EMPro Workshop - Module1 - Introduction Version 2.0

EMPro (Electro-Magnetic Professional) Workshop

HEESOO LEE Agilent EEsof 3DEM Application Lead

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During the course of the EMPro workshop, students will learn how to use EMPro to complete Electro-Magnetic (EM) simulation flow and process from solid modeling, simulation setup, simulations, data display, and postprocessing Students will also learn the most prevalent EM simulation technologies, FEM (Finite Element Method) and FDTD (Finite Difference Time Domain) technologies Students will learn 3D Component Technology that bridges EMPro and ADS and expands the simulation space into mechanical designs Various application examples will be covered, however the application examples used will be based on the audience’s interests and their field

Agenda 

Module 1: Introduction to 3D EM Technologies

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Module 2: EMPro Basics

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Module 3: EMPro Electro-Magnetic Simulations

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Module 4: Data Display and Post-processing in EMPro

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Module 5: 3D component technology: Bridging 3DEM and circuit simulator

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Module 6: Additional Topics

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Module 7: Additional Lab Exercises

Module 1: Introduction to 3D EM Technologies

3D EM Simulation Technologies FDTD ( Finite Difference Time Domain ) FEM ( Finite Element Method ) MoM ( Method of Moment )

3D arbitrary structures Full Wave EM simulations Handles much larger and complex problems Time Domain EM Simulate full size cell phone antennas EM simulations per each port GPU based hardware acceleration

FDTD 3D Arbitrary Structures Full Wave EM Simulation Direct, Iterative Solvers Frequency Domain EM Multiport simulation at no additional cost High Q

FEM

MoM 3D Planar structures Full Wave and Quasi-Static Dense & Compressed Solvers Frequency Domain Multiport simulation at no additional cost High Q

Agilent EEsof’s Integrated 3D EM Flow 3D Modeling

Circuit Design

EMPro Platform

ADS Platform   Parameterized  3D  Components 

Layout  CAD Data 

FDTD Simulator

FEM Simulator

Momentum Simulator  

3D EM in a Big Picture, Co-Design! o

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The old way, the sequential design process or “Throw -The-Die-Over-TheWall”, breaks down due to much smaller design form factors of packages, chips, and substrates in modern high frequency and high speed designs

Much closer proximity, embedded passives  – increased parasitics, couplings Multichip modules, and stacked die become more common - forcing IC, package, and board designers to work together more closely Chip/package/module/board co-design from the beginning of design process is inevitable! Chips Packages RF SiP

SiP

SMD PoP

Board

A Reference Example For Co-Design with 3D EM RFIC Differential Power Amplifier Test Board Bondwires

Single Ended PA Output

PCB

LTCC Balun

Single Ended PA Input

Si PA

LTCC Balun

Package

3D Component Technology for 3D EM Simulations o

Bridges circuit designers to 3D EM simulation space

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Augments ADS 2D layout drawing into 3D EM space for packages

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Two types of 3D components 

ADS default 3D components

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Custom Parameterized 3D components ADS Default 3D  Components 

Custom  Parameterized  3D Components  EMPro Platform 

ADS Platform 

You Can Build Custom 3D Component Library for ADS Circuit/EM Co-Simulations o

Build a set of custom 3D component library for ADS 

Very useful library when a package is often combined with a layout

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Makes dynamic EM simulations for package plus layout a lot easier

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Multiple packages can be added to the package 3D EM component design kit

ADS 3D EM Package Component Custom Library

EMPro (Electro-Magnetic Professional)

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Modern 3D EM Design Environment Flexible choice of full wave 3D EM simulation technologies, FDTD and FEM Wide range of industry standard CAD format support such as SAT, Pro-E, and odb++ format Parameterized Solid Modeling Supports Windows & Linux Innovative 3D Component Technology that bridges 3D EM design environment to your favorite circuit design environment, ADS