DA14580 DA1458 0 – Bluet Bluetooth ooth FAE Traini Training ng # Hands-on Experience Date: February, 2014
Agenda Morning Session 09.30 – 09.45
SmartBond™ - Introduction
09.45 – 10.15
BT Smart an Overview
10.15 – 10.30
DA14580 Hardware
10.45 – 11.00
Break
11: 1:00 00 – 11: 1:30 30
DA14 DA 1458 580 0 de dev vel elop opm men entt env nvir iron onm men entt ov over erv vie iew w
11:3 :30 0 – 12 12:3 :30 0
Tool ols s Ins Insta tall lla ati tion on + Usi Using ng the Co Com mpi pile lerr Han Hands ds-O -On n
12.30 – 13.30
Lunch
Agenda Afternoon Session 13:3 13 :30 0 – 15: 5:30 30
Han ands ds-o -on n Expe peri rien ence ce on DA145 4580 80 SDK & Tool ols s
15:30 – 15:45
Break
15:45 – 16:00
Measure cu current @ uA level wi with DA14580
16:00 – 16:15
Softwa warre Architecture Ov Overview
16:15 – 16:25
Roadmap
16:25 – 16:45
Support Model (Where / What / Who) & Q&A
16:45 – 17:00
Wrap-up and Feedback
Agenda Morning Session 09.30 – 09.45
SmartBond™ - Introduction (5-12)
09.45 – 10.15
BT Smart an Overview
10.15 – 10.30
DA14580 Hardware
10.45 – 11.00
Break
11:00 – 11:30
DA14580 development environment overview
11:30 – 12:30
Tools Installation + Using the Compiler Hands-On
12.30 – 13.30
Lunch
SmartBond™ DA14580 Bluetooth Smart Solution Part 1 – Introduction
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Dialog Semiconductor Overview ■
Fabless provider of mixed signal integrated circuits (ICs). Listed on Frankfurt Stock Exchange • • • • •
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We work with the leading OEMs in high volume, high growth portable device segments • • • •
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Smartphones, tablets & Ultrabooks™ Portable media devices, gaming consoles and digital cordless phones Wireless audio applications LED lighting
At forefront of mobile power management innovation • •
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Highly integrated power management, including AC/DC power conversion Ultra low power audio Low energy short-range wireless Multi-touch displays LED Solid State Lighting
Highest PMIC integration in the industry Broad power management IP portfolio, including high efficiency digital power conversion, fast battery charging & advanced packaging Dialog Semiconductor ©2013
Dialog revenue (US$ million) Cash (incl. restricted cash) 2007 2008 2009
774
57%
2010
CAGR
2011
527
2012
296 162
218
87 2007
2008
2009
2010
2011
2012
Customers and partners in key segments Power management and audio ICs
#1 in smartphones/tablet PMICs by shipment volume. Working with leading, trend-setting brands
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Short-range wireless
DECT ULE chipsets and Bluetooth Smart SoC ■
Processor Partner Initiative
■
■
DECT ULE – interference-free smart home connectivity with the widest range Smallest and lowest power Bluetooth Smart SoC
AC-DC power conversion
AC-DC Converter ICs in chargers and adapters for portable devices
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#1 in feature phones
■
#1 in smartphones/tablets
Dialog Semiconductor ©2013
LED Solid State Lighting (SSL)
LED Driver ICs in SSL applications ■
Positioned as a leader in retrofit bulbs
A global organisation R&D Centers
Global HQ Kirchheim (Stuttgart), Germany
US HQ, Santa Clara
Asia HQ, Taipei, Taiwan
Sales Offices
Stuttgart & Munich, Germany
Taipei, Taiwan ROC
Swindon & Edinburgh, UK
Seoul, Korea
Den Bosch & Hengelo, Holland
Tokyo, Japan
Athens & Patras, Greece Graz, Austria
Shanghai, Shenzhen, Hong Kong, China
Livorno, Italy
Singapore
Istanbul, Turkey
Reading, UK
Beijing, Tianjin, China
Stuttgart, Germany
Europe
10%
18%
APAC & Japan US ■
72% %
■
%
Total employees: ~1000 R&D engineering: ~72%
Tokyo, Japan Santa Clara & Campbell, US
Source date: July 2013
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Dialog Semiconductor ©2013
Den Bosch, Holland Santa Clara, US
Expertise in Radio & Software
Short-range wireless
DECT ULE chipsets and Bluetooth Smart SoC ■
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DECT ULE – interference-free smart home connectivity with the widest range Smallest and lowest power Bluetooth Smart SoC
Capability to support Bluetooth Radio & Software ? We’re a group of over 80 people with experience in multiple radio standards (including DECT ULE, Wireless Audio) and extensive software support (DECT stack is >> complex than bluetooth – 50% of the DECT phones on the market are Dialog Baseband & RF ! Dialog can support you.. Yes !
