gpt1e0110

Reference No. 83140 55625 PDM−Version D

SOAC

ILS 420 Instrument Landing System Glide Path 422

Technical Manual Part 1 Equipment Description

As for details, the electrical electrical and mechanical mechanical information information given in in the documentation supplied with each equipment prevails

All rights reserved reserved E 2010 Thales ATM GmbH Stuttgart Printed in Germany

NAVAIDS 400 Conventional Navaids

Documentation Documentation Structure

GP 422 The equipment documentation comprises:

Ed. 01.10

Part

Technical Manuals

Code No.

1

Equipment Description

83140 55625

2

Operation and Maintenance

3

Antenna Systems

83140 55626

Volume

Drawing Set

Code No.

A

Set of Circuit Diagrams (1F) Set of Circuit Diagrams (2F active)

83051 48561 83051 48561

B

Set of Circuit Diagrams (1F) Set of Circuit Diagrams (2F active)

83051 48561 83051 48561

SOAC

Info 1

NAVAIDS GENERAL

As for details, details, the electrical electrical and mechanical information information given given in the documentation supplied supplied with each equipequipment prevails. Despite of careful editing work technical inaccuracies and printing faults cannot be excluded in this publication. Change of text remains reserved without notification. Thales reserves the right to make design changes, additions to improvements in its products without obligation to install such in products previously manufactured or installed. TECHNICAL SUPPORT AND HANDLING REPLACEMENT PARTS

Subassemblies and components which are sent to the manufacturer for repair or returns must be packed in a way that no damage of the parts could arise. It is recommended to use the original packing, e.g. of the spare part, or a comparable packing in corresponding performance to ensure a safe shipping of defective subassemblies or components. For technical support and information on how to order or sent back replacement parts, contact your equipment provider listed below. Germany:

Italy:

United States:

Thales ATM GmbH Lilienthalstrasse 2 7082 70825 5 Kor Kornt ntal al−M −Mün ünch chin inge gen n Tel: +49 711 86032−151 86032−15 1 Fax: +49 711 86032−804

Germ German any y

Thales Italia SPA Via E. Mattei, 1 20064 Gorgonzola (MI) Tel: +39 02 95095−405 Fax: +39 02 95095−331

Italy

Thales les ATM Inc. 23501 West 84 th Street Shawnee, Kansas 66227 Tel: +1 913 422−2600 Fax: +1 913 422−2962

USA

LIMITATION OF USE

The use of this manual is limited to the operation and maintenance of the system stated in the title page. It shall not be used for purposes of product manufacture. The installation drawings in the manuals, e.g. foundations and site drawings are for information only. The as−built engineering drawings for the site are the only one to be used. The information in the technical manuals is thought to be used by skilled workers to install the antenna and perform the related electrical and mechanical adjustments. The leader of the installation team should be an engineer, technician or experienced master craftsman. Special training and initiation by Thales are urgently recommended. The fitters should be trained craftsman, for example mechanics, electricians or locksmiths. SAFETY PRECAUTIONS

The safety regulations laid down by the local authorities (e.g. concerning accident prevention, work safety or operation of electronic equipment and navigation systems) must be observed at all times. The purpose of safety precautions is to protect persons and property, and they must always be heeded. Station shutdown due to repair and maintenance: The responsible authorities must be notified of any work which may require operation of the system to be interrupted, in accordance with national regulations. Further information due to system handling is contained in the correspondent sections. COPYRIGHT

Reproduction of this manual is not permitted without written authorization of Thales ATM. TRADEMARKS

Microsoft and MS−DOS are registered trademarks, WINDOWS is a trademark of the Microsoft Corporation. IBM is a registered trademark of the International Business Machines Corporation. Pentium Pentium is a registered trademark of the Intel Corporation. All other mentioned product names may be trademarks of the respective manufacturers and must be observed. Ed. 01.10

Info 2

ILS 420

GP 422 Preliminary Remarks


PRELIMINARY REMARKS The equipment manuals for ILS Glide Path 422 (1F and 2F versions) comprise:

PART

CONTENTS

CODE NO.

1 2 3

Equipment Description Operation and Maintenance Antenna System Description

83140 55625 83140 55626

This Technical Technical Manual Part 1 includes the Equipment Description with wit h the chapters below:

1 2 3 4 5

General Information Technical Description GP−1F Technical Description GP−2F Emergency Power Supply Remote Maintenance and Monitoring Configuration (RMMC)

Chapter Chapt er 1 contains general descriptions both for GP−1F and −2F −2F. The GP−1F−specific descriptions are contained in Chapter 2, and the GP−2F−specific descriptions in Chapter 3. Due to the fact that subassembly descriptions are mostly identical, Chapter 2 comprises detailed descriptions only of different subassemblies or remarks to differences. With the cross−reference system used it is easily to be fined where the information can be found. Since it is not possible to include modifications, such as those which may be made to circuitry details or dimensioning in the th e interests of technical progress, in the Technical Technical Manual, we should point out that questions of detail should always be answered using the technical documentation supplied with the system. It is possible that drawing numbers used in this description are no longer contained in the set of drawings supplied (GP−1F (2F) , Volume A to B (C), but rather than (to conform with the system) syste m) they have been replaced by new drawings with another number. number. Please carry out a once−only check on the basis of delivery list supplied and exchange where appropriate. Description and use of the ’PC User Program’ will be found for use of ADRACS in the Tech. Manual, Code No. 83140 55324, the one for use of MCS in the Tech. Manual, Code No. 83140 55325.

MARK SYMBOLS To get the best out of the navigation systems you should study the contents of this manual carefully. In particular you should familiarize yourself with the marks given in this manual which are highlighted for easy recognition:

CAUTION

WARNING

Cautions call attention to methods and procedures which must be followed to avoid damage to equipment.

Warnings call attention to methods, procedures or limits which must be followed precisely to avoid injury to persons.

NOTE or REMARK : For more information about operations. Ed. 07.06

SOAC

A

GP 422

ILS 420 Equipment Description

Preliminary Remarks

Table of effective pages Basic edition: 01.04 / Revised: 01.10

Pages

Ed.

Pages

Ed.

Title Info 1 and 2 A B I to X AV−1 to 16 1−1 1−2 1−3 to 9 1−10 to 15 1−16 to 18 1−19 1−20 to 21 1−22 1−23 to 30 1−31 1−32 to 34 1−35 1−36 1−37 to 38 1−39 to 44 1−45 1−46 to 52 2−1 2−2 2−3 2−4 2−5 to 7 2−8 2−9 2−10 to 12 2−13 2−14 2−15 2−16 to 18 2−19

0 1 .1 0 0 1 .1 0 07.06 0 1 .1 0 0 7 .0 6 07.06 01.04 0 7 .0 6 0 1 .0 4 01.10 01.04 0 7 .0 6 01.04 0 7 .0 6 01.04 1 0 .0 4 01.04 0 7 .0 6 0 7 .0 8 01.04 01.10 0 7 .0 6 01.04 0 6 .0 5 0 7 .0 8 0 6 .0 5 0 1 .0 4 0 6 .0 5 0 1 .0 4 0 1 .1 0 01.04 0 1 .1 0 0 6 .0 5 0 7 .0 6 06.05 0 7 .0 6

2−20 2−21 to 24 2−25 to 26 3−1 3−2 3−3 to 3−4 3−5 to 7 3−8 to 9 3−10 3−11 3−12 to 14 3−15 3−16 3−17 3−18 3−19 3−20 3−21 3−22 to 23 3−24 to 26 3−27 to 31 3−32 3−33 3−34 to 37 3−38 to 40 3−41 to 44 3−45 3−46 to 48 3−49 to 50 3−51 to 52 3−53 to 54 3−55 to 63 3−64 3−65 to 66 4−1 to 2 5−1 to 6

06.05 07.08 01.04 01.04 07.08 10.04 01.04 06.05 01.04 06.05 01.04 01.10 01.04 07.06 01.04 07.06 01.10 01.04 07.08 01.04 06.05 01.04 07.06 01.10 01.04 01.10 10.04 01.04 10.04 07.06 08.04 01.04 07.08 01.04 07.06 07.06

Remarks

Trademarks: Trademarks:

Microsoft and MS−DOS MS−DOS are registered trademarks, WINDOWS WINDOWS is a trademark trademark of the Microsoft Microsoft Corporation. IBM is a registered trademark of the International Business Machines Corporation. Pentium  is a registered trademark of the Intel Corporation. All other mentioned product names may be trademarks of the respective manufacturers and must be observed.

Note

Despite Despite of careful careful editin editing g work work technic technical al inaccur inaccuracie acies s and print printing ing faults faults cannot cannot be exclu excluded ded in this publication. cation. Chang Change e of text text remain remains s reserve reserved d without without notif notificat ication. ion.

B

SOAC

Ed. 01.10

ILS 420

GP 422 Table of Contents


TABLE OF CONTENTS Section

Title

Page

CHAPTER 1 GENERAL INFORMATION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

1−1

1.1

INTRODUCTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

1−1

1.2

ILS−PRINCIPLE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

1−3

1.2.1

Arrangement of Subsystems . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

1−3

1.2.2

Navigation Signal Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

1−5

1.2.2.1

Localizer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

1−5

1.2.2.2

Glide Path . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

1−6

1.2.2.3

Approach Path . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

1−7

1.2.3

Monitoring . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

1−8

1.2.4

Equipment Versions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

1−9

1.2.4.1

Summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

1−9

1.2.4.2

Equipment Versions and Options . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

1−10

1.3

TECHNICAL DATA OF GLIDE PATH 1F/2F . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1−11

1.3.1

Dimensions and Weight of the Transmitter Rack . . . . . . . . . . . . . . . . . . . . .

1−11

1.3.2

Power Supply . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

1−11

1.3.3

Environmental Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

1−11

1.3.4

System Data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

1−11

1.3.5

Equipment Data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

1−12

1.3.5.1

CSB Transmitter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

1−12

1.3.5.2

CSB Modulation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

1−12

1.3.5.2.1

GS−1F . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

1−12

1.3.5.2.2

GS G S−2F (active) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

1−12

1.3.5.2.3

GS−2F (standard) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

1−13

1.3.5.3

SBO Transmitter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

1−13

1.3.5.4

Monitoring . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

1−13

1.3.5.5

Built In Test (BIT) Measuring Functions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1−14

1.3.6

Interfaces . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

1−14

1.3.7

Antenna System . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

1−14

1.3.8

Notes on "Standby" operational Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

1−15

1.3.9

Conformity and Licensing Approval . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

1−15

1.4

SAFETY PRECAUTIONS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

1−17

1.4.1

Operating at the Device . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

1−17

Ed. 07.06

SOAC

I

GP 422

ILS 420

Table of Contents


Section

Title

Page

1.4.2

Handling Subassemblies . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

1−17

1.4.3

Handling Lead Batteries . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

1−18

1.4.4

Components with Beryllium Oxide Ceramic . . . . . . . . . . . . . . . . . . . . . . . . .

1−18

1.4.5

Using Lithium Batteries . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

1−18

1.4.6

Miscellaneous . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

1−18

1.4.7

Observation of Safety Regulations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

1−18

1.5

FUNCTIONAL OVERVIEW . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

1−19

1.5.1

General . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

1−19

1.5.2

Brief Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

1−20

1.5.2.1

Transmitter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

1−20

1.5.2.2

M o n i t or . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

1−20

1.5.2.3

Equipment Control and Switching . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

1−21

1.5.2.4

Local/Remote Communication Interface (LRCI) . . . . . . . . . . . . . . . . . . . . . . . . . 1−22

1.5.2.5

Power Supply . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

1−22

1.5.3

Peripheral subassemblies . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

1−22

1.5.4

General block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

1−22

1.6

FUNCTIONAL DESCRIPTION OF THE TRANSMITTER . . . . . . . . . . . . . . . . . . 1−25

1.6.1

Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

1−25

1.6.2

Audio Generator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

1−25

1.6.3

Synthesizer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

1−26

1.6.4

Modulator/Power Amplifier . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

1−27

1.6.4.1

CSB Modulator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

1−27

1.6.4.2

SBO Modulator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

1−28

1.6.4.3

Linear Power Amplifiers for CSB and SBO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1−28

1.7

FUNCTIONAL DESCRIPTION OF THE MONITOR . . . . . . . . . . . . . . . . . . . . . . 1−29

1.7.1

Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

1−29

1.7.2

Monitor Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

1−30

1.7.2.1

Executive and Standby Monitoring . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

1−31

1.7.2.2

Alarm Identification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

1−31

1.7.2.3

Monitor Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

1−31

1.7.2.4

Fail Safe . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

1−31

1.7.3

Executive Control Unit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

1−32

1.7.3.1

Fail Safe . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

1−34

1.8

FUNCTIONAL DESCRIPTION LRCI . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1−35

II

SOAC

Ed. 07.06

ILS 420

GP 422


Table of Contents

Section

Title

Page

1.8.1

Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

1−35

1.8.2

Introduction to the LCP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

1−35

1.8.3

Data Transmission . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

1−35

1.9

FUNCTIONAL DESCRIPTION POWER SUPPLY . . . . . . . . . . . . . . . . . . . . . . . . 1−36

1.9.1

Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

1−36

1.9.2

Startup Procedure . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

1−36

1.10

NAVAIDS 400 SOFTWARE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

1−45

1.10.1

Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

1−45

1.10.2

PC User Program Software . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

1−45

1.10.3

Description of the ILS Transmitter Software . . . . . . . . . . . . . . . . . . . . . . . . .

1−46

1.10.3.1

Generation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

1−46

1.10.3.2

Diagnostics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

1−46

1.10.4

Description of Monitor Software . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

1−48

1.10.4.1

Operating System . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

1−48

1.10.4.2

Software Tasks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

1−48

1.10.5

Description of LRCI Software . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

1−52

1.10.5.1

Short Description of the Modules . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

1−52

CHAPT CHAPTER ER 2 TE TECHN CHNICA ICAL L DESCR DESCRIP IPTI TION ON GP−1 GP−1F F ..................................

2−1 2−1

2.1

GENERAL . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

2−1

2.1.1

System Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

2−1

2.1.2

Basic Components of an GP Transmitter Rack . . . . . . . . . . . . . . . . . . . . . .

2−2

2.1.2.1

Transmitter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

2−2

2.1.2.2

M o n i t or . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

2−2

2.1.2.3

Control and Switching . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

2−2

2.1.2.4

Local/Remote Communication Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2−2

2.1.2.5

Generation of the Operating Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2−2

2.2

MECHANICAL DESIGN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

2−5

2.2.1

GP Transmitter Rack . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

2−5

2.2.2

Shelter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

2−11

2.3

DESCRIPTION OF SUBASSEMBLIES OF THE TRANSMITTER RACK . . . . . 2−13

2.3.1

General . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

2−13

2.3.2

Overview Subassemblies GP−1F Transmitter Rack . . . . . . . . . . . . . . . . . .

2−13

2.3.3

Transmitter Subassemblies . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

2−15

2.3.3.1

Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

2−15

Ed. 07.06

SOAC

III

GP 422

ILS 420

Table of Contents


Section

Title

Page

2.3.3.2

Localizer/Glide Path Audio Generator LG−A . . . . . . . . . . . . . . . . . . . . . . . . . . . 2−16

2.3.3.3

Synthesizer (SYN) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

2.3.3.4

Modulator Power Amplifier (MODPA) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2−16

2.3.3.5

Transfer Assembly . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

2.3.3.6

B−Type: Power Adder (PAD−S) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2−17

2.3.4

Monitor Subassemblies . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

2−19

2.3.4.1

Monitor Interface (INTFC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

2−20

2.3.4.2

Localizer/Glide Path Monitor (LG−M) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2−20

2.3.4.3

Executive Control Unit (ECU) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

2.3.4.4

Stby and On−Air Combiner (SOAC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2−20

2.3.4.4.1

Operation of a typical Down Conversion Channel (On−air) . . . . . . . . . . . . . . 2−21

2.3.4.4.2

Standby Channels . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

2.3.4.4.3

Antenna Configuration Signal Processing Selection . . . . . . . . . . . . . . . . . . . . . 2−21

2.3.4.4.4

Local Oscillator Switching and Distribution . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2−21

2.3.5

LRCI Subassemblies . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

2−25

2.3.6

Power Supply . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

2−25

2−16 2−16

2−20

2−21

CHAPTER 3 TECHNICAL DESCRIPTION GP−2F . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

3−1

3.1

GENERAL . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

3−1

3.1.1

System Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

3−1

3.1.2

Basic Components of an GP Transmitter Rack . . . . . . . . . . . . . . . . . . . . . .

3−2

3.1.2.1

Transmitter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

3−2

3.1.2.2

M o n i t or . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

3−2

3.1.2.3

Control and Switching . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

3−2

3.1.2.4

Local/Remote Communication Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3−2

3.1.2.5

Generation of the Operating Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3−2

3.2

MECHANICAL DESIGN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

3−7

3.2.1

GP Transmitter Rack . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

3−7

3.2.2

Shelter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

3−13

3.3

DESCRIPTION OF SUBASSEMBLIES OF THE TRANSMITTER RACK . . . . . 3−15

3.3.1

General . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

3−15

3.3.2

Overview Subassemblies GP−2F Transmitter Rack . . . . . . . . . . . . . . . . . .

3−15

3.3.3

Transmitter Subassemblies . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

3−17

3.3.3.1

Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

3−17

3.3.3.2

Localizer/Glide Path Audio Generator (LG−A) . . . . . . . . . . . . . . . . . . . . . . . . . . 3−18

IV

SOAC

Ed. 07.06

ILS 420

GP 422


Table of Contents

Section

Title

Page

3.3.3.2.1

LG LG−A Hardware . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

3−18

3.3.3.2.2

LG−A functional Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

3−19

3.3.3.3

Synthesizer (SYN) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

3−21

3.3.3.4

Modulator Power Amplifier (MODPA) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3−23

3.3.3.5

PIN−Diode Transfer Switch . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

3−27

3.3.3.6

Power Adder . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

3−28

3.3.3.6.1

Power Adder (PAD−A), GP−2F (M−Type, active) . . . . . . . . . . . . . . . . . . . . . . . 3−28

3.3.3.6.2

Power Adder (PAD−S), GP−2F (M−Type, standard) . . . . . . . . . . . . . . . . . . . . 3−30

3.3.4

Monitor Subassemblies . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

3−33

3.3.4.1

Monitor Interface (INTFC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

3−34

3.3.4.2


3.3.4.2.1

LG−M Hardware . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

3−36

3.3.4.2.2

LG−M functional Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

3−38

3.3.4.3

Executive Control Unit (ECU) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

3−41

3.3.4.3.1

Executive Control Unit Action . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

3−41

3.3.4.4

Stby and On−Air Combiner (SOAC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3−45

3.3.4.4.1

Operation of a typical Down Conversion Channel (On−air) . . . . . . . . . . . . . . 3−46

3.3.4.4.2

Standby Channels . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

3.3.4.4.3

Antenna Configuration Signal Processing Selection . . . . . . . . . . . . . . . . . . . . . 3−49

3.3.4.4.4

Local Oscillator Switching and Distribution . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3−49

3.3.4.4.5

DC supply for PIN−Diode Transfer Switch . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3−50

3.3.4.4.6

Additional Functions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

3−50

3.3.5

LRCI Subassemblies . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

3−51

3.3.5.1

Local Control Panel (LCP) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

3−51

3.3.5.1.1

Local Control CPU (LC−CPU) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

3−52

3.3.5.1.2

CPU Board (DIMM−PC/386−I) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

3−54

3.3.5.1.3

Local Control Interface (LCI) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

3−55

3.3.5.2

Modem . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

3−56

3.3.5.2.1

Dedicated Line Modem LGM1200MD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3−56

3.3.5.2.2

Switched Line Modem LGM 28.8 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3−57

3.3.6

Power Supply . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

3.3.6.1

Overview DC/DC Converter and Power Switching . . . . . . . . . . . . . . . . . . . . . . 3−59

3.3.6.2

Low Voltage Sensor (LVS) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

3−60

3.3.6.3

DC Converter 5 V (DCC−5) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

3−60

Ed. 07.06

SOAC

3−49

3−59

V

GP 422

ILS 420

Table of Contents


Section

Title

Page

3.3.6.4

DC Converter Multivolt (DCC−MV) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

3−61

3.3.6.5

AC/DC Converter (ACC−54) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

3−64

CHAPTER 4 EMERGENCY POWER SUPPLY . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

4−1

CHAPT CHAPTER ER 5 REMOT REMOTE E MAINT MAINTENA ENANCE NCE AND AND MONI MONITO TORIN RING G CONF CONFIG IGUR URA ATION TION (RMMC (RMMC)) . 5−1 5−1 5.1

APPLICATION AND DESIGN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

5−1

5.1.1

Hierarchy of RMMC Remote Control System Components . . . . . . . . . . . .

5−2

5.1.2

System Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

5−3

5.1.2.1

Local Remote Control Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

5−3

5.1.2.2

Remote Control and Status Equipment (RC SE 443) . . . . . . . . . . . . . . . . . . . . . 5−3

5.1.2.3

Remote Control and Monitoring System (RCMS 443) . . . . . . . . . . . . . . . . . . . 5−4

5.1.2.4

Local Communication Unit (LCU) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

5.1.2.5

Remote Maintenance Center (RMC 443) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5−4

VI

SOAC

5−4

Ed. 07.06

ILS 420

GP 422 Table of Contents


LIST OF FIGURES Fig.−No.

Title

Page

Fig. 1−1

Measurement of DDM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

1−1

Fig. 1−2

Arrangement of ILS subsystems . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

1−4

Fig. 1−3

LLZ characteristic values . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

1−5

Fig. 1−4

GP characteristic values . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

1−6

Fig. 1−5

Overall diagram of ILS data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

1−7

Fig. 1−6

Localizer configurations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

1−10

Fig. 1−7

Glide Path configurations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

1−10

Fig. 1−8

Basic structure of an ILS GP; example GP−2F active, dual . . . . . . . . . . . . . . 1−23

Fig. 1−9

Cockpit indication . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

1−25

Fig. 1−10

Audio Generator principle . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

1−26

Fig. 1−11

Synthesizer principle . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

1−27

Fig. 1−12

Modulator Power Amplifier, principle . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1−28

Fig. 1−13

ILS 420 monitoring, simplified block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 1−29

Fig. 1−14

Monitored parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

1−29

Fig. 1−15

Detector Measurement Cycles . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

1−30

Fig. 1−16

Executive Control Unit, principle . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

1−32

Fig. 1−17

Monitor verification testing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

1−33

Fig. 1−18

Power supply, block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

1−37

Fig. 1− 1−19

ILS GP GP−1F; simplified block diagram (transmitter 2 partly shown) . . . . . . . . 1−39

Fig. ig. 1−2 1−20 0

ILS ILS GP GP−2F −2F act activ ive e; sim simp plifi lifie ed blo blocck dia diag gram ram (tr (tran ansm smit itte terr 2 par partl tlyy sho shown wn)) . . . 1−4 1−41

Fig. Fig. 1−21 1−21

ILS ILS GP− GP−2F 2F stand standar ard; d; simpl simplififie ied d bloc blockk diag diagra ram m (tr (tran ansm smitt itter er 2 par partl tlyy show shown) n) 1−43 1−43

Fig. 1−22

System software, overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Fig. 1−23

Task definitions and priority assignments . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1−48

Fig. 1−24

ADC S auto−calibration measurement times . . . . . . . . . . . . . . . . . . . . . . . . . . . 1−50

Fig. 1−25

Maximum ECU status update periods . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1−51

Fig. 1−26

Overview LCP SW structure . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

1−52

Fig. 2−1

GP−1F system overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

2−3

Fig. 2−2

Main components of a GP−1F transmitter cabinet . . . . . . . . . . . . . . . . . . . . . . 2−3

Fig. 2−3

Power distribution, block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2−4

Fig. 2−4

Locations in the GP−1F rack . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Fig. 2−5

Assignment of subassemblies for GP, dual . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2−7

Fig. 2−6

Transmitter rack ILS 420 (LLZ/GP) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2−8

Ed. 07.06

SOAC

1−45

2−6

VII

GP 422

ILS 420

Table of Contents


Fig.−No.

Title

Fig. 2−7

Transmitter rack GP−1F, dual, front door open, rear door open . . . . . . . . . . 2−9

Fig. 2−8

Navaids shelter, dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Fig. ig. 2−9 2−9

Stan Stand dard ard she shellter ter, inn inne er arr arran ang gemen ementt and and ele electr ctrical ical inst instal alla lati tion on (exa (exam mple ple) . . 2−1 2−12

Fig. 2−10

Circuit diagrams of subassemblies (transmitter rack) . . . . . . . . . . . . . . . . . . . . 2−13

Fig. Fig. 2−11 2−11

GP−1F GP−1F transmi transmitte tterr, block block diagra diagram m (dual (dual system system partly partly and power power . . . . . . . . 2−15 2−15 supply not shown)

Fig. 2−12

Transfer Assembly, block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2−16

Fig. 2−13

GP−1F, B−Type, overview and arrangement Power Adder PAD−S . . . . . . . 2−17

Fig. Fig. 2−14 2−14


Fig. 2−15

Stby and On−Air Combiner (SOAC), block diagram . . . . . . . . . . . . . . . . . . . . 2−20

Fig. Fig. 2−16 2−16

J19, J19, exam exampl ple e swi switc tch h set setti ting ng for for GP− GP−1F 1F Null Null refe refere renc nce e and and B−T B−Type ype mod mode e . 2−21 2−21

Fig. 2−17

Stby and On−Air Combiner (SOAC), front view . . . . . . . . . . . . . . . . . . . . . . . . 2−21

Fig. Fig. 2−18 2−18

Stby Stby and and On−Air On−Air Combi Combine nerr, blo block ck diag diagra ram, m, 0−Re 0−Ref. f. confi configu gura ratio tion n sel selec ecte ted d 2−22 2−22

Fig. Fig. 2−1 2−19 9

Stby Stby and and On−Air On−Air Com Combi biner ner,, bloc blockk diagr diagram am,, B−Typ B−Type e confi configu gura ratio tion n selec selecte ted d 2−23 2−23

Fig. 3−1

GP−2F system overview (GP active) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3−3

Fig. 3−2

GP−2F system overview (GP standard) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3−3

Fig. 3−3

Main components of a GP−2F transmitter cabinet (GP active) . . . . . . . . . . . 3−4

Fig. 3−4

Main components of a GP−2F transmitter cabinet (GP standard) . . . . . . . . . 3−4

Fig. 3−5

Power distribution, block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3−5

Fig. 3−6

Locations in the GP−2F rack . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Fig. 3−7

Assignment of subassemblies for GP, dual . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3−9

Fig. 3−8

Transmitter rack ILS 420 (LLZ/GP) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3−10

Fig. 3−9

Transmitter rack GP GP−2F active, dual, fr front do door open, re rear door op open . . . . 3−11

Fig. 3−10

Navaids shelter, dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Fig. Fig. 3−11 3−11

Stan Standa dard rd shel shelte terr, inne innerr arr arran ange geme ment nt and and elec electr tric ical al inst instal alla lati tion on (exa (examp mple le)) . . 3−14 3−14

Fig. 3−12

Circuit diagrams of subassemblies (transmitter rack) . . . . . . . . . . . . . . . . . . . . 3−15

Fig. Fig. 3−13 3−13


Fig. 3−14

Localizer/Glide Path Audio generator (LG−A) . . . . . . . . . . . . . . . . . . . . . . . . . . 3−20

Fig. 3−15

Synthesizer (SYN), block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3−22

Fig. 3−16

C SB and SBO, amplitude modulated signals (principle view) . . . . . . . . . . . . . 3−23

Fig. 3−17

MODPA CSB section, block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3−23

Fig. 3−18

MODPA SBO Section Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3−25

Fig. 3−19

Transfer Assembly, block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3−27

VIII

Page

SOAC

2−11

3−8

3−13

Ed. 07.06

ILS 420

GP 422


Table of Contents

Fig.−No.

Title

Fig. 3−20

Power Adder PAD−A, GP−2F (M−Type, active), block diagram . . . . . . . . . . 3−28

Fig. 3−21

Power Adder PAD−A, mechanical arrangement and cabling . . . . . . . . . . . . . 3−29

Fig. 3−22

Power Adder PAD−S, GP−2F (M−Type, standard), block diagram . . . . . . . 3−30

Fig. 3−23

Power Adder PAD−S, mechanical arrangement and cabling . . . . . . . . . . . . . 3−31

Fig. Fig. 3−24 3−24


Fig. 3−25

LLZ/GP Monitor Interface (INTFC), principle block diagram . . . . . . . . . . . . . . 3−35

Fig. 3−26


Fig. 3−27

Monitor ADCS conceptual block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3−38

Fig. 3−28

Acquisition and processing times . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Fig. Fig. 3−29 3−29

Monito Monitorr dete detecto ctorr proc proces essin sing g cycl cycle e and and measu measure reme ment nt cycl cycle e withi within n . . . . . . . . 3−39 3−39 the "other" slot

Fig. 3−30

ECU to Monitor Status Polling . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Fig. 3−31

Executive Control Unit (ECU), block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . 3−43

Fig. 3−32

Stby and On−Air Combiner, overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3−45

Fig. Fig. 3−33 3−33

Stby Stby and On−Air On−Air Combine Combinerr, block block diagram diagram,, active active M−array M−array config configurat uration ion selected

Fig. Fig. 3−34 3−34

Stby Stby and On−Air On−Air Combi Combine nerr, bloc blockk diag diagra ram, m, stand standar ard d M−ar M−arra rayy configuration selected

Fig. Fig. 3−3 3−35 5

J19, J19, exa examp mple le swi switch tch setti setting ng for for GP− GP−2F 2F act active ive and and stan standa dard rd M−Ar M−Arra rayy mode mode 3−49 3−49

Fig. 3−36

GP phase detector application (optional) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3−50

Fig. 3−37

Stby and On−Air Combiner (SOAC), front view . . . . . . . . . . . . . . . . . . . . . . . . 3−50

Fig. 3−38

LCP, overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Fig. 3−39

Local Control CPU (LC−CPU), block diagram . . . . . . . . . . . . . . . . . . . . . . . . . 3−53

Fig. 3−40

CPU board, block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Fig. 3−41

Local Control Interface (LCI), block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . 3−55

Fig. Fig. 3−42 3−42

Loca Locall Contr Control ol Inte Interf rfac ace e (LCI) (LCI),, visib visible le front front view view (tex (textt exam exampl ple: e: . . . . . . . . . . . . 3−55 3−55 system status screen)

Fig. 3−43

LGM1200MD, block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

3−56

Fig. 3−44

LGM 28.8, block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

3−58

Fig. 3−45

Overview power supply . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

3−59

Fig. 3−46

Low Voltage Sensor (LVS), block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3−60

Fig. 3−47

DC converter DCC−5, block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3−60

Fig. 3−48

DC converter DCC−MV, block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3−63

Fig. 3−49

AC/DC converter (ACC−54), block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . 3−65

Ed. 07.06

SOAC

Page

3−39

3−41

3−47 3−47

. . . . . . . . . 3−48 3−48

3−51 3−54

IX

GP 422

ILS 420

Table of Contents


Fig.−No.

Title

Page

Fig. 5−1

RMMC, overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

5−1

Fig. 5−2

Hierarchy of the RMMC system components . . . . . . . . . . . . . . . . . . . . . . . . . . . 5−2

Fig. 5−3

Example Configuration: RCMS 443 for two ILS and VOR/DME/TACAN . . . . 5−5

Fig. 5−4

MC S system architecture and components (example) . . . . . . . . . . . . . . . . . . . 5−6

X

SOAC

Ed. 07.06


List of Abbreviations

ABKÜRZUNGSVERZEICHNIS LIST OF ABBREVIATIONS LISTE D’ABRÉVIATIONS LISTA DE ABREVIATURAS A

Antenne Antenna Antena

AC

Alternating Current Courant alternatif Corriente alterna

ACA

Analogical Carrier Amplifier (BITE signal) Amplificateur pour porteurs analogiques (signal BITE) Amplificdor portador analogico (señal BITE)

ACC

Alternating Current Converter

ADC

Analog−Digital Converter Convertisseur analogique/numérique Convertidor analógico/digital

ADCS

Analog−to−digital Converter Subsystem Sous−système convertisseur analogique/numérique Subsistema convertidor analógico/digital

ADR

Analog Display Routine Routi ne Routine affichage analogique Rutina de indicator analógico

ADRACS

Automatic Data Recording R ecording And Control System

ADSB

Alternating Double Sideband Bande latérale double alternante Banda lateral doble alternante

ADU

Antenna Distribution Distributi on Unit Antennen−Verteileinheit Ensemble de distribution d’antenne Unidad de distribución de antena

AF

Audio Frequency Basse fréquence Audiofrequencia

AFC

Automatic Frequency Control Commande automatique par fréquence Control automático de frecuencia

AGC

Automatic Gain Control C ontrol Commande automatique de gain Control automático de ganancia

AM

Amplitude Modulation Modulation d’amplitude Modulación de amplitud

Ed. 07.06

SOAC

AV−1

NAVAIDS 400 List of Abbreviations AMP

ANSI ASB

ASC

ASCII

ASM

ASU

ATC ATC

ATIS

ATM AWD

BAZ BCD BCPS

BD

BF

BIT(E)

AV−2

Conventional Navaids

AMPlifier Amplificateur Amplificador American National Standards Institute In stitute Alternating SideBand Bandes latérales alternantes Banda lateral alternante Antenna Switch Control Con trol Commutateur d’antennes de commande Control de conmutador de antena American Standard Code for Information Interchange I nterchange Code standard américain pour l’échange d’informations Código stándard americano para el intercambio de informaciones Antenna Switch Module Module de commutateur d’antennes Módulo de conmutador de antena Antenna Switching Unit Ensemble de commutation d’antennes Unidad de conmutación de antena Air Traffic Traffic Control Contrôle du trafic aérien Control del tráfico aéreo Air Traffic Traffic Information System Système d’informations du trafic aérien Sistema de informaciones del tráfico aéreo Air Traffic Traffic Management Automatische Wähleinrichtung für Datenverbindungen Automatic dialling equipment for data connections Dispositif automatique de sélection pour liaisons d’acheminement de données Dispositivo automático de selección para comunicaciones de datos Back−Azimuth Binär Codiert Dezimal Binary Coded decimal Battery Charging Power Supply Chargeur de batterie et bloc d’alimentation Chargador de bateria y equipo de alimentación Baud Baud Baudio Basse Fréquency Audio Frequency Baja frecuencia (audiofrecuencia) Built−in Test (Equipment) Dispositif de test intégré Dispositivo de test integrado SOAC

Ed. 07.06



BK Z

BefehlsKennZahl Command code number Numéro indicatif de commande Número indicador de orden

BNC

Bayonet Navy Connector Koaxialverbinder mit Bayonetkupplung

BP

Backplane Rückwandverdrahtung

bro.

broches polig pin

B SE

Betriebs− und Schutzerde System and protective ground Prise de terre de système et terre t erre de protection Puesta a tierra del sistema y de protección

BSG−D

Blending Si Signal Ge Generator Générateur de signaux de transition Generador de señal de transición

B ST

Baustahl Structure steel Acier de construction Acero de construcción

BUSGNT

Bus Grant Autorisation de bus Autorización de bus

BUSRQ

Bus Request Demande de bus Solicitud de bus

CA

Carrier Amplifier

CAB

Cabinet Armoire Armario

CAT

Category Kategorie Category Categoría

CCA

Circuit Card Assembly Baugruppe Assemblage de la carte de circuit

CCIT CCITT T

Comm Commit itée ée Con Consu sult ltat atif if Int Inter erna nati tion onal al Tél Télé éphon phoniq ique ue et et Tél Télé égrap graphi hiqu que e International Telegraph and Telephone Telephone Consultative Cons ultative Committee Co mmittee

CCP

Control Coupler Coupleur de commande Acoplador de control

Ed. 07.06

SOAC

AV−3

NAVAIDS 400 List of Abbreviations


CDI

Course Deviation Indicator Indicateur de déviation (cap) Indicador de desviaciòn de rumbo

CD−R CD−ROM OM

Comp Compac actt Disc Disc − Read Read On Only ly Mem Memory ory Disque compact −Mémoire à lecture Disco compacto − Memoria permanente

CE

Conformité Européen oder/or/ou Communautés Européennes

CEE

Inte Interrnat nationa ionall Com Comm mmisio ision n on on Rul Rule es fo for the the App Approva oval of of El Electric trica al Eq Equipm ipment

CLR; CL

Clearance signal Signal de Clearance Señal de Clearance

CMOS

Complementary Metaloxide Semiconductor Semi−conducteur oxyde métallique complémentaire Semiconductor complementario de óxido metálico

CONC

Phone Concentrator Telefon−Umschalteinrichtung Installation de commutation téléphonique Centralilla teléfonica

CPU

Central Processing Unit Zentrale Prozessoreinheit

CR

Carriage Return Retour du chariot Retorno de carro

CRC

Cyclic Redundancy Check

CRT

Cathode Ray Tube Tube cathodique Tubo catódico

CRS; CS

Course signal Kurssignal Signal de directif Señal de rumbo

CSB CSB (1)

Carrier signal with SideBands (HF) Signal de porteuse avec bandes latérales Señal de portadora con bandas laterales

CSB CSB (2)

Contr ontrol ol& &Stat tatus Boa Board (part of the LCSU CSU)

C SL

Control and Selector Logic Logique de commande et de sélection Lógica de control y de selección

CTOL

Conventional Ta Take−off and Landing Décollage et atterrissage classiques Despegue y aterrizaje convencionales

CTS

Clear to Send Prêt à émettre Listo para transmitir

AV−4

SOAC

Ed. 07.06

NAVAIDS 400 Conventional Navaids CW

Continuous Wave Fortlaufende Welle Ondes continues Ondas continuos

DAC

Digital/Analog Converter Convertisseur numérique/analogique Convertidor digital/analógico

DAS

DME−based Azimuth System Système d’azimut basé DME Sistema de acimut basado en DME

DC

Direct Current Courant continu Corriente continua

DCC

DC−Converter Convertisseur de courant continu (Convertisseur CC) Convertidor de corriente continua (convertidor CC)

DCC−MV

DC−Converter Mul Multivolt Convertisseur CC−Multivolt Convertidor CC−Multivolt

DCC−M DCC−MVD VD

DC−C DC−Conv onver erte terr Multiv Multivol oltt Dopp Dopple lerr Convertisseur CC−Multivolt Doppler Convertidor CC−Multivolt Doppler

DDM

Difference in Depth of Modulation Differenz der Modulationsgrade Différence de taux de modulation Diferencia de grados de modulación

DDS

Direct Digital Synthesis

DFS

Deutsche Flugsicherung Administration of air navigation n avigation services Bureau de la sécurité aérienne Instituto de protección de vuelo

DF T

Diskrete Fourier Transformation Discrete Fourier Transformation

DIF

Differenzsignal Difference signal Signal différentiel Señal diferencial

DIN

Deutsche Industrie Norm German industrial standard Norme industrielle allemande Norma industrial alemana

DIP

Dual−In−Line Package

DME

Distance Measuring Equipment Equipement de mesure de la distance Equipo de medición de la distancia

Ed. 07.06

SOAC


AV−5

NAVAIDS 400 List of Abbreviations DSB

DSP DSR

DTR

DU

DVOR

EC EC U

EEPR EEPROM OM

Double Sideband Bandes latérales doubles Banda lateral doble Digital Signal Processing Digitaler Signal Prozessor Data Set Ready Enregistrement des données prêt Registro de datos listo Data Terminal Ready Terminal de données prêt Terminal de datos dat os listo Distribution Unit Verteilereinheit Ensemble de distribution Unidad de distribución Dopp oppler Ve Very Hig High h Fr Frequency Om Omnid nidirection tiona al Ra Radio Range nge Radiophare omnidirectionnel VHF Doppler Radiofaro omnidireccional VHF Doppler European Community Executive Control Unit Ausführende Steuereinheit Ensemble de contrôl exécutif Unidad de control ejecución Elec Electr tric ical ally ly Era Erasa sabl ble e Prog Progra ramm mmab able le Rea Read d Only Only Mem Memor oryy Mémoire à lecture seule, programmable et erasable électrique Memoria permanente borrable eléctricamente y programada

EMC

Electromagnetic Compatibility Elektromagnetische Verträglichkeit

ENBT

Enable Bus Transfer Validation transfert de bus Conexión transferencia de bus

EPLD

Electrically Programmable Logic D ev evice Elektrisch programmierbare Schaltungseinheit Montage programmable électrique Circuito programado eléctricamente Eras Erasa able Progr ogrammable Read Only nly Mem Memory Mémoire à lecture seule, programmable et erasable Memoria permanente borrable y programada

EPROM


EUROC EUROCAE AE

Euro Europe pean an Orga Organiz nizati ation on for for Civ Civilil Avia Aviatio tion n Elec Electr troni onics cs Organisation européenne pour l’électronique de l’aviation civile Organización europea para la electrónica de la aviacion civil

FAA

Federal Aviation Administration Administration fédérale de l’aviation Administración federal de aviación

AV−6

SOAC

Ed. 07.06

NAVAIDS 400 Conventional Navaids FET FFM (FF) FIFO

FM

FPE FSK

GP, GS

HF

IC

ICAO

ILS

IM

INC

INT

Ed. 07.06


Feldeffekttransistor Field−effect transistor Farfield Monitor Moniteur de champ lointain (zone Fraunhofer) Monitor campo lejano First In/First Out Premier entré/premier sortie Primera entrada/primera salida Frequency Modulation Modulation de fréquence Modulación de frecuencia Functional Protection Earth Betriebsschutzerde Frequency−Shift Keying Frequenzumtastverfahren Manipulation par déplacement de fréquence Método de manipulación de frecuencia Glide Slope, Glide Path Gleitweg Radiophare d’alignement de descente Transmisor de trayectoria de descenso Hochfrequenz Radio frequency Haute fréquence Alta frecuencia Integrated Circuit Integrierter Schaltkreis Circuit intégré Circuito integrado International Civil Aviation Organization Organisation de l’aviation civile internationale (OACI) Organización de aviación civil international (OACI) Instrument Landing System Système d’atterrissage aux instruments Sistema de aterrizaje por instrumentos Inner Marker Radiobalise intérieure Radiobaliza interior Indication and Control Anzeige und Steuerung Indicateur et contrôle Panel de indicaciones y control Interface Unit Schnittstelleneinheit Unité d’interface Unidad de interfase SOAC

AV−7

NAVAIDS 400 List of Abbreviations INTFC

Interface Board for monitor Schnittstellenkarte für Monitor Platine d’interface du moniteur Placa enchufable de la interfase de monitor

I/O−Port

Input/Output−Port Ein−/Ausgabeport Porte d’entrée/sortie Puerto de entrada/salida

IS O

International Organization for Standardization Internationale Organisation für Normung Organisation Internationale de Normalisation

I/Q

In Phase/Quadraturphase In−phase/Quadratur−phase

KADP

Kabeladapter Cable adapter Adaptateur de cable Adaptador de cable

LCC

Local Communication Control

LCD

Liquid Crystal Display Ecran à cristaux liquides Indicador de cristal liquido

LCI

Local Control Interface Interface de commande locale

LCP

Local Control Panel Panneau de commande locale

LC SU

Local Control and Status Unit

LCU

Local Communication Unit

LED

Light Emitting Diode Diode électroluminiscente Diodo electroluminiscente

LF

Line Feed Avancement de ligne Avance de línea

LG−A

Localizer/Glide Path − Audio Generator LLZ/GP − Générateur Audio

LG−M

Localizer/Glide Path − Monitor Processor LLZ/GP − Processeur du Moniteur

LGM

Modembezeichnung (LOGEM) Modem assignation

LLZ/LOC

Localizer Radiophare d’alignement de piste Localizador

AV−8


SOAC

Ed. 07.06



LP

Leiterplatte Printed circuit board Plaquette à circuits imprimé Placa de circuito impreso LPF Low Pass Filter Filtre passe−bas Filtro de paso bajo LRCI Local/Remote Communication In Interface LRU Line Replaceable Unit LSB (1) Lower Sideband (HF DVOR) Bandes latérales inférieures Banda lateral inferior LSB (2) Least Significant Bit (digital) m Modulationsgrad Mod−Depth Taux de modulation Profundidad (grado) de modulación MC S Monitoring and Control System MEU Marker Extension Unit Unité de radiobalise d’extension Fuente de alimentación suplementaria de la radiobaliza MIA Monitor Interface Adapter Adapteur d’interface du moniteur Adaptador de la interfase de monitor MIB Monitor Interface Board Platine d’interface du moniteur Placa enchufable de la interfase de monitor MLS Microwave Landing System Système d’atterrissage aux micro−ondes Sistema de aterrizaje por microondas MM Middle Marker Radiobalise médiane Radiobaliza intermedia MOD Modulation Modulation Modulación MODPA Modulator/Power Amplifier Modulateur/Amplificadeur de puissance Modulador/AmplificadorAlimentación MOD−S MOD−SBB BB Modu Modula lator tor Side Sideba band nd Blen Blendi ding ng (DVOR (DVOR)) Modulateur de transition des bandes latérales Modulador de transición de banda lateral MON M o n i t or Moniteur Monitor Ed. 07.06

SOAC

AV−9

NAVAIDS 400 List of Abbreviations MOS

Metallic Oxide Semiconductor Semi−conducteur métal oxyde Semiconductor de óxido metálico

MPS

Minimum Performance Specification Spécification de rendement minimum Especificación de rendimiento mínimo

MPU

Marker Processing Unit Unité de marqueur de traitement Procesador de radiobaliza

MSB

Most Significant Bit

MSG

Modulation Signal Generator Générateur de signaux de modulation Generador de señal de modulación

MSP

Monitor Signal Processor Processeur de signaux de moniteur Procesador de señal de monitor

MSR

Monitor Service Routine Routine de service de moniteur Rutina de servicio de monitor

MTBF

Meantime between Failures Temps moyen entre défauts Tiempo medio entre fallos

MTTR

Meantime to Repair Temps moyen de réparation Tiempo medio de reparacion

MUX

Multiplexer Multiplexeur Multiplexor

MV

Multivolt

NAV

Navigation Navigation Navigation Navegación

NAVAIDS

Navigational Ai A i ds Navigationsanlagen Aide de navigation Radioayudas a la navegación

NC

Normally closed Normalement fermé Normalmente cerrado

NDB

Non−Directional radio Beacon Radiophare omnidirectional Radiofaro omnidireccional

AV−10


SOAC

Ed. 07.06

NAVAIDS 400 Conventional Navaids NF

Niederfrequenz Audio frequency Basse fréquence Baja frecuencia

NFK

Niederfrequenzknoten (S (Sternverteiler) Star distributor (for audio frequency)

