
–34 dBm
–34 dBm
Saturation optical power
–14.0 dBm
–7.0 dBm
–9.0 dBm
–10.0 dBm
Power consump tion
N/A
17.1 W
Heat dissipati on
N/A
17.1 W
-
–
NOTE
l
All optical fiber interface boards are identical in appearance. They use different optical modules. You can query the optical module type of a board with LST OPTINFO.
l
The receiving power of the optical module must be larger than the maximum receive sensitivity and less than the saturation optical power. Insufficient receiving power may cause bit errors, which destabilizes the service. Excessive receiving power may cause damage to optical modules.
11.4 MS1E This describes the functions, panels and structures, indicators, interfaces, DIP switches and jumpers, fuses, and technical specifications of the MS1E. As the TDM service interface board, the MS1Es are inserted in back slots 2 to 5 and slots 10 to 15 in the main control frame, and back slots 0 to 5 and slots 10 to 15 in the service frame. The MS1E can be inserted only in the SSM-32 frame. The MS1E can work in master and slave backup mode or load-sharing mode. The MS1E provides the following functions: l
11-14
Extracting clock signals and forming frames at one 155 Mbit/s electrical interface Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd.
Issue 05 (2009-01-09)
HUAWEI UMG8900 Hardware Description
11 SDH Interface Units
l
Processing overheads of regenerator section and multiplex section of optical signals and checking communication over optical channels
l
Implementing SDH mapping, de-mapping and processing overheads of high-order path and low-order path
l
Forming 1 x 63 E1/ or 1 x 84 T1 frames and performing DS0 switch
11.4.1 Panel of the MS1E 11.4.2 Indicators on the MS1E 11.4.3 Interfaces on the MS1E 11.4.4 Fuses on the MS1E 11.4.5 Technical specifications of the MS1E
11.4.1 Panel of the MS1E Figure 11-4 shows the panel of the MS1E. Figure 11-4 Panel of the MS1E MS1E F1
Power
RUN ALM ACT T AC
J5
MBUS
0 TX NK LI 0 RX
T8
F2
Framer U22 J10
Framer U23
U34
8K_OUT
FPGA J18
CPLD U31
S1
COM0
J17
MAC
J7
Flash
MAC
CPU U57
OFFLINE
MAC
MS1E
11.4.2 Indicators on the MS1E Issue 05 (2009-01-09)
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11-15
HUAWEI UMG8900 Hardware Description
11 SDH Interface Units
Table 11-17 lists the meaning of the indicators on the MS1E. Table 11-17 Indicator meaning of the MS1E Indicator
Identificat ion
Color
Status
Meaning
Board running indicator
RUN
Green
Always on
There is power supply, but the board is faulty.
Always off
There is no power supply, or the board is faulty.
Flashing (on for 1 second, off for another second)
The board runs normally in accordance with configuration.
Flashing fast (4 times per second)
Software is being loaded to the board, or the board does not run.
Flashing slowly (on for 2 seconds, off for another 2 seconds)
The board is isolated.
Always on or flashing fast
Alarms occur to the board.
Always off
No fault occurs.
Flashing
The board is in service such as in the master state.
Always off
The board is out of service such as in the slave state or in loadsharing mode.
Always on
The line is in the synchronous state and the line specifications meet the requirements.
Always off
The line is in the asynchronous state and the line specifications do not meet the requirements.
Always on or flashing
The interface is in master state.
Always off
The interface is in slave state.
Board alarm indicator
Board master indicator
Service interface link connection indicator
Service interface master indicator
11-16
ALM
ACT
LINK
ACT
Red
Green
Green
Orange
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HUAWEI UMG8900 Hardware Description
11 SDH Interface Units
Indicator
Identificat ion
Color
Status
Meaning
Hot-pluggable indicator
OFFLINE
Blue
Always on
The board can be removed.
Always off
The board cannot be removed at the moment.
11.4.3 Interfaces on the MS1E Table 11-18 lists the interfaces on the MS1E. Table 11-18 Interfaces on the MS1E Category
Quantity
Physical Interface
Function
Specification
COM0
1
RJ48
Used as a debug serial port
RS232 serial port
8K_OUT
1
RJ48
Providing the output interface of 8 kHz clock signal
RS422
Service interface
1
SMB male connector
Providing one 155 Mbit/s SDH service interface
STM-1
11.4.4 Fuses on the MS1E For details on fuse positions of the MS1E, see 11.4.1 Panel of the MS1E. Table 11-19 lists the specifications. Table 11-19 Fuses on the MS1E No.
Function
Specification
F1
–48 V power fuse
2A
F2
MBus 5 V power fuse
1A
11.4.5 Technical specifications of the MS1E Table 11-20 lists the technical specifications of the MS1E. Table 11-20 Technical specifications of the MS1E
Issue 05 (2009-01-09)
Category
Parameter
Specification
Remarks
Interfaces
Bit rate of output signals
155520 kbit/s +/- 20 ppm
–
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11-17
HUAWEI UMG8900 Hardware Description
11 SDH Interface Units
Category
11-18
Parameter
Specification
Waveform and parameter of output signals
In conformity with the TABLE 11/G. 703 requirements
Allowable frequency deviation of input interface
155520 kbit/s +/- 20 ppm
Allowable attenuation of input interface
Attenuation range (0 to 12.7DB) @ 78 MHz
Over-voltage protection for interface
In conformity with the ITU-T K.41 recommendation
Reflection attenuation of input/output interface
Not less than 15 dB, with the frequency range 8000 kHz to 240000 kHz
Input jitter tolerance
In conformity with the ITU-T G.703 recommendation
Output jitter tolerance
In conformity with the ITU-T G.703 recommendation
Interface capability
STM-1 × 1
Framer capacity
E1: 63 x 1, T1: 84 x 1
Switching capacity
2 K DS0 switching
Electromagnetic characteristics
CLASS B
Power consumpti on
N/A
16.3 W
Heat dissipatio n
N/A
16.3 W
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Remarks
-
Issue 05 (2009-01-09)
HUAWEI UMG8900 Hardware Description
12 Packet Interface Units
12
Packet Interface Units
About This Chapter The packet interface units consist of ME8T, MG1O, MA4L, MP4L, and MP1H. 12.1 ME8T This describes the functions, panels and structures, indicators, interfaces, DIP switches and jumpers, fuses, and technical specifications of the ME8T. 12.2 MG1O This describes the functions, panels and structures, indicators, interfaces, DIP switches and jumpers, fuses, and technical specifications of the MG1O. 12.3 MA4L This describes the functions, panels and structures, indicators, interfaces, DIP switches and jumpers, fuses, and technical specifications of the MA4L.
Issue 05 (2009-01-09)
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12-1
HUAWEI UMG8900 Hardware Description
12 Packet Interface Units
12.1 ME8T This describes the functions, panels and structures, indicators, interfaces, DIP switches and jumpers, fuses, and technical specifications of the ME8T. As the back IP interface board, the ME8Ts are inserted in back slots 2 to 5 and slots 10 to 15 in the main control frame, and back slots 0 to 5 and slots 10 to 15 in the service frame. The ME8T corresponds to the MHRU in the front slot. The ME8T can be inserted in both SSM-256 frames and SSM-32 frames. The ME8T provides the following functions: l
Providing eight 10/100Base-TX Ethernet interfaces in conformity with the IEEE8002.3z and IEEE802.3u standards.
l
Providing the 1+1 backup function by collaborating with the service processing board MHRU/MRPU. NOTE
l
The MHRU/MRPU provides a dedicated maintenance bus (MBus) module on the back interface board, but no internal FE interface. Therefore, the main control board operates and maintains the back interface board through the front MHRU/MRPU.
l
The transmission distance of the twisted pair connected to the ME8T cannot be longer than 100 m [0.06 mi.].
12.1.1 Panel of the ME8T 12.1.2 Indicators on the ME8T 12.1.3 Interfaces on the ME8T 12.1.4 Fuses on the ME8T 12.1.5 Technical specifications of the ME8T
12.1.1 Panel of the ME8T Figure 12-1 shows the panel of the ME8T.
12-2
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HUAWEI UMG8900 Hardware Description
12 Packet Interface Units
Figure 12-1 Panel of the ME8T ME8T
F2
J2 POWER U6
RUN ALM ACT FE3 FE2 FE1 FE0
F1
MBUS
FE7 FE6 FE5 FE4
CPU U20 Control Module
U22 S1
OFFLINE
ME8T
12.1.2 Indicators on the ME8T Table 12-1 lists the meaning of the indicators on the ME8T. Table 12-1 Indicator meaning of the ME8T Indicator
Identificat ion
Color
Status
Meaning
Board running indicator
RUN
Green
Always on
There is power supply, but the board is faulty.
Always off
There is no power supply, or the board is faulty.
Flashing (on for 1 second, off for another second)
The board runs normally in accordance with configuration.
Always on or flashing fast
Alarms occur to the board.
Always off
No fault occurs.
Board alarm indicator
Issue 05 (2009-01-09)
ALM
Red
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HUAWEI UMG8900 Hardware Description
12 Packet Interface Units
Indicator
Identificat ion
Color
Status
Meaning
Board working indicator
ACT
Green
Flashing
The board is in service such as in the master state.
Always off
The board is out of service such as in the slave state.
Always on
The interface works at the rate of 100 Mbit/s.
Always off
The interface works at the rate of 10 Mbit/s.
Always on
The link is through.
Always off
The link is not through.
Always on or flashing
Some data is being received or transmitted through the link.
Always on
The board can be removed.
Always off
The board cannot be removed at the moment.
Network interface speed indicator
-
Green
Network interface connection indicator
-
Hot-pluggable indicator
OFFLINE
Orange
Blue
12.1.3 Interfaces on the ME8T Table 12-2 lists the interface on the ME8T. Table 12-2 Interface on the ME8T Category
Quantity
Physical Interface
Function
Specification
10/100BASETX Ethernet interface
8
RJ45
Providing eight 10/100BASE-TX Ethernet service access interfaces
In conformity with the IEEE802.3 and IEEE802.3u standards
12.1.4 Fuses on the ME8T For details on fuse positions of the ME8T, see 12.1.1 Panel of the ME8T. Table 12-3 lists the specifications. Table 12-3 Fuses on the ME8T
12-4
No.
Function
Specification
F1
MBus 5 V power fuse
1A
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12 Packet Interface Units
No.
Function
Specification
F2
–48 V power fuse
1A
12.1.5 Technical specifications of the ME8T Table 12-4 lists the technical specifications of the ME8T. Table 12-4 Technical specifications of the ME8T Category
Parameter
Specification
Remarks
Time of switchover between master and slave boards
N/A
<1s
Time of hardware switchover
Power consumption
N/A
9.6 W
–
Heat dissipation
N/A
9.6 W
12.2 MG1O This describes the functions, panels and structures, indicators, interfaces, DIP switches and jumpers, fuses, and technical specifications of the MG1O. As the back IP interface board, the MG1Os are inserted in back slots 2 to 5 and slots 10 to 15 in the main control frame, and back slots 0 to 5 and slots 10 to 15 in the service frame. The MG1O corresponds to the MHRU in the front slot. The MG1O can be inserted in both SSM-256 frames and SSM-32 frames. The MG1O provides the following functions: l
Being equipped with the pluggable interface module and providing one GE interface or electrical interface in conformity with the IEEE8002.3z standard
l
Providing the 1+1 backup function by collaborating with the service processing board MHRU/MRPU. NOTE
The MHRU/MRPU provides a dedicated maintenance bus (MBus) module on the back interface board, but no internal FE interface. Therefore, the main control board operates and maintains the back interface board through the front MHRU/MRPU.
The MG1Os are categorized as MG1O.A and MG1O.B. The MG1O.A and the MG1O.B are called MG1O and provide the same functions. 12.2.1 Panel of the MG1O 12.2.2 Indicators on the MG1O 12.2.3 Interfaces on the MG1O 12.2.4 Fuses on the MG1O 12.2.5 Technical specifications of the MG1O Issue 05 (2009-01-09)
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HUAWEI UMG8900 Hardware Description
12 Packet Interface Units
12.2.1 Panel of the MG1O Figure 12-2 shows the panel of the UG02MG1O.A. Figure 12-2 Panel of the MG1O.A MG10
F2 RUN ALM ACT AC
T
J2
POWER U6
F1
NK LI 0 TX 0 RX
MBUS
CPU U10 Control Module
U22 S1 OFFLINE
MG10
Figure 12-3 shows the panel of the UG02MG1O.B.
12-6
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HUAWEI UMG8900 Hardware Description
12 Packet Interface Units
Figure 12-3 Panel of the UG02MG1O.B MG10
F1002 F1001
T AC
J1000
POWER U32
RUN ALM ACT
J1001
NK LI 0 TX 0 RX
F1000 F1
MBUS
1002 Logic U33 Control Module
U22 S1 OFFLINE
MG10
12.2.2 Indicators on the MG1O Table 12-5 lists the meaning of the indicators on the MG1O. Table 12-5 Indicator meaning of the MG1O Indicator
Identificat ion
Color
Status
Meaning
Running indicator
RUN
Green
Always on
There is power supply, but the board is faulty.
Always off
There is no power supply, or the board is faulty.
Flashing (on for 1 second, off for another second)
The board runs normally in accordance with configuration.
Always on or flashing fast
Alarms occur to the board.
Alarm indicator
Issue 05 (2009-01-09)
ALM
Red
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HUAWEI UMG8900 Hardware Description
12 Packet Interface Units
Indicator
Identificat ion
Working indicator
ACT
Color
Green
Gigabit optical interface link indicator
LINK
Green
Gigabit optical interface working indicator
ACT
Hot-pluggable indicator
OFFLINE
Orange
Blue
Status
Meaning
Always off
No fault occurs.
Flashing
The board is in service such as in the master state.
Always off
The board is out of service such as in the slave or disconnected state.
Always on
The link is through.
Always off
No data is received and transmitted or the link is not through.
Flashing
Some data is received or transmitted through the link.
Always off
No data is received and transmitted or the link is not through.
Always on
The board can be removed.
Always off
The board cannot be removed at the moment.
12.2.3 Interfaces on the MG1O Table 12-6 lists the interface on the MG1O. Table 12-6 Interface on the MG1O Category
Quantity
Physical Interface
Function
Specification
GE interface
1
LC/PC interface or RJ-45 interface
Providing Gigabit Ethernet (GE) service access
1000Base-T Ethernet interface in conformity with the IEEE802.3z standard.
12.2.4 Fuses on the MG1O For details on fuse positions of the MG1O.A, see 12.2.1 Panel of the MG1O. Table 12-7 lists the specifications.
12-8
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12 Packet Interface Units
Table 12-7 Fuses on the MG1O.A No.
Function
Specification
F1
MBus 5 V power fuse
1A
F2
–48 V power fuse
4A
For details on fuse positions of the MG1O.B, see 12.2.1 Panel of the MG1O. Table 12-8 lists the specifications. Table 12-8 Fuses on the MG1O.B No.
Function
Specification
F1
MBus 5 V power fuse
1A
F1000
–48 V power fuse
4A
F1001
–48 V power fuse
41 A
F1002
–48 V power fuse
41 A
12.2.5 Technical specifications of the MG1O Table 12-9 lists the technical specifications of the MG1O. Table 12-9 Technical specifications of the MG1O
Issue 05 (2009-01-09)
Categor y
Parame ter
Specification
Optical module
Transmi ssion distance
500 m [0.3 mi.]
10 km [6.2 mi.]
40 km [24.9 mi.]
40 km [24.9 mi.]
70 km [43.5 mi.]
Mode
multimode
Singlemode
Singlemode
Singlemode
Singlemode
Wavelen gth
850 nm
1310 nm
1550 nm
1310 nm
1550 nm
Output optical power
–9.5 -9.0 dBm dBm to – to -3 2.5 dBm dBm
-4 dBm -2 dBm -4 dBm to 1 dBm to 5 dBm to 2 dBm
Maximu m receive sensitivit y
-17.0 dBm
-21.0 dBm
-20.0 dBm
Remark s
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-23.0 dBm
–
-22.0 dBm
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HUAWEI UMG8900 Hardware Description
12 Packet Interface Units
Categor y
Electrica l module
Time of switchov er between master and slave boards
Parame ter
Specification
Saturatio n optical power
0 dBm
Power consump tion
7.6 W
Heat dissipati on
7.6 W
Transmi ssion distance
100 m [0.06 mi.]
-
Power consump tion
1W
–
Heat dissipati on
1W
N/A
<1s
–3.0 dBm
Remark s –3.0 dBm
–3.0 dBm
–3.0 dBm –
Time of hardware switchov er
NOTE
l
All optical fiber interface boards are identical in appearance. They use different optical modules. You can query the optical module type of a board with LST OPTINFO.
l
The receiving power of the optical module must be larger than the maximum receive sensitivity and less than the saturation optical power. Insufficient receiving power may cause bit errors, which destabilizes the service. Excessive receiving power may cause damage to optical modules.
12.3 MA4L This describes the functions, panels and structures, indicators, interfaces, DIP switches and jumpers, fuses, and technical specifications of the MA4L. As the back service interface board, the MA4Ls are inserted in back slots 2 to 5 and slots 10 to 15 in the main control frame, and back slots 0 to 5 and slots 10 to 15 in the service frame. The MA4L corresponds to the MASU in the front slot. The MA4L can be inserted in both SSM-256 frames and SSM-32 frames. The MA4L provides the following functions: 12-10
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12 Packet Interface Units
l
Providing four 155 Mbit/s single-mode/multi-mode ATM optical interfaces for the front board
l
Providing the 1+1 backup function by collaborating with the service processing board MASU NOTE
The MASU provides a dedicated maintenance bus (MBus) module on the back interface board, but no internal FE interface. Therefore, the main control board operates and maintains the back interface board through the front MASU.
12.3.1 Panel of the MA4L 12.3.2 Indicators on the MA4L 12.3.3 Interfaces on the MA4L 12.3.4 Fuses on the MA4L 12.3.5 Technical specifications of the MA4L
12.3.1 Panel of the MA4L Figure 12-4 shows the panel of the MA4L. Figure 12-4 Panel of the MA4L MA4L
F2 RUN ALM ACT AC AC
T
AC
T
T
NK
LI 0 TX0 RX K N LI 1 TX1 RX K N LI 2 TX2 RX K N LI 3 T X3 X R
F1
SFP SFP
MBUS
SFP SFP
8K_OUT
AC
T
POWER
OFFLINE
MA4L
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HUAWEI UMG8900 Hardware Description
12 Packet Interface Units
12.3.2 Indicators on the MA4L Table 12-10 lists the meaning of the indicators on the MA4L. Table 12-10 Indicator meaning of the MA4L Indicator
Identificat ion
Color
Status
Meaning
Board running indicator
RUN
Green
Always on
There is power supply, but the board is faulty.
Always off
There is no power supply, or the board is faulty.
Flashing (on for 1 second, off for another second)
The board runs normally in accordance with configuration.
Always on or flashing fast
Alarms occur to the board.
Always off
No fault occurs.
Flashing
The board is in service such as in the master or connected state.
Always off
The board is out of service such as in the slave or disconnected state.
Always on
The link is normal.
Always off
The link is faulty.
Always on or flashing
Some data is received or transmitted through the link.
Always off
No data is received or transmitted through the link.
Always on
The board can be removed.
Always off
The board cannot be removed at the moment.
Board alarm indicator
ALM
Board working indicator
ACT
Optical interface link indicator
LINK
Optical interface working indicator
ACT
Hot-pluggable indicator
OFFLINE
Red
Green
Green
Orange
Blue
12.3.3 Interfaces on the MA4L Table 12-11 lists the interfaces on the MA4L.
12-12
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Table 12-11 Interfaces on the MA4L Category
Quantit y
Physical Interface
Function
Specification
155 Mbit/s ATM optical interface
4
LC
Providing four 155 Mbit/s ATM optical interfaces
OC-3 SDH/SONET
8K_OUT
1
RJ48
Providing the output interface of 8 kHz clock signal
RS422
12.3.4 Fuses on the MA4L For details on fuse positions of the MA4L, see 12.3.1 Panel of the MA4L. Table 12-12 lists the specifications. Table 12-12 Fuses on the MA4L No.
Function
Specification
F1
MBus 5 V power fuse
1A
F2
–48 V power fuse
1A
12.3.5 Technical specifications of the MA4L Table 12-13 lists the technical specifications of the MA4L. Table 12-13 Technical specifications of the MA4L
Issue 05 (2009-01-09)
Categor y
Paramete r
Specification
Interface s
Transmissi on distance
2 km [1.2 mi.]
15 km [9.3 mi.]
40 km [24.9 mi.]
80 km [49.7 mi.]
Mode
multimode
Singlemode
Singlemode
Singlemode
Wavelengt h
1310 nm
1310 nm
1310 nm
1550 nm
Output optical power
–19 dBm to –14 dBm
–15 dBm to –8 dBm
–5 dBm to 0 dBm
–5 dBm to 0 dBm
Maximum receive sensitivity
–30 dBm
–28 dBm
–34 dBm
–34 dBm
Remark s
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-
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HUAWEI UMG8900 Hardware Description
12 Packet Interface Units
Categor y
Paramete r
Specification
Saturation optical power
–14.0 dBm
Power consumpt ion
N/A
10.7 W
Heat dissipatio n
N/A
10.7 W
–7.0 dBm
Remark s –9.0 dBm
–10.0 dBm
–
NOTE
12-14
l
All optical fiber interface boards are identical in appearance. They use different optical modules. You can query the optical module type of a board with LST OPTINFO.
l
The receiving power of the optical module must be larger than the maximum receive sensitivity and less than the saturation optical power. Insufficient receiving power may cause bit errors, which destabilizes the service. Excessive receiving power may cause damage to optical modules.
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HUAWEI UMG8900 Hardware Description
13 Clock Units
13
Clock Units
About This Chapter This describes the functions, panels and structures, indicators, interfaces, DIP switches and jumpers, fuses, and technical specifications of the MCLK. As the clock board, the master and slave MCLKs are inserted in back slots 0 and 1 in the main control frame. The MCLK can be inserted in both SSM-256 frames and SSM-32 frames. The MCLK provides the following functions: l
l
Clock input –
Receiving one 2048 kbit/s or 2048 kHz signal input from the external synchronization interface.
–
Receiving two line clock inputs from the TDM interface board.
–
Receiving one satellite positioning signal input from the GPS/GLONASS system.
–
Receiving 1544 kbit/s, 64 kHz+8 kHz, or 64 kHz+8 kHz+400 Hz signals of one channel from the external clock source.
Clock output –
Sending 18 RS-422 level differential 16 kHz clock signals to the MNET or MTNC through backplane bus in the main control frame and through cable distributing in other frames.
–
Sending the 2048 kbit/s or 2048 kHz external synchronization signal of one channel.
–
Providing 1544 kbit/s external signals of one channel
l
Providing the output clock signal of one channel for the master and slave MNETs in the same frame.
l
Supporting the work mode that the master and slave clock boards only access to one external synchronization reference source.
The MCLK falls into two types: UG03MCLK_VB and UG03MCLK_VD. The UG03MCLK_VD provides all the functions of the UG03MCLK_VB. The new functions of the UG03MCLK_VD are as follows:
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HUAWEI UMG8900 Hardware Description
13 Clock Units l
The UG03MCLK_VD can receive the 1544 kbit/s, 64 kHz+8 kHz, or 64 kHz+8 kHz+400 Hz signal of one channel from the external clock source. The UG03MCLK_VD can send the 1544 kbit/s external signal of one channel.
l
The 1.5 Mbit/s and 64 kbit/s interfaces are added on the ejector level of the UG03MCLK_VD.
