104090146-LG-32le5300-5310-32le530n-ch-ld01d-ET-1

Internal Use Only North/Latin Ame merrica Europe/Africa Asia/Oceania

http://aic.lgservice.com htt http://eic.lgservice.com http://biz.lgservice.com

LED LCD TV SERVICE MANUAL CHASSIS : LD01D

MODEL : 32LE5300 MODEL : 32LE530N MODEL : 32LE5310

32LE5300-ZA 32LE5310-ZA 32LE5310-ZB

CAUTION

BEFORE SERVICING THE CHASSIS, READ THE SAFETY PRECAUTIONS IN THIS MANUAL.

/I P

P/NO : MFL62863026 (1002-REV00)

OK

MENU

INPUT

Printed in Korea

CONTENTS

CONTENTS ...................... ............................................... .................................................. ............................................... ...................... 2 PRODUCT SAFETY ...................... ............................................... ................................................. .................................. .......... 3 SPECIFICA SPEC IFICATION TION ........ ............... ............... ................ ................ ................ ................ ................ ................ ................ ................ ........ 6 ADJUSTME ADJU STMENT NT INSTR INSTRUCTI UCTION ON ........ ................ ................ ................ ................ ................ ................ ................ ........ 9 BLOCK DIAGRAM...................................................................................15 EXPLODED VIEW ......................... .................................................. ................................................. ................................ ........ 17 SVC. SHEET ...............................................................................................

Copyright © 2010 LG Electronics. Electronics. Inc. All rights reserved. Only for training and service purposes

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LGE Internal Use Only

SAFETY PRECAUTIONS IMPORTANT SAFETY NOTICE Many electrical electrical and mechanical parts in this chassis have special special safety-related characteristics. These parts are identified by in the Schematic Diagram and Exploded View. It is essential that these special safety parts should be replaced with the same components as recommended in this manual to prevent Shock, Fire, or other Hazards. Do not modify the original design without permission of manufacturer.

General Guidance

Leakage Current Hot Check (See below Figure) Plug the AC cord directly into the AC outlet.

An isolation Transformer should always be used during the servicing of a receiver whose chassis is not isolated from the AC power line. Use a transformer of adequate power rating as this protects the technician from accidents resulting in personal injury from electrical shocks. It will also protect the receiver and it's components from being damaged by accidental shorts of the circuitry that may be inadvertently introduced during the service operation. If any fuse (or Fusible Resistor) in this TV receiver is blown, replace it with the specified. When replacing a high wattage resistor (Oxide Metal Film Resistor, over 1 W), keep the resistor 10 mm away from PCB.

Do not use a line Isolation Transformer during this check. Connect 1.5 K / 10 watt resistor in parallel with a 0.15 uF capacitor between a known good earth ground (Water Pipe, Conduit, etc.) and the exposed metallic parts. Measure the AC voltage across the resistor using AC voltmeter with 1000 ohms/volt or more sensitivity. Reverse plug the AC cord into the AC outlet and repeat AC voltage measurements for each exposed metallic part. Any voltage measured must not exceed 0.75 volt RMS which is corresponds to 0.5 mA. In case any measurement is out of the limits specified, there is possibility of shock hazard and the set must be checked and repaired before it is returned to the customer.

Leakage Current Hot Check circuit Keep wires away from high voltage or high temperature parts.

AC Volt-meter

Before returning the receiver to the customer, always perform an AC leakage current check on the exposed metallic parts of the cabinet, such as antennas, terminals, etc., to be sure the set is safe to operate without damage of electrical shock.

Leakage Current Cold Check(Antenna Cold Check) With the instrument AC plug removed from AC source, connect an electrical jumper across the two AC plug prongs. Place the AC switch in the on position, connect one lead of ohm-meter to the AC plug prongs tied together and touch other ohm-meter lead in turn to each exposed metallic parts such as antenna terminals, phone jacks, etc. If the exposed metallic part has a return path to the chassis, the measured resistance should be be between 1 MΩ and 5.2 MΩ. When the exposed metal has no return path to the chassis the reading must be infinite. An other abnormality exists that must be corrected before the receiver is returned to the customer.

Copyright © 2010 LG Electronics. Electronics. Inc. All rights reserved. Only for training and service purposes

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To Instrument's exposed METALLIC PARTS

0.15 uF

Good Earth Ground such as WATER PIPE, CONDUIT etc.

1.5 Kohm/10W

When 25A is impressed between Earth and 2nd Ground for 1 second, Resistance must be less than 0.1 Ω *Base on Adjustment standard


SERVICING PRECAUTIONS CAUTION: Before servicing receivers covered by this service manual and its supplements and addenda, read and follow the SAFETY PRECAUTION PRECAUTIONS S on page 3 of this publication. NOTE: If unforeseen circumstances create conflict between the following servicing precautions and any of the safety precautions on page 3 of this publication, always follow the safety precautions. Remember: Safety First. General Servicing Precautions 1. Always unplug the receiver AC power cord from the AC power source before; a. Removing or reinstalling any component, circuit board module or any other receiver assembly. b. Disconnecting or reconnecting any receiver electrical plug plug or other electrical connection. c. Connecting a test substitute in parallel parallel with an electrolytic capacitor in the receiver. CAUTION: A wrong part substitution or incorrect polarity installation of electrolytic capacitors may result in an explosion hazard. 2. Test high voltage only by measuring it with an appropriate high voltage meter or other voltage measuring device (DVM, FETVOM, etc) equipped with a suitable high voltage probe. Do not test high voltage by "drawing an arc". 3. Do not spray chemicals on or near this receiver or any of its assemblies. 4. Unless specified specified otherwise otherwise in this service service manual, manual, clean electrical contacts only by applying the following mixture to the contacts with a pipe cleaner, cotton-tipped stick or comparable non-abrasive applicator; 10 % (by volume) Acetone and 90 % (by volume) isopropyl alcohol (90 % - 99 % st rength) CAUTION: This is a flammable mixture. Unless specified otherwise in this service manual, lubrication of contacts in not required. 5. Do not defeat any plug/socket B+ voltage interlocks with which receivers covered by this service manual might be equipped. 6. Do not apply AC power to this instrument and/or any of its electrical assemblies unless all solid-state device heat sinks are correctly installed. 7. Always connect the test receiver ground lead to the receiver chassis ground before connecting the test receiver positive lead. Always remove the test receiver ground lead last. 8. Use with this receiver only the test fixtures specified in this service manual. CAUTION: Do not connect the test fixture ground strap to any heat sink in this receiver. Electrostatically Sensitive (ES) Devices Some semiconductor (solid-state) devices can be damaged easily by static electricity. Such components commonly are called Electrostatically Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some field-effect transistors and semiconductor "chip" components. The following techniques should be used to help reduce the incidence of component damage caused by static by static electricity. 1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any electrostatic charge on your body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging wrist strap device, which should be removed to prevent potential shock reasons prior to applying power to the unit under test. Copyright © 2010 LG Electronics. Electronics. Inc. All rights reserved. Only for training and service purposes

2. After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as aluminum foil, to prevent electrostatic charge buildup or exposure of the assembly. 3. Use only a grounded-tip soldering iron to solder or unsolder unsolder ES devices. 4. Use only an anti-stati anti-static c type solder removal removal device. device. Some solder solder removal devices not classified as "anti-static" can generate electrical charges sufficient to damage ES devices. 5. Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ES devices. 6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most replacement ES devices are packaged with leads electrically shorted together by conductive foam, aluminum foil or comparable conductive material). 7. Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material to the chassis or circuit assembly into which the device will be installed. CAUTION: Be sure no power is applied to the chassis or circuit, and observe all other safety precautions. 8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise harmless motion such as the brushing together of your your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity sufficient to damage an ES device.) General Soldering Guidelines 1. Use a grounded-tip, low-wattage soldering iron and appropriate appropriate tip size and shape that will maintain tip temperature within the range or 500 °F to 600 °F. 2. Use an appropriate gauge of RMA resin-core resin-core solder composed of 60 parts tin/40 parts lead. 3. Keep the soldering iron iron tip clean and well tinned. 4. Thoroughly clean the surfaces to be soldered. Use a mall wirewirebristle (0.5 inch, or 1.25 cm) brush with a metal handle. Do not use freon-propelled spray-on cleaners. 5. Use the following unsoldering technique a. Allow the soldering iron iron tip to reach normal temperature. (500 °F to 600 °F) b. Heat the component lead until the solder melts. c. Quickly draw the melted solder with an anti-static, suctiontype solder removal device or with solder braid. CAUTION: CAUTIO N: Work quickly quickly to avoid overheating overheating the circuit board printed foil. 6. Use the following soldering technique. a. Allow the soldering iron tip to reach a normal temperature (500 °F to 600 °F) b. First, hold the soldering iron iron tip and solder the strand against the component lead until the solder melts. c. Quick Quickly ly move move the solderi soldering ng iron iron tip to the juncti junction on of the the component lead and the printed circuit foil, and hold it there only until the solder flows onto and around both the component lead and the foil. CAUTION: Work quickly to avoid overheating the circuit board printed foil. d. Close Closely ly inspect inspect the solde solderr area and remove remove any any excess excess or splashed solder with a small wire-bristle brush.