NFM

Nearfield Monitor Moniteur de champ proche Monitor campo cercano

NM

Nautical Mile Mile nautique Milla náutica

NO

Normally open Normalement ouvert Normalmente abierto

OAB

Optocoupler Adapter Board Platine d’adaptateur d’optcoupleur Placa enchufable del adaptador optoacoplador

OACI

Org Organi anisati satio on de l’aviat iation ion civil vile inte nternation tiona ale (= ICA ICAO) International Civil Aviation Organization Organización de aviación civil international

OI O

Opto Coupler Isolated Input/Output

OM

Outer Marker Radiobalise extérieure Radiobaliza exterior

PC

Personal Computer

PCB

Printed Circuit Board Carte à circuit imprimé Tarjeta de circuito impreso i mpreso

PDME

Precision DME DME de précision DME de precición

PE

Protection Earth

PEP

Peak Envelope Power Spitzenleistung Puissance de pointe Potencia punta

PLL

Phase Locked Loop Boucle à verrouillage de phase Bucle de bloqueo de fase

PM

Phase Modulation Pasenmodulation Modulation de phase Modulación de fase

Ed. 07.06

SOAC


AV−11

NAVAIDS 400 List of Abbreviations


PMC

Phase Monitor and Control Moniteur de phase et commande Monitor de fase y control PMM Power Management Module POP Power on Parallel POSN. OSN./P /Pos os.. Posit ositio ion n Axe Posición PROM Programmable Read Only Memory Mémoire à lecture seule et programmable Memoria permanente programada PRUM Protector Unit Marker Radiobalise d’unité de protection Unidad de protección de la radiobaliza PRUT Protector Unit Tower Unité de protection Unidad de protección PS Power Supply Bloc d’alimentation Equipo de alimentación PSI Power Supply Interface Interface du bloc d’alimentation Interfase equipo de alimentación PS S Power Supply Switch PSW Interrupteur de puissance Interruptor de alimentación PSN Position Position Axe Posición PSTN Public Switched Telephone Network PTT Post Te Telephone and Telecommunications (Authority) PVC Polyvinylchlorid Polyvinyl chloride Chlorure de polyvinyl (C.P.V.) Chloruro de polivinilo PWR Password Routine Routimne de mot de passe Rutina de contrasena RAM Random Access Memory Mémoire à accés aléatoire Memoria de acceso aleatorio RC Remote Control Télécommande Control remoto

AV−12

SOAC

Ed. 07.06

NAVAIDS 400 Conventional Navaids RCMS

RC SE SE RC SR

RC SU R EU RF

RI A

RIAX

RISC RL

RMMC RO M

RS T

RTC

RTCR

RTS

RW Y

Ed. 07.06


Remote Co Control Mo Monitoring Sy System Système de télécommande et de surveillance Sistema de control y monitoreo remotos Remote Control and Status Equipment Remote Control Service Routine Routine de service de télécommande Rutina de servicio de control remoto Remote Control Status Unit Remote Electronic Unit Radio Frequency Haute fréquence (HF) Radiofrecuencia Remote Interface Adapter Adaptateur d’interface de télécommande Adaptador de interfase telemando Remote Interface Adapter extended Adaptateur d’interface de télécommande étendé Adaptador suplementario de interfase telemando Reduced Instruction Set Computing Rechner mit reduziertem Befehlssatz Radio link Richtfunkverbindung Liaison hetzienne Radioenlace dirigido Rem Remote Monit onitor orin ing g and Maint intenanc ance Conf Confiiguratio tion Read Only Memory Mémoire à lecture seule Memoria permanente Restart Remettre en marche Nueva puesta en marche Real Time Clock Echtzeituhr Rythme en temps réel Reloj en tiempo real Real Time Clock Routine Routine de rythme en temps réel Rutina de reloj en tiempo real Request to send Marche l’émetteur Activación del transmisor Runway Landebahn Piste d’aviation Pista de aterrizaje SOAC

AV−13

NAVAIDS 400 List of Abbreviations RX

RX C

RX D

RXRDY

Receiver Récepteur Receptor Receiver Clock Rythme du récepteur Reloj de receptor Receiver Data Données de récepteur Datos de receptor Receiver Ready Récepteur prêt Receptor listo

S

Switch Commutateur Conmutador

SB

Sideband Bandes latérales Banda lateral Sideband 1, Sideband 2 Bandes latérales 1, 2 Banda lateral 1, 2

SB1, SB2

SBA

Sideband A (used in VOR) Bandes latérales A (utilizé en VOR) Banda lateral A (utilizado para VOR)

SBB

Sideband B (used in VOR) Bandes latérales B (utilizé en VOR) Banda lateral B (utilizado para VOR)

SBO

Sideband Only Bandes latérales seulement Banda lateral solamente Subrack Sous−bâti Subrack (con junto)

SBR

SCC SDM

SMA SPDT

SP3T

AV−14


Serial Communication Controller Sum of Depths of Modulation Somme des taux de modulation Suma de grado de modulación Subminiature connector type A Miniatur HF−Steckverbinder für Mikrowellenanwendungen Single Pole Double Throw Commutateur unipolaire Conmutador unipolar doble Single Pole 3 Throw Commutateur unipolaire triple Conmutador unipolar triple SOAC

Ed. 07.06

NAVAIDS 400 Conventional Navaids STOL

Short Take−Off and Landing Système de décollage et d’atterissage court Despegue y aterrizaje corto

SUM

Summensignal Summation Signal Signal de la somme Señal de suma

SW

Software

SYN (1 (1)

Synchronisation Synchronisation Sincronización

SYN (2)

Synthesizer

TACAN

Tactical Air Navigation Navigation aérienne tactique Navigación aérea táctica

TCXO

Temperature Compensated Crystal Oscillator Temperatur kompensierter Quarzoszillator Oscillateur à quartz compensé par témperature Oscilador de cuarzo termo compensado

TEG

Test Generator Générateur de test Generador de test

THR

Threshold Schwellwert Valeur de seuil Nivel determinado

TNC

Threaded Navy Connector Koaxialverbinder mit Gewindekupplung

TNV

Telephone Network Voltage

TOR

Time Out Routine Routine de temps de suspension Rutina de tiempo de suspensión

TTL

Transistor−Transistor Logic Logique transistor−transistor Lógica transistor − transistor

TX

Transmitter Emetteur Transmisor

TXC

Transmitter Clock Rythme d’émetteur Reloj de transmisor

TXD

Transmitter Data Données d’émetteur Datos de transmisor

Ed. 07.06

SOAC


AV−15

NAVAIDS 400 List of Abbreviations TXRDY

Transmitter Ready Emetteur prêt Transmisor listo list o

USAR USART T

Univ Unive ersal rsal Syn Synch chrronou onous/ s/As Asyn ynch chro rono nous us Rece Receiv iver er/T /Trransm ansmit itte terr Récepteur/émetteur universel synchrone/asynchrone Receptor/transmisor universal síncrono/asíncrono

USB

Upper Sideband (HF DVOR) Bandes latérales supérieures Banda lateral superior

UV

Ultraviolet Ultraviolet Ultravioleta

VAM

Voice Amplifier Amplificateur vocal Amplificador vocal

VCO

Voltage Controlled Oscillator

VGA

Video Graphic Adapter

VHF

Very High Frequency Hyperfréquence Hiperfrecuencia

VOR

Very High Frequency Omnidirectional Radio Range Radiophare omnidirectionnel VHF Radiofaro omnidireccional VHF

VSWR

Voltage Standing Wave Ratio Taux d’ondulation Grado de ondulación

VTOL

Vertical Take−off and Landing Décollage et atterrissage verticaux Despegue y aterrizaje vertical

WI

W idth signal Breite−Signal Signal faisceau

WT

Wechselstrom−Telegrafie Voice−frequency Voice−frequency carrier telegraphy Télégraphie harmonique à ondes porteuses Telegrafía armónica

ZU

Zeichenumsetzer Modem for data transfer Convertisseur de signaux Convertidor de señal

AV−16


SOAC

Ed. 07.06

ILS 420

GP 422 General


CHAPTER 1 GENERAL INFORMATION 1.1

INTRODUCTION

See Fig. 1−1, 1−1, 1−5. 1−5. The ILS (Instrument Landing System) is a navigation aid used internationally to facilitate approach and landing. It is comprised of a localizer (LLZ or LOC), LOC), a glide path (GP or GS) and a series of marker beacons that includes an outer and middle marker and, in special cases, an inner marker. Each group generates radio signals independently independently and simultaneously. simultaneously. The localizer supplies supplies left−right navigation information, the glide path supplies up−down navigation information, and the marker beacons supplies distance−to−threshold information. The system includes equipment in the control tower that can be used to remotely control, con trol, monitor, and maintain the localizer, glide slope and markers. The localizer and the glide path principle of operation is based on measurements of the difference in depth of modulation (DDM) between two signals with frequencies 90 Hz and 150 Hz. These are the navigation navig ation frequencies used to detect the correct approach course (DDM = 0) and the specified glide path angle (DDM = 0). The localizer operates in the frequency range of 108 to 112 MHz and generates a vertical guidance plane, which permits the aircraft pilot to select a left/right approach course from a distance of up to about 30 km. The antenna radiation pattern reveals exactly the same amplitude for the two modulation frequencies of 90 and 150 Hz in the guidance plane. If the pilot deviates to the left of the guidance plane, the 90 Hz modulation signal will predominate causing the cockpit indicator to show a fly right indication. If the pilot deviates to the right, the 150 Hz modulation signal will predominate causing the cockpit indicator to show a fly left indication (Fig. 1−1). 1−1). The glide path operates in the th e frequency range between 328 and 336 MHz and generates the glide path plane, which is elevated above the runway by the glide angle. The antenna radiation pattern results from an interaction with the earth’s surface, and contains predominantly 150 Hz modulation below the glide path plane and predominantly 90 Hz modulation above the glide path plane. In the glide path plane itself the amplitudes of the two modulation signals are equal. The beam which shows the aircraft the correct landing approach path is formed by the intersection of the vertical course guidance plane and the horizontal glide path plane. In addition, the marker beacons provide marks that indicate the distance from the runway thresholds. The marker beacon transmitters mitter s radiate vertically upwards at the same carrier frequency, frequency, and are characterized by various continuously keyed Morse code signals and different modulation frequencies (see also Fig. 1−5). 1−5). LLZ

GP

z H 0 9

MM 150 Hz

90 Hz

Fig. 1−1 Ed. 01.04

z H 0 5 1

OM DDM = 0

Measurement of DDM SOAC

1−1

GP 422 General


The main features of the NAV 400 family in general and the ILS 420 in particular are as follows: High compatibility: The ILS 420’s electronics are compatible with all o f Thales ATM’s ATM’s many antenna types and configurations. They are also compatible with previous Thales ATM (SEL, Alcatel Air Navigation Systems, Face, Thomson−CSF, Thomson−CSF, and Wilcox) Wi lcox) antenna configurations. The flexibility facilitates cost−effective update by allowing to combine the ILS 420 electronic subsystem with existing arrays. High−power output: The robust output powers of the Glide Path (5 W) and the Localizer (25 W) provide excellent coverage for challenging sites and for many types of antenna arrays. High configuration flexibility: The ILS 420 has been designed to meet any site’s needs. Its many configurations can be combined to suit your requirements, from the simplest CAT. I application to the most complex CAT. III application. A summary of the main ILS configuration options are: S S S S S S S S S S

single or dual frequency single or dual transmitter/monitor equipment seven Localizer antenna subsystems four Glide Path antenna subsystems optional environmental sensor package DME compatibility (can replace markers) optional field monitors LLZ course and displacement sensitivity far−field monitoring (FFM) LLZ and GP near−field monitoring (NFM) 10 ft shelters with pre−installed LLZ or GP equipment available

Easy setup and maintenance: All of the ILS 420 system parameters parameters can be setup, adjusted, and monitored locally or remotely with the PC. User−friendly: The maintenance software (ADRACS or MCS) is very user−friendly and facilitates troubleshooting to the modular level. Secure: ADRACS resp. MCS uses passwords to control operator access by level and proficiency. Simple and quick equipment firmware updates: The ILS 420 firmware incorporates "Flash Memory" technology that eliminates the need to replace EPROM’s* during updates. Instead, updates are quickly and conveniently achieved in the field through software alone. (* Erasable Programmable Read−Only Memory)

Advanced equipment equipment supervision: supervision: The The advance advanced d remote remote monitoring monitoring and control control system system is a powerfu powerfull tool for centralizing technical expertise and support. Its versatility and scalability allow it to meet the spectrum of usage needs, from servicing one site or a nation wide matrix of navigational equipment. equipment. With it, support personnel can monitor many systems from one location and can respond to maintenance needs anywhere in the network much more quickly than in typical maintenance organizations. This strategy uses personnel and resources more efficiently and creates si gnificant long−term savings. The monitoring system supports simultaneous NFM/FFM (LLZ) configurations and integral inputs. Its far−field monitor system meets the latest ICAO requirements and includes an executive control option.

1−2

SOAC

Ed. 07.06 01.04

ILS 420

GP 422


1.2

ILS−PRINCIPLE

1.2.1

Arrangement of Subsystems

General

See Fig. 1−2. 1−2. The basic subsystems belonging to the ILS system, namely − the Locali Localizer zer (LLZ) (LLZ) − the Glide Glide Path Path (GP) (GP) − and the the Marke Markers rs (MM, (MM, OM) OM) and in addition − a DME DME (opt (option ional) al) − and a Far Far Field Monitor (FFM) for the localizer localizer (optional) (optional) are arranged on the runway, as shown in Fig. 1−2. 1−2. This arrangement is valid for the single and dual frequency (1F, (1F, 2F) installations i nstallations described in further fu rther detail below. below. The LLZ antenna is located 200 to 360 m beyond the end of the runway on the extended centre line. The associated LLZ transmitter is in a shelter near the antenna. The GP antenna is located 120 to 180 m from the runway centre line. The reference height for the glide path has been fixed at 15 m above the runway threshold. The dimension "D" (286 to 344 m) between the GP antenna mast and the runway threshold is calculated from this height and the glide angle, the latter being determined determined on the basis of local circumstances. The associated GP transmitter transmitter is in a shelter in near the antenna. The inner marker (IM) is 75 to 450 m ahead of the runway threshold on the extended centre line, the middle marker (MM) is 1050 m ahead, and the outer marker (OM) is 7200 m ahead. In most cases only the middle and the outer marker are used. When a DME systems is used to supplement the marker beacons there are a number of installation alternatives, for example: − DME antenna on the GP GP mast (DME transponde transponderr in the GP shelter), shelter), − DME antenna on the roof of the LLZ LLZ shelter shelter (DME transponder transponder in the LLZ LLZ shelter), shelter), − DME transponder transponder in a separate separate shelter shelter with the DME DME antenna on its roof, roof, − DME transponder transponder in a separate separate shelter shelter and DME antenna antenna on a separate separate mast. The latter two configurations are preferable, since they permit the runway to be approached from both directions. The shelter is located next to the runway at its midpoint. Running time differences between touchdown and the DME installation are always included, so that touchdown is always at exactly 0 m.

Ed. 01.04

SOAC

1−3

GP 422

ILS 420

General


Control and monitoring of all ILS subsystems from the tower

RCMS MODEM

6+2 2 OM

MM FFM

2

2

2+2 GP−antenna**

D

GP−shelter +DME (optional)

ca. 150 m

LLZ −shelter FFM*

Runway

q/2

1050 m 7200 m

Runway threshold

Touchdown

LLZ antenna

ca. 250 m

* For opposite direction (optional) ** +DME antenna (optional) = FFM−antenna (optional) q/2 = Half course width

IM is not shown

Fig. 1− 1−2

1−4

Arrangement of of IL ILS su subsystems SOAC

Ed. 01.04

ILS 420

GP 422 General


1.2.2

Navigation Signal Parameters

1.2.2.1

Localizer

See Fig. 1−3. 1−3. The LLZ generates an RF−signal in the frequency range of 108 to 112 MHz, which is modulated in amplitude amplit ude with 90 and 150 Hz. This signal identifies the "course "course plane" and is produced produced by a transmitter and antenna system, which can be a 2F system with 25 W transmitter power or a 1F system with 30 W transmitter transmitt er power. power. The localizer signal is obtainable up to a distance of up to 25 nautical miles (approx. 46 km) for a sector of ±10°, and it is obtainable up to a distance of  17 nautical miles (approx. 31 km) for a sector of ±35° relative to the course line and the LLZ−antenna. The characteristic values for LLZ within certain sectors, and in relation to the runway centre line, are as follows: − DDM = 0 − DDM = 15.5 15.5 % (0.155 (0.155)) − DDM



18 % (0.18)

DDM 0 exists when the approach direction corresponds exactly to the runway centre line. DDM 15.5 % characterizes the course sector selected such that the boundary at the level of the runway threshold is 107 m to the left and right of the runway with respect to the centre line. These points are also known as WIDTH points. The DDM has a linear characteristic within these points and an elevation of 0.145 % per meter. meter. This results in approx. 107 m for the half sector calculated for DDM=15.5 %. ICAO Annex10 (4th Ed., April 85, section 3.1.3.7.3, Note1) assumes a nominal sector width of 210 m (700 ft). DDM 18 % characterizes a sector of ±10°and DDM 15.5 % characterizes a sector of ±10° to ±35° where correct LLZ information is still ensured. In the LLZ−1F, LLZ−1F, this sector is covered by a specifispecifically formed antenna pattern, and, in the LLZ−2F system, it is covered by an additional clearance signal (see also section 1.2.4). 1.2.4). The course information consists of 90 and 150 Hz amplitude−moduamplitude−modulated signals. When the aircraft is approaching the runway on the desired course, the air−borne receiver receives the two modulation signals with equal amplitudes. This state corresponds to DDM 0. If there is a leftward deviation from the desired course, there will be a predominant 90 Hz amplitude, and if there is a rightward deviation there will be a predominant 150 Hz amplitude.

DDM >15,5 % Off Course Clearance

DDM = +15,5 %

DDM >18 %

a n n e t n a Z L L

d l o h s e r h T

±10°

m150Hz > m90 Hz

m 7 0 1

DDM = 0

±35° m 7 0 1

DDM >18 %

m90 Hz = m150Hz

DDM = −15,5 % m90 Hz > m150Hz

DDM >15,5 %

Fig. 1−3 Ed. 01.04

LLZ characteristic values SOAC

1−5

GP 422

ILS 420

General


1.2.2.2

Glide Path

See Fig. 1−4. 1−4. The GP generates an RF−Signal in the frequency range of 328 to 336 MHz that is modulated in amplitude with 90 and 150 Hz. The signal to identify the "glide path plane" is achieved by a transmitter and antenna system. The transmitter can be a 2F system or 1F system, but both produce up to 5 W of power. The glide path signal is obtainable up to a distance of 10 nautical miles (approx. 18.5 km) within an azimuthal sector of±8° relative to the localizer course line with the touch down point as reference and between the elevations 0.30 q to 1.75 q, where"q" is the nominal glide path angle. Below the glide path sector the DDM increases smoothly for decreasing angle angle until a value of 22 % is reached. From there to 0.45 to 0.3 q the DDM is not less than 22 % as it is required to safeguard the promulgated glide path intercept procedure (turning to the guide beam). The characteristic values for GP within certain sectors and in relation to the runway centre line are as follows: − DDM = 0 − DDM = 17.5 17.5 % (0.175 (0.175)) − q= 2.5 to 3° (typical) The plane DDM 0 radiated by the glide path antenna is hyperbolic and does not touch the ground, as the dotted line shows. According to ICAO Annex 10, section 3.1.1, the reference height of this curve has been fixed at 15 m (ILS reference datum) at the runway threshold. Taken together with the specified glide angle of q= 2.5 to 3° this produces an offset of the glide path antenna mast with respect to the runway threshold of the distance D. This offset is 286 to 344 m depending upon the glide path angle selected (see Fig. 1−2). 1−2). Due to this the optimal vertical glide path is not a straight line in azimuth direction of the centre line of the extended runway, it is a hyperbola.

DDM=17.5 % is specified for glide angle deviations of ±0.24 q from the nominal glide path q (q = DDM 0). These values correspond to the WIDTH. The DDM characteristic is linear within this sector (±0.24 q). Like the localizer the glide path’s angle information consists of signals amplitude−modulated with 90 Hz and 150 Hz. When the aircraft approaches the runway on the desired glide path, the airborne receiver receive r receives both signals with equal amplitude (equivalent to DDM 0). Deviations above the nominal glide path will result in a predominant 90 Hz amplitude, and deviations below will result in a predominant 150 Hz amplitude (positive DDM). DDM −17.5%

1.75 q

m90 Hz > m150Hz

GP−1F antenna DDM 0

A2

actual DDM=0 curve

m90 Hz = m 150Hz

DDM +17.5%

0.24 q

A1

m150Hz > m90 Hz

0.24 q

15 m q

0.3 q

D

Fig. 1− 1−4

1−6

Runway threshold

GP ch characteristic va values SOAC

Ed. 01.04

ILS 420

GP 422 General


1.2.2.3

Approach Path

See Fig. 1−5. 1−5. The nominal approach path to the runway is obtained from the intersection of the planes generated by LLZ and the GP. GP. Both planes contain the above−mentioned 90 Hz and 150 Hz modulation signals. These signals are interpreted by the airborne receiver and supplied to a cross−pointer instrument, which displays control information to the t he pilot corresponding to deviations from the nominal course and glide path. The signals interpreted by the airborne receiver can also be supplied to the auto−pilot. In addition, the pilot receives distance information via two (three) marker beacons. The 2 (under normal conditions) or 3 (in special cases) marker beacons are set out at a distance of − 75 m (inner marker in special special cases) − 1050 1050 m (midd (middle le marke marker) r) − 7200 7200 m (outer (outer marker marker)) from the runway threshold. Each of these marker beacons transmits a particular pulse code vertically upwards at a carrier frequency of 75 MHz. The identity frequencies are: − 3000 3000 Hz (inne (innerr marker marker)) − 1300 1300 Hz (middle (middle mark marker) er) − 400 Hz (outer (outer marker marker)) The aircraft flies through the transmission "cones" in the approach path, and the pilot receives an audible indication of the pulse code and the identity signal. The marker outputs are adjusted to ensure the following beam widths, measured along the Glide Path axis and Localizer axis: − Inner marker: 150 ±50 m − Middle marker: 300 ±100 m − Outer marker: 600 ±200 m A DME system (distance (distance measuring measuring equipmen equipment) t) is often installed installed instead instead of the marke markerr beacons. beacons. This system provides continuous distance readout between the aircraft and the runway touchdown point. The DME principle is based on delay time measurements of high−frequency pulses, whereby the airborne system transmits a series of pulses, which are answered by a transponder on the ground after a defined time delay. The time between transmission of the interrogation pulses and receipt of the answering pulses is interpreted by the airborne system, and the distance is displayed in directly readable form. Localizer

Glide Path 110 MHz z H 0 0 3 1

330 MHz

Localizer Course Plane

z H 0 0 4

Glide Path Plane z H 0 9

110 MHz

Runway threshold

150 Hz

Middle Marker Beacon

75 MHz

330 MHz

90 Hz approx. 1050 m (3500 ft)

Outer Marker Beacon

75 MHz

Extended RWY Centre Line

Approach Path

z H 0 5 1

approx. 7200 m (3.9 NM)

Fig. 1−5 Ed. 01.04

Overall diagram of ILS data SOAC

1−7

GP 422

ILS 420

General

1.2.3


Monitoring

According to ICAO, ICAO, Annex 10 all all navigation navigation systems systems must must be permanently permanently monitored monitored for correct correct radiation by an independently operating monitoring system. The NAV 400/ILS 420 has 2 monitors that monitor monit or signals for CAT. CAT. II/III operatio o perations. ns. For CAT. CAT. I operations, a single monitor is applied. In both cases equipment−internal sensors and antenna−internal sensors provide signal components, along with the optional nearfield monitor dipole. These signals are transferred to the two monitors. The monitor 1 signal processing is driven by monitor signal processor 1, and the monitor 2 signal processing is driven by monitor signal processor 2. This assures that the the various signals are selected according to a specified control sequence. The processor compares the actual values of the signals with nominal values. Any deviations that exceed specified specified tolerance thresholds always leads leads to an alarm and to an automatic switch over to the standby transmitter or to a shut down of the system. This action is executed by the Executive Control Unit (ECU) and arrived at through hardware performed evaluation and decision on. For monitoring the localizer course signal and displacement sensitivity (standalone FFM only), we can provide an optional standalone st andalone and an integrated farfield monitor (FFM) facility. facility. The integrated FFM facility measures the course line; it includes a specified monitor channel within the ILS 420 and an external antenna with VHF receiver that is connected through twisted pair of telephone lines to the localizer locali zer.. The FFM signal evaluation uses one or more antennas placed in the farfield. This FFM facility will, however, however, only initiate initi ate an alarm output and will not no t trigger a changeover to the standby transmitter. The standalone farfield monitor operates independently, and has no connections to the localizer transmitter rack. Refer to Technical Manual FFM 414, part number 83140 55421 for information about the standalone FFM.

1−8

SOAC

Ed. 01.04

ILS 420

GP 422


1.2.4

Equipment Versions

1.2.4.1

Summary

General

The topography of the terrain preceding the airfield, including any obstructions, strongly influences the quality of the navigation signals (especially the smooth course signal) interpreted by the airborne receiver during glide path descent. The ideal site has smooth terrain without obstructions. Since not every site is ideal, however, we have many configurations designed to eliminate the influences of terrain and obstructions. The electronic and antenna equipment versions selected for a site will be determined according the site’s unique terrain and obstruction profile. The available equipment versions are: − LOCALIZER LOCALIZER 1F (single frequency frequency version) version) This is for sites with most flat terrain and without reflective obstructions, obstructions, near or in front of the runway, that might compromise the course signal. − LOCALIZER LOCALIZER 2F 2F (dual (dual frequency frequency version) version) This is for sites that do not have flat terrain and have reflective obstructions like hills or buildings near or in front of the runway. Two antenna types can be applied in 2F systems. Which kind is used depends on the severity of the obstructions. The medium−aperture antenna is recommended for moderate obstructive situations, and the wide−aperture antenna is recommended for cases of severe obstruction. Also, if necessary, off course clearance distortion can be eliminated on center line with specific clearance and course modulation phasing (Out of Phase Clearance). The medium aperture antenna offers maximum operational reliability (up to Cat. III) with minimal calibration and maintenance. The wide−aperture wide−aperture antenna facilitates Cat. III use, including automatic landing. − GLIDE PATH PATH 1F, 1F, 0−TYPE, null reference method (single frequency version) version) Used when the terrain in front of the GP antenna is smooth and level. − GLIDE PATH PATH 1F, 1F, B−TYPE, sideband method (single frequency version) Advantageous for sites with wit h moderate sloping and short terrain in front of the antenna. an tenna. − GLIDE PATH PATH 2F, 2F, M−TYPE, capture effect method (dual frequency version) Advantageous for sites with wit h severe sloping and short terrain in front of the antenna. an tenna. The tables shown in Figs. 1−6 and 1−7 list all configurations available for an ILS 420 and the equipment options. Usually the ILS subsystems are dualized. In the hot standby mode, the main transmitter operates on antenna, and the standby transmitter is on a dummy load. Remote monitoring and/or remote control from the tower is possible for the LLZ, GP and the marker beacons (or DME) via a Remote Maintenance and Monitoring Configuration (RMMC). Besides its course information, The localizer’s RF signal includes an airport identity signal in Morse code. This code includes 3 or 4 characters with a frequency of 1020 Hz, and can be entered via a connected PC and the user program. It is also possible to use an auxiliary feature to externally modulate the LLZ RF signal with a voice signal (e.g. ATIS from tower). This feature provides a tone frequency range of 300 to 3000 Hz and a modulation depth of up to 40 % are provided.

Ed. 01.04

SOAC

1−9

GP 422


General 1.2.4.2

Equipment Versions and Options

Equipment Electronic cabinet

Model SESF DESF DESF SED SEDF DEDF DEDF DEDF DEDF

Description Single trans ansmitte tter/monitor tor Equipment, Single Frequency Dual Dual tran transm smit itte ter/ r/mo moni nito torr Equi Equipm pme ent, nt, Sing Single le Frequ reque ency ncy Sing Single le tran transm smit itte ter/ r/mo moni nito torr Equip quipme ment nt,, Dual ual Frequ reque ency ncy Dual Dual tran trans smitt mitte er/mo r/moni nito torr Equip quipme ment nt,, Dual Dual Frequ requen ency cy Dual Dual tran transm smit itte ter/ r/mo moni nito torr Equ Equip ipme ment nt,, D Dua uall Fre Frequ quen ency cy,, moni monito tore red d Hot Hot Standby

Antenna

LPD

Single Frequency Dual Frequency

8 element or 14 element 14 element or 20 element

Dipole/Refl.

Single Frequency Dual Frequency

14 element 13 element or 21 element

Optional equipment

Near−field monitor for localizer course position Integrated Far−Field Monitor course position (maximum 2 receivers, 1 antenna) Standalone Far−Field Monitor course position (maximum 3 antennas) and displacement sensitivity (maximum 1 antenna). Battery kit Environmental sensor package Voice Amplifier circuit card assembly

LPD= Logarithmic Periodic Dipole antenna system; Dipole/Refl.= Dipole/Reflector antenna system

Fig. 1−6

Localizer configurations

Equipment Electronic cabinet

Model SESF DESF DESF SED SEDF DEDF DEDF DEDF DEDF

Description Single trans ansmitte tter/monitor tor Equipment, Single Frequency Dual Dual tran transm smit itte ter/ r/mo moni nito torr Equi Equipm pme ent, nt, Sing Single le Frequ reque ency ncy Sing Single le tran transm smit itte ter/ r/mo moni nito torr Equip quipme ment nt,, Dual ual Frequ reque ency ncy Dual Dual tran trans smitt mitte er/mo r/moni nito torr Equip quipme ment nt,, Dual Dual Frequ requen ency cy* * Dual Dual tran transm smit itte ter/ r/mo moni nito torr Equ Equip ipme ment nt,, Dua Duall Frequ requen ency cy,, moni monito tore red d hot hot standby* * active and conventional feed of antenna

Antenna

SF

Null Reference (0−Type) (0−Type) or Side Band Reference (B−Type)

DF

Capture effect method (M−Type),

Optional equipment

Fig. 1−7

1−10

Near−field monitor glide path position Battery kit Environmental sensor package

Glide Path configurations SOAC

Ed. 01.10 01.04

ILS 420

GP 422 General


1.3

TECHNICAL DATA OF GLIDE PATH 1F/2F

The system sys tem complies with ICAO IC AO Annex 10, Volume 1, Part 1, 6th Ed.July 96 including includi ng all amendments. All categories are available in single frequency or two frequency versions. − CA C AT. I − CA CAT. II − CAT. III

single or dual transmitter/single or dual monitor single or dual transmitter/dual monitor dual transmitter/dual monitor

The device fulfills the EMC requirements of EC Guideline 89/336/EEC. It bears the CE Designation and is licensed according to REG TP SSB FL 005 Licensing Test Regulations (see section 1.3.9). 1.3.9).

1.3.1

Dimensions and Weight of the Transmitter Rack

Height W idth Depth Weight

1.3.2

1736 mm 611 mm 661 mm approx. 205 kg

Power Supply

AC voltage input (with BCPS) DC−vo DC−volt ltag age e outp output ut BCP BCPS S mod module uless (ACC) (ACC) DC voltage input (system) Emergency power supply Power consumption

1.3.3

115 VAC to 230 VAC, min. 98/max. 264 VAC 48 to 64 Hz, three wire, single phase nom. nom. 48 48 VDC, VDC, 14 14 A (ma (max. x.)) each each 43 to 62 V, e.g. from BCPS 48 V battery, standby parallel operation approx. 285 W (GP−2F 5/5 W, hot standby)

Environmental Conditions

Ambient temperature Operation indoor Operation outdoor equipment Transport

−10 to +55 °C −50 to +70 °C −30 to +70 °C

Relative hu humidity Non operation and transport

max. 95 % (−10 to +35 °C); max. 60 % (>35 °C) up to 100 % with condensation

Atmospheric pressure Operation Transport

up to 10,000 ft (approx. 30 3000 m) up to 50,000 ft (approx. 15000 m)

1.3.4

System Data

In predominantly flat terrain Glide Path coverage Glide angle q Course width Prec recisio ision n and and stab stabililit ityy of of gli glid de ang angle le sett settin ing g Ed. 01.10 01.04

SOAC

10 NM in the range of the front course line ±8° azimuth 2 to 4° (variable) ±0.24 q (variable) > ±0 ±0.04 .04 q; typically ±0.02 q

1−11

GP 422

ILS 420

General

1.3.5 1.3.5.1


Equipment Data CSB Transmitter

Carrier frequency range Channel pattern Carrier frequency tolerance Frequ requen ency cy spac spacin ing g cou cours rse/ e/cl clea eara ranc nce e (2F (2F)) Course/clearance (2F) phase lock Cour ourse tran transsmitt itter power Course transmitter power C SB1 C SB2* Clearance transmitter power Output power stability

1.3.5.2 1.3.5.2.1

(1F) (2F) (2F) (2F)

CSB Modulation GS−1F

Navigation frequencies SDM SDM for course SDM setting range SDM stability DDM DDM DDM se setting ra range fo for te test pu purposes DDM stability Carrier modulation Distortion factor Phase stability

1.3.5.2.2 1.3.5.2.2

328.6 to 335.4 MHz 150 kHz, defined by synthesizer ±0.0005 % 8 kHz kHz ±0. ±0.5 5 %, cour course se and and cle clear aran ance ce carr carrie iers rs ±4 kHz to the nominal frequency f0 < 0.5° 0 to 5 W; set in 0.1 W ste steps 0 to 5 W; set in 0.1 W steps 0 to 1.5 W; set in 0.1 W steps 0 to 5 W; set in 0.1 W steps <3%

90 and 150 Hz ±0.01 %, coherent 80 % 0 to 99 % in steps of 0.1 %  ±0.5 % 0% 0 to to SD SDM se setting in in st steps of of 0. 0.1 %  ±0.15 % Control loop for envelope curve and RF phase < 1 % for all modulation signals < ±5 % with respect to the reference phase of the synthesizer

GS−2F (active)*

Navigation frequencies SDM SDM for course SDM for clearance SDM SDM sett settin ing g rang range e SDM stability DDM DDM (CSB1) DDM (CSB2)* DDM (Clearance) DDM se setting range for test pu purposes DDM stability

90 and 150 Hz ±0.01 %, coherent 80 % 80 % 0 to 99.5 99.5 % in step stepss of 0.1 0.1 %  ±0.5 % 12 % 48 % 30 % (or 150 Hz only with DDM=60%, SDM=60 %) 0 to to SD SDM se setting in in st steps of of 0. 0.1 %  ±0.15 %

* °active° means a direct feeding method of RFOut to antenna A2 via a separate path of the Modulator/Amplifier

Carrier modulation Distortion factor Phase stability

1−12

Control loop for envelope curve and RF phase < 1 % for all modulation signals < ±5 % with respect to the reference phase of the synthesizer SOAC

Ed. 01.10 01.04

ILS 420

GP 422 General

Equipment Description Phase modulation (CAT III) 90 Hz peak 150 Hz peak deviation difference

1.3.5.2.3

GS−2F (standard) (standar d)

Navigation frequencies SDM SDM for course SDM for clearance SDM setting range SDM stability DDM DDM se setting ra range fo for te test pu purposes DDM stability Carrier modulation Distortion factor Phase stability

1.3.5.3

90 and 150 Hz ±0.01 %, coherent 80 % 80 % 0 ... 99.5 % in steps of 0.1 %  ±0.5 % 0% 0 to to SD SDM se setting in in st steps of of 0. 0.1 %  ±0.15 % Control loop for envelope curve and RF phase < 1 % for all modulation signals < ±5 % with respect to the reference phase of the synthesizer

SBO Transmitter

Input signal Output signal Output power Output power instability RF phase setting range RF phase stability Carrier suppression

1.3.5.4

90 Hz / 1.0 radian  90 Hz / 0.6 radian  30 Hz 

Non−modulated carrier from the synthesizer SBO signal 90 Hz and 150 Hz above and below the carrier frequency 0 to 1.5 W, set in steps of 0.1 % Automatically regulated to < 5 % 0° to 359°, set in steps of 1° < 3° > 30 dB

Monitoring

Number of monitor systems Dualization Executive monitor channels Field monitor channels Frequency measurement Standby monitor channels

1 or 2 Hardware and software CRS Position, CRS W idth, CLR (2F), Nearfield course position dipole (NFM, optional) Difference frequency and channel frequency CRS Position, CRS W idth, CLR (2F), stdby transmitter Parameter Parameterss evaluated evaluated by each each monitor channel DDM, SDM, SDM, RF level Channel evaluation Fast Fourier analysis Alarm threshold* settings DDM, SDM in steps of 0.1 %; (* thresholds programmable, programmable, depending on Category) RF level in steps of 1 % Pre−alarm nominal 75 % of alarm threshold, limits progr. Integrity channel evaluation every 1.5 s Alarm check 4 to 6 times/second, depending on configuration Decision procedure Continuous status exchange of both monitor sys− tems and logically sequenced hardware decision procedure performed by the Executive Control Unit (ECU), three redundant decision paths Ed. 01.10 01.04

SOAC

1−13

GP 422

ILS 420

General


Radiation of a false signal

< 1 s for dual transmitter

Switch over delay * Executive monitor channels Standby monitor channels Nearfield monitor channels

Set between 0.5 and 30 s typ. 0.5 s typ. 5 s typ. 20 s

* setting setting depends on CAT of operation

Switch over and shutdown

1.3.5.5

Built In In Te Test (B (BIT) Me Measuring Fu Functions

Analog measurements

Fault location

1.3.6

within 1 s

Analog test signals sampled periodically, periodically, then digitized. Measurement of battery voltage. Built in measurement of signal characteristics evaluated by DFT filtering. Evaluation of measurement of RF power characteristics (e.g. output power, VSWR). Presentation of data is achieved using the PC User Program menus. Performed via connected data terminal (PC) and User Program software down to line replaceable unit (LRU−level), including BCPS modules.

Interfaces

− PC connector*/**

Serial, SubD, 9 pin, male on top of cabinet

− MODEM connectors*/*** LGM1 (opt.) LGM2/DME (opt.)

2−wire, via SubD, 9 pin, male, on top of cabinet 2−wire switched or dedicated line 2−wire switched or dedicated line or configured as RS232 interface used as additional serial interface (RS232)

LGM3/NDB (opt.) − DME−Inte DME−Interfa rface ce

(not used used in GP)

− LCP (s (spare in/ in/o out) ut) OI OIO IN IN/OI /OIO OU OU T input optocoupler output op optocoupler*/**

SubD ubD, 25 25 pin ea each, male/female, on to top of cabinet log 0= max. 1 mA / log 1= max. 10 mA max. 35 V/150 mA

− Inpu Inputt env envir iron onme ment ntal al sens sensor orss (op (opt. t.)* )*/* /*** ** (smoke, intrusion, temperature)

Anal Analog og sign signal al max. max. ±13. ±13.5 5 V; V; con conne nect cted ed to connector SubD, 37 pin, female on top of cabinet

* according IEC60950

1.3.7

** SELV−circuit SELV−circuit (Safety Extra Low Voltage)

*** TNV−circuit ( Telephone Network Voltage)

Antenna System

Technical characteristics of the antenna system will be found in Part 3, Antenna System Description.

1−14

SOAC

Ed. 01.10 01.04

ILS 420

GP 422 General


1.3.8

Notes on "Standby" operational Mode

The NAVAIDS Technical Manuals distinguish between the hot standby and cold standby operating states as follows: " Hot Standby

Both transmitters are in operation − i.e. one transmitter is connected by means of a command to the antenna (aerial), the second is connected to a dummy load (standby). In NORMAL operation mode, the Monitor Bypass is off. If the radiating transmitter fails, the system automatically switches the antenna to the standby transmitter. The switch over time is  20 ms. ILS installations are generally operated in the hot standby mode. " Cold Standby

One transmitter (TX1 or TX2) is in operation (i.e. connected to antenna or to dummy load), the second is switched off by means of a command. If the radiating transmitter fails, the monitor and controller ensure connection and initialisation of the standby transmitter and antenna switch−over. This process takes about 6 seconds.

1.3.9

Conformity and Licensing Approval

The ILS 420, Glide Path device (GP 422) of the Navaids 400 system family complies with the requirements of EC Guideline 89/336/EEC in its implementation. It also fulfills the requirements of the following EMC Guidelines: − − − −

EN 55022 EN 50082−1 ETS 300 339 EN60950 (IEC950)

Ed. 1998 Ed. 1997 Ed. 1998

Interference Transmittal, Class B Interference Resistance EMC for Radio Transmission Devices Device Safety

Furthermore, the device fulfills the requirements of the t he REG TP SSB FL 005 Licensing Test Test Regulations for the radio transmission interface.

Ed. 01.10 01.04

SOAC

1−15

GP 422 General

1−16


SOAC

Ed. 01.04

ILS 420

GP 422 General


1.4 1.4.1

SAFETY PRECAUTIONS Operating at the Device

To avoid injury in jury to persons or subsequent damage to subassemblies, always disconnect the supply voltage before removing a subassembly or a plug−in connection. Disconnect the supply voltage by actuating switch TX1 or TX2 or even mains switch on the AC/DC subassembly. For exceptions see Part 2, Operation and Maintenance, Chapter 6.

WARNING Mains subunit ACC (BCPS): The device should be disconnected from the mains before commencing maintenance or installation operations. The heat sinks of the t he modulators (MODPA) may warm up during operation. This is normal and does not have any affect on the functioning of the devices. Avoid touching the heat− sinks sink s when the cabinet door has been opened for any reason. When replacing this subassemblies it is recommended to let them cool down for a while or take suitable measures (e.g. gloves). The inner borders of the cabinet doors may have a residual flash which may injure hands or fingers. Use the handle to open or close the front or rear door.

1.4.2

Handling Subassemblies

To prevent damage to the components during replacement, take special precautionary measures when removing, transporting, and installing subassemblies and plug−in cards containing electrostatically sensitive components. PCB’s containing electrostatically sensitive components are marked with this symbol: Electrostatic damage may be caused when the person performing the subassembly replacement bears a static charge due to friction with an insulated floor covering or with synthetic articles of clothing (eg. soles) and the charge is transferred to the terminals of the MOS components. In order to avoid this, make positive cont contact act between the system ground and your hand before and during removal or insertion of the th e subassembly. subassembly. Any body charge is then discharged to the th e system ground. When the subassembly has been removed, the short−circuit bar provided should be connected to the connector strip, and the subassembly should be placed in a special container or envelope. Use the following procedure and sequence to insert a subassembly: − Discharge Discharge the body body by touching the the system ground ground with both both hands. − Remove the subassemb subassembly ly from the special special container container. − Remove the short−cir short−circuit cuit bar from the subassemb subassembly ly.. − Touch the device device ground. ground. − Insert the subassembly subassembly,, if possible whilst retaining retaining contact contact with the device ground. Further instructions on this type of safety measure can be found in the Technical Manual, Part 2. Ed. 01.04

SOAC

1−17

GP 422

ILS 420

General

1.4.3


Handling Lead Batteries WARNING Before starting up a battery, i.e. before filling an empty battery with acid, always refer to the relevant instructions in Part 2.

Wear protective goggles for fo r all maintenance operations that involve opening the acid screw screw caps. The acid is highly caustic, so remove any spattered acid immediately from the clothing by washing with water or any soda solution (100 g soda to 1 l water) on account of its highly caustic effect. Howecer, Howecer, make sure to avoid allowing soda or soda solution to get into the cells. When the emergency battery is charged up during mains operation oxyhydrogen gas can result from the decomposition of the water. For this reason do not seal the ventilation holes on the outside of the battery box.

1.4.4

Components with Beryllium Oxide Ceramic

Some of the subassemblies are equipped with transistors containing beryllium oxide. These are state of the art transistors and are in use all over the world. They are absolutely harmless in a sealed, compact condition. If they are opened, however, beryllium oxide dust, which is detrimental to health, may escape. They should not be dismantled or shattered even when scrapped or disposed of. The following subassemblies contain power transistors with beryllium oxide: − MODP ODPA

: Tr Transis nsisttor typ types MR MRFC16 C166

1.4.5

Using Lithium Batteries

Always read the label on the battery battery.. Thales ATM ATM recommends recommends only only those with lithium lithium copper copper oxide. Other types of lithium battery, e.g. e.g. those with lithium sulphur dioxide, are not approved by Thales ATM for use in navigation n avigation systems (see also the instructions in Part Part 2, Operation and an d Maintenance, Chapter 6).

WARNING Do not recharge, disassemble, heat above 100 °C or incinerate any lithium cell. Do not short−circuit the cell or solder directly on it. Disregard of the norms regarding the use of lithium batteries may cause the risk of fire, explosion and the leakage of toxic liquid and gas. Run−down batteries are objects that can pollute the environment and must be disposed of taking the proper precautions.

1.4.6

Miscellaneous

To avoid risks of lightning, do not work outside the shelter or on the antenna system during thunderstorms.

1.4.7

Observation of Safety Regulations

In addition to following the above instructions for avoiding damage and injury, always observe locally pertinent safety regulations.