13.1 Panel of the MCLK 13.2 Indicators on the MCLK 13.3 Interfaces on the MCLK 13.4 Fuses on the MCLK 13.5 Technical specifications of the MCLK
13-2
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HUAWEI UMG8900 Hardware Description
13 Clock Units
13.1 Panel of the MCLK Figure 13-1 shows the panel of the UG03MCLK_VB. Figure 13-1 Panel of the MCLK
MCLK RUN
8K_IN2 8K_IN1 2M_IN 2M_OUT CLK_OUT2 ANT CLK_OUT1 CLK_OUT0
ALM ACT
OFFLINE
MCLK FCLK
F1 Power module
Power module
F2 J15
Satellite card
MBSU subboard
U7
U15
FLASH
EPLD
U16 EPLD
U49
U17
BIOS
CPU
U44 J12 BIOS/EPLD JTAG
Constanttemperature cryst
Figure 13-2 shows the panel of the UG03MCLK_VD.
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HUAWEI UMG8900 Hardware Description
13 Clock Units
Figure 13-2 Panel of the UG03MCLK_VD
MCLK F1
RUN
ALM ACT
8K_IN2 8K_IN1 2M_IN 2M_OUT CLK_OUT2 1.5M/64K ANT CLK_OUT1 CLK_OUT0
Power module
Power module
F2 J15
Satellite card
MBSU subboard
U7
U16
U15
FLASH
EPLD
EPLD
U49
U17
BIOS
CPU
U44
OFFLINE
J12 BIOS/EPLD JTAG
Constanttemperature cryst
MCLK
13.2 Indicators on the MCLK Table 13-1 lists the meaning of the indicators on the MCLK. Table 13-1 Indicator meaning of the MCLK
13-4
Indicator
Identificat ion
Color
Status
Meaning
Running indicator
RUN
Green
Always on
There is power supply, but the board is faulty.
Always off
There is no power supply, or the board is faulty.
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HUAWEI UMG8900 Hardware Description
13 Clock Units
Indicator
Identificat ion
Alarm indicator
Working indicator
Hot-pluggable indicator
ALM
ACT
OFFLINE
Color
Red
Green
Blue
Status
Meaning
Flashing (on for 1 second, off for another second)
The board runs normally in accordance with configuration.
Flashing fast (4 times per second)
Software is being loaded to the board, or the board does not run.
Always on or flashing fast
Alarms occur to the board.
Always off
No fault occurs.
Flashing
The board is in service such as in the master state.
Always off
The board is out of service such as in the slave state.
Always on
The board can be removed.
Always off
The board cannot be removed at the moment.
13.3 Interfaces on the MCLK Table 13-2 lists the interfaces on the MCLK. Table 13-2 Interfaces on the MCLK
Issue 05 (2009-01-09)
Category
Quantity
Physical Interface
Function
Specification
CLK_OUT0
1
DB26PIN
16 kHz clock signal output interface 1
-
CLK_OUT1
1
DB26PIN
16 kHz clock signal output interface 2
CLK_OUT2
1
DB26PIN
16 kHz clock signal output interface 3
ANT
1
SMA socket
Satellite antenna interface (if satellite card is configured)
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13-5
HUAWEI UMG8900 Hardware Description
13 Clock Units
Category
Quantity
Physical Interface
Function
Specification
1.5 Mbit/s or 64 kbit/s
1
RJ45
Input interface of 1.544 Mbit/s and 64 kbit/s CC clock signals, and output interface of 1.544 Mbit/s clock signals
G.703
2M_OUT
1
SMB plug
2 M BITS clock output interface
2 MHz or 2 Mbit/s
2M_IN
1
SMB plug
2 M BITS clock output interface
2 MHz or 2 Mbit/s
8K_IN1
1
RJ45
Input interface for 8 K line synchronous master clock
RS422
8K_IN2
1
RJ45
Input interface for 8 K line synchronous slave clock
RS422
NOTE
l
One CLK_OUT interface outputs three channels of clock signal to the MNETs in three frames. The master and slave MCLKs correspond to master and slave MNETs in the same frame. In the main control frame, clock signals are transmitted through the backplane.
l
The 2M_IN interface supports 2 MHz or 2 Mbit/s BITS clock signals. If the two clock signals are available at the same time, the 2 Mbit/s clock signal is used.
l
The interface of 1.544 Mbit/s and 64 kbit/s signals is the new interface on the UG03MCLK_VD. The pin assignment of the RJ45 connector is as follows: 1 represents R+; 2 represents R-; 4 represents T+; 5 represents T-.
13.4 Fuses on the MCLK For details on fuse positions of the MCLK, see 13.1 Panel of the MCLK. Table 13-3 lists the specifications. Table 13-3 Fuses on the MCLK No.
Function
Specification
F1
–48 V power fuse
1A
F2
MBus 5 V power fuse
1A
13.5 Technical specifications of the MCLK Table 13-4 lists the technical specifications of the MCLK. 13-6
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HUAWEI UMG8900 Hardware Description
13 Clock Units
Table 13-4 Technical specifications of the MCLK
Issue 05 (2009-01-09)
Category
Parameter
Specification
Remarks
Output clock
Regulation of stratum 2 A clock output
BELLCORE GR-1244-CORE Stratum 2 clock
–
Regulation of the SSM function
ITU-T G0.781
Regulation that the interface of the external synchronization clock complies with
ITU-T G0.703
Power consumption
N/A
13 W
Heat dissipation
N/A
13 W
ITU-T G.812 Type I clock
ITU-T G.704
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13-7
HUAWEI UMG8900 Hardware Description
14 Lightning Protection Units
14
Lightning Protection Units
About This Chapter This describes the functions, panels and structures, indicators, interfaces, DIP switches and jumpers, fuses, and technical specifications of the MLPB. As the E1 lightning protection board, the MLPBs are inserted in back slots 2 to 5 or 10 to 15 in the main control frame, or back slots 0 to 5 or 10 to 15 in the central switching frame and the service frame. The MLPB can be inserted in both SSM-256 frames and SSM-32 frames. The MLPB provides the following functions: l
Providing the lightning protection to E1 trunk cables when they are connected to the UMG8900. NOTE
l
One MLPB can provide lightning protection to 16 E1 trunk cables. One ME32 can provide lightning protection to 32 E1 trunk cables in conjunction with two MLPB.
l
Given the cable length between the MLPB and the ME32,the following slot-matching relationship is recommended, that is ME32/MLPB.
l
The MLPB and the components have no power.
14.1 Panel of the MLPB 14.2 Indicators on the MLPB 14.3 Interfaces on the MLPB 14.4 Technical specifications of the MLPB
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14-1
HUAWEI UMG8900 Hardware Description
14 Lightning Protection Units
14.1 Panel of the MLPB Figure 14-1 shows the panel of the MLPB. Figure 14-1 Panel of the MLPB
Outside
E1/T1_0-15
Inside
E1/T1_0-7
Inside
E1/T1_8-15
MLPB
MLPB
14.2 Indicators on the MLPB None
14.3 Interfaces on the MLPB Table 14-1 lists the interfaces on the MLPB.
14-2
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Table 14-1 Interfaces on the MLPB Category
Quantity
Physical Interface
Function
Specificati on
Inside
2
DB25
Interface that the outdoor E1 trunk cable connects to the UMG8900 and 8 E1 input
–
Outside
1
DB44
16 E1 output after the processing of lightening protection and can be connected to the E32 board
–
14.4 Technical specifications of the MLPB Table 14-2 lists the technical specifications of the MLPB. Table 14-2 Technical specifications of the MLPB
Issue 05 (2009-01-09)
Category
Specification
Remarks
Power consumption
N/A
The MLPB has no power.
Heat dissipation
N/A
The MLPB has no power.
Service processing capability
Providing processing of lightening protection for 16 E1
–
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15
Cables
About This Chapter This describes the appearance and structure, signals, and technical specifications of cables of the UMG8900. NOTE
All network cables mentioned in this document refer to shielded twisted pairs.
15.1 Monitoring Cables This describes monitoring cables in terms of the application scenario, appearance, pin assignments, and technical specifications. 15.2 Alarm Box Connection Cables This describes alarm box connection cables in terms of the application scenario, appearance, pin assignments, and technical specifications. 15.3 Cascading Cables This describes cascading cables in terms of the application scenario, appearance, pin assignments, and technical specifications. 15.4 Clock Cables This describes clock cables in terms of the application scenario, appearance, pin assignments, and technical specifications. 15.5 Trunk Cables of SSM Frames This describes trunk cables in terms of the application scenario, appearance, pin assignments, and technical specifications. 15.6 Internal Trunk Cables from SSM Frames to SIWF Frames This describes internal trunk cables between the SSM frame and the SIWF frame in terms of the application scenario, appearance, pin assignments, and technical specifications. 15.7 Straight Through Cables and Crossover Cables This describes straight through cables and crossover cables in terms of the application scenario, appearance, pin assignments, and technical specifications. 15.8 Optical Fibers This describes optical fibers in terms of the application scenario, appearance, pin assignments, and technical specifications. Issue 05 (2009-01-09)
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15.9 Power Cables and PGND Cables This describes power cables and PGND cables in terms of the application scenario, appearance, pin assignments, and technical specifications.
15-2
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15.1 Monitoring Cables This describes monitoring cables in terms of the application scenario, appearance, pin assignments, and technical specifications.
CAUTION The monitoring cables are used between the power distribution frame (PDF) or the fan box and the SSM frame of the earlier version. In the SSM frame of the new version, the monitoring cables are not used. 15.1.1 Monitoring Cables from SSM Frames to Fan Boxes This describes the monitoring cable from the SSM frame to the fan box in terms of the application scenario, appearance, pin assignments, and technical specifications. 15.1.2 Monitoring Cables from SSM Frames to Power Distribution Frames and Fan Boxes This describes the monitoring cable from the SSM frame to the power distribution frame (PDF) and fan box in terms of the application scenario, appearance, pin assignments, and technical specifications.
15.1.1 Monitoring Cables from SSM Frames to Fan Boxes This describes the monitoring cable from the SSM frame to the fan box in terms of the application scenario, appearance, pin assignments, and technical specifications.
Application Scenario
CAUTION The SSM frames are of two versions. In the SSM frame of the new version, the fan box is not equipped with the power input interface and monitoring interface. The monitoring cables from the SSM frame to the fan box only used in the SSM frame of the earlier version. The monitoring cables from the SSM frame to the fan box is used to connect with the monitoring interface of a fan box. This cable is used to transmit RS485 differential signals. Each pair of signals received or transmitted must use a twisted pair. The cable material is shielded cable with shielding layer connected to the metal shells of the two connectors. Table 15-1 lists the connections of this cable.
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Table 15-1 Connections of monitoring cables from the SSM frame to the fan box Connector
Position
DB9 male connector
Connected to the Monitor interface at the back of an SSM frame
DB15 male connector
Connected to the RS485 serial port at the back of the corresponding fan box
Appearance Figure 15-1 shows its appearance. Figure 15-1 Appearance of the monitoring cables from the SSM frame to the fan box B
A
Pos.15
Pos.1
W
A
Pos.9
B
X1
Pos.1
X2
Pin Assignment Table 15-2 lists the pin assignment of this cable, where RX indicates receiving and TX indicates transmitting. Table 15-2 Pin assignment of monitoring cables from the SSM frame to the fan box DB9 Pin
Definition
DB15 Pin
Definition
Relation
1
TX1+
7
RX1+
Twisted pair
2
TX1-
6
RX1-
3
RX1+
3
TX1+
4
RX1-
2
TX1-
5
GND
5
GND
–
Metal shell
PGND
Metal shell
PGND
Shielding layer
Twisted pair
Technical Specifications Table 15-3 lists the technical specifications of the cable. 15-4
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Table 15-3 Technical specifications of the monitoring cables from the SSM frame to the fan box Parameter
Description
Connector X1
Cable Connector, D Connector, 9PIN, Male Connector, Cable Welding Type
Connector X2
Cable Connector, D Connector, 15PIN, Male Connector, Cable Welding Type
Cable
Twisted-Pair Cable, 100 ohm, SEYYP, 0.48 mm, 26 AWG, 4 Pairs, Black, Low Smoke Zero Halogen Cable
15.1.2 Monitoring Cables from SSM Frames to Power Distribution Frames and Fan Boxes This describes the monitoring cable from the SSM frame to the power distribution frame (PDF) and fan box in terms of the application scenario, appearance, pin assignments, and technical specifications.
Application Scenario The monitoring cables from the SSM frame to the PDF and fan box is used to connect with the monitoring interface of a fan box and PDF. In each cabinet, one SSM frame is required to provide a monitoring interface to the PDF of the cabinet. In the main control cabinet, main control frame provides the monitoring interface, and in service cabinet, the middle service frame provides the monitoring interface. For such SSM frames, to monitor the PDF and auxiliary fan box at the same time, the monitoring cable with two branches is required. This cable is used to transmit RS485 differential signals. Each pair of signals received or transmitted must use a twisted pair. The cable material is shielded cable with shielding layer connected to the metal shells of the three connectors. Table 15-4 lists the connections of the cables. Table 15-4 Connections of monitoring cables from the SSM frame to the PDF and fan box Connector
Position
X1 : DB9 male connector
Connected to the Monitor interface at the back of an SSM frame
X2 : DB15 male connector
Connected to the RS485 serial port at the back of the corresponding fan box
X3 : DB15 female connector
Connected to the RS485 serial port marked COM4 at the back of the power distribution frame
Appearance and Structure Figure 15-2 shows the appearance and structure of this monitoring cable. Issue 05 (2009-01-09)
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Figure 15-2 Monitoring cable from the SSM frame to the PDF and fan box DB15 male connector
A
DB9 male connector
Pos.1
B
W1
A Pos.9
B Pos.15
Pos.1
C
W2
X1
C
Pos.1
X2
DB15 female connector Pos.15
X3
Pin Assignment Table 15-5 and Table 15-6 list the pin assignment of this cable, where RX indicates receiving and TX indicates transmitting. Table 15-5 Pin assignment of monitoring cables from the SSM frame to the PDF and fan box (1) DB9 Male Pin
Definition
DB15 Male Pin
Definition
Relation
1
TX1+
7
RX1+
Twisted pair
2
TX1-
6
RX1-
3
RX1+
3
TX1+
4
RX1-
2
TX1-
5
GND
5
GND
–
Metal shell
PGND
Metal shell
PGND
Shielding layer
Twisted pair
Table 15-6 Pin assignment of monitoring cables from the SSM frame to the PDF and fan box (2)
15-6
DB9 Male Pin
Definition
DB15 Female Pin
Definition
Relation
6
TX2+
7
RX1+
Twisted pair
7
TX2-
6
RX1-
8
RX2+
3
TX1+
9
RX2-
2
TX1-
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Twisted pair
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DB9 Male Pin
Definition
DB15 Female Pin
Definition
Relation
5
GND
5
GND
–
Metal shell
PGND
Metal shell
PGND
Shielding layer
Technical Specifications Table 15-7 lists the technical specifications of the cable. Table 15-7 Technical specifications of the monitoring cables from the SSM frame to the fan box Parameter
Description
Connector X1
Cable Connector, D Connector, 9PIN, Male Connector, Cable Welding Type
Connector X2
Cable Connector, D Connector, 15PIN, Male Connector, Cable Welding Type
Connector X3
Cable Connector, D Connector, 15PIN, Female Connector, Cable Welding Type
Cable
Twisted-Pair Cable, 100 ohm, SEYVP, 0.48 mm, 26 AWG, 2 Pairs, Black
15.2 Alarm Box Connection Cables This describes alarm box connection cables in terms of the application scenario, appearance, pin assignments, and technical specifications.
Alarm Box RS422 Serial Port Cables l
Application Scenario This cable is used to connect with an SSM-256 or SSM-32 main control frame and the universal alarm box, for transmitting RS422 differential signals. Table 15-8 lists the connections of the cables. Table 15-8 Connections of alarm box RS422 serial port cables
l
Connector
Position
DB9 male connector
Connected to the interface marked with "ALM" at the back of an main control frame
6PIN connector
Connected to the universal alarm box
Appearance Figure 15-3 shows the appearance and structure of the alarm box RS422 serial port cable.
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Figure 15-3 Alarm box RS422 serial port cables B
M015 A-A
X1
Pos.9
A W
B
A Pos.1
X2
l
Pin assignment Table 15-9 lists pin assignment of the alarm box RS422 serial port cable, where RX indicates receiving and TX indicates transmitting. Table 15-9 Pin assignment of alarm box RS422 serial port cables
l
6PIN Connector
Pin Assignment
DB9 Male Connector
Pin Assignment
Relation
1
GND
5
GND
Single line
2
GND
3
RX+
1
TX+
4
RX-
2
TX-
5
TX+
3
RX+
6
TX-
4
RX-
–
–
Metal shell
PGND
Single line Twisted pair
Twisted pair
Shielding layer
Technical specifications Table 15-10 lists the technical specifications of the alarm box RS422 serial port cable. Table 15-10 Technical specifications of the alarm box RS422 serial port cable Parameter
Description
Connector X1
Ordinary plug, 6PIN, single row, 2.5 mm
Connector X2
Cable Connector, D Connector, 9PIN, Male Connector, Cable Welding Type
Cable
Twisted-Pair Cable, 100 ohm, UL2464, 0.4 mm, 26 AWG, 3P, PANTONE WARM GRAY 1U
Alarm Box RS232 Serial Port Cables l
Application Scenario This cable is used to connect with an local maintenance terminal (LMT) and the universal alarm box, for transmitting RS232 differential signals. Table 15-11 lists the connections of the cables.
15-8
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Table 15-11 Connections of alarm box RS232 serial port cables
l
Connector
Position
DB9 male connector
Connected to the LMT
Network connector-8PIN
Connected to the universal alarm box
Appearance and Structure Figure 15-4 shows the appearance and structure of the alarm box RS232 serial port cable. Figure 15-4 Alarm box RS232 serial port cables M016
A
A
B Pos.9 B
8 6 3 1
X1 X2
l
Pos.1
Pin assignment Table 15-12 lists pin assignment of the alarm box RS232 serial port cable, where RX indicates receiving and TX indicates transmitting. Table 15-12 Pin assignment of alarm box RS232 serial port cables
l
Network Connector-8PIN
DB9 Male Connector
3
5
5
2
6
3
Technical specifications Table 15-13 lists the technical specifications of the alarm box RS232 serial port cables. Table 15-13 Technical specifications of the alarm box RS232 serial port cables
Issue 05 (2009-01-09)
Parameter
Description
Connector X1
Network Interface Connector, 8Bit 8Pin, Crystal Plug
Connector X2
Cable connector, D model, 9PIN, female, welding model used for cable connection
Cable
Twisted-Pair Cable, 100 ohm, Category 5e UTP, 0.51 mm, 24 AWG, 8Cores, PANTONE 430U
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15.3 Cascading Cables This describes cascading cables in terms of the application scenario, appearance, pin assignments, and technical specifications. 15.3.1 FE Cascading Cables This describes FE cascading cables in terms of the application scenario, appearance, pin assignments, and technical specifications. 15.3.2 GE Cascading Cables This describes GE cascading cables in terms of the application scenario, appearance, pin assignments, and technical specifications. 15.3.3 TDM Cascading Cables This describes TDM cascading cables in terms of the application scenario, appearance, pin assignments, and technical specifications.
15.3.1 FE Cascading Cables This describes FE cascading cables in terms of the application scenario, appearance, pin assignments, and technical specifications.
Common FE Cascading Cables l
Application Scenario The common FE cascading cable is used for cascading of the FE planes between SSM frames.
l
Appearance The common FE cascading cable is the crossover cable. Figure 15-5 shows its appearance and structure. Figure 15-5 Common FE cascading cables 8 1 X1
8 1 X2
l
Pin assignment Figure 15-6 shows the pin assignment of the cable.
15-10
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Figure 15-6 Connections of crossover cables
SIDE 1
SIDE1
1 2 3 4 5 6 7 8
1--White/Orange
1 2 3 4 5 6 7 8
SIDE 2
l
SIDE2
2--Orange
1--White/Green 2--Green
3--White/Green 4--Blue
3--White/Orange 4--Blue
5--White/Blue
5--White/Blue
6--Green 7--White/Brown
6--Orange
8--Brown
7--White/Brown 8--Brown
Technical specifications Table 15-14 lists the technical specifications of the FE cascading network cable. Table 15-14 Technical specifications of the FE cascading network cable Item
Specification
Connector X1/X2
Network Interface Connector, 8-Bit 8PIN, Shielded, Crystal Model Connector
Cable
Twisted-Pair Cable, 100 ohm, CAT5E SFTP, 0.51 mm, 24 AWG, 8 Cores, PANTONE430U
Number of cores
8 Cores
FE Cascading Network Cable with Two Terminals at One End l
Application Scenario The FE cascading network cable with two terminals at one end is used for cascading of the FE planes between SSM frames. When the UG02MNET or UG02MBLU_VC is used, the FE cascading network cable with two terminals at one end is required. Table 15-15 lists the connections of the FE cascading network cables with two terminals at one end. Table 15-15 Connections of the FE cascading network cables with two terminals at one end
Issue 05 (2009-01-09)
Connector
Position
X1: Crystal model connector
Connected to FE1&FE2 interface or FE3&FE4 interface on the UG02MNET/UG02MBLU_VC.
X2, X3: Model socket/Top plugging type
Connected to FE3 cascading network ports on the MTNCs in two frames respectively.
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CAUTION When two frames are connected to the FE cascading network port on the UG02MNET or the UG02MBLU_VC through the FE cascading network cables with two terminals at one end, the branch cable with the identification FE1/FE3 is connected to the MTNC in the frame with the small frame number and the branch cable with the identification FE2/FE4 is connected to the MTNC in the frame with the large frame number. l
Appearance Figure 15-7 shows the appearance of the FE cascading network cable with two terminals at one end. Figure 15-7 Appearance of the FE cascading network cable with two terminals at one end
Figure 15-8 shows the structure of the FE cascading network cable with two terminals at one end.
15-12
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Figure 15-8 Structure of the FE cascading network cable with two terminals at one end Label1
B B
A 1
1
X1
Label2
A
8
X2
8
X3
l
X1: crystal model connector
X2 and X3: model socket/top plugging type
Label1: FE1/FE3
Label1: FE2/FE4
Pin assignment Table 15-16 lists the pin assignment of the FE cascading network cable with two terminals at one end. Table 15-16 Pin assignment of the FE cascading network cable with two terminals at one end
l
Start
End
Color
Relation
X1.1
X2.1
Blue
Twisted pair
X1.2
X2.2
White/Blue
X1.3
X2.3
Orange
X1.6
X2.6
White/Orange
X1.SHELL
X2.SHELL
–
Drain Wire
X1.4
X3.1
Green
Twisted pair
X1.5
X3.2
White/Green
X1.7
X3.3
Brown
X1.8
X3.6
White/Brown
X1.SHELL
X3.SHELL
–
Twisted pair
Twisted pair
Drain Wire
Technical specifications Table 15-17 lists the technical specifications of the FE cascading network cable with two terminals at one end. Table 15-17 Technical specifications of the FE cascading network cable with two terminals at one end
Issue 05 (2009-01-09)
Item
Specification
Connector X1
Network Interface Connector, 8-Bit 8PIN, Shielded, Crystal Model Connector
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Item
Specification
Connector X2 and X3
Network Interface Connector, 8-Bit 8PIN, Shielded, Model Socket/Top Plugging Type
Cable
Twisted-Pair Cable, FTP
Inner conductor core diameter
0.530 mm
Characteristic impedance
100.0 ohms
15.3.2 GE Cascading Cables This describes GE cascading cables in terms of the application scenario, appearance, pin assignments, and technical specifications.
Application Scenario The GE cascading cable is used for cascading between the GE planes of SSM frames.