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Dialog Semiconductor ©2013
SmartBond - A Breakthrough Solution World’s Lowest Power Consumption
<½
Power consumption of available solutions • • ■
■
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Dialog Semiconductor ©2013
<5mA Tx/Rx at 3V at 0/-93 dBm respectively 0.6 µA at 3V in deep sleep
Double the lifetime of your product Halve the size of your battery and reduce the size and cost of your system
SmartBond - A Breakthrough Solution World’s Smallest Solution
<½
Package size of currently available solutions • • ■
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■
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Dialog Semiconductor ©2013
2.5x2.5x0.5mm WL-CSP package QFN also available
Minimize the size of your PCB Create previously inconceivable small form factor industrial designs Lowest BOM count solution on the market
Enjoy the training !
• Please ask if you’d like anything covered again .. • Feel free to give us feedback on what else you may need.. • The development kits are available now to enable your support in the field. • All the collaterals will be made available to you.. • Support doesn’t stop here : Dialog FAE team are here to help you… • Most importantly, enjoy your training on the best BT Smart device on the market !
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Dialog Semiconductor ©2013
Agenda Morning Session 09.30 – 09.45
SmartBond™ - Introduction
09.45 – 10.15
BT Smart an Overview (14-25)
10.15 – 10.30
DA14580 Hardware
10.45 – 11.00
Break
11:00 – 11:30
DA14580 development environment overview
11:30 – 12:30
Tools Installation + Using the Compiler Hands-On
12.30 – 13.30
Lunch
Bluetooth SMART, Demonstration
Find Me Profile
Proximity Profile
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Dialog Semiconductor ©2013
Bluetooth SMART, The history of it all… • 2001, Nokia started working on a low power wireless specification inspired by Bluetooth technology • 2004, The first specification was published as “Bluetooth Low End Extension” • 2006, The specification had matured and was branded Wibree • 2007, An agreement was made with the Bluetooth SIG to include Wibree in the Bluetooth specification under the name Bluetooth Low Energy • 2010, The Bluetooth 4.0 specification which included Bluetooth Low Energy, now branded as Bluetooth SMART, was adopted. • 2011, The first product featuring Bluetooth 4.0 was released in Oct. (iPhone 4S) • 2013, Android finally joined the bandwagon and released Android 4.3 (Jelly Bean) with OS support for Bluetooth SMART.