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IC Remove/Replacement Some chassis circuit boards have slotted holes (oblong) through which the IC leads are inserted and then bent flat against the circuit foil. When holes are the slotted type, the following technique should be used to remove and replace the IC. When working with boards using the familiar round hole, use the standard technique as outlined in paragraphs 5 and 6 above.

Circuit Board Foil Repair Excessive heat applied to the copper foil of any printed circuit board will weaken the adhesive that bonds the foil to the circuit board causing the foil to separate from or "lift-off" the board. The following guidelines and procedures should be followed whenever this condition is encountered.

Removal 1. Desolder and straighten each IC lead in one operation by gently prying up on the lead with the soldering iron tip as the solder melts. 2. Draw away the melted solder with an anti-static suction-type solder removal device (or with solder braid) before removing the IC. Replacement 1. Carefully insert the replacement IC in the circuit board. 2. Carefully bend each IC lead against the circuit foil pad and solder it. 3. Clean the soldered areas with a small wire-bristle brush. (It is not necessary to reapply acrylic coating to the areas). "Small-Signal" Discrete Transistor Removal/Replacement 1. Remove the defective transistor by clipping its leads as close as possible to the component body. 2. Bend into a "U" shape the end of each of three leads remaining on the circuit board. 3. Bend into a "U" shape the replacement transistor leads. 4. Connect the replacement transistor leads to the corresponding leads extending from the circuit board and crimp the "U" with long nose pliers to insure metal to metal contact then solder each connection. Power Output, Transistor Device Removal/Replacement 1. Heat and remove all solder from around the transistor leads. 2. Remove the heat sink mounting screw (if so equipped). 3. Carefully remove the transistor from the heat sink of the circuit board. 4. Insert new transistor in the circuit board. 5. Solder each transistor lead, and clip off excess lead. 6. Replace heat sink.

At IC Connections To repair a defective copper pattern at IC connections use the following procedure to install a jumper wire on the copper pattern side of the circuit board. (Use this technique only on IC connections). 1. Carefully remove the damaged copper pattern with a sharp knife. (Remove only as much copper as absolutely necessary). 2. carefully scratch away the solder resist and acrylic coating (if used) from the end of the remaining copper pattern. 3. Bend a small "U" in one end of a small gauge jumper wire and carefully crimp it around the IC pin. Solder the IC connection. 4. Route the jumper wire along the path of the out-away copper pattern and let it overlap the previously scraped end of the good copper pattern. Solder the overlapped area and clip off any excess jumper wire. At Other Connections Use the following technique to repair the defective copper pattern at connections other than IC Pins. This technique involves the installation of a jumper wire on the component side of the circuit board. 1. Remove the defective copper pattern with a sharp knife. Remove at least 1/4 inch of copper, to ensure that a hazardous condition will not exist if t he jumper wire opens. 2. Trace along the copper pattern from both sides of the pattern break and locate the nearest component that is directly connected to the affected copper pattern. 3. Connect insulated 20-gauge jumper wire from the lead of the nearest component on one side of the pattern break to the lead of the nearest component on the other side. Carefully crimp and solder the connections. CAUTION: Be sure the insulated jumper wire is dressed so the it does not touch components or sharp edges.

Diode Removal/Replacement 1. Remove defective diode by clipping its leads as close as possible to diode body. 2. Bend the two remaining leads perpendicular y to the circuit board. 3. Observing diode polarity, wrap each lead of the new diode around the corresponding lead on the circuit board. 4. Securely crimp each connection and solder it. 5. Inspect (on the circuit board copper side) the solder joints of the two "original" leads. If they are not shiny, reheat them and if necessary, apply additional solder. Fuse and Conventional Resistor Removal/Replacement 1. Clip each fuse or resistor lead at top of the circuit board hollow stake. 2. Securely crimp the leads of replacement component around notch at stake top. 3. Solder the connections. CAUTION: Maintain original spacing between the replaced component and adjacent components and the circuit board to prevent excessive component temperatures. Copyright © 2010 LG Electronics. Inc. All rights reserved. Only for training and service purposes

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SPECIFICATION NOTE : Specifications and others are subject to change without notice for improvement.

1. Application range

3. Test method

This specification is applied to the LED LCD TV used LD01D chassis.

2. Requirement for Test

1) Performance: LGE TV test method followed 2) Demanded other specification - Safety: CE, IEC specification - EMC:CE, IEC

Each part is tested as below without special appointment. 1) Temperature : 25 ºC ± 5 ºC (77 ºF ± 9 ºF), CST : 40 ºC ± 5 ºC 2) Relative Humidity : 65 % ± 10 % 3) Power Voltage : Standard input voltage (AC 100-240 V~ 50 / 60 Hz) * Standard Voltage of each products is marked by models. 4) Specification and performance of each parts are followed each drawing and specification by part number in accordance with BOM. 5) The receiver must be operated for about 5 minutes prior to the adjustment.

4. Module General Specification No.

Item

Specification

Remark

1

Display Screen Device

80 cm(32 inch) wide color display module

2

Aspect Ratio

16:9

3

LCD Module

80 cm(32 inch) TFT LCD Slim Edge LED FHD (100 Hz)

4

Storage Environment

Temp. : -20 deg ~ 60 deg

LED LCD

LGD/ AUO

Humidity : 10 % ~ 90 % 5

Input Voltage

AC 100-240 V~ 50 / 60 Hz

6

Power Consumption

Power on ( Blue) LGD

Typ : 73.3 W 0.3638 mm x 0.3638 mm

8

Pixel Pitch

LGD

9

Back Light

Edge LED

10

Display Colors

1.06 Billion(FHD LGD),16.7 M (others)

11

Coating

3H, AG

Copyright © 2010 LG Electronics. Inc. All rights reserved. Only for training and service purposes

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LCD (Module) + Backlight(LED)


5. Component Video Input (Y, CB /PB, CR /PR) No.

Specification Resolution

H-freq(kHz)

Remark

V-freq(Hz)

1.

720x480

15.73

60.00

SDTV,DVD 480i

2.

720x480

15.63

59.94

SDTV,DVD 480i

3.

720x480

31.47

59.94

480p

4.

720x480

31.50

60.00

480p

5.

720x576

15.625

50.00

SDTV,DVD 625 Line

6.

720x576

31.25

50.00

HDTV 576p

7.

1280x720

45.00

50.00

HDTV 720p

8.

1280x720

44.96

59.94

HDTV 720p

9.

1280x720

45.00

60.00

HDTV 720p

10.

1920x1080

31.25

50.00

HDTV 1080i

11.

1920x1080

33.75

60.00

HDTV 1080i

12.

1920x1080

33.72

59.94

HDTV 1080i

13.

1920x1080

56.250

50

HDTV 1080p

14.

1920x1080

67.5

60

HDTV 1080p

6. RGB (PC) No.

Specification Resolution

H-freq(kHz)

V-freq(Hz)

Pixel Clock(MHz)

1.

720*400

31.468

70.08

28.321

2.

640*480

31.469

59.94

25.17

Proposed

Remark For only DOS mode

VESA

Input 848*480 60 Hz, 852*480 60 Hz

-> 640*480 60 Hz Display 3.