Appearance The gigabit Ethernet (GE) cascading cable is made of multi-mode optical fiber, and the optical connector is of LC/PC type. Figure 15-9 shows its appearance. Figure 15-9 Appearance of the GE cascading cable
Both ends of the GE cascading cable are LC/PC connectors. Figure 15-10 shows the appearance of the LC/PC connector. 15-14
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Figure 15-10 Appearance of the LC/PC connector
Cable Connections The GE cascading cable is used to connect to GE cascading optical ports on the MNET, MNLU, or MBLU, including the following two cases: l
One end is connected to the MBLU in the central switching frame, and the other end is connected to the MNET in the service frame.
l
The two ends are respectively connected to the MNETs in the main control frame and in the central switching frame.
l
One end is connected to the MBLU/MNET in the central switching frame, and the other end is connected to the MNLU in the service frame.
l
The two ends are respectively connected to the MNLUs in the main control frame and the service frame.
Each MNET, MNLU, or MBLU has two pairs of GE optical ports (an RX port and a TX port comprise a pair), and GE cascading cables are used in pairs.
Technical Specifications Table 15-18 lists the technical specifications of the GE cascading cable. Table 15-18 Technical specifications of the GE cascading cable Item
Specification
Bending radius
Dynamic bending: 20D, no less than 50 mm [1 15/16 in.] Static bending: 10D, no less than 30 mm [1 3/16 in.]
Maximum transmission distance
50 m [164 ft.]
Working temperature
–40℃ to +75℃ [–40℉ to 167℉]
NOTE
The minimum bending radius allowed by the optical fiber is indicated by the multiple of the cable diameter D.
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15.3.3 TDM Cascading Cables This describes TDM cascading cables in terms of the application scenario, appearance, pin assignments, and technical specifications.
Application Scenario The TDM cascading cable is used for cascading between the TDM planes of SSM frames. The TDM cascading cable is made of multi-mode optical fiber and the connectors are of the LC/ PC type. Figure 15-11 shows its appearance. Figure 15-11 Appearance of the TDM cascading cable
Both ends of the TDM cascading cable are LC/PC connectors. Figure 15-12 shows the appearance of the LC/PC connector. Figure 15-12 Appearance of the LC/PC connector
15-16
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Cable Connections TDM cascading cables are used in pairs on the all ports. For SSM-256 frames, there are four ports on each MTNB or MBLU. The cascading includes the following two cases: l
When three or more frames are cascaded, one end of the TDM cascading cable is connected to the MBLU in the central switching frame, and the other end to the MTNB in a service frame. In addition, the MTNB in the main control frame is connected to the MTNB in the central switching frame through the TDM cascading cable.
l
When two frames are cascaded, the TDM cascading cable connects the MTNB in the main control frame and the MTNB in a service frame.
For SSM-32 cascading, the MTNCs in the main control frame connect with the MTNCs in two service frames respectively through TDM cascading optical fibers. For the hybrid cascading between SSM-256 and SSM-32 frames, the MBLUs or MTNBs in the SSM-256 frame connect with the MTNCs in four SSM-32 frames respectively through four TDM cascading optical fibers.
Technical Specifications Table 15-19 lists the technical specifications of the TDM cascading cable. Table 15-19 Technical specifications of the TDM cascading cable Item
Specification
Bending radius
Dynamic bending: 20D, no less than 50 mm [1 15/16 in.] Static bending: 10D, no less than 30 mm [1 3/16 in.]
Insertion loss (1310 nm)
≤ 0.3 dB
Return loss (1310 nm)
> 35 dB
Working temperature
–40℃ to +75℃ [–40℉ to 167℉]
NOTE
The minimum bending radius allowed by the optical fiber is indicated by the multiple of the cable diameter D.
15.4 Clock Cables This describes clock cables in terms of the application scenario, appearance, pin assignments, and technical specifications. 15.4.1 Clock Distribution Cable This describes the clock distribution cable in terms of the application scenario, appearance, pin assignments, and technical specifications. 15.4.2 8 kHz Clock Cables Issue 05 (2009-01-09)
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This describes 8 kHz clock cables in terms of the application scenario, appearance, pin assignments, and technical specifications. 15.4.3 BITS Clock Cables This describes BITS clock cables in terms of the application scenario, appearance, pin assignments, and technical specifications. 15.4.4 GPS Clock Cables This describes GPS clock cables in terms of the application scenario, appearance, pin assignments, and technical specifications.
15.4.1 Clock Distribution Cable This describes the clock distribution cable in terms of the application scenario, appearance, pin assignments, and technical specifications.
Application Scenario The clock distribution cable provides clock signals for various SSM-256 subracks. It uses a DB-26 connector at one end to connect to the CLK in the main controlling subrack and uses six RJ-45 connectors at the other end to connect to the NET in the SSM-256 service subrack.
Appearance Figure 15-13 shows the appearance of the clock distribution cable. Figure 15-13 Appearance of the clock distribution cable
Figure 15-14 shows the structure of the clock distribution cable.
15-18
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Figure 15-14 Structure of the clock distribution cable Pos.1 W1
X2 8 1
W2
X3
W3
X4
W4
X5
W5
X1
X6
W6
X7
Pos.26
Pin Assignments Table 15-20 lists the pin assignments of the clock distribution cable. NOTE
l
CLK denotes the differential 8 kHz output.
l
UTC denotes the signal type of the clock board (signal with high level: active signal; signal with low level: standby signal).
l
+/- denotes the positive or the negative end of the differential twisted-pair cable.
Table 15-20 Pin assignments of the clock distribution cable Cable
From
To
Relation
Remark
W1
X1.1
X2.3
1 pair
CLK01+
X1.2
X2.6
X1.3
X2.1
X1.4
X2.2
X1.5
X3.3
X1.6
X3.6
X1.7
X3.1
X1.8
X3.2
X1.9
X4.3
X1.10
X4.6
X1.11
X4.1
X1.12
X4.2
X1.14
X5.3
W2
W3
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CLK01One pair
UTC01+ UTC01-
1 pair
CLK02+ CLK02-
1 pair
UTC02+ UTC02-
1 pair
CLK03+ CLK03-
1 pair
UTC03+ UTC03-
1 pair
CLK04+ 15-19
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Cable
W5
W6
From
To
X1.15
X5.6
X1.16
X5.1
X1.17
X5.2
X1.18
X6.3
X1.19
X6.6
X1.20
X6.1
X1.21
X6.2
X1.22
X7.3
X1.23
X7.6
X1.24
X7.1
X1.25
X7.2
Relation
Remark CLK04-
1 pair
UTC04+ UTC04-
1 pair
CLK05+ CLK05-
1 pair
UTC05+ UTC05-
1 pair
CLK06+ CLK06-
1 pair
UTC06+ UTC06-
Technical Specifications Table 15-21 lists the technical specifications of the clock distribution cable. Table 15-21 Technical specifications of the clock distribution cable Parameter
Description
Cable connector
X1: D type–26 pin–male dual edge X2 to X7: RJ-45 connector–8 pin
Cable type
Symmetrical twisted-pair cable
Characteristic impedance
100 ohms
Inner conductor diameter
0.48 mm
Wire gauge of the inner conductor
26 AWG
Color
Black
Number of cores
2 pairs
Fire resistance of the outer jacket
CM
15.4.2 8 kHz Clock Cables This describes 8 kHz clock cables in terms of the application scenario, appearance, pin assignments, and technical specifications.
15-20
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Application Scenario The 8 kHz clock cable connects the 8K_OUT port of the E32, T32, A4L, P4L, S1L, S2L, or PIE board with the 8K_IN port of the MCLK or the MTNC, to provide 8 kHz clock signals for the MCLK or the MTNC in the main control frame. Two 8 kHz clock cables are configured in the system. Table 15-22 shows the cable connections. Table 15-22 Connections of the 8 kHz clock cable Connector
Position
RJ48 connector
Connected to the 8K_OUT port of the E32, T32, A4L, P4L, S1L, S2L, or PIE board
Two RJ45 connectors
Connected to the 8K_IN1 port or 8K_IN2 port of the master and slave MCLK or MTNC boards
Appearance and Structure Figure 15-15 shows the appearance of this cable. Figure 15-15 Appearance of the 8 kHz clock cable
Figure 15-16 shows the structure of this cable. Figure 15-16 Structure of the 8 kHz clock cable A
X1
X2
A X3
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Pin Assignment Table 15-23 and Table 15-24 list the pin assignment of this cable. Table 15-23 Pin assignment of the 8 kHz clock cable (1) X1 (RJ48)
X2 (RJ45)
Definition
Relation
1
1
8K0+
Twisted pair
2
2
8K0-
Metal shell
Metal shell
PGND
Shielding layer
Table 15-24 Pin assignment of the 8 kHz clock cable (2) X1 (RJ48)
X3 (RJ45)
Definition
Relation
3
1
8K1+
Twisted pair
6
2
8K1-
Metal shell
Metal shell
PGND
Shielding layer
Technical Specifications Table 15-25 lists the technical specifications of the 8 kHz clock cable. Table 15-25 Technical specifications of the 8 kHz clock cable Item
Specifications
Connectors
Network Interface Connector, Single Row, Single Port, 8Bit, 8PIN, Shielded, Crystal Model Connector, Matching AWG 26 to AWG 28, Leads Twisted Inside Cable
Cable
Twisted-Pair Cable, 100 ohm, SEYVP, 0.48 mm, 26 AWG, 2 Pairs, Black
15.4.3 BITS Clock Cables This describes BITS clock cables in terms of the application scenario, appearance, pin assignments, and technical specifications.
Application Scenario The BITS clock cable is used to connect with the CLK and external clock device to transmit 2 MHz clock signals. The BITS clock cables can be of 75 ohms or 120 ohms. Choose proper BITS clock cables based on the impedances of site surveys. Table 15-26 lists the connections of this cable. 15-22
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Table 15-26 Connections of the BITS clock cable Connector
Position
SMB female connector
Connected to the 2M_IN port of a CLK
Idle
Equipped with corresponding connector based on the model of the cable distribution rack in the equipment room and connected to the BITS device
75-ohm BITS Clock Cables l
Appearance and structure Figure 15-17 shows the appearance of the 75-ohm BITS clock cable. Figure 15-17 Appearance of the 75-ohm BITS clock cable
Figure 15-18 shows the structure of the 75-ohm BITS clock cable. Figure 15-18 Structure of the 75-ohm BITS clock cable
This cable is equipped with an SMB female connector at one end and no connector at the other end. l
Pin Assignment None
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HUAWEI UMG8900 Hardware Description
15 Cables l
Technical specifications Table 15-27 lists the technical specifications of the 75-ohm BITS clock cable. Table 15-27 Technical specifications of the 75-ohm BITS clock cable Item
Specification
Connector
Coaxial Connector, SMB Connector, 75ohm/ Straight/Female, Matching SYV-75-2-2 Cable
Cable
Coaxial Cable, SYV-75-2-2 (4.0Z)-1/0.34mm, OD3.9mm, Double-Layer Copper Braid Shielded
120-ohm BITS Clock Cables l
Appearance and structure Figure 15-19 shows the appearance of the 120-ohm BITS clock cable. Figure 15-19 Appearance of the 120-ohm BITS clock cable
Figure 15-20 shows the structure of the 120-ohm BITS clock cable.
15-24
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Figure 15-20 Structure of the 120-ohm BITS clock cable Label 1
1
Main label
2
W1
W3
W2
W4
X1 Label 2
X2
Label 3
Label 4
1. Coaxial Connector, SMB Connector, 75ohm/ Straight/Female
2. 75 ohm/120 ohm transfer PCB
W1 and W2. Coaxial Cable, SYV-75-2-2
W3 and W4. Communication cable - 120ohm shielded twisted pair lines
This cable is equipped with two SMB female connectors at one end and no connector at the other end. l
Pin Assignment None
l
Technical specifications Table 15-28 lists the technical specifications of the 120-ohm BITS clock cable. Table 15-28 Technical specifications of the 120-ohm BITS clock cable Item
Specification
Connector
Coaxial Connector, SMB Connector, 75ohm/Straight/ Female, Matching SYV-75-2-2 Cable
Cable W1 and W2
Coaxial Cable, SYV-75-2-2(4.0Z)-1/0.34mm, OD3.9mm, Double-Layer Copper Braid Shielded
Cable W3 and W4
Communication cable - 120ohm shielded twisted pair lines - 1/0.5 - 2-core, round - outer diameter is 3.8 mm
15.4.4 GPS Clock Cables This describes GPS clock cables in terms of the application scenario, appearance, pin assignments, and technical specifications.
Application Scenario The GPS clock cable is used to transmit GPS clock signals. This cable is equipped with an SMA male plug at one end and an N50 female connector at the other end. Table 15-29 lists the connections of the cables. Table 15-29 Connections of the GPS clock cable
Issue 05 (2009-01-09)
Connector
Position
SMA male plug
Connected to the GPS clock input port ANT of a CLK
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HUAWEI UMG8900 Hardware Description
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Connector
Position
N50 female connector
Connected to the feeder or jumper
Appearance and Structure Figure 15-21 shows the appearance and structure of the GPS clock cable. Figure 15-21 GPS clock cable
Pin Assignment None
Technical Specifications Table 15-30 lists the technical specifications of the GPS clock cable. Table 15-30 Technical specifications of the GPS clock cable
15-26
Item
Specification
Connector 1
Coaxial Connector, SMA Connector, 50 ohm, Right Angle, Male Type, Matching SFF-50-1.5-1
Connector 2
Coaxial Connector, N Type Connector, 50 ohm, Straight, Female Type, Bulkhead Mounting, Matching SFF50-1.5-1 Cable
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Item
Specification
Cable
Coaxial Cable, Stranded Silver-plated Copper-clad Steel 7/0.17 mm, 50 ohm, 2.5 mm, 1.55 mm, 0.54 mm
15.5 Trunk Cables of SSM Frames This describes trunk cables in terms of the application scenario, appearance, pin assignments, and technical specifications. 15.5.1 75-ohm E1 Trunk Cable This describes the 75-ohm E1 trunk cable in terms of the application scenario, appearance, pin assignments, and technical specifications. 15.5.2 120-ohm E1 Trunk Cable This describes the 120-ohm E1 trunk cable in terms of the application scenario, appearance, pin assignments, and technical specifications. 15.5.3 100-ohm T1 Cables This describes 100-ohm T1 cables in terms of the application scenario, appearance, pin assignments, and technical specifications. 15.5.4 75-ohm E3/T3 Cables This describes 75-ohm E3/T3 trunk cables in terms of the application scenario, appearance, pin assignments, and technical specifications. 15.5.5 SDH Trunk Cables This describes SDH trunk cables in terms of the application scenario, appearance, pin assignments, and technical specifications.
15.5.1 75-ohm E1 Trunk Cable This describes the 75-ohm E1 trunk cable in terms of the application scenario, appearance, pin assignments, and technical specifications.
Application Scenario A 75-ohm E1 trunk cable provides 16 E1 interfaces. The 75-ohm E1 trunk cable uses a DB-100 connector at one end to connect to the E32/ESU and uses an SMB connector at the other end to connect to the DDF. The DB-100 connector ships with the trunk cable, whereas the SMB connector is prepared on site.
Appearance Figure 15-22 shows the appearance of the 75-ohm E1 trunk cable.
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Figure 15-22 Appearance of the 75-ohm E1 trunk cable Pos.100
Pos.1
Pin Assignments
CAUTION A pin assignment table is provided in the packaging bag of the cable connector. You must keep the table carefully. If the table is lost, record the information printed on the cable label and contact Huawei for the specific pin assignments. Table 15-31 lists the pin assignments of the 75-ohm E1 trunk cable. NOTE
l
STARTPT denotes the position of the pin on the DB-100 connector.
l
COAXIAL denotes the type of signals on each twisted pair.
l
Print denotes cable number printed on the cable.
l
Remark denotes the Rx/Tx relation, which applies to only the E32/ESU. For example:
l
15-28
l
R1: receive end of the E1 signals from line 1
l
T1: transmit end of the E1 signals from line 1
TIP denotes the inner conductor of the coaxial cable and RING the outer conductor of the coaxial cable. R denotes the receive direction and T the transmit direction.
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Table 15-31 Pin assignments of the 75-ohm E1 trunk cable
Issue 05 (2009-01-09)
STAR TPT
COAXI AL
REMAR K
PRINT
STAR TPT
COAXI AL
REMA RK
PRINT
8
TIP
R0
W1.1
33
TIP
R8
W2.1
9
RING
34
RING
11
RING
36
RING
T8
W2.2
12
TIP
37
TIP
5
RING
30
RING
R9
W2.3
6
TIP
31
TIP
2
TIP
27
TIP
T9
W2.4
3
RING
28
RING
58
TIP
83
TIP
R10
W2.5
59
RING
84
RING
61
RING
86
RING
T10
W2.6
62
TIP
87
TIP
55
RING
80
RING
R11
W2.7
56
TIP
81
TIP
52
TIP
77
TIP
T11
W2.8
53
RING
78
RING
20
TIP
45
TIP
R12
W2.9
21
RING
46
RING
23
RING
48
RING
T12
W2.10
24
TIP
49
TIP
17
RING
42
RING
R13
W2.11
18
TIP
43
TIP
14
TIP
39
TIP
T13
W2.12
15
RING
40
RING
70
TIP
95
TIP
R14
W2.13
71
RING
96
RING
73
RING
98
RING
T14
W2.14
74
TIP
99
TIP
67
RING
92
RING
R15
W2.15
T0
R1
T1
R2
T2
R3
T3
R4
T4
R5
T5
R6
T6
R7
W1.2
W1.3
W1.4
W1.5
W1.6
W1.7
W1.8
W1.9
W1.10
W1.11
W1.12
W1.13
W1.14
W1.15
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STAR TPT
COAXI AL
68
TIP
64
TIP
65
RING
REMAR K
T7
PRINT
W1.16
STAR TPT
COAXI AL
93
TIP
89
TIP
90
RING
REMA RK
PRINT
T15
W2.16
Technical Specifications Table 15-32 lists the technical specifications of the 75-ohm E1 trunk cable. Table 15-32 Technical specifications of the 75-ohm E1 trunk cable Parameter
Description
Cable connector
D type–100 pin–straight male
Cable type
Coaxial cable
Characteristic impedance
75 ohms
Shielding layer diameter of a single cable
2.2 mm
Inner insulation layer diameter of a single cable
1.2 mm
Inner conductor diameter
0.254 mm
Color
Huawei white
E1(T1) number
16 E1s
15.5.2 120-ohm E1 Trunk Cable This describes the 120-ohm E1 trunk cable in terms of the application scenario, appearance, pin assignments, and technical specifications.
Application Scenario A 120-ohm E1 trunk cable provides 16 E1 interfaces. The 120-ohm E1 trunk cable uses a DB-100 connector at one end to connect to the E32/ESU/ T32/TSU and uses bare wires at the other end to connect to the DDF.
CAUTION Two types of 120-ohm E1 trunk cables are available to fulfill different demands. The two types of cables differ in only the outer diameter. Pay attention to the cable type during installation.
15-30
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Appearance Figure 15-23 shows the appearance of the 120-ohm E1 trunk cable. Figure 15-23 Appearance of the 120-ohm E1 trunk cable Pos.100
Pos.1
Pin Assignments
CAUTION Two types of 120-ohm trunk cables are available. You must pay attention to the pin assignment when connecting the cable. A pin assignment table is provided in the packaging bag of the cable connector. You must keep the table carefully. If the table is lost, record the information printed on the cable label and contact Huawei for the specific pin assignments. Table 15-33 and Table 15-34 list the pin assignments of the 120-ohm E1 trunk cable. NOTE
Remark denotes the Rx/Tx relation, which applies to only the E32/ESU/T32/TSU. For example:
Issue 05 (2009-01-09)
l
R1: receive end of the E1 signals from line 1
l
T1: transmit end of the E1 signals from line 1
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Table 15-33 Pin assignments of the new 120-ohm E1 trunk cable
15-32
STAR TPT
WIRE COLO R
TWIST DEF.
TAPE COLO R
STAR TPT
WIRE COLO R
TWIST DEF.
TAPE COLOR
11
White
T0
Blue
23
Red
T4
Blue
12
Blue
24
Brown
8
White
20
Red
9
Orange
21
Gray
2
White
14
Black
3
Green
15
Blue
5
White
17
Black
6
Brown
18
Orange
61
White
73
Black
62
Gray
74
Green
58
Red
70
Black
59
Blue
71
Brown
52
Red
64
Black
53
Orange
65
Gray
55
Red
67
Yellow
56
Green
68
Blue
36
White
48
Red
37
Blue
49
Brown
33
White
45
Red
34
Orange
46
Gray
27
White
39
Black
28
Green
40
Blue
30
White
42
Black
31
Brown
43
Orange
86
White
98
Black
87
Gray
99
Green
83
Red
95
Black
84
Blue
96
Brown
R0
T1
R1
T2
R2
T3
R3
T8
R8
T9
R9
T10
R10
Orange
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R4
T5
R5
T6
R6
T7
R7
T12
Orange
R12
T13
R13
T14
R14
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STAR TPT
WIRE COLO R
TWIST DEF.
77
Red
T11
78
Orange
80
Red
81
Green
TAPE COLO R
R11
STAR TPT
WIRE COLO R
TWIST DEF.
89
Black
T15
90
Gray
92
Yellow
93
Blue
TAPE COLOR
R15
Table 15-34 Pin assignments of the old 120-ohm E1 trunk cable
Issue 05 (2009-01-09)
STAR TPT
WIRE COLO R
COAXIA L
TAPE COLO R
STAR TPT
WIRE COLO R
COAXIA L
TAPE COLOR
2
White
T1
Blue
27
Red
T9
Blue
3
Blue
28
Brown
5
White
30
Red
6
Orange
31
Gray
8
White
33
Black
9
Green
34
Blue
11
White
36
Black
12
Brown
37
Orange
14
White
39
Black
15
Gray
40
Green
17
Red
42
Black
18
Blue
43
Brown
20
Red
45
Black
21
Orange
46
Gray
23
Red
48
Yellow
24
Green
49
Blue
52
White
77
Red
53
Blue
78
Brown
55
White
80
Red
56
Orange
81
Gray
58
White
83
Black
R1
R0
T0
T5
R5
R4
T4
T3
R3
R2
Orange
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R9
R8
T8
T13
R13
R12
T12
T11
Orange
R11
R10
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HUAWEI UMG8900 Hardware Description
15 Cables
STAR TPT
WIRE COLO R
59
Green
61
White
62
Brown
64
White
65
Gray
67
Red
68
Blue
70
Red
71
Orange
73
Red
74
Green
COAXIA L
TAPE COLO R
T2
T7
R7
R6
T6
STAR TPT
WIRE COLO R
84
Blue
86
Black
87
Orange
89
Black
90
Green
92
Black
93
Brown
95
Black
96
Gray
98
Yellow
99
Blue
COAXIA L
TAPE COLOR
T10
T15
R15
R14
T14
Technical Specifications Table 15-35 lists the technical specifications of the 120-ohm E1 trunk cable. Table 15-35 Technical specifications of the 120-ohm E1 trunk cable Parameter
Description
Cable connector
D type–100 pin–straight male
Cable type
Symmetrical twisted-pair cable
Characteristic impedance
120 ohms
Inner conductor diameter
0.4 mm/0.5 mm
Wire gauge
26 AWG
Color
PANTONE 430U
E1(T1) number
16 E1s
15.5.3 100-ohm T1 Cables This describes 100-ohm T1 cables in terms of the application scenario, appearance, pin assignments, and technical specifications.
Application Scenario The 100-ohm T1 cable is the same as the 120-ohm E1 cable in terms of appearance, structure and pin definition. They are different in impedance. See 15.5.2 120-ohm E1 Trunk Cable. 15-34
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This cable is used to transmit 1.544 Mbit/s T1 signals.