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Bluetooth SMART, design goals
Technology Design goals: • Low Power, Low Power, Low Power… • Worldwide Operation • Low Cost • Robust • Short Range
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Products already featuring Bluetooth Smart
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Dialog
Ace Sensor Inc. Ace Sensor Inc. Acon Biotech Adidas Adidas Adidas Adonit Corp. Alatech Technology Albers Inc. Alutech Int'l Ltd. BAC Track BeetsBlu Beurer GmbH BiiFit BiiSafe Bluegiga Technologies Blue Bulb Blue Leza BodyGauge Buffalo Cardiofitness GbR Casio CCA Electronic Factory Chamberlain Citizen connectBlue Dayton Deltron Technology Denso Corporation EB Brands EB Brands Echowell Echowell Efilliate Elecom Co., Ltd Evluma FBSC Find My Car Smarter Fitbit, Inc. Fitbit, Inc. Fitcrew Fook Tin Garmin Geonaute GeoPalz Semiconductor ©2013 Gpulse Gunitech
Pally Smart Health Scale Weight scale Pally Smart Key Finder Proximity sensor On Call Bluetooth Adapter Medial adapter MiCoach HRM Hear rate monitor MiCoach SPEED_CELL Sports tracker MiCoach X_CELL Sports tracker Jot Touch Stylus CS010, CS009 Heart rate monitor Item Finder/APP controller Proximity sensor W183 Heart rate monitor BT-M5 Breathalyzer BBHRM1 Heart rate monitor PM250 Heart rate monitor HRM01 Heart rate monitor BiiSafe Buddy Proximity sensor D112 USB dongle Chameleon LED light strip BLSFHR01 Heart rate monitor TMMB-1018B Blood pressure monitor Bluetooth Proximity Tag Proximity sensor Brustgurt Proximity Device G-Shock GB-5600B, GB-6900, GB-6900B, GB-X6900 Smart watch RT-1201A Mobile phone accessory MyQ Garage door controller W760 Smart watch OLS425, OLP425 Platform, OLS426 Module HRM Heart rate monitor iFound Key Proximity sensor KFDNX Proximity sensor Sportline SYNC 3015, 3016 Heart rate monitor Sportline SYNC GPS 3010, 3011, 3012 Heart rate monitor BH20 Heart rate monitor BTR20 Cycling sensor SB-01HE Camera shutter remote M-BT11BB Mouse Area Max LED outdoor light F-PLUG Power consumption sensor Find My Car Smarter system Proximity sensor Fitbit One Fitness tracker Zip Fitness tracker RUN 4.1 Treadmill Scale Pro Series Body scale Fenix GPS hiking watch Geonaute Heart rate monitor iBitz Fitness Tracker BLE-HRM-100 Heart rate monitor L012 LED light bulb
And many more...
Bluetooth SMART, Market Growth Projections IMS research: 100 million Bluetooth Smart chipsets will be deployed in 2014 ABI research: Bluetooth Smart enabled device shipments reaching over 1 billion annual shipments by 2016
IHS research: The adoption of Bluetooth Smart is set to grow rapidly, with over 350 million Bluetooth Smart ICs projected to be shipped cumulatively by the end of 2016 IMS research: Shipment surpassing three billion units in 2017 (BT combo included) 18
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Bluetooth SMART, Network Topology, Roles, States
Link Layer State Machine Scanning
Advertising
Standby
Connected as Slave
Connected as Master
Connected
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Dialog Semiconductor ©2013
Initiating
Bluetooth SMART, Network Topology, Roles, States
Link Layer State Machine Scanning
Advertising
Standby
Connected as Slave
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Dialog Semiconductor ©2013
Bluetooth SMART, Network Topology, Roles, States
Link Layer State Machine Scanning
Standby
Connected as Master
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Dialog Semiconductor ©2013
Initiating
Bluetooth SMART, Network Topology, Roles, States Network Topology
Link Layer State Machine Scanning
Peripheral Advertising
Central Scanner Standby
Advertiser Slave
Master Initiator
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Standby
Standby
Slave
Master
Connected
Initiating
Bluetooth SMART, Network Topology, Roles, States Network Topology
Link Layer State Machine Scanning
Advertiser Peripheral
Advertiser
Advertising
Central Scanner Standby Slave
Advertiser Slave
Master
Standby
Connection Request Slave
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Dialog Semiconductor ©2013
Slave
Master
Connected
Initiator
Slave
Standby
Advertiser
Initiating
Strengths / weaknesses, Bluetooth SMART in general
• Minimal Power Consumption
• No direct cloud access
• Small Size
• No Mesh Networking(*)
• Direct interface to Smartphones
• Operates in crowded ISM band