1−18

SOAC

Ed. 01.04

ILS 420

GP 422


1.5

FUNCTIONAL OVERVIEW

1.5.1

General

Functional Description

The localizer and glide path subsystems of the ILS 420 are composed of four separate configuration items: − − − −

Electr Electronic onicss subsyst subsystem em Anten Antenna na subsys subsyste tem m Battery Battery kit (opt (optiona ional) l) Environmental Environmental sensors (optional) (optional)

The electronic subsystem consists of hardware based on RF and AF subassemblies and of software which controls the hardware to a large extent. It is subdivided into the following units: − − − − −

Transmitter ransmitter in dual dual or single single version version Monitor in dual dual or single version Equipment Equipment control and switching switching Local/Remote Local/Remote Communication Communication Interface Interface (LRCI) Battery Battery charger charger and power supply supply (BCPS)

The glide path electronics subsystem is nearly identical to the localizer electronics subsystem. Only the modulator/power amplifier (MODPA) assemblies are different, and their differences are due to the corresponding difference in RF operating frequencies and RF signals. Each transmitter path and monitor path is controlled by its own individual microprocessor. The monitor and audio generator are hardware identical units; their differences arise from their installed operating firmwares. Both communicate via the LRCI. The transmitter processor performs the following tasks: − − − −

Digital Digital signa signall generat generation ion Control/adjustm Control/adjustment ent of amplitude (envelop (envelope), e), RF phase and phase polarity polarity Calculation Calculation of the settings settings for the transmitter transmitter subassem subassemblies blies Commu Communic nicati ation on

The monitor processor performs the following tasks: − Processing Processing and evaluation evaluation of the signals of internal, integral integral sensors and nearfield nearfield dipoles dipoles − Initiation of appropriate appropriate actions actions in case of fault detection detection (station changeover changeover or shutdown) shutdown) − Ensuring of its own performance performance independe independent nt of environmental environmental conditions and component component aging The equipment control and switching assembly which may be considered as part of the overall monitoring function performs the following tasks: − HW decision and execution execution of appropriate appropriate actions actions in case of fault detection detection (station changeove changeoverr or shutdown) derived from monitor messages. The software packages (i.e. transmitter tra nsmitter SW, monitor SW, SW, LRCI SW and PC User Program SW) looks after and supports the most important tasks as follows: − − − − − −

Startup (alignme (alignment nt and calibration calibration of the antenna system system and the navigation navigation system) Modulation Modulation and and transmitt transmitter er control Signal Signal genera generation tion Monitor Monitoring ing the navigat navigation ion signal signal Support Support in system system repair repair and and maintenance maintenance Operation Operation of the system system (local/ (local/remote remote))

Ed. 07.06 01.04

SOAC

1−19

GP 422

ILS 420

Functional Functional Description

1.5.2


Brief Description

See Fig. 1−8. 1−8. Fig. 1−8 shows the basic structure of a ILS 420 GP system. Transmitter and monitor are dualized, whereby each monitor monitors both transmitters. The remaining subassemblies in the signal path of the transmitter are single. These are mostly components which cannot be practically dualized, such as the transfer assembly, the antennas and cables and the main passive components which are inherently reliable.

1.5.2.1

Transmitter

The transmitters utilize digital control for initial alignment/setup purposes, but once in normal operation they are not dependent on microprocessors or software−controlled servo−loops to maintain accuracy. Only three circuit card assemblies are required to provide the transmitter function: − The audio generator (LG−A) (LG−A) is responsible responsible for producing the composite carrier−plus−side carrier−plus−sideband band 1 (CSB1) and sideband−only (SBO) modulation envelopes for the course MODPA and, if a dual frequency and "active" GP system, the modulation envelope for the second MODPA which is used in one path for the composite carrier−plus−sideband carrier−plus−sideband 2 (CSB2) modulation envelope. The audio generator utilizes digital generation of the composite audio tone, essentially eliminating the audio signal signa l as a source of error. The complete dynamic range of a 13−bit digital−to−analog (D/A) converter is used to form the waveform with a further 8 bit multiplying D/A converter controlling the output level. The configuration data is maintained within an electrically erasable programmable read−only memory (EEPROM). The audio generator also has some measurement capabilities that are used to gather system data useful for maintenance and faultfinding. − The frequency synthesizer (SYN) generates the RF carrier for the course MODPA MODPA assembly and, if a dual frequency system, also generates RF for the clearance MODPA. The frequency synthesizer is based on a very stable temperature−compensated crystal oscillator (TXCO) combined with direct digital synthesis (DDS) to provide very accurate low noise continuous wave (CW) signal. The same synthesizer board is used in the localizer and glide path. The frequency is set by BCD jumpers on the printed circuit board (PCB) which which prevents prevents the the frequency frequency from being being inadverte inadvertently ntly changed from the local or remote keyboard. − The modulator/power amplifier (MODPA) provides two amplitude modulated signals, the CSB and the SBO. One MODPA unit is required for single frequency operation and, for two−frequency operation, a 2nd MODPA unit is required which generates the clearance signal. In addition for the "active" GP the remaining RF path of this modulator is fed by the SBO path of the other MODPA unit. The MODPA are broadband units with no field adjustments required either for frequency changes or unit replacement. replacement. The power amplifiers are conservatively designed, capable of operating at CW levels in excess of the required peak envelope power. The design and layout of LLZ and GP MODPA units are identical. Only components that are frequency specific are different. In addition the GP MODPA contains jumpers to adapt its function fun ction to the GP active acti ve or specific requirements. Feedback control loops are employed to control amplitude and phase while minimizing distortion. Feedback control loops also allow a full 360° setting of the SBO phase relative to the CSB.

1.5.2.2

Monitor

The monitor can be either a single or dual redundant monitor system. In the dual redundant mode the monitors can be configured in "OR" mode for high integrity or "AND" mode for high continuity. A single monitor system system consists consists of the the monitor board (LG−M) and monitor monitor interface interface board board (INTFC). (INTFC). A dual monitor monitor system system adds a second monitor monitor board. board. The input input paths from from the integral integral (on−air) (on−air) and internal (stdby) sensors are processed in the Stdby and On−Air Combiner unit (SOAC) and fed with other monitoring inputs to the monitor interface. The monitor interface board actually contains two identical circuit groups with wit h each group dedicated to a monitor. monitor.

1−20

SOAC

Ed. 01.04

ILS 420

GP 422



Both the monitor and monitor interface boards are identical for both the localizer and glide path path equipment. The monitor is identical to the audio generator used in the transmitter except with different firmware. The monitor board is essentially a high−precision audio−frequency spectrum analyzer, utilizing a combination of dedicated hardware and an electrically programmable logic device (EPLD) in con junction with an Intel 80C196 high−performance high−performance micro−controller micro−controller. Each monitor has an on−board sampling analog−to−digital converter subsystem (ADCS). The ADCS is continuously checked and calibrated against on−board precision external references, which are cross−verified against the analog−to−digital (A/D’s) internal precision reference, resulting in the elimination of factory or field hardware adjustment of monitor and detector paths. The monitor cycles through each input signal in turn, utilizing Discrete Fourier Transforms (DFT). It computes the spectral component of each, and from these components calculates the desired parameter (difference in depth of modulation [DDM], sum of depth of modulation [SDM], etc.). These parameters are compared to operator programmed threshold values. If any parameter is beyond the tolerances, this results in the appropriate monitor field signaling an alarm. Separate alarm timers exist for Executive, Field, and Standby parameter groups.

1.5.2.3

Equipment Control and Switching

The control and switching section consists of the following modules: Executive control unit (ECU) and transfer switch assembly. The ECU is responsible for performing all the control actions of the station such as which equipment is routed to the antenna, which to the load, and the on/off status of each. The ECU turns off the transmitting equipment, whether from an alarm off condition or a user off selection, using two redundant circuit paths. One goes to the audio generator to terminate the modulation signal; the other goes to the frequency synthesizer to turn off the carrier. Alarm action depends on whether the ECU is configured configured for series series (alarm−AND (alarm−AND,, higher continuity of service) servic e) or parallel (alarm−OR, higher station integrity). Alarm−AND requires that both monitors indicate the same alarm before control action is initiated, while alarm−OR initiates control action based on only one monitor’s status. An alarm status results in either a transfer to standby equipment (dual− equipment) or cessation of transmission (single equipment or hot standby in alarm) by the ECU. The ECU employs multiple redundancies for the critical path circuits to achieve the highest level of safety while maintaining high reliability by minimizing the individual parts count. The ECU is a state− machine built primarily from three EPLDs. Two of the three EPLDs provide dual semi−redundancy for the critical station control functions, although each has some unique inputs and outputs. A Watchdog circuit monitors these semi−redundant EPLDs to ensure they remain synchronized. The third EPLD, which is also of a different part type, implements a more basic and simplistic fail−safe circuit using a few external devices. Its function is to echo the other two and cause a complete station shutdown should they fail to take the appropriate action when needed. A poll−response poll−response alarm status protocol assures fail−safe communications communications between between the monitor and ECU. The ECU continuously requests a health status for one of three monitor normal signals (Executive, Field, or Standby) from each monitor CCA and expects a certain response within a certain time. Should Shoul d a monitor signal fail to respond within a specific timing window or respond with more than one edge during that window, the ECU will declare the particular parameter bad and take the appropriate alarm action. Ed. 01.04

SOAC

1−21

GP 422

ILS 420



The monitor system integrity of operation is verified by the ECU by periodically applying one of two analog test signals from the on−antenna audio generator to each monitor. These are set to simulate two different valid operating points. The monitor must be able to discern discern between the two, and provide provide a toggling health indication on one of two ECU inputs corresponding to the particular signal type. The monitor must respond correctly within a fixed time period or it will be switched out of executive alarm actions, with the ECU relying solely on the alternate monitor. The transfer switch assembly is built up with PIN−Diode switches. It is used for dual transmitter configurations. The job of the transfer switch is to route the selected main transmitter to the antenna with the standby transmitter being connected to dummy loads. The localizer and glide path assemblies are identical designs differing only in frequency dependant components.

1.5.2 .5.2.4 .4

Loca Local/ l/Re Remo mote te Comm Commu unicat icatio ion n Inte Interf rfac acee (LRCI LRCI))

The LRCI makes available the following interfaces: − Communications Communications of the the individual individual functional functional groups groups − Control Controlss for the the equipm equipment ent − Local display display and local local control control of the equipment equipment for the operator operator − Remote Remote contr control ol functio functions ns All relevant relevant data or parameters parameters can be be set locally or remotely via an intelligent terminal terminal (PC/Laptop). (PC/Laptop). A change−over change−over or shut down is is also possible. possible. For For integrity integrity reasons reasons data entry entry (input/change) (input/change) is is only possible in the maintenance mode (monitors bypassed). Access to the system is barred by a password procedure with different security levels. The software to be used is referred to as ’PC User Program’ (MCS or ADRACS).

1.5.2.5

Power Supply

The battery−charging power supply (BCPS) supplies the entire system with the DC supply voltage (nom. 48 VDC). The BCPS can be connected to a mains input voltage in the range from nominal 115 VAC to 230 VAC. The construction of the BCPS is modular, with a building−block concept allowing two 14 A (max.) modules. The power supply has sufficient capacity allowing collocated DME to share the power supply and batteries. The batteries are connected in parallel with the AC/DC converter outputs providing the functionality function ality of an uninterruptible power supply. The BCPS applies the correct voltage required to keep the batteries fully charged. Each transmitter owns dedicated quad output out put DC/DC converters (+5V,+15V (+5V,+15V,−15 ,−15 V,+24V). V,+24V). Common C ommon modules (i.e. ECU) are fed with combined power from both converters. In addition the power supply subrack contains a low voltage sensing circuit (LVS) and an electronic relais which inhibits deep discharge of a connected battery set. It also contains a single DC−Converter (+5 V) which supplies the LCP subassembly to provide operability.

1.5.3

Peripheral subassemblies

The DC power supply is switched on and off with separate DC switches for each transmitter.

1.5.4

General block diagram

Figs. 1−19, 1−19, 1−20 and 1−21 provide an overview of the subassemblies and signal flow of the ILS GP−1F and GP−2F system.

1−22

SOAC

Ed. 07.08 01.04

ILS 420

GP 422 Functional Description

Equipment Description A3

ANTENNAS

FIELD DIPOLE (opt.) A2

NFM

A1 * 3 A O B S

* 2 A 2 B S C

* 1 A 1 B S C

Power Adder*

PIN−diode Transfer Assembly 1 B S C S R C

* 2 O B B S S C S S R R C C

TRANSMITTER 1 R L C

RF Stdby

RF Stdby

RF on−air

NF

Stby and On−Air Combiner 1 B S C S R C

* 2 O B B S S C S S R R C C

analog inputs

detected field and stby signals in

TRANSMITTER 2

Monitor Interface

R L C

RF Signal Generation and Amplification

RF Signal Generation and Amplification

Modulation Signal Generator

Modulation Signal Generator

to TX1

Executive Control Unit

to TX2

MONITOR 1

MONITOR 2

Monitor Signal Processor

Monitor Signal Processor

Local Remote Communication Interface

DC/DC converter

DC/DC converter

DC/DC converter

Local Display

I

* GP−2F standard: A1: CSB+SBO+Clear. A2: CSB+SBO A3: SBO+Clear

Main DC switch I

CSB2 A2 not used, A2 fed by Power adder

BCPS AC/DC converter Mains 230 VAC

Fig. Fig. 1−8 1−8 Ed. 01.04

Transmitter Transmitter Cabinet Battery fuse switch I

Emergency Battery (Pb) 48 V (53.5 V)

PT T line RC

Local PC

Basi Basic c str struc uctu ture re of an ILS ILS GP GP; exa examp mple le GP−2 GP−2F F act activ ive, e, dual dual SOAC

1−23

GP 422 Functional Functional Description

1−24


SOAC

Ed. 01.04

ILS 420



1.6

FUNCTIONAL DESCRIPTION OF THE TRANSMITTER

This functional description of the transmitter provides a introduction to the signal generation and conditioning. It will be of use in understanding the subsequent chapters, since certain relationships are discussed in advance.

1.6.1

O ve r vi e w

The ILS 420 transmitter generates and radiates radio frequency (RF) signals to provide final approach glide path navigation information to landing aircraft. The aircraft interprets the signals and displays them on the cockpit indicator indicator,, guiding the pilot until the runway is in sight. The deflection of the cockpit indicator needle is directly proportional to the aircraft’s angular displacement from the centerline, within a 0.155 (LLZ) or 0.175 (GP) difference in depth of modulation (DDM) limit (150 m A). ConseCons equently, quently, the needle’s position reflects very accurately the aircraft’s distance from the t he glide path and the pilots subsequent adjustments. Thales ATM’s ILS transmitters use its patented sideband−only (SBO) generation process to digitally generate signals and high gain feedback loops that assure accurate and stable output signals. The 90− and 150−Hz navigation tones are precise, as are the high gain RF envelopes that follow these tones. The transmitters meet all of the signal generation, control, accuracy, accuracy, fidelity, and stability requirements of ICAO IC AO Annex 10. LEFT BESIDE ON RIGHT BESIDE Approach path (LLZ)

15.5 % (90)

0.0 % A u 0 5 1

ON BELOW ABOVE Approach path (GP)

15. 5 % (150)

A u 0 5 1

17.5 % (90) 150 uA 150 uA

Cockpit Indication

Fig. 1−9

Cockpit Indication

0.0 %

17.5 % (150)

Cockpit indication

The Transmitter Transmitter requires only 3 circuit cards to develop a complete ILS signal: − Audio Audio gene genera rator tor − Modulator/Po Modulator/Power wer Amplifie Amplifierr (2 in a dual system) − Synt Synthe hesi size zerr

1.6.2

Audio Generator

The Audio Generator and the t he monitor processor use the same s ame hardware but different firmware.The audio generator generates all of the navigation and identification information used to modulate the ILS RF carrier, carrier, and it provides the means to control the radiated signal. The audio generator digitally creates the system’s navigation signals, which essentially eliminates it as a source of error. error. The audio generator provides four channels of digital synthesized synth esized navigation information, one each for course carrier−plus−sideband carrier−plus−sideband (CSB), course sideband only (SBO), clearance CSB (Clear. (Clear. in the GP−2F), and clearance SBO (used in the "active" GP−2F for CSB2). Each of these synthesizers use a 12−bit 12−bit digital−to−analog (D/A) converter that outputs 512 separate data points for each ILS cycle (1/30th of a second), assuring very accurate and precise navigation audio that allow a DDM control resolut ion of 0.0005. The audio generator is completely independent of the monitor. The Executive Control Unit (ECU) and the Local Control Panel (LCP) control the ability of the audio generator to accept commands by gating the monitor write pulse with an active low enable signal. This enable signal is active only during the initialization period immediately following a system reset or when the system is accessed through the Local PC or LCP interface. Ed. 01.04

SOAC

1−25

GP 422

ILS 420



This write control approach allows audio generator programming and calibration flexibility while maintaining audio generator/monitor independence for fail−safe objectives. The interface electrically programmable logic device (EPLD) receives data and control inputs from the monitor through an 8−bit data bus. During station startup, the monitor board reads all the station requirements from nonvolatile memory, including these data inquiries: − Is the station station a localize localizerr or glide glide slope? slope? − Is there there single single or dual dual transmitte transmitters? rs? − Is there a distance−mea distance−measuring suring equipment equipment (DME) (DME) station to be keyed? keyed? (not used in GP) − What are the station station DDM and RF levels levels and % of modulation for each each CSB and SBO output? When all the pattern calculations are completed, the monitor then loads the information to the random−access memory (RAM). The RAM information is in the form of complete navigation waveform in digital format. This exact information is converted to analog signal by very accurate 12−bit D/A converters, filtered, and amplified through operational amplifiers and output to the modulator/power amplifier plifie r. Once loaded, the monitor and the audio generator remain independent until a change in station parameters is input by an operator. The complete navigation waveform always uses the full 12 bits of the D/A converter for best possible accuracy. The amplitude (RF level and modulation) is set using an 8−bit multiplying D/A converter that functions as an accurate 256−step level control. auto boot sequencer Flash program memory

Board personality serial communication communication External signals (10)

UART

used for monitor only digital output

digital input

RS 422 output Processor

External signals (8)

External signals (20) External signals (3) Internal signals

frequency measure MUX

analog measure MUX

Fig. ig. 1−1 1−10

Aud Audio Gener enerat ator or princ rincip iple le

1.6.3

Synthesizer

EEPROM station config. memory

RAM data memory

used for audio generator only CSB/SBO CRS CLR/CSB2 (GP active) analog wave generator Ident (not GP) Integrity

The synthesizer uses high frequency, phase stable temperature−compensated crystal oscillators (TCXO) and state−of−the−art direct digital synthesis (DDS) technology to produce its low−noise signal. The use of DDS allows a phase detector to operate at a frequency more than 350 times the 25 kHz of conventional phase−locked loop (PLL) designs. The advantage of this technique over conventional designs is that it gives a potential of 48 dB more phase correction gain at 150 Hz. The heart of the synthesizer’s design is its DDS integrated circuit. The synthesizer’s DDS and 10−bit D/A converter are combined into one package that is specified for clock speeds up to 125 MHz and for output frequencies of up to 40 MHz. The synthesizer’s frequency decoding is on the board, which makes it very easy to use. The operator needs only to know the desired frequency, which he or she can then set with the synthesizer’s BCD B CD jumpers. No charts or tables required, and no additional jumpers required. By setting the frequency frequency,, the operator selects selects whether the SYN functions as a localizer localizer or glide path synthesizer. synthesizer.

1−26

SOAC

Ed. 01.04

ILS 420



The frequency accuracy is achieved by the use of a stable TCXO and small frequency steps allowed by the DDS design. The TCXO has a specified frequency tolerance of ±10 parts per million (ppm) from −40 to 85 °C. The carrier frequencies are phase locked to this frequency. The station frequency and frequency offset for the capture effect is set by the program in the programmable erasable read−only memory (EPROM). The 8 kHz course/clearance frequency difference will be set to less than th an 2 Hz error and phase locked to the same TCXO so that there is always less than 2 Hz error. error. The 8 kHz frequency difference is either counted down to 125 Hz to be compatible with existing systems or selected by direct 8 kHz (jumper) for use in a more accurate difference detector. VCO LLZ

BCD jumper frequency select

DDS

PLL

ampl.

RF out LLZ or GP (1) CRS

ampl.

RF out LLZ or GP (2) CLR

VCO GP EPLD

EPROM

TCXO DDS

VCO LLZ PLL VCO GP

Fig. ig. 1−11

Synthe thesizer princ inciple

1.6.4

Modulator/Power Amplifier

The ILS 420 Modulator Power Amplifiers (MODPA) (MODPA) modulate and amplify the CSB C SB and SBO signals and they monitor and measure output power and reflected power. The MOPA includes three main circuits: the CSB modulator, the SBO modulator, modulator, and the linear power amplifier. amplifier.

1.6.4.1

CSB Modulator

The forward power RF sample is used in two feedback loops, the AM loop and the CSB phase control loop. The AM loop modulates the transmitter and corrects any AM modulation distortion. The audio generator creates the CSB Audio waveform, which consist of a DC level, the 90 and 150 Hz audio tones, and the Ident tone. It is input into one side of the AM loop error amplifier. Also, an audio signal from a highly linear AM detector which is driven from the RF Output sample obtained from the directional coupler is input to the loop error amplifier. The input DC level sets the desired RF carrier power and the detected DC level is proportional to the actual RF carrier power. Similarly, the levels of the 90 and 150 Hz tones, relative to the DC level, at the input of the error amplifier set the desired modulation percentage for each tone. The detected level of these tones represents the actual modulation percentage, including the effects of modulator and linear amplifier non−linearity. The signals are applied to the differential inputs of the AM error amplifier where the difference between them is amplified and output as a control voltage which is applied to the AM modulator. modulator. The result is a closed loop feedback control system which continuously detects, and compensates for, any deviation in RF power, or modulation mo dulation percentage. It also removes any distortion introduced by the AM modulator or the linear RF power amplifier. Thus the output power and modulation percentage are accurately determined by the digitally generated input CSB signal from the audio generator. The CSB phase control loop operates like the AM loop and has two main functions. The first is to set and maintain the phase relationship relationship between the input RF carrier signal (from the Synthesizer) and the modulated output carrier. This maintains the desired phase relationship between the CSB and SBO signals (in conjunction with similar loops in the SBO section which are also referenced to the input carrier). The second function of the CSB phase control loop is to compensate for any undesired phase modulation of the RF carrier occurring in the linear RF power amplifier. amplifier. This form of phase modulation, often referred to as AM to PM conversion, commonly occurs in highly efficient linear RF power amplifiers, and may result in undesired PM sidebands on the transmitter output. Ed. 01.04

SOAC

1−27

GP 422

ILS 420


Equipment Description Phase modulator

power divider

RF carrier input from SYN

power divider CW RF to SBO

CSB audio waveform from audio generator RF OUT

RF IN CW RF from CSB

Pin Diode AM modulator

GP−2F active jumper select: SBO RF out ext. RF SBO in

Power amplifier modulator

CSB out

AM control loop Carrier

CSB section

phase detector

reference phase

I and Q modulator

in phase power combiner

Power amplifier modulator

power divider

coupler

SBO out

SBO section Carrier

SBO audio waveform I and Q from audio generator

coupler

reference phase

Fig. Fig. 1−12 1−12

Modu Modula lato torr Pow Power er Ampl Amplif ifie ierr, pri princ ncip iple le

1.6.4.2

SBO Modulator

I detector Q detector

The SBO section controls the SBO Power, suppresses the RF carrier, and adjusts the SBO phase relative to the CSB C SB phase over the full range of 0 to 360 degrees. Full 360 degree phase adjustment adjustment saves installation time by eliminating the need to trim RF cables to correct phase lengths. The I−Q modulator use two balanced modulators. One modulates the 0 degree (I) signal from the power divider, and the other modulates the 90 degree (Q) signal. The two modulated signals are then summed in the in−phase power combiner to obtain the vector summation of the 0 and 90 degree components. For example, equal level control signals applied to both modulators will produce a vector sum of 45 degrees. Thus any output phase may be obtained by adjusting the relative proportion, and the polarity, of I and Q control signals. The power output obtained is proportional to the magnitude of the two signals. The output phase will be constant as the power is varied with the control voltages, provided the relative amplitude ratio is held constant between the I and Q voltages. The balanced modulators also suppress the RF carrier. Ideally, with 0 Volts on the control port, the output from each modulator is 0. If an AC signal, symmetrical about 0 Volts, is applied, the output from each modulator is a double sideband, suppressed carrier, or SBO signal. By adjusting the relative magnitude, and polarity, of the AC signals signals applied applied to the I and Q modulation modulation ports, an an operator operator can obtain obtain an SBO signal signal of any any desired phase from 0 to 360 degrees.

1.6.4.3

Linear Power Amplifiers for CSB CSB and SBO

The ILS 420 power stages s tages uses RF Power FETs. FETs. For added protection, the amplifiers incorporate a reverse power sensor and fold back circuit which reduces the power output until the load mismatch is corrected. Each amplifier includes forward and reverse power sensors and detectors providing power measurement outputs to the system monitor and portable maintenance data terminal. The power amplifiers are conservatively designed and fully capable of continuou s CW power outputs in excess of the peak envelope power required for full modulation as indicated in the following: − − − −

Amplifier Localizer C SB Rated Carrier Power 25 W Required Peak Envelope Power (@ 80 % modulation) 80 W CW CW Power Output Capability >100 W

1−28

Glide Path CSB 5W 18 W >25 W SOAC

Ed. 01.04

ILS 420



1.7

FUNCTIONAL DESCRIPTION OF THE MONITOR

This functional description of the monitor provides an introduction to the monitoring concept. Its purpose is to help you understand how the ILS 420 works and how its subsystems interrelate.

1.7.1

O ve r vi e w

Signals transmitted from a localizer or glide path station must be constantly validated to ensure safe landings. The Thales ATM high−integrity Monitor continually measures and analyzes these signals, comparing their current values to stored alarm limits. If a measured parameter is not within limits, the Monitor Monit or signals an alarm condition. Fig. Fig. 1−13 shows the information flow and Fig. 1−14 lists the monitored parameters for the on−antenna (Executive and Field groups) and the "hot" Standby group. Monitoring and Control Transmitter 1

Monitor path 1

Monitor path 2

Audio Demodulator

Audio Demodulator

Synthesizer 1

MODPA 1 RF power amplifiers

Transmitter 2

Monitor Interface (INTFC)

LG−A 1 Audio Generator

LG−M 1 Monitor

ECU Executive Control Unit

Audio 1 enable

Side1 Tx enable

Synthesizer 2

LG−M 2 Monitor

LG−A 2 Audio Generator

MODPA 2 RF power amplifiers

Audio 2 enable

Side2 Tx enable

Antenna select

RF out 2

RF out 1 4 PIN−diode switches (L LZ−2F, LZ−2F, GP−2F active) stby

Stby and On−Air Combiner

Antennas on−air

Fig. Fig. 1−13 1−13

Antenna Distribution Unit

ILS ILS 420 420 moni monito tori ring ng,, simp simplilifi fied ed bloc blockk diag diagra ram m

LLZ

GP

L LZ

GP

LLZ Executive Monitor

GP Executive Monitor

LLZ Near Field Monitor

GP Near Field Monitor

RF level of course position DDM of course position SDM of course position Ident modulation RF level of course width DDM of course width SDM of course width RF level of clearance width DDM of clearance width SDM of clearance width CRS/CLR RF frequency difference Antenna cable fauIt (opt.) Monitor auto−calibration Executive Monitor BITE Continuous Ident Lack of Ident Forced Alarm ECU status poll rate Synthesizer lock RF channel

RF level of course position DDM of course position SDM of course position − RF level of course width DDM of course width SDM of course width RF level of clearance width DDM of clearance width SDM of clearance width CRS/CLR RF frequency difference − Monitor auto−calibration Executive Monitor BITE − − Forced Alarm ECU status poll rate Synthesizer lock RF channel

RF level of course position nearfield DDM of course position nearfield SDM of course course position nearfield

RF level of course position nearfield DDM of course position nearfield SDM of course course position nearfield

LLZ Standby Monitor

GP Standby Monitor

RF level of course position DDM of course position SDM of course position RF level of course width DDM of course width SDM of course width RF level of clearance width DDM of clearance width SDM of clearance width CRS/CLR RF frequency difference Synthesizer lock RF channel

RF level of course position DDM of course position SDM of course position RF level of course width DDM of course width SDM of course width RF level of clearance width DDM of clearance width SDM of clearance width CRS/CLR RF frequency difference Synthesizer lock RF channel

Fig. ig. 1−14 Ed. 01.04

Moni onitor tored parameter ters SOAC

1−29

GP 422

ILS 420


1.7.2


Monitor Operation

The monitor processor uses the same hardware as the audio generator, but it uses different firmware. Refer for the hardware description part to in section 1.6.2. 1.6.2. On−board automatic calibration eliminates factory or field hardware adjustment of monitor and detector paths. The monitor provides the capability to fully characterize its analog signal processing through program−controlled adjustments using a precision 5−Volt (±0.05%) reference. Once it’s A/D subsystem is characterized characterized,, the monitors monitors are then then capabl capable e of calibrating calibrating the detect detector or path path (audio (audio generator) which provides accurate system measurements without factory or field manual hardware adjustments adjus tments.. The precision precision external reference reference is continuously cross−verified using the A/D’s internal precision reference. The Monitors basic "monitoring" function consists of measuring configured detector signals, plus measuring the RF carrier and carrier−difference frequencies. Localizer Monitors measure the Morse Code Ident level and may also optionally measure a cable fault signal. Once a station is operational, detector measurements are continuously cycled as shown in Fig. 1−15. 1−15. The measurements performed in the "OTHER" slot is variable, based on configuration. These may alternate between Integrity (one signal), ADCS calibration (one of the 16 ADCS calibration measuremeasurements), Field (one signal), and/or hot Standby (two or three signals). The "miscellaneous overhead" is time due to various other processing processing (e.g. alarm timer processing, alarm alarm history processing, and data file write operation, interrupts due to I/O servicing, higher priority tasks), that adds to the total cycle times. Capture Effect Localizer

Capture Effect Glideslope

Exec Course Position

Exec Path Position

Exec Course Width

Exec Path Width

Exec Clearance Width

Exec Clearance Signal

[ Exec Near Field ]

”OTHER”

”OTHER”

misc. overhead *

misc. overhead *

Fig. ig. 1−15 1−15

1−30

Dete Detect ctor or Meas Measur ure ement ment Cycl Cycles es SOAC

Ed. 01.04

ILS 420

GP 422



There are two modes for acquiring a digital representation of a selected analog signal. The 12−bit A/D may be used used to acquire acquire either a single sample sample of a selected selected analog signal, signal, or a block of converconversions of a selected signal may be acquired with virtually no processor overhead. The hardware−ashardware−assisted data conversion control and DMA are by an EPLD. The block size is selectable in 128−sample increments from 128 to 1024 samples and two different acquisition times are available: 7.58 and 30.72 kHz. Each sample of converted converted data is transferred directly directly in the microcontroller’s microcontroller’s data memory (SRAM) using the hold/hold ho ld/hold acknowledge bus arbitration protocol. The selection of which sampling mode is used (block or single) on a given signal is based on the signal type (periodic or dc) and the analysis to be performed on the result. The Monitor has a serial input/output communication link with the Local Control Panel (LCP) for access to the following setup parameters, commands, and system status identifiers: − alarm/prea alarm/prealarm larm limit limit entry entry and validation validation − on−command on−command calibration calibration of audio generator generator and detectors detectors − calibration calibration results of monitor, monitor, audio generator generator, or detectors detectors − current current executive, executive, field, and/or hot standby standby parameter parameter readings readings

1.7.2.1

Executive and Standby Monitoring

The RF signals for monitoring the aerial transmitter are derived from sensors in the antenna system. For LLZ, these RF signals are first processed in the Integral Network in the ADU and fed to the Stby and On−air Combiner (SOAC). The SOAC converts down the received signals (CRS Posn., CRS Width, CLR Width and Nearfield) to an Intermediate Frequency carrier (IF of 8 kHz). The resulting signal is fed to the monitor interface board (INTFC). For GP (and LLZ with LPD−antenna),, the Integral Network Networ k is part of the SOAC assembly and the incoming RF signals are processed here to CRS Posn., CRS Width and CLR. The RF signals for monitoring of the standby transmitter are derived from the PIN−diode transfer switch assembly and fed to the Stby and On−air Combiner, where these signals are down converted to an Intermediate Frequency Frequency carrier of (IF of 8 kHz) and following added in phase and amplitude in an appropriate manner to achieve the output signals CRS Posn., CRS Width and CLR Width (CLR for GP). The resulting signal is fed to the monitor interface board (INTFC).

1.7.2.2

Alarm Identification

Digital Digit al signal processing techniques provide system status st atus with minimal time delay. To To fully characterize the valid operation of an ILS 420 station, a predefined set of signal must be measured and validated. The monitor extracts the value of these parameters from the detected analog signals using Discrete Fourier Transforms (DFT) for the time−to−frequency domain conversion of the critical 90 and 150 Hz navigation signal components. Additionally, frequency frequency (e.g. carrier frequency) and/or peperiod (e.g. carrier frequency difference) measurements are performed on selected digital signals.

1.7.2.3

Monitor Interface

Transformer coupling provides isolation of electronics subsystem from incoming monitoring signals. The monitor interface (INTFC) provides signal interface for all configurations of localizer and glide path facilities. It provides the necessary interface between the electronics subsystem and the system’s integral and field detectors.

1.7.2.4

Fail Safe

The ILS 420 monitor includes many fail−safe checks. A fail−safe trigger could potentially potentially impact continuity−of−service or at least level−of−service; for instance the system could switch from CAT. III to CAT. CAT. II or CAT. I, at least momentarily. momen tarily. But the ILS 420 monitor minimizes this possibilit poss ibilityy with its high− availability mode. This mode uses two monitors which must agree on alarm status (i.e. alarm−AND) before any control action is taken. Ed. 10.04 01.04

SOAC

1−31

GP 422

ILS 420



Therefore, a momentary "glitch" on one on e Monitor, Monitor, even resulting in a Monitor Mo nitor reset, should not result a transfer or shutdown, since concurrent failures on both Monitors are very improbable.

1.7.3


The Executive Control Unit (ECU) ensures that safe guidance signals are generated by the ILS station. This unit controls where each of the redundant transmitting equipment is routed; to antenna or standby load, whether on or off, off, and, by periodically checking with both monitors, keeps a good signal in space by automatically changing equipment when a failure is detected. Due to the criticality of ensuring a good signal in space, the ECU employs multiple redundant control, alarm detection, and shutdown shutd own circuits to achieve the highest level of safety. safety. Fig. 1−16 shows the ECU’s principle diagram. Station control and status is communicated by the ECU to the Local Control Panel (LCP) using a single serial interface. This interface conveys such information as turning a particular equipment on/ off, bypass, changing mains, and interlock status. Replies provide status from each redundant control path to permit maximum flexibility for built in test capabilities. Unique customer applications can be accommodated by configuration switches on the ECU. These switches allow the user to define: − − − − − − − −

Which equipme equipment nt is the default default main Enable station interlock interlock or stand−alone stand−alone Require Require both LG−M to show alarm before before alarm alarm action or only one LG−M (and/or) (and/or) Define standby standby equipme equipment nt to be default default hot/cold hot/cold Enable Enable field field monito monitorin ring g Enable executiv executive e alarm action action with field field monitoring monitoring Define station station to shutdown if communicati communication on to LCP lost, or remain remain in last operational operational state Define whether whether DME to be interlocked interlocked with ILS or to be enabled enabled whenever whenever ILS is on (not GP)

serial communication communication to/from LCP

UART 3

Bypass

Status

Configuration switch

3

to 1 to 3 Mon 1 pres TX1 pres Mon 2 pres TX2 pres

Bypass 1 System configuration

Station Control 1st Antenna Select

Integ. detector Field Alarm 1 Field Alarm 2 Standby Alarm 1 Standby Alarm 2

Shutdown 1A

Redundant Shutdown

Station Control 2nd

Bypass 2 Integrity A1 Integrity B1 Integrity A2 Integrity B2

Integ. detector Off Tx1/Tx2 Integrity status Bypass 3

3rd safety shutdown clck fail detect.

Executive Alarm 1 Executive Alarm 2

3 Executive on

Status poll combiner Status poll 1 Status poll 2

Buffer from LG−A

Fig. ig. 1−1 1−16 6

1−32

Shutdown 1B Shutdown 2A Shutdown 2B

Integr. test signal

to LG−M

Exec Execut utiv ive e Con Contr trol ol Unit Unit,, pri princ ncip iplle SOAC

Ed. 01.04

ILS 420



In order to maintain a fail−safe design on a single circuit card assembly, redundancy is applied to the station stepping control and shutdown logic. Two programmable logic devices (PLD) process the user commands received received from the serial interface to select primary control of the station: setting which equipment is on antenna, or to bypass alarm processing for station setup and test. At all times, these PLD maintain a constant vigil on the station monitors, checking for any alarm condition, and if not otherwise bypassed by the Local Control Panel (LCP), will cause station equipment change in the event of an executive alarm. A third, fail−safe, path echoes these two PLD, PLD, capable of an entire station shutdown should the other two paths fail. This third path uses a different architecture, consisting of a different PLD type and a resistor/capacitor (RC) timed one shot to validate the health of the LG−M executive alarms. This third path not only checks for the alarm status, but, by using the RC one shot, also detects clock failures of the ECU. Redundant Redund ant logic is used also to disable both equipment transmitter chains to prevent unwanted transmissions. Two stacks (or totem poles) of three transistors each are combined so that any one transistor being turned off will disable the transmitter of the offending equipment. One totem pole turns off the audio modulation, the other the Synthesizer. The three redundant detection logic circuits described above each drive one of these three transistors. The redundant logic is further augmented by monitoring integrity validation circuitry (see Fig. 1−17). 1−17). The integrity tests assure that the monitors are capable of differentiating between two test signals. The test signals are generated by the LG−A. The ECU multiplexes these two test signals from the on−air LG−A to both LG−M, and then verifies that the LG−M responds with an alarm condition on the appropriate integrity status line. If an LG−M fails to respond appropriately, the ECU removes that particular monitor from alarm action consideration; relying solely on the alternate LG−M. Should the offending LG−M later respond correctly, it is again returned into alarm action consideration.

Audio Generator 1

Monitor 1

Raw integrity B #1 Raw integrity A #1 Alarm status poll Integrity A alarm #1 Integrity B alarm #1 Integrity measure #1 Integrity fail #1

Integrity test signal

Monitor 2

Audio Generator 2

Executive Control Unit ECU

Antenna select

Integrity A/B select

Alarm status poll Integrity A alarm #2 Integrity B alarm #2 Integrity measure #2 Integrity fail #2

Raw integrity A #2 Raw integrity B #2

Fig. ig. 1−17 1−17

Moni Monito torr veri verifi ficcatio ation n test testin ing g

By implementing all local control logic functions on a single CCA, the Thales ATM ECU requires no special grounding, mounting, or enclosure requirements because it is mounted directly into the localizer or glide slope electronics electronics card cage. Since the design is implemented implemented using low−speed digital logic, there are no shielding requirements for electromagnetic interference. Ed. 01.04

SOAC

1−33

GP 422

ILS 420


1.7.3.1


Fail Safe

The ECU plays a critical role in the Fail−Safe design, and the complete hardware implementation increases design testability testability and fail−safe analysis. The primary responsibility responsibility of the ECU is to ensure that an alarm indication from the monitor subsystem results in a station transfer or shutdown. This implies that any failure in the control unit must manifest itself in one of two ways: − a control unit failure failure must must directly directly result in a station station shutdown, shutdown, or − the failure must not prevent the control control unit from recognizing recognizing a monitor alarm and taking appropriappropriate action. Given these constraints, the control unit’s function must be implemented with some level of redundancy. dancy. Any single, non−redundant non−redundant control function possesses an inherent single point failure which can impede required required operation. In addition, any redundant implementation implementation must be fully testable in order to eliminate any common mode failures between similar components within the design. The shutdown detection logic is validated by means of independent bypass controls. By applying a bypass to the two opposing control paths and causing an alarm, each control path can be independently confirmed to be capable of detecting an alarm and equipment shutdown. The Thales ATM approach to the ILS 420 control con trol unit provides a triple−redundant hardware solution which is fully testable using straight−forward logical analysis. In addition, each of the redundant control sections are individually testable during system integrity diagnostics to ensure proper operation and to prevent failure latency. latency.

1−34

SOAC

Ed. 01.04

ILS 420

GP 422


1.8

FUNCTIONAL DESCRIPTION LRCI

1.8.1

O ve r vi e w


The Local/Remote Communication Interface (LRCI) facilitates all interfaces between the equipment groups. The LRCI’s task is to communicate with the different functions, including equipment controls, local display, local controls, and remote control functions. The LRCI includes the Local Control Panel (LCP), individual optional Modem units, and the optional voice amplifier (VAM) module (LLZ only). The Modem units enable remote communication. Modems used for dedicated or switched line applications are available.

1.8.2

Introduction to the LCP

Each equipment (ILS−LLZ, (I LS−LLZ, ILS−GP) includes incl udes an LCP. LCP. The LCP consists of a microprocessor microprocess or 80386 SX, which is called the Local Control CPU board (LC−CPU) and a station status display which is called the Local Control Interface (LCI). The LCI is controlled by the LC−CPU. The LCP enables the control of the LRCI’s functions and local control. It provides main status indication, equipment status, and measurement data. The Local Control Interface (LCI) has indication lamps for the main status and a menu driven liquid crystal display (LCD) for indication of status and measurement data, and it includes manual controls for simple commands like TX on/off or change TX. Besides serial data interfaces to the monitor and transmitter processors, there is an RS 232C interface so that an operator can use the PC User Program to locally and/or remotely (through the Modem) control the equipment from a PC. The LCP main features are: − − − − −

Communic Communicatio ation n to subsystem subsystemss Interface Interface to collocat collocated ed stations stations (DME, (DME, NDB) Built−In Built−In Test Test equipme equipment nt (BIT) (BIT) BCPS BCPS Con Contr trol ol Programming Programming station parameters parameters

The LCP is the interface of the NAV−Station to the outside world, e.g. Remote Control. The LCP controls up to ten serial control channels. channels. A NAV−Station normally normal ly consists consi sts of two transmitters, two monitors (which are ar e called subsystems) subsystems ) and the LCP. It is also possible to collocat stations stati ons like NDB or DME and have their data accessible through the LCP. LCP.

1.8.3

Data Transmission

When the station is switched on, the LCP reads the configuration files in the RAM−Floppy, RAM−Floppy, initializes the Station, and brings it into a normal operational state. The communication between LCP and the subsystems works on the master−slave principle. The LCP automatically sends queries (which are called INTERNAL) with a configured frequency between 0.04 Hz and 10 Hz (in steps of 100 ms) to the subsystems (monitors, transmitters). From the subsystem’s answers, the LCP gets the necessary information to determine the Main Status of the station and to check if all subsystems are available and working correctly. correctly. If the remote control is connected, it is possible to get directly data from transmitters, monitors, or the LCP itself to have detailed status information or to program station parameters. Every time data are requested from a PC, the LCP sends also the INTERNAL telegrams to compose the Main Status. For reliability reasons, the telegrams are checked with a cyclic redundancy check (CRC) after ANSI X3.99−1979 with the CCIT V.41 V.41 generator polynomial. Ed. 07.06 01.04

SOAC

1−35

GP 422

ILS 420


1.9

FUNCTIONAL DESCRIPTION POWER SUPPLY

1.9.1

O ve r vi e w


See Fig. 1−18. 1−18. The power supply used for the ILS system is normally the 230 VAC mains. An emergency power supply must be provided by a battery to ensure that operation is not interrupted if the mains power fails. The 230 V mains supplies the Battery−Charging Power Power Supply (BCPS), which in turn supplies a DC voltage to the navigation na vigation system and keeps the parallel floating battery charged. An uninterruptible power supply is thus available for a transitional period if the mains power fails. One of the two power modules (ACC) acts as a standby in case of failures, making the system extremely reliable. The output voltage is normally 54 V DC (max. 14 A per module), corresponding to the maximum charge of a lead battery with 24 cells. The number of modules which are connected in parallel is sufficient not only to operate the navigation system, but also to permit the floating battery to be recharged within a reasonable time. If one of the modules fails, the other continue working normally. The BCPS provides the supply voltage to the main DC−switches TX1 and TX2, which are used to switch on or off the DC supply voltage for the two transmitters, either individually or together. The switches also provide an overcurrent protection. In addition, a low voltage sensing circuit (LVS) is implemented which senses the 48 V supply voltage to cut off the supply line to the emergency battery if the operating voltage drops below 43 V; this prevents the battery from being exhausted and damaged. Downstream of switches TX1 and TX2 are the quad output DC converters (DCC−MV), which supply the voltages for the transmitters, monitors and the LRCI. They generate the component voltages 5 V, ±15 V and 24 V exactly from the nom. 48 V (43...62 V). The DC converters take the form of switching regulators. They incorporate circuits for current limiting, overvoltage cutoff, and internal monit oring. To supply common functions fu nctions in the ILS equipment the supply voltages +5/±15 V are ored o red by diodes. The converters can also be switched on or o r off electronically (e.g. command from LCP). Besides Besides the common voltages for ECU and Interface a separate DC−converter (5 V) is used to supply the LCP and Modem equipment, which remain operable if the quad converter are shut down. The transmitter and monitor assemblies are supplied by separate power supply modules. The LRCI, ECU and Interface CCA are operational as soon as at least one TX switch is switched on. A transmitter system (e.g. TX1) is electronically switched on or off either by the LRCI or the monitors via the ECU with control lines which enable or disable the Synthesizer board.

1.9.2

Startup Procedure

When the system is switched on first time with the TX1 and/or TX2 switches, all the power supply modules will be connected to the 54 V voltage. The system is initialized and is ready to start operation. The control of the station is performed via the connected PC and running User Program. The request ENTER PASSWORD appears on the PC. If an input is not made, or if an incorrect password password is entered, further action will not be possible. If the password is entered correctly, the system is ready to accept commands. Transmitter Transmitter TX1 or TX2 can then be switched on via the LRCI or the connected PC with the appropriate command. If the station is completely aligned and setup normal operation starts if the power is switched on.

1−36

SOAC

Ed. 07.08 01.04

ILS 420



Transmitter 1

Monitor 1

Transmitter 2

PIN−Diode Transfer Switch

SYN

24 V

Monitor 2

5V +15 V −15 V

5V +15 V −15 V

SYN

5 V 24 V +15 V −15 V

5V +15 V −15 V

SOAC INTFC ECU LRCI

Shutdown 1

Shutdown 2

LG−A 1/2 DCC−MV

DCC−MV DCC−5 F4

Transmitter 1

Transmitter 2 T X1

T X2

Sense

ACC (BCPS−Module)

Under− voltage sense

relay

Emergency Battery

54 VDC F5

Mains 230 VAC

collocated equipment

Control line

Fig. ig. 1−1 1−18 8 Ed. 01.04

Powe ower sup supp ply, ly, blo block ck diag diagra ram m SOAC

1−37

GP 422 Functional Functional Description

1−38


SOAC

Ed. 01.04

ILS 420

GP 422


TRANSMITTER 1 and MONITOR 1

from Transmitter 2

B−Type with PAD−S

CRS SBO CRS CSB

PAD−S*

not used

SYN

CSB

Carrier modulator CRS CSB Power Amplifier

SBO Q

Sideband modulator CRS SBO Power Amplifier

Course (CRSCSB) Course (CRSSBO)

load phase shifter

B−Type: CSB+SBO, LSB

PIN Diode Transfer switch

CRS SBO

CSB* RF aerial

B−Type: SBO, USB

not used

SBO*

SOAC

A2 CW RFoffset (from SYN TX2)

Stby and On−Air Combiner internal sensor signals

* B−Type signal characteristics set by DDM preadjustment (DDM no t 0) or alternatively with Power Adder PAD−S

integral sensor signals

Analog/Digital data (bus)

Monitor Interface board


Environmental inputs: Temp., obstruction light, etc.