15.5.4 75-ohm E3/T3 Cables This describes 75-ohm E3/T3 trunk cables in terms of the application scenario, appearance, pin assignments, and technical specifications.
Application Scenario The 75-ohm E3/T3 trunk cable is used to transmit E3/T3 signal. The UMG8900 adopts two types of E3/T3 trunk cable. Both of the two types are the coaxial cable with the impedance of 75 ohms and adopt the BNC connector. However, the number of connectors of the two types of trunk cables are different. For the first type, one end has the BNC connector and the other end has no connector. For the second type, both ends have the BNC connectors and T-shaped conversion connectors. When the PIE works in load-sharing mode, the E3/T3 trunk cable with one BNC connector is adopted. When the PIE works in master and slave mode, the E3/T3 trunk cable with two BNC connectors are used to collect the signals on the mater and slave boards. Then the E3/T3 trunk cable with one BNC connector is used to transmit the signals.
Appearance Figure 15-24 shows the appearance of the E3/T3 trunk cables with two BNC connectors. Figure 15-24 Appearance of the E3/T3 trunk cables with two BNC connectors
Figure 15-25 shows the appearance of the E3/T3 trunk cables with one BNC connector. Issue 05 (2009-01-09)
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Figure 15-25 Appearance of the E3/T3 trunk cables with one BNC connector
Cable Connections Table 15-36 lists the connections of this cable. Table 15-36 Connections of 75-ohm E3/T3 trunk cables Connector
Position
BNC male connector
Receiving and transmitting interfaces 0 to 2 on the PIE
Idle
Corresponding connector that is made on site for the digital distribution frame (DDF)
Technical Specifications Table 15-37 and Table 15-38 list the technical specifications of the two types of trunk cables. Table 15-37 Technical specifications of the E3/T3 trunk cable with two BNC connectors
15-36
Item
Specification
Connector 1
Coaxial Connector, BNC, 75 ohm, Straight Plug, Male, Matching 735A
Connector 2
RF Coaxial Connector, BNC, 75ohm, KKK, T Type, Adapter
Cable
Coaxial Cable, 735A1, 75 ohms, 3.3 mm, 1.98 mm, 0.45 mm, PANTONE WARM GRAY 1U
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Table 15-38 Technical specifications of the E3/T3 trunk cable with one BNC connector Item
Specification
Connector
Coaxial Connector, BNC, 75 ohm, Straight Plug, Male, Matching 735A
Outer diameter
Coaxial Cable, 735A1, 75 ohms, 3.3 mm, 1.98 mm, 0.45 mm, PANTONE WARM GRAY 1U
15.5.5 SDH Trunk Cables This describes SDH trunk cables in terms of the application scenario, appearance, pin assignments, and technical specifications.
Application Scenario The SDH trunk cable is used to connect the MS2E or MS1E board and synchronous digital hierarchy (SDH) transmission equipment to transmit 155 Mbit/s trunk signals. This cable is equipped with an SMB female connector at one end and no connector at the other end.
Appearance Figure 15-26 shows the appearance of the SDH trunk cable. Figure 15-26 Appearance of the SDH trunk cables
Cable Connections Table 15-39 lists the connections of the cables. Table 15-39 Connections of SDH trunk cables Connector
Position
SMB female connector
Connected to theMS2E or MS1E
Idle
Equipped with corresponding connector based on the model of the cable distribution rack in the equipment room
Technical Specifications Table 15-40 lists the technical specifications of the 155 Mbit/s trunk cable. Issue 05 (2009-01-09)
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Table 15-40 Technical specifications of the SDH trunk cable Item
Specification
Connector
Coaxial Connector, SMB, 75 ohm, Straight/Plug, Female
Cable
Coaxial Cable, Single Bare Copper, 75 ohm, 7.5 mm, 3.8 mm, 0.61 mm, PANTONE WARM GRAY 1U
Cable diameter
6.70 mm [1/4 in.]
Impedance
75 ohms
15.6 Internal Trunk Cables from SSM Frames to SIWF Frames This describes internal trunk cables between the SSM frame and the SIWF frame in terms of the application scenario, appearance, pin assignments, and technical specifications.
Application Scenario One end of the cable is the DB100 plug and the other end of the cable is eight 8-pin connectors for the network port. Each cable can be used by two SIWUs.
CAUTION Set the DIP switches of the E32 board to ensure that the characteristic impedance matching of the E32 board is 75 ohms. Table 15-41 lists the connections of this cable. Table 15-41 Connections of the internal trunk cable between the SSM frame and the SIWF frame Connector
Position
DB100 connector
DB100 E1/T1 interfaces on the E32/T32
Network interface connector
SIWU board in the SIWF frame
Appearance and Structure Figure 15-27 shows the appearance of the internal trunk cable between the SSM frame and the SIWF frame.
15-38
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Figure 15-27 Appearance of the internal trunk cable between the SSM frame and the SIWF frame
Figure 15-28 shows the structure of the internal trunk cable between the SSM frame and the SIWF frame. Figure 15-28 Structure of the internal trunk cable between the SSM frame and the SIWF frame W1.1
W2 X2
W1.2
M052 W1.3
W3
W1.4
W1.5
W4
W1.6
A Pos.100 M067
W1.7
W1
A
X3
X4 W5
W1.8
W1.9
X5 W6
W1.10
Pos.1
X1
W1.11
X6 W7
W1.12
W1.13
X7
W1.15
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B
B
W8
W1.14
W1.16
1 8
X8 W9 X9
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HUAWEI UMG8900 Hardware Description
15 Cables
Pin Assignment Table 15-42 lists the pin assignment of the DB100PIN connector of this cable. Table 15-42 pin assignment of the DB100PIN connector of the internal trunk cable between the SSM frame and the SIWF frame Pin
Coaxi al
Wire
Rema rk
Print
Pin
Coaxi al
Wire
Rema rk
Print
X1.2
TIP
W1.1
T1
X1.52
TIP
W1.9
T3
X1.3
RING
CHA NNEL 1
X1.53
RING
CHA NNEL 3
X1.5
RING
X1.55
RING
W1.10
R3
X1.6
TIP
X1.56
TIP
X1.8
TIP
X1.58
TIP
W1.11
R2
X1.9
RING
X1.59
RING
X1.11
RING
X1.61
RING
W1.12
T2
X1.12
TIP
X1.62
TIP
X1.14
TIP
X1.64
TIP
W1.13
T7
X1.15
RING
X1.65
RING
X1.17
RING
X1.67
RING
W1.14
R7
X1.18
TIP
X1.68
TIP
X1.20
TIP
X1.70
TIP
W1.15
R6
X1.21
RING
X1.71
RING
X1.23
RING
X1.73
RING
W1.16
T6
X1.24
TIP
X1.74
TIP
W1.2
W1.3
W1.4
W1.5
W1.6
W1.7
W1.8
R1
R0
CHA NNEL 0
T0
T5
CHA NNEL 5
R5
R4
T4
CHA NNEL 4
CHA NNEL 2
CHA NNEL 7
CHA NNEL 6
NOTE
In Table 15-42, TIP indicates the internal conductor of coaxial cable, RING indicates the external conductor of coaxial cable, R indicates receiving and T indicates transmitting. For example, RING R4 indicates the external conductor that is connected with E1 4 and is used to receive signals.
Technical Specifications Table 15-43 lists the technical specifications of this cable.
15-40
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15 Cables
Table 15-43 Technical specifications of the internal trunk cable between the SSM frame and the SIWF frame Item
Specification
Connector X1
Cable Connector, D Type, 100 PIN, Straight Male, Cable Solder Type, SCSI Type
Connector X2 to X9
Network port connector, 8-bit 8 PIN, shielded, crystal model connector
Cable W1
Coaxial cable, 16 single core Characteristic impedance: 75 ohm Diameter of the protection layer: 2.2 mm [0.09 in.] Diameter of the inner insulation layer: 1.2 mm [0.05 in.] Diameter of the inner conductor: 0.254 mm [0.01 in.] Color: white
Cable W2 to W9
Twisted-pair cable Characteristic impedance: 120 ohm Core diameter of the inner conductor: 0.4 mm [0.02 in.] Wire gauge of the inner conductor: 26 AWG Tips: 2 pairs Color: pantone 430U
15.7 Straight Through Cables and Crossover Cables This describes straight through cables and crossover cables in terms of the application scenario, appearance, pin assignments, and technical specifications.
Application Scenario The UMG8900 provides the interface to operate on, maintain, and manage the local maintenance terminal (LMT). The FE interface is designed with network card interface. The UMG8900 uses the straight through cable to connect to the media gateway controller (MGC) through the HUB or LAN Switch. The UM8900 uses the crossover cable to directly connect to the MGC. When the debug network port provided by the MOMU/MOMB is directly connected to the PC, the crossover cable is used. When the debug network port is connected to the PC through a HUB or a LAN Switch, the straight through cable is used.
Straight Through Cables l
Appearance Figure 15-29 shows the appearance of the straight through cable.
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HUAWEI UMG8900 Hardware Description
15 Cables
Figure 15-29 Appearance of straight through cable
1
8
l
Pin assignments Figure 15-30 shows the pin assignments of straight through cables. Figure 15-30 Pin assignments of straight through cables
SIDE 1 1 2 3 4 5 6 7 8
1--White/Orange 2--Orange 3--White/Green 4--Blue 5--White/Blue 6--Green
1 2 3 4 5 6 7 8
SIDE 2
l
7--White/Brown 8--Brown
Technical specifications Table 15-44 lists the technical specifications of the straight through cable. Table 15-44 Technical specifications of the straight through cable
15-42
Item
Specification
Connector X1/X2
Network Interface Connector, 8-Bit 8PIN, Shielded, Crystal Model Connector
Cable
Twisted-Pair Cable, 100 ohm, CAT5E SFTP, 0.51 mm, 24 AWG, 8 Cores, PANTONE430U
Number of cores
8 Cores
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15 Cables
Crossover Cables l
Appearance Figure 15-31 shows the appearance of the crossover cable. Figure 15-31 Appearance of crossover cable 8 1 X1
8 1 X2
l
Pin assignments Figure 15-32 shows the pin assignments of crossover cables. Figure 15-32 Pin assignments of crossover cables
SIDE 1
SIDE1
1 2 3 4 5 6 7 8
1--White/Orange
1 2 3 4 5 6 7 8
SIDE 2
l
SIDE2
2--Orange
1--White/Green 2--Green
3--White/Green 4--Blue
3--White/Orange 4--Blue
5--White/Blue
5--White/Blue
6--Green 7--White/Brown
6--Orange
8--Brown
7--White/Brown 8--Brown
Technical specifications Table 15-45 lists the technical specifications of the crossover cable. Table 15-45 Technical specifications of the crossover cable
Issue 05 (2009-01-09)
Item
Specification
Connector X1/X2
Network Interface Connector, 8-Bit 8PIN, Shielded, Crystal Model Connector
Cable
Twisted-Pair Cable, 100 ohm, CAT5E SFTP, 0.51 mm, 24 AWG, 8 Cores, PANTONE430U
Number of cores
8 Cores
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HUAWEI UMG8900 Hardware Description
15 Cables
15.8 Optical Fibers This describes optical fibers in terms of the application scenario, appearance, pin assignments, and technical specifications.
Application Scenario The optical connector connected to the UMG8900 is of LC/PC type. You need to select the proper optical connector according to the optical port of the peer device connected to the network interface module of the UMG8900. The single-mode optical port can only be connected to the single-mode optical fiber and the multi-mode optical port can only be connected to the multi-mode optical fiber. Before connecting the optical fiber, ensure the optical connector and optical fiber match the used optical port. The category of the optical fiber can be distinguished by fiber colors: The orange fiber is the multi-mode optical fiber and the yellow fiber is single-mode optical fiber.
Appearance and Structure Figure 15-33 shows the appearance of the multi-mode optical fiber. Figure 15-33 Appearance of the multi-mode optical fiber
Figure 15-34 shows the appearance of the single-mode optical fiber.
15-44
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15 Cables
Figure 15-34 Appearance of the single-mode optical fiber
Both ends of the multi-mode optical fiber and single-mode optical fiber are LC/PC connectors. Figure 15-35 shows the appearance of the LC/PC connector. Figure 15-35 Appearance of the LC/PC connector
Pin Assignment None
Technical Specifications Table 15-46 lists the technical specifications of the external optical fiber. Table 15-46 Technical specifications of the external optical fiber
Issue 05 (2009-01-09)
Item
Specification
Bending radius
Dynamic bending: 20D, no less than 50 mm [2.0 in.]
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HUAWEI UMG8900 Hardware Description
15 Cables
Item
Specification Static bending: 10D, no less than 30 mm [1.2 in.]
Maximum transmission distance
50 m [0.03 mi.]
Working temperature
–40℃ to +75℃ [–40℉ to 167℉]
NOTE
The minimum bending radius allowed by the optical fiber is indicated by the multiple of the cable diameter D.
15.9 Power Cables and PGND Cables This describes power cables and PGND cables in terms of the application scenario, appearance, pin assignments, and technical specifications. 15.9.1 Power Cables and PGND Cables for Cabinets This describes power cables and PGND cables for cabinets in terms of the application scenario, appearance, pin assignments, and technical specifications. 15.9.2 Power Cables and PGND Cables of Service Frames This describes power cables and PGND cables for service frames in terms of the application scenario, appearance, pin assignments, and technical specifications.
15.9.1 Power Cables and PGND Cables for Cabinets This describes power cables and PGND cables for cabinets in terms of the application scenario, appearance, pin assignments, and technical specifications.
–48 V Power Cables l
Application Scenario The –48 V power cable is used as the leadin of the –48 V power outside the cabinet. One end of the power cable is an OT terminal used for attaching the power cable to the wire post of the external power distribution cabinet. The other end is a cord end terminal used for attaching the power cable to the –48 V terminal block of the DC power distribution frame (PDF) in the cabinet.
l
Appearance Figure 15-36 shows the appearance of –48 V power cables.
15-46
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15 Cables
Figure 15-36 Appearance of the –48 V power cables
l
Cable connections None
l
Technical Specifications Table 15-47 lists the technical specifications of –48 V power cables. Table 15-47 Technical specifications of –48 V power cables Item
Specification
Color
Blue
Conductor section
25 mm2 [0.04 in.2]
Maximum current
110 A
Working temperature
–10℃ to 70℃ [14℉ to 158℉]
Inner conductor impedance
0.78 ohm
RTN Power Cables l
Application Scenario The RTN power cable is used as the leadin of the –48 V power outside the cabinet. One end of the power cable is an OT terminal used for attaching the power cable to the GND wire post of the external power distribution cabinet. The other end is a cord end terminal used for attaching the power cable to the RTN terminal block of the DC PDF in the cabinet.
l
Appearance Figure 15-37 shows the appearance of the RTN power cable.
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HUAWEI UMG8900 Hardware Description
15 Cables
Figure 15-37 Appearance of the RTN power cables
l
Cable connections None
l
Technical specifications Table 15-48 lists the technical specifications of RTN power cables. Table 15-48 Technical specifications of RTN power cables Item
Specification
Color
Black
Conductor section
25 mm2 [0.04 in.2]
Maximum current
110 A
Working temperature
–10℃ to 70℃ [14℉ to 158℉]
Inner conductor impedance
0.78 ohm
PGND Cables l
Application Scenario The protection ground (PGND) cable is used as the PGND leadin outside the cabinet. Both the ends of the PGND cable are OT terminals. One end of the cable is connected to the protection grounding bar of the power distribution cabinet. The other end is connected to the grounding bolt at the top of the cabinet.
l
Appearance Figure 15-38 shows the appearance of the PGND cable.
15-48
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Figure 15-38 Appearance of the PGND cables
l
Cable connections None
l
Technical specifications Table 15-49 lists the technical specifications of PGND cables. Table 15-49 Technical specifications of PGND cables Item
Specification
Color
Yellow and green
Conductor section
25 mm2 [0.04 in.2]
Maximum current
110 A
Working temperature
–10℃ to 70℃ [14℉ to 158℉]
Inner conductor impedance
0.78 ohm
PGND Feeder Cable l
Application Scenario The PGND feeder cable is used for grounding of chained cabinets. The PGND feeder cable is also used for connecting the grounding terminal of the lower enclosure frame of the cabinet to the grounding terminal of the cabinet door. This ensures that each part of the cabinet is grounded properly.
l
Appearance Figure 15-39 shows the appearance of the PGND feeder cable.
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HUAWEI UMG8900 Hardware Description
15 Cables
Figure 15-39 Appearance of the PGND feeder cable
l
Cable connections None
l
Technical Specifications Table 15-50 lists the technical specifications of the PGND feeder cable. Table 15-50 Technical specifications of the PGND feeder cable Parameter
Description
Cable connector (X1/X2)
OT6-6/OT6-6
Color
Yellow and green
Conductor section
0 mm2
Maximum current
50.0 A
Working temperature
0℃ to 40℃ [32℉ to 104℉]
Inner conductor impedance
3.76 ohm
15.9.2 Power Cables and PGND Cables of Service Frames This describes power cables and PGND cables for service frames in terms of the application scenario, appearance, pin assignments, and technical specifications.
Power Cables from Power Distribution Frames to SSM Frames l
Application Scenario This cable is used to supply power for the SSM frame. The power cables are used in pairs. The blue one is –48 V power cable and the black one is RTN cable. The left end is cord end terminal, connected to the power distribution frame, and the right end is OT terminal, connected to the feed-through filter of the SSM frame.
l
Appearance Figure 15-40 shows its appearance.
15-50
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15 Cables
Figure 15-40 Power cables from power distribution frames to SSM frames -48V RTN
l
Pin assignment None
l
Technical Specifications The cable is made of UL1015 10AWG wire materials, and its maximum current capacity is 50 A.
Power Cables from SSM Frames to Fan Boxes
CAUTION l
It is forbidden to pull out or insert the power cable of the fan box with power on.
l
The SSM frames are of two versions. In the SSM frame of the new version, the fan box is not equipped with the power input interface and monitoring interface. The power cables from SSM frames to fan boxes only used in the SSM frame of the earlier version.
l
Application Scenario This cable is used to supply power for the fan box. One end of this cable is a 3V3 connector, connected to the 3V3 socket at the back of the UMG8900 frame, and the other end has two 3V3 connectors, connected to the 3V3 sockets of the master/slave power input at the back of the corresponding fan box respectively.
l
Appearance Figure 15-41 shows its appearance. Figure 15-41 Power cables from SSM frames to fan boxes A A3 A2 A1
A
X2 X1 X3
l
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15-51
HUAWEI UMG8900 Hardware Description
15 Cables
None l
Technical Specifications The maximum current capacity of this cable is 18 A.
PGND Feeder Cables of SSM Frames l
Application Scenario The PGND feeder cable of SSM frame is used to connect with the protection ground of a frame and grounding bar of the cabinet. This cable is yellow and green, with OT terminals at both ends. Each SSM frame has two grounding cables. One end of the cable is connected to the grounding point (one point at each of left and right sides) at the back of the SSM frame, and the other end to the grounding bar of the cabinet. The terminals are fastened with M6 screws.
l
Appearance Figure 15-42 shows the appearance of the PGND feeder cable of SSM frame. Figure 15-42 Appearance of the PGND feeder cable of SSM frame
l
Pin assignment None
l
Technical Specifications Table 15-51 lists the technical specifications of the PGND feeder cable of SSM frame. Table 15-51 Technical specifications of the PGND feeder cable of SSM frame
15-52
Parameter
Description
Cable connector (X1/X2)
OT6-6/OT6-6
Color
Yellow and green
Conductor section
0 mm2
Maximum current
50.0 A
Working temperature
0℃ to 40℃ [32℉ to 104℉]
Inner conductor impedance
3.76 ohm
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A Impedance Transfer Boxes
A
Impedance Transfer Boxes
There are two types of impedance transfer boxes, namely, 120 ohm-75 ohm transfer box with the BNC socket and 120 ohm-75 ohm transfer box with the SMB socket. The dimensions (L x W x H) are 488 mm x 40 mm x 28 mm, that is 19.2 in. x 1.6 in. x 1.1 in. The two transfer boxes differ only in the 75-ohm coaxial connector. One is the SMB and the other is BNC, which can be adopted based on actual conditions. Figure A-1 shows the method for using the impedance transfer box. Figure A-1 Method for using the impedance transfer box 1
2
3
4
TX RX 1. 75-ohm coaxial cable
2. Coaxial cable connector
3. RJ45 connector
4. 120-ohm twisted pair
The impedance transfer box connects with the 75-ohm cable through the SMB or BNC coaxial connector at one end, and connects with the 120-ohm cable through the connector at the other end. The 75-ohm cable connects with the SMB female connector or the BNC male connector at one end, and connects with the cabling rack or directly with the equipment at the other end. The 120ohm cable connects with the 8-pin connector at one end, and connects with the cabling rack or directly with the equipment at the other end. The method for crimping the 75-ohm cable into the coaxial connector is not described here. The special crimping pliers are needed to crimp the 120-ohm cable into the RJ45 connector. Figure A-2 shows the appearance of the RJ45 connector. Issue 05 (2009-01-09)
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A-1
HUAWEI UMG8900 Hardware Description
A Impedance Transfer Boxes
Figure A-2 Appearance of the RJ45 connector 8 1
Table A-1 lists the pin assignment of the RJ45 connector connecting with the 120-ohm twisted pair. Table A-1 Pin assignment of the RJ45 connector of the 120-ohm twisted pair
A-2
Pin No.
Definition
1
RX-
2
RX+
3
PGND
4
TX-
5
TX+
6
PGND
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B
B Board Indicators of All SSM Frames
Board Indicators of All SSM Frames
B.1 Indicators on the MA4L B.2 Indicators on the MASU B.3 Indicators on the MBLU B.4 Indicators on the MCMB B.5 Indicators on the MCMF B.6 Indicators on the ME32 B.7 Indicators on the ME8T B.8 Indicators on the MEAC B.9 Indicators on the MECU B.10 Indicators on the MESU B.11 Indicators on the MFLU B.12 Indicators on the MG1O B.13 Indicators on the MHRU B.14 Indicators on the MHRD B.15 Indicators on the MIOE B.16 Indicators on the MMPB B.17 Indicators on the MMPU B.18 Indicators on the MNET B.19 Indicators on the MNLU Issue 05 (2009-01-09)
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B-1
B Board Indicators of All SSM Frames
HUAWEI UMG8900 Hardware Description
B.20 Indicators on the MOMB B.21 Indicators on the MOMU B.22 Indicators on the MPIE B.23 Indicators on the MPPB B.24 Indicators on the MRPU B.25 Indicators on the MS1E B.26 Indicators on the MS1L B.27 Indicators on the MS2E B.28 Indicators on the MS2L B.29 Indicators on the MSPF B.30 Indicators on the MT32 B.31 Indicators on the MTAC B.32 Indicators on the MTCB B.33 Indicators on the MTCD B.34 Indicators on the MTNB B.35 Indicators on the MTNC B.36 Indicators on the MTNU B.37 Indicators on the MTSU B.38 Indicators on the MVPB B.39 Indicators on the MVPD B.40 Indicators on the TCLU B.41 Indicators on the SCMU
B-2
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B Board Indicators of All SSM Frames
B.1 Indicators on the MA4L Table B-1 lists the meaning of the indicators on the MA4L. Table B-1 Indicator meaning of the MA4L Indicator
Identificat ion
Color
Status
Meaning
Board running indicator
RUN
Green
Always on
There is power supply, but the board is faulty.
Always off
There is no power supply, or the board is faulty.
Flashing (on for 1 second, off for another second)
The board runs normally in accordance with configuration.