• Profiles ensure interoperability • Applicable to all markets • Low cost • Secure data transmission 24
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Wi-Fi Co-existence, how robustness is achieved
Advertising Channels
Wi-Fi Ch. 1
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Wi-Fi Ch. 6
Wi-Fi Ch. 11
Agenda Morning Session 09.30 – 09.45
SmartBond™ - Introduction
09.45 – 10.15
BT Smart an Overview
10.15 – 10.30
DA14580 Hardware (27-50)
10.45 – 11.00
Break
11:00 – 11:30
DA14580 development environment overview
11:30 – 12:30
Tools Installation + Using the Compiler Hands-On
12.30 – 13.30
Lunch
The DA14580 Bluetooth Smart SoC
Designed for wearable computers, wireless keyboard
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and mouse, Smart TV remote control and proximity tag/indoor navigation markets Doubles battery life in Bluetooth Smart products (600nA in extended sleep, 4.9mA peek) Smallest package on the market (2.5mm x 2.5 mm) Minimum of external components required No external PA required On-chip OTP code space Boost and Buck mode operation (powered directly from 3V battery or 1.5V cell) Stand-alone or externally hosted operation
Dialog Semiconductor ©2013
The DA14580, Half the power consumption
Half the power consumption of currently available solutions: • <5 mA Tx/Rx at 3V at 0/-93 dBm respectively • 600nA at 3V in deep sleep Thereby doubling the lifetime of your product or reducing the required battery size by 50%
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DA14580 Package types
Order Number: DA14580-01UN6
QFN40 5.0 x 5.0 x 0.9mm 24GPIOs
Order Number: DA14580-01AT1
QFN48 6.0 x 6.0 x 0.9mm 32GPIOs
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Tray order numbers:
WL-CSP34 2.5 x 2.5 x 0.5mm 14GPIOs
Order Number: DA14580-01A31
DA14580 Minimum Implementation
optional
Optional!
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Reference C1 C2 C3 Y1 Y2 U1 L1
Value 1uF 1uF 100nF 16.000MHz 32.768kHz DA14580 2.2uH
Comparison matrix
Feature
DA14580
Competition
2.5mm x 2.5mm
3.5mm x 3.8mm
5
13
Peak Current Draw
4.9mA
13.4mA
Deep sleep
600nA
530nA (off)
Extended Sleep
1.2µA
-
Boost Regulator Physical Size External Components
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DA14580 Hardware Power Management Buck/Boost converter for efficient power conversion from a large range of batteries
Lithium coincell
LithiumIon pack
Alkaline
0.9V
1.8V
2.2V
3.3V
5V
Boost Operation Buck Operation
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Wide
voltage range coverage 0.9 to 3.3V natively 3.3V+ with external LDO
USB
NiMh
Dialog Semiconductor ©2013
+ext. LDO
Small form factor inductor 2.2 uH
On chip LDO’s for disabling power domain when possible – no external capacitors needed.
Switchable GPIO supply rails
Battery monitor ADC
DCDC converter efficiency
Power efficiency between 80% and 90% in Buck mode
Power efficiency up to 90% in Boost mode At Vbat1V > 1.5V the boost converter will go to a linear mode to avoid excess power on the LDOs: Vdcdc max voltage ~1.4V
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DA14580 product availability
Product
DA14580-00
Status
Development
Production samples DA14580-01 Volume Production
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Dialog Semiconductor ©2013
Container
Package
Order number
WLCSP
DA14580-00UN6
QFN40
DA14580-00AT1
QFN48
DA14580-00A31
WLCSP
DA14580-01UN6
QFN40
DA14580-01AT1
QFN48
DA14580-01A31
5k T&R
WLCSP
DA14580-01UNA
5k T&R
QFN40
DA14580-01AT2
4k T&R
QFN48
DA14580-01A32
Tray (50 units)
Tray (50 units)
Available
Lead time
Now
In Stock
12 Feb
In Stock
28 Feb 24 Mar
12 wks
DA14580 Development Kit availability
Product
Container
Package
Order number
Motherboard
Box
-
DA14580DEVKT
Box
WLCSP
DA14580UNDB
Box
QFN48
DA14580A3DB
Box
QFN40
DA14580ATDB
Daughterboard kit
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Available
Lead time
20 Feb
2 wks
Delta description between DA14580-00 and DA14580-01
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The numbering change from DA14580-00 to DA14580-01 is indicating a ROM code update.
The ROM update is done for following reasons: Clearing of the patch space To update the boot-rom to improve battery voltage monitoring during the boot sequence. In the same mask release an improvement in the 32kHz oscillator was done to reduce current consumption by 150nA and bring it back to the specified level in the datasheet.