Syn data Shutdown A (Synthesizer)

Ant. select Alarms Exec./Field/Stby

LG−M /1 Monitor Processor

Raw Integrity A alarm#1 Raw Integrity B alarm#1 Integrity test signal 1 ECU Poll

ECU

to transmitter 2 DC supply

−15 V +2 +24 V

DCC−MV

+5 V +15 V

−15 V +2 +24 V


LG−A /2 Audio Generator

Raw Integrity B alarm#2 Integrity test signal 2 ECU Poll

DC supply

TRANSMITTER 2 MONITOR 2

V.24 / RS232

V.24 / RS232

BITE

V.24 / RS232

V.24 / RS232

V.24 / RS232

Smoke det. Alarm Smoke det. reset Intrusion Alarm

DCC−MV

F4

Ant. select Alarms Exec./Field/Stby Raw Integrity A alarm#2


BITE


to MODPA 1/2

Monitor Bypassed

DC supply

+5 V +15 V

to SYN

Shutdown A (Synthesizer) Shutdown B (Modulation) DME Key (ident) Raw Integrity B#2 Raw Integrity A#2

Shutdown B (Modulation) DME Key (ident) Raw Integrity B#1 Raw Integrity A#1 Monitor Bypassed

LG−A /1

Inputs from the integral coupling probes of A1, A2

INTFC


Audio Generator

Outputs to the antenna arrays A1, A2 with 0−Reference 0−Reference (B−Type)*

upper

A1

IN A1 IN A2

CW RFoffset (from SYN TX1)

A2

Posn. NF

Transfer Control Antenna Select

to SOAC

A1 lower

Nearfield Dipole (opt.)

Stdby RF

CW RF f0 CW RF f0 offset

Power Adder

ANTENNA SYSTEM 80° cable

CRS CSB

SBO I

Synthesizer

load

MODPA 1/1

RFcw


to LG−A /2 Analog Inputs (spare) DC supply +5 V

TX1 (48 VDC nom.)

TX2

V.24 / RS232

MODEM

53,5 VDC

LC−CPU

LCI

Local Control CPU

Local Control Indicator

LGM1200MD o. LGM 28.8

ACC

LVS

DCC−5

RS232/TTL (opt.)

+5 V

LRCI RS232/TTL

V.24 / RS232

16

16

Local/Remote Communication Interface

Smoke Det. Intrusion Temp. outside etc.

2 Analog Inputs (spare)

ACC

2

LCP Local Control Panel

LGM1

Remote Site

LGM2/ LGM2/DM DME E

LGM3/ LGM3/NDB NDB

2nd modem (opt.) digital I/O (spare)

Local PC

Inputs

Outputs

(ADRACS)

(spare)

(spare)

Environmental sensors

F5

Mains 115 to 230 VAC

DC 48 V to colloc. NAV system (if available)

to emergency battery (if available)

Fig. 1−19 1−19 E Ed d.. 01.1 01.10 0

S OAC OAC

ILS GP−1F; GP−1F; simplified simplified block block diagra diagram m (transmit (transmitter ter 2 partly partly shown shown))

1−39

ILS 420

GP 422

Equipment Description CLR CRS CSB2 CRS SBO CRS CSB1

TRANSMITTER 1 and MONITOR 1 CW RF CRS to SOAC


from Transmitter 2

ANTENNA SYSTEM

MODPA 1/1 RFcw

SYN

Carrier modulator CRS CSB Power Amplifier

SBO Q


Course (CRSCSB1) Course (CRSSBO)

DDM=12 % CRS SBO

PIN Diode Transfer switch

SBO

Power Adder

6 dB opt.

CSB1−A1/clear.

phase shifter*

SBO−A3/Clear.

CRS CSB2 CSB2

CLR Stdby RF

CW RF CLR to SOAC

CW RF f0 + 4 kHz

PAD−A

CSB1

RF SBO out (RFcw)

SBO I

Synthesizer

phase shifter*

CRS CSB1

CSB1

CLR

CSB2−A2

RFcw (CL)

CW RF f0 − 4 kHz


RF SBO in (RFcw for CSB2)

CSB2

Carrier modulator CRS CSB2 Power Amplifier

SBO Q

Clearance modulator CLR Power Amplifier

CW RF CRS CW RF CLR (from SYN TX1 via MODPA)


IN A1 IN A2


SOAC

DDM=30%

Stby and On−Air Combiner internal sensor signals


INTFC

Environmental inputs: Temp., obstruction light, etc. Analog/Digital data (bus)




Syn data Shutdown A (Synthesizer)

LG−A /1




ECU


DCC−MV

+5 V +15 V

−15 V +2 +24 V

ECU Poll

TX1

DC supply BITE

V.24 / RS232 V.24 / RS232


TX2

Analog Inputs (spare) V.24 / RS232

LC−CPU

MODEM

LCI

Local Control CPU



LVS

Audio Generator

to LG−A /2

53,5 VDC

ACC

LG−A /2


V.24 / RS232 V.24 / RS232

DC supply +5 V

(48 VDC nom.)


Raw Integrity B alarm#2 Integrity test signal 2

V.24 / RS232

DCC−MV

F4



BITE

−15 V +2 +24 V

to MODPA 1/2

Monitor Bypassed

DC supply


to SYN



+5 V +15 V

middle

DDM=48 %

SBO I

Audio Generator

A2

A1 Inputs from the integral coupling probes of A2 A1, A2, A3 A3

IN A3

Course (CRSCSB2) Clearance (CLR)

Outputs to the antenna arrays A1, A2, A3

A3 upper

6 dB opt.

Posn. NF

MODPA 2/1

A1 lower

DCC−5

RS232/TTL (opt.)

+5 V

LRCI RS232/TTL

V.24 / RS232

16

16




ACC

2


LGM1

Remote Site

LGM2/ LGM2/DM DME E

LGM3/ LGM3/NDB NDB


Local PC

Inputs

Outputs

(ADRACS)

(spare)

(spare)


F5




* optional

Fig. 1−20 1−20 E Ed d.. 01.1 01.10 0

S OAC OAC

ILS GP−2F GP−2F active; active; simplified simplified block block diagra diagram m (transmitt (transmitter er 2 partly partly shown) shown)

1−41

ILS 420

GP 422



CLR

TRANSMITTER 1 and MONITOR 1

CRS SBO CRS CSB

CW RF CRS to SOAC

from Transmitter 2

ANTENNA SYSTEM

MODPA 1/1 RFcw

SYN

Course (CRSCSB) Course (CRSSBO)


SBO Q

CSB PIN Diode Transfer switch

CRS SBO

SBO

not used

SBO I

Synthesizer

phase shifter

CRS CSB Carrier modulator CRS CSB Power Amplifier

CSB

Power Adder

6 dB opt.

CSB+SBO phase shifter

SBO+Clear.

CLR

CLR

MODPA 2/1


not used

IN A3

Clearance modulator CLR Power Amplifier

SBO I

Clearance (CLR)



Analog/Digital data (bus) Syn data Shutdown A


INTFC





(Synthesizer)

LG−A /1


Monitor Processor


DC supply

ECU


DCC−MV

+5 V +15 V

−15 V +2 +24 V

ECU Poll

TX1

DC supply BITE

V.24 / RS232 V.24 / RS232


Analog Inputs (spare)

TX2

V.24 / RS232

LC−CPU

MODEM

LCI

Local Control CPU



LVS

Audio Generator

to LG−A /2

53,5 VDC

ACC

LG−A /2


V.24 / RS232 V.24 / RS232

DC supply +5 V

(48 VDC nom.)


Raw Integrity B alarm#2 Integrity test signal 2

V.24 / RS232

DCC−MV

F4



BITE

−15 V +2 +24 V

to MODPA 1/2

Monitor Bypassed

LG−M /1

Audio Generator

to SYN




upper


SOAC internal sensor signals

+5 V +15 V

Outputs to the antenna arrays A1, A2, A3

A3

A1 Inputs from the integral coupling probes of A2 A1, A2, A3 A3

IN A1 IN A2

not used

SBO Q

A2 middle


Posn. NF RFcw (CL)

CW RF f0 − 4 kHz

A1 lower

Stdby RF

CW RF CLR to SOAC

CW RF f0 + 4 kHz

CSB+SBO+Clear.

PAD−S

DCC−5

RS232/TTL (opt.)

+5 V

LRCI RS232/TTL

V.24 / RS232

16

16




ACC

2


LGM1

Remote Site

LGM2/ LGM2/DM DME E

LGM3/ LGM3/NDB NDB


Local PC

Inputs

Outputs

(ADRACS)

(spare)

(spare)


F5




Fig. 1−21 E Ed d.. 01.1 01.10 0

S OAC OAC

ILS GP−2F GP−2F standard standard;; simplified simplified block diagram (transmitter (transmitter 2 partly partly shown) shown)

1−43

ILS 420

GP 422 Software Description


1.10

NAVAIDS 400 SOFTWARE

1.10.1

O v e r vi e w

The Navaids 400 software is modular. modular. It’s modules are the TRANSMITTER SW, MONITOR SW, LRCI SW and the user software for PC. The The equipment SW is stored in the flash program memory of the microprocessor for transmitter (LG−A), monitor (LG−M) and LCP. The valid system syst em version can be called up via PC.

Navaids 400

Software packages

Transmitter software

Monitor software

LG−A Signal generation RF amplification, RF radiation

LG−M Transmitter/signal monitoring

LRCI software LCP Communication Local Control

PC User Program software (e.g. ADRACS or MCS) Operation, maintenance

Fig. ig. 1− 1−22

System tem so softwar tware e, ov overview iew

1.10.2

PC User Program Software

Much of the software that controls the ILS 420 is transparent to the user. The user controls, assesses, and maintains the system through the PC User Program software, which in turn relates with software that is embedded in the circuit card assemblies (CCA’s) in the system itself. The embedded programs programs control the t he transmitter and monitor and provide the user information to the PC User Program for status checking and maintenance. The PC User Program ADRACS or MCS is an easy−to−use interface for remotely monitoring and controlling the ILS 420. It limits access and control by password level and only allows full control to high level operators in the maintenance mode. The maintenance mode includes fault isolation, parameter save and restore, data recording(for trend analysis), history evaluation, and a highly configurable and menu driven technical t echnical data display. More details about the PC User Program and its use can be found in the Technical Manual ADRACS , Code No. 83140 55324, or in the Technical Technical Manual MCS, Code No. 83140 55325.

Ed. 07.06 01.04

SOAC

1−45

GP 422

ILS 420

Software Description

1.10.3


Description of of the ILS Transmitter Software

The ILS 420 transmitter software has two discreet sub−programs: Generation and Diagnostics.

1.10.3.1

Generation

The generation sub−program manages two sets of waveforms: the transmitter waveforms and the integrity setup wave forms. − TRANSM TRANSMITTER ITTER WAV WAVEFO EFORMS RMS These include the waveforms that setup, configure, and control the transmitter, including the various on−the−air calibration functions. AUTO CALIBRATION DATA This file contains data collected by the audio generator’s A/D subsystem (ADCS) calibration process. This process is immediately performed by the LG−A at power−up and continuously thereafter. CONFIGURATION The configuration function is primarily used by the waveform generation generation function to configure the audio generator for the outputs and functions appropriate to the system it is in. For instance, the configuration function tells the audio generator (LG−A) and MODPA what to produce, depending on what system the audio generator is in. It then adapts the audio generator and MODPA outputs to meet the system’s needs. − INTEGRI INTEGRITY TY TEST TEST WAVEFO WAVEFORMS RMS This file is a simplified version of the other waveform files, containing the specification for the two Integrity Test Test Waveforms used during LG−M Integrity Test Test measurements. Each signal has only the basic ILS signal specification for RF Level (i.e. the DC level) SDM and DDM. These files are non−volatile and read−write. read−write. An Integrity Test Test Waveform resemble resembless the CSB portion of a normal waveform file. − INTEGRITY INTEGRITY TEST CALIBRATION CALIBRATION DATA DATA This file contains data collected as the result of an audio generator’s integrity test calibration process performed by the LG−A under operator command. The data represents the voltage gain and DC voltage source error components of the audio CCA’s programming model and are only accurate for the LG−A that performed the calibration. The operator must perform a "calibrate audio" command comman d whenever the LG−A is replaced replaced and is recommended recommended only for scheduled periodic maintenance thereafter, so that any component drifts may be compensated and parametric failures may be detected

1.10.3.2

Diagnostics

− AUDIO GENERA GENERATOR TOR CALIBRATION CALIBRATION DATA DATA This file contains data collected as the result of an audio generator calibration process performed by the LG−A under operator command. − AUDIO GENERATOR GENERATOR DATA DATA This file contains ILS signal data measured from the LG−A diagnostic outputs. − RF POWER AMPLIFIE AMPLIFIER R (PA) (PA) DATA DATA This file contains ILS signal data measured from the LG−A and MODPA diagnostic outputs. − BIRD WATTMETER WATTMETER DATA DATA (optional) (optional) This file contains power measurement data derived from amplified outputs which are connected to optional Bird Wattmeter sensors.

1−46

SOAC

Ed. 01.04

ILS 420

GP 422



− MAINTENANCE MAINTENANCE ALERT ALERT DAT DATA A NOMINALS NOMINALS This file contains nominal values (i.e. midpoints) used for processing spare A/D input maintenance alerts (exclusive of environmental sensors). The power supply supply nominals are fixed internally to their respective supply levels. − MAINTENANCE MAINTENANCE ALERT ALARM LIMITS This file contains alarm limit definitions for the continuously collected power power supply data. data. Parameters that do not exist for a configuration are ignored and should be set to the respective nominal for compatibility.

NOTE:

Setting a limit to its corresponding nominal value disables that limit. Two sets of limits limits are available to distinguish primary and secondary alert levels, where needed

− CURRENT MAINTENANCE MAINTENANCE ALERT ALERT DAT DATA A This file contains data collected as the result of the LG−A’s maintenance monitoring function, plus LG−A BIT status bits.

Ed. 01.04

SOAC

1−47

GP 422

ILS 420



1.10.4

Description of Monitor Software

1.10.4.1

Operating System

The Monitor uses a Thales ATM developed minimal, preemptive, multitasking kernel, OS196. The entire kernel occupies less than 500 bytes of assembly code (the average 80C196 assembly instruction is about 3 bytes in length). The operating system (OS) allows the Monitor to be efficiently partitioned into independent tasks, simplifying the overall design and minimizing coupling between functions.

1.10.4.2

Software Tasks

Each OS196 task has a statically assigned (i.e. compile time) private stack and priority. priority. All priorities are fixed (i.e. no dynamic priority assignments) and unique to each task (i.e. no round−robin scheduling). The following table in Fig. 1−23 lists the eight (8) Monitor tasks along with the task’s name used, a brief description, and each task’s assigned priority.

Fig. Fig. 1−23 1−23

Task name

Description

Priority

idle

OS196 Idle task (always lowest priority)

8

rmm_comm

LCP communications task

4

file_mgr

file ile in initia itiallizatio ation n an and EE EEPROM ROM fifile wr write ite tas taskk

3

autocal

ADCS (periodic) automatic automat ic calibration task

7

exec

ECU interface and status reporting task

1

data

main data monitoring task

6

id_data

(LOC) Ident monitoring task

2

fp_data

frequency/period monitoring task

5

Task ask defi defini niti tion onss and and pri prior orit ityy assi assign gnme ment ntss

Task priority assignments follow "rate monotonic" guidelines, modified to favor the operational structure of the Monitor code when it is in "normal" monitoring mode. OS196 always checks the stack of each task for overflow before allowing it to transition from the ready to the running state. If a stack overflow is detected, program flow is redirected to OS_reset. Only I/O drivers service interrupts. In general, I/O drivers are dedicated to the specific specific task which uses its sere liminates priority inversion problems. The sole exception vices, since exclusive use of a resource eliminates is the combination A/D and frequency/period measurement measurement I/O driver (OS_GPIO). Since A/D services are needed by three distinct operational areas: autocal, audio card calibration, and data monitoring, OS_GPIO has a queue manager that is both first−come−first−serve and first−fit (i.e. the first re access to this driver driver for for A/D A/D meameaquester queste r that fits the available resources is granted access). However, access surements is regulated regulated by an access access protocol that gives the data task priority when the Monitor is in its normal monitor state.

1−48

SOAC

Ed. 01.04



There is no dynamic buffer allocation. All buffers are either either static or local (i.e. stack). All All control files use a CRC (CCITT−16), whose error detection capability is much more extensive than that of simple 2’s complement or exclusive−or checksums. All control files are read into a buffer private to each task which uses them (i.e. tasks do not access the common file store). Only one task may write to a file, while any number of tasks may read a file. When a critical setup file is updated, the "file manager" subroutines set a flag for those tasks that need to be informed of the new version. Tasks which whi ch write to files, do so by first updating updati ng a temporary, private copy. File writes are only performed when the file update is complete. This is true regardless of whether whether or not a file is volatile. File movement into and out−of the file store is via the 80C196’s uninterruptible block move instruction. Since all file sizes are relatively small (less than 256 bytes) and the 80C196’s block−move is similar in speed to a DMA operation, the length of time that interrupts are disabled does not impact critical interrupt response times. Non−volatile files are stored in E 2PROM. The architecture of the Monitor’s memory map overlays the E2PROM with SRAM. Switching between E 2PROM and SRAM banks is controlled by a special I/O mapped instruction (via an EPLD) which is used by only one task (the E2PROM task). task). When E2PROM data is read or write accessed, interrupts are disabled during the access. Access is limited to 8 byte pages to avoid any impact on critical interrupt response times. To ensure the maximum durability of the E2PROM, all write operations are read−modify−writes to avoid unnecessarily (re)programming a location with a value that it already has, thus avoiding premature memory write failure. All tasks requiring Monitor system level files are forced to wait until the entire file system has been verified and copied to its working RAM image. The autocal task continuously monitors the Monitors’ A/D converter subsystem (ADCS) and the Interface card demodulator (I/F−D). Should autocal fail (either a hard or parametric failure), the data task is not allowed to perform any of its detector measurements, which forces the data task to report an alarm status for fo r all detector data groups (i.e. EXEC, FIELD, STANDBY STANDBY, and Integrity) with all A/D derived data reported as zeroes. This can be seen as the AUTO−CAL status bit being in alarm on any of the monitoring data screens. A minimal minimal set set of key measur measuremen ements ts are made and compa compared red against against hard−cod hard−coded ed limits limits derived derived from design data including the manufacturers’ data sheets. The basic ADCS calibration measurements correct for net ADCS DC offset error (i.e. corrects corrects to "true" analog ground), net ADCS gain error (i.e. the number of A/D steps per Volt), nominal gain−DAC gain error, and DC offset−DAC error. error. The I/F reference detector signal and its DC offset error measurements compensate for variations in both DC and AC gain plus demodulator DC offset error due to aging and temperature effects in all detector measurements (done by the data task). The autocalibration sequence begins immediately on autocal task activation (i.e. after Monitor reset). There are a total of 16 ADC block conversions, where each block consists of 1024 equally time spaced samples within 1/30 second (or 33.3 ms): 5 for the basic ADCS, 10 for DC offset DAC, and 2 for the Interface CCA. The following following table table (Fig. 1−24) 1−24) shows the raw processor timing for these 16 autocal measurements.

Ed. 01.04

SOAC

1−49

GP 422

ILS 420



Signal

settling [ms]

processing [ms]

total [ms]

−5 Volt reference −5 Volt reference analog ground +5 V reference I/F analog ground I/F reference detector

0.2 0.2 0.2 0.2 10.0 10.0

6.1 6.1 16.0 6.1 6.1 42.0

39.6 39.6 49.6 39.6 49.4 85.3

DC offset DAC Do= 0 Do=255 Do=1 Do=2 Do=4 Do=8 Do=16 Do=32 Do=64 Do=128

0.2 0.2 0.2 0.2 0.2 0.2 0.2 0.2 0.2 0.2

6.1 6.1 6.1 6.1 6.1 6.1 6.1 6.1 6.1 6.1

39.6 39.6 39.6 39.6 39.6 39.6 39.6 39.6 39.6 39.6 699.0

grand total total

Fig. Fig. 1−24 1−24

ADCS ADCS aut auto− o−ca calilibr brat atio ion n mea measu sure reme ment nt time timess

The "DC offset DAC" measurements are for the ADCS’s programmable programmable 8−bit 0 to +10 Volt Volt DC offset DAC which is used to remove a signal’s DC portion prior to maximizing the gain for the remaining AC portion. The gains are the nominal values achieved by the ADCS’s 8−bit gain DAC. The processing time is essentially the raw CPU time required and includes the I/O driver CPU overhead, plus the calculation times associated with each specific signal. The total time is the sum of the processing time plus both the settling and measurement times (recall, measurement time is fixed at 1/30 second). Within the OS196 multitasking environment, other task(s) may run during the time periods due to either the settling or measurement times. Simply adding the processing times gives a grand total of 699.0 ms, which assumes no other task blocks the autocal task during the times that it needs the CPU. This is close to the measured first autocal cycle after power−up, since as mentioned earlier, earlier, when the autocal status is bad, the autocal task does not need permission from the data task to access the ADCS. Therefore, when autocal is the only user of the "other" measurements and data task cycles are normal, a full autocal task cycle is about 16 times the LLZ’s (average) data task measurement cycle time. As noted earlier, the ADCS shares the "other" measurement slot with other configured measurements. The worst case occurs for a LLZ−2F (Capture Effect) with Executive Near Field, Far Field, and hot Standby configured. Since the data task cycle time under these conditions is 242 ms and it requires six of these cycles for one ADCS measurement, the total time is: 6 * 16 * 242 ms = 23.23 seconds For all other configurations, this time is shorter. Once all data have been measured and is OK, then the autocal task follows the normal data task cycle access access protocol. For a functional Monitor, Monitor, the autocal task primarily compensates for drift effects, but due to the tight limits of the autocal checks, a hard failure will be detected detected within one data cycle, while a parametric (i.e. soft) failure may take up 23.23 s as indicated above. Each task performing A/D conversions has a private Direct Memory Access (DMA) block of SRAM statically allocated (i.e. separate autocal and data task SRAM blocks). While A/D measurements within withi n a task may use the same block of SRAM, they alternate between between different different types of signals. Thus, a failure to perform one measurement is typically detected by the limits applied to the next signal processed.

1−50

SOAC

Ed. 01.04

ILS 420



While the use of common signal−processing hardware has the disadvantage of serial access to signals ((e.g. slower throughput), the advantages are greater: − centralized centralized calibra calibration tion of the "heart" "heart" of the the Monitor − fewer components components means means a larger larger MTBF − a failure is both is more quickly and more more likely detected, detected, since since all signal processing processing goes through through a common path The use of digital signal processing (DSP) techniques (when coupled with automatic ADCS calibration) provides drift−free processing of the 90 and 150 Hz navigation components. Almost all drift can be attributed to analog sources external to the I/F detector and Monitor ADCS (e.g. RF cable phase and impedance drift with temperature). When the data (monitoring) task begins (i.e. power−up), all monitoring control files (limits, nominals, detector calibration and normalization) are read and processed into a static control table. The entire control table is checksummed prior to actual monitoring. After every "Monitor data cycle", the control table’s checksum is verified to detect memory corruption. corruption. If the memory is corrupt, the entire initialization procedure is repeated before monitoring resumes. This reinitialization typically requires less than 2 ms of CPU time and therefore is transparent to normal monitoring (see "ECU status watchdog"). All ECU status I/O is polled (i.e. not interrupt interrupt driven) by the Monitors’ exec task. Thus, if the Monitor software softw are has a stuck interrupt or somehow hangs (i.e. prevents an alarm status report cycle), the ECU will interpret this as an alarm condition and respond appropriately. This Monitor/ECU "handshake" cycles every 26.67 ms (i.e. the ECU detects a dead Monitor within 26.67 ms). Monitor’s ECU status watchdog: The exec task (highest priority) reports Monitor alarm status to the ECU, and it verifies the update rate of the Monitor’s EXEC, FIELD, STANDBY, and Integrity data measurements. The maximum ECU status update periods are listed in the following table (Fig. 1−25). 1−25). If these periods are not met, then the exec task forces the corresponding group’s status into alarm on subsequent ECU status polls, regardless of the data task’s last reported value. Signal Group EXEC FIELD STANDBY INTEGRITY

Fig. ig. 1−2 1−25 5

Must be updated no less than every.. 0.5 seconds 1.0 seconds 6.0 seconds 2.0 seconds

Maxi Maxim mum ECU ECU sta statu tuss upd updat ate e pe period riodss

The purpose of the Integrity test is to verify the Monitor’ ability to measure signals and perform alarm processing. The ILS 420 does this in an innovative way that is more comprehensive then prior methods employed by any other ILS equipment. Each Audio CCA produces two special Integrity signals (A and B). These signals are routed to the ECU. ECU. The Integrity signals si gnals from the on−antenna on−a ntenna equipment are then toggled between signals A and B and fed as one signal into the Monitors’ Integrity input. While the Monitor measures only one Integrity signal input, it must apply two distinct sets of limits to this single measurement. measurement. The signals and limits are designed designed so that, when the limits are applied applied to the current Integrity signal input, only one set of limits has no parameters p arameters in alarm. The ECU times the responses of the Integrity signal changes sent to the Monitors, and if the Monitors do not issue the correct response within the ECU’s hard−coded time limit, then the Monitor is declared to be in Integrity Integr ity alarm. An Integrity alarm may cause the ECU to initiate executive control action, depending on whether the ECU is configured for alarm−AND or alarm−OR operation. Ed. 01.04

SOAC

1−51

GP 422

ILS 420



1.10.5

Description of LRCI Software

1.10 .10.5.1 .5.1

Sho Short Desc Descri ript ptio ion n of the the Modu Module less

See Fig. 1−26. 1−26. The LCP Software is a customer of the RMMC Software package, e.g. the LCP Software get the orders from the RMMC part with the DEPOSIT_ORDER command and returns the result with the DEPOSIT_RESULT command. The RMMC part controls the communication to the remote control and the LCP part the communication to the subsystems inside the station. The modules of the LCP Software are: − REU_CUS REU_CUSTOM TOMER_M ER_MANA ANAGEM GEMENT ENT Receives Receiv es Order and perform queueing with DEPOSIT_ORDER command. After queueing the PERFORM entry of the task is called and performs a rendezvous with the four subsystem tasks by calling REQUEST_STATI. After completion of data acquisition the SUBSYSTEM_MANAGER reports ALL_READY and terminate the rendezvous. The The command SPLIT_RESUL SPLIT_RESULT T splits the telegram telegram ininformation format ion into data records. The command PUZZLE_Result prepares prepares of these records the RESULT telegrams. The DEPOSIT_Result command finally returns the RESULT telegrams to the RMMC part of the SW−Package. − SUBSYSTE SUBSYSTEM_M M_MANA ANAGER GER The SUBSYSTEM_MANAGER contains the five tasks depending to each Subsystem (TX1, TX2, MON1, MON2, ECU). It performs the communication between the subsystems and the th e LCP. LCP. The station management provides system data (e.g. Main Status), dependent on the configuration (e.g. TX/MON, DME/INDEP, DME/INDEP, Hot/Cold Stdby) − PS_M PS_MAN ANAG AGER ER The PS_MANAGER consists of one task: T_BCPS. It is responsible for status of the power supply and the calculation of the battery capacity. − LCD_MA LCD_MANAG NAGER ER of the Stati Station. on. It consists of two tasks: The T_BUTTON_OBSERVER controls the pushbuttons of the LCI−panel for the LCP−menu, and the T_LCI_CONTROL controls the display of LCI−text, and the read/write operation of I/O−signals (e.g. BIT−signals from power supply, external shelter signals). External Communication (e.g. RMMC) RS232/RS422/T TL RS232/RS422/ RS232/RS422/T T TL 2. DIAL COM3

NDB

DME

TTL not used

COM4

PC RS232

RS232

LGM1

LOCAL PC

not used

COM6

COM8

COM7

Communication to external units DEPOSIT RESULT PS_MANAGER

Terminal (opt.)

DEPOSIT ORDER

T_CONTROL

LCD_MANAGER

LCP

T_BCPS

T.BUTTON:OBSERVER

SUBSYSTEM_MANAGER

Internal Communication T_SUB

T.LCI CONTROL T_SUB

T_SUB

COM9

Mon1

1−52

T_SUB

I_AM READY

RS232

Fig. ig. 1−26

T_SUB

COM10

Mon2

COM1

TX1

PERFORM_EXTERNAL_ACTION PERFORM_INTERNAL_ACTION COM2

TX2

COM5

ECU

Overview LCP LCP SW st structure ure SOAC

Ed. 01.04

ILS 420

GP 422 Description GP−1F


CHAPTER 2 TECHNICAL DESCRIPTION GP−1F 2.1

GENERAL

This chapter describes the GP−1F system, 0−reference and sideband reference (B−Type). For the subassemblies, only the description of subassemblies which are different to the GP−2F are contained in this chapter. References to chapter 3 are made for the other which are identical to GP−2F.

2.1.1

System Overview

See Fig. 2−1, 2−1, 2−2. 2−2. The ILS GP−1F installation comprises the following main components and accessories: − Transmitter rack housing the transmitter, transmitter, monitor and power supply/battery charging (BCPS), single or dual − Emergency Emergency power power supply supply (48 V lead batter battery) y) These components are housed in a building or shelter. Since there is possibility of generated oxyhydrogen, the battery is separately housed. − Antenna system system (refer (refer to Part Part 3, Antenna System System Description) Description) The GP antenna is installed approximately 286 to 344 m beyond the runway threshold and 120 to 180 m from the runway centre line (see Fig. 1−2). 1−2). The GP transmitter building (shelter) is installed in the vicinity of the GS antenna. − Cab Cable set set − Grou Ground ndin ing g The antenna system (including optional nearfield dipole) and the transmitter rack are connected via 5 coaxial cables. The cables are fed via connectors on top of the transmitter rack on the one hand to the PIN diode transfer switch (2x RF out) and on the other hand to the Stby and On−Air Combiner unit (3x RF in) which combines the signal components, which are obtained via the coupling probes integrated in each antenna array. array. With W ith B−Type, B−Type, alternatively a power adder may be additionally inserted in the RF−out path which conditions passively the RF output signal required for the B−Type. B−Type. The Stby and On−Air Combiner supplies the resulting signals and the signal of the optional nearfield monitor at the antenna site to the monitors: − Course Course positio position n − Course Course width width

(POSN. (POSN.)) (WIDTH) (WIDTH)

A grounding grounding network network must be installe installed d around around the transmitter transmitter building building (shelter (shelter)) which which does does not afford afford special symmetrical requirements. The grounding networks of shelter and antenna system must be connected by low resistance. The GP transmitter can be controlled, monitored and maintained from the tower with a respective remote control and monitoring system (e.g. RMMC).

Ed. 06.05 01.04

SOAC

2−1

GP 422

ILS 420

Description GP−1F

2.1.2


Basic Components of an GP Transmitter Ra Rack

The main components of a GP transmitter rack are as follows (see Fig. 2−2): 2−2): − − − − −

Transm ransmitt itter er Monitor Monitoring ing system system (monit (monitor) or) Control Control and Switchi Switching ng Local/remote Local/remote communication communication interface interface (LRCI) Operat Operating ing voltag voltage e supply supply

2.1.2.1

Transmitter

The dualized transmitter generates the required RF signals for this type of installation. These signals are fed to and radiated from the antenna system. Signal generation and transmitter control are microprocessor controlled. A single transmitter configuration is also available.

2.1.2.2

Monitor

The dualized monitor is supplied with signals from the internal and integral sensors and with informations obtained from the t he radiated RF field via an optional nearfield and/or farfield monitor dipole. The RF signals obtained are down converted by the Stby and On−Air O n−Air Combiner to an Intermediate Frequency carrier and fed via an interface to the monitor signal processor for processing. A single monitor configuration is also available.

2.1.2.3

Control and Switching

The results of the monitor process are supplied to the control and switching function. This function will switch−over (in a dual system) or shutdown transmitters if the hardware based decision paths find an appropriate result. Also the other control functions are performed here.

2.1.2.4


The LRCI is the focal point for internal/external communication between the transmitter and the monitor, tor, the local or o r remote operator and the system, including any connected subsystems. All communication with the system takes place via a local or remote intelligent terminal (PC or laptop), which is used for all settings, commissioning and maintenance. The MAIN STATUS STATUS indication, basic settings (on/off, change over, Mon. Bypass) and call up of certain transmitter or monitor measurement data are performed with the Local Control Interface (LCI) of the Local Control Panel (LCP).

2.1.2.5

Generation of the Operating Voltage

The transmitter rack requires a nominal supply voltage of 48 V. V. The mains module (ACC) of the BCPS BC PS supplies an output DC voltage of 54 V and 14 A max. Two Two of the modules are connected in parallel depending on the power requirement of the navigation system. The value of 54 V is derived from the trickle charge voltage for a 48 V lead battery. The DC/DC converters housed in the BCPS subrack act as switched−mode regulators, which supply the necessary supply voltages with wit h a high efficiency, namely : − DC/DC converter DCC−MV

+5 V/3 A; +15 V/2.5 A; −15 V/1.5 A; +24 V/11 A

− DC/DC converte converterr DCC−5 (on Backpanel Backpanel)) +5 V/3 V/3 A, used used to supply separately separately LCP LCP, Modems Modems

2−2

SOAC

Ed. 07.08 01.04

ILS 420


Equipment Description a) GP−1F, GP−1F, 0−Reference 0−Re ference

9 8

b) GP−1F, Sideband Reference (B−Type) A2

9 8

1)

Dist Distan ance ce dep depen ende dent nt on glid glide e pat path h angle and local conditions

A2

A1

7 6

5

5

7 6

A1

4

4 B O S B C S

1)

) B S L ( O B S / B S C

1)

POSN. POSN.

GP−shelter

Tower

1

10 1 1a 2 3

3

Stby Stby and and On−A On−Air ir Com Combi bine nerr B−Type B−Type alt. alt.:: Power Power Adder Adder Emer Emerge genc ncyy powe powerr supp supply ly bat batte tery ry ILS/ ILS/GP GP tran transm smit itte terr rack rack

Fig. 2−1

4 5 6 7

Tower

1

10

2

Reflecting are area Near Nearfi fiel eld d Monit Monitor or dipo dipole le (opt (opt.) .) Indu Induct ctiv ive e cou coupl plin ing g pro probe be A1 Dipo Dipole le ante antenn nna a arr array ay A1

) B S U ( O B S

1a

GP−Shelter 2

3

8 Indu Induct ctiv ive e cou coupl plin ing g pro probe be A2 9 Dipo Dipole le ant anten enna na arra arrayy A2 A2 10 Remote Remote Contr Control ol and and Monitor Monitoring ing Syste System m

GP−1F system overview Antenna A1

Nearfield dipole (opt.)

A2 SBO

CSB

(B−type: SBO, USB)

(B−type: + SBO,LSB)

B−Type, alternative: Power Adder CSB

SBO

POSN.

Interface


RS 232

Monitor RS 232

LRCI Modem Operating voltages

RMMC

A2


Aerial/Stdby

Course Transmitter

A1

2

RS 232

Terminal (PC/Laptop)

DC−Converter Mains

Supply voltage

NOTE:

Fig. ig. 2−2 2−2 Ed. 06.05 01.04

ACC (BCPS) (BCPS)

Transmitter rack

Diagrammatic view, dual installation not shown for purposes of clarity.

Main Main com compone ponent ntss of of a GP GP−1F −1F tra trans nsmi mitt tter er cab cabinet inet SOAC

2−3

GP 422

ILS 420

Description GP−1F

Equipment Description PIN−diode transfer switch 24 V

SOAC

XMTR 1 24 V

MON1

LRCI/INTFC/ECU

MON 2**

5 V/±15 V

XMTR 2**

5 V/±15 V

24 V

LCP/Modem L/G−A

5 V/±15 V

+24 V +5 V +15 V

5V

48 V

−15 V +15 V

−15 V

DCC−MV /1

+5 V

+5 V +24 V

DCC−5

DCC−MV /2 **

F4

TX1

TX2**

Low Voltage Sense sense

relay

53,5 VDC (48 VDC nom.)

F5

Mains module 1

Mains module 2

Battery

shunt


Fig. ig. 2− 2−3

2−4

Mains (115 VAC to 230 VAC)

BCPS subrack ** dual Version

Power dis distr trib ibut utio ion, n, block dia diag gram

SOAC

Ed. 01.04

ILS 420



2.2

MECHANICAL DESIGN

2.2.1

GP Transmitter Rack

See Fig. 2−4 to 2−7. 2−7. The cabinet is made of sheet steel. It accommodates three standard 19" subassembly carriers (subrack). The subracks are assembled with plug−in units which are designed as double or single Euroform printed circuit boards (PCB) with dimensions of 233.4 x 200 [mm] or 100 x160 or 100 x 220 [mm]. The printed circuit boards are interconnected in each subrack on a motherboard back panel. The subracks themselves are connected together via flat ribbon cables with plug−in connectors or via plug− in or screw−on coaxial coa xial cables (used for RF connections) at the t he rear. rear. The front of the cabinet is hidden by a front door which can be key locked and swung open by a door handle. The local control and indication panel (LCP) is flush−mounted in the front door. The cabinet rear is closed by a rear door which can also be swung open by a door handle. The installed equipment should have enough room between the cabinet and the shelter wall to allow the rear door to be opened and to allow space for measuring equipment. The RF outputs to the antenna and the monitor sensor inputs from the antenna are located on top of the cabinet. The AF or interface connections (e.g. detector signals, local PC, modem, etc.) are located on top of the cabinet and those for the power supply are located on the back panel panel of the BCPS subrack or on a terminal bar in the lower part on the rear side of the cabinet. The cabinet, which has a perforated metal plate at the top and bottom, is self−ventilated (no forced ventilation necessary). The components of the PIN−diode transfer switch are located on a heat sink mounted inside the cabinet at the rear side. The Stby and On−Air Combiner unit (SOAC) is mounted inside the cabinet at the front side. The SOAC can be hinged down for easier access to the backside located RF connections. The alternatively used Power Adder (PAD−S) (PAD−S) in the B−type version is mounted to the rear side, upper part, of the rear door. door.

CAUTION Do not block or seal the holes for the cooling air supply at the bottom of the rack or the cooling air outlet at the top of the rack (transmitter)!

WARNING The heat sinks of the t he modulators (MODPA) may warm up during operation. This is normal and does not have any affect on the functioning of the devices. Avoid touching the heat− sinks when the cabinet door has been opened o pened for any reason. When replacing these subassemblies it is recommended to let them cool down for a while before touching them or take suitable measures (e.g. gloves). The inner borders of the cabinet doors may have a residual flash which may injure hands or fingers. Use the door handles for opening or closing the doors.

Ed. 06.05 01.04

SOAC

2−5

GP 422

ILS 420

Description GP−1F

Equipment Description Power Adder mounted to the rear door (PAD−S) alternatively with B −Type −Type version

CRS

CRS

1 / 1 A P / D O M

LCP

BP MODPA J1

2 / 1 A P / D O M

A P D O M P B

1 R T M X

1 1 A N − Y G S L

1 M − U G C L E

2 M − G L

* m e d o M 2 A − G L

2 N Y S

* m e d o M

SBO CRS CSB

J5

J8

J1 J4

2 G I D D O M

J2

1 G I D D O M

TX1

1J7 J10 2 J13 Jumper1 J16 e e n n J19 1 o o 2 J18 h h GND −15V +15V 5V P P J12

Modem2

l a t i g i D P B

2 R T M X

TX2

J3

C F T N I e c a f r e t n I

J2

XA12

J11

J6

J17J14

−15V +15V 5V −15V +15V 5V

1 m e d o M

6 T R C / W P P NJ9 C I L A M

5 T C / P C L

1 T C / P C L

7 3 G M I O D C / O P M C L

+24V1 1 +24V2

O / I B +48V A C

5V3

J15

BP Digital J10

J12

OUT

IN1

J7

J9

OUT

IN1

J11 J28

IN2 stby CSB

4 5 C C A

4 5 C C A

OUT

J2

IN2

IN2 stby CSB

CRSSBO

CRSCSB

PIN diode Transfer Switch assembly

Stby and On−air Combiner

2 / V M − C C D

J3

J25

stby SBO

J31

CLR CSB and CLR SBO path not used

(includes combining network for GP, GP, not used in L LZ)

1 / V M − C C D

J1

J5 J26

not used J 21

OUT

IN1

J8

IN2

J 20

J6

IN1

J27

stby SBO

J4

T X1 X1 T X2 X2

S P − P B

LVS DCC 5V

BP−PS

F4 F5 Relay

Mains connection and mains filter

Front View

Rear View

* optional

NOTE:

Fig. 2−4

2−6

The diagram shows the locations of the plug−in and screw−on subassemblies (printed circuit boards). The module assignment for GP−1F is shown in greater detail in Fig. 2−5. 2−5.

Locations in the GP−1F rack SOAC

Ed. 06.05 01.04

ILS 420



TYPE of INSTALLATION: GP−1F dual SUBRACK

TYPE of INSTALLATION: GP−2F, dual

Subassembly used

View from left to riright Front door

Cabinet, preassembled

SUBRACK assign. to

LCP

Backplane MODPA, left TX1

Backplane MODPA, right TX2

−

MODPA 2/1

CLR CSB2**

MODPA 1/1

CRSCSB CRSSBO

MODPA 1/1

CSB1 SBO

MODPA 1/2

CRSCSB CRSSBO

MODPA 1/2

CSB1 SBO

−

MODPA 2/2

CLR CSB2**

MON1/2

SYN 1 LG−A 1 LG−M 1 ECU

Cabinet, front

TX1 TX1 TX1 TX1/2

− INTFC SYN 1 LG−A 1 LG−M 1 ECU

MON1/2 TX1 TX1 TX1 TX1/2

LG−M 2 LG−A 2 SYN 2

TX2 TX2 TX2


TX2 TX2 TX2

Modem* Modem*

LGM2 LGM1

Modem* Modem*

LGM2 LGM1

PIN−diode transfer switch

TX1/2


TX1/2

SBO,CSB

SBO,CSB1; CLR ; CSB2

incl. Attenuator/Load (1x)



MON1/2

Cabinet, inner, left


MON1/2

Power Adder PAD−A**

TX1/TX2 TX1/TX2

Cabinet, rear, upper part

Power Adder PAD−S***


Cabinet, lower part, Backplane BP−PS

AC/DC−Converter: ACC /1 ACC /2


DC/DC−Converter: DCC−MV /1 DCC−MV /2

Cabinet, rear, lower part, Backplane BP−PS

assign. to

−

− INTFC

Cabinet, rear

Cabinet, preassembled LCP

− Backplane Digital

Subassembly used

TX1 TX2


TX1 TX2

DC main switch

TX1/TX2

DC main switch

TX1/TX2

Low Voltage Sensor (LVS) and DCC−5

TX1/TX2


TX1/TX2

* optional; Modem= LGM1200MD or LGM28.8 ** GP−2 GP−2F F acti active ve onl onlyy *** GP−2F standard or alternatively alternatively with B−Type B−Type (GP−1F)

Fig. ig. 2−5 2−5 Ed. 06.05 01.04

Assi Assign gnme ment nt of suba subass sse embli mblie es for for GP, dua duall SOAC

2−7

GP 422

ILS 420

Description GP−1F


1

2 3

rear view

front view

1 2 3

Door Door hand handle le,, rea rearr door door Loca Locall Con Contr trol ol Pane Panell (LC (LCP) P) Door Door handl handle e with with key key lock lock,, front front door door

Fig. ig. 2− 2−6

2−8

Trans ansmitte tter rac rackk IL ILS 42 420 (L (LLZ/GP /GP) SOAC

Ed. 01.04

ILS 420



1

2

not assembled in 1F systems

not assembled in 1F systems RF cable directly fed to SOAC not assembled in 1F systems

Power Adder, alternatively with B−Type, not shown

3 not connected in 1F systems

Front

1 2 3

Rear

Loca Locall Cont Contro roll Pan Panel el (LCP) (LCP) PIN− PIN−di diod ode e tra trans nsfe ferr swi switc tch h Stby Stby and and On− On−Ai Airr Combi Combine nerr (SOAC (SOAC))

Fig. Fig. 2−7 2−7 Ed. 01.10 01.04

Trans ransmi mitte tterr rack rack GP− GP−1F 1F,, dual dual,, front front doo doorr open open,, rear rear door door ope open n (exa (examp mple le show shown n 2F) 2F) SOAC

2−9


2−10


SOAC

Ed. 01.04

ILS 420



2.2.2

Shelter

See Fig. 2−8, 2−8, 2−9. 2−9. The Navaids shelter is used as permanent housing for electronic navaids equipment. The standard shelter is a self−supporting transport unit which is especially suited for the whole range of transportation means. It withstands all climatic conditions worldwide and is designed, except for mechanical damages, for a minimum life−cycle of 10 years. The standard shelter meets the ISO/DIN standards/ requirements for transport containers. It consists of a self−supporting, distortion resistant aluminium frame construction with eight ISO corners and standardized container dimensions. The walls are made of sandwich panels and provide plenty of options for installating equipment and accessories. The shelter includes a polyurethane layer that ensures excellent thermal isolation. The floor is covered with an antistatic material which is connected to the system ground to protect maintenance personnel and to avoid electronic equipment damage. The personnel door is in the front. The door has a key lock and can be locked from inside or outside. The inner and outer sides s ides of the shelter are typically painted white (RAL 9002), but, optionally, they can be painted with warning colours as per ICAO Annex 10. The standard shelterincludes a complete electrical installation that can be easily adapted to specific project requirements. The battery box, which is hermetically sealed from the interior in its operating state, is accessible from the inside of the shelter and ventilated from from the outside. Its shelf−type construction provides space for a block of batteries (48 V, 256 Ah max.) for the NAV 400 navaids as well as for collocated equipment. One or two through−the−wall air conditioning units and thermostats provide ventilation. The air conditioning equipment is designed to provide the appropriate environmental conditions for all products installed in the container. One fire extinguisher is provided. Other options are: obstruction lighting, heater, heater, table and chair, book−shelves, or an additional sun roof. The navaids shelter is secured using the ISO corners and twist locks that connect it to four foundation blocks.The roof of the Navaids Shelter is accessible. The container itself is splash−proof, resistant against sea climate and invulnerable to salty water, fungus and termites.