800*600

37.879

60.31

40.00

VESA

4.

1024*768

48.363

60.00

65.00

VESA(XGA)

5.

1280*768

47.78

59.87

79.5

WXGA

6.

1360*768

47.72

59.8

84.75

WXGA

FHD Model

7.

1366*768

47.56

59.6

84.75

WXGA

WXGA Model

8.

1280*1024

63.595

60.0

108.875

SXGA

FHD model

9.

1280*720

45

60

74.25

720p

10.

1920*1080

66.587

59.93

138.625

WUXGA


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DTV Standard FHD model


7. HDMI Input (1) DTV Mode No.

Resolution

H-freq(kHz)

V-freq.(Hz)

Pixel clock(MHz)

Proposed

1.

720*480

31.469 /31.5

59.94 /60

27.00/27.03

SDTV 480P

2.

720*576

31.25

50

54

SDTV 576P

3.

1280*720

37.500

50

74.25

HDTV 720P

4.

1280*720

44.96 /45

59.94 /60

74.17/74.25

HDTV 720P

5.

1920*1080

33.72 /33.75

59.94 /60

74.17/74.25

HDTV 1080I

6.

1920*1080

28.125

50.00

74.25

HDTV 1080I

7.

1920*1080

26.97 /27

23.97 /24

74.17/74.25

HDTV 1080P

8.

1920*1080

33.716 /33.75

29.976 /30.00

74.25

HDTV 1080P

9.

1920*1080

56.250

50

148.5

HDTV 1080P

10.

1920*1080

67.43 /67.5

59.94 /60

148.35/148.50

HDTV 1080P

Remark

(2) PC Mode No.

Resolution

H-freq(kHz)

V-freq.(Hz)

Pixel clock(MHz)

Proposed

Remark

1.

720*400

31.468

70.08

28.321

2.

640*480

31.469

59.94

25.17

VESA

HDCP

3.

800*600

37.879

60.31

40.00

VESA

HDCP

4.

1024*768

48.363

60.00

65.00

VESA(XGA)

HDCP

5.

1280*768

47.78

59.87

79.5

WXGA

HDCP

6.

1360*768

47.72

59.8

84.75

WXGA

HDCP

7.

1440*1050

55.5

59.90

88.750

WSXGA

Not used(Moniter Panel)

8.

1400*1050

64.744

59.948

101.00

WSXGA


9.

1680*1050

65.16

59.94

147.00

WSXGA


10.

1280*1024

63.595

60.0

108.875

SXGA

HDCP/FHD model

11.

1920*1080

67.5

60.00

138.625

WUXGA

HDCP/FHD model


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HDCP


ADJUSTMENT INSTRUCTION 1. Application Range

(2)

This specification sheet is applied to all of the LED LCD TV with LD01D chassis.

(3)

2. Designation 1) The adjustment is according to the order which is designated and which must be followed, according to the plan which can be changed only on agreeing. 2) Power Adjustment: Free Voltage 3) Magnetic Field Condition: Nil. 4) Input signal Unit: Product Specification Standard 5) Reserve after operation: Above 5 Minutes (Heat Run) Temperature : at 25 ºC ± 5 ºC Relative humidity : 65 % ± 10 % Input voltage : 220 V, 60 Hz 6) Adjustment equipments: Color Analyzer(CA-210 or CA-110), DDC Adjustment Jig equipment, SVC remote control. 7) Push The “IN STOP” KEY - For memory initialization.

Please Check the Speed : To use speed between from 200KHz to 400KHz

5) Click “Auto” tab and set as below 6) Click “Run”. 7) After downloading, check “OK” message. (4)

filexxx.bin (5)

(7) ……….OK

Case1 : Software version up 1. After downloading S/W by USB, TV set will reboot automatically 2. Push “In-stop” key 3. Push “Power on” key 4. Function inspection 5. After function inspection, Push “In-stop” key. Case2 : Function check at the assembly line 1. When TV set is entering on the assembly line, Push “In-stop” key at first. 2. Push “Power on” key for turning it on. -> If you push “Power on” key, TV set will recover channel information by itself. 3. After function inspection, Push “In-stop” key.

(6)

* USB DOWNLOAD 1) Put the USB Stick to the USB socket 2) Automatically detecting update file in USB Stick - If your downloaded program version in USB Stick is Low, it didn’t work. But your downloaded version is High, USB data is automatically detecting 3) Show the message “Copying files from memory”

3. Main PCB check process * APC - After Manual-Insult, executing APC

* Boot file Download 1) Execute ISP program “Mstar ISP Utility” and then click “Config” tab. (1) filexxx.bin

2) Set as below, and then click “Auto Detect” and check “OK” message If “Error” is displayed, Check connection between computer, jig, and set. 3) Click “Read” tab, and then load download file (XXXX.bin) by clicking “Read” 4) Click “Connect” tab. If “Can’ t” is di splayed, check connection between computer, jig, and set.


-9-


3.1. ADC Process

4) Updating is staring.

(1) ADC - Enter Service Mode by pushing “ADJ” key, - Enter Internal ADC mode by pushing “ G” key at “5. ADC Calibration”

Using ‘power on’ button of the Adjustment R/C, power on TV. * ADC Calibration Protocol (RS232) Item Adjust ‘Mode In’

CMD1 CMD2 Data0 A

A

0

0 When transfer the ‘Mode In’, Carry the command.

ADC Adjust

A

D

1

0 Automatically adjustment (The use of a internal pattern)

5) Uploading completed, The TV will restart automatically. 6) If your TV is turned on, check your updated version and Tool option.(explain the Tool option, next stage) * If downloading version is more high than your TV have, TV can lost all channel data. In this case, you have to channel recover. if all channel data is cleared, you didn’t have a DTV/ATV test on production line.

Adjust Sequence • aa 00 00 [Enter Adjust Mode] • xb 00 40 [Component1 Input (480i)] • ad 00 10 [Adjust 480i Comp1] • xb 00 60 [RGB Input (1024*768)] • ad 00 10 [Adjust 1024*768 RGB] • aa 00 90 End Adjust mode * Required equipment : Adjustment R/C.

3.2. Function Check

* After downloading, have to adjust Tool Option again. 1) Push "IN-START" key in service remote controller 2) Select “Tool Option 1” and Push “OK” button. 3) Punch in the number. (Each model hax their number) Module

Tool option1 Tool option2 Tool option3 Tool option4 Tool optin5

LGD

16609

27448

57388

26893

8

AUO

16617

27448

57388

26893

0

* Check display and sound - Check Input and Signal items. (cf. work instructions) 1) TV 2) AV (SCART1/SCART2/ CVBS) 3) COMPONENT (480i) 4) RGB (PC : 1024 x 768 @ 60hz) 5) HDMI 6) PC Audio In * Display and Sound check is executed by Remote control.

4) Completed selecting Tool option.


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4. Total Assembly line process

** Caution ** Color Temperature : COOL, Medium, Warm. One of R Gain/G Gain/ B Gain should be kept on 0xC0, and adjust other two lower than C0. (when R/G/B Gain are all C0, it is the FULL Dynamic Range of Module)

4.1. Adjustment Preparation · W/B Equipment condition CA210 : CH 9, Test signal : Inner pattern (85IRE) · Above 5 minutes H/run in the inner pattern. (“power on” key of adjust remote control) Cool

13,000k

Medium 9,300k Warm

6,500k

K K K

* Manual W/B process using adjusts Remote control.

X=0.269(±0.002)

• After enter Service Mode by pushing “ADJ” key, • Enter White Balance by pushing “ G ” key at “6. White Balance”.

Y=0.273(±0.002)

X=0.285(±0.002)

Inner pattern

Y=0.293(±0.002)

(216gray,85IRE)

X=0.313(±0.002) Y=0.329(±0.002)

* Connecting picture of the measuring instrument (On Automatic control) Inside PATTERN is used when W/B is controlled. Connect to auto controller or push Adjustment R/C POWER ON -> Enter the mode of White-Balance, the pattern will come out.