Always on or flashing fast
Alarms occur to the board.
Always off
No fault occurs.
Flashing
The board is in service such as in the master or connected state.
Always off
The board is out of service such as in the slave or disconnected state.
Always on
The link is normal.
Always off
The link is faulty.
Always on or flashing
Some data is received or transmitted through the link.
Always off
No data is received or transmitted through the link.
Always on
The board can be removed.
Always off
The board cannot be removed at the moment.
Board alarm indicator
ALM
Board working indicator
ACT
Optical interface link indicator
LINK
Optical interface working indicator
ACT
Hot-pluggable indicator
OFFLINE
Red
Green
Green
Orange
Blue
B.2 Indicators on the MASU Table B-2 lists the indicator meaning of the MASU.
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B-3
HUAWEI UMG8900 Hardware Description
B Board Indicators of All SSM Frames
Table B-2 Indicator meaning of the MASU Indicator
Identificat ion
Color
Status
Meaning
Running indicator
RUN
Green
Always on
There is power supply, but the board is faulty.
Always off
There is no power supply, or the board is faulty.
Flashing (on for 1 second, off for another second)
The board runs normally in accordance with configuration.
Flashing fast (4 times per second)
Software is being loaded to the board, or the board does not run.
Flashing slowly (on for 2 seconds, off for another 2 seconds)
The board is isolated.
Always on or flashing fast
Alarms occur to the board.
Always off
No fault occurs.
Flashing
The board is in service such as in the master state.
Always off
The board is out of service such as in the slave state.
Always on
The board can be removed.
Always off
The board cannot be removed at the moment.
Alarm indicator
Working indicator
Hot-pluggable indicator
ALM
ACT
OFFLINE
Red
Green
Blue
B.3 Indicators on the MBLU Table B-3 lists the meaning of the indicators on the MBLU. Table B-3 Indicator meaning of the MBLU
B-4
Indicator
Identificati on
Color
Status
Meaning
Running indicator
RUN
Green
Always on
There is power supply, but the board is faulty.
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B Board Indicators of All SSM Frames
Indicator
Alarm indicator
Working indicator
Identificati on
ALM
ACT
Optical fiber connection state indicator
LINK
Master optical channel indicator
ACT
Hot-pluggable indicator
OFFLINE
Color
Red
Green
Green
Orange
Blue
Status
Meaning
Always off
There is no power supply, or the board is faulty.
Flashing (on for 1 second, off for another second)
The board runs normally in accordance with configuration.
Flashing fast (4 times per second)
Software is being loaded to the board, or the board does not run.
Always on or flashing fast
Alarms occur to the board.
Always off
No fault occurs.
Flashing
The board is in service such as in the master state.
Always off
The board is out of service such as in the slave state.
Always on
Optical fiber connection is normal.
Always off
Optical fiber connection is abnormal.
Always on or flashing
The optical channel that corresponds to the optical module is in the master state.
Always off
The optical channel that corresponds to the optical module is in the slave state.
Always on
The board can be removed.
Always off
The board cannot be removed at the moment.
B.4 Indicators on the MCMB Table B-4 lists the meaning of the indicators on the MCMB.
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B-5
HUAWEI UMG8900 Hardware Description
B Board Indicators of All SSM Frames
Table B-4 Indicator meaning of the MCMB Indicator
Identificat ion
Color
Status
Meaning
Running indicator
RUN
Green
Always on
There is power supply, but the board is faulty.
Always off
There is no power supply, or the board is faulty.
Flashing (on for 1 second, off for another second)
The board runs normally in accordance with configuration.
Flashing fast (4 times per second)
Software is being loaded to the board, or the board does not run.
Always on or flashing fast
Alarms occur to the board.
Always off
No fault occurs.
Always on or flashing
The board is in service such as in the master state.
Always off
The board is out of service such as in the slave state.
Always on
The board can be removed.
Always off
The board cannot be removed at the moment.
Alarm indicator
Working indicator
Hot-pluggable indicator
ALM
ACT
OFFLINE
Red
Green
Blue
B.5 Indicators on the MCMF Table B-5 lists the meaning of the indicators on the MCMF. Table B-5 Indicator meaning of the MCMF
B-6
Indicator
Identificat ion
Color
Status
Meaning
Running indicator
RUN
Green
Always on
There is power supply, but the board is faulty.
Always off
There is no power supply, or the board is faulty.
Flashing (on for 1 second, off for another second)
The board runs normally in accordance with configuration.
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B Board Indicators of All SSM Frames
Indicator
Alarm indicator
Working indicator
Hot-pluggable indicator
Identificat ion
ALM
ACT
OFFLINE
Color
Red
Green
Blue
Status
Meaning
Flashing fast (4 times per second)
Software is being loaded to the board, or the board does not run.
Always on or flashing fast
Alarms occur to the board.
Always off
No fault occurs.
Flashing
The board is in service such as in the master state.
Always off
The board is out of service such as in the slave state.
Always on
The board can be removed.
Always off
The board cannot be removed at the moment.
B.6 Indicators on the ME32 Table B-6 lists the meaning of the indicators on the ME32. Table B-6 Indicator meaning of the ME32
Issue 05 (2009-01-09)
Indicator
Identificat ion
Color
Status
Meaning
Running indicator
RUN
Green
Always on
There is power supply, but the board is faulty.
Always off
There is no power supply, or the board is faulty.
Flashing (on for 1 second, off for another second)
The board runs normally in accordance with configuration.
Flashing fast (4 times per second)
Software is being loaded to the board, or the board does not run.
Flashing slowly (on for 2 seconds, off for another 2 seconds)
The board is isolated.
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B-7
HUAWEI UMG8900 Hardware Description
B Board Indicators of All SSM Frames
Indicator
Identificat ion
Color
Status
Meaning
Alarm indicator
ALM
Red
Always on or flashing fast
Alarms occur to the board.
Always off
No fault occurs.
Always on
The board can be removed.
Always off
The board cannot be removed at the moment.
Hot-pluggable indicator
OFFLINE
Blue
B.7 Indicators on the ME8T Table B-7 lists the meaning of the indicators on the ME8T. Table B-7 Indicator meaning of the ME8T Indicator
Identificat ion
Color
Status
Meaning
Board running indicator
RUN
Green
Always on
There is power supply, but the board is faulty.
Always off
There is no power supply, or the board is faulty.
Flashing (on for 1 second, off for another second)
The board runs normally in accordance with configuration.
Always on or flashing fast
Alarms occur to the board.
Always off
No fault occurs.
Flashing
The board is in service such as in the master state.
Always off
The board is out of service such as in the slave state.
Always on
The interface works at the rate of 100 Mbit/s.
Always off
The interface works at the rate of 10 Mbit/s.
Always on
The link is through.
Always off
The link is not through.
Board alarm indicator
ALM
Board working indicator
B-8
ACT
Network interface speed indicator
-
Network interface connection indicator
-
Red
Green
Green
Orange
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Issue 05 (2009-01-09)
HUAWEI UMG8900 Hardware Description
B Board Indicators of All SSM Frames
Indicator
Hot-pluggable indicator
Identificat ion
Color
OFFLINE
Blue
Status
Meaning
Always on or flashing
Some data is being received or transmitted through the link.
Always on
The board can be removed.
Always off
The board cannot be removed at the moment.
B.8 Indicators on the MEAC Table B-8 lists the meaning of the indicators on the MEAC. Table B-8 Indicator meaning of the MEAC Indicator
Identific ation
Color
Status
Meaning
Board running indicator
RUN
Green
Always on
There is power supply, but the board is faulty.
Always off
There is no power supply, or the board is faulty.
Flashing (on for 1 second, off for another second)
The board runs normally in accordance with configuration.
Flashing fast (4 times per second)
Software is being loaded to the board, or the board does not run.
Always on or flashing fast
Alarms occur to the board.
Always off
No fault occurs.
Flashing
The board is in service such as in the master state.
Always off
The board is out of service such as in the slave state.
Always on
The board can be removed.
Always off
The board cannot be removed at the moment.
Board alarm indicator
Board master indicator
Hot-pluggable indicator
ALM
ACT
OFFLINE
Red
Green
Blue
B.9 Indicators on the MECU Issue 05 (2009-01-09)
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B-9
HUAWEI UMG8900 Hardware Description
B Board Indicators of All SSM Frames
Table B-9 lists the meaning of the indicators on the MECU. Table B-9 Indicator meaning of the MECU Indicator
Identificat ion
Color
Status
Meaning
Running indicator
RUN
Green
Always on
There is power supply, but the board is faulty.
Always off
There is no power supply, or the board is faulty.
Flashing (on for 1 second, off for another second)
The board runs normally in accordance with configuration.
Flashing fast (4 times per second)
Software is being loaded to the board, or the board does not run.
Flashing slowly (on The board is isolated. for 2 seconds, off for another 2 seconds) Alarm indicator
Hot-pluggable indicator
ALM
OFFLINE
Red
Blue
Always on or flashing fast
Alarms occur to the board.
Always off
No fault occurs.
Always on
The board can be removed.
Always off
The board cannot be removed at the moment.
B.10 Indicators on the MESU Table B-10 lists the meaning of the indicators on the MESU. Table B-10 Indicator meaning of the MESU
B-10
Indicator
Identific ation
Color
Status
Meaning
Running indicator
RUN
Green
Always on
There is power supply, but the board is faulty.
Always off
There is no power supply, or the board is faulty.
Flashing (on for 1 second, off for another second)
The board runs normally in accordance with configuration.
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Issue 05 (2009-01-09)
HUAWEI UMG8900 Hardware Description
B Board Indicators of All SSM Frames
Indicator
Alarm indicator
Hot-pluggable indicator
Identific ation
ALM
OFFLINE
Color
Red
Blue
Status
Meaning
Flashing fast (4 times per second)
Software is being loaded to the board, or the board does not run.
Flashing slowly (on for 2 seconds, off for another 2 seconds)
The board is isolated.
Always on or flashing fast
Alarms occur to the board.
Always off
No fault occurs.
Always on
The board can be removed.
Always off
The board cannot be removed at the moment.
B.11 Indicators on the MFLU Table B-11 lists the meaning of the indicators on the MFLU. Table B-11 Indicator meaning of the MFLU Indicator
Identificat ion
Color
Status
Meaning
Running indicator
RUN
Green
Always on
There is power supply, but the board is faulty.
Always off
There is no power supply, or the board is faulty.
Flashing (on for 1 second, off for another second)
The board runs normally in accordance with configuration.
Flashing fast (4 times per second)
Software is being loaded to the board, or the board does not run.
Always on or flashing fast
Alarms occur to the board.
Always off
No fault occurs.
Flashing
The board is in service such as in the master state.
Alarm indicator
Working indicator
Issue 05 (2009-01-09)
ALM
ACT
Red
Green
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B-11
HUAWEI UMG8900 Hardware Description
B Board Indicators of All SSM Frames
Indicator
Identificat ion
Hot-pluggable indicator
OFFLINE
Color
Blue
Status
Meaning
Always off
The board is out of service such as in the slave state.
Always on
The board can be removed.
Always off
The board cannot be removed at the moment.
B.12 Indicators on the MG1O Table B-12 lists the meaning of the indicators on the MG1O. Table B-12 Indicator meaning of the MG1O Indicator
Identificat ion
Color
Status
Meaning
Running indicator
RUN
Green
Always on
There is power supply, but the board is faulty.
Always off
There is no power supply, or the board is faulty.
Flashing (on for 1 second, off for another second)
The board runs normally in accordance with configuration.
Always on or flashing fast
Alarms occur to the board.
Always off
No fault occurs.
Flashing
The board is in service such as in the master state.
Always off
The board is out of service such as in the slave or disconnected state.
Always on
The link is through.
Always off
No data is received and transmitted or the link is not through.
Flashing
Some data is received or transmitted through the link.
Alarm indicator
Working indicator
B-12
ALM
ACT
Gigabit optical interface link indicator
LINK
Gigabit optical interface working indicator
ACT
Red
Green
Green
Orange
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Issue 05 (2009-01-09)
HUAWEI UMG8900 Hardware Description
B Board Indicators of All SSM Frames
Indicator
Hot-pluggable indicator
Identificat ion
OFFLINE
Color
Blue
Status
Meaning
Always off
No data is received and transmitted or the link is not through.
Always on
The board can be removed.
Always off
The board cannot be removed at the moment.
B.13 Indicators on the MHRU Table B-13 lists the meaning of the indicators on the MHRU. Table B-13 Indicator meaning of the MHRU Indicator
Identificat ion
Color
Status
Meaning
Running indicator
RUN
Green
Always on
There is power supply, but the board is faulty.
Always off
There is no power supply, or the board is faulty.
Flashing (on for 1 second, off for another second)
The board runs normally in accordance with configuration.
Flashing fast (4 times per second)
Software is being loaded to the board, or the board does not run.
Flashing slowly (on for 2 seconds, off for another 2 seconds)
The board is isolated.
Always on or flashing fast
Alarms occur to the board.
Always off
No fault occurs.
Always on or flashing
The board is in service such as in the master state.
Always off
The board is out of service such as in the slave state.
Always on
The board can be removed.
Alarm indicator
Working indicator
Hot-pluggable indicator Issue 05 (2009-01-09)
ALM
ACT
OFFLINE
Red
Green
Blue
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B-13
HUAWEI UMG8900 Hardware Description
B Board Indicators of All SSM Frames
Indicator
Identificat ion
Color
Status
Meaning
Always off
The board cannot be removed at the moment.
B.14 Indicators on the MHRD Table B-14 lists the meaning of the indicators on the MHRD. Table B-14 Indicator meaning of the MHRD Indicator
Identificat ion
Color
Status
Meaning
Running indicator
RUN
Green
Always on
There is power supply, but the board is faulty.
Always off
There is no power supply, or the board is faulty.
Flashing (on for 1 second, off for another second)
The board runs normally in accordance with configuration.
Flashing fast (4 times per second)
Software is being loaded to the board, or the board does not run.
Flashing slowly (on for 2 seconds, off for another 2 seconds)
The board is isolated.
Always on or flashing fast
Alarms occur to the board.
Always off
No fault occurs.
Flashing
The board is in service such as in the master state.
Always off
The board is out of service such as in the slave state.
Always on
The board can be removed.
Always off
The board cannot be removed at the moment.
Alarm indicator
Working indicator
Hot-pluggable indicator
ALM
ACT
OFFLINE
Red
Green
Blue
B.15 Indicators on the MIOE B-14
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Issue 05 (2009-01-09)
HUAWEI UMG8900 Hardware Description
B Board Indicators of All SSM Frames
Table B-15 lists the meaning of the indicators on the MIOE. Table B-15 Indicator meaning of the MIOE Indicator
Identificat ion
Color
Status
Meaning
Running indicator
RUN
Green
Always on
There is power supply, but the board is faulty.
Always off
There is no power supply, or the board is faulty.
Flashing (on for 1 second, off for another second)
The board runs normally in accordance with configuration.
Flashing fast (4 times per second)
Software is being loaded to the board, or the board does not run.
Flashing slowly (on for 2 seconds, off for another 2 seconds)
The board is isolated.
Always on or flashing fast
Alarms occur to the board.
Always off
No fault occurs.
Flashing
The board is in service such as in the master state.
Always off
The board is out of service such as in the slave state.
Always on
The board can be removed.
Always off
The board cannot be removed at the moment.
Alarm indicator
Working indicator
Hot-pluggable indicator
ALM
ACT
OFFLINE
Red
Green
Blue
B.16 Indicators on the MMPB Table B-16 lists the meaning of the indicators on the MMPB.
Issue 05 (2009-01-09)
Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd.
B-15
HUAWEI UMG8900 Hardware Description
B Board Indicators of All SSM Frames
Table B-16 Indicator meaning of the MMPB Indicator
Identific ation
Color
Status
Meaning
Running indicator
RUN
Green
Always on
There is power supply, but the board is faulty.
Always off
There is no power supply, or the board is faulty.
Flashing (on for 1 second, off for another second)
The board runs normally in accordance with configuration.
Flashing fast (4 times per second)
Software is being loaded to the board, or the board does not run.
Always on or flashing fast
Alarms occur to the board.
Always off
No fault occurs.
Flashing
The board is in service such as in the master state.
Always off
The board is out of service such as in the slave state.
Always on
The board can be removed.
Always off
The board cannot be removed at the moment.
Alarm indicator
Working indicator
Hot-pluggable indicator
ALM
ACT
OFFLINE
Red
Green
Blue
B.17 Indicators on the MMPU Table B-17 lists the meaning of the indicators on the MMPU. Table B-17 Indicator meaning of the MMPU
B-16
Indicator
Identifica tion
Color
Status
Meaning
Running indicator
RUN
Green
Always on
There is power supply, but the board is faulty.
Always off
There is no power supply, or the board is faulty.
Flashing (on for 1 second, off for another second)
The board runs normally in accordance with configuration.
Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd.
Issue 05 (2009-01-09)
HUAWEI UMG8900 Hardware Description
B Board Indicators of All SSM Frames
Indicator
Alarm indicator
Working indicator
Hot-pluggable indicator
Identifica tion
ALM
ACT
OFFLINE
Color
Red
Green
Blue
Status
Meaning
Flashing fast (4 times per second)
Software is being loaded to the board, or the board does not run.
Always on or flashing fast
Alarms occur to the board.
Always off
No fault occurs.
Always on or flashing
The board is in service such as in the master state.
Always off
The board is out of service such as in the slave state.
Always on
The board can be removed.
Always off
The board cannot be removed at the moment.
B.18 Indicators on the MNET Table B-18 lists the meaning of the indicators on the MNET. Table B-18 Indicator meaning of the MNET Indicator
Identificati on
Color
Status
Meaning
Running indicator
RUN
Green
Always on
There is power supply, but the board is faulty.
Always off
There is no power supply, or the board is faulty.
Flashing (on for 1 second, off for another second)
The board runs normally in accordance with configuration.
Flashing fast (4 times per second)
Software is being loaded to the board, or the board does not run.
Always on or flashing fast
Alarms occur to the board.
Always off
No fault occurs.
Alarm indicator
Issue 05 (2009-01-09)
ALM
Red
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B-17
HUAWEI UMG8900 Hardware Description
B Board Indicators of All SSM Frames
Indicator
Identificati on
Color
Status
Meaning
Working indicator
ACT
Green
Flashing
The board is in service such as in the master state.
Always off
The board is out of service such as in the slave state.
Always on
The received optical power meets the requirement.
Always off
The received optical power does not meet the requirement.
Always on or flashing
The optical channel that corresponds to the optical module is in the master state.
Always off
The optical channel that corresponds to the optical module is in the slave state.
Always on
The board can be removed.
Always off
The board cannot be removed at the moment.
Optical fiber connection state indicator
Master optical channel indicator
Hot-pluggable indicator
LINK
ACT
Green
Orange
OFFLINE
Blue
The indicators of CLK0_IN and CLK1_IN interfaces on the panel of the MNET have no silkscreen. Table B-19 lists the meaning. Table B-19 Indicator meaning of clock interfaces on the MNET Indicator
Color
Status
Meaning
CLK0_IN
Orange
Always on
The MNET provides master clock for the frame where it is located.
Always off
The MNET does not provide clock for any frame, but it is in hot backup mode.
Always on
The MNET receives normal clock signals from the CLK in slot 0 through the backplane or clock cable.
Always off
The MNET receives abnormal clock signals from the CLK in slot 0 through the backplane or clock cable.
Green
B-18
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Issue 05 (2009-01-09)
HUAWEI UMG8900 Hardware Description
B Board Indicators of All SSM Frames
Indicator
Color
Status
Meaning
CLK1_IN
Orange
Always on
The interface on the panel of the MNET extracts clock signals from clock distribution cable normally.
Always off
The MNET extracts clock signals from the backplane.
Always on
The MNET receives normal clock signals from the CLK in slot 1 through the backplane or clock cable.
Always off
The MNET receives abnormal clock signals from the CLK in slot 1 through the backplane or clock cable.
Green
B.19 Indicators on the MNLU Table B-20 lists the meaning of the indicators on the MNLU. Table B-20 Indicator meaning of the MNLU Indicator
Identificati on
Color
Status
Meaning
Running indicator
RUN
Green
Always on
There is power supply, but the board is faulty.
Always off
There is no power supply, or the board is faulty.
Flashing (on for 1 second, off for another second)
The board runs normally in accordance with configuration.
Flashing fast (4 times per second)
The board is being loaded or it does not work.
Always on or flashing fast
Alarms occur to the board.
Always off
No fault occurs.
Always on
Optical fiber connection is normal.
Always off
Optical fiber connection is abnormal.
Alarm indicator
Optical fiber connection state indicator
Issue 05 (2009-01-09)
ALM
LINK
Red
Green
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B-19
HUAWEI UMG8900 Hardware Description
B Board Indicators of All SSM Frames
Indicator
Identificati on
Color
Status
Meaning
Master optical channel indicator
ACT
Orange
Always on or flashing
The optical channel that corresponds to the optical module is in the master state.
Always off
The optical channel that corresponds to the optical module is in the slave state.
Always on
The board can be removed.
Always off
The board cannot be removed at the moment.
Hot-pluggable indicator
OFFLINE
Blue
B.20 Indicators on the MOMB Table B-21 lists the meaning of indicators on the MOMB. Table B-21 Indicator meaning of the MOMB Indicator
Identifica tion
Color
Status
Meaning
Running indicator
RUN
Green
Always on
There is power supply, but the board is faulty.
Always off
There is no power supply, or the board is faulty.
Flashing (on for 1 second, off for another second)
The board runs normally in accordance with configuration.
Flashing fast (4 times per second)
Software is being loaded to the board, or the board does not run.
Always on or flashing fast
Alarms occur to the board.
Always off
No fault occurs.
Always on or flashing
The board is in service such as in the master state.
Always off
The board is out of service such as in the slave state.
Alarm indicator
Working indicator
B-20
ALM
ACT
Red
Green
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Issue 05 (2009-01-09)
HUAWEI UMG8900 Hardware Description
B Board Indicators of All SSM Frames
Indicator
Identifica tion
Color
Status
Meaning
Hot-pluggable indicator
OFFLINE
Blue
Always on
The board can be removed.
Always off
The board cannot be removed at the moment.
B.21 Indicators on the MOMU Table B-22 lists the meaning of the indicators on the MOMU. Table B-22 Indicator meaning of the MOMU Indicator
Identific ation
Color
Status
Meaning
Running indicator
RUN
Green
Always on
There is power supply, but the board is faulty.
Always off
There is no power supply, or the board is faulty.
Flashing (on for 1 second, off for another second)
The board runs normally in accordance with configuration.
Flashing fast (4 times per second)
Software is being loaded to the board, or the board does not run.
Always on or flashing fast
Alarms occur to the board.
Always off
No fault occurs.
Flashing
The board is in service such as in the master state.
Always off
The board is out of service such as in the slave state.
Always on
The board can be removed.
Always off
The board cannot be removed at the moment.
Alarm indicator
Working indicator
Hot-pluggable indicator
ALM
ACT
OFFLINE
Red
Green
Blue
B.22 Indicators on the MPIE Table B-23 lists the meaning of the indicators on the MPIE. Issue 05 (2009-01-09)
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B-21
HUAWEI UMG8900 Hardware Description
B Board Indicators of All SSM Frames
Table B-23 Indicator meaning of the MPIE Indicator
Identificat ion
Color
Status
Meaning
Running indicator
RUN
Green
Always on
There is power supply, but the board is faulty.
Always off
There is no power supply, or the board is faulty.
Flashing (on for 1 second, off for another second)
The board runs normally in accordance with configuration.
Flashing fast (4 times per second)
The board is being loaded or it does not work.
Flashing slowly (on for 2 seconds, off for another 2 seconds)
The board is isolated.