8 3 4 2 Support for A/C

2991

2438 (Dimensions in mm; Tare Tare weight approx. 900 kg)

Fig. 2− 2−8 Ed. 01.04

Navaids sh shelter, di dimensions SOAC

2−11

GP 422

ILS 420

Description GP−1F

Equipment Description cable duct on the ceiling Signal cable (RF/AF)

10 ft Container Shelter

Top connector panel on cabinet

cable entry

Location of NAV 400 racks (GP, LLZ, DME) Battery Box Ventilation of battery box Wiring Diagram of electrical Installation Main Distribution Panel

option box

*

Main Fuse switch

L1 L2 L3

Residual Current Breaker

N

I> FI1

40 0.03 B18A F3

B10A F4

PE

C20A F2

C20A F1

C20A F5

A 2 B

C20A F6

A 0 1 F8 B

F7

A 0 1 F9 B

change o.

Overvoltage Protection 4

3

1

Spare 2 optional

5

6

7

8

9

10

.. optional

d n u o r G n o i t a t S

r a B r o t c e l l o C h t r a E

BCPS E

... . ... . ... .

BCPS TX Rack DME etc.

Inside Inside Light Light 20 protected wires −

M D

−

) A 2 , 0 G ( 1 2 F

+ Signal lines NF 600 OHM

90 V/Type F

Line Terminal Box

A/C1

A/C2

if available

Socket Socket outlet outletss ) A 0 5 K ( 0 2 F

+ − 48 V

DME

TX

θ

Emergency battery 48 V

junction box

set to 36 °C

heater

Temp. Sensor

Air−Conditioner Single Phase "Option"

twilight switch

obstruction lights 1 2

* Example diagram for Mains Supply with 3 Phases, N and PE

Fig. Fig. 2−9 2−9

2−12

Stand Standar ard d shel shelte terr, inne innerr arra arrang ngem emen entt and and elec electr tric ical al inst instal alla lati tion on (ex (exam ampl ple) e) SOAC

Ed. 01.04

ILS 420

GP 422


Transmitter Subassemblies GP−1F

2.3

DESCRIPTION OF SUBASSEMBLIES OF THE TRANSMITTER RACK

2.3.1

General

All plug−i plug−in n or screw−on screw−on subass subassembl emblies ies (prin (printed ted circu circuit it boards) boards) in the the transmi transmitter tter rack rack for for the the GP−1F GP−1F version are described in Section 2.3. 2.3. Because subassemblies of GP−1F are mostly identical to those described with GP−2F, a reference is made to the applicable sections of chapter 3 if there is no major difference in function. Their tasks are described and illustrated with the aid of simplified block diagrams. The integration within the complete system is shown in block diagram Fig. 1−19. 1−19. More details about the subassemblies (printed circuit boards), which may exceed the information given in the following description part and figures, may be taken ta ken from the circuit diagrams listed in Fig. 2−10. 2−10.

2.3.2

Overview Su Subassemblies GP GP−1F Tr Transmitter Ra Rack

SUBAS SEMBLY ASSIGNMENT

CODE NUMBER*)

Transmitter: LLZ/GP Audio Generator Synthesizer Modulator Power Amplifier GP PIN−diode Transfer Switch Power Adder, Adder, alternativ. with B−Type B−Type

(LG−A) (SYN) (MODPA) (PAD−S) (PAD−S)

120570−0004 120496−0002 120589−0001 120622−0001 120609−0001

Monitor: Monitor Interface LLZ/GP Monitor Processor Executive Control Unit Stby and On−Air Combiner

(INTFC) (INTFC) (LG−M) (ECU) (SOAC)

120628−0001 120498−0001 120570−0004 120571−0003 120621−0001

Local/Remote Communication Interface: Local Control Panel Mode Modem, m, dedi dedica cate ted d lin line e / part party y lin line e Modem, switched line

(LCP) (LGM (LGM 120 1200M 0MD) D) (LGM 28.8)

(LVS) (DCC (DCC−5 −5)) (DCC−MV) (ACC−54) (ACC−54)

2.3.3

3.3.3

2.3.3.2 2.3.3.3 2.3.3.4 2.3.3.5 2.3.3.6

3.3.3.2 3.3.3.3 3.3.3.4 3.3.3.5 3.3.3.6.2

2.3.4

3.3.4

2.3.4.1

3.3.4.1

2.3.4.2 2.3.4.3 2.3.4.4

3.3.4.2 3.3.4.3 3.3.4.4

2.3.5

3.3.5

83135 21001/21002 − 84045 83233 − 84045 83245 −

Power Supply: Low Voltage Sensor DC−C DC −Con onve verte rterr 5 V (on (on LVS LVS board board)) DC−Converter Multivolt AC/DC−Converter (12 A) AC/DC−Converter (14 A)

1F RE REFERENCE 2F 2F

83138 − 83138 58341 58341

30511 12400 20101 20102

3.3.5.1 3.3.5.2.1 3.3.5.2.2

2.3.6

3.3.6

− − − − −

3.3.6.2 3.3.6.3 3.3.6.4 3.3.6.5

*) The code numbers given given may differ to those of the delivered installation in individual individual cases. In such case the actual code number can be taken from the delivery list of the installation or the drawing set.

Fig. Fig. 2−1 2−10 0

Ed. 01.10 06.05

Circ Circui uitt diag diagra rams ms of of suba subasse ssemb mbli lies es (tran (transm smit itte terr rack rack))

SOAC

2−13

GP 422 Transmitter Subassemblies GP−1F

2−14


SOAC

Ed. 06.05

ILS 420



2.3.3

Transmitter Subassemblies

2.3.3.1

O v e r vi e w

The GP−1F transmitter section, the function of which is to generate the RF signals and amplify the RF, RF, consists of o f the following subassemblies (single, Fig. 2−11, 2−11, blocks dark grey): − − − − −

Lo Localizer/Glide Path audio generator Synthesizer Mod Modulat ulator or/p /pow owe er amp amplifi lifie er for for carri arrier er (CSB (CSB)) and and side sideba band nd (SBO (SBO)) PIN−di PIN−diode ode transf transfer er switch switch B− B−Type: with additional Power Adder

LG−A SYN MODP MODPA1 A1 PAD−S

The location of the transmitter subassemblies is shown in Fig. 2−4. 2−4. NF dipole (NFM), opt.)

0 reference/B−Type antennas A1, A2**

B−Typ, antennas A1,A2

from probes RF OUT

Shelter/Cabinet

to antenna system 80°

stby RF signal

Phase Shifter

field signals

Power Adder (PAD−S) CSB

RF OUT

SBO

PIN−diode Transfer Switch

GP−1F B−Type alt. Version

TX1

TRANSMITTER 1 Synthesizer 1 SYN

SBO


MODPA 1

CW RF SYN 1/2

SOAC Interface INTFC

TX2

Modulator/ Power Amplifier

CW RF f0

CSB


Inputs analog 2 A P D O M m o r f

CSB

SBO

CW RF f0 offset to SOAC

TRANSMITTER 2

control

Audio Generator 1 LG−A



BITE Integrity signals

Monitor 1 LG−M

Analog IN (spare) SYN data

Monitor 2 LG−M

RS232C RS232C

RS232C RS232C

RS232C

LRCI LC I

* optional ** B−Type with DDM−presetting not 0

Fig. Fig. 2−11 2−11 Ed. 07.06 06.05

LC−CPU

OIO (spare)

MODEM* LCP

Maintenance Data Terminal

MODEM*

RMMC

PTT

GP−1F GP−1F tran transmi smitte tterr, block block diagra diagram m (dual (dual syst system em part partly ly and and powe powerr supply supply not show shown) n) SOAC

2−15

GP 422

ILS 420


2.3.3.2


Localizer/Glide Pa Path Au Audio Ge Generator LG LG−A

The LG−A produces the composite carrier−plus−sideband (CSB) and sideband−only (SBO) modulation envelopes for the CSB/SBO MODPA. The LG−A is described in detail in section 3.3.3.2. 3.3.3.2.

2.3.3.3

Synthesizer (SYN)

For GP−1F, the synthesizer delivers the CW RF of the desired frequency f 0. In addition, a second RF output supplies the Stby and On−Air Combiner (SOAC) with a frequency which is 8 kHz offset to f0. The SYN is described in detail in section 3.3.3.3. 3.3.3.3.

2.3.3.4

Modulator Po Power A Am mplifier (M (MODPA)

The MODPA delivers both the CSB and the SBO power to the antennas. The MODPA is described 3.3.3.4 . in detail in section 3.3.3.4.

2.3.3.5

Transfer Assembly

See Fig. 2−12. 2−12. The RF signals are distributed to the antenna system by means of the discrete PIN−diode transfer switches. The PIN−Diode transfer switches and the attenuators/dummy loads are located on a printed circuit board which is mounted to a heat sink. The complete assembly is mounted at the rear of the cabinet. Components of the RF signals used for monitoring the standby transmitter are coupled out and fed to the Stby and On−Air Combiner (SOAC). The components are: − 4 PIN−diode PIN−diode transfer switches switches (2 not used) including including attenuators/dumm attenuators/dummyy load resistors − PIN−diode PIN−diode bias supply supply (dc in: +24 V; V; dc out: +5 V, V, −120 V) − transfe transferr switch switch drive driverr J10

4

J12

J7

J9

3

J11

J28

J8

J27

J4

J6

2

J1

J3

1

J5

J26

J2

J25 SBO

to antenna system

CSB1

alternatively with B−Type HF OUT

Driver and Bias supply

J31

CSB

rear view

80°

SBO

CSB

CSB

SBO

J3

J6

20 dB/100 W

Antenna changeover PIN−diode switch 1

15 dB/1 W

Phase Shifter

Power Adder (PAD−S) SBO

not used

not used J9

RF Stby 20 dB/100 W 10 dB/1 W

J12

10 dB/1 W 20 dB/100 W

15 dB/1 W 20 dB/100 W




−120 VDC J1

CSB/ CSB/TX TX1 1

J2

J4

CSB/ CSB/TX TX2 2

+5 VDC

J5

J7

SBO/TX1 SBO/TX2

not used

J8

not used

J10

not used

J11

not used

changeover signals

PIN−diode PIN−diode switch driver bias supply 24 VDC

J31 Control

J26

J25

J28

Transfer assembly rear of cabinet

J27

DC

Stby and On−Air Combiner J21

ECU

Fig. Fig. 2−12 2−12

2−16

J20

24V1/24V2 to INTFC and monitor

Trans ransfe ferr Asse Assemb mbly ly,, bloc blockk diag diagra ram m SOAC

Ed. 06.05

ILS 420



The function of the various components is to switch the antenna system over to transmitter 1 or 2. The signals of the transmitter which is currently switched to the antenna by the PIN−diode transfer switch 1 to 2 each pass through to the antenna system. The changeover signals received from the Executive Control Unit (ECU) control the PIN−diode switches 1 to 2. The CSB/SBO signals of the standby transmitter, which is active, but not switched to the antenna, are passed through to the Stby and SOAC by RF attenuators which are also used as dummy loads. The PIN−diode transfer switch is supplied with two DC voltages (+5 V/2.5 A; −120 V/0.03 A) which are derived from the 24 V DC input in the bias supply part. This voltage coming from both DCC−MV is ored at the SOAC. The location of the PIN−diode transfer switch assembly is shown in Fig. 2−4. 2−4.

2.3.3.6

B−Type: Po Power Ad Adder (P (PAD−S)

The signal characteristic for the GP−1F B−Type can be generated either in a similar way to the GP−2F active with adjustment of the modulators (DDM unequal 0) or with the use of a Power Adder. With this alternative the same PAD−S is used as for the GP−2F standard version but with another suitable wiring (Fig. 2−13). 2−13). The PAD−S PAD−S is described in detail in section 3.3.3.6.2 . The location of the Power Adder for the B−Type B−Type is shown in Fig. 2−4. 2−4. swivel nut adjustable part position indication

to J1, cabinet top (A2) to J8, cabinet top (A1) Z3 upper antenna

J1

y a l e D

W26

Phase shifter

J2

° 5 3

° 0

° 5 3

y a l e D

PAD−S, GP−1F, B−Type cabinet, rear view

W21

J6 UPPER UPPER ANT ANTEN ENNA NA

J5

J4

LOWER LOWER ANTEN ANTENNA NA

MIDDLE ANTENNA

W23

THALES 120609−0001

PAD−S

J3

J2

CLE ARANCE

from J6, PIN diode transfer switch

W18

from J3, PIN diode transfer switch

W17

J1

CSB W17 PIN−diode Transfer switch

Load

SBO

W18

J2

Ed. 06.05

COURSE CSB

INPUT

INPUT

NOTE: The A1 signal path is 180° longer than the A2 signal path

J4 Load

CSB+SBO,LSB

J5

W21

J3 J6

W23

Fig. Fig. 2−13 2−13

COURSE SBO

INPUT

PAD−S

J1

80° −cable 932839−0002 f

Z3

adjustable Phase shifter

SBO,USB

W26

A1 lower A2 upper

to antenna system

GP−1F GP−1F,, B−T B−Type ype,, over overvie view w and and arrang arrangeme ement nt Powe Powerr Adde Adderr PAD− PAD−S S SOAC

2−17


2−18


SOAC

Ed. 06.05

ILS 420

GP 422 Monitor Subassemblies GP−1F


2.3.4

Monitor Subassemblies

The monitor section monitors the radiated signal and detects any errors or faults that might be critical for aviation. In addition to executive tasks, the monitor data can be used to identify any deviations or minor deficiencies in performance at an early stage, insofar as they might have a detrimental effect on the future continuity of service or system availability (warning monitor). The response to an alarm is a logic−controlled changeover or disconnection of the transmitters performed by the Executive Control Unit (ECU). The monitor subassemblies thus comprise (Fig. 2−14, 2−14, blocks dark grey): − Monitor Interface (INTFC) − Monitor signal processor processor (LG−M) − Executive Control Unit (EC U ) − Stby and On−Air Combiner (SOAC) The location of the monitor subassemblies is shown in Fig. 2−4. 2−4. NF dipole (NFM), opt.)

0 reference/B−Type antennas A1, A2 from probes to antenna system

Shelter/Cabinet

RF OUT

stby RF signal

CSB

field signals

SBO



CW RF SYN 1/2


TRANSMITTER 1


CW RF f0

Synthesizer 1 SYN

MODPA 1

Inputs analog 2 A P D O M m o r f

CSB

SBO

CW RF f0 offset to SOAC

TRANSMITTER 2

control





Monitor 1 LG−M


Monitor 2 LG−M

RS232C RS232C

RS232C RS232C

RS232C

LRCI LC I

OIO (spare)

* optional

Fig. Fig. 2−14 2−14 Ed. 07.06 06.05

LC−CPU

MODEM* LCP


MODEM*

RMMC

PTT


2−19

GP 422

ILS 420

Monitor Subassemblies GP−1F

2.3.4.1



The Monitor Interface (INTFC) is the signal interface for all configurations of localizer and glide path facilities. It provides the necessary interface between the electronics subsystem and the system’s integral and field detectors. The INTFC is described in detail in section 3.3.4.1.

2.3.4.2

Localizer/Glide Path Monitor (LG−M)

Signals transmitted from a localizer or glide path station must be constantly validated to ensure safe landings. For this purpose, the LG−M can be seen as a high precision audio frequency spectrum analyzer which continually measures and analyzes these signals, comparing their current values to stored alarm limits. If a measured parameter is not within limits, the monitor signals an alarm condition. The monitored parameters are evaluated for the on−antenna executive and field groups and the "hot" Standby group. The LG−M is described in detail in section 3.3.4.2. 3.3.4.2.

2.3.4.3

Executive Control Unit (ECU)

The Executive Control Unit (ECU) is responsible for performing all the control actions of the station (e.g. transfer, shutdown, bypass, etc.). Each Monitor reports its alarm status(es) to the ECU which then decides what type of action, if any, to take based upon that status and other internal state information. The ECU is described in detail in section 3.3.4.3. 3.3.4.3.

2.3.4.4

Stby and On−Air Combiner (SOAC)

See Fig. 2−15, 2−15, 2−17. 2−17. The Stby and On−Air Combiner (SOAC) unit processes the ILS monitor signals both for Localizer and Glide Path. For the Glid Glide e Path, it contains the function of an integral network which combines the input antenna sensor signals to farfield equivalent signals for position and width. The clearance path is not used in 1F installations. The SOAC operates in principal with a down−conversion technique which results in 8 kHz intermediate signals for further processing. The local oszillator offset frequency of 8 kHz is directly supplied by the Synthesizer. The SOAC is described in detail in section 3.3.4.4. 3.3.4.4. * also LLZ with LPD−antenna ** with LLZ and Dipole/Reflect. antenna

Antenna system Integral Network (LLZ)** Integral Sensors (GP)

Posn./CRS GP only* Integral Network Path

Posn./CRS

GP A1/LLZ CRS Posn. GP A2/LLZ Width not used

On−Air down converter combiner

Offset frequency (CRS L.O.)

SYN TX2 (8 kHz offset)

Transfer control from ECU

DC

Stby CRS SBO/GP A2


Fig. Fig. 2−15 2−15

2−20

Posn./CRS

Stby CRS CSB/GP A1 RF Stby

Width not used

Course frequency (CLR L.O.) not used in 1F system

DC supply in

RF aerial

via INTFC to LG−M 1/2

NFM output

NFM Input

SYN TX1 (8 kHz offset)

Width

not used

Standby down converter combiner

Width


not used

not used

Stby Stby and and On− On−Ai Airr Comb Combin iner er (SO (SOAC AC), ), blo block ck dia diagr gram am SOAC

Ed. 06.05

ILS 420



2.3.4.4.1 2.3.4.4.1

Operation of a typical Down Conversion Channel (On−air)

The signal flow within the SOAC for Null Reference and B−Type is shown in Figs. 2−18 and 2−19. 2−19. For details refer to section 3.3.4.4.1 . The CLR channel paths are not used. Jumper J1 and J6 are set to 1−3, 2−4 to insert a voltage divider because the mixer frequency is directly fed from SYN1 and SYN2 (CLR out) and not via a MODPA.

2.3.4.4.2 2.3.4.4.2

Standby Channels

The signal flow within the SOAC for Null Reference and B−Type is shown in Figs. 2−18 and 2−19. 2−19. For details refer to section 3.3.4.4.2 . The CLR channel paths are not used.

2.3.4.4.3 2.3.4.4.3

Antenna Configuration Signal Processing Selection

NOTE:

In GP−1F applications, input J7 "A3" "A3" is used as input for sensor signals of antenna antenna A2, i.e. upper antenna. Input J8 "A2" is used only in GP−2F M−Type systems ! The configuration setting for the GP−1F Null Reference and B−Type B−Type version is shown in Fig. 2−16. 2−16. For details refer to section 3.3.4.4.3 . J19/7−8

Null reference:

Switch Path A Path B

J19/5−6

Sideband reference (B−Type): (B−Type):

1 2 3 4 5 6 7 8 x x x x x x x x


1 2 3 4 5 6 7 8 x x x x x x x x

Fig. Fig. 2−16 2−16

J19, J19, exam example ple switch switch setting setting for GP−1F GP−1F Null refere reference nce and B−Type B−Type mode mode

2.3.4.4.4 2.3.4.4.4

Local Oscillator Switching and Distribution

The necessary offset of 8 kHz for the down conversion to the nominal frequency is derived from the second output of the synthesizer board. For details refer to section 3.3.4.4.4 . RF connectors rear: GP Nearfield A1 LLZ

A2*

Nearfield CRS Posn..

J10

CRS Stby CRS Stby CRS Stby A1 CSB1 CSB A2* SBO A3

A3 (A2) CRS Width

J9

J8

CRS Stby CSB

J7

CRS Stby SBO

J2

J47

J17

RFcwCLR TX2

R90

R62

R240

R166

J13

TP70

R150

R133

R327

R318

R305

R353

R345

TP68

R499

R312

R343

R146

1 7 P T

R524

J19

RFcwCRS TX1

J15

JP41

R136

R217

R286

TP69

RFcwCLR TX1

R123

J12

RFcwCRS TX2

R511 R25

J5

R189 R383 R372 R386 R185 R379

J11

R275

R382

J16 J14

TP67

R43

J3

CLR Stby CLR Stby SBO CSB

J18

R485

R2

R105

CLR Width(2) CLR Width(1)

J6

J4 J1

CLR Stby

12

R377 TP62 TP65

TP59 GND

TP66

TP60

TP63

TP61

TP64

TP18

TP15

TP14

TP17

TP13 TP16

TP10

TP11

TP7

TP12

TP6

TP2

TP9 TP8 TP3 T P7 P7 4 T P7 P7 6 T P7 P7 2

TP1

TP5

TP24

JP43

TP4

TP56

TP57

J20 TP41 TP77 TP75 TP73 TP51

TP58 GND TP30

TP55

TP29 TP26

TP53 TP47 TP49 TP37

TP25 TP27

J21

TP22 T P3 P31

TP 21 21

TP19

TP23

TP20

TP39 TP34

Front View

* used in G P−2F, P−2F, M−Type, only; for GP−1F: A3 = upper antenna, here A2

Fig. Fig. 2−17 2−17 Ed. 07.08 06.05

Stby Stby and and On− On−Ai Airr Com Combi bine nerr (SO (SOAC AC), ), fron frontt vie view w SOAC

2−21


2−24


SOAC

Ed. 07.08 06.05

ILS 420

GP 422 LRCI and Power Supply Subassemblies


2.3.5

LRCI Subassemblies

The local remote communication interface functional unit (LRCI) is the focal point for communication between the various functional fu nctional groups, the local control panel (LCP) and the remote remote control. The LRCI LRCI consists of the following subassemblies: − Local Control Panel − Modem for dedicated line − Modem for switched line

(LCP) (LGM1200MD, Pa Party Line) (LGM 28.8)

The LRCI subassemblies are described in detail in section 3.3.5. 3.3.5. The location of the LRCI subassemblies is shown in Fig. 2−4. 2−4.

2.3.6

Power Supply

The power supply of the Navaids 400 installation is taken from mains (nom. 115 to 230 VAC) or from an existing DC power supply (nom. 48 V). The equipment contains therefore a mains module with battery charger (BCPS). The BCPS is modular in a building−block concept with several AC/DC converter ACC−54 connected in parallel, and several DC/DC converters to generate the necessary voltages. ages . A low voltage sensor cuts off the battery line to prevent deep deep discharge of the emergency emergency batteries.The power supply subassemblies are described in detail in section 3.3.6. 3.3.6. The location of the AC/DC and DC/DC converters is shown in Fig. 2−4. 2−4.

Ed. 01.04

SOAC

2−25

GP 422 LRCI and Power Supply Subassemblies

2−26


SOAC

Ed. 01.04

ILS 420



CHAPTER 3 TECHNICAL DESCRIPTION GP−2F 3.1

GENERAL

3.1.1

System Overview

See Fig. 3−1 to 3−5. 3−5. The ILS GP−2F installation comprises the following main components and accessories: − Transmitter rack housing the transmitter, transmitter, monitor and power supply/battery charging (BCPS), single or dual − Emergency Emergency power power supply supply (48 V lead batter battery) y) These components are housed in a building or shelter. Since there is possibility of generated oxyhydrogen, the battery is separately housed. − Antenna system system (refer (refer to Part Part 3, Antenna System System Description) Description) The GP antenna is installed approximately 286 to 344 m beyond the runway threshold and 120 to 180 m from the runway centre line (see Fig. 1−2). 1−2). The GP transmitter building (shelter) is installed in the vicinity of the GS antenna. − Cab Cable set set − Grou Ground ndin ing g The antenna system (including optional nearfield dipole) and the transmitter rack are connected via 7 coaxial cables. The cables are fed via connectors on top of the transmitter rack on the one hand to the Power Adder and the PIN diode transfer switch (3x RF out) and on the other hand to the Stby and On−Air Combiner unit (4x RF in) which combines the signal components, which are obtained via the coupling probes integrated in each antenna array. The Stby and On−Air Combiner supplies the resulting signals and the signal of the optional nearfield monitor at the antenna site to the monitors: − − − −

Course Course position position Course Course width width Cleara Clearance nce Position Position Nearfield Nearfield

(POSN. (POSN.)) (WIDTH) (WIDTH) (CLEAR. (CLEAR.)) (POSN. NF, NF, optional) optional)

A grounding grounding network network must be installe installed d around around the transmitter transmitter building building (shelter (shelter)) which which does does not afford afford special symmetrical requirements. The grounding networks of shelter and antenna system must be connected by low resistance. The GP transmitter can be controlled, monitored and maintained from the tower with a respective remote control and monitoring system (e.g. RMMC).

Ed. 01.04

SOAC

3−1

GP 422

ILS 420

Description GP−2F

3.1.2


Basic Components of an GP Transmitter Ra Rack

The main components of a GP transmitter rack are as follows (see Fig. 3−3): 3−3): − − − − −

Transm ransmitt itter er Monitor Monitoring ing System System (monit (monitor) or) Control Control and Switchi Switching ng Local/Remote Local/Remote Communication Communication Interface Interface (LRCI) Operat Operating ing voltag voltage e supply supply

3.1.2.1

Transmitter

The dualized transmitter generates the required RF signals for this type of installation. These signals are fed to and radiated from the antenna system. Signal generation and transmitter control are microprocessor controlled. A single transmitter configuration is also available.

3.1.2.2

Monitor

The dualized monitor is supplied with signals from the internal and integral sensors and with informations obtained from the t he radiated RF field via an optional nearfield and/or farfield monitor dipole. The RF signals obtained are down converted by the Stby and On−Air O n−Air Combiner to an Intermediate Frequency carrier and fed via an interface to the monitor signal processor for processing. A single monitor configuration is also available.

3.1.2.3


The results of the monitor process are supplied to the control and switching function. These functions will switch−over (in a dual system) or shutdown transmitters if the hardware based decision paths find an appropriate result. Also, the other control functions are performed here.

3.1.2.4


The LRCI is the focal point for internal/external communication between the transmitter and the monitor, tor, the local or o r remote operator and the system, including any connected subsystems. All communication with the system takes place via a local or remote intelligent terminal (PC or laptop), which is used for all settings, commissioning and maintenance. The MAIN STATUS STATUS indication, basic settings (on/off, change over, Mon. Bypass) and call up of certain transmitter or monitor measurement data are performed with the Local Control Interface (LCI) of the Local Control Panel (LCP).

3.1.2.5

Generation of the Operating Voltage

The transmitter rack requires a nominal supply voltage of 48 V. V. The mains module (ACC) of the BCPS BC PS supplies an output DC voltage of 54 V and 14 A max. Two Two of the modules are connected in parallel depending on the power requirement of the navigation system. The value of 54 V is derived from the trickle charge voltage for a 48 V lead battery. The DC/DC converters housed in the BCPS subrack act as switched−mode regulators, which supply the necessary supply voltages with wit h a high efficiency, namely : − DC/DC converter DCC−MV

+5 V/3 A; +15 V/2.5 A; −15 V/1.5 A; +24 V/11 A

− DC/DC converte converterr DCC−5 (on Backpanel Backpanel)) +5 V/3 V/3 A, used used to supply separately separately LCP LCP, Modems Modems

3−2

SOAC

Ed. 07.08 01.04

ILS 420


Equipment Description A3 SBO A3 +Clear.

12 11 A2

CSB A2

10 9 A1

CSB A1 +Clear.

8 7

6

GP−shelter 5

4

Tower

3

13

1 2 3 4

Power ower add adder er GP− GP−2F 2F act activ ive e Emer Emerge genc ncyy powe powerr supp supply ly bat batte tery ry ILS/ ILS/GP GP tran transm smit itte terr rack rack Stby Stby and and On−A On−Air ir Com Combi bine nerr

Fig. ig. 3−1

1

5 6 7 8 9

Reflecting are area Near Nearfi fiel eld d Monit Monitor or dip dipol ole e (opt. (opt.)) Indu Induct ctiv ive e cou coupl plin ing g pro probe be A1 Dipo Dipole le ant anten enna na arra arrayy A1 A1 Indu Induct ctiv ive e cou coupl plin ing g pro probe be A2

10 11 12 13

2

Dipo Dipole le ant anten enna na arr array ay A2 A2 Induct Inductive ive coupli coupling ng probe probe A3 Dipo Dipole le ant anten enna na arr array ay A3 A3 Remote Remote Cont Control rol and and Monitor Monitoring ing Syste System m

GP−2F sys system tem overview (GP acti activve) A3 SBO+Clear.

12 11 A2

CSB1+SBO

10 9 A1

8 7

6

CSB1+SBO+Clear.

GP−shelter 5

4

Tower

3

13

1 2 3 4

Powe Powerr add adder er GP−2 GP−2F F sta stand ndar ard d Emer Emerge genc ncyy powe powerr supp supply ly bat batte tery ry ILS/ ILS/GP GP tran transm smit itte terr rack rack Stby Stby and and On−A On−Air ir Com Combi bine nerr

Fig. ig. 3−2 3−2 Ed. 10.04 01.04

1

5 6 7 8 9

Reflecting are area Near Nearfi fiel eld d Monit Monitor or dip dipol ole e (opt. (opt.)) Indu Induct ctiv ive e cou coupl plin ing g pro probe be A1 Dipo Dipole le ant anten enna na arra arrayy A1 A1 Indu Induct ctiv ive e cou coupl plin ing g pro probe be A2

10 11 12 13

2

Dipo Dipole le ant anten enna na arr array ay A2 A2 Induct Inductive ive coupli coupling ng probe probe A3 Dipo Dipole le ant anten enna na arr array ay A3 A3 Remote Remote Cont Control rol and and Monitor Monitoring ing Syste System m

GP−2F sy system tem ov overview (G (GP st standa ndard) SOAC

3−3

GP 422

ILS 420

Description GP−2F

Equipment Description Antenna system A2

A1 CSB−A1/Clear.

CSB−A2


A3 SBO−A3/Clear. A1

A2

A3

POSN.NF

Power Adder CSB1

SBO

CLEAR.

CSB2

4 Stby and On−Air Combiner

Aerial/Stdby

Course and Clearance Transmitter


RS 232

Monitor RS 232


RMMC

Interface

RS 232


DC−Converter Supply voltage

Mains

NOTE:

Fig. Fig. 3−3 3−3

Transmitter rack

ACC (BCPS) (BCPS)


Main Main com compo pone nent ntss of of a GP− GP−2F 2F tran transm smit itte terr cab cabin inet et (GP (GP act activ ive) e) Antenna system A2

A1 CSB+SBO+Clear.

CSB1+SBO


A3 SBO+Clear A1

A2

A3

POSN.NF

Power Adder CSB1

SBO

CLEAR.

4 Stby and On−Air Combiner

Aerial/Stdby

Course and Clearance Transmitter


RS 232

Monitor RS 232


RMMC

Interface

RS 232


DC−Converter Mains

Supply voltage

NOTE:

Fig. Fig. 3−4 3−4

3−4

ACC (BCPS) (BCPS)

Transmitter rack


Main Main com compo pone nent ntss of a GP− GP−2F 2F tran transm smit itte terr cab cabin inet et (GP (GP stan standa dard rd)) SOAC

Ed. 10.04 01.04

ILS 420


Equipment Description PIN−diode transfer switch 24 V

SOAC

XMTR 1

MON1

LRCI/INTFC/ECU

MON 2**

5 V/±15 V

24 V

XMTR 2**

5 V/±15 V

24 V

LCP/Modem L/G−A

5 V/±15 V

+24 V +5 V +15 V

5V

48 V

−15 V +15 V

−15 V

DCC−MV /1

+5 V

+5 V +24 V

DCC−5

DCC−MV /2 **

F4

TX1

TX2**

Low Voltage Sense sense

relay


F5

Mains module 1

Mains module 2

Battery

shunt


Fig. ig. 3− 3−5

Ed. 01.04

Mains (115 VAC to 230 VAC)

BCPS subrack ** dual Version

Power dis distr trib ibut utio ion, n, block dia diag gram

SOAC

3−5


3−6


SOAC

Ed. 01.04

ILS 420



3.2

MECHANICAL DESIGN

3.2.1

GP Transmitter Rack

See Fig. 3−6 to 3−9. 3−9. The cabinet is made of sheet steel. It accommodates three standard 19" subassembly carriers (subrack). The subracks are assembled with plug−in units which are designed as double or single Euroform printed circuit boards (PCB) with dimensions of 233.4 x 200 [mm] or 100 x160 or 100 x 220 [mm]. The printed circuit boards are interconnected in each subrack on a motherboard back panel. The subracks themselves are connected together via flat ribbon cables with plug−in connectors or via plug− in or screw−on coaxial coa xial cables (used for RF connections) at the t he rear. rear. The front of the cabinet is hidden by a front door which can be key locked and swung open by a door handle. The local control and indication panel (LCP) is flush−mounted in the front door. The cabinet rear is closed by a rear door which can also be swung open by a door handle. The installed equipment should have enough room between the cabinet and the shelter wall to allow the rear door to be opened and to allow space for measuring equipment. The RF outputs to the antenna and the monitor sensor inputs from the antenna are located on top of the cabinet. The AF or interface connections (e.g. detector signals, local PC, modem, etc.) are located on top of the cabinet and those for the power supply are located on the back panel panel of the BCPS subrack or on a terminal bar in the lower part on the rear side of the cabinet. The cabinet, which has a perforated metal plate at the top and bottom, is self−ventilated (no forced ventilation necessary). The components of the PIN−diode transfer switch are located on a heat sink mounted inside the cabinet at the rear side. The Stby and On−Air Combiner unit (SOAC) is mounted inside the cabinet at the front side. The SOAC can be hinged down for easier access to the backside located RF connections. The power adder for GP−2F active is mounted to the left inner side wall, the one of the standard GP−2F to the rear side, s ide, upper part, or to the rear door.

CAUTION Do not block or seal the holes for the cooling air supply at the bottom of the rack or the cooling air outlet at the top of the rack (transmitter)!

WARNING The heat sinks of the t he modulators (MODPA) may warm up during operation. This is normal and does not have any affect on the functioning of the devices. Avoid touching the heat− sinks when the cabinet door has been opened o pened for any reason. When replacing these subassemblies it is recommended to let them cool down for a while before touching them or take suitable measures (e.g. gloves). The inner borders of the cabinet doors may have a residual flash which may injure hands or fingers. Use the door handles for opening or closing the doors.

Ed. 01.04

SOAC

3−7

GP 422

ILS 420

Description GP−2F

Equipment Description Power Adder mounted to rear door*** PAD−S incl. phase shifter or PAD−A

connection not used in GP−2F standard PAD−S GP−2F standard or PAD−A (altern.)***

CLR

LCP

1 / 2 A P / D O M

CRS

CRS

1 / 1 A P / D O M

CLR

2 / 1 A P / D O M

BP MODPA J1

2 / 2 A P / D O M

A P D O M P B

J2 1 R T M X

2 R T M X

CSB2**

SBO CRS CSB

TX2 CLR

1 1 A N − Y G S L

1 M − U G C L E

2 M − G L

* m e d o M 2 A − G L

2 N Y S

* m e d o M

J5

J8

Modem2

l a t i g i D P B

J1 J4

2 G I D D O M

J2

1 G I D D O M

CLR

1J7 J10 2 J13 Jumper1 J16 e e n n J19 1 o o 2 J18 h h GND −15V +15V 5V P P J12

J3

C F T N I e c a f r e t n I

CSB2** TX1

XA12

J11

J6

J17J14

−15V +15V 5V −15V +15V 5V

1 m e d o M

6 T R C / W P P NJ9 C I L A M

5 T C / P C L

1 T C / P C L

7 3 G M I O D C / O P M C L

+24V1 1 +24V2

O / I B +48V A C

5V3

J15

BP Digital J10

J12

OUT

IN1

J7

J9

OUT

IN1

IN2 stby CSB

J31 CSB2**

J 21

J1

J3

OUT

J5

J2

J26

IN2

J 20

OUT

IN1

J8 J27

stby SBO

J6

IN1

J11 J28

J4

J25 IN2

IN2

stby SBO

CLR

stby CSB

CRSSBO

CRSCSB

PIN diode Transfer Switch assembly

Stby and On−air Combiner (includes combining network for GP, GP, not used in L LZ)

Power Adder** PAD−A alternative mounting

Power Adder** PAD−A alternative mounting

4 5 C C A

4 5 C C A

1 / V M − C C D

2 / V M − C C D

T X1 X1 T X2 X2

S P − P B

LVS

BP−PS

F4 F5

DCC 5V

Relay

Mains connection and mains filter

Front View Remark: The RFcw connections of CRS and CLR frequency from J7 or J6 at the Synthesizer to the CRS and CLR MODPA may be interchanged. But in one cabinet both TX must be connected the same.

NOTE:

Fig. 3−6

3−8

Rear View * optional

** GP−2F active only *** GP−2F standard

The diagram shows the locations of the plug−in and screw−on subassemblies (printed circuit boards). The module assignment for GP−2F is shown in greater detail in Fig. 3−7. 3−7.

Locations in the GP−2F rack SOAC

Ed. 06.05 01.04

ILS 420



TYPE of INSTALLATION: INSTALLATION: GP−2F, GP−2F, dual

TYPE of INSTALLATION: GP−1F dual SUBRACK

Subassembly used

View from left to riright Front door


SUBRACK assign. to

LCP

Backplane MODPA, left TX1

Backplane MODPA, right TX2

−

LCP CLR CSB2**

MODPA 1/1

CRSCSB CRSSBO

MODPA 1/1

CSB1 SBO

MODPA 1/2

CRSCSB CRSSBO

MODPA 1/2

CSB1 SBO

−

MODPA 2/2

CLR CSB2**

SYN 1 LG−A 1 LG−M 1 ECU

Cabinet, front


− INTFC SYN 1 LG−A 1 LG−M 1 ECU



TX2 TX2 TX2


TX2 TX2 TX2

Modem* Modem*

LGM2 LGM1

Modem* Modem*

LGM2 LGM1


TX1/2


TX1/2

SBO,CSB

SBO,CSB1; CLR ; CSB2




MON1/2

Cabinet, inner, left


MON1/2

Power Adder PAD−A**

TX1/TX2 TX1/TX2

Cabinet, rear door

Power Adder (B−Type)


Cabinet, lower part, Backplane BP−PS




Cabinet, rear, lower part, Backplane BP−PS

assign. to

MODPA 2/1

− INTFC

Cabinet, rear


−

− Backplane Digital

Subassembly used

TX1 TX2


TX1 TX2

DC main switch

TX1/TX2

DC main switch

TX1/TX2


TX1/TX2


TX1/TX2

* optional; Modem= LGM1200MD or LGM28.8 ** GP−2F active only, only, can be also loacated on the the rear door like the the PAD−S PAD−S *** GP−2F standa standard rd

Fig. ig. 3−7 3−7 Ed. 06.05 01.04

Assi Assign gnme ment nt of suba subass sse embli mblie es for for GP, dua duall SOAC

3−9

GP 422

ILS 420

Description GP−2F


1

2 3

rear view

front view

1 2 3

Door Door hand handle le,, rea rearr door door Loca Locall Con Contr trol ol Pane Panell (LC (LCP) P) Door Door handl handle e with with key key lock lock,, front front door door

Fig. ig. 3−8

3−10

Trans ansmitte tter rack ILS 420 (LLZ/GP) SOAC

Ed. 01.04

ILS 420



1

2

3

connection not used in GP−2F standard

4

3a

Front 1 2 3 3a 4

Rear

Loca Locall Cont Contro roll Pan Panel el (LCP) (LCP) PIN− PIN−di diod ode e tra trans nsfe ferr swi switc tch h Power Adder Adder PAD−A PAD−A incl. incl. opt. opt. phase phase shifter shifter (or PAD−S PAD−S with with phase phase shifter shifter for GP−2F GP−2F standard) standard) Power Adder Adder PAD−A, PAD−A, alternat alternative ive mounting mounting inside inside Stby Stby and and On− On−Ai Airr Combi Combine nerr (SOAC (SOAC))

Fig. Fig. 3−9 3−9 Ed. 06.05 01.04

Transmi ransmitte tterr rack rack GP−2 GP−2F F activ active, e, dual dual,, front front door door ope open, n, rea rearr door door open open (examp (example le view) view) SOAC

3−11


3−12


SOAC

Ed. 01.04

ILS 420



3.2.2

Shelter

See Fig. 3−10, 3−10, 3−11. 3−11. The Navaids shelter is used as permanent housing for electronic navaids equipment. The standard shelter is a self−supporting transport unit which is especially suited for the whole range of transportation means. It withstands all climatic conditions worldwide and is designed, except for mechanical damages, for a minimum life−cycle of 10 years. The standard shelter meets the ISO/DIN standards/ requirements for transport containers. It consists of a self−supporting, distortion resistant aluminium frame construction with eight ISO corners and standardized container dimensions. The walls are made of sandwich panels and provide plenty of options for installating equipment and accessories. The shelter includes a polyurethane layer that ensures excellent thermal isolation. The floor is covered with an antistatic material which is connected to the system ground to protect maintenance personnel and to avoid electronic equipment damage. The personnel door is in the front. The door has a key lock and can be locked from inside or outside. The inner and outer sides s ides of the shelter are typically painted white (RAL 9002), but, optionally, they can be painted with warning colours as per ICAO Annex 10. The standard shelterincludes a complete electrical installation that can be easily adapted to specific project requirements. The battery box, which is hermetically sealed from the interior in its operating state, is accessible from the inside of the shelter and ventilated from from the outside. Its shelf−type construction provides space for a block of batteries (48 V, 256 Ah max.) for the NAV 400 navaids as well as for collocated equipment. One or two through−the−wall air conditioning units and thermostats provide ventilation. The air conditioning equipment is designed to provide the appropriate environmental conditions for all products installed in the container. One fire extinguisher is provided. Other options are: obstruction lighting, heater, heater, table and chair, book−shelves, or an additional sun roof. The navaids shelter is secured using the ISO corners and twist locks that connect it to four foundation blocks.The roof of the Navaids Shelter is accessible. The container itself is splash−proof, resistant against sea climate and invulnerable to salty water, fungus and termites.

8 3 4 2 Support for A/C

2991

2438 (Dimensions in mm; Tare Tare weight approx. 900 kg)

Fig. ig. 3−10 3−10 Ed. 01.04

Nava Navaid idss she shelt lter er,, dim dime ensio nsions ns SOAC

3−13

GP 422

ILS 420

Description GP−2F

Equipment Description cable duct on the ceiling Signal cable (RF/AF)

10 ft Container Shelter

Top connector panel on cabinet

cable entry

Location of NAV 400 racks (GP, (GP, LLZ, LLZ , DME, CVOR, DVOR) DVOR ) Battery Box Ventilation of battery box Wiring Diagram of electrical Installation Main Distribution Panel

option box

*

Main Fuse switch

L1 L2 L3

Residual Current Breaker

N

I> FI1

40 0.03 B18A F3

B10A F4

PE

C20A F2

C20A F1

C20A F5

A 2 B

C20A F6

A 0 1 F8 B

F7

A 0 1 F9 B

change o.

Overvoltage Protection 4

3

1

Spare 2 optional

5

6

7

8

9

10

.. optional

d n u o r G n o i t a t S

r a B r o t c e l l o C h t r a E

BCPS E

... . ... . ... .

BCPS TX Rack DME etc.

Inside Inside Light Light 20 protected wires −

M D

−

) A 2 . 0 G ( 1 2 F

+ Signal lines NF 600 OHM

90 V/Type F

Line Terminal Box

A/C1

A/C2

if available

Socket Socket outlet outletss ) A 0 5 K ( 0 2 F

+ − 48 V

DME

TX

θ

Emergency battery 48 V

junction box

set to 36 °C

heater

Temp. Sensor

Air−Conditioner Single Phase "Option"

twilight switch

obstruction lights 1 2

* Example diagram for Mains Supply with 3 Phases, N and PE

Fig. Fig. 3−11 3−11

3−14

Standa Standard rd shelte shelterr, inner inner arrang arrangeme ement nt and and electr electrica icall instal installat lation ion (examp (example) le) SOAC

Ed. 01.04

ILS 420

GP 422



3.3

DESCRIPTION OF SUBASSEMBLIES OF THE TRANSMITTER RACK

3.3.1

General

All plug−i plug−in n or screw−on screw−on subassemb subassemblies lies (printed (printed circuit circuit boards) boards) in in the the transm transmitter itter rack for the GP−2F versions are described in Section 3.3. 3.3. Their tasks are described and illustrated with the aid of simplified block diagrams. The integration within the complete system is shown in block diagram Fig. 1−20. 1−20. More details about the subassemblies (printed circuit boards), which may exceed the information given in the following description part and figures, may be taken from the circuit diagrams listed in Fig. 3−12. 3−12. The following sections describe first the subassemblies of the GP−2F "active" version. Because subassemblies of the "standard" GP−2F version are mostly identical, the differences in description are highlighted in the correspondent section.

3.3.2

Overview Su Subassemblies GP GP−2F Tr Transmitter Ra Rack

SUBAS SEMBLY ASSIGNMENT

CODE NUMBER*)

Transmitter:

REFERENCE

3.3.3

LLZ/GP Audio Generator Synthesizer Modulato ator Power Amplifier GP PIN−diode Transfer Switch Power Adder (options) Power wer Adder (GP−2F active) Power Power Add Adder er (GP−2F (GP−2F standar standard) d)

(LG−A) (SYN) (MODPA)

120570−0004 120496−0002 120589−0001 120622−0001

(PAD−A) (PAD− (PAD−S) S)

120634−0001 120609−0001

Monitor:

3.3.3.2 3.3.3.3 3.3.3.4 3.3.3.5 3.3.3.6 3.3.3.6.1 3.3.3.6.2 3.3.4

Monitor Interface LLZ/GP Monitor Processor Executive Control Unit Stby and On−Air Combiner

(INTFC) (INTFC) (LG−M) (ECU) (SOAC)

120628−0001 120498−0001 120570−0004 120571−0003 120621−0001

Local/Remote Communication Interface: Local Control Panel (LCP) Modem, dedicated dedicated line / party party line line (LGM1200M (LGM1200MD) D) Modem, switched line (LGM28.8)

3.3.4.1 3.3.4.2 3.3.4.3 3.3.4.4 3.3.5

83135 21001/21002 84045 83233 84045 83245

Power Supply:

3.3.5.1 3.3.5.2.1 3.3.5.2.2 3.3.6

Low Voltage Sensor (LVS) DC−Converte DC−Converterr 5 V (on LVS LVS board) board) (DCC−5) (DCC−5) DC−Converter Multivolt (DCC−MV) AC/DC−Converter (12 A) (ACC−54) AC/DC−Converter (14 A) (ACC−54)

83138 − 83138 58341 58341

30511 12400 20101 20102

3.3.6.2 3.3.6.3 3.3.6.4 3.3.6.5

*) The code numbers given given may differ to those of the delivered installation in individual individual cases. In such case the actual code number can be taken from the delivery list of the installation or the drawing set.