Dialog Semiconductor ©2013
Software Development Kit Overview
Product
SDK version
Release date
DA14580-00
SDK-2.0.4
Dec 24, 2013
SDK-3.0.2-Engineering
Feb 20, 2014
SDK-3.0.2-Final
March 21, 2014
DA14580-01
Changes from SDK-2.0.4 to SDK-3.0.2 SDK structure will be simplified to improve ease-of-use Peripheral drivers will be added (Note: software API will not change) Old patches will be removed SDK Migration Process The customer application must be copied to the new SDK-3.0.2 and rebuilt before running it on the DA14580-01. A migration document is available together with the SDK-3.0.2 release
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Panasonic PAN1740
4PAN1740 4Based
on Dialogs single chip DA14580 4Highly integrated and compact Bluetooth controller 4Small 9.0 x 9.5 x 1.8 mm SMD package with antenna 4Includes 16MHz and 32.768kHz crystal 4Bluetooth 4.0 qualified (4.1 qualification is ongoing) 4Temperature Range from -40° C to +85°C 4Power consumption 5.0mA Rx and Tx 4Link budget 93dBm (Rx Sensitivity -93, Tx 0 dBm)
Panasonic Bluetooth Low Energy Portfolio
Part Number Size in mm Software
RF Performance
Power Consumption
Available Memory
PAN1720
PAN1740
15.6 x 8.7 x 1.8
9.0 x 9.5 x 1.8
1) BlueRadios AT Command 2) TI LE Stack with profiles
IC with GATT/GAP API Profiles available
4 dBm PAN1720 0 dBm PAN1721
0 dBm
Tx: 23mA Rx: 18 mA Sleep Mode: <1 µA 256k (stack uses 90-120k)
Tx: 5mA Rx: 5mA Sleep Mode: <1 µA
32k free (OTP) stack already included
PAN1740 Eval Kit
4Dialog
Mother-Board 4Profiling tool for Real-time power consumption measurement 4Correlate power consumption to your code 4Optimize your code 4Meet your power budget target
4PAN1740
ETU 4Daughter Board with Connector 4Mount on Mother-Board
Hardware overview
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Active mode
XTAL 32.468 kHz
ARM Cortex M0
System/ Exchange RAM 42KB Retention RAM 2KB Retention RAM 3KB
l r t C . m e M
Retention RAM 1KB
e g d i r b B P A
LDO SYS
LDO RET
Power/ Clock MGNT. (PMU)
T I M E R
RC16 MHz
Radio Transceiver
W T A I M K E E R U P
U A R T
U A R T
S P I
I 2 C
DMA
GPIO MULTIPLEXING
Dialog Semiconductor ©2013
RC32 kHz
LDO LD RF
CTRL
ROM 84KB
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XTAL 16MHz
BLE Core
Retention RAM 2KB
OTP 32KB
DCDC (Buck/Boost)
4 C H A D C
D E C Q O U D A E D R
PO R
Sleep/idle mode
XTAL 32.468 kHz
ARM Cortex M0
System/ Exchange RAM 42KB Retention RAM 2KB Retention RAM 3KB
l r t C . m e M
Retention RAM 1KB
e g d i r b B P A
LDO SYS
LDO RET
Power/ Clock MGNT. (PMU)
T I M E R
RC16 MHz
Radio Transceiver
W T A I M K E E R U P
U A R T
U A R T
S P I
I 2 C
DMA
GPIO MULTIPLEXING
Dialog Semiconductor ©2013
RC32 kHz
LDO LD RF
CTRL
ROM 84KB
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XTAL 16MHz
BLE Core
Retention RAM 2KB
OTP 32KB
DCDC (Buck/Boost)
4 C H A D C
D E C Q O U D A E D R
PO R
Extended sleep mode
XTAL 32.468 kHz
ARM Cortex M0
System/ Exchange RAM 42KB Retention RAM 2KB Retention RAM 3KB
l r t C . m e M
Retention RAM 1KB
e g d i r b B P A
LDO SYS
LDO RET
LDO LD RF
Power/ Clock MGNT. (PMU)
T I M E R
RC16 MHz
W T A I M K E E R U P
U A R T
U A R T
S P I
I 2 C
GPIO MULTIPLEXING
Dialog Semiconductor ©2013
RC32 kHz
Radio Transceiver
DMA CTRL
ROM 84KB
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XTAL 16MHz
BLE Core
Retention RAM 2KB
OTP 32KB
DCDC (Buck/Boost)
4 C H A D C
D E C Q O U D A E D R
PO R
Deep sleep mode
XTAL 32.468 kHz
ARM Cortex M0
System/ Exchange RAM 42KB Retention RAM 2KB Retention RAM 3KB
l r t C . m e M
Retention RAM 1KB
e g d i r b B P A
LDO SYS
LDO RET
LDO LD RF
Power/ Clock MGNT. (PMU)
T I M E R
RC16 MHz
W T A I M K E E R U P
U A R T
U A R T
S P I
I 2 C
GPIO MULTIPLEXING
Dialog Semiconductor ©2013
RC32 kHz
Radio Transceiver
DMA CTRL
ROM 84KB
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XTAL 16MHz
BLE Core
Retention RAM 2KB
OTP 32KB
DCDC (Buck/Boost)
4 C H A D C
D E C Q O U D A E D R