Full White Pattern

* After done all adjustments, Press “In-start” button and compare Tool option and Area option value with its BOM, if it is correctly same then unplug the AC cable. If it is not same, then correct it same with BOM and unplug AC cable. For correct it to the model’s module from factory JIG model. * Push the “IN STOP” key after completing the function inspection. And Mechanical Power Switch must be set “ON”.

CA-210 COLOR ANALYZER TYPE: CA-210

RS-232C Communication

* Auto-control interface and directions 1) Adjust in the place where the influx of light like floodlight around is blocked. (illumination is less than 10 lux). 2) Adhere closely the Color Analyzer (CA210) to the module less than 10 cm distance, keep it with the surface of the Module and Color Analyzer’s prove vertically.(80° ~ 100°). 3) Aging time - After aging start, keep the power on (no suspension of power supply) and heat-run over 5 minutes. - Using ‘no signal’ or ‘full white pattern’ or the others, check the back light on.

4.2. DDC EDID Write (RGB 128Byte ) • Connect D-sub Signal Cable to D-sub Jack. • Write EDID Data to EEPROM(24C02) by using DDC2B protocol. • Check whether written EDID data is correct or not. * For SVC main Assembly, EDID have to be downloaded to Insert Process in advance.

4.3. DDC EDID Write (HDMI 256Byte) • Connect HDMI Signal Cable to HDMI Jack. • Write EDID Data to EEPROM(24C02) by using DDC2B protocol. • Check whether written EDID data is correct or not. * For SVC main Assembly, EDID have to be downloaded to Insert Process in advance.

• Auto adjustment Map(RS-232C) RS-232C COMMAND [CMD ID DATA] Wb 00 00 White Balance Start Wb 00 ff White Balance End RS-232C COMMAND MIN

CENTER

[CMD ID DATA] Cool

Mid

Warm

R Gain

jg

Ja

jd

G Gain

jh

Jb

B Gain

ji

Jc

MAX

4.4. EDID DATA

(DEFAULT) Cool

Mid

Warm

00

172

192

192

192

je

00

172

192

192

192

jf

00

192

192

172

192

R Cut

64

64

64

128

G Cut

64

64

64

128

B Cut

64

64

64

128


- 11 -

1) All Data : HEXA Value 2) Changeable Data : *: Serial No : Controlled / Data:01 **: Month : Controlled / Data:00 ***:Year : Controlled ****:Check sum


- Auto Download

1) FHD RGB EDID data

• After enter Service Mode by pushing “ADJ” key, • Enter EDID D/L mode. • Enter “START” by pushing “OK” key.

00

0

1

2

3

4

5

6

7

8

9

00

FF

FF

FF

FF

FF

FF

00

1E

6D

01

03

68

73

41

78

0A

CF

10

A

B

C

D

E

F

74

A3

57

4C

B0

23

20

09

48

4C

A1

08

00

81

80

61

40

45

40

31

40

01

01

30

01

01

01

01

01

01

02

3A

80

18

71

38

2D

40

58

2C

40

45

00

7E

8A

42

00

00

1E

01

1D

00

72

51

D0

1E

20

50

6E

28

55

00

7E

8A

42

00

00

1E

00

00

00

FD

00

3A

60

3E

1E

53

10

00

0A

20

20

20

20

20

20

80

FF

FF

FF

FF

FF

FF

FF

FF

FF

FF

FF

FF

FF

FF

FF

FF

90

FF

FF

FF

FF

FF

FF

FF

FF

FF

FF

FF

FF

FF

FF

FF

FF

A0

FF

FF

FF

FF

FF

FF

FF

FF

FF

FF

FF

FF

FF

FF

FF

FF

B0

FF

FF

FF

FF

FF

FF

FF

FF

FF

FF

FF

FF

FF

FF

FF

FF

C0

FF

FF

FF

FF

FF

FF

FF

FF

FF

FF

FF

FF

FF

FF

FF

FF

D0

FF

FF

FF

FF

FF

FF

FF

FF

FF

FF

FF

FF

FF

FF

FF

FF

E0

FF

FF

FF

FF

FF

FF

FF

FF

FF

FF

FF

FF

FF

FF

FF

FF

F0

FF

FF

FF

FF

FF

FF

FF

FF

FF

FF

FF

FF

FF

FF

FF

FF

A

B

C

D

E

F

70

00

2) FHD HDMI EDID data 0

1

2

3

4

5

6

7

8

9

00

FF

FF

FF

FF

FF

FF

00

1E

6D

01

03

80

73

41

78

0A

CF

74

A3

57

4C

B0

23

20

09

48

4C

A1

08

00

81

80

61

40

45

40

31

40

01

01

30

01

01

01

01

01

01

02

3A

80

18

71

38

2D

40

58

2C

40

45

00

7E

8A

42

00

00

1E

01

1D

00

72

51

D0

1E

20

50

6E

28

55

00

7E

8A

42

00

00

1E

00

00

00

FD

00

3A

60

3E

1E

53

10

00

0A

20

20

20

20

20

20

80

02

03

26

F1

4E

10

1F

84

13

05

14

03

02

12

20

21

90

22

15

01

26

15

07

50

09

57

07

E3

05

03

01

01

1D

80

18

71

1C

16

20

58

2C

B0

25

00

7E

8A

42

00

00

9E

01

1D

00

80

51

D0

0C

20

C0

40

80

35

00

7E

8A

42

00

00

1E

02

3A

80

18

71

38

D0

2D

40

58

2C

45

00

7E

8A

42

00

00

1E

66

21

50

B0

E0

51

00

1B

30

40

70

36

00

7E

8A

42

00

00

1E

00

00

F0

00

00

00

00

00

00

00

00

00

00

00

00

00

00

00

F9

00 10

* Edid data and Model option download (RS232) Item

CMD1 CMD2 Data0

Download

A

A

0

‘Mode In’ Download

0 When transfer the ‘Mode In’, Carry the command.

A

E

00 10 Automatically Download

70

(The use of a internal pattern)

01

A0

- Manual Download * Caution 1) Use the proper signal cable for EDID Download - Analog EDID : Pin3 exists - Digital EDID : Pin3 exists 2) Never connect HDMI & D-sub Cable at the same time. 3) Use the proper cables below for EDID Writing 4) Download HDMI1, HDMI2, separately because HDMI1 is different from HDMI2 For Analog EDID

For HDMI EDID

D-sub to D-sub

DVI-D to HDMI or HDMI to HDMI

* Detail EDID Options are below Product ID Model Name

HEX

EDID Table

DDC Function

FHD Model

0001

01 00

Analog/Digital

Serial No: Controlled on production line. Month, Year: Controlled on production line: ex) Monthly : ‘02’ -> ‘02’ Year : ‘2009’ -> ‘13’ Model Name(Hex):

Item

Condition

Data(Hex)

Manufacturer ID

GSM

1E6D

Version

Digital : 1

01

Revision

Digital : 3

03


MODEL

MODEL NAME(HEX)

all

00 00 00 FC 00 4C 47 20 54 56 0A 20 20 20 20 20 20 20

Checksum: Changeable by total EDID data. Vendor Specific(HDMI)

- 12 -

INPUT

MODEL NAME(HEX)

HDMI1

67030C001000B82D

HDMI2

67030C002000B82D

HDMI3

67030C003000B82D

HDMI4

67030C004000B82D


4.5. V-COM Adjust(Only LGD(M+S) Module)

5. Model name & Serial number D/L

- Why need Vcom adjustment? A The Vcom (Common Voltage) is a Reference Voltage of Liquid Crystal Driving. -> Liquid Crystal need for Polarity Change with every frame.

• Press “Power on” key of service remocon. (Baud rate : 115200 bps) • Connect RS232 Signal Cable to RS-232 Jack. • Write Serial number by use RS-232. • Must check the serial number at the Diagnostics of SET UP menu. (Refer to below).