Fig. Fig. 3 3−1 −12 2 Ed. 01.10 01.04

Circ Circui uitt diag diagra rams ms of of suba subasse ssemb mbli lies es (tran (transm smit itte terr rac rack) k) SOAC

3−15


3−16


SOAC

Ed. 01.04

ILS 420



3.3.3

Transmitter Subassemblies

3.3.3.1

O v e r vi e w

The GP−2F transmitter section, the function of which is to generate the RF signals and amplify the RF, consists of the following subassemblies (single, Fig. 3−13, 3−13, blocks dark grey); the block diagram shows both active and standard version: − − − − − −

Lo Localizer/Glide Path audio generator Synthesizer Modul Modulato ator/ r/po powe werr ampl amplififier ier for for carr carrie ierr 1 (CSB1 (CSB1)) and sideb sideban and d (SBO) (SBO) Modulator/pow Modulator/power er amplifier amplifier for clearance clearance and carrier carrier 2 (CSB2) PIN−di PIN−diode ode transf transfer er switch switch Power Adder (GP−2F active or standard)

LG−A SYN MODP MODPA1 MODPA2 MODPA2 PAD−A; PAD−S NF dipole (NFM), opt.)

M−Type Antennas A1, A2, A3


from probes

Shelter/Cabinet

to antenna system

Phase Shifter

RF OUT

RF OUT CSB*

SBO*

Clear.*

TX1

TRANSMITTER 1

CSB A1

SBO A3

Synthesizer 1 SYN

CSB A 2

**


CW RF TX1/2 CRS/CLR


TX2

MODPA 1 Modulator/ Power Amplifier

CW RF f0 − 4 kHz

Clear.



CW RF f0 + 4 kHz

field signals

Power Adder (PAD−A)


GP−2F standard version

stby RF signal

Phase Shifter ***

Power Adder (PAD−S)

CSB−A1 (CSB)*

Inputs analog 2 / 1 A P D O M m o r f

SBO−A3 (SBO)* Clearance

TRANSMITTER 2

control

CSB−A2**

MODPA 2





Monitor 1 LG−M


Monitor 2 LG−M

RS232C RS232C

RS232C RS232C

RS232C

LRCI LC I

LC−CPU

MODEM*** LCP

MODEM***

* RF signal in GP−2F standard ** used in GP−2F active OIO (spare)

*** optional

Fig. Fig. 3−13 3−13 Ed. 07.06 01.04


RMMC

PTT


3−17

GP 422

ILS 420


3.3.3 .3.3.2 .2


Loca Locali lize zer/ r/Gl Glid idee Path ath Audi Audio o Gen Generat erato or (LG LG−A −A))

See Fig. 3−14. 3−14. The Audio generator LG−A produces the composite carrier−plus−sideband (CSB) and sideband− only (SBO) modulation envelopes for the CSB1/SBO MODPA and, in dual frequency Glide Path systems, the Clearance and CSB2 (active only) MODPA.

NOTE:

3.3.3.2.1 3.3.3.2.1

Audio Generator and Monitor module commonality: commonali ty: The same CCA module is used for the Monitor and Audio functions, which reduces spare inventory requirements. The difference is the dedicated individual firmware used. The CCA automatically configures itself for audio generator or monitor function when it is plugged into the backplane. The audio and monitor functions are always completely independent. Program updates are easily accommodated (see also 3.3.4.2.1 ).

LG−A Hardware

The design meets all audio generation requirements by combining an advanced EPLD in conjunction with an Intel 80C196 high−performance microcontroller. The design provides for measuring all required analog and digital signals through multiplexed input and direct port input/output (I/O). The versatile 80C196 RISC−based microcontroller provides complex complex I/O and an instruction set suitable for both computational and general−purpose use. Supporting circuitry for the 80C196 includes code (FLASH, program storage) and data (SRAM) memory as well as nonvolatile data storage (EEPROM, storage of station specific characteristics). The EPLD provides chip−select logic, Direct Memory Access (DMA) interface to the SRAM for automatic sampled A/D conversion, automatic D/A conversion for audio generation, a high−speed UART, and ROM−less booting of the FLASH programming boot−loader program. EPLD based hardware−partitioning of the programming function prevents accidental FLASH programming. A time−tested minimal multitasking OS kernel allows partitioning the software into separate functional tasks, easing the development and testing of the design and reducing design errors. The 80C196 microcontroller was selected based on its ideal combination of features for embedded applications including its internal I/O peripherals and its RISC based architecture which is optimized for both high−speed mathematical computations (e.g. DSP) and general−purpose use (e.g. interrupts and multitasking). The embedded software consists of a mix of compiled "C" language routines plus assembly language routines for time−critical portions. Internal peripherals include a watchdog timer, two 16−bit general−purpose timers, a high−speed I/O subsystem, and a hold/hold acknowledge bus protocol interface (used by the DMA). The 80C196’s high−level of integrated peripherals and its multi−feature advanced EPLD help it to achieve the system requirements. The increased reliability that results from reducing part counts makes it superior to other microprocessor or microcontroller implementations. For signal processing, up to 32 analog inputs are available for signals and 8 analog inputs for reference inputs. Selected signal and reference inputs are fed to a monolithic, unity−gain differential amplifier for common mode noise rejection. The reference input can also be connected to a software− controlled contr olled 0 to +10 Volt DAC controlled DC offset adjustment circuit to minimize a signal’s DC component, to maximize its AC portion and increase the signal’s signal−to−noise ratio (SNR). The accurate, high−speed high− speed 12−bit A/D converter has a dynamic range of ±10 Volts. Weak signals may be amplified by a software−controlled DAC gain amplifier to more closely achieve the A/D’s full−scale range. The EPLD provides the ability to automatically sample an entire block of data, in 128−sample increments up to 1024 equally spaced samples, as needed for digital signal processing. Over−sampled DC signals are averaged to provide resolution greater than 12 bits for various calibration operations.

3−18

SOAC

Ed. 01.04

ILS 420

GP 422



The EPLD also provides logic for a high−speed (19,200 bps) serial interface. The transmit/receive lines are buffered to normal EIA EI A RS−232/ITU−V.23 RS−232/ITU−V.23 levels for communication communi cation with wit h the LCP. LCP. For audio generation, the EPLD provides a convenient memory window for writing/reading the waveform data to/from SRAM and, when enabled, the EPLD automatically uses DMA to transfer the data from memory to the 13−bit audio generator DACs. By maintaining a versatile, high−level approach, the audio generator meets the requirements for generating high−quality signals for localizer or glide path systems. This flexible approach provides features that are not available with an all−hardware implementation. These features include self−calibration that continuously removes data acquisition errors from actual signal data while also verifying its validity through the use of design based, hard−coded hard−coded limits, plus easy signal waveform adjustment through the audio generator’s memory window.

3.3.3.2.2

LG−A functional Operation

On−board automatic calibration eliminates factory or field hardware adjustment of the audio generator and audio generation paths. The audio generator/monitor provides the capability to fully characterize its analog signal processing through program−controlled adjustments using a precision 5 V (±0.05 %) reference. Once its A/D subsystem is characterized, the processor then calibrates the A/D circuits which provides accurate system measurements without factory or field manual hardware ad justments. The precision external reference is continuously cross−verified cros s−verified using the A/D’s internal precision reference. Two modes exist for acquiring a digital representation of a selected analog signal. The 12−bit A/D may be used to acquire either a single sample of a selected analog signal, or a block of conversions of a selected signal may be acquired with virtually no processor overhead. The hardware−assisted data conversion control and DMA are by an EPLD. The block size is selectable in 128−sample increments from 128 to 1024 samples and two different acquisition times are available: 7.58 and 30.72 kHz. Each sample of converted data is transferred directly in the microcontroller’s data memory (SRAM) using the hold/hold acknowledge bus arbitration protocol. The selection of which sampling mode is used (block or single) on a given signal is based on the signal type (periodic or dc) and the analysis to be performed on the result. The audio card has a high−speed (19,200 bps) serial input/output communication link with the LCP for access to the following setup parameters, commands, and system status identifiers: − alarm/preal alarm/prealarm arm limit entry entry and validation (used (used only in the LG−M application) application) − on−command on−command calibration calibration of audio generator generator and detectors detectors − calibration calibration results results of audio generator generator,, or detectors Digital signal generation of navigational tones eliminates the audio generator maintenance as a source of error. The audio generator generates all navigation and identification information used to modulate the ILS RF carrier and provides the means to control the radiated signal. Four channels of digitally synthesized navigation information are provided, one each for course/path carrier−plus− sideband (CSB1), course/path SBO, Clearance and carrier−plus−sideband CSB2 (GP−2F active only). Each of these synthesizers uses a 12−bit digital−to−analog (D/A) converter that outputs 512 separate data points for each ILS cycle (1/30th of a second), assuring very accurate and precise navigation audio that allow a DDM control resolution of 0.0005. When all the pattern calculations are completed, the audio generator then loads the information to the random−access random−access memory (RAM). The RAM information is in the form of complete navigation waveform in digital format. This exact information is converted to analog signal by very accurate 12−bit D/A converters, filtered, and amplified through operational amplifiers and output to the modulator/ power amplifier. Ed. 07.06 01.04

SOAC

3−19

GP 422

ILS 420



Once loaded, the monitor and audio generator board remain independent until a change in station parameters is input by an operator. The complete navigation waveform always uses the full 12 bits of the D/A converter for best possible accuracy. The amplitude (RF level and modulation) is set using an 8−bit multiplying D/A converter that functions as an accurate 256−step level control. The monitor and audio generator are completely independent. Two Two LED at the front signalize availability or ok of the CPU and audio signals.

NOTE:

The LLZ or GP installation can be equipped with the LGx Ref. 120570−0004, 120570−0004, e.g. for replacement. The LGx 120570−0004 is backward compatible to the LGx −0003 version and can be used with former standard Export SW kits used by the 120570−0003.

The location of the two LG−A (transmitter 1 and 2) is shown in Fig. 3−6. 3−6.

UART

Serial communication communication to LRCI

3.3V

2

Board personality LG−A/LG−M

clock

CPU CPU Norm Normal al

Audi Audio o on LG−M program memory 1st data

Flash program memory Firmware LG−A station data config. data

(Firmware LG−M)

External signals

Reset out (P2/c18)

EPLD (1) Auto−boot sequencer

8

(e.g. ANT SEL, Shut down, ...)

Digital output buffer

4

used in LG−M application Digital input buffer

RS 422 Digital output

5

CPU Bus

External signals

MUX Frequency measure

8

(e.g. DME KEY IN, INTFC_CLK,...)

Micro−Controller

80C196KB

EEPROM configuration memory station data, config. data

Debug communication

Reset

External signals

used in LG−A application CSB/SBO

20

(e.g. +24 V, +48 V, V, obstr. light, etc.)

External Reference signals

1 CSB/2 SBO (I/Q)

clock

MUX 3

3

14.7456 MHz

to MODPA ’s

CLR/CSB2*

Analog measure

RAM data memory

Analog wave generator

3

(8 DAC)

Internal signals clock

ADCS

EPLD (2) timing control Vcc

Course

3.3V

2

Clearance Ident (not with GP) Integrity to ECU KEY_DME (not with GP)

* active GP only

Fig. Fig. 3−1 3−14 4

3−20

Loca Localilize zer/ r/Gl Glid ide e Pat Path h Audi Audio o gene genera rato torr (LG− (LG−A) A) SOAC

Ed. 01.10 01.04

ILS 420

GP 422


3.3.3.3


Synthesizer (SYN)

See Fig. 3−15. 3−15. The Frequency synthesizer CCA generates the RF carrier for the course MODPA and, if a dual frequency system, also for the clearance MODPA. The synthesizer produces a clean low noise CW signal. The low noise signal is achieved by high frequency, frequency, phase stable TCXO and modern Direct Digital Synthesis (DDS) technology t echnology.. The DDS allows a phase detector to operate at a frequency more than 350 times the 25 kHz of conventional PLL designs, which gives a potential of 48 dB more phase correction gain at 150 Hz than conventional designs. The desired frequency is easily set with the jumpers. Once the frequency is set, set, the synthesizer is automatically ready ready for glide path or localizer function. The frequency accuracy is achieved by the use of a stable TCXO and small frequency steps allowed by the DDS design. The TCXO has a specified frequency tolerance of ±10 parts per million (ppm) from −40 to 85 degrees. The carrier frequencies are phase locked to this frequency and can be set in 0.17 Hz steps (0.52 Hz steps for the glide slope). The station frequency and frequency offset for the capture effect is set by the program in the programmable read−only memory (PROM). The 8 kHz will be set to less than 2 Hz error and phase locked to the same TCXO to always have less than 2 Hz error. For measurement, the 8 kHz frequency difference is either counted down to 125 Hz (default for ILS 420) to be compatible with other ILS systems or directly supplied as 8 kHz (jumper selectable) for use in a more accurate difference detector. detector. − Direct Direct Digit Digital al Synthes Synthesis is : The heart of the design is the DDS integrated circuit. The DDS and the 10 bit D/A converter are specified for clock speeds up to 125 MHz and an d output frequencies of up to 40 MHz. The big advantage of using the DDS approach is that instead of a phase detector in the PLL that is limited to the channel frequency separation, the PLL detector can operate at 10 MHz or more. A frequency higher than 10 MHz can be used but there is a trade off between increased PLL gain and more spurious nois e out of the DDS. Using a high PLL detector frequency allows a much higher correction gain. The glide path phase corrections at 90 and 150 Hz are particularly interesting. The feedback correction frequency of any phase locked loop is limited by the frequency of the phase detector. With a standard PLL, the maximum phase detector frequency is the channel separation. The gain of the phase correction loop at 150 Hz can go up to 6 dB for every octave the phase detector frequency goes up. Since 25 kHz to 10 MHz is more than 8 octaves, the loop could theoretically have 48 dB more gain at 150 Hz than a PPL with a phase detector operating at 25 kHz. The 10 MHz (channel frequency divided by 10 for the localizer and by 30 for the glide path) can be set by increments of the TCXO divided by the numerical counter of the DDS integrated circuit (IC). For the capture effect, the plus and minus 4 kHz offset can be set in less than 1 Hz steps from the same TCXO and will always be phase locked at the exact frequency difference. − Phase− Phase−lock locked− ed−loop loop IC The Phase−locked−loop integrated circuit (IC) used is a high quality part designed for low−noise synthesizers. It allows the phase detector to operate at the incoming reference frequency. This is highly highl y desirable in this application because the phase detector detector can operate at the 10 MHz DDS output frequency. The IC has all the counters, lock detector, and charge pump output to complete a PLL function. The voltage−controlled oscillator (VCO) input will handle up to 2000 MHz and will allow this same circuit to operate in the DME band. The output filter to the VCOs is a standard active low−pass filter. − Voltage−C Voltage−Controll ontrolled−Osc ed−Oscillator illatorss These VCOs are rugged, linear tuning, surface mount, mini−circuit VCOs. The DDS IC requires a 40−bit tuning word to set it up and to set the 3−bit counter. This is accomplished with five 8−bit words and two ICs. The timing and control IC is a programmable device that has a resistance−capacitance (RC) oscillator and the outputs to control loading and addressing of the DDS IC and PROM. Ed. 01.04

SOAC

3−21

GP 422

ILS 420



The frequency set will be input to the DDS IC at power up and periodically thereafter. thereafter. The coding from BCD to binary is programmed into the PROMs. By programming PROMs, the VCO output frequency can be set to within less than 1 Hz for each channel frequency. Jumpering either the 100 MHz jumper or the 300 MHz jumper sets the VCO divider in the PLL IC and selects either the 100 MHz VCO or the 300 MHz VCO. Selecting the 100 or 300 MHz jumper also routes the signal through the 380 MHz low− pass filter or the 135 MHz low−pass filter. The location of the two SYN (transmitter 1 and 2) is shown in Fig. 3−6. 3−6.

(VCO2) harmonic filter

PLL

DDS

low pass

divide by 30/12

VCO LLZ

RF out

f+4 kHz

Amplifier

CRS J7

VCO GP

clock 8 bit

LLZ or GP

feedback loop

BCD jumper frequency select

J1 to J4

EPLD

TCXO

EPROM

Mixer

39.95 MHz

8 kHz :64

125 Hz (default setting)

8 bit

harmonic filter

DDS

LLZ :128 GP :256

(VCO1)

clock

PLL divide by 30/12

low pass

VCO LLZ

freq. diff.

fout

RF out CLR

f−4 kHz

Amplifier

J6

VCO GP

LLZ or GP

feedback loop

Fig. ig. 3−1 3−15 5

3−22

Synt Synthe hesi size zerr (SY (SYN) N),, blo block ck diag diagra ram m

SOAC

Ed. 07.08 01.04

ILS 420



3.3.3.4

Modulator Po Power A Am mplifier (M (MODPA)

See Fig. 3−16, 3−16, 3−17, 3−17, 3−18. 3−18. The Modulator/power amplifier (MODPA) assembly provides two amplitude modulated signals, t he CSB and the SBO. One MODPA MODPA unit is required for single frequency operation and two units are required for two−frequency operation.

SBO−signal (modulated with "90−150 Hz", the RF phase is reversed at the zero crossings of the envelope curve)

CSB−signal (modulated with "90+150 Hz")

Fig. Fig. 3−16 3−16

CSB and and SBO SBO,, ampl amplitu itude de modu modula late ted d sig signal nalss (pri (princ ncip iple le view view))

The designs and operation of the Localizer and Glide Path power amplifiers are the same, differing only in those components specific to the operating frequency bands. Consequently, the following discussion applies equally to both units. The CSB and SBO modulators, linear RF power amplifiers, and support circuits for measurement of power output, reflected power, and associated monitoring functions are constructed on a single surface mount printed wiring board. The printed wiring board is mounted on a heat sink inserted in the power amplifier card cage within the transmitter equipment cabinet. cabine t. For the active GP−2F GP−2F,, a special jumper setting and external connection conn ection (SBO section) allows the output RFcw of one MODPA to be one input path of the other that is responsible for the CSB2 path. − CSB modulator modulator power power amplifier amplifier section section RF carrier on the selected operating frequency frequency is input to the t he MODPA from the synthesizer. synthesizer. This signal is routed to an initial power divider from which which two outputs are obtained. One signal is routed to the SBO section of the MODPA. The other output from the power divider is amplified in a broadband MMIC amplifier, after which it is routed to a second power divider and split into the two channels used within the CSB section of the MODPA. Linear power amplifier

RF out to antenna

Phase Coupler

PIN diode AM modulator

Low pass filter

Modulator

AM Error amplifier MMIC AMP

Power Divider

AM Detector

Sample of RF output signal

Amplitude error control voltage Phase Error amplifier

Phase correction control voltage

RF from frequency subthesizer Power Divider

J1

Carrier reference phase

RFcw out

Factory

Phase Delay

J6* to SOAC

Phase align CSB Audio waveform from Audio Generator

RFcw to SBO section

Detector

Phase feedback

*LLZ: J7

Fig. ig. 3−1 3−17 7 Ed. 07.08 01.04

MODP MODPA A CSB CSB se sectio ction, n, bloc blockk dia diagr gram am SOAC

3−23



One signal which will become the modulated carrier is routed to a phase modulator (electronically controlled phase shifter) and then to the AM modulator. From the AM modulator this signal is applied to a linear RF power amplifier which increases the level of the low−power modulated signal to obtain the specified output power level. The signal is next applied to a low pass filter to remove undesired harmonics from the transmitter output. Following the filter, a directional coupler in the output line provides samples of the forward and reflected RF output signals. The forward power RF sample is used in two feedback loops to control both the amplitude and the phase performance of the CSB MODPA. Modulation of the transmitter and correction of any AM modulation distortion is accomplished by the AM loop. The CSB Audio waveform waveform consisting of a DC level, level, the 90 and 150 Hz audio audio tones and the Ident tone is created by the audio generator and input in put to one side of the AM loop error amplifier. amplifier. An audio signal from a highly linear AM detector that is driven from the RF output sample obtained from the directional coupler is also input to t o the loop error amplifier. The input DC level sets the desired RF carrier power, and the detected DC level is proportional to the actual RF carrier power power.. Similarly, the level of the 90 and 150 Hz tones, relative to the DC level, level, at the input of the error amplifier sets the desired modulation modulation percentage for each tone. The detected level of these tones represents the actual modulation percentage, including the effects of modulator and linear amplifier non−linearity. The signals are applied to the differential inputs of the AM error amplifier where the difference between them is amplified and output as a control voltage which is applied to the AM modulator. The result is a closed loop feedback control system which continuously detects and compensates for any deviation in RF power or modulation percentage. It also removes any distortion introduced by the AM modulator or the linear RF power amplifier. Thus, the output power and modulation percentage are accurately determined by the digitally generated input CSB signal from the audio generator. generator. The CSB phase control loop operates like the AM loop and has two primary functions. The first is to set and an d maintain the phase relationship between the input RF carrier signal (from the synthesizer) and the modulated output carrier. In conjunction with similar loops in the SBO section (which are also referenced to the input carrier), this maintains the desired phase relationship between the CSB and SBO signals. The second function of the CSB phase control loop is to compensate for any undesired phase pha se modulation modulati on of the RF carrier occurring in the linear RF power amplifier. amplifier. This form of phase modulation, often referred to as AM to PM conversion, commonly occurs in highly efficient linear RF power amplifiers, and may result in undesired PM sidebands on the transmitter output. The phase feedback loop operates as follows. A phase detector, detector, implemented with a double balanced mixer, provides one input to a high gain phase error amplifier, where it is compared with a 0 volt reference. The phase detector has two inputs, one is a sample of the RF output signal from the directional coupler. This signal contains the carrier and any phase modulation components. The other signal, obtained from the power divider at the input to the CSB section, consists only of unmodulated carrier originating from the frequency synthesizer. Undesired phase modulation is detected by the phase detector and output as an error voltage and amplified by the loop error amplifier. The output from the loop error amplifier is applied as a phase correction control voltage to the phase modulator or electronic troni c phase shifter. shifter. This signal, when applied to the modulator, modulator, counter modulates the RF carrier such that any undesired u ndesired phase modulation generated by the AM modulator or the linear power amplifier, is canceled and does not appear at the transmitter output. To maintain the desired phase relationship between the CSB and SBO channels, it is necessary to have the proper phase delay in the phase reference input to the phase detector. The delay compensates for the difference in propagation delay between the reference phase channel components and those in the modulated RF channel. Obtaining the delay is accomplished by means of a fixed LC delay network, in conjunction with a variable phase trimmer. Most of the phase delay is provided by the fixed delay network. Unit to unit variations are trimmed out with the factory phase alignment control during a one−time adjustment and unit test.

3−24

SOAC

Ed. 01.04

ILS 420


Equipment Description − SBO modulator modulator power power amplif amplifier ier section section

This section controls the SBO Power, suppresses the RF carrier, and adjusts the SBO phase relative to the CSB phase over the full range of 0 to 360 degrees. Full 360 degree phase adjustment saves time during system installation by eliminating the need to cut RF cables to the correct phase length. Fig. 3−18 shows the block diagram of the SBO SB O section. In−Phase and Quadrature modulation sigsi gnals are used in a closed loop system. The RF carrier is input to the SBO section from the power divider in the CSB section as discussed previously. This signal is routed to an additional power divider to create two channels; one is the SBO modulator channel, and the other is a carrier phase reference channel similar to that used in the CSB section. From the power divider, a CW signal is sent to the I−Q modulator. modulator. For the active GP−2F, the RF carrier from the CSB section is coupled out (J7) and fed as input RF to the SBO section of second MODPA (J7) which is used to modulate the CSB2 signal. The I−Q modulator consists of an input, 90 degree, power divider, two double balanced modulators, and an in−phase in− phase power combiner. The 90 degree power power divider splits the input signal into two signals having havin g a phase difference of 0 and 90 degrees. Each is applied to a balanced modulator. modulator. Each modulator is designed so that an input on the control voltage port will result in an RF output phase which is 0 degrees and proportional in amplitude to the voltage applied. Similarly, if the polarity of the voltage is negative, the RF output phase is 180 degrees relative relative to the input phase, and the amplitude is again proportional to the magnitude of the control signal. One is used to modulate the 0 degree (I) signal, from the power divider, and the other is used to modulate the 90 degree (Q) signal. The two modulated signals are then summed in the in−phase power combiner to obtain the vector summation of the 0 and 90 degree components. For example, equal level control signals applied to both modulators will produce a vector sum of 45 degrees. Thus, any output phase may be obtained by adjusting the relative proportion and the polarity of I and Q control signals. The power output obtained is proportional to the magnitude of the two signals. The output phase will be constant as the power is varied with the control voltages, provided the relative amplitude ratio is held constant between the I and Q voltages. I−Q Modulator I modulation

Linear power amplifier

0° 90 degr. Power Divider

I control

RF out to antenna

I−Q modulated SBO RF

In−phase power combiner

Coupler Low pass filter

90° RF carrier input from CSB section

I Error amplifier Power Divider

Q modulation

Sample of RF output signal

I error voltage Q control

JP5 SBO "I" Audio from Audio Generator 0 to ±5 V peak

RF in/out

0°

SBO "Q" Audio from Audio Generator 0 to ±5 V peak

J7 GP−2F active only

I Detector

90 degr. Power Divider 90°

Q error voltage

Carrier reference phase

In−phase Power Divider Q Detector

I−Q Demodulator

Q error amplifier

Factory Delay Phase align

Fig. ig. 3−18 3−18 Ed. 01.04

MODP MODPA A SBO SBO Sect Sectio ion n Blo Block ck Diag Diagra ram m SOAC

3−25



The balanced modulators also suppress the RF carrier. carrier. Ideally, Ideally, with 0 Volts on the control port, the output outpu t from each modulator is 0. If an AC signal, symmetrical about 0 Volts, is applied, the output from each modulator is a double sideband, suppressed suppressed carrier, carrier, or SBO, signal. By adjusting the relative magnitude and polarity of the AC signals applied to the I and Q modulation ports, a SBO signal of any desired phase from 0 to 360 degrees is obtainable. In the ILS 420 MODPA units, the I−Q modulator is used in conjunction with an I−Q demodulator in a closed loop feedback system (refer to the block diagram). RF is applied to the I−Q modulator operating as discussed above. The I and Q signals are summed and routed to the linear RF power amplifier where the signal is increased to the desired power level. The amplified signal is low pass filtered, to suppress harmonics, and routed to the antenna system via a directional coupler. A sample sample of the the modulat modulated ed RF output output signal, signal, obtain obtained ed from from the coupl coupler er,, is input to the the I−Q I−Q demodul demodulaator. Also input to the demodulator is an unmodulated carrier phase reference obtained from the input power divider. As in the case of the CSB section, a phase delay network and factory set fine phase alignment control are provided to set the reference phase input to the I−Q demodulator. demodulator. Operation of the I−Q demodulator is the reciprocal of the modulator. The demodulator provides two outputs: an I output proportional to the in−phase modulation components of the RF signal and a Q output proportional to the quadrature modulation components of the RF signal. The Q channel feed back loop operates similarly. Amplitude and phase errors in the quadrature component of the RF output sample are detected, compared with the input from the audio generator, and fed back to control the Q modulator. modulator. In operation, the I and Q feedback loops drive the I−Q modulator to produce SBO modulation which accurately replicates the amplitude and phase of the I and Q waveforms input from the audio generator. generator. By adjusting the I and an d Q inputs under software control, the SBO SB O power and phase may be accurately set and maintained. The I−Q demodulator I and an d Q outputs send to two high gain error amplifiers having differential inputs. These amplifiers also receive the I and Q modulation signals from the SBO section of the audio generator. ator. The I error amplifier provides an output proportional to the t he error between the I input audio au dio and the I detector output. This output controls the I modulator as part of a negative feed back loop which drives the I modulator to cancel any difference between the desired audio input and the detected I modulation. This closed loop system effectively removes removes non−linearity, non−linearity, distortion, or drift in the modulator or the RF power stages. − Linear Power Power Amplifiers Amplifiers RF Power FETs are employed in the Localizer and Glide Path power stages. FET RF power amplifiers provide high gain, wide operating band widths, and the inherent ability to withstand open or short circuit load conditions without damage. For added protection, the amplifiers incorporate a reverse power sensor and fold back circuit which reduces the power output until the load mismatch is corrected. Each amplifier includes forward and reverse power sensors and detectors providing power measurement outputs to the system monitor and portable maintenance data terminal. The power amplifiers are conservatively designed and fully capable of continuous CW power outputs in excess of the peak envelope power required for full modulation. A large and conservatively designed heat sink provides cooling of the output and driver stages for both designs. Junction temperatures are maintained below 125 °C in a +55 °C environment. This temperature is well below the manufacturer’s rated junction temperatures for each type of power amplifier FET. The location of the MODPA (transmitter 1 and 2) is shown in Fig. 3−6. 3−6.

3−26

SOAC

Ed. 01.04

ILS 420



3.3.3.5

PIN−Diode Transfer Switch

See Fig. 3−19. 3−19. The RF signals are distributed to the antenna system by means of the discrete PIN−diode transfer switches. The PIN−Diode transfer switches and the attenuators/dummy loads are located on a printed circuit board which is mounted to a heat sink. The complete assembly is mounted at the rear of the cabinet. Components of the RF signals used for monitoring the standby transmitter are coupled out and fed to the Stby and On−Air Combiner (SOAC). The components are: − 4 PIN−diode PIN−diode transfer switches switches including attenuators attenuators/dumm /dummyy load resistors − PIN−diode PIN−diode bias supply supply (dc in: +24 V; V; dc out: +5 V, V, −120 V) − transfe transferr switch switch drive driverr The function of the various components is to switch the antenna system over to transmitter 1 or 2. The signals of the transmitter which is currently switched to the antenna by the PIN−diode transfer switch 1 to 4 (Course/Clearance) each pass through to the antenna system. The changeover signals received from the Executive Control Unit (ECU) control the PIN−diode switches 1 to 4 for the Course and Clearance branch. The CSB1/SBO CSB1/SB O and Clear./C Clear./CSB2 SB2 (GP−active) signals of the standby transmitter, which is active, but not switched to the antenna, anten na, are passed through to the Stby and On−Air Combiner (SOAC) by RF attenuators which are also used as dummy loads. The PIN−diode transfer switch is supplied with two DC voltages (+5 V/2.5 A; −120 V/0.03 A) which are derived from the 24 V DC input in the bias supply part. This voltage coming from both DCC−MV is ored at the SOAC. The location of the PIN−diode transfer switch assembly is shown in Fig. 3−6. 3−6. to antenna system J10

4

J12

J7

J9

3

J11

J28

J8

J27

CSB2*

J4

J6

2

J1

1

J5

J26

Clearance

CSB−A1

J2

SBO−A3

Z1**

CSB1

GP−2F active

Z3** J5

CSB+S CSB+SBO BO+Cl +Clea ear. r. CSB1+ CSB1+SB SBO O SBO+C SBO+Cle lear ar

J1

Driver and Bias supply

PAD−A Z1,3=phase shifter

rear view CSB1

6 dB/5 W**

SBO

J3

J6

20 dB/100 W


15 dB/1 W

6 dB/5 W**

J4

J6

J2

J3

CSB1

S BO

Clear.

CSB2*

J9

J12

10 dB/1 W 20 dB/100 W

15 dB/1 W 20 dB/100 W


PAD−S

J1

Clear.

RF Stby 20 dB/100 W 10 dB/1 W

A3 Z3

J5 J4

A2

GP−2F standard Z1

J3

J2 J31

CSB−A2

A1

J25 SBO

to antenna system

J3


Antenna changeover PIN−diode switch 4*

−120 VDC J1

CSB/ CSB/TX TX1 1

J2

J4

CSB/ CSB/TX TX2 2

+5 VDC

J5

J7

SBO/TX1 SBO/TX2

Clear./TX1

J8

Clear./TX2

J10

J11

CSB2/TX1*

CSB2/TX2*

changeover signals

PIN−diode PIN−diode switch driver bias supply 24 VDC

J31 Control

J26

J25

J28

Transfer assembly rear of cabinet

J27

DC

Stby and On−Air Combiner J21

ECU

Fig. Fig. 3−19 3−19 Ed. 06.05 01.04

J20

24V1/24V2 to INTFC and monitor

* GP−2F active only ** optional

Trans ransfe ferr Asse Assemb mbly ly,, bloc blockk diag diagra ram m SOAC

3−27

GP 422

ILS 420


3.3.3.6


Power Adder

The Power Adder (PAD) is used to process the incoming signals to appropriate outgoing signals which supply the antennas A1, A2 and A3 to built a GP−2F (M−Type) system. This task is done by individual Power Adders for the t he active GP−2F (PAD−A) and the standard GP−2F (PAD−S).

3.3.3.6.1

Power Adder (PAD−A), GP−2F (M−Type, (M−Type, active) active )

See Fig. 3−20. 3−20. The simple Power Adder for the active GP−2F version (PAD−A) is used to add the clearance RF signal to the CSB1 RF signal which is fed to antenna A1 as CSB−A1, and to the SBO RF signal which is fed to antenna A3 as SBO−A3. In the active GP−version the CSB−A2 signal is directly fed to the antenna A2. The location of the PAD−A is shown Fig. 3−20 (alternatively (alternati vely within the cabinet or at the rear door) and in Fig. 3−6. 3−6. Optionally, phase shifters Z1 and Z3 may be installed which allow a fine tuning of A1 or A3 phases during flight check. The default setting is 0°, mid position.

PAD−A location in cabinet rear view, right side wall (cabling example)

PAD−A location in cabinet, rear door including optional phase shifters (cabling example)

PAD−A, top view

CSB−A2

MIDDLE ANTENNA

A2

W22 J2

CSB2

power adder CSB+Clear.

CSB1 6 dB opt.

Clear.

CSB−A1

W21

LOWER ANTENNA

*

power adder SBO+Clear.

J1 6 dB

Z1

A1

W26*

to antenna system A1*

default setting 0°

power divider

SBO

adjustable Phase Shifter* f

J4

6 dB opt. PIN−diode transfer switch

J5

SBO−A3

J3 PAD−A

W23

UPPER ANTENNA

*

adjustable Phase Shifter* f

Z3

A3

W26*

A3*

default setting 0°

NOTE: In some installations cable W22 for A2 may be labelled as W23 or W24, and W23 for A3 as W22. * optional: these phase shifters may be optionally installed, if the PAD−A is located in the rear door. Cables W21,W23 are fed then to the phase shifters.

Fig. Fig. 3−2 3−20 0

3−28

PAD−A, AD−A, GP−2 GP−2F F (M−T (M−Typ ype, e, act active ive), ), blo block ck diag diagra ram m and and desig design n SOAC

Ed. 06.05 01.04

ILS 420



to J1, cabinet top (A2) to J8, cabinet top (A1) to J2, cabinet top (A3)

swivel nut adjustable part position indication Z3 UPPER ANTENNA

J1

y a l e D

W26

Phase shifter

J2 ° 5 3

° 5 3

Z1 LOWER ANTENNA

J1

PAD−A, GP−2F active Cabinet, rear view

° 0

y a l e D

W25

Phase shifter

J2

J3 (A3) W22

J1

W23

NOTE:

UPPER ANTENNA

SBO IN

J4

Without optional phase shifters RF cables W21 and W22 are fed directly to J8 (A1) and J2 (A3). Normally the phase shifters are set to 0° as default.

THALES 120634−0001

CLR IN

J5 (A1) W21 LOWER ANTENNA

from J12, PIN diode transfer switch from J9, PIN diode transfer switch from J3, PIN diode transfer switch from J6, PIN diode transfer switch

J2

PAD−A

INPUT

W19

CSB IN

INPUT

INPUT

attenuator*

W17 W18

attenuator*

NOTE: In some installations cable W22 for A2 may be labelled as W23 or W24, and W23 for A3 as W22. * an attenuator (6 to 10 dB) may be optionally inserted in the SBO and CLR supply line.

Fig. Fig. 3−2 3−21 1

Ed. 06.05 01.04

Powe Powerr Adde Adderr PAD PAD−A, −A, mech mechani anica call arra arrang ngem emen entt and and cabl cabling ing

SOAC

3−29

GP 422

ILS 420


3.3.3.6.2


Power Adder (PAD−S), GP−2F (M−Type, (M−Type, standard) standar d)

See Fig. 3−23, 3−23, 3−22. 3−22. The Power Adder PAD−S PAD−S for the standard GP−2F (M−T (M−Type) ype) is used to divide and combine the CSB, CS B, the SBO and the Clearance RF signal to provide the appropriate feeding signals for the GP antennas A1 (CSB+SBO+Clear.), (CSB+SBO+Clear.), A2 (CSB+SBO) and A3 (SBO+Clear.). (SBO+Clear.). Mechanically Mechanically adjustable adjustable phase shifters Z1 and Z3 are installed at the outputs J5 and J6, which may be used for phasing of antennas (A1/A2 and A1/A3) during first alignment and for a fine tuning during flight check if necessary. The default defaul t setting is 0°, mid position, the setting range +/−35°. Fig. 3−23 shows the mechanical design, Fig. 3−22 shows the principle of operation. The location of the PAD−S is shown in Fig. 3−6. 3−6. The COURSE CSB input is the CSB signal as delivered from the transmitter with a power up to 5 watt; it is divided in two signals. One is applied via a 180° line W1 and attenuated by about 5.5 dB to the combiner A1 which combines the incoming signals SBO and CSB to the required A2 signal CSB+SBO. The other is fed via a crossover circuit to combiner A4 which combines incoming signals of CSB, SBO+Clearance to the required A1 signal CSB+SBO+Clear.. The COURSE SBO input is the SBO signal as delivered from the transmitter with a power up to 1.5 watt; it is divided in two signals. One is applied applied via a crossover circuit with 180° phase phase shift to combiner A1. The other is fed via a further divider to one path supplying combiner A6 which combines incoming signals of Clearance and SBO to the required signal for combiner A4. The other path is fed via a crossover circuit with 180° phase shift and attenuators to combiner A8, which supplies the SBO+Clear. signal via a 90° line W2 to antenna A3.

PAD−S phase shifters, located at rear door of the cabinet NOTE: In some installations cable W22 for A2 may be labelled as W23 or W24, and W23 for A3 as W22.

PAD−S, top view J1

W1 180°

J4

A2

W22

A1

CSB+SBO

X1

CSB

crossover

J5

W21

A4

J2

SBO

adjustable Phase Shifter f

W25

Z1

A1

CSB+SBO+Clear.

6 dB

Clear.

to antenna system

A6

PIN diode transfer switch X2 crossover

adjustable Phase Shifter

J6

J3 A8 W2 90°

W23

f

Z3

W26

A3

SBO+Clear.

PAD−S

Fig. Fig. 3−2 3−22 2

3−30

Powe Powerr Adde Adderr PAD PAD−S −S,, GP−2 GP−2F F (M−T (M−Type, ype, stand standar ard) d),, bloc blockk diagr diagram am SOAC

Ed. 06.05 01.04

ILS 420



to J1, cabinet top (A2) to J8, cabinet top (A1) to J2, cabinet top (A3)

swivel nut adjustable part position indication Z3 UPPER ANTENNA

J1

y a l e D

W26

Phase shifter

J2 ° 5 3

° 5 3

Z1 LOWER ANTENNA

J1

PAD−S, GP−2F standard Cabinet, rear view

° 0

y a l e D

W25

Phase shifter

J2

W22 W21

J6 U PP PP ER ER AN AN TE TE NN NN A

J5

J4

LO WE WE R A NT NT EN EN NA NA

MIDDLE ANTENNA

W23

THALES 120609−0001

PAD−S

J3 CLEA RANCE

from J9, PIN diode transfer switch from J6, PIN diode transfer switch from J3, PIN diode transfer switch

W19 W18

INPUT

J2 COUR SE SB O

J1 COURSE CSB

INPUT

INPUT

attenuator*

W17

NOTE: In some installations cable W22 for A2 may be labelled as W23 or W24, and W23 for A3 as W22. * an attenuator (6 to 10 dB) may be optionally inserted in SBO supply line.

Fig. Fig. 3−23 3−23

Ed. 06.05 01.04

Power Power Adder Adder PAD−S, AD−S, GP−2F GP−2F standar standard d (M−T (M−Type ype), ), mechani mechanical cal design design

SOAC

3−31


3−32


SOAC

Ed. 01.04

ILS 420



3.3.4

Monitor Subassemblies

The monitor section monitors the radiated signal and detects any errors or faults that might be critical for aviation. In addition to executive tasks, the monitor data can be used to identify any deviations or minor deficiencies in performance at an early stage, insofar as they might have a detrimental effect on the future continuity of service or system availability (warning monitor). The response to an alarm is a logic−controlled changeover or disconnection of the transmitters performed by the Executive Control Unit (ECU). The monitor subassemblies thus comprise (Fig. 3−24, 3−24, blocks dark grey); the block diagram shows both active and standard version: − − − −

Monitor Interface Monitor signal processor processor Executive Control Unit Stby and On−Air Combiner

(INTFC) (LG−M) (EC U ) (SOAC) NF dipole (NFM), opt.)



from probes to antenna system

Phase Shifter

Shelter/Cabinet

Power Adder (PAD−S) RF OUT

RF OUT CSB*

SBO*

Clear.*

TX1

TRANSMITTER 1

CSB A1

SBO A3

Synthesizer 1 SYN

CSB A 2

**


CW RF TX1/2 CRS/CLR


TX2

MODPA 1 Modulator/ Power Amplifier

CW RF f0 − 4 kHz

Clear.



CW RF f0 + 4 kHz

field signals

Power Adder (PAD−A)


GP−2F standard version

stby RF signal

CSB−A1 (CSB)*

Inputs analog 2 / 1 A P D O M m o r f

SBO−A3 (SBO)* Clearance

TRANSMITTER 2

control

CSB−A2**

MODPA 2





Monitor 1 LG−M


Monitor 2 LG−M

RS232C RS232C

RS232C RS232C

RS232C

LRCI LC I

LC−CPU

MODEM*** LCP

MODEM***

* RF signal in GP−2F standard ** used in GP−2F active OIO (spare)

*** optional

Fig. Fig. 3−24 3−24 Ed. 07.06 01.04


RMMC

PTT


3−33

GP 422

ILS 420


3.3.4.1



See Fig. 3−25. 3−25. The Monitor Interface (INTFC) is the signal interface for all configurations of localizer and glide path facilities. It provides the necessary interface between the electronics subsystem and both the system’s integral and field detectors. It also provides the interface for other internal and external signals that are fed to the subsystem, including obstruction light information, voice input, temperature measurement inputs. A monitors’ primary function is to monitor on−antenna and standby sensor signals which are processed in the Standby and On−Air combiner for aerial and standby transmitter. transmitter. For CAT II/III dual− equipment systems, there are 7 (6) navigation signal inputs from integral, far field, and internal standby detectors for LLZ (GP). If I f LLZ nearfield is used in addition to farfield, then a LLZ has 8 signals. Also, the option option having having two farfield farfield (nearfield) (nearfield) signals signals can can add one more more signal signal to the LLZ LLZ (GP). Dual field monitoring is split between the two monitors (one to each independently). Signal inputs on the INTFC are coupled both with buffer amplifiers and with transformer coupling to provide isolation between the system and external detectors, i.e. inputs of FFM1, FFM2 and LLZ antenna cable fault input (LPD antenna). The input signals come into the INTFC down converted in the SOAC to an IF−signal of about 8 kHz. The analog multiplexer MUX1 and MUX2, one for each monitor, select which signal to demodulate. The demodulation produces a DC level representing the original RF carrier level, plus AC components representing the original audio modulation frequencies 90 and 150 Hz. A "reference detector detector generator" provides provides a stable, simulated simulated detector calibration calibration signal using using only a single 120 Hz modulation frequency rather than the normal 90/150/1024 Hz frequencies, as 120 Hz is midway between the critical 90 and 150 Hz frequencies.The reference reference detector allows verification of the demodulator operation and continuous compensation for changes in gain. The low−pass filter removes 1024 Hz Morse code identification (Ident, LLZ only), since there are separate s eparate Ident envelope detectors (1 and 2) for Ident monitoring. For factory test purposes (with use of e.g. the PIR) a further multiplexer path is assembled which processes the same signals as MUX1 and MUX2. Multiplexer input path selection is done by the monitor through a set of four digital signals. This arrangement allows all detector signals to be processed using the same processing path (independent paths for each monitor). The input of the additonal multiplexer can also be selected manually via the hex−switch SW2. NOTE:

The INTFC 120628−0001 is backward compatible to the INTFC I NTFC 120498−0001 version. If the LLZ or GP installation shall be equipped with the INTFC board, Ref. No. 120628−0001, e.g. for replacement, it is allowed to use both INTFC 120628 and 120498 in the same system. Fig. 3−25 shows in addition to the above described INTFC 120628−0001 the block diagram of the previously used INTFC 120498−0001.

The location of the Monitor Interface is shown in Fig. 3−6. 3−6.