PO R
Hosting configurations
Applications can be created in different memory and processor configurations:
Flash
MCU
SPI/I2C I/F
DA14580
Integrated Processor Solution (stand-alone):
Ext. Proc. I/F
DA14580
Integrated Processor Solution with External memory:
DA14580
External Processor Solution:
Controller and host stack running on DA14580.
Controller and host stack running on DA14580.
Controller and host stack running on DA14580.
Profiles and Application stored in OTP and executed from SRAM
Profiles and Application loaded from external Flash and executed from SRAM
Profiles and Application executed on Ext MCU
Fully sourced sample code available for both stand-alone and externally hosted applications 46
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Minimum hardware implementation
47
The WL-CSP and low count of external components allow for very small Bluetooth Smart applications
Dialog Semiconductor ©2013
OTP programming
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Customer needs to program the OTP in the production line
It requires 6.8V on the DA14580 to program the OTP
Programming is done through UART interface using SmartSnippet tool
A Command Line Interface (CLI) tool is available for integration in a customer production environment
For a 10kByte application Program + Verify is about 1sec
Dialog Semiconductor ©2013
Agenda Morning Session 09.30 – 09.45
SmartBond™ - Introduction
09.45 – 10.15
BT Smart an Overview
10.15 – 10.30
DA14580 Hardware
10.45 – 11.00
Break
11:00 – 11:30
DA14580 development environment overview
11:30 – 12:30
Tools Installation + Using the Compiler Hands-On
12.30 – 13.30
Lunch
Agenda Morning Session 09.30 – 09.45
SmartBond™ - Introduction
09.45 – 10.15
BT Smart an Overview
10.15 – 10.30
DA14580 Hardware
10.45 – 11.00
Break
11:00 – 11:30
DA14580 development environment overview (53-61)
11:30 – 12:30
Tools Installation + Using the Compiler Hands-On
12.30 – 13.30
Lunch
The Smartbond DVK
WL-CSP
QFN40
QFN48
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The DVK contents
Segger Link Lite for ARM
DVK Motherboard
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Daughterboard with DA14580 mounted
The DVK Motherboard
• JTAG interface for programming and debugging • Interface to the DA14580 Daughterboard • OTP supply voltage generator (6V8) • Mother board is powered through the USB interface. • 2 Bicolor LEDs and 2 pushbuttons for application development • USB to serial port converter (UART for debugging and/or external host application interface. SPI for current consumption evaluation using SmartSnippets). • Current evaluation A/D conversion circuitry • One battery holder for single alkaline AAA cell and one for a 3V CR2032 coin cell battery • All I/Os are exposed onto 100mill pin headers for easy prototyping 53
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The DVK Daughterboard
• St Stan andd-al alon one e imp imple leme ment ntat atio ion n of of DA14 DA1458 580 0 (except for power source) • Three Three varian variants ts availa available ble:: WL-CS WL-CSP P, QFN4 QFN40 0 and and QFN48 – ordered ordered separat separately ely in sets of of three • Exte Extern rnal al an ante tenn nna a for for ea easy sy RF eval evalua uati tion on • All All I/O I/Os s are are bro broug ught ht to the the edg edge e con conne nect ctor ors s (interface to motherboard)
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WL-CSP variant
DVK USB Dongle
• Features the DA14580 • Prov Provid ides es a seco second ndar ary y BLE BLE enti entity ty (US (USB B don dongl gle e can can act as central device while DVK board acts as peripher peripheral al – or the other other way way around) around) • Usef Useful ul whe hen nw wor orki king ng wit with h Conn Connec ecti tion on Man Manag ager er • Ca Can no ope pera rate te as stan standd-al alon one e or or can can use use PC PC as as external host.