Circuit Block Gamma Re fe ren c e V o lta ge

Data(R,G,B) & Control signal

S Da t a I n p u t

Y

I n t e r f a

Timing C o nt r o l l e r

Data(R,G,B) & C ontrol signal Control signal

S o ur ce D r i v e I C

c e

S T E

Power Po w e rInput I nput

M

Gamma R eference Voltage

G a t e D r i v

Power Blo ck

V COM

Column Line

Panel

V COM CLC

CST

e I C

Liquid Crystal Row Line TFT

V COM

5.1. Signal TABLE C MD

- Adjust sequence · Press the PIP key of th ADJ remote control.(This PIP key is hot key to enter the VCOM adjuting mode) (Or After enter Service Mode by pushing “ADJ” key, then Enter V-Com Adjust mode by pushing “ G” key at “10. VCom” · As pushing the right or the left key on the remote control, and find the V-COM value which is no or minimized the Flicker. (If there is no flicker at default value, Press the exit key and finish the VCOM adjustment.) · Push the “OK” key to store value. Then the message “Saing OK” is pop. · Press the exit key to finish VCOM adjustment.

L EN GT H

A DH

A DL

D AT A_ 1

...

D at a_ n

CS

D EL AY

CMD : A0h LENGTH : 85~94h (1~16 bytes) ADH : EEPROM Sub Address high (00~1F) ADL : EEPROM Sub Address low (00~FF) Data : Write data CS : CMD + LENGTH + ADH + ADL + Data_1 +…+ Data_n Delay : 20ms

5.2. Command Set No. 1

Adjust mode EEPROM WRITE

CMD(hex) A0h

LENGTH(hex)

Description

84h+n

n-bytes Write (n = 1~16)

* Description FOS Default write : <7mode data> write Vtotal, V_Frequency, Sync_Polarity, Htotal, Hstart, Vstart, 0, Phase Data write : Model Name and Seri al Numbe r writ e in EEPROM,.

5.3. Method & notice

(Visual Adjust and control the Voltage level)

4.6. Outgoing condition Configuration - When pressing IN-STOP key by SVC remocon, Red LED are blinked alternatively. And then Automatically turn off. (Must not AC power OFF during blinking)

A. Serial number D/L is using of scan equipment. B. Setting of scan equipment operated by Manufacturing Technology Group. C. Serial number D/L must be conformed when it is produced in production line, because serial number D/L is mandatory by D-book 4.0.

4.7. Internal pressure Confirm whether is normal or not when between power board’s ac block and GND is impacted on 1.5 kV(dc) or 2.2 kV(dc) for one second.


- 13 -


* Manual Download (Model Name and Serial Number) If the TV set is downloaded by OTA or Service man, Sometimes model name or serial number is initialized.(Not always) There is impossible to download by bar code scan, so It need Manual download. 1) Press the ‘instart’ key of ADJ remote controller. 2) Go to the menu ‘5.Model Number D/L’ like below photo. 3) Input the Factory model name(ex 42LD450-ZA) or Serial number like photo.

4) Check the model name Instart menu -> Factory name displayed (ex 42LD450-ZA) 5) Check the Diagnostics (DTV country only) -> Buyer model displayed (ex 42LD450)


- 14 -


BLOCK DIAGRAM


- 15 -


GIP Model k c o l B t f i h S L E V E L

H L G G V V = H = G w I o H L

D D O / N ] E 6 : V T 1 S [ E _ V K D L D C V

2 0 6 C I

D D O / N ] E V 6 : E 1 [ _ K D L D C V T G G S V G

V V V 6 3 . 7 V 1 3 2 5 M M L C C H G L L G V _ _ V D C D C V V L O P E O S ) t i b 6 ( R a t a D S D V L i n i M

M 7 1 N 0 R 1 U C I T A S

) t i b 6 ( L a t a D S D V L i n i M S D V L I N I M 2 0 7 P , 1 0 7 P

V 8 D D V H

0 0 6 C I

V 2 1 C C V _ L E N A P

k c o l B R E W O P

V 5 - L G V V 6 1 M C L _ D D V V 3 . 3 M C L _ C C V

V 6 1 M C L _ D D V V 3 . 3 M C L _ C C V

) B 8 M F ~ O _ 1 ( C M A O V M C G V

k c o l B A M M A G P

V V 7 5 2 H L G G V V 3 1 3 1 0 7 6 1 C I X A M

C C V V _ L 2 E 1 N A P

V V 6 3 . 1 3 M M C C L L _ _ D C D C V V

R M F A B R 1 3 0 6 D 3 G S 1 C I Q 3 T R 5 D H D

P T E 1 8 0 6 6 6 C I 9 X A M


L C S / A D S _ P M A

] 7 : 0 [ U Q D M C , ] 7 : 0 [ L Q D M C , ] 2 1 : 0 [ A M C

- 16 -


EXPLODED VIEW IMPORTANT SAFETY NOTICE Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts are identified by in the Schematic Diagram and EXPLODED VIEW. It is essential that these special safety parts should be replaced with the same components as recommended in this manual to prevent X-RADIATION, Shock, Fire, or other Hazards. Do not modify the original design without permission of manufacturer.

800

300 200

400

540 530

521

880 820 830 LV1 LV2

810

120

500

910

920

900 A2

A5

A9

A10

Copyright LG Electronics. Inc. All rights reserved. Only for training and service purposes

- 17 -


0 D M L F

F p 2 2

T S _ V 5 K 0 . 1 3 + 0 3 0 1 R K 7 4 T P O 6 8 0 1 R

C1003 0.1uF

1

T S _ V 5 . 3 +

3

4

MICOM_RESET

5

R 1 07 6

22

R 1 07 8

22

R 1 01 0

22

R 1 08 1

22

R 1 01 3

22

NEC_ISP_Tx

NEC_ISP_Rx

6

7

OCD1A

8

9

OCD1B

10

11

R1018

NEC_SCL

R1019

NEC_SDA

+3.5V_ST

+3.5V_ST 10K

R1072

10K

R1073

10K

22

P60/SCL0

1

22

P61/SDA0

2

NEC_EEPROM_SCL

NEC_ISP_Tx

OCD1A

10K

P62/EXSCL0

3

P63

4

NEC_EEPROM_SDA

OPT R1084

NEC_ISP_Rx

R 10 20

10K

R1005

P33/TI51/TO51/INTP4

0

CEC_REMOTE_NEC 22

P75

R 10 67

22

P74

OCD1B

7

R 10 66

22

P73/KR3

8

R 10 23

22

P72/KR2

9

R 10 64

22

P71/KR1

10

R 10 63

22

P70/KR0

11

R 10 59

22

P32/INTP3/OCD1B

12

R 10 60

22

AMP_MUTE

SOC_RESET

INV_CTL

EEPROM for Micom

+3.5V_ST

MODEL1_OPT_1

OCD1B

IC1001 M24C16-WMN6T 1

2

1 0 0 1 P T

3

1

8

2

7

3

6

RF_RESET

6

4

7

6 4 0 1 R

SW1001 JTP-1127WEM 2

1

4 0.1uF

3

2 2

I V L 9 3 X 0 1 E R / 0 P T N I T / E 0 S 0 1 2 E 4 4 1 R P P P

C1010

R 1 04 7

20K

1/16W 1% 9 W 8 6 0 K 1 1 0 / % R 2 1 1

EDID_WP C B

Q1001 2SC3052 E

36 P140/PCL/INTP6 35 P00/TI000 34 P01/TI010/TO00 33 P130 32 P20/ANI0 31 ANI1/P21

UPD78F0513AGA-GAM-AX

30 ANI2/P22 29 ANI3/P23

NEC_MICOM

M_REMOTE

6

TP1002

5

TP1003

R1080

K 7 . 4

K 7 . 4

4 1 0 1 R

5 1 0 1 R

2 0 0 1 C

28 ANI4/P24 27 ANI5/P25

R 1 04 8

R 1 04 9

22

RL_ON

22 OPC_EN

OPT R 1 05 0 R 10 90

10K 22 WIRELESS_SW_CTRL

R 1 05 5

10K

R 1 05 6

22

R 1 05 7

22

R 1 05 1

22

R 1 05 4

2 2 19~22_LAMP

R 1 05 2

10K

SCART1_MUTE

MODEL1_OPT_3

MODEL1_OPT_2

POWER_ON/OFF1 OLP

SIDE_HP_MUTE

26 ANI6/P26 25 ANI7/P27

A 1 0 5 0 6 6 0 0 0 1 P 5 P H D D 1 D D D T O T O X X O X X C N T N T R T S R T O I / I / / / / / / / / 0 / 5 4 3 2 0 0 2 0 5 1 1 1 1 1 1 1 P 3 I H P P P P L K T P T O S C N / T / S I 7 / 1 / / 1 6 1 0 1 P 1 P 1 3 P P P