Always on or flashing fast
Alarms occur to the board.
Always off
The board is out of service such as in the slave state.
Flashing
The board is in service such as in the master state.
Always off
The board is out of service such as in the slave state.
Always on
The line is in the synchronous state and the line specifications meet the requirements.
Always off
The line is in the asynchronous state and the line specifications do not meet the requirements.
Always on or flashing
The interface is in master state.
Always off
The interface is in slave state.
Always on
The board can be removed.
Alarm indicator
Working indicator
Service interface link connection indicator
B-22
ALM
ACT
LINK
Service interface master indicator
ACT
Hot-pluggable indicator
OFFLINE
Red
Green
Green
Orange
Blue
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Issue 05 (2009-01-09)
HUAWEI UMG8900 Hardware Description
B Board Indicators of All SSM Frames
Indicator
Identificat ion
Color
Status
Meaning
Always off
The board cannot be removed at the moment.
B.23 Indicators on the MPPB Table B-24 lists the meaning of the indicators on the MPPB. Table B-24 Indicator meaning of the MPPB Indicator
Identificat ion
Color
Status
Meaning
Running indicator
RUN
Green
Always on
There is power supply, but the board is faulty.
Always off
There is no power supply, or the board is faulty.
Flashing (on for 1 second, off for another second)
The board runs normally in accordance with configuration.
Flashing fast (4 times per second)
Software is being loaded to the board, or the board does not run.
Always on or flashing fast
Alarms occur to the board.
Always off
No fault occurs.
Always on
The board can be removed.
Always off
The board cannot be removed at the moment.
Alarm indicator
Hot-pluggable indicator
ALM
OFFLINE
Red
Blue
B.24 Indicators on the MRPU Table B-25 lists the indicator meaning of the MRPU.
Issue 05 (2009-01-09)
Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd.
B-23
HUAWEI UMG8900 Hardware Description
B Board Indicators of All SSM Frames
Table B-25 Indicator meaning of the MRPU Indicator
Identificat ion
Color
Status
Meaning
Running indicator
RUN
Green
Always on
There is power supply, but the board is faulty.
Always off
There is no power supply, or the board is faulty.
Flashing (on for 1 second, off for another second)
The board runs normally in accordance with configuration.
Flashing fast (4 times per second)
Software is being loaded to the board, or the board does not run.
Flashing slowly (on for 2 seconds, off for another 2 seconds)
The board is isolated.
Always on or flashing fast
Alarms occur to the board.
Always off
No fault occurs.
Always on or flashing
The board is in service such as in the master state.
Always off
The board is out of service such as in the slave state.
Always on
The board can be removed.
Always off
The board cannot be removed at the moment.
Alarm indicator
Working indicator
Hot-pluggable indicator
ALM
ACT
OFFLINE
Red
Green
Blue
B.25 Indicators on the MS1E Table B-26 lists the meaning of the indicators on the MS1E. Table B-26 Indicator meaning of the MS1E
B-24
Indicator
Identificat ion
Color
Status
Meaning
Board running indicator
RUN
Green
Always on
There is power supply, but the board is faulty.
Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd.
Issue 05 (2009-01-09)
HUAWEI UMG8900 Hardware Description
B Board Indicators of All SSM Frames
Indicator
Board alarm indicator
Board master indicator
Service interface link connection indicator
Issue 05 (2009-01-09)
Identificat ion
ALM
ACT
LINK
Service interface master indicator
ACT
Hot-pluggable indicator
OFFLINE
Color
Red
Green
Green
Orange
Blue
Status
Meaning
Always off
There is no power supply, or the board is faulty.
Flashing (on for 1 second, off for another second)
The board runs normally in accordance with configuration.
Flashing fast (4 times per second)
Software is being loaded to the board, or the board does not run.
Flashing slowly (on for 2 seconds, off for another 2 seconds)
The board is isolated.
Always on or flashing fast
Alarms occur to the board.
Always off
No fault occurs.
Flashing
The board is in service such as in the master state.
Always off
The board is out of service such as in the slave state or in loadsharing mode.
Always on
The line is in the synchronous state and the line specifications meet the requirements.
Always off
The line is in the asynchronous state and the line specifications do not meet the requirements.
Always on or flashing
The interface is in master state.
Always off
The interface is in slave state.
Always on
The board can be removed.
Always off
The board cannot be removed at the moment.
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B-25
HUAWEI UMG8900 Hardware Description
B Board Indicators of All SSM Frames
B.26 Indicators on the MS1L Table B-27 lists the meaning of the indicators on the MS1L. Table B-27 Indicator meaning of the MS1L Indicator
Identific ation
Color
Status
Meaning
Board running indicator
RUN
Green
Always on
There is power supply, but the board is faulty.
Always off
There is no power supply, or the board is faulty.
Flashing (on for 1 second, off for another second)
The board runs normally in accordance with configuration.
Flashing fast (4 times per second)
Software is being loaded to the board, or the board does not run.
Flashing slowly (on for 2 seconds, off for another 2 seconds)
The board is isolated.
Always on or flashing fast
Alarms occur to the board.
Always off
No fault occurs.
Flashing
The board is in service such as in the master state.
Always off
The board is out of service such as in the slave state or in loadsharing mode.
Always on
The line is in the synchronous state and the line specifications and optical power meet the requirements.
Always off
The line is in the asynchronous state and the line specifications and optical power do not meet the requirements.
Board alarm indicator
Board master indicator
Service interface link connection indicator
B-26
ALM
ACT
LINK
Red
Green
Green
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Issue 05 (2009-01-09)
HUAWEI UMG8900 Hardware Description
B Board Indicators of All SSM Frames
Indicator
Identific ation
Color
Status
Meaning
Service interface master indicator
ACT
Orange
Always on or flashing
The interface is in master state.
Always off
The interface is in slave state.
Hot-pluggable indicator
OFFLINE
Always on
The board can be removed.
Always off
The board cannot be removed at the moment.
Blue
B.27 Indicators on the MS2E Table B-28 lists the meaning of the indicators on the MS2E. Table B-28 Indicator meaning of the MS2E Indicator
Identificat ion
Color
Status
Meaning
Board running indicator
RUN
Green
Always on
There is power supply, but the board is faulty.
Always off
There is no power supply, or the board is faulty.
Flashing (on for 1 second, off for another second)
The board runs normally in accordance with configuration.
Flashing fast (4 times per second)
Software is being loaded to the board, or the board does not run.
Flashing slowly (on for 2 seconds, off for another 2 seconds)
The board is isolated.
Always on or flashing fast
Alarms occur to the board.
Always off
No fault occurs.
Always on or flashing
The board is in service such as in the master state.
Board alarm indicator
Board master indicator
Issue 05 (2009-01-09)
ALM
ACT
Red
Green
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B-27
HUAWEI UMG8900 Hardware Description
B Board Indicators of All SSM Frames
Indicator
Service interface link connection indicator
Identificat ion
LINK
Service interface master indicator
ACT
Hot-pluggable indicator
OFFLINE
Color
Green
Orange
Blue
Status
Meaning
Always off
The board is out of service such as in the slave state or in loadsharing mode.
Always on
The line is in the synchronous state and the line specifications meet the requirements.
Always off
The line is in the asynchronous state and the line specifications do not meet the requirements.
Always on or flashing
The interface is in master state.
Always off
The interface is in slave state.
Always on
The board can be removed.
Always off
The board cannot be removed at the moment.
B.28 Indicators on the MS2L Table B-29 lists the meaning of the indicators on the MS2L. Table B-29 Indicator meaning of the MS2L
B-28
Indicator
Identificat ion
Color
Status
Meaning
Board running indicator
RUN
Green
Always on
There is power supply, but the board is faulty.
Always off
There is no power supply, or the board is faulty.
Flashing (on for 1 second, off for another second)
The board runs normally in accordance with configuration.
Flashing fast (4 times per second)
Software is being loaded to the board, or the board does not run.
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HUAWEI UMG8900 Hardware Description
B Board Indicators of All SSM Frames
Indicator
Board alarm indicator
Board master indicator
Service interface link connection indicator
Identificat ion
ALM
ACT
LINK
Service interface master indicator
ACT
Hot-pluggable indicator
OFFLINE
Color
Red
Green
Green
Orange
Blue
Status
Meaning
Flashing slowly (on for 2 seconds, off for another 2 seconds)
The board is isolated.
Always on or flashing fast
Alarms occur to the board.
Always off
No fault occurs.
Always on or flashing
The board is in service such as in the master state.
Always off
The board is out of service such as in the slave state or in loadsharing mode.
Always on
The line is in the synchronous state and the line specifications and optical power meet the requirements.
Always off
The line is in the asynchronous state and the line specifications and optical power do not meet the requirements.
Always on or flashing
The interface is in master state.
Always off
The interface is in slave state.
Always on
The board can be removed.
Always off
The board cannot be removed at the moment.
B.29 Indicators on the MSPF Table B-30 lists the meaning of the indicators on the MSPF.
Issue 05 (2009-01-09)
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B-29
HUAWEI UMG8900 Hardware Description
B Board Indicators of All SSM Frames
Table B-30 Indicator meaning of the MSPF Indicator
Identificat ion
Color
Status
Meaning
Running indicator
RUN
Green
Always on
There is power supply, but the board is faulty.
Always off
There is no power supply, or the board is faulty.
Flashing (on for 1 second, off for another second)
The board runs normally in accordance with configuration.
Flashing fast (4 times per second)
Software is being loaded to the board, or the board does not run.
Always on or flashing fast
Alarms occur to the board.
Always off
No fault occurs.
Always on
The board can be removed.
Always off
The board cannot be removed at the moment.
Alarm indicator
Hot-pluggable indicator
ALM
OFFLINE
Red
Blue
B.30 Indicators on the MT32 Table B-31 lists the meaning of the indicators on the MT32. Table B-31 Indicator meaning of the MT32
B-30
Indicator
Identificat ion
Color
Status
Meaning
Running indicator
RUN
Green
Always on
There is power supply, but the board is faulty.
Always off
There is no power supply, or the board is faulty.
Flashing (on for 1 second, off for another second)
The board runs normally in accordance with configuration.
Flashing fast (4 times per second)
Software is being loaded to the board, or the board does not run.
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Issue 05 (2009-01-09)
HUAWEI UMG8900 Hardware Description
B Board Indicators of All SSM Frames
Indicator
Identificat ion
Alarm indicator
Hot-pluggable indicator
ALM
OFFLINE
Color
Red
Blue
Status
Meaning
Flashing slowly (on for 2 seconds, off for another 2 seconds)
The board is isolated.
Always on or flashing fast
Alarms occur to the board.
Always off
No fault occurs.
Always on
The board can be removed.
Always off
The board cannot be removed at the moment.
B.31 Indicators on the MTAC Table B-32 lists the indicator meaning of the MTAC. Table B-32 Indicator meaning of the MTAC Indicator
Identificat ion
Color
Status
Meaning
Board running indicator
RUN
Green
Always on
There is power supply, but the board is faulty.
Always off
There is no power supply, or the board is faulty.
Flashing (on for 1 second, off for another second)
The board runs normally in accordance with configuration.
Flashing fast (4 times per second)
Software is being loaded to the board, or the board does not run.
Always on or flashing fast
Alarms occur to the board.
Always off
No fault occurs.
Always on or flashing
The board is in service such as in the master state.
Always off
The board is out of service such as in the slave state.
Board alarm indicator
Board master indicator
Issue 05 (2009-01-09)
ALM
ACT
Red
Green
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B-31
HUAWEI UMG8900 Hardware Description
B Board Indicators of All SSM Frames
Indicator
Identificat ion
Color
Status
Meaning
Hot-pluggable indicator
OFFLINE
Blue
Always on
The board can be removed.
Always off
The board cannot be removed at the moment.
B.32 Indicators on the MTCB Table B-33 lists the indicator meaning of the MTCB. Table B-33 Indicator meaning of the MTCB Indicator
Identificat ion
Color
Status
Meaning
Running indicator
RUN
Green
Always on
There is power supply, but the board is faulty.
Always off
There is no power supply, or the board is faulty.
Flashing (on for 1 second, off for another second)
The board runs normally in accordance with configuration.
Flashing fast (4 times per second)
Software is being loaded to the board, or the board does not run.
Flashing slowly (on for 2 seconds, off for another 2 seconds)
The board is isolated.
Always on or flashing fast
Alarms occur to the board.
Always off
No fault occurs.
Always on
The board can be removed.
Always off
The board cannot be removed at the moment.
Alarm indicator
Hot-pluggable indicator
ALM
OFFLINE
Red
Blue
B.33 Indicators on the MTCD Table B-34 lists the indicator meaning of the MTCD.
B-32
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HUAWEI UMG8900 Hardware Description
B Board Indicators of All SSM Frames
Table B-34 Indicator meaning of the MTCD Indicator
Identificat ion
Color
Status
Meaning
Running indicator
RUN
Green
Always on
There is power supply, but the board is faulty.
Always off
There is no power supply, or the board is faulty.
Flashing (on for 1 second, off for another second)
The board runs normally in accordance with configuration.
Flashing fast (4 times per second)
Software is being loaded to the board, or the board does not run.
Flashing slowly (on for 2 seconds, off for another 2 seconds)
The board is isolated.
Always on or flashing fast
Alarms occur to the board.
Always off
No fault occurs.
Always on
The board can be removed.
Always off
The board cannot be removed at the moment.
Alarm indicator
Hot-pluggable indicator
ALM
OFFLINE
Red
Blue
B.34 Indicators on the MTNB Table B-35 lists the meaning of the indicators on the MTNB. Table B-35 Indicator meaning of the MTNB
Issue 05 (2009-01-09)
Indicator
Identificat ion
Color
Status
Meaning
Running indicator
RUN
Green
Always on
There is power supply, but the board is faulty.
Always off
There is no power supply, or the board is faulty.
Flashing (on for 1 second, off for another second)
The board runs normally in accordance with configuration.
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B-33
HUAWEI UMG8900 Hardware Description
B Board Indicators of All SSM Frames
Indicator
Alarm indicator
Working indicator
Optical fiber connection state indicator
Master optical channel indicator
Hot-pluggable indicator
Identificat ion
ALM
ACT
LINK
ACT
OFFLINE
Color
Red
Green
Green
Orange
Blue
Status
Meaning
Flashing fast (4 times per second)
Software is being loaded to the board, or the board does not run.
Always on or flashing fast
Alarms occur to the board.
Always off
No fault occurs.
Always on or flashing
The board is in service such as in the master state.
Always off
The board is out of service such as in the slave state.
Always on
The line is in the synchronous state and the optical power meets the requirement.
Always off
The line is in the asynchronous state and the optical power does not meet the requirement.
Always on or flashing
The optical channel that corresponds to the optical module is in the master state.
Always off
The optical channel that corresponds to the optical module is in the slave state.
Always on
The board can be removed.
Always off
The board cannot be removed at the moment.
B.35 Indicators on the MTNC Table B-36 lists the meaning of the indicators on the MTNC.
B-34
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HUAWEI UMG8900 Hardware Description
B Board Indicators of All SSM Frames
Table B-36 Indicator meaning of the MTNC Indicator
Identificat ion
Color
Status
Meaning
Running indicator
RUN
Green
Always on
There is power supply, but the board is faulty.
Always off
There is no power supply, or the board is faulty.
Flashing (on for 1 second, off for another second)
The board runs normally in accordance with configuration.
Flashing fast (4 times per second)
Software is being loaded to the board, or the board does not run.
Always on or flashing fast
Alarms occur to the board.
Always off
No fault occurs.
Flashing
The board is in service such as in the master state.
Always off
The board is out of service such as in the slave state.
Always on
The board can be removed.
Always off
The board cannot be removed at the moment.
Always on
Optical fiber connection is normal.
Always off
Optical fiber connection is abnormal.
Always on or flashing
The optical channel that corresponds to the optical module is in the master state.
Always off
The optical channel that corresponds to the optical module is in the slave state.
Alarm indicator
Working indicator
Hot-pluggable indicator
Issue 05 (2009-01-09)
ALM
ACT
OFFLINE
Optical fiber connection state indicator
LINK
Master optical channel indicator
ACT
Red
Green
Blue
Green
Orange
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B-35
HUAWEI UMG8900 Hardware Description
B Board Indicators of All SSM Frames
B.36 Indicators on the MTNU Table B-37 lists the meaning of the indicators on the MTNU. Table B-37 Indicator meaning of the MTNU Indicator
Identific ation
Color
Status
Meaning
Running indicator
RUN
Green
Always on
There is power supply, but the board is faulty.
Always off
There is no power supply, or the board is faulty.
Flashing (on for 1 second, off for another second)
The board runs normally in accordance with configuration.
Flashing fast (4 times per second)
Software is being loaded to the board, or the board does not run.
Always on or flashing fast
Alarms occur to the board.
Always off
No fault occurs.
Flashing
The board is in service such as in the master state.
Always off
The board is out of service such as in the slave state.
Always on
The line is in the synchronous state and the optical power meets the requirement.
Always off
The line is in the asynchronous state and the optical power does not meet the requirement.
Always on or flashing
The optical channel that corresponds to the optical module is in the master state.
Alarm indicator
Working indicator
Optical fiber connection state indicator
Master optical channel indicator
B-36
ALM
ACT
LINK
ACT
Red
Green
Green
Orange
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HUAWEI UMG8900 Hardware Description
B Board Indicators of All SSM Frames
Indicator
Hot-pluggable indicator
Identific ation
OFFLINE
Color
Blue
Status
Meaning
Always off
The optical channel that corresponds to the optical module is in the slave state.
Always on
The board can be removed.
Always off
The board cannot be removed at the moment.
B.37 Indicators on the MTSU Table B-38 lists the meaning of the indicators on the MTSU. Table B-38 Indicator meaning of the MTSU Indicator
Identificat ion
Color
Status
Meaning
Running indicator
RUN
Green
Always on
There is power supply, but the board is faulty.
Always off
There is no power supply, or the board is faulty.
Flashing (on for 1 second, off for another second)
The board runs normally in accordance with configuration.
Flashing fast (4 times per second)
Software is being loaded to the board, or the board does not run.
Flashing slowly (on for 2 seconds, off for another 2 seconds)
The board is isolated.
Always on or flashing fast
Alarms occur to the board.
Always off
No fault occurs.
Always on
The board can be removed.
Always off
The board cannot be removed at the moment.
Alarm indicator
Hot-pluggable indicator
Issue 05 (2009-01-09)
ALM
OFFLINE
Red
Blue
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B-37
HUAWEI UMG8900 Hardware Description
B Board Indicators of All SSM Frames
B.38 Indicators on the MVPB Table B-39 lists the meaning of the indicators on the MVPB. Table B-39 Indicator meaning of the MVPB Indicator
Identificat ion
Color
Status
Meaning
Running indicator
RUN
Green
Always on
There is power supply, but the board is faulty.
Always off
There is no power supply, or the board is faulty.
Flashing (on for 1 second, off for another second)
The board runs normally in accordance with configuration.
Flashing fast (4 times per second)
Software is being loaded to the board, or the board does not run.
Flashing slowly (on for 2 seconds, off for another 2 seconds)
The board is isolated.
Always on or flashing fast
Alarms occur to the board.
Always off
No fault occurs.
Flashing
The board is in service such as in the master state.
Always off
The board is out of service such as in the slave state.
Always on
The board can be removed.
Always off
The board cannot be removed at the moment.
Alarm indicator
Working indicator
Hot-pluggable indicator
ALM
ACT
OFFLINE
Red
Green
Blue
NOTE
The working indicator ACT is unavailable on the panel of the UG01MVPB. The working indicator ACT is available on the panel of the UG02MVPB. The UG02MVPB is in loadsharing mode. Therefore, the indicator is always off.
B.39 Indicators on the MVPD Table B-40 lists the meaning of the indicators on the MVPD. B-38
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HUAWEI UMG8900 Hardware Description
B Board Indicators of All SSM Frames
Table B-40 Indicator meaning of the MVPD Indicator
Identificat ion
Color
Status
Meaning
Running indicator
RUN
Green
Always on
There is power supply, but the board is faulty.
Always off
There is no power supply, or the board is faulty.
Flashing (on for 1 second, off for another second)
The board runs normally in accordance with configuration.
Flashing fast (4 times per second)
Software is being loaded to the board, or the board does not run.
Flashing slowly (on for 2 seconds, off for another 2 seconds)
The board is isolated.
Always on or flashing fast
Alarms occur to the board.
Always off
No fault occurs.
Flashing
The board is in service such as in the master state.
Always off
The board is out of service such as in the slave state.
Always on
The board can be removed.
Always off
The board cannot be removed at the moment.
Alarm indicator
Working indicator
Hot-pluggable indicator
ALM
ACT
OFFLINE
Red
Green
Blue
NOTE
The working indicator ACT is unavailable on the panel of the UG01MVPD. The working indicator ACT is available on the panel of the UG02MVPD. The UG02MVPD is in loadsharing mode. Therefore, the indicator is always off.
B.40 Indicators on the TCLU Table B-41 lists the indicator meaning of the TCLU.
Issue 05 (2009-01-09)
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B-39
HUAWEI UMG8900 Hardware Description
B Board Indicators of All SSM Frames
Table B-41 Indicator meaning of the TCLU Indicator
Identificat ion
Color
Status
Meaning
Running indicator
RUN
Green
Always on
There is power supply, but the board is faulty.
Always off
There is no power supply, or the board is faulty.
Flashing (on for 1 second, off for another second)
The board runs normally in accordance with configuration.
Flashing fast (4 times per second)
Software is being loaded to the board, or the board does not run.
Always on or flashing fast
Alarms occur to the board.
Always off
No fault occurs.
Always on or flashing
The board is in service such as in the master state.
Always off
The board is out of service such as in the slave state.
Always on
The line is in the synchronous state and the optical power meets the requirement.
Always off
The line is in the asynchronous state and the optical power does not meet the requirement.
Always on or flashing
The optical channel that corresponds to the optical module is in the master state.
Always off
The optical channel that corresponds to the optical module is in the slave state.
Always on
The board can be removed.
Alarm indicator
Working indicator
Optical fiber connection state indicator
Master optical channel indicator
Hot-pluggable indicator
B-40
ALM
ACT
LINK
ACT
OFFLINE
Red
Green
Green
Orange
Blue
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HUAWEI UMG8900 Hardware Description
B Board Indicators of All SSM Frames
Indicator
Identificat ion
Color
Status
Meaning
Always off
The board cannot be removed at the moment.
B.41 Indicators on the SCMU Table B-42 lists the meaning of the indicators on the SCMU. Table B-42 Indicator meaning of the SCMU Indicator
Identificat ion
Color
Status
Meaning
Running indicator
RUN
Green
Always on
There is power supply, but the board is faulty.
Always off
There is no power supply, or the board is faulty.
Flashing (on for 1 second, off for another second)
The board runs normally in accordance with configuration.
Flashing fast (4 times per second)
Software is being loaded to the board, or the board does not run.
Always on or flashing fast
Alarms occur to the board.
Always off
No fault occurs.
Flashing
The board is in service such as in the master state.
Always off
The board is out of service such as in the slave state.
Always on
The board can be removed.
Always off
The board cannot be removed at the moment.