3−34

SOAC

Ed. 01.10 01.04

ILS 420

GP 422



INTFC 120628−0001

to Monitors LG−M 1/2

Ident peak detect (LLZ only) buffer/filter

detector/amplfier

keying output

path 1

LLZ (GP) NFM LLZ CLR Width (GP CLR Width) LLZ (GP) CRS Posn. LLZ CLR Width CRS CLR/GP CLR

gr: key tone rd: Alarm HW MEM ALRM_MEM

(Stby and On Air Combiner) LLZ (GP) CRS Posn. LLZ (GP) CRS Width

key tone

Ident evaluation

from SOAC:

buffer/filter

detector/amplfier

path2 l a r g e t n i

MUX 1

10 l a n r e t n i

path1

keying output 90 Hz, Level detector DC, 150 Hz DDM, SDM, RF Low pass filter

AM detector buffer Ref. generator 1

calibr. signal 120 Hz 1 chopped

to monitor 1 analog input from/to ECU (n.c.)* to monitor 2 analog input to monitor 1 detector analog input

Interface clock out (120 Hz) DC, 90 Hz,

MUX 2

LLZ (GP) CRS Width

path2

LLZ FFM1

(LLZ only)

Ident peak

T2,T3

LLZ FFM2

calibr. signal signal 120 Hz 2, chopped

Multiplexer

Level detector 150 Hz DDM, SDM, RF Low pass filter

AM detector buffer

squaring amplif. 90 Hz and 150 Hz

Ref. generator 2

TP19 Level detector DDM, SDM, RF Test output *** Low pass filter TP18

AM detector buffer

Test detector input selection

to monitor 2 detector analog input MODFREQ (n.c.)*

SW2 Input select

LOC ant cable fault (from LPD antenna)

Antena fault tone receiver

T1

inside temp.

to monitor 1/2**

1200 Hz tone, output TTL

amplifier for temperature measurement

outside temp. obstr. lights

to LG−A 1/2

buffer

diverse input signals

to LCP

buffer SW Monitor ok Gate by HW Mon

4 MON1,2 OUT A,B

4

* not used in standard version; not connected at BP Digital 120598−0002

** not used

*** factory use to Monitors LG−M 1/2

INTFC 120498−0001 (previously used) Ident peak detect (LLZ only)

path 1

from SOAC:

LLZ (GP) NFM LLZ CLR Width (GP CLR Width) LLZ (GP) CRS Posn. LLZ CLR Width CRS CLR/GP CLR

path2

reference detector generator l a r g e t n i

buffer/filter

detector/ amplifier

to monitor 1 analog input

detector/ amplifier

to monitor 2 analog input

MUX 1

path 1 unity gain buffer low Q audio carrier bandpass

rms to dc conv. switched capacitor 5 pole low pass antialiasing low pass

to monitor 1 detector analog input

MUX 2

path2 unity gain buffer low Q audio carrier bandpass

rms to dc conv. switched capacitor 5 pole low pass antialiasing low pass

to monitor 2 detector analog input

10 l a n r e t n i

T1...10 trafo isolated input

LLZ (GP) CRS Width (LLZ only)

buffer/filter Ident evaluation

(Stby and On Air Combiner) LLZ (GP) CRS Posn. LLZ (GP) CRS Width

to/from ECU (n.c.)*

MON1,2 IN A,B

LOC FFM 1 LOC FFM 2

to monitor 1/2**

LOC ant cable fault Freq. difference 1 (8kHz) Freq. difference 2

Stby

2x SPDT

Main

inside temp.

amplifier for temperature measurement

outside temp.

to LG−A 1/2

buffer

obstr. lights 2 Battery fuse monitoring

buffer

diverse input signals

buffer

2

DME Key/DME Lock (LLZ only)

Fig. Fig. 3−25 3−25 Ed. 01.10 01.04

to LCP to/from ECU (LLZ only)

LLZ/ LLZ/GP GP Mon Monit itor or Int Inter erfa face ce (INT (INTFC FC), ), prin princi cipl ple e bloc block k diagr diagram am SOAC

3−35

GP 422

ILS 420


3.3.4.2


Localizer/Glide Path Monitor (LG−M)

See Fig. 3−26. 3−26. Signals transmitted from a localizer or glide path station must be constantly validated to ensure safe landings. For this purpose, the LG−M can be seen as a high precision audio frequency spectrum analyzer which continually measures and analyzes these signals, comparing their current values to stored alarm limits. If a measured parameter is not within limits, the monitor signals an alarm condition. The monitored parameters are evaluated for the on−antenna executive and field groups and the "hot" Standby group. The following sections describe the functions of an individual board unless otherwise specified. Monitor and Audio Generator module commonality: The same module is used for the NOTE: Monitor and Audio functions. The difference is the dedicated individual firmware used which defines the operation of the board. The audio and monitor functions are always completely independent. Program updates are easily accommodated (see 3.3.4.2.1 ).

3.3.4.2.1 3.3.4.2.1

LG−M Hardware

The design meets all monitoring requirements requirements by combining an advanced EPLD in conjunction with an Intel 80C196 high−performance microcontroller. microcontroller. The design provides for measuring all required analog and digital signals through multiplexed input and direct port input/output (I/O). The versatile 80C196 RISC−based microcontroller provides complex I/O and an instruction set suitable for both computational and general−purpose use. Supporting circuitry for the 80C196 includes code (FLASH, program storage) and data (SRAM) memory as well as nonvolatile data storage (EEPROM, storage of station specific characteristics). The EPLD provides chip−select logic, Direct Memory Access (DMA) interface to the SRAM for automatic sampled A/D conversion, automatic D/A conversion for audio generation, a high−speed UART, and ROM−less booting of the FLASH programming boot−loader program. EPLD based hardware−partitioning of the programming function prevents accidental FLASH programming. A time−tested minimal multitasking OS kernel allows partitioning the software into separate functional tasks, easing the development and testing of the design and reducing design errors. Program updates are easily accommodated by an on−board auto−boot sequencer. This sequencer is activated by a specific sequence sequence of the two switches on the front edge of the board. When activated, the sequencer looks for the uploading of special boot software which will permit the processor to be capable of writing to the Flash memory. memory. The processor has write capability to the flash only while in this special boot mode. Once the special boot software is uploaded, new application code can be uploaded and stored. The 80C196 microcontroller was selected based on its ideal combination of features for embedded applications, including its internal I/O peripherals and its RISC based architecture which is optimized for both high−speed mathematical computations (e.g. DSP) and general−purpose use (e.g. interrupts and multitasking). The embedded software consists of a mix of compiled "C" language routines and, for time−critical portions, assembly language routines. Its internal peripherals include a watchdog timer, timer, two 16−bit general−purpose timers, a high−speed I/O subsystem, su bsystem, and a hold/hold acknowledge bus protocol interface (used by the DMA). The 80C196’s high−level of integrated peripherals and its multi−feature advanced EPLD help it achieve the system requirements. Its increased reliability is due to its reduced part count compared to other microprocessor or microcontroller implementations. For signal processing, up to 32 analog inputs are available for signals and 8 analog inputs for reference inputs. Selected signal and reference inputs are fed to a monolithic, unity−gain differential amplifier for common mode noise rejection. The reference input can also be connected to a software− controlled contr olled 0 to +10 Volt DAC controlled DC offset adjustment circuit to minimize a signal’s DC component, to maximize its AC portion, and to increase the signals signal−to−noise ratio (SNR).

3−36

SOAC

Ed. 01.10 01.04

ILS 420



The accurate, high−speed 12−bit A/D has a dynamic range of ±10 Volts. Weak signals may be amplified by a software−controlled DAC gain amplifier to more closely achieve the A/D’s full−scale range. The EPLD provides the ability to automatically sample an entire block of data, in 128−sample increincrements up to 1024 equally spaced samples, as needed for digital signal processing. Over−sampled DC signals are averaged to provide resolution greater greater than 12 bits for various calibration operations. The EPLD also provides logic for a high−speed (19,200 bps) serial interface. The transmit/receive lines are buffered to normal no rmal EIA RS−232/ITU−V RS−232/I TU−V.23 .23 levels for communication communi cation with wi th the LCP. LCP. By maintaining a versatile, high−level approach, the monitor meets the requirements for monitoring the localizer or glide path systems. This flexible approach provides features that are not available with an all− hardware implementation.

NOTE:

The LGx 120570−0004 is backward compatible to the LGx −0003 version and can be used with former standard Export SW kits used by the 120570−0003. The location of the two LG−M (transmitter 1 and 2) is shown in Fig. 3−6. 3−6. UART

Serial communication communication to LRCI

3.3V

2

Board personality LG−A/LG−M

Reset out (P2/c18)

EPLD (1) Auto−boot sequencer clock

Flash program memory

CPU CPU Norm Normal al

Firmware LG−M LG−M program memory 1st data

Firmware LG−M

(Firmware LG−M)

Digital output buffer

LG−M program memory 1st data

External signals

8

(e.g. ANT SEL, Shut down, ...)

Audi Audio o on

4

to INTFC (MUX)

used in LG−M application Digital input buffer

RS 422 Digital output

Exec. Alarm Stby Alarm Field alarm Integr. A Alarm Integr. B Alarm

5

CPU Bus

External signals

MUX Frequency measure

8

(e.g. DME KEY IN, INTFC_CLK,...)

Micro−Controller

80C196KB

EEPROM configuration memory station data, config. data

Debug communication

Reset

External signals

used in LG−A application CSB/SBO

20

(e.g. +24 V, +48 V, obstr. light, etc.)

External Reference signals

1 CSB/2 SBO (I/Q)

clock

MUX 3

3

14.7456 MHz

CLR/CSB2*

Analog measure

RAM data memory

Analog wave generator

3

(8 DAC)

Internal signals ADCS

see Fig. 3−27

clock

EPLD (2) timing control Vcc

to MODPA ’s

Course

3.3V

2

Clearance Ident (not with GP) Integrity to ECU KEY_DME (not with GP) * active GP only

Fig. Fig. 3−26 3−26 Ed. 01.10 01.04

Loca Localilize zer/ r/Gl Glid ide e Path ath Mon Monit itor or (LG− (LG−M) M) SOAC

3−37

GP 422

ILS 420


3.3.4.2.2 3.3.4.2.2


LG−M functional Operation

See Fig. 3−26, 3−26, 3−27. 3−27. On−board automatic calibration eliminates factory or field hardware adjustment of monitor and detector paths. The monitor provides the capability to fully characterize its analog signal processing through program−controlled adjustments, using a precision 5 Volt (±0.05 %) reference. Once its A/D subsystem is characterized, the monitors are then capable of calibrating the detector path which provides accurate system measurements without factory or field manual hardware adjustments. The precision external reference is continuously cross−verified using the A/D’s internal precision reference. Two modes exist for acquiring a digital representation of a selected analog signal. The 12−bit A/D may be used to acquire either a single sample of a selected analog signal, or a block of conversions of a selected signal may be acquired with virtually no processor overhead. The hardware−assisted data conversion control and DMA are by an EPLD. The block size is selectable in 128−sample increments from 128 to 1024 samples and two different acquisition times are available: 7.58 and 30.72 kHz. Each sample of converted data is transferred directly in the microcontroller’s data memory (SRAM) using the hold/hold acknowledge bus arbitration protocol. The selection of which sampling mode is used (block or single) on a given signal is based on the signal type (periodic or dc) and the analysis to be performed on the result. The monitor cards have a high−speed (19,200 bps) Serial input/output i nput/output communication link with the LCP for access to the following setup parameters, commands, and system status identifiers: − alarm/prea alarm/prealarm larm limit limit entry entry and validation validation − calibration calibration results results of monitor or detectors detectors − current current executive, executive, field, and/or hot standby standby parameter parameter readings readings Data conversion control

Interface CCA Detector mux output

1 measurement signals

5 signal input e.g. waveform DC values, etc.

32 input signal MUX

17

Sample clock and DMA logic (part of EPLD)

Out Start Convert

32 1

−

calibration voltage for ADC

8 input reference MUX

Ref

+

Variable Gain Out In 8−bit DAC

In

12−bit ADC

16 bit data

to CPU data latch (RAM)

block conversion/single sample

Differential Amp

8

Out

Out

calibration intern.

End of Convert

0V to +10V DC offset 8 bit DAC

CPU data bus

high accuracy 5 V reference

C P U d a t a b u s

AGND

Fig. Fig. 3−27 3−27

3−38

Moni Monito torr ADC ADCS S conc concep eptu tual al bloc blockk diag diagra ram m SOAC

Ed. 01.04

ILS 420


Equipment Description − Monitor Monitor Stabil Stabiliza ization tion Time Time

The monitor stabilization time is the time it takes a monitor to measure and analyze any specific critical input signal. A hardware−assisted data acquisition subsystem allows concurrent data processing which reduces fault detection latency. The monitor processes signals sequentially, so it is necessary to determine the number of signals processed each monitor cycle and the time it takes to process them. The time it takes for a monitor to acquire and process each detected signal is shown in Fig. 3−28 a) for a single signal. The three timing components are: − Ts is the 10 ms settling time of the audio−carrier demodulator and filter path (on the INTFC), − Ta is the 33.333 ms A/D signal acquisition sampling time and − Tp is the digital signal processing time (i.e. converting the time samples into DC+AC components, performing scaling and calibration adjustments, plus alarm processing). Now, since Tp is less than Ts, by preselecting the next signal immediately after the current signal has been acquired, the Tp of the current signal may be made coincident with the Ts of the next signal. Thus, the effective throughput is 10+33.333 ms or 43.333 ms, as shown in Fig. 3−28 b). Note that this pipelined method produces the fastest processing throughput achievable for a single demodulator−A/D converter system. Only the very first measurement has the burden of the extra 10 ms of settling time, but it occurs within the power−up transition during the system stabilization period, and so it is transparent to the system’s normal operation. a) single A/D acquisition and signal processing times

Ts

b) Pipelined signal processing

Ts

Ta Ta (signal A)

Tp Tp Ts

Fig. ig. 3−2 3−28 8

Ta (signal B)

Tp

Acq Acquisi uisiti tion on and and pr proces ocessi sing ng time timess

Fig. 3−29 a) lists the set of detector signals processed for a LLZ−2F and GP−2F with Field and hot Standby configured. The integrity signal is always processed (i.e. not configurable). The temporal importance of these signals varies and is used to produce the resultant cycling of signals as listed in Fig. 3−29 b). The worst case timing is for a LLZ−2F with executive nearfield monitoring, with five signal processing slots total. The "other" slot is multiplexed depending on the station’s configuration as listed in Fig. 3−29 b). This ordering affects the throughput of those signal groups but not the critical Executive signal group. a) Monitor detector detector processin processing g cycle cycle Item 1 2 3 4 5 b)

L LZ Exec Course Position Exec Course Width Exec Course Clearance Width (executive) Near Field Other

GP Exec Path Position Exec Path Width Exec Path Clearance Width N/A Other

measurement cycle within the "other" slot

Configuration No Field or Standby Field only Standby only Field & Standby

Fig. Fig. 3−29 3−29 Ed. 01.04

Measurement types cycles Integrity → ADCS autocal → Integrity… Field → Integrity → Field → ADCS autocal → Field … Integrity → ADCS autocal → Standby → Integrity… Field → Integrity → Field → ADCS autocal → Field → Standby → Field …

Monitor Monitor detect detector or proc process essing ing cycle cycle and and meas measure uremen mentt cycle cycle within within the the "othe "other" r" slot slot SOAC

3−39



Thus, for the worst case configuration (LLZ−2F with NFM), there are a total of 5 signals at about 43.333 ms each for a total of 216.67 ms. However, However, there is an additional overhead of about 25 ms in the total processing (due to higher−priority task and interrupt service routine interrupts), so the actual total is closer to 242 ms, or about 4 cycles per second. Thus, if any arbitrary Executive signal became corrupt, it would take a maximum of a ¼ of a second to detect it. Similarly, Similarly, it would take a minimum of a ¼ of a second for the monitor to "recover" from the faulty signal on an equipment transfer. − Fault Fault Iden Identifi tificat cation ion Digital signal signa l processing techniques provide system status with minimal time delay. To fully characterize the valid operation of a localizer or glide slope station, a predefined set of signals must be measured and validated. The Thales monitor extracts the value of these parameters from the detected analog signals using Discrete Fourier Transforms Transforms (DFT) for the time−to−frequency time−to−frequency domain conversion of the critical 90 and 150 Hz navigation signal components. Additionally, frequency frequency (e.g. carrier frequency) and/or period (e.g. carrier frequency difference) measurements are performed on selected digital signals. − Fail ail Saf Safe e The ILS 420 (LLZ/GP) Monitor has numerous fail−safe checks for different aspects of its monitoring operation. In general, a fail−safe trigger could potentially impact continuity−of−service or at least level−of−service by, for instance, causing it to switch from CAT. III to CAT. II or CAT. I, at least momentarily taril y. The high−availability mode of the ILS 420 architecture relies on dual monitors which must agree on alarm status (i.e. alarm−AND) before any control action is taken. Therefore, momentary "glitches" on one monitor, even those resulting in a monitor reset (see below), should not result a transfer or shutdown, since concurrent failures on both monitors are very improbable.

3−40

SOAC

Ed. 01.04

ILS 420



3.3.4.3

Executive Co Control Unit (ECU)

See Fig. 3−30, 3−30, 3−31. 3−31. The Executive Control Unit (ECU) is responsible for performing all the control actions of the station (e.g. transfer, transfer, shutdown, bypass, etc.). The ECU is a state−machine built primarily from three EPLD’s. Two critical EPLD’s are semi−redundant, although each has some unique inputs and outputs. These semi−redundant EPLD’s must remain synchronized, and this synchronisation is monitored by a missing−clock detector. Each Monitor reports its alarm status(es) to the ECU which then decides what type of action, if any, to take based upon that status and other internal state information (e.g. if the transmitters are on or not, if the alarm is bypassed or not, etc.). All noise susceptible control inputs are digitally debounced in hardware. The alarm status reporting protocol between the Monitors’ exec tasks and the ECU is a dynamic protocol (i.e. not level driven) driven) as shown in Fig. 3−30. 3−30. When the Monitor detects the rising edge of the ECU status poll input, it must output one and only one positive edge on any of the five (5) status lines going to the ECU for each status that is normal . When no edge is generated, the respective data group is considered to be in alarm. While this poll−response protocol may add up to a 26.7 ms latency to the alarm response time, it is not susceptible of the failure modes associated with level or even other edge−triggered mechanisms commonly used. All ECU status I/O is polled (i.e. not interrupt driven) by the Monitors’ exec task. Thus, if the Monitor software has a stuck interrupt or somehow hangs (i.e. prevents an alarm status report cycle), the ECU will interpret this as an alarm condition and respond appropriately. This Monitor/ECU "handshake" cycles every 26.67 ms (i.e. the ECU detects a dead Monitor within 26.67 ms). If the LLZ or GP installation shall be equipped with the t he ECU Ref. 120571−0003, e.g. for NOTE: replacement, it is allowed to use both the −0001 or 0002 and the new −0003 version together in one system. But, to get the benefit of the −0003 (e.g. advanced MIT−test) MIT−test) it is recommended to replace and use the −0003 in both LLZ and GP of a runway system. The location of the ECU is shown in Fig. 3−6. 3−6. tpoll = 26.667 ms t1 ECU to Monitor poll

tR tH

Monitor to ECU response A B C tR = tH = 1 ’tick’ (typical) A (A) Poll cycle cycle begins on positive positive edge of ECU’s poll, poll, soliciting Monitor’s Monitor’s status. (B) Monitor Monitor generates generates one (and only one) positive edge of response pulse to indicate that the alarm status is normal, otherwise the ECU assumes status is alarm. (C) Monitor Monito r must remove normal status pulse (i.e. return low) before end of t1. The result of the previous status poll takes effect now.

Fig. ig. 3−30 3−30

ECU ECU to Moni Monito torr Stat Status us Polli olling ng

3.3.4.3.1 3.3.4.3.1

Executive Control Unit Action

A poll−response poll−response alarm status protocol assures fail−safe communications communications between between the monitor and the ECU. The primary purpose of the monitor is to identify out−of−tolerance transmitter signals and pass this information to the ECU for possible corrective action. The Local Control Panel (LCP) provides all alarm local and remote status information. Alarm action depends on whether the ECU is configured for alarm−AND (higher continuity of service) or alarm−OR (higher statio n integrity). Alarm− AND requires that both Monitors indicate the same alarm before control action is initiated, while alarm−OR initiates control action based on only one monitor’s status. Alarm control action results in either a transfer to standby equipment (dual−equipment) or cessation of transmission (single equipment of hot Standby in alarm) by the ECU based on monitor alarm indication. Ed. 01.10 01.04

SOAC

3−41



For "hot" standby equipment, if ECU control action results in the shut down of Standby equipment, the system cannot enter CAT. III operation. Once a parameter fault is detected, a programmable time delay (0 to 100 s in 0.01−second increments) is initiated within the monitor. Separate alarm timers exist for Executive, (LLZ) Near Field, Field, and hot Standby parameter groups. If the corresponding delay expires before the fault condition is cleared, an alarm condition exists for that group and its corresponding alarm status is signaled to the ECU. The monitor provides a set of edge−triggered alarm outputs (executive, field, standby, plus Integrity A and B) which indicate the current state of the equipment. When the ECU requests alarm status from a monitor, the ECU sends a positive−edge poll, and it must receive a positive−edge on the monitor status outputs that are not in alarm. The monitor acknowledgment must occur within a 26.67 ms window to indicate a ‘normal’ status, otherwise the ECU interprets the status as an "alarm" indication. Station controls, as defined in ICAO Annex 10, are implemented in the ECU. The total time that an out−of−tolerance signal is radiated (i.e. on−antenna) is computed as a function of the monitor stabilization time and ECU equipment transfer time (direct (direct shutdown time is always always shorter). The monitor is designed to comply comply with the ICAO recommendation of 1 s when the monitor programmable alarm time delay is set to 0. Implementation of dynamic, edge−triggered status protocol, versus a static status, protocol between the monitors and ECU is but one of many fail−safe design features incorporated into the equipment. To ensure the highest level of safety, safety, the monitor response is not generated within an interrupt routine, but is software−polled instead. Thus a monitor with stuck−interrupts cannot respond with a "normal" alarm status. This protocol is immune to both short or open circuits and "streaming" "streaming" on the communication signals as all are interpreted as an alarm indication. The monitor’s ECU status watchdog: The exec task (highest priority) reports Monitor alarm status to the ECU and verifies the update rate of the Monitor’s EXEC, FIELD, STANDBY, and Integrity data measurements. The maximum ECU status update periods is as follows: Signal Group Must be updated no less than every ... E X EC 0.5 s FIELD 1.0 s STANDBY 6.0 s INTEGRITY 2.0 s If these periods are not met, then the exec task forces the corresponding group’s status into alarm on subsequent ECU status polls, regardless of the data task’s last reported value. The ECU includes an interface for collocation with a DME equipment. For For GP this interface is not used. − Integ Integri rity ty tes testt The purpose of the Integrity test is to verify the Monitor’ ability to measure signals and perform alarm processing. process ing. The ILS 420 420 does this in a innovative innovative way way that is more comprehensive than prior methods employed by any other ILS equipment. Each LG−A produces two special Integrity signals (A and B). These signals are routed to the ECU. The Integrity signals from the on−antenna equipment are then toggled between signals A and B and fed as one signal into the Monitors’ Integrity input. While the Monitor measures only one Integrity signal input, it must apply two distinct sets of limits to this single measurement. The signals and limits are designed so that, when the limits are applied to the current Integrity signal input, only one set of limits has no parameters in alarm . The ECU times the responses of the Integrity signal changes sent to the Monitors, and if the Monitors do not issue the correct response within the ECU’s hard−coded time limit, then the Monitor is declared declared to be in Integrity alarm. An Integrity alarm may cause the ECU to initiate executive control action, depending on whether the ECU is configured for alarm−AND or alarm−OR operation.

3−42

SOAC

Ed. 01.10 01.04

ILS 420


Equipment Description Oscillator

UART

RSCU Control ** serial communication to/from RSCU

Status

On/Off toggle

Bypass

FFM1 FFM2

Shutdown 1A (SYN)

UART

LCP Control

serial communication to/from LCP

Bypass

Status

Shutdown 1B (LG−A)

Redundant Shutdown

On/Off toggle

Shutdown 2A (SYN) Shutdown 2B (LG−A)

Oscillator Mon 1 pres System configuration

TX1 pres Mon 2 pres TX2 pres

Station Control 1st

Bypass 1

Antenna Select via SOAC to PIN−diode transfer switch

from LG−M 1/2 Integrity A1 Integrity B1

Integ. detector

Integrity A2 Integrity B2

Field Alarm 1 Field Alarm 2 Standby Alarm 1 Standby Alarm 2

Configuration switch

Station Control 2nd

Bypass 2

Main 1 Lock Bypass

Integ. detector

OR enable

Status poll combiner

Hot Stby Field enable Field executive Com Shutdown DME Bypass OR enable

safety shutdown

Bypass 3

Executive Alarm 1

Executive on Off Tx1/Tx2

Executive Alarm 2

clck fail detect.

Start clock

Buffer

Status poll 1 LG−M 1 Status poll 2 LG−M 2

Integrity test signal A 1 from LG−A 1/2

Integrity test signal B1 Integrity test signal A2

Integrity test signal

Integrity test signal B2 DME Key 1/2 EXEC_OFF DME Bypass DME Indep./Associated

Ed. 01.10 01.04

Monitor 2 integrity test signal

to LG−M 1/2

Antenna Select

DME Ident*

DME−Key

DME Interlock*

DME−Lock

to/from INTFC

** used for special application only

Fig. Fig. 3−31 3−31

Monitor 1 integrity test signal

* LLZ only

Exec Execut utiv ive e Con Contr trol ol Uni Unitt (ECU (ECU), ), bloc blockk dia diagr gram am SOAC

3−43


3−44


SOAC

Ed. 01.10 01.04

ILS 420



3.3.4.4

Stby and On−Air Combiner (SOAC)

See Fig. 3−32, 3−32, 3−33, 3−33, 3−34, 3−34, 3−37. 3−37. The Stby and On−Air Combiner (SOAC) unit processes the ILS monitor signals both for Localizer and Glide Path. For the Glid Glide e Path, it contains the function of an integral network which combines the input antenna sensor signals to farfield equivalent signals for position and width, and clearance. The SOAC operates in principal with a down−conversion technique which results in 8 kHz intermediate signals for further processing. Fig. 3−32 shows the basic functions, Fig. 3−37 the design of the SOAC. In LLZ, the RF signal is supplied by the Integral Network (Dipole/Reflector (Dipole/Reflector antenna) located in the ADU as pre−combined CRS Posn., CRS Width, CLR Width signals or CSB, SBO, CLR from DUCU (LPD antenna). For GP, GP, the input in put signals are supplied from the probes of antennas A1, A2, A3. In addition there is the optional nearfield monitor signal (NFM). These signals become converted to 8 kHz and output without additional processing other than a level adjustment (for LLZ) or combined to Posn., Width and Clear. (GP and LLZ LPD−antenna). Fig. 3−33 and 3−34 indicate the block diagram showing the RF and IF processing. The Input RF signals containing Course and Clearance frequencies are routed via a power divider to separate down conversion mixers. These are designated the "Course" and "Clearance" mixers. For the Course down conversion, the CLR RF carrier frequency is used as the local oscillator signal. Similarly, for the Clearance down conversion, the CRS RF carrier frequency is used as the local oscillator signal. The RF frequency of these signals is separated by 8 kHz. The local oscillator frequencies are derived from the same frequency synthesizer used to generate the RF transmitter carrier frequencies. The output of the Course mixer consists of the Course RF input spectrum down converted to an 8 kHz intermediate frequency (IF) while the Clearance signal spectrum is translated to an IF centered on 0 Hz. Similarly, the Clearance mixer outputs the clearance RF input frequency to an IF centered at 8 kHz and the Course RF input is output at an IF centered on 0 Hz. High pass filters at the output of each mixer attenuate the DC and 90 Hz and 150 Hz components of the undesired signal and pass the desired 8 kHz IF signals. The 8 kHz IF signals are processed to create the appropriate monitoring signals which are fed via the INTFC board to the monitor 1 and 2. The location of the Stby and On−Air Combiner (SOAC) is shown in Fig. 3−6. 3−6. * and LLZ with LPD−antenna ** with LLZ and Dipole/reflector antenna

Posn./CRS GP * Integral Network Path

Clearance

1)

Antenna system Integral Network (LLZ)** Integral Sensors (LLZ)*

Posn./CRS

GP A1/LLZ CRS Posn. GP A2/LLZ Width GP A3/LLZ CLR Width

On−Air down converter combiner

Clearance frequency (CRS L.O.)

SYN TX2 via MODPA(CLR)

Course frequency (CLR L.O.)

DC supply in

Stby GP CRS CSB A2 RF Stby


Stby CRS CSB/GP A1 Stby CRS SBO/GP A3

Clearance

SYN TX1 via MODPA (CRS) SYN TX2 via MODPA (CRS) Transfer control from ECU

DC RF aerial

Width


NFM output

NFM Input

SYN TX1 via MODPA (CLR)

Width

Posn./CRS Standby down concverter combiner

Width


Clearance

Stby CLR CSB Stby CLR SBO* 1) with GP−2F active

Fig. Fig. 3−32 3−32 Ed. 10.04 01.04

Stby Stby and and On On−A −Air ir Comb Combin iner er,, over overvi view ew SOAC

3−45

GP 422

ILS 420


3.3.4.4.1 3.3.4.4.1


Operation of a typical Down Conversion Channel (On−air)

See Fig. 3−33, 3−33, 3−34. 3−34. The following section describes the main functions of the Stby and On−Air Combiner (SOAC). Hereby some functional parts used in GP applications are also described which are not used in LLZ. The combiner consists of a number of identical down converter channels which may be configured to monitor both the on−air and standby transmitters of a dual frequency Localizer or Glide Path. Operation of all channels is essentially the same, with the major difference being that the on−air monitor channels have more gain and dynamic range than the channels for monitoring of the standby transmitter. The operation of a typical channel (example: "A3 Input") is described in the following. This channel is used for monitoring either the A3 antenna of a Glide Path, or the CRS WIDTH WI DTH Input from a Localizer combiner. combiner. The signal routing is defined with jumper bank J19, set for GP to ’3−4’ or ’1−2’. Signals are Input at J7 and routed to a power splitter. The power splitter is used to make a portion of the signal available to the clearance down converter for certain applications, such as monitoring the clearance level at A3 of an M−array (GP only). This option is selected with jumpers (JP11). After the power splitter means are provided to adjust the dynamic range of the down converter to handle the specified −46 to +17 dBm RF input range. Coarse adjustment of the RF level is accomplished with two fixed 10 dB aftenuators which may be switched in or out by means of jumpers (JP7,8). In addition, other jumpers (JP9,10) enable selection of either a −5 dB attenuator or an amplifier having a gain of +15 dB. Thus a total adjustment range of −25 to +15 dB of gain is provided. This is sufficient to ensure that the mixer operates well within its dynamic range under all input signal conditions. From JP10 the signal is routed to the down conversion mixer, mixer, and converted to the 8 kHz intermediate frequency (IF). Passing a passive RF filter the signal is fed to R43. This potentiometer provides fine adjustment of the signal level on the output ou tput of the mixer. mixer. It enables continuous adjustment of the IF level over a 20 dB dynamic range. From the IF gain control, the 8 kHz IF signal is routed to a high pass active filter having a 2 kHz cut off frequency, frequency, and a gain of 20 dB. This filter rejects the undesired 90 and 150 Hz components. Next the signal is routed to a low pass filter with a 20 kHz cut off frequency. These stages provide an additional gain of 18 dB. The combination of the 2 kHz high pass and 20 kHz low pass filters provide a band pass response which is very flat at the 8 kHz IF frequency and which rolls off sharply at 150 Hz and 50 kHz. Attenuation of signals above 20 kHz is desirable to avoid interference from nearby transmitters, or the transfer switch power supply which operates at 50 kHz. From the filters, the signal is routed to a temperature compensation circuit which is required to overcome a slight variation in conversion loss of the mixer’s with temperature. Increasing temperature results in slightly less output from the mixers. The temperature compensation circuit is simply a voltage divider with a negative temperature coefficient thermistor connected to increase the input to the operational amplifier as temperature increases. From the temperature compensation circuit, the 8 kHz signal is routed different ways for GP and LLZ depending on the configuration selected. For LLZ it is routed as fixed phase signal via switch S5 to a fixed phase network and then to a adjustable phase shifter network (R166) which allows phase compensation during field alignment. The signal is next fed to the output (TP53) as CRS WIDTH adjustable via R383 and R382. For GP applications the signal is routed to an adjustable phase shift network (not used in LLZ), which is used in conjunction with similar networks in the A1 and A2 channels, to remove any differences in the phase shift of the three down converter channels. To To do this an initial phase shifter is introduced which produces an adjustable lag (with R150) which is nominally 90°. This is done as part of the factory test process. Following the signal is routed to a second adjustable phase shifter which is used to phase match the monitor signals during system installation. The phase is adjusted with R146 which provides an adjustment range of +62° to −62°. This allows to match the phase difference of two channels (e.g. A3,A2) to 0° measured between TP9 and TP13.

3−46

SOAC

Ed. 10.04 01.04

ILS 420



Test point TP7 is provided to enable the installer to determine the center point of the adjustment range of by connecting an Ohmmeter from the test point to ground. This measurement may be made with the system powered because the wiper of the potentiometer is grounded. When the resistance from TP7 to ground is 3.7k the wiper is at the center of the available phase adjustment range. Due to the non linear change in phase with resistance, the electrical center of the phase adjustment range is not the physical center of the resistance adjustment range. Each phase adjustment on the combiner board has a similar test point to enable the installer to determine the center point point of the phase adjustment range and, by noting the resistance, approximately how much phase shift has been introduced.

3.3.4.4.2 3.3.4.4.2

Standby Channels

See Fig. 3−33, 3−33, 3−34. 3−34. Operation of the standby transmitter monitor converter channels is similar to the on−air channels. The notable exceptions being that less gain is required and the IF does not have a 20 kHz low pass filter. A low pass filter is not required due to the benign interference situation resulting from the direct connection between the Standby transmitter and the Standby combiner circuits. The arrangement of the phase shifters in the course and clearance standby converter lF pathes are different, but the operational concept is the same. In all cases there is a factory alignment which takes out any difference in down conversion phase tracking between channels (e.g. R123, R305) and a "field" phase ad justment (e.g. R136, R136, R524*) to phase phase the monitor during installation. installation. For monitoring the active Glide Glide Path standby transmitter, three standby down converters are required: CSB1/A1, SBO, CSB2/A2. JP46 must be set to enable the A2 channel for active GP (not used in LLZ). (* GP−2F active only)

3.3.4.4.3 3.3.4.4.3

Antenna Configuration Signal Processing Selection

See Fig. 3−33, 3−33, 3−34, 3−34, 3−35. 3−35. The outputs of the three on−air combiner channels are routed, either directly from the IF output, or from the outputs of the phase shifters, by means of analog switches which send the signals to the combining network. To To simplify setup of the combiner for a particular antenna type, a single si ngle jumper is installed between two pins of J19. This, in conjunction with the diode matrix is sufficient to set all of analog switches to the correct position for each supported antenna configuration. Depending upon the system configuration, Glide Path or Localizer, and antenna array type, this network is configured to provide the required combining functions. functions . In the case of a GP−2F (M−Type) (M−Type) the input signals of A1 IN, A2 IN and A3 IN are combined combined to the signal CRS Width. The presence presence of a real diode causes +5 V to be applied to the related switch and that causes the switch (S1 to S8) to be changed from A− COM to B− COM. The setting setting for for the active active and standard standard GP−2F GP−2F M−Type M−Type is shown shown in Fig. 3−35. 3−35. J19/3−4

"M−array TSIS" (GP−2F active or standard):


1 2 3 4 5 6 7 8 x x x x x x x x

J19/1−2

"M−array (GP−2F standard only):


1 2 3 4 5 6 7 8 x x x x x x x x

GP−2F active: Diode CR10 (for S1) must not be assembled!

Fig. Fig. 3−35 3−35

J19, J19, exam example ple switch switch setting setting for GP−2F GP−2F active active and standar standard d M−Ar M−Array ray mode mode

3.3.4.4.4 3.3.4.4.4

Local Oscillator Switching and Distribution

See Fig. 3−33. 3−33. The local oscillator signals for the mixers are obtained from output connectors on the RF power amplifiers (MODPA). These signals are routed to input connectors on the SOAC. Two signals are required, one from TX1, and one from TX2. From the input connector the LO signal is routed to a jumper which either passes it directly to the LO transfer switch or to a resistive RF sampling network. Ed. 10.04 01.04

SOAC

3−49

GP 422

ILS 420



In ILS 420, the signal is sent directly to the LO transfer switch by setting the jumpers. The expected LO power with this connection is −5 (±5) dBrn and is not at all critical because the LO amplifier operates in saturation. The LO transfer switch is controlled by a logic signal (TRAN−1−ON−LOW). When this signal is ’low’, TX1 is on the antenna and the TX1 LO signals are sent to the on−air combiner down converters, while the TX2 LO signals are sent to the standby down converters. This signal may be monitored at TP55. The LO signals are a re amplified to obtain the required LO power for the mixers. All LO signals are distributed in shielded phase matched 50 Ohm strip lines run on an inner layer of the printed circuit board. The logic signal is also fed through to the PIN−diode transfer switch.

3.3.4.4.5

DC supply for PIN−Diode PIN−Diod e Transfer Switch

The 24 V supply for the PIN−diode transfer switch is "ORed" on the SOAC board by diodes.

CAUTION Do not accidentally ground these diodes by a scope probe ground lead or other test lead.

3.3.4.4.6 3.3.4.4.6

Additional Functions

Additional functions, functions, i.e. optional optional phase phase detector detector operation, operation, are are implem implemented ented in the SOAC which which conconcern the GP system only. This measurement feature is i s selected with JP43. JP41 and an d potentiometer R485 are used in this application. The phase detector provides phase measurement of A2, A3 compared to fixed phase of A1. The output signal (TP86) is a DC−voltage which is proportional to the phase difference of the two input signals. The out signal is supplied at the BP−Digital to the monitors but not evaluated as standard. JP43 1

phase zero adjustment R485

TP67

2

A1−IF−adj. phase phase A1−fixed phase CLR A1 fixed phase CLR A3 fixed phase A3−IF adj. phase A3−IF fixed phase A2 fixed phase A2/A3−IF adj. phase

8 kHz squ squari aring ng ampl amplifier i fier

Phase detector out

Phase Phase dete detecto ctorr

TP69 IN

TP68

JP41

adjustable 90° lead

0°

to BP−digital, J18: 25 CSC_PHS_DET_A 26_CSC_PHS_DET_B

20 Hz 180°

1 V = 10° phase difference or relative phase change

TP70 15 16

Fig. Fig. 3−36 3−36

GP phas phase e det detec ecto torr app applilica cati tion on (opt (optio iona nal) l)

RF connectors rear: GP Nearfield A1 LLZ

A2

Nearfield CRS Posn..

J10

CRS Stby CRS Stby CRS Stby A1 CSB1 CSB A2 SBO A3

A3 CRS Width

J9

J8

CRS Stby CSB

J7

CRS Stby SBO

J2

J47

J17

RFcwCLR TX2

R90

R62

R240

R166

J13

TP70

R150

R133

R327

R318

R305

R353

R345

TP68

R499

R312

R343

R146

1 7 P T

R524

J19

RFcwCRS TX1

J15

JP41

R136

R217

R286

TP69

RFcwCLR TX1

R123

J12

RFcwCRS TX2

R511 R25

J5

R189 R383 R372 R386 R185 R379

J11

R275

R382

J16 J14

TP67

R43

J3

CLR Stby CLR Stby SBO CSB

J18

R485

R2

R105

CLR Width(2) CLR Width(1)

J6

J4 J1

CLR Stby

12

R377 TP62 TP65

TP59 GND

TP66

TP60

TP63

TP61

TP64

TP18

TP15

TP14

TP17

TP13 TP16

TP10

TP11

TP7

TP12

TP6

TP2

TP9 TP8 TP3 T P7 P7 4 T P7 P7 6 T P7 P7 2

TP1

TP5

TP24

JP43

TP4

TP56

TP57

J20

TP58 GND TP30

TP55

TP29 TP26

TP53 TP47 TP49 TP37

TP25 TP27

J21

TP22 T P3 P31

TP 21 21

TP19

TP23

TP20

TP39 TP34

TP41 TP77 TP75 TP73 TP51

Fig. Fig. 3−37 3−37

3−50

Stby Stby and and On− On−Ai Airr Com Combi bine nerr (SO (SOAC AC), ), fron frontt vie view w SOAC

Ed. 10.04 01.04

ILS 420

GP 422 LRCI Subassemblies


3.3.5

LRCI Subassemblies

The local remote communication interface functional unit (LRCI) is the focal point for communication between the various functional fu nctional groups, the local control panel (LCP) and the remote remote control. The LRCI LRCI consists of the following subassemblies: − Local Control Panel − Modem for dedicated line − Modem for switched line

(LCP) (LGM1200MD, Pa Party Line) (LGM 28.8)

Each installation ins tallation contains an a n LCP, LCP, which controls the th e LRCI functions and is responsible for local control and the local main status of the station. In addition to the serial interfaces for communication with the monitor and transmitter processors (LG−M and LG−A) and the Executive Control Unit (ECU), it has RS232 interfaces for connecting locally to a standard PC that is loaded with the PC User Program software, and it controls communication with the remote site via the modems.

3.3.5.1

Local Co Control Panel (L (LCP)

The LCP consists of two separate boards: − Local Control CPU board board (LC−CPU) (LC−CPU) − Local Local Control Control Interf Interface ace (LCI) (LCI) The location of the LCP is shown in Fig. 3−6. 3−6.

LG−A

LG−M

ECU

LG−A

LG−M

PC local

PC−Remote

BCPS

Modems

TX1

TX2

RS232

in/out opto out

RS232

RS232

RS232/485/TTL opto out opto in

opto in spare

in

opto out spare

out

Local Control CPU (LC−CPU)

in/out

Local Control Interface (LCI)

Fig. 3−38 Ed. 07.06 01.04

LCP, overview SOAC

3−51

GP 422

ILS 420

LRCI Subassemblies

3.3.5.1.1


Local Control CPU (LC−CPU)

See Fig. 3−39. 3−39. The LC−CPU and its processor comprise the switching center between the operator side (local or remote) and the four subsystems of a dual Navaids system (two transmitters and two monitors). Its most important tasks are as follows: − Communication Communication control and communica communication tion with the various functional functional units (e.g. transmitter internal, other systems like DME etc.) − Sequ Sequen ence ce contr control ol − Executive Executive command commandss (e.g. (e.g. to ECU) − Local display display control and local local operation operation − Remo Remote te cont contro roll − Battery measurement measurement and monitoring monitoring The LC−CPU board is equipped for these tasks with the peripherals needed for various purposes. The CPU function is built by an individual CPU board (PC104 compatible), which is inserted to a DIMM−connector on the LC−CPU board. The processor functions are defined by the associated software. The respective memory area (EEPROM, DRAM, Flash memory) is located on the CPU board. R/W−operation of the RAM−disk is indicated by a flashing HD−LED. The real−time clock is battery backed−up via X36. The supervisory controller (D83) manages the battery voltage supervision, watch dog enabling (X35), and reset reset switch (S2). A live LED (H1) connected to the supervisory controller indicates the LC−CPU is operable. The LC−CPU board provides 10 serial communication ports. The serial communication controllers (SCC) used have two channels each. Each channel has its own interrupt connected to an interrupt request line on the PC104 bus. The serial controller clock input for baud rate generation generation is 1.8432 MHz (standard PC COM). Three serial ports are provided with a jumper selectable signal interface which can be set to RS232, RS422, RS485 or TTL. Each selectable port has an associated jumper bank: − port 3: 3: X95, X95, X24, X24, X41, X25...32 X25...32 − port 4: 4: X99, X99, X15, X15, X40, X16...23 X16...23 − port 5: 5: X8, X9, X11...1 X11...14, 4, X37...39 X37...39 The following equipment functions and components are controlled via the serial interfaces: − − − − −

Communication Communication between between the transmitter and monitor monitor processors processors (channel 1, 2, 9, 10) Communication Communication with ECU (channel (channel 5) Communication Communication with the local PC control unit (user program program software) software) (channel (channel 8) Communication Communication with the remote remote PC control control unit via via modem (channel (channel 6) Additional Additional communication communication channels channels via serial interface interface or modem, spare spare (channel 3, 4, 7)

The LC−CPU board provides several I/O registers with specialized signal function. After reset, all output register are a re cleared to zero. The Input/Output register function is used mainly to control both transmitters. mitters . Registers Regi sters 4, 5 (IN) and 6 (OUT) are used for signal exchange from/to from/to the ECU. The Local Control Interface (LCI) is controlled via registers 4,5 (OUT) and 3 (IN). Signal BFUSE from the battery switch signals an interruption of battery supply and is fed via register 5 (IN) to the LC−CPU. The additional optocoupler inputs (Addin1 to 4) to register 7 (IN) are spare. Additional executive commands (Addout1 to 6) can be supplied via register 7 (OUT) to optocouplers. Addout1 and Addout2 are used to switch the AC/DC power supply, BCPS OFF (AC DC ENA 1 and AC DC ENA 2). The other outputs Addout 3 to 6 are spare.

3−52

SOAC

Ed. 07.06 01.04

ILS 420


Equipment Description Optocoupler SCC 16552

Input Register 1

parallel IN 8x X2 spare

8

8

P

D10

port2

S

2 8 parallel IN 8x level configurable

D50

8

P

8 bit

X2

D23

8

parallel OUT 16x spare

8

ADB1..8: Alarm Smoke, AC Fail 1 / 2 Batt Disconnect other spare

Input Register 4 D1

X6

8

ADB9..12: BFUSE, AC DC OFF 1 / 2, spare X6 Alarm Intrusion other spare

other spare

port4

to UARTS (SCC)

8 bit

D71

4 4

X6

PAL Decoder D80

Input Register 5 D2

8

RS232 Rx/Tx

port6

X1

Channel 2 TX2

X1

Channel 3 LGM 2/DME PC Com 3

configuration jumpers

RS485/ 422 TTL

X1

TTL

X1

D72

D0...7 Output Register 4,5

port9

RS232 Rx/Tx

port7

RS232 Rx/Tx

X6

P

X1

D39,38 commands Ubat Fault

Channel 6 LGM1 RC−Unit Channel 9 Mon 1

SCC 16552

16 bit


Channel 4 LGM 3/NDB PC Com 4

configuration jumpers

A0...3 S

Indication control

RS232 Rx/Tx

RS232 Rx/Tx SCC 16552 P

I/O Decoder D65,68

Output Register 6 D7

to BP−Digital CTL bit 7

S

D29 Interface Register

(Alarm RST Smoke)

port3

2

16

from BP−Digital

Channel 1 TX1

RS485/ 422 TTL

SCC 16552

Output Register 1

Optocoupler

X1

D63

8 bit

spare X2

RS232 Rx/Tx

8 bit

Optocoupler

level conf. X81...84

port 1

Input Register 3

S

8 bit

D78

port8

D13

RS232 Rx/Tx

X4

Channel 7 PC Com 2 not used

Channel 8 PC Com 1 Local PC

Out5...7

Output Register 3

TTL

X7

not used

SCC 16552

8 bit

X2

RS485/ 422 TTL

D41

P port5

RS232 Rx/Tx

Control S

33/100* MHz Process. clock

port10

PC104 board

X1 configuration jumpers

RS232 Rx/Tx

X6

D64

Data bus

Optocoupler Input Register 7

Reset S2

Battery SL−389 3,6 V

8 bit

microprocess. Supervisory

Ubat Fault

IRQ 3...6 10 14...15

D83

watch dog on

TTL

not used

Input Register 6 8 bit

D62 S1/1...8*

* for optional use, not assembled

Ed. 08.04 01.04

4

Parallel Addin 1..4 spare

Optocoupler

1.8432 MHz

X2

Fig. Fig. 3−39 3−39

U36...39

from BP−Digital

D74

battery on

Life LED

D33

SCC clock

4

X6

to D13

X35 X36

Channel 10 Mon 2

Address bus

DIMM−PC/386−I or DIMM−PC/520−I

PAL Decoder D86

Channel 5 ECU (ILS 420)

to X6 BP−Digital Parallel Addout1,2: 6 AC DC ENA 1, 2 8 bit 6 Addout3...6 U3..6,16,17 D17 spare from X56,X55,X54 DCC−5/15/15 power supply (+5/−15/GND) X5 not used via BP−Digital Output Register 7

Loca Locall Con Contr trol ol CPU CPU (LC (LC−C −CPU PU), ), bloc blockk dia diagr gram am SOAC

3−53

GP 422

ILS 420

LRCI Subassemblies


Auxiliary optocoupler optocoupler isolated inputs via regis register ter 1,2 (IN) and optocoupl optocoupler er isola isolated ted outputs outputs via via register register 1,2 (OUT) may be used for additional user features. The parallel, isolated inputs and outputs can be reserved for various analog signals si gnals to supply additional information info rmation (e.g. burglary alarm, fire fire etc.). The auxiliary inputs (IAUX8 to 15) can be set to high or low level logic with jumper X81 to 84. The auxiliary outputs and inputs are available on top of the cabinet via Sub−D connectors. The battery backup function on the LC−CPU board is connected to the CPU board for real−time clock supply. The battery is a 0.8 Ah non rechargeable Lithium cell with a voltage rating of 3.6 V. The battery backup function is enabled if jumper X36 is closed. The battery voltage is compared against a fixed reference voltage. If the voltage drops to <2.9 V, a BIT signal is generated by the supervisory circuit D83. The LC−CPU has its own RESET signal controlled by the switch S2 at the supervisory circuit D83. This signal is ORed with the reset on the CPU board. The watch−dog on the LC−CPU board is active if jumper X35 is closed and if enabled by software. Additional connector connectorss are provided provided on the LC−CPU LC−CPU board board but but not used. used. They They are designed designed for optiooptional connections of a keyboard (X10), printer (X53), an ethernet line (X100), or DME/NDB (X50 to 52).