F u 1 . 0

NEC_EEPROM_SCL

5

R1008 NEC_EEPROM_SDA

+3.5V_ST

R 10 07

1 00

R 10 70

1 00

R 10 03

K 7 4

3 4 0 1 R

KEY2 KEY1

8

MICOM MODEL OPTION

PANEL_CTL

2 2

3 4 5 6 7 8 9 0 1 2 3 4 1 1 1 1 1 1 1 2 2 2 2 2

22

AMP_RESET_N

4.7M

NON_M_REMOTE

22 4

T S _ V 5 . 3 +

IC1002

5

R 10 65 POWER_ON/OFF2_1

MODEL1_OPT_0

1 0 K 0 7 1 4 R

N E _ R W P _ S S E L E R I W

8 7 6 5 4 3 2 1 0 9 8 7 4 4 4 4 4 4 4 4 4 3 3 3

R1002 10K

R1006

R1034

T C E T E D _ S S E L E R I W

FLMD0

12 13

32.768KHz

B 0 D C O S F u / K 1 . A K L 0 0 L C 6 D C X 0 0 C X E 1 C O E / / / 1 2 1 2 T T X X X X / / 0 / / C 1 2 D 3 4 D S G 2 2 M 2 2 D S E 1 1 L 1 1 V V R P P F P P

for Debugger

2

T E S E R _ M O C I M

GND

+3.5V_ST

P1001

8 0 0 1 C

X1002

R1091 10K

+3.5V_ST

12505WS-12A00

F p 7 2

7 0 0 1 C

K 0 1 D 3 / 9 P D 7 0 P 1 R

K 0 Y 1 E K _ H 5 C 7 U 0 O 1 T R

D E L _ K 0 O 1 I P G / 9 Z 0 Z 0 U 1 B R _ M W P

K 0 1 D 3 / D 1 E 7 L 0 O 1 R

K 0 D 1 E L O / D 4 C 7 L 0 1 R

K 0 Y 1 E K _ T C 1 A 1 T 0 1 R

K 0 1 D E L _ M W 4 0 P 0 1 R

K 0 1 P D P / D 2 C 1 L 0 1 R

PIN NAME

MODEL1_OPT_0

PIN NO.

MODEL_OPT_0

8

MODEL_OPT_1

11

MODEL_OPT_2

30

OPTION LOW

HIGH

LCD/PDP

OLED/3D

MODEL1_OPT_1 MODEL1_OPT_2

0

CEC_ON/OFF

MODEL1_OPT_3

THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION. FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.


MODEL

MODEL_OPT_3

31

PWM_BUZZ/GPIO_LED T O UC H _K E Y PDP/3D

E T O M E R _ M

E T O M E R _ M _ N O N

2 2

2 2

1 6 0 1 R

2 6 0 1 R

2 2

7 3 0 1 R

1 4 0 1 R

9 0 0 1 C

+3.5V_ST

R 1 04 4

10K OPT 10K OPT

2 2

9 6 0 1 R

2 2

8 6 0 1 R

6 3 0 1 R

R 1 08 3

10K OPT

PWM_LED

LCD/OLED

+3.5V_ST

F u 1

R 1 04 5

2 2

T A CT _ KE Y

2 2

F S E S R V V A A

E L B A N E _ F R

A 1 D C O

T E D _ R E W O P

O G O L _ G L / B _ D E L

R I

Z Z U B / R _ D E L

x R _ P S I _ C E N

x T _ P S I _ C E N

2 _ 2 F F O / N O _ R E W O P

D X R _ C E N

D X T _ C E N

GP2_Saturn7M MICOM

Ver.

1.4

5


CONTROL IR

&

LED

+3.5V_ST EYEQ/TOUCH_KEY R2411 100 NEC_EEPROM_SCL R2404 10K 1%

P2401 12507WR-12L

R2405 10K 1%

R2401 100

D2403

1

KEY1

EYEQ/TOUCH_KEY 100

L2402 BLM18PG121SN1D

R2402 100

5.6B

C2408 1000pF 50V OPT


D2402 5.6V AMOTECH

KEY2 C2401 0.1uF

C2402 0.1uF

2

NEC_EEPROM_SDA R2412

D2401 5.6V AMOTECH

5.6B D2404

C2409 1000pF 50V OPT

3

JP2407

4

+3.5V_ST +3.5V_ST

JP2408

5

L2403 BLM18PG121SN1D +3.5V_ST

R2425 47K R2428 22

IR Q2406 2SC3052

6

+3.5V_ST

R2429 47K R2430 10K

C B E

R2431 47K

C

C2403 0.1uF 16V

C2404 1000pF 50V

R 2 41 3

1 . 5K

7

LED_B/LG_LOGO

OPT C2410 0.1uF 16V

R2426 3.3K OPT

JP2409

R2410 100

JP2410

B Q2405 2SC3052

E

COMMERCIAL

C2407 100pF 50V

+3.3V_Normal

+3.5V_ST

D2405 5.6B

OPT

R2403 22

9

10

L2404 BLM18PG121SN1D JP2411

R2427 0

8

+3.5V_ST

R2406 47K Commercial_EU

R2414 R2408 47K R2407 Commercial 10K

IR_OUT Commercial C

Q2401 2SC3052 Commercial_EU

C2405 0.1uF 16V

LED_R/BUZZ C2406 1000pF 50V

B E Commercial_EU

11

12

1.5K

OPT R2416 10K

13

R2409 47K

C B

Q2402 2SC3052 Commercial

Commercial

E

R2422 0 Commercial_US

Zener WIRELESS

R2417 22

close

+3.5V_ST

to

is

wafer

+3.5V_ST

R2420 47K WIRELESS

IR_PASS WIRELESS Q2404 2SC3052 WIRELESS

Diode

R2418 10K

C

R2419 47K WIRELESS

B E

WIRELESS

R2421 47K

C B Q2403 2SC3052 WIRELESS



E

WIRELESS

GP2_Saturn7M IR

&

LED

Ver.

1.2

6


COMMON AREA New

Item

Development

EARPHONE BLOCK EXCEPT_CHINA_HOTEL_OPT

HP_LOUT

C1118 10uF 16V

2:X19

C1115 1000pF 50V OPT

R1125 1K

C Q1101 MMBT3904-(F)

E B

MMBT3904-(F) Q1104

B E

JK3301 KJA-PH-0-0177

+3.3V_Normal 0 3 1 K 1 0 R 1

C

R1155 1K HP_ROUT

2:X19

5

L

4

DETECT

3

R

1 C

C1116 1000pF 50V OPT

C R1128 1K

Q1102 MMBT3904-(F)