Alarm indicator
Working indicator
Hot-pluggable indicator
Issue 05 (2009-01-09)
ALM
ACT
OFFLINE
Red
Green
Blue
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B-41
HUAWEI UMG8900 Hardware Description
C
C Board DIP Switches and Jumpers of all SSM Frames
Board DIP Switches and Jumpers of all SSM Frames
C.1 DIP Switches and Jumpers of the ME32 C.2 DIP Switches on the MEAC C.3 DIP Switches and Jumpers of the MESU C.4 Jumpers on the MMPU C.5 Jumpers on the MOMU C.6 DIP Switches and Jumpers of the MT32 C.7 DIP Switches and Jumpers of the MTAC C.8 DIP Switches and Jumpers of the MTSU
Issue 05 (2009-01-09)
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C-1
HUAWEI UMG8900 Hardware Description
C Board DIP Switches and Jumpers of all SSM Frames
C.1 DIP Switches and Jumpers of the ME32
CAUTION The 32 E1 cables connected with the ME32 must be of the same characteristic impedance value. That is, one ME32 cannot be connected with both 75-ohm E1 cables and 120-ohm E1 cables. The methods for setting DIP switches for the UG01ME32 and UG02ME32 are slightly different. The following describes how to set the DIP switches.
DIP Switches of the UG01ME32 Table C-1 lists DIP switches of the UG01ME32. Table C-1 DIP switches of the UG01ME32 Function
Switch
Bit
Range of E1 Interfaces
Setting the grounding modes for the E1 cables
S2
1 to 8
16 to 23
S3
1 to 8
24 to 31
S4
1 to 8
0 to 7
S5
1 to 8
8 to 15
S6
1 to 8
24 to 27
S7
1 to 8
20 to 23
S8
1 to 8
28 to 31
S9
1 to 8
0 to 3
S10
1 to 8
4 to 7
S11
1 to 8
8 to 11
S12
1 to 8
12 to 15
S13
1 to 8
16 to 19
S14
1 to 2
0 to 31
Setting the impedance values that match the E1 cables
Reporting attribute of the E1 links
The method for setting DIP switches of the UG01ME32 is as follows: l
C-2
Method for setting DIP switches for 75-ohm E1 cables
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HUAWEI UMG8900 Hardware Description
C Board DIP Switches and Jumpers of all SSM Frames
Table C-2 Setting DIP switches of the UG01ME32 (75-ohm E1 coaxial cable)
l
Switch
Bit
Status
S2 to S13
1 to 8
ON
S14
1 to 2
ON
Method for setting DIP switches for 120-ohm E1 cables Table C-3 Setting DIP switches of the UG01ME32 (120-ohm E1 twisted pair) Switch
Bit
Status
S2 to S5
1 to 8
OFF
S6 to S13
1 to 4
OFF
5 to 8
ON
1
OFF
2
ON
S14
DIP Switches of the UG02ME32 Table C-4 lists DIP switches of the UG02ME32. Table C-4 DIP switches of the UG02ME32 Function
Switch
Bit
Range of E1 Interfaces
Setting the impedance values that match the E1 cables
S2
1 to 8
20 to 23
S3
1 to 8
24 to 27
S4
1 to 8
28 to 31
S5
1 to 8
0 to 3
S6
1 to 8
4 to 7
S7
1 to 8
8 to 11
S8
1 to 8
12 to 15
S9
1 to 8
16 to 19
S10
1 to 8
16 to 23
S11
1 to 8
8 to 15
S12
1 to 8
0 to 7
S13
1 to 8
24 to 31
Setting the grounding modes for the E1 cables
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C-3
HUAWEI UMG8900 Hardware Description
C Board DIP Switches and Jumpers of all SSM Frames
Function
Switch
Bit
Range of E1 Interfaces
Reporting attribute of the E1 links
S14
1 to 2
0 to 31
The method for setting DIP switches of the UG02ME32 is as follows: l
Method for setting DIP switches for 75-ohm E1 cables Table C-5 Setting DIP switches of the UG02ME32 (75-ohm E1 coaxial cable)
l
Switch
Bit
Status
S2 to S13
1 to 8
ON
S14
1 to 2
ON
Method for setting DIP switches for 120-ohm E1 cables Table C-6 Setting DIP switches of the UG02ME32 (120-ohm E1 twisted pair) Switch
Bit
Status
S2 to S9
1 to 4
OFF
5 to 8
ON
S10 to S13
1 to 8
OFF
S14
1
OFF
2
ON
C.2 DIP Switches on the MEAC Table C-7 lists DIP switches on the MEAC. Table C-7 DIP switches of the MEAC
C-4
Function
Switch
Bit
Range of E1 Interfaces
Resetting the switch manually
S1
1
Resetting the board
Setting the grounding modes for the E1 cables
S5
1 to 8
0 to 7
S6
1 to 8
8 to 15
S7
1 to 8
16 to 23
S8
1 to 8
24 to 31
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HUAWEI UMG8900 Hardware Description
C Board DIP Switches and Jumpers of all SSM Frames
Function
Switch
Bit
Range of E1 Interfaces
Setting the impedance values that match the E1 cables
S9
1 to 8
0 to 3
S10
1 to 8
4 to 7
S11
1 to 8
8 to 11
S12
1 to 8
12 to 15
S13
1 to 8
16 to 19
S14
1 to 8
20 to 23
S15
1 to 8
24 to 27
S16
1 to 8
28 to 31
The method for setting DIP switches of the MEAC is as follows: l
Method for setting DIP switches for 75-ohm E1 cables Table C-8 Setting DIP switches of the MEAC (75-ohm E1 coaxial cable)
l
Switch
Bit
Status
S5 to S8
1 to 8
ON
S9 to S16
1 to 8
ON
Method for setting DIP switches for 120-ohm E1 cables Table C-9 Setting DIP switches of the MEAC (120-ohm E1 twisted pair) Switch
Bit
Status
S5 to S8
1 to 8
OFF
S9 to S16
1 to 4
OFF
5 to 8
ON
C.3 DIP Switches and Jumpers of the MESU
CAUTION The 32 E1 cables connected with the MESU must be of the same characteristic impedance value. That is, one MESU cannot be connected with both 75-ohm E1 cables and 120-ohm E1 cables. Table C-10 lists DIP switches of the MESU. Issue 05 (2009-01-09)
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C-5
HUAWEI UMG8900 Hardware Description
C Board DIP Switches and Jumpers of all SSM Frames
Table C-10 DIP switches of the MESU Function
Switch
Bit
Range of E1 Interfaces
Setting the impedance values that match the E1 cables
S2
1 to 8
20 to 23
S3
1 to 8
24 to 27
S4
1 to 8
28 to 31
S5
1 to 8
0 to 3
S6
1 to 8
4 to 7
S7
1 to 8
8 to 11
S8
1 to 8
12 to 15
S9
1 to 8
16 to 19
S10
1 to 8
16 to 23
S11
1 to 8
8 to 15
S12
1 to 8
0 to 7
S13
1 to 8
24 to 31
S14
1 to 2
0 to 31
Setting the grounding modes for the E1 cables
Reporting attribute of the E1 links
The method for setting DIP switches of the MESU is as follows: l
Method for setting DIP switches for 75-ohm E1 cables Table C-11 Setting DIP switches of the MESU (75-ohm E1 coaxial cable)
l
Switch
Bit
Status
S2 to S13
1 to 8
ON
S14
1 to 2
ON
Method for setting DIP switches for 120-ohm E1 cables Table C-12 Setting DIP switches of the MESU (120-ohm E1 twisted pair)
C-6
Switch
Bit
Status
S2 to S9
1 to 4
OFF
5 to 8
ON
S10 to S13
1 to 8
OFF
S14
1
OFF
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HUAWEI UMG8900 Hardware Description
C Board DIP Switches and Jumpers of all SSM Frames
Switch
Bit
Status
2
ON
C.4 Jumpers on the MMPU The jumper JP13 is available on the MMPU to choose packet switching modules to load. Table C-13 lists the setting. Table C-13 Jumper description of the MMPU Jumper Name and Location No.
State
Function
Loading selection jumper of switching module JP13
Jumper pins 1 and 2 are closed.
To load switching module 1
Jumper pins 2 and 3 are closed.
To load switching module 2
C.5 Jumpers on the MOMU The jumper JP13 is available on the MOMU to choose packet switching modules to load. Table C-14 lists the setting. Table C-14 Jumper description of the MOMU Jumper Name and Location No.
State
Function
Loading selection jumper of switching module JP13
Jumper pins 1 and 2 are closed.
To load switching module 1
Jumper pins 2 and 3 are closed.
To load switching module 2
C.6 DIP Switches and Jumpers of the MT32 DIP Switches and Jumpers of the UG01MT32 Table C-15 lists DIP switches of the UG01MT32. Table C-15 DIP switches of the UG01MT32
Issue 05 (2009-01-09)
Function
Switch
Bit
Range of E1 Interfaces
Setting the grounding modes for the E1 cables
S2
1 to 8
16 to 23
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C-7
HUAWEI UMG8900 Hardware Description
C Board DIP Switches and Jumpers of all SSM Frames
Function
Setting the impedance values that match the E1 cables
Reporting attribute of the E1 links
Switch
Bit
Range of E1 Interfaces
S3
1 to 8
24 to 31
S4
1 to 8
0 to 7
S5
1 to 8
8 to 15
S6
1 to 8
24 to 27
S7
1 to 8
20 to 23
S8
1 to 8
28 to 31
S9
1 to 8
0 to 3
S10
1 to 8
4 to 7
S11
1 to 8
8 to 11
S12
1 to 8
12 to 15
S13
1 to 8
16 to 19
S14
1 to 2
0 to 31
Table C-16 lists the method for setting DIP switches of the UG01MT32. Table C-16 Setting DIP switches of the UG01MT32 (100-ohm T1 cable) Switch
Bit
Status
S2 to S5
1 to 8
OFF
S6 to S13
1 to 4
ON
5 to 8
OFF
1
ON
2
OFF
S14
DIP Switches of the UG02MT32 Table C-17 lists DIP switches of the UG02MT32. Table C-17 DIP switches of the UG02MT32
C-8
Function
Switch
Bit
Range of E1 Interfaces
Setting the impedance values that match the E1 cables
S2
1 to 8
20 to 23
S3
1 to 8
24 to 27
S4
1 to 8
28 to 31
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HUAWEI UMG8900 Hardware Description
C Board DIP Switches and Jumpers of all SSM Frames
Function
Setting the grounding modes for the E1 cables
Reporting attribute of the E1 links
Switch
Bit
Range of E1 Interfaces
S5
1 to 8
0 to 3
S6
1 to 8
4 to 7
S7
1 to 8
8 to 11
S8
1 to 8
12 to 15
S9
1 to 8
16 to 19
S10
1 to 8
16 to 23
S11
1 to 8
8 to 15
S12
1 to 8
0 to 7
S13
1 to 8
24 to 31
S14
1 to 2
0 to 31
Table C-18 lists the method for setting DIP switches of the UG02MT32. Table C-18 Setting DIP switches of the UG02MT32 (100-ohm T1 cable) Switch
Bit
Status
S2 to S9
1 to 4
ON
5 to 8
OFF
S10 to S13
1 to 8
OFF
S14
1
ON
2
OFF
C.7 DIP Switches and Jumpers of the MTAC Table C-19 lists DIP switches of the MTAC. Table C-19 DIP switches of the MTAC
Issue 05 (2009-01-09)
Function
Switch
Bit
Range of E1 Interfaces
Resetting the switch manually
S1
1
Resetting the board
Setting the grounding modes for the T1 cables
S5
1 to 8
0 to 7
S6
1 to 8
8 to 15
S7
1 to 8
16 to 23
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C-9
HUAWEI UMG8900 Hardware Description
C Board DIP Switches and Jumpers of all SSM Frames
Function
Setting the impedance values that match the T1 cables
Switch
Bit
Range of E1 Interfaces
S8
1 to 8
24 to 31
S9
1 to 8
0 to 3
S10
1 to 8
4 to 7
S11
1 to 8
8 to 11
S12
1 to 8
12 to 15
S13
1 to 8
16 to 19
S14
1 to 8
20 to 23
S15
1 to 8
24 to 27
S16
1 to 8
28 to 31
Table C-20 lists the method for setting DIP switches of the MTAC. Table C-20 Setting DIP switches of the MTAC (100-ohm T1 cable) Switch
Bit
Status
S5 to S8
1 to 8
OFF
S9 to S16
1 to 4
ON
5 to 8
OFF
C.8 DIP Switches and Jumpers of the MTSU Table C-21 lists DIP switches of the MTSU. Table C-21 DIP switches of the MTSU
C-10
Function
Switch
Bit
Range of E1 Interfaces
Setting the impedance values that match the T1 cables
S2
1 to 8
20 to 23
S3
1 to 8
24 to 27
S4
1 to 8
28 to 31
S5
1 to 8
0 to 3
S6
1 to 8
4 to 7
S7
1 to 8
8 to 11
S8
1 to 8
12 to 15
S9
1 to 8
16 to 19
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HUAWEI UMG8900 Hardware Description
C Board DIP Switches and Jumpers of all SSM Frames
Function
Switch
Bit
Range of E1 Interfaces
Setting the grounding modes for the T1 links
S10
1 to 8
16 to 23
S11
1 to 8
8 to 15
S12
1 to 8
0 to 7
S13
1 to 8
24 to 31
S14
1 to 2
0 to 31
Reporting attribute of the T1 links
Table C-22 lists the method for setting DIP switches of the MTSU. Table C-22 Setting DIP switches of the MTSU (100-ohm T1 cable)
Issue 05 (2009-01-09)
Switch
Bit
Status
S2 to S9
1 to 4
ON
5 to 8
OFF
S10 to S13
1 to 8
OFF
S14
1
ON
2
OFF
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C-11
HUAWEI UMG8900 Hardware Description
D Boards of All SSM Frames
D
Boards of All SSM Frames
Table D-1 Equipment and resource management units Board Name Logical Board
Physical Board
Operation Maintenance Unit (OMU)
Media gateway Operation Maintenance Unit (MOMU)
Backup Mode
Board Position
Function
Master/slave
It is inserted in front slot 7 or 8 of the SSM-256 main control frame.
The OMU manages all the frames of the UMG8900 when multiple frames are configured.
A corresponding NET back board is required. Media gateway Operation Maintenance Unit B (MOMB)
Master/slave
It is inserted in front slots 6, 7, 8 and 9 of the SSM-32 main control frame. Each board occupies two slots. A corresponding TNC back board is required.
Main processing unit (MPU)
Media gateway Main Processing Unit (MMPU)
Master/slave
It is inserted in front slot 7 or 8 of the SSM-256 frame except the main control frame. A corresponding NET back board is required.
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The MOMB can convert the broadband service data. The board provides the external interfaces including the Console interface. The MPU manages the boards in the frame where the MPU is located. The MMPB can convert the broadband service data.
D-1
HUAWEI UMG8900 Hardware Description
D Boards of All SSM Frames
Board Name Logical Board
Physical Board Media gateway Main Processing Unit B (MMPB)
Backup Mode
Board Position
Function
Master/slave
It is inserted in front slots 6, 7, 8 and 9 of a SSM-32 service frame. Each board occupies two slots. A corresponding TNC back board is required.
Media gateway Connection Maintenance Front Unit (MCMF)
Master/slave
Media gateway Connection Maintenance Back unit (MCMB)
Master/slave
Connection Maintenance Unit (CMU)
Sub-card of Connection & Management Unit (SCMU)
Load sharing or master/ slave
It is inserted in the subboard slot of the UG02MOMB or the UG02MMPB of the SSM-32 frame.
The CMU processes messages of the media resource control protocol and operates the corresponding resources.
Protocol Processing Unit (PPU)
Media gateway Back Protocol Processing Unit (MPPB)
Load sharing
It is inserted in a common back slot of the SSM-256 frame.
The PPU processes the H. 248/SCTP/ UDP/TCP/IP protocols. The external interfaces include the FE interface.
Connection Maintenance Unit (CMU)
D-2
It is inserted in a common front slot of the SSM-256 frame or the SSM-32 frame. No corresponding back board is required.
The CMU processes messages of the media resource control protocol and operates the corresponding resources.
It is inserted in a common back slot of the SSM-256 frame or SSM-32 frame. No corresponding front board is required.
No corresponding front board is required.
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HUAWEI UMG8900 Hardware Description
D Boards of All SSM Frames
Board Name Logical Board
Backup Mode
Board Position
Media gateway Connection Maintenance Front Unit (MCMF)
Load sharing
It is inserted in a common front slot of the SSM-256 frame or the SSM-32 frame.
Media gateway Connection Maintenance Back unit (MCMB)
Load sharing
Physical Board
Function
No corresponding back board is required. It is inserted in a common back slot of the SSM-256 frame or the SSM-32 frame. No corresponding front board is required.
Table D-2 Service and protocol processing units Board Name Logical Board
Physical Board
High-speed Routing Unit (HRB)
Media gateway High-speed Routing Unit (MHRU)
Backup Mode
Board Position
Function
Master/slave
It is inserted in a common front slot of the SSM-256 frame or the SSM-32 frame.
The MHRU transfers the RTP/RTCP and IP bearer services.
A corresponding E8T/E1G back board is required. High-speed Routing Unit (HRB)
Media gateway RTP Processing Unit (MRPU)
Master/slave
It is inserted in a common front slot of the SSM-256 frame or the SSM-32 frame. A corresponding E8T/E1G back board is required.
Issue 05 (2009-01-09)
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The MRPU processes the IP routes, converges and distributes IP services.
D-3
HUAWEI UMG8900 Hardware Description
D Boards of All SSM Frames
Board Name Logical Board
Physical Board
High-speed Routing Unit (HRB)
Media gateway High-speed Routing Unit D (MHRD)
Backup Mode
Board Position
Function
Master/slave
It is inserted in a common back slot of the SSM-256 frame or the SSM-32 frame.
The MHRD processed the IP routes, and it converges, and distributes the IP services.
A corresponding D8FT/D1GO subboard is required.
High-speed Routing Unit (HRB)
ATM AAL2/ AAL5 SAR Processing Unit (ASU)
Media gateway IP over E1 Unit (MIOE)
Media gateway ATM AAL2/ AAL5 SAR Processing Unit (MASU)
Master/slave
Master/slave
It is inserted in a common front slot of the SSM-256 frame or the SSM-32 frame.
The MHRD provides the service access function. The MIOE implement IP over E1. When the board is used in the SSM-256 frame, the frame must be configured with the MTNB.
In the SSM-256 The ASU frame or the SSM-32 processes ATM frame, it is inserted in services. a common front slot of the main control frame and the service frame. A corresponding A4L/EAC/TAC back board is required.
Front Signalling Processing unit (SPF)
Media gateway Front Signalling Processing unit (MSPF)
Load sharing
It is inserted in a common front slot of the SSM-256 frame or the SSM-32 frame. No corresponding back board is required.
D-4
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The SPF performs signaling adaptation and transfers the signaling.
Issue 05 (2009-01-09)
HUAWEI UMG8900 Hardware Description
D Boards of All SSM Frames
Table D-3 Switching and cascading units Board Name Logical Board
Physical Board
Packet switch Unit (NET)
Media gateway Packet switch Unit (MNET)
Backup Mode
Board Position
Function
Master/slave
It is inserted in back slot 7 or 8 of the SSM-256 frame.
The NET implements switching of packet services and data cascading between frames.
A corresponding MPU or OMU front board is required.
The external interfaces includes the 2xGE, 4xFE, Clock, MIR, OMC interfaces. Front Link Unit (FLU)
Media gateway Front Link Unit (MFLU)
Nullbackup
It is inserted in a front slot of the SSM-256 central switching frame except slots 6, 7, 8 and 9. A corresponding BLU back board is required.
Back Link Unit (BLU)
Media gateway Back Link Unit (MBLU)
Master/slave
It is inserted in a back slot of the SSM-256 central switching frame except slots 6, 7, 8 and 9. A corresponding FLU front board is required.
The FLU and BLU provide 32 K or 24 K subscriber cascading capacity, interfacing and switching functions on time division multiplexing (TDM) narrowband data plane, and 2 x 1.25 Gbit/s cascading capacity and interfacing function on the broadband data plane. Providing FE control data channels to directly connect frames The BLU provides the cascading interface.
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D-5
HUAWEI UMG8900 Hardware Description
D Boards of All SSM Frames
Board Name
Backup Mode
Board Position
Function
Logical Board
Physical Board
Net Link Unit (NLU)
Media gateway Net Link Unit (MNLU)
Load sharing
It is in back slots 4, 5, 10 and 11 of the SSM-32 frame.
The NLU provides 2 x 1.25G/1 x 1.25G cascading capacity and interfacing function on the broadband data plane.
TDM central switching Net Unit (TNU)
Media gateway TDM switching Net Unit (MTNU)
Master/slave
It is inserted in back slot 6 or 9 of the SSM-256 frame.
TDM Convergence & Link Unit (TCLU)
Master/slave
The TNU implements TDM service switching. The MTNU provides 24 K cascading capacity. The TCLU provides 24 K cascading capacity. The MTNB provides 32 K cascading capacity. The MTNC provides maximum 4 x 8K cascading capacity. The MTNC provides the FE switching function for the control plane. The MTNC provides multiframe cascading channels for the FE plane and the TDM plane. The MTNC manages the boards in the
No corresponding front board is required. It is inserted in back slot 6 or 9 of the SSM-256 main control frame or the service frame. No corresponding front board is required.
Media gateway TDM switching Net Unit B (MTNB)
D-6
Master/slave
It is inserted in back slot 6 or 9 of the SSM-256 frame. No corresponding front board is required.
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HUAWEI UMG8900 Hardware Description
D Boards of All SSM Frames
Board Name Logical Board
Physical Board Media gateway TDM switching Net Unit C (MTNC)
Backup Mode
Board Position
Function
Master/slave
It is in back slots 6, 7, 8 and 9 of the SSM-32 frame.
frame where the MTNC is located.
The MTNC provides level 3 clock signal for A corresponding MOMB/MMPB front the system through the board is required. clock subboard. Each board occupies two slots.
Table D-4 Interface units Board Name Logical Board
Physical Board
1-port GE Optical interface card (E1G)
Media gateway one-port GE Optical interface card (MG1O)
Backup Mode
Board Position
Function
Nullbackup
It is inserted in a common back slot of the SSM-256 frame or the SSM-32 frame.
The E1G provides one GE interface.
A corresponding HRB front board is required. 2*155M SDH/ SONET optical interface card (S2L)
Issue 05 (2009-01-09)
Media gateway 2*155M SDH/ SONET optical interface card (MS2L)
Master/ slave or load sharing
The UG01MS2L and UG01MS2E can be only inserted in a common back slot of the SSM-256 frame. The UG02MS2L and UG02MS2E can be
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The MS2L provides two 155 Mbit/s SDH optical interfaces. The MS2E provides two
D-7
HUAWEI UMG8900 Hardware Description
D Boards of All SSM Frames
Board Name Logical Board
1*155M SDH/ SONET optical interface card (S1L)
4 Ports STM-1 ATM Optical Interface Board (A4L)
Backup Mode
Board Position
Function
Media gateway 2*155M SDH/ SONET Electronical interface card (MS2E)
Master/ slave or load sharing
inserted in a common back slot of the SSM-256 frame or the SSM-32 frame. No corresponding front board is required.
155 Mbit/s SDH electrical interfaces.
Media gateway 1*155M SDH/ SONET optical interface card (MS1L)
Master/ slave or load sharing
Media gateway 2*155M SDH/ SONET Electronical interface card (MS1E)
Master/ slave or load sharing
It is inserted in a common back slot of the SSM-32 frame. No corresponding front board is required.
The MS1L provides one 155 Mbit/s SDH optical interface. The MS1E provides one 155 Mbit/s SDH electrical interface.
Media gateway 4 Ports STM-1 ATM Optical Interface Board (MA4L)
Nullbackup
It is inserted in a common back slot of the SSM-256 frame or the SSM-32 frame.
The A4L provides four 155 M ATM optical interfaces.
Physical Board
A corresponding ASU front board is required. 8-port 10/100M Ethernet interface board (E8T)
Media gateway 8port 10/100M Ethernet Interface Board (ME8T)
Nullbackup
It is inserted in a common back slot of the SSM-256 frame or the SSM-32 frame.