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Tools provided with DVK
• Keil Keil uVis uVisio ion n ID IDE, E, free free 32 32kB kByt yte e AR ARM M MDK MDK-l -lit ite e vers versio ion n
• Smar SmartS tSni nipp ppet ets s for for eval evalua uati tion on of po pow wer cons consum umpt ptio ion n
• Co Conne nnecti ction on Manage Managerr for for protoc protocol ol ana analy lysis sis and test test
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Dialog Semiconductor ©2013
Keil uVision MDK-Lite, IDE and compiler (Ver.5)
• Free 32KByte version • Standard IDE • Full debugger • Easy to use • SW loads directly to target via Segger J-Link interface • Well-known and popular IDE
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SmartSnippets
• Provides exact power profiling • Includes a boot-loader (UART) • Includes an OTP programmer • Displays profiling data graphically (User defined cursors) • Capable of export to and import from comma separated files
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Connection Manager
• Can act as central or peripheral device • Includes a UART boot loader • Log window displays protocol frames (Logs can be stored) • Let’s user modify scan interval and scan window timing • Let’s user modify Connection Interval, Slave Latency and Connection Supervision interval • Connection can be established and bonding can be performed • Full service and characteristic discovery • Reading and writing of characteristics 59
Dialog Semiconductor ©2013
Agenda Morning Session 09.30 – 09.45
SmartBond™ - Introduction
09.45 – 10.15
BT Smart an Overview
10.15 – 10.30
DA14580 Hardware
10.45 – 11.00
Break
11:00 – 11:30
DA14580 development environment overview
11:30 – 12:30
Tools Installation + Using the Compiler Hands-On
(63-68)
12.30 – 13.30
Lunch
Kit Content
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Dialog Semiconductor ©2013
Tools & Software Overview
Keil MDK ARM uVision IDE Microcontroller (ARM) Development Kit, including C-compiler and Debugger
Segger J-Link driver JTAG/SWD+SWO Debug Probe
FTDI RS-232/USB Driver Virtual COM-Port driver
Connection Manager (needs Microsoft .NET vs.4) Dialog tool to manage BTLE peer connections
Smartsnippets Dialog tool to optimize code/power usage and OTP programming
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Installing the tools & software 1 (refer to handout)
Copy the files from the USB Drive to your computer and include the latest SDK:
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Installing the tools & software 2 (refer to handout)
1/ Install Keil compiler ‘mdk501.exe’ No need to install additional packages
2/ Install Segger J-Link driver ‘Setup_JLinkARM_V478k.exe’
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Installing the tools & software 3 (refer to handout)
3/ Install FTDI driver ‘CDM v2.08.30 WHQL Certified.exe’ 4/ Install Smart{Snippets} ‘SmartSnippets_install_winxx.exe (.._win32.exe for 32-bit OS /.._win64.exe for 64-bit OS) If the Java runtime environment is not installed you’ll get an error:
Install Java ‘jre-7u45-windows-i586.exe’
5/ Install ConnectionManager ‘ConnectionManager_install.exe’
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Using the Bluetooth Smart Development Kit Once you have installed all the tools and software continue with the ‘Hands-On’ manual.
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Agenda Morning Session 09.30 – 09.45
SmartBond™ - Introduction
09.45 – 10.15
BT Smart an Overview
10.15 – 10.30
DA14580 Hardware
10.45 – 11.00
Break
11:00 – 11:30
DA14580 development environment overview
11:30 – 12:30
Tools Installation + Using the Compiler Hands-On
12.30 – 13.30
Lunch