E B B

E

B

MMBT3904-(F) Q1103

E

+3.5V_ST

1 C A 0 3 5 5 0 1 1 A 1 S Q I

HP_DET

EXCEPT_CHINA_HOTEL_OPT C1119 10uF 16V

GND

C

SPK_R+_HOTEL

R1129 3.3K

2:X19

C

B

E

SIDE_HP_MUTE

Q1106 2SC3052

SPK_R-_HOTEL 2:X19

PC

RGB

+3.3V_Normal

AUDIO

SPDIF

JK1102

OPTIC

JACK

PC

+5V_Normal D1115 ENKMC2838-T112 A1

5.15 Mstar Circuit Application

PEJ027-01 3 E_SPRING

C

A SPDIF_OUT

7A B_TERMINAL1 4 R_SPRING

5

7B

6B

T_SPRING

PC_R_IN D1101 AMOTECH 5.6V OPT

C1107 100pF 50V

R1107 15K R1102 470K

R1112 0

2:X18

D1102 AMOTECH 5.6V OPT

C1108 100pF 50V

R1103 470K

B

GND

5

VCC C1117 0.1uF 16V OPT

2

3

GND

4

Y

VCC R1126 22 OPT

PC_L_IN T_TERMINAL2

1

OPT

2:S16

R1110 10K

R1108 15K

B_TERMINAL2

A2

IC1104 NL17SZ00DFT2G

OPT R1152 4.7K

6A T_TERMINAL1

R1113 0

VINPUT C1131 0.1uF 16V

2:S16

R1111 10K

F i 1 0 b 0 e 3 r 0 3 1 2 O 1 2 p K 1 t J T i S c J

1

2

3

A1

4

C1121 100pF 50V

A2

E L O P _ X I F

GND

1

8

2

7

3

6

4

5

R1140 4.7K

R1139 4.7K

IC 1105 AT 24C0 2BN- 10S U-1. 8

A0

C1129 0.1uF 16V

R1142 10K

VCC

WP

EDID_WP SCL

RGB_DDC_SCL SDA

RGB_DDC_SDA C1127 18pF 50V

C1128 18pF 50V

R1141 22

R1143 22

R1127 0

DSUB_VSYNC

R1150 0

DSUB_HSYNC C1122 68pF 50V OPT

R1148 0

D1109 30V

C1126 68pF 50V OPT

D1113

D1116

D1114

5.6V OPT

5.6V OPT

30V

DSUB_B+ R1133 75

OPT C1123 OPT

D1110 30V

DSUB_B 0 4 3 1 1 R

DSUB_G+ R1135 75

OPT C1124 OPT

D1111 30V +3.3V_Normal

DSUB_G 0 6 3 1 1 R

R1146 10K DSUB_DET R1147 1K

DSUB_R+ R1137 75

OPT C1125 OPT

D1112 30V

D1117 5.6V

DSUB_R 0 8 3 1 1 R D N D G N _ G 2 N _ _ E D D D E E N E R R G R G

0 1 0 B D 4 0 9 1 0 1 G K P J S

1 1

6


2 1

7

1


A D D T N N A G C C G D N _ N N 1 _ _ E E Y E Y _ C C E U S U S D N D R L _ L C _ N Y D G B H B N V G S

2

3 1

8

4 1

5 1

0 1

9

3

4

GP2_Saturn7M COMMON

K C O D L N C G _ _ C C D D D D

AREA

D E L I H S 6 1

5

Ver.

1.0

9


RS232C 10 5 9

OPT IR_OUT

4

R1122 0 R1123 100

JP1121

R1124 100

JP1122

8 3

+3.5V_ST

7 2

D1107 CDS3C30GTH 30V

6

D1108 CDS3C30GTH 30V

1

C1101 0.33uF

SPG09-DB-009 IC1101

C1102 0.1uF

V+

C1103 0.1uF

C1-

C2-

VC1105 0.1uF

16

2

15

3

14

VCC

GND +3.5V_ST

C2+ C1104 0.1uF

1

JK1101

C1106 0.1uF

MAX3232CDR

C1+

DOUT2

4

13

5

12

6

11

7

10

DOUT1

RIN1

R1109 4.7K OPT

R1114 4.7K OPT

ROUT1

R1157 0

DIN1

R1156 0

S7_RXD1 NEC_RXD

DIN2 R1154 0 S7_TXD1

RIN2

8

9

ROUT2 R1153 0 NEC_TXD

EAN41348201



GP2_Saturn7M RS232C 9PIN

Ver.

1.0

10


(New Item SIDE_AV

Developmen

H:9.2mm) SIDE_AV_OPT L3303 BLM18PG121SN1D SIDEAV_CVBS_IN

5A

[YL]E-LUG

4A

[YL]O-SPRING

3A

[YL]CONTACT

4B

[WH]O-SPRING

3C

[RD]CONTACT

4C

[RD]O-SPRING

SIDE_AV_OPT D3301 30V

SIDE_AV_OPT R3301 75

+3.3V_Normal SIDE_AV_OPT 10K R3302

C3304 100pF OPT SIDE_AV_OPT R3305 1K SIDEAV_DET

5C

C3301 100pF SIDE_AV_OPT

SIDE_AV_OPT D3302 5.6V

SIDE_AV_OPT

SIDE_AV_OPT


[RD]E-LUG

SIDE_AV_OPT D3303 5.6V

470K

PPJ235-01

SIDE_AV_OPT 10K SIDE_AV_OPT L3302 BLM18PG121SN1D

JK3302

R3306 SIDEAV_L_IN

SIDE_AV_OPT R3303

C3302 100pF 50V

SIDE_AV_OPT R3308 12K

SIDE_AV_OPT R3307 SIDEAV_R_IN

SIDE_AV_OPT SIDE_AV_OPT D3304 5.6V




SIDE_AV_OPT 10K C3303 100pF 50V


GP2_Saturn7M SIDE

AV

Ver.

1.0

11


WIRELESS

READY

MODEL

JK2601

Wireless

KJA-PH-3-0168

power

From wireless_I2C to micom I2C VCC[24V/20V/17V]_1 VCC[24V/20V/17V]_2 VCC[24V/20V/17V]_3 VCC[24V/20V/17V]_4 VCC[24V/20V/17V]_5

+24V VCC[24V/20V/17V]_6 DETECT

+3.3V_Normal R2604 22K

C2601 0.1uF 50V

INTERRUPT

C2602 TP2601

2.2uF

GND_1

R2612 10K

S

RESET

G R2605 27K R2603 10K

WIRELESS_PWR_EN

Q2602 AO3407A WIRELESS

WIRELESS

GND_2 I2C_SCL

WIRELESS_SCL I2C_SDA

1/4W 3216

Q2601

TP2602

1K

WIRELESS_DETECT

R2607 0

B WIRELESS

R2617

WIRELESS

D

C

WIRELESS_SDA GND_3

C2603 0.01uF 50V

E

UART_RX WIRELESS_RX UART_TX WIRELESS_TX GND_4 IR IR_PASS GND_5 GND_6

1

OPT

2 WIRELESS_PWR_EN

3

+3.3V_Normal

R2602 10K

B

5

OPT 6 C

7

9 10

G

11

OPT

12

AMP_SDA

D

13

+3.5V_ST

OPT R2606 0

WIRELESS_SDA

S

Q2604 FDV301N

14 G

15

OPT

16

AMP_SCL

D

17

WIRELESS_SCL

S

Q2605 FDV301N

18 19

WIRELESS

20

R2611

0

R2613 0 WIRELESS

SHIELD

0

E 3 1 0 C 6 A 2 0 Q 3 5 1 A S I

8

21

R2618

K 4 0 1 1 6 2 R

OPT

4

+3.3V_Normal

OPT R2608 0

IC2601 MC14053BDR2G

WIRELESS 0

R2601 WIRELESS_DL_RX

Y1 WIRELESS_TX

1

16

VDD C2604

Y0 S7_TXD Z1

OPT 2

15

3

14

4

13

Y

X

S7_TXD1

0.1uF

RS232C

OPT

Z0

INH

R2620

0

VEE

5

12

6

11

7

10

8

9

X1

Wireless

S7_RXD1 R2615 0

Z

&

WIRELESS

WIRELESS_DL_TX

WIRELESS_SW_CTRL

SELECT PIN

STATUS

WIRELESS_RX X0

R2619 0

+3.5V_ST

HIGH

X1/Y1/Z1

WIRELESS Dongle connect --> WIRELESS RS232

LOW

X0/Y0/Z0

WIRELESS Dongle Dis_con --> S7 RS232

S7_RXD A

T P O

B

K 7 9 . 0 4 6 2 R

WIRELESS VSS

C

T P O

K 7 0 4 1 6 2 R

WIRELESS_SW_CTRL

Ver.



1.2

-->

1.3:

wireless

opt

change,

090818,

GP2_Saturn7M Wireless ready

hongsu

Ver.

1.3

12


+3.3V_Normal

+3.3V_Normal

+3.3V_Normal

4 0 4 1 R

S_FLASH K 7 . 4

IC1401 MX25L8005M2I-15G CS#

3 0 4 K 1 0 R 1

/SPI_CS

/FLASH_WP

R1402 0

WP#

GND

C R1401

1

8

2

7

3

6

4

5

C1401

VCC

0.1uF SO SPI_SDO

B

HOLD#

SCLK SPI_SCK SI

R1405 33 SPI_SDI

Q1401 KRC103S

OPT 0 E



GP2_Saturn7M S-Flash(1MB)

Ver.