3.3.5.1.2

CPU Board (PC/386−I or PC/520−I))

See Fig. 3−40. 3−40. The CPU board is a PC104 compatible PC and consists of the following main components: − − − −

Processor 80386SX or 586DX* St Standard AMI BIOS address, data, control bus Re Real−time clock

− − − −

EEPROM (setup data) 4 MB or 32 MB* DRAM Flash hard disk (8 MB or 32 MB*) su supervisory circuit

The CPU board has its own RESET signal. This signal is ORed with the push button reset line coming from switch S2 on the LC−CPU board. The watchdog of the CPU board is not activated. The CPU board is located piggy back on the LC−CPU board. I/O controller

33/100* MHz Process. clock

Address

Processor 80386SX or 586DX*

Data

to/from LC−CPU board

Control

uP Super− visory

BIOS EEPROM

Real time clock

EEPROM Set Up data

DRAM 4 MB (32 MB)*

Flash disk 8 MB (32 MB)* Battery supply

32.768 kHz

Watch Dog/Reset HD−LED

* with DIMM−PC/520−I

Fig. ig. 3−40

3−54

CPU boa boarrd, bl block di diagram SOAC

Ed. 08.04 01.04

ILS 420



3.3.5.1.3


See Fig. 3−41, 3−41, 3−42. 3−42. The Local Control Interface (LCI) is the operators local interface. Its indicators show the local main status, and an d its liquid crystal display (LCD) screen gives local operator access to critical control functions and to historical transmitter and monitor measurement data. The menu based operation is achieved with four control buttons below the LCD−screen. It includes a key locked switch function that switches from local to remote control or to maintenance local operation. The graphics LCD screen can display up to 16 lines with up to 40 characters. The LCI is flush mounted in the front door.

LCI

LC−CPU Alarm device device

Audible device driver

B1

X9

Indicators

H1 to 3

control lines in/out

Indicator driver

Data display data

Liquid Crystal Display Screen (TFT)

brightness R1

control button S1 to S4

DC supply

Key control

X4

key lock

Fig. Fig. 3−41 3−41

Interface

Loca Locall Cont Contro roll Inte Interf rfac ace e (LC (LCI) I),, blo block ck dia diagr gram am liquid crystal display screen

ALARM

main status status indication

TX 1:

WARNING

ILS 420 GLIDEPATH −−−−−−−−−−−−−−−−−− ON TX 2: ON STANDBY MAIN LOAD AERIAL 146 hrs. 145 hrs.

Monitor: Executive: Far Field: Standby:

NORMAL

−−1−− NORMAL NORMAL NORMAL

−−2−− NORMAL NORMAL NORMAL

Maintenance MENU

MONITOR

ALERTS

CONTROL

REMOTE LOCAL

key−lock switch

MAINTENANCE

S1

Fig. Fig. 3−42 3−42 Ed. 01.04

S2

S3

S4

control buttons

Local Local Contr Control ol Inter Interfac face e (LCI), (LCI), visible visible front front view view (text (text exam example ple:: syste system m status status screen screen)) SOAC

3−55

GP 422

ILS 420

LRCI Subassemblies


3.3.5.2

Modem

3.3.5.2.1 3.3.5.2.1

Dedicated Line Modem LGM1200MD

See Fig. 3−43. 3−43. The LGM 1200MD is a universally applicable half duplex permanent line modem. The data transfer rate is 1200 or 600 bit/s. The LGM 1200MD (MD=multidrop) is optimised for operation on permanent two−wire lines in the "party line" mode. In the party line mode, several modems are served by a control station via one line only (polling mode). The LGM 1200MD operates in the voice band with FSK modulation, its frequency shift keying conforms with V.23 at 1300 Hz and 2100 Hz with up to 1200 bit/s and 1300 Hz and 1700 Hz with up to 600 bit/s. The data transfer method is half duplex or simplex. Generation of interfering trailing bits (on deactivation of the remote transmitter) is largely excluded by process−controlled "fast clamping" of the received data. In the asynchronous mode, data transfer from 0 to 1200 bit/s or 0 to 600 bit/s is possible, independently of the code and speed. A microcomputer controls and monitors all functions of the LGM. Parameters for the processor and processor−independent circuitry can be influenced by means of 14 adjacent coding switches. A power−on self−test is run. LEDs indicate transmit and receive data activity or line seizure. The connected trunk lines are accessible via an ISEP test socket on the front panel (for monitoring the t he analog line signal). When the "TEST" key on the front panel is pressed, the modem switches to the "close range analog loop" (without transmitter) while the key is pressed. This is also active during the transmission phase (the connection is then aborted). In half duplex mode on two−wire connections, each participating data transmission equipment seizes the telephone line in succession. The respective DTE responsible for transmission controls operation with the t he 105/S2/RTS (ready to send) signal. This activates the t he modem’s carrier. carrier. The DTE must only offer data to the modem via the 103/D1/TD line. There is a preset delay after the "ready to send" has elapsed and then the modem switches the 106/M2/CTS ("clear to send"). During the delay time between the "ready to send" 105/S2/RTS and "clear to send" 106/M2/CTS signals, the signal detector of the receiving modem will already react and will adapt the clock signals of the receiver to the clock pulse of the incoming signals. transmit path

Over− voltage protection a2 La Lb b2 E connection 2−wire line

Level adaptation

TxA FSK signal converter

Level adaptation

RxA

Filter

receive path

TD

Microprocessor RD DIL switch

Set 1...14

Fig. ig. 3− 3−43

3−56

TTL/V.24 interface Data in/out

LGM12 M1200MD, bl block ock di diagr agram SOAC

Ed. 01.04

ILS 420

GP 422


LRCI Subassemblies

With the 109/M5/DCD (receive signal level) signal, the receiving modem indicates that it is capable of forwarding received data (104/D2/RD). (104/D2/RD). If the 109/M5/DCD 109/M5/DCD (receive signal level level)) signal is not in the ON state, the receive interface line (104/D2/RD) is in the "I" state. A so−called fast clamping circuit is integrated in the th e LGM1200MD to avoid trailing bits during reception. It is processor−controlled, processor−controlled, and no more than 1 byte can occur as a trailing byte.

NOTE:

When using the LGM1200MD the permanent line must be equipped with a termination (600 Ohm/47 nF parallel) at the point where it ends (station and remote ends). The R/C combination can be soldered onto the 9pin SubD connector together with the two−wire line.

The location of the LGM1200D is shown in Fig. 3−6. 3−6.

3.3.5.2.2 3.3.5.2.2

Switched Line Modem LGM 28.8

See Fig. 3−44. 3−44. The LGM 28.8 high speed modems are for duplex operation, and they support all common duplex modulation procedures. The modems are designed for synchronous as well as asynchronous data transmission according to the following CCITT modulation modes: V.34 (only LGM28.8), V.32bis, V.32, V.22bis, V.22, and V.21, which have implemented the data securing procedures according to V.42 and MNP4. Data compressing to increase the baud rate is implemented according to V.42bis and MNP5. These procedures enable a practical fault free transmission between two data terminal equipment (DTE) units. Depending on the procedure, the transmission rate can be increased up to 38400 Bd (autobaud) using V.42bis V.42bis and the AT−mode/reliable AT−mode/reliable mode. The modems can also communicate with modems from other vendors at the same transmission rates, provided these modems comply with CCITT Recommendations V.22 and V.22bis. Software configuration is possible using AT or DNL commands while hardware configuration is performed employing the DIP switches located at the bottom and on one side of the module. It is designed for operation in public switched networks and consequently equipped with an integrated automatic dialing facility (IAWD). The subscriber can, however, set up Data connections by dialing manually and pressing the data key. Point−to−point operation on dedicated lines (leased or tie lines) is likewise possible. Almost all the modem functions can be set by the data terminal equipment (DTE) using a command set in accordance with CCITT Recommendation V.25bis. V.25bis. Correct operation of the microprocessor and the signal processors is monitored by an integrated circuit, which initiates a "master reset" if one of these processors malfunctions (watchdog). A data connection conn ection can be set up by means of either eith er the integrated automatic dialing facility or the automatic call acceptance feature. It is also possible to dial out or to accept incoming calls manually. No dialing takes place on dedicated lines. All the V.25bis commands and messages are exchanged via the interfaces which are also used to transfer the actual data. After a call request with identification, the LGM checks whether the subscriber line is already busy, i.e. whether the subscriber is in the process of making a call. If not, the outside line is seized. The LGM then transmits the dialed digits which have previously been transmitted by the DTE. After the dialing procedure, an intermittent 1300 Hz tone is transmitted and the modem waits for a constant 2100 Hz answer tone. As soon as this answer tone − which is transmitted by modems with an automatic call acceptance facility − is identified, the two modems start the prolog (handshake). A data connection can only be terminated by the DTE, unless there is no carrier for more than 250 ms/10 s. In this case, the line seizure is canceled by the LGM. Ed. 01.04

SOAC

3−57

GP 422

ILS 420

LRCI Subassemblies


Eighteen switches are provided on the pc board for presetting the seven different operating modes, the four communication protocols and various other parameters. A self−test is performed each time the modem is switched on. The default setup is as follows: 2400 bd, V.22bis, autodial. If autodial is set, the connection is set up automatically by the modem. The telephone number is notified to the modem by means of a request (command). This call request with identification can be preceded by a command for setting the transmission parameters. The command and the desired data (transmission parameters and telephone number) can be transmitted automatically using the communication software; that is, the user does not need to be concerned with this. The location of the LGM 28.8 is shown in Fig. 3−6. 3−6.

Busy detection

La a2 Lb

Modem controller

b2 Ringing tone detection

Data key detection

G E Setting

Fig. ig. 3−44

3−58

LGM 28 28.8, block dia diag gram

SOAC

Ed. 01.04

ILS 420

GP 422 Power Supply Subassemblies


3.3.6

Power Supply

The power supply of the Navaids 400 installation is taken from mains (nom. 115 to 230 VAC) or from an existing DC power supply (nom. 48 V). The equipment contains therefore a mains module with battery charger (BCPS). The BCPS is modular in a building−block concept with up to two AC/DC converter ACC−54 connected in parallel, and individual DC/DC converter to generate the necessary voltages. A low voltage sensor (LVS) cuts off the supply line to a connected emergency battery to prevent against deep discharge. The AC power supply is switched on or off at the ACC−54 modules while the DC supply is switched on or off by switches TX1 or TX2 located on a panel in front of the BCPS subrack. The location of the AC/DC, the DC/DC converters and the switches TX1/TX2 is shown in Fig. 3−6. 3−6.

3.3.6 .3.6.1 .1

Over Overvi view ew DC/D DC/DC C Con Convert verter er and and Power ower Swit Switch chin ing g

See Fig. 3−45. 3−45. A total of 3 DC converter converter are are required required for the DC voltage voltage supply; supply; these are subdivided subdivided into into 2 groups: groups: Group 1 supplies transmitter 1 and comprises the following unit: − DC converter converter +24 V/11 A nom., nom., +15 V/2.5 A, −15 −15 V/1 A, +5 V/3 V/3 A ( (DCC−MV) (DCC−MV) Group 2 supplies transmitter 2 and comprises the following unit: − DC converter converter +24 V/11 A nom., nom., +15 V/2.5 A, −15 −15 V/1 A, +5 V/3 V/3 A ( (DCC−MV) (DCC−MV) As soon as the AC/DC converter is switched on, switch S1 can be set to supply group group 1 and switch S2 group 2 with a DC supply voltage of +54 V. V. Once S1 or S2 are switched to ON, commonly used modules INTFC, ECU and the th e LRCI are supplied with DC (±15 V, V, 5 V). The DC converter DCC−5 supplies the LCP and the Modems when either switch S1 or S2 is on to enable operability operability if one or both of the DCC−MV may be shut down. S1 and S2 have an over−current protection function in addition to their manual switching function. They respond at >16 A for either switch.

NOTE:

The supply voltage of the DC converter described here is a rated 54 V for mains operation or 48 V for battery operation. In mains operation the operating voltage may rise to 65 V; in battery operation it may fall to 43 V (monitoring limits). The permitted input voltage range of the DC converter is therefore between 43 and 65 V. The term "variable input voltage" has therefore been used in a number of cases in the description which follows. The various voltage specifications should therefore be interpreted within this context.

The actual voltage value for measurement measurement purposes on the LG−A is derived directly behind the TX1 and TX2 switch. The line to the LG−A, and the DCC−5, is protected with a fuse: F4 (T1.0 A). A further fuse F5 (T6.3H) is used to protect the DC−supply of a collocated device. TX1/MON1 +24 V

INTFC/ECU/LRCI TX2/MON2 L/G−A 1/2

+5/+15/−15 V

DCC−MV /1

+5/+ +5/+15 15/− /−15 15 V

LCP/Modem

+24 +24 V

DCC−MV /2 **

+5 V

F4 48 V

DCC−5 LVS LVS

TX1 S1

TX2** S2

sense

Low Voltage Sense relay


Fig. ig. 3−45 Ed. 01.04

F5


Battery

** dual Version

Ove Ov erview power supply SOAC

3−59

GP 422

ILS 420

Power Supply Subassemblies

3.3.6.2


Low Voltage Se Sensor (L (LVS)

See Fig. 3−46. 3−46. The Low Voltage Sensor (LVS) comprises: − Low voltage sensor sensor circuits and drive drive stage for the cut off relay and a measurement measurement multiplexer multiplexer and, assembled also to the LVS circuit board, − the DCC−5 DCC−5 module module (IMS 25), see 3.3.6.3. 3.3.6.3. A low voltage voltage sensor sensor,, which which is built on a separ separate ate printed printed circui circuitt board board that that is on the back of the the BCPS backpanel, cuts off the battery supply line at a defined low voltage level. This level (40.8, (40.8, 43.2, 45 V) can be defined with jumper setting (X12, X13). To disable the low voltage cut off function jumper X11 must be open. In addition the low voltage sensor board contains a multiplexer MUX to fed through current/voltage measurement signals from/to BP−PS. The location of the LVS is shown in Fig. 3−6. 3−6. The optional On/Off control for DCC−MV is set fixed to On with jumper X14,X15. to BP−PS VCC +5 V

X9

X10

+54V

+54V

in

X8

X13

X11

REL

IBAT+ IBAT− INAV+ INAV−

MUX

X4

out

Low Voltage Sensor GND

Fig. Fig. 3−46 3−46

Low Low Vol Volta tage ge Sens Sensor or (LVS (LVS), ), bloc blockk dia diagr gram am

3.3.6.3

DC Converter 5 V (DCC−5)

X15

X2

Current measurement

sense 54 V

GND

X3

X14

X12

(on BP−PS)

X1

control

DC/DC converter DCC−5

54 VDC to battery

out

54 V

in

On/Off control DCC−MV (optional) LVS

See Fig. 3−47. 3−47. The DCC−5 subassembly is a DC converter, which generates a stabilized output voltage (5.1 V/3 A) for the LRCI subassemblies from a nominal input voltage of 54VDC (operating range 40...65V). It is located on the th e Low Voltage Sensor (LVS) board. The converter module is subdivided into a primary and a secondary section. The two sections are electrically isolated from each other in the power stage by a transformer. transformer. The DC supply voltage is converted into an AC voltage in a forward converter with a clock frequency of 30 kHz. The output is directly monitored and feedback to the primary control circuit via a pulse transformer, resulting in tight regulation of the output voltage. Current limitation is provided by the primary circuit. The DCC−5 is active when switches TX1 and/or TX2 are set to ON. Module Vo+ Vi+ 48 V

Vi−

Input Filter

5V/3 A

Forward Converter Vo−

GND

Conttrol

Fig. ig. 3−4 3−47 7

3−60

DC conv conve erte rter DCC DCC−5 −5,, blo block ck diagr iagram am SOAC

Ed. 01.04

ILS 420

GP 422


3.3.6.4


DC Converter Multivolt (DCC−MV)

See Fig. 3−48. 3−48. The DCC−MV subassembly is a DC converter, converter, which generates four stabilized output voltages from a nominal input voltage of 54 V DC (operating range 40...65 V). The DCC−MV supplies the voltages below at the output: +24 V, V, nominal 11 A, A , max. 14 A +15 V, 2.5A −15 V, 1 A +5.2 V, 3 A. These voltages are referenced to a common neutral. The DCC−MV comprises a primary and secondary section. The two sections of the device are electrically isolated from each other both in the power section and in the control and monitoring circuit by means of transformers and optocouplers. In addition the primary on/off signal is coupled also via optocoupler. optocoupler. A LED located on the front signals the presence of the output voltage. The main functional units of the DCC−MV are: V Power section − Primary Primary safety safety and softstart softstart circuit circuit − Input Input filte filterr − Power Power conve conversi rsion on stage stage 24 V − Power Power conversion conversion stage stage 5 V and ±15 ±15 V − Rectifi Rectifier er and outp output ut filter filter − Voltage Voltage regulators regulators for ±15V V Control and monitoring section − Primary Primary controller controller including auxiliary voltage generator, generator, control input On/off, oscillator, pulse width modulator, modulator, controller con troller,, driver stage − Secondary Secondary controlle controllerr and monitor monitor including including voltage and current monitor moni tor 24 V and 5 V, over/under−voltage and temperature monitor, BIT/Alarm signalling The DC supply voltage is converted into an AC voltage in a forward converter (FWC) for 24 V and a flyback−converter (FBC) for 5 V and ±15 V. V. Both converter work with a clock frequency of approximately 100 kHz. A transformers each, which also ensures electrical isolation of the secondary section, transforms the input voltage to the required output voltage. The dc converter is primary protected against overcurrent or short circuit by means of fuse NSI1 (30 A).

If the input voltage is connected incorrectly, diode D1 will be enabled and the fuse is blown to prevent any damage. R1 prevents against overvoltage peaks up to 130 VAC. The power section is initially isolated from the input by means of the FET transistors T1,T2, which are controlled by IC1 and act as primary on/off switch. The ON or OFF command which enables the main and auxiliary voltage is supplied via optocoupler IC2. The incoming voltage is smoothed and noise is suppressed by L/C elements in the input filter. The voltage is reduced in the power conversion stage by means of electronically controlled chopping. IC5 as primary control circuit generates the chopping frequency of 100 kHz and controls both the driver stage T11...12,TR6 for the 24 V power section with OUT1 (FWC) and directly the 5 V/±15 V power section with OUT2 (FBC). Ed. 01.04

SOAC

3−61



The 24 V driver stage in turn controls the 24 V power section (FWC) consisting of FET transistors T3,4, building a bridge with D2,3. The bridge circuit chops the DC voltage. The chopped DC voltage is transformed by TR2 to the desired value, then rectified and smoothed via an output filter. The 5 V/±15 V power section (FBC) consists of FET transistor T5 and transformator TR3. T5 chops the DC voltage. The chopped DC voltage is transformed by TR3 to three desired values with three secondary windings. For the 5 V path the output voltage is rectified and smoothed via an output filter. The secondary output current is monitored via the voltage drop on a series resistor. For the ±15 V path the output voltages are rectified, smoothed and regulated to +15 V or −15 V with integrated voltage regulators IC101, 102. The regulated voltages are led via an smoothing output filter to the output. The input voltage for the auxiliary voltage generator is extracted after the smoothing stage. The auxiliary voltage for primary and secondary controller and monitoring circuits is generated by an individual converter built by IC3, T8 and TR5. It works with a clock frequency of approx. 100 kHz. The output voltage is regulated directly via the turn−on time of the power stage in order to obtain stabilized voltages of 24 V and 5 V. This regulation is implemented via the primary controller (IC5), which obtains its information from the various current and voltage sensor circuits. The regulation takes the form of changes in the pulse width, suppression of single clock pulses and deactivation. The operational reliability reliability of the converter is ensured by a number of monitoring circuits. The power power stages are protected against overvoltage, undervoltage and overcurrent conditions. It is interlocked in the event of an automatic deactivation resulting resulting from an overvoltage condition. condition. This interlock can can be cancelled by interrupting the power supply or by entering the Tx OFF and Tx ON commands at the keyboard of the rack or software command (PC). A primar primaryy or secondar secondaryy overcur overcurrent rent condition condition will lead to pulse pulse width width control, control, which which causes causes the output output voltage to be reduced. The current transformers TR1,TR4 monitor the primary power sections for overcurrent conditions, whilst the secondary output current is monitored via the voltage drop on a series resistor for the 24 V and 5 V path. As BIT signal a switch function, which indicates operation of the DC converter, is implemented. In the event of a malfunction FET transistor T102 becomes conductive and the front LED does not light.

3−62

SOAC

Ed. 01.04

ILS 420



Primary safety circuit

Filter

Primary power section

Secondary power section

Uin+ IC1 U

48 Vdc D1

T1,2

TR1

R1

Rectifier

D2 T3

Uin− NSI1/30 A 6.3x32mm

Filter + 24 V/11 A

TR2

28 V current −

T4

U0 D3

FWC current

Rectifier

Filter + 5 V/3 A 5 V current − U0

Rectifier

TR4

voltage regulator +15 V IC101

+ +15 V/2.5 A

TR3

−

T5

U0 Rectifier

FBC current

voltage regulator −15 V

U0

IC102

+

−15 V/1 A −

heat sink

test connector primary

Primary controller

θ

TR6

disable 5V

R173

IC5

disable 24V current FBC current FWC sync 2 Controller 24V Controller 5V overvoltage

enable 5 & 24 V ST1

T14 T12 OUT1

T10

T11

OUT2

OK LED Front panel IC9

TR5 sync2

Uaux. second.

IC3

enable 5 & 24 V

Remote On/Off

Uaux.

RT/CT IC2

ref. volt.

OUT

IC7 T8

Uaux. primary

temperature overvoltage undervoltage current monitor 24 V, 5 V

Uref IC8

IC6

reference voltages

Auxiliary voltage generator

voltage monitor 24 V, 5 V

Secondary controller and monitor

switch T102

BIT signal

test connector secondary disable keep alive

ST2

FWC = Forward Converter FBC = Flyback Converter

Fig. Fig. 3−48 3−48 Ed. 01.04

DC conv conver erte terr DCC DCC−M −MV V, bloc blockk diag diagra ram m SOAC

3−63

GP 422

ILS 420


3.3.6.5


AC/DC Converter (A (ACC−54)

See Fig. 3−49. 3−49. See Fig. 3−49. 3−49. The mains unit ACC−54 acts as a AC/DC converter which generates a stabilized 54 VDC voltage obtained from the mains voltage (wide range input: 115 VAC to 230 VAC, ±15 %). It is a push pull switched−mode converter with electrical isolation of the input and output. Up to two mains units connected in parallel buffer a 48V battery (24 lead cells), which can supply the connected navigation system with voltage for several hours if mains power fails. The output voltage is 54 V. This ensures that the battery charge is permanently maintained (2.25 V per cell, standby parallel operation). The supply to the navigation system from the mains and the battery trickle charge is still ensured in case of a power subrack failure. A power switch, a fuse, an LED, and two test jacks for the voltage ahead of the isolating diode are located on the front panel. The LED signals the presence of the equipment output voltage, but not of the battery voltage. The AC/DC converter consists mainly of the following functional groups: − Input section (primary) with noise suppression filter for AC − Power section (primary/secondary) − Flux converter converter controller controller (primary/se (primary/secondar condary) y) − DC/DC controller controller (primary/se (primary/secondar condary) y) − Output Output section section (seco (seconda ndary) ry) In the input section the input voltage of 230 VAC passes a fuse, an overvoltage protector, and an RF filter to prevent RF interference voltages. It is rectified with a bridge−connected rectifier and smoothed by an electrolytic capacitor. The subassembly also contains a resistor which limits the current inrush. This resistor is short−circuited by a relay contact (K1A) following current stabilization. The DC voltage generated in the mains board is chopped in the power pc board board with the aid of a push pull power circuit with a frequency of 20 kHz. The square wave voltage generated in this way is stepped down in a transformer and rectified. The input and output of the device are electrically isolated with the aid of this transformer. The DC voltage generated in this way is then smoothed with the aid of a number nu mber of chokes and filter capacitors. The voltage is fed via an RF R F output filter, to prevent RF interference voltages and a further fuse to the output terminals. The output voltage is regulated by modifying the pulse width for driving the switching transistor. transistor. The 20 kHz control pulses for the transistor chopper are generated in the flux converter controller. The output current is measured by means of the series resistor in the output line. The voltage drop at this resistor, which is a measure of the current flow, passes to the monitor DC/DC converter, where it serves as the actual value for current limiting. The clock generator (oscillator frequency 400 kHz) supplies, after the frequency division, the auxiliary voltage and the controller DC/DC converter. An appropriate circuit enables enables the pulse width to be modified so that the output voltage can remain roughly constant until the maximum output current of 12.2 A (with Ref. No. 58341 20101) respectively 14 A (with Ref. No. 58341 20102) is reached. When this current is reached, the pulse width is reduced accordingly. The resulting output characteristic is thus almost rectangular. The input quantities received by the controller are the output voltage of 54 V and the voltage drop at a series resistor. The pulse width is controlled by these quantities through a nominal/actual nominal/actual comparison. An additional circuit interrupts the generation of the control pulses in the case of an over−voltage  62 V at the output of the power pc board. In such cases the output voltage is also interrupted.

3−64

SOAC

Ed. 07.08 01.04

ILS 420



Any fault which occurs in the t he power supply triggers a BIT signal to the navigation navigat ion system e.g.: − − − −

fail failur ure e of one of the subracks connected in parallel under under−v −vol oltag tage e  45 V in one subrack over− over−vo volta ltage ge  62 V total failure failure of the power supply or mains

The appropriate WARNING WARNING is displayed for as long as the system is supplied with power by the battery. The fault can be localized following manual input of a fault interrogation.

Power section

OK LED Front panel test jack front panel +Vout

push pull converter F/6.3A

F/5A L

K1A

Filter

+

Filter 54 VDC

230 VAC N

−

PE

F/1A

−Vout

PE

voltage measurement UDC driver

C A C F P C A e g a t l o v

t n e m e r u s a e m t n e r r u c

current measurement IDC Temperature

I F C P

Control section

TEMP

heat sink

G C F P

V C F P C D e g a t l o v

O L V C A C A e g a t l o v

Flux converter controller

s i a l e r p u t e s f o l o r t n o c

I C D P t n e r r u c e g d i r b

DC/DC converter controller

Primary

e g d i r b / r e v i r d l o r t n o c

DC/DC converter controller Secondary

Primary Primary monitoring

n o r i e t t a r z e i v n c n r o o n y c h S x c C n u y F l F S P

Secondary output voltage output current overvoltage Temperature

setpoint control pulse modulation driver

PFCENA e g a t l o v y y r a r a ä i l i m i r x u P a

DC/DC converter monitor

n o r i t a e z t r i e n v o n C r h o N Y c c S n C C y S D D

R32 Fine adjustment output voltage for optimization of charging voltage

clock generator 400 kHz

divider

auxiliary voltage converter

Secondary auxiliary voltage

Remote On/Off

5 V/10 mA potential free Optocoupler in

Fig. Fig. 3−49 3−49 Ed. 01.04

Status

closed contact BIT−Signal potential free BCPSx (x= 1..4)

AC/D AC/DC C con conve vert rter er (ACC (ACC−5 −54) 4),, blo block ck diag diagra ram m SOAC

3−65


3−66


SOAC

Ed. 01.04

ILS 420

GP 422 Emergency Power Supply


CHAPTER 4 EMERGENCY POWER PO WER SUPPLY SUPPLY 4.1

GENERAL

For use in Navaids 400, a set of lead batteries, comprising four bloc batteries, is connected in parallel to the DC voltage supply from the mains unit BCPS. In case of a mains failure or disconnection of the primary voltage for maintenance purposes, it is used to supply the Thales navigation installation. Batteries, which are maintained at a permanent cell voltage of 2.25 V (standby parallel operation) by the BCPS, are supplied by Thales as standard for NAV−installations (Navaids 400). Battery sets are available as lead acid batteries (type Vb...) or maintenance free lead batteries (type 12 VE...) using an electrolyte which is fixed as a gel. Maintenance free lead batteries (type VE... series) can be installed in a battery compartNOTE: ment or shelf which does not require forced ventilation due to the type of batteries. The recommended battery battery type has a capacity tailored to the requirements of the Thales navigation installation. In such case should be noted, that the 54 V trickle charge voltage supplied by the BCPS is a fixed output and can not be changed therefore. NOTE: Alkaline batteries, e.g. Nickel Cadmium batteries, require a different charging method, and cannot therefore be used in conjunction with the power supply BCPS (module ACC 54, Ref. No. 58341 20100). Batteries supplied by the customer have to correspond to the specification of recommended battery sets. The following battery types are recommended for ILS−installations: System

Mode

Current at 48 V batt. operation

Capacity

Type *

No. of bloc batteries

Thales Ref. No. for battery set

ca. 13,73 A

54 Ah 68 Ah

Vb 12144 12 VE 75

4x 12 V bloc 4x 12 V bloc

83131 72242 83131 72253

ca. 6,31 A

36 Ah 46 Ah

Vb 12143 12 VE 50


83131 72241 83131 72251

ca. 9,13 A

36 Ah 46 Ah

Vb 12143 12 VE 50


83131 72241 83131 72251

ILS 420 LLZ−2F

hot stdby

GP−2F

hot stdby

GP−2F + DME415

hot stdby

*

Vb = lead lead acid acid batter batterie; ie; 12 VE xx= xx= mainten maintenance ance free battery battery

Dimensions and weight of the recommended bloc batteries: Type

Dimension [ L x D x H]

Weight [kg]

Weight of acid

Remarks

Vb 12143 Vb 12144 12 VE 50 12 VE 75

221 x 176 x 277 311 x 176 x 277 218 x 164 x 220 314 x 164 x 220

24.8 33.7 18.9 26.7

5.3 7.8 − −

− − − −

Discharge times (guiding values) by use of the recommended battery set: System

Mode

LLZ 421 GP 422 GP 422+DME

Type

Discharge time *

Remarks

Vb 12144 12 VE 75 Vb 12143 12 VE 50 Vb 12123 12 VE 50

ca. 4.5 h ca. 4.7 h ca. 7.7 h ca. 7.3 h ca. 5.1 h ca. 5.7 h

Times down to reaching the nominal over−discharge limit of the battery (manufacturer instruction)

*) The discharge times times are valid for an an environmental temperature of approx. approx. 20 °C. At lower temperature the the discharge times are decreased accordingly. accordingly.

Ed. 07.06

SOAC

4−1

GP 422

ILS 420

Emergency Power Supply

4.2


CONNECTION OF BATTERIES CAUTION Before the battery is connected the power supply unit BCPS must be connected to the mains, and the output voltage must have reached its rated value; the reaching of this level is displayed by lighting LED’s at the front panels of the AC/DC−converter in the cabinet.

The battery set is connected via two PVC−insulated cables as per DIN 57281, 16 mm2 (red and black or blue). The length of this connection is restricted to a maximum of 10 m for electrical reasons. The red cable should be connected to the positive terminal of the battery set (+), and the black cable to the minus terminal (−). It should be connected to the transmitter rack corresponding the polarity at the "B1+" and "B1−" terminals. The cables of "B1+" and "B1−" are fed via the fuse switch F20 (50 A) in the fuse box to protect the batteries. For monitoring purposes, the battery is connected via a measuring cable (5x 1.5 mm2) to the BCPS (terminals 2, 1, F, F, 0). This cable is connected on one hand to the terminals BAT0, BAT1 and BAT2 in the battery fuse box, and connects on the other hand the auxiliary contact (BFUSE) at the fuse switch F20 to terminals F, F. The measuring cables BAT0, BAT1, BAT2 are protected by the fuse switch F21 (0.2 A). The terminal signs for battery monitoring mean: BAT0 BAT1 BAT2

(0) (1) (2)

0 V or − 24 V (half battery vo voltage; not us used in IL ILS 420) 48 V or +

The test procedure for the battery measurement is described in the Technical Manual, Part 2, chapter 6, Maintenance (ILS), or chapter 5, Maintenance Ma intenance (CVOR/DVOR). The discharge times of the recommended batteries related to the NAV−systems concerned are listed in the table in section 4.1. 4.1.

CAUTION Maintenance−free batteries have to be set into operation within a half year after delivery to prevent drawback in lifetime of battery.

4−2

SOAC

Ed. 07.06

ILS 420

GP 422 RMMC


CHAPTER 5 REMOTE MAINTENANCE AND MONITORING CONFIGURATION (RMMC) 5.1

APPLICATION AND DESIGN

The Remote Maintenance and Monitoring Configuration (RMMC) is used for remote monitoring, operation and maintenance of all the connected navigation systems. The network has a radially configured architecture based on communication between the system components via switched or private lines in the public network and dedicated lines in private networks. The remote control system components allow all the networked navigation systems to be operated optionally from central points, from normal operation of the dual systems with automatic changeover in the event of a fault through manual operation to measurement and setting of all the possible signal parameters, as well as detailed fault analyses on the basis of a wide range of measured values. They facilitate new maintenance strategies, whereby importance is placed firstly on concentrating logistics and qualified personnel, and secondly on responding to specific failures with systematic maintenance activities rather than relying on periodic precautionary precautionary measures. This considerably considerably improves both maintenance efficiency and the economic efficiency of the systems throughout their service life. The RMMC can be composed of RCMS components and the PC User Program (e.g. ADRACS and/or the latest development, the MCS). Although these advantages only only apply to the modern modern generation of air traffic control systems developed by Thales ATM, with the navigational aids, namely the enroute navigational systems CVOR and DVOR, the approach and landing systems ILS and MLS, the ILS farfield monitor (FFM) for Localiser, Localiser, the TACAN 453 and the electronic TACAN antenna (ELTA (ELTA 200), the DME 415/435, and the NDB 436 radio beacons, the extensive range of interface boards makes it possible to incorporate other collocated systems in the remote control and monitoring strategy if desired.

MCS

RMC 443

Monitoring and Control System

Remote Maintenance Center

optional

RCSE 443

Controller WorkingPosition

CWP

CWP

INC REU Firewall Router

PSTN

LAN

National

RCMS 443

Remote Control and Monitoring System

RCSE 443 INC REU

RCMS 443 RCMS 443 Other systems

Fig. 5−1 Ed. 07.06

Stations

RMMC, overview SOAC

5−1

GP 422

ILS 420

RMMC


5.1.1

Hierarchy of of RM RMMC Re Remote Co Control Sy System Co Components

At the top, the Remote Maintenance Maintenance Center (RMC−C) is used as central point point to obtain an overview overview of the status of all available systems. The RMC−C is connected via dialing modems to the public PTT network to obtain serial data from the RMC−R, LCU 443 or RCMS 443. For MCS see section 5.1.3. 5.1.3. At the RMC−R the main status status of all all en−route en−route equipment equipment (CVOR, (CVOR, DME−Transponde DME−Transponderr and TACAN− TACAN− ground stations) of one defined region are displayed continuously at the indication and control panel (INC) of the RMC and at installed optional Remote Status Units (RSU) to the controller for en−route. Besides en−route subsystems, the main status of the Landing Systems ILS and MLS are also displayed for maintenance purposes. The RMC−R is also connected to the PTT network via autodialing modems. For special applications a fixed line interface int erface may be provided. For maintenance activities at the screen of the the Personal Computer maintenance data are a re displayed. The maintenance technician obtains all the data from the subsystems configured for this region with defined menus on the screen of the data terminal (PC). It is possible to use the ’PC User Program’ software (ADRACS or MCS) for maintenance purposes to control Navaids 400 family or System 4000 equipment at the remote site. For MLS the MLS−menu technique is employed as well as respective ELTA−, ELTA−, DME−, or TACAN−PC supervisory programs. The RCMS 443 and the NAV LCU 443 are link control units and provide central points for communication between RMC’s and the navaids systems. While the RCMS is connected via twisted telephone line pairs and modems to the ILS/MLS−equipment the NAV LCU 443 has direct RS−232/422 interfaces to the CVOR, DVOR, TACAN and ELTA−equipment, and DME. For small projects, it is possible to connect the NAV LCU of en−route navigation systems via switched lines to an RCMS. Remote Maintenance Center CENTRAL

RMC−C Remote Maintenance Center REGIONAL RMC−R

RMC−R

RMC−R

PTT network

RMS

RCMS 443 ILS

LCU 443 VOR LLZ

GP

MM LCP

VOR 4000

TAC

RCMS 443 MLS

ELTA

CVOR 431

TAC AZ

Fig. ig. 5−2 5−2

5−2

EL

ELTA

DME/P

Hier Hierar arcchy of the the RMMC RMMC syst syste em compo ompone nent ntss SOAC

Ed. 07.06

ILS 420

GP 422 RMMC


5.1.2

System Configuration

5.1.2.1

Local Remote Control Interface

The NAV stations communicate with the remote control system in different ways. The remote control interfaces which are provided locally vary according to the type of installation:

Type

Modem

Baudrate

Remark

600 bd

System 4000 (until ’92)

ZUA29

1200 bd (V.23)

System 4000 (since 1993), AN 400 (until 1999)

LGM1200MD

600/1200 bd (V.23) party line

SYSTEM 4000, AN 400 (since 1999)

LGM9600H1

1200 bd (V.23), half duplex

ILS MK20A

LGM14.4 LGM28.8

1200...19200 bd (V.32) 1200...38400 bd (V.34)

AN 400 (up to end 1999) AN 400 (since 1999)

Std. Std. bus bus mod modem em

1200 1200,, 240 2400, 0, 4800 4800,, 9600 9600

DME 415, 435, TAC 453

Dedicated line ZU1

Switched line

5.1.2 .1.2.2 .2

LGM724,(de LGM724,(desktop) sktop) 2400 bd (V.22b (V.22bis) is)

ELTA−200

LGM14.4 LGM28.8 LGM64K (ISDN)

LCU 443 (up to end 2000)

up to 14.4 kbd up to 28.8 kbd 64 kbd

Remo Remote te Cont Contrrol and and Stat Statu us Equip quipme men nt (RCS RCSE 443 443)

The RCSE is an REU with a control and indication panel (INC). It can be used as a simple, yet complete, remote control unit. The INC indicates the states of up to eight substations with the following LED displays: ALARM, WARNING, NORMAL, DATA COMmunication and MAINTENance. An alarm tone is sounded sounded if a status changes. changes. Each station station can can be selected selected by by pressing pressing a membrane membrane button, in order to activate the EQUIPment ON, OFF and CHANGEOVER functions and to indicate specific monitor alarms. An additional status indication device device is the control tower unit (CTU), which however, only indicates the NORMAL, WARNING and ALARM operating states of up to eight NAV stations. Its display brightness is adjustable to permit adaptation to the varying light conditions in the control tower. The CTU can be used in conjunction with a runway selector (RWY−SELECT), which activates activ ates the ILS systems in one approach direction and switches switches the other direction to a dummy load. This panel also indicates the general status of the two ILS systems (OPERATIONAL, DEGRADED, SHUT DOWN) and their availability (ENABLE) to aircraft as a landing aid. A variety of interface boards boards is available for serial or parallel parallel data I/O, I/O, installing an ETHERNET interface, connecting a PC and autodialing via the public network, so that the system has a considerable considerable potential for expansion. The connections to the NAV stations are set up via modems and telephone lines (600 ohms). The control and indication panels are connected by means of serial RS422 interfaces. Ed. 07.06

SOAC

5−3

GP 422

ILS 420

RMMC

5.1.2 .1.2.3 .3


Remo Remote te Con Contro trol an and Mo Monito itorin ring Sys System tem (RC (RCM MS 443 443))

The maintenance, fault analysis and documentation functions of the RMMC are implemented by connecting a PC system to the RCSE and installing the RMS or RCMS application software on it. The difference in the names is a reflection of the definitions laid down by the U.S. FAA. An RMS designed for maintenance purposes has direct, permanent access to the navigation systems via separate cable connections, and is operated independently of the Remote Control and Status Equipment (RCSE), while an RCMS uses the same communication paths for the maintenance functions as it does for remote control and monitoring. The following functions are provided: − − − − − − − − − − − −

System status status indication indication for each each connected connected system system Permanent Permanent indication indication of the general general status status of all systems systems Permanent Permanent indication indication of the current current date and time time Detailed Detailed status indications indications for for a selected selected system system Polling, Polling, display display and setting setting of system system parameters parameters Polling Polling of internal internal measured measured values values (BIT) (BIT) Continuous monitoring of parameters (either printout if a programmable programmable limit limit value is reached reached or periodic polling) 5−level 5−level password password protection protection Configuration Configuration of the remote remote maintenance maintenance and and monitoring monitoring system Loading and saving saving of setups setups for operati operation on Logbook Logbook function, status status and alarm alarm history history memories memories Selection Selection of data to to be printed printed out

5.1.2.4

Local Communication Unit (LCU)

The local communication unit (LCU) comprises a remote control electronic unit (REU), which is equipped according to the specific requirements of the NAV station. It serves as a communication interface between the connected equipment and the public switched network, and as a common point for connecting a service terminal (Laptop PC) for commissioning and maintenance purposes.

NOTE:

5.1.2.5

In AN 400 en−route navigation systems (e.g. CVOR 431) no separate LCU device has to be used as local communication interface. The LCU functionality is integrated in the NAV 400 subrack, i.e. the LCU software is running on the already existing LCP board, additional modems are used for communication purposes.

Remote Ma Maintenance Ce Center (R (RMC 44 443)

If a maintenance center is installed, it is possible to connect several different remote control systems to a central REU via switched lines. The general status of all the remote control systems in the network is indicated permanently on one or more INC panels. Any change in a status causes a connection to be set up automatically from the LCU or the RCSE to the responsible center and all the current status statu s information to be transmitted. The center can also be set up to poll the regional stations periodiperiodically. The center is fully equipped to exchange such data with the networked systems which is necessary for it to be able to perform a detailed fault diagnosis. It communicates either directly with en−route navigation systems via switched connections or with ILS substations via the Remote Control and Status Equipment (RCSE) at each airfield.

5−4

SOAC

Ed. 07.06

ILS 420

GP 422 RMMC


TO MAINTENANCE CENTER PTT−LINE

ETHERNET (LAN)

RCMS

RCSE MODEM

CTU

REU

RWY SELECT

INC

L A N S O L I E T I N D A D P A

LCU MODEM MODEM

MODEM MODEM MODEM FFM

LLZ

GP

KDI

CSB

VOR

DME

DVOR

TACAN

CU ELTA

Marker

DME

SYSTEM 2 (S 4000)

MODEM MODEM

Modem

MODEM MODEM FFM

LCP

CS B

CU ELTA

Marker DME CVOR

LLZ

GP

TACAN

DVOR

DME

SYSTEM 1 (NAV 400)

Fig. Fig. 5−3 5−3 Ed. 07.06

Exam Exampl ple e Conf Config igur urat atio ion: n: RCM RCMS S 443 443 for for two two ILS ILS and and VOR VOR/D /DME ME/T /TAC ACAN AN SOAC

5−5

GP 422

ILS 420

RMMC


5.1.3

Monitoring and Control System (MCS)

The new MCS is based on the existing Thales RMMC, and replaces the remote control equipment RCSE RC SE 443 and the ADRACS PC user Program functionality. The Remote Maintenance and Monitoring Mon itoring Configuration (RMMC) is used for remote monitoring, operation and maintenance of all connected navigation systems. The RMMC network has a radially configured architecture based on communication between Thales Monitor and Control Systems (MCS) on different levels, local (airport) (airport) and remote (regional, national, international). The MCS systems are connected via WAN/LAN/Internet or via switched/private lines in the public network (PTT) and dedicated lines in private networks. With the use of the MCS for control and monitoring via personal computer (PC) a user−friendly interface for the supervision adjustment and modification of relevant operating data according to the respective operational application is made available for first set up and ongoing operation of the terrestrial and satellite navigation equipment (e.g. DVOR, CVOR, DME, ILS, ADS−B). The use of common PC standards and operating systems ensures a familiar operating environment for the user.

Controller Working Position (optional)

Controller Working Position

Controller Working Position

CWP

CWP

CWP


CWP

LAN

LAN Firewall Router

Firewall Router

National

Regional

Remote (National, Regional) SNMP protocol

LAN/WAN/ PTT/Leased Lines SNMP protocol

Firewall Router

Local (Airport)

LAN CWP

Customer−specific Equipment

MCWP

(e.g. intrusion alarm)

Satellite Navigation Equipment

proprietary protocol

(e.g. ADS−B)


Terrestrial Navigation Equipment (e.g. DME, VOR, ILS)

Fig. Fig. 5−4 5−4

5−6

MCS syst system em arch archit itec ectu ture re and and comp compon onen ents ts (exa (examp mple le)) SOAC

Ed. 07.06

gpt1e0110

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