The E8T provides eight FE interfaces.
A corresponding HRB front board is required. 32*E1 port TDM interface board (E32)
D-8
Media gateway 32*E1 ports TDM interface board (ME32)
Load sharing
It is inserted in a common back slot of the SSM-256 frame or the SSM-32 frame. No corresponding front board is required.
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The ME32 provides 32 E1 interfaces to extract line signaling from CAS such as R2 and CNo.1 or insert line
Issue 05 (2009-01-09)
HUAWEI UMG8900 Hardware Description
D Boards of All SSM Frames
Board Name Logical Board
32*T1 port TDM interface board (T32)
Physical Board
Backup Mode
Media gateway 32*E1 interface card with Signaling function Unit (MESU)
Load sharing
Media gateway 32*T1 ports TDM interface board (MT32)
Load sharing
Board Position
signaling into them. The MESU provides 32 E1 interfaces to receive and send NO.5 line signaling and register signaling.
It is inserted in a common back slot of the SSM-256 frame or the SSM-32 frame. No corresponding front board is required.
32*T1 port TDM interface board (T32)
PDH Interface Electronical Unit (PIE)
Media gateway 32*T1 interface card with Signaling function Unit (MTSU)
Media gateway PDH Interface Electronical Unit (MPIE)
Load sharing
Master/ slave or load sharing
Function
It is inserted in a common back slot of the SSM-256 frame or the SSM-32 frame.
The MT32 provides 32 T1 interfaces to extract line signaling from CAS such as R2 and CNo.1 or insert line signaling into them.
No corresponding front board is required.
The MTSU provides 32 T1 interfaces to receive and send NO.5 line signaling and register signaling.
It is inserted in a common back slot of the SSM-256 frame or the SSM-32 frame.
The PIE provides three E3/T3 PDH electrical interfaces.
No corresponding front board is required.
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D-9
HUAWEI UMG8900 Hardware Description
D Boards of All SSM Frames
Board Name Logical Board
Physical Board
32-port E1 ATM Interface Card (EAC)
Media gateway 32port E1/T1 ATM Interface Card (MEAC)
Backup Mode
Board Position
Function
Nullbackup
It is inserted in a common back slot of the SSM-256 frame or the SSM-32 frame.
The EAC provides 32 IMA E1 interfaces.
A corresponding ASU front board is required. 32-port T1 ATM Interface Card (TAC)
Media gateway 32port T1 ATM Interface Card (MTAC)
Nullbackup
In the SSM-256 frame or the SSM-32 frame, it is inserted in a common back slot of the main control frame or the service frame.
The TAC provides 32 IMA T1 interfaces.
A corresponding ASU front board is required. Table D-5 Media resource processing units Board Name Logical Board
Physical Board
Voice Processing Unit (VPU)
Media gateway Voice Processing Unit B (MVPB)
Backup Mode
Board Position
Function
Load sharing
It is inserted in a common front slot of the SSM-256 frame.
The VPU works with the voice subboards. The VPU provides the transcoding and EC functions for voice service streams. The VPU provides announcement playing resources to implement the digit-collecting and announcementplaying services.
No corresponding back board is required. Media gateway Voice Processing Unit D (MVPD)
Load sharing
It is inserted in a common front slot of the SSM-256 frame or the SSM-32 frame. No corresponding back board is required.
D-10
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HUAWEI UMG8900 Hardware Description
D Boards of All SSM Frames
Board Name Logical Board
Physical Board Media gateway TransCode Unit B (MTCB)
Backup Mode
Board Position
Function
Load sharing
It is inserted in a common front slot of the SSM-256 frame.
When the MVPD is used in the SSM-256 frame, the frame must be configured with the MTNB.
No corresponding back board is required. Media gateway TransCode Unit D (MTCD)
Load sharing
It is inserted in a common front slot of the SSM-256 frame or the SSM-32 frame. No corresponding back board is required.
Echo Cancellation Unit (ECU)
Media gateway Echo Cancellation Unit (MECU)
Load sharing
The UG01MECU can be inserted in a common front slot of the SSM-256 frame. The UG02MECU can be inserted in a common front slot of the SSM-256 frame or the SSM-32 frame.
The ECU works with the voice subboards. The ECU implements the EC function for voice signals.
No corresponding front board is required. Table D-6 Clock units Board Name
Issue 05 (2009-01-09)
Logical Board
Physical Board
Clock Unit (CLK)
Media gateway Clock Unit (MCLK)
Backup Mode
Board Position
Function
Master/ slave
It is inserted in back slot 0 or 1 of the SSM-256 frame or the SSM-32 frame.
The CLK provides clock signals for services.
No corresponding front board is required.
The external interfaces includes the clock input/ output interfaces.
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D-11
HUAWEI UMG8900 Hardware Description
D Boards of All SSM Frames
Table D-7 Lightning protection units Board Name Logical Board
Physical Board
Lighting Protected Board (LPB)
Media gateway E1 Lightning Protected Board (MLPB)
Backup Mode
Board Position
Function
Nullback up
It is inserted in a common back slot of the SSM-256 frame or the SSM-32 frame.
The LPB provides the lightning protection for the outdoor E1 trunk cable.
No corresponding front board is required.
D-12
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HUAWEI UMG8900 Hardware Description
E Subboards of all SSM Frames
E
Subboards of all SSM Frames
E.1 MECU Subboards E.2 MHRU Subboards E.3 MHRD Subboards E.4 MASU Subboard E.5 MPIE Subboards E.6 Subboards of the MSPF E.7 MTCB Subboards E.8 MTCD Subboards E.9 MTNC Subboards E.10 MVPB Subboards E.11 MVPD Subboards
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E-1
HUAWEI UMG8900 Hardware Description
E Subboards of all SSM Frames
E.1 MECU Subboards MECC/MECF/MECG/MECJ/MECK Subboards The MECC/MECF/MECG/MECJ/MECK subboards work as the EC subboards and provide the following functions: l
The MECC/MECF/MECG subboards provide the acoustic echo cancellation (AEC) and electric EC functions.
l
The MECJ/MECK subboards provide the electric EC functions.
l
The MECC/MECF/MECG/MECJ/MECK subboards support various tail delays.
Table E-1 lists the technical specifications of the MECC/MECF/MECG/MECJ/MECK subboards. Table E-1 Technical specifications of the MECC/MECF/MECG/MECJ/MECK subboards Subboard
Tail Delay
Number of EC Channels
Power Consum ption
Heat Dissipat ion
MECC
16 ms/32 ms
1024
3.8 W
3.8 W
48 ms/64 ms
1024
80 ms/96 ms/110 ms/128 ms
512
MECF
64 ms
1024
2W
2W
MECG
128 ms
1024
5.3 W
5.3 W
MECJ
64 ms
1024
5.4 W
5.4 W
MECK
64 ms
2048
12.2 W
12.2 W
E.2 MHRU Subboards The subboard of the host process module broad (HPMB) is the main processor module subboard. The MHRU subboard processes the upper-layer protocol, initiates the backplane and implements the configuration and management through the HPMB subboard. The MHRU falls into two types: the UG01HPMB and UG02HPMB. They are similar in function. The UG01HPMB is used with UG01MHRU, whereas the UG02HPMB is used with UG02MHRU. The technical specifications of the HPMB correspond to the MHRU, see 7.1.5 Technical Specifications of the MHRU.
E-2
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Issue 05 (2009-01-09)
HUAWEI UMG8900 Hardware Description
E Subboards of all SSM Frames
E.3 MHRD Subboards D1GO Subboards The D1GO subboard provides one optical gigabit Ethernet (GE) interface or one electrical GE interface for the MHRD. The D1GO subboard is equipped with the pluggable interface module and provides one GE interface or electrical interface in conformity with the IEEE8002.3z standard. If the D1GO subboards are inserted in two MHRDs working in master/slave mode, by default, the D1GO subboards work in load-sharing mode. That is, one MHRD can manage two D1GO subboards at the same time. The interface of the D1GO subboard supports the non-APS 1+1 backup mode. Table E-2 lists the meaning of the indicators on the D1GO. Table E-2 Indicator meaning of the D1GO Indicator
Identifica tion
Color
Status
Meaning
Working indicator
ACT
Yellow
Flashing
Data receiving and transmitting on the optical interface
Optical fiber connection state indicator
LINK
Green
Always on
Connection established
Always off
Connection not established
Table E-3 lists the technical specifications of the D1GO. Table E-3 Technical specifications of the D1GO
Issue 05 (2009-01-09)
Category
Parameter
Specification
Remarks
Optical module
Physical type
LC
–
Mode
Multi-mode
Transmission distance
0.5 km
Wavelength
850 nm
Output optical power
–9.5 dBm to –2.5 dBm
Maximum receive sensitivity
–17.0 dBm
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HUAWEI UMG8900 Hardware Description
E Subboards of all SSM Frames
Category
Parameter
Specification
Saturation optical power
0 dBm
Specification
IEEE802.3 and IEEE802.3z
Electrical module
Physical type
RJ45 electrical interface
Transmission distance
100 m [0.06 mi.]
Power consumption
N/A
8.5 W
Heat dissipation
N/A
8.5 W
Remarks
–
–
D8FT Subboards The D8FT subboard provides eight fast Ethernet (FE) interfaces for the MHRD. If the D8FT subboards are inserted in the MHRDs working in master/slave mode, by default, the D8FT subboards work in load-sharing mode. That is, one MHRD can manage two D8FT subboards at the same time. The interface of the D8FT subboard supports non-APS 1+1 backup mode. Table E-4 lists the meaning of the indicators on the D8FT. Table E-4 Indicator meaning of the D8FT Indicator
Identifica tion
Color
Status
Meaning
Network interface speed indicator
-
Green
Always on
The interface works at the rate of 100 Mbit/s.
Always off
The interface works at the rate of 10 Mbit/s.
Network interface connection indicator
-
Always on
The link is through.
Always off
The link is not through.
Flashing
Some data is being received or transmitted through the link.
Yellow
Table E-5 lists the technical specifications of the D8FT. Table E-5 Technical specifications of the D8FT
E-4
Category
Parameter
Specification
Remarks
Interface
Physical type
RJ45
–
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HUAWEI UMG8900 Hardware Description
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Category
Parameter
Specification
Quantity
8
Specification
IEEE802.3 and IEEE802.3u
Power consumption
N/A
8.5 W
Heat dissipation
N/A
8.5 W
Remarks
–
E.4 MASU Subboard The subboard of the host process module broad (HPMB) is the main processor module subboard. The MASU subboard processes the upper-layer protocol, initiates the backplane and implements the configuration and management through the HPMB subboard. The MHRU falls into two types: the UG01HPMB and UG02HPMB. They are similar in function. The UG01HPMB is used with UG01MASU, whereas the UG02HPMB is used with UG02MASU. The technical specifications of the HPMB correspond to the MASU, see 7.4.5 Technical Specifications of the MASU.
E.5 MPIE Subboards Up to three ME3A subboards can be configured on the MPIE. The ME3A subboard is mainly used to multiplex and demultiplex an E3/T3 interface. Table E-6 lists the technical specifications of the ME3A subboard. Table E-6 Technical specifications of the ME3A subboard Category
Parameter
Specification
Remarks
Power consumption
N/A
6W
–
Heat dissipation
N/A
6W
E.6 Subboards of the MSPF The SHPU subboard is the signaling high-level processing subboard. The MSPF processes layer 2 signaling protocol through the SHPU subboard. Based on the configured work modes, the subboards can support different layer 2 protocols. Up to two subboards can be configured on each MSPF. Table E-7 lists the technical specifications of the SHPU subboard. Issue 05 (2009-01-09)
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HUAWEI UMG8900 Hardware Description
E Subboards of all SSM Frames
Table E-7 Technical specifications of the SHPU subboard Category
Parameter
Specification
Remarks
Power consumption
N/A
8.5 W
–
Heat dissipation
N/A
8.5 W
Service processing capability
Number of the MTP2 links
Up to twenty-three 64 kbit/s MTP2 links
PRO_64K_PRA or PRO_BT_64K_PRA mode
Up to one 2 Mbit/s MTP2 link
PRO_2M or PRO_BT_2M mode
Up to 64 links
PRO_PRA mode
Number of the Q. 921 links Number of the LAPRSA links Number of the LAPV5 links
Up to 32 links
E.7 MTCB Subboards For details on the description of the MTCB subboard, see E.10 MVPB Subboards.
E.8 MTCD Subboards For details on the description of the MTCD subboard, see E.11 MVPD Subboards.
E.9 MTNC Subboards UG01MTNC Subboards The TLDA subboard provides one TDM cascading channel for the UG01MTNC2. The TLDB subboard provides two TDM cascading channels for the UG01MTNC5. The cascading capacity for each channel is 8 K timeslots. The interfaces are connected with the corresponding frames through optical fibers. Table E-8 lists the indicator meaning of the TLDA/TLDB subboards.
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HUAWEI UMG8900 Hardware Description
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Table E-8 Indicator meaning of the TLDA/TLDB Indicator
Identific ation
Color
Status
Meaning
Working indicator
ACT
Orange
Always on or flashing
The optical interface is in the master state.
Always off
The optical interface is in the slave state.
Always on
Connection established
Always off
Connection not established
Optical fiber connection state indicator
LINK
Green
Table E-9 lists the technical specifications of the TLDA/TLDB subboards. Table E-9 Technical specifications of the TLDA/TLDB subboards Category
Parameter
Specification
Remarks
Optical module
Physical type
LC
–
Wavelength
850 nm
–
Output optical power
–9.5 dBm to –4.0 dBm
–
Maximum receive sensitivity
–17.0 dBm
–
Transmission distance
550 m [0.3 mi.]
50 um optical fiber
275 m [0.2 mi.]
62.5 um optical fiber
Power consumption
N/A
6.4 W
–
Heat dissipation
N/A
6.4 W
UG02MTNC Subboards The UG02MTNC provides a maximum of 4 x 8 K time division multiplex (TDM) cascading capability. The TS1C subboard provides 1 x 8 K TDM cascading capability. The TS2C subboard provides 2 x 8 K TDM cascading capability. The TS4C subboard provides 4 x 8 K TDM cascading capability. The meaning of the indicators of the TS1C/TS2C/TS4C subboards is the same as that of the TLDA/TLDB subboards. Refer to Table E-8. The technical specifications of the optical interfaces of the TS1C/TS2C/TS4C subboards are the same as those of the TLDA/TLDB subboards. Refer to Table E-9. Table E-10 lists the power consumption of the TS1C/TS2C/TS4C subboards. Issue 05 (2009-01-09)
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HUAWEI UMG8900 Hardware Description
E Subboards of all SSM Frames
Table E-10 Power consumption of the TS1C/TS2C/TS4C subboards Subboard
Power Consumption
Heat Dissipation
TS1C
22.9 W
22.9 W
TS2C
24.3 W
24.3 W
TS4C
27 W
27 W
E.10 MVPB Subboards MVDB Subboards The MVDB subboard works as the TC subboard and provides the following functions: l
Providing the voice codec conversion function and supporting the voice codec modes including AMR, AMR-WB, QCELP, EVRC, SMV, G.711, G.726, G.723, and G.729
l
Providing 512 AMR channels
l
Providing the FAX function, and supporting the T.30 and T.38 protocols
l
Providing the DTMF detection and DTMF number sending functions
l
Working with the MVPB to play simple announcements
Table E-11 lists the technical specifications of the MVDB subboard. Table E-11 Technical specifications of the MVDB subboard Category
Parameter
Specificatio n
Remarks
Power consumption
N/A
10 W
–
Heat dissipation
N/A
10 W
Service processing capability
Number of the TC channels
1024
G.711 voice codec mode
512
G.723/G.726/G.729/AMR voice codec modes
Number of the CC channels
1024
Use the MVDB subboard in subboard slot 0/1.
2048
Use the MVDB subboard in subboard slot 2.
MECC/MECE/MECF/MECG/MECH/MECI/MECJ/MECK Subboards The MECC/MECE/MECF/MECG/MECH/MECI/MECJ/MECK subboards work as the echo cancellation (EC) subboard and provide the following functions:
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l
The MECC/MECE/MECF/MECG/MECH/MECI subboards provide the acoustic echo cancellation (AEC) and electric EC (EEC) functions.
l
The MECJ/MECK subboards provide the electric EC functions.
l
Supporting various tail delays.
Table E-12 lists the technical specifications of the MECC/MECE/MECF/MECG/MECH/ MECI/MECJ/MECK subboards. Table E-12 Technical specifications of the MECC/MECE/MECF/MECG/MECH/MECI/ MECJ/MECK subboards Subboard
Tail Delay
Number of the EC Channels
Power Consumpti on
Heat Dissipation
MECC
16 ms/32 ms
1024
3.8 W
3.8 W
48 ms/64 ms
1024
80 ms/96 ms/110 ms/128 ms
512
16 ms/32 ms
2048
9W
9W
48 ms/64 ms
2048
80 ms/96 ms/110 ms/128 ms
1024
MECF
64 ms
1024
2W
2W
MECG
128 ms
1024
5.3 W
5.3 W
MECH
64 ms
2048
6.4 W
6.4 W
MECI
128 ms
2048
2.3 W
2.3 W
MECJ
64 ms
1024
5.4 W
5.4 W
MECK
64 ms
2048
12.2 W
12.2 W
MECE
UG01MECL Subboards The UG01MECL subboard can be inserted only in the UG02MVPB. The UG01MECL serves as the EC subboard and provides the following functions: l
Providing electric echo cancellation
l
Providing a maximum of 1500 EC channels of 64 ms tail delay
l
Detecting the individual tone
l
Supporting simultaneous recording of four timeslots, and subboard buffering voice data of four timeslots with 384 ms tail delay
l
Providing the loopback test of the subboard EC ASIC and boasting the capability of locating the noise
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HUAWEI UMG8900 Hardware Description
E Subboards of all SSM Frames l
Providing independent production information
l
Providing the JTAG interface to communicate with the CAN bus module, and supporting the system online test and logic online upgrade
Table E-13 lists the technical specifications of the UG01MECL subboard. Table E-13 Technical specifications of the UG01MECL subboard Category
Parameter
Specification
Remarks
Power consumption
N/A
4.3 W
Fully loaded
Heat dissipation
N/A
4.3 W
–
Service processing capability
Number of the EC channels
1536
Tail length: 64 ms
UG01MVDD Subboards The UG01MVDD subboard, only for the UG02MVPB, works as the integrated subboard of the EC and TC, and provides the following functions: l
Providing the voice codec conversion function and supporting the voice codec modes such as AMR, AMR-WB, QCELP, EVRC, SMV, G.711, G.726, G.723, and G.729.
l
Providing the echo cancellation (EC) function
l
Providing the FAX function, and supporting the T.30 and T.38 protocols
l
Providing the DTMF detection and DTMF number sending functions
l
Working with the UG02MVPB to play simple announcements
Table E-14 lists the technical specifications of the MVDB subboard. Table E-14 Technical specifications of the MVDD subboard Category
Parameter
Specification
Remarks
Power consumption
N/A
12 W
Fully loaded
Heat dissipation
N/A
12 W
–
Service processing capability
Number of the EC channels
1024
G.711 voice codec mode
672
G.729a/b voice codec mode
Board Positions Figure E-1 shows the position of the MVPB subboard.
E-10
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HUAWEI UMG8900 Hardware Description
E Subboards of all SSM Frames
Figure E-1 Position of the MVPB subboard
TC subboard 0 MBUS subboard
TC subboard 1
TC subboard 2/ EC subboard
The position of the EC subboard is the same as that of TC subboard 2, but the EC subboard and TC subboard 2 do not share the subboard connector. In addition, the EC subboard and TC subboard cannot be configured in this position at same time.
E.11 MVPD Subboards MVQE Subboards The MVQE subboard functions as the transcoder (TC) subboard and provides the following functions: l
Providing the acoustic echo cancellation (AEC) electric EC functions.
l
Supporting various tail delays.
Table E-15 lists the technical specifications of the MVQE subboard. Table E-15 Technical specifications of the MVQE subboard Subboard
Tail Delay
Number of the EC Channels
Power Consumption
Heat Dissipation
MVQE
64 ms
1024
10 W
10 W
UG01MVDD Subboards The UG01MVDD subboard, only for the UG02MVPD, works as the integrated subboard of the EC and TC, and provides the following functions: Issue 05 (2009-01-09)
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HUAWEI UMG8900 Hardware Description
E Subboards of all SSM Frames l
Providing the voice codec conversion function and supporting the voice codec modes such as AMR, AMR-WB, QCELP, EVRC, SMV, G.711, G.726, G.723, and G.729.
l
Providing the echo cancellation (EC) function
l
Providing the FAX function, and supporting the T.30 and T.38 protocols
l
Providing the DTMF detection and DTMF number sending functions
l
Working with the UG02MVPD to play simple announcements
Table E-16 lists the technical specifications of the MVDB subboard. Table E-16 Technical specifications of the MVDD subboard Category
Parameter
Specification
Remarks
Power consumption
N/A
12 W
Fully loaded
Heat dissipation
N/A
12 W
-
Service processing capability
Number of the EC channels
1024
G.711 voice codec mode
672
G.729a/b voice codec mode
UG01MVDF Subboards The UG01MVDF subboard can be inserted only in the UG02MVPD_VC. The UG01MVDF subboard serves as the TC subboard and provides the following functions: l
Supporting the codec of 768 channels, G.729a/b codec, and AMR codec
l
Supporting the G.711 voice codec service of 1500 channels
l
Supporting the multiparty service of 2000 channels
l
Detecting the clock status of the subboards by adding the subboard logic
Table E-17 lists the technical specifications of the UG01MVDF subboard. Table E-17 Technical specifications of the UG01MVDF subboard
E-12
Category
Parameter
Specification
Remarks
Power consumption
N/A
7.6 W
Fully loaded
Heat dissipation
N/A
7.6 W
–
Service processing capability
Number of the TC channels
1536
G.711 voice codec mode
768
G.723/G.726/G.729/AMR voice codec mode
Number of the CC channels
1024
Use the MVDF subboard in subboard slot 0/1.
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Category
Parameter
Specification
Remarks
2048
Use the MVDF subboard in subboard slot 2.
UG01MECL Subboards The UG01MECL subboard can be inserted only in the UG02MVPD_VC. The UG01MECL serves as the EC subboard and provides the following functions: l
Providing electric echo cancellation
l
Providing a maximum of 1500 EC channels of 64 ms tail delay
l
Detecting the individual tone
l
Supporting simultaneous recording of four timeslots, and subboard buffering voice data of four timeslots with 384 ms tail delay
l
Providing the loopback test of the subboard EC ASIC and boasting the capability of locating the noise
l
Providing independent production information
l
Providing the JTAG interface to communicate with the CAN bus module, and supporting the system online test and logic online upgrade
Table E-18 lists the technical specifications of the UG01MECL subboard. Table E-18 Technical specifications of the UG01MECL subboard Category
Parameter
Specification
Remarks
Power consumption
N/A
4.3 W
Fully loaded
Heat dissipation
N/A
4.3 W
–
Service processing capability
Number of the EC channels
1536
Tail length: 64 ms
Board Positions Figure E-2 shows the position of the MVPD subboard.
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E-13
HUAWEI UMG8900 Hardware Description
E Subboards of all SSM Frames
Figure E-2 Position of the MVPD subboard
TC subboard 0 MBUS subboard
TC subboard 1
TC subboard 2/ EC subboard
The position of the EC subboard is the same as that of TC subboard 2, but the EC subboard and TC subboard 2 do not share the subboard connector. In addition, the EC subboard and TC subboard cannot be configured in the same position at the same time. The subboards used by the MVPD are the same as those of the MVPB. See E.10 MVPB Subboards.
E-14
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