1.2

23


+1.8V_AMP +3.3V_Normal IC404 AP1117E18G-13 IN

4 7 4 R 1

3 Vd=1.4V 1 ADJ/GND

120 mA

2 C434 0.1uF 16V

OUT

C446 0.1uF 16V

C421 10uF 10V

+24V

SPK_L+ D501 1N4148W 100V OPT

OPT R535 3.3

C515 0.1uF 50V

+3.3V_Normal D 1 N S 1 2 1 G P 8 1 M L B

AMP_RESET_N

C514 22000pF 50V

2 1 2 1 2 1 2 1 _ _ 2 1 _ _ _ _ 2 1 _ _ D A A _ _ A A B B _ _ B B A 1 1 A A 1 1 1 1 B B 1 1 B B P D D 1 1 D D D D 1 1 D D 1 1 _ N N T T D D D D T T N N T R P G G U U V V V V U U G G S D E P P O O P P P P O O P P B V

BST1A

1

VDR1A 2 5 V /RESET

2

AD

4

C512 1uF

+1.8V_AMP

D 1 N S 1 2 1 G P 8 1 M L B

L501

C509 0.1uF

OPT C501 10uF 10V

D 1 N S 1 2 1 G P 8 1 M L B

L502 C504 100pF 50V

C502 0.1uF 16V

DGND_1

5

GND_IO

6

CLK_I

7

VDD_IO

8

DGND_PLL

9

R508

AGND_PLL

10

LF

11

AVDD_PLL

12

DVDD_PLL

13

GND

14

C505 0.1uF 16V

OPT C511 10uF 10V

AUD_LRCK AUD_SCK AMP_SDA AMP_SCL

R 50 3

1F

4.7K

C534 0.47uF 50V

C540 OPT 0.01uF 50V R531 OPT 3.3

SPEAKER_L

R532 OPT C537 0.1uF 50V

15uH

R520 12

R527

R524 12

R528 4.7K

3.3 C541 OPT 0.01uF 50V SPK_L-

C520 1uF 25V

42

NC

41 VDR2A

THERMAL 57

C522 25V 1uF

SPK_R+ C525 22000pF

40 BST2A 39 PGND2A_2

D503 1N4148W 100V OPT

50V

38 PGND2A_1 37 OUT2A_2

IC501

C531 390pF 50V

36 OUT2A_1 35 PVDD2A_2 34 PVDD2A_1

EAN60969601

33 PVDD2B_2

C532 390pF 50V

D504 1N4148W 100V OPT

32 PVDD2B_1 31 OUT2B_2

NTP-7000

30 OUT2B_1 29 PGND2B_2

R525 12

R521 12

R522 12

2S

2F

1S

1F

15uH R523 12

C542

L506 AD-9060 C535 0.47uF 50V

C538

R529

0.1uF 50V

4.7K

C539

R530

0.1uF 50V

4.7K

OPT

0.01uF 50V R533 OPT

SPEAKER_R

3.3 R534 OPT 3.3 C543 OPT 0.01uF 50V SPK_R-

+24V

5 6 7 8 9 0 1 2 3 4 5 6 7 8 1 1 1 1 1 2 2 2 2 2 2 2 2 2

+1.8V_AMP

AUD_LRCH

3

C508 1000pF 50V

3.3K

OPT C503 10uF 10V

1S C530 390pF 50V

D502 1N4148W 100V OPT

C536 0.1uF 50V

2F

6 5 4 3 2 1 0 9 8 7 6 5 4 3 5 5 5 5 5 5 5 4 4 4 4 4 4 4

AUD_MASTER_CLK

+1.8V_AMP

L507 AD-9060 2S

C518 22000pF 50V

L504

2 0 5 P T

C506 1000pF 50V

R526 12

C529 390pF 50V

OPT C547 0.01uF 50V

C521 10uF 35V

C519 0.1uF 50V

R519 12

2 D A K K A L 0 1 2 T B B 1 _ D T C C D C R R R L 2 2 _ D V A W B S S O O O U R T B N D D T T T A D S 2 G S I I I F V B D D N N N / N O O O G M M M P

C517 1uF 25V

C513 0.1uF 16V

C526

C527

0.1uF

0.1uF

50V

50V

C528 10uF 35V

C524 22000pF 50V

1 00

R 50 4

1 00

R 50 5

1 00

R 50 6

33

R 50 7

33

R513 0 POWER_DET C516 1000pF 50V

C507 18pF 50V

C510 18pF 50V

C546 22pF 50V

C544 22pF 50V

C545 22pF 50V

OPT

OPT

OPT

L E T O H _ E T U M _ P M A

OPT

+3.5V_ST

R 51 4

1 00

WAFER-ANGLE

R515 10K R536 0

C B

Q501 2SC3052

R517

SPK_L+ AMP_MUTE

4

4

3

3

R537 0

10K E

SPK_LR538 0 SPK_R+

2

2

R539 0 SPK_R-

1

1 P501

SPK_SLIM

SMAW250-04 P502 SPK_NORMAL



GP2_Saturn7M AUDIO[NTP]

Ver.

1.1

38


USB1 OPTION

USB_MICREL +3.3V_Normal +5V_USB

IC2301 MIC2009YM6-TR

L2301 MLB-201209-0120P-N2

VOUT

120-ohm C2302 10uF 4 0 0 0 4 1 0 B 3 U U 2 S - K B A J D J K o O W i N t p o S T @ R E A M

1 0 3 0 2 8 R 1

ILIMIT

6

1

5

$0.125 2

4

3

VIN

R2303 4.7K OPT

GND

R2306 FAULT/

R2307 10K R2302

47

USB1_OCD R2305

2

0 SIDE_USB_DM

R2304 3

4

0 SIDE_USB_DP

D2301 CDS3C05HDMI1 5.6V OPT

D2302 CDS3C05HDMI1 5.6V OPT

TP2301


C2304 0.1uF

USB1_CTL

1

5


C2303 10uF 10V

0

ENABLE

10V

/RST_HUB

GP2_Saturn7M USB

Ver.

1.0

39


NOT

USING

B/T BT_ON/OFF

BT_DM

BT_DP

BT_LOUT



GP2_Saturn7M NON

B/T

Ver.

1.0

44


NON

ETHERNET

TP2101

EPHY_RXD0

TP2102

EPHY_RXD1

TP2103 TP2104 TP2105 TP2106 TP2107 TP2108 TP2109 TP2110 TP2111

EPHY_TXD1 EPHY_TXD0 EPHY_REFCLK EPHY_CRS_DV EPHY_MDIO ET_RXER /RST_PHY EPHY_MDC EPHY_EN



GP2_Saturn7M NON ETHERNET

Ver.

1.0

48


NON

Motion

Remocon

Region

M_REMOTE_RX

TP2501

M_REMOTE_TX

TP2502

RF_RESET

TP2503

TP2504



RF_ENABLE

GP2_Saturn7M NON

M

REMOCON

Ver.

1.0

50


China HOTEL Option Chinese Hotel Option +24V P3401 12505WS-09A00 HOTEL_OPT R3404 0 HOTEL_OPT C3401 0.1uF HOTEL_OPT

1

2

3

AUDIO_R +3.3V_Normal

4 HOTEL_OPT AMP_RESET_N

R3403 0

R3402 10K HOTEL_OPT AMP_MUTE_HOTEL R3401 200

C B

AMP_MUTE_HOTEL

5

6

Q3401 RT1C3904-T112 HOTEL_OPT

HOTEL_OPT

7 HOTEL_OPT

E

R3406 0 SPK_R+_HOTEL

8

HOTEL_OPT R3405 0 SPK_R-_HOTEL CLOSE TO THE EARPHONE



9

10

GP2_Saturn7M CHINA HOTEL

Ver.

1.0

51


/PIF_SPI_CS

R 6 00 1

0

CHB_CVBS_IN



GP2_Saturn7M NON

CHB

Ver.

1.0

68


104090146-LG-32le5300-5310-32le530n-ch-ld01d-ET-1

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